Temperature control device, method and storage medium for a heating plate

Abstract

The application provides a temperature control device, method and storage medium of a heating disc. The temperature control device of the heating disc comprises a first power controller, a second power controller and a temperature controller. The first power controller is connected to a first area of the heating disc and is configured to collect a first resistance value of the first area of the heating disc at a plurality of preset first time points. The second power controller is connected to a second area of the heating disc and is configured to collect a second resistance value of the second area of the heating disc at the plurality of first time points. The temperature controller is connected to the first power controller and the second power controller and is configured to determine a first output power of the first power controller and a second output power of the second power controller according to the first resistance value and the second resistance value respectively, and output the first output power and the second output power to the first area and the second area respectively at a plurality of preset second time points.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing, and more particularly to a temperature control device for a heating plate, a temperature control method for a heating plate, and a computer-readable storage medium. Background Technology

[0002] As the semiconductor industry becomes increasingly sensitive to temperature fluctuations in processes such as coating, the precision requirements for heating plate temperature control have also increased significantly. The accuracy of heating plate temperature control directly determines product quality. Currently, traditional temperature control devices rely on changes in the heating plate's electrical parameters to indirectly reflect its temperature status. However, this approach requires the power supply circuit on the heating plate to simultaneously handle both power output and status detection. These detection and output actions overlap and interfere with each other, and electrical disturbances generated during power supply can easily intrude into the detection signal, making it difficult to guarantee the accuracy and stability of the detection results. Consequently, the temperature information derived from this deviation is also inaccurate, affecting the accuracy and uniformity of temperature control across different areas of the heating plate.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved temperature control device for heating plates, which can improve the anti-interference ability and response speed of heating plate temperature detection, make the temperature control of the inner and outer zones of the heating plate more accurate and balanced, thereby improving the uniformity of wafer heating under high-temperature processes and extending the service life of the heating plate. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] To overcome the aforementioned deficiencies in the prior art, this invention provides a temperature control device for a heating plate, a temperature control method for a heating plate, and a computer-readable storage medium. This device can collect resistance values ​​of various regions of the heating plate at multiple first time points and output power to each region at multiple second time points, achieving time-division multiplexing of resistance detection and power output. This improves the anti-interference capability and response speed of the heating plate temperature detection, making the temperature control of the inner and outer regions of the heating plate more precise and balanced. This, in turn, improves the uniformity of wafer heating under high-temperature processes and extends the service life of the heating plate.

[0006] Specifically, the temperature control device for the heating plate according to the first aspect of the present invention includes a first power controller, a second power controller, and a temperature controller. The first power controller is connected to a first region of the heating plate and is configured to: acquire a first resistance value of the first region of the heating plate at a preset plurality of first time points. The second power controller is connected to a second region of the heating plate and is configured to: acquire a second resistance value of the second region of the heating plate at the plurality of first time points. The temperature controller is connected to the first power controller and the second power controller and is configured to: determine a first output power of the first power controller and a second output power of the second power controller based on the first resistance value and the second resistance value, respectively; and send the first output power and the second output power to the first region and the second region, respectively, at a preset plurality of second time points.

[0007] Furthermore, in some embodiments of the present invention, the first power controller and the second power controller respectively acquire the first resistance value and the second resistance value through the power supply circuits of the first region and the second region. The plurality of first time points are the moments when the voltage value of the power supply circuit changes from a positive value to a negative value. The plurality of second time points are the moments when the voltage value changes from a negative value to a positive value.

[0008] Furthermore, in some embodiments of the present invention, the step of collecting the first resistance value of the first region of the heating plate at a preset plurality of first time points includes: triggering an interrupt at the plurality of first time points, and collecting the first resistance value of the first region of the heating plate after a preset first duration of the interruption, so as to avoid harmonic interference at the plurality of first time points.

[0009] Furthermore, in some embodiments of the present invention, the power supply circuit uses alternating current (AC), and each AC cycle is divided into a positive half-cycle and a negative half-cycle. The plurality of first time points are plurality of first zero points at which the positive half-cycle transitions to the negative half-cycle. The plurality of second time points are plurality of second zero points at which the negative half-cycle transitions to the positive half-cycle.

