Pump array assembly for immersion cooling

Abstract

An information handling system includes a system board having electronic components and supported by a chassis. The chassis includes a fan tray attachment point configured to receive a fan tray. A pump array assembly includes a mounting tray configured to couple to the chassis. One or more pumps are coupled to the mounting tray, the one or more pumps each including an inlet and an outlet. When the information handling system is submerged in a pool of liquid coolant in an immersion cooling tank, the pumps draw a flow of the liquid coolant from the pool through the inlets and eject the flow back into the pool as at least one output flow directed onto at least one of the electronic components through the outlets.

Description

[0001] Information processing systems (such as servers) generate heat during operation, and if this heat is not dissipated or cooled, various components within the system may be damaged. One way to cool a system is by using airflow through it, such as by using a fan installed within the system, utilizing the airflow passing over the components to provide cooling. Another way to cool a system is by using liquid cooling, where a coolant liquid flowing over the components removes heat from the system. Attached Figure Description

[0002] This disclosure may be understood either alone or in conjunction with the accompanying drawings in the following detailed description. The accompanying drawings and related descriptions of the images are included to provide a further understanding of this disclosure and are incorporated into and constitute a part of this specification. The drawings illustrate one or more non-limiting aspects and embodiments of this teaching and, together with the description, explain certain principles and operations. In the drawings: Figure 1 It is a block diagram of a system including a pump array assembly for immersion cooling; Figure 2 This is a perspective view of the mounting bracket for the pump array assembly used in immersion cooling; Figure 3 yes Figure 2 Rear elevation view of the mounting bracket; Figure 4 yes Figure 2 Bottom elevation view of the mounting bracket; Figure 5 yes Figure 2 Top elevation view of the mounting bracket; Figure 6 This is a perspective view of a pump array assembly, which includes... Figure 2 The mounting bracket and the two pumps shown in a separated state during pump installation; Figure 7 yes Figure 6 A perspective view of a pump array assembly having two pumps mounted on a mounting bracket; Figure 8 yes Figure 6 A front perspective view of a pump array assembly having six pumps mounted on a mounting bracket for immersion cooling; Figure 9 yes Figure 8 Rear perspective view of the pump array assembly; Figure 10 yes Figure 8 Rear perspective view of a pump array assembly having an inlet manifold; Figure 11 yes Figure 8Rear perspective view of a pump array assembly having an inlet manifold; Figure 12 yes Figure 10 Rear elevation view of the inlet manifold; Figure 13 It is a perspective view of an information processing system that includes a pump array assembly for immersion cooling; Figure 14 yes Figure 13 Another perspective on information processing systems; Figure 15 This is a method for adapting an information processing system to include a pump array assembly for immersion cooling. Detailed Implementation

[0003] Information processing components (such as CPUs) are generating more power and heat, making it increasingly difficult to effectively cool systems via airflow. With increased heat generation, a larger volume of air must be moved through the system to achieve the same level of cooling. This increased air volume through the system leads to increased power consumption and noise. Furthermore, the increased amount of air to be moved through the system also increases the cost of various components, such as fans and heat sinks.

[0004] An alternative method for cooling information processing systems is liquid cooling, where a liquid coolant is used to remove heat from the system. One form of liquid cooling is direct liquid cooling (DLC), in which a liquid coolant flows through the system using pipes / pipes, and heat is extracted from the heat-generating components of the system into the liquid coolant via cold plates attached to the components. DLC is frequently used in information processing systems with high component density, such as supercomputers or high-performance computing systems with multiple components that generate significant amounts of heat. DLC is efficient at removing heat from the system; however, it is costly due to the addition of additional components to the system, such as cold plates and coolant pipes. Because of the complexity of many DLC cooling systems, these additional components often need to be customized for each specific system, meaning that many components cannot be easily reused.

[0005] On the other hand, immersion cooling involves submerging part or all of the information processing system in a tank of a non-conductive liquid coolant (e.g., a dielectric fluid). This allows the liquid coolant to contact some or all of the information processing components, enabling the heat generated by the components to be dissipated into the coolant. The heated coolant can then be circulated through a heat exchanger to remove heat before being recirculated back into the tank. Immersion cooling represents a highly efficient method of cooling systems without a corresponding increase in power or noise output that might occur in air-cooled systems. Similarly, immersion cooling allows for some of the benefits of direct liquid cooling, namely, an increase in the amount of heat that can be removed from the system due to the use of a coolant fluid, without requiring a cooling system custom-designed for the specific information processing system. Therefore, the increased availability and affordability of immersion cooling systems make it an attractive option for system cooling.

[0006] When designing a new information processing system, it is feasible to design the system specifically for cooling via immersion cooling. However, generating and validating such a new system design can be costly and difficult. Furthermore, such a special-purpose system may have a relatively limited market segment; that is, it may be limited to users who utilize immersion cooling. Therefore, it may be preferable if an existing information processing system originally designed for some other environment (e.g., for air cooling) can be used in an immersion cooling system, as this can save costs by avoiding the need for a new system design and also allows the same overall design to cover multiple market segments (i.e., both air cooling and immersion cooling).

[0007] However, existing information processing systems originally designed for air cooling may not be well optimized for immersion cooling. Generally, air-cooled systems can be relatively easily converted to a state where they can be used in an immersion cooling bath, for example, by removing air-cooling specific components (such as fans, heatsinks, and baffles) and components incompatible with immersion (such as thermal paste, stickers, etc.). This form of conversion can be referred to as a baseline conversion in this paper because it represents the minimum conversion required to prepare the system for immersion. While this baseline conversion can relatively easily allow an air-cooled system to be converted for use in an immersion cooling bath, the resulting system is not well optimized for immersion cooling, and therefore some of the potential benefits of immersion cooling may not be fully realized. For example, in addition to the cooling that occurs when the system converted in the above manner is immersed in an immersion bath, additional cooling may be required for certain components, such as the CPU.

[0008] To address these and other issues, in the examples disclosed herein, a pump array assembly is mounted in the area between the system board and the front or rear panel of the information processing system. This pump array assembly is arranged to generate a flow of liquid coolant directed toward hot components of the device, such as the CPU and memory, to improve their cooling. The pump array assembly includes a cage connected to the system rack and multiple pumps connected to that cage. This pump array assembly can be used in information processing systems originally designed for air cooling and already (or being) converted to immersion-ready conditions, and can further optimize the system for immersion cooling beyond the baseline conversion. In this context, optimization means that the system is configured to provide cooling performance to one or more components, such as the CPU, that is superior to what the system would provide without the pump array assembly (i.e., exceeding the cooling performance already provided with a baseline conversion alone). In some examples, the pump array assembly can be configured to utilize features of a rack originally designed for air cooling. For example, the area where the pump array assembly is mounted can be the same area where, or formerly the area where, the fans are located in the system's air-cooled configuration (hereinafter referred to as the "fan area"). For example, in some systems, the fan area where the pump array assembly is mounted may be located in the space between the front edge of the system board and the front drive frame section of the rack. Furthermore, in some examples, the mounting bracket may be attached to the rack at a mounting feature for the fan mount. Additionally, in some examples, the pump may be electrically connected to and driven by a fan power connector—that is, a connector designed to provide power and drive signals to the fan in an air-cooled configuration of the system—which may be mounted on the system board or on a fan plate to which it is attached.

