A protection circuit module and a battery assembly including the same

Abstract

A protection circuit module and a battery assembly including the same are disclosed. The protection circuit module includes a first circuit board electrically connected to a battery cell and extending in a first direction, a second circuit board electrically connected to the first circuit board, and a coupling member coupling the first circuit board and the second circuit board to each other. The first circuit board includes a recess at an end portion overlapping the second circuit board in a second direction crossing the first direction, and at least a portion of the coupling member is inserted into the recess.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a protection circuit module and a battery assembly including the protection circuit module. Background Technology

[0002] Unlike primary batteries, which are non-rechargeable, secondary batteries are rechargeable and dischargeable. Low-capacity secondary batteries are used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources for electric motors in hybrid and electric vehicles, as well as for energy storage. Such secondary batteries include electrode assemblies containing positive and negative electrodes, a housing for accommodating the electrode assemblies, and electrode terminals connected to the electrode assemblies.

[0003] Secondary batteries can be equipped with a protection circuit module (PCM) to protect them from overcharging, over-discharging, or overcurrent. When the battery's internal temperature or voltage rises, the protection circuit module can prevent the battery from catching fire or exploding by interrupting current flow.

[0004] The information disclosed in this background section is intended to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute related (or prior art). Summary of the Invention

[0005] A protection circuit module (PCM) may include multiple circuit boards. These circuit boards may be coupled together and electrically connected to each other. During the inspection of the protection circuit module or the installation of a secondary battery, external forces may be applied to the joints of the multiple circuit boards. In such cases, the joints of the multiple circuit boards may be damaged or broken due to the external forces. Therefore, it is desirable to improve the bonding strength between the multiple circuit boards.

[0006] Embodiments of this disclosure can be applied to a protection circuit module and a battery assembly including the protection circuit module.

[0007] However, the technical problems to be solved by this disclosure are not limited to those described above. Those skilled in the art will clearly understand from the following description of this disclosure other problems not mentioned herein, as well as aspects and features of this disclosure that will solve such problems.

[0008] According to one or more embodiments of this disclosure, a protection circuit module includes: a first circuit board electrically connected to a battery cell and extending in a first direction; a second circuit board electrically connected to the first circuit board; and a coupling member for joining the first circuit board and the second circuit board to each other. The first circuit board includes a recess at an end that overlaps with the second circuit board in a second direction intersecting the first direction, and at least a portion of the coupling member is inserted into the recess.

[0009] In one embodiment, the recessed portion may have a shape that is recessed into the interior of the first circuit board on the surface of the end facing the first direction.

[0010] In one embodiment, the recessed portion may penetrate the end of the first circuit board in a second direction.

[0011] In one embodiment, the recess may be located at the center of the first circuit board in a third direction intersecting the first and second directions.

[0012] In one embodiment, in a third direction intersecting the first and second directions, the width of the recess may be less than or equal to 50% of the width of the first circuit board.

[0013] In one embodiment, in the first direction, the length of the recess may be less than or equal to 50% of the width of the first circuit board.

[0014] In an embodiment, the connecting member may have a width that decreases as the distance from the end increases, and the maximum width of the connecting member may be greater than or equal to the width of the recess.

[0015] In one embodiment, the recessed portion can penetrate the end of the first circuit board upwards at a third direction intersecting the first and second directions.

[0016] In one embodiment, the recess may be located at the center of the first circuit board in the second direction.

[0017] In one embodiment, in the second direction, the thickness of the recess may be less than or equal to 50% of the thickness of the first circuit board.

[0018] In one embodiment, in the first direction, the length of the recess may be less than or equal to 50% of the thickness of the first circuit board.

[0019] In one embodiment, the connecting member may have a thickness that decreases with increasing distance from the end, and the top end of the connecting member may be higher than or at the same level as the top end of the recess.

[0020] In embodiments, the bonding component may include at least one of epoxy resin, silicone resin, polyurethane, polyimide, UV-curable resin, and acrylic resin.

[0021] In one implementation, the width of the second circuit board may correspond to the width of the first circuit board.

[0022] In one implementation, the center of the second circuit board may correspond to the center of the first circuit board in a third direction that intersects the first and second directions.

