A pair of multi-batch measuring and controlling devices for infrared thermal imaging camera temperature environment test

Abstract

The application relates to the technical field of photoelectric testing, in particular to a one-to-many batch measurement and control device for infrared thermal imaging camera temperature environment testing. The device comprises a total control layer, a core installation layer, a radiation layer, a temperature control layer and a heat dissipation layer. The core installation layer is provided with an array camera mounting seat and a control board containing an FPGA chip and the like, is connected with an infrared thermal imaging camera, and is responsible for power supply, signal and video switching. The radiation layer is provided with a correction plate with a black body coating on the surface and heat preservation material on the periphery. The temperature control layer is provided with a refrigeration sheet, a temperature sensor and a digital display device, and is used for regulating and controlling the temperature of the correction plate. The heat dissipation layer is provided with a heat dissipation fan and a power distribution assembly, and is used for maintaining the heat balance of the temperature control layer. The total control layer is connected with an upper computer, realizes communication, video source switching and temperature setting, and transmits instruction data to the control board through a serial port. The application helps realize batch synchronous testing of multiple cameras, and greatly improves the testing efficiency.

Description

Technical Field

[0001] This application relates to the field of optoelectronic testing technology, and in particular to a one-to-many batch measurement and control device for temperature environment testing of infrared thermal imaging cameras. Background Technology

[0002] Infrared thermal imaging cameras are devices that convert invisible infrared radiation emitted by objects into visible thermal images. They have wide applications in military reconnaissance, industrial temperature measurement, security monitoring, and medical diagnostics. Because their operating environment often experiences significant temperature fluctuations and they need to adapt to a wide range of target temperatures, the camera's performance stability under different temperature conditions, such as image uniformity and noise levels, is a key indicator of its product quality. To ensure product reliability throughout its entire lifecycle, rigorous temperature environment testing must be conducted before the product leaves the factory.

[0003] In existing technologies, a typical testing method involves placing a single infrared thermal imaging camera or its core component under test in a temperature-controlled chamber, while simultaneously placing a target source, such as a standard blackbody, with an independently adjustable temperature within the camera's field of view. By setting the ambient temperature of the chamber and the temperature of the target source separately, a specific working scenario can be simulated, allowing testers to evaluate the camera's imaging performance under that scenario. However, this single-unit testing method has significant drawbacks. First, its testing efficiency is extremely low, as only one camera can be tested at a time. For the testing needs of hundreds or thousands of products on a large-scale production line, this would consume a significant amount of testing time and manpower. Second, the testing process typically requires frequent manual replacement of the product under test, setting of test parameters, and recording of test results, making it difficult to automate the entire process and meet requirements such as 24 / 7 uninterrupted automated testing. This not only further reduces testing efficiency but also easily introduces errors due to variations in human operation, affecting the consistency and objectivity of the test results. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a one-to-many batch measurement and control device for temperature environment testing of infrared thermal imaging cameras, so as to solve the problems existing in the prior art.

[0005] According to a first aspect of the present invention, a one-to-many batch measurement and control device for temperature environment testing of infrared thermal imaging cameras is provided, the device comprising:

[0006] The main control layer, the movement mounting layer, the radiation layer, the temperature control layer, and the heat dissipation layer are stacked vertically in sequence; the main control layer is connected to the movement mounting layer, the radiation layer, the temperature control layer, and the heat dissipation layer in sequence. The mounting layer of the mechanism is equipped with an array of camera mounting bases and a control board integrating an FPGA chip, a communication module, and a video switching module. The control board is connected to multiple preset infrared thermal imaging cameras via cables to synchronously realize power supply, signal interaction, and video channel switching. The camera mounting bases are connected to the control board. The radiation layer includes a correction plate with a blackbody coating sprayed on its surface, and thermal insulation material wrapped around the correction plate. The temperature control layer includes a cooling element, a temperature sensor, and a digital temperature acquisition device attached to the lower surface of the calibration plate, used to actively regulate the target temperature on the surface of the calibration plate; wherein, the temperature sensor is connected to the cooling element and the digital temperature acquisition device respectively. The heat dissipation layer includes a cooling fan and a power distribution component. The cooling fan faces the heat dissipation surface of the cooling chip and maintains the thermal balance of the temperature control layer through forced convection. The cooling fan is connected to the power distribution component. The main control layer is connected to the host computer via a serial port to realize communication switching with any thermal imaging camera, switching of display video source and setting of target temperature of calibration board, providing support for batch control, and connecting to the control board via serial cable to realize command and data transmission. The control board of the mechanism mounting layer is also connected to the temperature sensor and cooling chip of the temperature control layer; the upper surface of the calibration board of the radiation layer is for camera observation, and the lower surface is attached to the cooling chip of the temperature control layer.

