A power module, motor controller, electric drive assembly, and vehicle

Abstract

The embodiment of the present application discloses a power module, a motor controller, an electric drive assembly and a vehicle. The power module comprises: at least one sub-power module, the sub-power module comprises an upper bridge module and a lower bridge module, the upper bridge module and the lower bridge module are arranged along a first direction; at least one alternating current transmission structure is electrically connected with the at least one sub-power module one by one, the alternating current transmission structure and the sub-power module electrically connected with the alternating current transmission structure are arranged along a second direction; and the first direction intersects with the second direction. The present application can more reasonably utilize the space of the power module and improve the use performance of the power module.

Description

[0001] This application claims priority to Chinese Patent Application No. 202510522780.4, filed on April 23, 2025, entitled “A Power Module, Motor Controller, Electric Drive Assembly and Vehicle”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to the field of power device technology, and in particular to a power module, a motor controller, an electric drive assembly, and a vehicle. Background Technology

[0003] With the rapid development of semiconductor technology, the performance of power devices has been greatly improved. Power devices can withstand increasingly larger currents and are becoming smaller in size.

[0004] Power devices can be combined to form sub-power modules, and these sub-power modules can be embedded within power modules to improve integration. However, in related technologies, power modules with integrated sub-power modules have low space utilization and their performance needs improvement. Summary of the Invention

[0005] This invention provides a power module, a motor controller, an electric drive assembly, and a vehicle to improve the space utilization and performance of the power module.

[0006] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0007] According to a first aspect of the present invention, an embodiment of the present invention provides a power module, the power module comprising:

[0008] At least one sub-power module, the sub-power module comprising an upper bridge module and a lower bridge module, the upper bridge module and the lower bridge module being arranged along a first direction;

[0009] At least one AC transmission structure is electrically connected to at least one sub-power module in a one-to-one correspondence, and the AC transmission structure and the sub-power module electrically connected thereto are arranged along a second direction; the first direction intersects the second direction.

[0010] Optionally, the AC terminal of the sub-power module is electrically connected to the AC transmission structure.

[0011] Optionally, the AC transmission structure and the lower bridge module of the sub-power module electrically connected thereto are arranged along the second direction; or,

[0012] The AC transmission structure and the upper bridge module of the sub-power module electrically connected thereto are arranged along the second direction.

[0013] Optionally, the at least one sub-power module includes a first sub-power module, a second sub-power module, and a third sub-power module;

[0014] The at least one AC transmission structure includes a first AC transmission structure, a second AC transmission structure, and a third AC transmission structure;

[0015] The first AC transmission structure is electrically connected to the first sub-power module, the second AC transmission structure is electrically connected to the second sub-power module, and the third AC transmission structure is electrically connected to the third sub-power module;

[0016] The first sub-power module, the second sub-power module, and the third sub-power module are arranged along the second direction.

[0017] Optionally, the first AC transmission structure is located between the first sub-power module and the second sub-power module; the second AC transmission structure is located between the second sub-power module and the third sub-power module; and the third AC transmission structure is located on the side of the third sub-power module away from the second sub-power module.

[0018] Alternatively, the first AC transmission structure is located on the side of the first sub-power module away from the second sub-power module, the second AC transmission structure is located between the first sub-power module and the second sub-power module, and the third AC transmission structure is located on the side of the third sub-power module away from the second sub-power module;

[0019] Alternatively, the first AC transmission structure is located on the side of the first sub-power module away from the second sub-power module, and the second AC transmission structure and the third AC transmission structure are located between the second sub-power module and the third sub-power module;

[0020] Alternatively, the first AC transmission structure and the second AC transmission structure are located between the first sub-power module and the second sub-power module, and the third AC transmission structure is located between the second sub-power module and the third sub-power module.

[0021] Optionally, the power module further includes a multilayer conductive layer, in which at least one sub-power module is embedded; and the AC transmission structure is at least partially disposed in the multilayer conductive layer.

[0022] Optionally, the multilayer conductive layer includes a third conductive layer and a fourth conductive layer;

[0023] The sub-power module is disposed in a through hole that penetrates the third conductive layer and the fourth conductive layer.

[0024] Optionally, the multilayer conductive layer includes a fifth conductive layer, a portion of which forms a first transmission section, which is electrically connected to the upper bridge module and the lower bridge module of the same sub-power module.

[0025] Optionally, the AC transmission structure includes a first AC output unit, which is electrically connected to the first transmission unit.

[0026] Optionally, both the first AC output section and the first transmission section are disposed on the fifth conductive layer.

[0027] Optionally, the AC transmission structure further includes a second AC output section, which is disposed in a through hole penetrating the third conductive layer and the fourth conductive layer, and is electrically connected to the first AC output section.

[0028] Optionally, the fifth conductive layer further includes a third transmission section, and the DC terminals of the upper bridge module and the power module are both electrically connected to the third transmission section.

[0029] Optionally, the multilayer conductive layer includes a second conductive layer, and the second conductive layer includes a second transmission section; the upper bridge module and the lower bridge module of the same sub-power module are both electrically connected to the second transmission section.

[0030] Optionally, the second conductive layer further includes a fourth transmission section, and the DC terminals of both the lower bridge module and the power module are electrically connected to the fourth transmission section.

[0031] According to another aspect of the present invention, a motor controller is provided, the motor controller including the power module as described above.

[0032] According to another aspect of the present invention, an electric drive assembly is provided, the electric drive assembly including the motor controller as described above; or, the electric drive assembly including the power module as described above.

[0033] According to another aspect of the invention, a vehicle is provided, the vehicle including the electric drive assembly as described above; or, the vehicle including the motor controller as described above; or, the vehicle including the electric drive assembly as described above.

[0034] The technical solution provided in this invention employs a power module comprising at least one sub-power module, which includes an upper bridge module and a lower bridge module arranged along a first direction; at least one AC transmission structure electrically connected to at least one sub-power module in a one-to-one correspondence, and the AC transmission structure and the sub-power module electrically connected thereto arranged along a second direction; the first direction and the second direction intersect. Arranging the AC transmission structure and the corresponding sub-power module along the second direction, rather than along the first direction, allows for more efficient use of the extra space in the power module, resulting in higher integration, reduced power module size, and improved performance. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the structure of a power module in related technologies;

[0037] Figure 2 A schematic diagram of the structure of a power module provided in an embodiment of the present invention;

[0038] Figure 3 A schematic diagram of the circuit structure of a sub-power module provided in an embodiment of the present invention;

[0039] Figure 4 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0040] Figure 5 A schematic diagram of a three-phase full-bridge circuit provided for an embodiment of the present invention;

[0041] Figure 6 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0042] Figure 7 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0043] Figure 8 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0044] Figure 9 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0045] Figure 10 A schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention;

[0046] Figure 11 A schematic diagram of the structure of the fourth conductive layer of a power module provided in an embodiment of the present invention;