[0023] According to one or more embodiments of this disclosure, a battery assembly includes: a battery cell including electrode terminals; and a protection circuit module electrically connected to the electrode terminals. The protection circuit module includes: a first circuit board electrically connected to the battery cell and extending in a first direction; a second circuit board electrically connected to the first circuit board; and a coupling member for joining the first and second circuit boards together. The first circuit board includes a recess at an end that overlaps with the second circuit board in a second direction intersecting the first direction, and at least a portion of the coupling member is inserted into the recess.

[0024] In one embodiment, the recessed portion may have a shape that is recessed into the interior of the first circuit board on the surface of the end facing the first direction.

[0025] In one embodiment, the recessed portion may penetrate the end of the first circuit board in a second direction.

[0026] In one embodiment, the recessed portion can penetrate the end of the first circuit board upwards at a third direction intersecting the first and second directions.

[0027] In embodiments, the bonding component may include at least one of epoxy resin, silicone resin, polyurethane, polyimide, UV-curable resin, and acrylic resin.

[0028] According to some embodiments of this disclosure, a protection circuit module with improved mechanical strength and a battery assembly including the protection circuit module can be provided.

[0029] According to some embodiments of this disclosure, a protection circuit module having improved bonding strength between multiple circuit boards and a battery assembly including the protection circuit module can be provided.

[0030] According to some embodiments of this disclosure, the bonding strength between multiple circuit boards can be improved by arranging bonding members in recesses formed in a circuit board to bond multiple circuit boards together.

[0031] According to some embodiments of this disclosure, the bonding member can absorb external forces applied to the protection circuit module to prevent or substantially prevent damage to the bonding portion of the plurality of circuit boards, and the protection circuit module can operate more stably due to the high heat resistance of the bonding member at high temperatures.

[0032] However, the aspects and features of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the detailed description below that other aspects and features not mentioned will be apparent.

[0033] The above and other aspects and features will be set forth in part in the following detailed description with reference to the accompanying drawings, and may be apparent in part from therein, or may be learned by practicing one or more of the embodiments presented in this disclosure. Attached Figure Description

[0034] The following accompanying drawings illustrate embodiments of the present disclosure and, together with the detailed description of the present disclosure, further describe aspects and features of the present disclosure. Therefore, the present disclosure should not be construed as limited to the drawings.

[0035] Figure 1 This is an exploded perspective view showing an example of a battery assembly according to an embodiment of the present disclosure.

[0036] Figure 2 This is a plan view illustrating an example of a battery assembly according to an embodiment of the present disclosure.

[0037] Figure 3 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure.

[0038] Figure 4 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction and a connecting member having a width corresponding to the width of the recessed portion.

[0039] Figure 5 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction and a connecting member having a width greater than the width of the recessed portion.

[0040] Figure 6 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction and an end including a curved surface at a corner.

[0041] Figure 7 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction.

[0042] Figure 8 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion extending upward through a third side.

[0043] Figure 9This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion extending upward through a third end and a connecting member having a top end portion higher than the top end portion of the recessed portion.

[0044] Figure 10 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion extending upward through a third party and a connecting member having a top portion corresponding to the top portion of the recessed portion.

[0045] Figure 11 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion extending upward through a third party and a connecting member having a top portion corresponding to the top portion of the recessed portion. Detailed Implementation

[0046] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims are not to be construed as having a general or dictionary meaning, and should be interpreted in a way consistent with the technical concept of the present disclosure, based on the principle that the inventor can be his / her own lexicographer to appropriately define the concepts of the terms in order to best describe his / her invention.

[0047] The embodiments described in this specification and the configurations shown in the accompanying drawings are only some of the embodiments of this disclosure and do not represent all the technical spirit, aspects, and features of this disclosure. Therefore, it should be understood that various equivalents and modifications may exist to replace or modify the embodiments described herein at the time of filing this application.

[0048] It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected" to another element or layer, or "bonded" to another element or layer, it can be directly on, directly connected to, or directly bonded to the other element or layer, or there may be one or more intermediary elements or layers. When an element or layer is referred to as being "directly on" another element or layer, "directly connected" to another element or layer, or "directly bonded" to another element or layer, there are no intermediary elements or layers. For example, when a first element is described as being "bonded" or "connected" to a second element, the first element can be directly bonded or connected to the second element, or the first element can be indirectly bonded or connected to the second element via one or more intermediary elements.

