A redundancy backup switching liquid cooling cooling plate assembly for a computing power server

Abstract

The application provides a redundancy backup switching liquid cooling plate assembly for a computing power server, which comprises a server body and a cooling plate structure assembly arranged in the server body. The cooling plate structure assembly comprises an inflow system, three groups of heat dissipation units, an outflow system, a redundancy flow switching valve group, a state monitoring unit and a controller. Each group of heat dissipation units comprises a group of upper liquid cooling plate structures and a group of lower liquid cooling plate structures which are in communication with each other. The state monitoring unit is used for detecting the inlet and outlet liquid temperatures and the inlet and outlet liquid pressure differences of each heat dissipation unit. The controller judges whether the heat dissipation unit is abnormal according to the detection signals, and controls the redundancy flow switching valve group to smoothly switch the cooling liquid to the standby heat dissipation unit when any primary heat dissipation unit is abnormal. Through the above structure, the continuous supply of cooling liquid can be maintained when a single group of heat dissipation units is abnormal in heat exchange, blocked or interrupted, the flow mutation and hydraulic impact in the switching process are reduced, and the continuous operation reliability of the liquid cooling system of the computing power server is improved.

Description

Technical Field

[0001] This invention relates to a redundant backup switching liquid-cooled cooling plate assembly for computing servers, belonging to the field of computing server cooling technology. Background Technology

[0002] Computing servers typically integrate high-power components such as processors, accelerator cards, power modules, and storage modules, generating a significant amount of heat during operation. As server computing density and continuous workloads increase, traditional air cooling methods are increasingly failing to meet the demands of high-load computing scenarios in terms of heat dissipation efficiency, noise control, and space utilization. Therefore, using liquid cooling plates for targeted heat exchange in high-heat areas within the server has become a common technological approach in computing server cooling structures.

[0003] Existing liquid-cooled servers typically deliver coolant to the liquid cooling plate via inlet pipes and then discharge the cooled coolant through outlet pipes. While this structure improves local heat exchange efficiency, it still has certain shortcomings in actual operation. First, if some liquid cooling plates or pipes experience blockages, flow interruptions, leaks, or reduced heat exchange capacity, the coolant may not be able to switch to other effective heat exchange paths in a timely manner, easily causing a rapid rise in temperature in the corresponding heat-generating area and affecting the stability of continuous server operation. Second, although some systems are equipped with parallel backup pipes, there is a lack of a real-time judgment structure for operating conditions such as temperature and pressure difference between the backup and primary pipes. This often requires external control systems or manual maintenance intervention, resulting in insufficient timeliness in fault response. Third, conventional pipe switching often relies on simple valve opening and closing. When the primary and backup paths are directly switched, instantaneous flow changes and pressure fluctuations can easily occur, impacting pipe joints, seals, and the internal flow channels of the liquid cooling plate. Over long-term use, this may increase the risk of leakage and connection failure.

[0004] Furthermore, existing liquid cooling plate structures typically focus more on the heat exchange capacity of a single cooling plate, while neglecting the collaborative backup relationships between multiple cooling plates. For different heat dissipation areas inside a server, relying solely on a single liquid cooling plate or a single cooling path makes it difficult to maintain overall heat dissipation continuity when one cooling structure malfunctions. Operating all cooling plates at full flow simultaneously for extended periods increases the burden on coolant distribution and energy consumption, hindering the orderly switching between primary and backup cooling units.

[0005] Therefore, it is necessary to provide a liquid cooling plate assembly for computing servers that can monitor the temperature and differential pressure of multiple heat dissipation units and smoothly switch the coolant to the backup heat dissipation unit when any heat dissipation unit malfunctions, so as to improve the fault response capability and continuous heat dissipation reliability of the liquid cooling system. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the purpose of this invention is to provide a redundant backup switching liquid cooling plate assembly for computing servers.

[0007] The technical solution of this invention is implemented as follows: a redundant backup switching liquid cooling plate assembly for a computing server, the assembly including a server body, a cooling plate structure assembly disposed within the server body, a connecting panel, and a heat dissipation port, the cooling plate structure assembly including an inlet system, an upper liquid cooling plate structure, a primary swirling circulation tube, a lower liquid cooling plate structure, and an outlet system, characterized in that: Both the upper liquid cooling plate structure and the lower liquid cooling plate structure are provided in three groups. Each group of the upper liquid cooling plate structure and the corresponding group of the lower liquid cooling plate structure are connected through a primary vortex tube to form a heat dissipation unit. Each group of heat dissipation units has an independent liquid inlet interface and an independent liquid outlet interface. The cooling plate structure assembly also includes a redundant flow switching valve group, a status monitoring unit, and a controller; The redundant flow switching valve group is disposed between the inlet system, the outlet system and each heat dissipation unit. The redundant flow switching valve group includes an inlet-side switching part for selectively connecting the inlet interface of the inlet system and each heat dissipation unit, an outlet-side switching part for selectively connecting the outlet interface of each heat dissipation unit and the outlet system, and a bypass pressure stabilizing part for balancing the pressure of the inlet system and the outlet system during the switching process. The status monitoring unit includes a temperature sensor and a differential pressure sensor installed at the liquid inlet and liquid outlet of each heat dissipation unit. The temperature sensor is used to detect the liquid inlet temperature, liquid outlet temperature, or liquid inlet-outlet temperature difference of the corresponding heat dissipation unit, and the differential pressure sensor is used to detect the pressure difference between the liquid inlet and liquid outlet of the corresponding heat dissipation unit. The controller includes a PLC control unit, which is electrically connected to a temperature sensor, a differential pressure sensor, and a redundant flow switching valve group. The PLC control unit is preset with the outlet liquid temperature threshold, inlet-outlet liquid temperature difference threshold, blockage differential pressure threshold, and flow interruption differential pressure threshold of the heat dissipation unit. When the outlet temperature of any primary cooling unit is higher than the outlet temperature threshold, the inlet-outlet temperature difference is lower than the inlet-outlet temperature difference threshold, the inlet-outlet pressure difference is higher than the blockage pressure difference threshold, or the inlet-outlet pressure difference is lower than the flow interruption pressure difference threshold, the controller determines that the primary cooling unit is abnormal and controls the redundant flow switching valve group to gradually reduce the coolant flow to the abnormal cooling unit, while gradually increasing the coolant flow to the standby cooling unit, so that the coolant is smoothly switched from the abnormal cooling unit to at least one set of normally operating standby cooling units.

