Display module, manufacturing method and electronic device

Abstract

The application discloses a display module, a manufacturing method and an electronic device, and belongs to the technical field of electronic devices. The display module comprises a substrate, a pixel definition layer, a thin film packaging layer, an inorganic layer, a light transmission layer, a first flat layer, a touch layer, a first black matrix layer, a second flat layer and a cover plate. The pixel definition layer is arranged on one surface of the substrate. In the direction from the substrate to the pixel definition layer, the thin film packaging layer, the inorganic layer, the light transmission layer, the first flat layer, the first black matrix layer, the second flat layer and the cover plate are sequentially and layerwisely distributed, the touch layer is arranged between the first flat layer and the first black matrix layer, and the thin film packaging layer is arranged on the surface of the pixel definition layer away from the substrate.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a display module, manufacturing method, and electronic equipment. Background Technology

[0002] Electronic devices typically include a display module that displays images, videos, etc., and allows users to control the device via touch. For example, users can click or swipe on the display module. In related technologies, the display module includes a touch layer. The touch layer senses the user's touch input, enabling the electronic device to perform corresponding actions. In some privacy-protecting display modules, openings are formed in the black matrix layer to accommodate the relative pixel positions, and a cover plate is bonded to a planarization layer using optical adhesive. However, in these technologies, the openings in the black matrix layer are relatively small, and the planarization layer is quite thick, resulting in a large distance between the touch layer and the display module surface. This leads to decreased touch sensitivity and unresponsive touch operation. Summary of the Invention

[0003] This application aims to provide a display module, manufacturing method, and electronic device, at least to solve the problem that the large distance between the touch layer and the surface of the display module leads to a decrease in the touch sensitivity of the display module and an easy occurrence of unresponsive touch.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application propose a display module, the display module comprising: a substrate, a pixel definition layer, a thin film encapsulation layer, an inorganic layer, a light-transmitting layer, a first planarization layer, a touch layer, a first black matrix layer, a second planarization layer, and a cover plate; The pixel definition layer is disposed on one surface of the substrate; Along the direction from the substrate to the pixel definition layer, the thin film encapsulation layer, the inorganic layer, the light-transmitting layer, the first planarization layer, the first black matrix layer, the second planarization layer, and the cover plate are stacked in sequence. The touch layer is disposed between the first planarization layer and the first black matrix layer, and the thin film encapsulation layer is disposed on the surface of the pixel definition layer opposite to the substrate.

[0005] Secondly, embodiments of this application provide a manufacturing method for manufacturing the display module described in the first aspect above, the manufacturing method comprising: Provide substrate; A pixel definition layer is formed on one surface of the substrate; A thin film encapsulation layer is formed on the surface of the pixel definition layer opposite to the substrate; An inorganic layer is formed on the surface of the thin film encapsulation layer opposite to the pixel definition layer; A light-transmitting layer is formed on the surface of the inorganic layer opposite to the thin-film encapsulation layer; The first planarization layer is formed on the surface of the light-transmitting layer opposite to the inorganic layer; The touch layer is formed on the surface of the first planar layer opposite to the light-transmitting layer; The first black matrix layer is formed on the surface of the touch layer that is opposite to the first planar layer; A second flat layer is formed on the surface of the first black matrix layer that is opposite to the touch layer, and a cover plate is disposed on the surface of the second flat layer that is opposite to the first black matrix layer to obtain the display module.

[0006] Thirdly, embodiments of this application provide an electronic device, which includes a housing and the display module described in the first aspect above; The display module is mounted on the housing.

[0007] In this embodiment, the pixel definition layer is disposed on one surface of the substrate. Along the direction from the substrate to the pixel definition layer, the thin film encapsulation layer, inorganic layer, light-transmitting layer, first planarization layer, first black matrix layer, second planarization layer, and cover plate are stacked sequentially. The touch layer is disposed between the first planarization layer and the first black matrix layer, and the thin film encapsulation layer is disposed on the surface of the pixel definition layer away from the substrate. Therefore, compared with the display module in the related art, the position of the touch layer has been adjusted so that the touch layer is located between the first planarization layer and the first black matrix layer, that is, the touch layer is located above the first planarization layer and below the first black matrix layer. This makes the touch layer closer to the surface of the display module, that is, the distance between the touch layer and the cover plate is closer, which is beneficial to improving the touch sensitivity of the display module. In other words, in this embodiment, by placing the touch layer between the first planarization layer and the first black matrix layer, the touch layer is closer to the surface of the cover plate than the display module in the related art. As a result, when the user touches the display module, that is, when the user touches the cover plate, the touch distance between the touch layer and the user's finger is smaller, which improves the touch sensitivity of the display module and reduces the probability of unresponsive touch. Attached Figure Description

[0008] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of one embodiment of a display module provided in this application; Figure 2This is a second schematic diagram illustrating a display module provided in an embodiment of this application; Figure 3 This is a third schematic diagram illustrating a display module provided in an embodiment of this application; Figure 4 This is the fourth schematic diagram illustrating a display module provided in an embodiment of this application; Figure 5 This is a schematic diagram showing the pads of a display module provided in an embodiment of this application; Figure 6 This is the fifth schematic diagram illustrating a display module provided in an embodiment of this application; Figure 7 This is a flowchart illustrating a manufacturing method provided in an embodiment of this application.