[0010] Furthermore, in some embodiments of the present invention, the temperature controller is further configured to: acquire a first target temperature of the first region and a second target temperature of the second region; and determine the output duty cycle of the first power controller and the second power controller in each AC cycle based on the difference between the first temperature value and the first target temperature, and the difference between the second temperature value and the second target temperature.

[0011] Furthermore, in some embodiments of the present invention, the frequency of the alternating current is 50Hz. The duration of the alternating current cycle is 20ms. The duration of the positive half-cycle and the negative half-cycle is 10ms.

[0012] Furthermore, in some embodiments of the present invention, the step of determining the first output power of the first power controller and the second output power of the second power controller based on the first resistance value and the second resistance value respectively includes: determining the first temperature value of the first region based on the first resistance value and a pre-calibrated resistance-temperature curve; determining the second temperature value of the second region based on the second resistance value and the resistance-temperature curve; and determining the first output power of the first power controller and the second output power of the second power controller based on the first temperature value and the second temperature value respectively.

[0013] Furthermore, in some embodiments of the present invention, the first region is a circular region with a first diameter at the center of the heating plate. The second region is an annular region concentric with the first region on the periphery of the heating plate.

[0014] Furthermore, the temperature control method for the heating plate provided according to the second aspect of the present invention includes the following steps: acquiring a first resistance value of a first region of the heating plate at a preset plurality of first time points via a first power controller in the temperature control device for the heating plate provided in the first aspect of the present invention; acquiring a second resistance value of a second region of the heating plate at the plurality of first time points via a second power controller in the temperature control device; determining a first output power of the first power controller and a second output power of the second power controller based on the first resistance value and the second resistance value respectively; and sending the first output power and the second output power to the first power controller and the second power controller respectively at a preset plurality of second time points, so as to adjust the temperature of the first region and the second region to their target temperature respectively.

[0015] Furthermore, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, the temperature control method for the heating plate as provided in the second aspect of the present invention is implemented. Attached Figure Description

[0016] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0017] Figure 1A schematic diagram of the structure of a temperature control device for a heating plate provided according to some embodiments of the present invention is shown.

[0018] Figure 2 A schematic flowchart of a temperature control method for a heating plate according to some embodiments of the present invention is shown.

[0019] Figure 3 A schematic diagram illustrating the principle of a temperature control method for a heating plate according to some embodiments of the present invention is shown. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0023] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0024] As mentioned above, traditional temperature control devices rely on changes in the electrical parameters of the heating plate itself to indirectly reflect its temperature status. However, under this approach, the power supply circuit on the heating plate needs to simultaneously perform both power output and status detection functions. The detection and output actions overlap and interfere with each other in time. Electrical disturbances generated during the power supply process can easily be mixed into the detection signal, making it difficult to guarantee the accuracy and stability of the detection results. Consequently, the temperature information obtained from this process will also be inaccurate, thus affecting the accuracy and uniformity of temperature control in different areas of the heating plate.

[0025] To overcome the aforementioned deficiencies in the prior art, this invention provides a temperature control device for a heating plate, a temperature control method for a heating plate, and a computer-readable storage medium. This device can collect resistance values ​​of various regions of the heating plate at multiple first time points and output power to each region at multiple second time points, achieving time-division multiplexing of resistance detection and power output. This improves the anti-interference capability and response speed of the heating plate temperature detection, making the temperature control of the inner and outer regions of the heating plate more precise and balanced. This, in turn, improves the uniformity of wafer heating under high-temperature processes and extends the service life of the heating plate.

[0026] In some non-limiting embodiments, the temperature control device for the heating plate provided in the first aspect of the present invention can be implemented based on the temperature control method for the heating plate provided in the second aspect of the present invention.

[0027] Please refer to the details. Figure 1 . Figure 1 A schematic diagram of the structure of a temperature control device for a heating plate provided according to some embodiments of the present invention is shown.

[0028] exist Figure 1 In the embodiment shown, the temperature control device for the heating plate provided by the first aspect of the present invention includes a first power controller 11, a second power controller 12, and a temperature controller 13.