[0049] In the accompanying drawings, the dimensions of various elements, layers, etc., may be exaggerated for clarity of illustration. The same reference numerals denote the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Furthermore, when describing embodiments of this disclosure, the use of "may" refers to "one or more embodiments of this disclosure." Expressions such as "at least one of" and "any one of" modify the entire list of elements when following it, without modifying individual elements of the list. When phrases such as "at least one of A, B, and C," "at least one of A, B, or C," "at least one selected from the group of A, B, and C," or "at least one selected from A, B, and C" are used to refer to a list of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, and C, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the terms "use," "using," and "being used" may be considered synonymous with the terms "utilize," "using," and "being exploited," respectively. As used herein, the terms “substantially,” “about,” and similar terms are used as approximate terms rather than as terms of degree, and are intended to describe the inherent variations in measured or calculated values ​​that will be recognized by one of ordinary skill in the art.

[0050] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or segment from another element, component, region, layer, or segment. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0051] For ease of description, spatial relation terms such as “below,” “under,” “down,” “above,” and “above” are used herein to describe the relationship of an element or feature to other elements or features as shown in the figures. It will be understood that, in addition to the orientation depicted in the figures, the spatial relation terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features will be oriented “above” or “above” said other elements or features. Therefore, the term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relation descriptions used herein should be interpreted accordingly.

[0052] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, the singular form “a” is also intended to include the plural form unless the context clearly indicates otherwise. It will also be understood that, when used herein, the terms “comprising,” “including,” “including,” and / or “containing” indicate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0053] Furthermore, any numerical range disclosed and / or described herein is intended to include all subranges of the same numerical precision falling within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between the described minimum value of 1.0 and the described maximum value of 10.0 (and including the range between the described minimum value of 1.0 and the described maximum value of 10.0), i.e., all subranges having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits falling within it, and any minimum numerical limit described in this specification is intended to include all higher numerical limits falling within it. Therefore, the applicant reserves the right to amend this specification (including the claims) to expressly describe any subranges falling within the range expressly described herein.

[0054] Referring to two compared elements, features, etc., as “identical” can mean that they are “substantially identical.” Therefore, the phrase “substantially identical” can include cases with deviations considered low in the art (e.g., 5% or less). Furthermore, when a parameter is said to be uniform in a given region, it can mean that it is uniform in terms of average value.

[0055] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0056] Arranging any element "above (or below)" or "on (below)" another element can mean that the arbitrary element can be positioned to contact the upper (or lower) surface of the other element, or that another element can be inserted between the other element and the arbitrary element positioned on (or below) the other element.

[0057] Furthermore, it will be understood that when a component is referred to as “linked,” “combined,” or “connected” to another component, these components can be directly “linked,” “combined,” or “connected” to each other, or another component can be “inserted” between these components.

[0058] Throughout this specification, when “A and / or B” is stated, it means A, B, or A and B, unless otherwise stated. That is, “and / or” includes any or all combinations of the listed items. When “C to D” is stated, it means C or more and D or fewer, unless otherwise stated.

[0059] The terminology used in this specification is for describing embodiments of this disclosure and is not intended to limit this disclosure.

[0060] In the accompanying drawings, for ease of illustration, the dimensions and relative dimensions of the layers and regions shown may be exaggerated. That is, this disclosure is not limited to the dimensions shown in the drawings. Furthermore, throughout the specification, the same reference numerals refer to the same parts. In the following text, "corresponding" may mean identical or substantially identical within a reasonable margin of error.

[0061] Figure 1 This is an exploded perspective view showing an example of a battery assembly according to an embodiment of the present disclosure. Figure 2 This is a plan view illustrating an example of a battery assembly according to an embodiment of the present disclosure.

[0062] Reference Figure 1 and Figure 2 The battery assembly 100 may include a battery cell 110, a protection circuit module 120 electrically connected to the battery cell 110, a fixing band (not shown) for fixing the protection circuit module 120 to the battery cell 110, and a cover band 160 covering the surface of the battery cell 110.