[0009] Figure label: 10: Substrate; 101: Gate metal layer; 102: First source / drain metal layer; 103: Second source / drain metal layer; 104: First inorganic layer; 105: Second inorganic layer; 20: Pixel definition layer; 21: Pixel unit; 30: Thin film encapsulation layer; 40: Inorganic layer; 50: Light-transmitting layer; 51: Second black matrix layer; 52: Color filter; 53: Color filter layer; 531: Color filter unit; 511: First opening; 60: First planarization layer; 70: Touch layer; 71: First touch metal layer; 72: Insulating layer; 73: Second touch metal layer; 80: First black matrix layer; 801: Second opening; 90: Second planarization layer; 11: Cover plate; 100: Display area; 200: Non-display area; 300: Pad. Detailed Implementation

[0010] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0011] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. "At least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, "at least one of a, b, or c" can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0012] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0013] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0014] Before explaining the display module provided in the embodiments of this application, the application background of the display module provided in the embodiments of this application will be specifically described: In related technologies, a display module includes a substrate, a pixel definition layer, a thin film encapsulation layer, an inorganic layer, a touch layer, a first black matrix layer, a first planarization layer, a second black matrix layer, a second planarization layer, and a cover plate. The pixel definition layer is disposed on one surface of the substrate. Along the direction from the substrate to the pixel definition layer, the thin film encapsulation layer, the inorganic layer, the touch layer, the second black matrix layer, the first planarization layer, the first black matrix layer, the second planarization layer, and the cover plate are sequentially stacked. The touch layer is used to sense the user's touch on the display module. However, in related technologies, the opening on the second black matrix layer is small, and the thickness of both the first and second planarization layers is relatively large, resulting in a large distance between the touch layer and the surface of the display module, i.e., a large distance between the touch layer and the cover plate. This leads to a decrease in the touch sensitivity of the display module and easily causes problems with unresponsive touch.

[0015] This application provides a display module, such as... Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the display module includes: a substrate 10, a pixel definition layer 20, a thin film encapsulation layer 30, an inorganic layer 40, a light-transmitting layer 50, a first planarization layer 60, a touch layer 70, a first black matrix layer 80, a second planarization layer 90, and a cover plate 11.

[0016] A pixel definition layer 20 is disposed on one surface of the substrate 10; along the direction from the substrate 10 to the pixel definition layer 20, a thin film encapsulation layer 30, an inorganic layer 40, a light-transmitting layer 50, a first planarization layer 60, a first black matrix layer 80, a second planarization layer 90, and a cover plate 11 are stacked in sequence, a touch layer 70 is disposed between the first planarization layer 60 and the first black matrix layer 80, and the thin film encapsulation layer 30 is disposed on the surface of the pixel definition layer 20 away from the substrate 10.

[0017] In this embodiment, the pixel definition layer 20 is disposed on one surface of the substrate 10. Along the direction from the substrate 10 to the pixel definition layer 20, the thin film encapsulation layer 30, the inorganic layer 40, the light-transmitting layer 50, the first planarization layer 60, the first black matrix layer 80, the second planarization layer 90, and the cover plate 11 are stacked sequentially. The touch layer 70 is disposed between the first planarization layer 60 and the first black matrix layer 80, and the thin film encapsulation layer 30 is disposed on the surface of the pixel definition layer 20 away from the substrate 10. Therefore, compared with the display module in the related art, the position of the touch layer 70 is adjusted so that the touch layer 70 is located between the first planarization layer 60 and the first black matrix layer 80, that is, the touch layer 70 is located above the first planarization layer 60 and below the first black matrix layer 80. This makes the touch layer 70 closer to the surface of the display module, that is, the distance between the touch layer 70 and the cover plate 11 is closer, which is beneficial to improving the touch sensitivity of the display module. That is, in this embodiment of the application, by placing the touch layer 70 between the first planarization layer 60 and the first black matrix layer 80, the touch layer 70 is closer to the surface of the cover plate 11 than the display module in the related art. As a result, when the user touches the display module, that is, when the user touches the cover plate 11, the touch distance between the touch layer 70 and the user's finger is smaller, which improves the touch sensitivity of the display module and reduces the probability of unresponsive touch response.

