Display module architecture

Abstract

The present application provides a display module architecture, which includes a flexible circuit board, a first wafer and a second wafer. The flexible circuit board includes a first portion and a second portion. The first wafer is disposed on the first portion of the flexible circuit board, and the second wafer is disposed on the second portion of the flexible circuit board.

Description

Technical Field

[0001] This invention relates to an architecture for a display module, and more particularly to an architecture for a display module for a wearable device. Background Technology

[0002] As wearable devices evolve towards narrower bezels, internal structural design plays a crucial role, with the use of flexible printed circuits (FPCs) becoming an important consideration in balancing design and cost. Traditional wearable device display modules consist of two parts: a chip-on-film (COF) package and a flexible circuit board for the display driver chip, and a flexible circuit board for the touch chip. The capacitors used by the display driver IC (DDIC) are attached to the flexible circuit board. Using the DDIC's flexible circuit board as a carrier, signals from the touch chip (Touch IC) are transmitted to the DDIC's flexible circuit board via connectors, and then merged with the display driver chip's signals before connecting to the main board via a board-to-board (BTB) connector.

[0003] In traditional wearable device designs, flexible circuit boards often occupy a large area. While this design offers some flexibility in module connections, it also brings several drawbacks. First, large flexible circuit boards compress internal usable space, limiting battery capacity and the placement of other critical components, thus impacting battery life and functional expansion. Second, excessive and large flexible circuit board layouts tend to increase structural stacking thickness, hindering the design of thinner and lighter devices and narrower bezels. Furthermore, longer traces can lead to decreased signal transmission efficiency and increased interference risk. From a manufacturing perspective, large flexible circuit boards not only increase material costs but also increase assembly difficulty and defect rates.

[0004] Based on the above, the present invention provides an architecture for a display module that solves the various technical problems mentioned above. Summary of the Invention

[0005] One objective of this invention is to provide a display module architecture comprising a flexible circuit board, a first chip, and a second chip. The flexible circuit board includes a first portion and a second portion. The first chip is disposed on the first portion of the flexible circuit board, and the second chip is disposed on the second portion of the flexible circuit board. By significantly reducing the area and number of flexible circuit boards and removing the flexible circuit board for the display driver chip, compared to traditional display module architectures, the number of flexible circuit board bonding operations in the process can be reduced, effectively freeing up component space within the module. This allows the display panel to be closer to the outer frame edge, facilitating the design of narrow bezels.

[0006] One objective of this invention is to provide a display module architecture comprising a flexible circuit board, a first chip, and a second chip. The flexible circuit board includes a first portion and a second portion. The first chip is disposed on the first portion of the flexible circuit board, and the second chip is disposed on the second portion of the flexible circuit board. Reducing the area and number of flexible circuit boards allows for more streamlined wiring and shorter signal paths, helping to reduce signal attenuation and interference risks, and further improving the stability and response speed of the display panel. Simultaneously, reducing the area of ​​the flexible circuit board also lowers material costs and reduces alignment difficulties in bonding and assembly steps, improving manufacturing yield and production efficiency. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the architecture of a display module according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the display module architecture according to another embodiment of the present invention; Figure 3 This is a schematic diagram of the display module architecture according to another embodiment of the present invention; Figure 4 This is a schematic diagram of the display module architecture according to another embodiment of the present invention.

[0008] Explanation of symbols in the attached drawings: 100, 200, 300, 400: Display modules; 110, 210, 310, 410: Display panels; 120, 320: Part One; 220, 420: First flexible circuit board; 130, 330: Part Two; 230, 430: Second flexible circuit board; 122, 222, 322, 422: Reinforcing plates; 132, 134, 232, 332, 334, 432: Connectors; 140, 240, 340, 440: First chip; 150, 250, 350, 450: Second chip. Detailed Implementation

[0009] To provide a better understanding of the features and effects of this invention, the following examples and descriptions are provided: Certain terms are used in the specification and claims to refer to specific elements. However, those skilled in the art will understand that manufacturers may use different names to refer to the same element. Furthermore, the specification and claims do not distinguish elements by differences in name, but rather by differences in the overall technical aspects of the elements. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." Moreover, the term "coupled" here includes any direct and indirect means of connection. Therefore, if a first device is described as coupled to a second device, it means that the first device can be directly connected to the second device, or can be indirectly connected to the second device through other devices or other means of connection.

[0010] Please see Figure 1 This is a schematic diagram of the architecture of a display module according to an embodiment of the present invention. The display module 100 includes a display panel 110, a first portion 120 of a flexible circuit board, a second portion 130 of a flexible circuit board, a first chip 140, and a second chip 150. The first portion 120 of the flexible circuit board includes a reinforcing plate 122, and the second portion 130 of the flexible circuit board includes connectors 132 and 134. The first chip 140 is disposed on the first portion 120 of the flexible circuit board, and the second chip 150 is disposed on the second portion 130 of the flexible circuit board. Figure 1 The diagram shows the first part 120 of the flexible circuit board, the second part 130 of the flexible circuit board, the first chip 140 and the second chip 150 folded back to the display panel 110, which is a circular display panel.

