A power module, motor controller, electric drive assembly, and vehicle

Abstract

The application discloses a power module, an electric power module, a motor controller, an electric drive assembly and a vehicle. The power module comprises: a first transmission layer, a third transmission layer and a second transmission layer located between the first transmission layer and the third transmission layer; a power unit is arranged between the second transmission layer and the third transmission layer; the current direction of the first transmission layer and the third transmission layer along a bridge arm is opposite to the current direction of the second transmission layer along the bridge arm; and the orthographic projection of the current transmission area in the first transmission layer on the second transmission layer at least partially overlaps with the current transmission area in the second transmission layer. The technical scheme provided by the application reduces the parasitic inductance of the power module and reduces the switching loss.

Description

[0001] Cross-references and priority statements

[0002] This patent application claims priority to Chinese application No. 2025105210555, filed on April 23, 2025, entitled "A power module, a motor controller, an electric drive assembly and a vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to the field of power device technology, and in particular to a power module, a motor controller, an electric drive assembly, and a vehicle. Background Technology

[0004] With the development of chip technology, the requirements for power modules are becoming increasingly stringent. Existing power modules are generally packaged in HPD or plastic packages, with each HPD or plastic-packaged module having a parasitic inductance between 4nH and 10nH. The large parasitic inductance of existing power modules leads to high switching losses. Summary of the Invention

[0005] This invention provides a power module, an electric power module, a motor controller, an electric drive assembly, and a vehicle to solve the problem that existing power modules have large parasitic inductance, resulting in high switching losses.

[0006] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0007] The power module includes:

[0008] A first transport layer, a second transport layer, and a third transport layer; the second transport layer is located between the first transport layer and the third transport layer.

[0009] A power unit is disposed between the second transmission layer and the third transmission layer;

[0010] The current direction along the bridge arm in both the first and third transmission layers is opposite to the current direction along the bridge arm in the second transmission layer.

[0011] The orthographic projection of the current transmission region in the first transmission layer onto the second transmission layer at least partially overlaps with the current transmission region in the second transmission layer.

[0012] Optionally, the area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer onto the second transmission layer and the current transmission region in the second transmission layer is the first area.

[0013] The area of ​​the overlap between the orthographic projection of the current transmission region in the third transmission layer onto the second transmission layer and the current transmission region in the second transmission layer is the second area.

[0014] The first area is larger than the second area.

[0015] Optionally, the current transmission region in the first transmission layer accounts for more than or equal to 90% of the area of ​​the first transmission layer.

[0016] Optionally, the second transport layer is located between the first transport layer and the third transport layer.

[0017] Optionally, the power module includes:

[0018] First conductive layer;

[0019] A second conductive layer is disposed on one side of the first conductive layer;

[0020] A third conductive layer is disposed on the side of the second conductive layer away from the first conductive layer;

[0021] A fourth conductive layer is disposed on the side of the third conductive layer away from the first conductive layer;

[0022] The fifth conductive layer is disposed on the side of the fourth conductive layer away from the first conductive layer;

[0023] The sixth conductive layer is disposed on the side of the fifth conductive layer away from the first conductive layer;

[0024] The seventh conductive layer is disposed on the side of the sixth conductive layer away from the first conductive layer;

[0025] The power unit is disposed on the fourth conductive layer and the fifth conductive layer;

[0026] The first transmission layer is the second conductive layer; the second transmission layer is the third conductive layer; and the third transmission layer is the sixth conductive layer.

[0027] Optionally, the power module is electrically connected to the T+ conductor and the T- conductor;

[0028] The first transmission layer and the third transmission layer are electrically connected to the T+ conductor;

[0029] The second transport layer is electrically connected to the T-conductor.

[0030] Optionally, the power module further includes:

[0031] At least one first conductive via and at least one second conductive via;

[0032] The T+ conductor is disposed in the first conductive via, and the first conductive via is disposed at least in the first transmission layer and the third transmission layer;

[0033] The T-conductor is disposed in the second conductive via, and the second conductive via is disposed at least in the second transmission layer.

[0034] Optionally, the second conductive via is provided in at least the second transmission layer and the third transmission layer.

[0035] Optionally, at least one first conductive hole is provided between the first transmission layer and the third transmission layer;

[0036] The first conductive hole is used to connect the first transmission layer and the third transmission layer.

[0037] Optionally, the at least one first conductive hole forms at least one array of first conductive holes.

[0038] Optionally, at least one second conductive hole is provided between the second transmission layer and the third transmission layer;

[0039] The second conductive via is used to connect the second transport layer and the third transport layer.

[0040] Optionally, the at least one second conductive hole forms at least one array of second conductive holes.

[0041] According to another aspect of the present invention, this embodiment provides a motor controller including the power module proposed in any of the first aspects.

[0042] According to another aspect of the present invention, this embodiment provides an electric drive assembly including the power module proposed in any of the first aspects.

[0043] According to another aspect of the present invention, this embodiment provides a vehicle including a power module as proposed in any of the first aspects, or a motor controller as proposed in any of the second aspects, or an electric drive assembly as proposed in any of the third aspects.

[0044] The technical solution provided by this invention adds a first transmission layer to the power module, and sets the current direction along the bridge arm in the first transmission layer to be opposite to the current direction along the bridge arm in the second transmission layer. The orthogonal projection of the current transmission region in the first transmission layer onto the second transmission layer at least partially overlaps with the current transmission region in the second transmission layer. This allows the parasitic inductance generated by the first transmission layer to cancel the parasitic inductance generated by the second transmission layer, thereby effectively reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching losses of the power module.

[0045] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0047] Figure 1 This is a structural block diagram of a power module provided in an embodiment of the present invention;

[0048] Figure 2 This is a structural block diagram of another power module provided in an embodiment of the present invention;

[0049] Figure 3 This is a top view of a power module provided in an embodiment of the present invention;

[0050] Figure 4 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention;

[0051] Figure 5 This is a schematic diagram of the structure of a second conductive layer provided in an embodiment of the present invention;

[0052] Figure 6 This is a schematic diagram of the structure of a third conductive layer provided in an embodiment of the present invention;

[0053] Figure 7 This is a schematic diagram of the structure of a fourth conductive layer provided in an embodiment of the present invention;

[0054] Figure 8 This is a schematic diagram of the structure of a fifth conductive layer provided in an embodiment of the present invention;

[0055] Figure 9 This is a schematic diagram of the structure of a sixth conductive layer provided in an embodiment of the present invention;

[0056] Figure 10 This is a schematic diagram of the structure of a seventh conductive layer provided in an embodiment of the present invention;

[0057] Figure 11 This is a cross-sectional schematic diagram of another power module provided in an embodiment of the present invention;

[0058] Figure 12This is a schematic diagram of another structure of the second conductive layer provided in an embodiment of the present invention;

[0059] Figure 13 This is a schematic diagram of another third conductive layer structure provided in an embodiment of the present invention;

[0060] Figure 14 This is a schematic diagram of another sixth conductive layer provided in an embodiment of the present invention. Detailed Implementation

[0061] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0062] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0063] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0064] Figure 1 This is a structural block diagram of a power module provided in an embodiment of the present invention, with reference to... Figure 1 The power module includes: a first transmission layer C1, a second transmission layer C2, and a third transmission layer C3, with the second transmission layer C2 located between the first transmission layer C1 and the third transmission layer C3; a power unit disposed between the second transmission layer C2 and the third transmission layer C3; the current direction along the bridge arm in the first transmission layer C1 and the third transmission layer C3 is opposite to the current direction along the bridge arm in the second transmission layer C2; the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 at least partially overlaps with the current transmission region in the second transmission layer C2. The extension direction of the bridge arm is parallel to the plane of the transmission layer; the direction perpendicular to the power module is the longitudinal direction Z, and the bridge arm direction is perpendicular to the longitudinal direction Z.

