A power module, motor controller, electric drive assembly, and vehicle

Abstract

The application discloses a power module, a motor controller, an electric drive assembly and a vehicle. The power module comprises at least two sub-power modules and at least one direct current connection terminal connected with the at least two sub-power modules. The technical scheme provided by the embodiment connects the at least two sub-power modules with the direct current connection terminal, so that the at least two sub-power modules share the direct current connection terminal with each other, the signal flow path of the direct current connection terminal is increased, the parasitic inductance of the power module is reduced, the switching efficiency of the power module is improved, the switching loss of the power module is reduced, and the heat dissipation effect of the electric signal transmission is improved.

Description

[0001] Cross-references and priority statements

[0002] This patent application claims priority to application No. 2025105229960, filed on April 23, 2025, entitled "A power module, a motor controller, an electric drive assembly and a vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to the field of power device technology, and in particular to a power module, a motor controller, an electric drive assembly, and a vehicle. Background Technology

[0004] With the development of chip technology, the requirements for power modules are becoming increasingly stringent. Existing power modules for motor inverter circuits are generally in HPD (Hybrid Power Drive Package) or plastic encapsulation, with each HPD or plastic-encapsulated module having a parasitic inductance between 4nH and 10nH. Existing power modules suffer from relatively large parasitic inductance and inadequate heat dissipation along the current transmission path. Summary of the Invention

[0005] This invention provides a power module, a motor controller, an electric drive assembly, and a vehicle to solve the problems of large parasitic inductance and poor heat dissipation in the current transmission path of existing power modules.

[0006] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0007] This invention provides a power module, comprising:

[0008] At least two sub-power modules;

[0009] Two DC connection terminals;

[0010] The at least two sub-power modules are connected to at least the same DC connection terminal.

[0011] Optionally, the two DC connection terminals include a first DC connection terminal and a second DC connection terminal;

[0012] Wherein, the projections of the first DC connection terminal and the second DC connection terminal on the first plane at least partially overlap; wherein, the plane where the at least two sub-power modules are located is configured as the first plane.

[0013] Optionally, the two DC connection terminals include a first DC connection terminal and a second DC connection terminal; the projections of the first DC connection terminal and the second DC connection terminal on the second plane at least partially overlap;

[0014] The second plane intersects with the first plane, and the plane containing the at least two sub-power modules is configured as the first plane.

[0015] Optionally, at least one of the DC connection terminals includes a body portion and at least one terminal portion, the body portion being connected to the at least one terminal portion, and the power module further includes a power layer, the at least one DC connection terminal being connected to the power layer through the terminal portion.

[0016] Optionally, the at least one terminal portion may be a plurality of terminal portions, which are spaced apart.

[0017] Optionally, the two DC connection terminals include a first DC connection terminal and a second DC connection terminal;

[0018] Along a first direction, the terminal portions of the first DC connection terminal and the terminal portions of the second DC connection terminal are alternately arranged, wherein the at least two sub-power modules are arranged along the first direction.

[0019] Optionally, the body portion includes a bend connected to the terminal portion, the bend extending along a third direction, the third direction intersecting with a first plane containing the at least two sub-power modules.

[0020] Optionally, the projections of the bends of the two DC connection terminals onto the second plane at least partially overlap.

[0021] The plane containing the at least two sub-power modules is configured as a first plane, and the second plane intersects with the first plane.

[0022] Optionally, the body portion includes a horizontal portion extending along a second direction, the horizontal portion being connected to the terminal portion via the bend, the second direction intersecting the first direction, and both the second direction and the first direction being parallel to the plane containing the at least two sub-power modules.

[0023] Optionally, the projections of the transverse portions of the two DC connection terminals onto the first plane at least partially overlap.

[0024] Optionally, the body portion includes a longitudinal portion extending along a third direction, the longitudinal portion being connected to the curved portion via the transverse portion; the third direction intersects with a first plane containing the at least two sub-power modules.

[0025] Optionally, the projections of the vertical portions of the two DC connection terminals onto the second plane at least partially overlap.

[0026] Optionally, the two DC connection terminals include a first DC connection terminal and a second DC connection terminal;

[0027] The power layer in the power module is configured with at least one first conductor and at least one second conductor, wherein the first conductor is connected to the first DC connection terminal, the second conductor is connected to the second DC connection terminal, and the at least two sub-power modules are connected to the same first conductor and / or second conductor.

[0028] Optionally, the first conductor is configured as a positive current layer and the second conductor is configured as a negative current layer.

[0029] Optionally, the power module includes a printed circuit board, and the at least two sub-power modules are embedded in the printed circuit board;

[0030] The printed circuit board includes multiple stacked conductor layers, wherein the conductor layers include the power layer of the power module.

[0031] Optionally, the plurality of stacked conductor layers are configured to be 6 or 7 layers.

[0032] Optionally, the power module further includes:

[0033] At least one absorption capacitor is connected in parallel with the sub-power module;

[0034] At least two of the sub-power modules are connected to the same absorption capacitor.

[0035] Optionally, the projection of the absorption capacitor on the first plane is located between the projections of two adjacent sub-power modules on the first plane;

[0036] The plane containing at least two sub-power modules is configured as the first plane.

[0037] Optionally, each sub-power module includes:

[0038] Upper and lower bridge arm chipsets distributed along the second direction;

[0039] In the second direction, the lower bridge arm chipset is disposed between the DC connection terminal and the upper bridge arm chipset.

[0040] According to a second aspect of the present invention, this embodiment provides a motor controller including the power module proposed in any of the first aspects.

[0041] According to a third aspect of the present invention, this embodiment provides an electric drive assembly including a power module as described in any of the first aspects, and / or including a motor controller as described in the second aspect.

[0042] According to a fourth aspect of the present invention, this embodiment provides a vehicle including a power module provided by any of the first aspects, and / or including a motor controller provided by any of the second aspects, and / or including an electric drive assembly provided by any of the third aspects.

[0043] The power module provided in this embodiment of the invention connects at least two sub-power modules to at least the same DC connection terminal, so that the at least two sub-power modules reuse at least the same DC connection terminal, thereby increasing the DC current signal flow path transmitted through the DC connection terminal, reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, reducing the switching loss of the power module, and improving the heat dissipation effect of the DC current signal transmission of the power module. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the structure of a power module provided in an embodiment of the present invention;

[0046] Figure 2 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention;

[0047] Figure 3 This is a circuit schematic diagram of a power module provided in an embodiment of the present invention;

[0048] Figure 4 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0049] Figure 5 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0050] Figure 6 This is a schematic diagram of the structure of the fifth conductive layer and the first DC connection terminal of a power module provided in an embodiment of the present invention;

[0051] Figure 7 This is a schematic diagram of the structure of the second conductive layer and the second DC connection terminal of a power module provided in an embodiment of the present invention;

[0052] Figure 8 This is a schematic diagram of another power module provided in an embodiment of the present invention;

[0053] Figure 9This is a cross-sectional structural diagram of a power module provided in an embodiment of the present invention;

[0054] Figure 10 This is a schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention;

[0055] Figure 11 This is a schematic diagram of the structure of the fourth conductive layer of a power module provided in an embodiment of the present invention;

[0056] Figure 12 This is a schematic diagram of the structure of the first conductive layer of a power module provided in an embodiment of the present invention;

[0057] Figure 13 This is a schematic diagram of the structure of the sixth conductive layer of a power module provided in an embodiment of the present invention;

[0058] Figure 14 This is a schematic diagram of the structure of the fifth conductive layer and the first DC connection terminal of another power module provided in an embodiment of the present invention;

[0059] Figure 15 This is a schematic diagram of the structure of the second conductive layer and the second DC connection terminal of another power module provided in an embodiment of the present invention;

[0060] Figure 16 This is a cross-sectional structural diagram of another power module provided in an embodiment of the present invention. Detailed Implementation

[0061] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0062] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0063] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0064] Figure 1 This is a schematic diagram of the structure of a power module provided in an embodiment of the present invention. Figure 2 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention. Figure 3 This is a circuit schematic diagram of a power module provided in an embodiment of the present invention. Combined with... Figures 1 to 3 The present invention provides a power module comprising: at least two sub-power modules 2; and two DC connection terminals 6, wherein the at least two sub-power modules 2 are connected to at least the same DC connection terminal 6.

[0065] Specifically, the power module achieves AC / DC conversion and voltage boosting / pull-down functions through internal circuitry. For example, the IGBT module achieves efficient switching characteristics through gate control. The power module can amplify the input signal and output high current or high voltage to drive high-power devices. The power module can incorporate overcurrent, overtemperature, and short-circuit protection circuits, significantly improving system reliability. The power module includes at least two half-bridge circuits. Each half-bridge circuit includes an upper bridge module H and a lower bridge module L. The upper bridge module H is a power chip connected to the positive terminal of the battery. The lower bridge module L is a power chip connected to the negative terminal of the battery. The power module includes at least two sub-power modules 2. Each half-bridge circuit corresponds to one sub-power module 2.

[0066] For example, the power module may include two sub-power modules 2 or three sub-power modules 2. When the power module includes two sub-power modules 2, they can work in conjunction with another power module having a single sub-power module 2 to realize a three-phase full-bridge circuit of the electric drive system. When the power module provided in this embodiment includes three sub-power modules 2, only one power module is needed to realize a three-phase full-bridge circuit of the electric drive system. Each sub-power module 2 of the three-phase full-bridge circuit is alternately turned on, outputting a drive AC current signal to the load.

[0067] For example, the power module of the drive motor may include a U-phase sub-power module, a V-phase sub-power module, and a W-phase sub-power module.

[0068] Any two or three of the U-phase, V-phase, and W-phase sub-power modules can be connected to the same DC connection terminal 6. With this configuration, since the upper bridge module H and lower bridge module L corresponding to the U-phase, V-phase, and W-phase sub-power modules of the power module are alternately turned on, at least two sub-power modules 2 connected to at least the same DC connection terminal 6 can reuse each other's DC connection terminals 6 to transmit DC current signals when they are turned on. This makes the current transmission loop of the power module wider, effectively reducing the parasitic inductance of the power module and improving heat dissipation.

[0069] The technical solution provided in this embodiment connects at least two sub-power modules 2 to at least the same DC connection terminal 6, so that at least two sub-power modules 2 reuse at least the same DC connection terminal 6, thereby increasing the DC current signal flow path transmitted through the DC connection terminal 6, reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, reducing the switching loss of the power module, and improving the heat dissipation effect of electrical signal transmission.

[0070] Optional, Figure 4 This is a schematic diagram of another power module provided in an embodiment of the present invention. Based on the above embodiments, see... Figure 4 The two DC connection terminals 6 include a first DC connection terminal 601 and a second DC connection terminal 602; wherein the projections of the first DC connection terminal 601 and the second DC connection terminal 602 on the first plane at least partially overlap; wherein the plane where the at least two sub-power modules 2 are located is configured as the first plane.

[0071] Specifically, the first DC connection terminal 601 and the second DC connection terminal 602 are used to transmit different DC current signals, such as a first current signal and a second current signal. The first current signal can be the positive DC current signal of the battery. The second current signal can be the negative DC current signal of the battery. Alternatively, the first current signal can be the negative DC current signal of the battery, and the second current signal can be the positive DC current signal of the battery; no limitation is made here.

[0072] Since the first DC connection terminal 601 and the second DC connection terminal 602 are used to transmit different current signals, the projection of the first DC connection terminal 601 on the first plane and the projection of the second DC connection terminal 602 on the first plane are configured to at least partially overlap, so that the magnetic field generated by the DC current signal flowing through the first DC connection terminal 601 is opposite in direction to the magnetic field generated by the DC current signal flowing through the second DC connection terminal 602. This effectively cancels out the parasitic inductance generated by the first DC connection terminal 601 and the parasitic inductance generated by the second DC connection terminal 602, effectively reducing the parasitic inductance of the power module and thus reducing the switching loss of the power module.

[0073] Optionally, based on the above embodiments, combined with Figures 1 to 4 The two DC connection terminals 6 include a first DC connection terminal 601 and a second DC connection terminal 602; the projections of the first DC connection terminal 601 and the second DC connection terminal 602 on the second plane at least partially overlap; the second plane and the first plane intersect, and the plane where the at least two sub-power modules 2 are located is configured as the first plane.

