A motor base and a manufacturing method thereof

Abstract

The application is a motor base, which comprises an insulating base, a metal circuit, a plurality of plastic blocks fixed with the metal circuit, and a plurality of electronic components. The metal circuit comprises a plurality of branches. One end of each branch is arranged in parallel and at intervals to form a pin end. The other end of each branch forms a solder end. The solder end is embedded in the plastic block and exposed to the plastic block. The electronic component is welded to the solder end. The base further comprises a metal plate. The metal plate, the metal circuit, and the plastic block are embedded in the insulating base by injection molding. The metal plate is provided with a relief portion to accommodate the plastic block. A gap is formed between the relief portion and the plastic block and is filled by the insulating base. In the application, the metal plate and the insulating base are formed in one body, which can reduce the size of the overall component while ensuring the strength of the insulating base. Moreover, the metal plate is provided with a relief portion to accommodate the plastic block, which can avoid cracks in the plastic block caused by the large difference in the thermal expansion coefficient between the metal plate and the plastic block during the injection molding of the insulating base.

Description

This application is a divisional application of Chinese patent application No. 202111218755.5, filed on October 20, 2021, entitled "A Motor Base and a Method for Manufacturing the Same," and also enjoys priority over Chinese patent application No. 202111008232.8, filed on August 30, 2021.

[0001] This invention relates to the technical field of a motor base and its manufacturing method, and more particularly to a motor base with electronic components and its manufacturing method. Background Technology

[0002] Existing motor bases and motors typically include an insulating base, metal circuitry injection-molded into the insulating base, and electronic components soldered to the metal circuitry. Generally, the insulating base is made of pure plastic. To increase the strength of the insulating base, the material thickness is directly increased. However, this results in an excessively large insulating base, hindering product miniaturization.

[0003] For example, patent application CN108989511A discloses a base and voice coil motor. The insulating base in this patent application is made of pure plastic, which is not strong enough. Another example is patent CN109212710B, which uses a one-piece molding method to form an insulating base with a structure of wires, an insulating layer, and a metal substrate from top to bottom. Although the metal substrate can increase the strength of the insulating base, the insulating layer cannot facilitate the soldering of electronic components because the precision of the one-piece molded insulating layer at the wire terminals is poor, which increases the difficulty of soldering electronic components.

[0004] Therefore, it is indeed necessary to provide a new motor base and its manufacturing method to overcome the above-mentioned defects. Summary of the Invention

[0005] The purpose of this invention is to provide a motor base and a method for manufacturing the same.

[0006] The objective of this invention is achieved through the following technical solution: A motor base includes an insulating base, a metal circuit, a plastic block holding the metal circuit, and electronic components soldered to the metal circuit. The metal circuit includes a plurality of branches arranged at intervals, one end of each branch being arranged at intervals to form a pin terminal, and the other end of each branch forming a solder joint terminal. The solder joint terminal is embedded in and exposed to the plastic block. The electronic components are soldered to the solder joint terminal. The base also includes a metal plate. The metal plate, the metal circuit, and the plastic block are embedded in the insulating base by injection molding. The metal plate has a clearance portion to allow space for the plastic block, and a gap is formed between the clearance portion and the plastic block and filled by the insulating base.

[0007] Furthermore, the metal plate is spaced apart from the metal circuit, the plastic block has a groove, the solder feet are exposed in the groove and soldered to the electronic components housed in the groove, and the plastic block isolates the solder feet from the metal plate.

[0008] Furthermore, the metal circuit includes a horizontally arranged portion, the solder joint includes a first solder joint disposed on the horizontal portion, the plastic block includes a first plastic block injection molded on the first solder joint and arranged horizontally, the first plastic block has an upper surface and a lower surface disposed opposite each other in the vertical direction, and the first solder joint is exposed on the upper surface; the insulating base includes a horizontally arranged main body, the first plastic block is embedded in the main body, the main body has a top surface and a bottom surface disposed opposite each other in the vertical direction, and the upper surface of the first plastic block is flush with or higher than the top surface of the main body.

