Peeling apparatus and peeling method using the same

Abstract

The present disclosure provides a peeling apparatus and a peeling method using the same. The peeling apparatus includes a housing accommodating a first roller and a second roller, and a peeling structure connected to the housing. The peeling structure includes a connecting portion connected to a protruding portion of the housing, and a cylindrical body rotatably connected to the connecting portion, and the connecting portion includes an elastic body having a length varied according to linear motion of the cylindrical body.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0049361, filed on April 16, 2025, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a stripping device and a stripping method using the stripping device. Background Technology

[0003] Multilayer electronic components, such as multilayer ceramic capacitors (MLCCs), can be manufactured by stacking and pressing dielectric sheets and internal electrode sheets to form a laminate, and then cutting the laminate to the design size.

[0004] During such a cutting process, mechanical stress may be applied to the laminate, which may cause cracks or delamination between the laminated dielectric sheet and the inner electrode sheet.

[0005] When cutting laminates, a protective film, such as a carrier film, can be attached to the laminate. The protective film prevents cracks or delamination between the dielectric sheet and the inner electrode sheet, enabling precise cutting and preventing contamination of the cut laminate due to contaminants or static electricity generated during cutting.

[0006] After the laminate is cut and the laminate strips are formed, a process can be performed to remove a protective film, such as a carrier film, for subsequent processes such as forming or sintering external electrodes. In related technologies, a triangular prism structure with an interior angle of approximately 30 degrees has been used to remove the protective film. However, such a structure may increase the stress applied to the laminate strip when peeling the protective film from it, leading to A / C delamination (i.e., delamination between the capacitor forming portion and the cover portion) or peeling of the cover portion in the MLCC.

[0007] Therefore, there is a need for an improved stripping device and a stripping method using the stripping device, which can minimize the stress applied to the laminate when removing a protective film such as a carrier film. Summary of the Invention

[0008] One aspect of this disclosure is to minimize the stress applied to the laminates when removing a protective film, such as a carrier film.

[0009] However, the aspects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0010] According to one aspect of this disclosure, a stripping device is provided, the stripping device comprising: a housing housing a first roller and a second roller; and a stripping structure connected to the housing. The stripping structure may include: a connecting portion a protruding portion connected to the housing; and a cylinder rotatably connected to the connecting portion, and the connecting portion may include an elastomer whose length varies with linear movement of the cylinder.

[0011] According to another aspect of this disclosure, a peeling method using a peeling device is provided, the peeling method peeling a film substrate attached to a laminate, and the peeling method comprising: applying pressure to the film substrate using the peeling device including a cylinder. The peeling device may include: a housing housing a first roller and a second roller; and a peeling structure connected to the housing. The peeling structure may include: a connecting portion a protrusion connected to the housing; and the cylinder rotatably connected to the connecting portion, and the connecting portion may include an elastomer whose length varies with linear movement of the cylinder.

[0012] According to an example embodiment of this disclosure, when a protective film, such as a carrier film, is removed, the stress applied to the laminate can be minimized.

[0013] However, the various advantages and effects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure. Attached Figure Description

[0014] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic 3D diagram of a multilayer ceramic capacitor (MLCC); Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I'; Figure 3 It is along Figure 1 A cross-sectional view taken from line II-II'; Figure 4 It is a schematic plan view of the operation of stacking dielectric sheets and internal electrode patterns to form a laminate; Figure 5 It is a schematic three-dimensional diagram illustrating the operation of cutting a laminated body; Figure 6 It is a 3D diagram of the stripping equipment based on relevant technologies; Figure 7 When peeling the carrier film using a peeling device based on relevant technology, along Figure 6 A schematic plan view from direction P1; Figure 8 This is a schematic perspective view of a stripping device according to an exemplary embodiment of the present disclosure; Figure 9 When performing the peeling of the carrier film using the peeling apparatus according to an example embodiment of the present disclosure, along Figure 8 A schematic plan view from direction P1; Figure 10A These images were obtained by photographing a carrier film peeled from a laminated strip using a peeling device based on relevant technology. Figure 10B Images are obtained by capturing images of a carrier film being peeled from a laminate using a peeling device according to an exemplary embodiment of this disclosure; and Figure 11A and Figure 11B Both are graphs showing the results of measuring the peel strength when peeling a carrier film is performed using a peeling device according to the related art and when peeling a carrier film is performed using a peeling device according to an example embodiment of the present disclosure. Detailed Implementation