[0047] Figure 12 A schematic diagram of the structure of the fifth conductive layer of a power module provided in an embodiment of the present invention;

[0048] Figure 13 A cross-sectional view of a power module along the A1A2 direction provided in an embodiment of the present invention;

[0049] Figure 14 This is a cross-sectional view of a power module along the A3A4 direction, provided for an embodiment of the present invention. Detailed Implementation

[0050] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0051] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0052] Figure 1 This is a schematic diagram of the structure of a power module in related technologies, for reference. Figure 1In related technologies, a power module includes a sub-power module and corresponding phase busbar connection terminals 2A. The sub-power module includes an upper bridge module 11A and a lower bridge module 12A, which are arranged along a first direction X. Along the first direction X, the T+ terminal 3A for connecting the upper bridge module 11A and the T- terminal 4A for connecting the lower bridge module are located on the first side of the sub-power module, while the phase busbar connection terminals 2A for connecting the series nodes in the upper bridge module 11A and the lower bridge module 12A are located on the second side of the sub-power module relative to the first side. When the lower bridge module 12A is connected to the corresponding T- terminal in the sub-power module, current paths need to be arranged on both sides of the upper bridge module 11A, which makes the size of the sub-power module larger than that of the upper bridge module in the second direction Y. Placing the phase busbar connection terminals 2A on the second side of the sub-power module results in a larger size of the sub-power module in the first direction, while there is significant space wastage on both sides of the lower bridge module 12A along the second direction Y.

[0053] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0054] Figure 2 This is a schematic diagram of a power module provided in an embodiment of the present invention, with reference to... Figure 2 The power module includes at least one sub-power module 1 and at least one AC transmission structure 2. The sub-power module 1 includes an upper bridge module 11 and a lower bridge module 12, which are arranged along a first direction X. The at least one AC transmission structure 2 is electrically connected to the at least one sub-power module 1 in a one-to-one correspondence. The AC transmission structure 2 and the sub-power module 1 electrically connected to it are arranged along a second direction Y. The first direction X intersects the second direction Y.

[0055] In some implementations, each sub-power module constitutes a half-bridge circuit. The AC transmission structure 2 is electrically connected to the series node of the upper bridge module 12 and the lower bridge module 12, and the AC transmission structure 2 is used to input or output AC signals.

[0056] In this embodiment, the upper bridge module 11 and lower bridge module 12 in the sub-power module 1 are arranged along the first direction X, while the sub-power module and the corresponding AC transmission structure 3 are arranged along the second direction Y. The first direction X intersects the second direction Y. That is, the upper bridge module 11, lower bridge module 12, and AC transmission structure 3 are not arranged along the same direction. Since the upper bridge module 11 and lower bridge module 12 are arranged along the first direction X, the copper busbar corresponding to the upper bridge module 11 needs to be connected to the side of the upper bridge module 11 away from the lower bridge module along the first direction X, and the copper busbar corresponding to the lower bridge module 12 needs to be connected to the side of the upper bridge module 11 away from the lower bridge module 12 along the first direction X; that is, the terminal of the connecting busbar corresponding to the sub-power module is located on the side of the upper bridge module 11 away from the lower bridge module along the first direction X (e.g., Figure 2 (The upper side of the middle). The size of the power module in the second direction Y needs to be larger than the size of the sub-power module. This allows for extra space on both sides of the upper bridge module 11 to form the power loop of the lower bridge module 12, which is the loop connecting the lower bridge module to the corresponding bus connection terminal. The size of the power module in the second direction Y is larger than the size of the sub-power module 1 in the second direction Y. There is extra space on both sides of the sub-power module 1, meaning the power module has more space in the second direction Y. Therefore, arranging the sub-power modules 1 corresponding to the AC transmission structure 2 along the second direction Y allows for more efficient use of the power module space, resulting in higher integration of the power module, reducing its size, and improving its performance. In some embodiments,

[0057] The technical solution of this embodiment employs a power module including at least one sub-power module, which includes an upper bridge module and a lower bridge module, arranged along a first direction; at least one AC transmission structure is electrically connected to at least one sub-power module in a one-to-one correspondence, and the AC transmission structure and the sub-power module electrically connected to it are arranged along a second direction; the first direction and the second direction intersect. Arranging the AC transmission structure and the corresponding sub-power module along the second direction, rather than along the first direction, allows for more efficient use of the extra space in the power module, resulting in higher integration, reduced power module size, and improved performance.

[0058] Optionally, in some implementations, the AC terminal of the sub-power module is electrically connected to the AC transmission structure 2.

[0059] Specifically, sub-power module 1 in the power module can be used to form a switching power supply or an inverter, etc. For example... Figure 3 As shown, Figure 3This is a schematic diagram of the circuit structure of a sub-power module provided in an embodiment of the present invention. Each sub-power module 1 includes an upper bridge module 11 and a lower bridge module 12 connected in series. The upper bridge module 11 and the lower bridge module 12 are connected in series at a series node K, which is also the AC terminal of the sub-power module. More specifically, the first terminal of the upper bridge module 11 is electrically connected to the T+ terminal, and the second terminal of the upper bridge module 11 is electrically connected to the series node K; the first terminal of the lower bridge module 12 is electrically connected to the T- terminal, and the second terminal of the lower bridge module 12 is electrically connected to the series node K. The T+ terminal can be connected to the positive bus of the DC bus, and the T- terminal can be connected to the negative bus of the DC bus, for example; in some other embodiments, the T+ terminal can be connected to the negative bus of the DC bus, and the T- terminal can be connected to the positive bus of the DC bus. The upper bridge module 11 can be a power device, and the upper bridge module 11 functions as a switch. The upper bridge module 11 can include at least one power switch, but this embodiment does not specifically limit this. The downbridge module 12 can be, for example, a power device. The downbridge module 12 functions as a switch and may include at least one power switch. This embodiment does not specifically limit this.

[0060] Each sub-power module corresponds to an AC transmission structure 2. The AC transmission structure 2 can be understood as a structure connected to the series node K on the power module and used for contact with external components. The AC transmission structure 2 is used to output the AC signal at the series node K to the outside. Of course, in some other embodiments, it can also transmit the external AC signal to the series node K.

[0061] Optionally, in some embodiments, the AC transmission structure 2 and the lower bridge module 12 of the sub-power module 1 electrically connected thereto are arranged along the second direction Y.

[0062] Specifically, there is excess space on both sides of the lower bridge module 12 along the second direction Y. That is, the power module has ample space along the second direction Y. Therefore, arranging the AC transmission structure 2 and the lower bridge module 12 along the second direction Y allows for more efficient use of the power module space, resulting in higher integration, reduced power module size, and improved performance. Furthermore, the space on both sides of the lower bridge module 12 along the second direction Y does not require a structure for current transmission between the lower bridge module 12 and the T- terminal. Therefore, this embodiment not only makes efficient use of the power module space but also does not affect the performance of current transmission between the lower bridge module 12 and the T- terminal, nor does it affect the performance of current transmission between the upper bridge module 11 and the T+ terminal.