[0074] Specifically, the projection of the first DC connection terminal 601 onto the second plane is configured to at least partially overlap with the projection of the second DC connection terminal 602 onto the second plane. Since the first DC connection terminal 601 and the second DC connection terminal 602 are used to transmit different DC current signals, the magnetic field generated by the DC current signal flowing through the first DC connection terminal 601 is opposite in direction to the magnetic field generated by the DC current signal flowing through the second DC connection terminal 602. This effectively cancels out the parasitic inductance generated by the first DC connection terminal 601 and the parasitic inductance generated by the second DC connection terminal 602, further reducing the parasitic inductance of the power module and further reducing the switching losses of the power module.

[0075] Optionally, based on the above embodiments, combined with Figures 1 to 4 At least one of the DC connection terminals 6 includes a body portion 61 and at least one terminal portion 62, the body portion 61 being connected to the at least one terminal portion 62, and the power module further includes a power layer 1, the at least one DC connection terminal 6 being connected to the power layer 1 through the terminal portion 62.

[0076] Specifically, since at least two of the sub-power modules 2 are connected to the body portion 61 of at least the same DC connection terminal 6, the area of ​​the body portion 61 can be made larger. Because the sub-power modules 2 connected to the same body portion 61 are alternately turned on, the DC current signal input to the sub-power module 2 or the DC current signal output by the sub-power module 2 can be shared through the body portion 61, further increasing the transmission path of the electrical signal.

[0077] This configuration further increases the flow area of ​​electrical signals, effectively reducing the parasitic inductance of the sub-power module 2, and thus reducing the parasitic inductance of the power module. Furthermore, this configuration increases the heat dissipation area of ​​the DC connection terminal 6 when the at least two sub-power modules 2 sharing the DC connection terminal 6 are turned on, further improving the heat dissipation capacity of the power module.

[0078] In one optional implementation, the terminal portions 62 can be configured one-to-one with the sub-power modules 2, or each sub-power module 2 can have at least two terminal portions 62. Since the body portion 61 is connected to the terminal portions 62, the DC current signal can be multiplexed through the terminal portions 62, further increasing the transmission path of the electrical signal. This configuration further increases the signal flow area, effectively reducing the parasitic inductance of the sub-power modules 2, and thus reducing the parasitic inductance of the power module. Furthermore, this configuration increases the heat dissipation area of ​​the DC connection terminal 6 when the at least two sub-power modules 2 with multiplexed terminal portions 62 are turned on, further improving the heat dissipation capacity of the power module.

[0079] In another optional implementation, at least two sub-power modules 2 can share terminal portions 62 and body portions 61, so that when the sub-power module 2 with shared terminal portions 62 is turned on, the DC current signal can be transmitted to the positive or negative terminal of the battery through each terminal portion 62 connected to the power layer 1. Since the body portion 61 is connected to the terminal portions 62, the electrical signal can be further multiplexed through the body portion 61, further increasing the transmission path of the electrical signal. This configuration further increases the flow area of ​​the electrical signal, effectively reducing the parasitic inductance of the sub-power module 2, and thus reducing the parasitic inductance of the power module. In addition, with this configuration, when at least two sub-power modules 2 of the multiplexed power layer 1 are turned on, they can reuse the terminal portion 62 and body portion 61 of the DC connection terminal 6, increasing the heat dissipation area of ​​the power layer 1 and the DC connection terminal 6, and further improving the heat dissipation capacity of the power module.

[0080] Another alternative implementation method, continuing to combine Figures 1 to 3 The power module 100 provided in this embodiment of the invention includes at least two power layers 1; at least two sub-power modules 2, the at least two sub-power modules 2 reusing at least one power layer 1; and at least one DC connection terminal 6, the DC connection terminal 6 being connected to at least one power layer 1 of the at least two sub-power modules 2.

[0081] Specifically, power layer 1 is the power routing layer of sub-power module 2. The power routing layer refers to the wire paths designed in sub-power module 2 to carry high currents. The material of power layer 1 can include conductive materials, such as copper, aluminum, and silver. DC connection terminal 6 connects sub-power module 2 to the first terminal (e.g., positive) and the second terminal (e.g., negative) of the battery. The material of DC connection terminal 6 can be the same as that of power layer 1. The shape of DC connection terminal 6 can be a row of DC connection terminals 6.

[0082] Any two or three of the U-phase sub-power modules, V-phase sub-power modules, and W-phase sub-power modules can be configured to multiplex at least one power layer 1. Correspondingly, at least two sub-power modules 2 of the multiplexed power layer 1 multiplex the DC connection terminal 6 when they are turned on.

[0083] With this configuration, since the upper and lower arms of the U-phase, V-phase, and W-phase sub-power modules are alternately turned on, when any two of the U-phase, V-phase, and W-phase sub-power modules reuse at least one power layer 1, the two sub-power modules 2 that reuse at least one power layer 1 can reuse each other's power layer 1 to transmit DC current signals when they are turned on. This configuration makes the power loop path of the full-bridge circuit of the power module wider, effectively reducing the parasitic inductance of the at least two sub-power modules 2 and improving heat dissipation. In addition, the reuse of the power loop by at least two sub-power modules 2 makes the loop path wider, eliminating the need for a width two or three times that of a half-bridge circuit, effectively reducing the size of the power module. At least two sub-power modules 2 of the power layer 1 reuse DC connection terminals 6 when they are turned on, thereby increasing the area of ​​the power layer 1 of the two sub-power modules 2. Since the DC connection terminals 6 of the sub-power modules 2 reuse at least one DC connection terminal 6 of the sub-power modules 2, the flow area of ​​electrical signals is increased, effectively reducing the parasitic inductance of the two sub-power modules 2.

[0084] Furthermore, since the power layer 1 generates heat when transmitting electrical signals, by setting any two of the U-phase sub-power modules, V-phase sub-power modules, and W-phase sub-power modules to reuse at least one layer of power layer 1, and connecting the DC connection terminal 6 to at least one layer of power layer 1 of at least two sub-power modules 2, the DC connection terminal 6 is reused when the at least two sub-power modules 2 of the reused power layer 1 are turned on, thereby increasing the heat dissipation area of ​​power layer 1 and DC connection terminal 6 and optimizing the heat dissipation capacity of the two sub-power modules 2.

[0085] In another optional implementation, three sub-power modules 2, comprising a U-phase sub-power module, a V-phase sub-power module, and a W-phase sub-power module, can be configured to reuse at least one power layer 1. The DC connection terminal 6 is connected to at least two of the power layers 1 of the sub-power modules 2. With this configuration, since the upper and lower bridge arms of the U-phase, V-phase, and W-phase sub-power modules are alternately turned on, when the U-phase, V-phase, and W-phase sub-power modules reuse at least one power layer 1, the DC connection terminal 6 is connected to at least two of the power layers 1 of the sub-power modules 2. When the three sub-power modules 2 reuse at least one power layer 1, they can reuse each other's power layers 1 and DC connection terminals 6 to transmit electrical signals, thereby further increasing the area of ​​the power layers 1 of the three sub-power modules 2, further expanding the signal flow path, increasing the signal flow area, and effectively reducing the parasitic inductance of the three sub-power modules 2.

[0086] Furthermore, since the power layer 1 generates heat when transmitting electrical signals, by setting the U-phase sub-power module, V-phase sub-power module and W-phase sub-power module to reuse at least one layer of power layer 1 and reuse the DC connection terminals 6 of at least two sub-power modules 2, the heat dissipation area of ​​power layer 1 can be further increased, and the heat dissipation of the three sub-power modules 2 can be further optimized.

[0087] It should be noted that any two or three sub-power modules 2 among the U-phase sub-power module, V-phase sub-power module, and W-phase sub-power module may reuse at least one power layer 1. This reuse can be either the power layer 1 connected to the positive terminal of the battery via the DC connection terminal 6, or the power layer 1 connected to the negative terminal of the battery via the DC connection terminal 6. Alternatively, at least one power layer 1 connected to the positive terminal of the battery via the DC connection terminal 6, and at least one power layer 1 connected to the negative terminal of the battery via the DC connection terminal 6, may be reused; no limitations are imposed here.

[0088] In another optional implementation, at least two sub-power modules 2 reuse at least one power layer 1. Furthermore, the DC connection terminal 6 is connected to at least one power layer 1 of the at least two sub-power modules 2.

[0089] The power module provided in this embodiment reuses at least one power layer 1 through at least two sub-power modules 2, thereby increasing the area of ​​the power layer 1. A DC connection terminal 6 is provided to connect to at least one power layer 1 of the at least two sub-power modules 2, and the at least two sub-power modules 2 reuse each other's DC connection terminals 6, increasing the signal flow path of the DC connection terminals 6. Since the upper bridge module H and lower bridge module L of the three sub-power modules 2 of the power module are alternately turned on, when at least two of the three sub-power modules 2 reuse at least one power layer 1, the at least two sub-power modules 2 reusing at least one power layer 1 can reuse each other's power layer 1 and DC connection terminals 6 to transmit electrical signals when they are turned on, increasing the current flow area, improving the signal transmission capability of the power layer 1 and DC connection terminals 6, reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, reducing the switching losses of the power module, and improving the heat dissipation effect of electrical signal transmission. This configuration makes the power loop path of the full bridge wider, effectively reducing the parasitic inductance of the two sub-power modules 2 and improving heat dissipation. In addition, at least two sub-power modules 2 reuse the power loop, making the loop path wider, eliminating the need for a two- or three-times wider half-bridge circuit, and effectively reducing the size of the power module.

[0090] Another alternative implementation method, based on the above embodiments, continues to refer to... Figure 4The DC connection terminal 6 includes a body portion 61 and at least two terminal portions 62. The body portion 61 is connected to the at least two terminal portions 62, and each terminal portion 62 is connected to the power layer 1. At least two sub-power modules 2 reuse the terminal portions 62 and the body portion 61.

[0091] Specifically, terminal portions 62 can be configured one-to-one with sub-power modules 2, or each sub-power module 2 can have at least two terminal portions 62. Since at least two sub-power modules 2 reuse terminal portions 62 and body portions 61, when the sub-power module 2 with reused terminal portions 62 is turned on, electrical signals can be transmitted to the positive or negative terminal of the battery through the terminal portions 62 connected to the power layer 1. Because the body portion 61 is connected to the terminal portions 62, electrical signals can further reuse through the body portion 61, further increasing the transmission path of the electrical signals. This configuration further increases the flow area of ​​the electrical signals, effectively reducing the parasitic inductance of the two sub-power modules 2, and thus reducing the parasitic inductance of the power module. Furthermore, this configuration allows at least two sub-power modules 2 of the reused power layer 1 to reuse the terminal portions 62 and body portions 61 of the DC connection terminal 6 when they are turned on, increasing the heat dissipation area of ​​the power layer 1 and the DC connection terminal 6, further improving the heat dissipation capacity of the power module.

[0092] Another alternative implementation method, Figure 5 This is a schematic diagram of another power module provided in an embodiment of the present invention. Based on the above embodiments, see... Figure 5 Optionally, at least one of the terminal portions 62 is positioned in the orthographic projection of the second plane between the orthographic projection areas of the two sub-power modules 2 of the multiplexed power layer 1 on the second plane. The plane containing at least two sub-power modules 2 is configured as a first plane. The second plane intersects with the first plane. Preferably, the second plane is perpendicular to the first plane.

[0093] In this configuration, at least two sub-power modules 2 are arranged sequentially along a first direction X. Each sub-power module 2 includes an upper bridge module H and a lower bridge module L. The upper bridge module H and the lower bridge module L are arranged along a second direction Y, and the first direction X and the second direction Y intersect. A third direction Z is perpendicular to both the first direction X and the second direction Y. The orthographic projection of the first DC connection terminal 601 onto the first plane at least partially overlaps with the orthographic projection of the second DC connection terminal 602 onto the first plane. The first plane is a plane perpendicular to the third direction Z. For example, the first plane can be a plane with a specific orientation.

