A film layer structure and an electronic device

Abstract

The application provides a film layer structure and an electronic device, and relates to the technical field of electronic devices. The film layer structure is used to solve the problem that the sound generating device of the electronic device causes vibration of the electronic device during sound generation, the vibration is transmitted to the palm of a user, and the use experience of the user is reduced. The film layer structure comprises a plurality of gel film layers and at least one conductive layer which are arranged in layers. Each of the adjacent two gel film layers is provided with one conductive layer, and the at least one conductive layer forms a reticular structure. The film layer structure provided by the application is applied to the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a film structure and an electronic device. Background Technology

[0002] Electronic devices are indispensable products in daily life, such as mobile phones and tablets. These devices contain sound-producing components to play audio. However, the sound-producing process causes vibrations in the device, which, when transmitted to the user's hand, can degrade the user experience. Summary of the Invention

[0003] This application provides a membrane structure and an electronic device to solve the problem that the sound-generating device of an electronic device will cause the electronic device to vibrate during the sound generation process, and the vibration will be transmitted to the user's palm, reducing the user experience.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, a membrane structure is provided, which includes a plurality of gel membrane layers stacked together and at least one conductive layer, wherein a conductive layer is disposed between each pair of adjacent gel membrane layers, and the at least one conductive layer forms a mesh structure.

[0006] The membrane structure provided in the first aspect of this application allows the membrane structure to vibrate when the sound-generating device of an electronic device is in operation. This vibration excites the membrane structure to vibrate, causing the gel membrane to deform and fill the mesh pores within the conductive layer of the mesh structure. Through continuous stretching and compression of the gel membrane, the vibration energy generated by the sound-generating device is absorbed, thereby playing a vibration isolation role. This reduces the risk of vibration being transmitted to the back cover or display module of the electronic device, and further to the user's hand, thus improving the user experience.

[0007] In one possible implementation of the first aspect of this application, the material of the gel membrane layer includes polyvinyl chloride and a plasticizer. In this structure, the plasticizer can enhance the overall elasticity of the gel membrane layer, making it easier for the gel membrane layer to deform, which is beneficial to improving the vibration isolation effect of the membrane structure.

[0008] In one possible implementation of the first aspect of this application, the mass ratio of polyvinyl chloride to plasticizer is 1:4 to 1:6. This structure is beneficial for improving the vibration isolation effect of the membrane structure.

[0009] In one possible implementation of the first aspect of this application, the porosity of the mesh structure is greater than or equal to 70%. This structure is beneficial for improving the vibration isolation effect of the membrane structure.

[0010] In one possible implementation of the first aspect of this application, the thickness of the membrane structure is greater than or equal to 0.1 mm and less than or equal to 0.5 mm. This structure is beneficial for improving the vibration isolation effect of the membrane structure.

[0011] In one possible implementation of the first aspect of this application, the conductive layer includes a first conductive layer and a second conductive layer. A first conductive layer or a second conductive layer is disposed between two adjacent gel film layers. The first conductive layer and the second conductive layer are alternately distributed along the stacking direction of the gel film layers, forming a mesh structure. In this way, the first conductive layer can act as an anode, and the second conductive layer can act as a cathode. When the first and second conductive layers are energized, the gel film layers can vibrate, thereby counteracting the vibrations generated by the sound-generating device and achieving an active vibration isolation effect.

[0012] In one possible implementation of the first aspect of this application, the first conductive layer and the second conductive layer are used for electrical connection with the power supply system of the electronic device, and the driving voltage of the first conductive layer and the second conductive layer is greater than or equal to 2V. This is beneficial to improving the vibration isolation effect of the film structure.

[0013] In one possible implementation of the first aspect of this application, a gel membrane layer and a conductive layer form a laminated structure, and the membrane structure further includes a fiber membrane layer connected to the laminated structure. This structure combines the low-frequency sound absorption effects of the laminated structure with the high-frequency sound absorption effects of the fiber membrane layer, enabling the membrane structure to absorb sound over a wider bandwidth. For example, a high-fiber membrane structure can exhibit good sound absorption in frequency bands below 700Hz.

[0014] In one possible implementation of the first aspect of this application, the stacking direction of the plurality of gel membrane layers is a first direction, and the fiber membrane layer and the stacked structure are stacked along the first direction. Exemplarily, the total thickness of the membrane structure is less than or equal to 0.5 mm, and the total area is greater than or equal to 500 mm². 2 .

[0015] In one possible implementation of the first aspect of this application, the stacking direction of the multiple gel membrane layers is a first direction, and the fiber membrane layers and the stacked structure are distributed along a direction perpendicular to the first direction. Exemplarily, the total thickness of the membrane structure is less than or equal to 0.5 mm, and the total area is greater than or equal to 500 mm². 2 .

[0016] In one possible implementation of the first aspect of this application, the fiber membrane layer includes a first fiber membrane layer and a second fiber membrane layer, wherein the first fiber membrane layer and the laminated structure are distributed along a direction perpendicular to a first direction; along the first direction, the second fiber membrane layer is disposed on one side of the first fiber membrane layer and the laminated structure. Exemplarily, the total thickness of the membrane structure is less than or equal to 0.5 mm, and the total area is greater than or equal to 500 mm².2 .

[0017] In one possible implementation of the first aspect of this application, the fiber membrane layer includes multiple sub-fiber layers, each sub-fiber layer including multiple fibers, and the fibers in the sub-fiber layer have different extension directions than the fibers in adjacent sub-fiber layers. For example, the included angle formed between the fibers in adjacent sub-fiber layers can be 90°, 45°, or 30°.

[0018] In one possible implementation of the first aspect of this application, the spacing between two adjacent sub-fiber layers is less than or equal to 0.15 mm. In this structure, the smaller the spacing, the better the sound absorption performance of the fiber membrane layer.

[0019] In one possible implementation of the first aspect of this application, the spacing between two adjacent fibers in the sub-fiber layer is less than or equal to 0.5 mm. In this structure, the smaller the spacing, the better the sound absorption performance of the fiber membrane layer.

[0020] Secondly, an electronic device is provided, comprising a housing, a display module, a sound-emitting device, and a diaphragm structure. The display module is fixedly connected to the housing and encloses a receiving space. The sound-emitting device is disposed within the housing, and at least a portion of the receiving space forms a rear acoustic cavity for the sound-emitting device. The diaphragm structure is as described in any of the above technical solutions, and the diaphragm structure is disposed within the rear acoustic cavity of the sound-emitting device.

