Modular manifold assembly

Abstract

An information handling system includes a system board having electronic components and a chassis supporting the system board, the chassis having a fan shroud attachment point configured to receive a fan shroud. The system also includes a modular manifold assembly. The modular manifold assembly includes a mounting structure having a base, a pair of side arms configured to couple to the chassis at the fan shroud attachment point, and a plurality of brackets coupled to the base. At least one manifold is configured to removably engage with the plurality of brackets.

Description

Background Technology

[0001] Information processing systems (such as servers) generate heat during operation, and if this heat is not dissipated or cooled, various components within the system may be damaged. One way to cool a system is by using airflow through the system, such as by using fans located within the system, to provide cooling above the components. Another way to cool a system is by using fluid cooling, where a coolant fluid above the components removes heat from the system. Attached Figure Description

[0002] From the following detailed description alone or with the appendix Figure 1 This disclosure is understood from the accompanying drawings. The accompanying drawings and related descriptions are included to provide a further understanding of this disclosure and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate one or more non-limiting aspects and implementations of the teachings and, together with the description, explain certain principles and operations. In the figures:

[0003] Figure 1 It is a block diagram of a system that includes modular manifold components.

[0004] Figure 2 These are top and rear perspective views of the modular manifold assembly.

[0005] Figure 3 yes Figure 2 Bottom and front perspective views of the modular manifold assembly.

[0006] Figure 4 yes Figure 2 Another bottom and front perspective view of the modular manifold assembly.

[0007] Figure 5 yes Figure 2 A top view of the modular manifold assembly.

[0008] Figure 6 yes Figure 2 A front view of the modular manifold assembly.

[0009] Figure 7 yes Figure 2 Rear view of the modular manifold assembly.

[0010] Figure 8 yes Figure 2 Side view of the modular manifold assembly.

[0011] Figure 9 It includes Figure 2 A perspective view of the information processing system of the modular manifold components.

[0012] Figure 10It is a method for adapting systems to include modular manifold components. Detailed Implementation

[0013] The power and heat generation of information processing components such as CPUs are increasing, making it increasingly difficult to efficiently cool systems through airflow. As heat generation increases, a greater amount of air must be circulated through the system to achieve the same level of cooling. This increased airflow leads to increased power consumption and noise. Furthermore, the cost of various components such as fans and heatsinks also increases with the increased airflow through the system.

[0014] An alternative method for cooling information processing systems is fluid cooling, where a fluid coolant is used to remove heat from the system. One form of fluid cooling is direct fluid cooling (DLC), in which a fluid coolant flows through the system using pipes / pipes, and heat is extracted from the heat-generating components of the system into the fluid coolant via cold plates attached to the components. DLC is commonly used in information processing systems with high component density, such as supercomputers or high-performance computing systems, where multiple components generate significant amounts of heat. DLC is highly efficient at removing heat from the system; however, it is expensive due to the addition of additional components to the system, such as cold plates and coolant pipes. Because of the complexity of many DLC cooling systems, these additional components are often custom-made for each specific system, meaning that many components are not easily reusable.

[0015] On the other hand, immersion cooling involves submerging part or all of the information processing system in a tank of a non-conductive fluid coolant (such as a dielectric fluid). This allows the fluid coolant to contact some or all of the information processing components, enabling the heat generated by these components to dissipate into the coolant. The heated coolant can then be circulated through a heat exchanger to remove heat before being recirculated back into the tank. Immersion cooling represents a highly efficient method for cooling systems without the corresponding increase in power or noise output that might occur in air-cooled systems. Similarly, immersion cooling allows for some of the benefits of direct fluid cooling, namely the increased heat removal from the system, without requiring a custom-designed cooling system based on the specific information processing system. Therefore, the increased accessibility and affordability of immersion cooling systems make it an attractive option for system cooling.

[0016] However, existing information processing systems originally designed for air cooling may not be well optimized for immersion cooling. Generally, air-cooled systems can be relatively easily converted to be usable in an immersion tub, for example, by removing air-cooling specific components such as fans, heatsinks, and baffles, as well as removing components incompatible with immersion, such as thermal paste, stickers, etc. This form of conversion will be referred to as baseline conversion in this paper, as it represents the minimum conversion required to prepare the system for immersion. While the baseline conversion described above can relatively easily allow an air-cooled system to be converted for use in an immersion tub, the resulting system is not well optimized for immersion cooling, and therefore some of the potential benefits of immersion cooling may not be fully realized. For example, it may be desirable to provide additional cooling for certain components (such as the CPU) beyond what would occur if the system converted in the above manner were immersed in an immersion tub.

[0017] To address these and other issues, the examples disclosed herein relate to a modular manifold assembly that can be used as part of a modular immersion cooling adapter kit installed in an information processing system to optimize the system for immersion cooling. The modular manifold assembly can be coupled to a pump, which may also be part of the adapter kit. The pump draws in fluid coolant and supplies the fluid coolant flow to the manifold. In some examples, the fluid coolant can be drawn from a pool in an immersion tank, while in others, it can be drawn from the tank via piping between the tank and the pump, which is associated with a heat exchanger. Once the fluid is drawn, the modular manifold assembly can convert the fluid flow into multiple output streams, which the manifold directs to the system's electronic components, such as CPUs and memory modules. These output streams increase the cooling rate of the electronic components by continuously removing fluid that has been heated by the components and surrounding them, replacing it with fresh, cooler fluid.

[0018] These modular immersion cooling adapter kits, including the modular manifold assembly disclosed herein, can be used as part of converting an information processing system originally designed for air cooling to an immersion-ready state, and can further optimize the system for immersion cooling beyond a baseline conversion. In this case, optimization means that the system is configured to provide superior cooling performance to one or more components, such as the CPU (exceeding the performance that a system without the modular adapter kit can provide (i.e., exceeding the performance provided by performing a baseline conversion alone)). In some examples, the adapter kit can be designed to utilize aspects of the existing air cooling system design, allowing for easy deployment of the modular adapter in the system during the conversion process. For example, portions of the adapter kit—in some cases including the modular manifold assembly—may reside in the space freed up by air cooling components removed during the conversion, and / or may use the same mounting features and / or connectors previously used with the now-removed air cooling components for attachment and / or electrical connection to the system. For example, the modular manifold assembly can be configured to be mounted in the space above the system board, which, in an air-cooled configuration of the system (i.e., the space above the CPU and memory modules), would be occupied by a fan shroud; in some examples, the manifold can be mounted to the chassis using the same mounting features used with the fan shroud. By leveraging air-cooled design features through modular adapter kits, it becomes easier to convert previously air-cooled information processing systems to immersion-cooled configurations. Furthermore, even if a system was designed from the outset for immersion cooling (rather than a conversion to an air-cooled system), it can be beneficial to design modular adapter kits to fit within the space and utilize the mounting features typically used in air-cooled infrastructures, as this may allow certain components (such as chassis) to be shared across multiple different product lines. For example, air-cooled and immersion-cooled systems can share the same chassis design, thereby reducing development, manufacturing, and logistical costs.

[0019] Modular manifold assemblies may include a mounting structure and a manifold supported by the mounting structure. The mounting structure is configured to be mounted on the chassis of an information processing system and extends across its width at a location above one or more electronic components, such as the CPU and memory modules of a system board. The manifold may include a hollow body (e.g., a tube) having an internal volume extending axially along the length of the body, an inlet at one end of the body into the volume, and a plurality of outlets distributed along an axis parallel to the length of the body to spray liquid radially (transverse to the axis).

