A gimbal device

Abstract

The application relates to a gimbal device and belongs to the technical field of gimbals. The gimbal device comprises a main body part and a shooting part movably connected to the main body part, the shooting part having an unfolded state and a retracted state relative to the main body part; the shooting part comprises a shell provided with a first air inlet, a second air inlet and an air outlet; a heating module is arranged in the shell; and a piezoelectric fan is arranged in the shell and used for generating airflow; when the shooting part is in the unfolded state, the airflow enters the shell from the first air inlet and the second air inlet, flows through the heating module and is discharged from the air outlet; when the shooting part is in the retracted state, the airflow enters the shell from the second air inlet, flows through the heating module and is discharged from the air outlet. According to the embodiment, the first air inlet and the second air inlet are arranged, so that the heating module in the shooting part can obtain sufficient air volume for heat dissipation in the unfolded state and the retracted state, and the heat dissipation stability of the gimbal device in multiple states is ensured.

Description

Technical Field

[0001] This application relates to the field of gimbal technology, and in particular to a gimbal device. Background Technology

[0002] Smart devices with rotatable shooting gimbals are now widely used. To meet the demands of high-quality shooting, the pixel count and frame rate of the image sensors mounted on these gimbals are constantly increasing, leading to a significant increase in power consumption and consequently, greater pressure on heat dissipation. If heat cannot be dissipated in time, it can cause temperature drift in the image sensor, affecting image quality and, in severe cases, damaging the device.

[0003] Current gimbal cooling systems are mainly divided into two categories: active cooling and passive cooling. Passive cooling relies on heat conduction and natural convection through structures such as metal casings and heat-conducting plates. However, its cooling capacity is limited and cannot meet the cooling requirements of high-power, heat-generating modules. Active cooling uses devices such as axial fans to generate forced convection, which has a stronger cooling capacity. However, the rotational inertia and mechanical vibration generated by the high-speed rotation of the fan blades can interfere with the gimbal equipment and affect the accuracy of its image stabilization control. In addition, currently, cameras are used to shoot in different postures as needed. The air inlets and outlets for heat dissipation are generally located on the casing near the heat-generating module. When the casing is in certain postures (e.g., folded), the air inlets may be blocked, affecting the cooling effect. Summary of the Invention

[0004] In view of this, the present application provides a gimbal device to solve at least one problem existing in the background art.

[0005] In a first aspect, embodiments of this application provide a gimbal device, including a main body and a camera unit movably connected to the main body, the camera unit having an extended state and a retracted state relative to the main body; the camera unit includes:

[0006] The housing has a first air inlet, a second air inlet, and an air outlet;

[0007] A heating module is disposed within the housing; and

[0008] A piezoelectric fan, disposed within the housing, is used to generate airflow;

[0009] When the camera unit is in the unfolded state, airflow enters the housing through the first air inlet and the second air inlet, flows through the heating module, and is discharged through the air outlet; when the camera unit is in the retracted state, airflow enters the housing through the second air inlet, flows through the heating module, and is discharged through the air outlet.

[0010] In one alternative embodiment, the housing has a first panel, a second panel, and a third panel; the first air inlet is located on the first panel, the second air inlet is located on the second panel, and the air outlet is located on the third panel; in the retracted state, the first panel is attached to the main body.

[0011] In one optional embodiment, the piezoelectric fan is provided with a rear air inlet and a side air outlet. The first air inlet and the second air inlet are connected to different positions of the rear air inlet, and the air outlet is connected to the side air outlet. Airflow enters through the first air inlet and the second air inlet, flows through the rear air inlet and the side air outlet in sequence, and is discharged through the air outlet.

[0012] In one optional embodiment, a first flow channel is provided between the first air inlet and the rear air inlet, and a second flow channel is provided between the second air inlet and the rear air inlet. Airflow enters through the first air inlet and the second air inlet, flows through the first flow channel and the second flow channel respectively, and then enters from the rear air inlet.

[0013] In an optional embodiment, the imaging unit further includes an air inlet baffle connected between the first panel and the piezoelectric fan, and the air inlet baffle surrounds the rear air inlet, such that the rear air inlet, the first air inlet, and the air inlet baffle constitute the first flow channel.

[0014] In one optional embodiment, the air inlet baffle is provided with a notch, which is correspondingly provided with the second air inlet; the shooting part further includes: an extension member, which has a through channel inside, one end of the channel is connected to the second air inlet of the housing, and the other end is connected to the notch of the air inlet baffle, the channel forming the second flow channel.

[0015] In one optional embodiment, the first air inlet is a grille structure; the rear air inlet is disposed opposite to the first air inlet.