[0009] In some examples, the mounting bracket includes a base on which a plurality of pump mounts are formed, each pump mount including a space defined for receiving one of the pumps and engagement features configured to hold the pump in that space. The base may extend along the width dimension of the rack, in some cases spanning the entire width of the rack, with the pump mounts distributed at different locations along the base. Each of the pump mounts includes a space in which a pump can be disposed, defined by a set of supports configured to engage and hold the pump. In some examples, there are four supports for each pump mount, wherein the supports extend vertically from the base at positions corresponding to the four corners of a rectangle, such that the supports can engage different sides or edges of the pump to hold the pump between the supports. In some examples, the pump housing may have a shape resembling a rectangular prism (i.e., a box) with four vertically extending edges, and the supports may be arranged to engage correspondingly with the four vertically oriented edges of the pump housing. In some examples, the supports hold the pump therebetween by friction fit or snap-fit ​​fit, and the pump may be held in a mounted position within the mounting bracket. Each pump is oriented such that the fluid outlet faces at least one electronic component of the system, allowing the liquid coolant to be pumped onto the electronic component.

[0010] At least some pumps can also be coupled to an inlet manifold located away from the pump, which draws coolant from the immersion tank and supplies coolant to the pump. The inlet manifold can be positioned to allow the pump to receive liquid that is colder than the liquid near the pump. For example, in some examples, where the liquid in the immersion tank changes from cold to hot from the front to the rear of the server, the inlet manifold could be located at the front of the rack, such as in the drive bay section of the rack (e.g., the inlet manifold could occupy one or more bays of the drive bay in the drive bay section, or could completely replace one of the drive bays). Conversely, in some examples, where the liquid changes from cold to hot from the rear to the front, the inlet manifold could be located near the rear panel, such as in unused stand-up rack space. The inlet manifold can be used to help funnel-feed coolant liquid to the pump, allowing the pump to direct the coolant liquid to desired electronic components on the system board. An outlet on the inlet manifold can be connected to the pump at the pump inlet via tubing, allowing coolant liquid to move through the tubing to the pump. By using the inlet manifold, the pump receives coolant liquid that has not yet been heated due to contact with other electronic components. This allows the pump to direct the cooler liquid onto the electronic components, which in turn allows the coolant liquid to absorb and carry away more heat from the components, thus optimizing the cooling provided by the installed pump.

[0011] The following will combine Figures 1 to 15 These and other examples will be described in more detail.

[0012] Figure 1 Example system 100 is shown. Figure 1It is illustrative in nature and should be understood that, unless otherwise specified herein, Figure 1 This is not intended to show a precise or scaled representation of specific shapes, dimensions, positional relationships, or other structural details. Implementations of the information processing system 100 may include different numbers and arrangements of the components shown. Furthermore, Figure 1 The components shown may be omitted from some of the examples disclosed herein, and are not included in Figure 1 The components shown may also be included in some examples of this disclosure. Figure 1 In this diagram, physical connections between components (e.g., physical attachments and / or supports) are conceptually represented by solid lines extending between the components. Positional relationships are indicated by thick white filled arrows. The movement of coolant is indicated by dashed arrows.

[0013] System 100 is a system for immersion cooling of information processing equipment (such as servers, network equipment, etc.). System 100 includes an information processing system 102 and an immersion tank 130. The immersion tank 130 contains a pool of liquid coolant 132 and is configured to receive multiple information processing systems immersed in the coolant 132 to provide them with immersion cooling, as will be explained in more detail below.

[0014] The information processing system 102 may be a server, network device (e.g., a switch, router, etc.), or other device with information processing components. The information processing system 102 may include a rack 104, a system board 108, and a pump array assembly 112.

[0015] The rack 104 may include structural components for supporting and / or housing other components of the system 102. For example, the rack 104 may include a housing or enclosure comprising walls or panels, such as a base, sidewalls, or cover, joined together to define an internal space in which other components of the system are housed. The rack may also include other support structures that may be arranged within or integral with the housing, such as drive frames, power unit frames, etc. Alternatively, the rack 104 may include a tray or other support structure that supports but does not necessarily completely enclose the components of the system.

[0016] In some examples, system 102 is compatible with both air cooling and immersion cooling, meaning that system 102 is switchable between air cooling and immersion cooling configurations. In such examples, rack 104 may also include fan areas 111 and fan mount attachment points 106 (these are in...). Figure 1(These are shown in dashed lines to indicate that they do not necessarily exist in all examples of system 102). Fan area 111 is an area in rack 104 configured to receive a set of fans in an air-cooled configuration. For example, fan area 111 may include an open space between the system board 108 and the drive rack at the front of rack 104. Fan rack attachment point 106 includes attachment features configured to attach a fan rack holding a fan to rack 104. In some examples, fan rack attachment point 106 may be located in or on a side wall of rack 104 and / or in or on a base of rack 104. System 102 may also include fan power connectors 109 to mate with fan power cables to power the fans, and these connectors 109 may be mounted, for example, to system board 108. When system 102 is deployed in an immersion cooling configuration, the fans and fan racks may be removed. Therefore, in an immersion cooling configuration, if any fan area 111, fan mount attachment point 106 and / or fan power connector 109 are included in system 102, they are not used by the fan, but can be used by the pump array assembly 112 described below in some examples.

[0017] System board 108 may be supported by rack 104. System board 108 may be a motherboard including electronic components 110 and the aforementioned fan power connector 109 connected thereto. Electronic components 110 include at least some information processing components (such as a central processing unit (CPU), memory, etc.) and other passive or active electrical components (not shown), but are not limited to this example, and any system board may be used.

[0018] Pump array assembly 112 can be coupled to rack 104. Pump array assembly 112 may include mounting bracket 114 and an array of one or more pumps 122. In some examples, pump array assembly 112 may also include inlet manifold 128.