[0063] The battery cell 110 may include an electrode assembly and an outer packaging material 111 surrounding the surface of the electrode assembly. The electrode assembly may include a positive electrode plate, a negative electrode plate, and a separator inserted between the positive and negative electrode plates. Electrode tabs 112 may protrude from one side of the electrode assembly. For example, a positive electrode tab 112a connected to the positive electrode plate may protrude, and a negative electrode tab 112b connected to the negative electrode plate may protrude. The outer packaging material 111 may surround the surface of the electrode assembly, exposing the electrode tabs 112 to the outside.

[0064] The protection circuit module 120 can prevent overcharging, over-discharging, and / or overcurrent of the battery cell 110. The protection circuit module 120 may include a first circuit board 121, a second circuit board 125, and a connecting member. The connecting member can connect the first circuit board 121 and the second circuit board 125 to each other, as will be referred to below. Figures 3 to 11 A more detailed description.

[0065] Electronic components for monitoring and protecting the state of the battery cell 110 can be mounted on the first circuit board 121. For example, electronic components such as relays, capacitors, and positive temperature coefficient (PTC) thermistors can be mounted on one surface of the first circuit board 121.

[0066] The first circuit board 121 can be electrically connected to the battery cell 110. For example, the first circuit board 121 can be electrically connected via electrode terminals to electrode tabs 112 protruding from one side of the battery cell 110. In this case, the electrode terminal connected to the positive electrode tab 112a can be used as a positive electrode terminal, and the electrode terminal connected to the negative electrode tab 112b can be used as a negative electrode terminal.

[0067] The second circuit board 125 may be electrically connected to the first circuit board 121. For example, the second circuit board 125 may be on a surface of the first circuit board 121 opposite to the surface on which electronic components are mounted. The second circuit board 125 may be electrically connected to the first circuit board 121 by various suitable methods such as soldering or blazing.

[0068] The second circuit board 125 can be a detachable circuit board. For example, the second circuit board 125 can be manufactured separately from the first circuit board 121 and then connected to the first circuit board 121 during the assembly process of the protection circuit module 120. For example, the second circuit board 125, which may be designed differently depending on the type of battery assembly 100, can be connected to the first circuit board 121.

[0069] In this embodiment, the second circuit board 125 may correspond to a flexible printed circuit board (FPCB). In this case, the second circuit board 125 can be designed in various suitable forms, thus offering greater design freedom compared to a circuit board made of rigid materials. The rigidity of the second circuit board 125 may be lower than that of the first circuit board 121. For example, the second circuit board 125 may be an FPCB, and the first circuit board 121 may be a PCB. The ends of the second circuit board 125 may include connectors for connection to external devices.

[0070] The first circuit board 121 and the second circuit board 125 may be multilayer printed circuit boards. In some embodiments, each of the first circuit board 121 and the second circuit board 125 may be made of at least one material selected from phenolic resins, epoxy resins, and polyimides. For example, each of the plurality of substrate layers forming the substrate may include at least one material selected from flame retardant 4 (FR4), tetrafunctional epoxy resin, polyphenylene ether, epoxy resin / polyphenylene ether oxide, bismaleimide triazine (BT), aromatic polyamide fibers (e.g., substrate material traded under the name Thermount), cyanate esters, polyimides, and liquid crystal polymers.

[0071] A protection circuit module 120 connected to the battery cell 110 can be mounted on one side of the battery cell 110. A platform portion 113 can be formed on one side of the outer packaging material 111 (e.g., in the direction in which the electrode terminal piece 112 protrudes), and the platform portion 113 can provide space for mounting the protection circuit module 120. For example, an insulating strip can be placed on the platform portion 113, and the protection circuit module 120 can be mounted on the insulating strip.

[0072] Figure 3 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure.

[0073] When viewed in a third direction (e.g., the Z-axis direction), Figure 3 The protection circuit module 300 shown can correspond to Figure 1 and Figure 2 The protection circuit module 120 shown. Figure 3 The recessed portion 314 is indicated by a dashed line to show the location of the recessed portion 314.

