Bionic spiral micro-channel heat dissipation structure and construction method thereof

Abstract

The application discloses a kind of bionic spiral microchannel heat dissipation structure and its construction method, its characteristics are that the heat dissipation structure includes: base, fluid inlet, fluid outlet and the micro perturbation flow column array arranged on base;The node position of the micro perturbation flow column array follows the regular distribution of bionic spiral topological law.This structure construction method includes: establishing bionic spiral mathematical model to obtain node coordinate matrix, and then by writing program macro instruction, directly driving three-dimensional modeling software completes the automatic stretching of micro perturbation flow column and array generation.Compared with prior art, its bionic topological arrangement effectively destroys flow boundary layer, significantly strengthens the heat transfer performance in channel while optimizing the pressure drop distribution of flow field, improves the comprehensive heat transfer efficiency.In addition, this parameterized construction method greatly improves the design efficiency of complex microchannel, especially suitable for high heat flux chip and interconnect line topological structure high-efficiency heat management field, and has good application prospect.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology for electronic devices, specifically to a biomimetic spiral microchannel heat dissipation structure and its construction method. Background Technology

[0002] With the rapid development of integrated circuit technology and the evolution of advanced packaging processes, the computing power and integration density of chips are constantly increasing, leading to an exponential surge in chip heat flux density. Traditional thermal management methods, such as external macroscopic heat sinks, are gradually failing to meet the heat dissipation requirements of today's high heat flux density chips due to their large package thermal resistance and interface thermal resistance. Therefore, liquid-cooled microchannel heat dissipation technology, with its extremely high heat transfer surface area to volume ratio, has become the mainstream solution to address the bottleneck of chip thermal management.

[0003] However, traditional microchannel heat sinks typically employ straight microchannels or regularly arranged micro-turbulence column arrays. While these methods can improve heat transfer efficiency to some extent, they still have drawbacks in practical applications: Firstly, fluids flowing within regular channels tend to form a thicker flow and heat transfer boundary layer, limiting further improvements in the convective heat transfer coefficient. Secondly, high-density, regularly arranged micro-turbulence column arrays often lead to a sharp increase in fluid pressure drop and are prone to generating unreasonable local high pressures within the flow field. This not only significantly increases system power consumption but also affects the structural reliability of the chip's underlying structure, making it difficult to optimize overall heat transfer efficiency.

[0004] Furthermore, in order to further enhance heat transfer, the design of microchannel structures has become increasingly complex with the introduction of irregular biomimetic topologies. Traditional computer-aided design modeling methods usually rely on manual drawing. When faced with nodes with complex mathematical distributions, the design cycle is not only long and inefficient, but it is also difficult to achieve parameterized rapid iteration and optimization of model size and array number.

[0005] In summary, existing microchannel heat dissipation structures suffer from technical problems such as difficulty in balancing heat transfer and flow resistance, uneven internal flow field pressure distribution, and low efficiency in modeling complex topology heat dissipation structures. Summary of the Invention

[0006] The purpose of this invention is to address the problems of existing microchannel heat sinks, such as thick fluid boundary layers, uneven internal pressure drop distribution and easy formation of local high pressure accumulation, and low efficiency in modeling complex topologies, by providing a biomimetic spiral microchannel heat dissipation structure and its construction method. This structure can effectively disrupt the fluid boundary layer, enhance heat transfer, and optimize the overall flow field pressure drop. Furthermore, its construction method enables the automated and rapid generation of complex mathematical arrays, showing promising application prospects.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A biomimetic spiral microchannel heat dissipation structure includes:

[0009] A substrate, the upper surface of which has a plurality of microchannels; a fluid inlet region and a fluid outlet region disposed on the substrate; and an array of micro-turbulence columns arranged on the substrate;

[0010] The micro-perturbation column array comprises several needle-like structures extending upward from the substrate surface as micro-perturbation columns. These micro-perturbation columns are regularly distributed following a biomimetic spiral topology; the polar coordinates (r, θ) of their central node positions satisfy: , Where c is a proportionality constant and n is the sequence number of the micro-turbulence column.

[0011] Furthermore, the micro-turbulence columns in the micro-turbulence column array have a needle-wing structure, with a diameter of 0.05~0.2mm, a height of 0.2~0.8mm, and a spacing of 0.1~0.3mm between adjacent needle wings.