[0018] It should be noted that in this embodiment, the cover plate 11 can be made of glass, or it can be made of sapphire; however, this embodiment does not limit the application in this regard. Furthermore, the cover plate 11 can be bonded to the second planarization layer 90 using optical adhesive. Specifically, the cover plate 11 is directly bonded to the surface of the second planarization layer 90 facing away from the first black matrix layer 80 using optical adhesive, thus placing the cover plate 11 on the surface of the second planarization layer 90 facing away from the first black matrix layer 80.

[0019] Additionally, in some embodiments, such as Figure 1 and Figure 2 As shown, the light-transmitting layer 50 includes a second black matrix layer 51 and a color filter 52, and the pixel definition layer 20 includes a plurality of pixel units 21; the second black matrix layer 51 is provided with a plurality of first openings 511, and along the direction from the substrate 10 to the pixel definition layer 20, one first opening 511 is positioned opposite to one pixel unit 21, and each first opening 511 is provided with a color filter 52.

[0020] With this setup, each pixel unit 21 is essentially equipped with a first opening 511, meaning each pixel unit 21 corresponds to a color filter 52. This allows light emitted from the pixel unit 21 to pass through the color filter 52, which filters out stray light, resulting in a purer color for the light passing through it. Furthermore, by using a second black matrix layer 51 and a color filter 52, a polarizer is unnecessary in the display module; the second black matrix layer 51 and the color filter 52 can replace the polarizer, thus saving costs.

[0021] It should be noted that, along the direction from the pixel definition layer 20 to the substrate 10, the projection of the pixel unit 21 on the substrate 10 is located inside the projection of the first opening 511 on the substrate 10, thereby effectively ensuring that the light emitted by the pixel unit 21 passes through the color filter 52 in the first opening 511.

[0022] In addition, in this embodiment, the pixel unit 21 can be an RGB pixel unit, that is, the pixel unit 21 may include a red pixel unit, a blue pixel unit, and a green pixel unit. In this case, the color filter 52 in the first opening 511 opposite to the pixel unit 21 has the same color as the pixel unit 21. For example, the color filter 52 in the first opening 511 opposite to the red pixel unit is red, the color filter 52 in the first opening 511 opposite to the green pixel unit is green, and the color filter 52 in the first opening 511 opposite to the blue pixel unit is blue.

[0023] Additionally, in the embodiments of this application, such as Figure 2 As shown, the color filter 52 can protrude from the first opening 511 and extend to the surface of the first black matrix layer 80 away from the substrate 10, so that the color filter 52 can completely cover the first opening 511, thereby effectively ensuring that the light emitted by the pixel unit 21 can be completely filtered by the color filter 52.

[0024] Additionally, in some embodiments, such as Figure 3 As shown, the light-transmitting layer 50 includes a color filter layer 53, which includes a plurality of color filter units 531; along the direction from the substrate 10 to the pixel definition layer 20, one color filter unit 531 is positioned opposite to one pixel unit 21; at least a portion of two adjacent color filter units 531 overlap each other.

[0025] Since a color filter unit 531 is positioned opposite a pixel unit 21, light emitted from the pixel unit 21 can pass through the color filter unit 531. The color filter unit 531 can then filter the light from the pixel unit 21, making the light passing through it relatively pure. Furthermore, at least a portion of two adjacent color filter units 531 overlap, and this overlapping portion can act as a light-blocking layer, essentially functioning as a black matrix layer. In other words, by providing a color filter layer 53, and ensuring that at least a portion of two adjacent color filter units 531 within the color filter layer 53 overlaps, a second black matrix layer 51 is unnecessary; only the color filter layer 53 needs to be provided, simplifying the manufacturing process of the display module.

[0026] It should be noted that pixel unit 21 can be an RGB pixel unit 21, that is, pixel unit 21 can include red pixel units, blue pixel units, and green pixel units. In this case, the color filter unit 531 opposite to pixel unit 21 has the same color as pixel unit 21. For example, the color filter unit 531 opposite to the red pixel unit is red, the color filter unit 531 opposite to the green pixel unit is green, and the color filter unit 531 opposite to the blue pixel unit is blue.

[0027] It should also be noted that in the color filter layer 53, it is equivalent to extending two adjacent color filter units 531 respectively, such that at least a portion of the two adjacent color filter units 531 overlaps with each other. For example, if the two adjacent color filter units 531 are a blue color filter unit 531 and a red color filter unit 531, a portion of the blue color filter unit 531 overlaps with a portion of the red color filter unit 531, thereby providing light blocking at the overlapping position. As another example, if the two adjacent color filter units 531 are a green color filter unit 531 and a red color filter unit 531, a portion of the green color filter unit 531 overlaps with a portion of the red color filter unit 531, thereby providing light blocking at the overlapping position.