[0015] In the following description, exemplary embodiments of the present disclosure are illustrated with reference to the accompanying drawings. However, the present disclosure may be exemplified in many different forms and should not be construed as being limited to the specific exemplary embodiments set forth herein. Additionally, exemplary embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements denoted by the same reference numerals in the drawings may be the same elements.

[0016] To clearly illustrate this disclosure, parts irrelevant to the description have been omitted, and dimensions (such as thickness) have been enlarged to clearly indicate layers and regions. Throughout the specification, similar parts having the same function within the same area are indicated by similar reference numerals. Throughout the specification, unless otherwise expressly stated, when an element is defined as "including" or "comprising," it means that it may also include other elements, rather than excluding them. In the drawings, the X direction may refer to a first direction, the Y direction may refer to a second direction, and the Z direction may refer to a third direction.

[0017] Figure 1 This is a schematic 3D diagram of a multilayer ceramic capacitor (MLCC).

[0018] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0019] Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0020] Figure 4It is a schematic plan view of the operation of stacking dielectric sheets and internal electrode patterns to form a laminate.

[0021] Figure 5 It is a schematic three-dimensional diagram illustrating the operation of cutting a multilayered body.

[0022] Before describing the stripping apparatus and stripping method using the stripping apparatus according to exemplary embodiments of the present disclosure, a method for manufacturing MLCCs will be described below, MLCCs being an example of multilayer electronic components to which the stripping apparatus and stripping method can be applied.

[0023] However, the stripping apparatus and stripping method using the exemplary embodiments of this disclosure can be applied not only to the methods for manufacturing MLCCs described below, but also to the processes for stripping film substrates (or protective films such as carrier films) in semiconductor manufacturing processes, display panel manufacturing processes, solar panel manufacturing processes, multilayer inductor manufacturing processes, and multilayer rheostat manufacturing processes.

[0024] The MLCC 100 according to an example embodiment may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122; and outer electrodes 130 and 140 disposed on the body 110.

[0025] Reference Figure 2 The main body 110 may include: a dielectric layer 111, including dielectric grains; and inner electrodes 121 and 122, wherein the dielectric layer 111 and the inner electrodes 121 and 122 are stacked in the capacitor forming portion Ac of the main body 110 to form a capacitor. The main body 110 may include a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 to the fourth surface 4 and opposite to each other in a third direction.

[0026] In the body 110, the dielectric layer 111 and the internal electrodes 121 and 122 may be stacked alternately.

[0027] The capacitor forming section Ac can be a region that includes a first inner electrode 121 and a second inner electrode 122 that are positioned opposite each other, with a dielectric layer 111 between the first inner electrode 121 and the second inner electrode 122 to form a capacitor.

[0028] The dielectric layers 111 included in the body 110 may be configured as multiple dielectric layers 111 and may be in a sintered state. Adjacent dielectric layers 111 may be integrated with each other, making it difficult to distinguish the boundaries between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0029] The dielectric layer 111 may be formed by preparing a dielectric slurry including ceramic powder particles, preparing a dielectric sheet using the dielectric slurry, and then stacking and sintering the dielectric sheet. As the material of the ceramic powder particles, barium titanate (BaTiO3)-based powder particles may be used. More specifically, the barium titanate (BaTiO3)-based powder particles may include BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) and Ba(Ti 1-y Zr y )O3 (0<y<1) of one or more.

[0030] Referring to Figure 2 , the internal electrodes 121 and 122 may be alternately stacked with the dielectric layer 111.

