Miniaturized coupling switch matrix and overall structure

Abstract

The application provides a miniaturized coupling switch matrix and a whole machine structure, the coupling switch matrix comprising a coupler module, a switch selection module, a main control module and a power module; the coupler module comprising two PCB boards, 56 couplers arranged on each PCB board, and the PCB boards connected with SMA connectors; the switch selection module integrated in an LTCC substrate, comprising two 56-to-3 switch selection modules and a 6-to-3 switch selection module; each 56-to-3 switch selection module corresponding to a coupler module; the output signals of the two 56-to-3 switch selection modules transmitted to the 6-to-3 switch selection module, realizing the output of 3 signals selected from 109 coupling signals; the main control module receiving and converting external switch control instructions, and sending and controlling the switch states of the two 56-to-3 switch selection modules and the 6-to-3 switch selection module respectively; and the power module converting input voltage into voltage required by each module. The application can realize miniaturization and high integration.

Description

Technical Field

[0001] This invention relates to the fields of communication and radar technology, and specifically to a miniaturized coupling switch matrix and its overall structure. Background Technology

[0002] Coupled switch matrices are widely used in multi-channel signal processing systems. Their basic function is to split multiple input signals into direct and coupled paths using couplers. The direct path outputs directly, while the coupled path allows for the selection of any number of outputs via a switch selection module. In a typical application scenario, 109 input signals need to be split into direct and coupled paths using 109 couplers, resulting in 218 paths. The 109 direct signals are output directly, and 3 signals are randomly selected from the 109 coupled signals for output. The external interface consists of 109 input ports, 109 direct output ports, and 3 coupled output ports. For example... Figure 1 As shown, the coupling switch matrix mainly performs two functions: first, it outputs 109 signals from the direct channel; second, it arbitrarily selects 3 signals from the coupling channel for output.

[0003] To achieve the above functions, due to limitations in existing circuit board manufacturing processes, equipment installation dimensions, and circuit integration capabilities, conventional technologies cannot achieve the overall coupling and gating of 109 signals using a single complete circuit. Therefore, a two-level grouped circuit architecture is commonly used. Specifically, existing solutions divide the 109 signals into five signal sub-channels: four groups of 24 signals and one group of 13 signals (standardized grouping in conventional processes results in five 24-channel sub-array modules, compatible with a general switch sub-array architecture). The first-level signal processing circuit is constructed using five structurally identical switch sub-array modules. Each switch sub-array module integrates 24 couplers, a 24-to-3 switch selection module, and corresponding switch control and power supply circuits. It can independently complete the coupling and splitting of 24 signals, direct output, and gating output of 3 coupled signals. The five sub-array modules output a total of 15 coupled gating signals. Subsequently, a second-stage 15-to-3 selection and signal amplification circuit is used to perform secondary selection on the 15 primary coupled selection signals. Signal amplification compensates for signal loss caused by multi-stage switching, ultimately achieving precise selection of any 3 of the 109 coupled signals, thus realizing the overall matrix function. Figure 2 As shown.

[0004] However, the existing two-level grouped coupled switch matrix architecture has many inherent technical defects, which seriously restrict the miniaturization, lightweighting, and integration of the equipment, while increasing production and assembly costs. Firstly, the existing solution adopts an integrated design mode for the coupler circuit and switch selection module, resulting in unreasonable matching of circuit resources. The coupler circuit has a simple structure and single function, requiring only two circuit boards to achieve its layout and function; while the switch selection module includes multi-channel switching, logic control, and signal conditioning units, with a complex circuit structure and dense wiring, requiring multiple circuit boards to meet design requirements. Integrating both into the same sub-array module significantly increases the overall circuit design complexity. The large-area use of multiple circuit boards leads to a serious waste of board and wiring resources, directly resulting in a large size and weight of individual switch sub-array modules and low overall equipment integration.

[0005] Secondly, the existing equipment's assembly layout is unreasonable, further exacerbating the overall size, weight, and assembly complexity. In the current technology, all five switch subarray modules are integrated and installed inside the main unit. The input and output signals of these subarray modules must be transferred to the signal interfaces on the surface of the main unit via external cable assemblies. The extensive use of external cables not only increases the overall size and weight of the equipment but also significantly increases the difficulty of internal wiring, adding to assembly processes and labor costs. Furthermore, the cable transfer structure reduces the overall structural stability and signal transmission consistency of the equipment, easily introducing signal attenuation and interference, thus affecting the equipment's operational reliability.