[0020] In some examples, the mounting structure includes a base and one or more side arms extending from the base. Each side arm may include engagement features for engaging with fasteners on the opposite side of the chassis. In some examples, where the system is air-cooled, the support structure may be attached to the chassis at the location where a fan shroud or fan cage is attached to the system. Thus, the support structure can be installed within the volume formed by removing air-cooled components such as fans and fan shrouds.

[0021] The mounting base may include one or more pairs of brackets designed to receive and engage with a manifold. For a given pair of brackets, one bracket is positioned on one side of the base to support one end of the manifold, and the other bracket is positioned on the opposite side of the base to support the other end of the manifold, which extends along the width of the chassis. Each bracket may include an opening to receive one end of the manifold. In some examples, the opening of one bracket in a pair extends fully through the bracket, allowing the manifold to slide into the bracket during installation. The manifold may be positioned such that the output flow can be directed over one or more hot components within the information processing system. In some examples, the manifold may engage with a stop feature on the bracket to aid in positioning the manifold, particularly the fluid outlet. More specifically, engagement of the manifold with the stop feature helps position the outlet relative to the component to be cooled.

[0022] In some examples, multiple pairs of brackets are provided. This allows a single manifold to be mounted in various locations on the base, or it allows multiple manifolds to be mounted simultaneously. This contributes to the modular nature of the manifold assembly, making it easy to adapt to a variety of different system configurations and requirements. For example, in some immersion cooling systems, the flow direction of the bulk fluid through the chassis can be from front to back. In this case, the manifold assembly can be configured with a manifold on the front side of the CPU to allow its output flow to be guided in a generally rearward direction (consistent with the flow direction of the bulk fluid). In another immersion cooling system, the flow direction of the bulk fluid through the chassis is from back to front. The manifold assembly can instead be configured with a manifold on the rear side of the CPU to allow its output flow to be guided in a generally forward direction consistent with the flow direction of the bulk fluid. In examples that include multiple manifolds, each manifold can have the same structure as the other manifolds to allow the use of a single part number for both, which reduces manufacturing and logistics costs.

[0023] The modular manifold assembly may also have a distribution pipe with one or more outlets that are coupled to a bracket on one side of the mounting structure. The outlets of the distribution pipe may be coupled to a side of the bracket opposite to the side of the manifold that may be coupled. With the manifold mounted within the bracket at a given outlet coupling, the given outlet of the distribution pipe may be fluidly coupled to the inlet of the manifold, allowing coolant to flow through the distribution pipe, into the manifold, and out from the outlet nozzle of the manifold. Therefore, the brackets not only physically support the distribution pipe and the manifold, but they also form part of the fluid flow path that connects them.

[0024] In some examples, the distribution pipe may have two fluid inlets separated by the pipe body, allowing for flexibility in the location of the pump supplying fluid to the distribution pipe. In some examples, the outlet of the distribution pipe may be plugged if it is not in use. In other examples, a valve may be used to selectively plug or unblock the outlet of the distribution pipe. A two-way valve on the inlet pipe may be movable to allow for regulation of the direction of fluid flow within the inlet pipe; that is, a two-way valve may allow one of the two fluid inlets of the inlet pipe to be selectively sealed. This allows the information processing system to be immersed in fluid coolant in multiple directions, adding modularity to the manifold assembly.

[0025] The following will combine Figures 1 to 10 These and other examples will be described in more detail.

[0026] Figure 1 Example system 100 is shown. Figure 1 This is essentially illustrative, and it should be understood that unless otherwise stated herein, Figure 1 It is not intended to show specific shapes, dimensions, positional relationships, or other structural details accurately or to scale. The information processing system 100 can be implemented with different numbers and arrangements of the components shown. Furthermore, Figure 1 The components shown may be omitted from some of the examples disclosed herein, and Figure 1 Components not shown may also be included in some of the examples disclosed herein. Figure 1 In this diagram, physical connections between components (e.g., physical attachments and / or supports) are conceptually represented by solid lines extending between the components. Certain positional relationships are indicated by thick, white-filled arrows. The movement of coolant is indicated by dashed arrows.

[0027] System 100 is a system for immersion cooling of information processing equipment (such as servers, network equipment, etc.). System 100 includes an information processing system 102 and an immersion tank 138. Immersion tank 138 contains a pool of fluid coolant 140 and is configured to receive multiple information processing systems immersed in coolant 140 to provide them with immersion cooling, as will be explained in more detail below.

[0028] The information processing system 102 may be a server, network equipment (e.g., a switch, a router, etc.), or other equipment with information processing components. The information processing system 102 may include a chassis 104, a system board 108, and a modular manifold assembly 112.

[0029] The chassis 104 may include structural components to support and / or house other components of the system 102. For example, the chassis 104 may include a housing or enclosure comprising walls or panels, such as a base, sidewalls, and a cover joined together to define an internal volume in which other parts of the system are housed. The chassis may also include other support structures that may be disposed within or form part of the aforementioned housing, such as a drive cage, power unit cage, etc. Instead of forming a housing, the chassis 104 may alternatively include a tray or other support structure that supports, but does not necessarily completely enclose, components of the system.

[0030] In some examples, system 102 is compatible with both air cooling and immersion cooling, meaning system 102 can switch between air cooling and immersion cooling configurations. In these examples, chassis 104 may also include a fan shroud area 105 and fan shroud attachment points 106 (these are in...). Figure 1 (These are shown in dashed lines to indicate that they are not necessarily present in all examples of system 102). Fan shroud area 105 is an area within chassis 104 configured to receive a fan shroud in an air-cooled configuration. A fan shroud is a device that includes airflow control structures (e.g., baffles, holes, etc.) that promote a desired airflow pattern through certain areas of information processing by selectively blocking, allowing, or redirecting airflow. In particular, the fan shroud is typically located in the space above (one or more) CPU and memory modules (i.e., between these components and the top cover of chassis 104) and is configured to increase the amount of airflow through the CPU heatsink and memory modules. Thus, in some examples, fan shroud area 105 corresponds to this space above the CPU and memory modules. Fan shroud attachment point 106 includes attachment features configured to attach the fan shroud to chassis 104. In some examples, fan shroud attachment point 106 may be located in or on the side wall of chassis 104 and / or the base of chassis 104. For example, the sidewalls may include slits configured to receive laterally projecting tabs from the fan shroud. When system 102 is deployed in an immersion cooling configuration, the fan, fan cage, and fan shroud can be removed. Therefore, in an immersion cooling configuration, if system 102 includes any fan shroud areas 105 and fan shroud attachment points 106, they will not be used by the fan shroud but may instead be used by the modular manifold assembly 112 described below in some examples.

[0031] System board 108 may be supported by chassis 104. System board 108 may be a motherboard including electronic components 110 connected thereto. Electronic components 110 include at least some information processing components, such as central processing unit (CPU), memory, etc., as well as other passive or active electrical components (not shown), but are not limited to this example, and any system board may be used.