[0094] Specifically, compared to existing power modules that include a single sub-power module 2, by setting at least one terminal portion 62 to multiplex the position of two sub-power modules 2 in the projection of the power layer 1 onto the second plane, the terminal portion 62 is directly connected to the power layer 1 located between the projections of the two sub-power modules 2 in the second plane. This configuration increases the number of terminal portions 62 and their cross-sectional area, reduces the parasitic inductance of the terminal portions 62, alleviates the heat generated when high-power current flows through the terminal portions 62, and optimizes the heat dissipation capacity of the DC connection terminal 6. Furthermore, this configuration effectively utilizes the idle area between adjacent sub-power modules 2, improves the utilization rate of the circuit layout, and facilitates the practicality of optimizing the circuit layout design of the power module.

[0095] Optional, Figure 6 This is a schematic diagram of the structure of the first conductive layer and the first DC connection terminal of a power module provided in an embodiment of the present invention. Figure 7 This is a schematic diagram of the structure of the second conductive layer and the second DC connection terminal of a power module according to an embodiment of the present invention. Based on the above embodiments, further combining... Figures 1 to 7 The two DC connection terminals 6 include a first DC connection terminal 601 and a second DC connection terminal 602; the power layer 1 in the power module is configured with at least one first conductor 11 and at least one second conductor 12, wherein the first conductor 11 is connected to the first DC connection terminal 601, the second conductor 12 is connected to the second DC connection terminal 602, and the at least two sub-power modules 2 are connected to the same first conductor 11 and / or second conductor 12.

[0096] Optionally, based on the above embodiments, further combinations can be made... Figures 1 to 7 The first conductor 11 is configured as a positive current layer, and the second conductor 12 is configured as a negative current layer.

[0097] Specifically, the first conductor 11 is configured as a positive current layer. At least two sub-power modules 2 are connected to the same first conductor 11. The at least two sub-power modules 2 multiplex the positive current layer to transmit the positive DC current signal, thereby increasing the area of ​​the first conductor 11 of the power layer 1 of the at least two sub-power modules 2. Since the at least two sub-power modules 2 are connected to at least the same first DC connection terminal 601, the flow area of ​​the positive DC current signal is increased, effectively reducing the parasitic inductance of the at least two sub-power modules 2 and further optimizing the heat dissipation of the power modules.

[0098] The second conductor 12 is configured as a negative current layer. At least two sub-power modules 2 are connected to the same second conductor 12. The at least two sub-power modules 2 multiplex the negative current layer to transmit the negative DC current signal, thereby increasing the area of ​​the second conductor 12 of the power layer 1 of the at least two sub-power modules 2. Since the at least two sub-power modules 2 are connected to at least the same second DC connection terminal 602, the flow area of ​​the negative DC current signal is increased, further reducing the parasitic inductance of the at least two sub-power modules 2 and further optimizing the heat dissipation of the power modules.

[0099] Another alternative implementation, based on the above embodiments, see [link to relevant documentation]. Figure 6 The power layer 1 includes at least one first conductor 11, which is connected to the first input terminals of at least two sub-power modules 2. The first input terminal is connected to the positive terminal of the battery and is used to input a positive DC current signal. The DC connection terminal 6 includes at least one first DC connection terminal 601; the first DC connection terminal 601 is connected to the first conductor 11 of at least two sub-power modules 2.

[0100] Specifically, the first conductor 11 can be the power layer 1 connected to the positive terminal of the battery. The first input terminal can include the input terminal of the upper bridge module H of the sub-power module 2. The upper bridge module H refers to a power switching circuit that is connected to the first conductor 11 of the power layer 1 with a higher potential, and then connected to the positive terminal of the battery.

[0101] Since the three sub-power modules 2 are alternately turned on, and the first conductor 11 is connected to the first input terminal of at least two sub-power modules 2, the at least two sub-power modules 2 that reuse the first conductor 11 can reuse each other's first conductor 11 to transmit electrical signals when they are turned on. By setting the first DC connection terminal 601 to be connected to the first conductor 11 of at least two sub-power modules 2, the area of ​​the first conductor 11 and the first DC connection terminal 601 of the sub-power modules 2 that reuse the first conductor 11 is increased, the flow area of ​​the first DC connection terminal 601 is also increased, and the flow area of ​​the electrical signal of the first conductor 11 is also larger, which effectively reduces the parasitic inductance of the sub-power modules 2, improves the switching efficiency of the power module, and reduces the switching loss of the power module. On the other hand, since the first conductor 11 generates heat when transmitting electrical signals, the heat dissipation area of ​​the first conductor 11 is increased, and the heat generation problem of the first DC connection terminal 601 connected to the first conductor 11 when carrying high power current is significantly improved, optimizing the heat dissipation of the first DC connection terminal 601 and the sub-power modules 2, and thus optimizing the heat dissipation of the power module.

[0102] Optionally, based on the above embodiments, see [link to relevant documentation]. Figure 7The power layer 1 includes at least one second conductor 12, which serves as the second input terminal of at least two sub-power modules 2; the DC connection terminal 6 includes at least one second DC connection terminal 602, which is connected to the second conductor 12 of at least two sub-power modules 2.

[0103] Specifically, the second conductor 12 can be the power layer 1 connected to the negative terminal of the battery. The second input terminal can include the input terminal of the lower bridge arm of the sub-power module 2. The lower bridge arm refers to the power switching circuit connected to the lower potential power layer 1, and thus connected to the negative terminal of the battery.

[0104] The second conductor 12 is connected to the second input terminals of at least two sub-power modules 2, allowing the at least two sub-power modules 2 that reuse the second conductor 12 to transmit electrical signals when they are turned on. By connecting the second DC connection terminal 602 to the second conductor 12 of the at least two sub-power modules 2, the area of ​​the second conductor 12 and the second DC connection terminal 602 of the sub-power modules 2 that reuse the second conductor 12 is increased. The increased area for electrical signal transmission in the second conductor 12 and the increased area for transmission in the second DC connection terminal 602 effectively reduce the parasitic inductance of the sub-power modules 2, further improving the switching efficiency of the power modules and further reducing the switching losses of the power modules. On the other hand, since the second conductor 12 also generates heat when transmitting electrical signals, the increased heat dissipation area of ​​the second conductor 12 significantly improves the heat generation problem of the second DC connection terminal 602 connected to the second conductor 12 when carrying high-power current, further optimizing the heat dissipation of the sub-power modules 2 and thus further optimizing the heat dissipation of the power modules.

[0105] Optionally, based on the above embodiments, see also... Figure 5 The first DC connection terminal 601 and the second DC connection terminal 602 are insulated from each other; at least two sub-power modules 2 are arranged sequentially along the first direction X, each sub-power module 2 includes an upper bridge module H and a lower bridge module L, the upper bridge module H and the lower bridge module L are arranged along the second direction Y, the first direction X and the second direction Y intersect; the third direction Z is perpendicular to both the first direction X and the second direction Y; the orthographic projection of the first DC connection terminal 601 on the first plane and the orthographic projection of the second DC connection terminal 602 on the first plane at least partially overlap, wherein the first plane is a plane perpendicular to the third direction Z.

[0106] Specifically, since the first DC connection terminal 601 and the second DC connection terminal 602 transmit different current signals, they are insulated from each other, which helps improve the reliability of signal transmission in the power module. Preferably, the first direction X and the second direction Y are perpendicular to each other. The first plane can be the plane containing the large surface of the power module.

[0107] It should be noted that, Figure 3 Exemplarily, Q1 represents the power device of the upper bridge module H of the first sub-power module U. The power device of the upper bridge module H of the first sub-power module U can be one or more. When the power device of the upper bridge module H of the second sub-power module V includes multiple power devices, the multiple power devices form an upper bridge arm chipset. In some embodiments, Hu can represent the upper bridge arm chipset included in the upper bridge module H of the first sub-power module U. Q2 represents the power device of the lower bridge module L of the first sub-power module U. The power device of the lower bridge module L of the first sub-power module U can be one or more. When the power device of the lower bridge module L of the first sub-power module U includes multiple power devices, the multiple power devices form a lower bridge arm chipset. In some embodiments, Lu can represent the lower bridge arm chipset included in the lower bridge module L of the first sub-power module U. Q3 represents the power device of the upper bridge module H of the second sub-power module V. The power device of the upper bridge module H of the second sub-power module V can be one or more. When the power device of the upper bridge module H of the second sub-power module V includes multiple power devices, the multiple power devices form an upper bridge arm chipset. In some embodiments, Hv may represent the upper bridge arm chipset included in the upper bridge module H of the second sub-power module V. Q4 represents the power device of the lower bridge module L of the second sub-power module V. The power device of the lower bridge module L of the second sub-power module V may be one or more. When the power device of the lower bridge module L of the second sub-power module V includes multiple power devices, the multiple power devices form a lower bridge arm chipset. In some embodiments, Lv may represent the lower bridge arm chipset included in the lower bridge module L of the second sub-power module V. Q5 represents the power device of the upper bridge module H of the third sub-power module W. The power device of the upper bridge module H of the third sub-power module W may be one or more. When the power device of the upper bridge module H of the third sub-power module W includes multiple power devices, the multiple power devices form an upper bridge arm chipset. In some embodiments, Hw may represent the upper bridge arm chipset included in the upper bridge module H of the third sub-power module W. Q6 represents the power device of the lower bridge module L of the third sub-power module W. The power device of the lower bridge module L of the third sub-power module W may be one or more. When the power devices of the lower bridge module L of the third sub-power module W include multiple power devices, the multiple power devices form a lower bridge arm chipset. In some embodiments, Lw may represent the lower bridge arm chipset included in the lower bridge module L of the third sub-power module W. The first sub-power module U, the second sub-power module V, and the third sub-power module W together form a full-bridge circuit, forming a power module.

[0108] The projections of the first DC connection terminal 601 and the second DC connection terminal 602 on the first plane are at least partially overlapped. Since the first DC connection terminal 601 is connected to the first conductor 11, and the second DC connection terminal 602 is connected to the second conductor 12, and the upper and lower bridge arms of the first sub-power module U, the second sub-power module V, and the third sub-power module W are alternately turned on, the currents flowing through the first DC connection terminal 601 and the second DC connection terminal 602 flow in opposite directions. The at least partial overlap of the projections of the first DC connection terminal 601 and the second DC connection terminal 602 on the first plane ensures that the magnetic field generated by the current flowing through the first DC connection terminal 601 is opposite in direction to the magnetic field generated by the current flowing through the second DC connection terminal 602. This effectively cancels out the parasitic inductance generated by the first DC connection terminal 601 and the second DC connection terminal 602, effectively reducing the parasitic inductance of the sub-power module 2 and thus reducing the switching losses of the power module.

[0109] An alternative implementation method, Figure 8 This is a schematic diagram of another power module provided in an embodiment of the present invention. Based on the above embodiments, see [link to other embodiments]. Figure 8 The orthographic projection of the first DC connection terminal 601 on the second plane and the orthographic projection of the second DC connection terminal 602 on the second plane at least partially overlap, wherein the second plane is a plane perpendicular to the second direction Y.

[0110] Specifically, the plane containing sub-power module 2 is the first plane. That is, the first plane is the plane containing the large surface of the power module. The second plane is the plane intersecting with the first plane. For example, the second plane can be the plane containing the large surface of the power module, which is perpendicular to the first plane. Since the current flowing through the first DC connection terminal 601 and the second DC connection terminal 602 flows in opposite directions, the orthographic projection of the first DC connection terminal 601 on the second plane is set to at least partially overlap with the orthographic projection of the second DC connection terminal 602 on the second plane. This ensures that the magnetic field generated by the current flowing through the first DC connection terminal 601 is opposite in direction to the magnetic field generated by the current flowing through the second DC connection terminal 602. This effectively cancels out the parasitic inductance generated by the first DC connection terminal 601 and the parasitic inductance generated by the second DC connection terminal 602, further reducing the parasitic inductance of sub-power module 2 and further reducing the switching losses of the power module.

[0111] Another alternative implementation method, based on the above embodiments, continues to combine... Figure 6 and Figure 8The first DC connection terminal 601 may include a first terminal portion 621 and a first body portion 611. The first body portion 611 is connected to at least two first terminal portions 621, and each first terminal portion 621 is connected to the first conductor 11 of at least two sub-power modules 2. The first conductor 11 of at least two sub-power modules 2 reuses the first terminal portion 621 and the first body portion 611.

