Heat dissipation module

Abstract

The present disclosure provides a heat dissipation module, which includes a heat conducting member, a locking member, and at least one elastic member. The heat conducting member is movably floated on a circuit board and has a convex ring portion and a through hole penetrating the convex ring portion. The locking member is threaded through the through hole and fixed to the circuit board. The at least one elastic member is connected to the heat conducting member and abuts against the circuit board. The convex ring portion can move along the locking member to be adjacent to or away from the circuit board, so as to compress or release the elastic member.

Description

Technical Field

[0001] This disclosure relates to a heat dissipation module, and more particularly to a heat dissipation module adaptable to solid-state drive cards of different thicknesses. Background Technology

[0002] To meet modern demands, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, this process also brings about heat dissipation problems due to the high performance of the hardware. Generally speaking, computers and various electronic devices usually use heat dissipation components, such as thermal paste or heat sinks, to absorb and dissipate heat from the electronic components.

[0003] Solid-state drives (SSDs) mounted on the motherboard also require heat dissipation. However, current SSD heatsinks are typically fixed at a uniform height, sandwiching the SSD between the motherboard and the heatsink. However, different SSDs have varying chip heights and thicknesses, resulting in greater interference and pressure from existing heatsinks on thicker SSDs, potentially damaging the chip. Summary of the Invention

[0004] The purpose of this disclosure is to provide a heat dissipation module to solve at least one of the above-mentioned problems.

[0005] This disclosure provides a heat dissipation module for a circuit board with a connector capable of connecting a storage element. The heat dissipation module includes: a heat-conducting element movably floating on the circuit board, having opposing first and second surfaces, a raised ring portion, a through hole, and an accommodating space, wherein the first surface faces the circuit board, the raised ring portion extends outward from the first surface and surrounds and defines the accommodating space, exposing the accommodating space to the second surface, and the through hole passes through the raised ring portion and communicates with the accommodating space; a locking fastener passing through the through hole and fixed to the circuit board, having a head, wherein the head is located in the accommodating space and spaced apart from the circuit board; and at least one elastic member connected to the first surface of the heat-conducting element and abutting against the circuit board, and constantly providing an elastic force; wherein the raised ring portion of the heat-conducting element is movable along the locking fastener to be adjacent to or away from the circuit board to compress or release the elastic member, and the elastic force continuously keeps the heat-conducting element in contact with the storage element.

[0006] As described above, the heat dissipation module includes a fixed part and two wings. The fixed part is fixed to the first surface of the heat-conducting component. The wings extend outward from opposite sides of the fixed part and abut against the circuit board. The elastic force can be provided by changing the angle between the wings and the fixed part.

[0007] As described in the aforementioned heat dissipation module, the fixing part has two protrusions, and the heat-conducting component also has at least two through holes, with the protrusions respectively passing through the through holes.

[0008] As described in the aforementioned heat dissipation module, the protrusion has a head section and a column section after being heat-melted. The head section and the column section together have a T-shaped cross section. The column section passes through the perforation, and the head section abuts against the second surface of the heat-conducting component.

[0009] As described in the aforementioned heat dissipation module, each of the wing sections has a support post, which abuts against the circuit board and corresponds to the two opposite long sides of the heat-conducting component.

[0010] As described in the aforementioned heat dissipation module, the fixing part has a stop post, and when the stop post abuts against the circuit board, the included angle between the wing and the fixing part stops increasing continuously.

[0011] As described above for the heat dissipation module, the fastener also has a stepped portion and a screw portion. The stepped portion extends outward from the head and passes through the through hole, and the screw portion extends outward from the stepped portion and is screwed onto the circuit board.

[0012] As in the aforementioned heat dissipation module, the cross-sectional area of ​​the head is greater than the cross-sectional area of ​​the through hole, and the cross-sectional area of ​​the through hole is greater than the cross-sectional area of ​​the step portion.

[0013] As described above, the heat dissipation module has a ring wall and a base plate connected to the end of the ring wall. The through hole passes through the base plate, and the thickness of the base plate is less than the height of the step, so that the base plate can move along the step and be limited by the head and the circuit board.