[0019] In some examples where the rack 104 includes a fan region 111, a pump array assembly 112 is mounted in the fan region 111 (in place of a fan omitted or removed from the fan region 111). In some examples where the rack 104 includes a fan mount attachment point 106, a mounting bracket 114 may be coupled to the rack 104 at the fan mount attachment point 106 instead of a fan mount (not shown) being coupled to the fan mount attachment point 106. In other words, the mounting bracket 114 can be coupled to the rack 104 by engaging a corresponding attachment feature on the mounting bracket 114 with the fan mount attachment point 106. The mounting bracket 114 can be coupled to the fan mount attachment point 106 by engaging, for example, a snap-fit ​​coupling, a friction-fit coupling, an actuated latching mechanism, a mechanical fastener (e.g., a screw) or another suitable coupling.

[0020] Mounting bracket 114 may include a base 116 configured to receive and hold one or more pumps 112. In some examples, mounting bracket 114 may be coupled to rack 104 at the base 116 of mounting bracket 114; that is, base 116 may include attachment features to engage and attach to rack 104. In some examples where mounting bracket 114 is attached to fan mount attachment point 106, the corresponding attachment feature engaging therewith may be located on base 116 such that base 116 engages with fan mount attachment point 106. In other examples (described below), the corresponding attachment feature engaging with fan mount attachment point 106 may be part of another portion of mounting bracket 114, such as a vertical wall (not shown) coupled to base 116.

[0021] The base 116 may include a plate 118 and engagement features 120. The plate 118 may provide a generally planar surface for supporting the pump 122 thereon. In some examples, the plate 118 may be parallel to the base of the rack 104 when the mounting bracket 114 is mounted in the rack 104. A plurality of engagement features 120 are coupled to the plate 118, wherein the engagement features 120 are arranged in one or more groups. Each group of engagement features 120 may be configured to hold one of the pumps(one or more) 122 at a specific location on the plate 118. More specifically, each group of engagement features 120 may be arranged on the plate 118 to define a space for receiving one of the pumps(one or more) 122 to engage with the pump 122 to hold and secure it to the mounting bracket 114. This space may be an empty volume partially defined or otherwise defined by the engagement features 120. Each individual group of engagement features 120 and the space thereby defined may be collectively referred to herein as a “pump mount”, wherein at least one pump mount is arranged on plate 118 (i.e., at least as many pump mounts as pump 122 are provided).

[0022] In some examples, the engagement feature 120 of a given pump mount can be a bracket configured to engage with the pump 122 via a friction fit. In such an example, the bracket may project vertically from the face of the plate 118, and each set of brackets may at least partially define a lateral side or edge of a corresponding space to receive the pump 122. The bracket also defines an opening on the top side of the space through which the pump 122 can be inserted into the space by moving downward through and between the brackets. When inserted into the space, the pump 122 may contact and slide against the engagement surface of the bracket, thereby engaging with the engagement feature 120.

[0023] A set of brackets for a given pump mount can be arranged to abut pump 122 on multiple sides or edges to restrict lateral movement of pump 122 relative to plate 118. Furthermore, plate 118 can restrict downward movement of pump 122. Therefore, in some examples, pump 122 may have only one degree of freedom of movement when mounted, namely upward movement away from plate 118. In some examples, friction between the mating surfaces and pump 122 can resist this upward movement, thus holding pump 122 in the pump mount. In other examples, a snap-fit ​​latching element on the bracket can engage with the top side of the pump to restrict upward movement of pump 122. In some examples, the bracket may have an "L" or "C" shaped cross-sectional profile, as described above. Figure 2 and Figure 5 One example is explained in more detail. However, the example is not limited to this, and other variations of engagement feature 120 can be used. For example, engagement feature 120 may include a latch, a snap-fit ​​coupling, or a feature such as a column configured to be received within a corresponding feature on a pump.

[0024] The pump array assembly 112 may further include one or more pumps 122. As used herein, a "pump" refers to a mechanical device that uses suction or pressure to move liquid from one space to another. Although Figure 1 Only one pump 122 is shown, but the example is not limited to this, and other numbers of pumps 122 may be used. The maximum number of pumps 122 that may be included in the pump array assembly 122 may be determined by the number of pump mounts provided on the plate 118. In many examples, multiple pumps 122 are provided and arranged in an array on the plate 118. The array may include various positional arrangements, including a linear arrangement in which the pumps 122 are positioned at points on a line that may extend parallel to the width dimension of the rack 104 and perpendicular to the flow direction of the liquid flow discharged by the pumps 122 (the width dimension of the rack is perpendicular to the side walls and front-to-back dimensions of the rack 104). As another example, the array may include an interleaved arrangement in which pump positions alternate between two (or more) parallel lines extending along the width dimension of the rack. An example of an alternating arrangement is as follows: the pump 122 closest to the first sidewall of the rack 104 is positioned on a first line extending parallel to the width dimension of the rack 104; the second pump 122 closest to the first sidewall is positioned on a second line parallel to but spaced apart from the first line; the third pump 122 closest to the first sidewall is positioned on the first line; the fourth pump 122 closest to the first sidewall is positioned on the second line; and this continues in an alternating manner for any number of pumps 122.

[0025] Pump 122 may include an inlet 124 and an outlet 126 through which fluid (e.g., liquid coolant 132) can flow. Inlet 124 may be an inlet fluid connector (e.g., a hose hook, threaded fitting, etc.) capable of connecting to a pipe or conduit, although examples are not limited thereto. Liquid 132 may flow into inlet 124 and outlet 126, such that liquid 132 is directed to flow through at least one electronic component 110. Outlet 126 may include a nozzle arranged to direct the flow of liquid 132 through electronic component 110. In some examples, outlet 126 may include a fluid connector similar to inlet 124, but in some examples the fluid connector may be left unconnected to a pipe / conduit, such that the fluid connector functions similarly to a nozzle. Pump 122 may include an electric motor driving the rotation of an impeller that generates a pressure differential and causes liquid 132 to flow from inlet 124 to outlet 126. Pump 122 may also include a power cable 125 supplying power and / or data signals to pump 122. In some examples, power cable 125 may be connected to one of the fan power connectors 109 on system board 108. In such examples, instead of system board 108 supplying fan drive signals to the fan via fan power connector 109, system board 108 may alternatively be configured to supply pump drive signals to pump 122 via fan power connector 109 to supply power and / or otherwise control the operation of pump 122.