[0016] In one optional embodiment, the main body is provided with a heat dissipation guiding structure; in the retracted state, the side of the housing with the air outlet faces the heat dissipation guiding structure on the main body, so that the airflow discharged from the air outlet flows through the heat dissipation guiding structure.

[0017] In an optional embodiment, the imaging unit further includes a heat conduction component disposed between the heating module and the piezoelectric fan; the heat conduction component includes a thermoelectric cooler having a first side and a second side opposite to each other, the first side of the thermoelectric cooler being thermally coupled to the heating module, and the second side of the thermoelectric cooler being disposed corresponding to the airflow action area of ​​the piezoelectric fan; one of the first side and the second side is a cold end and the other is a hot end, and the cold end and the hot end can be switched between each other.

[0018] In an optional embodiment, the heat conduction component further includes: a temperature acquisition module disposed within the housing for acquiring temperature data, the temperature data including a first temperature of the first surface, a second temperature of the second surface, and a third temperature of the housing; wherein, the thermoelectric cooler controls and adjusts its operating power and / or switches the hot end and the cold end based on the temperature data acquired by the temperature acquisition module.

[0019] The gimbal device provided in this application embodiment has at least the following technical effects:

[0020] By setting a first air inlet and a second air inlet on the housing of the shooting unit, the heat-generating module inside the shooting unit can obtain sufficient airflow for heat dissipation in both the deployed and retracted states. In the deployed state, airflow enters the housing through both the first and second air inlets to participate in heat dissipation, providing a large airflow and heat dissipation efficiency to meet the needs of high-load scenarios. In the retracted state, even if the first air inlet is blocked by the main body, airflow can still enter the housing through the second air inlet to participate in heat dissipation, ensuring stable heat dissipation for the gimbal device in both the deployed and retracted states.

[0021] Meanwhile, using a piezoelectric fan as the airflow drive source, compared to an axial fan for heat dissipation, it has no rotating parts and will not generate significant rotational inertia and mechanical vibration, thereby reducing the impact of heat dissipation components on the gimbal's stabilization accuracy. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0023] Figure 1 This is one of the structural schematic diagrams of the gimbal device in its deployed state provided in the embodiments of this application;

[0024] Figure 2 This is the second structural schematic diagram of the gimbal device in its deployed state provided in an embodiment of this application.

[0025] Figure 3 This is a structural diagram of the pan-tilt device in its retracted state, provided in an embodiment of this application.

[0026] Figure 4 This is one of the structural schematic diagrams of the imaging unit in the gimbal device provided in the embodiments of this application;

[0027] Figure 5 This is the second schematic diagram of the imaging unit in the gimbal device provided in the embodiments of this application;

[0028] Figure 6 This is a cross-sectional schematic diagram of the imaging section in the gimbal device provided in the embodiments of this application;

[0029] Figure 7 A thermal simulation diagram of the air duct of the shooting section in the deployed state of the gimbal device provided in this application embodiment;

[0030] Figure 8 A thermal simulation diagram of the air duct of the shooting section in the retracted state of the gimbal device provided in the embodiments of this application.

[0031] Figure 9 This is a schematic diagram of the airflow direction in the shooting section of the gimbal device provided in the embodiments of this application.

[0032] Reference numerals: 100, main body; 110, heat dissipation structure; 200, imaging unit; 210, housing; 211, first air inlet; 212, second air inlet; 213, air outlet; 214, first panel; 215, second panel; 216, third panel; 220, heating module; 230, piezoelectric fan; 231, rear air inlet; 232, side air outlet; 240, air inlet baffle; 250, extension; 260, heat conduction component; 261, thermoelectric cooler; 262, thermally conductive material layer; 263, thermally conductive medium layer; 300, rotating part. Detailed Implementation

[0033] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the disclosure of the present application to those skilled in the art.

[0034] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0035] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0036] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0037] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0038] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0039] To meet the demands of high-quality shooting, the image sensor on the gimbal is constantly being upgraded in terms of pixel count and frame rate. This leads to increased power consumption and a corresponding increase in heat dissipation pressure. If heat cannot be dissipated in time, it can cause temperature drift in the image sensor, affecting image quality and, in severe cases, damaging the device.

[0040] Current heat dissipation methods for gimbal devices are mainly divided into two categories: passive heat dissipation and active heat dissipation. Passive heat dissipation utilizes structures such as metal casings and heat-conducting plates for heat conduction and natural convection. This process requires no additional power input, is simple in structure, and does not generate mechanical vibration. However, the heat dissipation capacity of passive heat dissipation is limited by the size and weight of the device. In devices like gimbals with limited internal space, it is impossible to significantly increase the heat dissipation area to improve the heat dissipation effect, thus failing to meet the heat dissipation requirements of high-power, heat-generating modules.