[0008] In a preferred embodiment, the inlet system includes an inlet pipe, a flow equalization pump, three flow dividers, and three flow dividers. The inlet pipe is sealed to an external cooling water pipe. The flow equalization pump is located downstream of the inlet pipe and is used to supply coolant to the three flow dividers. The three flow dividers are respectively connected to the inlet ports of three sets of heat dissipation units through corresponding flow dividers. The outflow system includes an outflow pipe, a main pump, three pumping connectors, and three pumping pipes. The three pumping pipes are respectively connected to the liquid outlet interfaces of the three heat dissipation units, and the three pumping connectors are respectively connected to the corresponding pumping pipes. The main pump is used to collect the coolant after heat exchange in the three heat dissipation units and discharge it through the outflow pipe. The redundant flow switching valve group is located downstream of the flow equalization pump and between the three branch pipes and the liquid inlet ports of the three sets of heat dissipation units, and between the liquid outlet ports of the three sets of heat dissipation units and the main pump. This allows the flow equalization pump to provide coolant pressure and flow, and the redundant flow switching valve group to control the distribution and switching of coolant between the main heat dissipation unit and the backup heat dissipation unit.

[0009] In a preferred embodiment, the upper liquid cooling plate structure includes an upper shell, side ventilation holes, side heat-conducting aluminum grids, support grids, inner support frame, lower shell, cooling cavity, water cooling components, and water distribution head. The upper shell is made of aluminum alloy. A set of hollow side heat-conducting aluminum grids is provided on the left and right sides of the upper shell. Several sets of triangular side ventilation holes are provided inside the side heat-conducting aluminum grids. Support grids and inner support frame are provided inside the side heat-conducting aluminum grids to prevent internal thermal expansion and contraction. A cooling cavity is provided at the lower end of the two sets of side heat-conducting aluminum grids to adjust the cooling area of ​​the cooling water by concentrating and dispersing. The cooling chamber is equipped with several sets of water cooling components for active cooling. On the left and right sides of each water cooling component are a set of water distribution heads for concentrating cooling water into the components and collecting the cooling water from within them. The cross-section of each water distribution head is a semi-elliptical structure when viewed from above. Each water distribution head has a flow channel inside. The left side of each water cooling component is connected to the flow channel inside the left water distribution head, and the right side of each water cooling component is connected to the flow channel inside the right water distribution head. The left water distribution head is connected to a distribution pipe, and the right water distribution head is connected to an extraction pipe. The left water distribution head is the inlet, and the right water distribution head is the outlet.

[0010] In a preferred embodiment, the water cooling component includes an upper outlet sleeve and an upper inlet sleeve. The upper outlet sleeve has a set of upper temperature-conducting pipes on its left side for conducting cooling water. The upper temperature-conducting pipes have an outer bonding sleeve on their outer side for conducting cooling water. The outer bonding sleeve is made of an aluminum alloy material. Each set of upper outlet sleeves has six outer bonding sleeves on its outer side. Between every two sets of outer bonding sleeves is a sealing sleeve to prevent leakage of internal cooling water. Each set of upper temperature-conducting pipes has an upper inlet sleeve on its left side for guiding cooling water.

[0011] In a preferred embodiment, the upper temperature-conducting pipe assembly has a set of support frames on the outer sides of its left and right ends for adjusting its movable position. The support frames are inclined structures. The middle position of the upper end of the support frame is connected to a set of upper water outlet sleeve movable limiters, and the middle position of the lower end is connected to a set of lower water outlet sleeve movable limiters. Each pair of support frames is connected in an X-shape. The intersection of the movable connection of the two sets of support frames is fixedly connected by a set of locking shafts. The upper and lower rows of outer bonding cylinders are respectively bonded to the lower end surface of the upper shell and the upper end surface of the lower shell. The lower water outlet sleeve has a set of lower temperature-conducting pipe assemblies on its inner side. The upper temperature-conducting pipe assembly has the same structure as the lower temperature-conducting pipe assembly.

[0012] In a preferred embodiment, the upper temperature-conducting pipe assembly includes an inlet nozzle, a first sealing gasket, a water-passing bend, a temperature-conducting spiral blade, a second sealing gasket, and an outlet nozzle. The inlet nozzle is embedded inside the upper water-inlet sleeve. A first sealing gasket is provided on the outside of the inlet nozzle to maintain a sealed fit with the inner side of the left end of the outer bonding cylinder. A water-passing bend is provided on the right side of the inlet nozzle to guide the cooling water flow. The water-passing bend is a metal corrugated pipe, and a set of temperature-conducting spiral blades is provided on the outside of the water-passing bend. The temperature-conducting spiral blades are a metal spiral structure and are in contact with the inner side of the outer bonding cylinder. A set of outlet nozzles is provided on the right side of the water-passing bend for sealing and fitting with the upper outlet sleeve. A second sealing gasket is provided on the outside of the outlet nozzle for sealing and fitting with the inner side of the right end. Both the first and second sealing gaskets are sealed and fitted with the left and right sides of the outer bonding cylinder.

[0013] In a preferred embodiment, the lower liquid cooling plate structure includes an upper thermally conductive patch, a water-cooled guide plate, a water channel, an inlet pipe, a pressure-resistant inlet elbow, an outlet pipe, a semiconductor heat sink, a lower thermally conductive patch, and a detachable inner shell. The lower end of the upper thermally conductive patch is provided with a water-cooled guide plate for cooling water circulation, and the lower end of the water-cooled guide plate is provided with a lower thermally conductive patch. The water-cooled guide plate has a water channel inside, and the detachable inner shell is embedded in the water channel. The detachable inner shell forms a U-shaped internal flow channel communicating with the water channel. The rear right side of the water-cooled guide plate is provided with an inlet pipe for introducing coolant, and the front right side of the water-cooled guide plate is provided with an outlet pipe for discharging coolant.