[0021] The electronic device provided in the second aspect of this application, by including the film structure as described in any of the above technical solutions, is able to solve the same technical problem and achieve the same technical effect.

[0022] In one possible implementation of the second aspect of this application, the housing includes a middle frame and a rear cover, with the rear cover and the display module respectively fixed to opposite sides of the middle frame, and a membrane structure attached to the surface of the rear cover facing the display module. In this structure, the space between the rear cover and the middle frame forms an open rear acoustic cavity for the sound-emitting device.

[0023] In one possible implementation of the second aspect of this application, the film structure is attached to the surface of the display module facing the receiving space. In this structure, the space between the display module and the middle plate forms an open rear acoustic cavity for the sound-emitting device.

[0024] In one possible implementation of the second aspect of this application, the electronic device includes a battery disposed within a receiving space, and the conductive layer of the film structure is electrically connected to the battery. In this structure, the battery supplies power to the film structure, enabling the film structure to perform active vibration isolation.

[0025] In one possible implementation of the second aspect of this application, the electronic device includes a circuit board disposed within a receiving space, a battery electrically connected to the circuit board, and a conductive layer of the membrane structure electrically connected to the circuit board. In this structure, controlling the voltage supplied to the membrane structure via the circuit board helps improve the vibration isolation effect of the membrane structure.

[0026] For example, the electronic device includes a flexible connector, such as an FPC board. One end of the flexible connector is electrically connected to a conductive layer, and the other end of the flexible connector is electrically connected to a circuit board. The flexible connector and the circuit board are connected via a board-to-board connector.

[0027] In one possible implementation of the second aspect of this application, the vertical projection of the film structure onto the display module overlaps at least partially with the vertical projection of the battery onto the display module. This structure avoids the film structure affecting the layout of other devices, thus improving the space utilization within the electronic device. Attached Figure Description

[0028] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0029] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0030] Figure 3 A cross-sectional view of a sound-generating device provided in an embodiment of this application;

[0031] Figure 4 A cross-sectional view of another sound-generating device provided in an embodiment of this application;

[0032] Figure 5 A cross-sectional view of an electronic device provided in an embodiment of this application;

[0033] Figure 6 A structural diagram of a membrane structure provided in an embodiment of this application;

[0034] Figure 7 This is a magnified view of a partial structure of the conductive layer provided in an embodiment of this application;

[0035] Figure 8 A comparison curve of the sound insulation performance of two membrane structures provided in the embodiments of this application;

[0036] Figure 9 Comparison curves of the sound insulation performance of two other membrane structures provided for embodiments of this application;

[0037] Figure 10 Comparison curves of the sound insulation performance of three membrane structures with different thicknesses provided in the embodiments of this application;

[0038] Figure 11 A structural diagram of another membrane structure provided in an embodiment of this application;

[0039] Figure 12 This is a structural diagram showing the electrical connection between the film layer structure and the circuit board provided in the embodiments of this application;

[0040] Figure 13 A cross-sectional view of another electronic device provided in an embodiment of this application;

[0041] Figure 14 A comparison curve of the sound insulation performance of the membrane structure under different voltages provided in the embodiments of this application;

[0042] Figure 15 A strain rate comparison line graph of multiple membrane structures provided in the first case of the embodiments of this application;

[0043] Figure 16 A strain rate comparison line graph of multiple membrane structures in a second case provided in the embodiments of this application;

[0044] Figure 17 A strain rate comparison line graph of multiple membrane structures in a third case provided in the embodiments of this application;

[0045] Figure 18 A strain rate comparison line graph of multiple membrane structures in the fourth case provided in the embodiments of this application;

[0046] Figure 19 A partial cross-sectional view of a membrane structure and a back cover provided in an embodiment of this application;

[0047] Figure 20 The three film structures provided in the embodiments of this application (including) Figure 19 A comparison curve of the sound absorption coefficients of the membrane structure shown;

[0048] Figure 21 A partial cross-sectional view of another membrane structure and back cover provided in an embodiment of this application;

[0049] Figure 22 The three film structures provided in the embodiments of this application (including) Figure 21 A comparison curve of the sound absorption coefficients of the membrane structure shown;

[0050] Figure 23 A partial cross-sectional view of another membrane structure and back cover provided in an embodiment of this application;

[0051] Figure 24 The two film structures provided in the embodiments of this application (both are) Figure 23A comparison curve of the sound absorption coefficients of the membrane structure shown;

[0052] Figure 25 This is a magnified view of a partial structure of the fiber membrane layer provided in an embodiment of this application;

[0053] Figure 26 A cross-sectional view of the fiber membrane layer provided in the embodiments of this application;

[0054] Figure 27 A comparison curve of the sound absorption coefficients of the three fiber membrane layers provided in the embodiments of this application;

[0055] Figure 28 A comparison curve of the sound absorption coefficients of the three fiber membrane layers provided in the embodiments of this application;

[0056] Figure 29 A comparison curve of the sound absorption coefficients of the three fiber membranes provided in the embodiments of this application.

[0057] Reference numerals: 10-Electronic device; 100-Display module; 110-Light-transmitting cover; 120-Display screen; 200-Housing; 210-Back cover; 220-Frame; 221-Sound outlet; 230-Middle plate; 300-Circuit board; 400-Sound-generating device; 400a-Front sound cavity; 400b-Rear sound cavity; 410-Outer shell; 420-Core; 421-Diaphragm; 430-Support; 500-Membrane structure; 510-Gel membrane layer; 520-Conductive layer; 521-First conductive layer; 522-Second conductive layer; 530-Layered structure; 540-Fiber membrane layer; 540a-First fiber membrane layer; 540b-Second fiber membrane layer; 541-Sub-fiber layer; 541a-First sub-fiber layer; 541b-Second sub-fiber layer; 541c-Fiber; 600-Battery. Detailed Implementation

[0058] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0059] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0060] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0061] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0062] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), monitor, camera, personal computer, laptop computer, wearable device, etc. For ease of explanation, the following description uses a mobile phone as an example.

[0063] Please see Figure 1 and Figure 2 , Figure 1 This is a structural diagram of the electronic device 10 provided in the embodiments of this application. Figure 2 This is an exploded view of the electronic device 10 provided in an embodiment of this application. As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 can have an approximately rectangular plate-like structure. The electronic device 10 may include a display module 100, a housing 200, a circuit board 300, and electronic components.

[0064] For ease of description below, an XYZ coordinate system is established, defining the width direction of electronic device 10 as the X-axis, the length direction of electronic device 10 as the Y-axis, and the thickness direction of electronic device 10 as the Z-axis. It is understood that the coordinate system of electronic device 10 can be flexibly set according to actual needs; this application only provides an example and should not be considered a specific limitation thereof. Figure 1 and Figure 2 The electronic device 10 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 Restrictions.