[0074] Reference Figure 3 The protection circuit module 300 may include a first circuit board 310, a second circuit board 340, and a bonding member 350. The first circuit board 310 may be electrically connected to a battery cell and may have a suitable shape extending in a first direction (e.g., the X-axis direction). The second circuit board 340 may be electrically connected to the first circuit board 310. The bonding member 350 may bond the first circuit board 310 and the second circuit board 340 together. For example, the bonding member 350 may physically bond the first circuit board 310 and the second circuit board 340 together using adhesive force.

[0075] The first circuit board 310 may include a recess 314 formed at an end 312, the end 312 overlapping the second circuit board 340 in a second direction (e.g., the Y-axis direction) perpendicular to or substantially perpendicular to a first direction (e.g., the X-axis direction). According to an embodiment, the recess 314 may be formed recessed into the first circuit board 310 on the surface of the end 312 facing the first direction (e.g., the X-axis direction). According to an embodiment, the recess 314 may be formed to penetrate the end 312 of the first circuit board 310 in the second direction (e.g., the Y-axis direction). According to an embodiment, the recess 314 may be formed to penetrate the end 312 of the first circuit board in a third direction (e.g., the Z-axis direction) perpendicular to or substantially perpendicular to the first direction (e.g., the X-axis direction) and the second direction (e.g., the Y-axis direction). The shape of the recess 314 may be semi-circular, but this disclosure is not limited thereto; the recess 314 may have various suitable shapes, such as elliptical or polygonal. This will be referred to below. Figures 4 to 11 To describe in more detail.

[0076] The first circuit board 310 may include a contact patch 330. The contact patch 330 may be located on a surface of the first circuit board 310 opposite to the surface on which electronic components are mounted. The contact patch 330 may be connected to the electrode contacts of a battery cell and may be electrically connected to an electrode assembly connected to the electrode contacts. The contact patch 330 may be a conductor through which current for electrical connection can flow. For example, the contact patch 330 may include a nickel (Ni) material. The connection between the contact patch 330 and the electrode contacts may be made by soldering, resistance soldering, laser soldering, or projection soldering.

[0077] Electronic components may be mounted on one surface of the first circuit board 310. According to embodiments, the electronic components described above may include protection integrated circuits (ICs), field-effect transistors (FETs), resistors, capacitors, thermistors, diodes, electrostatic discharge protection elements (e.g., transient voltage suppressor (TVS) diodes), voltage regulators, or suitable combinations thereof, performing functions such as detecting and preventing overcurrent, overheating, etc., of battery cells. However, this disclosure is not limited thereto; the electronic components may include various suitable electronic components for detecting abnormal states of the battery or for storing and / or processing state information. For example, the electronic components may include electrically erasable programmable read-only memory (EEPROM) or microcontroller units (MCUs) for storing and / or processing battery cell state information. Spaces may be formed between electronic components, between electronic components and the first circuit board 310, and on top of the electronic components. According to embodiments, a filling resin may be applied to the spaces and cured in the spaces to form a seal that seals the electronic components, thereby preventing or substantially preventing the penetration of external shocks or moisture, and improving the mechanical stability of the electronic components and the durability of the protection circuit module 300. For example, the filler resin may include epoxy resin, polyurethane resin, silicone resin, acrylic resin, or suitable combinations thereof.

[0078] The second circuit board 340 may have a suitable shape extending in a first direction (e.g., the X-axis direction). The surface of the second circuit board 340 that contacts the first circuit board 310 may be connected to the first circuit board 310 by soldering. However, the method of connecting the surfaces of the first circuit board 310 and the second circuit board 340 that contact each other is not limited to this, and they may be connected to each other by various suitable connection methods.

[0079] The coupling member 350 can bond the first circuit board 310 and the second circuit board 340 together. According to an embodiment, at least a portion of the coupling member 350 can be inserted into the recess 314. The coupling member 350 can be on at least a portion of the recess 314 and at least a portion of the second circuit board 340. As a result, the bonding strength between the first circuit board 310 and the second circuit board 340 can be improved.

[0080] The bonding member 350 may include a suitable material with strong adhesive properties to improve the bonding strength between the first circuit board 310 and the second circuit board 340. For example, the bonding member 350 may include at least one selected from epoxy resin, silicone resin, polyurethane, polyimide, UV-curable resin, and acrylic resin. As a result, the bonding strength between the first circuit board 310 and the second circuit board 340 can be improved. The bonding member 350 can absorb external forces applied to the first circuit board 310 and the second circuit board 340 to prevent or substantially prevent damage to the first circuit board 310 and the second circuit board 340. The bonding member 350 may have high heat resistance to withstand high temperatures.