[0009] Furthermore, the metal plate is embedded in the main body, and the metal plate has a top surface and a bottom surface that are oppositely arranged in the vertical direction. The bottom surface of the metal plate is flush with or lower than the bottom surface of the main body, and the bottom surface of the metal plate is flush with or lower than the lower surface of the first plastic block.

[0010] Furthermore, the metal plate has a bent portion that bends to one side, and the bent portion is disposed in the insulating base so that the metal plate and the insulating base are formed as one piece.

[0011] Furthermore, the insulating base is provided with a plurality of pin holes that expose the metal branches.

[0012] The objective of this invention is achieved through the following technical solution two: a method for manufacturing a motor base, comprising the following steps: The first step is to provide a metal circuit with several branches, one end of which is arranged in parallel and spaced apart to form a pin terminal, and the other end of which forms a solder pad terminal; The second step is to perform injection molding on the solder foot end to form a plastic block that holds the solder foot end, with the solder foot end exposed to the plastic block. The third step is to place the electronic components inside the plastic block and solder them to the corresponding soldering pins. Fourth step, a metal plate is provided, the metal plate having a clearance portion to allow the plastic block to pass, and a gap is formed between the clearance portion and the plastic block; The fifth step involves secondary injection molding of the metal plate, metal circuit, and plastic block to form an insulating base and fill the gaps, thereby forming the motor base.

[0013] Furthermore, in the fourth step, the metal circuit and the metal plate are arranged at a distance from each other, and the metal circuit and the metal plate are fixed relative to each other by a strip.

[0014] Furthermore, the plastic block has a groove, the soldering pin is exposed in the groove and soldered to the electronic component housed in the groove, and the plastic block isolates the soldering pin from the metal plate.

[0015] Furthermore, in the fifth step, during the secondary injection molding of the insulating base, ejector pins are used to hold the metal circuit, thereby creating a plurality of ejector pin holes on the insulating base that expose the metal branches.

[0016] In this invention, by setting a metal plate, the insulating base formed during the injection molding process can fix the plastic block, metal circuit and metal plate, so that the metal plate and the insulating base are formed into one piece. While ensuring the strength of the insulating base, the size of the overall component can be reduced. Moreover, the metal plate is provided with a clearance part to avoid the plastic block, so as to avoid the plastic block cracking due to the large difference in the thermal expansion coefficients between the metal plate and the plastic block during the injection molding of the insulating base. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the base of the present invention.

[0018] Figure 2 for Figure 1 A three-dimensional diagram viewed from another direction.

[0019] Figure 3 This is an exploded perspective view of the base of the present invention.

[0020] Figure 4 for Figure 3 A three-dimensional exploded view from another direction.

[0021] Figure 5 This is a further exploded perspective view of the base of the present invention.

[0022] Figure 6for Figure 5 A magnified view of a portion of the image.

[0023] Figure 7 for Figure 5 A further exploded view of the three-dimensional structure from another direction.

[0024] Figure 8 for Figure 1 A cross-sectional view along line AA.

[0025] Figure 9 for Figure 8 Enlarged view of point B in the middle.

[0026] Figure 10 This is a top view of the base in the first embodiment of the present invention.

[0027] Figure 11 This is a top view of the base in the second embodiment of the present invention.

[0028] Please refer to the following diagrams for the following symbols and their meanings: Base 100 / 100', Metal Circuit 1 / 1', Branch 10, Gap G, Pin End 11, Solder Foot End 12, First Solder Foot End 121, Second Solder Foot End 122, Top Wall 123, Horizontal Part 13, Vertical Part 14, Top Side 15 / 15', Electronic Component 2, Insulating Base 3, Main Body 30, Side Wall 35, Top Surface 31 / 31', Bottom Surface 32, Clearance Hole 33, Second Ejector Pin Hole 34, Plastic Block 4, First Plastic Block 41, Upper Surface 411, Lower Surface 412, First Groove 413, Second Plastic Block 42, Second Groove 421, Groove 43, Inner Wall 431, Metal Plate 5, Clearance Part 51, Top Surface 52, Bottom Surface 53, First Ejector Pin Hole 54, Bending Part 55, Gap 56. Detailed Implementation

[0029] In the description of this invention, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, and those skilled in the art can understand the specific meaning of the above term in this invention according to the specific circumstances.