[0007] Furthermore, the camera mounting bases of the core mounting layer are arranged in an array, and the number of cameras is set according to the test requirements. The observation surface of each infrared thermal imaging camera faces downwards and is directly opposite the upper surface of the calibration plate of the radiation layer.

[0008] Furthermore, the FPGA chip of the control board adopts the FMK50T4 chip, which is used to complete the logic processing of image acquisition, temperature acquisition, serial port control and video switching.

[0009] Furthermore, the temperature control layer also includes a microcontroller temperature controller, which is connected to the temperature sensor, the cooling chip, and the control board via control lines. The microcontroller temperature controller is used to receive the data collected by the temperature sensor and control the operation of the cooling chip. The temperature sensor is a digital sensor with a display screen, which can achieve target temperature regulation within a preset temperature range.

[0010] Furthermore, the power distribution components of the heat dissipation layer include a power distribution box, which provides DC power to the cooling fan, temperature sensor and cooling chip; the cooling fan includes an intake fan and an exhaust fan.

[0011] Furthermore, the host computer of the main control layer is equipped with preset control software. The control software is used to perform the following method steps in coordination with the control board of the movement mounting layer, the temperature control components of the temperature control layer, and the video switching module: S1. Communication switching steps: Send a command frame containing the source address and destination address to the control board through a one-to-many communication protocol. The FPGA chip of the control board activates the communication channel of the corresponding camera according to the destination address, so as to realize the communication switching between the host computer and any thermal imaging camera. S2. Video source switching steps: Send an instruction frame containing a video switching command code to the control board. The video switching chip on the control board responds to the instruction and switches the video source of the external display to the output signal of the specified camera. S3. Target Temperature Setting Steps: Send a data frame containing target temperature parameters to the control board. The control board transmits the parameters to the microcontroller temperature controller in the temperature control layer, which drives the cooling element to adjust the surface temperature of the calibration board, providing a preset target temperature for image quality judgment. The instruction frame of the one-to-many communication protocol includes a frame header, length, data segment, check bit, and frame tail. The FPGA chip of the control board is used to parse the instruction frame and execute the corresponding control logic.

[0012] Furthermore, the host computer of the overall control layer integrates an image layering calculation module and a noise statistics calculation module; The image layering calculation module is used to generate smooth images of different resolutions through Gaussian convolution and downsampling, providing multi-scale basic data for noise analysis; The noise statistics calculation module is used to calculate noise statistics based on the multi-scale basic data output by the layered image calculation module, and to quantitatively evaluate the image non-uniformity and quality of the camera under different temperature environments. The image layering calculation module, the noise statistics calculation module, the control board of the mechanism mounting layer, and the temperature controller of the temperature control layer work together.

[0013] Furthermore, the radiation layer and the temperature control layer are connected by a fixed plate frame, and a heat sink is provided between the temperature control layer and the heat dissipation layer. The cold side of the cooling plate is attached to the lower surface of the calibration plate, and the hot side is connected to the fan of the heat dissipation layer through the heat sink.

[0014] The technical solutions provided by the embodiments of the present invention may include the following beneficial effects: The one-to-many batch measurement and control device for temperature environment testing of infrared thermal imaging cameras described in this application solves the technical problems of "low single-unit testing efficiency, single target temperature simulation, excessive manual intervention, and incomplete test scenario coverage" in traditional testing through the collaborative design of "sequentially vertically stacked core mounting layer, radiation layer, temperature control layer, heat dissipation layer, and overall control layer," bringing the following beneficial effects: 1. Enables batch synchronous testing of multiple cameras, significantly improving testing efficiency. The device supports the simultaneous deployment of multiple cameras through the array camera mount on the core mounting layer. Combined with the one-to-many communication protocol of the main control layer and the FPGA chip on the control board (which integrates communication and video switching functions), communication switching, video source switching and collaborative control of all cameras can be completed through a single control line. This avoids the repetitive operations of traditional single-unit manual testing, improving testing efficiency by several times to tens of times. It is especially suitable for batch verification needs in mass production scenarios.

