Method and system for power management optimization of low voltage loss high speed optical module

Abstract

The present application belongs to the technical field of power management, and particularly relates to a high-speed optical module power management optimization method and system with low voltage loss. The present application introduces a transient feedforward compensation mechanism, which makes up for the deficiency of the response lag of the conventional single temperature compensation to load transient changes, can effectively suppress the voltage transient drop caused by the sudden change of the laser modulation current, and multi-dimensionally fuses the temperature compensation value, the junction temperature partition nonlinear compensation component and the transient feedforward compensation component to form a comprehensive line voltage drop compensation value, and the feedback deviation of the actual voltage at the far end jointly acts on the digital-to-analog converter output adjustment, realizes the double-channel collaborative compensation of feedforward plus feedback, and makes the optical module load end voltage quickly and accurately approach the preset target voltage under various working conditions, which can significantly reduce the voltage loss of the optical module power supply line.

Description

Technical Field

[0001] This invention belongs to the field of power management technology, specifically relating to a power management optimization method and system for high-speed optical modules with low voltage loss. Background Technology

[0002] High-speed optical modules have extremely high requirements for the accuracy and stability of the power supply voltage. The load current of the optical module changes drastically with the working state, and the voltage drop of the power supply line fluctuates continuously. At the same time, changes in ambient temperature cause line impedance drift, which further aggravates the voltage deviation at the load end and affects the quality of the optical eye diagram and the bit error rate.

[0003] In conventional optical module power supply line voltage drop compensation schemes, a single temperature sensor is commonly used to compensate for the temperature drift of the output voltage. That is, the output voltage is linearly adjusted according to the ambient temperature or chip junction temperature with a fixed coefficient. Although this method can offset the temperature drift of the line impedance to a certain extent, it has obvious shortcomings: First, it does not consider the impact of the optical module's own load current changes on the line voltage drop. When the laser switches between the emission state and the standby state, the load current fluctuates greatly, and a single temperature compensation cannot respond to the voltage drop changes caused by the current change, resulting in obvious compensation lag. Second, it does not distinguish the voltage drop characteristics of the optical module under different operating states. The characteristics of the laser drive current during low-temperature startup are completely different from those during high-temperature full-load operation, and the transient voltage drop caused by the sudden change in the laser modulation current cannot be dealt with by linear temperature drift compensation.

[0004] To address the aforementioned issues, this application presents a method and system for optimizing power management of high-speed optical modules with low voltage loss. Summary of the Invention

[0005] To address the shortcomings of the prior art mentioned in the background section, this application proposes a power management optimization method and system for high-speed optical modules with low voltage loss. This invention solves the problems in the background section by constructing a comprehensive voltage drop compensation mechanism that integrates temperature compensation, load state identification, junction temperature partitioning nonlinear compensation, and transient feedforward multi-dimensional fusion.

[0006] Firstly, to achieve the above objectives, this application provides a power management optimization method for high-speed optical modules with low voltage loss, comprising the following specific steps: Step S1: Connect the digital-to-analog converter output of the analog front-end chip to the reference input of the low dropout linear regulator, and establish a remote voltage feedback link from the load end of the optical module to the analog front-end chip. Step S2: The analog front-end chip synchronously collects the actual voltage at the remote end of the optical module load, the load current in the optical module power supply line, the chip junction temperature, and the ambient temperature. Step S3: Read the pre-stored initial line voltage drop value of the optical module power supply line, and use the current ambient temperature to perform temperature correction on the initial line voltage drop value to obtain the temperature-compensated line voltage drop value. Step S4: Determine the working status of the optical module based on the load current, distinguish the working conditions by combining the chip junction temperature, and combine the corresponding nonlinear compensation component with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value. Step S5: Based on the deviation between the preset target voltage and the actual voltage at the remote end, add the comprehensive line voltage drop compensation value, calculate the target reference voltage value and write it into the digital-to-analog converter, update the reference voltage of the low dropout linear regulator, and compensate for the voltage drop loss of the optical module power supply line. Step S6: When the power supply voltage to the optical module triggers the overvoltage threshold or undervoltage threshold, the comparator first performs hardware shutdown, and then the analog front-end chip captures fault data to distinguish between transient interference and persistent hardware faults, and performs voltage self-healing reset or fault blocking reporting respectively.