[0041] Active cooling uses components such as axial fans to generate forced convection, improving heat dissipation by increasing airflow speed. Axial fans have strong cooling capabilities, meeting the heat dissipation requirements of high-power devices. However, axial fans rely on motors to drive the fan blades to rotate at high speeds, and this rotation generates rotational inertia and mechanical vibration. The main function of a gimbal is to precisely control the camera's posture through multi-axis motors to achieve stable image capture. Even minor mechanical vibrations are transmitted to the gimbal motors, interfering with the gimbal's image stabilization control precision and thus affecting image quality.

[0042] In view of the above, this application provides a gimbal device to solve at least one problem existing in the aforementioned prior art. The following is a detailed description in conjunction with the accompanying drawings. Figure 1 To be continued Figure 9 The gimbal device provided in this embodiment will be described.

[0043] The gimbal device provided in this embodiment includes a main body 100 and a shooting unit 200 movably connected to the main body 100.

[0044] Specifically, the main body 100 typically serves as the support base, grip, or control unit of the gimbal device. The shooting unit 200 is used to mount camera optical components such as image sensors and optical lenses. The shooting unit 200 and the main body 100 are movably connected via a multi-axis (such as yaw axis, pitch axis, roll axis, etc.) rotating part 300, allowing the shooting unit 200 to have an extended state and a retracted state relative to the main body 100. The extended state typically corresponds to the normal shooting mode of the gimbal device, in which the shooting unit 200 is away from the storage position of the main body 100; the retracted state typically corresponds to the standby, folded storage, or specific close-fitting posture of the gimbal device, in which the shooting unit 200 moves closer to the main body 100 and folds. In some examples, the structural components of the main body 100 of the gimbal and the shooting part 200 can be made of 6xxx series aluminum alloy, 7xxx series aluminum alloy or other metal alloys, or high-strength non-metallic materials; among them, 6xxx series aluminum alloy refers to wrought aluminum alloys with the first digit of the grade being 6 and magnesium and silicon as the main alloying elements; 7xxx series aluminum alloy refers to wrought aluminum alloys with the first digit of the grade being 7 and zinc as the main alloying element.

[0045] The camera unit 200 includes a housing 210, a heating module 220, and a piezoelectric fan 230.

[0046] The housing 210 serves as the external support and protective structure for the imaging unit 200, and its interior forms a cavity space for accommodating various electronic components and constructing airflow channels. The housing 210 has a first air inlet 211, a second air inlet 212, and an air outlet 213, which provide channels for gas exchange between the internal space of the housing 210 and the external environment. In some examples, the housing 210 also has a high-transmittance exposed glass cover to protect the internal camera optical components.

[0047] The heat-generating module 220 is housed within the housing 210. The heat-generating module 220 typically includes a camera module and related high-power electronic components such as image processing chips. During operation, the heat-generating module 220 generates a significant amount of heat. If this heat is not dissipated promptly, excessively high temperatures can cause temperature drift in the sensor, thereby affecting image quality and device lifespan. In some examples, the camera module is fixed inside the housing 210 by a metal bracket, which can be made of metal alloys such as aluminum or copper.

[0048] A piezoelectric fan 230 is housed within the casing 210 to generate airflow. Unlike traditional micro fans that use rotating motors, the piezoelectric fan 230 utilizes the inverse piezoelectric effect of piezoelectric materials. It drives a piezoelectric vibrator to generate high-frequency mechanical vibration via an AC signal, which in turn causes the blades or diaphragm to oscillate, thus propelling the gas flow. Using the piezoelectric fan 230 as the airflow drive source eliminates the rotational inertia caused by axial rotation, compared to traditional motorized fan blades. This reduces the adverse effects of internal rotating components on the gimbal motor's anti-shake control accuracy. Furthermore, using the piezoelectric fan 230 also reduces mechanical vibration and electromagnetic interference. In some examples, the piezoelectric fan 230 is a MEMS piezoelectric fan, which is small in size and low in power consumption, making it suitable for the confined internal space of gimbal devices.

[0049] Figure 1 and Figure 2 The image in the middle is a schematic diagram of the gimbal device in the deployed state in an embodiment of this application. Figure 3 This is a schematic diagram of the gimbal device in the retracted state according to an embodiment of this application. Figure 3 The connecting piece between the main body and the shooting unit is hidden inside. Figure 7 This is a thermal simulation diagram of the air duct of the camera unit in the deployed state of the gimbal device in this application embodiment. Figure 8 This is a thermal simulation diagram of the air duct of the camera unit in the retracted state of the gimbal device in the embodiments of this application.