[0065] Specifically, the power module achieves AC / DC conversion and voltage boosting / pull-down functions through internal circuitry. For example, the IGBT module achieves efficient switching characteristics through gate control. The power module can amplify the input signal and output high current or high voltage to drive high-power devices. The power module can incorporate overcurrent, overtemperature, and short-circuit protection circuits, significantly improving the system reliability. The power module includes a power unit 10. The power unit 10 includes power devices. The power unit 10 is disposed between the second transmission layer C2 and the third transmission layer C3 of the power module, allowing it to be embedded within the power module's circuit board.

[0066] The first transmission layer C1, the second transmission layer C2, and the third transmission layer C3 can be understood as power layers, with the first transmission layer C1 being a newly added power layer in the power module. Optionally, the third transmission layer C3 is closer to the heat sink than the first transmission layer C1. Since the power unit is located between the second transmission layer C2 and the third transmission layer C3, placing the third transmission layer C3 closer to the heat sink compared to the first transmission layer C1 reduces the distance between the heat sink and the power unit, thus facilitating heat dissipation from the power unit by the heat sink.

[0067] The first transmission layer C1 and the third transmission layer C3 are both electrically connected to the first electrode of the external device 2, and the second transmission layer C2 is electrically connected to the second electrode of the external device 2. (Reference) Figure 1 The first electrode of the external device 2 can be a positive electrode, and the second electrode of the external device 2 can be a negative electrode. The first transmission layer C1 and the third transmission layer C3 are both connected to the positive electrode of the external device 2, and the second transmission layer C2 is connected to the negative electrode of the external device 2. The power unit 10 is connected to the positive electrode of the external device 2 through at least one of the first transmission layer C1 and the third transmission layer C3, and the power unit 10 is connected to the negative electrode of the external device 2 through the second transmission layer C2. In other embodiments of the present invention... Figure 2 This is a structural block diagram of another power module provided in an embodiment of the present invention, for reference. Figure 2 The first electrode of the external device 2 can be the negative electrode, the second electrode of the external device 2 can be the positive electrode, the first transmission layer C1 and the third transmission layer C3 are both connected to the negative electrode of the external device 2, the second transmission layer C2 is connected to the positive electrode of the external device 2, the power unit 10 is connected to the negative electrode of the external device 2 through at least one of the first transmission layer C1 and the third transmission layer C3, and the power unit 10 is connected to the positive electrode of the external device 2 through the second transmission layer C2.

[0068] For example, the external device 2 can be a battery. Power unit 10 is connected to the positive terminal of the battery through at least one of the first transmission layer C1 and the third transmission layer C3, and power unit 20 is connected to the negative terminal of the battery through the second transmission layer C2. Alternatively, power unit 20 is connected to the negative terminal of the battery through at least one of the first transmission layer C1 and the third transmission layer C3, and power unit 10 is connected to the positive terminal of the battery through the second transmission layer C2. The external device 2 can also be an external capacitor. Power unit 10 is electrically connected to the positive plate of the external capacitor through at least one of the first transmission layer C1 and the third transmission layer C3, and power unit 10 is electrically connected to the negative plate of the external capacitor through the second transmission layer C2. Alternatively, power unit 10 is electrically connected to the negative plate of the external capacitor through at least one of the first transmission layer C1 and the third transmission layer C3, and power unit 20 is electrically connected to the positive plate of the external capacitor through the second transmission layer C2.

[0069] The positive and negative terminals of the external device 2, which connect to the power module, are located on the same side of the power module. This causes the current direction in the first transmission layer C1 to be opposite to the current direction in the second transmission layer C2, and the current direction in the third transmission layer C3 to be opposite to the current direction in the second transmission layer C2. Since the projection of the current transmission area in the first transmission layer C1 onto the second transmission layer C2 at least partially overlaps with the current transmission area in the second transmission layer C2, and the current direction in the first transmission layer C1 is opposite to the current direction in the second transmission layer C2, the magnetic field generated by the first transmission layer C1 is opposite to the magnetic field generated by the second transmission layer C2. This allows the parasitic inductance generated by the first transmission layer C1 to cancel out the parasitic inductance generated by the second transmission layer C2, thereby reducing the parasitic inductance of the power module.

[0070] The technical solution provided by this invention adds a first transmission layer to the power module, and sets the current direction along the bridge arm in the first transmission layer to be opposite to the current direction along the bridge arm in the second transmission layer. The orthogonal projection of the current transmission area in the first transmission layer onto the second transmission layer at least partially overlaps with the current transmission area in the second transmission layer. This allows the parasitic inductance generated by the first transmission layer to cancel the parasitic inductance generated by the second transmission layer, thereby effectively reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching losses of the power module.

[0071] Furthermore, the projection of the current transmission region in the third transmission layer C3 onto the second transmission layer C2 at least partially overlaps with the current transmission region in the second transmission layer C2. The current direction in the third transmission layer C3 is opposite to the current direction in the second transmission layer C2, which makes the magnetic field generated by the third transmission layer C3 opposite to the magnetic field generated by the second transmission layer C2. This allows the parasitic inductance generated by the third transmission layer C3 to cancel out the parasitic inductance generated by the second transmission layer C2, thus achieving the effect of reducing the parasitic inductance of the power module.

[0072] Furthermore, by using the parasitic inductance generated by the first transmission layer C1 to cancel the parasitic inductance generated by the second transmission layer C2, and by using the parasitic inductance generated by the third transmission layer C3 to cancel the parasitic inductance generated by the second transmission layer C2, a double cancellation of the parasitic inductance generated by the second transmission layer C2 can be achieved. This improves upon the problem of insufficient single cancellation effect and effectively reduces the parasitic inductance of the power module. For example, the parasitic inductance of the power module provided in this embodiment can be reduced to less than or equal to 0.4nH, which is significantly lower than the parasitic inductance of existing power modules.