[0006] In summary, existing 109-channel coupling switch matrices suffer from technical problems such as wasted circuit design resources, large module size and weight, high assembly complexity, low integration, and poor reliability. They are unable to meet the current needs of high-precision, miniaturized, lightweight, and highly integrated multi-channel signal transmission equipment. Therefore, it is urgent to design a new type of coupling switch matrix to solve the above-mentioned defects of existing technologies. Summary of the Invention

[0007] In view of this, the present invention provides a miniaturized coupling switch matrix and overall structure, which can achieve miniaturization and high integration.

[0008] The technical solution adopted in this invention is as follows: A miniaturized coupling switch matrix includes a coupler module, a switch selection module, a main control module, and a power supply module; The coupler module includes two PCBs, each with 56 couplers. The PCBs are connected to SMA connectors to enable signal input and coupler pass-through signal output. The switch selection module is integrated into the LTCC substrate and includes two 56-to-3 switch selection modules and one 6-to-3 switch selection module. Each 56-to-3 switch selection module corresponds to a coupler module. The 56 input signals of the 56-to-3 switch selection module are connected to the 56 couplers of the coupler module through a cable assembly to couple the output signals. The output signals of the two 56-to-3 switch selection modules are connected to the 6-to-3 switch selection module through a cable assembly, realizing the arbitrary selection of 3 signals from 109 coupled signals for output. The main control module communicates with the external master control data, receives switch control commands and converts them into three control signals, which are then sent to two 56-to-3 switch selection modules and one 6-to-3 switch selection module to control their switching states. The power supply module is used to convert the input voltage into the voltage required by the switch selection modules and the main control module.

[0009] Furthermore, a low-noise amplifier is provided before the 6-to-3 switch selection module.

[0010] Furthermore, the main control module includes four control signal input interfaces, two for main control and two for backup control; the power supply module includes two power input interfaces, one for main control and one for backup power supply.

[0011] Furthermore, the center pin of the SMA connector passes through the support bracket of the PCB board and the via on the PCB board, and is then connected to the signal line on the PCB board through a gold ribbon bonding process.

[0012] The present invention also provides an overall structure based on a miniaturized coupling switch matrix, including the above-mentioned coupling switch matrix, a base plate, and a top plate; The main control module, power supply module, and two support brackets with PCBs mounted on them serve as the four side panels of the entire machine, with the two support brackets with PCBs mounted on them positioned opposite each other. The side panels are connected to each other and to the bottom plate using an interlocking structure. The two 56-to-3 switch selection modules and the 6-to-3 switch selection module are located inside the machine. The main control module, the two 56-to-3 switch selection modules, the 6-to-3 switch selection module, and the power supply module are parallel to each other and fastened by inter-board screws, which are perpendicular to the main control module. The two 56-to-3 switch selection modules and the 6-to-3 switch selection module are fixed to the bottom plate and the top plate.

[0013] Furthermore, 109 RF input SMA connectors and 109 RF direct output SMA connectors are distributed on the outer surfaces of the two PCBs of the coupler module as input terminals; 3 RF coupling output SMA connectors are set on one of the support brackets used to mount the PCBs, and are located on the same plane as the RF input SMA connectors and the RF direct output SMA connectors. Each PCB board has 14 rows and 8 columns of SMA connectors. Odd-numbered rows of connectors are connected to the input RF signal, and even-numbered rows of connectors are connected to the corresponding through-output signal. On the other side of the PCB board, the 109 output terminals are connected to two 56-to-3 switch selection modules via RF cable assemblies. The two 56-to-3 switch selection modules are connected to a 6-to-3 switch selection module via RF cable assemblies. The 6-to-3 switch selection module is connected to the interfaces corresponding to the three RF coupling output SMA connectors on the support bracket of the PCB board via RF cable assemblies. The power interface and control interface are located on the two side walls of the power module and the main control module, and are on the same plane as the SMA connector after the whole machine is assembled. The main control module interface is connected to two 56-to-3 switch selection modules and one 6-to-3 switch selection module via a micro rectangular connection harness.

[0014] Furthermore, the LTCC substrate of the 56-to-3 switch selection module has 28 input signals distributed on both sides, and 28 SMP RF connectors are surface-mounted on both sides of the LTCC substrate for receiving signals; the RF signals input by the SMP RF connectors are selected by cascading combination of 4-to-1 switches and 8-to-1 switches.

