An imaging driving device and a camera module thereof

Abstract

The application discloses an imaging driving device and a camera module thereof. The imaging driving device comprises an imaging module, a driving module and a driving circuit assembly. The imaging module comprises a base and an imaging circuit board. The base is formed on the imaging circuit board and is suitable for supporting a movable assembly. The imaging circuit board is electrically connected with a photosensitive chip. The driving module comprises a shell and the driving circuit assembly. The driving circuit assembly comprises a driving circuit board and a driving coil. The driving circuit board is fixed on the inner wall of the shell. The driving coil is arranged on the driving circuit board. The driving circuit board is connected with the imaging circuit board and the driving coil. The driving coil is arranged opposite to the movable assembly along a second direction and / or a third direction to drive the movable assembly to move. The imaging module and the driving module are assembled respectively. The driving module is provided with a containing space. The containing space can cover the driving module on the imaging module along a first direction.

Description

Technical Field

[0001] This invention relates to the field of camera module technology, and in particular to an imaging driving device and its camera module. Background Technology

[0002] In the consumer electronics field, especially in the field of smart devices, miniaturized and lightweight camera modules are an indispensable component. Currently, portable terminals are equipped with at least one camera module. The driving device is an essential component of a high-pixel camera module. During the operation of the camera module, the driving device enables the optical lens to move in multiple directions to achieve AF (Auto Focus) and OIS (Optical Image Stabilization) functions during shooting.

[0003] To meet market demands, the requirements for imaging quality and imaging functions of camera modules are becoming increasingly stringent. As a result, the number of lenses in optical lenses is gradually increasing, leading to larger and heavier optical lenses. Consequently, the driving device needs to have greater driving force to ensure that the optical lens moves quickly and smoothly.

[0004] Furthermore, as electronic devices become increasingly thinner and lighter, the demand for miniaturization of camera modules is becoming more stringent, especially regarding the shoulder height of camera modules. The shoulder height of a camera module refers to the vertical distance from the mounting substrate (e.g., imaging circuit board, bottom surface of the camera module) to the highest point (e.g., top surface of the camera module housing, top surface of the optical lens). The shoulder height of the camera module directly affects the thickness of the electronic device and the overall appearance design, and it is necessary to strictly limit the shoulder height of the camera module to meet the requirements of the overall design of the electronic device.

[0005] However, in related technologies, the structures of the driving device and the camera module are typically designed independently and installed separately. For example, the base of the driving device, the base of the camera module, and the housing of the camera module are three different components. The base of the driving device mainly supports the driving circuit board, movable components, and many other functional components; while the base of the camera module mainly supports the driving device, optical lens, and other components, and can also be used to attach filters. The housing of the camera module is placed on the base of the camera module, so that the movable components and the base of the driving device are housed between the housing and the base of the camera module. Furthermore, when installing the driving device on the base of the camera module, it is necessary to consider avoiding obstructing components; when installing the housing of the camera module on the base of the camera module, it is also necessary to consider avoiding the base and driving circuit board of the driving device. In other words, the base of the drive unit and the base of the camera module need to be considered separately for their structural strength, minimum injection-molded wall thickness, and flatness of the finished product. The outer shell of the camera module also needs to be considered independently for its structural strength, minimum injection-molded wall thickness, and the structure of the base that is compatible with the camera module. Ultimately, the total height of the camera module is increased by the base of the drive unit and the base of the camera module, thus increasing the overall size of the camera module. Summary of the Invention

[0006] One object of the present invention is to provide an imaging driving device that integrates the driving circuit components of the camera module into the housing of the imaging driving device, making the structure of the camera module more compact and reducing the size of the camera module; it can also form a modular semi-finished product, which is convenient for assembly and production.

[0007] One object of the present invention is to provide an imaging driving device in which the driving control chip of the driving circuit assembly is disposed on the imaging circuit board, thereby effectively reducing the damage to the driving control chip during the assembly process and reducing the wear and tear of the driving control chip.

[0008] One object of the present invention is to provide an imaging driving device in which the driving module is lowered or its orientation is lowered relative to the base of the camera module, thereby reducing the shoulder height of the camera module.

[0009] Another objective of this invention is to provide a camera module in which the movable component is directly supported by the base of the imaging drive device, thereby enabling the movable component to sink or move downward, thus reducing the shoulder height of the camera module.

[0010] Another object of the present invention is to provide a camera module that reduces the number of devices supported on the base, thereby reducing the burden on the support area of ​​the base.

[0011] To achieve at least one of the above objectives, the technical solution adopted by the present invention is as follows: an imaging driving device, comprising: an imaging module including a base and an imaging circuit board, the base being formed on the imaging circuit board and adapted to support a movable component; the imaging circuit board being used for electrical connection with a photosensitive chip; and a driving module including a housing and a driving circuit assembly, the driving circuit assembly including a driving circuit board and a driving coil, the driving circuit board being fixed to the inner wall of the housing, the driving coil being disposed on the driving circuit board, the driving circuit board being conductive to the imaging circuit board and the driving coil, the driving coil being disposed opposite to the movable component along a second direction and / or a third direction to drive the movable component to move; wherein, the imaging module and the driving module are respectively assembled, the driving module having a receiving space, the receiving space allowing the driving module to cover the imaging module along a first direction; wherein, the first direction is parallel to the height direction of the imaging driving device, the second direction is parallel to the length direction of the imaging driving device, and the third direction is parallel to the width direction of the imaging driving device.

[0012] As a preferred embodiment, the drive circuit board includes a conductive portion and at least two plates, each of which is attached to the inner wall of the housing. The conductive portion is disposed at the edge of at least one of the plates facing the imaging circuit board, and the conductive portion is adapted to conduct electricity between the drive circuit board and the imaging circuit board.

[0013] As a preferred embodiment, the drive circuit board further includes a connecting portion, which can be bent to connect and conduct electricity between two adjacent boards, so that each board of the drive circuit board and the connecting portion are integrally formed.

[0014] As a preferred embodiment, at least two of the plates include a first plate, a second plate, and a third plate. When the driving module is covered on the light-incident side of the imaging module, the first plate, the second plate, and the third plate surround the outside of the movable component. The driving coil includes a focusing coil, a first image stabilization coil, and a second image stabilization coil, wherein the focusing coil is disposed on the first plate, the first image stabilization coil is disposed on the second plate, and the second image stabilization coil is disposed on the third plate.

[0015] As a preferred embodiment, the drive circuit assembly further includes a sensing device electrically disposed on the side of the drive circuit board facing the movable component, the sensing device being used to sense the position of the optical lens.

[0016] As a preferred embodiment, the driving circuit assembly further includes a driving control chip, which is electrically disposed on the imaging circuit board, and the base covers the driving control chip.

[0017] As a preferred embodiment, the imaging driving device further includes a reinforcing plate disposed on the surface of each of the plates opposite to the driving coil, to support each of the plates.

[0018] As a preferred embodiment, the base includes an inner base and an outer base surrounding the inner base, the drive module rests on the outer base, and the inner base is adapted to support the filter, wherein the lower end surface of the drive module is lower than the inner top surface of the inner base, so as to sink relative to the inner base.

[0019] As a preferred embodiment, the outer base includes a base and side corner portions. The base is disposed along the edge of the imaging circuit board and is adapted to support movable components. The side corner portions extend in a first direction and are located at the corners of the imaging circuit board. A coil groove adapted to accommodate the drive coil is defined between two adjacent side corner portions. The side corner portions are integrally formed with the base, or the side corner portions are formed within the housing.

[0020] As a preferred embodiment, the side corner portion is formed within the housing, and at least a portion of the side corner portion is spaced apart from the inner wall of the housing to form a limiting groove suitable for accommodating the drive circuit board between the side corner portion and the inner wall of the housing. The limiting groove allows the drive circuit board to be clamped between the side corner portion and the inner wall of the housing.

[0021] As a preferred embodiment, the inner base and the outer base are spaced apart to form a clearance space between the inner base and the outer base, the clearance space being adapted to accommodate at least a portion of the movable component.