[0031] In existing technologies, the insulating base of a motor base is typically made of pure plastic, which has relatively weak strength. To achieve the required strength, the plastic thickness of the insulating base needs to be increased, resulting in a thicker overall structure that cannot meet the growing demand for thinner and lighter electronic products. In the aforementioned technology, the insulating base is manufactured using a one-piece molding process, forming a structure from top to bottom: wire-insulation layer-metal substrate. While the metal substrate provides structural support for the insulation layer, during wire welding, the insulation layer may crack due to the inconsistency in thermal expansion coefficients between the insulation layer and the metal substrate at high temperatures. Therefore, the metal substrate cannot facilitate the welding of electronic components, increasing process difficulty and cost, and reducing product yield. This invention employs a multi-stage injection molding process. The plastic block 4 formed in the first injection molding process improves the mold opening accuracy near the solder joints 12 of the metal circuit 1, facilitating the welding of electronic components 2. The insulating base 3 formed in the second injection molding process serves to fix the plastic block 4, the metal circuit 1, and the metal plate 5. The metal plate 5 is made of stainless steel and is molded into the insulating base 3 to increase the strength of the insulating base 3.

[0032] In this invention, please refer to Figures 1 to 11 This invention relates to a base 100 in a motor (not shown), the base 100 comprising an insulating base 3, a metal circuit 1 embedded in the insulating base 3, a plastic block 4 fixed to the metal circuit 1, and electronic components 2 soldered to the metal circuit 1. The motor in this application can be an electric drive such as a piezoelectric motor or a voice coil motor; therefore, the base 100 is not limited to various types of motor products driven by the metal circuit 1, and the motor can be applied to various fields such as consumer electronics, automobiles, and security.

[0033] The metal circuit 1 includes a plurality of branches 10 spaced apart within an insulating base 3. One end of each branch 10 is parallel and spaced apart to form a pin 11, and the other end of each branch 10 is provided with a solder joint 12. The pin 11 extends outward from the insulating base 3 to be electrically connected to an external circuit. The solder joint 12 is embedded in and exposed to the plastic block 4. Specifically, the solder joint 12 is exposed on the upper surface 411 of the plastic block 4 and has a top wall 123 exposed to the plastic block 4. After bending, the metal circuit 1 includes a horizontal portion 13 and a vertical portion 14. The horizontal portion 13 and the vertical portion 14 are arranged at an angle to each other in different planes. In this embodiment, the horizontal portion 13 and the vertical portion 14 are arranged at right angles. A portion of the solder feet 12 of the branch 10 are disposed on the horizontal portion 13 and are defined as first solder feet 121; a portion of the solder feet 12 of the branch 10 are disposed on the vertical portion 14 and are defined as second solder feet 122. The first solder feet 121 are disposed on a portion of the branch 10 for soldering to one of the electronic components 2. The second solder feet 122 are disposed on the other branch 10, allowing the first solder feet 121 and the second solder feet 122 to be disposed simultaneously on a portion of the branch 10. In this application, the metal circuit 1 has a top side 15, which is flush with or lower than the top surface 31 of the insulating base 3.

[0034] The electronic component 2 is soldered to the solder pad 12 held by the plastic block 4. In this application, at least one electronic component 2 is provided corresponding to the first solder pad 121 and / or the second solder pad 122. In this invention, the electronic component 2 refers to electronic components such as IC chips, Hall effect sensors, capacitors, or inductors.