[0015] Furthermore, the RF cable between the two PCBs and the two 56-to-3 switch selection modules is: one end is a straight semi-escapement SMP, and the other end is a bent semi-escapement SMP. The RF cable between the two 56-to-3 switch selection modules and the one 6-to-3 switch selection module is: one end is a bent semi-escapement SMP, and the other end is a bent semi-escapement SMP. The RF cable between the 6-to-3 switch selection module and the side panel interface is: one end is a bent semi-escapement SMP, and the other end is a flange-mounted SMA.

[0016] Beneficial effects: 1. This invention separates the coupler circuit function and the switch selection module function into several independent modules. Different process technologies are used according to the function of each module to minimize design difficulty, reduce product size and weight, and achieve miniaturization.

[0017] 2. The coupler circuit structure of this invention is simple. It uses a conventional double-sided PCB board design and connects directly to the circuit on the PCB board through a through-wall SMA connector to form a coupler module containing 56 signals. A total of 112 SMA connectors are installed on the surface of the module to connect the input signals and the direct output signals. The two modules are used as the two sides of the whole machine, avoiding the use of a large number of cable assemblies for conversion, and realizing the miniaturization of the whole machine.

[0018] 3. This invention balances product size requirements and manufacturing capabilities. The switch selection module is designed using LTCC multilayer ceramic technology. It achieves a 109-to-3 selection function for coupled signals through a two-stage switch selection module. The first stage requires two switch selection modules, each implementing a 56-to-3 selection function; the second stage uses one module to implement a 6-to-3 amplified selection function. The LTCC process embeds numerous RF transmission lines, control lines, and power lines within a multilayer ceramic substrate. Through methods such as symmetrical front and back and left and right structural designs, it increases integration density, reduces circuit area and the number of circuit boards, further achieving miniaturization. Attached Figure Description

[0019] Figure 1 This is a block diagram of the coupling switch matrix principle.

[0020] Figure 2 This is a schematic diagram of a conventional solution.

[0021] Figure 3 This is a schematic diagram of the PCB board of the coupler module of the present invention.

[0022] Figure 4 This is an exploded view of the coupler module structure of the present invention.

[0023] Figure 5 This is an exploded view of the overall structure of the present invention.

[0024] Figure 6 This is a schematic diagram of the overall structure of the present invention.

[0025] Figure 7(a) shows the interface on the power module, and Figure 7(b) shows the interface on the main control module.

[0026] Figure 8 This is a schematic diagram of the base plate structure.

[0027] Figure 9 A schematic diagram of the front and back of a 56-to-3 switch selection module.

[0028] Figure 10 A schematic diagram of a 6-to-3 switch selection module.

[0029] Figure 11 Exploded view of the switch selection module.

[0030] Figure 12 A schematic diagram of the cable fixing for a 56-to-3 switch selection module.

[0031] Figure 13 This describes the topology between the coupler module and the 56-to-3 switch selection module.

[0032] Figure 14 This describes the topology relationship between the 56-to-3 switch selection module and the 6-to-3 switch selection module.

[0033] Figure 15 A schematic diagram showing the bending and binding positions of the input cable for the 6-to-3 selector module.

[0034] Figure 16 A schematic diagram of the output cable binding for a 6-to-3 selector module.

[0035] Figure 17 This is a schematic diagram of the internal wiring harness connections of the entire machine structure.

[0036] Among them, 1-PCB board, 2-substrate cover plate, 3-SMA connector, 4-side plate support bracket, 5-cable fixing plate, 6-56-to-3 switch selection module, 7-power module, 8-main control module, 9-coupler module, 10-6-to-3 switch selection module, 11-base plate, 12-RF input SMA connector, 13-RF direct output SMA connector, 14-RF coupled output SMA connector, 15-power interface, 16-control interface, 17-input SMP RF connector, 18-output SMP RF connector, 19-circuit cover plate, 20-LTCC substrate, 21-reinforcing rib, 22-micro rectangular connector, 23-long cable fixing bracket, 24-line clip, 25-rubber sleeve, 26-support bracket. Detailed Implementation

[0037] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0038] This invention provides a miniaturized coupling switch matrix, including a coupler module 9, a switch selection module, a main control module 8, and a power supply module 7. 109 couplers are implemented through the coupler module 9, and the switch selection circuit is implemented by the switch selection module.