[0063] Alternatively, in some implementations, such as Figure 4 As shown, Figure 4This is a schematic diagram of another power module provided in an embodiment of the present invention. The AC transmission structure 2 and the upper bridge module 11 of the sub-power module electrically connected thereto are arranged along the second direction Y. In the power module, the space on both sides of the upper bridge module 11 along the second direction Y is relatively large. Therefore, the arrangement in this embodiment can reduce the size of the power module along the first direction X, thereby making more reasonable use of the space of the power module and improving the integration.

[0064] It should be noted that the two modules described in this embodiment are arranged along a certain direction, which can be understood as at least having a straight line extending along that direction that passes through the two modules.

[0065] Optionally, the power module may include, for example, a PCB (Printed Circuit Board).

[0066] Optionally, in some implementations, the first direction X is perpendicular to the second direction Y.

[0067] Optionally, in some embodiments, the power module is, for example, an embedded power module, which can form an inverter circuit. Further, the inverter circuit can be used in a vehicle to provide drive current to the electric motor in the vehicle. In this embodiment, the AC transmission structure 2 can transmit the AC current generated at the series node K to the outside of the drive current board, and then to the electric motor.

[0068] It is understandable that after the sub-power modules 1 form a full-bridge circuit, each sub-power module 1's series node K can output a phase current.

[0069] Optionally, in some embodiments, at least one sub-power module includes a first sub-power module 1 (U), a second sub-power module 1 (V), and a third sub-power module 1 (W); at least one AC transmission structure includes a first AC transmission structure 2 (U), a second AC transmission structure 2 (V), and a third AC transmission structure 2 (W). The first AC transmission structure 2 (U) is electrically connected to the first sub-power module 1 (U), the second AC transmission structure 2 (V) is electrically connected to the second sub-power module 1 (V), and the third AC transmission structure 2 (W) is electrically connected to the third sub-power module 1 (W); the first sub-power module 1 (U), the second sub-power module 1 (V), and the third sub-power module 1 (W) are arranged along a second direction Y.

[0070] Specifically, such as Figure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram of a three-phase full-bridge circuit provided in an embodiment of the present invention. Figure 6This is a schematic diagram of another power module provided in an embodiment of the present invention. The power module includes three sub-power modules 1 arranged along the second direction Y. The three sub-power modules 1 form a three-phase full-bridge circuit, namely, the first sub-power module 1(U), the second sub-power module 1(V), and the third sub-power module 1(W) form a three-phase full-bridge circuit. The first sub-power module 1(U) can be a U-phase sub-power module, the second sub-power module 1(V) can be a V-phase sub-power module, and the third sub-power module 1(W) can be a W-phase sub-power module. The upper bridge module in the first sub-power module 1(U) is the first upper bridge module 11(U), the lower bridge module in the first sub-power module is the first lower bridge module 12(U), and the series node in the first sub-power module is the first series node K(U). The upper bridge module in the second sub-power module 1(V) is the second upper bridge module 11(V), the lower bridge module in the second sub-power module is the second lower bridge module 12(V), and the series node in the second sub-power module is the second series node K(V). The upper bridge module in the third sub-power module 1(W) is the third upper bridge module 11(W), the lower bridge module in the third sub-power module is the third lower bridge module 12(W), and the series node in the third sub-power module is the third series node K(W). The first series node K(U) is electrically connected to the U phase of the three-phase motor through the first AC transmission structure 2(U), the second series node K(V) is electrically connected to the V phase of the three-phase motor through the second AC transmission structure 2(V), and the third series node K(W) is electrically connected to the W phase of the three-phase motor through the third AC transmission structure 2(W). The T+ terminals of the three sub-power modules are shared, and the T- terminals of the three sub-power modules are shared. When the power module includes a three-phase full-bridge circuit, the AC transmission structures corresponding to different sub-power modules are insulated. In this embodiment, the first sub-power module 1(U), the second sub-power module 1(V), and the third sub-power module 1(W) are arranged sequentially along the second direction Y. Furthermore, the sub-power module 1 and the AC transmission structure 2 electrically connected to it are adjacent, meaning that no other sub-power modules or other AC transmission structures are set between them. This facilitates the electrical connection between the sub-power module and the corresponding AC transmission structure.

[0071] Optionally, such as Figure 6As shown, in some embodiments, the first AC transmission structure 2(U) is located between the first sub-power module 1(U) and the second sub-power module 1(V); the second AC transmission structure 2(V) is located between the second sub-power module 1(V) and the third sub-power module 1(W); and the third AC transmission structure 2(W) is located on the side of the third sub-power module 1(W) away from the second sub-power module 1(V). The different AC transmission structures are located on the same side of their respective sub-power modules, resulting in a more uniform distribution of all AC transmission structures in the second direction Y within the power module, which helps reduce signal interference. The greater distance between the different AC transmission structures also allows for better insulation and facilitates connection to the copper busbars for electrical connection with the motor.

[0072] Alternatively, in some other embodiments, such as Figure 7 As shown, Figure 7 This is a schematic diagram of another power module structure provided in an embodiment of the present invention. A first AC transmission structure 2(U) is located on the side of the first sub-power module 1(U) away from the second sub-power module 1(V); a second AC transmission structure 2(V) is located between the first sub-power module 1(U) and the second sub-power module 1(V); and a third AC transmission structure 2(W) is located on the side of the third sub-power module 1(W) away from the second sub-power module 2(V). The greater distance between the second AC transmission structure 2(V) and the third AC transmission structure 2(W) is more advantageous for connecting the AC transmission structure to the copper busbar electrically connected to the motor.

[0073] Alternatively, in some other embodiments, such as Figure 8 As shown, Figure 8 This is a schematic diagram of another power module provided in an embodiment of the present invention. The first AC transmission structure 2 (U) is located on the side of the first sub-power module 1 (U) away from the second sub-power module 1 (V); the second AC transmission structure 2 (V) and the third AC transmission structure 2 (W) are located between the second sub-power module 1 (V) and the third sub-power module 1 (W).

[0074] Alternatively, in some other embodiments, such as Figure 9 As shown, Figure 9 This is a schematic diagram of another power module provided in an embodiment of the present invention. The first AC transmission structure 2(U) and the third AC transmission structure 2(V) are located between the first sub-power module 1(U) and the second sub-power module 1(V); the third AC transmission structure 2(W) is located between the second sub-power module 1(V) and the third sub-power module 1(W).

[0075] Optionally, in some embodiments, the cross-sectional shapes and dimensions of the different AC transmission structures are the same. The projections of the different AC transmission structures along the second direction Y overlap.