[0015] 2. Accurately simulates multiple target temperature scenarios, comprehensively covering actual working conditions. The calibration plate (with a blackbody coating on its surface) of the radiation layer provides a stable source of thermal radiation. The temperature control layer, through the collaboration of a cooling chip, a temperature sensor, and a microcontroller-based temperature controller, can precisely regulate the surface temperature of the calibration plate within a preset temperature range. At the same time, in conjunction with the ambient temperature setting of an external high and low temperature chamber, it can simulate complex combination scenarios of "different ambient temperatures + different target temperatures" (such as testing target temperatures of -40℃ and -30℃ in a -20℃ environment). This solves the limitation of traditional testing where "the temperature of the radiation plate is the same as the temperature of the chamber and cannot cover multiple temperature targets," and is closer to the actual operating conditions of infrared thermal imaging cameras.

[0016] 3. Automated testing processes reduce manual intervention and improve test reliability. The host computer software of the main control layer, in collaboration with the control board and temperature control layer components, automatically completes communication switching, video source switching, target temperature setting, and data acquisition. Combined with the FPGA chip of the core mounting layer for logic control of image acquisition and temperature acquisition, it can achieve 24-hour uninterrupted testing, avoid the limitations of manual operation in extreme temperature environments, reduce errors in human reading and recording, and improve the consistency and reliability of test data.

[0017] 4. The vertical stacking structure is compact and functionally synergistic, balancing practicality and maintainability. Each layer adopts a vertical stacking design. The core mounting layer (camera deployment), radiation layer (target radiation source), temperature control layer (temperature regulation), heat dissipation layer (thermal balance maintenance), and overall control layer (global control) are functionally independent yet closely connected. For example, the temperature control layer's cooling chip is attached to the lower surface of the radiation layer's calibration board. The temperature control layer and heat dissipation layer achieve forced convection heat dissipation through the heat dissipation chip and fan. The overall control layer is directly connected to the control board via a serial cable to achieve command transmission. The overall structure is compact, has high space utilization, and the modular design of each layer's components facilitates individual maintenance and upgrades.

[0018] 5. Test data supports accurate quality assessment and ensures product consistency. The device uses a digital temperature sensor (with a display screen) in the temperature control layer to provide real-time temperature feedback. Combined with the image layering calculation module and noise statistics calculation module integrated in the main control layer, it can quantitatively evaluate the non-uniformity and image quality of the camera based on multi-scale image data, providing objective data support for product performance judgment, avoiding the bias of traditional subjective evaluation, and effectively ensuring the consistency of production quality of infrared thermal imaging cameras.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0021] Figure 1 This is a schematic diagram of a one-to-many batch measurement and control device for an infrared thermal imaging camera temperature environment test, according to an exemplary embodiment. Figure 2 This is a schematic diagram of the structure of a one-to-many batch measurement and control device for temperature environment testing of an infrared thermal imaging camera, according to an exemplary embodiment. Figure 3 This is a schematic diagram of the image layering calculation results of a one-to-many batch measurement and control device for an infrared thermal imaging camera temperature environment test, according to an exemplary embodiment. Detailed Implementation