[0039] Coupler module 9 includes two double-sided PCBs 1, with 109 couplers distributed across them. Each PCB 1 has 56 couplers arranged in a 7×8 matrix. The extra three channels can be omitted. Figure 3 As shown. PCB board 1 is connected to SMA connector 3 to realize signal input and coupler direct signal output, as follows. Figure 4 As shown, the coupler module 9 also includes a side plate support bracket 4, a base plate cover 2, and a cable fixing plate 5, which are stacked together in the order of SMA connector 3, side plate support bracket 4, PCB board 1, base plate cover 2, and cable fixing plate 5. Specifically, the center pin of the SMA connector 3 passes through the side plate support bracket 4 of the PCB board 1 and the through hole on the PCB board 1, and is then connected to the signal line on the PCB board 1 through a gold tape bonding process. The SMA connector 3 includes 109 RF input SMA connectors 12, 109 RF straight-through output SMA connectors 13, and 3 RF coupling output SMA connectors 14.

[0040] The switch selection module is integrated into the LTCC substrate 20, including two 56-to-3 switch selection modules 6 and one 6-to-3 switch selection module 10. Each 56-to-3 switch selection module 6 corresponds to a coupler module 9. The 56 input signals of the 56-to-3 switch selection module 6 are connected to the 56 couplers of the coupler module 9 via a cable assembly to couple the output signals. The output signals of the two 56-to-3 switch selection modules 6 (the extra 3 channels can be ignored) are connected to the 6-to-3 switch selection module 10 via a cable assembly, enabling arbitrary selection of 3 signals from 109 coupled signals for output. To compensate for the transmission loss after the signal passes through two stages of switch selection, a low-noise amplifier is added before the 6-to-3 circuit to achieve 6-to-3 amplified switch selection function.

[0041] The main control module 8 implements the 1553B bus terminal interface logic through FPGA to achieve data communication with the external master control, receive switch control commands and convert them into three control signals, which are sent to two 56-to-3 switch selection modules 6 and one 6-to-3 switch selection module 10 respectively to control their switch status.

[0042] The power supply module 7 is used to convert the input voltage into the voltage required by the switch selection module and the main control module 8. In this embodiment, a 100V DC input voltage is selected.

[0043] To enhance the reliability of individual units, both the main control module 8 and the power supply module 7 adopt a primary-backup design. The coupling switch matrix has 109 signal input RF interfaces, 109 signal pass-through output RF interfaces, and 3 signal coupling selection output RF interfaces. The main control module 8 includes 4 control signal input interfaces, 2 for primary and 2 for backup; the power supply module 7 includes 2 power input interfaces, 2 for primary and 2 for backup.

[0044] The present invention also provides a complete structure based on a miniaturized coupling switch matrix, which adopts a frame structure and includes the above-mentioned coupling switch matrix, a base plate 11, and a top plate. like Figure 5As shown, the main control module 8, the power supply module 7, and the two side plate support brackets 4 with PCB board 1 installed serve as the four sides of the whole machine, with the two side plate support brackets 4 with PCB board 1 installed facing each other. The side plates are fixed together by interlocking structures. The two 56-to-3 switch selection modules 6 and 6-to-3 switch selection modules 10 are located inside the whole machine. The main control module 8, the two 56-to-3 switch selection modules 6 and 6-to-3 switch selection modules 10, and the power supply module 7 are parallel to each other and fastened by inter-board screws. The inter-board screws are perpendicular to the main control module 8, thereby achieving the support of the whole machine frame in the Y direction. The two 56-to-3 switch selection modules 6 and 6-to-3 switch selection modules 10 are fixed to the bottom plate 11 and the top plate, suppressing the deformation of the internal radio frequency circuit in the X direction. The deformation of the two side plate support brackets 4 with PCB board 1 in the Z direction is suppressed by the fixing of the two side plates in the XY plane to the bottom plate 11 and the top plate, and the rigidity of the side plates themselves; the rigidity of the whole machine meets the requirements by the support of the internal X, Y and Z direction structural components (including bottom plate, top plate, inter-plate screws, support brackets, etc.).