[0112] Specifically, this configuration maximizes the number of first terminal portions 621 connected to the first conductor 11. At least two sub-power modules 2 reuse each first terminal portion 621 and the first body portion 611 in their first conductors 11. This configuration further increases the current-carrying area of ​​the first DC connection terminal 601, further improves the heat dissipation of the power module, and further reduces the power module's inductance.

[0113] Another optional implementation method, based on the above embodiments, continues to combine... Figure 7 and Figure 8 The second DC connection terminal 602 includes a second terminal portion 622 and a second body portion 612. The second body portion 612 is connected to at least two second terminal portions 622, and each second terminal portion 622 is connected to a second conductor 12. The second conductor 12 of at least two sub-power modules 2 reuses the second terminal portion 622 and the second body portion 612.

[0114] Specifically, this configuration maximizes the number of second terminal portions 622 connected to the second conductor 12. At least two sub-power modules 2 reuse each second terminal portion 622 and the second body portion 612 in their second conductors 12. This configuration further increases the current-carrying area of ​​the second DC connection terminal 602, further improves heat dissipation of the power module, and further reduces power module inductance.

[0115] Optionally, based on the above embodiments, see also... Figure 8 The at least one terminal portion 62 is a plurality of terminal portions 62, and the plurality of terminal portions 62 are arranged at intervals.

[0116] Specifically, this configuration facilitates the insulation of the first DC connection terminal 601 and the second DC connection terminal 602, maintaining a safe creepage distance between them. Furthermore, the spaced-apart terminal portions 62 facilitate the distribution of these portions to correspond to at least two sub-power modules 2, increasing the similarity of the current signal transmission path length when each sub-power module 2 is turned on, and improving the uniformity of the DC current signal transmitted by each sub-power module 2.

[0117] Optionally, based on the above embodiments, see also... Figure 8The two DC connection terminals 6 include a first DC connection terminal 601 and a second DC connection terminal 602; along the first direction X, the terminal portion 62 of the first DC connection terminal 601 and the terminal portion 62 of the second DC connection terminal 602 are alternately arranged, wherein the at least two sub-power modules 2 are arranged along the first direction X.

[0118] Specifically, this configuration saves layout space in the power module circuit diagram and avoids creepage risk between the terminal portion 62 of the first DC connection terminal 601 (e.g., the first terminal portion 621) and the terminal portion 62 of the second DC connection terminal 602 (e.g., the second terminal portion 622), thus improving the reliability of the power module.

[0119] An alternative implementation, based on the above embodiments, continues to refer to... Figure 8 Each first terminal portion 621 is spaced apart along the first direction X; each second terminal portion 622 is spaced apart along the first direction X; and / or, along the first direction X, the first terminal portions 621 and the second terminal portions 622 are alternately arranged.

[0120] Specifically, this configuration saves layout space in the power module circuitry and avoids creepage risk between the first terminal 621 and the second terminal 622, thus improving the reliability of the power module.

[0121] Another alternative implementation, based on the above embodiments, continues to refer to... Figure 8 The first terminal portion 621 and the second terminal portion 622 are both rectangular or square in shape when projected onto the first plane; and / or the first terminal portion 621 and the second terminal portion 622 are both rectangular or square in shape when projected onto the second plane; and / or the structure of the second terminal portion 622 is the same as that of the first terminal portion 621, and the number of second terminal portions 622 is greater than the number of first terminal portions 621.

[0122] Specifically, this configuration, where the first terminal 621 and the first conductor 11 are in surface contact, and the second terminal 622 and the second conductor 12 are in surface contact, further increases the co-current area of ​​the first terminal 621 and the second terminal 622, reduces stray inductance, and optimizes heat dissipation. Furthermore, this configuration also improves the connection reliability between the DC connection terminal 6 and the power layer 1, thereby enhancing the reliability of the power module.

[0123] Optionally, based on the above embodiments, see also... Figure 8The body portion 61 includes a bend that connects to the terminal portion 62. The bend extends along a third direction Z, which intersects with a first plane containing the at least two sub-power modules 2. Preferably, the bend and the terminal portion 62 are perpendicular to each other.

[0124] Specifically, the body portion 61 includes a bend that connects to the terminal portion 62, and the bend extends in a third direction Z. Preferably, the bend and the terminal portion 62 are perpendicular to each other. This arrangement saves space and facilitates the miniaturization design of the power module.

[0125] Optionally, based on the above embodiments, see also... Figure 8 The bend and terminal 62 are smoothly connected. This design helps to avoid tip discharge at the connection between the bend and terminal 62, improving the reliability and safety of signal transmission.

[0126] Optionally, based on the above embodiments, see also... Figure 8 The projections of the bends of the two DC connection terminals 6 onto the second plane at least partially overlap. The plane containing the at least two sub-power modules 2 is configured as a first plane, and the second plane intersects with the first plane.

[0127] Specifically, since the two DC connection terminals 6 are connected to the positive and negative terminals of the battery respectively, the projections of the bends of the two DC connection terminals 6 on the second plane at least partially overlap, so that the magnetic field generated by the current flowing through the bend of one DC connection terminal 6 is opposite in direction to the magnetic field generated by the current flowing through the bend of the other DC connection terminal 6. This effectively cancels out the parasitic inductance generated by the bends of the two DC connection terminals 6, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching losses of the power module.

[0128] An alternative implementation, based on the above embodiments, continues to refer to... Figure 8 The first body portion 611 includes a first bend 6111, which extends along a third direction Z and a first direction X, and is connected to at least two first terminal portions 621; the first conductors 11 of at least two sub-power modules 2 reuse the first bend 6111; the second body portion 612 includes a second bend 6121, which extends along a third direction Z and a first direction X, and is connected to at least two second terminal portions 622; the second conductors 12 of at least two sub-power modules 2 reuse the second bend 6121; along a second direction Y, the first bend 6111 and the second bend 6121 are arranged alternately; the orthographic projection of the first bend 6111 on the second plane and the orthographic projection of the second bend 6121 on the second plane at least partially overlap.

[0129] Specifically, since the current flowing through the first DC connection terminal 601 and the second DC connection terminal 602 flows in opposite directions, the first conductor 11 of at least two sub-power modules 2 reuses the first bend 6111, and the second conductor 12 of at least two sub-power modules 2 reuses the second bend 6121. The orthographic projection of the first bend 6111 on the second plane and the orthographic projection of the second bend 6121 on the second plane at least partially overlap, so that the magnetic field generated by the current flowing through the first bend 6111 is opposite in direction to the magnetic field generated by the current flowing through the second bend 6121. This effectively cancels out the parasitic inductance generated by the first bend 6111 and the parasitic inductance generated by the second bend 6121, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching loss of the power module.

[0130] Optionally, based on the above embodiments, see also... Figure 8 Along the first direction X, the size of the first bend 6111 is the same as the size of the second bend 6121; and / or, the size of the first bend 6111 along the first direction X is greater than or equal to the sum of the maximum distances between the two power chips that are furthest apart along the first direction X in at least two sub-power modules 2; and / or, along the third direction Z, the size of the first bend 6111 is smaller than the size of the second bend 6121.

[0131] Specifically, this configuration, on the one hand, increases the current-carrying area of ​​the first DC connection terminal 601 and the second DC connection terminal 602, further improving the heat dissipation of the power module and further reducing the power module's irritation. On the other hand, it ensures that the first bend 6111 and the second bend 6121 maintain sufficient creepage distance, improving the reliability of the power module.

[0132] For example, when each sub-power module 2 includes multiple power devices along the first direction X, the maximum distance between the two power chips that are furthest apart along the first direction X in the sub-power module 2 refers to the distance between the left boundary of the leftmost power chip of each sub-power module and the right boundary of its rightmost power chip along the first direction X.

[0133] Optionally, based on the above embodiments, see also... Figure 8 The body portion 61 includes a horizontal portion that extends along a second direction Y. The horizontal portion is connected to the terminal portion 62 through the bend. The second direction Y intersects with the first direction X. Both the second direction Y and the first direction X are parallel to the plane where the at least two sub-power modules 2 are located.

[0134] Preferably, the bend and the horizontal part are perpendicular to each other.

[0135] Optionally, based on the above embodiments, see also... Figure 8The projections of the horizontal portions of the two DC connection terminals 6 onto the first plane at least partially overlap.

[0136] Specifically, since the two DC connection terminals 6 are connected to the positive and negative terminals of the battery respectively, the projections of the horizontal portions of the two DC connection terminals 6 on the first plane at least partially overlap, such that the magnetic field generated by the current flowing through the horizontal portion of one DC connection terminal 6 is opposite in direction to the magnetic field generated by the current flowing through the horizontal portion of the other DC connection terminal 6. This effectively cancels out the parasitic inductance generated by the horizontal portions of the two DC connection terminals 6, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching losses of the power module.

[0137] Optionally, based on the above embodiments, see also... Figure 8 The bend and the horizontal section are smoothly connected. This design helps to avoid tip discharge at the connection point, improving the reliability and safety of signal transmission.

[0138] An alternative implementation, based on the above embodiments, continues to refer to... Figure 8 The first body portion 611 includes a first horizontal portion 6112, which extends along a first direction X and a second direction Y, and is connected to a first bend 6111; the first conductors 11 of at least two sub-power modules 2 reuse the first horizontal portion 6112; the second body portion 612 includes a second horizontal portion 6122, which extends along a first direction X and a second direction Y, and is connected to a second bend 6121; the second conductors 12 of at least two sub-power modules 2 reuse the second horizontal portion 6122; along a third direction Z, the first horizontal portion 6112 and the second horizontal portion 6122 are arranged alternately; the orthographic projection of the first horizontal portion 6112 on the first plane and the orthographic projection of the second horizontal portion 6122 on the first plane at least partially overlap.

[0139] Specifically, since the current flowing through the first DC connection terminal 601 and the second DC connection terminal 602 flows in opposite directions, the first conductor 11 of at least two sub-power modules 2 reuses the first horizontal portion 6112, and the second conductor 12 of at least two sub-power modules 2 reuses the second horizontal portion 6122. The orthographic projection of the first horizontal portion 6112 on the first plane along the third direction Z at least partially overlaps with the orthographic projection of the second horizontal portion 6122 on the first plane, so that the magnetic field generated by the current flowing through the first horizontal portion 6112 is opposite in direction to the magnetic field generated by the current flowing through the second horizontal portion 6122. This effectively cancels out the parasitic inductance generated by the first horizontal portion 6112 and the parasitic inductance generated by the second horizontal portion 6122, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching loss of the power module.

[0140] Another alternative implementation, based on the above embodiments, continues to refer to... Figure 8 Along the first direction X, the size of the first horizontal portion 6112 is the same as the size of the second horizontal portion 6122; and / or, the size of the first horizontal portion 6112 along the first direction X is greater than or equal to the sum of the maximum distances between the two power chips that are furthest apart along the first direction X in at least two sub-power modules 2; and / or, along the second direction Y, the size of the first horizontal portion 6112 is smaller than the size of the second horizontal portion 6122.

[0141] Specifically, this configuration, on the one hand, further increases the current-carrying area of ​​the first DC connection terminal 601 and the second DC connection terminal 602, further improving the heat dissipation of the power module and further reducing the power module's spurious inductance. On the other hand, it ensures that the first bend 6111 and the second bend 6121 maintain sufficient creepage distance, improving the reliability of the power module.

[0142] Optionally, based on the above embodiments, see also... Figure 8 The main body 61 includes a longitudinal section that extends along a third direction Z and is connected to the curved section through the transverse section; the third direction Z intersects with the first plane where the at least two sub-power modules 2 are located.

[0143] Preferably, the vertical and horizontal sections are perpendicular to each other.

[0144] Optionally, based on the above embodiments, see also... Figure 8 The projections of the vertical portions of the two DC connection terminals 6 onto the second plane at least partially overlap.

[0145] Specifically, since the two DC connection terminals 6 are connected to the positive and negative terminals of the battery respectively, the projections of the vertical portions of the two DC connection terminals 6 on the second plane at least partially overlap, such that the magnetic field generated by the current flowing through the vertical portion of one DC connection terminal 6 is opposite in direction to the magnetic field generated by the current flowing through the vertical portion of the other DC connection terminal 6. This effectively cancels out the parasitic inductance generated by the vertical portions of the two DC connection terminals 6, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching losses of the power module.