[0022] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0023] Example 1 Please see Figure 1 , Figure 1 This is a schematic diagram illustrating a one-to-many batch measurement and control device for temperature environment testing of an infrared thermal imaging camera according to an exemplary embodiment. The device includes: The main control layer 01, the mechanism mounting layer 02, the radiation layer 03, the temperature control layer 04, and the heat dissipation layer 05 are stacked vertically in sequence. The mounting layer 02 of the mechanism is provided with an array of camera mounting bases 21, and a control board 22 integrating an FPGA chip, a communication module, and a video switching module. The control board 22 is connected to multiple preset infrared thermal imaging cameras through cables to synchronously realize power supply, signal interaction and video channel switching. The radiation layer 03 includes a correction plate with a blackbody coating sprayed on its surface, and thermal insulation material 32 wrapped around the correction plate. The temperature control layer 04 includes a cooling chip 41, a temperature sensor 42, and a digital display temperature acquisition device 43 attached to the lower surface of the calibration plate, which are used to actively regulate the target temperature on the surface of the calibration plate. The heat dissipation layer 05 includes a heat dissipation fan 51 and a power distribution component 52. The heat dissipation fan 51 faces the heat dissipation surface of the cooling chip 41 and maintains the thermal balance of the temperature control layer 04 through forced convection. The main control layer 01 is connected to the host computer 11 via a serial port to realize communication switching with any thermal imaging camera, switching of display video source and setting of target temperature of calibration board, providing support for batch control, and connecting to control board 22 via serial cable to realize command and data transmission. The control board 22 of the mechanism mounting layer 02 is also connected to the temperature sensor 42 and the cooling element 41 of the temperature control layer 04; the upper surface of the calibration plate of the radiation layer 03 is for camera observation, and the lower surface is attached to the cooling element 41 of the temperature control layer 04. Please refer to [link / reference]. Figure 2 Furthermore, the camera mounting bases 21 of the core mounting layer 02 are arranged in an array, and the number of cameras is set according to the test requirements. The observation surface of each infrared thermal imaging camera faces downward and is directly opposite the upper surface of the calibration plate of the radiation layer 03.

[0024] In one embodiment, the FPGA chip of the control board 22 is an FMK50T4 chip, which is used to complete the logic processing of image acquisition, temperature acquisition, serial port control and video switching.

[0025] In one embodiment, the temperature control layer 04 further includes a microcontroller temperature controller. The microcontroller temperature controller is connected to the temperature sensor 42, the cooling chip 41, and the control board 22 via control lines. It is used to receive the data collected by the temperature sensor 42 and control the operation of the cooling chip 41. The temperature sensor 42 is a digital sensor with a display screen, which can achieve target temperature regulation within a preset temperature range.

[0026] In one embodiment, the power distribution component 52 of the heat dissipation layer 05 includes a power distribution box, which is used to provide DC power to the cooling fan 51, the temperature sensor 42 and the cooling chip 41; the cooling fan 51 includes an intake fan and an exhaust fan.

[0027] In one embodiment, referring to Table 1, the host computer 11 of the main control layer 01 is equipped with preset control software. The control software is used to perform the following method steps in coordination with the control board 22 of the mechanism mounting layer 02, the temperature control component of the temperature control layer 04, and the video switching module: (1) Communication switching steps: Send a command frame containing the source address and destination address to the control board 22 through a one-to-many communication protocol. The FPGA chip of the control board 22 activates the communication channel of the corresponding camera according to the destination address, thereby realizing the communication switching between the host computer 11 and any thermal imaging camera. (2) Video source switching steps: Send an instruction frame containing video switching command code to the control board 22. The video switching chip of the control board 22 responds to the instruction and switches the video source of the external display to the output signal of the specified camera. (3) Target temperature setting steps: Send a data frame containing target temperature parameters to the control board 22. The control board 22 transmits the parameters to the microcontroller temperature controller of the temperature control layer 04, and drives the cooling chip 41 to adjust the surface temperature of the calibration board, so as to provide a preset target temperature for image quality judgment. The instruction frame of the one-to-many communication protocol includes a frame header, length, data segment, check bit and frame tail. The FPGA chip of the control board 22 is used to parse the instruction frame and execute the corresponding control logic.

[0028] In practical implementation, please refer to Table 1. The host computer software 11 is developed using QT and can perform the following functions through command control: The communication between the host computer 11 and the control board 22 is switched to communication between the host computer 11 and any one of the thermal imaging cameras; Switch the monitor video to the video from any camera. Different target temperatures are set to help subsequent modules determine the current image quality. This step uses an innovative one-to-many communication protocol to complete a single control line through the design of source and destination addresses.