[0012] The microchannels have a width of 0.05~0.25mm, a height of 0.1~0.5mm, and a spacing of 0.1~0.25mm.

[0013] The total number of micro-turbulence columns is 30 to 200.

[0014] Furthermore, the fluid inlet region is provided with an inlet diversion cavity; the fluid outlet region is provided with an outlet collection cavity; along the flow direction of the cooling medium, the fluid inlet region, the inlet diversion cavity, the micro-turbulence column array, the outlet collection cavity, and the fluid outlet region are sequentially connected; the inlet diversion cavity gradually expands along the flow direction of the cooling medium, and the outlet collection cavity gradually contracts along the flow direction of the cooling medium.

[0015] Furthermore, the substrate is made of any one of silicon, silicon carbide, or copper-based materials; and a thermal interface material layer is provided at the bottom of the substrate, which is used for physical bonding with the chip.

[0016] A method for constructing the above-mentioned biomimetic spiral microchannel heat dissipation structure, the method specifically includes the following steps:

[0017] Step S1, Node coordinate sequence generation: Based on the mathematical laws of biomimetic spirals, according to the preset proportional constant and node arrangement number, the polar coordinate data of the center node of each micro-bumper column is calculated, and the polar coordinate data is converted into plane rectangular coordinate data; according to the arrangement range of the micro-bumper column array and the structural size of the micro-bumper column, the plane rectangular coordinate data is filtered for validity to obtain a valid node coordinate sequence;

[0018] Step S2, Establishment of substrate and reference system: Based on the determined structural parameters, establish a three-dimensional model of substrate with a thickness of 0.01mm to 0.3mm, construct several microchannels, fluid inlet regions and fluid outlet regions on the upper surface of the substrate, and establish a reference system with the geometric center of the hot spot region as the global coordinate origin;

[0019] Step S3, instruction-driven materialization: By executing the program macro instruction script, the coordinate data obtained in step S1 is read, and the two-dimensional cross-sectional features of the micro-turbulence column are automatically generated at the corresponding position of the substrate. A three-dimensional model of the substrate is established according to the determined structural parameters, and several microchannels, fluid inlet regions and fluid outlet regions are constructed on the upper surface of the substrate, thereby obtaining the biomimetic spiral microchannel heat dissipation structure.

[0020] Furthermore, in step S1, the Cartesian coordinate data is filtered for validity, specifically including:

[0021] Boundary determination is performed on the micro-turbulence column cross-sectional profile corresponding to each center node. When the entire micro-turbulence column cross-sectional profile is located within the projection range of the hotspot region on the upper surface of the substrate, the corresponding center node is retained; when the micro-turbulence column cross-sectional profile at least partially exceeds the projection range, the corresponding center node is deleted.

[0022] The distance between any two retained center nodes is judged. When the distance between the two center nodes is less than the sum of the cross-sectional size of the corresponding micro-bumper column and the preset minimum spacing, one of the center nodes is deleted according to the node arrangement order until the cross-sectional profiles of any adjacent micro-bumper columns do not overlap, thus obtaining the effective node coordinate sequence.

[0023] Compared with the prior art, the present invention has the following beneficial technical advancements and significant technical effects:

[0024] 1) Significantly Improved Overall Heat Transfer Performance (PEC): The biomimetic spiral arrangement of this invention breaks the continuity of fluid channels in traditional regular arrays, continuously disrupting the fluid flow and heat transfer boundary layer. Data shows that the overall heat transfer evaluation index of this biomimetic structure is significantly greater than the benchmark value of 1.0, reaching a maximum of 1.244. Simultaneously, considering the overall system power consumption, the system PEC index can reach a maximum of 1.651, demonstrating that it has a heat dissipation benefit far exceeding that of traditional structures under the same energy consumption.

[0025] 2) Significantly improves convective heat transfer coefficient and suppresses extreme temperature rise: Micro-turbulent flow columns arranged in a specific spiral pattern (N=100 to N=121 range) can greatly enhance fluid mixing. Under this topology, the average heat transfer coefficient h of the flow channel can reach as high as 147778 W / m. 2• K. Under extremely high heat flux density conditions, the maximum temperature of the heating surface can be effectively suppressed to around 473.88 K, which greatly alleviates the problem of hot spot concentration on the chip compared to sparse or excessively dense arrays.