[0014] The aforementioned heat dissipation module also includes a first thermally conductive pad disposed on the second surface, so that the storage element disposed on the second surface of the thermally conductive member can contact the first thermally conductive pad.

[0015] The aforementioned heat dissipation module also includes a heat sink disposed on the storage element and a second thermally conductive pad disposed between the heat sink and the storage element.

[0016] As described above, the heat dissipation module has a circuit board with fixing screws. The fixing screws and the connector are respectively located near the two opposite short sides of the heat-conducting element. Multiple screws pass through the heat sink and are respectively screwed to the connector and the fixing screws so that the heat sink contacts the second thermally conductive pad.

[0017] The aforementioned heat dissipation module also includes at least one magnetic element disposed between the circuit board and the heat-conducting element, which provides a repulsive force that continuously keeps the heat-conducting element in contact with the storage element.

[0018] As described in the aforementioned heat dissipation module, the magnetic component includes a first magnetic body and a second magnetic body. The heat-conducting component also has a receiving portion formed by a recess in the first surface. The first magnetic body is disposed in the receiving portion, and the second magnetic body is attached to the circuit board and corresponds to the first magnetic body.

[0019] As described in the aforementioned heat dissipation module, the first magnetic body and the second magnetic body are respectively disposed on the heat-conducting component and the circuit board with the same magnetic poles corresponding to each other, so as to generate the mutual repulsion force.

[0020] As described in the aforementioned heat dissipation module, the first magnetic body and the second magnetic body are magnets.

[0021] In summary, the elastic element disclosed herein can effectively match and compress or release when the thickness of each component in the heat dissipation module changes or when the thickness or height of each electronic component connected to the heat dissipation module changes. It can also automatically adjust the amount of interference to the storage element, which can prevent excessive pressure from damaging the storage element and maintain heat transfer efficiency. The magnetic element can ensure the relative distance between the heat-conducting element and the circuit board by changing the magnitude of the mutual repulsion force, and ensure that the heat-conducting element can continuously contact the storage element. Attached Figure Description

[0022] Figure 1 This is an exploded view of the heat dissipation module disclosed herein.

[0023] Figure 2 This is an exploded view of the heat dissipation module disclosed herein.

[0024] Figure 3 This is an overall schematic diagram of the heat dissipation module in use.

[0025] Figure 4 for Figure 3 A schematic diagram of its breakdown.

[0026] Figure 5 for Figure 3 A schematic diagram of a cross section along section AA.

[0027] Figure 6 for Figure 3 This is a schematic diagram of a cross-section along the BB line.

[0028] Figure 7 This is a cross-sectional schematic diagram of another embodiment of the heat dissipation module disclosed herein.

[0029] Figure 8 and Figure 9 They are respectively Figure 5 and Figure 6 A cross-sectional schematic diagram of another embodiment.

[0030] Figure 10This is an exploded view of another embodiment of the heat dissipation module disclosed herein.

[0031] Figure 11 This is an exploded view of another embodiment of the heat dissipation module disclosed herein.

[0032] Figure 12 This is a cross-sectional schematic diagram of another embodiment of the heat dissipation module disclosed herein.

[0033] The attached figures are labeled as follows:

[0034] 100 heat dissipation module

[0035] 200 circuit boards

[0036] 201 Fixing Screw

[0037] 300 connector

[0038] 400 storage elements

[0039] 500 First thermal pad

[0040] 600 Second thermal pad

[0041] 700 heatsink

[0042] 800 screw fastener

[0043] 1. Thermal conductive components

[0044] 11 First page

[0045] 12 Second page

[0046] 13 convex ring part

[0047] 131 Ring Wall

[0048] 132 base plate

[0049] 14 Through holes

[0050] 15. Storage space

[0051] 16. Perforation

[0052] 17. Reception Section

[0053] 2 Locking fasteners

[0054] 21 Head

[0055] 22 Steps

[0056] 23. Threaded part

[0057] 3. Elastic components

[0058] 31 Fixing part

[0059] 311 Protruding post

[0060] 3111 First Segment

[0061] 3112 column segment

[0062] 312 Stop bar

[0063] 32 Wings

[0064] 321 Support Column

[0065] 4 Magnetic components

[0066] 41 First Magnetic Body

[0067] 42 Second magnetic body

[0068] Thicknesses H1 and H2

[0069] The included angle between θ1 and θ2. Detailed Implementation

[0070] The following describes the implementation of this disclosure through specific embodiments. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification, and can also implement or apply it through other different specific embodiments.