[0146] Optionally, based on the above embodiments, see also... Figure 8 The vertical and horizontal sections are smoothly connected. This design helps to avoid tip discharge at the connection point, improving the reliability and security of signal transmission.

[0147] An alternative implementation, based on the above embodiments, continues to refer to... Figure 8The first body portion 611 includes a first vertical portion 6113, which extends along a first direction X and a third direction Z, and is connected to a first horizontal portion 6112; the first conductors 11 of at least two sub-power modules 2 reuse the first vertical portion 6113; the second body portion 612 includes a second vertical portion 6123, which extends along a first direction X and a third direction Z, and is connected to a second horizontal portion 6122; the second conductors 12 of at least two sub-power modules 2 reuse the second vertical portion 6123; along a second direction Y, the second vertical portion 6123 and the first vertical portion 6113 are arranged alternately; the orthographic projection of the first vertical portion 6113 on the second plane and the orthographic projection of the second vertical portion 6123 on the second plane at least partially overlap.

[0148] Specifically, since the current flowing through the first DC connection terminal 601 and the second DC connection terminal 602 flows in opposite directions, the first conductor 11 of at least two sub-power modules 2 reuses the first vertical portion 6113, and the second conductor 12 of at least two sub-power modules 2 reuses the second vertical portion 6123. The orthographic projection of the first vertical portion 6113 on the second plane and the orthographic projection of the second vertical portion 6123 on the second plane at least partially overlap, so that the magnetic field generated by the current flowing through the first vertical portion 6113 is opposite in direction to the magnetic field generated by the current flowing through the second vertical portion 6123. This effectively cancels out the parasitic inductance generated by the first vertical portion 6113 and the parasitic inductance generated by the second vertical portion 6123, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching loss of the power module.

[0149] Another alternative implementation, based on the above embodiments, continues to refer to... Figure 8 Along the first direction X, the size of the first vertical portion 6113 is the same as the size of the second vertical portion 6123; and / or, the size of the first vertical portion 6113 along the first direction X is greater than or equal to the sum of the maximum distances between the two power chips that are furthest apart along the first direction X in at least two sub-power modules 2; and / or, along the third direction Z, the size of the first vertical portion 6113 is less than or equal to the size of the second vertical portion 6123.

[0150] Specifically, this configuration, on the one hand, further increases the current-carrying area of ​​the first DC connection terminal 601 and the second DC connection terminal 602, further improving the heat dissipation of the power module and further reducing the noise inductance of the power module. On the other hand, it maintains a sufficient safe distance between the first bend 6111 and the second bend 6121, improving the reliability of the power module.

[0151] Optionally, based on the above embodiments, see also... Figure 8The first body portion 611 includes a first connecting portion 6114, which extends along a first direction X and a second direction Y. A first end of the first connecting portion 6114 is connected to a first vertical portion 6113, and a second end of the first connecting portion 6114 is connected to a first electrode of a battery and a first electrode of a capacitor. The second body portion 612 includes a second connecting portion 6124, which extends along a first direction X and a second direction Y. A first end of the second connecting portion 6124 is connected to a second vertical portion 6123, and a second end of the second connecting portion 6124 is connected to a second electrode of a battery and a second electrode of a capacitor. The second connecting portion 6124 and the first connecting portion 6114 are arranged alternately along the second direction Y. The orthographic projection of the first connecting portion 6114 on the second plane and the orthographic projection of the second connecting portion 6124 on the second plane at least partially overlap.

[0152] Specifically, since the current flowing through the first DC connection terminal 601 and the second DC connection terminal 602 flows in opposite directions, the orthographic projection of the first connection portion 6114 on the second plane and the orthographic projection of the second connection portion 6124 on the second plane are at least partially overlapped. This makes the magnetic field generated by the current flowing through the first connection portion 6114 opposite in direction to the magnetic field generated by the current flowing through the second connection portion 6124. This effectively cancels out the parasitic inductance generated by the first connection portion 6114 and the parasitic inductance generated by the second connection portion 6124, further reducing the parasitic inductance of the sub-power module 2 and further reducing the switching losses of the power module.

[0153] An optional implementation method, based on the above embodiments, further combines... Figure 4 and Figure 5 The power module may include three sub-power modules 2 extending along the first direction X; the first conductor 11 serves as the first input terminal of the three sub-power modules 2, the three sub-power modules 2 reuse the first conductor 11, and the three sub-power modules 2 reuse the first DC connection terminal 601 of the DC connection terminal 6; and / or, the second conductor 12 serves as the second input terminal of the three sub-power modules 2, the three sub-power modules 2 reuse the second conductor 12, and the three sub-power modules 2 reuse the second DC connection terminal 602 of the DC connection terminal 6.

[0154] Specifically, since the upper bridge module H and lower bridge module L of the first sub-power module U, the second sub-power module V, and the third sub-power module W are alternately turned on, the three sub-power modules 2, which reuse at least one layer of first conductor 11, reuse the second conductor 12, and reuse the first DC connection terminal 601 and the second DC connection terminal 602, can reuse each other's first conductor 11 to transmit DC current signals, reuse the DC current signals transmitted by the second conductor 12, reuse the positive DC current signal of the first conductor 11, and reuse the negative DC current signal of the second conductor 12 when they are turned on. This configuration further increases the current signal flow area of ​​the three sub-power modules 2, effectively reduces the parasitic inductance of the power modules, and further optimizes the heat dissipation of the power modules.

[0155] Optional, Figure 9 This is a cross-sectional structural diagram of a power module provided in an embodiment of the present invention. Based on the above embodiments, see... Figure 9 The power module includes a printed circuit board, and the at least two sub-power modules 2 are embedded in the printed circuit board; the printed circuit board includes a plurality of stacked conductor layers, wherein the conductor layers include the power layer 1 of the power module.

[0156] Optionally, based on the above embodiments, see also... Figure 9 The multiple stacked conductor layers are configured as 6 or 7 layers. It should be noted that... Figure 9 An exemplary case is shown where the printed circuit board of the power module includes 6 conductor layers, which will not be described in detail here.

[0157] An alternative implementation, based on the above embodiments, continues to refer to... Figure 9 The power module may include: a second conductor layer M2; a third conductor layer M3 disposed on one side of the second conductor layer M2; a fourth conductor layer M4 disposed on the side of the third conductor layer M3 away from the second conductor layer M2; a fifth conductor layer M5 disposed on the side of the fourth conductor layer M4 away from the second conductor layer M2; a first conductor 11 located on the fifth conductor layer M5; and a second conductor 12 located on the second conductor layer M2; a first DC connection terminal 601 of the DC connection terminal 6 is located on the side of the second conductor layer M2 away from the third conductor layer M3, and the first DC connection terminal 601 is connected to the first conductor 11 through a via; and a second DC connection terminal 602 of the DC connection terminal 6 is located on the side of the first conductor layer M1 away from the second conductor layer M2, and the second DC connection terminal 602 is connected to the second conductor 12 through a via.

[0158] In another alternative implementation, the power module may further include: a first conductor layer M1, which is located on the side of the second conductor layer M2 away from the third conductor layer M3.

[0159] Another alternative implementation method, Figure 10 This is a schematic diagram of the structure of the third conductor layer of a power module provided in an embodiment of the present invention. Figure 11 This is a schematic diagram of the structure of the fourth conductor layer of a power module according to an embodiment of the present invention. Based on the above embodiments, further combining... Figures 6 to 11 The power module includes: a first conductor layer M1; a second conductor layer M2 disposed on one side of the first conductor layer M1; a third conductor layer M3 disposed on the side of the second conductor layer M2 away from the first conductor layer M1; a fourth conductor layer M4 disposed on the side of the third conductor layer M3 away from the first conductor layer M1; and a fifth conductor layer M5 disposed on the side of the fourth conductor layer M4 away from the first conductor layer M1. The first conductor 11 is located on the fifth conductor layer M5, and the second conductor 12 is located on the second conductor layer M2. A first DC connection terminal 601 of the DC connection terminal 6 is located on the side of the first conductor layer M1 away from the second conductor layer M2, and is connected to the first conductor 11 through a via. A second DC connection terminal 602 of the DC connection terminal 6 is located on the side of the first conductor layer M1 away from the second conductor layer M2, and is connected to the second conductor 12 through a via.

[0160] Specifically, the sub-power module 2 includes an upper bridge module H and a lower bridge module L. The upper bridge module H includes at least one power device S. The lower bridge module L includes at least one power device S. The power device S can be disposed between two conductor layers. For example, the power device S can be disposed between the third conductor layer M3 and the fourth conductor layer M4, and on the conductor layer where the third conductor layer M3 and the fourth conductor layer M4 are located. The first conductor 11 and the second conductor 12 connected to the power device S are disposed on different layers, such that the direction of the current flowing through the first conductor 11 is opposite to the direction of the current flowing through the second conductor 12, and the orthogonal projections of the first conductor 11 and the second conductor 12 on the same conductor layer at least partially overlap, such that the magnetic field generated by the current flowing through the first conductor 11 is opposite to the direction of the magnetic field generated by the current flowing through the second conductor 12. This effectively cancels out the parasitic inductance generated by the first conductor 11 and the parasitic inductance generated by the second conductor 12, thereby reducing the parasitic inductance of the sub-power module 2, improving the switching efficiency of the power module 100, and thus reducing the switching loss of the power module 100.

[0161] Optional, Figure 12 This is a schematic diagram of the structure of the first conductive layer of a power module provided in an embodiment of the present invention. Based on the above embodiment, further combining... Figure 2 and Figure 12The power module further includes: at least one absorption capacitor C0, which is connected in parallel with the sub-power module 2; at least two sub-power modules 2 are connected to the same absorption capacitor C0.

[0162] Specifically, since the sub-power modules 2 of the power module are alternately turned on, by setting at least two of the sub-power modules 2 to be connected to the same absorption capacitor C0, at least two power units 2 can share the same absorption capacitor C0. It is not necessary to set an absorption capacitor C0 for each sub-power module 2. This can save the cost of setting the absorption capacitor C0, and when at least two sub-power modules 2 reuse the absorption capacitor C0, it can effectively absorb the oscillation of the power module. Furthermore, by connecting the absorption capacitor C0 in parallel with the second capacitor C1, the parasitic inductance of the power module can be further reduced, thereby improving the switching efficiency of the power module.

[0163] An optional implementation method, based on the above embodiments, further incorporates... Figure 2 and Figure 12 The power module further includes at least one absorption capacitor C0, which is located in the first conductor layer M1 and is connected in parallel with the sub-power module 2.

[0164] Specifically, the absorption capacitor C0 can be connected to the power device S of the sub-power module 2 through the laser aperture. The power module may also include a second capacitor C1. The second capacitor C1 is connected to the sub-power module 2 through the DC connection terminal 6. The second capacitor C1 serves as an energy storage device to maintain the stability of the power supply when the battery is powered on.

[0165] By including an absorption capacitor C0 in the power module and connecting it in parallel with the second capacitor C1, the parasitic inductance of the power module is further reduced. Furthermore, the absorption capacitor C0 effectively absorbs oscillations in the power module, improving its reliability.

[0166] Because the power module exhibits oscillation issues, adding an absorption capacitor C0 between the first conductor 11 or the second conductor 12, or between the first conductor 11 and the second conductor 12, can effectively reduce the oscillation and lower the parasitic inductance of the power module. However, the absorption capacitor C0 between the first conductor 11 or the second conductor 12, or between the first power layer 1 and the second conductor 12, requires a high withstand voltage, resulting in higher device costs. Integrating the three sub-power modules 2 into a single full-bridge circuit allows for the reuse of the absorption capacitor C0. Since the three sub-power modules 2 will not be switched on simultaneously, integrating them into a single power module eliminates the need for an absorption circuit with three times the number of absorption capacitors C0, effectively saving space and material costs.

[0167] Optionally, based on the above embodiments, further combinations can be made... Figure 2 and Figure 12 The projection of the absorption capacitor C0 on the first plane is located between the projections of two adjacent sub-power modules 2 on the first plane; the plane containing at least two sub-power modules 2 is configured as the first plane.