[0031] That is, referring to Figure 2 , the first internal electrode 121 may be connected to the first external electrode 130 without being connected to the second external electrode 140, and the second internal electrode 122 may be connected to the second external electrode 140 without being connected to the first external electrode 130. In this case, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0032] The material included in the internal electrodes 121 and 122 is not limited, and a material having excellent conductivity may be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0033] Referring to Figure 2 and Figure 3 , the main body 110 may include covering portions 112 and 113 disposed on two surfaces of the capacitance forming portion Ac in the first direction.

[0034] Specifically, the main body 110 may include a first covering portion 112 and a second covering portion 113, the first covering portion 112 being disposed on one surface of the capacitance forming portion Ac in the first direction, and the second covering portion 113 being disposed on the other surface of the capacitance forming portion Ac in the first direction. More specifically, the first covering portion 112 may be disposed on an upper portion of the capacitance forming portion Ac in the first direction, and the second covering portion 113 may be disposed on a lower portion of the capacitance forming portion Ac in the first direction.

[0035] The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the first direction, respectively, and may be used to substantially prevent damage to the inner electrodes 121 and 122 caused by physical stress and / or chemical stress.

[0036] The upper cover 112 and the lower cover 113 do not include the inner electrodes 121 and 122, and may include the same material as the dielectric layer 111. That is, the upper cover 112 and the lower cover 113 may include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0037] Reference Figure 3 Edge portions 114 and 115 may be respectively disposed on two surfaces of the capacitor forming portion Ac in the third direction.

[0038] More specifically, edge portions 114 and 115 may include a first edge portion 114 disposed on one surface of the capacitor forming portion Ac in the third direction and a second edge portion 115 disposed on another surface of the capacitor forming portion Ac in the third direction. In other words, edge portions 114 and 115 may be formed on two surfaces of the body 110 in the third direction (i.e., the fifth surface and the sixth surface), respectively.

[0039] like Figure 3 As shown, the edges 114 and 115 may refer to the following regions: based on the cross-section of the body 110 in the first direction and the third direction, the regions located between the two ends of the first inner electrode 121 and the second inner electrode 122 in the third direction and the outer surface of the body 110.

[0040] Edges 114 and 115 can be used to prevent damage to the inner electrodes 121 and 122 caused by physical stress and / or chemical stress.

[0041] To suppress the step portion caused by the inner electrodes 121 and 122, the edge portions 114 and 115 can be formed by: applying conductive paste to the portion of the ceramic green sheet except for the portion on which the edge portions 114 and 115 will be formed to form the inner electrodes 121 and 122; stacking the ceramic green sheet on which the inner electrodes 121 and 122 are formed to obtain a laminate; cutting the laminate to expose the inner electrodes 121 and 122 to the two third-direction surfaces of the capacitor forming portion Ac; and then stacking a single dielectric layer or two or more dielectric layers on the two third-direction surfaces of the capacitor forming portion Ac.

[0042] The first edge portion 114 and the second edge portion 115 do not include the inner electrodes 121 and 122, and may include the same material as the dielectric layer 111. That is, the first edge portion 114 and the second edge portion 115 may include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0043] Reference Figure 1 External electrodes 130 and 140 may be disposed on the main body 110. External electrodes 130 and 140 may be formed using any conductive material (such as metal), and the specific material may be determined taking into account electrical properties, structural stability, etc. Furthermore, external electrodes 130 and 140 may have a multilayer structure.

[0044] For example, the external electrodes 130 and 140 may include electrode layers 131 and 141 disposed on the body 110 and plating layers 132 and 142 disposed on the electrode layers 131 and 141.

[0045] Reference Figure 4 and Figure 5 The method of manufacturing MLCC 100 may include stacking and pressing dielectric sheets 211 on which internal electrode patterns 221 and 222 are disposed to form a laminate 220.

[0046] Reference Figure 5 After forming the laminate 220, the operation of cutting the laminate 220 to form the laminate strip 210 can be performed. (See reference...) Figure 5 The carrier film 10 can be attached to one surface of the laminate 220. Therefore, even when the laminate 220 is cut along lines C1-C1 and C2-C2, cracks or delamination between the laminated dielectric sheet and the inner electrode sheet can be suppressed.