[0028] Additionally, in some embodiments, such as Figure 5 and Figure 6 As shown, the display module includes a display area 100 and a non-display area 200, with the non-display area 200 surrounding the display area 100. At least a portion of the pixel definition layer 20, thin film encapsulation layer 30, inorganic layer 40, light-transmitting layer 50, first planarization layer 60, touch layer 70, and first black matrix layer 80 are all located in the display area 100. A portion of the substrate 10 is located in the non-display area 200, and the non-display area 200 has a pad 300 formed thereon. A portion of the touch layer 70 extends into the non-display area to form a portion of the structure of the pad 300.

[0029] Since at least a portion of the pixel definition layer 20, thin film encapsulation layer 30, inorganic layer 40, light-transmitting layer 50, first planarization layer 60, touch layer 70, and first black matrix layer 80 are all located in the display area 100, after the pixel unit 21 in the pixel definition layer 20 emits light, the light from the pixel unit 21 can pass through the thin film encapsulation layer 30, inorganic layer 40, light-transmitting layer 50, first planarization layer 60, touch layer 70, and first black matrix layer 80, thereby enabling the display area 100 to display an image. Since the non-display area 200 has pads 300, and a portion of the touch layer 70 extends into the non-display area to form a portion of the pads 300, during the processing of the display module, after forming the pixel definition layer 20 on the substrate 10, a thin film encapsulation layer 30 is formed on the pixel definition layer 20, followed by an inorganic layer 40 on the thin film encapsulation layer 30, then a light-transmitting layer 50 is formed on the inorganic layer 40, followed by a first planarization layer 60 is formed on the light-transmitting layer 50, followed by a touch layer 70 is formed on the first planarization layer 60, and then... The first black matrix layer 80 is formed. During the formation of the first black matrix layer 80, development is required. The touch layer 70 extends into the non-display area to form part of the pad 300 structure. Therefore, development is only required after the touch layer 70 is formed. This means that the pad 300 formed by the part of the touch layer 70 is etched by the developing solution less often. In other words, the pad 300 undergoes fewer development processes, which greatly improves the side marking of the metal at the pad 300. This, in turn, helps to improve the problem of dark lines on the screen and the silver ion ionization after reliability testing.

[0030] In related technologies, a display module includes a substrate 10, a pixel definition layer 20, a thin-film encapsulation layer 30, an inorganic layer 40, a touch layer 70, a first black matrix layer 80, a first planarization layer 60, a second black matrix layer 51, a second planarization layer 90, and a cover plate. The pixel definition layer 20 is disposed on one surface of the substrate 10. Along the direction from the substrate 10 to the pixel definition layer 20, the thin-film encapsulation layer 30, the inorganic layer 40, the touch layer 70, the second black matrix layer 51, the first planarization layer 60, and the first black matrix layer 80 are... A second planarization layer 90 and a cover plate are sequentially stacked to form a display module in the related technology. A pixel definition layer 20 is formed on the substrate 10, followed by a thin-film encapsulation layer 30 on the pixel definition layer 20, an inorganic layer 40 on the thin-film encapsulation layer 30, a touch layer 70 on the inorganic layer 40, a second black matrix layer 51 on the touch layer 70, a second planarization layer 90 on the second black matrix layer 51, and a cover plate on the second planarization layer 90. A portion of the structure of the touch layer 70 forms the pads 300 of the display module. A color filter 52 is typically disposed on the second black matrix layer 51. Development is required during the formation of the second black matrix layer 51, color filter 52, first planarization layer 60, first black matrix layer 80, and second planarization layer 90. Specifically, one development process is performed during the formation of the second black matrix layer 51; three development processes are required during the formation of the color filter 52 on the second black matrix layer 51. This is because pixel units 21 are typically red, blue, and green, and each color filter 52 corresponding to a different pixel unit 21 requires one development process. Therefore, three development processes are required during the formation of the color filter 52 on the second black matrix layer 51; one development process is required during the formation of the first planarization layer 60; one development process is required during the formation of the first black matrix layer 80; and one development process is required during the formation of the second planarization layer 90. Therefore, in the relevant technology, after the touch layer 70 is formed into part of the structure of the pad 300, the pad 300 will undergo 7 developing processes during the processing of the display module. That is, the pad 300 will be etched 7 times with developing solution, which makes the metal at the pad 300 more side-etched, thus making it easy for dark lines to appear on the screen and for silver ion to be released after reliability testing.