[0071] Please see Figure 1 and Figure 2 The heat dissipation module 100 disclosed herein can be disposed on a circuit board 200 (e.g., a motherboard), the circuit board 200 having a connector 300, and the heat dissipation module 100 including a heat-conducting element 1, a locking element 2 and two elastic elements 3.

[0072] The heat-conducting component 1 is generally a rectangular plate, and has a first surface 11 and a second surface 12 facing each other, a raised ring portion 13, a through hole 14, an accommodating space 15, and a plurality of perforations 16. The heat-conducting component 1 is disposed above the circuit board 200 with the first surface 11 facing the circuit board 200. The raised ring portion 13 extends outward from the first surface 11 (i.e., extends towards the circuit board 200) and has an annular wall 131 and a base plate 132. The annular wall 131 has a generally circular cross section and tapers away from the first surface 11. The base plate 132 is connected to the end of the annular wall 131 and together with the annular wall 131 surrounds and defines the accommodating space 15, so that the accommodating space 15 is exposed on the second surface 12. The through hole 14 is formed through the base plate 132 and connects to the accommodating space 15. The perforations 16 are located on opposite sides of the heat-conducting component 1 in pairs.

[0073] In this embodiment, the material of the heat-conducting component 1 can be a metal with thermal conductivity (such as aluminum, copper, etc.), but this disclosure is not limited thereto.

[0074] Please also refer to Figure 6 The fastener 2 passes through the through hole 14 and is fixed to the circuit board 200, and has a head 21, a stepped portion 22, and a screw portion 23. The head 21 is located in the accommodating space 15 and is spaced apart from the circuit board 200. The stepped portion 22 extends outward from the head 21 and passes through the through hole 14. The screw portion 23 extends outward from the stepped portion 22 and is screwed to the circuit board 200.

[0075] In this embodiment, the cross-sectional area of ​​the head 21 is larger than that of the through hole 14, so the head 21 cannot pass through the through hole 14 and can only be disposed in the accommodating space 15; the cross-sectional area of ​​the through hole 14 is larger than that of the step portion 22, and the thickness of the base plate 132 is less than the height of the step portion 22 extending vertically from the circuit board 200, so the base plate 132 can move along the annular side of the step portion 22 through the through hole 14 and is limited by the head 21 and the circuit board 200. In other words, the heat-conducting component 1 is movably floating on the circuit board 200 via the fastener 2.

[0076] The elastic member 3 includes a fixing part 31 and two wings 32. The fixing part 31 is generally a rectangular plate and has two protrusions 311 and a stop post 312. The two protrusions 311 are located on the side of the fixing part 31 facing the heat-conducting member 1, while the stop post 312 is located on the side of the fixing part 31 facing the circuit board 200. The protrusions 311 are respectively inserted into the through holes 16. In this embodiment, the fixing part 31 can be fixed to the first surface 11 of the heat-conducting member 1 by, for example, the protrusions 311 snapping into the through holes 16 or the protrusions 311 adhering to the through holes 16. The fixing method is not limited to the above. In one embodiment, such as Figure 7 As shown, after the protrusions 311 are respectively inserted into the perforations 16, the protrusions 311 are melted by thermal fusion, so that the protrusions 311 have a head section 3111 and a column section 3112. The cross-section of the head section 3111 is larger than the cross-section of the column section 3112, so that the head section 3111 and the column section 3112 together have a T-shaped cross-section. The column section 3112 is inserted into the perforation 16, while the head section 3111 abuts against the second surface 12 of the heat-conducting element 1, thereby fixing the fixing part 31 to the first surface 11 of the heat-conducting element 1.