[0029] Here, the first power controller 11 is connected to the first area of ​​the heating plate 20, and is used to collect the first resistance value of the first area and output the first output power to the first area to adjust the temperature of the first area to its target temperature.

[0030] Similarly, the second power controller 12 is connected to the second region of the heating plate 20 to collect the second resistance value of the second region and output a second output power to the second region to adjust the temperature of the second region to its target temperature.

[0031] Temperature controller 13 is connected to first power controller 11 and second power controller 12, and is used to determine its corresponding first output power and second output power based on the first resistance value and second resistance value collected by first power controller 11 and second power controller 12, and send them to first power controller 11 and second power controller 12.

[0032] Furthermore, in some embodiments, the temperature controller 13 transmits power control commands to the first power controller 11 and the second power controller 12 using analog signals. For example, the temperature controller 13 transmits control signals corresponding to a first output power and a second output power to the first power controller 11 and the second power controller 12 respectively via a 4-20 mA current loop signal. The first power controller 11 and the second power controller 12 then output corresponding power to the first region and the second region at multiple second time points based on the received control signals. The temperature controller 13 may be a 3508 type temperature controller, which supports controlling the lower-level power controller via a 4-20 mA analog output.

[0033] In addition, in some embodiments, the temperature controller 13 can also communicate with a host computer (e.g., a process management controller) via a fieldbus (e.g., DeviceNet) to set the target temperatures of the first and second zones, and to read the process values ​​and alarm values ​​of the temperature control device. The first power controller 11 and the second power controller 12 can also report their output voltage, current, and other operating parameters to the host computer via an industrial Ethernet (e.g., EtherNet) to monitor the operating status of the heating plate 20.

[0034] Furthermore, in some non-limiting embodiments, the temperature control device for the heating plate also includes a memory. Here, the memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect above, on which computer instructions are stored. The first power controller 11, the second power controller 12, and the temperature controller 13 are connected to the memory and configured to execute the computer instructions stored in the memory to implement the temperature control method for the heating plate as provided in the second aspect of the invention.

[0035] The working principle of the temperature control device for the heating plate described above will be described below with reference to some embodiments of the temperature control methods for the heating plate. Those skilled in the art will understand that these embodiments of the temperature control methods for the heating plate are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide some specific solutions convenient for public implementation, rather than limiting all functions or all operating modes of the temperature control device for the heating plate. Similarly, the temperature control device for the heating plate is also only one non-limiting implementation provided by the present invention, and does not constitute a limitation on the executing subject and execution order of each step in these temperature control methods for the heating plate.

[0036] Please refer to Figure 2 . Figure 2 A schematic flowchart of a temperature control method for a heating plate according to some embodiments of the present invention is shown.

[0037] like Figure 2 As shown, the temperature control device for the heating plate provided in the first aspect of the present invention can first collect the first resistance value of the first region of the heating plate 20 at a preset number of first time points via the first power controller 11, and collect the second resistance value of the second region of the heating plate 20 at a preset number of first time points via the second power controller 12.

[0038] Here, the first region is a circular region with a first diameter at the center of the heating plate 20, and the second region is an annular region on the periphery of the heating plate 20 that is concentric with the first region.

[0039] Furthermore, the first power controller 11 and the second power controller 12 respectively acquire the first resistance value and the second resistance value through the power supply circuits of the first region and the second region. Here, the aforementioned multiple first time points are the moments when the voltage value of the power supply circuit changes from a positive value to a negative value. The aforementioned multiple second time points are the moments when the voltage value changes from a negative value to a positive value.

[0040] Thus, the temperature control device, method, and storage medium of the heating plate provided by the present invention can periodically sample the resistance values ​​of the first and second regions at each time the voltage value changes from positive to negative via the first power controller 11 and the second power controller 12, and output power to the first and second regions at the time the voltage value changes from negative to positive. This allows the resistance detection and power output to be staggered in time and multiplexed using the same power supply circuit. In this way, without adding temperature measuring elements or changing the structure of the heating plate, resistance data that can reflect the true heating state of each region can be obtained, and interference of power output on the resistance measurement signal can be effectively avoided, thereby improving the accuracy and stability of resistance measurement.