[0026] In some examples where multiple pumps 122 are provided, an inlet manifold 128 may be coupled to the inlet 124 of the pump 122. As used herein, a “manifold” refers to a device that defines an internal volume that receives liquid via an input and distributes the liquid to multiple outputs. The inlet manifold 128 may include a manifold body that defines a volume through which coolant liquid 132 can flow. The inlet manifold 128 may include an inlet 127 and an outlet 129, which are fluidly coupled to each other via the body of the inlet manifold 128. The outlet 129 of the inlet manifold 128 may be fluidly coupled to the inlet 124 of the pump 122. In some examples, the number of outlets 129 is equal to the number of pumps 122, and the inlet 124 of each pump 122 is coupled to a corresponding outlet 129. In other examples, the number of outlets 129 may be less than the number of pumps 122, such that some pumps 122 may share the same outlet 129—for example, a group of pumps may have all their inlets 124 fluidly coupled to the same outlet 129. The outlet 129 can be directly connected to the inlet 124 or indirectly connected to the inlet 124 via a fluid conduit (pipe, pipe, etc.). In some examples, the outlet 129 can be screwed into the corresponding inlet 124 or fluid conduit, such that the threaded engagement between the outlet 129 and the inlet 124 or fluid conduit maintains the connection between the inlet manifold 128 and the pump 122. In other examples, the outlet 129 can be engaged with the corresponding inlet 124 by a press fit or a friction fit. Examples are not limited to these, and other connection methods may be used.

[0027] System 100 may also include an immersion tank 130 comprising a liquid coolant 132 held in a liquid holding portion of the tank 130 to form a pool of liquid coolant 132. The liquid holding portion of the tank 130 may be configured to receive an information processing system 102 such that the information processing system 102 is immersed in the pool of liquid coolant 132. As used herein, “immersion” means that at least system board 108 is submerged in liquid coolant 132. In some examples, each information processing system 102 may be completely submerged. In other examples, a small portion of system 102, such as a support bracket for a support system, may protrude beyond the liquid coolant 132. The immersion of system 102 in liquid coolant 132 is indicated by arrow 134.

[0028] Coolant 132 may be a non-conductive material that is liquid at room temperature, such as a dielectric fluid. Immersing the information processing system 102 in the liquid coolant 132 allows heat generated by the electronic components 110 to be removed from the information processing system 102. More specifically, coolant 132 absorbs heat from components of the system via convection and releases heat outside the system. In some examples, coolant 132 may be a single-phase coolant, meaning it is designed to absorb heat and circulate it through the immersion tank 130 while remaining substantially in a liquid phase. This circulation may include transferring the absorbed heat to a heat exchanger before circulating back through the immersion tank 130. Figure 1 (Not shown in the image), thus allowing the liquid coolant 132 to move continuously over the information processing system 102. In a single-phase system, essentially all heat transfer is achieved through the coolant 132 in the liquid phase. Although some of the coolant 132 may inevitably evaporate, this evaporation is incidental and not the primary heat transfer mode in a single-phase system. In other examples, the coolant 132 is a two-phase coolant, meaning it is designed to transfer heat during operation of the device by changing between a liquid phase and a vapor (gas) phase, and by transferring heat through this phase change. In such an example, the coolant 132 has a boiling point close to the desired operating temperature of the electronic component 110, meaning the electronic component 110 can cause the coolant 132 to boil during operation. This boiling absorbs heat from the component and allows the heat to dissipate via the interaction of the coolant 132 in vapor form with a radiator or other heat dissipation structure (not shown).

[0029] When the information processing system 102 is immersed in liquid coolant 132, pump 128 can be configured to move liquid coolant 132. More specifically, inlet manifold 128 can draw liquid coolant 132 from the pool in immersion tank 130 through inlet 127. Liquid coolant 132 can then move through inlet manifold 128 to exit at outlet 129. Because outlet 129 is fluidly connected to inlet 124 of pump 122, liquid coolant 132 moves through inlet 124 of pump 122 before exiting pump 122 at outlet 126. Outlet 126 can move liquid coolant 132 onto at least one electronic component 110. More specifically, outlet 126 can be oriented to flow onto selected electronic components 110. For example, outlet 126 can be positioned to allow liquid coolant 132 to flow onto high-temperature components (e.g., CPU or memory), thereby allowing additional liquid coolant 132 to move onto the components, increasing the cooling of those components.

[0030] Turn Figures 2 to 7 Example mounting bracket 214 is shown. Mounting bracket 214 can be... Figure 1 The image shown and about Figure 1An implementation example of the described mounting bracket 114, and which can be used for... Figure 1 In the described system (e.g., system 100), mounting bracket 214 includes components that correspond (i.e., are examples of implementations thereof) to components of mounting bracket 114, and the correspondence between these components is indicated herein by components having the same last two digits in their reference numerals, such as 120 and 220. The aspects of mounting bracket 114 and its components described above also apply to mounting bracket 214 and its corresponding components, but mounting bracket 114 and its components are not limited to mounting bracket 214 and its components; mounting bracket 214 and its components are merely one example of how mounting bracket 114 can be implemented. In some cases, to avoid repetition, aspects of mounting bracket 114 already described above (which also apply to mounting bracket 214) are not described below.

[0031] Mounting bracket 214 includes a base 216. Base 216 includes a plate 218 and a plurality of engagement features 220. Although only a subset of engagement features 220 may be labeled, it should be understood that unlabeled engagement features have features similar to those of the labeled engagement features 220. Engagement features 220 include a support formed by a wall 236 having a gap 238 defined by the edge of the wall 236. More specifically, the support may have an “L” or “C” shaped cross-sectional profile as described above, such that the gap 238 may correspond to an opening in the “L” or “C”. The size of the gap 238 may be designed to slidably receive a pump (e.g., Figure 6 and Figure 7 The pump 222 shown is held within a single engagement feature 220.

[0032] Each engagement feature 220 is coupled to plate 218 at its first end and extends vertically from plate 218. Multiple engagement features 220 may be arranged on plate 218 to accommodate the pump. Figure 2 and Figures 5 to 7 As shown, a group of four engagement features 220 are arranged on plate 218 to define an open rectangular space 219 having a height h and a width w. Each of the individual engagement features 220 is coupled to plate 218 at a corner of rectangular space 219, such that engagement features 220 are arranged at the corner of space 219. Space 219 and the group of its corresponding engagement features 220 together define a pump mount, which is configured to receive, hold, and support a pump (e.g., a base 216) relative to base 216. Figures 6 to 7(Pump 222 shown). In this example, there are six pump mounts, allowing six pumps to be mounted to the mounting bracket 214 (although not all pump mounts need to be filled with pumps in any given implementation). Other examples of mounting brackets (not shown) may be similar to mounting bracket 214 but may have more or fewer pump mounts. In this example, the pump mounts are distributed across the longitudinal dimension 299 of the bracket 214, which corresponds to the width dimension of the bracket when the bracket 214 is mounted in a rack. In this example, the pump mounts are arranged in a staggered pattern. This staggered arrangement allows pumps whose inlets extend along the longitudinal dimension 299 of the bracket 214 to be positioned close to each other, with their inlets extending behind or in front of adjacent pumps. If these pumps were instead arranged in a straight line, they might need to be spaced further apart to avoid one pump's inlet interfering with adjacent pumps. In other examples of mounting brackets (not shown), the pump mounts can be arranged in different patterns, such as all in a straight line, different staggered patterns, or any other desired arrangement.