[0026] 3) Achieving a dynamic balance between local pressure drop and thermal management: Addressing the inherent drawback of traditional high-density needle-fin arrays easily generating extreme maximum pressure drops, the biomimetic arrangement of this invention achieves a good balance between flow resistance and heat transfer. Although the maximum pressure drop increases non-linearly with the number of needles, at the optimal distribution density, the structure can control the maximum pressure drop within a reasonable range while achieving the lowest extreme temperature on the heating surface, effectively avoiding unreasonable local high-pressure accumulation.

[0027] 4) Extremely high parametric design and iteration efficiency: The automatic construction method based on code macro instructions proposed in this invention completely eliminates the inefficient mode of manually drawing complex mathematical topological arrays. Designers only need to adjust the parameters to directly generate accurate 3D solid models after one-click execution, greatly improving design efficiency. Attached Figure Description

[0028] Figure 1 A three-dimensional structural schematic diagram of the biomimetic spiral microchannel heat dissipation structure provided in an embodiment of the present invention;

[0029] Figure 2 A top view of the micro-perturbation column array arranged in a counterclockwise Fibonacci spiral, provided in an embodiment of the present invention;

[0030] Figure 3 A top view of the micro-perturbation column array arranged in a clockwise Fibonacci spiral, as provided in another embodiment of the present invention;

[0031] Figure 4 A flowchart illustrating the construction method of the biomimetic spiral microchannel heat dissipation structure provided in this embodiment of the invention;

[0032] Figure 5 This is a schematic diagram of a traditional straight microchannel three-dimensional structure used for comparison in the prior art;

[0033] Figure 6 This is a schematic diagram comparing the bottom surface temperature distribution of the biomimetic spiral structure of the present invention and the traditional flat microchannel structure under the same high heat flux density.

[0034] Figure 7 This is a schematic diagram of the flow characteristics of the internal cross-section of the biomimetic spiral structure of the present invention;

[0035] Figure 8 This is a schematic diagram comparing the performance of the biomimetic spiral structure of this invention with that of the traditional flat microchannel structure in terms of maximum temperature and overall system heat transfer index. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings and examples. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1

[0038] See Figures 1-3 This embodiment provides a biomimetic spiral microfluidic channel heat dissipation structure to solve the heat dissipation bottleneck problem of high-performance chips under extremely high heat flux density. The structure is in the form of a microfluidic channel, including a substrate 1, an array of micro-turbulence pillars 2, a fluid inlet region 3, and a fluid outlet region 4.

[0039] In this embodiment, the planar dimensions of the substrate 1 are designed to be 10 mm × 10 mm, with an actual physical thickness of 0.2 mm to ensure processing strength and structural stability. More preferably, in pursuit of extreme heat dissipation and high-precision ideal simulation, the thickness of the substrate 1 can be further reduced to 0.01 mm to minimize the thermal resistance of the material in the vertical direction. In practical applications, the lower surface of the substrate 1 is directly bonded to the heating surface of the high heat flux density chip via a thermal interface material layer. Furthermore, a hot spot region 5 with dimensions of 2 mm × 2 mm is defined in the geometric center region of the substrate 1, corresponding to the logic unit with the most concentrated heat generation at the bottom of the chip. To target and cool this hot spot region 5, several micro-turbulence pillars 2 with a diameter of 0.12 mm and a height of 0.5 mm are provided on the upper surface of the substrate 1. The core breakthrough of this invention lies in the fact that these micro-turbulence pillars 2 are arranged using a biomimetic Fibonacci spiral topology. With the geometric center of hotspot region 5 as the origin of polar coordinates, the polar coordinates (r, θ) of the nth micro-perturbation column 2 in the array satisfy: ; Where c is the proportional constant controlling the radial spacing of the needle fins, and n is the sequence number of the micro-turbulence column. Figure 2 and Figure 3 Two equivalent arrangements of the micro-turbulence column array along counterclockwise and clockwise directions are shown respectively. By introducing a 137.5° golden divergence angle, the micro-turbulence columns 2 achieve extremely high area utilization and complementarity in space, avoiding the "straight-through effect" of fluid channels that is prone to occur in regular arrays. The total number N of the micro-turbulence columns is preferably set to 64 to 144. In this embodiment, when the total number N=100, the biomimetic array achieves the optimal dynamic balance between heat transfer efficiency and pressure drop.