[0014] As a preferred embodiment, a set of pressure-resistant water inlet elbows is provided at the connection between the water inlet pipe and the water outlet pipe.

[0015] Therefore, the cooling plate assembly disclosed in this invention, by integrating the temperature sensor, differential pressure sensor, redundant flow switching valve group and PLC control unit into a fixed physical structure and electrical connection, constitutes a complete physical device capable of self-judgment and actively executing the cooling flow redistribution function. The redundant switching function of the device does not depend on an external independent general control system, but is provided by the PLC control unit, sensor, valve group and their hard connections and control program integrated in the device.

[0016] After adopting the above technical solution, the beneficial effects of the present invention are as follows: 1. The present invention sets up three heat dissipation units consisting of an upper liquid cooling plate structure and a lower liquid cooling plate structure, and makes each heat dissipation unit have an independent liquid inlet interface and an independent liquid outlet interface, so that when any heat dissipation unit has a heat exchange abnormality, the remaining heat dissipation units can still participate in cooling as backup heat dissipation units, avoiding server heat dissipation interruption caused by a single cooling path failure.

[0017] 2. By setting up redundant flow switching valve groups, status monitoring units and controllers, this invention can determine whether a heat dissipation unit is abnormal based on the temperature and pressure difference changes of each heat dissipation unit, and control the redundant flow switching valve groups to switch the coolant from the abnormal heat dissipation unit to the backup heat dissipation unit when an abnormality occurs, thereby improving the fault response capability and continuous operation reliability of the liquid cooling system.

[0018] 3. In this invention, the flow equalization pump is used to supply coolant to each heat dissipation unit, the main pump is used to collect and discharge the coolant after heat exchange, and the redundant flow switching valve group is used to control the flow path switching between the main heat dissipation unit and the standby heat dissipation unit, so that the functions of supplying, returning and switching are clearly defined, and the risk of chaotic coolant flow distribution is reduced.

[0019] 4. This invention uses a controller to control a redundant flow switching valve group to perform gradual flow adjustment, so that the coolant flow of the abnormal heat dissipation unit gradually decreases, while the coolant flow of the standby heat dissipation unit gradually increases, thereby reducing pressure surges and hydraulic shocks during the switching process and improving the reliability of pipelines, joints and seals.

[0020] 5. This invention, through the combination of the upper liquid cooling plate structure and the lower liquid cooling plate structure, enables the coolant to continuously exchange heat with the upper and lower heat dissipation areas of the server body, expands the cooling coverage, and improves the heat dissipation stability of the computing server under high load operation. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention; Figure 2 This is a left oblique top view of the upper liquid cooling plate structure and several sets of lower liquid cooling plate structures in a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention. Figure 3 This is a top view of the front structure of several sets of upper liquid cooling plates in a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention. Figure 4 This is a schematic diagram of the internal structure of the upper liquid cooling plate structure 22 in a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention. Figure 5 This is a front view schematic diagram of the multiple sets of upper and lower liquid cooling plate structures in this invention; Figure 6 This is a top view of the upper temperature-conducting pipe group in a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention. Figure 7 This is a top-explosive view of the lower liquid cooling plate structure in a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention. Figure 8 This is a top view of the pressure-resistant water inlet elbow in a redundant backup switching liquid cooling plate assembly for a computing server according to the present invention. In the diagram: 1-Server main body, 2-Cooling plate structure component, 3-Connection panel, 4-Heat dissipation vent; 21-Inlet system, 22-Upper liquid cooling plate structure, 23-First-stage swirl circulation tube, 24-Lower liquid cooling plate structure, 25-Outlet system, 26-Redundant flow switching valve group; 21a-Inlet pipe, 21b-Flow equalization pump, 21c-Flow divider connector, 21d-Flow divider pipe; 25a - Outlet pipe, 25b - Main pump, 25c - Pump connector, 25d - Pump pipe; 22a-Upper shell, 22b-Side ventilation hole, 22c-Side heat-conducting aluminum grid, 22d-Support grid, 22e-Inner support frame, 22f-Lower shell, 22g-Cooling cavity, 22h-Water cooling component, 22i-Water distribution head; h1-Upper outlet sleeve, h2-Upper temperature guide tube assembly, h3-Support frame, h4-Positioning shaft, h5-Lower outlet sleeve, h6-Lower temperature guide tube assembly, h7-Outer fitting cylinder, h8-Sealing rubber sleeve, h9-Upper inlet sleeve; h2a - Water inlet nozzle, h2b - Sealing gasket 1, h2c - Water inlet bend, h2d - Temperature-conducting spiral blade, h2e - Sealing gasket 2, h2f - Water outlet nozzle; 24a - Upper thermally conductive patch, 24b - Water-cooled baffle plate, 24c - Water channel, 24d - Inlet water pipe, 24e - Pressure-resistant inlet water elbow, 24f - Outlet water pipe, 24g - Semiconductor heat sink, 24h - Lower thermally conductive patch, 24i - Removable inner shell. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1-8 As the first embodiment of the present invention: a redundant backup switching liquid cooling plate assembly for a computing server includes a server body 1, a cooling plate structure assembly 2 disposed within the server body 1, a connecting panel 3, and a heat dissipation port 4. The cooling plate structure assembly 2 includes an inlet system 21, an upper liquid cooling plate structure 22, a primary swirl circulation pipe 23, a lower liquid cooling plate structure 24, an outlet system 25, a redundant flow switching valve group 26, a status monitoring unit, and a controller.

[0025] The upper liquid cooling plate structure 22 is located in the upper heat dissipation area of ​​the server body 1, and the lower liquid cooling plate structure 24 is located in the lower heat dissipation area of ​​the server body 1. There are three sets of both the upper and lower liquid cooling plate structures 22 and 24, with each set corresponding to one other. Each corresponding set of upper and lower liquid cooling plate structures 22 and 24 is connected by a primary swirl tube 23 to form a heat dissipation unit. Each heat dissipation unit has an independent inlet and outlet liquid interface and can independently form a coolant flow path to participate in heat exchange.