[0031] In this embodiment, the display module includes a substrate 10, a pixel definition layer 20, a thin-film encapsulation layer 30, an inorganic layer 40, a light-transmitting layer 50, a first planarization layer 60, a touch layer 70, and a first black matrix layer 80. The pixel definition layer 20 is disposed on one surface of the substrate 10. Along the direction from the substrate 10 to the pixel definition layer 20, the thin-film encapsulation layer 30, the inorganic layer 40, the light-transmitting layer 50, the first planarization layer 60, the touch layer 70, and the first black matrix layer 80 are sequentially stacked, with the thin-film encapsulation layer 30 disposed on the surface of the pixel definition layer 20 facing away from the substrate 10. A portion of the touch layer 70 extends into the non-display area 200 and forms part of the structure of the pad 300. Therefore, during the processing of the display module, after forming the pixel definition layer 20 on the substrate 10, a thin film encapsulation layer 30 is formed on the pixel definition layer 20, followed by an inorganic layer 40 on the thin film encapsulation layer 30, then a light-transmitting layer 50 on the inorganic layer 40, then a first planarization layer 60 on the light-transmitting layer 50, then a touch layer 70 on the first planarization layer 60, and finally a first black matrix layer 80 on the touch layer 70. During the formation of the first black matrix layer 80, one development process is performed. When the display module includes a second planarization layer 90, and the second planarization layer 90 is located on the surface of the first black matrix layer away from the substrate 10, only one development process is performed during the formation of the second planarization layer 90. That is, in this embodiment, the pad 300 undergoes a maximum of two development processes, thereby greatly reducing the number of times the pad 300 is etched by the developer, resulting in less metal being side-etched at the pad 300, which helps to improve the problem of dark lines on the screen and silver ion ionization after reliability testing. Even though the light-transmitting layer 50 includes a second black matrix layer 51 and a color filter 52, the second black matrix layer 51 and the color filter 52 are closer to the substrate 10 than the touch layer 70. Therefore, when processing the second black matrix layer 51 and the color filter 52, the touch layer 70 has not yet been formed, and thus the complete pad 300 has not been formed. Even though processing the second black matrix layer 51 and the color filter 52 requires multiple development processes, it will not affect the subsequently formed pad 300.

[0032] Additionally, in some embodiments, such as Figure 5 and Figure 6As shown, a gate metal layer 101, a first source / drain metal layer 102, a second source / drain metal layer 103, a first inorganic layer 104, and a second inorganic layer 105 are provided on the substrate 10 located in the non-display area 200. The first source / drain metal layer 102 and the second source / drain metal layer 103 are stacked, and a portion of the touch metal layer extending into the non-display area 200 is stacked with the second source / drain metal layer 103. Within the area where the gate metal layer 101 is located, the first source / drain metal layer 102 and the second source / drain metal layer 103 are in contact, and the touch metal layer is in contact with the second source / drain metal layer 103. Outside the area where the gate metal layer 101 is located, the first inorganic layer 104 is provided between the first source / drain metal layer 102 and the second source / drain metal layer 103, and the second inorganic layer 105 is provided between the touch metal layer and the second source / drain metal layer 103. With this setup, it is equivalent to stacking the gate metal layer 101, the first source / drain metal layer 102, the second source / drain metal layer 103, the first inorganic layer 104, and the second inorganic layer 105, and then stacking the touch layer 70 to form a pad 300 structure. This makes it easier for the display module to be driven after the pad 300 structure is connected to the driving source.

[0033] It should be noted that, in the embodiments of this application, the first inorganic layer 104 extends to the outside of the regions of the first source / drain metal layer 102 and the second source / drain metal layer 103, the second inorganic layer 105 extends to the outside of the regions of the first source / drain metal layer 102 and the second source / drain metal layer 103, and the second inorganic metal layer is in contact with the first inorganic metal layer.

[0034] In addition, in this embodiment, the pad 300 structure is the driving pad 300 structure in the display module, that is, the IC pad 300 structure in the display module.

[0035] In addition, in this embodiment, along the direction from the pixel definition layer 20 to the substrate 10, a gate metal layer 101, a first source / drain metal layer 102, a second source / drain metal layer 103, and a first inorganic layer 104 can be formed first on the substrate 10 at the location of the non-display area 200. The gate metal layer 101, the first source / drain metal layer 102, the second source / drain metal layer 103, and the first inorganic layer 104 are all closer to the substrate 10 relative to the pixel definition layer 20. That is, along the direction from the pixel definition layer 20 to the substrate 10, the gate metal layer 101, the first source / drain metal layer 102, the second source / drain metal layer 103, and the first inorganic layer 104 are all located below the pixel definition layer 20, while the second inorganic layer 105 and the touch layer 70 are both farther away from the substrate 10 relative to the pixel definition layer 20. That is, along the direction from the pixel definition layer 20 to the substrate 10, the second inorganic layer 105 and the touch layer 70 are both located above the pixel definition layer 20.

