display module

Abstract

A display module includes a display panel, a first protective layer, a sensor, a control unit, a flexible circuit, a second protective layer, a high adhesion portion, and a low adhesion portion. The first protective layer is disposed on the display panel. The sensor is disposed on the display panel so as not to overlap the first protective layer in a plane. The control unit is disposed on the display panel and electrically connected to the display panel. The flexible circuit is connected to the sensor and the control unit. The second protective layer is disposed on the first protective layer and the sensor so as to cover the sensor. The high adhesion portion is disposed between the first protective layer and the second protective layer. The low adhesion portion is disposed between the second protective layer and the sensor. The low adhesion portion has an integral shape.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to and all benefits derived therefrom of Korean Patent Application No. 10-2025-0048698, filed on April 15, 2025, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates to display modules, and more specifically, to display modules that use a protective layer to secure the connection points of sensors and use adhesive portions removed during the manufacturing process to improve reliability. Background Technology

[0004] Typically, a display device may include a display panel and is manufactured using a modular process in which components for driving and sensors are attached. Because display panels are usually very thin, even small steps can affect their performance and lead to defects. Recently, various studies have been conducted to address these limitations. Summary of the Invention

[0005] This disclosure provides a display module with improved reliability.

[0006] Embodiments of the present invention provide a display module, the display module comprising: a display panel; a first protective layer; a sensor; a control unit; a flexible circuit; a second protective layer; a high adhesion portion; and a low adhesion portion.

[0007] In this implementation, the first protective layer is disposed on the display panel.

[0008] In this implementation, the sensor is positioned on the display panel so as not to overlap with the first protective layer in the plan view.

[0009] In this implementation, the control unit is mounted on the display panel and is electrically connected to the display panel.

[0010] In this implementation, the flexible circuit is connected to the sensor and the control unit.

[0011] In this implementation, a second protective layer is disposed on the first protective layer and the sensor to cover the sensor.

[0012] In this embodiment, the high-adhesion portion is disposed between the first protective layer and the second protective layer.

[0013] In this implementation, the low-adhesion portion is disposed between the second protective layer and the sensor.

[0014] In this implementation, the low-adhesion portion has an integral shape.

[0015] In an implementation, the first protective layer may include: a first sub-protective layer; and a second sub-protective layer.

[0016] In this implementation, the first sub-protective layer may be disposed on at least a portion of the display panel.

[0017] In this implementation, the second sub-protective layer may be disposed on another part of the display panel and at least a part of the first sub-protective layer.

[0018] In this implementation, the second sub-protective layer can cover the area of ​​the display panel corresponding to the driver integrated circuit (driver IC) in the plan view.

[0019] In an implementation, the display module may further include a buffer layer disposed on the second sub-protective layer.

[0020] In this implementation, the buffer layer can overlap with the area of ​​the display panel corresponding to the driver IC in the plan view.

[0021] In one embodiment, the high-adhesion portion may contact the second protective layer and at least one selected from the first and second sub-protective layers.

[0022] In an implementation, the high adhesion portion may include a first sub-adhesion portion and a second sub-adhesion portion spaced apart from each other.

[0023] In the implementation, the first sub-adhesive portion can contact the first sub-protective layer and the second protective layer.

[0024] In this implementation, the second sub-adhesive portion can contact the second sub-protective layer and the second protective layer.

[0025] In the implementation, the second sub-adhesive portion can contact the first sub-protective layer, the second sub-protective layer, and the second protective layer.

[0026] In this implementation, the first sub-adhesive portion can contact the first sub-protective layer and the second protective layer.

[0027] In one embodiment, the first sub-adhesive portion and the second sub-adhesive portion may be spaced apart from each other, and the sensor is located between the first sub-adhesive portion and the second sub-adhesive portion.

[0028] In this implementation, the high-adhesion portion can be disposed on the first protective layer and the second protective layer.