[0076] Optionally, in some embodiments, the power module includes multiple conductive layers, with at least one sub-power module embedded in the multiple conductive layers; at least a portion of the AC transmission structure is disposed in the multiple conductive layers. Optionally, the upper bridge module 11 and the lower bridge module 12 are embedded in the multiple conductive layers. More specifically, the upper boundaries of the upper bridge module 11 and the lower bridge module 12 along the thickness direction in the multiple conductive layers can be substantially flush, and similarly, the lower boundaries can also be substantially flush, for example, they can each penetrate through two through-holes in at least two identical conductive layers. The two conductive layers mentioned above can be adjacent conductive layers or different conductive layers. For example, if the upper bridge module 11 and the lower bridge module 12 are located in through-holes penetrating the first conductive layer and the second conductive layer, respectively, then the surface of the upper bridge module 11 away from the second conductive layer can be substantially flush with the surface of the first conductive layer away from the second conductive layer, and the surface of the upper bridge module 11 away from the first conductive layer can be substantially flush with the surface of the second conductive layer away from the first conductive layer. Similarly, the surface of the lower bridge module 12 away from the second conductive layer can be approximately flush with the surface of the first conductive layer away from the second conductive layer, and the surface of the lower bridge module 12 away from the first conductive layer can be approximately flush with the surface of the second conductive layer away from the first conductive layer. The term "approximately flush" can be understood as the vertical distance between the two surfaces being within a certain threshold range. This threshold range can be determined based on the thickness of the conductive layer corresponding to the surface, such as not exceeding the thickness of the corresponding conductive layer. The corresponding conductive layer can be the conductive layer on which one of the approximately flush surfaces is located.

[0077] In some embodiments, optionally, the multilayer conductive layer may include at least five conductive layers. The at least five conductive layers may include a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked sequentially. The first conductive layer can be used to connect surface-mount devices such as resistors and capacitors, and gate drive circuits or protection circuits can be connected to the first conductive layer. The second conductive layer can be electrically connected to the second end of the upper bridge module and the first end of the lower bridge module. The sub-power module is disposed within a through-hole penetrating the third and fourth conductive layers. The upper bridge module and the lower bridge module can be respectively disposed within the through-hole penetrating the third and fourth conductive layers. The fifth conductive layer can be used to connect the first end of the upper bridge module and the second end of the lower bridge module. Of course, in other embodiments, the multilayer conductive layer may also include a sixth conductive layer that is not used for transmitting electrical signals but for connecting the heat sink via a connection method such as sintered silver / sintered copper / welding, and the sixth conductive layer is located on the side of the fifth conductive layer away from the first conductive layer. It is understood that the aforementioned conductive layers may be, for example, metallic conductive layers, more specifically, materials such as copper, aluminum, nickel-gold, or alloys of the aforementioned materials. An electrically insulating material is also disposed between adjacent conductive layers, such as plastic, ceramic, laminate, glass, or pre-impregnated composite fiber. In other embodiments, the power module further includes materials such as FR-2, FR-3, FR-4, CEM-1, CEM-2, or CEM-3. In other embodiments, resin material may be filled between adjacent conductive layers in the first to fifth conductive layers, and a thermally conductive insulating film may be disposed between the fifth and sixth conductive layers.

[0078] Optionally, Figure 2 and Figure 4 This can be understood as the second conductive layer of the power module; Figure 10 This is a schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention. Figure 11 This is a schematic diagram of the structure of the fourth conductive layer of a power module provided in an embodiment of the present invention. Figure 12 This is a schematic diagram of the structure of the fifth conductive layer of a power module provided in an embodiment of the present invention. Figure 13 This is a cross-sectional view of a power module along the A1A2 direction provided in an embodiment of the present invention. Figure 14 A cross-sectional view of a power module along the A3A4 direction is provided for an embodiment of the present invention, with reference to... Figures 1 to 14 Only the A1A2 and A3A4 directions are marked on the second conductive layer. The conductive layers are designated as first conductive layer L1, second conductive layer L2, third conductive layer L3, fourth conductive layer L4, fifth conductive layer L5, and sixth conductive layer L6. For example... Figure 13 and Figure 14As shown, optionally, the upper bridge module 11 can be disposed in the through-hole penetrating the third conductive layer L3 and the fourth conductive layer L4 in the power module. The surface of the upper bridge module 11 near the first conductive layer L1 can be approximately flush with the surface of the third conductive layer L3 near the first conductive layer L1, and the surface of the upper bridge module 11 near the fifth conductive layer L5 can be approximately flush with the surface of the fourth conductive layer L4 near the fifth conductive layer L5. Similarly, optionally, the surface of the lower bridge module 12 near the first conductive layer L1 can be approximately flush with the surface of the third conductive layer L3 near the first conductive layer L1, and the surface of the lower bridge module 13 near the fifth conductive layer L5 can be approximately flush with the surface of the fourth conductive layer L4 near the fifth conductive layer L5. For a more detailed understanding of "approximately flush," please refer to the description above, which will not be repeated here. Furthermore, for the second conductive layer L2 and the fifth conductive layer L5, there is no upper bridge module and lower bridge module structure. Therefore, the projection area 11' of the upper bridge module 11, the projection area 12' of the lower bridge module, the projection area 111' of the first power switch, and the projection area 121' of the second power switch are illustrated in the second conductive layer L2 and the fifth conductive layer L5.

[0079] Continue to refer to Figure 13 and Figure 14 The first end of the upper bridge module 11 can be disposed on the second surface of the upper bridge module 11, and the second end of the upper bridge module 11 can be disposed on the first surface of the upper bridge module 11. The first end of the lower bridge module 12 can be disposed on the first surface of the lower bridge module 12, and the second end of the lower bridge module 12 can be disposed on the second surface of the lower bridge module 12. Further, in some embodiments, such as Figures 2 to 14As shown, the upper bridge module 11 includes a plurality of first power switches 111 arranged in an array, and the plurality of first power switches 111 are connected in parallel; the lower bridge module 12 includes a plurality of second power switches 121 arranged in an array, and connected in parallel. In some embodiments, the upper bridge module 11 may optionally include a first copper block 112, which may have a groove, and the first power unit 111 is disposed in the groove. The plurality of first power switches connected in parallel may be located together in the same groove of the first copper block 112, or each first power switch may correspond to one first copper block 112. Similarly, the lower bridge module 12 may also include a second copper block 122, which may have a groove, and the second power unit 122 is located in the groove of the second copper block 122. The plurality of second power switches 121 connected in parallel may be located together in the same groove of the second copper block 122, or each second power switch 121 may correspond to one second copper block 122. The power switches may be MOSFETs, IGBTs, HEMTs, etc. In some embodiments, optionally, the power switch can be positioned approximately at the location of the third conductive layer, and the corresponding copper block can be positioned across the third and fourth conductive layers. The copper block provides a heat dissipation channel for the power switch and a current channel for it. The first end of the first power switch 111 can be electrically connected to the corresponding first copper block 122, and the surface of the first copper block 122 near the fifth conductive layer L5 serves as the surface of the upper bridge module 11 near the fifth conductive layer L5. The surface of the first copper block 122 near the fifth conductive layer L5 can serve as the first end of the upper bridge module 11. The surface of the first power switch 111 near the second conductive layer L2 can include the second end of the upper bridge module 11. The power switch can be in the form of a chip. It should be noted that... Figure 5 The structure shown is illustrated using one copper block for each power switch as an example, but this embodiment is not limited to this.