[0007] In a preferred embodiment based on the above scheme, step S1 specifically comprises: First, connect one output pin of the analog-to-digital converter inside the analog front-end chip directly to the reference voltage input pin of the low dropout linear regulator through the printed circuit board trace, so that the output voltage of the analog-to-digital converter serves as the only adjustable reference of the low dropout linear regulator. Then, a Kelvin trace, physically separate from the main power supply current path, is led out from the power supply pin pad at the load end of the optical module and connected to the dedicated input channel of the analog-to-digital converter of the analog front-end chip, forming a remote voltage feedback link.

[0008] In a preferred embodiment based on the above scheme, the load current in the optical module power supply line in step S2 is amplified by a differential amplifier by a sampling resistor connected in series in the optical module power supply line and then sent to the analog-to-digital converter of the analog front-end chip for acquisition. The ambient temperature is provided by an external temperature sensor located close to the connector of the optical module's power supply line; The chip junction temperature is provided by a temperature sensor built into the analog front-end chip.

[0009] Based on the above scheme, the preferred temperature correction formula for correcting the initial line voltage drop value using the current ambient temperature in step S3 is as follows: ; in, This represents the line voltage drop value after temperature compensation. The initial line voltage drop value for the power supply line of the optical module, where K is a preset temperature correction factor. The current ambient temperature. For calibration at room temperature.

[0010] Based on the above scheme, step S4 specifically includes the following steps: Step S41: Compare the load current with the preset dynamic load judgment threshold. When the load current is greater than the dynamic load judgment threshold, the optical module is determined to be in the laser emission working state; otherwise, the control circuit is determined to be in the standby state. Step S42: When the change in load current within two adjacent sampling periods exceeds the preset transient jump threshold, output a feedforward compensation component that is proportional to the rate of change of current to offset the voltage transient drop caused by the sudden change in laser modulation current. Step S43: When it is determined that the laser is in the emission working state and the junction temperature of the chip is lower than the preset low temperature threshold, the first nonlinear compensation component is output according to the first set of compensation coefficients to compensate for the voltage drift caused by the laser starting in the low temperature environment. Step S44: When it is determined that the laser is in the emission working state and the chip junction temperature is higher than the preset high temperature threshold and the load current is close to the full load current value, the second nonlinear compensation component is output according to the second set of compensation coefficients to compensate for the additional line voltage drop caused by the laser driving under high temperature and high current. Step S45: Add the compensation components output in steps S42 to S44 algebraically to the line voltage drop value after temperature compensation obtained in step S3 to obtain the comprehensive line voltage drop compensation value.

[0011] Based on the above scheme, the preferred formula for calculating the target reference voltage value in step S5 is: ; in, The target reference voltage value, This is the current output value of the digital-to-analog converter. To preset the target voltage, VFS is the actual voltage at the far end of the optical module load, and VFS is the comprehensive line voltage drop compensation value used as a feedforward compensation term. This represents the voltage deviation, which is used as a feedback correction term.

[0012] In a preferred embodiment based on the above scheme, step S6 specifically includes the following steps: Step S61: Set the threshold of the overvoltage comparator to be higher than the preset target voltage upper limit, and set the threshold of the undervoltage comparator to be lower than the preset target voltage lower limit. Connect the output terminals of the two comparators to the enable terminal of the low dropout linear regulator or the control terminal of the switching transistor in the power supply path of the optical module, respectively. Step S62: When the power supply voltage output to the optical module exceeds the overvoltage threshold or falls below the undervoltage threshold, the corresponding comparator pulls down the output signal within a nanosecond time, directly turning off the low dropout linear regulator or cutting off the power supply path of the optical module. Step S63: After shutdown, the simulated front-end chip latches the output voltage waveform, load current and chip junction temperature data before shutdown within a preset time window. If the duration of voltage abnormality is less than the preset time threshold and the current surge amplitude is less than the preset current threshold, it is determined to be a transient interference fault; otherwise, it is determined to be a persistent hardware fault. Step S64: If it is a transient interference fault, recalculate the reference voltage value based on the current actual voltage at the remote end and enable power supply to the optical module. If it is a persistent hardware fault, latch the fault data and keep it off, and report the fault code through the communication interface.