[0033] More specifically, such as Figures 6 to 7 As shown, each individual pump 222 includes a top wall 264, a bottom wall (not shown) offset from and parallel to the top 264, and a side wall 266. Pump 222 also includes a front wall 268 and a rear wall 270 (as shown) configured to offset from and parallel to the front wall 268. Figures 9 to 11 As shown, and further regarding Figures 9 to 11 (Discussion). A sidewall 266 in Figures 6 to 7 As shown in the diagram; however, it should be understood that the second sidewall is arranged in the opposite manner and with... Figures 6 to 7 Like the sidewall 266 shown, it extends between the top wall 264 and the front wall 268, and between the top wall 264 and the bottom wall and the rear wall, connecting the top wall 264 to the front wall 268 and to the bottom wall and the rear wall. When the pump 222 is installed in the pump mounting bracket, as... Figure 6 As shown, pump 222 is aligned with a specific rectangular space 219 and its corresponding engagement feature 220. Since engagement feature 220 is a support with a gap 238 defined by wall 236, the corresponding intersecting edges of sidewall 266, front wall 268, and rear wall 270 can be inserted into the space of gap 238 and slide through the length of engagement feature 220 until pump 222 is fully received in the pump mount, and the bottom wall of pump 222 rests on and is supported by plate 218 within the defined rectangular space 219. Figure 7 As shown, each pump 222 is held in place by an engagement feature 220 during installation. More specifically, inserting the edge of the pump 222 into the gap 238 of the engagement feature 220 deforms the wall 236 of the engagement feature 220, allowing the pump 222 to move through the gap 238. Once the pump 222 is in the installed position, as... Figure 7As shown, wall 236 contacts and clamps the edge of pump 222, thereby holding pump 222 on plate 218.

[0034] In this example, the frame 214 also includes a wall 242 extending vertically from the base 216 to provide additional structure and stability to the mounting frame 214. The wall 242 includes a plurality of cutouts 243 extending through the thickness of the wall 242. The cutouts 243 allow cables (e.g., power cables connected to the pump 222) to be routed through the mounting frame 214 while maintaining an open structure to allow liquid coolant to flow through and around the mounting frame 214. A ledge 244 extends vertically from the wall 242 and includes an opening 246 adjacent to the cutouts 243. The opening 246 also allows liquid coolant to flow through and around the ledge 244.

[0035] The lower crossbar 240 extends from the wall 242 parallel to and offset from the upper crossbar 244. The lower crossbar 240 is substantially parallel to and connected to the base 216, such that the lower crossbar 240 extends away from the plate 218 of the base 216. The lower crossbar 240 may include attachment features that allow the mounting bracket 214 to be attached to the rack. Specifically... Figure 2 and Figures 4 to 5 As shown, one such attachment feature is an attachment tab 250. The attachment tab 250 extends vertically from the lower crossbar 240.

[0036] The attachment tab 250 includes a horizontal portion 252 parallel to the lower crossbar 240. A hole 254 is formed within the horizontal portion 252, the size of which is designed to receive a fastener (e.g., a screw or pin). The horizontal portion 252 of the attachment tab 250 is coupled to the lower crossbar 240 at a vertical portion 256, which extends between the edge of the lower crossbar 240 and the edge of the horizontal portion 252 of the attachment tab 250 and connects the edge of the lower crossbar 240 to the edge of the horizontal portion 252 of the attachment tab 250. In this way, the attachment tab 250 is offset both horizontally and vertically from the lower crossbar 240. Although the two attachment tabs 250 are... Figure 2 and Figures 4 to 5 The example is shown, but is not limited to this, and more or fewer attachment tabs may be used.

[0037] In use, the attached tab 250, specifically the hole 254, is aligned with the corresponding opening on the frame, these openings corresponding to... Figure 1 The fan mount attachment point discussed (e.g., fan mount attachment point 110). Once the attachment tab 250 is in the correct position, fasteners (e.g., screws, pins, etc.) can pass through the hole 254 and the corresponding attachment point on the rack, thereby attaching the mounting bracket 214 to the rack.

[0038] In addition, the lower horizontal bar 240 may include positioning features 258, such as Figure 4 As shown. Positioning feature 258 includes a notch 260 that selectively engages with a corresponding feature (e.g., a pin) on the rack and / or system board. More specifically, the pin slides into the notch 260 to hold the mounting bracket 214 in a desired position. Figure 4 As shown, the lower crossbar 240 may include both a positioning feature 258 and an attachment tab 250. Therefore, during the installation of the mounting bracket 214, the mounting bracket 214 can first be positioned on the system board at the positioning feature 258 before being coupled to the rack at the attachment tab 250. A gripping tab 262 can extend from the lower crossbar 240 and can provide an additional contact point at which the user can manipulate the mounting bracket 214.

[0039] Specifically return Figure 2 A pair of sidewalls 248 extend vertically from wall 242, and the sidewalls 248 are spaced apart by the length of wall 242. When the mounting bracket 214 is installed in the rack, each of the sidewalls 248 contacts the corresponding side of the rack, while providing additional contact points between the mounting bracket 214 and the rack. This configuration will be relevant to... Figure 13 and Figure 14 Further discussion.

[0040] Specific direction Figures 6 to 9 The pump array assembly 212, including mounting bracket 214 and pump 222, is shown in various states of the component. As previously described, mounting bracket 214 is configured to receive at least one pump 222. Two pumps are... Figure 6 and Figure 7 The images show the pumps in both installed and uninstalled states, and six pumps are shown in... Figure 8 and Figure 9 The example is shown in its installed state; however, this is not an isolated case, and more or fewer pumps may be installed. Figure 6 As shown, each individual pump 222 is aligned with the pump mount and moves toward the base 216. Figure 6 and Figure 7 The diagram shows pumps 222 mounted such that the front wall 268 faces the opposite direction of the wall 242 of the mounting bracket 214. Each pump 222 includes an outlet 226 on the front wall 268; therefore, in Figure 7 In the installation position shown, outlet 226 also faces away from wall 242. Furthermore, each pump 222 includes an inlet. The inlet is located in... Figures 6 to 11 They are not visible because they are covered by liquid conduits 272 attached to them, as described below. However, the approximate location of the inlets is determined by... Figure 7 and Figure 9 The arrow marked 224 indicates this.