[0011] In this embodiment, the first chip 140 is, for example, a display driver chip, and the second chip 150 is, for example, a touch chip. The flexible circuit board includes a first part 120 and a second part 130. The first part 120 includes a reinforcing plate 122. The first part 120 and the second part 130 of the flexible circuit board are coupled to each other through the reinforcing plate 122. The signals of the first chip 140 and the second chip 150 are transmitted to the motherboard through the flexible circuit board.

[0012] In this embodiment, the reinforcing plate 122 can enhance the structural strength. The flexible circuit board can be more robustly coupled to other components through the reinforcing plate 122. For example, the flexible circuit boards are coupled to each other through the reinforcing plate 122, thereby increasing the overall structural strength of the display module.

[0013] In this embodiment, the first part 120 of the flexible circuit board is a flip-chip thin film package. Compared with a general flexible circuit board, the flip-chip thin film package has a smaller volume and higher line density, and can achieve finer line spacing. In this embodiment, the general flexible circuit board is removed from the flexible circuit board structure used for the display driver chip and a flip-chip thin film package is used to achieve a smaller structural area and maintain a high line density.

[0014] In this embodiment, the second part 130 includes connectors 132 and 134. The second part 130 of the flexible circuit board is coupled to the first part 120 through connector 132. The signals of the first chip 140 and the second chip 150 are transmitted to the motherboard through connector 134 of the flexible circuit board.

[0015] In this embodiment, the display module 100 also includes a capacitor (not shown), which is disposed on the second part 130 of the flexible circuit board or on the main board. Compared with the conventional architecture where the capacitor is disposed on the large area of ​​the flexible circuit board of the display driver chip, it can reduce the space occupied by the capacitor and increase the thinness, and reduce the number of components on the flexible circuit board, which is beneficial for narrow bezel design.

[0016] In this embodiment, by significantly reducing the area and number of flexible circuit boards and removing the large-area flexible circuit board of the display driver chip, compared to traditional display module architectures, the number of flexible circuit board bonding operations in the process can be reduced, effectively freeing up component space within the module. This allows the display panel to be closer to the outer frame edge, facilitating a narrow bezel design. Furthermore, the streamlined wiring and shorter signal paths help reduce signal attenuation and interference risks, further improving the stability and response speed of the display panel.

[0017] In one embodiment, the second portion 130 includes an anisotropic conductive film (ACF) or solder paste, and the second portion 130 of the flexible circuit board is coupled to the first portion 120 through the anisotropic conductive film or solder paste.

[0018] In one embodiment, the first portion and the second portion of the flexible circuit board are not coupled to each other. The flexible circuit board includes a first flexible circuit board and a second flexible circuit board. The first portion of the flexible circuit board can be regarded as the first flexible circuit board, and the second portion can be regarded as the second flexible circuit board.

[0019] Please see Figure 2This is a schematic diagram of the architecture of a display module according to another embodiment of the present invention. The display module 200 includes a display panel 210, a first flexible circuit board 220, a second flexible circuit board 230, a first chip 240, and a second chip 250. The first flexible circuit board 220 includes a reinforcing plate 222, and the second flexible circuit board 230 includes a connector 232. The first chip 240 is disposed on the first flexible circuit board 220, and the second chip 250 is disposed on the second flexible circuit board 230. Figure 2 The diagram shows the first flexible circuit board 220, the second flexible circuit board 230, the first chip 240, and the second chip 250 folded back onto the display panel 210, which is a circular display panel.

[0020] In this embodiment, the first flexible circuit board 220 is coupled to the motherboard via a reinforcing plate 222.

[0021] In one embodiment, the first flexible circuit board 220 and the second flexible circuit board 230 include connectors, anisotropic conductive films or solder paste, and the first flexible circuit board 220 and the second flexible circuit board 230 are coupled to the motherboard through connectors, anisotropic conductive films or solder paste.

[0022] Figure 2 Compared to the embodiments Figure 1 In this embodiment, the structure is more streamlined. The first flexible circuit board 220 and the second flexible circuit board 230 are folded back and coupled to the motherboard, further reducing material costs and providing more streamlined wiring and shorter signal paths.