[0065] The aforementioned display module 100 is used to display images, videos, etc. The display module 100 may include a light-transmitting cover 110 and a display screen 120 (also known as a display panel), with the light-transmitting cover 110 and the display screen 120 stacked together. The material of the light-transmitting cover 110 includes, but is not limited to, glass. For example, the light-transmitting cover 110 can be a common light-transmitting cover 110, used to protect the display screen 120 from damage caused by external forces and to provide dust protection. Alternatively, the light-transmitting cover 110 can also be a touch-enabled light-transmitting cover 110, enabling the electronic device 10 to have touch functionality, thus making it more convenient for users. Therefore, this application does not impose any special limitations on the specific material of the light-transmitting cover 110.

[0066] Furthermore, the aforementioned display screen 120 can be a flexible display screen or a rigid display screen. For example, the display screen 120 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0067] The aforementioned housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 may include a rear cover 210 and a frame 220. The rear cover 210 is located on the side of the display screen 120 away from the light-transmitting cover plate 110 and is stacked with the light-transmitting cover plate 110 and the display screen 120. The frame 220 is located between the light-transmitting cover plate 110 and the rear cover 210. The frame 220 is fixed to the rear cover 210. Exemplarily, the frame 220 can be fixed to the rear cover 210 by means of adhesive bonding, threaded connection, welding, snap-fit, etc.; alternatively, the frame 220 can also be integrally formed with the rear cover 210, that is, the frame 220 and the rear cover 210 form a single structural component. The light-transmitting cover plate 110 can be glued to the frame 220, so that the light-transmitting cover plate 110, the rear cover 210, and the frame 220 form a receiving cavity inside the electronic device 10, within which the aforementioned circuit board 300 and electronic components are disposed.

[0068] In some embodiments, the housing 200 may further include a middle plate 230, which is disposed within the accommodating cavity and located on the side of the display screen 120 away from the light-transmitting cover 110. The middle plate 230 is fixedly connected to the frame 220 to form the middle frame of the electronic device 10. Exemplarily, the middle plate 230 and the frame 220 can be fixedly connected by adhesive, threaded connection, welding, snap-fit, or other methods; alternatively, the middle plate 230 and the frame 220 can be an integrally formed structure, i.e., the middle plate 230 and the frame 220 form a single structural component. The middle plate 230 divides the accommodating cavity into two independent spaces. One space is located between the light-transmitting cover 110 and the middle plate 230, and the display screen 120 is located within this space. The other space is located between the middle plate 230 and the rear cover 210, and the circuit board 300 is located within this space.

[0069] The aforementioned circuit board 300 is used to house electronic components inside the electronic device 10 and to achieve electrical connections between these components. The circuit board 300 can be fixed to the middle plate 230 by means of adhesive bonding, threaded connection, soldering, snap-fitting, etc. Therefore, this application does not impose any special limitations on the fixing method of the circuit board 300.

[0070] The aforementioned electronic components are used to implement various functions of the electronic device 10. For example, the electronic components may be control chips (e.g., system-on-chip, SOC), graphics processing units (GPUs), universal flash storage (UFS), camera modules, flash modules, sound-generating devices 400, as well as capacitors, resistors, inductors, etc.

[0071] The sound-generating device 400 converts the audio electrical signal of the electronic device 10 into a sound signal, enabling the user to hear the sound signal emitted by the electronic device 10. The sound-generating device 400 is electrically connected to the circuit board 300. For example, the sound-generating device 400 can be a handset, allowing the user to listen to phone calls or voice messages by bringing the sound-generating device 400 close to their ear. Alternatively, the sound-generating device 400 can be a speaker, allowing the electronic device 10 to play music or make hands-free calls, thus supporting external sound output.

[0072] Please see Figure 3 , Figure 3This is a cross-sectional view of a sound-generating device 400 provided in an embodiment of this application. The sound-generating device 400 may include a housing 410 and a core 420. The core 420 is disposed inside the housing 410, and a diaphragm 421 is disposed in the core 420. The diaphragm 421 divides the cavity inside the housing 410 into two independent sound chambers, namely a front sound chamber 400a and a rear sound chamber 400b. The front sound chamber 400a is connected to the outside through a sound outlet 221. When the diaphragm 421 vibrates, it can compress the air in the front sound chamber 400a and the rear sound chamber 400b, thereby realizing the emission of sound.

[0073] For example, the aforementioned sound outlet 221 can be formed on the frame 220, that is, the sound outlet 221 penetrates the inner wall and outer wall of the frame 220 and communicates with the front sound cavity 400a of the sound-emitting device 400. Alternatively, there can be a gap between the inner wall of the frame 220 and the side wall of the display module 100 to form the aforementioned sound outlet 221. Therefore, the specific structural form of the sound outlet 221 is not particularly limited in the embodiments of this application.

[0074] In this design, the rear acoustic cavity 400b located inside the housing 410 is a closed rear acoustic cavity. Under this structure, the volume of the housing 410 is affected by the internal acoustic cavities (including the front acoustic cavity 400a and the rear acoustic cavity 400b), resulting in a larger housing volume, which is detrimental to the trend of thinner and lighter electronic devices 10. Therefore, the sound-generating device 400 can also adopt an open rear acoustic cavity structure.

[0075] Specifically, please refer to Figure 4 , Figure 4 This is a cross-sectional view of another sound-generating device 400 provided in an embodiment of this application. The sound-generating device 400 employs an open rear acoustic cavity. The sound-generating device 400 may include a core 420 and a support 430. The support 430 is fixed to a middle plate 230. For example, the support 430 may be fixed to the side of the middle plate 230 away from the display module 100, or the support 430 may be fixed to the side of the middle plate 230 closer to the display module 100. In this embodiment, the example of the support 430 being fixed to the side of the middle plate 230 away from the display module 100 will be described.

[0076] The aforementioned core 420 is fixed to the bracket 430, and the aforementioned front acoustic cavity 400a is formed between the core 420 (i.e., the diaphragm 421) and the bracket 430, which communicates with the sound outlet 221. The side of the diaphragm 421 away from the front acoustic cavity 400a is exposed in the space between the middle plate 230 and the rear cover 210, thus forming the rear acoustic cavity 400b of the sound-generating device 400, i.e., an open rear acoustic cavity, in the space between the middle plate 230 and the rear cover 210. It can be understood that when the bracket 430 of the sound-generating device 400 is fixed to the side of the middle plate 230 near the display module 100, the rear acoustic cavity 400b of the sound-generating device 400 is formed by the space between the display module 100 and the middle plate 230.