[0041] In addition, in some preferred embodiments, the first power controller 11 can trigger an interrupt at multiple first time points, and after a preset first duration of interruption (e.g., 2ms), acquire the first resistance value of the first region of the heating plate 20 to avoid harmonic interference at the first time point.

[0042] Similarly, the second power controller 12 can also trigger an interrupt at multiple first time points, and after a preset first duration of the interrupt, collect the second resistance value of the second region of the heating plate 20 to avoid harmonic interference at the first time point.

[0043] Thus, the temperature control device, method, and storage medium for the heating plate provided by the present invention can be delayed for a preset first duration after an interruption is triggered at the first time point, avoiding the harmonic interference window near the zero crossing point, further improving the measurement accuracy of the resistance value, thereby improving the accuracy of the temperature value obtained by reverse calculation based on the resistance value, and providing a more reliable control basis for subsequent power adjustment.

[0044] Please refer to further information. Figure 3 . Figure 3 A schematic diagram illustrating the principle of a temperature control method for a heating plate according to some embodiments of the present invention is shown.

[0045] exist Figure 3 In the illustrated embodiment, the power supply circuit uses alternating current (AC), and each AC cycle is divided into a positive half-cycle and a negative half-cycle. Here, multiple first time points are multiple first zero points 31 when the positive half-cycle transitions to the negative half-cycle, and multiple second time points are multiple second zero points 32 when the negative half-cycle transitions to the positive half-cycle.

[0046] Specifically, the frequency of the aforementioned alternating current is 50Hz, the duration of the alternating cycle is 20ms, and the duration of the positive half-cycle and the negative half-cycle is 10ms.

[0047] At 0ms of each AC cycle, the first power controller 11 and the second power controller 12 capture the first zero point 31 and trigger an MCU interrupt. To avoid minor harmonic interference near the zero point, a 2ms delay is set after the interrupt trigger before the current channel's heating band resistance acquisition begins. Here, the resistance acquisition for this channel takes approximately 3ms, and data filtering, resistance calculation, and output duty cycle calculation are completed before 10ms. At 10ms, the first power controller 11 and the second power controller 12 capture the second zero point 32 and synchronously execute a power switching action (e.g., turning on or off the heating band in the corresponding area), which is completed within 10ms. At 20ms, the AC voltage enters the next AC cycle, and the above detection and temperature control process is repeated.

[0048] Thus, the resistance measurement is completed during the low-interference period after the first zero point 31, and the power output is executed synchronously at the second zero point 32. The detection window and the temperature control window do not overlap in time, which ensures that the resistance measurement is not affected by the power output disturbance and that the power switch action is strictly synchronized with the AC waveform.

[0049] Furthermore, in some embodiments, the first power controller 11 and the second power controller 12 perform resistance acquisition on each heating band of the heating plate 20 according to a polling cycle. Specifically, after the acquisition of the first heating band (e.g., the first region) is completed at the first zero point 31 of the current AC cycle, the acquisition is switched to the next channel (e.g., the second region) at the first zero point 31 of the subsequent AC cycle, so that the acquisition of subsequent channels is sequentially matched with the next first zero point 31. In this way, the resistance acquisition of each heating band starts from the same relative time after the first zero point 31 and is completed before the second zero point 32, ensuring the consistency of the acquisition conditions of each channel and the comparability of the detection results.

[0050] After that, such as Figure 2 As shown, the temperature control device for the heating plate provided in the first aspect of the present invention can determine the first output power of the first power controller and the second output power of the second power controller based on the first resistance value and the second resistance value, respectively, via the temperature controller 13.

[0051] Specifically, the temperature controller 13 can determine the first temperature value of the first region based on the first resistance value and the pre-calibrated resistance-temperature curve.

[0052] Similarly, the temperature controller 13 can determine the second temperature value of the second region based on the second resistance value and the resistance-temperature curve.

[0053] Then, the temperature controller 13 can determine the first output power of the first power controller and the second output power of the second power controller based on the first temperature value and the second temperature value, respectively.