[0047] The formed laminate 210 can be subjected to a process to remove the carrier film 10 in order to perform subsequent processes such as sintering or forming an external electrode.

[0048] Figure 6 It is a 3D diagram of the stripping equipment based on relevant technologies.

[0049] Figure 7 When peeling the carrier film using a peeling device based on relevant technology, along Figure 6 A schematic plan view observed from direction P1.

[0050] Reference Figure 6According to the related art, the peeling device 300 may include: housings 321 and 322, housing a first roller 331 and a second roller 332 spaced apart from each other; and a peeling structure 340, connected to a protrusion 321a of the housing. In this case, the peeling structure 340 according to the related art may include a peeling body 341 having a triangular prism shape. The peeling device 300 according to the related art may include a support portion 310 that can be connected to an external facility or device, and the peeling structure 340 may include a connecting portion 342 that connects the peeling body 341 to the protrusion 321a of the housing.

[0051] Reference Figure 7 The carrier film 10 attached to the laminate 210 can be peeled off according to the pressure applied by the peeling body 341 of the peeling structure 340, and the carrier film 10 peeled off by the pressure applied by the peeling body 341 can be wound onto the third roller 11 when the first roller 331 and the second roller 332 rotate in opposite directions. Figure 7 In order to facilitate observation of the internal structure of the stripping device 300, the housing 322 is omitted.

[0052] Reference Figure 7 The method of peeling the carrier film 10 from the lamination strip 210 using the peeling device 300 in the related art may involve applying pressure directly to the carrier film 10 using the triangular prism-shaped peeling body 341 of the peeling structure 340. In this case, one edge of the triangular prism peeling the carrier film 10 from the lamination strip 210 has a small radius of curvature of 0.5 mm to 1.0 mm, which may increase the peeling angle of the carrier film 10 from the lamination strip 210, thereby increasing the peeling force of the carrier film 10. When the peeling force of the carrier film 10 increases, the stress applied to the surface of the lamination strip 210 may also increase. When the lamination strip 210 undergoes subsequent processes to form the MLCC 100, the increase in surface stress of the lamination strip 210 may cause A / C delamination in the MLCC 100 or cause the peeling of the caps 112 and 113 of the MLCC 100.

[0053] Reference Figure 7 The peeling structure 340 may be connected to a protrusion 321a of one of the housings 321 and 322, such that the peeling angle of the carrier film 10 may be different for each location, and the vertical distance (or vertical gap, vertical interval) between the carrier film 10 and the peeling structure 340 may also be different for each location. Furthermore, the connection structure (e.g., connection portion 342) connecting the peeling structure 340 to the protrusion 321a of one of the housings 321 and 322 may sag due to the weight of the peeling structure 340 itself, thereby increasing the vertical distance (or vertical gap, vertical interval) between the carrier film 10 and the peeling structure 340 and causing an increase in the peeling angle of the carrier film 10.

[0054] To minimize the stress applied to the laminate 210, it is desirable for the peel angle of the carrier film 10 to be close to 0°. However, due to the structure of the peeling device that requires applying pressure to specific areas of the carrier film 10, it may not be possible to maintain a 0° peel angle while performing peeling. Therefore, there is a need for an improved peeling device and peeling method that can minimize the stress applied to the laminate 210 by the carrier film 10 during a peeling process using pressure applied by the peeling device.

[0055] Figure 8 This is a schematic perspective view of a stripping device according to an exemplary embodiment of the present disclosure.

[0056] Figure 9 When performing the peeling of the carrier film using the peeling apparatus according to an example embodiment of the present disclosure, along Figure 8 A schematic plan view observed from direction P1.

[0057] Reference Figure 8 and Figure 9 A peeling apparatus 400 according to an exemplary embodiment of the present disclosure may include: housings 421 and 422 housing a first roller 431 and a second roller 432; and a peeling structure 440 connected to protrusions 421a and 422a of the housings 421 and 422. Figure 9 In order to facilitate observation of the internal structure of the stripping device 400, the housing 422 is omitted.