[0026] The inlet system 21 supplies coolant to each heat dissipation unit, while the outlet system 25 collects and discharges the coolant after heat exchange from each heat dissipation unit. The inlet system 21 includes an inlet pipe 21a, a flow equalization pump 21b, three flow dividers 21c, and three flow dividers 21d. The inlet pipe 21a is sealed to an external cooling water connection. The flow equalization pump 21b is located downstream of the inlet pipe 21a and provides coolant pressure and flow rate to the three flow dividers 21c. The three flow dividers 21c are connected to the inlet ports of the three heat dissipation units via their respective flow dividers 21d. The outlet system 25 includes an outlet pipe 25a, a main pump 25b, three flow dividers 25c, and three flow dividers 25d. The three flow dividers 25d are connected to the outlet ports of the three heat dissipation units. The main pump 25b collects the coolant after heat exchange from the three heat dissipation units and discharges it through the outlet pipe 25a.

[0027] A redundant flow switching valve assembly 26 is disposed between the inlet system 21, the outlet system 25, and each heat dissipation unit. Specifically, the redundant flow switching valve assembly 26 is disposed downstream of the flow equalization pump 21b and upstream of the main pump 25b. The redundant flow switching valve assembly 26 includes an inlet-side switching section, an outlet-side switching section, and a bypass pressure stabilizing section. The inlet-side switching section is used to selectively connect the inlet interface of the inlet system 21 to the inlet interface of each heat dissipation unit; the outlet-side switching section is used to selectively connect the outlet interface of each heat dissipation unit to the outlet system 25; and the bypass pressure stabilizing section is used to balance the pressure fluctuations between the inlet system 21 and the outlet system 25 during flow path switching. For the sake of simplicity in the accompanying drawings, the redundant flow switching valve assembly 26 is shown as an overall structure in the drawings. Its internal inlet-side switching section, outlet-side switching section, and bypass pressure stabilizing section can be integrated into the same valve body or formed by a combination of multiple electrically controlled valve components.

[0028] The status monitoring unit includes temperature sensors and differential pressure sensors installed at the inlet and outlet ends of each heat dissipation unit. The temperature sensors detect the inlet temperature, outlet temperature, or inlet-outlet temperature difference of the corresponding heat dissipation unit, while the differential pressure sensors detect the pressure difference between the inlet and outlet ends of the corresponding heat dissipation unit. The controller includes a PLC control unit, which is electrically connected to the temperature sensors, differential pressure sensors, and redundant flow switching valve group 26. The PLC control unit has preset threshold values ​​for the outlet temperature, inlet-outlet temperature difference, and inlet-outlet pressure differential of the heat dissipation unit.

[0029] Under normal operating conditions, the controller controls the redundant flow switching valve group 26 to prioritize the flow of coolant into the cooling unit in primary cooling mode. The cooling unit in standby cooling mode can maintain a low-flow pre-charge state or a shut-off standby state. In the low-flow pre-charge state, a small amount of coolant enters the standby cooling unit to expel gas from the piping and reduce the temperature shock during switching; in the shut-off standby state, both the inlet and outlet sides of the standby cooling unit are closed by the redundant flow switching valve group 26.

[0030] The controller determines that the main cooling unit is in an abnormal state when the outlet temperature of any main cooling unit is higher than the outlet temperature threshold, the inlet-outlet temperature difference is lower than the inlet-outlet temperature difference threshold, the inlet-outlet hydraulic pressure difference is higher than the blockage threshold, or the inlet-outlet hydraulic pressure difference is lower than the flow interruption threshold. Specifically, an outlet temperature higher than the outlet temperature threshold indicates that the coolant temperature after heat exchange in the corresponding cooling unit is too high; an inlet-outlet temperature difference lower than the inlet-outlet temperature difference threshold indicates that the heat exchange capacity of the corresponding cooling unit has decreased or the coolant has not flowed sufficiently through the heat exchange area; an inlet-outlet hydraulic pressure difference higher than the blockage threshold indicates that there may be blockage in the internal channels of the corresponding cooling unit; and an inlet-outlet hydraulic pressure difference lower than the flow interruption threshold indicates that there may be flow interruption, leakage, or valve malfunction in the corresponding cooling unit.

[0031] After the controller determines that the primary cooling unit is malfunctioning, it sends a switching command to the redundant flow switching valve group 26. The redundant flow switching valve group 26 first opens the inlet and outlet switching channels corresponding to the standby cooling unit, putting the standby cooling unit into control mode. Then, it gradually reduces the opening of the inlet and outlet switching channels corresponding to the malfunctioning cooling unit, while simultaneously gradually increasing the opening of the channel corresponding to the standby cooling unit, smoothly transferring the coolant flow from the malfunctioning cooling unit to the standby cooling unit. During the switching process, the bypass pressure stabilization section opens or adjusts its opening based on pressure changes between the inlet system 21 and the outlet system 25 to release instantaneous pressure fluctuations and reduce hydraulic shock.

[0032] The equalizing pump 21b is mainly used to provide coolant pressure and uniform coolant supply to the inlet system 21. The main pump 25b is mainly used to collect and discharge the coolant after heat exchange from each heat dissipation unit. The redundant flow switching valve group 26 is mainly used to control the switching of coolant flow paths between the primary heat dissipation unit and the standby heat dissipation unit. The equalizing pump 21b and the main pump 25b do not participate in the abnormal judgment of the heat dissipation unit. The abnormal identification of the heat dissipation unit is completed by the status monitoring unit and the controller. The flow path switching between heat dissipation units is completed by the controller controlling the redundant flow switching valve group 26.

[0033] When the coolant flows within a single heat dissipation unit, it first enters the cooling chamber 22g of the upper liquid cooling plate structure 22 for initial heat exchange, then enters the corresponding lower liquid cooling plate structure 24 through the first-stage swirl circulation pipe 23 for secondary heat exchange, and finally enters the outflow system 25 through the liquid outlet of the heat dissipation unit. Through the cooperation of the upper liquid cooling plate structure 22 and the lower liquid cooling plate structure 24, continuous heat exchange can be achieved between the upper and lower heat dissipation areas of the server body 1.