[0073] The technical solution provided by this invention involves setting a first transmission layer C1, a third transmission layer C3, and a second transmission layer C2 located between the first transmission layer C1 and the third transmission layer C3 in a power module. The current direction along the bridge arm in the third transmission layer C3 is opposite to the current direction along the bridge arm in the second transmission layer C2. The orthographic projection of the current transmission region in the third transmission layer C3 onto the second transmission layer C2 at least partially overlaps with the current transmission region in the second transmission layer C2. This allows the parasitic inductance generated by the third transmission layer C3 to cancel the parasitic inductance generated by the second transmission layer. Based on this, a first transmission layer C1 is added, and the current direction along the bridge arm in the first transmission layer C1 is opposite to the current direction along the bridge arm in the second transmission layer C2. The orthogonal projection of the current transmission area in the first transmission layer C1 onto the second transmission layer C2 at least partially overlaps with the current transmission area in the second transmission layer C2. This allows the parasitic inductance generated by the first transmission layer C1 to cancel the parasitic inductance generated by the second transmission layer C2, thereby further and effectively reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching loss of the power module.

[0074] Based on the above embodiments, optionally, the area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2 is the first area; the area of ​​the overlapping region between the orthographic projection of the current transmission region in the third transmission layer C3 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2 is the second area; wherein, the first area is larger than the second area.

[0075] For details, please refer to Figure 1 Power unit 10 is disposed between the second transmission layer C2 and the third transmission layer C3. Power unit 10 is electrically connected to the positive terminal of external device 2 through the third transmission layer C3, and electrically connected to the negative terminal of external device 2 through the second transmission layer C2, thereby realizing the electrical connection between power unit and external device 2, forming a loop, so that current can flow through the second transmission layer C2 and the third transmission layer C3. The first transmission layer C1 is electrically connected to the positive terminal of external device 2. The first transmission layer C1 can also be electrically connected to the third transmission layer C3 through a conductive hole located between the first transmission layer C1 and the third transmission layer C3. Therefore, the first transmission layer C1 is sequentially electrically connected to the negative terminal of external device 2 through the conductive hole, the third transmission layer C3, power unit 10, and the second transmission layer C2, thus forming a loop, so that current can flow through the first transmission layer C1. Since there is no need to set a contact area in the first transmission layer C1 to contact the power unit 10, the transmission area of ​​the current in the first transmission layer C1 with the current direction parallel to the plane of the first transmission layer C1 can be increased. Therefore, the area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2 is larger than the area of ​​the overlapping region between the orthographic projection of the current transmission region in the third transmission layer C3 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2. By increasing the area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2, the effect of the parasitic inductance generated by the first transmission layer C1 in offsetting the parasitic inductance generated by the second transmission layer C2 can be further improved, thereby further reducing the parasitic inductance of the power module.

[0076] For example Figure 2In the connection shown, the power unit 10 is disposed between the second transmission layer C2 and the third transmission layer C3. The power unit 10 is electrically connected to the negative terminal of the external device 2 through the third transmission layer C3, and the power unit is electrically connected to the positive terminal of the external device 2 through the second transmission layer C2, thereby realizing the electrical connection between the power unit and the external device 2, forming a loop, so that current can flow through the second transmission layer C2 and the third transmission layer C3. The first transmission layer C1 is electrically connected to the negative terminal of the external device 2. The first transmission layer C1 can also be electrically connected to the third transmission layer C3 through a conductive hole located between the first transmission layer C1 and the third transmission layer C3. Therefore, the first transmission layer C1 is sequentially electrically connected to the positive terminal of the external device 2 through the conductive hole, the third transmission layer C3, the power unit 10, and the second transmission layer C2, so that current can flow through the first transmission layer C1. Since there is no need to set a contact area in the first transmission layer C1 to contact the power unit 10, the transmission area of ​​the current in the first transmission layer C1 with the current direction parallel to the plane of the first transmission layer C1 can be increased. Therefore, the area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2 is larger than the area of ​​the overlapping region between the orthographic projection of the current transmission region in the third transmission layer C3 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2. By increasing the area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2, the effect of the parasitic inductance generated by the first transmission layer C1 in offsetting the parasitic inductance generated by the second transmission layer C2 can be further improved, thereby further reducing the parasitic inductance of the power module.

[0077] Based on the above embodiments, optionally, more than half of the area in the first transmission layer C1 is the current transmission area, which can make the area of ​​the overlapping region between the orthographic projection of the current transmission area in the first transmission layer C1 on the second transmission layer C2 and the current transmission area in the second transmission layer C2 further meet the requirement of low parasitic inductance of the power module.

[0078] Based on the above embodiments, optionally, the current transmission region in the first transmission layer C1 occupies an area of ​​greater than or equal to 90% of the first transmission layer C1. By optimizing the layout of the lines in the power module, the entire first transmission layer C1 can be a current transmission region, thereby making the current transmission region in the first transmission layer C1 account for 100% of the area of ​​the first transmission layer C1, so as to further improve the effect of the parasitic inductance generated by the first transmission layer C1 in offsetting the parasitic inductance generated by the second transmission layer C2.

[0079] Compared to the power modules in the prior art, the first transmission layer C1 in this embodiment of the invention can be understood as an additional power layer. By adding a power layer, the power stacking portion can be increased, greatly reducing parasitic inductance from the existing 1-2nH to 0.4nH. At the same time, increasing the number and area of ​​the power layer can also reduce the temperature of the power circuit.

[0080] In other embodiments of the present invention, two or more power layers may be added, and the number of power layers added may be set according to the actual situation.

[0081] Based on the above embodiments, optionally, Figure 3 This is a top view of a power module provided in an embodiment of the present invention. Figure 4 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention, for reference. Figure 3 and Figure 4 The power module includes:

[0082] First conductive layer M1;

[0083] The second conductive layer M2 is disposed on one side of the first conductive layer M1;

[0084] The third conductive layer M3 is disposed on the side of the second conductive layer M2 away from the first conductive layer M1;

[0085] The fourth conductive layer M4 is disposed on the side of the third conductive layer M3 away from the first conductive layer M1;

[0086] The fifth conductive layer M5 is disposed on the side of the fourth conductive layer M4 away from the first conductive layer M1;

[0087] The sixth conductive layer M6 is disposed on the side of the fifth conductive layer M5 away from the first conductive layer M1;

[0088] The seventh conductive layer M7 is disposed on the side of the sixth conductive layer M6 away from the first conductive layer M1;

[0089] The power unit 10 is disposed on the fourth conductive layer M4 and the fifth conductive layer M5; the first transmission layer C1 is the second conductive layer M2; the second transmission layer C2 is the third conductive layer M3; and the third transmission layer C3 is the sixth conductive layer M6.