[0022] To achieve at least one of the above objectives, the technical solution adopted by the present invention is as follows: a camera module, comprising: an imaging driving device as described above; a photosensitive component, including a photosensitive chip for imaging, the photosensitive chip being electrically connected to the imaging circuit board of the imaging driving device; a movable component, being movably disposed on the base of the imaging driving device; and an optical lens, being carried on the movable component and being movably held on the photosensitive path of the photosensitive component.

[0023] As a preferred embodiment, the movable component includes a focusing carrier, which includes a main body and a guide portion extending along a first direction. The main body is used to carry the optical lens, and the guide portion is located at at least two corners of the main body to support the focusing carrier to move relative to the base along the first direction. The guide portion protrudes from the main body toward the imaging circuit board, such that at least a portion of the guide portion is accommodated within the clearance space of the base.

[0024] As a preferred embodiment, the movable component includes a focusing guide. The guiding portion has an inner guiding groove on one side facing the corner of the base, and an outer guiding groove on the side facing the guiding portion. The openings of the inner guiding groove and the outer guiding groove are arranged opposite to each other, such that the focusing guide is clamped between the groove wall of the inner guiding groove and the groove wall of the outer guiding groove.

[0025] As a preferred embodiment, the camera module further includes a driving magnet, which is disposed on the movable component. The driving magnet is disposed opposite to the driving coil of the imaging driving device along a second direction and / or a third direction to drive the movable component to move relative to the base.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The functional devices with electrical properties in the camera module are integrated into the imaging drive device, and the drive circuit components are integrated into the housing to form a drive module. Furthermore, the drive module and the imaging module can be assembled separately, and then the drive module is placed over the imaging module. The modular design not only facilitates assembly, but also facilitates the independent design, development and iterative updates of the drive module and the imaging module, which is beneficial to improving the scalability of the camera module.

[0027] (2) The drive control chip of the drive circuit assembly is placed on the imaging circuit board and the drive control chip is covered by the base, which helps to avoid damage to the drive control chip caused by the welding and disassembly of the imaging circuit board and the drive circuit board, thereby reducing the wear of the drive control chip. Attached Figure Description

[0028] Figure 1 This is a three-dimensional structural diagram of a camera module according to some embodiments of this application.

[0029] Figure 2A This is an exploded view of an imaging driving device according to some embodiments of this application.

[0030] Figure 2B This is an exploded view of an imaging drive device according to some other embodiments of this application.

[0031] Figure 3A This is a three-dimensional structural diagram of a driver module according to some embodiments of this application.

[0032] Figure 3B This is a perspective structural diagram of a driver module according to some other embodiments of this application.

[0033] Figure 4A This is an exploded view of a driver module according to some embodiments of this application.

[0034] Figure 4B This is an exploded view of a driver module according to other embodiments of this application.

[0035] Figure 5 This is a perspective structural diagram of the casing according to some embodiments of this application.

[0036] Figure 6A This is a three-dimensional structural diagram of an imaging module according to some embodiments of this application.

[0037] Figure 6B This is a three-dimensional structural diagram of an imaging module according to some other embodiments of this application.

[0038] Figure 7A-1 This is a cross-sectional view of a camera module according to some embodiments of this application.

[0039] Figure 7A-2 yes Figure 7A-1 Enlarged view of section A.

[0040] Figure 7B-1 This is a cross-sectional view of a camera module according to other embodiments of this application.

[0041] Figure 7B-2 yes Figure 7B-1 Enlarged view of section B.

[0042] Figure 8A-1 This is another cross-sectional view of a camera module according to some embodiments of this application.

[0043] Figure 8A-2 yes Figure 8A-1 Enlarged view of section C.

[0044] Figure 8B-1 This is another cross-sectional view of a camera module according to other embodiments of this application.

[0045] Figure 8B-2 yes Figure 8B-1 Enlarged view of section D.

[0046] Figure 9A This is a three-dimensional schematic diagram of movable components placed in an imaging module according to some embodiments of this application.

[0047] Figure 9B This is a three-dimensional schematic diagram of movable components placed in an imaging module according to other embodiments of this application.

[0048] Figure 10 This is a three-dimensional structural diagram of a focusing carrier according to some embodiments of this application.

[0049] Figure 11 This is a three-dimensional structural diagram of a stabilization carrier according to some embodiments of this application.

[0050] Figure 12 This is a perspective structural diagram of a stop assembly according to some embodiments of this application.

[0051] In the diagram: 1. Imaging drive device; 10. Base; 11. Outer base; 111. Bottom base; 1111. Outer top surface; 112. Side corner; 1121. Outer guide groove; 113. Coil groove; 114. Lower buffer; 12. Inner base; 121. Mounting part; 1211. Through hole; 122. Stepped part; 1221. Inner top surface; 13. Clearance space; 2. Imaging module; 20. Photosensitive component; 21. 22. Circuit board; 23. Photosensitive chip; 24. Electronic component; 25. Filter; 26. Support plate; 37. Drive module; 30. Housing; 31. Limiting groove; 32. Accommodating space; 40. Drive circuit assembly; 41. Drive circuit board; 411. First board; 412. Second board; 413. Third board; 414. Connecting part; 415. Conducting part; 42. Drive coil; 421. Focusing coil; 42 2. First image stabilization coil; 423. Second image stabilization coil; 43. Sensing device; 44. Reinforcing plate; 4. Camera module; 50. Movable component; 51. Focusing carrier; 511. Main body; 5111. Support surface; 5112. Focusing receiving groove; 5113. Open area; 512. Guide part; 5121. Inner guide groove; 5122. Lower end face; 52. Image stabilization carrier; 521. First image stabilization receiving groove; 52 2. Second image stabilization receiving slot; 523. Image stabilization guide slot; 60. Drive magnet; 61. Focusing magnet; 62. First image stabilization magnet; 63. Second image stabilization magnet; 71. Focusing guide component; 72. Image stabilization guide component; 81. Focusing plate; 82. Focusing magnetic guide component; 83. Image stabilization magnetic guide component; 90. Stop assembly; 91. Bracket; 92. Upper buffer component; 100. Optical lens; 101. Lens barrel; 102. Lens. Detailed Implementation

[0052] The present invention will now be further described in conjunction with specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0053] In the description of this invention, it should be noted that directional terms such as "center," "lateral," "longitudinal," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this invention.

[0054] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0055] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0056] This application provides a camera module 4, such as Figures 1 to 2B As shown, the camera module 4 includes an imaging drive device 1, a photosensitive component 20, a movable component 50, and an optical lens 100. The imaging drive device 1 is adapted to drive the movable component 50, which carries the optical lens 100, to move relative to the photosensitive component 20, thereby adjusting optical performance, such as AF and OIS functions. Furthermore, functional devices with electrical properties in the camera module 4 are integrated into the imaging drive device 1, allowing the functional devices to be lowered or repositioned, thus reducing the height of the camera module 4. Even further, the movable component 50 directly rests on the base 10 of the imaging drive device 1, thereby allowing the movable component 50 to be lowered or repositioned, further reducing the height of the camera module 4. In addition, the imaging and driving devices used in the imaging drive device 1 are modularly integrated with the structural components of the camera module 4, making the structure of the camera module 4 more compact.

[0057] Specifically, this application provides an imaging driving device 1, such as... Figure 2A and Figure 2BAs shown, the imaging driving device 1 integrates the functional devices with electrical properties of the camera module 4 and the photosensitive component 20 of the camera module 4. Specifically, the imaging driving device 1 includes a base 10, an imaging module 2, and a driving module 3. The base 10 is adapted to support the movable component 50. The imaging module 2 includes an imaging circuit board 21, which is electrically connected to the photosensitive chip 22 to convert the optical signals captured by the photosensitive chip 22 into electrical signals and process them.