[0077] In this structure, since the support 430 forms a front sound cavity 400a only between itself and the core 420, the support 430 does not need to completely enclose the core 420. Therefore, it is beneficial to reduce the volume of the sound-generating device 400, thereby reducing the space occupied by the sound-generating device 400 inside the electronic device 10, which is beneficial to the thinning and lightening of the electronic device 10.

[0078] Based on this, please refer to Figure 5 , Figure 5 This is a cross-sectional view of an electronic device 10 provided in an embodiment of this application. The electronic device 10 may further include a diaphragm structure 500, which may be disposed within the rear acoustic cavity 400b (i.e., the open rear acoustic cavity 400b) of the sound-emitting device 400. For example, when the rear acoustic cavity 400b of the sound-emitting device 400 is formed between the middle plate 230 and the rear cover 210, the diaphragm structure 500 may be attached to the inner wall of the rear cover 210. Alternatively, when the rear acoustic cavity 400b of the sound-emitting device 400 is formed between the display module 100 and the middle plate 230, the diaphragm structure 500 may be attached to the surface of the display module 100 facing the middle plate 230, so that the diaphragm structure 500 can play a certain vibration isolation role against the vibration generated by the sound-emitting device 400 during sound generation. In the following embodiments, the diaphragm structure 500 attached to the rear cover 210 is used as an example for description.

[0079] For details, please continue reading Figure 5 and in conjunction with reference Figure 6 , Figure 6 This is a structural diagram of a membrane structure 500 provided in an embodiment of this application. The membrane structure 500 may include multiple stacked gel membrane layers 510 and at least one conductive layer 520. A conductive layer 520 is disposed between each two adjacent gel membrane layers 510, and at least one conductive layer 520 forms a mesh structure. (See also...) Figure 7 , Figure 7 This is a magnified view of a portion of the conductive layer 520 provided in an embodiment of this application.

[0080] For example, please continue reading Figures 5-7 There can be three gel film layers 510, which are distributed along the Z-axis. A conductive layer 520 is provided between each two adjacent gel film layers 510, that is, there are two conductive layers 520, and one of the two conductive layers 520 can form the above-mentioned mesh structure.

[0081] Furthermore, the material of the gel film layer 510 may include polyvinyl chloride and plasticizers, such as dibutyl adipate (DBA) or tetrahydrofuran (THF), to increase the elasticity of the gel film layer 510 so that the gel film layer 510 is more easily deformed.

[0082] The natural frequency of the film structure 500 can be calculated based on the following formula: Among them, f n The natural frequency of the film structure is 500, μ n The Poisson's ratio of the membrane structure 500, T is the overall tension of the membrane structure 500, a is the side length of the mesh in the conductive layer 520, and σ is the surface tension of the membrane structure 500. Please refer to Tables 1 and 2. Table 1 shows the relevant parameters corresponding to different proportions of the gel membrane 510, and Table 2 shows the relevant parameters corresponding to different porosities of the conductive layer 520 in the mesh structure.

[0083] Table 1

[0084]

[0085] Table 2

[0086]

[0087]

[0088] Therefore, based on the above formula and the parameters shown in Tables 1 and 2, the natural frequency of the membrane structure 500 can be calculated, that is, the membrane structure 500 itself can vibrate.

[0089] In this way, when the aforementioned sound-generating device 400 is in operation, the vibrations it generates are transmitted to the rear acoustic cavity 400b, i.e., the space between the middle plate 230 and the rear cover 210. Since a membrane structure 500 is provided in this space and is attached to the inner surface of the rear cover 210, when vibrations are transmitted to the membrane structure 500, they can excite the membrane structure 500, causing it to vibrate, i.e., the gel membrane layer 510 of the membrane structure 500 deforms. Furthermore, at least one conductive layer 520 forms the aforementioned mesh structure; therefore, after the gel membrane layer 510 deforms, it can fill the mesh structure, causing the gel membrane layer 510 to continuously stretch and compress to absorb the vibration energy generated by the sound-generating device 400. This reduces the risk of vibrations being transmitted to the rear cover 210 and further to the user's hand; that is, the membrane structure 500 can provide vibration isolation, which is beneficial to improving the user experience.

[0090] Therefore, to improve the vibration isolation effect of the aforementioned membrane structure 500, parameters such as the mass ratio of the gel membrane layer 510, the porosity of the mesh structure of the conductive layer 520, and the overall thickness of the membrane structure 500 can be adjusted to enable the membrane structure 500 to have a better vibration isolation effect. The mass ratio of the gel membrane layer 510 refers to the mass ratio of polyvinyl chloride to plasticizer.

[0091] Specifically, please refer to Figure 8 , Figure 8 A comparative sound insulation performance curve of two membrane structures 500 provided in the embodiments of this application. Figure 8 The horizontal axis represents frequency, and the vertical axis represents sound insulation. Figure 8 The two curves show that the mass ratio of the gel membrane layer 510 in both membrane structures 500 is 1:4. In the membrane structure 500 shown by curve A, the porosity of the conductive layer 520 forming the network structure is 70%. In the membrane structure 500 shown by curve B, the porosity of the conductive layer 520 forming the network structure is 90%.

[0092] Please see Figure 9 , Figure 9 Comparison curves of the sound insulation performance of two other membrane structures 500 provided in the embodiments of this application. Figure 9 The horizontal axis represents frequency, and the vertical axis represents sound insulation. Figure 9 The mass ratio of the gel membrane layer 510 in both of the two membrane structures 500 shown by the two curves is 1:6. In the membrane structure 500 shown by curve C, the porosity of the conductive layer 520 forming the network structure is 70%. In the membrane structure 500 shown by curve D, the porosity of the conductive layer 520 forming the network structure is 90%.

[0093] Depend on Figure 8 and Figure 9It can be seen that when the mass ratio of gel membrane layer 510 is 1:4, the sound insulation performance of the two membrane layer structures 500 is relatively similar. In the 200-400Hz frequency band, both membrane layer structures 500 can produce obvious sound insulation peaks (i.e., apex). Curve A has two obvious sound insulation peaks, while curve B has only one obvious sound insulation peak. That is, the sound insulation performance of membrane layer structure 500 shown in curve A is better than that of membrane layer structure 500 shown in curve B.