[0013] Secondly, this application provides a low-voltage-loss high-speed optical module power management optimization system, which specifically includes: The link establishment module is used to directly connect one output of the analog-to-digital converter inside the analog front-end chip to the reference voltage input terminal of the low dropout linear regulator, and to lead the far-end voltage of the optical module load terminal back to the analog-to-digital converter input terminal of the analog front-end chip through an independent voltage feedback trace, so as to establish a reference pass-through and far-end voltage feedback link. The synchronous acquisition module is used to control the multi-channel analog-to-digital converter of the analog front-end chip to latch the actual voltage at the far end of the optical module load, the load current in the optical module power supply line, the chip junction temperature and the ambient temperature within the same sampling window. The temperature correction module is used to read the pre-stored initial line voltage drop value of the optical module power supply line, correct the initial line voltage drop value according to the temperature coefficient based on the difference between the current ambient temperature and the calibrated room temperature, and output the temperature-compensated line voltage drop value. The nonlinear compensation module is used to determine the working state of the optical module based on the magnitude and rate of change of the load current, distinguish the working conditions by combining the chip junction temperature and superimposing the corresponding nonlinear compensation component, and combining it with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value. The reference update module is used to calculate the target reference voltage value and write it into the digital-to-analog converter based on the deviation between the preset target voltage and the actual voltage at the remote end, by superimposing the comprehensive line voltage drop compensation value, so as to update the reference voltage of the low dropout linear regulator and compensate for the voltage drop loss of the optical module power supply line. The graded protection module includes an overvoltage comparator and an undervoltage comparator. When the power supply voltage from the low-dropout linear regulator to the optical module triggers the overvoltage comparator or undervoltage comparator, it first performs a fast hardware shutdown. Then, it captures voltage, current, and temperature data at the time of the fault through the analog front-end chip, distinguishes between transient interference and persistent hardware faults, and performs voltage self-healing reset or fault blocking reporting respectively.

[0014] Thirdly, this application provides an electronic device, including: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the aforementioned low-voltage-loss high-speed optical module power management optimization method by calling the computer program stored in the memory.

[0015] Fourthly, this application provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the low-voltage-loss high-speed optical module power management optimization method described above.

[0016] Compared with the prior art, the beneficial effects of the present invention are: First, by synchronously collecting four types of parameters—ambient temperature, load current of the optical module power supply line, chip junction temperature, and actual voltage at the remote end—temperature compensation is combined with load status identification, overcoming the deficiency of conventional single temperature compensation in responding to changes in load current. When changes in load current cause changes in line voltage drop, the system can identify and participate in compensation calculations in real time, rather than relying solely on temperature for adjustment.

[0017] Secondly, based on temperature compensation, this invention further divides the working state of the optical module into zones according to the chip junction temperature, distinguishing between low-temperature start-up, high-temperature full-load, and transient load jump conditions. Corresponding nonlinear compensation components are applied to different conditions. Compared with the conventional linear temperature drift compensation method that uses the same compensation coefficient in different temperature ranges, this solution can perform zoned differentiated compensation for nonlinear characteristics such as voltage drift during low-temperature start-up and additional line voltage drop during high-temperature full-load, resulting in higher compensation accuracy.

[0018] Third, this invention introduces a transient feedforward compensation mechanism. When a transient jump in the load current is detected within an adjacent sampling period, a feedforward compensation amount proportional to the rate of change of the current is directly output. The reference voltage of the low-dropout linear regulator is adjusted in advance before the voltage drop occurs. This mechanism makes up for the shortcomings of conventional single temperature compensation in responding to load transient changes with lag, and can effectively suppress voltage transient drops caused by sudden changes in the laser modulation current.