[0058] The peeling structure 440 according to an exemplary embodiment of the present disclosure may include: connecting portions 441, 442a, 442b, 443, 444a and 444b, connected to protrusions 421a and 422a of the housing; and a cylinder 445 rotatably connected to the connecting portions 441, 442a, 442b, 443, 444a and 444b. The connecting portions 441, 442a, 442b, 443, 444a and 444b may include an elastomer sp, the length of which varies according to the linear movement of the cylinder 445.

[0059] The cylinder 445 can directly apply pressure to the carrier film 10 attached to the laminate 210, thereby peeling the carrier film 10 off the laminate 210.

[0060] The cylindrical structure of cylinder 445 can be used to minimize the gap with carrier membrane 10 according to its radius of curvature, thereby reducing the peel angle of carrier membrane 10. In addition, the elastomer sp can change its length according to the external force caused by the linear motion of cylinder 445, thereby maintaining a uniform pressure applied to carrier membrane 10.

[0061] In other words, the peeling device 400 according to an exemplary embodiment of this disclosure may include a peeling structure 440, which includes: connecting portions 441, 442a, 442b, 443, 444a and 444b, protrusions 421a and 422a connected to the housing; and a cylinder 445 rotatably connected to the connecting portions 441, 442a, 442b, 443, 444a and 444b. The connecting portions 441, 442a, 442b, 443, 444a and 444b may include an elastomer sp, the length of which varies according to the linear movement of the cylinder 445, thereby reducing the peeling angle of the carrier film 10 attached to a laminate such as the laminate strip 210, and reducing the stress applied to the surface of the laminate strip 210.

[0062] Reference Figure 9 In this disclosure, a process for peeling the carrier film 10 from the lamination strip 210 is described, but this disclosure is not limited thereto, and the above description can be applied in the same manner to the peeling of a film substrate (or a protective film such as the carrier film 10) attached to various laminated components other than the lamination strip 210.

[0063] In an example embodiment, the connecting portions 441, 442a, 442b, 443, 444a, and 444b may include a plurality of elastomers sp arranged parallel to each other, thereby preventing sagging caused by the weight of the peeling structure 340 in the peeling device 300 according to the related art. Therefore, the distance (or vertical gap, vertical interval) between the peeling device 400 and the carrier membrane 10 can be minimized, and the pressure applied to the carrier membrane 10 by the cylinder 445 can be uniformly adjusted for each position of the cylinder 445.

[0064] Housings 421 and 422 can accommodate the first roller 431 and the second roller 432, and specifically, housings 421 and 422 can be connected to the two ends of the first roller 431 and the second roller 432, which are spaced apart from each other.

[0065] Housings 421 and 422 may be separated from each other, but this disclosure is not limited thereto. When housings 421 and 422 are separated from each other, the separated housings 421 and 422 may be connected to each other by support portion 410 to maintain rigidity.

[0066] The method by which the first roller 431 and the second roller 432 are connected to the housings 421 and 422 is not limited, and the first roller 431 and the second roller 432 can be connected by bearings to be able to rotate within the space formed by the housings 421 and 422.

[0067] In an example embodiment, housings 421 and 422 may include a plurality of protrusions 421a and 422a, and connecting portions 441, 442a, 442b, 443, 444a and 444b may be connected to the plurality of protrusions 421a and 422a.

[0068] The material of each of the housings 421 and 422, as well as the first roller 431 and the second roller 432, is not limited. For example, the housings 421 and 422, as well as the first roller 431 and the second roller 432, can all be formed using metallic materials, resin materials, or a combination of metallic and resin materials.

[0069] The peeling structure 440 can be physically connected to the housings 421 and 422 and can be used to apply pressure directly to the carrier membrane 10.