[0032] The modular manifold assembly 112 can be attached to the chassis 104 at the fan shroud attachment point 106. The modular manifold assembly 112 may include a mounting structure 114, a manifold 122, and a distribution pipe 130, which together allow the information processing system 102 to be cooled by direct fluid cooling.

[0033] Mounting structure 114 is configured to attach to chassis 104 and support other components of the modular manifold assembly 112 relative to chassis 104 when the modular manifold assembly 112 is mounted in system 102. Mounting structure 114 may include a base 116, which may be generally planar. Base 116 is configured such that when the modular manifold assembly 112 is attached to chassis 104, base 116 is substantially parallel to system board 108 and extends through the width of chassis 104. In some examples, base 116 is configured to be positioned within fan shroud region 105.

[0034] In some examples, the mounting structure 114 may also include one or more side arms 118 coupled to the base 116, these side arms 118 being configured to engage with the chassis 118 to attach the mounting structure 114 to the chassis 118. In some examples, the side arms 118 may be arranged opposite to each other, with the base 116 extending between the side arms 118, and the side arms 118 projecting laterally from the base 116 in opposite directions, i.e., one side arm 118 extending from one end of the base 116 toward one side wall of the chassis 104, and another side arm 118 extending from the other end of the base 116 toward another side wall of the chassis 104. More specifically, in some examples, the side arms 118 may include attachment features to engage with the fan shroud attachment point 106, thereby allowing the modular manifold assembly 112 to be coupled to the chassis 104. In some examples, the fan shroud attachment points 106 include two sets of fan shroud attachment points 106 disposed in two opposing sidewalls of the chassis 104, and the side arms 118 can engage with these sets of fan shroud attachment points 106 respectively, that is, one side arm 118 engages with one set of fan shroud attachment points on one sidewall, and the other side arm 118 engages with another set of fan shroud attachment points on another sidewall.

[0035] Mounting structure 114 also includes a plurality of brackets 120 coupled to base 116. The brackets 120 are configured to engage with manifold 122 and distribution tube 130, as described below, to attach these components to mounting structure 114. In some examples, the brackets 120 may be arranged in pairs, with each pair of brackets 120 configured to hold manifold 122 in a corresponding mounting position relative to base 116. For a given pair of brackets 120, one bracket 120 may be positioned on one side of base 114 to support one end of manifold 122, and the other bracket 120 may be positioned on the opposite side of base 114 to support the other end of manifold 112, such that manifold 112 extends along the width dimension of chassis 104. Each bracket 120 may include a hole (e.g., a drilled hole) to receive one end of manifold 122. In some examples, the hole in one of the brackets in a pair of brackets 120 extends fully through bracket 120, such that manifold 122 can slidably engage through bracket 120 during installation.

[0036] In some examples, base 116 may include multiple pairs of brackets 120, each pair of brackets 120 being configured to hold manifold 122. For example, one pair of brackets 120 may be located near the front of base 114 (e.g., one bracket 120 of the pair is near the front left portion of base 114, and the other bracket is near the front right portion of base 114), while another pair of brackets 120 may be located near the rear of base 113 (e.g., one bracket 120 of the pair is near the rear left portion of base 114, and the other bracket is near the rear right portion of base 114). The number of pairs of brackets 120 is only limited by the space available in the system, and in some examples may include one, two, three, four, or any number of pairs of brackets 120. Providing multiple pairs of brackets 120 allows for the mounting of a single manifold 122 in various locations on base 114, or allows for the simultaneous mounting of multiple manifolds 122. This contributes to the modular nature of manifold assembly 112, enabling it to be easily adapted to a variety of different system configurations and requirements. Furthermore, although manifold 122 is shown and described as being held by a pair of supports 120, the example is not limited to this, and manifold 122 can be held by any number of supports 120.

[0037] Manifold assembly 112 also includes one or more manifolds 122 that can be coupled to mounting structure 114. As used herein, a manifold refers to a structure that receives a fluid input and distributes the input to multiple outputs. Manifold 122 includes a manifold body 128, an inlet 124, and multiple outlets 126. Manifold body 128 may be hollow, defining an internal volume through which coolant fluid can flow. The internal volume in manifold body 128 may be fluidly coupled to multiple fluid outlets 126. Fluid outlets 126 include orifices through the outer wall of manifold body 128 that fluidly connect the internal volume to the environment outside manifold body 128. In some examples, fluid outlets 126 include only orifices. In other examples, fluid outlets 126 may include additional structures, such as nozzles, that are fluidly coupled to the internal volume through the orifices. Fluid outlets 126 may be integrally formed within manifold body 128; however, the examples are not limited thereto, and fluid outlets 126 may be separately coupled to manifold body 128.

[0038] The manifold body 128 may also be coupled to a fluid inlet 124. The inlet 124 includes an aperture through the outer wall of the manifold body 128, which fluidly connects the internal volume to the external environment outside the manifold body 128. In some examples, the fluid inlet 124 may include an intake fluid connector (e.g., a friction-fit fluid connector, hose barb, threaded fitting, compression fitting, etc.) that can be coupled to a tube or pipe, but the examples are not limited thereto (more specifically, in cases where the fluid connector comprises two mating halves, the inlet 124 may contain one half of such a fluid connector).

[0039] Fluid inlet 124 can be fluidly connected to fluid outlet 126 through the internal volume of manifold body 128, allowing coolant 140 to flow into the internal volume of manifold body 128 through fluid inlet 124 and then exit through manifold body 128 as multiple output streams of coolant 140 via fluid outlet 126. A pump (not shown) can supply this flow of coolant 140. Outlet 128 can be arranged such that, with modular adapter 112 mounted in chassis 104, the output stream is directed to electronic components 110, such as a CPU and / or memory.

[0040] The manifold body 128 can be received and supported in and by a bracket 120, with one end of the body 128 engaging with one bracket 120 of a pair of brackets, and the other end engaging with the other bracket 120 of the pair. When thus installed, the longitudinal dimension of the manifold body 128 can be substantially parallel to the length of the base 116, the length of which is parallel to the width dimension of the chassis 104 when the modular manifold assembly 112 is mounted therein. In some examples, the outlet 126 can be distributed along the longitudinal dimension of the manifold body 128 to allow the coolant output flow to be distributed across the entire width of the chassis 104. In some examples, the manifold body 128 can have a tube or pipe shape (i.e., a hollow cylindrical shell) such that the longitudinal dimension of the manifold body 128 is parallel to the central axis of the tubular manifold body 128. In some examples, the inlet 124 includes an opening at one end of the tubular manifold body 128.

[0041] The distribution tube 130 can be physically connected to the mounting structure 114 and fluidly connected to the manifold 122. The distribution tube 130 includes a distribution tube body 134 having a hollow internal volume. The distribution tube 130 also has at least one inlet 132 fluidly connected to the hollow internal volume. In some examples, the distribution tube may have multiple (e.g., a pair) inlets 132 arranged at different locations along the distribution tube body 134. For example, in some cases, two inlets 132 may be located at opposite ends of the distribution tube body 134, allowing fluid to enter the internal volume of the distribution tube 130 at either end and flow through the distribution tube body 132. In some examples where multiple inlets 132 are present, one inlet may be selected to receive input fluid (e.g., from a pump via another fluid conduit connected to the selected inlet 132), and the other inlet 132 may be closed with a plug, cap, or valve. In other cases, multiple inlets 132 may simultaneously receive input fluid from different fluid conduits connected to them.