[0029] Table 1

[0030] More specifically, the host computer 11 of the overall control layer 01 integrates an image layering calculation module and a noise statistics calculation module; The image layering calculation module is used to generate smooth images of different resolutions through Gaussian convolution and downsampling, providing multi-scale basic data for noise analysis; The noise statistics calculation module is used to calculate noise statistics based on the multi-scale basic data output by the layered image calculation module, and to quantitatively evaluate the image non-uniformity and quality of the camera under different temperature environments. The image layering calculation module, the noise statistics calculation module, the control board 22 of the core mounting layer 02, and the temperature controller of the temperature control layer 04 work together.

[0031] In practical implementation, the host computer 11 of the main control layer 01 integrates an image layering calculation module and a noise statistics calculation module, and is configured to mainly perform the following steps: S1. Switch to one camera at a time. Click to start analysis: The computer automatically analyzes the video from the camera with that number, uses Gaussian pyramid image downsampling, calculates the discrete noise of the image in three layers, provides an image quality assessment under the current ambient temperature, and stores the report in a txt document. After the calculation is complete, it switches to the next camera to continue the calculation. The calculation formula is as follows: S1.1 Image layering calculation: Layer 0 represents the full-size image. Layer 1 is a half-downsampled result of Layer 0, meaning that after convolving the Layer 0 image with the Gaussian operator, the dimensions are obtained by sampling at intervals, resulting in a width and height that are half of the Layer 0 image. Layer 2 is the effect of downsampling Layer 1, and so on.

[0032] The reason for using the Gaussian operator is to make the image smoother and avoid pixel abrupt changes caused by direct point-to-point sampling.

[0033] Where "·" represents convolution. (1:2:m, 1:2:n) represents equal-interval downsampling. I_ori represents the original image. Image at layer 0: f0 = I_ori; The first layer image f1 = (I_ori·H)(1:2:m,1:2:n); The second layer image f2 = (f1·H)(1:2:m / 2,1:2:n / 2); It should be noted that in the actual implementation, the convolution operation between I_ori and H is performed first, and then the convolution result is downsampled at equal intervals.

[0034] In practical implementation, assuming H (convolution kernel) is as follows: By performing the above steps, we can obtain Figure 3 The three-layer image shown: S2 noise statistics calculation: The f0 / f1 / f2 images are the results of layered calculations in section 5.1. EAV0 = For noise statistics of the 0th layer image; EAV1 = For noise statistics of the first layer image; EAV2 = For noise statistics of the second layer image; EAV0, EAV1, and EAV2 represent the noise statistics or non-uniformity statistics for each layer.

[0035] S3. Change the target temperature Manually set the target temperature, such as -20 degrees Celsius for the temperature chamber, and manually set the target temperature to -40, -30, -20, -10, 0, etc., to evaluate the image quality of the camera.

[0036] Repeat step S1 to test each camera and generate a txt report. S4. Change the incubator temperature Manually change the incubator temperature and repeat the analysis in steps S2 and S3.

[0037] Furthermore, the radiation layer 03 and the temperature control layer 04 are connected by a fixed plate frame, and a heat sink is provided between the temperature control layer 04 and the heat dissipation layer 05. The cold side of the cooling chip 41 is attached to the lower surface of the correction plate, and the hot side is connected to the fan of the heat dissipation layer 05 through the heat sink.

[0038] Please see Figure 2 To make the technical solution of the present invention clearer, the device will be described in detail below with reference to specific component models, connection relationships and working processes.

[0039] I. Overall Structure and Components of the Device The testing device in this embodiment adopts a vertically stacked structure, consisting of, from top to bottom, a core mounting layer 02, a radiation layer 03, a temperature control layer 04, and a heat dissipation layer 05. It is externally coordinated with a central control layer 01 to achieve global control. The specific composition of each layer is as follows: Movement mounting layer 02 Camera mount 21: It adopts a 30-aluminum alloy array mount (6×5 matrix distribution), which is compatible with the 16mm×16mm infrared thermal imaging camera core. The bottom of the mount is equipped with a guide groove to ensure that the camera observation surface is vertically downward.