[0058] The drive module 3 includes a housing 30 and a drive circuit assembly 40, such as Figures 3A to 4B As shown, the drive circuit assembly 40 is fixed to the inner wall of the housing 30. The drive circuit assembly 40 includes a drive circuit board 41 and a drive coil 42. The drive coil 42 is disposed on the drive circuit board 41, which is fixed to the inner wall of the housing 30. The drive coil 42 and the movable component 50 are disposed opposite each other along a second direction and / or along a third direction. Further, the drive circuit board 41 conducts electricity to the imaging circuit board 21 and the drive coil 42, thereby driving the movable component 50 to move relative to the base 10, thus realizing the AF function and the OIS function. Further still, as... Figure 2A and Figure 2B As shown, the drive module 3 has a receiving space 32, which allows the drive module 3 to be mounted on the light-incident side of the imaging module 2 along a first direction. That is, the movable component 50, the photosensitive chip 22, and at least a portion of the base 10 can be housed within the receiving space 32 of the drive module 3. Therefore, the housing 30 can protect the drive circuit assembly 40, the movable component 50, the photosensitive chip 22, and at least a portion of the base 10. Figures 3A to 4B As shown, the driving circuit assembly 40 is integrated into the housing 30 of the imaging driving device 1. This design makes the arrangement of the functional and structural components of the camera module 4 more concentrated, which is conducive to reducing the size of the camera module 4; and it can form a modular semi-finished product, which is convenient for assembly and production.

[0059] The first direction is parallel to the height direction of the imaging drive device 1, the second direction is parallel to the length direction of the imaging drive device 1, and the third direction is parallel to the width direction of the imaging drive device 1. The first direction, the second direction, and the third direction are orthogonal to each other.

[0060] It is understandable that in related technologies, the camera module base and the drive unit base need to be assembled separately, then the drive unit is assembled onto the camera module base, and finally a housing is placed on top to complete the assembly of the camera module. Not only is the assembly process complicated, but the design also needs to consider the compatibility between the camera module base, drive unit, and housing. Moreover, the drive coil, drive circuit board, etc., are exposed on the base of the drive unit, making them difficult to store and prone to aging and damage during storage.

[0061] In this embodiment, the driving circuit assembly 40 is integrated into the housing 30 to form the driving module 3. Furthermore, the driving module 3 and the imaging module 2 can be assembled separately, and finally, the driving module 3 is placed over the imaging module 2, connecting the driving circuit board 41 and the imaging circuit board 21. This not only facilitates assembly but also allows for independent design, development, and iterative updates of the driving module 3 and the imaging module 2, improving the scalability of the camera module 4. Moreover, the driving coil 42, driving circuit board 41, etc., are covered by the housing 30, facilitating storage and effectively preventing aging. It is worth noting that in related technologies, the movable component is supported on the base of the driving device, and further, the driving device is supported on the base of the camera module. The base of the camera module needs to support not only the movable component but also the base of the driving device. In this embodiment, the movable component 50 directly rests on the base 10, reducing the number of devices resting on the base 10 and thus alleviating the burden on the support area of ​​the base 10.

[0062] In addition, such as Figures 1 to 2B As shown, in this embodiment, the driving circuit board 41 connects the imaging circuit board 21 and the driving coil 42. That is, the driving circuit board 41 is directly connected to the imaging circuit board 21, thereby supplying power to the driving circuit board 41 and the driving coil 42 through the imaging circuit board 21. It should be understood that compared to using an insert injection molding process to connect the driving coil 42 and the imaging circuit board 21, the process of connecting the imaging circuit board 21 and the driving coil 42 through the driving circuit board 41 in this embodiment is more mature, which is beneficial for improving the yield of the imaging driving device 1 and reducing the production cost of the imaging driving device 1.

[0063] In some embodiments, such as Figure 6A and Figure 6B As shown, the base 10 includes an inner base 12, which is adapted to support the filter 24 so that the filter 24 is positioned on the photosensitive path of the photosensitive chip 22. The base 10 also includes an outer base 11 surrounding the inner base 12. The drive module 3 rests on the outer base 11; that is, the outer base 11 provides support and auxiliary positioning for the drive module 3. The movable component 50 is housed within the drive module 3 and the outer base 11. Wherein, as... Figures 7A-1 to 7B-1 As shown, the surface of the inner base 12 facing the light-incident side forms an inner top surface 1221. The lower end surface of the drive module 3 is lower than the inner top surface 1221 of the inner base 12, so that it sinks relative to the inner base 12, thereby reducing the size of the imaging drive device 1 along the first direction, which is beneficial to reducing the shoulder height of the camera module 4.

[0064] In at least one embodiment, such as Figure 7A-2 and Figure 7B-2As shown, the lower end face of the driving module 3 refers to the side of the driving circuit board 41 facing the imaging circuit board 21. That is, the driving circuit board 41, fixed to the inner wall of the housing 30, extends out of the housing 30 along the first direction, such that the distance between the driving circuit board 41 and the imaging circuit board 21 along the first direction is less than the distance between the housing 30 and the imaging circuit board 21. Furthermore, the side of the driving circuit board 41 facing the imaging circuit board 21 is lower than the inner top surface 1221 of the inner base 12, causing the driving circuit assembly 40 to sink relative to the base 10, thereby reducing the size of the imaging driving device 1 along the first direction. Even further, the housing 30 covers the outer periphery of the outer base 11, so that the side of the housing 30 facing the imaging circuit board 21 is also lower than the inner top surface 1221 of the inner base 12, further reducing the size of the imaging driving device 1 along the first direction, thereby lowering the shoulder height of the camera module 4.

[0065] It should be understood that in related technologies, the drive circuit board is supported on the base of the drive device, and the base of the drive device is further supported on the base of the camera module, making it difficult to achieve the sinking of the drive circuit board and drive coil relative to the base of the camera module. In this embodiment, the base 10 integrates the functions of the base of the camera module and the base of the drive device in related technologies, which is beneficial to achieve the sinking of the drive circuit assembly 40 relative to the inner base 12, further reducing the shoulder height of the camera module 4.

[0066] In some embodiments, such as Figures 3A to 4B As shown, the driving circuit board 41 includes at least two boards, each of which is attached to the inner wall of the housing 30. Specifically, each board is attached to a different side of the inner wall of the housing 30, such that each circuit board surrounds the outer side of the movable component 50. A driving coil 42 is provided on the side of the board facing the movable component 50, enabling the movable component 50 to move in a first direction and / or in a second direction and / or in a third direction. It is worth noting that the boards and the driving coils 42 on the boards are attached to different side of the inner wall of the housing 30, which facilitates the reasonable distribution of the driving coils 42, thereby reducing the size of the imaging driving device 1; it also helps to balance the overall weight of the driving module 3, and thus, when the driving module 3 is placed on the light-incident side of the imaging module 2, it can effectively prevent the driving module 3 from tilting due to its own weight eccentricity.

[0067] Furthermore, such as Figure 2A and Figure 2BAs shown, the driving circuit board 41 also includes a conductive portion 415, which is disposed on at least one edge of the board facing the imaging circuit board 21. The conductive portion 415 is adapted to conduct with the imaging circuit board 21, thereby connecting the driving circuit board 41 and the imaging circuit board 21. It should be understood that the direct soldering of the driving circuit board 41 and the imaging circuit board 21 facilitates the avoidance of additional flexible printed circuit boards for connecting the driving circuit board 41 and the imaging circuit board 21, reducing the space required for additional flexible printed circuit boards and contributing to the miniaturization of the camera module 4. Furthermore, during the design of the camera module 4, there is no need to consider the installation position and method of the flexible printed circuit board, thereby reducing the design difficulty and complexity of the camera module 4.

[0068] In at least one embodiment, the various plates are interconnected, including but not limited to being interconnected between adjacent plates via connecting strips or by welding. Further, one of the plates has a conductive portion 415 at its edge facing the imaging circuit board 21 to communicate with the imaging circuit board 21, thereby enabling the drive circuit board 41 to communicate with the imaging circuit board 21, simplifying the welding operation between the drive module 3 and the imaging module 2.

[0069] In at least one embodiment, each board has a conductive portion 415 at its edge facing the imaging circuit board 21, thereby allowing each board to be independently connected to the imaging circuit board 21. It should be understood that each board is located on a different side of the imaging circuit board 21 and is connected to that side. This helps to make the wiring on the imaging circuit board 21 more uniform, reducing the risk of short circuits, open circuits, and other defects during manufacturing; it also helps to reduce stress concentration points on the imaging circuit board 21, thereby improving the reliability of the imaging circuit board 21.