[0050] like Figure 1 and Figure 7 As shown, when the imaging unit 200 is in the unfolded state, the external space of the housing 210 is relatively open, and airflow enters the housing 210 through both the first air inlet 211 and the second air inlet 212. Driven by the piezoelectric fan 230, the airflow entering the housing 210 flows through the heating module 220 (or a heat-conducting structure thermally coupled to the heating module 220, such as...) Figure 6 As shown, the heat generated by the heating module 220 is carried away and then discharged to the outside of the housing 210 through the air outlet 213. In the unfolded state, the first air inlet 211 and the second air inlet 212 can simultaneously intake air, thereby increasing the air intake cross-sectional area and air volume, reducing wind resistance, and improving heat dissipation efficiency under high-load shooting conditions.

[0051] like Figure 3 and Figure 8 As shown, when the camera unit 200 is in the retracted state, because the camera unit 200 folds and closes towards the main body 100, the surface space of part of the housing 210 is restricted, causing a change in the original air intake path. In the retracted state, the airflow enters the housing 210 through the second air inlet 212 and flows through the heating module 220 (or a heat-conducting structure thermally coupled to the heating module 220, such as...) under the drive of the piezoelectric fan 230. Figure 6(As shown) and then discharged through the air outlet 213. The second air inlet 212 serves as an effective air intake channel for the imaging unit 200 in the retracted state, ensuring good airflow circulation within the housing 210 to guarantee heat dissipation even when the imaging unit 200 is operating in the retracted state.

[0052] In this embodiment, the heating module 220 continuously generates heat during the operation of the gimbal device. The piezoelectric fan 230 starts and generates driving air pressure, guiding external cold air into the housing 210. Through the first air inlet 211 and the second air inlet 212 provided on the housing 210, when the shooting unit 200 is in the unfolded state, the two air inlets work together to provide sufficient cooling airflow; when in the retracted state, even if the first air inlet 211 loses its air intake capacity due to the folding and pressing of the mechanical structure, the second air inlet 212 can still provide an air intake channel for the entry of cold air to ensure the smooth flow of cooling air. The dual-airflow structure of this embodiment, which adapts to the unfolded and retracted states of the shooting unit 200 relative to the main body 100, can provide sufficient heat dissipation for the heat-generating module 220 while alleviating the problems of poor heat dissipation and sensor temperature drift caused by the main air inlet (first air inlet 211) being blocked. At the same time, the piezoelectric fan 230 used has no significant rotational inertia during operation, so that the active heat dissipation inside the housing 210 of the shooting unit 200 will not have a significant impact on the accuracy and anti-shake performance of the gimbal device, which is conducive to improving the reliability of the gimbal device.

[0053] In an alternative embodiment, such as Figure 4 As shown, the housing 210 has a first panel 214, a second panel 215 and a third panel 216; the first air inlet 211 is located on the first panel 214, the second air inlet 212 is located on the second panel 215, and the air outlet 213 is located on the third panel 216; in the retracted state, the first panel 214 is attached to the main body 100.

[0054] In this embodiment, the first panel 214, the second panel 215, and the third panel 216 are typically the outer surfaces of the housing 210 facing different spatial directions (e.g., adjacent side surfaces or top / bottom surfaces). By distributing the first air inlet 211, the second air inlet 212, and the air outlet 213 onto different panels, the two air inlet channels and the air outlet channel are spatially separated. When the camera unit 200 of the gimbal device switches from the unfolded state to the retracted state, the camera unit 200 undergoes mechanical displacement and posture flipping, causing the first panel 214 to move closer to the main body 100 and abut against the surface of the main body 100. At this time, the first air inlet 211 on the first panel 214 is blocked by the main body 100, losing or partially losing its air intake capability; while the second air inlet 212 on the second panel 215, due to its different orientation, still maintains communication with the external environment. Based on the structure in this embodiment, the gimbal device can passively and adaptively switch the air intake path when in a folded or stowed posture, without the need for additional valves or movable baffles. At the same time, the heating module 220 inside the housing 210 can obtain continuous heat dissipation airflow under different mechanical postures.

[0055] In an alternative embodiment, such as Figure 5 , Figure 6 and Figure 9 As shown, the piezoelectric fan 230 is provided with a rear air inlet 231 and a side air outlet 232. The first air inlet 211 and the second air inlet 212 are connected to different positions of the rear air inlet 231, and the air outlet 213 is connected to the side air outlet 232. The airflow enters through the first air inlet 211 and the second air inlet 212, flows through the rear air inlet 231 and the side air outlet 232 in sequence, and is discharged through the air outlet 213.

[0056] Figure 9 The arrows in the diagram illustrate the airflow direction as air enters through the first air inlet 211 and the second air inlet 212 and exits through the air outlet 213.