[0090] Specifically, the power module comprises seven conductive layers. The power module also includes an interlayer insulating layer, which is disposed between adjacent conductive layers and serves an insulating function. The first conductive layer M1 may house a drive circuit and related protection circuitry. The drive circuit transmits drive signals to the power unit to control the conduction state of the power devices within the power unit. (Reference) Figure 5The second conductive layer M2 is the first transmission layer C1, i.e., the newly added power layer. The second conductive layer M2 can be a single layer of copper, electrically connected to the first electrode of the external device 2 via conductive vias or laser welding of copper blocks, thereby connecting to the power circuit. (Reference) Figure 6 The third conductive layer M3 is the second transport layer C2, and is electrically connected to the second electrode of the external device 2, as referenced. Figure 7 and Figure 8 The power unit 10 is disposed on the fourth conductive layer M4 and the fifth conductive layer M5, wherein the fourth conductive layer M4 includes an opening K1 for accommodating the power device in the power unit 10; the side of the power unit 10 near the third conductive layer M3 is electrically connected to the third conductive layer M3 through a conductive hole that penetrates the interlayer insulating layer between the third conductive layer M3 and the fourth conductive layer M4, so that the side near the third conductive layer M3 is electrically connected to the power unit.

[0091] refer to Figure 9 The sixth conductive layer M6 is the third transmission layer C3, used for electrical connection with the first electrode of the external device 2. The side of the power unit 10 closest to the sixth conductive layer M6 contacts the sixth conductive layer M6 through a conductive hole penetrating the interlayer insulating layer located between the fifth conductive layer M5 and the sixth conductive layer M6, thereby electrically connecting the sixth conductive layer M6 to the power unit 10. (Reference) Figure 10 The seventh conductive layer M7 is a single copper layer, which can be connected to an external heat sink by welding or sintering. Between the first conductive layer M1 and the sixth conductive layer M6, the interlayer insulation layer between each adjacent conductive layer can be made of resin. The interlayer insulation layer between the sixth conductive layer M6 and the seventh conductive layer M7 is a thermally conductive insulating material; that is, the interlayer insulation layer between the sixth conductive layer M6 and the seventh conductive layer M7 is a thermally conductive insulating film.

[0092] Optionally, in one embodiment of the present invention, the power module is electrically connected to the T+ conductor and the T- conductor; the first transmission layer C1 and the third transmission layer C3 are electrically connected to the T+ conductor; and the second transmission layer C2 is electrically connected to the T- conductor.

[0093] Specifically, the T+ conductor can be understood as the positive terminal of the external device 2 connected to the power module, and the T- conductor can be understood as the negative terminal of the external device 2 connected to the power module. For example, the T+ conductor can be the connection terminal of the positive plate of an external capacitor, and the T- conductor is the connection terminal of the negative plate of the external capacitor. By setting the first transmission layer C1 and the third transmission layer C3 to be electrically connected to the T+ conductor, and the second transmission layer C2 to be electrically connected to the T- conductor, the following can be achieved: Figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 9The direction of current transmission in the first transmission layer C1, the direction of current transmission in the second transmission layer C2, and the direction of current transmission in the third transmission layer C3.

[0094] The power module may further include at least one first conductive via TK1 and at least one second conductive via TK2; wherein a T+ conductor is disposed in the first conductive via TK1, and the first conductive via TK1 is disposed at least in the first transmission layer C1 and the third transmission layer C3; a T- conductor is disposed in the second conductive via TK2, and the second conductive via TK2 is disposed at least in the second transmission layer. In this embodiment of the invention, the first transmission layer C1 and the third transmission layer C3 are electrically connected to the T+ conductor through the first conductive via TK1, and the second transmission layer C2 is electrically connected to the T- conductor through the second conductive via TK2.

[0095] Furthermore, since the second conductive via TK2 can be etched from the side of the third transport layer C3 away from the second transport layer C2, the second conductive via TK2 can be provided at least in the second transport layer C1 and the third transport layer C3. Figures 3-9 An example is shown where a first conductive via TK1 penetrates the power module and a second conductive via TK2 penetrates the power module. That is, both the first conductive via TK1 and the second conductive via TK2 penetrate the first to seventh conductive layers (M1 to M7). This eliminates the need for precise control of the etching depth of the first conductive via TK1 and the second conductive via TK2, thereby reducing the fabrication difficulty of the power module.

[0096] Optionally, in another embodiment of the present invention, the power module is electrically connected to the T+ conductor and the T- conductor; the first transmission layer C1 and the third transmission layer C3 are electrically connected to the T- conductor; and the second transmission layer C2 is electrically connected to the T+ conductor. By configuring the first transmission layer C1 and the third transmission layer C3 to be electrically connected to the T- conductor, and the second transmission layer C2 to be electrically connected to the T+ conductor, the following can be achieved: Figure 2 , Figure 11 , Figure 12 , Figure 13 and Figure 14 The direction of current transmission in the first transmission layer C1, the direction of current transmission in the second transmission layer C2, and the direction of current transmission in the third transmission layer C3.

[0097] The power module may further include: at least one first conductive via TK1 and at least one second conductive via TK2; wherein a T- conductor is disposed in the first conductive via TK1, and the first conductive via TK1 is disposed at least in the first transmission layer C1 and the third transmission layer C3; a T+ conductor is disposed in the second conductive via TK2, and the second conductive via TK2 is disposed at least in the second transmission layer.

[0098] Furthermore, since the second conductive via TK2 can be etched from the side of the third transport layer C3 away from the second transport layer C2, the second conductive via TK2 can be provided at least in the second transport layer C1 and the third transport layer C3. Figure 3 , Figures 11-14 An example is shown where a first conductive via TK1 penetrates the power module and a second conductive via TK2 penetrates the power module, thereby reducing the difficulty of fabricating the power module without the need for precise control of the etching depth of the first conductive via TK1 and the etching depth of the second conductive via TK2.

[0099] In summary, for such Figure 1 The connection method shown has a T+ conductor in the first conductive via TK1 and a T- conductor in the second conductive via TK2; for example, Figure 2 The connection method shown has a T- conductor in the first conductive through-hole TK1 and a T+ conductor in the second conductive through-hole TK2; wherein the T+ conductor is used for electrical connection with the positive plate of the external capacitor and the T- conductor is used for electrical connection with the negative plate of the external capacitor. Figure 3 , Figure 4 and Figure 5 and Figure 8 The direction of the current shown is as follows: Figure 1 The current transmission direction is as follows in the connection method shown, i.e., when a T+ conductor is provided in the first conductive through-hole TK1 and a T- conductor is provided in the second conductive through-hole TK2; for example, Figure 2 The connection shown is in the case where a T- conductor is provided in the first conductive through-hole TK1 and a T+ conductor is provided in the second conductive through-hole TK2. Figure 3 , Figure 4 and Figure 5 and Figure 8 The current transport directions in the films shown are opposite, which can be referenced. Figure 11 , Figure 12 , Figure 13 and Figure 14 .

[0100] Based on the above embodiments, optionally, the power module includes at least one power submodule 1, for example, referring to... Figures 3-9 An exemplary power module is shown, comprising three power sub-modules 1, corresponding to the three phases U, V, and W respectively, each power sub-module 1 including one power unit 10; and further comprising:

[0101] At least one first conductive via TK1 and at least one second conductive via TK2; the area where the first conductive via TK1 is located is located on opposite sides of the area where the second conductive via TK2 is located.