[0070] In some embodiments, such as Figure 4A and Figure 4B As shown, the drive circuit board 41 also includes a connecting part 414, which can be bent to connect and conduct between two adjacent boards. In other words, the connecting part 414 acts as a connecting strip, so that the boards are mechanically and electrically connected, so that each board of the drive circuit board 41 and the connecting part 414 are integrally formed.

[0071] It should be understood that the connecting part 414 is flexible and can be bent. Therefore, when the drive coil 42 is installed on the drive circuit board 41, the various boards can be arranged coplanarly, which facilitates the installation and conduction operation of the drive coil 42, thereby improving the assembly accuracy and assembly efficiency of the drive coil 42. Furthermore, when the drive circuit board 41 is installed on the inner wall of the housing 30, by bending the connecting part 414, the various boards can be fixed to the inner wall of the housing 30 with opposite surfaces, so that the drive circuit board 41 surrounds the outside of the movable component 50. In this way, the drive coil 42 can be located on the side of the board facing the movable component 50, so that it is arranged opposite to the movable component 50 in a second direction and / or opposite to a third direction.

[0072] In some embodiments, such as Figure 4A and Figure 4B As shown, at least two plates include a first plate 411, a second plate 412, and a third plate 413. When the drive circuit board 41 is attached to the inner wall of the housing 30, the surfaces of the first plate 411, the second plate 412, and the third plate 413 are all parallel to the first direction. The first plate 411 and the third plate 413 are arranged opposite each other along the third direction, and the second plate 412 is located between the first plate 411 and the third plate 413. When the drive module 3 is covered on the light-incident side of the imaging module 2 along the first direction, the first plate 411, the second plate 412, and the third plate 413 can surround the outside of the movable component 50. Furthermore, the drive coil 42 includes a focusing coil 421, a first image stabilization coil 422, and a second image stabilization coil 423. The focusing coil 421 is disposed on the surface of the first plate 411 facing the movable component 50, and is used to drive the movable component 50 of the camera module 4 to move relative to the base 10 in a first direction. The first image stabilization coil 422 is disposed on the surface of the second plate 412 facing the movable component 50, and is used to drive the movable component 50 of the camera module 4 to move relative to the base 10 in a second direction. The second image stabilization coil 423 is disposed on the surface of the third plate 413 facing the movable component 50, and is used to drive the movable component 50 of the camera module 4 to move relative to the base 10 in a third direction.

[0073] In some embodiments, the driving circuit assembly 40 further includes a driving control chip, which is disposed on the imaging circuit board 21 and is directly connected to the imaging circuit board 21. That is, the driving control chip, the photosensitive chip 22, and the electronic components 23 are all disposed on the imaging circuit board 21, thereby improving the integration of electronic devices, making the signal transmission path more concentrated, and also helping to reduce the impact of external electromagnetic interference on the driving control chip, thereby improving the reliability of the AF function and OIS function.

[0074] It is worth mentioning that by placing the drive control chip on the imaging circuit board 21, the impact of soldering errors or disassembly damage on the drive control chip is reduced during the soldering of the drive circuit board 41 to or from the imaging circuit board 21. In other words, the drive control chip, photosensitive chip 22, and electronic components 23 integrated on the imaging circuit board 21 can be protected to reduce wear and tear. It should be understood that the drive control chip in the drive circuit assembly 40 has a relatively high cost; reducing the wear and tear of the drive control chip can lower the production cost of the imaging drive device 1. Furthermore, when the AF and OIS functions of the imaging drive device 1 need to be upgraded, only the imaging circuit board 21 needs to be adjusted and updated, without adjusting the drive circuit board 41. This improves the scalability of the imaging drive device 1 and reduces its iteration cost.

[0075] Furthermore, the base 10 covers the drive control chip, which protects the drive control chip and helps to prevent the drive control chip from colliding with the movable component 50 or from being damaged by external impacts during assembly, thereby extending the service life of the drive control chip.

[0076] Notably, the drive control chip can also be mounted on the drive circuit board 41 and directly connected to it. This shortens the signal transmission path between the drive control chip and the drive coil 42, reducing signal interference and delay, thereby improving the speed, stability, and accuracy of drive control. Furthermore, the drive circuit board 41 is fixed to the inner wall of the housing 30. When the drive control chip is mounted on the drive circuit board 41, it facilitates heat dissipation through the housing 30, improving the heat dissipation efficiency and extending the chip's lifespan.

[0077] In some embodiments, such as Figures 5 to 6B As shown, the outer base 11 includes a base 111 formed on the imaging circuit board 21. The base 111 is disposed along the edge of the imaging circuit board 21 and is suitable for supporting the movable component 50, thereby assisting in positioning and supporting the movable component 50, which helps to avoid collision between the movable component 50 and the imaging circuit board 21. Furthermore, the outer base 11 also includes side corner portions 112 extending along the first direction. The side corner portions 112 are located at the corners of the imaging circuit board 21. The movable component 50 is placed in the area enclosed by each side corner portion 112 so that it can move within the area to realize the AF function and OIS function. Furthermore, a coil groove 113 is defined between two adjacent side corner portions 112. The coil groove 113 is suitable for accommodating the drive coil 42, thereby making the structure between the drive circuit assembly 40 and the base 10 more compact, which helps to reduce the size of the imaging drive device 1 along the second direction and the third direction.

[0078] Among them, such as Figure 6A As shown, the side corner portion 112 and the base 111 are integrally formed, thereby improving the connection strength and structural strength between the side corner portion 112 and the base 111. Furthermore, it allows for easier positioning and installation of the movable component 50 on the base 10. Alternatively, as... Figure 5 As shown, the side corner portion 112 is formed within the housing 30, making the structure between the side corner portion 112 and the housing 30 more compact. This helps to avoid additional mounting gaps between the housing 30 and the base 10, further reducing the dimensions of the imaging drive device 1 along the second and third directions. In other words, the side corner portion 112 of the base 10 of the camera module 4 is integrated onto the imaging circuit board 21 of the imaging module 2, or onto the housing 30 of the drive module 3. This allows for a more concentrated arrangement of structural components, making the structure of the camera module 4 more compact, thereby reducing the shoulder height of the camera module 4 and facilitating its thinning and lightening.

[0079] In some embodiments, such as Figure 5 As shown, the side corner portion 112 is formed inside the housing 30. At least a portion of the side corner portion 112 is spaced apart from the inner wall of the housing 30 along a second direction and / or along a third direction to form a limiting groove 31 between the side corner portion 112 and the inner wall of the housing 30. The limiting groove 31 is adapted to accommodate the drive circuit board 41, such that the drive circuit board 41 is clamped between the side corner portion 112 and the inner wall of the housing 30.

[0080] Specifically, when the various boards of the drive circuit board 41 are separately arranged, the limiting groove 31 is adapted to accommodate the ends of the boards, so that the ends of the boards are clamped between the side corner portions 112 and the inner wall of the outer casing 30, and the drive coil 42 disposed in the middle section of the boards can be accommodated in the coil groove 113 between the side corner portions 112. When the various boards of the drive circuit board 41 are connected and conductive through the connecting portion 414, that is, when the drive circuit board 41 is integrally formed, the limiting groove 31 is adapted to accommodate the connecting portion 414, or is adapted to accommodate the connecting portion 414 and the ends of the boards, so that the imaging circuit board 21 is clamped between the side corner portions 112 and the inner wall of the outer casing 30, and the drive coil 42 disposed in the middle section of the boards can be accommodated in the coil groove 113 between the side corner portions 112, such as Figure 3B As shown.

[0081] It should be understood that the side corner portion 112 is formed within the housing 30, making the structure between the side corner portion 112 of the base 10 and the housing 30 more compact. This helps to avoid additional installation gaps between the side corner portion 112 and the housing 30, thereby reducing the overall size of the imaging drive device 1. Furthermore, the limiting groove 31 formed between the side corner portion 112 and the housing 30 helps to limit the drive circuit board 41, improving the positional accuracy of the drive circuit board 41 installation and increasing the installation efficiency of the drive circuit board 41. Further, the drive circuit board 41 is clamped between the side corner portion 112 and the inner wall of the housing 30, improving the reliability of the connection between the drive circuit board 41 and the housing 30 and helping to prevent the drive circuit board 41 from detaching from the housing 30. It is worth noting that the drive circuit board 41 can also be attached to the inner wall of the housing 30, further improving the reliability of the connection between the drive circuit board 41 and the housing 30.