[0057] In this embodiment, since the piezoelectric fan 230 typically utilizes the high-frequency deformation of its internal diaphragm to create negative pressure in its normal direction (i.e., a large area on the back or front) to draw in gas and discharge the accelerated gas at its radial edge (i.e., the side), in this preferred embodiment, the first air inlet 211 and the second air inlet 212 are both guided to the back air intake end 231 of the piezoelectric fan 230, which can make full use of the negative pressure area of ​​the piezoelectric fan 230. At the same time, the air outlet 213 is connected to the side air outlet end 232, so that the airflow can follow the air path from the wide back of the piezoelectric fan 230 to the side of the piezoelectric fan 230, making full use of the aerodynamic characteristics of the piezoelectric fan 230. In the limited internal space of the housing 210, the airflow is guided directionally with a shorter path and less flow resistance, which can improve the volumetric efficiency and overall heat dissipation effect of the piezoelectric fan 230.

[0058] In an optional embodiment, a first flow channel is provided between the first air inlet 211 and the rear air inlet 231, and a second flow channel is provided between the second air inlet 212 and the rear air inlet 231. The airflow enters through the first air inlet 211 and the second air inlet 212 and flows through the first flow channel and the second flow channel respectively before entering through the rear air inlet 231.

[0059] In this embodiment, the first and second flow channels serve as airflow guiding structures within the housing 210, acting as airflow channels from the first air inlet 211 and the second air inlet 212 to the rear air intake end 231 of the piezoelectric fan 230, respectively. In the deployed state, external cold air enters through the first air inlet 211 and the second air inlet 212, and is guided along their respective first and second flow channels to the rear air intake end 231 of the piezoelectric fan 230. The separately configured first and second flow channels can rectify the airflow entering the housing 210, reducing disordered diffusion and turbulent collisions within the internal cavity of the housing 210, thus reducing wind noise and wind resistance loss. Simultaneously, they can separate the incoming airflow from other non-target heat dissipation areas within the housing 210, reducing the internal backflow of heated exhaust gas (i.e., thermal short-circuit phenomenon), ensuring that the airflow reaching the air intake end of the piezoelectric fan 230 maintains a lower initial temperature and sustains the system's heat exchange temperature difference. In some examples, the first and second flow channels can be made of metal or non-metallic structural components.

[0060] In an alternative embodiment, such as Figure 5 and Figure 6 As shown, the imaging unit 200 also includes an air inlet baffle 240, which is connected between the first panel 214 and the piezoelectric fan 230, and the air inlet baffle 240 surrounds the rear air inlet end 231, so that the rear air inlet end 231, the first air inlet 211 and the air inlet baffle 240 form a first flow channel.

[0061] In this embodiment, the air inlet baffle 240 serves as an isolation and airflow guiding component. One end of the baffle abuts against or is fixed to the inner side of the first panel 214 of the housing 210, and the other end extends and fits against the periphery of the rear air inlet end 231 of the piezoelectric fan 230. The air inlet baffle 240 forms a relatively enclosed enclosure space between the first air inlet 211 and the rear air inlet end 231, and the inner cavity of this enclosure space constitutes the aforementioned first flow channel. Specifically, when external cold air is drawn in from the first air inlet 211 (e.g., a grille-type opening), the air inlet baffle 240 restricts the escape of cold air into other gaps inside the housing 210, causing the airflow to flow vertically or nearly vertically to the rear air inlet end 231 of the piezoelectric fan 230. Furthermore, the enclosing function of the air inlet baffle 240 improves the structural rigidity of the first flow channel, while simultaneously forming a local high negative pressure chamber on the air intake side of the piezoelectric fan 230, enhancing the air intake and suction capacity of the first air inlet 211 and meeting the heat dissipation requirements of the heating module 220 under high load conditions. At the same time, the structural form of the air inlet baffle 240 also provides a structural foundation for the connection of the second flow channel in subsequent embodiments. In some examples, the air inlet baffle 240 can be integrally formed with the first panel 214 of the housing 210, or installed on the piezoelectric fan 230 as an independent sealing gasket / guide shroud assembly. In other examples, the air inlet baffle 240 can be made of non-metallic materials such as foam or plastic, or it can be made of metallic materials.

[0062] In an alternative embodiment, such as Figure 5 and Figure 6 As shown, the air inlet baffle 240 has a notch, which is corresponding to the second air inlet 212; the camera part 200 also includes an extension 250, which has a through channel inside. One end of the channel is connected to the second air inlet 212 of the housing 210, and the other end is connected to the notch of the air inlet baffle 240. The channel forms a second flow channel.