[0077] Please also refer to Figure 5 The wing portions 32 are generally rectangular plates, extending outward from opposite sides of the fixing portion 31, and each having an angle θ1 with the fixing portion 31. The wing portion 32 also has a support post 321, the extension direction of which is opposite to the extension direction of the protrusion 311, and corresponds to the opposite long sides of the heat-conducting element 1 and is used to abut against the circuit board 200.

[0078] In this embodiment, the elastic element 3 can be made of elastic metal, plastic, or stainless steel, etc., and can provide an elastic force by changing the included angle θ1 between the wing 32 and the fixing part 31. For example, when the convex ring 13 moves away from the circuit board 200 along the fastener 2, the included angle θ1 between the wing 32 and the fixing part 31 becomes smaller, and the elastic element 3 is released and becomes smaller, shorter, or narrower (e.g., ...). Figure 5 As shown in the diagram, when the protruding ring 13 moves along the fastener 2 and approaches the circuit board 200, the included angle θ2 between the wing 32 and the fixing part 31 increases, and the elastic member 3 is compressed and becomes larger, longer, or wider (as shown in the diagram); Figure 8 As shown in the figure, the included angle θ2 is stopped from increasing continuously by the stop post 312 on the fixing part 31 abutting against the circuit board 200.

[0079] Please see Figure 3 and Figure 4 A first thermally conductive pad 500 with heat transfer properties may be provided on the second surface 12 of the thermally conductive component 1. The storage element 400 is connected to the connector 300 and is disposed on the second surface 12 of the thermally conductive component 1 to contact the first thermally conductive pad 500, so that the electronic components (chips) on the storage element 400 can dissipate heat through the first thermally conductive pad 500 and the thermally conductive component 1.

[0080] The storage element 400 may also be provided with a second thermally conductive pad 600 with heat transfer properties, and the heat sink 700 is provided on the storage element 400, so that the second thermally conductive pad 600 is sandwiched between the heat sink 700 and the storage element 400.

[0081] In this embodiment, the circuit board 200 has fixing screws 201 spaced apart from the connector 300. The fixing screws 201 and the connector 300 are respectively located near the two opposite short sides of the heat-conducting element 1. A plurality of locking members 800 pass through the opposite ends of the heat sink 700 and are respectively screwed to the connector 300 and the fixing screws 201, so that the heat sink 700 contacts the second thermally conductive pad 600. Therefore, the electronic components (chips) on the storage element 400 can dissipate heat through the second thermally conductive pad 600 and the heat sink 700.

[0082] Because the elastic element 3 in the heat dissipation module 100 of this disclosure is elastic, and the heat-conducting element 1 can move along the locking fastener 2, the heat dissipation module 100 of this disclosure can accommodate different thicknesses of the storage element 400. For example, as Figure 5 and Figure 6 As shown, when the storage element 400 has a small thickness H1, there is a small included angle θ1 between the wing 32 and the fixing part 31, at which time the base plate 132 is adjacent to the head 21 (that is, away from the circuit board 200); as Figure 8 and Figure 9As shown, when the storage element 400 has a large thickness H2, there is a large included angle θ2 between the wing 32 and the fixing part 31 (up to 180 degrees, that is, the wing 32 and the fixing part 31 are parallel). At this time, the base plate 132 is away from the head 21 (that is, adjacent to the circuit board 200). Regardless of whether the protruding ring 13 is adjacent to or away from the circuit board 200, the elastic force generated by the elastic member 3 can continuously keep the heat-conducting member 1 in contact with the storage element 400 to ensure heat transfer efficiency.

[0083] In another embodiment, when the connector 300 is low in height or the heat-conducting component 1 is thick, the protruding ring 13 moves along the locking fastener 2 and approaches the circuit board 200, the angle θ2 between the wing 32 and the fixing part 31 increases, and the elastic element 3 is compressed (refer to the elastic element 3 in...). Figure 8 (In the state of...), when the connector 300 is high or the heat-conducting component 1 is thin, the convex ring 13 will move along the locking fastener 2 and move away from the circuit board 200, and the included angle θ1 between the wing 32 and the fixing part 31 will become smaller. At this time, the elastic element 3 is released (refer to the elastic element 3 in...). Figure 5 (State).