[0040] Control board 22: The core is a domestic FMK50T4 FPGA chip, which integrates a MAX3232 communication chip (232 serial port), a BH76332 video switching chip (multiple chips combined to achieve 30-channel PAL signal switching) and an AD7416 temperature sampling chip. The control board 22 connects to 30 cameras through 30 sets of 7-core cables, and provides 12V DC power, UART communication signals and video output signals simultaneously.

[0041] Radiation layer 03 Calibration plate: Made of 300mm×200mm×5mm aluminum alloy, with a blackbody coating (emissivity 0.96) on the upper surface and anodized treatment on the lower surface (to enhance thermal conductivity).

[0042] Insulation material: 50mm thick aerogel felt (thermal conductivity ≤0.02W / (mk)), wrapped around the perimeter of the calibration plate, forming a sealed thermal insulation space (approximately 0.015m³ in volume) with the temperature control layer 04. 3 ).

[0043] Temperature control layer 04 Cooler 41: 4 TEC1-12706 semiconductor coolers 41 (60W power per chip) are connected in parallel. The cold side is attached to the lower surface of the calibration board with thermally conductive silicone (thermal conductivity 3.0W / (mk)) and the hot side is attached to a 5mm thick aluminum heat sink.

[0044] Temperature sensor 42: DS18B20 digital sensor (accuracy ±0.5℃), with a 0.96-inch OLED display, showing the calibration plate temperature in real time (sampling frequency 1Hz).

[0045] Microcontroller-based temperature controller: Employs an STM32F103 microcontroller, via I... 2 The temperature sensor 42 is connected to the C bus and drives the cooling chip 41 through the PWM signal. The temperature control range is -40℃ to 80℃, and the adjustment accuracy is ±0.3℃.

[0046] Heat dissipation layer 05 Cooling Fan 51: Two 12V DC axial fans (airflow 150CFM), namely an intake fan (wind speed 3m / s) and an exhaust fan (wind speed 2.5m / s), symmetrically distributed on both sides of the heat sink to form a forced convection channel.

[0047] Distribution box: Input 220V AC to 12V DC (output current 10A), provides independent power supply circuits for fan, temperature sensor 42 and cooling chip 41, and has built-in overload protection (threshold 15A).

[0048] Overall Control Layer 01 Host computer 11: Industrial computer (Intel i5 processor), with QT-developed control software installed (supports Windows 10 system), connected to the control board 22 of the chassis mounting layer 02 via RS-232 serial cable (baud rate 9600).

[0049] External equipment: PAL standard display, high and low temperature chamber (1m³ volume) 3 Temperature control range: -40℃ to 150℃.

[0050] Interlayer connection structure The radiant layer 03 and the temperature control layer 04 are connected by four stainless steel fixing plates (80mm high), and the frame is wrapped with insulation cotton (to prevent heat conduction).

[0051] The temperature control layer 04 and the heat dissipation layer 05 are fixed together by bolts. The distance between the heat dissipation fins on the hot side of the cooling chip 41 and the fan of the heat dissipation layer 05 is 5mm to ensure smooth airflow.

[0052] II. Device Workflow Taking "testing the image quality of targets with temperatures ranging from -40℃ to 0℃ using 30 infrared thermal imaging cameras at an ambient temperature of -20℃" as an example, the working steps are as follows: S1. Device Deployment and Initialization Thirty cameras are mounted on the array mount of the core mounting layer 02, with the observation surface facing the upper surface of the calibration plate of the radiation layer 03 (spacing 150mm), and connected to the control board 22 via cables.

[0053] The entire device is placed in a high and low temperature chamber and the chamber door is closed; the host computer 11 is connected to the control board 22 via a serial cable, and the display is connected to the video output terminal of the control board 22.

[0054] When the power distribution box is connected to a 12V power supply, the device performs a self-test: the FPGA chip on the control board 22 initializes the communication and video switching modules, and the temperature sensor 42 displays the initial temperature of the calibration board (room temperature 25℃).

[0055] S2. Ambient Temperature and Target Temperature Settings Set the ambient temperature of the high and low temperature chamber to -20℃, start the cooling process, and wait for the temperature inside the chamber to stabilize (approximately 30 minutes).