[0034] Please see Figures 4-6 As a second embodiment of the present invention: based on the description in the first embodiment, the upper liquid cooling plate structure 22 further includes an upper shell 22a, side ventilation holes 22b, side heat-conducting aluminum grids 22c, support grids 22d, inner support frame 22e, lower shell 22f, cooling cavity 22g, water cooling component 22h, and water distribution head 22i. The upper shell 22a is made of aluminum alloy. A set of hollow side heat-conducting aluminum grids 22c is provided on the left and right sides of the upper shell 22a. The side heat-conducting aluminum grids 22c are provided with several sets of triangular side ventilation holes 22b inside. The side heat-conducting aluminum grids 22c are provided with support grids 22d and inner support frame 22e inside to prevent internal thermal expansion and contraction. A set of cooling cavity 22g is provided at the lower end of the two sets of side heat-conducting aluminum grids 22c for concentrating and dispersing the cooling water cooling area. The cooling chamber 22g contains several sets of water cooling components 22h for active cooling. On the left and right sides of the water cooling components 22h, there are two sets of water distribution heads 22i for concentrating cooling water into the water cooling components 22h and collecting the cooling water inside the water cooling components 22h. The cross-section of the water distribution head 22i is a semi-elliptical structure when viewed from above. The water distribution head 22i contains a flow channel. The left side of the water cooling components 22h is connected to the flow channel inside the left water distribution head 22i, and the right side of the water cooling components 22h is connected to the flow channel inside the right water distribution head 22i. The left water distribution head 22i is connected to the diversion pipe 21d, and the right water distribution head 22i is connected to the extraction pipe 25d. The left water distribution head 22i is the water inlet, and the right water distribution head 22i is the water outlet.

[0035] The water cooling component 22h includes an upper outlet sleeve h1, an upper temperature-conducting pipe assembly h2, a support frame h3, a positioning shaft h4, a lower outlet sleeve h5, a lower temperature-conducting pipe assembly h6, an outer fitting sleeve h7, a sealing sleeve h8, and an upper inlet sleeve h9. The upper outlet sleeve h1 has an upper temperature-conducting pipe assembly h2 on its left side for inputting and conducting cooling water. An outer fitting sleeve h7 is located on the outside of the upper temperature-conducting pipe assembly h2 for conducting cooling water. The outer fitting sleeve h7 is made of an aluminum alloy material. Each upper outlet sleeve h1 has six outer fitting sleeves h7 on its outside. Between every two outer fitting sleeves h7 is a sealing sleeve h8 to prevent leakage of internal cooling water. Each upper temperature-conducting pipe assembly h2 has an upper inlet sleeve h9 on its left side for introducing cooling water.

[0036] Each of the left and right outer sides of the upper temperature-conducting pipe assembly h2 is provided with a set of support frames h3 for adjusting its movable position. The support frames h3 are inclined. The middle position of the upper inner part of the support frame h3 is connected to a set of upper water outlet sleeves h1 for movable limiting, and the middle position of the lower inner part is connected to a set of lower water outlet sleeves h5 for movable limiting. Each pair of support frames h3 is connected in an X-shaped structure. The intersection of the two sets of support frames h3 is fixedly connected by a set of locking shafts. The lower water outlet sleeve h5 is provided with a set of lower temperature-conducting pipe assemblies h6. The upper temperature-conducting pipe assembly h2 and the lower temperature-conducting pipe assembly h6 have the same structure. When using the upper liquid cooling plate structure 22, first connect the left side water distribution head 22i to the distribution pipe 21d, and simultaneously seal the right side water distribution head 22i to the extraction pipe 25d. After confirming that the side heat-conducting aluminum grid 22c, the support grid 22d, and the inner support frame 22e are installed securely, maintain support by using the support frame h3 around the positioning shaft h4, and allow the outer fitting cylinder h7 to fit the lower surface of the upper shell 22a and the upper surface of the lower shell 22f respectively, completing the heat exchange contact adaptation of the internal cooling cavity 22g. Then, the cooling medium is smoothly introduced from the flow channel of the left side water distribution head 22i, enters the upper temperature-conducting pipe group h2 through the upper water inlet sleeve h9, and then completes the full path circulation through the lower temperature-conducting pipe group h6. During the process, the sealing sleeve h8 ensures the connection of the pipeline throughout. In a sealed state, the cooling medium, after heat exchange, finally flows into the flow channel of the right-side water distribution head 22i and is discharged outward through the pumping pipe 25d. This maximizes the thermal contact area of ​​the outer bonding cylinder, significantly reducing the thermal resistance of the overall heat exchange path. The support grid 22d and the inner support frame 22e can avoid structural deformation caused by thermal expansion and contraction throughout the process. The semi-elliptical structure of the water distribution head 22i makes the cooling medium distribution and convergence process smoother and more uniform, avoiding heat exchange blind spots caused by uneven local flow. The side ventilation and heat dissipation structure can help remove edge heat accumulation, significantly improving the overall heat exchange efficiency. The full-point protection of the sealing sleeve h8 can also completely avoid the risk of leakage during operation, ensuring the long-term stable and reliable operation of the entire heat dissipation unit.