[0084] Please see Figure 10 , Figure 11 and Figure 12 In another embodiment of the present disclosure, the heat dissipation module 100 may include a heat-conducting element 1, a locking element 2, an elastic element 3, and a magnetic element 4. The difference between this embodiment and the previous embodiment lies in the magnetic element 4. The following only describes the differences, and the same technical content will not be repeated here.

[0085] The heat-conducting component 1 also has a receiving portion 17. The receiving portion 17 is recessed from the first surface 11 and faces the circuit board 200, and is adjacent to the protruding ring portion 13. The magnetic component 4 is disposed between the circuit board 200 and the heat-conducting component 1, and is used to provide a repulsive force. In this embodiment, the magnetic component 4 includes a first magnetic body 41 and a second magnetic body 42. The first magnetic body 41 is matchedly disposed in the receiving portion 17, and the second magnetic body 42 is attached to the circuit board 200 and corresponds to the first magnetic body 41. The first magnetic body 41 and the second magnetic body 42 can specifically be magnets, and are respectively disposed on the heat-conducting component 1 and the circuit board 200 in a manner that corresponds to each other with the same magnetic poles (e.g., both are N poles or both are S poles). In one embodiment, the size of the first magnetic body 41 is smaller than the size of the second magnetic body 42, but this disclosure is not limited thereto.

[0086] When the storage element 400 is connected to the connector 300 and disposed on the second surface 12 of the heat-conducting element 1, the elastic element 3 is elastic, the heat-conducting element 1 can move along the locking fastener 2, and a repulsive force is generated between the first magnetic body 41 and the second magnetic body 42. When the storage element 400 has a smaller thickness, the distance between the first magnetic body 41 and the second magnetic body 42 is larger, resulting in a smaller repulsive force. When the storage element 400 has a larger thickness, the distance between the first magnetic body 41 and the second magnetic body 42 is smaller, resulting in a larger repulsive force. Regardless of whether the repulsive force is small or large, this repulsive force can continuously keep the heat-conducting element 1 in contact with the storage element 400 through the first thermally conductive pad 500 to ensure heat transfer efficiency. Similarly, if the height of the connector 300 is lower or higher, or the thickness of the heat-conducting element 1 is thicker or thinner, the repulsive force generated between the first magnetic body 41 and the second magnetic body 42 can also be changed accordingly.

[0087] The above embodiments are illustrated using a single elastic element 3 and a single magnetic element 4 as examples, but this disclosure is not limited thereto. It is also possible to use only the magnetic element 4 without the elastic element 3, increase the number of magnetic elements 4, or exchange the positions of the elastic element 3 and the magnetic element 4, etc.

[0088] In summary, the elastic element disclosed herein can effectively match and compress or release when the thickness of each component in the heat dissipation module changes or when the thickness or height of the electronic components (such as connectors) connected to the heat dissipation module changes. It can also automatically adjust the amount of interference to the storage element, which can prevent excessive pressure from damaging the storage element and maintain heat transfer efficiency. The magnetic element can ensure the relative distance between the heat-conducting element and the circuit board by changing the magnitude of the mutual repulsion force, and ensure that the heat-conducting element can continuously contact the storage element.

[0089] The above embodiments are merely illustrative of the technical principles, features, and effects of this disclosure and are not intended to limit the scope of implementation of this disclosure. Those skilled in the art can modify and alter the above embodiments without departing from the spirit and scope of this disclosure. However, any equivalent modifications and alterations made using the teachings of this disclosure should still be covered by the claims. The scope of protection of this disclosure should be as set forth in the claims.