[0102] Specifically, multiple through holes can be formed at at least one side edge of the power module by laser drilling. The diameter of the through holes is larger than the diameter of the T+ conductor and larger than the diameter of the T- conductor to ensure that the T+ conductor can be inserted into the through holes and that the T- conductor can be inserted into the through holes. Then, the T+ conductor and the T- conductor are electrically connected to their respective transmission layers by solder.

[0103] Based on the above embodiments, optionally, refer to... Figure 3 The power submodule 1 includes a first side L1 and a second side L2 extending along a first direction X, and a third side L3 and a fourth side L4 extending along a second direction Y; the first direction X and the second direction Y intersect; the first side L1 and the second side L2 are arranged opposite to each other, the third side L3 and the fourth side L4 are arranged opposite to each other, and the third side L3 and the fourth side L4 are connected between the first side L1 and the second side L2; wherein, the first conductive through hole TK1 and the second conductive through hole TK2 are arranged along the third side L3.

[0104] Specifically, the power submodule 1 has a plate-like structure with a thickness on the order of millimeters. The plane containing the power submodule 1 is parallel to the plane formed by the first direction X and the second direction Y. Optionally, the first direction X and the second direction Y can be perpendicular to each other or not. The power submodule 1 can be a quadrilateral or a polygon with more than four sides. For example, the power submodule 1 can be a quadrilateral, including a first side L1 and a second side L2 extending along the first direction X, and a third side L3 and a fourth side L4 extending along the second direction Y; wherein the first side L1 and the second side L2 are arranged opposite each other, the third side L3 and the fourth side L4 are arranged opposite each other, one end of the third side L3 is connected to the first side L1, and the other end of the third side L3 is connected to the second side L2, one end of the fourth side L4 is connected to the first side L1, and the other end of the fourth side L4 is connected to the second side L2, that is, the first side L1, the third side L3, the fourth side L4 and the second side L2 are connected end to end in sequence. The first side L1, the second side L2, the third side L3, and the fourth side L4 can all be straight edges. Any one of the first side L1, the second side L2, the third side L3, and the fourth side L4 can be partially straight and partially curved. This can be set according to actual needs. Figure 3 In the middle, the power submodule 1 is a rounded rectangle.

[0105] The first conductive via TK1 and the second conductive via TK2 are arranged along the third side L3, so that the current direction in the first transmission layer C1 is opposite to the current direction in the second transmission layer C2, and the current direction in the third transmission layer C3 is opposite to the current direction in the second transmission layer C2.

[0106] Based on the above embodiments, optionally, the total number of the first conductive via TK1 and the second conductive via TK2 is proportional to the length of the third side L3.

[0107] Specifically, a larger number of first conductive vias TK1 can make the current in the first transmission layer C1 and the third transmission layer C3 more uniform, and can allow the current in the first transmission layer C1 and the third transmission layer C3 to be input or output from multiple locations, preventing current from accumulating and causing the temperature of the area where the current accumulates to rise, thus damaging the power module. Similarly, a larger number of second conductive vias TK2 can make the current in the second transmission layer C2 more uniform, and can allow the current in the second transmission layer C2 to be output or input from multiple locations, preventing current from accumulating and causing the temperature of the area where the current accumulates to rise, thus damaging the power module. However, the spacing between the first conductive vias TK1, the spacing between the second conductive vias TK2, and the spacing between the first conductive vias TK1 and the second conductive vias TK2 need to meet certain requirements to prevent signal interference, short circuits, and other problems caused by excessively small spacing. Therefore, in this embodiment of the invention, while satisfying the requirements for the spacing between the first conductive vias TK1, the spacing between the second conductive vias TK2, and the spacing between the first conductive vias TK1 and the second conductive vias TK2, the total number of the first conductive vias TK1 and the second conductive vias TK2 is set to be proportional to the length of the third side L3. This can prevent signal interference, short circuits, and other problems caused by excessively small spacing, while also reducing the temperature at the third side L3 of the power module.

[0108] Optionally, there are multiple first conductive vias TK1 and multiple second conductive vias TK2. The multiple second conductive vias TK2 are sequentially arranged along the middle section of the third side L3, and the multiple first conductive vias TK1 are evenly distributed on opposite sides of the multiple second conductive vias TK2. For example, Figure 3In this embodiment, each power submodule includes four second conductive vias TK2 and four first conductive vias TK1. The four second conductive vias TK2 are sequentially arranged along the middle section of the third side L3, and two first conductive vias TK1 are arranged on each side of the four second conductive vias TK2. In this embodiment, the arrangement of multiple second conductive vias TK2 sequentially along the middle section of the third side L3, and the equal distribution of multiple first conductive vias TK1 on opposite sides of the multiple second conductive vias TK2, can increase the area of ​​the overlap between the orthographic projection of the current transmission region in the first transmission layer C1 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2, as well as increase the area of ​​the overlap between the orthographic projection of the current transmission region in the third transmission layer C3 onto the second transmission layer C2 and the current transmission region in the second transmission layer C2. Furthermore, it can also improve the uniformity of the current in the first transmission layer C1, the second transmission layer C2, and the third transmission layer C2.

[0109] Based on the above embodiments, refer to Figure 4 and Figure 11 Optionally, at least one first conductive hole DK1 is provided between the first transmission layer C1 and the third transmission layer C3; the first conductive hole DK1 is used to connect the first transmission layer C1 and the third transmission layer C3.

[0110] Specifically, the first transmission layer C1 is electrically connected to the positive (or negative) terminal of the external device 2. The first transmission layer C1 is also electrically connected to the third transmission layer C3 through at least one first conductive hole located between the first transmission layer C1 and the third transmission layer C3. Therefore, the first transmission layer C1 is electrically connected to the negative (or positive) terminal of the external device 2 in sequence through at least one first conductive hole DK1, the third transmission layer C3, the power unit, and the second transmission layer C2, so that current can flow through the first transmission layer C1.

[0111] Furthermore, at least one first conductive via DK1 forms at least one first conductive via array DK10. By increasing the number of first conductive vias DK1 to form the first conductive via array DK10, multiple connection potentials can be made between the first transmission layer C1 and the third transmission layer C3, allowing the current in the first transmission layer C1 to be input or output from multiple locations, preventing current from accumulating and causing the area where the current accumulates to have a high temperature, which could damage the power module. When the number of first conductive vias DK1 is large, the current in the first transmission layer C1 can be made more uniform.

[0112] For example, refer to Figures 5-9 as well as Figures 12-14In each power submodule 1, there are two first conductive via arrays DK10; one first conductive via array DK10 is disposed along the first side L1, and the other first conductive via array DK10 is disposed along the second side L2; relative to the third side L3, the first conductive via array DK10 is closer to the fourth side L4, thereby ensuring that the current in the first transmission layer C1 flows in from the third side L3 and flows out from the side closer to the fourth side L4 (for Figure 1 (as shown in the connection diagram), or, ensuring that the current in the first transmission layer C1 flows in from the side closest to the fourth side L4 and then flows out from the third side L3 (for Figure 2 (As shown in the connection method), this increases the current transmission area in the first transmission layer C1. The middle region of the third transmission layer C3 needs to contact the power unit; therefore, in this embodiment, the first conductive aperture array DK10 is positioned relative to the first side L1 and the second side L2 to prevent the first conductive aperture array DK10 from affecting the layout of the power unit 10. The first conductive aperture array DK10 includes multiple first conductive apertures DK1 arranged in an array.