[0094] When the mass ratio of gel membrane layer 510 is 1:6, the sound insulation performance of the two membrane structures 500 differs significantly. In multiple frequency bands, such as 200-400Hz and above 600Hz, the sound insulation performance of membrane structure 500 shown in curve C is better than that of membrane structure 500 shown in curve D, with a maximum sound insulation of approximately 28dB.

[0095] In the frequency bands of 400-600Hz and above 1400Hz, the sound insulation of the membrane structure 500 shown in curve D is greater than that of the membrane structure 500 shown in curve C. That is, in this frequency band, the sound insulation of the membrane structure 500 shown in curve D is better.

[0096] Furthermore, the peak-valley frequencies of curve C and curve D are significantly different. The peak-valley frequencies of curve C appear 100Hz earlier than those of curve D, and the difference in sound insulation is about 5dB. In other words, curve C shows a better sound insulation effect.

[0097] As can be seen from the above, in the membrane structure 500 provided in this application embodiment, when the mass ratio of the gel membrane layer 510 is 1:4-1:6 and the porosity of the conductive layer 520 of the mesh structure is greater than 70%, the membrane structure 500 can have good sound insulation performance.

[0098] In addition, please see Figure 10 , Figure 10 The image shows a comparison curve of the sound insulation performance of three membrane structures 500 with different thicknesses provided in the embodiments of this application. Figure 10The horizontal axis represents frequency, and the vertical axis represents sound insulation. Curve A shows a membrane structure 500 with a thickness of 0.1 mm, curve B shows a membrane structure 500 with a thickness of 0.15 mm, and curve C shows a membrane structure 500 with a thickness of 0.2 mm. This shows that as the thickness of the membrane structure 500 increases, the average sound insulation of the membrane structure 500 increases by approximately 2 dB, thus improving its sound insulation performance. Therefore, the thickness of the membrane structure 500 provided in this embodiment is greater than or equal to 0.1 mm and less than or equal to 0.5 mm. This ensures the sound insulation performance of the membrane structure 500 while avoiding increasing the thickness of the electronic device 10, thereby reducing vibration transmission to the housing 200 of the electronic device 10 and contributing to the thinner and lighter design of the electronic device 10.

[0099] The above describes the passive sound insulation performance of the membrane structure 500 provided in the embodiments of this application. In other embodiments, the membrane structure 500 provided in the embodiments of this application can also perform active sound insulation, that is, a voltage is applied to the conductive layer 520 of the membrane structure 500 to cause the membrane structure 500 to undergo tension changes (i.e., deformation), so that the gel membrane layer 510 fills the mesh of the conductive layer 520 of the mesh structure, continuously stretching and compressing, that is, the gel membrane layer 510 itself vibrates to deliver the vibration generated by the sound generating device 400, thereby forming an active vibration isolation effect to reduce the risk of vibration being transmitted to the housing 200.

[0100] For example, please refer to Figure 11 , Figure 11 This is a structural diagram of another film structure 500 provided in an embodiment of this application. Three gel film layers 510 are provided, stacked along the Z-axis. Two adjacent gel film layers 510 form a group, thus the three gel film layers 510 form two groups of adjacent gel film layers 510. Two conductive layers 520 are provided, namely a first conductive layer 521 and a second conductive layer 522. The first conductive layer 521 can be made of a metal material and form a mesh structure, while the second conductive layer 522 can be made of conductive cloth. The first conductive layer 521 is disposed between two adjacent gel film layers 510 in one group and serves as the anode (positive electrode +). The second conductive layer 522 is disposed between two adjacent gel film layers 510 in the other group and serves as the cathode (negative electrode -).

[0101] The equivalent capacitance of the film structure 500 can be calculated based on the following formula:

[0102]

[0103] Among them, C eC1 represents the equivalent capacitance of the film structure 500, C2 represents the capacitance of the gel film 510, C3 represents the capacitance of the first conductive layer 521, C3 represents the capacitance of the second conductive layer 522, ε1 represents the dielectric constant of the gel film 510, ε2 represents the dielectric constant of the first conductive layer 521, ε3 represents the dielectric constant of the second conductive layer 522, d1 represents the thickness of the gel film 510, d2 represents the thickness of the first conductive layer 521, d3 represents the thickness of the second conductive layer 522, and S represents the area of ​​the film structure 500.

[0104] It is understood that the thicknesses of the gel film layer 510, the first conductive layer 521, and the second conductive layer 522 are all thickness dimensions of the film structure 500 in the stacking configuration, i.e., along the Z-axis direction. Furthermore, the area of ​​the film structure 500 is parallel to the XY plane, meaning that when the film structure 500 is attached to the back cover 210, it covers the area of ​​the back cover 210.

[0105] Furthermore, the electric field strength E and electric force F of the membrane structure 500 can be calculated using the following two formulas:

[0106]

[0107] Where E represents the electric field strength, U represents the potential difference, and ε e Let d represent the dielectric constant of the film structure 500, d represent the thickness of the film structure 500, and F represent the electric field force. It can be seen that when a voltage is applied to the film structure 500, the electric field strength changes, causing a change in the structural tension of the film structure 500. This affects the stiffness and resonant frequency of the film structure 500. Furthermore, the smaller the thickness of the film structure 500 (i.e., the smaller the distance between the electrodes formed by the first conductive layer 521 and the second conductive layer 522), the greater the electric field force. With the increase of the electric field force, the stiffness of the film structure 500 is better.

[0108] In some embodiments, please continue reading Figure 11 and in conjunction with reference Figure 12 , Figure 12This is a structural diagram showing the electrical connection between the film structure 500 and the circuit board 300 provided in this application embodiment. The first conductive layer 521 and the second conductive layer 522 of the film structure 500 can also be electrically connected to the circuit board 300, that is, the battery 600 provides a driving voltage to the film structure 500 through the circuit board 300. Exemplarily, the first conductive layer 521 and the second conductive layer 522 can be electrically connected to the circuit board 300 through a flexible connector. For example, the flexible connector can be a flexible printed circuit (FPC) or a wire, that is, one end of the FPC is soldered to the first conductive layer 521 and the second conductive layer 522 respectively, and the other end of the FPC is connected to the circuit board 300 through a board-to-board connector, thereby realizing the power supply to the film structure 500.

[0109] Alternatively, the first conductive layer 521 and the second conductive layer 522 can also be directly electrically connected to the battery 600 of the electronic device 10. It is understood that the power supply method for the film structure 500 can be flexibly changed based on the design requirements of the electronic device 10. The above examples are only possible connection methods, and therefore, this application does not impose any special limitations on them.