[0036] Additionally, in some embodiments, such as Figure 1As shown, the touch layer 70 includes a first touch metal layer 71, an insulating layer 72, and a second touch metal layer 73; the first touch metal layer 71, the insulating layer 72, and the second touch metal layer 73 are stacked sequentially, the first touch metal layer 71 is adjacent to the first planarization layer 60, and the second touch metal layer 73 is adjacent to the first black matrix layer 80; the second touch metal layer 73 extends to the non-display area 200, and the portion of the second touch metal layer 73 extending to the non-display area 200 is stacked with the second source / drain metal layer 103.

[0037] With this arrangement, the first touch metal layer 71 of the touch layer 70 is positioned closer to the substrate 10 than the second touch metal layer 73. Therefore, during the processing of the display module, the first touch metal layer 71 can be formed first, followed by the insulating layer 72, and then the second touch metal layer 73. The second touch metal layer 73 extends into the non-display area 200, and the portion of the second touch metal layer 73 extending into the non-display area 200 is stacked with the second drain metal layer. This effectively forms a pad 300 on the second touch metal layer 73 extending into the non-display area 200, which helps reduce the number of times the metal at the pad 300 is etched by the developing solution during the processing of the display module.

[0038] Additionally, in some embodiments, such as Figure 1 and Figure 2 As shown, the pixel definition layer 20 includes multiple pixel units 21, which include multiple pixel units 21 of a first color, multiple pixel units 21 of a second color, and multiple pixel units 21 of a third color. The first black matrix layer 80 is provided with multiple second openings 801. Along the direction from the substrate 10 to the pixel definition layer 20, one second opening 801 is positioned opposite to one pixel unit 21. The size of the second opening 801 corresponding to different color pixel units 21 is different. Among the pixel units 21 of the same color, the size of the second opening 801 corresponding to some pixel units 21 is different from the size of the second opening 801 corresponding to other pixel units 21.

[0039] With this configuration, the sizes of pixel units 21 of different colors are typically different, thus ensuring that the sizes of the second openings 801 corresponding to pixel units 21 of different colors are also different. This effectively ensures that the pixel unit 21 is appropriately matched to its corresponding second opening 801, facilitating the effective passage of light emitted from the pixel unit 21 through the corresponding second opening 801. Furthermore, among pixel units 21 of the same color, the size of the second opening 801 corresponding to some pixel units 21 is different from the size of the second opening 801 corresponding to others. This configuration allows the display module to have two modes: a privacy mode and a sharing mode. In privacy mode, only a portion of the pixel units 21 of the same color emit light, while the other portion stops emitting light. In sharing mode, all pixel units 21 of the same color emit light. Furthermore, in the pixel units 21 of the same color, the size of the second opening 801 corresponding to some pixel units 21 is different from the size of the second opening 801 corresponding to other pixel units 21. This allows the pixel units 21 corresponding to the smaller second opening 801 to function as the privacy mode pixel units 21, and the pixel units 21 corresponding to the larger second opening 801 to function as the sharing mode pixel units 21. When the display module is in privacy mode, only the pixel units 21 corresponding to the smaller second opening 801 emit light, and the light from these pixel units 21 passes through the smaller second opening 801. This ensures that the display content of the display module is only visible in directions perpendicular or nearly perpendicular to the surface of the display module, thus providing a privacy effect. In other words, by setting the size of the second opening 801 corresponding to some pixel units 21 of the same color to be different from the size of the second opening 801 corresponding to other pixel units 21, the display module can have two modes.

[0040] It should be noted that, in the embodiments of this application, when the display module has a first black matrix layer 80 and a second black matrix layer 51, the second opening 801 on the first black matrix layer 80 is equivalent to adjusting the angle at which the light from the pixel unit 21 is emitted from the display module, so that the display module has different modes; the presence of the second black matrix layer 51 means that a polarizer does not need to be set in the display module.

[0041] This application provides a manufacturing method for producing a display module in any of the above embodiments, such as... Figure 7 As shown, the manufacturing method includes: Step 601: Provide a substrate.

[0042] Step 602: Form a pixel definition layer on one surface of the substrate.

[0043] In this case, a pixel definition layer can be formed directly on one surface of the substrate.

[0044] It should be noted that when forming the pixel definition layer, you can refer to the methods for forming pixel definition layers in related technologies, which will not be elaborated here.

[0045] Step 603: Form a thin film encapsulation layer on the surface of the pixel definition layer facing away from the substrate.

[0046] When forming a thin-film encapsulation layer on the surface of the pixel definition layer away from the substrate, the formation method of the thin-film encapsulation layer in related technologies can be referred to, and will not be repeated here.