[0041] In some examples, a liquid conduit 272 can be installed to fluidly connect two or more pumps 222 to a common inlet port 274. Figures 7 to 11In the example shown, liquid conduit 272 is connected to the inlet of pump 222. Each of the liquid conduits 272 shown has a "Y" or "T" configuration, wherein a single inlet pipe 273c has a common inlet port 274 at one end of conduit 272 and at least two outlet pipes 273a and 273b at the other end of conduit 272, wherein the inlet pipe 273c and the outlet pipes 273a and 273b are fluidly connected together (e.g., via a T-joint). In some examples, additional outlet pipes may be included, wherein additional outlet pipes are also configured to be connected to inlet pipe 273c. Outlet pipes 273a and 273b are connected to the inlets of two of pumps 222. Thus, the inlets of a pair of pumps 222 are fluidly connected to the same common inlet port 274. For example, as Figure 7 As shown, the first outlet pipe 273a of the liquid conduit 272 is connected to the inlet of the first pump 222-1, and the second outlet pipe 273b is connected to the inlet of the second pump 222-2. These pipes 273a and 273b are then joined together and connected to the inlet pipe 273c via a T-joint. The inlet pipe 273c then terminates at a common inlet port 274, which extends away from the pump 222 toward the cutout 243 in the wall 242. In such an example, the inlet of each of the pumps 222 is fluidly connected to the common inlet port 274 via the liquid conduit 272. This allows a single inlet (i.e., the common inlet port 274) to guide fluid through the fluidly connected pumps 222.

[0042] like Figure 8 and Figure 9 As shown, multiple pumps 222 can be mounted on plate 218 as part of mounting bracket 214, wherein Figure 8 and Figure 9 The six pumps 222 installed are shown. (As shown) Figure 2 As shown, each pump 222 is mounted in a pump mounting bracket. That is, each pump 222 is mounted within a rectangular space 219 and held in place by corresponding sets of engaging features 220. Each pump 222 has an outlet 226 formed as a portion of a front wall 268. Figure 8 and Figure 9 In the installed pump 222 shown, each outlet 226 faces away from the wall 242; however, the example is not limited to this, and the pump 222 may be oriented in different directions relative to each other.

[0043] In systems with two or more pumps 222, multiple liquid conduits 272 are installed to fluidly connect the two pumps 222 at a common inlet port 274. Figure 7 As shown in pump 222, common inlet port 274 directs fluid through pump 222 via fluid connection.

[0044] In some cases, the pump array assembly 212 may also include, for example: Figures 10 to 12 The inlet manifold 228 is shown. (As shown...) Figure 10 and Figure 11 As shown, mounting bracket 214 houses six pumps 222, each pump 222 being held in place by engagement feature 220. Inlet manifold 228 is shown as being separate from pumps 222.

[0045] The inlet manifold 228 includes a top wall 276, a bottom wall 280, and a pair of side walls 278 connecting the top wall 276 and the bottom wall 280 to form an open rectangular prism (i.e., a box). A front wall 284 closes one side of the rectangular prism. The inlet 227 is defined by additional openings formed by the top wall 276, the bottom wall 280, and the side walls 278, allowing liquid coolant to flow into the inlet manifold 228. The inlet 227 is defined by an inclined surface 282 that extends around a perimeter formed by the top wall 276, the bottom wall 280, and the side walls 278. In some examples, the inclined surface 282 facilitates the insertion of another component (e.g., another pump) into the inlet 227 of the inlet manifold 228.

[0046] Outlet 229 extends from front wall 284 opposite to inlet 227, allowing liquid flowing through inlet manifold 228 to enter inlet 227 and exit via outlet 229. Although three outlets 229 are shown, the example is not limited to this, and more or fewer outlets 229 may be used. Outlet 229 is spaced from front wall 284 by shoulder 288. In some examples, shoulder 288 provides a narrowing between the open space of inlet 227 and outlet 229. This can help increase the velocity at which liquid coolant exits inlet manifold 228 at outlet 229.

[0047] Inlet manifold 228 is connected to pump 222 mounted on mounting bracket 214. More specifically, outlet 229 of inlet manifold 228 is physically engaged with common inlet port 274 to fluidly connect inlet manifold 228 to pump 222. This allows fluid to move through inlet manifold 228 into pump 222, where it is then directed to electronic components.

[0048] Figure 13 and Figure 14 This is a perspective view of the information processing system 202, in which the pump array assembly 212, as described above, including mounting bracket 214, pump 222, and inlet manifold 228, can be used. The information processing system 202 includes a rack 204 supporting a system board 208. The system board 208 includes multiple electronic components 210 coupled thereto. Although... Figure 13 and Figure 14Two electronic components 210 are shown, but the example is not limited to this, and there may be more or fewer electronic components 210. Electronic components 210 may be processors (e.g., CPUs), memory, or any other core components. The rack 204 may also include a fan area 211, in which fans will be mounted in an air-cooled configuration. Figure 13 and Figure 14 In this configuration, the system is in an immersion cooling configuration, so the fan is removed and the fan bracket is not present, thus allowing a portion of the pump array assembly 212 to be installed in the fan area 211.

[0049] More specifically, mounting bracket 214 is mounted with plate 218 substantially parallel to system plate 208, and sidewall 248 adjacent to the sidewall of rack 208. Furthermore, although... Figure 13 and Figure 14 Not shown, but attachment features (such as attachment tabs 250 and / or positioning features 258) connect the mounting bracket 214 and thus the pump array assembly 212 to the rack 204.

[0050] Multiple pumps 222 are mounted within a mounting bracket 214 such that, in the mounting position of the pump array assembly 212 at rack 204, the fluid outlet 226 of the pumps 222 faces the liquid flow and directs the liquid flow toward the electronic components 210 (where the liquid coolant flow is...). Figure 13 (Indicated by dashed arrows). Pumps 222 are arranged in pairs, and each pair of pumps 222 is connected to the same liquid conduit 272, which includes a common fluid inlet 274, such that the inlets 226 of the two pumps 222 are fluidly connected to each other, as described above. The common fluid inlet 274 of each of the various liquid conduits 272 is then each connected to a corresponding liquid conduit 277, each of the liquid conduits 277 being subsequently connected to a corresponding outlet 229 of the inlet manifold 229 (not shown in the image). Figure 13 and Figure 14 (As shown in the diagram). Therefore, liquid enters manifold 229, is distributed from manifold 229 to liquid conduits 227, flows from each liquid conduit 227 to a corresponding liquid conduit 272, flows from each liquid conduit 272 to a corresponding pair of pumps 222, and then pumps 222 eject liquid coolant in the form of a stream from an outlet, which is directed toward and / or onto electronic component 210.