[0042] The distribution tube 130 may also include at least one outlet 136 fluidly connected to an internal volume. The outlet 136 may include an aperture extending through a wall of the distribution tube body 134 and, in some examples, a fluid connector (or a portion thereof) fluidly connected to the aperture. The outlet 136 is configured to fluidly connect to an inlet 124 of the manifold 122. Therefore, the distribution tube 130 may be fluidly connected to the manifold 122, allowing fluid to flow into the distribution tube 130 via at least one of the fluid inlets 132, and into the manifold 122 and through the distribution tube body 134 before exiting from the outlet 136.

[0043] In some examples, the outlet 136 of the distribution pipe 130 is directly physically and fluidly connected to the inlet 124 of the manifold 122. For example, the inlet 124 and the outlet 136 may form two halves of a fluid connector that fit together. In these examples, both the inlet 124 and the outlet 136 may be physically connected to the mounting structure 114 via one of the supports 120, but the support 120 may not necessarily participate in the fluid connection between them.

[0044] In other examples, the bracket 120 may either physically connect the distribution tube 130 and the manifold 122 to the mounting structure 114, or participate in the fluid connection between the distribution tube 130 and the manifold 122. In other words, the bracket may be (or act as) a fluid connector connecting the inlet 124 to the outlet 136. For example, the bracket 120 may include a borehole extending through the bracket 120, having a first opening at a first end and a second opening at a second end, with the manifold 122 connected to the first end of the bracket 120 within or on the first opening, and the distribution tube 130 connected to the second end of the bracket 120 within or on the second opening, such that the borehole forms at least a portion of a fluid path connecting the outlet 136 of the tube 130 to the inlet 124 of the manifold 122. In some examples, the inlet 124 may be inserted into the borehole of the bracket 120 through the first opening, while in other examples, the first end of the bracket 120 may be inserted into the inlet 124. In some examples, outlet 136 can be inserted into the borehole of bracket 120 through a second opening, while in other examples, the second end of the bracket can be inserted into outlet 136. In each of these examples, manifold 122 is fluidly connected to distribution pipe 130 via the borehole of bracket 120, inlet 124, and outlet 136.

[0045] In some examples, the distribution tube 130 includes multiple outlets 136. In some examples, each pair of supports 120 may have one outlet 136, with each outlet 136 connected to one of the supports 120 in the corresponding pair. This allows the distribution tube 130 to supply fluid to manifolds 122 connected to any of the supports in the pair 120, thereby further increasing the flexibility of the system. For example, if only one manifold 122 is used, the outlet 136 connected to the manifold 122 can remain open, while other outlets 136 can be closed, for example, by a plug, cap, or valve. Alternatively, as another example, if multiple manifolds 122 are used, the outlets 136 connected to these manifolds 122 can remain open, allowing the distribution tube to supply fluid to these manifolds 122 simultaneously.

[0046] As described above, in some examples providing multiple inlets 132 and / or multiple outlets 136, valves can be used to selectively close inlets 132 and / or outlets 136. In some of these examples, these valves may be located within the distribution pipe body 130. In other examples, these valves may be located within or as part of inlets 132 and / or outlets 136. In some examples, the valve may be a separate component coupled to the distribution pipe body 130, inlets 132, and / or outlets. In some examples, the valve may be part of or coupled to the support 120. In some examples, a valve such as a three-way valve may be shared by inlets 132 and outlets 136, meaning that the same valve can control fluid flow through both inlets 132 and 136.

[0047] System 100 may also include an immersion tank 138, which includes a fluid coolant 140 held in a fluid holding portion of the tank 138 to create a pool of fluid coolant 140. The fluid holding portion of the tank 138 may be configured to receive information processing system 102 such that information processing system 120 is immersed in the pool of fluid coolant 140. As used herein, “immersion” means that at least one electronic component 110 on system board 108 is submerged in fluid coolant 140. In some examples, the entirety of each information processing system 102 may be completely submerged. In other examples, a portion of system 102, such as a support bracket supporting the system, may protrude from the fluid coolant 140. The immersion of system 102 in fluid coolant 140 is indicated by arrow 142.

[0048] Coolant 140 may be a non-conductive material that is liquid at room temperature, such as a dielectric fluid. Immersing the information processing system 102 in the fluid coolant 140 allows heat generated by the electronic components 110 to be removed from the information processing system 102. More specifically, heat from system components is transferred to the circulating coolant 140. The heat is then released from outside the system. In some examples, coolant 140 may be a single-phase coolant, meaning it is designed to absorb heat and circulate it through immersion tank 130. This circulation may include transferring the absorbed heat to a heat exchanger before circulating through immersion tank 138. Figure 1(Not shown in the image), thus allowing the fluid coolant 140 to move continuously above the information processing system 102. In other examples, the coolant 140 is a two-phase coolant, meaning it is designed to transfer heat by changing between a liquid phase and a vapor (gas) phase during device operation. In these examples, the boiling point of the coolant 140 is close to the desired operating temperature of the electronic component 110, meaning the electronic component 110 can cause the coolant 140 to boil during operation. This boiling absorbs heat from the component and allows the heat to dissipate through the interaction of the coolant 140 in vapor form with a radiator or other heat dissipation structure (not shown).

[0049] With the information processing system 102 immersed in the fluid coolant 140, the distribution pipe 130 can be configured to move the fluid coolant 140. More specifically, the distribution pipe 130 can move the fluid coolant 140 from a pool in the immersion tank 130 to a fluid inlet 132. The fluid coolant 140 can then move through the distribution pipe body 134 and exit at the outlet 136. Because the distribution pipe 130 is fluidly connected to the manifold 122, the fluid coolant 140 then flows through the inlet 124 of the manifold 122 as it exits the outlet 136. The fluid coolant 140 flows through the manifold body 128 before flowing through the outlet 126 of the manifold 122. In some examples, the fluid outlet 126 can direct the fluid coolant 140 over electronic components 110 on the system board 108. More specifically, the fluid outlet 126 can be oriented to flow over selected electronic components 110. For example, fluid outlet 126 can be positioned to allow fluid coolant 140 to flow over high-temperature components, such as processing units or storage units, thereby allowing additional fluid coolant 140 to move over the components and thus increase the cooling of these components.

[0050] Go to Figures 2 to 8 An example modular manifold assembly 212 is shown. The modular manifold assembly 212 can be... Figure 1 An implementation of the exemplary modular manifold assembly 112 shown and described, and which can be used for, for example Figure 1In the system of system 100. Therefore, modular manifold assembly 212 includes components corresponding to the components of modular manifold assembly 112 (i.e., examples of its implementation), and the correspondence between these components is indicated herein by components having the same last two digits of reference numerals, such as 112 and 212. The aspects of modular manifold assembly 112 and its components described above are also applicable to modular manifold assembly 212 and its corresponding components, but modular manifold assembly 112 and its components are not limited to modular manifold assembly 212 and its components; this is merely one example of how modular manifold assembly 112 can be implemented. In some cases, to avoid repetition, the aspects of modular manifold assembly 112 already described above, which also apply to modular manifold assembly 212, are not described below. Modular manifold assembly 212 includes mounting structure 214, manifold 222, and distribution pipe 230.