[0019] Fourth, this invention integrates the above-mentioned temperature compensation value, junction temperature partition nonlinear compensation component, and transient feedforward compensation component in multiple dimensions to form a comprehensive line voltage drop compensation value. This value, together with the feedback deviation of the actual voltage at the far end, acts on the output adjustment of the digital-to-analog converter, realizing dual-channel collaborative compensation of feedforward and feedback. This enables the voltage at the load end of the optical module to quickly and accurately approach the preset target voltage under various operating conditions, which can significantly reduce the voltage loss of the optical module power supply line. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall process of the low-voltage-loss high-speed optical module power management optimization method of the present invention. Figure 2 This is a flowchart illustrating step S4 in this invention; Figure 3 This is a system block diagram of the low-voltage-loss high-speed optical module power management optimization system of the present invention. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] Example 1 To address the technical problems raised in the background art, this application provides a preferred embodiment: such as Figures 1-3 As shown, the power management optimization method for high-speed optical modules with low voltage loss includes the following specific steps: Step S1: Connect the digital-to-analog converter output of the analog front-end chip to the reference input of the low dropout linear regulator, and establish a remote voltage feedback link from the load end of the optical module to the analog front-end chip. Step S2: The analog front-end chip synchronously collects the actual voltage at the remote end of the optical module load, the load current in the optical module power supply line, the chip junction temperature, and the ambient temperature. Step S3: Read the pre-stored initial line voltage drop value of the optical module power supply line, and use the current ambient temperature to perform temperature correction on the initial line voltage drop value to obtain the temperature-compensated line voltage drop value. Step S4: Determine the working status of the optical module based on the load current, distinguish the working conditions by combining the chip junction temperature, and combine the corresponding nonlinear compensation component with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value. Step S5: Based on the deviation between the preset target voltage and the actual voltage at the remote end, add the comprehensive line voltage drop compensation value, calculate the target reference voltage value and write it into the digital-to-analog converter, update the reference voltage of the low dropout linear regulator, and compensate for the voltage drop loss of the optical module power supply line. Step S6: When the power supply voltage to the optical module triggers the overvoltage threshold or undervoltage threshold, the comparator first performs hardware shutdown, and then the analog front-end chip captures fault data to distinguish between transient interference and persistent hardware faults, and performs voltage self-healing reset or fault blocking reporting respectively.

[0023] Furthermore: In an optional embodiment, step S1 specifically involves: First, connect one output pin of the analog-to-digital converter inside the analog front-end chip directly to the reference voltage input pin of the low dropout linear regulator through the printed circuit board trace, so that the output voltage of the analog-to-digital converter serves as the only adjustable reference of the low dropout linear regulator. Then, a Kelvin trace, physically separate from the main power supply current path, is led out from the power supply pin pad at the load end of the optical module and connected to the dedicated input channel of the analog-to-digital converter of the analog front-end chip, forming a remote voltage feedback link.

[0024] In an optional embodiment, the load current in the optical module power supply line in step S2 is amplified by a differential amplifier by a sampling resistor connected in series in the optical module power supply line and then sent to the analog-to-digital converter of the analog front-end chip for acquisition. The ambient temperature is provided by an external temperature sensor located close to the connector of the optical module's power supply line; The chip junction temperature is provided by a temperature sensor built into the analog front-end chip.

[0025] In an optional embodiment, the temperature correction formula for adjusting the initial line voltage drop value using the current ambient temperature in step S3 is as follows: ; in, This represents the line voltage drop value after temperature compensation. The initial line voltage drop value for the power supply line of the optical module, where K is a preset temperature correction factor. The current ambient temperature. For calibration at room temperature.

[0026] It should be noted that the initial line voltage drop of the optical module power supply line is... During the factory calibration phase, when the output voltage of the low dropout linear regulator is known to be fixed, the analog front-end chip successively collects the voltage at the output terminal of the low dropout linear regulator and the far-end voltage at the load terminal of the optical module, and takes the difference between the two.

[0027] Furthermore: In an optional embodiment, step S4 specifically includes the following steps: Step S41: Compare the load current with the preset dynamic load judgment threshold. When the load current is greater than the dynamic load judgment threshold, the optical module is determined to be in the laser emission working state; otherwise, the control circuit is determined to be in the standby state. Step S42: When the change in load current within two adjacent sampling periods exceeds the preset transient jump threshold, output a feedforward compensation component that is proportional to the rate of change of current to offset the voltage transient drop caused by the sudden change in laser modulation current. Step S43: When it is determined that the laser is in the emission working state and the junction temperature of the chip is lower than the preset low temperature threshold, the first nonlinear compensation component is output according to the first set of compensation coefficients to compensate for the voltage drift caused by the laser starting in the low temperature environment. Step S44: When it is determined that the laser is in the emission working state and the chip junction temperature is higher than the preset high temperature threshold and the load current is close to the full load current value, the second nonlinear compensation component is output according to the second set of compensation coefficients to compensate for the additional line voltage drop caused by the laser driving under high temperature and high current. Step S45: Add the compensation components output in steps S42 to S44 algebraically to the line voltage drop value after temperature compensation obtained in step S3 to obtain the comprehensive line voltage drop compensation value.