[0082] In some embodiments, such as Figures 8A-1 to 8B-2 As shown, the inner base 12 and the outer base 11 are spaced apart to form a clearance space 13 between the inner base 12 and the outer base 11. The clearance space 13 is adapted to accommodate at least a portion of the movable component 50. That is, during the movement of the movable component 50 along the first direction, especially when the movable component 50 moves to the lower end of the focusing stroke along the first direction, at least a portion of the movable component 50 extends into the clearance space 13 along the first direction, so as to be located between the bases 111 of the inner base 12 and the outer base 11. This makes the structure of the camera module 4 more compact, which is beneficial to reducing the shoulder height of the camera module 4. It can also increase the focusing stroke of the movable component 50 while maintaining a low shoulder height of the camera module 4, thereby improving the AF function of the camera module 4.

[0083] In some embodiments, such as Figure 8A-2 and Figure 8B-2As shown, the inner base 12 includes a mounting portion 121 and a stepped portion 122. The mounting portion 121 is formed on the imaging circuit board 21 and is used to support the filter 24. Further, the mounting portion 121 has a through hole 1211, which is adapted to expose the photosensitive area of ​​the photosensitive chip 22, so that the photosensitive areas of the filter 24 and the photosensitive chip 22 are positioned opposite each other along a first direction. Notably, the mounting portion 121 covers the electronic components 23, the drive control chip, and the edge of the photosensitive chip 22 mounted on the imaging circuit board 21, thereby protecting the electronic components 23 and the drive control chip, and also assisting in limiting the position of the photosensitive chip 22. The step portion 122 is provided protrudingly on the surface of the mounting portion 121 facing the light-incident side along the first direction. The step portion 122 surrounds the outer periphery of the filter 24. Furthermore, along the first direction, the upper surface of the step portion 122 is higher than the upper surface of the filter 24. Thus, the step portion 122 can protect the filter 24 and help avoid collision between the movable component 50 and the filter 24 during the movement along the first direction.

[0084] In some embodiments, such as Figures 6A to 7B-2 As shown, the surface of the inner base 12 facing the light-incident side forms an inner top surface 1221, that is, the upper surface of the step portion 122 forms an inner top surface 1221; the surface of the base 111 facing the light-incident side forms an outer top surface 1111, which supports the movable component 50. That is, when the movable component 50 moves along the first direction to the lowest point of the focusing stroke, the outer top surface 1111 and the movable component 50 abut against each other, thereby assisting in positioning and supporting the movable component 50, which helps to avoid collisions between the movable component 50 and the imaging circuit board 21 or the inner base 12; at the same time, at least a portion of the movable component 50 is located within the clearance space 13, thereby making the structure between the movable component 50 and the imaging module 2 more compact. In at least one embodiment, along the first direction, the outer top surface 1111 is lower than the inner top surface 1221, which helps to further realize the sinking or downward displacement of the movable component 50, reducing the shoulder height of the camera module 4.

[0085] In some embodiments, such as Figures 3A to 4B As shown, the drive circuit assembly 40 also includes a sensing device 43, which is used to sense the position of the optical lens 100 in order to realize closed-loop control of the movable component 50, thereby improving the reliability of the AF and OIS functions of the camera module 4. Specifically, the sensing device 43 is electrically connected to the drive circuit board 41. When the drive module 3 is covered on the light-incident side of the imaging module 2, the sensing device 43 is located on the side of the drive circuit board 41 facing the movable component 50, so that the sensing device 43 and the movable component 50 are arranged opposite each other along a second direction and / or along a third direction.

[0086] In at least one embodiment, the sensing device 43 is located inside the driving coil 42, making the arrangement of the driving coil 42 and the sensing device 43 on the driving circuit board 41 more compact, thereby reducing the area of ​​the driving circuit board 41 and facilitating a further reduction in the size of the camera module 4. In at least one other embodiment, the sensing device 43 is located outside the driving coil 42, thereby reducing the magnetic interference of the driving coil 42 on the sensing device 43, making the detection results of the sensing device 43 more accurate, and improving the accuracy of the position control of the optical lens 100 by the camera module 4.

[0087] In some embodiments, such as Figures 3A to 4B As shown, the imaging drive device 1 also includes a reinforcing plate 44, which is disposed on the surface of each plate opposite to the drive coil 42 to support each plate, improve the structural strength and flatness of the plate. It should be understood that the reinforcing plate 44, located on the side of the plate opposite to the drive coil 42, also helps to resist external impacts, protecting the plate, drive coil 42, and even the base 10 and movable components 50. It is worth noting that when the reinforcing plate 44 is fixed to the inner wall of the outer casing 30, it can also improve the structural strength of the outer casing 30 and reduce the risk of damage to the outer casing 30 under external impact. The reinforcing plate 44 includes, but is not limited to, metal plates such as steel plates and copper plates, as well as plastic plates; this application does not specifically limit its use.

[0088] In at least one embodiment, the reinforcing plate 44 is implemented as a metal plate, and thus the reinforcing plate 44 also functions as a magnetic yoke. Specifically, the reinforcing plate 44 is located on the side of the driving coil 42 opposite to the driving magnet 60 of the camera module 4, which can constrain the magnetic field of the driving magnet 60, reduce the diffusion of the magnetic field of the driving magnet 60 outward from the camera module 4, thereby improving the utilization efficiency of the magnetic field, enhancing the driving force of the imaging driving device 1 and improving the driving stability. In addition, it can reduce the electromagnetic interference of the magnetic field of the driving magnet 60 to external circuits and improve the stability of the electronic equipment on which the camera module 4 is installed.

[0089] A camera module 4, such as Figures 1 to 2B ,as well as Figures 7A-1 to 12As shown, the device includes: the aforementioned imaging drive device 1, photosensitive component 20, movable component 50, and optical lens 100. The photosensitive component 20 includes a photosensitive chip 22, which is electrically connected to the imaging circuit board 21 of the imaging drive device 1 for imaging. The movable component 50 is movably disposed on the base 10 of the imaging drive device 1. The optical lens 100 is supported by the movable component 50 and movably held in the photosensitive path of the photosensitive component 20 to collect external imaging light. The optical lens 100 defines an optical axis O. Specifically, the movable component 50 is adapted to support the optical lens 100 and drive the optical lens 100 to move along a first direction to achieve AF function, and along a second direction and / or a third direction to achieve OIS function.

[0090] In some embodiments, such as Figure 1 As shown, the optical lens 100 includes a lens barrel 101 and at least one lens 102 mounted within the lens barrel 101. In at least one embodiment, the lens barrel 101 is integrally formed with the image stabilization carrier 52 of the imaging drive device 1, thereby improving the structural strength of the lens barrel 101 and the connection strength and reliability between the lens barrel 101 and the image stabilization carrier 52.

[0091] In some embodiments, such as Figure 2A and Figure 2B As shown, the camera module 4 also includes a driving magnet 60, which is disposed on the movable component 50. The driving magnet 60 is disposed opposite to the driving coil 42 of the imaging driving device 1 along a second direction and / or along a third direction, thereby driving the movable component 50 to move relative to the base 10 by the Lorentz force between the driving coil 42 and the driving magnet 60.

[0092] It should be understood that, compared to the driving magnet 60 and driving coil 42 being arranged opposite each other along a first direction, in this embodiment, the driving magnet 60 and driving coil 42 are arranged opposite each other along a second direction and / or a third direction. This helps to avoid the stacking of the driving magnet 60 and driving coil 42 in the first direction, thereby reducing the shoulder height of the camera module 4 and aligning with the trend towards thinner and lighter electronic devices. Furthermore, compared to the driving coil 42 being disposed on the movable component 50 and the driving magnet 60 being disposed on the base 10 or the housing 30, in this embodiment, the driving magnet 60 is disposed on the movable component 50 and the driving coil 42 is disposed on the housing 30. This reduces the electromagnetic interference of the camera module 4 to external circuits and improves the stability of the electronic device on which the camera module 4 is installed.