[0051] Mounting structure 214 includes a base 216. The base 216 is generally planar. One or more side arms 218 may extend from the base 216. In some examples, a pair of side arms 218 extend from the base 216, with the base 216 separating the side arms 218. Each side arm 218 includes a first vertical portion 246 adjacent to the base 216 and a second vertical portion 250 parallel to and spaced apart from the first vertical portion 246. A support member 248 extends along the first vertical portion 246 between the base 216 and the first vertical portion 246 to provide additional structure and support for the first vertical portion 246. Similarly, as... Figure 4 As specifically shown, the support member 252 extends along the inner surface of the second vertical portion 250. The support member 252 provides structure and support for the second vertical portion 250.

[0052] The first vertical portion 246 and the second vertical portion 250 are connected by a top 254 extending between the first vertical portion 244 and the second vertical portion 250. The top 254 is substantially planar and generally parallel to the base 216. A plurality of attachment features 256 extend outward from the top 254. The attachment features 256 may be integrally formed as part of the arm 218, or may be formed separately and subsequently attached. These attachment features 256 may include first type attachment features 256-1 and second type attachment features 256-2 (collectively referred to as attachment features 256), which are configured to mate with fan shroud attachment points, thereby allowing the modular adapter 212 to be installed in the chassis in a volume otherwise occupied by the fan shroud.

[0053] More specifically, such as Figure 8As shown, attachment feature 256-1 includes a horizontal portion 258 and a vertical portion 260 vertically joined together to form a T-shaped profile, which together form attachment feature 256-1. Each of the horizontal portion 258 and the vertical portion 260 is configured to engage with a complementary attachment feature in the chassis. For example, the complementary attachment feature may include a horizontal frame and a vertical slit extending downward through the horizontal frame, such that the vertical portion 260 can slide into the vertical slit when the horizontal portion rests against the horizontal frame. For example, the horizontal frame may be formed by the bottom edge of a horizontal slit cut into the sidewall of the chassis, such that the horizontal and vertical slits together form an opening in the sidewall, which resembles the T-shaped profile of attachment feature 256-1. In some examples, attachment feature 256-1 is held engaged with the chassis by gravity and / or by a cover of the chassis. In other examples, attachment feature 256-1 is also secured to chassis 204 by, for example, snap-fit ​​or friction fit to hold mounting structure 214 in the mounting position relative to the chassis. Simultaneously, attachment feature 256-2 is a horizontal tab configured to engage with a second complementary attachment feature in the chassis, such as another horizontal bracket similar to the one described above. In some examples, attachment feature 256-2 is held engaged with the chassis by gravity and / or by the chassis cover. In other examples, attachment feature 256-2 is configured to be further secured to the chassis by, for example, snap-fit ​​or friction fit; however, the examples are not limited to this.

[0054] Mounting structure 214 also includes a bracket 220 connected to base 216. In some examples, bracket 220 is integrally formed with base 216 of mounting structure 214. Figure 3 and Figure 4 As shown, the bracket 220 is disposed near the first vertical portion 246 of the side arm 218. Further, the brackets 220 can be disposed in pairs, with one bracket 220 disposed near one side arm 218 and the other bracket 200 disposed near the opposite side arm 218, the pair of brackets 220 being separated by the length L of the base 216. The first pair of brackets 220 is disposed at one edge of the base 216, and the second pair of brackets 220 is disposed parallel to the first pair of brackets 200 and offset from the first pair of brackets 200 by a width W relative to the base 216.

[0055] The bracket 220 includes an opening 262 configured to receive a component, such as a manifold 222. Each pair of brackets 220 is configured to receive a component, allowing the component to be mounted on either side of the manifold body 216. This provides flexibility for the modular manifold assembly 212, enabling it to be used in multiple orientations. The specific side of the mounting structure 214 to which a component is coupled can be determined by system considerations, such as the location of electronic components on a system board to be cooled and the location of attachment features on the chassis.

[0056] like Figure 4 As shown, the support 220 includes a detent feature 264 located inside the support 220. Although Figure 4 Only one stop feature 264 is shown, but it should be understood that each bracket 220 has a stop feature 264. The stop feature 264 helps to position the manifold 222 received in the bracket 220. When the manifold 222 is installed in the correct position and / or orientation, the stop feature 264 is configured to engage with a corresponding stop feature on the manifold 222. In some examples, the stop feature 264 may include a protrusion, and the corresponding detection feature includes a recess, while in other examples, the stop feature 264 may include a recess, while the corresponding detection feature includes a protrusion. The engagement of the stop feature 264 with the corresponding stop feature of the manifold 222 can provide tactile feedback to the installer, indicating that the manifold 222 is correctly positioned and / or oriented. In some examples, the stop feature 264 can also lock the installed manifold 222 in that position and / or orientation relative to the bracket 220 by preventing the bracket 220 from moving out of that position or orientation.

[0057] In some examples, the stop feature 264, which holds the manifold 222 in a predetermined direction, can be configured to direct the outlet 226 toward the electronic component that the manifold 222 is intended to cool. In other words, the stop feature 264 helps ensure that the manifold 222 is correctly positioned to direct flow toward the intended electronic component. In some examples, the stop features 264 of different pairs of supports 220 can be arranged to hold the manifold 222 in different orientations to accommodate different positions of the supports 220. For example, if one pair of supports 220 holds the manifold 220 slightly behind the CPU, its stop feature 264 can be configured to orient the manifold 222 so that the outlet 226 is tilted downward and forward, thus directing the outlet flow toward the CPU; while if another pair of supports 220 holds the manifold 220 slightly in front of the CPU, its stop feature 264 can be configured to orient the manifold 220 so that the outlet 226 is tilted downward and backward, thus directing the outlet flow toward the CPU.

[0058] Manifold 222 is connected to mounting structure 214 at a pair of brackets 220, such that manifold 222 extends downward from base 216, as... Figure 2 As shown. More specifically, the manifold body 228 extends along the length L of the base 216 between a pair of supports 220, such that the manifold body is parallel to the length L of the base 216. As described above, the manifold 222 may include Figures 2 to 8 The corresponding feature, not shown, allows engagement with the stop feature 264 on the bracket 220.

[0059] The manifold body 228 includes multiple fluid outlets 226. For example... Figures 3 to 4 and Figure 6As specifically shown, fluid outlet 226 is formed as an opening within manifold body 228, wherein fluid outlet 226 is oriented to direct fluid (such as fluid coolant) outward from manifold body 228. In some examples, engagement of manifold 222 with locking feature 264 orients fluid outlet 226. Fluid outlet 226 may be oriented to direct fluid to a specific electronic component.

[0060] exist Figures 3 to 4 In the image, the dashed arrow extending from fluid outlet 226 indicates the direction of fluid flow. Although Figures 2 to 4 and Figure 6 The example shows ten fluid outlets 226, but it is not limited to this; more or fewer fluid outlets 226 may be used. Furthermore, as shown... Figure 6 As specifically shown, the fluid outlet 226 is linearly arranged along the x-axis of the manifold body 228, with the fluid outlet 226 located closer to the end of the manifold body 228. However, the fluid outlet 226 may be located elsewhere on the manifold body 228 and arranged in a different direction relative to the x-axis of the manifold body 228. Furthermore, the fluid outlet 226 may be arranged along the manifold body 228 at a greater angle than... Figures 3 to 4 and Figure 6 The figure shows a larger length extension.