[0045] like Figure 6 As shown, 109 RF input SMA connectors 12 and 109 RF direct output SMA connectors 13 are distributed on the outer surfaces of the two PCBs 1 of the coupler module 9 as input terminals; 3 RF coupling output SMA connectors 14 are mounted on one of the side plate support brackets 4 used to mount the PCB 1, and are located on the same plane as the RF input SMA connectors 12 and the RF direct output SMA connectors 13.

[0046] As shown in Figures 7(a) and 7(b), each PCB board 1 has 14 rows and 8 columns of SMA connectors 3. Odd-numbered rows of connectors connect to the input RF signals, and even-numbered rows connect to the corresponding through-output signals. The 109 output terminals on the other side of the PCB board 1 are connected to two 56-to-3 switch selection modules 6 via RF cable assemblies. The two 56-to-3 switch selection modules 6 are connected to a 6-to-3 switch selection module 10 via RF cable assemblies. The 6-to-3 switch selection module 10 is connected to the interfaces of the three RF-coupled output SMA connectors 14 on the side plate support bracket 4 of the PCB board 1 via RF cable assemblies. The power interface 15 and the control interface 16 are located on the two side walls of the power module 7 and the main control module 8, and are on the same plane as the SMA connectors 3 after the whole machine is assembled. The control interface 16 of the main control module 8 is connected to the two 56-to-3 switch selection modules 6 and the one 6-to-3 switch selection module 10 via micro rectangular connecting wire harnesses.

[0047] like Figure 8 As shown, the top plate and bottom plate 11 are treated to reduce weight, and internal reinforcing ribs are designed to reduce the wall thickness while maintaining the strength of the structure.

[0048] The LTCC substrate 20 of the 56-to-3 switch selection module 6 has 28 input signals distributed on both sides, such as... Figure 9 As shown, the LTCC substrate 20 has 28 input SMP RF connectors 17 surface-mounted on both sides for receiving signals, and 3 output SMP RF connectors 18 are also located on the front side of the LTCC substrate 20. The RF signals input to the input SMP RF connectors 17 are selected by a cascaded combination of 4-to-1 switches and 8-to-1 switches. To control the switches, the circuit also includes a serial-to-parallel converter, a 3-to-8 decoder, and other components.

[0049] Two 56-to-3 selector modules output six signals. It is necessary to select three signals from these six signals. This function is achieved by a 6-to-3 selector amplification circuit. Figure 10 As shown, the 6-channel signal input SMP RF connector 17 and the 3-channel signal output SMP RF connector 18 are located on the same side. The switch selection module realizes a 6-to-3 selection of beamcoupled signals and amplifies the signals. The 6-to-3 switch amplification selection circuit is similar to the 56-to-3 switch selection module 6. The circuit design includes switch circuit design, control circuit design, amplifier circuit design, RF transmission line design, control line design, power line design, etc. This module circuit also adopts the LTCC ceramic substrate design. Signal selection is realized through a 4-to-1 switch, and signal amplification is realized through a low-noise amplifier.

[0050] Both the 56-to-3 switch selection module 6 and the 6-to-3 switch selection module 10 use LTCC (Low Temperature Co-fired Ceramic) material, which has a coefficient of thermal expansion of 7-8 ppm and exhibits a certain degree of brittleness. The LTCC substrate 20 is wrapped with a rubber sleeve around its perimeter, and the treated substrate is then housed within a lightweight frame. The advantages of this structure are its relatively lightweight substrate mounting structure, effective release of thermal stress on the substrate under thermal vacuum conditions, and reduced stress on the substrate under vibration, preventing unnecessary damage from collisions with metal structures.

[0051] In this embodiment, the circuit board area of ​​both the 56-to-3 switch selection module 6 and the 6-to-3 switch selection module 10 is 150mm × 103mm, and the usable circuit size is 140mm × 93mm. The substrate has a 3mm mounting space on all four sides. The circuit board substrate thickness of both the 56-to-3 switch selection module 6 and the 6-to-3 switch selection module 10 is 3.6mm, the rubber sleeve 25 thickness is 6.6mm, and the thickness of the rubber sleeve 25 after compression is 6mm, with a compression amount of 9%. The mounting structure of the substrate of the 56-to-3 switch selection module 6 is as follows: Figure 11As shown, the 56-to-3 switch selection module 6 includes a circuit cover plate 19, an LTCC substrate 20, a reinforcing rib 21, a micro rectangular connector 22, a long cable fixing bracket 23, a wire clip 24, a rubber sleeve 25, and a support bracket 26. The micro rectangular connector 22, which is used to transmit control signals, is soldered inside the support bracket 26. The internal pins of the micro rectangular connector 22 are interconnected with the LTCC substrate 20 by gold wire bonding.