[0029] In this implementation, the high-adhesion portion can have an integral shape.

[0030] In this implementation, the sensor may be a fingerprint sensor.

[0031] In an implementation, the second protective layer may have a thickness greater than that of the first protective layer.

[0032] In an implementation, the second protective layer may have a thickness of about 100 micrometers (μm) or greater.

[0033] In this implementation, the low-adhesion portion can contact the sensor but not the display panel.

[0034] In an embodiment, the second protective layer may include at least one selected from polyethylene terephthalate (PET), polyethylene (PE), and polyimide (PI).

[0035] In this implementation, one end of the connector can be connected to the control unit.

[0036] In this implementation, the opposite ends of the connector can protrude from one side of the display panel.

[0037] In an embodiment of the present invention, the display module includes: a display panel; a first protective layer; a sensor; a control unit; a flexible circuit; a second protective layer; a high-adhesion portion; and a low-adhesion portion.

[0038] In this implementation, the first protective layer is disposed on the display panel.

[0039] In this implementation, the sensor is positioned on the display panel so as not to overlap with the first protective layer in the plan view.

[0040] In this implementation, the control unit is mounted on the display panel and is electrically connected to the display panel.

[0041] In this implementation, the flexible circuit is connected to the sensor and the control unit.

[0042] In this implementation, a second protective layer is disposed on the first protective layer and the sensor to cover the sensor.

[0043] In this embodiment, the high-adhesion portion is disposed between the first protective layer and the second protective layer.

[0044] In this implementation, the low-adhesion portion is disposed between the second protective layer and the sensor.

[0045] In this embodiment, the second protective layer has a thickness greater than that of the first protective layer.

[0046] In this implementation, the sensor may be a fingerprint sensor.

[0047] In this implementation, the low-adhesion portion can contact the sensor but not the display panel.

[0048] In an implementation, the second protective layer may have a thickness of about 100 μm or greater.

[0049] In an embodiment of the present invention, the display module includes: a display panel; a first sub-protective layer; a second sub-protective layer; a sensor; a second protective layer; a high adhesion portion; and a low adhesion portion.

[0050] In this implementation, the first sub-protective layer is disposed on at least a portion of the display panel.

[0051] In this implementation, the second sub-protective layer is disposed on another part of the display panel and at least a part of the first sub-protective layer.

[0052] In this implementation, the sensor is positioned on the display panel so as not to overlap with the first and second sub-protective layers on a plane.

[0053] In this implementation, a second protective layer is disposed on the first sub-protective layer, the second sub-protective layer, and the sensor to cover the sensor.

[0054] In this embodiment, the high-adhesion portion is disposed between the second protective layer and at least one selected from the first and second sub-protective layers.

[0055] In this implementation, the low-adhesion portion is disposed between the second protective layer and the sensor.

[0056] In this implementation, the low-adhesion portion has an integral shape.

[0057] In this implementation, the sensor may be a fingerprint sensor.

[0058] In this implementation, the second sub-protective layer can cover the area of ​​the display panel corresponding to the driver IC in the plan view. Attached Figure Description

[0059] The above and other features of the present invention will become more apparent from the description of embodiments of the invention in more detail with reference to the accompanying drawings, in which: Figure 1 This is a perspective view showing a display device according to an embodiment; Figure 2 This is a cross-sectional view showing the display panel according to an embodiment; Figure 3 This is a plan view showing the display module according to an embodiment; Figure 4It is along Figure 3 A sectional view taken by line I-I'; Figure 5 This is a plan view showing the display module according to an embodiment; Figure 6 This is a plan view showing the display module according to an embodiment; Figure 7 This is a plan view showing the display module according to an embodiment; Figure 8 This is a plan view showing the display module according to an embodiment; Figure 9 This is a block diagram illustrating an electronic device according to an embodiment; and Figure 10 This is a schematic diagram illustrating an electronic device according to various embodiments. Detailed Implementation

[0060] In the following description, the invention will be described more fully with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0061] It will be understood that when an element is referred to as "on" another element, it can be directly on the other element, or there can be an intervening element between them. Conversely, when an element is referred to as "directly on" another element, there is no intervening element. In this specification, it will be understood that when a component (or region, layer, part) is referred to as "connected to" or "attached to" another component, it can be directly connected / directly attached to / directly linked to the other component, or there may be an intervening third component.