[0070] The peeling structure 440 may form a connection structure for connecting to the protrusions 421a and 422a of the housings 421 and 422. In an example embodiment, the connection portions 441, 442a, 442b, 443, 444a and 444b of the peeling structure 440 may include: a first connection portion 441 integrally connected to a plurality of protrusions 421a and 422a; a plurality of second connection portions 442a and 442b, each second connection portion connecting to a corresponding point among a plurality of points of the first connection portion 441; a third connection portion 443 integrally connected to the plurality of second connection portions 442a and 442b; and fourth connection portions 444a and 444b protruding from both sides of the third connection portion 443 and connecting to both ends of the cylinder 445.

[0071] The first connecting portion 441 can be integrally connected to a plurality of protrusions 421a and 422a, and the third connecting portion 443 can be integrally connected to a plurality of second connecting portions 442a and 442b, thereby maintaining the rigidity of the peeling structure 440. The plurality of second connecting portions 442a and 442b can be used to absorb the pressure applied from the carrier membrane 10 and allow the cylinder 445 to apply uniform pressure to the carrier membrane 10.

[0072] The plurality of second connecting portions 442a and 442b may include an elastomer sp to absorb pressure applied from the carrier membrane 10. The elastomer sp may be disposed on the surface of a member capable of extending in length, but this disclosure is not limited thereto, and the plurality of second connecting portions 442a and 442b themselves may be formed using the elastomer sp; for example, the plurality of second connecting portions 442a and 442b may consist only of the elastomer sp and not include any member disposed within the elastomer sp (such as...). Figure 8 As shown in the image).

[0073] There are no restrictions on the type of elastomer sp. In example embodiments, the elastomer sp may include one or more of polyurethane springs, gas springs, and steel springs.

[0074] The cylinder 445 can be a component that directly applies pressure to the carrier membrane 10, and can apply uniform pressure to the carrier membrane 10 through line contact. Since the elastomer sp has a length that varies according to the linear movement of the cylinder 445, uniform pressure can be applied to the carrier membrane 10 at each location. The carrier membrane 10 can be peeled off from the laminate 210 according to the pressure applied to it by the cylinder 445.

[0075] The shape of cylinder 445 is not limited. However, in order to apply pressure to the carrier membrane 10 or to maintain rigidity during rotation, cylinder 445 may have a solid cylindrical shape.

[0076] The material of cylinder 445 is not limited. However, in order to apply pressure to the carrier membrane 10 or to maintain rigidity during rotation, cylinder 445 can be formed using a metal with excellent mechanical strength. Specifically, cylinder 445 can be formed using stainless steel.

[0077] The average radius of curvature of cylinder 445 can be greater than or equal to 2.5 mm and less than or equal to 3.0 mm. Therefore, the gap between cylinder 445 and carrier film 10 can be minimized, thereby further reducing the peeling angle of carrier film 10. Here, the average radius of curvature of cylinder 445 may refer to the average of the radii of curvature measured from the outer side in the radial direction at three or more equidistant points along the length of cylinder 445, but this disclosure is not limited thereto. A radius measuring instrument can be used to measure the radius of curvature. Other methods and / or tools understood by those skilled in the art may be used, even if not described in this disclosure.

[0078] The cylinder 445 can be rotatably connected to the connecting portion, more specifically, it can be rotatably connected to the fourth connecting portions 444a and 444b, and the cylinder 445 and the fourth connecting portions 444a and 444b can be connected to each other by bearings.

[0079] In the example embodiment, the hardness of cylinder 445 may be greater than or equal to 37 HRC and less than or equal to 43 HRC (HRC: Rockwell hardness C scale). Therefore, damage to cylinder 445 due to friction between cylinder 445 and bearing during rotation can be prevented. Hardness can be measured using an indenter. Other methods and / or tools understood by those skilled in the art may be used, even if not described in this disclosure.

[0080] In an example embodiment, the peeling device 400 may include a support portion 410 that can be connected to an external facility or device, thereby allowing adjustment of the position of the peeling device 400 relative to the carrier film 10. Specifically, the support portion 410 of the peeling device 400 may be connected to a drive unit for movement on the carrier film 10 in a vertical and / or horizontal direction.