[0052] The RF cable between the two PCB boards 1 and the two 56-to-3 switch selection modules 6 is a straight semi-escapement SMP at one end and a bent semi-escapement SMP at the other end; the RF cable between the two 56-to-3 switch selection modules 6 and the one 6-to-3 switch selection module 10 is a bent semi-escapement SMP at one end and a bent semi-escapement SMP at the other end; the RF cable between the 6-to-3 switch selection module 10 and the top plate interface is a bent semi-escapement SMP at one end and a flange-mounted SMA at the other end.

[0053] The two PCB boards 1 of the coupler module 9 each output 56 coupled signals, which are connected to two 56-to-3 switch selection modules 6 via cables. The coupler module 9 is divided into 56+56 channels on the left and right sides (the extra channels are for backup), with 8 columns × 7 channels on each side; the corresponding signal inputs of the 56-to-3 switch selection modules 6 are also divided into left and right sides, with 14 inputs on each side, for a total of 56 inputs on both sides. The design of the 56-to-3 switch selection modules 6 consists of two modules with a total of 112 inputs.

[0054] When installing cables, if Figure 12 As shown, the first step is to insert the cable bend end into the signal 56-to-3 switch selection module 6 and fix it in the wire clips 24 on both sides of the support bracket 26; the second step is to... Figure 13 The diagram illustrates the cable laying process, connecting the 56-to-3 switch selection module 6 to the coupler module 9. The cable passes through the cable fixing plate and is inserted into the SMP socket on the coupling module. In the third step, adhesive is applied to the line clip 24 and the SMP plug end for fixation. Silicone is applied to the holes in the cable fixing plate and cable sheath to confine the cable, providing reliable support for the cable root. The upper portion of the long cable is fixed in the middle to the long cable fixing brackets 23 on both sides of the top of the module, preventing the cable bundle from being pulled or impacted at the cable joint root under vibration.

[0055] The distance between the coupler module 9 and the 56-to-3 switch matrix module structure is 24mm. The two ends of the cable are fixed to the line clips 24 on both sides of the 56-to-3 switch matrix module structure and the cable fixing plate 5 of the coupler module 9, respectively. The upper part of the long cable is tied to the side bracket in the middle, and the lower part of the short cable is suspended in the middle. Its force transmission efficiency is relatively poor. Therefore, it is considered that the RF cable connection between the coupler module and the 56-to-3 switch selection module 6 is safe and reliable.

[0056] Each 56-to-3 switch selects 3 output RF signals, and the two switches (6 in total) connect to the 6-to-3 switch selection module 10. The topology and the bending and bundling positions of the RF cables are shown in the diagram below. Figure 14 As shown. The RF cable type is: one end is a bent semi-escapement SMP, and the other end is a bent semi-escapement SMP. After the cable is inserted into the 56-to-3 switch selection module 6, it is secured at the tail end, then tied to the top stud, and finally secured at the tail end of the insertion end of the 6-to-3 switch selection module 10, as shown. Figure 15 As shown.

[0057] The RF cable between the 6-to-3 selector module 10 and the device side panel interface is of the following type: one end is a bent-type semi-escaping SMP, and the other end is a through-wall flange mounting SMA. The output cable installation and bundling positions are shown in the diagram below. Figure 16 As shown.

[0058] The low-frequency sockets for power module 7 and main control module 8 are located in the middle area, with reserved space for wiring. Power module 7 supplies power to main control module 8, two 56-to-3 switch selection modules 6, and a 6-to-3 switch selection module 10 via wiring harness. Main control module 8 provides control signals to the two 56-to-3 switch selection modules 6 and the 6-to-3 switch selection module 10 via wiring harness. The main and backup connections are the same; the wiring harness connection diagram is shown below. Figure 17 As shown, the wire harness is tied to the studs on both sides.