[0062] The same reference numerals always denote the same elements. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of the components are exaggerated for clarity.

[0063] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0064] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to encompass different orientations of the device. For example, if a device in one of the drawings is flipped, an element described as being “down” to the other element will be oriented “up” to the other element. Thus, based on the specific orientation of the drawing, the term “down” can encompass both “down” and “up” orientations. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” the other element will be oriented “above” the other element. Thus, the term “below” or “under” can encompass both “up” and “down” orientations.

[0065] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a (a)”, “an (an)”, “the”, and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, a reference to “the” element following a reference to “a (an)” element in a claim includes one element and multiple elements. For example, “a single element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a (a)” or “an (an)”. “Or” means “and / or”. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms “comprises” and / or “comprising” or “includes” and / or “including” specify the presence of the said features, regions, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and / or groups thereof.

[0066] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include the value and mean within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the value.

[0067] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. Terms defined in common dictionaries shall be interpreted as having the same meaning as in the relevant technical context, and unless expressly defined in this specification, these terms shall not be idealized or over-interpreted as having a formal meaning.

[0068] Embodiments are described herein with reference to schematic cross-sectional views as idealized embodiments. Therefore, variations in the shape of the figures should be expected due to, for example, manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0069] In this specification, if the implementation can be carried out in different ways, specific process steps can be performed in an order different from the order described. For example, two consecutively described steps can be performed substantially simultaneously, or in the reverse order of the described order.

[0070] The first direction DR1, the second direction DR2, and the third direction DR3 can be defined. The first direction DR1 and the second direction DR2 can intersect each other, and the first direction DR1 and the second direction DR2 are... Figure 1 The direction defined on the plane of the display device DD shown. The third direction DR3 can be in... Figure 1 The thickness direction of the display device DD is defined in the middle.

[0071] In this specification, the expressions "in a plane" or "in a plan view" can indicate the direction of view from a third party toward DR3, i.e., the direction of view from the top to the bottom of the component. Furthermore, descriptions based on specific directions in this specification may include not only the directions shown in the accompanying drawings, but also directions opposite to those shown in the drawings.

[0072] In the following description, embodiments of the invention will be illustrated with reference to the accompanying drawings. Identical or corresponding components are indicated by the same reference numerals, and redundant descriptions thereof will be omitted.

[0073] Figure 1 This is a perspective view showing a display device according to an embodiment.

[0074] refer to Figure 1According to the embodiments, the display device DD may include a display area DA and a non-display area NDA disposed on at least one side of the display area DA.

[0075] The display area DA is the portion on which the image is displayed, and multiple pixels PX can be set within the display area DA. Although in Figure 1 The illustration shows an embodiment where the display area DA has a rectangular shape with rounded corners, but the embodiments of the present invention are not limited thereto. In the embodiments, for example, the display area DA may have various shapes, such as circular shapes, elliptical shapes, polygonal shapes, or specific graphic shapes.

[0076] The sensing area FA can be defined on one side of the display area DA. The sensing area FA can be an area used to sense fingerprint information from the user's finger FNG. The sensing area FA can be an area corresponding to the sensor FS, which will be described later.

[0077] Various lines for transmitting electrical signals applied to the display area DA can be set in the non-display area NDA.