[0028] In an optional embodiment, the formula for calculating the target reference voltage value in step S5 is: ; in, The target reference voltage value, This is the current output value of the digital-to-analog converter. To preset the target voltage, VFS is the actual voltage at the far end of the optical module load, and VFS is the comprehensive line voltage drop compensation value used as a feedforward compensation term. This represents the voltage deviation, which is used as a feedback correction term.

[0029] In an optional embodiment, step S6 specifically includes the following steps: Step S61: Set the threshold of the overvoltage comparator to be higher than the preset target voltage upper limit, and set the threshold of the undervoltage comparator to be lower than the preset target voltage lower limit. Connect the output terminals of the two comparators to the enable terminal of the low dropout linear regulator or the control terminal of the switching transistor in the power supply path of the optical module, respectively. Step S62: When the power supply voltage output to the optical module exceeds the overvoltage threshold or falls below the undervoltage threshold, the corresponding comparator pulls down the output signal within a nanosecond time, directly turning off the low dropout linear regulator or cutting off the power supply path of the optical module. Step S63: After shutdown, the simulated front-end chip latches the output voltage waveform, load current and chip junction temperature data before shutdown within a preset time window. If the duration of voltage abnormality is less than the preset time threshold and the current surge amplitude is less than the preset current threshold, it is determined to be a transient interference fault; otherwise, it is determined to be a persistent hardware fault. Step S64: If it is a transient interference fault, recalculate the reference voltage value based on the current actual voltage at the remote end and enable power supply to the optical module. If it is a persistent hardware fault, latch the fault data and keep it off, and report the fault code through the communication interface.

[0030] Example 2 Based on the same inventive concept as in Embodiment 1, such as Figure 3 As shown, this embodiment provides a low-voltage-loss high-speed optical module power management optimization system, which specifically includes: The link establishment module is used to directly connect one output of the analog-to-digital converter inside the analog front-end chip to the reference voltage input terminal of the low dropout linear regulator, and to lead the far-end voltage of the optical module load terminal back to the analog-to-digital converter input terminal of the analog front-end chip through an independent voltage feedback trace, so as to establish a reference pass-through and far-end voltage feedback link. The synchronous acquisition module is used to control the multi-channel analog-to-digital converter of the analog front-end chip to latch the actual voltage at the far end of the optical module load, the load current in the optical module power supply line, the chip junction temperature and the ambient temperature within the same sampling window. The temperature correction module is used to read the pre-stored initial line voltage drop value of the optical module power supply line, correct the initial line voltage drop value according to the temperature coefficient based on the difference between the current ambient temperature and the calibrated room temperature, and output the temperature-compensated line voltage drop value. The nonlinear compensation module is used to determine the working state of the optical module based on the magnitude and rate of change of the load current, distinguish the working conditions by combining the chip junction temperature and superimposing the corresponding nonlinear compensation component, and combining it with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value. The reference update module is used to calculate the target reference voltage value and write it into the digital-to-analog converter based on the deviation between the preset target voltage and the actual voltage at the remote end, by superimposing the comprehensive line voltage drop compensation value, so as to update the reference voltage of the low dropout linear regulator and compensate for the voltage drop loss of the optical module power supply line. The graded protection module includes an overvoltage comparator and an undervoltage comparator. When the power supply voltage from the low-dropout linear regulator to the optical module triggers the overvoltage comparator or undervoltage comparator, it first performs a fast hardware shutdown. Then, it captures voltage, current, and temperature data at the time of the fault through the analog front-end chip, distinguishes between transient interference and persistent hardware faults, and performs voltage self-healing reset or fault blocking reporting respectively.