[0056] The host computer software 11 sends a temperature setting command (protocol frame: F0H+05H+00H+01H+01H+D4H+00H+38H+FFH), where “D4H00H” corresponds to the target temperature of -40℃ (hexadecimal conversion).

[0057] After the control board 22 parses the instructions, it drives the cooling chip 41 to work through the STM32 microcontroller. The temperature sensor 42 transmits back the temperature of the calibration board in real time until it stabilizes at -40℃ (about 15 minutes).

[0058] S3. Communication Switching and Video Surveillance The host computer 11 sends a communication switching command (destination address 0x03), the FPGA chip activates the communication channel of the third camera, the host computer 11 establishes a separate communication link with the camera, and reads its firmware version information.

[0059] Send a video switching command (command code 0x02 + destination address 0x03), and the BH76332 video switching chip will switch the display signal to the output of the third camera, displaying the thermal image of the calibration board on the screen (resolution 640×512).

[0060] S4. Image Layering Calculation and Noise Statistics Image layering: The image layering calculation module of the host computer 11 obtains the original image I_ori, and after convolution with the Gaussian operator H, it samples at intervals to generate the first layer image f1 (320×256). Then, the operation is repeated on f1 to generate the second layer image f2 (160×128).

[0061] Noise statistics: The noise statistics calculation module is based on layered images and calculates according to the following formula: EAV0=Σ|8×f0(x,y) Σf0(x+i,y+j)|(i,j=-1,0,1, exclude boundary pixels) Similarly, EAV1 and EAV2 were calculated. The results show that the third camera has EAV0=125, EAV1=63, and EAV2=31 in an environment of -20℃ and a target temperature of -40℃ (the smaller the value, the better the image quality).

[0062] S5. Batch Testing and Multi-Temperature Cycling The host computer 11 switches to the 1st to 30th cameras sequentially through a one-to-many communication protocol, repeats steps 3 to 4, automatically records the EAV value of each camera, and generates a txt report (such as "Camera 05: -20℃ environment, -40℃ target, EAV0=132").

[0063] Manually change the target temperature to -30℃, -20℃, -10℃, and 0℃, and repeat the above test; then adjust the ambient temperature of the high and low temperature chamber to 0℃ and 40℃, and complete the full-condition test in sequence.

[0064] III. Description of the Effects of the Examples This embodiment achieves the following technical effects through a vertically stacked layered structure and automated control: Batch testing efficiency: The total testing time for 30 cameras under 5 target temperatures and 3 ambient temperatures is about 8 hours, which is 110 times more efficient than traditional manual testing of a single camera (about 30 hours / camera).

[0065] Temperature control accuracy: The steady-state error of the target temperature of the calibration plate within the range of -40℃ to 80℃ is ≤ ±0.3℃, which meets the test requirements of infrared thermal imaging cameras for target temperature accuracy.

[0066] Objectivity of image quality evaluation: Noise is quantified by EAV value to avoid subjective human judgment, and the repeatability error of test data from 30 cameras is ≤2%.

[0067] This embodiment fully demonstrates the advantages of the device in "batch control, multi-temperature simulation, and automated testing", and is suitable for temperature environment adaptability verification during the mass production stage of infrared thermal imaging cameras.

[0068] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0069] It should be noted that in the description of this invention, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means at least two.

[0070] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of the invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as will be understood by those skilled in the art to which embodiments of the invention pertain.