[0051] In this example, the inlet manifold 229 is disposed within the slot 207 of the drive frame 209 on the front panel of the rack 204, so the inlet manifold 229 is in Figure 13 and Figure 14The inlet manifold 229 is not visible in the view. It is provided in the slot 207 in place of a drive module or other module that might otherwise occupy the slot 207. The inlet 227 of the manifold 229 can be positioned behind and facing the perforated front panel of the slot 207, allowing the inlet manifold 229 to draw liquid from outside the rack 304 through the perforated front panel. Therefore, liquid drawn into the manifold 229 in this manner will not have passed through any electronics in the system 202 and will not be preheated by them. On the other hand, liquid directly surrounding the pump 222 may pass through various electronics (e.g., storage drives in the drive rack 209 or other electronic components (not shown)) before reaching the area around the pump 222, and therefore the liquid around the pump 222 may be hotter than the liquid drawn into the manifold 229. Therefore, using manifold 229 to supply liquid to pump 222 allows the liquid flow ejected by the pump to be colder than if pump 222 were to draw liquid from an adjacent area of ​​pump 222 instead.

[0052] Pump 222 is also configured to be electrically connected to system board 208 at a power connector on the system board. In some examples, pump 222 is configured to be coupled to a fan power connector, although the examples are not limited thereto.

[0053] Furthermore, pump 222 is electrically connected to control system 275 on system board 208. Control system 275 includes a temperature sensor disposed on or within at least one of the electronic components 210 to monitor the operating temperature of the electronic components 210. Control system 275 also includes a pump speed control interface communicatively coupled to the temperature sensor. The pump speed control interface is configured to dynamically control at least one of the pumps 222. More specifically, the pump speed control interface is configured to change the speed of at least one of the pumps 222, thereby increasing or decreasing the amount of liquid coolant moving through the pump 222. The pump speed control interface can change the pump speed in response to the temperature measured at the temperature sensor reaching a threshold temperature. That is, the speed of pump 222 may increase when the electronic components 210 approach the threshold temperature. This allows liquid coolant to be directed to those electronic components 210 that require more cooling. In some examples, the pump speed control interface may be a board management controller (BMC), although the examples are not limited to this.

[0054] When the information processing system 202 is immersed in an immersion tank containing a liquid coolant (as per relevant information) Figure 1When the information processing system 202 is immersed in the liquid coolant 132 in the immersion tank 130, the pump helps to guide additional liquid coolant above the electronic components 210 via the fluid outlet. Therefore, even when the information processing system 202 is immersed in liquid cooling to provide system cooling, certain electronic components 210 are able to receive additional cooling, thereby keeping the information processing system 202 at an operating temperature that is unlikely to cause heat-related damage to system components.

[0055] Figure 15 This is method 390 for adapting a system to immersion cooling. At 392, method 390 includes removing at least one air-cooling component attached to the system board. The air-cooling component may be a fan bracket, a fan, or any other component used in an air-cooling system. Removing at least one air-cooling component creates a usable volume on the system board. That is, by removing at least one air-cooling component, the system board has empty space previously occupied by at least one air-cooling component.

[0056] At 394, method 390 includes attaching a pump mount to a system board. More specifically, attaching the pump mount to a rack includes engaging an attachment feature on the pump mount with a corresponding feature on the rack. The feature on the rack may correspond to the attachment feature of the air-cooling component removed at 362, while allowing the engagement feature on the pump mount to be attached in place of the removed air-cooling component. For example, as specifically regarding... Figure 1 The attachment feature on the rack can be a fan mount attachment feature, although examples are not limited to this. This attachment feature can be associated with engagement features on the mounting bracket (such as those related to...). Figures 2 to 9 The aforementioned engagement tab engages. When the mounting bracket is attached to the rack, it is positioned within the available volume of the system board. In other words, the mounting bracket is configured to occupy the space originally occupied by at least one air-cooling component removed at 362.

[0057] At 396, method 390 includes coupling one or more pumps to a pump mounting bracket. Coupling one or more pumps to the pump mounting bracket includes engaging each of the one or more pumps with a pump receiving feature on the pump mounting bracket. These pump receiving features may be engagement features, such as those related to... Figures 1 to 9 As discussed. Once the pump is engaged with the pump receiving feature, the pump can be electrically connected to the system board. The pump can be electrically connected to a power source available by removing at least one air-cooling component at 392. For example, if the air-cooling component removed at 392 is a fan, the pump can be electrically connected to the system board in place of the removed fan (but in the same location).

[0058] Connecting one or more pumps to the pump mount at point 396 may also include connecting the inlet of one or more pumps to the corresponding output of the inlet manifold. (See also: Regarding...) Figures 10 to 12The inlet manifold can be selectively connected to the inlet of one or more pumps to guide fluid (such as liquid coolant) through the pump.

[0059] At 398, method 390 includes immersing the information processing system in a coolant liquid. More specifically, immersing the information processing system in a coolant liquid at 398 includes immersing at least a portion of the system board (including an immersion cooling adapter) in the coolant liquid. This immersion allows a pump to move coolant liquid into a manifold, thereby providing cooling to components on the system board. In some examples, the coolant liquid is a dielectric liquid, although the examples are not limited to this.

[0060] It should be understood that both the general description and the detailed description provide illustrative examples of implementations intended to provide an understanding of this disclosure without limiting its scope. Based on consideration of the content of this disclosure, those skilled in the art will appreciate other examples based on this disclosure. For example, various mechanical, compositional, structural, electronic, and operational changes can be made to the disclosed examples without departing from the scope of this disclosure, including the addition, removal, alteration, substitution, or rearrangement of elements of the disclosed examples, as will be apparent to those skilled in the art when considering this disclosure. Furthermore, those skilled in the art will appreciate that certain features or aspects of this teaching may be used independently (even if disclosed together in some examples) or together (even if disclosed in separate examples), provided that it is practically practicable. In some cases, well-known circuits, structures, and techniques have not been shown or described in detail to avoid obscuring the examples. Therefore, the following claims are intended to be given the broadest scope under applicable law, including equivalents, but not limited to the examples disclosed herein.

[0061] References to examples, implementation methods, or other similar designations herein should be understood as referring to predictive or hypothetical examples, and not to actual manufactured devices / systems, unless otherwise expressly indicated. Similarly, references to the nature or characteristics of examples should be understood as representing reasonable estimates or expectations by the inventors based on their understanding, theoretical application, and / or modeling and / or past experience of the relevant principles involved, and not representing the actual nature or characteristics of actually manufactured devices / systems or empirical results of actual tests, unless otherwise expressly indicated.