[0031] The parameters and steps for each unit module to achieve the corresponding functions in the low-voltage-loss high-speed optical module power management optimization system of the present invention described above can be referred to the parameters and steps in the embodiments of the low-voltage-loss high-speed optical module power management optimization method above, and will not be repeated here.

[0032] In specific implementation: First, by establishing a reference pass-through and remote voltage feedback link, one output of the analog-to-digital converter inside the analog front-end chip is directly connected to the reference voltage input terminal of the low dropout linear regulator, serving as the adjustable reference of the low dropout linear regulator. At the same time, an independent Kelvin trace is led out from the power supply pin pad at the load end of the optical module and connected to the dedicated input channel of the analog-to-digital converter of the analog front-end chip, forming a remote voltage feedback link.

[0033] Then, four types of parameters are acquired synchronously. Within the same sampling window, the analog front-end chip synchronously latches the actual voltage at the remote end, the load current in the optical module power supply line, the chip junction temperature, and the ambient temperature through a multi-channel analog-to-digital converter.

[0034] Next, the initial line voltage drop value is corrected by temperature. The pre-stored initial line voltage drop value of the optical module power supply line is read. The difference between the current ambient temperature and the calibrated normal temperature is used to correct the initial line voltage drop value according to the preset temperature correction coefficient, so as to obtain the temperature-compensated line voltage drop value.

[0035] Next, through load status identification and nonlinear compensation, the optical module is determined to be in laser emission working state or control circuit standby state based on the load current magnitude. Combined with the chip junction temperature, it distinguishes between low temperature start-up condition, high temperature full load condition and transient load jump condition. The corresponding nonlinear compensation component is superimposed according to the condition and combined with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value.

[0036] Next, the reference voltage is calculated and updated. Based on the deviation between the preset target voltage and the actual voltage at the far end, the total compensation amount is obtained by superimposing the comprehensive line voltage drop compensation value. Then, the current output value of the digital-to-analog converter is added to the total compensation amount to obtain the target reference voltage value, which is written to the digital-to-analog converter to update the reference voltage of the low dropout linear regulator.

[0037] Ultimately, the fault is handled through a graded protection mechanism. When the power supply voltage to the optical module triggers the overvoltage comparator or undervoltage comparator, the comparator performs a hardware shutdown within a nanosecond time. After shutdown, the simulation front-end chip captures the output voltage waveform, load current, and chip junction temperature data at the time of the fault to distinguish between transient interference and persistent hardware faults. If it is a transient interference, the reference voltage is recalculated and the power supply is restored. If it is a persistent hardware fault, the fault data is latched and the shutdown is maintained, while the fault code is reported.

[0038] Example 3 Based on the same inventive concept as Embodiment 1, this embodiment provides an electronic device, including: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the aforementioned low-voltage-loss high-speed optical module power management optimization method by calling the computer program stored in the memory.

[0039] It should be noted that all computer programs for the low-voltage-loss high-speed optical module power management optimization method are implemented in C language.

[0040] Example 4 Based on the same inventive concept as in Embodiment 1, this embodiment proposes a computer-readable storage medium having an erasable and rewritable computer program stored thereon. When the computer program runs on the computer device, it causes the computer device to perform the aforementioned low-voltage-loss high-speed optical module power management optimization method.

[0041] For example, computer-readable storage media can be read-only memory, random access memory, read-only optical disc, magnetic tape, floppy disk, and optical data storage devices.

[0042] The various embodiments in this invention are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on its differences from other embodiments. In particular, the embodiments for IoT devices and media are relatively simple in description because they are fundamentally similar to the method embodiments; relevant parts can be referred to the descriptions in the method embodiments.

[0043] The systems, media, and methods provided in the embodiments of the present invention are in one-to-one correspondence. Therefore, the systems and media also have similar beneficial technical effects as their corresponding methods. Since the beneficial technical effects of the methods have been described in detail above, the beneficial technical effects of the systems and media will not be repeated here.