[0047] Step 604: Form an inorganic layer on the surface of the thin film encapsulation layer opposite to the pixel definition layer.

[0048] When forming an inorganic layer on the surface of the thin-film encapsulation layer away from the pixel definition layer, the formation method of the inorganic layer in related technologies can be referred to, and will not be elaborated here.

[0049] Step 605: Form a light-transmitting layer on the surface of the inorganic layer opposite to the thin film encapsulation layer.

[0050] In some implementations, the light-transmitting layer includes a second black matrix layer and a color filter; then step 605 can be implemented as follows: a second black matrix layer is formed on the surface of the inorganic layer away from the thin film encapsulation layer, and the second black matrix layer is provided with a plurality of first openings; a color filter is formed in each of the first openings.

[0051] When a second black matrix layer is formed on the surface of the inorganic layer away from the thin film encapsulation layer, and the second black matrix layer has multiple first openings, the method of forming the black matrix layer and forming openings on the black matrix layer can be referred to in the relevant technology, and will not be repeated here.

[0052] When forming a color filter in each first opening, refer to the methods for forming color filters in related technologies, which will not be elaborated here.

[0053] In some implementations, the light-transmitting layer includes a color filter layer. The implementation of forming the light-transmitting layer on the surface of the inorganic layer away from the thin-film encapsulation layer can be as follows: a color filter layer is formed on the surface of the inorganic layer away from the thin-film encapsulation layer, and the color filter layer includes multiple color filter units, with at least a portion of two adjacent color filter units overlapping each other.

[0054] In this method, a color filter layer can be formed directly on the surface of the inorganic layer away from the thin film encapsulation layer, and at least a portion of two adjacent color filter units in the color filter layer overlap each other, which is equivalent to not needing to set a second black matrix layer.

[0055] Step 606: Form a first planarization layer on the surface of the light-transmitting layer opposite to the inorganic layer.

[0056] In some implementations, the formation of the first planarization layer on the surface of the light-transmitting layer away from the inorganic layer can be achieved through a developing process, i.e., by developing technology. Alternatively, in some implementations, the formation of the first planarization layer can also be achieved through a spraying process, i.e., by directly spraying the material of the first planarization layer onto the surface of the light-transmitting layer away from the inorganic layer to form the first planarization layer.

[0057] Step 607: Form a touch layer on the surface of the first planar layer opposite to the light-transmitting layer.

[0058] When the touch layer includes a first touch metal layer, an insulating layer, and a second touch metal layer, the first touch metal layer is first formed on the surface of the first planar layer away from the light-transmitting layer, then an insulating layer is formed on the first touch metal layer, and finally the second touch metal layer is formed on the insulating layer.

[0059] In some implementations, the second touch metal layer can extend into the non-display area of ​​the display module, and the second touch metal layer can form part of the pad structure.

[0060] Step 608: Form a first black matrix layer on the surface of the touch layer opposite to the first planar layer.

[0061] When forming the first black matrix layer on the surface of the touch layer away from the first planar layer, the method of forming the black matrix layer in related technologies can be referred to, and will not be elaborated here.

[0062] Step 609: A second planarization layer is formed on the surface of the first black matrix layer opposite to the touch layer, and a cover plate is provided on the surface of the second planarization layer opposite to the first black matrix layer to obtain a display module.

[0063] In some implementations, the formation of the second planarization layer on the surface of the first black matrix layer away from the touch layer can be achieved through a developing process, i.e., by developing technology. Alternatively, in some implementations, the formation of the second planarization layer can also be achieved through a spraying process, i.e., by directly spraying the material of the second planarization layer onto the surface of the first black matrix layer away from the touch layer to form the second planarization layer.

[0064] In addition, when a cover plate is installed on the surface of the second flat layer that is opposite to the first black matrix layer, the cover plate can be bonded to the surface of the second flat layer that is opposite to the first black matrix layer using optical adhesive.

[0065] This application provides an electronic device, which includes a housing and a display module as described in any of the above embodiments; the display module is mounted on the housing.

[0066] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, terminal products, etc., wherein smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., and terminal products include, for example, personal computers, tablet computers, etc.

[0067] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0068] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that, The display module includes: a substrate, a pixel definition layer, a thin film encapsulation layer, an inorganic layer, a light-transmitting layer, a first planarization layer, a touch layer, a first black matrix layer, a second planarization layer, and a cover plate; The pixel definition layer is disposed on one surface of the substrate; Along the direction from the substrate to the pixel definition layer, the thin film encapsulation layer, the inorganic layer, the light-transmitting layer, the first planarization layer, the first black matrix layer, the second planarization layer, and the cover plate are stacked in sequence. The touch layer is disposed between the first planarization layer and the first black matrix layer, and the thin film encapsulation layer is disposed on the surface of the pixel definition layer opposite to the substrate.