[0063] In this embodiment, the air inlet baffle 240 has a notch, allowing airflow from the second air inlet 212 to flow towards the rear air inlet 231 of the piezoelectric fan 230. The extension 250 is a flow guide connecting the second air inlet 212 and the notch in the air inlet baffle 240, and its internal through-channel guides the airflow to the air inlet side of the piezoelectric fan 230. The extension 250 cooperates with the air inlet baffle 240 to connect the first flow channel and the second flow channel at the rear air inlet 231 of the piezoelectric fan 230. In the retracted state, when the airflow from the first air inlet 211 is reduced or restricted, external airflow can continuously flow into the rear air inlet 231 of the piezoelectric fan 230 through the second air inlet 212, the channel of the extension 250, and the notch in the air inlet baffle 240. The structure provided in this embodiment can achieve stable air supply from dual air inlets to a single rear air inlet 231 without increasing the internal complexity of the housing 210, thus ensuring the heat dissipation stability of the imaging unit 200 under different conditions. In some examples, the air inlet baffle 240 has a U-shaped structure, with its open end facing the direction of the second air inlet 212. The two side walls of the U-shaped air inlet baffle 240 are respectively attached to the two side edges of the rear air inlet 231 of the piezoelectric fan 230; the extension 250 has a tubular structure, with one end sealed to the inside of the second air inlet 212 by adhesive bonding, and the other end sealed to the open end of the air inlet baffle 240 by snap-fit.

[0064] In an alternative embodiment, such as Figure 4 , Figure 5 As shown, the first air inlet 211 has a grille structure; the rear air inlet 231 is positioned opposite to the first air inlet 211.

[0065] In this embodiment, the first air inlet 211 of the grille structure is composed of multiple arrayed perforated holes, serving as a gas flow channel. The grille structure can block larger particles of debris from the external environment, reducing the risk of debris entering the housing 210 and affecting the normal operation of the piezoelectric fan 230 or the heating module 220. The rear air intake end 231 of the piezoelectric fan 230 is positioned opposite to the first air inlet 211, allowing external cold air to flow directly into the air intake area (rear air intake end 231) of the piezoelectric fan 230 via a shorter straight path when in the unfolded state. This relative arrangement reduces the turning and bypassing of airflow inside the housing 210, lowers flow resistance, and thus improves the air intake efficiency of the piezoelectric fan 230, enhancing the overall heat dissipation performance.

[0066] In an alternative embodiment, such as Figure 2 , Figure 3 As shown, the main body 100 is provided with a heat dissipation guiding structure 110; in the retracted state, the side of the housing 210 with the air outlet 213 faces the heat dissipation guiding structure 110 on the main body 100, so that the airflow discharged from the air outlet 213 flows through the heat dissipation guiding structure 110.

[0067] In this embodiment, the heat dissipation guiding structure 110 can be a heat dissipation fin, a guide groove, or a guide plate disposed on the surface of the main body 100, used to guide the airflow discharged from the air outlet 213 of the imaging unit 200. When the imaging unit 200 is in the retracted state, the air outlet 213 of the housing 210 is aligned with the heat dissipation guiding structure 110 of the main body 100. At this time, the airflow driven by the piezoelectric fan 230 and discharged from the air outlet 213 will flow along the heat dissipation guiding structure 110 after leaving the housing 210 of the imaging unit 200, reducing the accumulation and backflow of hot air between the imaging unit 200 and the main body 100, thereby improving the heat dissipation stability of the imaging unit 200 in the retracted state.

[0068] In an alternative embodiment, such as Figure 5 and Figure 6 As shown, the imaging unit 200 also includes a heat conduction component 260, which is disposed between the heating module 220 and the piezoelectric fan 230. The heat conduction component 260 includes a thermoelectric cooler 261, which has a first side and a second side facing each other. The first side of the thermoelectric cooler 261 is thermally coupled to the heating module 220, and the second side of the thermoelectric cooler 261 is correspondingly disposed to the airflow action area of ​​the piezoelectric fan 230. The first side is a cold end and the second side is a hot end, and the cold end and the hot end can be switched between each other.

[0069] In this embodiment, a heat conduction component 260 is disposed between the heating module 220 and the piezoelectric fan 230 to conduct the heat generated by the heating module 220 to the airflow area of ​​the piezoelectric fan 230. The thermoelectric cooler 261 (TEC) operates based on the Peltier effect; the input current can create a temperature difference between its first and second surfaces, achieving active cooling or heating. Under normal heat dissipation conditions, the thermoelectric cooler 261 is forward-biased, with the first surface (cold end) absorbing heat from the heating module 220 and the second surface (hot end) releasing heat. The airflow generated by the piezoelectric fan 230 carries the heat from the second surface out of the housing 210. By incorporating the thermoelectric cooler 261, the surface temperature of the heating module 220 can be controlled within a lower range, suppressing temperature drift in devices such as image sensors. Meanwhile, the cold and hot ends of the thermoelectric cooler 261 can be switched by changing the direction of the power supply current. The control unit can adjust the operating mode of the thermoelectric cooler 261 according to actual operating conditions (such as changes in ambient humidity or the risk of internal condensation), for example, switching the first side to the hot end for heating and dehumidification, further improving the adaptability and reliability of the heat dissipation components in the imaging unit 200. In some examples, the MEMS piezoelectric fan 230 can be integrated with the thermoelectric cooler 261 into a single module, wherein the thermoelectric cooler 261 adopts a 7104 die solution, with a maximum input current of less than 50mA, an input power of less than 200mW, and a cooling capacity of more than 500mW.