[0168] Specifically, this setup can effectively save circuit board layout space for power modules, which is conducive to the miniaturization of power modules, thereby reducing costs and increasing efficiency, and improving the space utilization of power modules.

[0169] An optional implementation method, based on the above embodiments, further incorporates... Figure 2 and Figure 12 At least two of the sub-power modules 2 reuse at least one of the absorption capacitors C0.

[0170] Specifically, since each sub-power module 2 is turned on alternately, by setting at least two of the sub-power modules 2 to reuse the absorption capacitor C0, at least two sub-power modules 2 can reuse the same absorption capacitor C0, eliminating the need to set an absorption capacitor C0 for each sub-power module 2. This saves the cost of setting the absorption capacitor C0, and when at least two sub-power modules 2 reuse the absorption capacitor C0, it can effectively absorb the oscillation of the power module. Furthermore, by connecting the absorption capacitor C0 in parallel with the second capacitor, the parasitic inductance of the power module is further reduced, thereby improving the switching efficiency of the power module.

[0171] Another alternative implementation method, based on the above embodiments, continues to combine... Figure 2 and Figure 12 At least one of the absorption capacitors C0 is projected onto the first plane, and its orthogonal projection is located between the orthogonal projection regions of the two sub-power modules 2 of the power layer 1 that are reused on the first plane.

[0172] Specifically, this setup can effectively save circuit board layout space for power modules, which is conducive to the miniaturization of power modules, thereby reducing costs and increasing efficiency, and improving the space utilization of power modules.

[0173] Another optional implementation method, based on the above embodiments, continues to combine... Figures 9 to 11 The power devices of the sub-power module 2 are located in the region between the third conductor layer M3 and the fourth conductor layer M4, and between the third conductor layer M3 and the fourth conductor layer M4.

[0174] Specifically, this configuration allows the power devices of sub-power module 2 to be embedded inside the circuit board of the power module, effectively reducing the trace distance between the power devices and the various layers of the circuit board, increasing the area of ​​the connection between the power devices and the various layers of the circuit board, and improving the integration of the power module's circuit board.

[0175] Optionally, based on the above embodiments, further combinations can be made... Figure 3 , Figures 6 to 7 and Figure 9 Each sub-power module 2 includes an upper bridge arm chip group and a lower bridge arm chip group distributed along the second direction Y; in the second direction Y, the lower bridge arm chip group is disposed between the DC connection terminal 6 and the upper bridge arm chip group.

[0176] Specifically, the upper bridge arm chipset corresponds to Figure 6 , Figure 7 and Figure 9 The upper bridge module H is located in the middle. The lower bridge arm chipset corresponds to... Figure 6 , Figure 7 and Figure 9 The lower bridge module L. See also Figure 6 and Figure 9 The lower bridge arm chipset is positioned between the DC connection terminal 6 and the upper bridge arm chipset, which can increase the flow area of ​​the first conductor 11 and reduce the noise inductance of the positive DC current signal transmitted by the first conductor 11. (See also...) Figure 3 and Figure 6 At least a portion of the fifth conductor layer M5 forms the first conductor 11. See also Figure 3 and Figure 7 At least a portion of the second conductor layer M2 forms the second conductor 12.

[0177] For example, see [link to previous article] Figure 3 , Figures 6 to 9 The positive DC current signal T+ flows through the terminal portion 62 of the first DC connection terminal 601 to the first conductor 11, and then to the upper bridge module H of a sub-power module 2, such as the upper bridge arm chipset Hu of the U-phase sub-power module. The upper bridge module H outputs an AC current signal, which flows to the lower bridge module L of another sub-power module 2, such as the lower bridge arm chipset Lw of the W-phase sub-power module. See also... Figure 3 , Figure 7 and Figure 9 The lower bridge module L outputs a negative DC current signal T-. The negative DC current signal T- flows back from the lower bridge module L, such as the lower bridge arm chipset Lw of the W phase sub-power module, to the second DC connection terminal 602.

[0178] Another alternative implementation method, based on the above embodiments, continues to combine... Figures 9 to 11Each of the sub-power modules 2 may include: an upper bridge module H and a lower bridge module L. The first end of the upper bridge module H is connected to the first conductor 11 as the first input end of the sub-power module 2. The second end of the upper bridge module H is connected to the first end of the lower bridge module L at a first node, serving as the output end of the sub-power module 2. The second end of the lower bridge module L is connected to the second conductor 12 as the second input end of the sub-power module 2. The upper bridge module H is disposed in a first intermediate region between the third conductor layer M3 and the fourth conductor layer M4. The lower bridge module L is disposed in a second intermediate region between the third conductor layer M3 and the fourth conductor layer M4.

[0179] Specifically, the second intermediate region and the first intermediate region refer to the middle positions of the circuit board of the sub-power module 2, not the edge positions. The second intermediate region and the first intermediate region extend sequentially along the second direction Y. The first direction X intersects the second direction Y, and preferably, the first direction X and the second direction Y are perpendicular to each other.

[0180] It should be noted that, in combination Figure 2 and Figure 9 An exemplary illustration shows an upper bridge module H and a lower bridge module L. The upper bridge module H corresponds to the upper bridge arm chipset. The lower bridge module L corresponds to the lower bridge arm chipset. The first terminal of the power device in the upper bridge module H, such as the drain (D), is connected to the first conductor 11 as the first input terminal of the sub-power module 2. The second terminal of the power device in the upper bridge module H, such as the source, is connected to the first terminal of the power device in the lower bridge module L, such as the drain, at a first node, serving as the output terminal of the sub-power module 2, and connected to the phase trace, i.e., the AC current signal transmission line. The second terminal of the power device in the lower bridge module L, such as the source, is connected to the second conductor 12 as the second input terminal of the sub-power module 2. The upper bridge module H, such as the upper bridge arm, is disposed in the first intermediate region between the third conductor layer M3 and the fourth conductor layer M4, for example, located in... Figure 11 The lower half of the neutron power module 2. The lower bridge module L, such as the lower bridge arm, is disposed in the second intermediate region between the third conductor layer M3 and the fourth conductor layer M4, for example, located in... Figure 11 The upper half of neutron power module 2.

[0181] Another optional implementation method, based on the above embodiments, continues to combine... Figures 6 to 11The orthographic projection of the upper bridge module H onto the second conductor layer M2 does not overlap with the orthographic projection of the second conductor 12 onto the second conductor layer M2; the orthographic projection of the lower bridge module L onto the second conductor layer M2 falls within the region of the orthographic projection of the second conductor 12 onto the second conductor layer M2; the orthographic projection of the upper bridge module H onto the fifth conductor layer M5 falls within the region of the orthographic projection of the first conductor 11 onto the fifth conductor layer M5; the orthographic projection of the lower bridge module L onto the fifth conductor layer M5 does not overlap with the orthographic projection of the first conductor 11 onto the fifth conductor layer M5.

[0182] For details, see Figure 7 The upper bridge module H is configured such that its orthographic projection on the second conductor layer M2 does not overlap with the orthographic projection of the second conductor 12 on the second conductor layer M2. Furthermore, the orthographic projection of the lower bridge module L on the second conductor layer M2 falls within the area of ​​the orthographic projection of the second conductor 12 on the second conductor layer M2. This configuration allows for a sufficiently large area of ​​the second conductor layer M2 while also providing ample wiring space for the phase traces connected to the upper bridge module H.

[0183] It should be noted that, Figure 7 An exemplary illustration shows the second conductor layer M2 in which the three sub-power modules 2, composed of the U-phase sub-power module, the V-phase sub-power module, and the W-phase sub-power module, reuse the second conductor 12. No limitation is made here.

[0184] See also Figure 6 The orthographic projection of the upper bridge module H on the fifth conductor layer M5 is set to fall within the area of ​​the orthographic projection of the first conductor 11 on the fifth conductor layer M5, and the orthographic projection of the lower bridge module L on the fifth conductor layer M5 does not overlap with the orthographic projection of the first conductor 11 on the fifth conductor layer M5. This setting allows for a sufficiently large area of ​​the first conductor layer M1 while also reserving enough wiring space for the phase traces connected to the lower bridge module L.

[0185] It should be noted that, Figure 6 An exemplary illustration shows the case where the first conductor layer M1 reuses the first conductor 11 in the three sub-power modules 2, which are jointly composed of the U-phase sub-power module, the V-phase sub-power module, and the W-phase sub-power module, in the fifth conductor layer M5. No limitation is made here.

[0186] Another optional implementation method, based on the above embodiments, combines... Figures 9 to 11Each sub-power module 2's upper bridge module H includes at least one first power device S1, and each sub-power module 2's lower bridge module L includes at least one second power device S2; when each sub-power module 2's upper bridge module H includes at least two first power devices S1, the first power devices S1 of each sub-power module 2 are connected in parallel; when each sub-power module 2's lower bridge module L includes at least two second power devices S2, the second power devices S2 of each sub-power module 2 are connected in parallel.

[0187] Specifically, the number of first power devices S1 included in the upper bridge module H of each sub-power module 2 is not limited. Figure 6 and Figure 7 An exemplary embodiment is shown where the upper bridge module H includes six first power devices S1, which can be connected in parallel to form the upper bridge module H.

[0188] The number of second power devices S2 included in the lower bridge module L of each sub-power module 2 is not limited. Figure 6 and Figure 7 An exemplary case is shown where the lower bridge module L includes six second power devices S2, which can be connected in parallel to form the lower bridge module L.

[0189] Another alternative implementation method, based on the above embodiments, continues to refer to... Figure 2 , Figure 4 and Figure 5 Each of the sub-power modules 2 further includes a phase trace 3, which is respectively disposed on the second conductor layer M2 and the fifth conductor layer M5; the power module further includes a phase copper block, which is connected to the first node by the phase trace 3 and the phase copper block, and is disposed on the third conductor layer M3 and the fourth conductor layer M4.

[0190] Specifically, phase trace 3 is connected between sub-power module 2 and load. Since each sub-power module 2 includes phase trace 3 located on the second conductor layer M2 and phase trace 3 located on the fifth conductor layer M5, by setting phase copper blocks, it is convenient to connect the phase trace 3 located on the second conductor layer M2 and the phase trace 3 located on the fifth conductor layer M5 to the first node, so as to connect the phase trace 3 and form a power network of phase trace 3.

[0191] Another alternative implementation method, based on the above embodiments, continues to refer to... Figure 6 , Figure 7 and Figure 9The phase trace 3 includes a first phase trace 31 and a second phase trace 32. The first phase trace 31 is located in the fifth conductor layer M5, and the second phase trace 32 is located in the second conductor layer M2. The first phase trace 31 is connected between the upper bridge module H and the phase copper block, and the second phase trace 32 is connected between the phase copper block and the lower bridge module L. The orthographic projection of the first phase trace 31 in the fifth conductor layer M5 does not overlap with the orthographic projection of the first conductor 11 in the fifth conductor layer M5. The orthographic projection of the second phase trace 32 in the second conductor layer M2 does not overlap with the orthographic projection of the second conductor 12 in the second conductor layer M2.

[0192] For details, see Figure 6 The first-phase traces 31 of the U-phase sub-power module, V-phase sub-power module, and W-phase sub-power module located on the fifth conductor layer M5 are independently configured to facilitate the output of the lower arm current signals of each of the U-phase sub-power module, V-phase sub-power module, and W-phase sub-power module through their respective first-phase traces 31. (See also...) Figure 7 The second-phase traces 32 of the U-phase sub-power module, V-phase sub-power module and W-phase sub-power module located in the second conductor layer M2 are set independently to facilitate the output of the current signals of each upper bridge arm of the U-phase sub-power module, V-phase sub-power module and W-phase sub-power module through the corresponding second-phase traces 32.

[0193] Another alternative implementation method, based on the above embodiments, continues to refer to... Figures 1 to 11 The power layer 1 may include two layers of the first conductor 11; at least one of the two layers of the first conductor 11 is connected to the first input terminal of at least two of the sub-power modules 2, and the at least two sub-power modules 2 reuse the first conductor 11 connected to the first input terminal of the sub-power module 2.