[0113] Based on the above embodiments, optionally, refer to... Figure 8 The power unit 10 includes a first power subunit 11 and a second power subunit 12; the first power subunit 11 and the second power subunit 12 are arranged side by side in the first direction X between the third side L3 and the fourth side L4; wherein, the first power subunit 11 includes a plurality of first power devices S1 connected in parallel; the second power subunit includes a plurality of second power devices S2 connected in parallel; the first power subunit and the second power subunit are used to form a half-bridge circuit topology.

[0114] Specifically, the first power subunit 11 can be positioned closer to the third side L3 than the second power subunit 12. The first power subunit 11 includes multiple first power devices S1 connected in parallel, which can be either lower-bridge or upper-bridge power devices. The second power subunit 12 includes multiple second power devices S2 connected in parallel, which can be either upper-bridge or lower-bridge power devices. Figure 1 The connection method shown is in Figure 3 , Figure 4 and Figure 5 and Figure 8 In the current direction within the shown film layer, the first power device S1 is the lower bridge power device, and the second power device S2 is the upper bridge power device. For Figure 2 The connection method shown is in Figure 11 , Figure 12 and Figure 13 and Figure 14When the current directions in the membrane layer are opposite, the first power device S1 is the upper bridge power device and the second power device S2 is the lower bridge power device.

[0115] Based on the above embodiments, optionally, refer to... Figure 4 and Figure 11 At least one second conductive hole DK2 is provided between the second transmission layer C2 and the third transmission layer C3; the second conductive hole DK2 is used to connect the second transmission layer C2 and the third transmission layer C3 to connect the first power device S1 and the second power device S2.

[0116] Further reference Figures 5-9 as well as Figures 12-14 At least one second conductive hole DK2 forms at least one second conductive hole array DK20.

[0117] For example, the first power subunit 11 includes six first power devices S1, which are arranged in a 2×3 array; the second power subunit 12 includes six second power devices S2, which are arranged in a 2×3 array; that is, the power devices in the power unit are arranged in a 4×3 array. In the first direction X, two first power devices S1 and two second power devices S2 are arranged side by side, and at least one second conductive hole connecting the third transmission layer C3 and the second transmission layer C2 is provided between adjacent first power devices S1 and second power devices S2.

[0118] Since two first power devices S1 and two second power devices S2 are arranged side by side in the first direction X, and at least one second conductive hole is provided between adjacent first power devices S1 and second power devices S2 to connect the third transmission layer C3 and the second transmission layer C2, the number of second conductive hole arrays DK20 in each power submodule 1 can be at least 1. The second conductive hole arrays DK20 are located in the middle region of the power submodule 1 and extend along the second direction Y.

[0119] Based on the above embodiments, optionally, for example, Figure 1 The connection method shown is for reference. Figure 6 and Figure 9 The power submodule 1 also includes:

[0120] The first T+ power link section Q1 and the first power trace section J1 are both located in the third transmission layer C3 (reference). Figure 8The first T+ power link portion Q1 is electrically connected to the T+ conductor located in the first conductive via TK1; the first T+ power link portion Q1 is also electrically connected to the drain of the second power device S2; the first power trace portion J1 is electrically connected to the drain of the first power device S1; the first power trace portion J1 is located on the side of the third transmission layer C3 near the third side L3, and the first T+ power link portion Q1 is located on the side of the first power trace portion J1 away from the third side L3 and on the opposite sides of the first power trace portion J1.

[0121] The T-power link section Q2 and the second power trace section J2 are both located in the second transmission layer C2 (reference). Figure 5 The T-power link Q2 is electrically connected to the T-conductor located in the second conductive via TK2; the T-power link Q2 is also electrically connected to the source of the first power device S1; the second power trace J2 is electrically connected to the source of the second power device S2; the T-power link Q2 is located on the side of the second transmission layer C2 closer to the third side L3, and the second power trace J2 is located on the side of the T-power link Q2 away from the third side L3.

[0122] Combination Figure 3 The source of the second power device S2 is electrically connected to the drain of the first power device S1 through the second power trace J2, the second conductive hole DK2 and the first power trace J1 in sequence.

[0123] Based on the above embodiments, optionally, for example, Figure 2 The connection method shown is for reference. Figure 13 and Figure 14 The power submodule 1 also includes:

[0124] The first T+ power link section Q1 and the first power trace section J1 are both located in the second transmission layer C2 (reference). Figure 13 The first T+ power link portion Q1 is electrically connected to the T+ conductor located in the second conductive via TK2; the first T+ power link portion Q1 is also electrically connected to the drain of the first power device S1; the first power trace portion J1 is electrically connected to the drain of the second power device S2; the first power trace portion J1 is located on the side of the third transmission layer C3 away from the third side L3, and the first T+ power link portion Q1 is located between the first power trace portion J1 and the third side L3;

[0125] The T-power link section Q2 and the second power trace section J2 are both located in the third transmission layer C3 (reference). Figure 14The T-power link Q2 is electrically connected to the T-conductor located in the first conductive via TK1; the T-power link Q2 is also electrically connected to the source of the second power device S2; the second power trace J2 is electrically connected to the source of the first power device S1.

[0126] Combination Figure 11 The source of the first power device S1 is electrically connected to the drain of the second power device S2 through the second power trace J2, the second conductive hole DK2 and the first power trace J1 in sequence.

[0127] Based on the above embodiments, optionally, the number of first transmission layers C1 can be one, two, or more than two; the number of second transmission layers C2 can be one, two, or more than two.

[0128] When the number of first transmission layers C1 is greater than or equal to two, it can be set up so that all the first transmission layers C1 are stacked sequentially adjacent to each other, or it can be set up so that at least one second transmission layer C2 is set between at least two first transmission layers C1; wherein, each adjacent first transmission layer C1 is connected by a conductive hole.

[0129] When the number of second transmission layers C2 is greater than or equal to two, it can be set up so that all the second transmission layers C2 are stacked sequentially adjacent to each other, or it can be set up so that at least one first transmission layer C1 is set between at least two second transmission layers C2; wherein, each adjacent second transmission layer C2 is connected by a conductive hole.

[0130] Optionally, when the number of first transmission layers C1 is greater than or equal to two and the number of second transmission layers C2 is greater than or equal to two, all first transmission layers C1 can be stacked sequentially adjacent to each other, and all second transmission layers C2 can be stacked sequentially adjacent to each other; or, the first transmission layers C1 and the second transmission layers C2 can be alternately arranged sequentially in the Z direction.