[0080] Optionally, such as Figures 2 to 14 As shown, at least a portion of the AC transmission structure 2 is disposed in a multilayer conductive layer; the multilayer conductive layer includes a fifth conductive layer L5, at least a portion of the fifth conductive layer L5 forms a first transmission phase 2, and the first transmission phase 2 is electrically connected to the upper bridge module 11 and the lower bridge module 12 of the same sub-power module.

[0081] Specifically, the power module includes at least one first transmission section Phase 2 corresponding to at least one sub-power module; along the thickness direction of the power module, the orthographic projection of the lower bridge module 12 lies within the orthographic projection of the first transmission section Phase 2. The first transmission section Phase 2 is used to electrically connect the series node K of the sub-power module to the corresponding AC transmission structure 2. The first transmission section Phase 2 can be disposed on the fifth conductive layer L5, and the orthographic projection of the lower bridge module 12 on the sixth conductive layer L6 is disposed within the orthographic projection of the first transmission section Phase 2 on the sixth conductive layer L6. The first transmission section Phase 2 can be electrically connected to the lower bridge module 12 by a vertical electrical connection, specifically by means of a laser aperture.

[0082] Optionally, the AC transmission structure 2 includes a first AC output section 22, which is electrically connected to a first transmission section Phase 2. The first AC output section 22 is electrically connected to the series node of the sub-power module via its connection to the first transmission section Phase 2. Since the electrical connection between the first AC output section 22 and the first transmission section Phase 2 is relatively easy to achieve, this embodiment reduces the difficulty of electrically connecting the first AC output section 22 to the sub-power module.

[0083] Optionally, both the first AC output section 22 and the first transmission section Phase2 are disposed on the fifth conductive layer L5.

[0084] Specifically, the first AC output section 22 and the first transmission section Phase2 can be on the same layer and form an integral structure. The first AC output section 22 and the first transmission section Phase2 are integrally formed, meaning they are molded as a single piece during the fabrication of the fifth conductive layer L5. The first AC output section 22 can be understood as the area defined by the orthographic projection of the structure outside the power module used for connection with the series node onto the fifth conductive layer L5. The shape of this area can be rectangular, circular, or other irregular shapes, etc., and this embodiment does not specifically limit this. The integral structure of the first transmission section Phase2 and the first AC output section 22 reduces contact resistance, thereby facilitating the transmission of large currents.

[0085] Additionally, it should be noted that, in Figures 5 to 9In this context, the upper bridge module of the first sub-power module 1 (U) is defined as the first upper bridge module 11 (U), and the lower bridge module in the first sub-power module 1 (U) is defined as the first lower bridge module 12 (U); the upper bridge module in the second sub-power module 1 (V) is defined as the second upper bridge module 11 (V), and the lower bridge module in the second sub-power module 1 (V) is defined as the second lower bridge module 12 (V); the upper bridge module in the third sub-power module 1 (W) is defined as the third upper bridge module 11 (W), and the lower bridge module in the third sub-power module 1 (W) is defined as the third lower bridge module 12 (W). Figure 6 This can be understood as the fifth conductive layer of the power module. The projection areas 11'(U), 11'(V), and 11'(W) of each upper bridge module 11, and the projection areas 12'(U), 12'(V), and 12'(W) of each lower bridge module are illustrated in the fifth conductive layer L5. When the power module includes a three-phase full-bridge circuit, the first sub-power module corresponds to a first first transmission section Phase2(U) and a first first AC output section 22(U), which are integrated into a single structure. The second sub-power module corresponds to a second first transmission section Phase2(V) and a second first AC transmission section 22(V), which are integrated into a single structure. The third sub-power module corresponds to a third first transmission section Phase2(W) and a third first AC output section 22(W), which are integrated into one unit. These three integrated units are mutually insulated.

[0086] Alternatively, in some implementations, such as Figure 6 As shown, each AC transmission structure 2 is located on the same side of the corresponding downbridge module 12. A downbridge module 12 is provided between two adjacent AC transmission structures 2, which makes the distance between the two adjacent AC transmission structures 2 larger and more conducive to the insulation between copper busbars of different phases.

[0087] In some embodiments, the AC transmission structure 2 may be entirely located in multiple conductive layers. In this embodiment, the AC transmission structure 2 includes only the first AC output section 22 located in the fifth conductive layer L5.

[0088] Since it is difficult to directly electrically connect the conductive layer to the connection structure (such as a copper busbar) used to connect the motor, in some other embodiments, the AC transmission structure 2 can be partially located in the fifth conductive layer. In this case, the AC transmission structure 2 may also include a second AC output section 21. The second AC output section 21 is disposed in a through hole penetrating the third conductive layer L3 and the fourth conductive layer L4, and the second AC output section 21 is electrically connected to the second AC output section 22.

[0089] Specifically, the orthographic projection of the second AC output section 21 onto the first AC output section 22 can coincide with the first AC output section 22; the second AC output section 21 is embedded in multiple conductive layers. Specifically, the second AC output section 21 can serve as an intermediate structure for the electrical connection between the first AC output section 22 and the copper busbar. During the fabrication of the power module, the second AC output section 21 and the first AC output section 22 can be electrically connected through the power module fabrication process; for example, one end of the second AC output section 21 can be electrically connected to the first AC output section 22 via a laser-drilled hole. When the subsequent AC transmission structure 2 needs to connect the copper busbar, it is only necessary to solder the copper busbar onto the second AC output section 21. The surface of the second AC output section 21 near the first conductive layer L1 can be flush with the surface of the third conductive layer L3 near the first conductive layer L1, and the surface of the second AC output section 21 near the fifth conductive layer L5 can be flush with the surface of the fourth conductive layer L4 near the fifth conductive layer L5. The surface of the second AC output section 21 near the fifth conductive layer L5 can be vertically electrically connected to the first AC output section 22 via a laser-drilled hole. The second AC output unit 21 can be electrically connected to the copper busbar by soldering. Optionally, such as Figures 2 to 14 As shown, the power module also includes phase busbar welding holes 2', which expose the surface of the corresponding second AC output section 21 near the first conductive layer L1. The phase busbar welding holes 2' penetrate the first conductive layer L1 and the second conductive layer L2, and extend to the surface of the third conductive layer L3 near the first conductive layer L1. The cross-sectional shape of the phase busbar welding holes 2' can be the same as the shape of the AC transmission structure. The cross-sectional area of ​​the phase busbar welding holes 2' can be larger than the cross-sectional area of ​​the AC transmission structure, thus facilitating the welding process.