[0078] In the following description, an organic light-emitting display device will be used as an example of a display device DD according to an embodiment of the present invention. However, the embodiments of the present invention are not limited thereto. In another embodiment, the display device DD according to an embodiment of the present invention may be an inorganic light-emitting display device or a quantum dot light-emitting display device. In an embodiment, for example, the light-emitting layer of the display element of the display device DD may include organic materials, inorganic materials, quantum dots, both organic materials and quantum dots, or both inorganic materials and quantum dots.

[0079] Figure 2 This is a cross-sectional view showing the display panel according to an embodiment.

[0080] According to an embodiment, the display panel DP may include a cover panel CP, a substrate SS, a circuit layer CL, a display layer DL, and a packaging layer EN.

[0081] A cover panel CP can be disposed at the lower end (lower surface) of the display panel DP. The cover panel CP can protect the display panel DP from external impacts or reduce the impact of heat on the display panel DP. In embodiments, for example, the cover panel CP may include at least one selected from sponge, plastic panel, metal panel, and heat dissipation film.

[0082] The substrate SS may comprise at least one material selected from a variety of materials such as glass, metal, or plastic, or may be made of at least one material selected from a variety of materials such as glass, metal, or plastic. In embodiments, the substrate SS may be a flexible substrate. In embodiments, for example, the substrate SS may comprise a polymer resin such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP).

[0083] The circuit layer CL can be disposed on the substrate SS. The circuit layer CL may include a transistor (not shown) and an insulating layer (not shown), which applies electrical signals to the light-emitting elements (not shown) of the display layer DL.

[0084] Each includes a light-emitting element with at least one light-emitting layer and a pixel PX for distinguishing pixels (reference). Figure 1 The pixel-limiting layer can be set in the display layer DL.

[0085] An encapsulation layer EN can be disposed on the display layer DL. The encapsulation layer EN may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The encapsulation layer EN can protect the display layer DL from external moisture or contaminants.

[0086] According to an embodiment, the display module DM may include a display panel DP and a module layer ML. The module layer ML may be disposed on the display panel DP, and more specifically, on a cover panel CP, which is disposed on the rear surface of the display panel DP. Detailed features of the module layer ML will be described later.

[0087] Figure 3 This is a plan view showing the display module according to an embodiment. Figure 4 It is along Figure 3 A sectional view taken by line I-I'.

[0088] refer to Figure 3 and Figure 4 According to the embodiments, the display module DM may include a display panel DP and a module layer ML. The module layer ML may include a first protective layer PL1, a sensor FS, a control unit CM, a flexible circuit FC, a second protective layer PL2, a low-adhesion portion SC, a high-adhesion portion HC, and a connector CN.

[0089] In embodiments of the present invention, it can be understood that the display module DM includes a display panel DP and a module layer ML. By removing the first protective layer PL1, the second protective layer PL2, the low-adhesion portion SC, the high-adhesion portion HC, and the connector CN from the display module DM, and then connecting other components to the display module DM, a display device DD (see reference) can be formed. Figure 1 As components of the temporary protection sensor FS and display panel DP, or components that are temporarily attached, the first protective layer PL1, the second protective layer PL2, the low-adhesion portion SC, the high-adhesion portion HC, and the connector CN may not be included in the display device DD (see reference). Figure 1 )middle.

[0090] The first protective layer PL1 can be disposed on the display panel DP to cover a portion of the display panel DP. The first protective layer PL1 may include a first sub-protective layer PL1-1 and a second sub-protective layer PL1-2.

[0091] The first sub-protective layer PL1-1 may be disposed on at least a portion of the display panel DP to cover a portion of the display panel DP. The first sub-protective layer PL1-1 may be attached to the display panel DP to protect a portion of the display panel DP from foreign objects or external impacts. The first sub-protective layer PL1-1 may be used in the manufacture of the display device DD (reference). Figure 1 Components removed from the display panel DP during the process.