[0035] After the metal circuit 1 and the plastic block 4 are soldered to the electronic component 2, they are jointly embedded in the insulating base 3 through secondary injection molding. The insulating base 3 is rectangular and has a main body 30 and sidewalls 35 surrounding the main body 30. The sidewalls 35 are higher than the height of the main body 30 in a vertical direction. The insulating base 3 includes a top surface 31 and a bottom surface 32 located opposite each other in the vertical direction on the main body 30, and a clearance hole 33 for accommodating and avoiding the plastic block 4. In this invention, there is one clearance hole 33, but in other embodiments, the number of clearance holes 33 is not limited and can be adjusted according to the number of plastic blocks 4. The insulating base 3 has a plurality of second ejector pin holes 34 distributed through the top surface 31 and the bottom surface 32.

[0036] The plastic block 4 has a groove 43 with an inner wall 431. The soldering lead 12 is exposed on the bottom surface of the groove 43. The electronic component 2 is housed and positioned in the groove 43 and soldered to the soldering lead 12. Before bending the metal circuit 1, the height of the electronic component 2 in the vertical direction may be greater than the depth of the groove 43, forming a gap G between the electronic component 2 and the inner wall 431 of the groove 43. Specifically, the plastic block 4 includes a first plastic block 41 and a second plastic block 42 separately disposed. The first plastic block 41 holds the first soldering lead 121 of the horizontal portion 13, and the second plastic block 42 holds the second soldering lead 122 of the vertical portion 14. Before bending the metal circuit 1, the second plastic block 42 is located in the same plane as the first plastic block 41 in the horizontal portion 13 to facilitate the soldering of the electronic component 2. As the metal circuit 1 is bent, the second plastic block 42 moves from the plane of the horizontal portion 13 to the plane of the vertical portion 14. The second plastic block 42 is formed above the top surface 31 of the insulating base 3 and completely covers the vertical portion 14 of the metal circuit 1. Each plastic block 4 is provided with a groove 43. A first groove 413 is formed on the first plastic block 41, and the first soldering end 121 is exposed in the first groove 413. The electronic component 2, which is arranged in the horizontal direction, is soldered to the first soldering end 121 in the first groove 413. The electronic component 2 and the inner wall 431 of the first groove 413 form the gap G. A second groove 421 is formed on the second plastic block 42, and the second soldering end 122 is exposed in the second groove 421. The electronic component 2, which is arranged in the vertical direction, is soldered to the second soldering end 122 in the second groove 421. The electronic component 2 and the inner wall 431 of the second groove 421 form the gap G. The gap G at these two locations prevents cracks in the plastic block 4 caused by the significant difference in thermal expansion coefficients between the metal plate 5 (hereinafter referred to as the first plastic block 41) during the soldering of the electronic component 2. The plastic block 4 has an upper surface 411 and a lower surface 412 arranged opposite each other in the vertical direction. Here, the plastic block 4 refers to the first plastic block 41 and the second plastic block 42 before the metal circuit 1 is bent. The upper surface 411 of the plastic block 4 is flush with or higher than the top surface 31 of the insulating base 3, thereby preventing the molding material of the insulating base 3 from being poured into the groove 43 of the plastic block 4 during the secondary injection molding of the insulating base 3.

[0037] The base 100 further includes a metal plate 5, which has a top surface 52 and a bottom surface 53 disposed opposite to each other in the vertical direction. The plastic block 4 covers the solder foot 12 to isolate the solder foot 12 from the metal plate 5, or in other words, to isolate the high-temperature welding process of the solder foot 12 from the embedding and positioning process of the metal plate 5. Specifically, the plastic block 4 here refers to the first plastic block 41 located in the horizontal direction, and the solder foot 12 refers to the first solder foot 121. The metal plate 5 is embedded in the insulating base 3, that is, the metal plate 5 is embedded in the insulating base 3, and the bottom surface 53 of the metal plate 5 is flush with or lower than the bottom surface 32 of the insulating base 3. The metal plate 5 and the metal circuit 1 are parallel and spaced apart in the vertical direction. The metal plate 5 is provided with a plurality of first ejector pin holes 54 that expose the branch circuit 10. During the secondary injection molding of the insulating base 3, the external ejector pin (not shown) abuts against the metal circuit 1 through the ejector pin holes 54 to position the metal plate 5 and the metal circuit 1 at an interval. Correspondingly, the insulating base 3 is provided with a plurality of second ejector pin holes 34 that penetrate the top surface 31 and the bottom surface 32 to facilitate the external ejector pin abutting against the metal circuit 1. The first ejector pin holes 54 and the second ejector pin holes 34 are collectively referred to as ejector pin holes (not labeled).