[0054] Specifically, before normal use, the temperature control device of the heating plate can first calibrate the resistance and temperature curve of the heating plate 20. During the calibration stage, the wafer is heated by a thermocouple installed on the heating plate 20, and the wafer temperature at different temperature points, as well as the resistance values ​​of the first and second regions of the heating plate 20 corresponding to each temperature point, are collected. The wafer temperature and the heating plate resistance value are matched and stored to form a resistance and temperature curve. The resistance detection during the calibration process can also adopt the zero-point detection method described above, that is, the resistance value is collected when the voltage value of the power supply circuit changes from a positive value to a negative value, so as to reduce the interference of the power supply waveform on the calibration data. After calibration, the normal heating stage no longer relies on thermocouples. Instead, the first power controller 11 and the second power controller 12 periodically collect the resistance values ​​of the first and second regions, and calculate the corresponding temperature value according to the resistance and temperature curve to realize the temperature control of the heating plate 20.

[0055] Those skilled in the art will understand that the above-described embodiments of converting resistance values ​​to temperature values ​​via a temperature controller are merely some non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are easy for the public to implement, rather than intended to limit the scope of protection of the present invention.

[0056] Optionally, in other embodiments, the conversion from resistance value to temperature value can also be performed by the first power controller 11 and the second power controller 12 respectively. After acquiring the first resistance value and the second resistance value, the first power controller 11 and the second power controller 12 respectively calculate the first temperature value of the first region and the second temperature value of the second region according to the resistance-temperature curve, and feed back the temperature values ​​to the temperature controller 13 through the communication link. The temperature controller 13 determines the corresponding output power based on the fed-back temperature values. The transmission of temperature values ​​and power control commands can use analog signals or industrial communication methods such as EtherNet and DeviceNet. Variations of such implementation methods do not depart from the protection scope of this invention.

[0057] Furthermore, under high-temperature process conditions (e.g., above 600°C), the temperature difference between the inner and outer rings of the heating plate 20 becomes more pronounced. To address this, the temperature controller 13 can acquire a first target temperature for the first region and a second target temperature for the second region. Based on the difference between the first temperature value and the first target temperature, and the difference between the second temperature value and the second target temperature, it determines the output duty cycle of the first and second power controllers in each AC cycle, i.e., the time percentage of actual output power within each AC cycle. Since the duty cycle directly determines the average current delivered to the corresponding region in each AC cycle, this invention effectively achieves differentiated power output distribution between the inner and outer regions by controlling the current ratio of the inner and outer regions. This allows the outer ring region, which dissipates heat more quickly, to receive a higher heating percentage, thereby ensuring approximately balanced temperatures between the inner and outer regions.

[0058] Thus, the temperature control device, method, and storage medium of the heating plate provided by the present invention can independently adjust the output duty cycle of the first power controller 11 and the second power controller 12 in each AC cycle according to the temperature difference between the first region and the second region and their respective target temperatures, so that the region with a lower temperature gets a larger heating ratio and the region with a higher temperature gets a smaller heating ratio. In this way, the temperature of the inner and outer regions of the heating plate tends to be balanced by controlling the current ratio of the inner and outer regions, avoiding the impact on process uniformity and shortening the service life of the heating plate due to excessive temperature difference between the inner and outer regions.

[0059] After that, such as Figure 2 As shown, the temperature control device for the heating plate provided in the first aspect of the present invention can output a first output power and a second output power to the first power controller 11 and the second power controller 12 respectively at a plurality of preset second time points via the temperature controller 13, so as to adjust the temperature of the first region and the second region to their target temperature respectively.

[0060] In summary, the temperature control device, method, and storage medium for the heating plate provided by the present invention can collect the resistance values ​​of each region of the heating plate at multiple first time points and output power to each region at multiple second time points, thereby realizing time-division multiplexing of resistance detection and power output. This improves the anti-interference capability and response speed of the heating plate temperature detection, making the temperature control of the inner and outer regions of the heating plate more accurate and balanced, thereby improving the uniformity of wafer heating under high-temperature processes and extending the service life of the heating plate.

[0061] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0062] Those skilled in the art will understand that information, signals, and data can be represented using any of a variety of different techniques and skills. For example, the data, instructions, commands, information, signals, bits, symbols, and chips described throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0063] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps are described above in a generalized manner in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention.