[0040] Example 2

[0041] See Figure 4 This embodiment provides a parameterized construction method applicable to the aforementioned biomimetic spiral microchannel heat dissipation structure. Addressing the challenges of tedious manual arraying and difficult polar coordinate positioning in 3D modeling of topologies with complex mathematical patterns, this embodiment achieves automated construction through macro instruction scripts. The specific steps are as follows:

[0042] Step S1, Mathematical Logic Transformation and Node Coordinate Generation: Set the spiral scaling constant and a divergence angle of 137.5°, and establish a loop logic to traverse the index n of the micro-perturbation column. The program automatically calculates the polar coordinates of each node according to the polar coordinate formula and converts them into recognizable planar Cartesian coordinate matrix data. When the generated coordinates exceed the physical boundary of the hotspot region or the base, the program automatically removes the node.

[0043] Step S2, Geometric datum establishment and coordinate reference system creation: An extruded base feature with a thickness of 0.2 mm is created in the 3D modeling software. The geometric center of the hotspot region on the base is established as the global coordinate origin, creating a unified reference system.

[0044] Step S3, Macro-driven Automatic Solid Extrusion: A macro script containing program instructions is invoked, the coordinate matrix data generated in step S1 is read, and circular cross-sections with a diameter of 0.12 mm are automatically drawn in batches at the corresponding coordinate positions of the base features. The solid extrusion operation is then performed vertically downwards. It is particularly important to note that after executing the array macro command, to avoid the central feature entity generated at the origin of the polar coordinate system blocking the inflow core region and affecting the divergence of the overall spiral flow field, the automatic solid extrusion step also includes a feature correction process: without destroying the associated constraints of the entire sub-array, the central needle-wing feature located at the origin is selected and deleted individually, ultimately completing the efficient construction of the microchannel 3D solid model.

[0045] Example 3

[0046] To verify the beneficial effects of the biomimetic spiral microchannel heat dissipation structure proposed in this invention, this embodiment compares it with traditional regular channels through numerical simulation.

[0047] See Figure 5 and Figure 6 Under the same boundary conditions with extremely high input heat flux density, Figure 6 (a) in the text represents a traditional straight structure. Figure 6 (b) in the figure represents the biomimetic spiral structure of this invention; Figure 6The comparison of bottom surface temperature distribution shows that heat easily accumulates in the central region of traditional flat microchannels, while the biomimetic spiral structure of this invention effectively disperses the heat flow in the central region, significantly reducing the maximum temperature in the hot spot area. (See also...) Figure 7 , Figure 7 (a) in the diagram is the velocity contour plot of the internal cross section. Figure 7 (b) is the velocity vector distribution diagram of the internal cross section; the irregular physical obstruction continuously induces the fluid to generate complex secondary flows and vortices, which continuously destroys the heat transfer boundary layer from a physical mechanism, and significantly improves the convective heat transfer capacity.

[0048] This embodiment also performed parameter optimization on the number of micro-turbulence columns N within the range of 64 to 144. The results show that when N=100, the biomimetic array can achieve the optimal dynamic balance between heat transfer and pressure drop. See also... Figure 8 The performance comparison bar chart shows that, under the same high heat flux density boundary conditions, the highest temperature of a traditional straight microchannel reaches 580.4 K, while the optimal structure of this invention significantly suppresses it to 473.85 K, avoiding heat accumulation in the central region. Furthermore, considering overall pump power consumption, the system's overall heat transfer index for the traditional structure is a baseline value of 1.0, while the system's overall heat transfer index for this invention jumps dramatically to 1.24. This intuitively and fully demonstrates that the biomimetic topological arrangement of this invention can provide significantly superior heat dissipation capabilities and operational reliability compared to traditional regular channels under the same energy consumption.