[0110] In other embodiments, please refer to Figure 13 , Figure 13 This is a cross-sectional view of another electronic device 10 provided in an embodiment of this application. The vertical projection of the film layer structure 500 on the back cover 210 (or the aforementioned display module 100) at least partially overlaps with the vertical projection of the battery 600 on the back cover 210 (or the aforementioned display module 100). That is, along the Z-axis direction, the film layer structure 500 and the battery 600 are at least partially stacked. Exemplarily, along the Z-axis direction, the battery 600 can be completely superimposed on the film layer structure 500, that is, the film layer structure 500 is completely located between the battery 600 and the back cover 210, thereby avoiding the film layer structure 500 from affecting the distribution of other components inside the electronic device 10. In other possible examples, along the Z-axis direction, the film layer structure 500 may also be staggered with the battery 600; therefore, this application does not impose any special limitations on this.

[0111] Based on this, please refer to Figure 14 , Figure 14 This is a comparison curve of the sound insulation performance of the membrane structure 500 provided in the embodiments of this application when different voltages are applied. Figure 14 The horizontal axis represents frequency, and the vertical axis represents sound insulation. Figure 14 In the membrane structure 500 shown, the mass ratio of the gel membrane layer 510 is 1:4, and the porosity of the first conductive layer 521 is 70%. Figure 14The five curves in the figure correspond to the cases with no voltage applied and with voltages of 0.5V, 1V, 1.5V, and 2V respectively. As can be seen from the curves, when the applied voltage is below 2V, the sound insulation curve remains essentially unchanged as the voltage increases. When the applied voltage increases to 2V, the sound insulation curve changes significantly, with a marked improvement in sound insulation across the entire frequency band. The peak sound insulation increases by more than 5dB, and the average sound insulation increases by approximately 3dB. This means that when the driving voltage applied to the membrane structure 500 is greater than or equal to 2V, the sound insulation performance of the membrane structure 500 is better.

[0112] In addition, please see Figure 15 , Figure 16 , Figure 17 as well as Figure 18 , Figure 15 A line graph comparing the strain rates of multiple membrane structures 500, provided in the first case of the embodiments of this application. Figure 16 A strain rate comparison line graph of multiple membrane structures 500 in the second case provided in the embodiments of this application. Figure 17 A line graph comparing the strain rates of multiple membrane structures 500 in the third case provided in the embodiments of this application. Figure 18 A line graph showing the strain rate comparison of multiple membrane structures 500 in the fourth case provided in the embodiments of this application. Figures 15 to 18 The horizontal axis represents voltage, and the vertical axis represents strain rate.

[0113] in, Figure 15 The mass ratio of the gel membrane layer 510 in the membrane structure 500 shown is 1:2. Figure 16 The mass ratio of the gel membrane layer 510 in the membrane structure 500 shown is 1:4. Figure 17 The mass ratio of the gel membrane layer 510 in the membrane structure 500 shown is 1:6. Figure 18 The mass ratio of the gel membrane layer 510 in the membrane structure 500 shown is 1:8. Figures 15 to 18 Five broken lines are shown in each of the five broken lines, and the porosities of the first conductive layer 521 of the film structure 500 shown by the five broken lines are 10%, 30%, 50%, 70%, and 90%, respectively. A voltage is applied to each of these film structures 500, and the voltage is gradually increased.

[0114] Depend on Figures 15-18It can be seen that after applying a 2V voltage, the strain rates of the film structures 500 with porosities of 90% and 70% in the first conductive layer 521 are higher, meaning that the greater the porosity of the first conductive layer 521, the greater the strain rate of the film structure 500. Furthermore, with the same porosity in the first conductive layer 521, the strain rates of the film structures 500 with gel film layer 510 mass ratios of 1:4 and 1:6 are higher. A higher strain rate allows for greater deformation of the film structure 500, which is more conducive to generating vibration and thus improves the vibration isolation performance of the film structure 500.

[0115] In summary, the total thickness of the membrane structure 500 provided in this embodiment is greater than or equal to 0.1 mm and less than or equal to 0.5 mm. The mass ratio of polyvinyl chloride to plasticizer in the gel membrane layer 510 is in the range of 1:4 to 1:6. The porosity of the conductive layer 520 forming the mesh structure (i.e., the first conductive layer 521 mentioned above) is greater than or equal to 70%. The driving voltage applied to the membrane structure 500 is greater than or equal to 2V. Under these conditions, the membrane structure 500 can have better vibration isolation performance, thereby reducing the risk of vibrations generated by the sound-generating device 400 being transmitted to the back cover 210 of the electronic device 10, which is beneficial to improving the user experience.

[0116] Based on the above embodiments, to further improve the vibration isolation effect of the membrane structure 500, please refer to... Figure 19 , Figure 19 This is a partial cross-sectional view of a membrane structure 500 and a back cover 210 provided in an embodiment of this application. The membrane structure 500 may further include a fiber membrane layer 540. Figure 11 The gel membrane layer 510 and the conductive layer 520 form a laminated structure 530, and the fiber membrane layer 540 is connected to the laminated structure 530. In this way, the low-frequency sound absorption of the laminated structure 530 formed by the combination of the gel membrane layer 510 and the conductive layer 520 and the high-frequency sound absorption of the fiber membrane layer 540 are combined to achieve broadband sound absorption. That is, the membrane structure 500 can isolate vibrations over a wider frequency range, thereby further improving the vibration isolation effect of the membrane structure 500 inside the electronic device 10, and further reducing the risk of vibrations generated by the sound-generating device 400 being transmitted to the back cover 210.

[0117] In some examples, please refer to [link / reference]. Figure 19 The laminated structure 530 and the fiber membrane layer 540 can be stacked along the Z-axis. For example, the fiber membrane layer 540 is located between the laminated structure 530 and the back cover 210, or the fiber membrane layer 540 can be disposed on the side of the laminated structure 530 away from the back cover 210. The total thickness of both is less than 0.5 mm, and the coverage area of ​​the membrane structure 500 formed by the two on the inner wall of the back cover 210 is greater than 500 mm². 2 .

[0118] Please see Figure 20 , Figure 20 The three membrane structures 500 provided in the embodiments of this application include Figure 19 The diagram shows a comparison of the sound absorption coefficients of the membrane structure (500). Figure 20 The horizontal axis represents frequency, and the vertical axis represents sound absorption coefficient. Figure 20 The membrane structure 500 shown in curve A includes only the stacked structure 530 formed by the gel membrane layer 510 and the conductive layer 520 (e.g., Figure 11 As shown in the figure), the membrane structure 500 shown by curve B includes a stacked structure 530 and a fiber membrane layer 540 (as shown in the figure). Figure 19 As shown in the figure, the membrane structure 500 shown by curve C only includes the fiber membrane layer 540.