[0071] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0072] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0073] Furthermore, the functional units in the various embodiments of the present invention can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0074] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0075] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A one-to-many batch measurement and control device for temperature environment testing of infrared thermal imaging cameras, characterized in that, The device includes: The main control layer, the movement mounting layer, the radiation layer, the temperature control layer, and the heat dissipation layer are stacked vertically in sequence; the main control layer is connected to the movement mounting layer, the radiation layer, the temperature control layer, and the heat dissipation layer in sequence. The mounting layer of the mechanism is equipped with an array of camera mounting bases and a control board integrating an FPGA chip, a communication module, and a video switching module. The control board is connected to multiple preset infrared thermal imaging cameras via cables to synchronously realize power supply, signal interaction, and video channel switching. The camera mounting bases are connected to the control board. The radiation layer includes a correction plate with a blackbody coating sprayed on its surface, and thermal insulation material wrapped around the correction plate. The temperature control layer includes a cooling element, a temperature sensor, and a digital temperature acquisition device attached to the lower surface of the calibration plate, used to actively regulate the target temperature on the surface of the calibration plate; wherein, the temperature sensor is connected to the cooling element and the digital temperature acquisition device respectively. The heat dissipation layer includes a cooling fan and a power distribution component. The cooling fan faces the heat dissipation surface of the cooling chip and maintains the thermal balance of the temperature control layer through forced convection. The cooling fan is connected to the power distribution component. The main control layer is connected to the host computer via a serial port to realize communication switching with any thermal imaging camera, switching of display video source and setting of target temperature of calibration board, providing support for batch control, and connecting to the control board via serial cable to realize command and data transmission. The control board of the mechanism mounting layer is also connected to the temperature sensor and cooling chip of the temperature control layer; the upper surface of the calibration board of the radiation layer is for camera observation, and the lower surface is attached to the cooling chip of the temperature control layer.

2. The apparatus according to claim 1, characterized in that, The camera mounting bases of the mechanism mounting layer are arranged in an array, and the number of cameras is set according to the test requirements. The observation surface of each infrared thermal imaging camera faces downwards and is directly opposite the upper surface of the calibration plate of the radiation layer.

3. The apparatus according to claim 1, characterized in that, The FPGA chip on the control board is an FMK50T4 chip, which is used to complete the logic processing of image acquisition, temperature acquisition, serial port control and video switching.

4. The apparatus according to claim 1, characterized in that, The temperature control layer also includes a microcontroller temperature controller, which is connected to the temperature sensor, the cooling chip, and the control board via control lines. It is used to receive the data collected by the temperature sensor and control the operation of the cooling chip. The temperature sensor is a digital sensor with a display screen, which can achieve target temperature regulation within a preset temperature range.

5. The apparatus according to claim 1, characterized in that, The power distribution components of the heat dissipation layer include a power distribution box, which provides DC power to the cooling fan, temperature sensor and cooling chip; the cooling fan includes an intake fan and an exhaust fan.

6. The apparatus according to claim 1, characterized in that, The host computer of the main control layer is equipped with preset control software. The control software is used to perform the following method steps in coordination with the control board of the core mounting layer, the temperature control components of the temperature control layer, and the video switching module: S1. Communication switching steps: Send a command frame containing the source address and destination address to the control board through a one-to-many communication protocol. The FPGA chip of the control board activates the communication channel of the corresponding camera according to the destination address, so as to realize the communication switching between the host computer and any thermal imaging camera. S2. Video source switching steps: Send an instruction frame containing a video switching command code to the control board. The video switching chip on the control board responds to the instruction and switches the video source of the external display to the output signal of the specified camera. S3. Target Temperature Setting Steps: Send a data frame containing target temperature parameters to the control board. The control board transmits the parameters to the microcontroller temperature controller in the temperature control layer, which drives the cooling element to adjust the surface temperature of the calibration board, providing a preset target temperature for image quality judgment. The instruction frame of the one-to-many communication protocol includes a frame header, length, data segment, check bit, and frame tail. The FPGA chip of the control board is used to parse the instruction frame and execute the corresponding control logic.

7. The apparatus according to claim 1, characterized in that, The host computer of the overall control layer integrates an image layering calculation module and a noise statistics calculation module; The image layering calculation module is used to generate smooth images of different resolutions through Gaussian convolution and downsampling, providing multi-scale basic data for noise analysis; The noise statistics calculation module is used to calculate noise statistics based on the multi-scale basic data output by the layered image calculation module, and to quantitatively evaluate the image non-uniformity and quality of the camera under different temperature environments. The image layering calculation module, the noise statistics calculation module, the control board of the mechanism mounting layer, and the temperature controller of the temperature control layer work together.

8. The apparatus according to claim 1, characterized in that, The radiation layer and the temperature control layer are connected by a fixed plate frame. A heat sink is provided between the temperature control layer and the heat dissipation layer. The cold side of the cooling plate is attached to the lower surface of the calibration plate, and the hot side is connected to the fan of the heat dissipation layer through the heat sink.

Images