2. The display module according to claim 1, characterized in that, The light-transmitting layer includes a second black matrix layer and a color filter, and the pixel definition layer includes multiple pixel units; The second black matrix layer has a plurality of first openings. Along the direction from the substrate to the pixel definition layer, one first opening is positioned opposite to one pixel unit, and each first opening is provided with the color filter.

3. The display module according to claim 1, characterized in that, The light-transmitting layer includes a color filter layer, and the color filter layer includes multiple color filter units; Along the direction from the substrate to the pixel definition layer, one color filter unit is positioned opposite to one pixel unit; At least a portion of two adjacent color filter units overlap each other.

4. The display module according to claim 1, characterized in that, The display module includes a display area and a non-display area, wherein the non-display area is arranged around the display area; The pixel definition layer, the thin film encapsulation layer, the inorganic layer, the light-transmitting layer, the first planarization layer, at least a portion of the touch layer, and the first black matrix layer are all located in the display area; A portion of the substrate is located in the non-display area, where pads are formed, and a portion of the touch layer extends into the non-display area to form a partial structure of the pads.

5. The display module according to claim 4, characterized in that, The substrate located in the non-display area is provided with a gate metal layer, a first source / drain metal layer, a second source / drain metal layer, a first inorganic layer, and a second inorganic layer; The first source / drain metal layer and the second source / drain metal layer are stacked together, and the portion of the touch metal layer extending into the non-display area is also stacked together with the second source / drain metal layer. Within the region where the gate metal layer is located, the first source / drain metal layer is in contact with the second source / drain metal layer, and the touch metal layer is in contact with the second source / drain metal layer; Outside the region where the gate metal layer is located, a first inorganic layer is provided between the first source / drain metal layer and the second source / drain metal layer, and a second inorganic layer is provided between the touch metal layer and the second source / drain metal layer.

6. The display module according to claim 5, characterized in that, The touch layer includes a first touch metal layer, an insulating layer, and a second touch metal layer; The first touch metal layer, the insulating layer, and the second touch metal layer are stacked sequentially. The first touch metal layer is adjacent to the first planarization layer, and the second touch metal layer is adjacent to the first black matrix layer. The second touch metal layer extends into the non-display area, and the portion of the second touch metal layer extending into the non-display area is stacked with the second source / drain metal layer.

7. The display module according to claim 1, characterized in that, The pixel definition layer includes multiple pixel units, which include multiple pixel units of a first color, multiple pixel units of a second color, and multiple pixel units of a third color. The first black matrix layer has a plurality of second openings. Along the direction from the substrate to the pixel definition layer, one second opening is positioned opposite to one pixel unit. The size of the second opening is different for pixel units of different colors. In the pixel units of the same color, the size of the second opening corresponding to some of the pixel units is different from the size of the second opening corresponding to other pixel units.

8. A manufacturing method, characterized in that, The method for manufacturing a display module according to any one of claims 1-7 includes: Provide substrate; A pixel definition layer is formed on one surface of the substrate; A thin film encapsulation layer is formed on the surface of the pixel definition layer opposite to the substrate; An inorganic layer is formed on the surface of the thin film encapsulation layer opposite to the pixel definition layer; A light-transmitting layer is formed on the surface of the inorganic layer opposite to the thin-film encapsulation layer; The first planarization layer is formed on the surface of the light-transmitting layer opposite to the inorganic layer; The touch layer is formed on the surface of the first planar layer opposite to the light-transmitting layer; The first black matrix layer is formed on the surface of the touch layer that is opposite to the first planar layer; A second flat layer is formed on the surface of the first black matrix layer that is opposite to the touch layer, and a cover plate is disposed on the surface of the second flat layer that is opposite to the first black matrix layer to obtain the display module.

9. The manufacturing method according to claim 8, characterized in that, The light-transmitting layer includes a second black matrix layer and a color filter; The step of forming a light-transmitting layer on the surface of the inorganic layer opposite to the thin-film encapsulation includes: A second black matrix layer is formed on the surface of the inorganic layer opposite to the thin film encapsulation layer, and the second black matrix layer is provided with a plurality of first openings; The color filter is formed in each of the first openings.

10. The manufacturing method according to claim 8, characterized in that, The light-transmitting layer includes a color filter layer. The step of forming a light-transmitting layer on the surface of the inorganic layer opposite to the thin-film encapsulation includes: The color filter layer is formed on the surface of the inorganic layer away from the thin film encapsulation layer. The color filter layer includes a plurality of color filter units, and at least a portion of two adjacent color filter units overlap each other.

11. An electronic device, characterized in that, The electronic device includes a housing and a display module as described in any one of claims 1-7; The display module is mounted on the housing.

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