[0049] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A biomimetic spiral microchannel heat dissipation structure, characterized in that, include: A substrate, wherein a plurality of microchannels are formed on the upper surface of the substrate; a fluid inlet region and a fluid outlet region are disposed on the substrate; And an array of micro-perturbation columns arranged on the substrate; The micro-perturbation column array comprises several needle-like structures extending upward from the substrate surface as micro-perturbation columns. These micro-perturbation columns are regularly distributed following a biomimetic spiral topology; the polar coordinates (r, θ) of their central node positions satisfy: , Where c is a proportionality constant and n is the sequence number of the micro-turbulence column.

2. The biomimetic spiral microchannel heat dissipation structure according to claim 1, characterized in that, The micro-turbulence columns in the micro-turbulence column array have a needle-wing structure with a diameter of 0.05~0.2mm, a height of 0.2~0.8mm, and a spacing of 0.1~0.3mm between adjacent needle wings.

3. The biomimetic spiral microchannel heat dissipation structure according to claim 1, characterized in that, The microchannels have a width of 0.05~0.25mm, a height of 0.1~0.5mm, and a spacing of 0.1~0.25mm.

4. The biomimetic spiral microchannel heat dissipation structure according to claim 1, characterized in that, The total number of micro-turbulence columns is 30 to 200.

5. The biomimetic spiral microchannel heat dissipation structure according to claim 1, characterized in that, The fluid inlet region is provided with an inlet flow divider cavity; the fluid outlet region is provided with an outlet flow collector cavity; along the flow direction of the cooling medium, the fluid inlet region, the inlet flow divider cavity, the micro-turbulence column array, the outlet flow collector cavity, and the fluid outlet region are sequentially connected; the inlet flow divider cavity gradually expands along the flow direction of the cooling medium, and the outlet flow collector cavity gradually contracts along the flow direction of the cooling medium.

6. The biomimetic spiral microchannel heat dissipation structure according to claim 1, characterized in that, The substrate is made of any one of silicon, silicon carbide, or copper-based materials; and a thermal interface material layer is provided at the bottom of the substrate, which is used to physically bond with the chip.

7. A method for constructing a biomimetic spiral microchannel heat dissipation structure as described in any one of claims 1 to 6, characterized in that, The construction method specifically includes the following steps: Step S1, Node coordinate sequence generation: Based on the mathematical laws of biomimetic spirals, according to the preset proportional constant and node arrangement number, the polar coordinate data of the center node of each micro-bumper column is calculated, and the polar coordinate data is converted into plane rectangular coordinate data; according to the arrangement range of the micro-bumper column array and the structural size of the micro-bumper column, the plane rectangular coordinate data is filtered for validity to obtain a valid node coordinate sequence; Step S2, Establishment of substrate and reference system: Based on the determined structural parameters, establish a three-dimensional model of substrate with a thickness of 0.01mm to 0.3mm, construct several microchannels, fluid inlet regions and fluid outlet regions on the upper surface of the substrate, and establish a reference system with the geometric center of the hot spot region as the global coordinate origin; Step S3, instruction-driven materialization: By executing the program macro instruction script, the coordinate data obtained in step S1 is read, and the two-dimensional cross-sectional features of the micro-turbulence column are automatically generated at the corresponding position of the substrate. A three-dimensional model of the substrate is established according to the determined structural parameters, and several microchannels, fluid inlet regions and fluid outlet regions are constructed on the upper surface of the substrate, thereby obtaining the biomimetic spiral microchannel heat dissipation structure.

8. The method for constructing a biomimetic spiral microchannel heat dissipation structure according to claim 7, characterized in that, In step S1, the Cartesian coordinate data is filtered for validity, specifically including: Boundary determination is performed on the micro-turbulence column cross-sectional profile corresponding to each center node. When the entire micro-turbulence column cross-sectional profile is located within the projection range of the hotspot region on the upper surface of the substrate, the corresponding center node is retained; when the micro-turbulence column cross-sectional profile at least partially exceeds the projection range, the corresponding center node is deleted. The distance between any two retained center nodes is judged. When the distance between the two center nodes is less than the sum of the cross-sectional size of the corresponding micro-bumper column and the preset minimum spacing, one of the center nodes is deleted according to the node arrangement order until the cross-sectional profiles of any adjacent micro-bumper columns do not overlap, thus obtaining the effective node coordinate sequence.

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