[0092] The second sub-protective layer PL1-2 can be disposed on a portion of the display panel DP that is different from the portion on which the first sub-protective layer PL1-1 is disposed, as well as on at least a portion of the first sub-protective layer PL1-1. The second sub-protective layer PL1-2 can be attached to the first sub-protective layer PL1-1 and a portion of the display panel DP. The second sub-protective layer PL1-2 can protect a portion of the display panel DP from foreign objects or external impacts.

[0093] In an implementation, the second sub-protective layer PL1-2 may cover the area of ​​the display panel DP corresponding to the driver integrated circuit (driver IC) (not shown).

[0094] The display module DM according to the embodiment may further include a buffer layer PL3 disposed on the second sub-protective layer PL1-2. The buffer layer PL3 may overlap with the area corresponding to the driver IC (not shown) in a plane (in a plan view or on a third-direction DR3) to protect components disposed below the buffer layer PL3 (such as the driver IC (not shown)) from external impacts.

[0095] In an implementation, the second sub-protective layer PL1-2 may be used in the manufacture of the display device DD (reference). Figure 1The components removed from the display panel DP during the process, together with the first sub-protective layer PL1-1.

[0096] The sensor FS can be disposed on the display panel DP and can be non-overlapping with the first protective layer PL1. The sensor FS can be a fingerprint sensor disposed in the sensing area FA (reference) of the display device DD. Figure 1 The system detects the user's fingerprint information at the corresponding location.

[0097] In an implementation, the cover panel CP may include a mounting slot SG.

[0098] The sensor FS can be installed in the mounting slot SG of the display panel DP.

[0099] The control unit CM can be electrically connected to the sensor FS via a flexible circuit FC to receive the user's fingerprint information from the sensor FS. In one embodiment, the control unit CM may include a main circuit board for controlling the drive of the display panel DP, and a connector CN, described later, can be connected to the control unit CM. The control unit CM may be disposed on and electrically connected to the display panel DP.

[0100] A second protective layer PL2 can be disposed on the first protective layer PL1 and the sensor FS. The second protective layer PL2 can protect the sensor FS from foreign objects or external impacts. Furthermore, the second protective layer PL2 can be attached to the first protective layer PL1 via a high-adhesion portion HC to fix its position, and temporarily attached to the sensor FS via a low-adhesion portion SC to fix the position of the sensor FS. Its detailed features will be described later.

[0101] According to an embodiment, the second protective layer PL2 may include at least one selected from polyethylene terephthalate (PET), polyethylene (PE), and polyimide (PI).

[0102] In this implementation, the second protective layer PL2 can cover the sensor FS.

[0103] In an implementation, the second protective layer PL2 may be used in the manufacture of the display device DD (reference). Figure 1 The components removed from the display panel DP along with the first protective layer PL1 during the process.

[0104] The high-adhesion portion HC can be disposed between the first protective layer PL1 and the second protective layer PL2. The second protective layer PL2 can be connected to the first protective layer PL1 through the high-adhesion portion HC to be fixed in position.

[0105] The low-adhesion portion SC can be disposed between the sensor FS and the second protective layer PL2. (Refer to the section on manufacturing display devices DD). Figure 1 During the manufacturing process, the sensor FS can be attached to the second protective layer PL2 to connect to the cover panel CP of the display panel DP. That is, the sensor FS and the second protective layer PL2 can be temporarily connected to each other with low strength via the low-adhesion portion SC. Here, since the second protective layer PL2 is fixed in position by the first protective layer PL1 and the high-adhesion portion HC, the sensor FS connected to the second protective layer PL2 can also be fixed in position. The low-adhesion portion SC and the second protective layer PL2 can be components that are removed after the sensor FS is permanently connected to the cover panel CP. Therefore, the display device DD (reference) according to an embodiment of the present invention... Figure 1 ) It may not include components used for temporary connection to the sensor FS.