[0081] Reference Figure 9 The carrier film 10 attached to the laminate 210 can be peeled off by the pressure applied by the cylinder 445 of the peeling structure 440, and the carrier film 10 peeled off by the pressure applied by the cylinder 445 can be wound onto the third roller 11 when the first roller 431 and the second roller 432 rotate in opposite directions.

[0082] Figure 10A These images were obtained by photographing a carrier film peeled from a laminated strip using a peeling device based on relevant technology. Figure 10B The images are obtained by taking pictures of the carrier film peeled from the laminated strips using a peeling device according to an example embodiment of the present disclosure.

[0083] Reference Figure 10A When the carrier film 10 is peeled using the peeling device 300 according to the related art, it is confirmed that a vertical gap is formed between the peeling device 300 and the carrier film 10, and it is also confirmed that the peeling angle of the carrier film 10 forms a large obtuse angle. In contrast, when the carrier film 10 is peeled using the peeling device 400 according to an exemplary embodiment of the present disclosure, it is confirmed that the vertical gap between the peeling device 400 and the carrier film 10 is reduced, and the peeling angle of the carrier film 10 is also slightly reduced.

[0084] Figure 11A and Figure 11B Both are graphs showing the results of measuring peel strength when peeling a carrier film is performed using a peeling device according to related technologies and when peeling a carrier film is performed using a peeling device according to an exemplary embodiment of this disclosure. (See attached...) Figure 11A and Figure 11B In the diagram, the horizontal axis represents the elongation (displacement) of the carrier membrane during peeling, while the vertical axis represents the load in Newtons (N). Furthermore, Figure 11B yes Figure 11A A magnified view of a portion of it.

[0085] Comparative Example 1 describes the case where the peeling angle is maintained at 150 degrees using a peeling device according to the related technology. Comparative Example 2 describes the case where the peeling angle is maintained at 150 degrees using a peeling device according to the related technology, and it is assumed that the vertical distance between the peeling device and the carrier film is 5 mm in actual use. The peeling angle in Comparative Examples 1 and 2 is set at 150 degrees based on the fact that in the peeling device according to the related technology, when the angle between the edge of the peeling body having a triangular prism shape that contacts the carrier film or the peeling tip and the surface of the laminate strip to which the carrier film is attached is 30 degrees, the actual peeling angle is formed to be approximately 150 degrees.

[0086] An example embodiment may be the result of measuring peel strength using a peeling device according to an example embodiment of this disclosure.

[0087] Reference Figure 11A and Figure 11B In Comparative Example 1, it was confirmed that the peak peel strength at the peeling tip was 2.2 N; in Comparative Example 2, it was confirmed that the peak peel strength at the peeling tip was 4.4 N, indicating that the peak peel strength increased; in the exemplary embodiment, it was confirmed that the peak peel strength at the peeling tip improved to 1.7 N.

[0088] In other words, as in the exemplary embodiments of this disclosure, when the peeling structure 440 includes connecting portions 441, 442a, 442b, 443, 444a and 444b connected to the protrusions 421a and 422a of the housing and a cylinder 445 rotatably connected to the connecting portions 441, 442a, 442b, 443, 444a and 444b, and when the connecting portions 441, 442a, 442b, 443, 444a and 444b include an elastomer sp having a length that varies according to the linear movement of the cylinder 445, it can be confirmed that the stress applied to the laminate can be reduced when peeling the film substrate attached to the laminate member, such as a lamination strip.

[0089] (Experimental Example) Table 1 below shows the results of measuring and comparing the peeling rates of the cover portion, wherein the case of manufacturing MLCCs using a peeling device according to the related art is defined as a comparative example, and the case of manufacturing MLCCs using a peeling device according to an exemplary embodiment of the present disclosure is defined as an exemplary embodiment.

[0090] [Table 1]

[0091] Referring to Table 1, it can be confirmed that the peeling rate of the cover portion is reduced in the example embodiment compared to the comparative example. Therefore, in the case of the example embodiment, it can be confirmed that the stress applied to the cover portion during carrier film peeling can be minimized.