[0038] The metal plate 5 is provided with a clearance part 51 corresponding to the clearance hole 33. The clearance part 51 has an opening (not labeled). The clearance part 51 makes way for the first plastic block 41, so that the projection of the first plastic block 41 in the vertical direction does not overlap with the projection of the metal plate 5 in the vertical direction. At the same time, there is a gap 56 between the clearance part 51 and the first plastic block 41, which is filled by the insulating base 3. In this way, when the first plastic block 41 and the metal plate 5 are injection molded for the second time, the first plastic block 41 will not crack due to the difference in the coefficients of thermal expansion of the two due to their close contact.

[0039] The upper surface 411 of the first plastic block 41 is flush with or higher than the top surface 31 of the insulating base 3, the bottom surface 53 of the metal plate 5 is flush with or lower than the bottom surface 32 of the insulating base 3, and the lower surface 412 of the plastic block 4 is flush with or higher than the bottom surface 53 of the metal plate 5. Here, "plastic block 4" refers to the first plastic block 41. Furthermore, the bottom surface 53 of the metal plate 5 is necessarily lower than or flush with the bottom surface 32 of the insulating base 3, and simultaneously, the bottom surface 53 of the metal plate 5 is also lower than or flush with the lower surface 412 of the plastic block 4 (specifically, the first plastic block 41). The height of the first plastic block 41 in the vertical direction is greater than or equal to the distance between the bottom surface 53 of the metal plate 5 and the top surface 31 of the insulating base 3. That is, the thickness of the plastic block 4 is greater than or equal to the thickness of the main body 30 of the insulating base 3 formed after secondary injection molding. This gives the plastic block 4 a relatively thick thickness, which can prevent the side surface (unlabeled) of the plastic block 4 from bending due to the large impact force of the liquid molten plastic during the secondary injection molding of the insulating base 3. This can also prevent the groove 43 from deforming and further ensure the performance of the electronic component 2.

[0040] The metal plate 5 is also provided with a bending part 55 at the four corners, which bends to one side, specifically upward. The bending part 55 is provided in the insulating base 3 so that the metal plate 5 and the insulating base 3 are formed into one piece during the secondary injection molding, so that the two can be better fitted and fixed together.

[0041] The present invention also relates to a method for manufacturing a base 100 with a metal circuit 1, specifically including the following steps: Step 1: Form a metal circuit 1 on the same strip. The metal circuit 1 includes a plurality of spaced branches 10. One end of each branch 10 is parallel and spaced to form a lead end 11, and the other end of each branch 10 forms a solder end 12. Step 2: Injection molding is performed on the welding foot end 12 to form a plastic block 4 that holds the welding foot end 12 (in other embodiments, the number of plastic blocks 4 is not limited and is set according to the position of the welding foot end 12), and the welding foot end 12 is exposed on the upper surface 411 provided by the plastic block 4 and has a top wall 123. Step 3: Place the electronic component 2 inside the plastic block 4 and weld it to the corresponding soldering end 12; the plastic block 4 is provided with a groove 43, the groove 43 is provided with an inner wall 431, the soldering end 12 is exposed in the groove 43, the electronic component 2 is housed in the groove 43, the height of the electronic component 2 in the vertical direction is greater than the depth of the groove 43, and a gap G is formed between the electronic component 2 and the inner wall 431 of the groove 43.