[0061] Manifold 220 also includes a pair of fluid inlets 224. The fluid inlets 224 are separated by manifold body 228. At least one fluid inlet 224 can be fluidly connected to distribution pipe 230 via fluid connector 266. More specifically, fluid inlet 224 is fluidly connected to outlet 236 of distribution pipe 230.

[0062] The distribution pipe 230 includes a pair of inlets 232 separated by a distribution pipe body 234. The inlets 232 are located at opposite ends of the distribution pipe body 234, such that fluid (such as a fluid coolant) can enter the distribution pipe 230 at either end and flow through the distribution pipe body 234. A pair of outlets 236 are located in the distribution pipe body 234, such that the outlets 236 are fluidly connected to the inlets 232 through the distribution pipe body 232.

[0063] The distribution pipe 230 is connected to the mounting structure 214 via a fluid connector 266 engaging with the bracket 220. More specifically, the fluid connector 266 engages with the bracket 220 at an opening 262 via, for example, a threaded engagement or friction fit between the bracket 220 and the fluid connector 266. The fluid connector 266 then engages with an outlet 236, such that the outlet 236 of the distribution pipe 230 is connected to the mounting structure 214. Therefore, the distribution pipe 230 is movable and can be connected to the mounting structure 214 from either side of the base 216. The specific side of the mounting structure 214 to which the distribution pipe 230 is connected can be determined by system considerations, including system board orientation and the location of electrical components to be cooled.

[0064] like Figure 3 and Figure 7 As shown, specifically, a fluid connector 266 is connected to the support 220, and a manifold 222 is also connected to the support 220. In this way, the fluid inlet 224 is fluidly connected to the distribution pipe 230, and more specifically, to the outlet 236 of the distribution pipe 234. This allows fluid to enter the inlet 232 of the distribution pipe 230, as... Figure 4 As indicated by the dashed arrow marked A, fluid flows through the distribution pipe body 234 and exits through the outlet 236. Due to the fluid connection between the outlet 236 of the distribution pipe 230 and the fluid inlet 224 of the manifold 222, fluid subsequently flows into the manifold 222 at the fluid inlet 224. The fluid then exits the manifold body 228 at the fluid outlet 226. The outward flow of fluid at the fluid outlet 226 is indicated by the dashed arrow extending from the fluid outlet 226. In this way, when the modular manifold assembly 212 is installed in a system immersed in cooling fluid, fluid moves through the modular manifold assembly 212.

[0065] The distribution pipe 230 also includes one or more valves 268. As used herein, a valve refers to a device configured to control fluid flow through an opening, such as a pipe or conduit. In some examples, valve 268 is a two-way valve capable of controlling the flow of fluid in both directions. In some examples, valve 268 is movable between two positions to selectively connect or disconnect one inlet 232 from the rest of the distribution pipe 230 (in some examples) or from an adjacent outlet 236 (in some instances). For example, this could allow one inlet 232 to open to allow fluid to enter the distribution pipe 230 while the other inlet 230 is closed, or it could allow both inlets 232 to open to allow fluid to enter the distribution pipe 230. In other examples, valve 268 is a three-way valve configured to selectively close or open the connection between the respective inlet 232, the respective outlet 236, and the rest of the distribution pipe 230. In this configuration, valve 268 can have the following positions: a first position, in which it allows fluid to flow from the corresponding inlet 232 to the corresponding outlet 236 and distribution pipe 230 (from which the fluid can eventually reach other outlets 236); a second position, in which it allows fluid to flow from the corresponding inlet 232 to the corresponding outlet 236, but prevents fluid from flowing to the rest of pipe 230; a third position, in which it allows fluid to flow from the rest of pipe 230 (e.g., from a distant inlet 232) to the corresponding outlet 236, but prevents fluid from flowing into or out of the corresponding inlet 232; and a fourth position, in which it prevents all fluid from flowing through valve 268. In a two-way or three-way example, valve 268 allows distribution pipe 230 to be selectively configured to direct fluid flow to manifold 222, regardless of which set of supports 220 manifold 222 is connected to, and allows fluid input to be received through any one or two of the inlets 232. This flexibility allows manifold assembly 212 to be reconfigured as needed to meet different conditions that may be encountered in different systems. For example, in one system, the overall flow direction of the fluid may be from front to back. In this case, it might be necessary to position the manifold 222 in the foremost pair of brackets 220 so that the output flow flows in a generally rearward direction, aligned with the overall flow direction. However, in another system with an overall fluid flow direction from back to front, it might be desirable to mount the manifold 220 on the rearmost pair of brackets 220. Valve 268 allows the same manifold assembly 212 to be configured for both systems, thus avoiding the cost of designing and manufacturing different manifold assemblies for different systems. As another example, in one system, the pump supplying fluid to the manifold assembly 212 can be located at the front of the chassis, making it convenient to connect the pump to the foremost inlet 232. However, in another system, the pump can be located at the rear of the chassis, making it more convenient to connect the pump to the rearmost inlet 232.Valve 268 allows the use of the most convenient inlet 232 in a given system, which avoids the need to design a separate manifold assembly 212 for each system.

[0066] Figure 9 This is a perspective view of information processing system 202, in which the modular manifold component 212 described above can be used. Information processing system 202 is an example implementation of information processing system 102 described above. Components of system 202 corresponding to components of system 102 are given similar reference numerals, such as 104 and 204.

[0067] The information processing system 202 includes a chassis 204 supporting the system board 208 and the aforementioned modular manifold assembly 212. In this example, the information processing system 202 is a rack-mountable server capable of both air-cooled and immersion-cooled configurations, wherein the system 202 is described as being configured for immersion cooling by mounting the modular manifold assembly 212, etc., in the chassis 204.

[0068] System board 208 includes multiple electronic components 210. Although Figure 9 Two electronic components 210 are shown, but the example is not limited to this and there may be more or fewer electronic components 210. In this example, electronic components 210 include two CPU sockets and one or more CPUs (not shown) installed to these CPU sockets in the fully assembled state of system 202. In this example, electronic components 210 also include multiple memory module slots and one or more memory modules (not shown) installed in these slots in the fully assembled state of system 202. System 202 also includes other information processing components.

[0069] The chassis 204 includes a fan shroud region 205 and a plurality of fan shroud attachment points 206 formed as part of the chassis 204. In this example, the fan shroud region 205 includes the space above the electronic components 210 (e.g., the space above the CPU and memory modules). In other words, the fan shroud region 205 may be defined below by the CPU and memory modules, above by the cover (not shown) of the chassis 204, and laterally by the side walls 207 and 209 of the chassis 204. Figure 9 As shown, in this example, fan shroud attachment point 206 can be located on the side walls 207 and 209 of chassis 204, but other examples are not limited to this. Fan shroud attachment point 206 can be configured to attach to the fan shroud ( Figure 9 (Not present in the text) to help guide air in the air-cooled configuration of system 202. However, as... Figure 9As shown, in the immersion cooling configuration, there is no fan shroud, allowing the modular manifold assembly 212 to be installed in the information processing system 202, such that the modular manifold assembly 212 occupies the fan shroud area 205. It should be understood that, although... Figure 9 The modular manifold assembly 212 in its installed position is not shown, but it is configured to engage with the chassis 204 at the fan shroud attachment point 206, and in the engaged state, the modular adapter is positioned above the system board 208 and the electronic components 210.