[0131] It should be noted that the power unit 10 is disposed between the third transmission layer C3 and the second transmission layer C2 that is closest to the third transmission layer C3, and there is no first transmission layer C1 between the third transmission layer C3 and the second transmission layer C2 that is closest to the third transmission layer C3.

[0132] Based on the above embodiments, optionally, the connection method between the power module and the external device 2 can be a connection method other than conductive vias. For example, the connection can be achieved by laser welding of copper blocks. Multiple copper blocks are disposed on the outer surface of the power module or inside the power module. These copper blocks include at least one T+ copper block and at least one T- copper block. The T+ copper block is used for electrical connection to the positive electrode of the external device 2, and the T- copper block is used for connection to the negative electrode of the external device 2. The conductive layer in the power module is connected to the corresponding T+ and T- copper blocks through conductive vias or leads, thus achieving the connection between the conductive layer in the power module and the external device 2. This embodiment of the invention does not limit the method of connection between the power module and the external device 2, as long as the positive and negative electrodes of the power module and the external device 2 are connected.

[0133] This embodiment provides a motor controller, including the power module proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0134] This embodiment provides an electric drive assembly, including the power module proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0135] This embodiment provides a vehicle that includes the power module proposed in any of the above embodiments, or the motor controller proposed in any of the above embodiments, or the electric drive assembly proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0136] This embodiment provides a power module, including:

[0137] At least three conductive layers;

[0138] The power unit 10 is disposed between two adjacent conductive layers in at least three conductive layers;

[0139] Among them, at least three conductive layers include a first transmission layer C1, a second transmission layer C2 and a third transmission layer C3; the second transmission layer C2 is located between the first transmission layer C1 and the third transmission layer C3; the power unit 10 is disposed between the second transmission layer C2 and the third transmission layer C3, and the third transmission layer C3 is closer to the heat sink than the first transmission layer C1.

[0140] The current direction along the bridge arm in the first transmission layer C1 is opposite to the current direction along the bridge arm in the second transmission layer C2, and the orthogonal projections of the current transmission regions in the first transmission layer C1 and the second transmission layer C2 on the same conductive layer at least partially overlap; the current direction along the bridge arm in the third transmission layer C3 is opposite to the current direction along the bridge arm in the second transmission layer C2, and the orthogonal projections of the current transmission regions in the third transmission layer C3 and the second transmission layer C2 on the same conductive layer at least partially overlap.

[0141] Optionally, the area of ​​the overlapping region of the current transmission region in the first transmission layer C1 and the current transmission region in the second transmission layer C2 on the same conductive layer is the first area.

[0142] The area of ​​the overlapping region of the current transmission region in the third transmission layer C3 and the current transmission region in the second transmission layer C2 on the same conductive layer is the second area.

[0143] The first area is larger than the second area.

[0144] Optionally, the current transmission region in the first transmission layer C1 accounts for more than or equal to 90% of the area of ​​the first transmission layer C1.

[0145] Optional, the power module includes:

[0146] First conductive layer M1;

[0147] The second conductive layer M2 is disposed on one side of the first conductive layer M1;

[0148] The third conductive layer M3 is disposed on the side of the second conductive layer M2 away from the first conductive layer M1;

[0149] The fourth conductive layer M4 is disposed on the side of the third conductive layer M3 away from the first conductive layer M1;

[0150] The fifth conductive layer M5 is disposed on the side of the fourth conductive layer M4 away from the first conductive layer M1;

[0151] The sixth conductive layer M6 is disposed on the side of the fifth conductive layer M5 away from the first conductive layer M1;

[0152] The seventh conductive layer M7 is disposed on the side of the sixth conductive layer M6 away from the first conductive layer M1;

[0153] Power unit 10 is disposed on the fourth conductive layer M4 and the fifth conductive layer M5;

[0154] The first transport layer C1 is the second conductive layer M2; the second transport layer C2 is the third conductive layer M3; and the third transport layer C3 is the sixth conductive layer M6.

[0155] Optionally, the power module includes at least one power submodule 1, each power submodule 1 including a power unit 10; and further includes:

[0156] At least two conductive vias, the conductive vias penetrating the power submodule 1; the at least two conductive vias include at least one first conductive via TK1 and at least one second conductive via TK2;

[0157] In this configuration, a T+ conductor is disposed in the first conductive via TK1, and a T- conductor is disposed in the second conductive via TK2. The first transmission layer C1 and the third transmission layer C3 are electrically connected to the T+ conductor through the first conductive via TK1; the second transmission layer C2 is electrically connected to the T- conductor through the second conductive via TK2. Alternatively, a T- conductor is disposed in the first conductive via TK1, and a T+ conductor is disposed in the second conductive via TK2. The first transmission layer C1 and the third transmission layer C3 are electrically connected to the T- conductor through the first conductive via TK1; the second transmission layer C2 is electrically connected to the T+ conductor through the second conductive via TK2.

[0158] The T+ conductor is used for electrical connection with the positive plate of the external capacitor, and the T- conductor is used for electrical connection with the negative plate of the external capacitor.

[0159] Optionally, the power submodule 1 includes a first side L1 and a second side L2 extending along a first direction X, and a third side L3 and a fourth side L4 extending along a second direction Y; the first direction X and the second direction Y intersect; the first side L1 and the second side L2 are arranged opposite to each other, the third side L3 and the fourth side L4 are arranged opposite to each other, and the third side L3 and the fourth side L4 are connected between the first side L1 and the second side L2.

[0160] The first direction X is parallel to the extension direction of the bridge arm, and the first conductive through hole TK1 and the second conductive through hole TK2 are set along the third side L3.

[0161] Optionally, the total number of the first conductive via TK1 and the second conductive via TK2 is proportional to the length of the third side L3;

[0162] And / or, the number of first conductive vias TK1 is equal to the number of second conductive vias TK2.

[0163] Optionally, there may be multiple first conductive vias TK1 and multiple second conductive vias TK2;

[0164] Among them, multiple second conductive through holes TK2 are arranged sequentially along the middle section of the third side L3, and multiple first conductive through holes TK1 are evenly arranged on the opposite sides of the multiple second conductive through holes TK2.

[0165] Optionally, at least one first conductive hole array DK10 is provided between the first transmission layer C1 and the third transmission layer C3;

[0166] The first conductive via array DK10 is used to connect the first transport layer C1 and the third transport layer C3.

[0167] Optionally, in each power submodule 1, the number of first conductive hole arrays DK10 is 2;

[0168] One of the first conductive hole arrays DK10 is disposed along the first side L1, and the other first conductive hole array DK10 is disposed along the second side L2;

[0169] The first conductive hole array DK10 is closer to the fourth side L4 than the third side L3.

[0170] Optionally, at least one second conductive hole array DK20 is provided between the second transmission layer C2 and the third transmission layer C3;

[0171] The second conductive via array DK20 is used to connect the second transport layer C2 and the third transport layer C3.