[0042] Fourth step, a metal plate 5 connected with a material strip is provided. The metal plate 5 is located at the bottom of the metal circuit 1, and the metal circuit 1 and the metal plate 5 are arranged opposite to each other at intervals. The metal circuit 1 and the metal plate 5 are fixed to each other by the material strip between them. A plurality of first ejector pin holes 54 are provided on the metal plate 5. When the insulating base 3 is injection molded in the second stage, the ejector pins abut against the metal circuit 1 through the first ejector pin holes 54 to keep the metal plate 5 and the metal circuit 1 at intervals. At the same time, the metal plate 5 is provided with a clearance part 51 to allow the plastic block 4 to pass, so that the projection of the plastic block 4 in the vertical direction does not overlap with the projection of the metal plate 5 in the vertical direction. A gap 56 is formed between the clearance part 51 and the plastic block 4. Fifth step, bend the metal circuit 1 so that the metal circuit 1 has a horizontal portion 13 and a vertical portion 14. The solder joint 12 of the branch 10 includes a first solder joint 121 disposed on the horizontal portion 13 and a second solder joint 122 disposed on the vertical portion 14. The first solder joint 121 is covered with a first plastic block 41, and the second solder joint 122 is covered with a second plastic block 42. As the metal circuit 1 is bent, the second plastic block 42 moves from the plane where the horizontal portion 13 is located to the plane where the vertical portion 14 is located. The lower surface 412 of the plastic block 4 is flush with or higher than the bottom surface 53 of the metal plate 5, and the height of the plastic block 4 is greater than or equal to the distance between the bottom surface 53 of the metal plate 5 and the top surface 31 of the insulating base 3. Step 6: Place the metal circuit 1, electronic component 2, metal plate 5 and plastic block 4 into a reflow oven to solder the metal circuit 1 and the electronic component 2; Step 7: Perform secondary injection molding to cover the metal circuit 1, plastic block 4 and metal plate 5 to form an insulating base 3, and fill the gap 56 with the material of the secondary injection molded insulating base 3. Cut the material strip on the metal circuit 1 and metal plate 5 to obtain multiple independent bases 100.

[0043] During the secondary injection molding of the insulating base 3, the metal circuit 1 and the metal plate 5 are separated by the insulating base 3, and the bending part 55 makes the metal plate 5 and the insulating base 3 fit and fix more stably.

[0044] In other implementations, the fifth step may be performed before the fourth step.

[0045] In this embodiment of the application, the electronic component 2 is soldered to the solder pad 12 by SMT (Surface Mount Technology).

[0046] This invention utilizes a two-stage (multi-stage) injection molding process. In the first injection molding, a plastic block 4 is formed, improving the mold opening accuracy near the solder joint 12 of the metal circuit 1 and facilitating the soldering of the electronic component 2. The plastic block 4, metal circuit 1, and metal plate 5 are then integrally fixed within the insulating base 3 through the second injection molding. Simultaneously, after the metal circuit 1 and electronic component 2 are soldered, the metal plate 5 is embedded in the insulating base 3, achieving both increased structural strength and miniaturization. The vertical projection of the first plastic block 41 and the metal plate 5 in the horizontal portion 13 avoids cracking of the first plastic block 41 due to the significant difference in thermal expansion coefficients between the metal plate 5 and the first plastic block 41 during the second injection molding of the insulating base 3. In addition, the thickness of the plastic block 4 is at least equal to the thickness of the insulating base 3 formed by the secondary injection molding. That is, the upper surface 411 of the plastic block 4 is higher than or flush with the top surface 31 of the insulating base 3, and the bottom surface 53 of the metal plate 5 is lower than or flush with the bottom surface 32 of the insulating base 3. On the one hand, this can prevent the side surface of the plastic block 4 from deforming or breaking due to the flow force of the liquid plastic during the secondary injection molding process. On the other hand, it can reduce the overall thickness of the base 100 as much as possible.