[0093] In some embodiments, such as Figure 2A and Figure 2BAs shown, the movable component 50 includes an image stabilization carrier 52 and a focusing carrier 51. The image stabilization carrier 52 supports the optical lens 100, and the focusing carrier 51 is stacked between the image stabilization carrier 52 and the base 10 along a first direction. Specifically, the image stabilization carrier 52 and the optical lens 100 move together relative to the focusing carrier 51 along a second direction and / or a third direction to achieve the OIS function; the focusing carrier 51, together with the image stabilization carrier 52 and the optical lens 100, moves relative to the base 10 along the first direction to achieve the AF function. It is worth mentioning that the focusing carrier 51 being stacked between the image stabilization carrier 52 and the base 10 along the first direction allows the camera module 4 to have both a low shoulder height and good focusing performance.

[0094] In some embodiments, such as Figure 10 As shown, the focusing carrier 51 includes a main body 511, which carries the image stabilization carrier 52 and the optical lens 100, allowing the image stabilization carrier 52, the optical lens 100, and the focusing carrier 51 to move together relative to the base 10 along a first direction. A support surface 5111 is formed on the side of the main body 511 facing the image sensor 22. When the focusing carrier 51 moves along the first direction to the lowest point of the focusing stroke, the support surface 5111 abuts against the outer top surface 1111 of the base 111 of the outer base 11. This allows the base 111 to assist in positioning and supporting the focusing carrier 51, helping to prevent collisions between the focusing carrier 51 and the imaging circuit board 21 or the inner base 12.

[0095] Furthermore, such as Figure 10 As shown, the focusing carrier 51 also includes a guide portion 512, which is located at at least two corners of the main body 511. The guide portion 512 extends along a first direction to support the focusing carrier 51 to move relative to the base 10 in the first direction. The guide portion 512 protrudes from the main body 511 toward the imaging circuit board 21, such that at least a portion of the guide portion 512 is accommodated in the clearance space 13 between the base 111 of the outer base 11 and the inner base 12. It should be understood that the guide portion 512 has a lower end surface 5122 on the side facing the imaging circuit board 21. During the movement of the movable component 50 along the first direction, especially when the bearing surface 5111 of the main body 511 abuts against the outer top surface 1111 of the base 111, the lower end surface 5122 is lower than the outer top surface 1111 and the inner top surface 1221 of the inner base 12 along the first direction. This makes the structure between the movable component 50 and the imaging module 2 more compact, allowing the movable component 50 to sink or move downwards, reducing the shoulder height of the camera module 4. Figure 8A-2 and Figure 8B-2 As shown.

[0096] In some embodiments, such as Figures 8A-1 to 8B-2 ,as well as Figure 10As shown, the movable component 50 includes a focusing guide 71. An inner guide groove 5121 is formed on the side of the guide portion 512 facing the side corner 112 of the base 10, and an outer guide groove 1121 is formed on the side of the side corner 112 facing the guide portion 512. The openings of the inner guide groove 5121 and the outer guide groove 1121 are arranged opposite each other along a second direction or a third direction, so that the focusing guide 71 is clamped between the groove walls of the inner guide groove 5121 and the outer guide groove 1121. This allows the focusing guide 71 to support the focusing carrier 51 to move relative to the base 10 in a first direction, thereby achieving the AF function. It should be understood that the focusing guide 71 reduces the frictional force when the focusing carrier 51 and the base 10 move relative to each other, thereby reducing the driving force required to drive the focusing carrier 51, which is beneficial for improving the flexibility and stability of the focusing carrier 51's movement. The focusing guide 71 includes, but is not limited to, balls, rollers, guide rods, etc., and this application does not impose specific limitations on it.

[0097] It should be understood that the guide portion 512 protrudes from the main body portion 511 toward the imaging circuit board 21, which can increase the size of the guide portion 512 along the first direction. During the movement of the focusing carrier 51 relative to the base 10 along the first direction, it is beneficial to prevent the focusing guide 71, such as the ball, from disengaging from the inner guide groove 5121 and the outer guide groove 1121, thereby improving the reliability of the camera module 4.

[0098] In at least one embodiment, such as Figure 10 As shown, the focusing carrier 51 includes two guide portions 512, and the two guide portions 512 are located at two adjacent corners of the main body 511, that is, the two guide portions 512 are located on the same side of the main body 511. Specifically, the two guide portions 512 are respectively provided with inner guide grooves 5121 on the same side facing the base 10, that is, the opening direction of the inner guide grooves 5121 on the two guide portions 512 is the same. Further, two side corner portions 112 of the base 10 are respectively provided with outer guide grooves 1121, so that the inner guide grooves 5121 and the outer guide grooves 1121 are arranged in a one-to-one correspondence. A focusing guide member 71 is respectively provided between the two sets of inner guide grooves 5121 and outer guide grooves 1121 to support the focusing carrier 51 to move relative to the base 10 in a first direction. It should be understood that the two guide parts 512 are located at two adjacent corners of the main body 511, and the two sets of focusing guides 71 are clamped between the focusing carrier 51 and the base 10 along the second direction or the third direction. This can reduce the rotation or tilting phenomenon that may occur during the movement of the focusing carrier 51, thereby improving the stability of the focusing drive; in addition, it can also reduce frictional resistance and improve the speed and sensitivity of the focusing drive; furthermore, it can make the structure of the camera module 4 more compact and realize the miniaturization of the camera module 4.

[0099] In at least one embodiment, the focusing carrier 51 includes two guide portions 512, which are located at two diagonally opposite corners of the main body 511. Specifically, the two guide portions 512 are located diagonally opposite each other on opposite sides of the main body 511. In other words, the inner guide grooves 5121 on the two guide portions 512 facing away from the base 10 are respectively provided, meaning the opening directions of the inner guide grooves 5121 on the two guide portions 512 are opposite. Further, outer guide grooves 1121 are respectively provided on two side corner portions 112 of the base 10, so that the inner guide grooves 5121 and the outer guide grooves 1121 are arranged in a one-to-one correspondence. A focusing guide 71 is respectively provided between the two sets of inner guide grooves 5121 and outer guide grooves 1121 to support the focusing carrier 51 to move relative to the base 10 in a first direction. It should be understood that the two guide parts 512 are located at two diagonally opposite corners of the main body 511, and the two sets of focusing guides 71 are clamped between the diagonal carrier and the base 10 along the second direction or the third direction. This can improve the symmetry of the distribution of the focusing guides 71, so that the focusing carrier 51 can maintain balance during movement, thereby improving the stability and reliability of the focusing drive.

[0100] In some embodiments, such as Figures 8A-1 to 8B-2 As shown, the movable component 50 also includes a plurality of image stabilization guides 72, which are pressed between the image stabilization carrier 52 and the focusing carrier 51 along a first direction to support the movement of the image stabilization carrier 52 relative to the focusing carrier 51 along a second direction and / or a third direction to achieve the OIS function. It should be understood that the image stabilization guides 72 can reduce the frictional force when the image stabilization carrier 52 and the focusing carrier 51 move relative to each other, thereby reducing the driving force required to drive the image stabilization carrier 52, which is beneficial to improving the flexibility and stability of the movement of the image stabilization carrier 52.

[0101] Furthermore, such as Figures 8A-1 to 8B-2 As shown, the bottom surface of the image stabilization carrier 52 has an image stabilization guide groove 523, which is used to accommodate the image stabilization guide 72 and limit its position, thus preventing the image stabilization guide 72 from detaching from the image stabilization carrier 52. Furthermore, by providing the image stabilization guide groove 523, the structure between the image stabilization carrier 52, the image stabilization guide 72, and the focusing carrier 51 can be made more compact, thereby reducing the shoulder height of the camera module 4. The image stabilization guide 72 includes, but is not limited to, ball bearings, rollers, etc., and this application does not impose specific limitations on it.

[0102] In some embodiments, such as Figure 2A , Figure 2B and Figure 10As shown, the driving magnet 60 includes a focusing magnet 61. Specifically, a focusing receiving groove 5112 is provided on one side of the main body 511 of the focusing carrier 51, which is opposite to the base 10 along a third direction. The focusing receiving groove 5112 is adapted to accommodate the focusing magnet 61, so that the focusing magnet 61 and the focusing coil 421 accommodated in the coil groove 113 are arranged opposite each other along a third direction, thereby driving the movable component 50 to move relative to the base 10 in a first direction.