[0106] In embodiments of the invention, the low-adhesion portion SC and the high-adhesion portion HC can be used to temporarily fix the position of the sensor FS before performing a curing process for permanently connecting the display panel DP and the sensor FS. According to an embodiment, the sensor FS can be an ultrasonic sensor, and an autoclave process for removing the air gap between the sensor FS and the display panel DP can be performed before the curing process. Therefore, in a process performed before the curing process (such as an autoclave process), the low-adhesion portion SC and the high-adhesion portion HC can be used to temporarily fix the position of the sensor FS.

[0107] In the display device according to the comparative example, adhesive portions are disposed at each corner of the sensor above the sensor and the cover panel to fix the sensor's position. Subsequently, the adhesive portions are cured by ultraviolet light, and the sensor is temporarily attached to the cover panel, thus fixing the sensor's position. In the display device according to the comparative example, the adhesive portions used for temporary attachment remain on the sensor, and the thickness of the adhesive portions causes various undesirable effects on the display device. For example, design margins such as the thickness of the sensor or the depth of the mounting groove are reduced by the thickness of the adhesive portions. Furthermore, due to the thickness of the adhesive portions, direct or indirect pressure is applied to components overlapping the sensor on the plane, reducing the reliability of the display device.

[0108] According to the embodiment, the high-adhesion portion HC can be disposed between the first protective layer PL1 and the second protective layer PL2. The high-adhesion portion HC can strongly connect the first protective layer PL1 and the second protective layer PL2 with high strength for fixation.

[0109] According to an embodiment of the present invention, the sensor FS can be temporarily connected to the second protective layer PL2 via the low-adhesion portion SC for temporary positioning, and the second protective layer PL2 can be connected to the first protective layer PL1 via the high-adhesion portion HC for fixed positioning. Thereafter, the first protective layer PL1, the second protective layer PL2, the low-adhesion portion SC, and the high-adhesion portion HC can be used in the manufacture of the display device DD (reference). Figure 1 The process of removing the DD (reference) is carried out during the process, and the display device DD (reference) is removed. Figure 1 It can have improved reliability.

[0110] According to the implementation method, the low-adhesion portion SC can have a monolithic shape or a monolithic terrain that forms an indivisible part of a single whole.

[0111] In an implementation, the second protective layer PL2 may have a thickness greater than that of the first protective layer PL1 (or the overall thickness).

[0112] According to the implementation, the second protective layer PL2 may have a thickness of about 100 micrometers (μm) or greater to stably fix the position of the sensor FS that is not permanently connected.

[0113] According to an embodiment, the high adhesion portion HC may include a first sub-adhesion portion HC1 and a second sub-adhesion portion HC2 spaced apart from each other.

[0114] like Figure 3 As shown, the first sub-adhesive portion HC1 can contact the first sub-protective layer PL1-1 of the first protective layer PL1, and the second sub-adhesive portion HC2 can contact the second sub-protective layer PL1-2 of the first protective layer PL1. However, embodiments of the present invention are not limited thereto. In embodiments, for example, the first sub-adhesive portion HC1 and the second sub-adhesive portion HC2 can contact at least one selected from the first sub-protective layer PL1-1 and the second sub-protective layer PL1-2 based on their positions. Detailed features will be described later.

[0115] Connector CN can be disposed on the control unit CM and the first protective layer PL1. Connector CN may have one end connected to the control unit CM and an opposite end protruding from one side of the display panel DP. Connector CN can electrically connect the display panel DP to an external test device (not shown). Connector CN can be used in test processes to check the operation of the display panel DP.

[0116] Figure 5 This is a plan view showing the display module according to an embodiment.