[0194] Specifically, this configuration increases the overlap area between the first conductor 11 and the second conductor 12. On one hand, it further increases the area of ​​the first conductor 11, reduces the parasitic inductance of the sub-power module 2, further improves the switching efficiency of the power module 100, and further optimizes the heat dissipation of the first conductor 11. On the other hand, the direction of the current flowing through the first conductor 11 is opposite to the direction of the current flowing through the second conductor 12. The overlap area of ​​the projections of the first conductor 11 and the second conductor 12 in the horizontal direction is significantly increased, so that the magnetic field generated by the current flowing through the first conductor 11 is opposite to the direction of the magnetic field generated by the current flowing through the second conductor 12. This effectively cancels out the parasitic inductance generated by the first conductor 11 and the parasitic inductance generated by the second conductor 12, further reducing the parasitic inductance of the sub-power module 2, and thus reducing the switching losses of the power module 100.

[0195] In another optional implementation, the power module may further include a seventh conductor layer located between the first conductor layer M1 and the second conductor layer M2; the two layers of first conductors 11 include a first first conductor 11 and a second first conductor 11; the first first conductor 11 is located in the seventh conductor layer; the second first conductor 11 is located in the fifth conductor layer M5. A second DC connection terminal 602 is connected to the second conductor 12 via a via. A first DC connection terminal 601 of the DC connection terminal 6 is connected to both the first and second first conductors 11 via a via.

[0196] Specifically, this increases the overlap area between the first conductor 11 located in the seventh conductor layer M7 and the second conductor 12 located in the second conductor layer M2. On one hand, by increasing the number of first conductors 11 to include the first conductor 11 located in the entire seventh conductor layer M7 and the second conductor 11 located in the fifth conductor layer M5, the area of ​​the first conductor 11 is further increased, the parasitic inductance of the sub-power module 2 is reduced, the switching efficiency of the power module is further improved, and the heat dissipation of the first conductor 11 is further optimized.

[0197] On the other hand, the direction of the current flowing through the first conductor 11 is opposite to the direction of the current flowing through the second conductor 12. The overlapping area of ​​the projections of the first conductor 11 located in the seventh conductor layer M7 and the second conductor 12 located in the second conductor layer M2 in the horizontal direction is significantly increased. This makes the magnetic field generated by the current flowing through the first conductor 11 opposite to the magnetic field generated by the current flowing through the second conductor 12. As a result, the parasitic inductance generated by the first conductor 11 and the parasitic inductance generated by the second conductor 12 are effectively canceled out, effectively reducing the parasitic inductance of the sub-power module 2, and thus reducing the switching loss of the power module.

[0198] Another alternative implementation method, Figure 13 This is a schematic diagram of the sixth conductor layer of a power module according to an embodiment of the present invention. Based on the above embodiment, further combining... Figure 2 and Figure 12 The power module further includes a sixth conductor layer M6, which is disposed on the side of the fifth conductor layer M5 away from the first conductor layer M1, and is used to connect the heat dissipation module.

[0199] Specifically, the sixth conductor layer M6 is a single layer of copper. The sixth conductor layer M6 is connected to the heat sink by welding or sintering.

[0200] In another optional implementation, based on the above embodiments, the power module further includes an interlayer insulation layer, which is disposed between the conductor layers on adjacent sides and serves as an insulation layer.

[0201] Specifically, the interlayer insulation layer between the first conductor layer M1 and the fifth conductor layer M5 is made of resin. The interlayer insulation layer between the fifth conductor layer M5 and the sixth conductor layer M6 can be made of insulating material.

[0202] It should be noted that, Figures 1 to 13 This is just an example and is not intended to be limiting.

[0203] It should be noted that the polarity of the first conductor 11 in the above embodiments of the present invention can be T+ and the polarity of the second conductor 12 can be T-; in some cases, the polarity of the first conductor 11 can also be T- and the polarity of the second conductor 12 can be T+, without any limitation.

[0204] It should be noted that the upper bridge module H can be the lower bridge arm, and the lower bridge module L can be the upper bridge arm; in some cases, the upper bridge module H can also be the upper bridge arm, and the lower bridge module L can be the lower bridge arm, without any restrictions here.

[0205] It should be noted that a portion of the second conductor 12 may be disposed in a portion of the second conductor layer M2, the third conductor layer M3, or the fourth conductor layer M4, and a portion of the first conductor 11 may be disposed in the fifth conductor layer M5, without any limitation.

[0206] An alternative implementation method, Figure 14 This is a schematic diagram of the structure of the fifth conductive layer and the first DC connection terminal of another power module provided in an embodiment of the present invention. Figure 15 This is a schematic diagram of the structure of the second conductive layer and the second DC connection terminal of another power module provided in an embodiment of the present invention. Figure 16 This is a cross-sectional structural diagram of another power module provided in an embodiment of the present invention. Based on the above embodiments, further combining... Figure 3 , Figures 14 to 16 Each sub-power module 2 includes an upper bridge arm chip group and a lower bridge arm chip group distributed along the second direction Y; in the second direction Y, the upper bridge arm chip group is disposed between the DC connection terminal 6 and the lower bridge arm chip group.

[0207] Specifically, the upper bridge arm chipset corresponds to Figures 14 to 16 The upper bridge module H is located in the middle. The lower bridge arm chipset corresponds to... Figures 14 to 16 The lower bridge module L in the middle. See also Figure 15 and Figure 16 The upper bridge arm chip group is disposed between the DC connection terminal 6 and the lower bridge arm chip group. The lower bridge arm chip group is further away from the DC connection terminal 6, which can increase the flow area of ​​the second conductor 12 and reduce the noise inductance of the negative DC current signal transmitted by the second conductor 12.

[0208] For example, see Figure 14 At least a portion of the fifth conductor layer M5 forms the first conductor 11. See also Figure 15 At least a portion of the second conductor layer M2 forms the second conductor 12. (Continue to see...) Figure 3 , Figures 14 to 16 The positive DC current signal T+ flows through terminal 62 of the first DC connection terminal 601 to the first conductor 11, and then to the upper bridge module H of a sub-power module 2, such as the upper bridge arm chipset Hu of the U-phase sub-power module. The upper bridge module H outputs an AC current signal that flows to the lower bridge module L of another sub-power module 2, such as the lower bridge arm chipset Lw of the W-phase sub-power module. See also... Figure 15 and Figure 16 The lower bridge module L outputs a negative DC current signal T-. The negative DC current signal T- flows back from the lower bridge module L, such as the lower bridge arm chipset Lw of the W phase sub-power module, to the second DC connection terminal 602.

[0209] This embodiment provides a motor controller, including the power module proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0210] This embodiment provides an electric drive assembly, including the power module proposed in any of the above embodiments, and / or including the motor controller proposed in any of the above embodiments, which has the beneficial effects of the power module proposed in any of the above embodiments, and will not be repeated here.

[0211] This embodiment provides a vehicle that includes the power module proposed in any of the above embodiments, and / or includes the motor controller proposed in any of the above embodiments, and / or includes the electric drive assembly proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0212] The following are the previously applied proposals:

[0213] This invention provides a power module, comprising:

[0214] At least two power units;

[0215] At least one connection structure is provided, and the connection structure is connected to at least two power units.

[0216] Optionally, the connection structure includes a body portion connected to at least one electrode layer of at least two of the power units.

[0217] Optionally, the connection structure includes at least two terminal portions, which are connected to at least one electrode layer of at least two power units; the body portion is connected to the terminal portions.

[0218] Optionally, the connection structure includes:

[0219] A first connection structure is used to transmit a first electrode signal;

[0220] The second connection structure is used to transmit the second electrode signal;

[0221] The orthographic projection of the first connecting structure in the horizontal plane at least partially overlaps with the orthographic projection of the second connecting structure in the horizontal plane; and / or, the orthographic projection of the first connecting structure in the vertical plane at least partially overlaps with the orthographic projection of the second connecting structure in the vertical plane.

[0222] Optionally, the power module further includes:

[0223] At least two electrode layers;

[0224] At least two power units, and at least two power units share at least one electrode layer;

[0225] The connection structure is connected to at least one electrode layer of at least two of the power units.

[0226] Optionally, the connection structure includes a body portion and at least two terminal portions, the body portion being connected to the at least two terminal portions, and each terminal portion being connected to the electrode layer;

[0227] At least two power units share the terminal section and the body section.

[0228] Optionally, the electrode layer includes at least one first electrode layer, which serves as the first input terminal of at least two power units;

[0229] The connection structure includes at least one first connection structure; the first connection structure is connected to the first electrode layer of at least two power units.

[0230] Optionally, the electrode layer includes at least one second electrode layer, which serves as the second input terminal of at least two power units;

[0231] The connection structure includes at least one second connection structure, which is connected to the second electrode layer of at least two power units.

[0232] Optionally, the first connection structure and the second connection structure are insulated from each other;

[0233] At least two power units are arranged sequentially along a first direction. Each power unit includes a first bridge arm and a second bridge arm. The first bridge arm and the second bridge arm are arranged along a second direction, and the first direction and the second direction intersect. A third direction is perpendicular to both the first direction and the second direction.

[0234] The orthographic projection of the first connecting structure onto the first plane at least partially overlaps with the orthographic projection of the second connecting structure onto the first plane, wherein the first plane is a plane perpendicular to a third direction.

[0235] Optionally, the orthographic projection of at least one of the terminal portions onto the first plane is located between the orthographic projection regions of the two power units sharing the electrode layer onto the first plane.

[0236] Optionally, the orthographic projection of the first connecting structure onto the second plane at least partially overlaps with the orthographic projection of the second connecting structure onto the second plane, wherein the second plane is a plane perpendicular to the second direction.

[0237] Optionally, the first connection structure includes a first terminal portion and a first body portion, the first body portion being connected to at least two first terminal portions, and each first terminal portion being connected to the first electrode layer of at least two power units;

[0238] The first electrode layers of at least two power units share a first terminal portion and a first body portion.

[0239] Optionally, the second connection structure includes a second terminal portion and a second body portion, the second body portion being connected to at least two second terminal portions, and each second terminal portion being connected to the second electrode layer;

[0240] The second electrode layers of at least two power units share a second terminal portion and a second body portion.

[0241] Optionally, each of the first terminal portions is spaced apart along a first direction;

[0242] Each second terminal portion is spaced apart along the first direction;

[0243] Along the first direction, the first terminal portion and the second terminal portion are alternately arranged.

[0244] Optionally, the shapes of the first terminal portion and the second terminal portion in the orthographic projection of the first plane both include a rectangle or a square;

[0245] And / or, the shapes of the first terminal portion and the second terminal portion in the orthographic projection of the second plane both include rectangles or squares;

[0246] And / or, the structure of the second terminal portion is the same as the structure of the first terminal portion; and / or, the number of second terminal portions is greater than the number of first terminal portions.

[0247] Optionally, the first body portion includes a first bend, which extends along a third direction and a first direction, and is connected to at least two first terminal portions; the first electrode layers of at least two power units share the first bend.

[0248] The second body portion includes a second bend that extends along a third direction and a first direction, and the second bend is connected to at least two second terminal portions; the second electrode layers of at least two power units share the second bend.

[0249] Along the second direction, the first bend and the second bend are arranged alternately.

[0250] The orthographic projection of the first curve on the second plane and the orthographic projection of the second curve on the second plane at least partially overlap.

[0251] Optionally, along the first direction, the dimensions of the first bend and the second bend are the same;

[0252] And / or, the dimension of the first bend along the first direction is greater than or equal to the sum of the dimensions of at least two power units along the first direction;

[0253] And / or, along a third direction, the size of the first bend is smaller than the size of the second bend.

[0254] Optionally, the first body portion includes a first horizontal portion, which extends along a first direction and a second direction, and is connected to a first bend; the first electrode layers of at least two power units share the first horizontal portion;

[0255] The second body portion includes a second horizontal portion, which extends along a first direction and a second direction, and is connected to a second bend; the second electrode layers of at least two power units share the second horizontal portion.

[0256] Along a third direction, the first horizontal section and the second horizontal section are arranged alternately.

[0257] The orthographic projection of the first horizontal part onto the first plane and the orthographic projection of the second horizontal part onto the first plane at least partially overlap.