[0037] Please see Figures 6-8 As a third embodiment of the present invention: based on the description in the first and second embodiments, the upper temperature-conducting pipe assembly h2 further includes an inlet nozzle h2a, a first sealing gasket h2b, a water-passing bend h2c, a temperature-conducting spiral blade h2d, a second sealing gasket h2e, and an outlet nozzle h2f. The inlet nozzle h2a is embedded inside the upper water inlet sleeve h9. A set of first sealing gasket h2b is provided on the outside of the inlet nozzle h2a to maintain a sealed fit with the inner side of the left end of the outer fitting cylinder h7. A set of water-passing bend h2 is provided on the right side of the inlet nozzle h2a to guide the cooling water flow. c. The water bend h2c is a metal corrugated pipe, and a set of temperature-conducting spiral blades h2d are provided on the outside of the water bend h2c. The temperature-conducting spiral blades h2d are metal spiral structures. The temperature-conducting spiral blades h2d are in contact with the inner side of the outer bonding cylinder h7. A set of water outlet nozzles h2f are provided on the right side of the water bend h2c for sealing and fitting with the upper water outlet sleeve h1. A set of sealing gaskets h2e is provided on the outside of the water outlet nozzles h2f for sealing and fitting with the inner side of the right end. Both sealing gaskets h2b and h2e are sealed and fitted with the left and right sides of the outer bonding cylinder h7. When using this upper temperature-conducting tube assembly, first, smoothly insert the inlet nozzle h2a into the upper inlet sleeve h9. Adjust the position of the sealing gasket h2b to ensure it fully adheres to the inner side of the left end of the outer sleeve h7, forming the first sealing barrier. Then, push the water bend h2c axially into the outer sleeve h7, ensuring that the outer metal spiral temperature-conducting spiral blade h2d is fully in contact with the inner wall of the outer sleeve h7 throughout the entire process, avoiding local warping or detachment. Next, insert the outlet nozzle h2f into the upper outlet sleeve h1, and adjust the sealing gasket h2e to ensure it fully adheres to the inner side of the right end of the outer sleeve h7, forming the second closed-loop seal. After confirming that there are no loose gaps at all joints, the cooling circulation is connected. The cooling medium is introduced into the water bend h2c from the water inlet nozzle h2a. During the flow, it is continuously disturbed by the temperature-conducting spiral blades h2d to prevent laminar flow accumulation. Heat can be quickly conducted to the outer bonding cylinder h7 through the temperature-conducting spiral blades h2d to complete heat exchange. Finally, the medium is discharged outward from the water outlet nozzle h2f. This process is easy to assemble and does not require additional tightening procedures. The double sealing structure completely avoids the risk of leakage. The fully bonded temperature-conducting structure greatly reduces contact thermal resistance. The medium turbulence effect significantly improves heat exchange efficiency. The metal bellows can also offset the stress of cold and hot deformation, ensuring the long-term stable operation of the entire structure.

[0038] The lower liquid cooling plate structure 24 includes an upper thermally conductive patch 24a, a water-cooled guide plate 24b, a water channel 24c, an inlet water pipe 24d, a pressure-resistant inlet water elbow 24e, an outlet water pipe 24f, a semiconductor heat sink 24g, a lower thermally conductive patch 24h, and a detachable inner shell 24i. The lower end of the upper thermally conductive patch 24a is provided with a set of water-cooled guide plates 24b for circulating cooling water. The lower end of the water-cooled guide plate 24b is provided with a set of lower thermally conductive patches 24h. The water-cooled guide plate 24b is provided with a water channel 24c inside. The detachable inner shell 24i is embedded in the water channel 24c. The interior of the detachable inner shell 24i forms a U-shaped internal flow channel that communicates with the water channel 24c.

[0039] A set of water inlet pipes 24d are provided on the rear right side of the water-cooled guide plate 24b to guide the coolant inside the upper liquid-cooled plate structure 22. A set of semiconductor heat sinks 24g are provided in the middle of the water-cooled guide plate 24b. When using the lower liquid cooling plate structure 24, first, smoothly insert the detachable inner shell 24i, which matches the contour of the water channel 24c, into the water cooling guide plate 24b. Confirm that the detachable inner shell 24i is completely fitted to the inner wall of the water channel 24c without misalignment or looseness. Then, smoothly attach the upper thermal conductive patch 24a to the upper end face of the water cooling guide plate 24b. Next, align and install the semiconductor heat sink 24g and the lower thermal conductive patch 24h to the lower end face of the water cooling guide plate 24b, completing the fitting assembly of the upper and lower thermal conductive surfaces. Afterward, connect the inlet pipe 24d and the outlet pipe 24f to the water cooling guide plate 24b respectively. For port b, install a pressure-resistant inlet elbow 24e at the pipe connection point to complete the sealed connection. After confirming that there are no leaks at all connection points, start the cooling cycle. The cooling medium is introduced from the inlet outer pipe 24d and flows continuously through the removable inner shell 24i inside the water channel 24c. During the process, the upper heat-conducting patch 24a and the lower heat-conducting patch 24h simultaneously conduct heat to the water-cooled guide plate 24b, which, together with the semiconductor heat sink 24g, completes efficient heat exchange. Finally, the medium that has completed heat exchange is discharged outward from the outlet outer pipe 24f. During subsequent maintenance, the removable inner shell 24i can be directly removed to clean the scale.