[0092] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

[0093] Furthermore, the term "example embodiment" as used herein does not refer to the same example embodiment, but is provided to emphasize a specific feature or characteristic that differs from that of another example embodiment. However, the example embodiments provided herein are considered to be implementable by combining them entirely or partially with each other. For example, an element described in a particular example embodiment may be understood to be relevant to another example embodiment, even if it is not described in another example embodiment, unless a contrary or contradictory description is provided in that other example embodiment.

[0094] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the exemplary embodiments. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well.

Claims

1. A stripping device, comprising: The housing accommodates the first and second rollers; as well as The peel-off structure is connected to the housing. The peeling structure includes: The connecting portion, the protruding portion connected to the housing, and A cylinder, rotatably connected to the connecting portion, and The connecting portion includes an elastic body whose length varies according to the linear motion of the cylinder.

2. The stripping device according to claim 1, wherein, The elastomer comprises a plurality of elastomers arranged in parallel with each other.

3. The stripping device according to claim 1, wherein, The protruding portion of the housing includes a plurality of protruding portions. The connection portion also includes: The first connecting portion is integrally connected to the plurality of protruding portions of the housing; Multiple second connection portions, each second connection portion connecting to a corresponding point among multiple points of the first connection portion; The third connecting portion is integrally connected to the plurality of second connecting portions; and The fourth connecting portion protrudes from both sides of the third connecting portion and connects to both ends of the cylinder.

4. The stripping device according to claim 1, wherein, The average radius of curvature of the cylinder is greater than or equal to 2.5 mm and less than or equal to 3.0 mm.

5. The stripping device according to claim 1, wherein, The cylinder is a solid cylinder.

6. The stripping device according to claim 1, wherein, The hardness of the cylinder is greater than or equal to 37 HRC and less than or equal to 43 HRC.

7. The stripping device according to claim 1, wherein, The elastomer includes one or more selected from the group consisting of polyurethane springs, gas springs and steel springs.

8. A peeling method using a peeling device, the peeling method peeling a film substrate attached to a laminate, and the peeling method comprising: Pressure is applied to the membrane substrate using the peeling device comprising a cylinder. The stripping device includes: The housing, which accommodates the first and second rollers; and The peel-off structure is connected to the housing. The peeling structure includes: The connecting portion, the protruding portion connected to the housing, and The cylinder is rotatably connected to the connecting portion, and The connecting portion includes an elastic body whose length varies according to the linear motion of the cylinder.

9. The peeling method according to claim 8, wherein, The elastomer comprises a plurality of elastomers arranged in parallel with each other.

10. The peeling method according to claim 8, wherein, The protruding portion of the housing includes a plurality of protruding portions. The connection portion also includes: The first connecting portion is integrally connected to multiple protruding portions of the housing; Multiple second connection portions, each second connection portion connecting to a corresponding point among multiple points of the first connection portion; The third connecting portion is integrally connected to the plurality of second connecting portions; and The fourth connecting portion protrudes from both sides of the third connecting portion and connects to both ends of the cylinder.

11. The peeling method according to claim 8, wherein, The average radius of curvature of the cylinder is greater than or equal to 2.5 mm and less than or equal to 3.0 mm.

12. The peeling method according to claim 8, wherein, The cylinder is a solid cylinder.

13. The peeling method according to claim 8, wherein, The hardness of the cylinder is greater than or equal to 37 HRC and less than or equal to 43 HRC.

14. The peeling method according to claim 8, wherein, The elastomer includes one or more selected from the group consisting of polyurethane springs, gas springs and steel springs.

15. The peeling method according to claim 8, further comprising moving the peeling device on the membrane substrate.

16. The peeling method according to claim 15, wherein, The stripping device moves on the membrane substrate in a vertical and / or horizontal direction.

17. The peeling method according to claim 8, wherein, The laminated strip includes multiple dielectric sheets and multiple internal electrode patterns.

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