[0258] Optionally, along the first direction, the dimensions of the first horizontal section and the second horizontal section are the same;

[0259] And / or, the dimension of the first horizontal portion along the first direction is greater than or equal to the sum of the dimensions of at least two power units along the first direction;

[0260] And / or, along the second direction, the size of the first horizontal section is smaller than the size of the second horizontal section.

[0261] Optionally, the first body portion includes a first vertical portion, which extends along a first direction and a third direction, and is connected to a first horizontal portion; the first electrode layers of at least two power units share the first vertical portion;

[0262] The second body portion includes a second vertical portion, which extends along a first direction and a third direction, and is connected to a second horizontal portion; the second electrode layers of at least two power units share the second vertical portion.

[0263] Along the second direction, the second longitudinal section and the first longitudinal section are arranged alternately.

[0264] The orthographic projection of the first vertical part onto the second plane and the orthographic projection of the second vertical part onto the second plane at least partially overlap.

[0265] Optionally, along the first direction, the dimensions of the first longitudinal portion and the second longitudinal portion are the same;

[0266] And / or, the dimension of the first vertical portion along the first direction is greater than or equal to the sum of the dimensions of at least two power units along the first direction;

[0267] And / or, along a third direction, the size of the first longitudinal section is less than or equal to the size of the second longitudinal section.

[0268] Optionally, the first body portion includes a first connecting portion, which extends along a first direction and a second direction. A first end of the first connecting portion is connected to a first longitudinal portion, and a second end of the first connecting portion is connected to a first electrode of the battery and a first electrode of the capacitor.

[0269] The second body portion includes a second connecting portion, which extends along a first direction and a second direction. The first end of the second connecting portion is connected to the second longitudinal portion, and the second end of the second connecting portion is connected to the second electrode of the battery and the second electrode of the capacitor.

[0270] Along the second direction, the second connecting portion and the first connecting portion are arranged at intervals in sequence;

[0271] The orthographic projections of the first connecting part and the second connecting part on the second plane at least partially overlap.

[0272] Optionally, the power module includes three power units extending along the first direction;

[0273] The first electrode layer serves as the first input terminal of the three power units. The three power units share the first electrode layer and the three power units share the first connection structure of the connection structure.

[0274] And / or, the second electrode layer serves as the second input terminal of the three power units, the three power units share the second electrode layer, and the three power units share the second connection structure of the connection structure.

[0275] Optional, the power module includes:

[0276] Second conductive layer;

[0277] The third conductive layer is disposed on one side of the second conductive layer;

[0278] The fourth conductive layer is disposed on the side of the third conductive layer away from the second conductive layer;

[0279] The fifth conductive layer is disposed on the side of the fourth conductive layer away from the second conductive layer;

[0280] The first electrode layer is located in the fifth conductive layer, and the second electrode layer is located in the second conductive layer;

[0281] The first connection structure of the connection structure is located on the side of the second conductive layer away from the third conductive layer, and the first connection structure is connected to the first electrode layer through a via.

[0282] The second connection structure is located on the side of the first conductive layer away from the second conductive layer, and the second connection structure is connected to the second electrode layer through a via.

[0283] Optionally, the power module further includes:

[0284] A first conductive layer is located on the side of the second conductive layer that is away from the third conductive layer;

[0285] At least one first capacitor is located in the first conductive layer and is connected in parallel with the power unit.

[0286] Optionally, at least two of the power units share at least one of the first capacitors.

[0287] Optionally, at least one of the first capacitors, as an orthographic projection onto the first plane, is located between the orthographic projection regions of the two power units sharing the electrode layer onto the first plane.

[0288] Optionally, along the second direction, the power devices of the power unit are located in the region between the third conductive layer and the fourth conductive layer, and between the third conductive layer and the fourth conductive layer.

[0289] Optionally, each of the power units includes:

[0290] First bridge arm and second bridge arm, the first end of the first bridge arm is connected to the first electrode layer as the first input terminal of the power unit;

[0291] The second end of the first bridge arm is connected to the first end of the second bridge arm at the first node, serving as the output end of the power unit;

[0292] The second end of the second bridge arm is connected to the second electrode layer as the second input terminal of the power unit;

[0293] The first bridge arm is disposed in a first intermediate region between the third conductive layer and the fourth conductive layer; the second bridge arm is disposed in a second intermediate region between the third conductive layer and the fourth conductive layer.

[0294] Optionally, the orthographic projection of the first bridge arm onto the second conductive layer does not overlap with the orthographic projection of the second electrode layer onto the second conductive layer; the orthographic projection of the second bridge arm onto the second conductive layer falls within the region of the orthographic projection of the second electrode layer onto the second conductive layer.

[0295] The orthographic projection of the first bridge arm on the fifth conductive layer falls within the region of the orthographic projection of the first electrode layer on the fifth conductive layer; the orthographic projection of the second bridge arm on the fifth conductive layer does not overlap with the orthographic projection of the first electrode layer on the fifth conductive layer.

[0296] Optionally, the first arm of each power unit includes at least one first power device, and the second arm of each power unit includes at least one second power device;

[0297] When the first bridge arm of each power unit includes at least two first power devices, the first power devices of each power unit are connected in parallel.

[0298] When the second bridge arm of each power unit includes at least two second power devices, each of the second power devices in each power unit is connected in parallel.

[0299] Optionally, each power unit further includes a phase trace, which is disposed on the second conductive layer and the fifth conductive layer respectively;

[0300] The power module also includes a phase copper block, the phase trace is connected to the phase copper block at the first node, and the phase copper block is disposed on the third conductive layer and the fourth conductive layer.

[0301] Optionally, the phase trace includes a first phase trace and a second phase trace, wherein the first phase trace is located in the fifth conductive layer and the second phase trace is located in the second conductive layer;

[0302] The first phase trace is connected between the first bridge arm and the phase copper block, and the second phase trace is connected between the phase copper block and the second bridge arm;

[0303] The orthogonal projection of the first phase trace on the fifth conductive layer does not overlap with the orthogonal projection of the first electrode layer on the fifth conductive layer;

[0304] The orthographic projection of the second phase trace onto the second conductive layer does not overlap with the orthographic projection of the second electrode layer onto the second conductive layer.

[0305] Optionally, the electrode layer includes two layers of the first electrode layer;

[0306] At least one of the two first electrode layers is connected to the first input terminal of at least two power units, and at least two power units share the first electrode layer connected to the first input terminal of the power unit.

[0307] Optionally, the power module further includes:

[0308] A seventh conductive layer is located between the first conductive layer and the second conductive layer;

[0309] The two first electrode layers include a first first electrode layer and a second first electrode layer;

[0310] The first first electrode layer is located in the seventh conductive layer; the second first electrode layer is located in the fifth conductive layer.

[0311] Optionally, the power module further includes:

[0312] A sixth conductive layer is disposed on the side of the fifth conductive layer away from the first conductive layer, and the sixth conductive layer is used to connect an external heat dissipation module.

[0313] Optionally, the power module further includes:

[0314] An interlayer insulating layer is disposed between adjacent conductive layers on both sides, and the interlayer insulating layer serves an insulating function.

[0315] Note: The terminology correspondence between later and earlier applications is as follows: A sub-power module in a later application corresponds to a power unit in an earlier application. A DC connection terminal in a later application corresponds to a connection structure in an earlier application. A first conductor in a later application corresponds to a first electrode layer in an earlier application. A second conductor in a later application corresponds to a second electrode layer in an earlier application. A conductor layer in a later application corresponds to a conductive layer in an earlier application. An upper bridge module in a later application corresponds to a first bridge arm in an earlier application. A lower bridge module in a later application corresponds to a second bridge arm in an earlier application.

[0316] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A power module, characterized in that, include: At least two sub-power modules; Two DC connection terminals; The at least two sub-power modules are connected to at least the same DC connection terminal.

2. The power module according to claim 1, characterized in that, The two DC connection terminals include a first DC connection terminal and a second DC connection terminal; Wherein, the projections of the first DC connection terminal and the second DC connection terminal on the first plane at least partially overlap; wherein, the plane where the at least two sub-power modules are located is configured as the first plane.

3. The power module according to claim 1 or 2, characterized in that, The two DC connection terminals include a first DC connection terminal and a second DC connection terminal; the projections of the first DC connection terminal and the second DC connection terminal on the second plane at least partially overlap; The second plane intersects with the first plane, and the plane containing the at least two sub-power modules is configured as the first plane.

4. The power module according to any one of claims 1 to 3, characterized in that, At least one of the DC connection terminals includes a body portion and at least one terminal portion, the body portion being connected to the at least one terminal portion, and the power module further includes a power layer, the at least one DC connection terminal being connected to the power layer through the terminal portion.

5. The power module according to claim 4, characterized in that, The at least one terminal portion may be a plurality of terminal portions, which are spaced apart.

6. The power module according to claim 4 or 5, characterized in that, The two DC connection terminals include a first DC connection terminal and a second DC connection terminal; Along a first direction, the terminal portions of the first DC connection terminal and the terminal portions of the second DC connection terminal are alternately arranged, wherein the at least two sub-power modules are arranged along the first direction.

7. The power module according to any one of claims 4 to 6, characterized in that, The body portion includes a bend that connects to the terminal portion, the bend extending along a third direction, the third direction intersecting with a first plane containing the at least two sub-power modules.

8. The power module according to claim 6 or 7, characterized in that, The projections of the bends of the two DC connection terminals on the second plane at least partially overlap; The plane containing the at least two sub-power modules is configured as a first plane, and the second plane intersects with the first plane.

9. The power module according to any one of claims 7 to 8, characterized in that, The main body includes a horizontal portion extending along a second direction, which is connected to the terminal portion via the bend. The second direction intersects with the first direction, and both the second direction and the first direction are parallel to the plane containing the at least two sub-power modules.

10. The power module according to claim 9, characterized in that, The projections of the horizontal portions of the two DC connection terminals onto the first plane at least partially overlap.

11. The power module according to claim 9 or 10, characterized in that, The main body includes a longitudinal section extending along a third direction, which is connected to the curved section via the transverse section; the third direction intersects with a first plane containing the at least two sub-power modules.

12. The power module according to claim 11, characterized in that, The projections of the vertical portions of the two DC connection terminals onto the second plane at least partially overlap.

13. The power module according to any one of claims 1-12, characterized in that, The two DC connection terminals include a first DC connection terminal and a second DC connection terminal; The power layer in the power module is configured with at least one first conductor and at least one second conductor, wherein the first conductor is connected to the first DC connection terminal, the second conductor is connected to the second DC connection terminal, and the at least two sub-power modules are connected to the same first conductor and / or second conductor.

14. The power module according to claim 13, characterized in that, The first conductor is configured as a positive current layer, and the second conductor is configured as a negative current layer.

15. The power module according to any one of claims 1-14, characterized in that, The power module includes a printed circuit board, and the at least two sub-power modules are embedded in the printed circuit board. The printed circuit board includes multiple stacked conductor layers, wherein the conductor layers include the power layer of the power module.

16. The power module according to claim 15, characterized in that, The multiple stacked conductor layers are configured as 6 or 7 layers.

17. The power module according to any one of claims 1-16, characterized in that, The power module also includes: At least one absorption capacitor is connected in parallel with the sub-power module; At least two of the sub-power modules are connected to the same absorption capacitor.

18. The power module according to claim 17, characterized in that, The projection of the absorption capacitor on the first plane is located between the projections of two adjacent sub-power modules on the first plane; The plane containing at least two sub-power modules is configured as the first plane.

19. The power module according to any one of claims 1-18, characterized in that, Each sub-power module includes: Upper and lower bridge arm chipsets distributed along the second direction; In the second direction, the lower bridge arm chipset is disposed between the DC connection terminal and the upper bridge arm chipset.

20. A motor controller, characterized in that, Includes the power module as described in any one of claims 1 to 19.

21. An electric drive assembly, characterized in that, Includes the power module according to any one of claims 1 to 19, and / or includes the motor controller according to claim 20.

22. A vehicle, characterized in that, Includes the power module according to any one of claims 1 to 19, and / or includes the motor controller according to claim 20, and / or includes the electric drive assembly according to claim 21.

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