[0040] The water-cooled guide plate 24b has a set of outlet pipes 24f on the front right side for exporting the coolant inside the upper liquid-cooled plate structure 22. The inlet pipes 24d and outlet pipes 24f are connected by a set of pressure-resistant inlet elbows 24e. The water channel 24c inside the water-cooled guide plate 24b is U-shaped. The cooling water flows through the removable inner shell 24i inside the water channel 24c in a U-shaped circulation path. When scale is generated, the staff can disassemble and assemble the removable inner shell 24i to clean the inside, reducing the cost of use. The pressure-resistant inlet elbow 24e includes an inner sealing tube e1, a limiting sleeve e2, and an anti-torsion corrugated sleeve e3. The inner sealing tube e1 is sealed and embedded inside the limiting sleeve e2. Several sets of anti-torsion corrugated sleeves e3 are distributed on the outside of the limiting sleeve e2 to improve the torsional strength. The anti-torsion corrugated sleeve e3 is a multi-triangular splicing structure and can be twisted. When using this pressure-resistant water inlet elbow 24e, first smoothly push the inner sealing hose e1 into the inner cavity of the limiting sleeve e2, ensuring that the inner sealing hose e1 completely fits the inner wall of the limiting sleeve e2 without any wrinkles, misalignments, or local bulges. Then, align the assembled pressure-resistant water inlet elbow 24e with the pipe port to be connected, and slowly rotate and push it to fully embed the pipe port into the internal channel of the inner sealing hose e1. During this process, the elbow's mating angle can be slightly adjusted using the movable characteristic of the anti-torsion corrugated sleeve e3 to accommodate alignment deviations during pipe installation, confirming the pipe... After the end is fully engaged, check the fit of all joints to ensure that the inner sealing tube e1 completely seals all gaps in the pipe connection. The triangular splicing structure of the anti-torsion corrugated sleeve e3 is evenly distributed on the outside of the limiting sleeve e2. After all installation and verification are completed, it can be put into use. This process can flexibly adapt to the angle deviation during pipe installation and achieve reliable sealing without additional complicated fastening procedures. During operation, the anti-torsion corrugated sleeve e3 can offset the torsional stress caused by pipe deformation, avoid cracking and leakage at the connection, and greatly improve the structural strength of the elbow.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A redundant standby switching liquid-cooled cooling plate assembly for a computing server, the assembly comprising a server body (1), a cooling plate structure assembly (2) disposed within the server body (1), a connecting panel (3), and a heat dissipation port (4), wherein the cooling plate structure assembly (2) comprises an inlet system (21), an upper liquid-cooled plate structure (22), a primary swirl circulation tube (23), a lower liquid-cooled plate structure (24), and an outlet system (25), characterized in that: The upper liquid cooling plate structure (22) and the lower liquid cooling plate structure (24) are each provided with three sets. Each set of the upper liquid cooling plate structure (22) and the corresponding set of the lower liquid cooling plate structure (24) are connected through a first-stage swirling flow tube (23) to form a heat dissipation unit. Each set of the heat dissipation unit has an independent liquid inlet interface and an independent liquid outlet interface. The cooling plate structure assembly (2) also includes a redundant flow switching valve group (26), a status monitoring unit, and a controller; The redundant flow switching valve group (26) is disposed between the inlet system (21), the outlet system (25) and each heat dissipation unit. The redundant flow switching valve group (26) includes an inlet-side switching part for selectively connecting the inlet system (21) and the inlet interface of each heat dissipation unit, an outlet-side switching part for selectively connecting the outlet interface of each heat dissipation unit and the outlet system (25), and a bypass pressure stabilizing part for balancing the pressure of the inlet system (21) and the outlet system (25) during the switching process. The status monitoring unit includes a temperature sensor and a differential pressure sensor installed at the liquid inlet and liquid outlet of each heat dissipation unit. The temperature sensor is used to detect the liquid inlet temperature, liquid outlet temperature, or liquid inlet-outlet temperature difference of the corresponding heat dissipation unit, and the differential pressure sensor is used to detect the pressure difference between the liquid inlet and liquid outlet of the corresponding heat dissipation unit. The controller includes a PLC control unit, which is electrically connected to a temperature sensor, a differential pressure sensor and a redundant flow switching valve group (26) respectively. The PLC control unit is preset with the outlet liquid temperature threshold, inlet and outlet liquid temperature difference threshold, blockage differential pressure threshold and flow interruption differential pressure threshold of the heat dissipation unit. When the outlet temperature of any primary heat dissipation unit is higher than the outlet temperature threshold, the inlet-outlet temperature difference is lower than the inlet-outlet temperature difference threshold, the inlet-outlet pressure difference is higher than the blockage pressure difference threshold, or the inlet-outlet pressure difference is lower than the flow interruption pressure difference threshold, the controller determines that the primary heat dissipation unit is abnormal and controls the redundant flow switching valve group (26) to gradually reduce the flow rate of coolant to the abnormal heat dissipation unit, while gradually increasing the flow rate of coolant to the standby heat dissipation unit, so that the coolant is smoothly switched from the abnormal heat dissipation unit to at least one set of normally functioning standby heat dissipation units.

2. The redundant backup switching liquid-cooled cooling plate assembly for a computing server according to claim 1, characterized in that: The inlet system (21) includes an inlet pipe (21a), a flow equalization pump (21b), three flow dividers (21c), and three flow dividers (21d). The inlet pipe (21a) is sealed to an external cooling water pipe. The flow equalization pump (21b) is located downstream of the inlet pipe (21a) and is used to supply coolant to the three flow dividers (21c). The three flow dividers (21c) are respectively connected to the inlet interfaces of the three heat dissipation units through the corresponding flow dividers (21d). The outflow system (25) includes an outflow pipe (25a), a main pump (25b), three pumping connectors (25c), and three pumping pipes (25d). The three pumping pipes (25d) are respectively connected to the liquid outlet interfaces of the three heat dissipation units, and the three pumping connectors (25c) are respectively connected to the corresponding pumping pipes (25d). The main pump (25b) is used to collect the coolant after heat exchange in the three heat dissipation units and discharge it through the outflow pipe (25a). The redundant flow switching valve group (26) is located downstream of the equalizing pump (21b) and between the three branch pipes (21d) and the liquid inlet of the three heat dissipation units, and between the liquid outlet of the three heat dissipation units and the main pump (25b), so that the equalizing pump (21b) is used to provide coolant pressure and flow, and the redundant flow switching valve group (26) is used to control the distribution and switching of coolant between the main heat dissipation unit and the standby heat dissipation unit.

3. The redundant backup switching liquid cooling plate assembly for a computing server according to claim 1, characterized in that: The upper liquid cooling plate structure (22) includes an upper plate shell (22a) and a water distribution head (22i). The upper plate shell (22a) is made of aluminum alloy. A set of hollow side heat-conducting aluminum grids (22c) are provided on the left and right sides of the upper plate shell (22a). The side heat-conducting aluminum grids (22c) are provided with several sets of triangular side ventilation holes (22b). The side heat-conducting aluminum grids (22c) are provided with support grids (22d) and inner support frames (22e) to prevent internal thermal expansion and contraction. A set of cooling chambers (22g) is provided at the lower end of the two sets of side heat-conducting aluminum grids (22c) to adjust the cooling area of ​​the cooling water in a concentrated and dispersed manner. The cooling chamber (22g) is equipped with several sets of water cooling components (22h) for active cooling. On the left and right sides of each water cooling component (22h) are a set of water distribution heads (22i) for concentrating cooling water into the several sets of water cooling components (22h) and collecting the cooling water inside the several sets of water cooling components (22h). The water distribution head (22i) has a semi-elliptical cross-section when viewed from above. The water distribution head (22i) has a flow channel inside, and several sets of... The left side of the water cooling component (22h) is connected to the internal flow channel of the left branch water head (22i), and the right side of several sets of the water cooling components (22h) is connected to the internal flow channel of the right branch water head (22i). The left branch water head (22i) is connected to the branch pipe (21d), and the right branch water head (22i) is connected to the pumping pipe (25d). The left branch water head (22i) is the water inlet, and the right branch water head (22i) is the water outlet.