[0059] In summary, the above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A miniaturized coupled switch matrix, characterized in that, It includes a coupler module, a switch selection module, a main control module, and a power supply module; The coupler module includes two PCBs, each with 56 couplers. The PCBs are connected to SMA connectors to enable signal input and coupler pass-through signal output. The switch selection module is integrated into the LTCC substrate and includes two 56-to-3 switch selection modules and one 6-to-3 switch selection module. Each 56-to-3 switch selection module corresponds to a coupler module. The 56 input signals of the 56-to-3 switch selection module are connected to the 56 couplers of the coupler module through a cable assembly to couple the output signals. The output signals of the two 56-to-3 switch selection modules are connected to the 6-to-3 switch selection module through a cable assembly, realizing the arbitrary selection of 3 signals from 109 coupled signals for output. The main control module communicates with the external master control data, receives switch control commands and converts them into three control signals, which are then sent to two 56-to-3 switch selection modules and one 6-to-3 switch selection module to control their switching states. The power supply module is used to convert the input voltage into the voltage required by the switch selection modules and the main control module.

2. The miniaturized coupling switch matrix as described in claim 1, characterized in that, A low-noise amplifier is provided before the 6-to-3 switch selection module.

3. The miniaturized coupling switch matrix as described in claim 1, characterized in that, The main control module includes four control signal input interfaces, two for main control and two for backup control; the power supply module includes two power input interfaces, one for main control and one for backup control.

4. The miniaturized coupling switch matrix as described in any one of claims 1-3, characterized in that, The center pin of the SMA connector passes through the support bracket and via on the PCB board, and then connects to the signal line on the PCB board through a gold-ribbon bonding process.

5. A complete machine structure based on a miniaturized coupled switch matrix, characterized in that, Includes the coupling switch matrix as described in any one of claims 1-4, as well as the base plate and the top plate; The main control module, power supply module, and two support brackets with PCBs mounted on them serve as the four side panels of the entire machine, with the two support brackets with PCBs mounted on them positioned opposite each other. The side panels are connected to each other and to the bottom plate using an interlocking structure. The two 56-to-3 switch selection modules and the 6-to-3 switch selection module are located inside the machine. The main control module, the two 56-to-3 switch selection modules, the 6-to-3 switch selection module, and the power supply module are parallel to each other and fastened by inter-board screws, which are perpendicular to the main control module. The two 56-to-3 switch selection modules and the 6-to-3 switch selection module are fixed to the bottom plate and the top plate.

6. The overall structure based on a miniaturized coupled switch matrix as described in claim 5, characterized in that, 109 RF input SMA connectors and 109 RF direct output SMA connectors are distributed on the outer sides of the two PCBs of the coupler module as input terminals; 3 RF coupling output SMA connectors are set on one of the support brackets used to mount the PCBs, and are located on the same plane as the RF input SMA connectors and the RF direct output SMA connectors. Each PCB board has 14 rows and 8 columns of SMA connectors. Odd-numbered rows of connectors are connected to the input RF signal, and even-numbered rows of connectors are connected to the corresponding through-output signal. On the other side of the PCB board, the 109 output terminals are connected to two 56-to-3 switch selection modules via RF cable assemblies. The two 56-to-3 switch selection modules are connected to a 6-to-3 switch selection module via RF cable assemblies. The 6-to-3 switch selection module is connected to the interfaces corresponding to the three RF coupling output SMA connectors on the support bracket of the PCB board via RF cable assemblies. The power interface and control interface are located on the two side walls of the power module and the main control module, and are on the same plane as the SMA connector after the whole machine is assembled. The main control module interface is connected to two 56-to-3 switch selection modules and one 6-to-3 switch selection module via a micro rectangular connection harness.

7. The overall structure based on a miniaturized coupled switch matrix as described in claim 5, characterized in that, The LTCC substrate of the 56-to-3 switch selection module has 28 input signals distributed on both sides. 28 SMP RF connectors are surface-mounted on both sides of the LTCC substrate for receiving signals. The RF signals input by the SMP RF connectors are selected by cascading a 4-to-1 switch and an 8-to-1 switch.

8. The overall structure based on a miniaturized coupled switch matrix as described in any one of claims 5-7, characterized in that, The RF cable between the two PCBs and the two 56-to-3 switch selection modules is: one end is a straight semi-escapement SMP, and the other end is a bent semi-escapement SMP. The RF cable between the two 56-to-3 switch selection modules and the one 6-to-3 switch selection module is: one end is a bent semi-escapement SMP, and the other end is a bent semi-escapement SMP. The RF cable between the 6-to-3 switch selection module and the side panel interface is: one end is a bent semi-escapement SMP, and the other end is a flange-mounted SMA.

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