[0023] Please see Figure 3 This is a schematic diagram of the architecture of a display module according to another embodiment of the present invention. The display module 300 includes a display panel 310, a first portion 320 of a flexible circuit board, a second portion 330 of a flexible circuit board, a first chip 340, and a second chip 350. The first portion 320 of the flexible circuit board includes a reinforcing plate 322, and the second portion 330 of the flexible circuit board includes connectors 332 and 334. The first chip 340 is disposed on the first portion 320 of the flexible circuit board, and the second chip 350 is disposed on the second portion 330 of the flexible circuit board. Figure 3 The first part 320 of the flexible circuit board, the second part 330 of the flexible circuit board, the first chip 340 and the second chip 350 are shown before they are folded back to the display panel 110, and the display panel 310 is a rectangular display panel.

[0024] In this embodiment, the first chip 340 is, for example, a display driver chip, and the second chip 350 is, for example, a touch chip. The flexible circuit board includes a first portion 320 and a second portion 330. The first portion 320 includes a reinforcing plate 322. The first portion 320 and the second portion 330 of the flexible circuit board are coupled to each other through the reinforcing plate 322. Signals from the first chip 340 and the second chip 350 are transmitted to the motherboard through the flexible circuit board. Other components are connected to the motherboard. Figure 1 The similarities between the embodiments will not be repeated here.

[0025] Please see Figure 4 This is a schematic diagram of the architecture of a display module according to another embodiment of the present invention. The display module 400 includes a display panel 410, a first flexible circuit board 420, a second flexible circuit board 430, a first chip 440, and a second chip 450. The first flexible circuit board 420 includes a reinforcing plate 422, and the second flexible circuit board 430 includes a connector 432. The first chip 440 is disposed on the first flexible circuit board 420, and the second chip 450 is disposed on the second flexible circuit board 430. Figure 4 The first flexible circuit board 420, the second flexible circuit board 430, the first chip 440 and the second chip 450 are shown before they are folded back to the display panel 410, which is a rectangular display panel.

[0026] Figure 4 Compared to the embodiments Figure 3 In this embodiment, the structure is more streamlined. The first flexible circuit board 420 and the second flexible circuit board 430 are folded back and coupled to the motherboard, further reducing material costs and providing more streamlined wiring and shorter signal paths.

[0027] The display module architecture of this invention significantly reduces the area and number of flexible circuit boards and removes the flexible circuit board for the display driver chip. Compared to traditional display module architectures, this reduces the number of flexible circuit board bonding steps in the process, effectively freeing up component space within the module. This allows the display panel to be closer to the outer frame edge, facilitating narrow bezel designs. Secondly, reducing the area and number of flexible circuit boards allows for more streamlined wiring and shorter signal paths, helping to reduce signal attenuation and interference risks, further improving the stability and response speed of the display panel. Simultaneously, the reduced area of ​​the flexible circuit boards also lowers material costs and reduces alignment difficulties in bonding and assembly steps, improving manufacturing yield and production efficiency.

[0028] The embodiments described above are merely some embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, all equivalent changes and modifications made in accordance with the structure, features and spirit described in the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A display module architecture, characterized in that, Include: A flexible circuit board, comprising a first part and a second part; A first chip is disposed on the first portion of the flexible circuit board; and A second chip is disposed on the second portion of the flexible circuit board.

2. The display module architecture as described in claim 1, characterized in that, The first portion of the flexible circuit board includes a reinforcing plate, and the first portion and the second portion of the flexible circuit board are coupled to each other through the reinforcing plate.

3. The display module architecture as described in claim 1, characterized in that, The signals from the first chip and the second chip are transmitted to a motherboard through the flexible circuit board.

4. The display module architecture as described in claim 1, characterized in that, The second portion of the flexible circuit board includes a connector, an anisotropic conductive film, or a solder paste, and the second portion of the flexible circuit board is coupled to the first portion through the connector, the anisotropic conductive film, or the solder paste.

5. The display module architecture as described in claim 1, characterized in that, The first portion of the flexible circuit board includes a reinforcing plate, and the first portion of the flexible circuit board is coupled to a motherboard through the reinforcing plate.

6. The display module architecture as described in claim 1, characterized in that, The first and second portions of the flexible circuit board include a connector, an anisotropic conductive film, or a solder paste, and the first and second portions of the flexible circuit board are coupled to a motherboard through the connector, the anisotropic conductive film, or the solder paste.

7. The display module architecture as described in claim 1, characterized in that, The first and second portions of the flexible circuit board are not coupled to each other.

8. The display module architecture as described in claim 1, characterized in that, The first part of the flexible circuit board is a flip-chip thin-film package.

9. The display module architecture as described in claim 1, characterized in that, The first chip is a display driver chip.

10. The display module architecture as described in claim 1, characterized in that, The second chip is a touch chip.

11. The display module architecture as described in claim 1, characterized in that, It also includes a capacitor disposed on the second portion of the flexible circuit board or a main board.

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