[0117] refer to Figure 5According to the embodiment, the display module DM1 may include a second protective layer PL2a and a high-adhesion portion HCa. The high-adhesion portion HCa may include a first sub-adhesion portion HC1a and a second sub-adhesion portion HC2a. The second protective layer PL2a may extend in the second direction DR2 to overlap with the first sub-protective layer PL1-1 and the second sub-protective layer PL1-2. The second sub-adhesion portion HC2a may be disposed between the first sub-protective layer PL1-1 and the second protective layer PL2a to connect the first sub-protective layer PL1-1 and the second protective layer PL2a to each other. The sensor FS may be temporarily connected to the second protective layer PL2a through the low-adhesion portion SC to be temporarily fixed in position, and the second protective layer PL2a may be connected to the first protective layer PL1a through the high-adhesion portion HCa to be fixed in position.

[0118] Figure 6 This is a plan view showing the display module according to an embodiment.

[0119] refer to Figure 6 According to the embodiment, the display module DM2 may include a second protective layer PL2b and a high-adhesion portion HCb. The high-adhesion portion HCb may include a first sub-adhesion portion HC1b and a second sub-adhesion portion HC2b. The second protective layer PL2b may extend in the second direction DR2 to overlap with the first sub-protective layer PL1-1 and the second sub-protective layer PL1-2. The second sub-adhesion portion HC2b may extend from a portion of the first sub-protective layer PL1-1 to the second sub-protective layer PL1-2 to overlap with the first sub-protective layer PL1-1 and the second sub-protective layer PL1-2 in a plane. The sensor FS may be temporarily connected to the second protective layer PL2b through the low-adhesion portion SC to be temporarily fixed in position, and the second protective layer PL2b may be connected to the first protective layer PL1 through the high-adhesion portion HCb to be fixed in position.

[0120] Figure 7 This is a plan view showing the display module according to an embodiment.

[0121] refer to Figure 7According to the embodiment, the display module DM3 may include a second protective layer PL2c and a high-adhesion portion HCc. The high-adhesion portion HCc may include a first sub-adhesion portion HC1c and a second sub-adhesion portion HC2c. The second protective layer PL2c may extend in a first direction DR1. The first sub-adhesion portion HC1c and the second sub-adhesion portion HC2c may be spaced apart from each other, and the sensor FS is located between the first sub-adhesion portion HC1c and the second sub-adhesion portion HC2c. The first sub-adhesion portion HC1c may be disposed between the first sub-protective layer PL1-1 and the second protective layer PL2c, and the second sub-adhesion portion HC2c may be disposed between the second sub-protective layer PL1-2 and the second protective layer PL2c. The sensor FS may be temporarily connected to the second protective layer PL2c through the low-adhesion portion SC for temporary fixation, and the second protective layer PL2c may be connected to the first protective layer PL1 through the high-adhesion portion HCc for fixation.

[0122] Figure 8 This is a plan view showing the display module according to an embodiment.

[0123] refer to Figure 8 According to the embodiment, the display module DM4 may include a second protective layer PL2d and a high-adhesion portion HCd. The high-adhesion portion HCd may be integrally formed as a single, indivisible part to contact the first sub-protective layer PL1-1, the second sub-protective layer PL1-2, and the second protective layer PL2d. The sensor FS may be temporarily connected to the second protective layer PL2d via the low-adhesion portion SC for temporary positioning, and the second protective layer PL2d may be connected to the first protective layer PL1 via the high-adhesion portion HCd for fixed positioning.

[0124] According to the reference Figures 5 to 8 In the described embodiment, the sensor can be temporarily attached to the second protective layer via a low-adhesion portion for temporary positioning, and the second protective layer can be attached to the first protective layer via a high-adhesion portion for positioning. Subsequently, the first protective layer, the second protective layer, the low-adhesion portion, and the high-adhesion portion can be removed during the manufacturing process of the display device, and the display device can have improved reliability. Therefore, referring to... Figures 5 to 8 The described implementation methods may have the same characteristics as those in the reference. Figure 3 The described display module has the same effect, but with greater design flexibility and various shapes.

[0125] The display device according to embodiments of the present invention can be applied to various electronic devices. The electronic device according to the embodiments may include the above-described display device, and may also include modules or devices with additional functions.