[0064] Although the controller described in the above embodiments can be implemented through a combination of software and hardware, it is understood that the controller can also be implemented in software or hardware. For hardware implementation, the controller can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection of combinations of the above devices. For software implementation, the controller can be implemented using independent software modules such as procedures and functions running on a general-purpose chip, each module performing one or more functions and operations described herein.

[0065] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0066] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0067] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A temperature control device for a heating plate, characterized in that, include: A first power controller, connected to a first region of the heating plate, is configured to: collect the first resistance value of the first region of the heating plate at multiple preset first time points; A second power controller, connected to a second region of the heating plate, is configured to: acquire a second resistance value of the second region of the heating plate at a plurality of first time points; as well as A temperature controller, connected to the first power controller and the second power controller, is configured to: determine the first output power of the first power controller and the second output power of the second power controller based on the first resistance value and the second resistance value, respectively. And at a plurality of preset second time points, the first output power and the second output power are respectively sent to the first power controller and the second power controller to adjust the temperature of the first region and the second region to their target temperature respectively.

2. The temperature control device as described in claim 1, characterized in that, The first power controller and the second power controller respectively collect the first resistance value and the second resistance value through the power supply circuits of the first region and the second region, wherein the plurality of first time points are the moments when the voltage value of the power supply circuit changes from a positive value to a negative value, and the plurality of second time points are the moments when the voltage value changes from a negative value to a positive value.

3. The temperature control device as described in claim 2, characterized in that, The step of collecting the first resistance value of the first region of the heating plate at a preset plurality of first time points includes: An interrupt is triggered at the plurality of first time points, and after a preset first duration of the interrupt, the first resistance value of the first area of ​​the heating plate is collected to avoid harmonic interference at the plurality of first time points.

4. The temperature control device as described in claim 2, characterized in that, The power supply circuit uses alternating current, and each alternating current cycle is divided into a positive half-cycle and a negative half-cycle. The plurality of first time points are the plurality of first zero points when the positive half-cycle turns into the negative half-cycle, and the plurality of second time points are the plurality of second zero points when the negative half-cycle turns into the positive half-cycle.

5. The temperature control device as described in claim 4, characterized in that, The frequency of the alternating current is 50Hz, the duration of the alternating cycle is 20ms, and the duration of the positive half-cycle and the negative half-cycle is 10ms.

6. The temperature control device as described in claim 4, characterized in that, The step of determining the first output power of the first power controller and the second output power of the second power controller based on the first resistance value and the second resistance value respectively includes: Based on the first resistance value and the pre-calibrated resistance-temperature curve, determine the first temperature value of the first region; Based on the second resistance value and the resistance-temperature curve, determine the second temperature value of the second region; and The first output power of the first power controller and the second output power of the second power controller are determined based on the first temperature value and the second temperature value, respectively.

7. The temperature control device as described in claim 6, characterized in that, The temperature controller is also configured to: Obtain the first target temperature of the first region and the second target temperature of the second region; and Based on the difference between the first temperature value and the first target temperature, and the difference between the second temperature value and the second target temperature, the output duty cycle of the first power controller and the second power controller in each AC cycle is determined.

8. The temperature control device as described in claim 1, characterized in that, The first region is a circular region with a first diameter at the center of the heating plate, and the second region is an annular region on the periphery of the heating plate that is concentric with the first region.

9. A method for controlling the temperature of a heating plate, characterized in that, Includes the following steps: The first resistance value of the first region of the heating plate is collected at a plurality of preset first time points via the first power controller in the temperature control device of the heating plate as described in any one of claims 1 to 8. The second resistance value of the second region of the heating plate is acquired at the plurality of first time points via the second power controller; The first output power of the first power controller and the second output power of the second power controller are determined based on the first resistance value and the second resistance value, respectively. as well as At multiple preset second time points, the first output power and the second output power are sent to the first power controller and the second power controller respectively, so as to adjust the temperature of the first region and the second region to their target temperature respectively.

10. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the temperature control method for the heating plate as described in claim 9 is implemented.

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