4. A redundant backup switching liquid-cooled cooling plate assembly for a computing server according to claim 3, characterized in that: The water cooling component (22h) includes an upper outlet sleeve (h1) and an upper inlet sleeve (h9). The upper outlet sleeve (h1) has a set of upper temperature-conducting pipes (h2) on its left side for conducting cooling water. The upper temperature-conducting pipes (h2) has a set of outer fitting sleeves (h7) on its outer side for conducting cooling water. The outer fitting sleeves (h7) are made of aluminum alloy. Each set of upper outlet sleeves (h1) has six sets of outer fitting sleeves (h7) on its outer side. Between every two sets of outer fitting sleeves (h7) is a set of sealing sleeves (h8) for preventing leakage of internal cooling water. Each set of upper temperature-conducting pipes (h2) has an upper inlet sleeve (h9) on its left side for guiding cooling water.

5. A redundant backup switching liquid-cooled cooling plate assembly for a computing server according to claim 4, characterized in that: The upper temperature-conducting pipe assembly (h2) has a set of support frames (h3) on the outer sides of its left and right ends for adjusting its movable position. The support frames (h3) are inclined. The middle position of the upper end of the support frame (h3) is connected to a set of upper water outlet sleeves (h1) for movable limiting and fitting. The middle position of the lower end of the support frame (h3) is connected to a set of lower water outlet sleeves (h5) for movable limiting and fitting. Each pair of support frames (h3) is connected in an X-shaped structure. The intersection of the movable connection of the two sets of support frames (h3) is fixedly connected by a set of locking shafts. The upper and lower rows of outer bonding cylinders (h7) are respectively bonded to the lower surface of the upper shell (22a) and the upper surface of the lower shell (22f). The lower water outlet sleeve (h5) has a set of lower temperature-conducting pipe assemblies (h6) inside. The upper temperature-conducting pipe assembly (h2) and the lower temperature-conducting pipe assembly (h6) have the same structure.

6. A redundant backup switching liquid-cooled cooling plate assembly for a computing server according to claim 5, characterized in that: The upper temperature-conducting pipe assembly (h2) includes an inlet nozzle (h2a) and an outlet nozzle (h2f). The inlet nozzle (h2a) is embedded inside the upper water inlet sleeve (h9). A set of sealing gaskets (h2b) is provided on the outside of the inlet nozzle (h2a) to maintain a tight seal with the inner left side of the outer fitting sleeve (h7). A set of water-passing bends (h2c) for guiding cooling water flow is provided on the right side of the inlet nozzle (h2a). The water-passing bend (h2c) is a metal corrugated pipe, and a set of... The temperature-conducting spiral blade (h2d) is a metal spiral structure. The temperature-conducting spiral blade (h2d) is in contact with the inner side of the outer bonding cylinder (h7). The right side of the water bend (h2c) is provided with a set of water outlet nozzles (h2f) for sealing and fitting with the upper water outlet sleeve (h1). The outer side of the water outlet nozzle (h2f) is provided with a set of sealing gaskets (h2e) for sealing and fitting with the inner side of the right end. Both sealing gaskets (h2b) and sealing gaskets (h2e) are sealed and fitted with the left and right sides of the outer bonding cylinder (h7).

7. A redundant backup switching liquid-cooled cooling plate assembly for a computing server according to claim 2, characterized in that: The lower liquid cooling plate structure (24) includes an upper thermally conductive patch (24a) and a detachable inner shell (24i). The lower end of the upper thermally conductive patch (24a) is provided with a set of water-cooled guide plates (24b) for circulating cooling water. The lower end of the water-cooled guide plate (24b) is provided with a set of lower thermally conductive patches (24h). The water-cooled guide plate (24b) is provided with a water channel (24c). The detachable inner shell (24i) is embedded in the water channel (24c). The detachable inner shell (24i) forms a U-shaped internal flow channel that communicates with the water channel (24c). The rear right side of the water-cooled guide plate (24b) is provided with a set of water inlet pipes (24d) for guiding the coolant inside the upper liquid cooling plate structure (22). The middle position of the water-cooled guide plate (24b) is provided with a set of semiconductor heat sinks (24g).

8. A redundant backup switching liquid cooling plate assembly for a computing server according to claim 7, characterized in that: The water-cooled guide plate (24b) has a set of outlet pipes (24f) on the front right side for exporting the coolant inside the upper liquid-cooled plate structure (22). A set of pressure-resistant inlet elbows (24e) is provided at the connection between the inlet pipe (24d) and the outlet pipe (24f). The water channel (24c) inside the water-cooled guide plate (24b) is U-shaped. The cooling water completes a U-shaped circulation path within the removable inner shell (24i) inside the water channel (24c). When scale is generated, the working... Personnel can disassemble and assemble the removable inner shell (24i) to clean its interior, reducing the cost of use. The pressure-resistant water inlet elbow (24e) includes an inner sealing tube (e1), a limiting sleeve (e2), and an anti-torsion corrugated sleeve (e3). The inner sealing tube (e1) is sealed and embedded inside the limiting sleeve (e2). Several sets of anti-torsion corrugated sleeves (e3) are distributed on the outside of the limiting sleeve (e2) to provide improved torsional strength. The anti-torsion corrugated sleeve (e3) has multiple triangular splicing structures and can be twisted.

9. A redundant backup switching liquid-cooled cooling plate assembly for a computing server according to claim 1, characterized in that: At least one of the three heat dissipation units is in the primary heat dissipation state and at least one is in the standby heat dissipation state. The heat dissipation unit in the standby heat dissipation state is kept in a low flow pre-charge state or a cut-off standby state through the redundant flow switching valve group (26). When any primary heat dissipation unit is abnormal, the controller controls the redundant flow switching valve group (26) to switch the standby heat dissipation unit from the low flow pre-charge state or the cut-off standby state to the primary heat dissipation state.

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