[0070] In an alternative embodiment, such as Figure 5 and Figure 6 As shown, the heat conduction component 260 further includes a thermally conductive material layer 262 and a thermally conductive medium layer 263. One side of the thermally conductive material layer 262 is thermally coupled to the heating module 220; one side of the thermally conductive medium layer 263 is thermally coupled to the thermally conductive material layer 262, and the other side is thermally coupled to the first surface of the thermoelectric cooler 261. The thermally conductive medium layer 263 includes at least one of thermally conductive gel, thermally conductive silicone grease, and thermally conductive pad.

[0071] In this embodiment, the thermally conductive material layer 262 and the thermally conductive medium layer 263 form the heat conduction channel between the heating module 220 and the thermoelectric cooler 261. In some examples, the thermally conductive material layer 262 can be made of a metallic or non-metallic material with a thermal conductivity greater than 20 W / m·K, such as aluminum alloy, copper, or a heat spreader plate. It can be used as a structural reinforcement for the heating module 220, such as an image sensor, to improve the mechanical strength of the component and to quickly conduct the heat generated by the heating module 220. The thermally conductive medium layer 263 fills the space between the thermally conductive material layer 262 and the first surface of the thermoelectric cooler 261. It is made of at least one of thermally conductive gel, thermally conductive silicone grease, or thermally conductive pad. It can eliminate tiny gaps between solid contact surfaces, reduce interfacial contact thermal resistance, thereby improving the efficiency of heat transfer from the heating module 220 to the thermoelectric cooler 261, reducing heat loss, and improving heat dissipation efficiency.

[0072] In an optional embodiment, the heat conduction component 260 further includes: a temperature acquisition module disposed within the housing 210 for acquiring temperature data, the temperature data including a first temperature of a first surface, a second temperature of a second surface, and a third temperature of the housing 210; wherein, the thermoelectric cooler 261 adjusts its operating power and / or switches between the hot end and the cold end based on the temperature data acquired by the temperature acquisition module.

[0073] In this embodiment, the temperature acquisition module may include multiple temperature sensors, such as contact-type NTC thermistors or non-contact infrared temperature sensors. When using NTC thermistors, they are respectively arranged on the first side, the second side, and the inner wall or outer surface of the housing 210. When using infrared temperature sensors, the temperature status of the above three nodes can be acquired simultaneously by a single sensor. By acquiring the first temperature, the second temperature, and the third temperature, the control unit of the gimbal device can evaluate the current heat load of the heating module 220, the operating status of the thermoelectric cooler 261, and the tactile temperature of the surface of the housing 210. Based on the aforementioned temperature data, the control unit can dynamically adjust the electrical power input to the thermoelectric cooler 261 (e.g., by adjusting the duty cycle through pulse width modulation) to balance heat dissipation requirements and overall power consumption; or under specific conditions (e.g., when the temperature difference between the first and third temperatures is large, or when the thermoelectric cooler 261 has been operating for a long time and there is a risk of condensation), the control unit can switch the polarity of the thermoelectric cooler 261, so that the first surface changes from the cold end to the hot end for heating and dehumidification; by adjusting based on the aforementioned temperature threshold, the operational stability of the thermoelectric cooler 261 and its adaptability to different operating conditions can be improved.

[0074] In some examples, the temperature acquisition module includes three NTC thermistors: a first NTC is attached to the contact surface between the first side of the thermoelectric cooler 261 and the heat-conducting medium layer 263, for acquiring a first temperature; a second NTC is attached to the center of the second side of the thermoelectric cooler 261, for acquiring a second temperature; and a third NTC is attached to the inner surface of the third panel 216 of the housing 210, corresponding to the position of the air outlet 213, for acquiring a third temperature. The control unit pre-stores a first preset temperature threshold, a second preset temperature threshold, and a third preset temperature threshold. When the first temperature is greater than the first preset temperature threshold and less than the second preset temperature threshold, the thermoelectric cooler 261 is controlled to operate at a first power; when the first temperature is greater than the second preset temperature threshold and less than the third preset temperature threshold, the thermoelectric cooler 261 is controlled to operate at a second power, which is greater than the first power.