[0070] More specifically, the modular manifold assembly 212 includes a mounting structure 214 that includes attachment features 256-1 and 256-2 (collectively referred to as attachment feature 252) as described above. Attachment features 256 are configured to engage fan shroud attachment points 206 on the chassis 204, as indicated by the dashed arrows extending between each attachment feature 255 and the corresponding fan shroud attachment point 206, to allow the modular manifold assembly 212 to be mounted within the information processing system 202. More specifically, in this example, attachment points 256 include two types of attachment points: attachment point 256-1 configured to engage attachment feature 256-1 and attachment point 256-2 configured to engage attachment point 256-2. Attachment point 256-1 includes a T-shaped opening formed in the top edge of the sidewall 207 or 209 of the chassis 204, the T-shaped opening including a horizontally connected horizontal slit and a vertical slit. The bottom edge of the horizontal slit forms a shelf on which the horizontal portion of attachment point 256-1 can be placed, while the vertical portion of attachment point 256-1 is located within the vertical slit. Attachment point 256-2 includes a horizontal slit opening formed in the top edge of the sidewall 207 or 209 of the chassis 204, the bottom edge of which forms a shelf on which the tab of attachment point 256-2 can be placed. Attachment points 256-1 and 256-2 are recessed relative to the top edge of the sidewall 207 / 209, sufficient to allow the modular manifold assembly 212 to be positioned in the chassis 204 without protruding above the top edge of the sidewall 207 / 209, thereby avoiding interference between the modular manifold assembly 212 and the top cover (not shown).

[0071] Manifold 222 is connected to mounting structure 214 at bracket 220, such that at the mounting position of modular manifold assembly 212 at chassis 204, the fluid outlet in manifold 222 ( Figure 9 (Not shown) is configured such that the fluid outlet faces the electronic component 210. The dispensing tube 230 is connected to the mounting structure 214 at the bracket 230, and the manifold 222 is fluidly connected to the outlet of the dispensing tube 230. The dispensing tube 230 includes an inlet 232, one of which is as follows: Figure 9 As shown. The distribution pipe 230 also includes a two-way valve 268 to allow selection of the direction of fluid flow through the distribution pipe 230.

[0072] In the case where the information processing system 202 is immersed in an immersion tank containing a fluid coolant pool, for example, refer to Figure 1 The described immersion tank 138 contains a fluid coolant 140, through which the coolant moves via the inlet 232 of the distribution pipe 230, then through the manifold 222, and is directed above the electronic components 210 via the fluid outlet. More specifically, the system 202 may also include a pump (not shown) and a fluid conduit connecting the pump to the inlet 232 of the distribution pipe, such that the pump can draw coolant from the tank and force it through the distribution pipe 230 and the manifold 222. Therefore, even when the information processing system 202 is immersed in the fluid coolant to provide system cooling, certain electronic components are able to receive additional cooling, thereby keeping the information processing system 2020 at an operating temperature unlikely to cause heat-related damage to system components.

[0073] Figure 10 This is method 370 for adapting a system to include modular manifold components. In 372, method 370 includes removing at least one air-cooling component attached to the system board. The air-cooling component can be a fan shroud, a fan, or any other component used in an air-cooling system. Removing at least one air-cooling component creates a usable volume on the system board. That is, by removing at least one air-cooling component, the system board has an empty space that was previously occupied by at least one air-cooling component.

[0074] At 374, method 370 includes coupling a modular manifold assembly to a chassis. The modular manifold assembly may include a mounting structure and a manifold. More specifically, coupling the modular manifold assembly to the chassis may include coupling the manifold to the mounting structure. The mounting structure may include a base and a pair of side arms. Coupling the manifold to the mounting structure may also include coupling the manifold to the base at multiple supports on the base, the manifold being configured to be received within the supports. An inlet of the manifold may then be coupled to a distribution tube coupled to the base. More specifically, the inlet of the manifold may be fluidly coupled to the output end of the distribution tube.

[0075] Attaching the modular manifold assembly to the chassis may also include attaching a mounting structure to the chassis. A pair of side arms may include multiple engagement features, and engagement features on the side arms may engage with corresponding engagement features on the chassis. Such attachment features on the chassis may correspond to engagement features of the air-cooling component removed at 372. For example, as specifically referenced... Figure 1 and Figure 9The connection feature on the chassis may be a fan shroud attachment point, but the examples are not limited to this. In the case where the modular manifold assembly is attached to the chassis, the modular manifold assembly is arranged within the available volume of the system board. In other words, the modular manifold assembly is configured to occupy space initially occupied by at least one air-cooled component, which is removed at position 372.

[0076] At 376, method 370 includes immersing the information processing system in a coolant fluid. More specifically, immersing the information processing system in a coolant fluid at 376 includes immersing at least a portion of a system board including a modular manifold assembly in the coolant fluid. This immersion allows the coolant fluid to move into the manifold, providing cooling to components on the system board. In some examples, the coolant fluid is a dielectric fluid, but the examples are not limited to this.

[0077] It should be understood that both the general description and the detailed description provide illustrative examples that are inherently explanatory and are intended to provide an understanding of this disclosure without limiting its scope. Other examples based on this disclosure will be apparent to those skilled in the art, given consideration for its content. For example, various mechanical, compositional, structural, electronic, and operational changes can be made to the disclosed examples without departing from the scope of this disclosure, including, for example, the addition, deletion, alteration, substitution, or rearrangement of elements of the disclosed examples, as will be apparent to those skilled in the art. Furthermore, those skilled in the art will understand that certain features or aspects of this teaching can be used independently (even if they are disclosed together in some examples) or together (even if disclosed in separate examples), as long as practicable. In some cases, well-known circuits, structures, and techniques are not shown or described in detail in order not to obscure the examples. Therefore, the following claims are intended to achieve the greatest breadth, including, but not limited to, the examples disclosed herein, in accordance with applicable law.

[0078] Unless otherwise expressly stated, references to examples, implementations, or other similar references herein should be understood as predictive or hypothetical examples, not actual manufactured devices / systems. Similarly, unless otherwise expressly stated, references to the quality or characteristics of examples should be understood as representing educated estimates or expectations made by the inventors based on their understanding of the application and / or past experience of the relevant principles, theories, and / or modeling involved, and not as representations of the actual quality or characteristics of actually manufactured devices / systems or empirical results of actual testing.

[0079] Furthermore, the spatial, positional, and relational terms used herein are intended to aid the reader in understanding examples of the invention, but are not intended to limit the invention to specific frames of reference, directions, or positional relationships. For example, as shown in the figures, spatial, positional, and relational terms such as “up,” “down,” “lateral,” “below,” “lower,” “above,” “upper,” “near,” “far,” etc., can be used to describe directions or spatial relationships between one element or feature and another. These spatial terms are used relative to the frame of reference in the figures and are not limited to specific frames of reference in the real world. Moreover, if the frame of reference considered differs from that shown in the figures, the spatial terms used herein may require different interpretations in those different frames of reference. Additionally, the poses of the objects shown in the figures are chosen for ease of illustration and description, but in practice, the poses of the objects may differ.