[0119] Depend on Figure 20 As can be seen, the membrane structure 500 shown in curve A exhibits better sound absorption performance in a narrower frequency range, for example, below 400Hz. The membrane structure 500 shown in curve B combines low and high frequencies, demonstrating good sound absorption performance below 700Hz. The membrane structure 500 shown in curve C exhibits better sound absorption performance in a wider frequency range, for example, above 800Hz.

[0120] Since the human body has little to no perception of vibrations with frequencies greater than 1000Hz, and the membrane structure 500 shown in curve C has a good sound absorption effect on the frequency band below 700Hz, when the aforementioned sound-generating device 400 emits sound, the membrane structure 500 has a good sound absorption effect on the sound with frequencies below 700Hz, and can cover a large frequency band, thereby further reducing the risk of vibrations generated by sound waves being transmitted to the back cover 210.

[0121] In other examples, please refer to Figure 21 , Figure 21 This is a partial cross-sectional view of another membrane structure 500 and back cover 210 provided in this application embodiment. The laminated structure 530 and the fiber membrane 540 can also be distributed along a direction perpendicular to the Z-axis, that is, both are attached to the back cover 210. For example, the fiber membrane 540 and the laminated structure 530 can be distributed along the X-axis or along the Y-axis (e.g., Figure 21 (As shown). Both components have a thickness of less than 0.5 mm, and the total area they cover covering the inner wall of the back cover 210 is greater than 500 mm². 2 Furthermore, the areas of the two can be the same or different.

[0122] Please see Figure 22 , Figure 22 The three membrane structures 500 provided in the embodiments of this application include Figure 21 The diagram shows a comparison of the sound absorption coefficients of the membrane structure (500). Figure 22 The membrane structure 500 shown by curve A includes only a stacked structure 530 formed by a gel membrane layer 510 and a conductive layer 520; the membrane structure 500 shown by curve B includes only a fiber membrane layer 540; and the membrane structure 500 shown by curve C includes a stacked structure 530 and a fiber membrane layer 540 distributed along a direction perpendicular to the Z-axis. Figure 22 It can be seen that curve C has a good sound absorption effect in the frequency band below 700Hz.

[0123] In yet another example, please refer to Figure 23 , Figure 23 This is a partial cross-sectional view of another membrane structure 500 and back cover 210 provided in an embodiment of this application. The aforementioned fiber membrane 540 may include a first fiber membrane 540a and a second fiber membrane 540b. The first fiber membrane 540a and the laminated structure 530 are distributed along a direction perpendicular to the Z-axis and are attached to the back cover 210. The second fiber membrane 540b is located on the side of the first fiber membrane 540a and the laminated structure 530 away from the back cover 210. Alternatively, the first fiber membrane 540a and the laminated structure 530 may be disposed on the side of the second fiber membrane 540b away from the back cover 210, and the second fiber membrane 540b is attached to the back cover 210.

[0124] The total thickness of the membrane structure 500 is less than 0.5 mm, and the total coverage area on the inner wall of the back cover 210 is greater than 500 mm². 2 For example, the total area of ​​the first fiber membrane layer 540a and the laminated structure 530 can be the same as or different from the area of ​​the second fiber membrane layer 540b. The area of ​​the first fiber membrane layer 540a and the area of ​​the laminated structure 530 can be the same as or different from the area of ​​the first fiber membrane layer 540a and the laminated structure 530. The thickness of the first fiber membrane layer 540a and the second fiber membrane layer 540b can be the same as or different from the thickness of the laminated structure 530.

[0125] Please see Figure 24 , Figure 24 The two membrane structures 500 provided in the embodiments of this application are both Figure 23 The diagram shows a comparison of the sound absorption coefficients of the membrane structure (500). Figure 24 In the two curves shown in the figure, only the density of the gel membrane layer 510 is different; the materials of the other structures are the same. As can be seen from the figure, in the frequency band below 700Hz, the sound absorption coefficients of the two membrane structures 500 are basically the same, meaning that the density of the gel membrane layer 510 does not have a significant impact on the sound absorption performance of the membrane structure 500.

[0126] Based on this, as can be seen from the above examples, the inclusion of a fiber membrane layer 540 in the membrane structure 500 increases its applicable bandwidth, enabling it to maintain good sound insulation performance across a wider frequency range. Specifically, when the membrane structure 500 includes the laminated structure 530 and the fiber membrane layer 540, it exhibits good sound absorption in frequency bands below 700Hz. It is understood that the above examples are merely illustrations of the distribution structure of the laminated structure 530 and the fiber membrane layer 540. Other possible distribution structures can be used between the fiber membrane layer 540 and the laminated structure 530, and these different distribution structures do not significantly affect the sound absorption performance of the membrane structure 500.

[0127] Based on this, please refer to Figure 25 and Figure 26 , Figure 25 This is a magnified view of a partial structure of the fiber membrane layer 540 provided in an embodiment of this application. Figure 26 This is a cross-sectional view of the fiber membrane layer 540 provided in an embodiment of this application. The fiber membrane layer 540 may include a plurality of sub-fiber layers 541 stacked together, i.e., the plurality of sub-fiber layers 541 are distributed along the Z-axis direction. Each sub-fiber layer 541 includes a plurality of fibers 541c, and the extension direction of the fibers 541c included in each sub-fiber layer 541 is different from that of the fibers 541c included in the adjacent sub-fiber layers 541.

[0128] For example, in a sub-fiber layer 541 comprising a plurality of fibers 541c, the distance between any two adjacent fibers 541c is δ. h This spacing is a distance perpendicular to the extension direction of fiber 541c, hereinafter referred to as the first spacing δ. h The plurality of subfiber layers 541 may include a first subfiber layer 541a and a second subfiber layer 541b, which are alternately distributed along the Z-axis direction. The distance between the fibers 541c included in two adjacent first subfiber layers 541a is δ. h Half of it, that is, the two adjacent first subfiber layers 541a are misaligned. The distance between the first fiber layer 541c and the second fiber layer 541c is δ. v hereinafter referred to as the second spacing δ v The included angle θ formed by the fibers 541c in the first sub-fiber layer 541a and the second sub-fiber layer 541b in the XY plane can be 90°, or it can be 30° or 45°, that is, less than 90°.