[0126] Figure 9 This is a block diagram illustrating an electronic device according to an embodiment. (Reference) Figure 9 The electronic device 10 according to the embodiment may include a display device 11, a processor 12, a memory 13 and a power module 14.

[0127] The processor 12 may include at least one selected from a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), or a controller.

[0128] The memory 13 can store data information for the operation of the processor 12 or the display device 11. When the processor 12 runs the application stored in the memory 13, image data signals and / or input control signals can be transmitted to the display device 11, and the display device 11 can process the received signals to output image information through the display screen.

[0129] The power module 14 may include a power supply module such as a power adapter or battery device and a power conversion module that converts the power supplied by the power supply module to generate power for the operation of the electronic device 10.

[0130] At least one of the aforementioned components of the electronic device 10 may be included in the display device according to the above embodiment. Furthermore, some of the individual modules functionally included in a single module may be included in the display device, and others of the individual modules may be provided separately from the display device.

[0131] Figure 10 This is a schematic diagram illustrating an electronic device according to various embodiments.

[0132] refer to Figure 10 Various electronic devices 10 that utilize the display device according to the embodiments may include image display electronic devices (such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, televisions (TVs) 10_1d, and desktop monitors 10_1e), wearable electronic devices including display modules (such as smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c), and vehicle electronic devices 10_3 (such as vehicle dashboards, center trim panels, central information displays (CIDs) mounted on the dashboard, and rearview mirror displays).

[0133] According to embodiments of the present invention, since no residual material remains on the sensor after it is attached to the display panel, a display module and electronic device with improved reliability can be provided.

[0134] This invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0135] Although the invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made in the invention without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. A display module, comprising: Display panel; A first protective layer is disposed on the display panel; The sensor is mounted on the display panel so as not to overlap with the first protective layer in a plan view; A control unit is disposed on the display panel and electrically connected to the display panel; A flexible circuit is connected to the sensor and the control unit; A second protective layer is disposed on the first protective layer and the sensor to cover the sensor; The high-adhesion portion is disposed between the first protective layer and the second protective layer; as well as A low-adhesion portion is disposed between the second protective layer and the sensor; The low-adhesion portion has an integral shape.

2. The display module according to claim 1, wherein, The first protective layer includes: A first sub-protective layer is disposed on at least a portion of the display panel; and A second sub-protective layer is disposed on another portion of the display panel and at least a portion of the first sub-protective layer. The second sub-protective layer covers the area of ​​the display panel corresponding to the driver integrated circuit in the plan view.

3. The display module according to claim 2 further includes a buffer layer disposed on the second sub-protective layer. in, The buffer layer overlaps with the area of ​​the display panel corresponding to the driver integrated circuit in the plan view.

4. The display module according to claim 2, wherein, The high-adhesion portion contacts the second protective layer and at least one selected from the first sub-protective layer and the second sub-protective layer.

5. The display module according to claim 1, wherein, The high adhesion portion includes a first sub-adhesion portion and a second sub-adhesion portion that are spaced apart from each other.

6. The display module according to claim 5, wherein, The first sub-adhesive portion contacts the first sub-protective layer and the second protective layer, and The second sub-adhesive portion contacts the second sub-protective layer and the second protective layer.

7. The display module according to claim 5, wherein, The second sub-adhesive portion contacts the first sub-protective layer, the second sub-protective layer, and the second protective layer, and The first sub-adhesive portion contacts the first sub-protective layer and the second protective layer.

8. The display module according to claim 5, wherein, The first sub-adhesive portion and the second sub-adhesive portion are spaced apart from each other, and the sensor is located between the first sub-adhesive portion and the second sub-adhesive portion.

9. The display module according to claim 1, wherein, The high-adhesion portion is disposed on the first protective layer and the second protective layer, and The high-adhesion portion has a one-piece shape.

10. The display module according to claim 1, wherein, The sensor is a fingerprint sensor.

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