[0172] Optionally, in each power submodule 1, the number of the second conductive hole array DK20 is 1;

[0173] The second conductive aperture array DK20 is located in the middle region of the power submodule 1 and extends along the second direction Y.

[0174] Optionally, the power unit 10 includes a first power subunit 11 and a second power subunit 12;

[0175] The first power subunit 11 and the second power subunit 12 are arranged side by side in the first direction X between the third side L3 and the fourth side L4;

[0176] The first power subunit 11 includes multiple first power devices S1 connected in parallel; the second power subunit 12 includes multiple second power devices S2 connected in parallel; the first power subunit 11 and the second power subunit 12 in the same power unit 10 are used to form a half-bridge circuit topology.

[0177] Optionally, the first power subunit 11 includes six first power devices S1, which are arranged in a 2×3 array.

[0178] The second power subunit 12 includes six second power devices S2, which are arranged in a 2×3 array.

[0179] In the first direction X, two first power devices S1 and two second power devices S2 are arranged side by side, and at least one second conductive hole connecting the third transmission layer C3 and the second transmission layer C2 is provided between adjacent first power devices S1 and second power devices S2.

[0180] Optionally, if a T+ conductor is provided in the first conductive via TK1 and a T- conductor is provided in the second conductive via TK2, each power submodule 1 further includes:

[0181] The first T+ power link section Q1 and the first power trace section J1 are both located in the third transmission layer C3. The first T+ power link section Q1 is electrically connected to the T+ conductor located in the conductive via. The first T+ power link section Q1 is also electrically connected to the drain of the second power device S2. The first power trace section J1 is electrically connected to the drain of the first power device S1.

[0182] The T-power link section Q2 and the second power trace section J2 are both located in the second transmission layer C2. The T-power link section Q2 is electrically connected to the T-conductor located in the conductive via. The T-power link section Q2 is also electrically connected to the source of the first power device S1. The second power trace section J2 is electrically connected to the source of the second power device S2.

[0183] The source of the second power device S2 is electrically connected to the drain of the first power device S1 through the second power trace J2, the second conductive hole DK2 and the first power trace J1 in sequence.

[0184] When a T- conductor is provided in the first conductive via TK1 and a T+ conductor is provided in the second conductive via TK2, each power submodule 1 further includes:

[0185] The first T+ power link section Q1 and the first power trace section J1 are both located in the second transmission layer C2. The first T+ power link section Q1 is electrically connected to the T+ conductor located in the second conductive via TK2. The first T+ power link section Q1 is also electrically connected to the drain of the first power device S1. The first power trace section J1 is electrically connected to the drain of the second power device S2.

[0186] The T-power link section Q2 and the second power trace section J2 are both located in the third transmission layer C3. The T-power link section Q2 is electrically connected to the T-conductor located in the first conductive via TK1. The T-power link section Q2 is also electrically connected to the source of the first power device S1. The second power trace section J2 is electrically connected to the source of the first power device S1.

[0187] The source of the first power device S1 is electrically connected to the drain of the second power device S2 through the second power trace, the second conductive hole, and the first power trace in sequence.

[0188] Optionally, the power module may also include:

[0189] Interlayer insulation layer: The interlayer insulation layer is disposed between adjacent conductive layers on both sides, and the interlayer insulation layer serves as insulation.

[0190] This embodiment provides a motor controller, including the power module proposed in any of the above embodiments.

[0191] This embodiment provides an electric drive assembly, including the power module proposed in any of the above embodiments.

[0192] This embodiment provides a vehicle that includes the power module proposed in any of the above embodiments, or the motor controller proposed in any of the above embodiments, or the electric drive assembly proposed in any of the above embodiments.

[0193] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A power module, characterized in that, include: First transport layer, second transport layer, and third transport layer; The second transport layer is located between the first transport layer and the third transport layer; A power unit is disposed between the second transmission layer and the third transmission layer; The current direction along the bridge arm in both the first and third transmission layers is opposite to the current direction along the bridge arm in the second transmission layer. The orthographic projection of the current transmission region in the first transmission layer onto the second transmission layer at least partially overlaps with the current transmission region in the second transmission layer.

2. The power module according to claim 1, characterized in that, The area of ​​the overlapping region between the orthographic projection of the current transmission region in the first transmission layer onto the second transmission layer and the current transmission region in the second transmission layer is the first area; The area of ​​the overlap between the orthographic projection of the current transmission region in the third transmission layer onto the second transmission layer and the current transmission region in the second transmission layer is the second area. The first area is larger than the second area.

3. The power module according to claim 1, characterized in that, The current transmission region in the first transmission layer accounts for more than or equal to 90% of the area of ​​the first transmission layer.

4. The power module according to claim 1, characterized in that, include: First conductive layer; A second conductive layer is disposed on one side of the first conductive layer; A third conductive layer is disposed on the side of the second conductive layer away from the first conductive layer; A fourth conductive layer is disposed on the side of the third conductive layer away from the first conductive layer; The fifth conductive layer is disposed on the side of the fourth conductive layer away from the first conductive layer; The sixth conductive layer is disposed on the side of the fifth conductive layer away from the first conductive layer; The seventh conductive layer is disposed on the side of the sixth conductive layer away from the first conductive layer; The power unit is disposed on the fourth conductive layer and the fifth conductive layer; The first transmission layer is the second conductive layer; the second transmission layer is the third conductive layer; and the third transmission layer is the sixth conductive layer.

5. The power module according to any one of claims 1 to 4, characterized in that, The power module is electrically connected to the T+ conductor and the T- conductor; The first transmission layer and the third transmission layer are electrically connected to the T+ conductor; The second transport layer is electrically connected to the T-conductor.

6. The power module according to claim 5, characterized in that, Also includes: At least one first conductive via and at least one second conductive via; The T+ conductor is disposed in the first conductive via, and the first conductive via is disposed at least in the first transmission layer and the third transmission layer; The T-conductor is disposed in the second conductive via, and the second conductive via is disposed at least in the second transmission layer.

7. The power module according to claim 6, characterized in that, The second conductive via is provided at least in the second transmission layer and the third transmission layer.

8. The power module according to claim 1, characterized in that, At least one first conductive hole is provided between the first transmission layer and the third transmission layer; The first conductive hole is used to connect the first transmission layer and the third transmission layer.

9. The power module according to claim 8, characterized in that, The at least one first conductive hole forms at least one first conductive hole array.

10. The power module according to claim 1, characterized in that, At least one second conductive hole is provided between the second transmission layer and the third transmission layer; The second conductive hole is used to connect the second transmission layer and the third transmission layer.

11. The power module according to claim 10, characterized in that, The at least one second conductive hole forms at least one array of second conductive holes.

12. A motor controller, characterized in that, Includes the power module as described in any one of claims 1 to 11.

13. An electric drive assembly, characterized in that, Includes the power module as described in any one of claims 1 to 11.

14. A vehicle, characterized in that, It includes the power module according to any one of claims 1 to 11, or the motor controller according to claim 12, or the electric drive assembly according to claim 13.

Images