[0047] In the first embodiment of the present invention, reference is made to... Figure 10 The top side 15 of the metal circuit 1 is not exposed to the top surface 31 of the insulating base 3. In the preferred embodiment, i.e., referring to... Figure 11 In the second embodiment of the present invention, the top side 15' of the metal circuit 1' is exposed to the top surface 31' of the insulating base, so that the size of the base 100' can be reduced as much as possible to meet the requirements of thinner and lighter electronic products.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0049] The above description is only a partial embodiment of the present invention, not all embodiments. Any equivalent changes to the technical solutions of the present invention made by those skilled in the art through reading the present invention specification are covered by the claims of the present invention.

Claims

1. A motor base, comprising an insulating base, a metal circuit, a plastic block holding the metal circuit, and electronic components soldered to the metal circuit, wherein the metal circuit includes a plurality of branches spaced apart, one end of each branch being spaced apart to form pins, the other end of each branch forming solder pads, the solder pads being embedded in and exposed to the plastic block, and the electronic components being soldered to the solder pads, characterized in that: The base also includes a metal plate, the metal circuit and the plastic block are embedded in the insulating base by injection molding, the metal plate has a clearance part to make way for the plastic block, and a gap is formed between the clearance part and the plastic block and is filled by the insulating base.

2. The motor base as described in claim 1, characterized in that: The metal plate is spaced apart from the metal circuit, the plastic block has a groove, the solder feet are exposed in the groove and soldered to the electronic components housed in the groove, and the plastic block isolates the solder feet from the metal plate.

3. The motor base as described in claim 1, characterized in that: The metal circuit includes a horizontally arranged portion, the solder joint includes a first solder joint disposed on the horizontal portion, the plastic block includes a first plastic block injection molded on the first solder joint and arranged horizontally, the first plastic block has an upper surface and a lower surface disposed opposite each other in the vertical direction, and the first solder joint is exposed on the upper surface; the insulating base includes a horizontally arranged main body, the first plastic block is embedded in the main body, the main body has a top surface and a bottom surface disposed opposite each other in the vertical direction, and the upper surface of the first plastic block is flush with or higher than the top surface of the main body.

4. The motor base as described in claim 3, characterized in that: The metal plate is embedded in the main body. The metal plate has a top surface and a bottom surface that are arranged opposite each other in the vertical direction. The bottom surface of the metal plate is flush with or lower than the bottom surface of the main body. The bottom surface of the metal plate is flush with or lower than the lower surface of the first plastic block.

5. The motor base as described in claim 1, characterized in that: The metal plate has a bent portion that bends to one side, and the bent portion is disposed in the insulating base so that the metal plate and the insulating base are formed as one piece.

6. The motor base as described in claim 1, characterized in that: The insulating base has a number of pin holes that expose the metal branches.

7. A method for manufacturing a motor base, characterized in that, Includes the following steps: The first step is to provide a metal circuit with several branches, one end of which is arranged in parallel and spaced apart to form a pin terminal, and the other end of which forms a solder pad terminal; The second step is to perform injection molding on the solder foot end to form a plastic block that holds the solder foot end, with the solder foot end exposed to the plastic block. The third step is to place the electronic components inside the plastic block and solder them to the corresponding soldering pins. Fourth step, a metal plate is provided, the metal plate having a clearance portion to allow the plastic block to pass, and a gap is formed between the clearance portion and the plastic block; The fifth step involves secondary injection molding of the metal plate, metal circuit, and plastic block to form an insulating base and fill the gaps, thereby forming the motor base.

8. The method for manufacturing the motor base as described in claim 7, characterized in that: In the fourth step, the metal circuit and the metal plate are arranged at intervals relative to each other, and the metal circuit and the metal plate are fixed relative to each other by a strip.

9. The method for manufacturing the motor base as described in claim 7, characterized in that: The plastic block has a groove, the solder feet are exposed in the groove and soldered to the electronic component housed in the groove, and the plastic block isolates the solder feet from the metal plate.

10. The method for manufacturing the motor base as described in claim 7, characterized in that: In the fifth step, during the secondary injection molding of the insulating base, ejector pins are used to hold the metal circuit, thereby creating a number of ejector pin holes on the insulating base that expose the metal branches.

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