[0081] Through a coating and curing process, the bonding member 350 can be applied to at least a portion of the recess 314 and at least a portion of the second circuit board 340. The curing process can be a thermosetting or UV curing process, allowing the bonding member 350 to be fixed. Curing conditions can be set or determined according to the characteristics of the bonding member 350. For example, curing conditions may include curing temperature, curing time, etc. As a result, the bonding member 350 can be connected between the first circuit board 310 and the second circuit board 340, or it can be inserted into the recess 314 and cured, thereby improving the mechanical bonding force of the protection circuit module 300.

[0082] Figure 4 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction (e.g., the Y-axis direction) and a connecting member having a width corresponding to the width of the recessed portion.

[0083] Figure 4 This can correspond to when viewed in a second direction (e.g., the Y-axis direction). Figure 3 A plan view of part A. Figure 4 And in the accompanying diagrams, for ease of illustration, Figure 3 The electronic components mounted on the first circuit board 310 and the sealing portion that seals the mounted electronic components are omitted. The first circuit board 410 and the second circuit board 440 may refer to boards protecting the circuit module that do not include the mounted electronic components and the sealing portion.

[0084] Reference Figure 4 At least a portion of the connecting member 450 can be inserted into the recess 414 of the first circuit board 410. For example, the connecting member 450 can be on at least a portion of the recess 414 of the first circuit board 410 and on at least a portion of the second circuit board 440. The connecting member 450 can be on the entire recess 414 of the first circuit board 410 and on a portion of the second circuit board 440.

[0085] According to the implementation, the width w1 of the second circuit board 440 may correspond to the width w2 of the first circuit board 410. In a third direction (e.g., the Z-axis direction), the width w1 of the second circuit board 440 may be the same as or substantially the same as the width w2 of the first circuit board 410.

[0086] According to an implementation, in a third direction (e.g., the Z-axis direction), the center of the second circuit board 440 may correspond to the center of the first circuit board 410. Figure 4 As shown, the center of the width w2 of the first circuit board 410 and the center of the width w1 of the second circuit board 440 can be set to correspond to the virtual center line C.

[0087] According to an embodiment, the recess 414 may be formed to penetrate the end 412 of the first circuit board 410 in a second direction (e.g., the Y-axis direction). On a plane defined by the X-axis and Z-axis (e.g., in a plane such as...) Figure 4 (As shown in the plan view), the recess 414 can have a semi-circular shape. However, the shape of the recess 414 is not limited to this, and the recess 414 can be formed into various suitable shapes.

[0088] According to one embodiment, the recess 414 can be formed by drilling through the end 412 of the first circuit board 410. For example, the recess 414 penetrating the end 412 of the first circuit board 410 can be formed using a drill before the first circuit board 410 is bonded to the second circuit board 440. In another embodiment, the recess 414 can be formed by using a laser to penetrate the end 412 of the first circuit board 410. For example, the recess 414 can be formed by locally heating the end 412 of the first circuit board 410 via a laser and removing the heated portion.

[0089] According to an embodiment, the first circuit board 410 may include a circuit pattern. The circuit pattern may be designed on the first circuit board 410 using a conductive material such as copper (Cu) to allow electrical signals to flow. The circuit pattern may be designed to avoid the portion where a recess 414 is formed at the end 412 of the first circuit board 410. As a result, the design of the circuit pattern may be unaffected by the recess 414 of the first circuit board 410.

[0090] According to an embodiment, the recess 414 may be formed on the central portion of the first circuit board 410 in a third direction intersecting the first and second directions (e.g., a third direction perpendicular to or substantially perpendicular to the first direction (e.g., the X-axis direction) and the second direction (e.g., the Y-axis direction) (e.g., the Z-axis direction)). The center of the recess 414 may be arranged to correspond to a virtual centerline C. However, the location of the recess 414 is not limited to this, and the recess 414 may be formed at various suitable locations at the end 412 of the first circuit board 410.