[0090] Optionally, in some embodiments, the second AC output section 21 may be located in the fourth conductive layer L4. That is, a portion of the fourth conductive layer L4 forms the second AC output section 21.

[0091] Optionally, in some embodiments, the second AC output section 21 may be located in a through hole penetrating from the second conductive layer L2 to the fourth conductive layer L4, and the second AC transmission section 21 penetrates from the second conductive layer L2 to the fourth conductive layer L4.

[0092] Optionally, in some embodiments, the second AC output section 21 may be located in a through hole penetrating from the first conductive layer L1 to the fourth conductive layer L4, and the second AC transmission section 21 penetrates from the first conductive layer L1 to the fourth conductive layer L4.

[0093] Alternatively, in some embodiments, the material of the second AC output unit 21 may be copper.

[0094] Optionally, refer to Figures 2 to 14The multilayer conductive layer includes a second conductive layer L2, which includes a second transmission section Phase1. Both the upper bridge module 11 and the lower bridge module 12 of the same sub-power module are electrically connected to the second transmission section Phase1. Specifically, the second conductive layer L2 includes at least one second transmission section Phase1 corresponding to at least one upper bridge module 11; along the thickness direction of the power module, the orthographic projection of the upper bridge module 11 at least partially overlaps with the orthographic projection of the second transmission section Phase1, and the second end of the upper bridge module 11 is electrically connected to the second transmission section Phase1; the second transmission section Phase1 is electrically connected to the first transmission section Phase1. Figure 2 and Figure 13 As shown, the second transmission unit Phase 1 is electrically connected to the second end of the corresponding upper bridge module 11, that is, electrically connected to the series node K of the sub-power module. The orthographic projection of the second transmission unit Phase 1 on the first conductive layer L1 is configured to at least partially overlap with the orthographic projection of the upper bridge module 11 on the first conductive layer L1. Furthermore, the second transmission unit Phase 1 and the upper bridge module 11 can be vertically connected. For example, a laser aperture can be used to connect the second transmission unit Phase 1 and the upper bridge module 11, specifically connecting the laser aperture to the copper foil corresponding to the upper bridge module 11 to achieve electrical connection. This vertical connection allows for vertical current transmission. Using a laser aperture to electrically connect to the upper bridge module can reduce the switching losses of the upper bridge module.

[0095] Furthermore, such as Figures 2 to 13 As shown, along the thickness direction of the power module, the second transmission section Phase 1 and the first transmission section Phase 2 corresponding to the same sub-power module partially overlap; the overlapping portion of the first transmission section Phase 2 and the second transmission section Phase 1 is electrically connected through a vertical interconnect structure LVR.

[0096] Specifically, the vertical interconnect structure (LVR) is, for example, a laser aperture. The first transmission section (Phase 2) and the second transmission section (Phase 1) are electrically connected using the vertical interconnect structure to form a sub-power module. The vertical interconnect structure (LVR) extends through the third conductive layer (L3) and the fourth conductive layer (L4). It should be further noted that... Figure 13 The diagram illustrates the region LVR' in the fifth conductive layer L5, corresponding to the vertical interconnect structure LVR.

[0097] Optionally, continue to refer to Figures 2 to 14 The fifth conductive layer L5 also includes a third transmission section L_T+, and the DC terminals of the upper bridge module 11 and the power module are electrically connected to the third transmission section L_T+.

[0098] Specifically, the power module includes a first DC terminal and a second DC terminal. The first DC terminal can be understood as the terminal that electrically connects each upper bridge module. That is, the first DC terminal of each upper bridge module and the power module is electrically connected to the third transmission section L_T+. The orthographic projection of each upper bridge module 11 on the fifth conductive layer L5 is located within the third transmission section L_T+, and the first end of each upper bridge module 11 is electrically connected to the third transmission section L_T+. The third transmission section can be the T+ transmission section.

[0099] In some implementations, when the power module includes a three-phase full-bridge circuit, the third transmission section corresponding to all upper bridge modules 11 in the fifth conductive layer L5 is a single, integrated third transmission section L_T+. The first end of each upper bridge module 11 can be vertically electrically connected to the third transmission section L_T+ via a laser aperture. Both the first and second ends of the upper bridge module 11 are vertically electrically connected to the corresponding conductive layer. In the upper bridge module 11, the current direction is vertical (i.e., the thickness direction of the power module), allowing it to carry a larger current and thus improving the performance of the power module. Furthermore, all upper bridge modules 11 are connected to the same third transmission section L_T+, which can have a larger size and a larger current-carrying area.

[0100] like Figure 12 As shown, the third transmission unit L_T+ and the first transmission unit Phase 1 are arranged along the first direction X. The third transmission unit L_T+ can be electrically connected to the external T+ copper busbar. The position where the T+ copper busbar is electrically connected to the third transmission unit can be located in the third transmission unit away from the first transmission unit Phase 2. In the second direction Y, the AC transmission structure 22 is set between two adjacent sub-power modules 1. That is, the size of the power module along the second direction Y can be larger. The larger size of the third transmission unit L_T+ in the second direction Y can make the size of the third transmission unit L_T+ larger, which is more conducive to increasing the current-carrying area of ​​the third transmission unit L_T+.

[0101] Optionally, refer to Figure 10 and Figure 14 The second conductive layer L2 further includes a fourth transmission section L_T-, and the DC terminals of both the lower bridge module 12 and the power module are electrically connected to the fourth transmission section L_T-. In this embodiment, the second DC terminals of both the lower bridge module 12 and the power module are electrically connected to the fourth transmission section L_T-. Along the thickness direction Z of the power module, the orthographic projection of each lower bridge module 12 on the second conductive layer L2 at least partially overlaps with the orthographic projection of the fourth transmission section L_T-; the first end of each lower bridge module 12 is electrically connected to the fourth transmission section L_T-. The fourth transmission section may be a T-transmission section.