[0062] Furthermore, the spatial, positional, and relational terms used herein are for the purpose of assisting the reader in understanding examples of the invention and are not intended to limit the invention to a particular reference frame, orientation, or positional relationship. For example, spatial, positional, and relational terms such as “up,” “down,” “side,” “below,” “below,” “lower,” “above,” “higher,” “proximal,” and “farthest” may be used herein to describe orientation or to describe the spatial relationship between one element or feature and another element or feature in the figures. These spatial terms are used relative to the reference frame shown in the figures and are not limited to a specific reference frame in the real world. Moreover, if a reference frame different from that shown in the figures is considered, the spatial terms used herein may require different interpretations in that different reference frame. In addition, the orientations of the items shown in the figures are chosen for ease of illustration and description, but in actual implementation, the items may be placed in different orientations.

[0063] Furthermore, unless the context otherwise indicates, the singular forms “a,” “an,” and “the” are intended to include the plural forms. Additionally, the terms “comprising,” “including,” “having,” etc., specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Unless otherwise specifically stated, components described as being connected can be directly connected electronically or mechanically, or can be indirectly connected via one or more intermediate components.

[0064] And / or: The phrase “and / or” is occasionally used in conjunction with a list of items in this article. This phrase means that any combination of items in the list—from a single item to all items and any permutation in between—can be included. Thus, for example, “A, B and / or C” means “one of {A}, {B}, {C}, {A, B}, {A, C}, {C, B}, and {A, C, B}.”

[0065] Mathematical and geometric terms are not necessarily intended to be used according to their strict definitions unless the context of the description indicates otherwise, as those skilled in the art will understand that, for example, fundamentally similar elements that are substantially similar in function can readily fall within the scope of descriptive terms, even if those terms also have strict definitions. Furthermore, unless otherwise stated herein or implied by the context, the use of approximate terms such as “substantially,” “approximately,” “about,” “roughly,” “approximately,” etc., should be understood as not requiring mathematical precision, but rather referring to a range of variation, including but not limited to, the stated values, characteristics, or relationships. In particular, in addition to any ranges explicitly stated herein (if any), the range of variation implied by the use of such approximate terms includes at least any insignificant variation, as well as typical variations in the relevant field for articles of the type due to manufacturing or other tolerances. In any case, the range of variation may include at least ±1% of the stated values, characteristics, or relationships, unless otherwise indicated.

Claims

1. An information processing system, the information processing system comprising: System board, the system board including electronic components; A rack that supports the system board and includes a fan mount attachment point configured to receive a fan mount; Pump array assembly, the pump array assembly comprising: Mounting bracket, the mounting bracket being configured to attach to the rack at the fan bracket attachment point; and One or more pumps are coupled to the mounting bracket, wherein each of the pumps: Including entrances and exits; and Configured to, when the information processing system is immersed in a pool of liquid coolant in an immersion cooling tank, draw a flow of liquid coolant from the pool through the inlet and spray the flow back into the pool as at least one output flow directed to at least one of the electronic components through the outlet.

2. The system of claim 1, further comprising an inlet manifold fluidly connected to each inlet of the pump.

3. The system of claim 1, further comprising a control system electrically connected to the pump, the control system further comprising: A temperature sensor, wherein the temperature sensor is disposed on or in one of the electronic components; as well as A pump speed control interface is communicatively connected to the temperature sensor, wherein the pump speed control interface dynamically controls the one or more pumps.

4. The system according to claim 3, wherein, The pump speed control interface changes the speed of at least one of the pumps in response to the temperature measured at the temperature sensor reaching a threshold temperature.

5. The system according to claim 3, wherein, The pump speed control interface is the Baseboard Management Controller (BMC).

6. The system according to claim 1, wherein, The mounting bracket includes a base, the base comprising: Plate, the plate being used to support the pump; and One or more pump mounts are arranged on the plate, each pump mount including a space therein for receiving one of the pumps and a plurality of engagement features coupled to the base and configured to retain the pump received in the space.

7. The system according to claim 6, wherein, The plurality of engagement features include a plurality of supports configured to slidably receive the at least one pump and retain the at least one pump by frictional engagement.

8. The system according to claim 7, wherein: The plurality of supports includes four supports arranged at the corners of a rectangle on the plate; and Each of the plurality of supports is connected to the plate at a first end and extends vertically from the plate.

9. The system according to claim 1, wherein: The one or more pumps include a first pump and a second pump; and The inlets of both the first and second pumps are fluidly connected to a common inlet port via liquid conduits.

10. The system according to claim 1, wherein, The at least one pump is electrically connected to the fan power connector in place of the fan.

11. The system according to claim 1, wherein: The pump array assembly is disposed in the fan area of ​​the rack, the fan area of ​​the rack being configured to receive the fan frame and the fan; and The fan area of ​​the rack is located between the system board and the front or rear panel of the rack.

12. A pump array assembly, the pump array assembly comprising: Pump mounting bracket, the pump mounting bracket comprising: A base defining multiple locations for receiving and supporting one or more pumps, the base also being configured to engage with the rack of an information processing system; and Multiple engagement features are provided to hold the one or more pumps relative to the base in a mounting state in which the one or more pumps are mounted in the pump mounting bracket; and An inlet manifold is fluidly connected to the one or more pumps at the inlet valve of the one or more pumps.

13. The pump array assembly of claim 12, wherein, The base also includes a pair of walls that extend vertically perpendicular to the base and are configured to engage with the frame via a frictional fit between the pair of walls and corresponding side walls of the frame to connect the pump mounting bracket to the frame.

14. The pump array assembly of claim 12, wherein, The base also includes a plurality of screw attachment points that extend parallel to the base and are configured to engage with corresponding screw attachment points on the frame to connect the pump mounting bracket to the frame.

15. The pump array assembly of claim 12, wherein: The inlet manifold also includes a manifold inlet and a manifold outlet; and The manifold output is fluidly connected to the pump's intake valve via a pipe extending between the manifold output and the pump's intake valve.

16. A method for adapting an information processing system to immersion cooling, the method comprising: Remove at least one air-cooled component that is attached to the system board, wherein removing the at least one air-cooled component creates a usable volume on the system board; A pump mounting bracket is connected to a frame, wherein the pump mounting bracket is connected to the frame within the available volume on the system board; Connect one or more pumps to the pump mounting bracket; and The information processing system is immersed in a coolant liquid.

17. The method according to claim 16, wherein, Connecting the pump mounting bracket to the frame includes engaging attachment features on the pump mounting bracket with the frame.

18. The method of claim 16, wherein, Connecting one or more pumps to the pump mounting bracket also includes: Engage the one or more pumps with the pump receiving feature on the pump mounting bracket; and Connect the one or more pumps to the system board.

19. The method according to claim 18, wherein, Connecting the one or more pumps to the rack includes connecting the one or more pumps to a power source previously used by the at least one air-cooled component.

20. The method according to claim 18, wherein, Connecting one or more pumps to the pump mount also includes connecting the inlet of the one or more pumps to the corresponding output of the inlet manifold.

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