Claims

1. A heat dissipation module for a circuit board having a connector for connecting a storage element, characterized in that, The heat dissipation module includes: A heat-conducting component is movably floating on the circuit board and has a first surface and a second surface facing each other, a raised ring portion, a through hole and an accommodating space. The first surface faces the circuit board, the raised ring portion extends outward from the first surface and surrounds and defines the accommodating space, so that the accommodating space is exposed on the second surface, and the through hole passes through the raised ring portion and connects to the accommodating space. A fastener, passing through the through hole and fixed to the circuit board, and having a head, wherein the head is located in the receiving space and spaced apart from the circuit board; and At least one elastic element is connected to the first surface of the heat-conducting element and abuts against the circuit board, and constantly provides an elastic force; The protruding ring portion of the heat-conducting component moves along the fastener to be adjacent to or away from the circuit board in order to compress or release the elastic element, and the elastic force continuously keeps the heat-conducting component in contact with the storage element.

2. The heat dissipation module as described in claim 1, characterized in that, The elastic element includes a fixed part and two wings. The fixed part is fixed to the first surface of the heat-conducting element. The wings extend outward from opposite sides of the fixed part and abut against the circuit board to change the angle between the wings and the fixed part to provide the elastic force.

3. The heat dissipation module as described in claim 2, characterized in that, The fixing part has two protrusions, and the heat-conducting element also has at least two through holes, with the protrusions respectively passing through the through holes.

4. The heat dissipation module as described in claim 3, characterized in that, The protruding post, after being heat-melted, has a head section and a column section. The head section and the column section together have a T-shaped cross section. The column section passes through the perforation, and the head section abuts against the second surface of the heat-conducting component.

5. The heat dissipation module as described in claim 2, characterized in that, Each of the wing sections has a support post, which abuts against the circuit board and corresponds to the two opposite long sides of the heat-conducting component.

6. The heat dissipation module as described in claim 2, characterized in that, The fixing part has a stop post, and when the stop post abuts against the circuit board, the included angle between the wing and the fixing part stops increasing.

7. The heat dissipation module as described in claim 1, characterized in that, The fastener also has a stepped portion and a screwing portion. The stepped portion extends outward from the head and passes through the through hole, and the screwing portion extends outward from the stepped portion and is screwed onto the circuit board.

8. The heat dissipation module as described in claim 7, characterized in that, The cross-sectional area of ​​the head is greater than the cross-sectional area of ​​the through hole, and the cross-sectional area of ​​the through hole is greater than the cross-sectional area of ​​the step.

9. The heat dissipation module as described in claim 7, characterized in that, The protruding ring portion has a ring wall and a base plate connected to the end of the ring wall. The through hole passes through the base plate, and the thickness of the base plate is less than the height of the step portion, so that the base plate can move along the step portion and be limited by the head and the circuit board.

10. The heat dissipation module as described in claim 1, characterized in that, The heat dissipation module also includes a first thermally conductive pad disposed on the second surface, so that the storage element disposed on the second surface of the heat-conducting component can contact the first thermally conductive pad.

11. The heat dissipation module as described in claim 1, characterized in that, The heat dissipation module also includes a heat sink disposed on the storage element and a second thermally conductive pad disposed between the heat sink and the storage element.

12. The heat dissipation module as described in claim 11, characterized in that, The circuit board has a fixing screw, which corresponds to the connector and is located on opposite short sides of the heat-conducting component. Multiple screws pass through the heat sink and are respectively screwed to the connector and the fixing screw, so that the heat sink contacts the second thermally conductive pad.

13. The heat dissipation module as described in claim 1, characterized in that, The heat dissipation module also includes at least one magnetic element disposed between the circuit board and the heat-conducting element, which provides a repulsive force that continuously keeps the heat-conducting element in contact with the storage element.

14. The heat dissipation module as described in claim 13, characterized in that, The magnetic component includes a first magnetic body and a second magnetic body. The heat-conducting component also has a receiving portion formed by a recess from the first surface. The first magnetic body is disposed in the receiving portion, and the second magnetic body is attached to the circuit board and corresponds to the first magnetic body.

15. The heat dissipation module as described in claim 14, characterized in that, The first magnetic body and the second magnetic body are respectively disposed on the heat-conducting component and the circuit board with the same magnetic poles corresponding to each other, so as to generate the mutual repulsion force.

16. The heat dissipation module as described in claim 14, characterized in that, The first magnetic body and the second magnetic body are magnets.

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