[0129] Based on this, please refer to Figure 27 , Figure 27 A comparison curve of the sound absorption coefficients of the three fiber membrane layers 540 provided in the embodiments of this application. Figure 27In the fiber membrane layer 540 shown, the three curves represent the second spacing δ of the three fiber membrane layers 540. v All are 0.30 mm, and the first spacing δ of the three fiber membrane layers is 540. h The thicknesses are 0.5 mm, 0.6 mm, and 0.8 mm, respectively, and the included angle θ between fibers 541c in adjacent sub-fiber layers 541 of the three fiber membrane layers 540 is 90°. Figure 27 As shown by the curve, the first spacing δ of the fiber membrane layer 540 is... h The smaller the value, the better the sound absorption performance of the fiber membrane layer 540.

[0130] Please see Figure 28 , Figure 28 A comparison curve of the sound absorption coefficients of the three fiber membrane layers 540 provided in the embodiments of this application. Figure 28 In the fiber membrane layer 540 shown, the first spacing δ of the three fiber membrane layers 540 indicated by the three curves is... h All are 0.60 mm, and the second spacing δ of the three fiber membrane layers is 540. v The thicknesses are 0.15 mm, 0.30 mm, and 0.60 mm, respectively, and the included angle θ between fibers 541c in adjacent sub-fiber layers 541 of the three fiber membrane layers 540 is 90°. Figure 28 As shown by the curve, the second spacing δ of the fiber membrane layer 540 is... v The smaller the value, the better the sound absorption performance of the fiber membrane layer 540.

[0131] Please see Figure 29 , Figure 29 A comparison curve of the sound absorption coefficients of the three fiber membrane layers 540 provided in the embodiments of this application. Figure 29 In the fiber membrane layer 540 shown, the first spacing δ of the three fiber membrane layers 540 indicated by the three curves is... h Second spacing δ v All are identical; the included angles θ formed between fibers 541c in adjacent sub-fiber layers 541 of the three fiber membrane layers 540 are 30°, 45°, and 90°, respectively. Figure 29 As shown by the curve, the angle formed between fibers 541c in two adjacent sub-fiber layers 541 has little effect on the sound absorption performance of the fiber membrane layer 540.

[0132] Therefore, in the fiber membrane layer 540 provided in this application embodiment, the spacing between the fibers 541c included in each sub-fiber layer 541 is less than or equal to 0.5 mm, and the spacing between two adjacent sub-fiber layers 541 is less than or equal to 0.15 mm. No special limitation is made on the included angle θ formed between the fibers 541c included in two adjacent sub-fiber layers 541.

[0133] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0134] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A membrane structure, characterized in that, It includes at least one conductive layer among multiple gel film layers stacked together, with a conductive layer disposed between each two adjacent gel film layers, and at least one conductive layer forming a mesh structure.

2. The membrane structure according to claim 1, characterized in that, The gel film layer is made of polyvinyl chloride and plasticizer.

3. The membrane structure according to claim 2, characterized in that, The mass ratio of the polyvinyl chloride to the plasticizer is 1:4 to 1:

6.

4. The membrane structure according to any one of claims 1-3, characterized in that, The porosity of the mesh structure is greater than or equal to 70%.

5. The membrane structure according to any one of claims 1-4, characterized in that, The thickness of the membrane structure is greater than or equal to 0.1 mm and less than or equal to 0.5 mm.

6. The membrane structure according to any one of claims 1-5, characterized in that, The conductive layer includes a first conductive layer and a second conductive layer. A first conductive layer or a second conductive layer is disposed between two adjacent gel film layers. The first conductive layer and the second conductive layer are alternately distributed along the stacking direction of the gel film layers, and the first conductive layer forms the mesh structure.

7. The membrane structure according to claim 6, characterized in that, The first conductive layer and the second conductive layer are used for electrical connection with the power supply system of the electronic device, and the driving voltage of the first conductive layer and the second conductive layer is greater than or equal to 2V.

8. The membrane structure according to any one of claims 1-7, characterized in that, The gel film layer and the conductive layer form a stacked structure, and the film structure further includes a fiber film layer connected to the stacked structure.

9. The membrane structure according to claim 8, characterized in that, The stacking direction of the plurality of gel membrane layers is a first direction, and the fiber membrane layer and the stacked structure are stacked along the first direction.

10. The membrane structure according to claim 8, characterized in that, The stacking direction of the plurality of gel membrane layers is a first direction, and the fiber membrane layers and the stacked structure are distributed along a direction perpendicular to the first direction.

11. The membrane structure according to claim 10, characterized in that, The fiber membrane layer includes a first fiber membrane layer and a second fiber membrane layer, wherein the first fiber membrane layer and the laminated structure are distributed along a direction perpendicular to the first direction; along the first direction, the second fiber membrane layer is disposed on one side of the first fiber membrane layer and the laminated structure.

12. The membrane structure according to any one of claims 8-11, characterized in that, The fiber membrane layer includes multiple sub-fiber layers, each sub-fiber layer including multiple fibers, and the fibers in the sub-fiber layer have different extension directions than the fibers in the adjacent sub-fiber layers.

13. The membrane structure according to claim 12, characterized in that, The spacing between two adjacent subfiber layers is less than or equal to 0.15 mm.

14. The membrane structure according to claim 12, characterized in that, The sub-fiber layer comprises multiple fibers, wherein the spacing between two adjacent fibers is less than or equal to 0.5 mm.

15. An electronic device, characterized in that, include: case; The display module is fixedly connected to the housing and encloses a receiving space. A sound-generating device is disposed within the housing, and at least a portion of the accommodating space forms the rear acoustic cavity of the sound-generating device; The membrane structure is as described in any one of claims 1-14, wherein the membrane structure is disposed within the rear acoustic cavity of the sound-generating device.

16. The electronic device according to claim 15, characterized in that, The housing includes a middle frame and a back cover. The back cover and the display module are respectively fixed to the two sides of the middle frame, and the film layer structure is attached to the surface of the back cover facing the display module.

17. The electronic device according to claim 15, characterized in that, The film structure is attached to the surface of the display module facing the receiving space.

18. The electronic device according to any one of claims 15-17, characterized in that, The electronic device includes a battery disposed within the receiving space, and the conductive layer of the film structure is electrically connected to the battery.

19. The electronic device according to claim 18, characterized in that, The electronic device includes a circuit board disposed within the receiving space, the battery being electrically connected to the circuit board, and the conductive layer of the film structure being electrically connected to the circuit board.

20. The electronic device according to claim 18, characterized in that, The vertical projection of the film structure onto the display module overlaps with at least a portion of the vertical projection of the battery onto the display module.

Images