[0080] Furthermore, unless the context otherwise requires, the singular forms “a,” “an,” and “the” also include the plural forms. Additionally, the terms “comprising,” “including,” “having,” etc., specify the presence of the stated feature, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Unless otherwise specifically stated, components described as connected may be directly electronically or mechanically connected, or indirectly connected through one or more intermediate components.

[0081] And / or: The word “and / or” is occasionally used in conjunction with a list of items in this article. This phrase means that any combination of items in the list—from a single item to all items and any permutation in between—can be included. Thus, for example, “A, B, and / or C” means “one of {A}, {B}, {C}, {A, B}, {A, C}, {C, B}, and {A, C, B}.”

[0082] Unless otherwise indicated by the context of this specification, mathematical and geometric terms are not necessarily intended to be used according to their strict definitions, as those skilled in the art will understand that, for example, fundamentally similar elements that function in a substantially similar manner easily fall within the scope of descriptive terms, even if those terms have strict definitions. Furthermore, unless otherwise stated herein or implied by the context, the use of approximate terms such as “substantially,” “approximately,” “about,” “around,” “roughly,” etc., should be understood as not requiring mathematical precision, but rather referring to a range of variations, including, but not strictly limited to, the stated values, properties, or relationships. In particular, in addition to any ranges expressly specified herein (if any), the range of variations implied by the use of such approximate terms includes at least any insignificant variations, as well as those typical of the type of article under discussion in the relevant field due to manufacturing or other tolerances. In any case, unless otherwise stated, the range of variations may include values ​​within ±1% of the specified value, property, or relationship.

Claims

1. An information processing system, comprising: System board, the system board including electronic components; A chassis that supports the system board and includes a fan shroud attachment point configured to receive a fan shroud; as well as Modular manifold assembly, the modular manifold assembly having: The mounting structure includes: Base; Side arm, the side arm being configured to attach to the chassis at the fan shroud attachment point; and Multiple supports, the multiple supports being connected to the base; and At least one manifold, the at least one manifold being configured to removably engage with the plurality of supports; The at least one manifold is configured to receive a flow of fluid coolant drawn from the pool in the mounted state of the modular manifold assembly installed in the chassis and in the submerged state of the information processing system immersed in a fluid coolant pool in an immersion cooling tank, and to discharge the flow back into the pool as a plurality of output flows, wherein the output flows are directed toward the electronic components.

2. The information processing system according to claim 1, wherein: The distribution pipe is connected to the mounting structure at a subset of the plurality of supports; and The at least one manifold is fluidly connected to the distribution pipe.

3. The information processing system according to claim 2, wherein: The dispensing tube includes a pair of inlets located at opposite ends of the dispensing tube and separated by the dispensing tube body; and The dispensing tube includes a plurality of outlets formed in the body of the dispensing tube, each of the plurality of outlets being coupled to a single bracket among the plurality of brackets.

4. The information processing system according to claim 3, wherein, The distribution tube also includes one or more valves to selectively close or open one of the pair of inlets.

5. The information processing system according to claim 3, wherein, The distribution pipe also includes one or more valves to selectively close or open one of the plurality of outlets.

6. The information processing system according to claim 3, wherein, The distribution pipe also includes one or more three-way valves, each three-way valve being configured to selectively close or open one of the pair of inlets and one of the plurality of outlets.

7. The information processing system according to claim 1, wherein, The modular manifold assembly is configured to be positioned in the chassis in place of the fan shroud in the fan shroud area, the fan shroud area including the space between one or more of the electronic components and the cover of the chassis.

8. The information processing system according to claim 1, wherein, The side arm also includes: A first vertical portion, which is connected to the base of the mounting structure and extends away from the base of the mounting structure; The second vertical portion, which is offset from and parallel to the first vertical portion; and The top is disposed between and connects the first vertical portion and the second vertical portion, and the top also includes a plurality of engagement features for engaging with the chassis at the fan shroud attachment point.

9. The information processing system according to claim 1, wherein, The plurality of supports also includes multiple pairs of supports, each pair of supports being configured to hold one of the at least one manifold.

10. The information processing system according to claim 1, wherein, The at least one manifold also includes: fluid inlet; Manifold body, the manifold body being connected to the fluid inlet and defining a volume; and Multiple outlets are located in the manifold body and fluidly connected to the fluid inlet, and the multiple outlets are configured to output one or more output streams.

11. The information processing system according to claim 10, wherein, The manifold is configured such that, when the side arm is connected to the chassis, the one or more output streams are directed to or flow through one or more of the electronic components.

12. The information processing system according to claim 1, wherein: The plurality of supports further includes at least one stop feature configured to engage with a corresponding stop feature on the at least one manifold when the manifold is mounted in the plurality of supports; and The at least one stop feature is a locking mechanism to lock the at least one manifold in place relative to the plurality of supports.

13. A modular manifold assembly, comprising: The mounting structure has a base and a pair of side arms configured to be attached to the chassis at attachment points on the chassis. The manifold is removably connected to the base, and the manifold further includes a fluid inlet, a manifold body connected to the fluid inlet, and a plurality of fluid outlets formed within the manifold body; as well as A distribution tube is connected to the base and is fluidly connected to the manifold at its fluid inlet.

14. The modular manifold assembly of claim 13, wherein, The manifold is configured to receive a flow of fluid coolant drawn from the pool through the fluid inlet while the modular manifold assembly is immersed in a fluid coolant pool in an immersion cooling tank, and to discharge the flow back into the pool as a plurality of output flows through the plurality of fluid outlets.

15. The modular manifold assembly of claim 13, wherein, The dispensing tube also includes: First fluid inlet; Second fluid inlet; A dispensing tube body is disposed between and connects the first fluid inlet and the second fluid inlet; At least one fluid outlet; and An adjustable two-way valve is configured to regulate the flow direction of the coolant fluid when the information processing system is immersed in the coolant.

16. The modular manifold assembly of claim 15, wherein, At least one fluid outlet of the distribution pipe is fluidly connected to the fluid inlet of the manifold.

17. The modular manifold assembly of claim 13, wherein, The plurality of fluid outlets are oriented such that fluid passing through the plurality of fluid outlets is directed over at least one specific component among the plurality of information processing components.

18. The modular manifold assembly of claim 17, wherein, The plurality of fluid outlets are oriented by engagement of a stop feature on the manifold body with a corresponding stop feature on at least one support of the base.

19. A method for adapting an information processing system to immersion cooling, comprising: Remove at least one air-cooled component connected to the system board, wherein removing at least one air-cooled component creates a usable volume; An immersion cooling adapter, including a mounting structure and manifold, is connected to the chassis, wherein the immersion cooling adapter is connected to the chassis such that the immersion cooling adapter is disposed within the available volume; and The information processing system is immersed in a coolant fluid.

20. The method according to claim 19, wherein, Connecting the immersion cooling adapter to the chassis also includes: Connecting the manifold to the mounting structure, the mounting structure including a base and a pair of side arms having multiple engagement features, wherein connecting the manifold to the mounting structure further includes: The manifold is connected to the base at multiple supports on the base; and The inlet of the manifold is connected to a distribution pipe, which is connected to the base, wherein the inlet of the manifold is fluidly connected to the output of the distribution pipe; and The mounting structure is attached to the chassis by engaging the plurality of engagement features with corresponding engagement features on the chassis.

Images