[0044] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0045] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, as well as combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0046] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0047] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0048] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0049] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0050] Computer-readable media include both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0051] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. The above are merely embodiments of the present invention and are not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A low-voltage-loss power management optimization method for high-speed optical modules, characterized in that, Includes the following steps: Step S1: Connect the digital-to-analog converter output of the analog front-end chip to the reference input of the low dropout linear regulator, and establish a remote voltage feedback link from the load end of the optical module to the analog front-end chip. Step S2: The analog front-end chip synchronously collects the actual voltage at the remote end of the optical module load, the load current in the optical module power supply line, the chip junction temperature, and the ambient temperature. Step S3: Read the pre-stored initial line voltage drop value of the optical module power supply line, and use the current ambient temperature to perform temperature correction on the initial line voltage drop value to obtain the temperature-compensated line voltage drop value. Step S4: Determine the working status of the optical module based on the load current, distinguish the working conditions by combining the chip junction temperature, and combine the corresponding nonlinear compensation component with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value. Step S5: Based on the deviation between the preset target voltage and the actual voltage at the remote end, add the comprehensive line voltage drop compensation value, calculate the target reference voltage value and write it into the digital-to-analog converter, update the reference voltage of the low dropout linear regulator, and compensate for the voltage drop loss of the optical module power supply line. Step S6: When the power supply voltage to the optical module triggers the overvoltage threshold or undervoltage threshold, the comparator first performs hardware shutdown, and then the analog front-end chip captures fault data to distinguish between transient interference and persistent hardware faults, and performs voltage self-healing reset or fault blocking reporting respectively.

2. The low-voltage-loss high-speed optical module power management optimization method according to claim 1, characterized in that: Step S1 specifically involves: First, connect one output pin of the analog-to-digital converter inside the analog front-end chip directly to the reference voltage input pin of the low dropout linear regulator through the printed circuit board trace, so that the output voltage of the analog-to-digital converter serves as the only adjustable reference of the low dropout linear regulator. Then, a Kelvin trace, physically separate from the main power supply current path, is led out from the power supply pin pad at the load end of the optical module and connected to the dedicated input channel of the analog-to-digital converter of the analog front-end chip, forming a remote voltage feedback link.

3. The low-voltage-loss high-speed optical module power management optimization method according to claim 2, characterized in that: In step S2, the load current in the optical module power supply line is amplified by a differential amplifier by a sampling resistor connected in series in the optical module power supply line and then sent to the analog-to-digital converter of the analog front-end chip for acquisition. The ambient temperature is provided by an external temperature sensor located close to the connector of the optical module's power supply line; The chip junction temperature is provided by a temperature sensor built into the analog front-end chip.

4. The low-voltage-loss high-speed optical module power management optimization method according to claim 3, characterized in that: The temperature correction formula for correcting the initial line voltage drop value using the current ambient temperature in step S3 is as follows: ； Wherein, represents the line voltage drop value after temperature compensation. The initial line voltage drop value for the power supply line of the optical module, where K is a preset temperature correction factor. The current ambient temperature. For calibration at room temperature.

5. The low-voltage-loss high-speed optical module power management optimization method according to claim 4, characterized in that: Step S4 specifically includes the following steps: Step S41: Compare the load current with the preset dynamic load judgment threshold. When the load current is greater than the dynamic load judgment threshold, the optical module is determined to be in the laser emission working state; otherwise, the control circuit is determined to be in the standby state. Step S42: When the change in load current within two adjacent sampling periods exceeds the preset transient jump threshold, output a feedforward compensation component that is proportional to the rate of change of current to offset the voltage transient drop caused by the sudden change in laser modulation current. Step S43: When it is determined that the laser is in the emission working state and the junction temperature of the chip is lower than the preset low temperature threshold, the first nonlinear compensation component is output according to the first set of compensation coefficients to compensate for the voltage drift caused by the laser starting in the low temperature environment. Step S44: When it is determined that the laser is in the emission working state and the chip junction temperature is higher than the preset high temperature threshold and the load current is close to the full load current value, the second nonlinear compensation component is output according to the second set of compensation coefficients to compensate for the additional line voltage drop caused by the laser driving under high temperature and high current. Step S45: Add the compensation components output in steps S42 to S44 algebraically to the temperature-compensated line voltage drop value obtained in step S3 to obtain the comprehensive line voltage drop compensation value.