[0103] Furthermore, such as Figure 2A , Figure 2B and Figure 11 As shown, the driving magnet 60 also includes a first image stabilizing magnet 62 and a second image stabilizing magnet 63. Specifically, a first image stabilizing receiving groove 521 is formed on one side of the image stabilizing carrier 52 opposite to the base 10 along the second direction. The first image stabilizing receiving groove 521 is adapted to accommodate the first image stabilizing magnet 62, such that the first image stabilizing magnet 62 and the first image stabilizing coil 422 housed in the coil groove 113 are arranged opposite each other along the second direction, thereby driving the image stabilizing carrier 52 to move relative to the focusing carrier 51 and the base 10 along the second direction. A second image stabilizing receiving groove 522 is formed on one side of the image stabilizing carrier 52 opposite to the base 10 along the third direction. The second image stabilizing receiving groove 522 is adapted to accommodate the second image stabilizing magnet 63, such that the second image stabilizing magnet 63 and the second image stabilizing coil 423 housed in the coil groove 113 are arranged opposite each other along the third direction, thereby driving the image stabilizing carrier 52 to move relative to the focusing carrier 51 and the base 10 along the third direction. It should be understood that the second image stabilization receiving slot 522 and the focus receiving slot 5112 are located on opposite sides of the movable component 50 along a third direction, which helps to avoid interference between the second image stabilization magnet 63 and the focus magnet 61.

[0104] In some embodiments, such as Figure 10 As shown, an open area 5113 is provided on the side of the main body 511 of the focusing carrier 51 opposite to the first image stabilizing magnet 62 and on the side opposite to the second image stabilizing magnet. The open area 5113 allows the first image stabilizing magnet 62 and the second image stabilizing magnet 63 on the image stabilizing carrier 52 to be exposed to the focusing carrier 51. This helps to prevent the focusing carrier 51 from being blocked between the first image stabilizing coil 422 and the first image stabilizing magnet 62, and also helps to prevent the focusing carrier 51 from being blocked between the second image stabilizing coil 423 and the second image stabilizing magnet 63. This, in turn, helps to enhance the Lorentz force between the first image stabilizing coil 422 and the first image stabilizing magnet 62, and between the second image stabilizing coil 423 and the second image stabilizing magnet 63, thereby improving the driving force and stability of the image stabilization drive of the camera module 4.

[0105] In some embodiments, such as Figure 10As shown, the camera module 4 also includes a focusing magnetic guide 82, which is disposed on the groove wall of the focusing receiving groove 5112, located on the side of the focusing magnet 61 opposite to the focusing coil 421. It should be understood that the focusing magnetic guide 82 can constrain the magnetic field of the focusing magnet 61, reducing the diffusion of the magnetic field of the focusing magnet 61 towards the optical lens 100, thereby improving the utilization efficiency of the magnetic field and further improving the driving force and stability of the focusing drive of the camera module 4. In at least one embodiment, the focusing magnetic guide 82 is embedded within the focusing carrier 51 to improve the connection strength and reliability between the focusing magnetic guide 82 and the focusing carrier 51.

[0106] Furthermore, such as Figure 10 As shown, the camera module 4 also includes a focusing plate 81, which is disposed on the bottom surface of the main body 511 of the focusing carrier 51. This improves the structural strength and flatness of the bottom surface of the main body 511, allowing the focusing carrier 51 to more stably and reliably support the image stabilization carrier 52 and the optical lens 100. In at least one embodiment, the focusing plate 81 is embedded in the bottom surface of the main body 511, which helps to improve the connection strength and reliability between the focusing plate 81 and the main body 511.

[0107] In some embodiments, such as Figure 11 As shown, the camera module 4 also includes a stabilizing magnetic guide component 83. The stabilizing magnetic guide component 83 is disposed on the groove walls of the first stabilizing receiving groove 521 and the second stabilizing receiving groove 522, located on the side of the first stabilizing magnet 62 opposite to the first stabilizing coil 422, and on the side of the second stabilizing magnet 63 opposite to the second stabilizing coil 423. It should be understood that the stabilizing magnetic guide component 83 can constrain the magnetic fields of the first and second stabilizing magnets 62 and 63, reducing the diffusion of the magnetic field towards the optical lens 100, thereby improving the utilization efficiency of the magnetic field and further improving the driving force and stability of the stabilization drive of the camera module 4. In at least one embodiment, the stabilizing magnetic guide component 83 is embedded within the stabilizing carrier 52 to improve the connection strength and reliability between the stabilizing magnetic guide component 83 and the stabilizing carrier 52.

[0108] In some embodiments, such as Figure 8A-2 and Figure 8B-2 As shown, the photosensitive assembly 20 also includes a support plate 25, which is fixed to the side of the imaging circuit board 21 facing away from the base 10 to support the imaging circuit board 21 and improve the structural strength of the bottom of the imaging drive device 1. It is worth mentioning that the support plate 25 includes, but is not limited to, metal plates such as steel plates and copper plates, as well as plastic plates; this application does not impose specific limitations on these materials.

[0109] In some embodiments, such as Figures 8A-1 to 8B-2As shown, the photosensitive assembly 20 also includes a filter 24, which is mounted on the mounting portion 121 of the inner base 12 and thus held in the photosensitive path of the photosensitive chip 22. The filter 24 is used to filter the incident light entering the photosensitive chip 22 to filter out stray light that is not needed for imaging, such as infrared light.

[0110] In some embodiments, such as Figure 8A-2 and Figure 8B-2 As shown, the photosensitive assembly 20 also includes several electronic components 23 electrically connected to the imaging circuit board 21. It should be understood that the multiple electronic components 23 include, but are not limited to, passive electronic devices such as resistors and capacitors and / or driver chips, memory chips, etc., and this application does not impose specific limitations on them.

[0111] In some embodiments, such as Figure 9A and Figure 9B As shown, the camera module 4 also includes a stop assembly 90, which is disposed on the focusing carrier 51. At least a portion of the stop assembly 90 is disposed opposite to the image stabilization carrier 52 along a first direction. The image stabilization carrier 52 is held between the stop assembly 90 and the focusing component along the first direction, which helps to prevent the image stabilization carrier 52 from separating from the focusing carrier 51 due to mechanical vibration, external impact, or inertia caused by movement along the first direction, thereby improving the reliability of the image stabilization guide 72 pressed between the image stabilization carrier 52 and the focusing carrier 51.

[0112] In some embodiments, such as Figure 12 As shown, the stop assembly 90 includes a bracket 91 and a plurality of upper buffers 92. The bracket 91 is mounted on the focusing carrier 51, at least a portion of which is located on the top surface of the focusing carrier 51 and bends and extends in a plane perpendicular to a first direction to hold the image stabilization carrier 52 between the bracket 91 and the focusing carrier 51. The plurality of upper buffers 92 are spaced apart on the bracket 91, at least a portion of which protrudes from the bracket 91 toward the image stabilization carrier 52 along the first direction to be located between the bracket 91 and the image stabilization carrier 52. This helps to avoid hard collisions between the image stabilization carrier 52 and the bracket 91, thereby protecting the image stabilization carrier 52, reducing the risk of damage to the image stabilization carrier 52, and reducing noise caused by collisions. At least another portion of the upper buffer 92 protrudes from the bracket 91 toward the housing 30 along the first direction, so as to be located between the bracket 91 and the housing 30. This helps to avoid hard collision between the focusing carrier 51 and the housing 30, thereby protecting the focusing carrier 51 and the housing 30, reducing the risk of damage to the focusing carrier 51, reducing noise caused by the collision, and extending the service life of the camera module 4.

[0113] In some embodiments, such as Figure 7A-2 and Figure 7B-2As shown, the camera module 4 also includes a lower buffer 114, which is disposed on the base 111 of the outer base 11, and at least a portion of the lower buffer 114 protrudes from the outer top surface 1111 of the base 111, so as to be located between the base 111 and the bearing surface 5111 of the focusing carrier 51. This helps to avoid hard collisions between the focusing carrier 51 and the outer base 11, thereby protecting the focusing carrier 51, reducing the risk of damage to the focusing carrier 51, and reducing noise caused by collisions.