[0102] Specifically, the fourth transmission unit L_T- can transmit signals between itself and the first end of each lower bridge module 12. The orthographic projection of the fourth transmission unit L_T- on the first conductive layer L1 is configured to at least partially overlap with the orthographic projection of the lower bridge module 12 on the first conductive layer L1. The first end of the lower bridge module 12 can be perpendicularly electrically connected to the fourth transmission unit L_T-, for example, via a laser aperture. Furthermore, since the second end of the lower bridge module 12 is perpendicularly electrically connected to the first transmission unit Phase 2, meaning the current flow direction in the lower bridge module 12 is vertical, the lower bridge module 12 can carry a larger current, which is more conducive to improving the performance of the lower bridge module 12. The fourth transmission unit L_T- can be electrically connected to the T-copper busbar on the side of the power module away from the first transmission unit Phase 2. The fourth transmission unit, which is located on the second conductive layer L2, needs to be insulated from the second transmission unit Phase 1. (See reference...) Figure 10 The fourth transmission section L_T- can also be understood as a T-network structure. For example, it is the entire structure of the second conductive layer L2 after removing the portions of each second transmission section and the welding holes of each phase copper busbar, leaving the remaining portions to form the fourth transmission section LT-. When the current from the lower bridge module 12 flows into the fourth transmission section L_T-, it first enters the portion of the fourth transmission section corresponding to the lower bridge module (i.e.,...). Figure 10 The current is then divided at the position corresponding to the second transmission section, and transmitted to the portion of the fourth transmission section located on both sides of the second transmission section, and then flows into the T-copper busbar. In this embodiment, the AC transmission structure 2 and the lower bridge module 12 are arranged along the second direction Y. From one perspective, if the AC transmission structure 2 needs to have a larger size in the second direction Y, the size between two adjacent sub-power modules can be larger, that is, the size of the portion of the second conductive layer L2 located between the two second transmission sections Phase 1 is larger, which means that the size of the portion of the fourth transmission section that can conduct current to the T-copper busbar is larger, thus which is more conducive to increasing the current-carrying area. From another perspective, when the power module has a larger size in the second direction Y to form the power loop of the lower bridge module, further arranging the AC transmission structure 2 and the lower bridge module along the second direction Y can make more reasonable use of the space of the power module, that is, the layout is more reasonable.

[0103] Optionally, in some embodiments, the projection of the AC transmission structure 2 onto the lower bridge module 12 along the second direction is located in the central region of the lower bridge module 12.

[0104] In some implementations, the center of the AC transmission structure 2 is aligned with the center of the lower bridge module 12 in the second direction Y. For example, as... Figure 10As shown, if the lower bridge module 12 includes two rows of second power switches, the center line of the AC transmission structure 2 along the second direction Y is located between the two rows of second power switches. If the lower bridge module 12 includes three rows of first power switches, the center line of the AC transmission structure 2 along the second direction Y is located on the middle row of second power switches. Each second power switch carries current, and the current flowing from each second power switch needs to flow into the corresponding AC transmission structure 2. The arrangement in this embodiment makes the current path between each second power switch and the AC transmission structure closer, thereby achieving a better current sharing effect.

[0105] In the above embodiments, such as Figure 2 As shown, the fourth transmission section L_T- required by the power module needs to be connected to the corresponding copper busbars on both sides of the upper bridge module 11 along the second direction Y, thus making the power module larger in the second direction Y. Figure 12 As shown, in the fifth conductive layer L5, the first transmission section Phase 1 also has a large amount of wasted space in the second direction Y. However, this application arranges the AC transmission structure 2 and the lower bridge module 12 along the second direction Y, which can make more reasonable use of the space of the power module.

[0106] Based on the same inventive concept, the present invention also provides a motor controller, which includes the power module provided in any embodiment of the present invention. Since the motor controller provided in the embodiments of the present invention includes the power module provided in any embodiment of the present invention, it also has the same beneficial effects, and will not be described again here.

[0107] Based on the same inventive concept, the present invention also provides an electric drive assembly, which includes the power module provided in any embodiment of the present invention; or, the electric drive assembly includes the motor controller provided in the embodiments of the present invention. Since the electric drive assembly provided in the embodiments of the present invention includes the power module provided in any embodiment of the present invention, it also has the same beneficial effects, and will not be described further here.

[0108] Based on the same inventive concept, the present invention also provides a vehicle, which can be a new energy vehicle such as a pure electric vehicle, a range-extended electric vehicle, or a plug-in hybrid electric vehicle. The vehicle includes the power module provided in any embodiment of the present invention, or the electric drive assembly provided in any embodiment of the present invention, or the motor controller provided in any embodiment of the present invention, and has the same beneficial effects, which will not be elaborated further here.

[0109] The following are the previously applied proposals:

[0110] According to a first aspect of the present invention, an embodiment of the present invention provides a power module, the power module comprising:

[0111] At least one sub-power module, the sub-power module comprising an upper bridge module and a lower bridge module, the upper bridge module and the lower bridge module being arranged along a first direction;

[0112] At least one AC transmission structure is connected to the at least one sub-power module, the AC transmission structure and the sub-power module being arranged along a second direction; the first direction intersects the second direction.

[0113] Optionally, the power module includes:

[0114] At least one of the sub-power modules, the sub-power module comprising the upper bridge module and the lower bridge module connected in series;

[0115] Optionally, the power module further includes at least one AC transmission structure corresponding one-to-one with the at least one sub-power module;

[0116] Optionally, the AC transmission structure and the sub-power module are arranged along a second direction.

[0117] Optionally, the power module further includes a multilayer conductive layer, in which the upper bridge module and the lower bridge module are embedded;

[0118] The AC transmission structure is at least partially disposed in the multilayer conductive layer;

[0119] The multilayer conductive layer includes at least one first transmission section corresponding to each of the at least one sub-power module; along the thickness direction of the power module, the orthographic projection of the lower bridge module is located within the orthographic projection of the first transmission section, and the AC transmission structure includes a first sub-AC transmission structure, which is on the same layer as the first transmission section and is an integral structure.

[0120] Optionally, the power module includes three sub-power modules arranged along the second direction, and the three sub-power modules form a three-phase full-bridge circuit; the AC transmission structures corresponding to different sub-power modules are insulated.

[0121] Optionally, along the second direction, the projection of the AC transmission structure onto the lower bridge module is located in the central region of the lower bridge module.

[0122] Optionally, the lower bridge module includes a plurality of first power switches arranged in an array, wherein the plurality of first power switches are connected in parallel;

[0123] The upper bridge module includes multiple second power switches arranged in an array, and the multiple second power switches are connected in parallel.

[0124] Optionally, the AC transmission structure further includes a second sub-AC transmission structure, wherein the orthographic projection of the second sub-AC transmission structure onto the first sub-AC transmission structure coincides with the first sub-AC transmission structure; the second sub-AC transmission structure is embedded in the multilayer conductive layer.

[0125] Optionally, the multilayer conductive layer includes a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer stacked sequentially;

[0126] The sub-power module is disposed between the third conductive layer and the fourth conductive layer;

[0127] The second sub-AC transmission structure is disposed between the third conductive layer and the fourth conductive layer;

[0128] The first transmission unit is located in the fifth conductive layer.

[0129] Optionally, the power module includes three sub-power modules arranged along the second direction, and the three sub-power modules form a three-phase full-bridge circuit; the AC transmission structures corresponding to different sub-power modules are insulated;

[0130] Each of the aforementioned AC transmission structures is located on the same side of the corresponding lower bridge module.