[0075] In an alternative embodiment, such as Figures 3 to 5 As shown, a heating element is provided inside the main body 100; in the retracted state, the housing 210 is attached to the area of ​​the main body 100 near the heating element.

[0076] In this embodiment, the heat-generating components inside the main body 100 include a central processing unit, a power management chip, or other high-power electronic components. When the shooting unit 200 is in the retracted state, the housing 210 folds towards the main body 100 and rests against the area of ​​the main body 100 near the heat-generating components. Combined with the airflow discharge path of the aforementioned air outlet 213, the airflow generated by the piezoelectric fan 230, after exiting the housing 210, can act on the surface of the high-heat area of ​​the main body 100 or its corresponding heat dissipation guiding structure 110. In the folded storage or standby state of the gimbal device, the airflow flowing in from the second air inlet 212 and the airflow flowing out from the air outlet 213 can provide auxiliary convection heat dissipation for the heat-generating area of ​​the main body 100, improving the heat distribution of the entire device in the retracted state.

[0077] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0078] In the various embodiments of the specification, some or all of the steps and their optional implementations can be arbitrarily combined with some or all of the steps in other embodiments, or arbitrarily combined with the optional implementations in other embodiments.

[0079] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A gimbal device, characterized in that, The device includes a main body and a camera unit movably connected to the main body. The camera unit has an extended state and a retracted state relative to the main body. The camera unit includes: The housing has a first air inlet, a second air inlet, and an air outlet; A heating module is disposed within the housing; and A piezoelectric fan, disposed within the housing, is used to generate airflow; When the camera unit is in the unfolded state, airflow enters the housing through the first air inlet and the second air inlet, flows through the heating module, and is discharged through the air outlet; when the camera unit is in the retracted state, airflow enters the housing through the second air inlet, flows through the heating module, and is discharged through the air outlet.

2. The gimbal device according to claim 1, characterized in that, The housing has a first panel, a second panel, and a third panel; The first air inlet is located on the first panel, the second air inlet is located on the second panel, and the air outlet is located on the third panel; In the retracted state, the first panel rests against the main body.

3. The gimbal device according to claim 2, characterized in that, The piezoelectric fan is provided with a rear air inlet and a side air outlet. The first air inlet and the second air inlet are connected to different positions of the rear air inlet, and the air outlet is connected to the side air outlet. Airflow enters through the first air inlet and the second air inlet, flows sequentially through the back air inlet and the side air outlet, and is then discharged through the air outlet.

4. The gimbal device according to claim 3, characterized in that, A first flow channel is provided between the first air inlet and the rear air inlet, and a second flow channel is provided between the second air inlet and the rear air inlet. Airflow enters through the first air inlet and the second air inlet, flows through the first flow channel and the second flow channel respectively, and then enters from the rear air inlet.

5. The gimbal device according to claim 4, characterized in that, The camera unit also includes: An air inlet baffle is connected between the first panel and the piezoelectric fan, and the air inlet baffle surrounds the rear air inlet, so that the rear air inlet, the first air inlet and the air inlet baffle constitute the first flow channel.

6. The gimbal device according to claim 5, characterized in that, The air inlet baffle is provided with a notch, and the notch is provided corresponding to the second air inlet. The camera unit also includes: An extension component has a through channel inside, one end of which is connected to the second air inlet of the housing, and the other end is connected to the notch of the air inlet baffle, forming the second flow channel.

7. The gimbal device according to claim 3, characterized in that, The first air inlet has a grille structure; the rear air inlet is positioned opposite to the first air inlet.

8. The gimbal device according to claim 1, characterized in that, The main body is provided with a heat dissipation guiding structure; In the retracted state, the side of the housing with the air outlet faces the guiding heat dissipation structure on the main body, so that the airflow discharged from the air outlet flows through the guiding heat dissipation structure.

9. The gimbal device according to claim 1, characterized in that, The imaging unit further includes a heat conduction component, which is disposed between the heating module and the piezoelectric fan; the heat conduction component includes: A thermoelectric cooler has a first side and a second side facing each other. The first side of the thermoelectric cooler is thermally coupled to the heating module, and the second side of the thermoelectric cooler is correspondingly arranged to the airflow action area of ​​the piezoelectric fan. The first side and the second side are respectively a cold end and a hot end, and the cold end and the hot end can be switched between each other.

10. The gimbal device according to claim 9, characterized in that, The heat conduction component also includes: A temperature acquisition module is disposed inside the housing and is used to acquire temperature data, the temperature data including a first temperature of the first surface, a second temperature of the second surface, and a third temperature of the housing; The thermoelectric cooler adjusts its operating power and / or switches the hot end and the cold end based on the temperature data collected by the temperature acquisition module.

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