6. The low-voltage-loss high-speed optical module power management optimization method according to claim 5, characterized in that: The formula for calculating the target reference voltage value in step S5 is as follows: ； in, The target reference voltage value, This is the current output value of the digital-to-analog converter. To preset the target voltage, VFS is the actual voltage at the far end of the optical module load, and VFS is the comprehensive line voltage drop compensation value used as a feedforward compensation term. This represents the voltage deviation, which is used as a feedback correction term.

7. The low-voltage-loss high-speed optical module power management optimization method according to claim 6, characterized in that: Step S6 specifically includes the following steps: Step S61: Set the threshold of the overvoltage comparator to be higher than the preset target voltage upper limit, and set the threshold of the undervoltage comparator to be lower than the preset target voltage lower limit. Connect the output terminals of the two comparators to the enable terminal of the low dropout linear regulator or the control terminal of the switching transistor in the power supply path of the optical module, respectively. Step S62: When the power supply voltage output to the optical module exceeds the overvoltage threshold or falls below the undervoltage threshold, the corresponding comparator pulls down the output signal within a nanosecond time, directly turning off the low dropout linear regulator or cutting off the power supply path of the optical module. Step S63: After shutdown, the simulated front-end chip latches the output voltage waveform, load current and chip junction temperature data before shutdown within a preset time window. If the duration of voltage abnormality is less than the preset time threshold and the current surge amplitude is less than the preset current threshold, it is determined to be a transient interference fault; otherwise, it is determined to be a persistent hardware fault. Step S64: If it is a transient interference fault, recalculate the reference voltage value based on the current actual voltage at the remote end and enable power supply to the optical module. If it is a persistent hardware fault, latch the fault data and keep it off, and report the fault code through the communication interface.

8. A low-voltage-loss high-speed optical module power management optimization system, implemented based on the low-voltage-loss high-speed optical module power management optimization method as described in any one of claims 1-7, characterized in that, include: The link establishment module is used to directly connect one output of the analog-to-digital converter inside the analog front-end chip to the reference voltage input terminal of the low dropout linear regulator, and to lead the far-end voltage of the optical module load terminal back to the analog-to-digital converter input terminal of the analog front-end chip through an independent voltage feedback trace, so as to establish a reference pass-through and far-end voltage feedback link. The synchronous acquisition module is used to control the multi-channel analog-to-digital converter of the analog front-end chip to latch the actual voltage at the far end of the optical module load, the load current in the optical module power supply line, the chip junction temperature and the ambient temperature within the same sampling window. The temperature correction module is used to read the pre-stored initial line voltage drop value of the optical module power supply line, correct the initial line voltage drop value according to the temperature coefficient based on the difference between the current ambient temperature and the calibrated room temperature, and output the temperature-compensated line voltage drop value. The nonlinear compensation module is used to determine the working state of the optical module based on the magnitude and rate of change of the load current, distinguish the working conditions by combining the chip junction temperature and superimposing the corresponding nonlinear compensation component, and combining it with the temperature-compensated line voltage drop value to form a comprehensive line voltage drop compensation value. The reference update module is used to calculate the target reference voltage value and write it into the digital-to-analog converter based on the deviation between the preset target voltage and the actual voltage at the remote end, by superimposing the comprehensive line voltage drop compensation value, so as to update the reference voltage of the low dropout linear regulator and compensate for the voltage drop loss of the optical module power supply line. The graded protection module includes an overvoltage comparator and an undervoltage comparator. When the power supply voltage from the low-dropout linear regulator to the optical module triggers the overvoltage comparator or undervoltage comparator, it first performs a fast hardware shutdown. Then, it captures voltage, current, and temperature data at the time of the fault through the analog front-end chip, distinguishes between transient interference and persistent hardware faults, and performs voltage self-healing reset or fault blocking reporting respectively.

9. An electronic device, comprising: A processor and a memory, wherein the memory stores a computer program that can be called by the processor, characterized in that: the processor executes the low-voltage-loss high-speed optical module power management optimization method as described in any one of claims 1-7 by calling the computer program stored in the memory.

10. A computer-readable storage medium, characterized in that: The device stores instructions that, when executed on a computer, cause the computer to perform the low-voltage-loss high-speed optical module power management optimization method as described in any one of claims 1-7.

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