[0131] Optionally, the second conductive layer includes at least one second transmission section corresponding to each of the at least one upper bridge module; along the thickness direction of the power module, the orthographic projection of the upper bridge module and the orthographic projection of the second transmission section at least partially overlap, and the second end of the upper bridge module is electrically connected to the second transmission section; the second transmission section is electrically connected to the first transmission section.

[0132] Optionally, along the thickness direction of the power module, the second transmission section corresponding to the same sub-power module partially overlaps with the first transmission section; the overlapping portion of the first transmission section and the second transmission section is electrically connected through a vertical interconnection structure.

[0133] Optionally, the power module includes three sub-power modules arranged along the second direction, and the three sub-power modules form a three-phase full-bridge circuit; the AC transmission structures corresponding to different sub-power modules are insulated;

[0134] The fifth conductive layer further includes a third transmission section, and the orthographic projection of each of the upper bridge modules on the fifth conductive layer is located within the third transmission section; the first end of each of the upper bridge modules is electrically connected to the third transmission section.

[0135] Optionally, the power module includes three sub-power modules arranged along the second direction, and the three sub-power modules form a three-phase full-bridge circuit; the AC transmission structures corresponding to different sub-power modules are insulated;

[0136] The second conductive layer further includes a fourth transmission section. Along the thickness direction of the power module, the orthographic projection of each of the lower bridge modules on the second conductive layer at least partially overlaps with the orthographic projection of the fourth transmission section; the first end of each of the lower bridge modules is electrically connected to the fourth transmission section.

[0137] According to another aspect of the present invention, a motor controller is provided, the motor controller including the power module as described above.

[0138] According to another aspect of the present invention, an electric drive assembly is provided, the electric drive assembly including the motor controller as described above; or, the electric drive assembly including the power module as described above.

[0139] According to another aspect of the invention, a vehicle is provided, the vehicle including the electric drive assembly as described above; or, the vehicle including the motor controller as described above; or, the vehicle including the electric drive assembly as described above.

[0140] Note: The first AC output unit in the later application corresponds to the first sub-AC transmission structure in the earlier application; the second AC output unit in the later application corresponds to the second sub-AC transmission structure in the earlier application.

[0141] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A power module, characterized in that, The power module includes: At least one sub-power module, the sub-power module comprising an upper bridge module and a lower bridge module, the upper bridge module and the lower bridge module being arranged along a first direction; At least one AC transmission structure is electrically connected to at least one sub-power module in a one-to-one correspondence, and the AC transmission structure and the sub-power module electrically connected thereto are arranged along a second direction; the first direction intersects the second direction.

2. The power module according to claim 1, characterized in that, The AC terminal of the sub-power module is electrically connected to the AC transmission structure.

3. The power module according to claim 1 or 2, characterized in that, The AC transmission structure and the lower bridge module of the sub-power module electrically connected thereto are arranged along the second direction; or, The AC transmission structure and the upper bridge module of the sub-power module electrically connected thereto are arranged along the second direction.

4. The power module according to any one of claims 1 to 3, characterized in that, The at least one sub-power module includes a first sub-power module, a second sub-power module, and a third sub-power module; The at least one AC transmission structure includes a first AC transmission structure, a second AC transmission structure, and a third AC transmission structure; The first AC transmission structure is electrically connected to the first sub-power module, the second AC transmission structure is electrically connected to the second sub-power module, and the third AC transmission structure is electrically connected to the third sub-power module; The first sub-power module, the second sub-power module, and the third sub-power module are arranged along the second direction.

5. The power module according to claim 4, characterized in that, The first AC transmission structure is located between the first sub-power module and the second sub-power module; the second AC transmission structure is located between the second sub-power module and the third sub-power module; the third AC transmission structure is located on the side of the third sub-power module away from the second sub-power module. Alternatively, the first AC transmission structure is located on the side of the first sub-power module away from the second sub-power module, the second AC transmission structure is located between the first sub-power module and the second sub-power module, and the third AC transmission structure is located on the side of the third sub-power module away from the second sub-power module; Alternatively, the first AC transmission structure is located on the side of the first sub-power module away from the second sub-power module, and the second AC transmission structure and the third AC transmission structure are located between the second sub-power module and the third sub-power module; Alternatively, the first AC transmission structure and the second AC transmission structure are located between the first sub-power module and the second sub-power module, and the third AC transmission structure is located between the second sub-power module and the third sub-power module.

6. The power module according to any one of claims 1-5, characterized in that, The power module further includes a multilayer conductive layer, and the at least one sub-power module is embedded in the multilayer conductive layer; the AC transmission structure is at least partially disposed in the multilayer conductive layer.

7. The power module according to claim 6, characterized in that, The multilayer conductive layer includes a third conductive layer and a fourth conductive layer; The sub-power module is disposed in a through hole that penetrates the third conductive layer and the fourth conductive layer.

8. The power module according to claim 6 or 7, characterized in that, The multilayer conductive layer includes a fifth conductive layer, a portion of which forms a first transmission section, which is electrically connected to the upper bridge module and the lower bridge module of the same sub-power module.

9. The power module according to claim 8, characterized in that, The AC transmission structure includes a first AC output unit, which is electrically connected to the first transmission unit.

10. The power module according to claim 9, characterized in that, Both the first AC output section and the first transmission section are disposed on the fifth conductive layer.

11. The power module according to any one of claims 8-10, characterized in that, The AC transmission structure further includes a second AC output section, which is disposed in a through hole penetrating the third conductive layer and the fourth conductive layer, and is electrically connected to the first AC output section; wherein, the multilayer conductive layer includes the third conductive layer and the fourth conductive layer.

12. The power module according to claims 8-11, characterized in that, The fifth conductive layer also includes a third transmission section, and the DC terminals of the upper bridge module and the power module are both electrically connected to the third transmission section.

13. The power module according to claims 8-12, characterized in that, The multilayer conductive layer includes a second conductive layer, and the second conductive layer includes a second transmission section; the upper bridge module and the lower bridge module of the same sub-power module are both electrically connected to the second transmission section.

14. The power module according to claim 13, characterized in that, The second conductive layer also includes a fourth transmission section, and the DC terminals of the lower bridge module and the power module are both electrically connected to the fourth transmission section.

15. A motor controller, characterized in that, The motor controller includes the power module as described in any one of claims 1-14.

16. An electric drive assembly, characterized in that, The electric drive assembly includes the power module according to any one of claims 1-14; or, the electric drive assembly includes the motor controller according to claim 15.

17. A vehicle, characterized in that, The vehicle includes the power module according to any one of claims 1-14; or, the vehicle includes the motor controller according to claim 15; or, the vehicle includes the electric drive assembly according to claim 16.

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