[0114] An assembly method for assembling the aforementioned camera module 4 includes the following steps: S1. Provide an imaging module 2 and a movable component 50, and install the movable component 50 on the base 10 of the imaging module 2; S2. Provide an optical lens 100 and install the optical lens 100 on the movable component 50. The optical lens 100 is energized through an external coil semi-finished fixture and the photosensitive component 20 of the imaging module 2 to assist in the calibration and installation of the optical lens 100. S3. A drive module 3 is provided. The drive module 3 includes a housing 30 and a drive circuit assembly 40 fixed to the housing 30. The drive module 3 is covered on the light-incident side of the imaging module 2, and the drive circuit board 41 of the drive circuit assembly 40 is connected to the imaging circuit board 21 of the imaging module 2.

[0115] Specifically, in step S2, by energizing the external coil semi-finished fixture, the coil on the coil semi-finished fixture interacts with the driving magnet 60 on the movable component 50. In other words, the external coil semi-finished fixture replaces the driving module 3, thereby driving the movable component 50 to move relative to the base 10. Furthermore, by energizing the photosensitive component 20, the imaging quality of the photosensitive chip 22 can be directly observed. Based on the imaging quality of the photosensitive chip 22, the position of the optical lens 100 can be calibrated to improve the yield of the camera module 4.

[0116] It is understandable that using an external coil semi-finished fixture instead of the drive module 3 helps to avoid damage to the drive circuit assembly 40 of the drive module 3 during the installation of the optical lens 100, thereby reducing the wear and tear on the drive circuit assembly 40 or the drive module 3 and lowering the production cost of the camera module 4. Furthermore, using an external coil semi-finished fixture instead of the drive module 3 also helps to avoid interference from the housing 30 of the drive module 3 on the installation operation of the optical lens 100, thereby improving the ease of installation and adjustment of the optical lens 100, reducing operational difficulty, and increasing assembly efficiency.

[0117] It is worth mentioning that the imaging module 2 and the driving module 3 can be assembled independently to form a modular semi-finished product. After the movable component 50 and the optical lens 100 are installed on the imaging module 2, the driving module 3 is finally placed on the imaging module 2, and the driving circuit board 41 and the imaging circuit board 21 are connected to complete the assembly of the camera module 4, which helps to improve the assembly efficiency of the camera module 4.

[0118] In some embodiments, the coil semi-finished fixture in step S2 contains a control chip, which is used to input drive information during the calibration process in step S2. Further, after the calibration and installation of the optical lens 100 is completed, the information in the control chip is input into the drive control chip of the camera module 4, so that the drive information in the drive control chip is adapted to the camera module 4, thereby improving the accuracy of the AF and OIS functions of the camera module 4.

[0119] The basic principles, main features, and advantages of this invention have been described above. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made without departing from the spirit and scope of the invention, and all such changes and modifications fall within the scope of the invention as claimed. The scope of protection claimed by this invention is defined by the appended claims and their equivalents.

Claims

1. An imaging driving device, characterized in that, include: An imaging module includes a base and an imaging circuit board, wherein the base is formed on the imaging circuit board and is adapted to support movable components; the imaging circuit board is used for electrical connection with a photosensitive chip. as well as, A drive module includes a housing and a drive circuit assembly. The drive circuit assembly includes a drive circuit board and a drive coil. The drive circuit board is fixed to the inner wall of the housing. The drive coil is disposed on the drive circuit board. The drive circuit board conducts electricity to the imaging circuit board and the drive coil. The drive coil is disposed opposite to the movable component along a second direction and / or a third direction to drive the movable component to move. The imaging module and the driving module are assembled separately. The driving module is provided with a receiving space, which allows the driving module to cover the imaging module along a first direction. The first direction is parallel to the height direction of the imaging driving device, the second direction is parallel to the length direction of the imaging driving device, and the third direction is parallel to the width direction of the imaging driving device.

2. The imaging driving device according to claim 1, characterized in that, The drive circuit board includes a conductive portion and at least two plates, each of which is attached to the inner wall of the housing. The conductive portion is disposed on the edge of at least one of the plates facing the imaging circuit board, and the conductive portion is adapted to conduct electricity between the drive circuit board and the imaging circuit board.

3. The imaging driving device according to claim 2, characterized in that, The drive circuit board also includes a connecting portion, which can be bent to connect and conduct electricity between two adjacent boards, so that each board of the drive circuit board and the connecting portion are integrally formed.

4. The imaging driving device according to claim 2, characterized in that, At least two of the plates include a first plate, a second plate, and a third plate. When the drive module is covered on the light-incident side of the imaging module, the first plate, the second plate, and the third plate surround the outside of the movable component. The drive coil includes a focusing coil, a first image stabilization coil, and a second image stabilization coil, wherein the focusing coil is disposed on the first plate, the first image stabilization coil is disposed on the second plate, and the second image stabilization coil is disposed on the third plate.

5. The imaging driving device according to any one of claims 1-4, characterized in that, The drive circuit assembly also includes a sensing device electrically connected to the drive circuit board on the side facing the movable component, the sensing device being used to sense the position of the optical lens.

6. The imaging driving device according to any one of claims 1-4, characterized in that, The driving circuit assembly further includes a driving control chip, which is electrically connected to the imaging circuit board, and the base covers the driving control chip.

7. The imaging driving device according to any one of claims 2-4, characterized in that, The imaging driving device further includes a reinforcing plate disposed on the surface of each plate body opposite to the driving coil, to support each plate body.

8. The imaging driving device according to any one of claims 1-4, characterized in that, The base includes an inner base and an outer base surrounding the inner base. The drive module rests on the outer base, and the inner base is adapted to support the filter. The lower end surface of the drive module is lower than the inner top surface of the inner base, so as to sink relative to the inner base.

9. The imaging driving device according to claim 8, characterized in that, The outer base includes a base and side corner portions. The base is disposed along the edge of the imaging circuit board and is suitable for supporting movable components. The side corner portions extend in a first direction and are located at the corners of the imaging circuit board. A coil groove suitable for accommodating the drive coil is defined between two adjacent side corner portions. The side corner portions are integrally formed with the base, or the side corner portions are formed inside the outer shell.

10. The imaging driving device according to claim 9, characterized in that, The side corner portion is formed inside the housing, and at least a portion of the side corner portion is spaced apart from the inner wall of the housing to form a limiting groove suitable for accommodating the drive circuit board between the side corner portion and the inner wall of the housing. The limiting groove allows the drive circuit board to be clamped between the side corner portion and the inner wall of the housing.

11. The imaging driving device according to claim 9, characterized in that, The inner base and the outer base are spaced apart to form a clearance space between the inner base and the outer base, the clearance space being adapted to accommodate at least a portion of the movable component.

12. A camera module, characterized in that, include: The imaging driving device as described in any one of claims 1-11; A photosensitive component includes a photosensitive chip for imaging, the photosensitive chip being electrically disposed on the imaging circuit board of the imaging driving device; A movable component is movably disposed on the base of the imaging drive device; An optical lens is mounted on the movable component and can be movably held in the light-sensing path of the photosensitive component.

13. The camera module according to claim 12, characterized in that, The movable component includes a focusing carrier, which includes a main body and a guide portion extending along a first direction. The main body is used to carry the optical lens, and the guide portion is located at at least two corners of the main body to support the focusing carrier to move relative to the base along the first direction. The guide portion protrudes from the main body toward the imaging circuit board, such that at least a portion of the guide portion is accommodated within the clearance space of the base.

14. The camera module according to claim 13, characterized in that, The movable component includes a focusing guide. An inner guide groove is provided on the side of the guide portion facing the side corner of the base, and an outer guide groove is provided on the side of the side corner facing the guide portion. The openings of the inner guide groove and the outer guide groove are arranged opposite to each other, so that the focusing guide is clamped between the groove wall of the inner guide groove and the groove wall of the outer guide groove.

15. The camera module according to claim 12, characterized in that, The camera module also includes a driving magnet, which is disposed on the movable component. The driving magnet and the driving coil of the imaging driving device are disposed opposite each other along a second direction and / or a third direction to drive the movable component to move relative to the base.

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