[0091] According to an embodiment, in a third direction (e.g., the Z-axis direction), the width w3 of the recess 414 can be less than or equal to 50% of the width w2 of the first circuit board 410. The width w2 of the first circuit board 410 can refer to the length of the first circuit board 410 in a third direction (e.g., the Z-axis direction). The width w3 of the recess 414 can refer to the length of the recess 414 in a third direction (e.g., the Z-axis direction).

[0092] According to an embodiment, in a first direction (e.g., the X-axis direction), the length d1 of the recess 414 may be less than or equal to 50% of the width w2 of the first circuit board 410. The length d1 of the recess 414 in the first direction (e.g., the X-axis direction) may be referred to as the depth of the recess 414 penetrating the end 412 of the first circuit board 410.

[0093] According to an embodiment, the coupling member 450 may have a width that decreases with increasing distance from the end 412. The width of the coupling member 450 may refer to its length in a third direction (e.g., the Z-axis direction). The maximum width w4 of the coupling member 450 may be equal to or substantially equal to the width w3 of the recess 414. As a result, the bonding strength between the first circuit board 410 and the second circuit board 440 may be improved. However, this disclosure is not limited thereto, and the coupling member 450 may have a portion whose width increases or remains constant with increasing distance from the end 412.

[0094] Figure 5 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction (e.g., the Y-axis direction) and a connecting member having a width greater than the width of the recessed portion.

[0095] Figure 5 This can correspond to when viewed in a second direction (e.g., the Y-axis direction). Figure 3 A plan view of part A. See below for reference. Figure 5 It is not necessary to repeat the reference above. Figure 4 Redundant descriptions of parts that are the same or substantially the same.

[0096] like Figure 5 As shown, the connecting member 550 may have a width that decreases with increasing distance from the end 412. According to an embodiment, the maximum width w4 of the connecting member 550 may be greater than the width w3 of the recess 414. As a result, the bonding strength between the first circuit board 410 and the second circuit board 440 can be improved. However, this disclosure is not limited thereto; the connecting member 550 may have a portion whose width increases or remains constant with increasing distance from the end 412.

[0097] Figure 6 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction (e.g., the Y-axis direction) and an end including a curved surface at a corner. Figure 6 This can correspond to when viewed in a second direction (e.g., the Y-axis direction). Figure 3 A plan view of part A. See below for reference. Figure 6 It is not necessary to repeat the reference above. Figure 4 and Figure 5 Redundant descriptions of parts that are the same or substantially the same.

[0098] Reference Figure 6 The end portion 612 of the first circuit board 410 may include at least one curved surface at its corners. According to an embodiment, the end portion 612 of the first circuit board 410 may include a curved surface at each of its corners. The corners of the end portion 612 may refer to two edges (e.g., opposite edges) in a third direction (e.g., the Z-axis direction). At least a portion of the bonding member 650 may be located at the corner of the end portion 612. As a result, the bonding strength between the first circuit board 410 and the second circuit board 440 may be improved.

[0099] Figure 7 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a second direction (e.g., the Y-axis direction).

[0100] Figure 7 This can correspond to the view when observed in a third direction (e.g., the Z-axis direction) by Figures 4 to 6 A side view of the section obtained by cutting along the virtual centerline C. See below for reference. Figure 7 It is not necessary to repeat the reference above. Figures 4 to 6 Redundant descriptions of parts that are the same or substantially the same.

[0101] Reference Figure 7 In the second direction (e.g., the Y-axis direction), the thickness t2 of the recess 414 can be equal to or substantially equal to the thickness t3 of the first circuit board 410. The thickness t2 of the recess 414 can refer to the length of the recess 414 in the second direction (e.g., the Y-axis direction).

[0102] like Figure 7As shown, the bonding member 750 can have a thickness that decreases with increasing distance from the recess 414. The thickness of the bonding member 750 can be modified in various ways depending on the designed bonding force of the first circuit board 410 and the second circuit board 440. According to an embodiment, the maximum thickness t1 of the bonding member 750 can be less than or equal to the thickness t2 of the recess 414. In other words, the top end of the bonding member 750 can be lower than or at the same level as the top end of the recess 414.

[0103] Figure 8 This is a plan view illustrating an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a third direction (e.g., the Z-axis direction). Referring below... Figure 8 It is not necessary to repeat the reference above. Figures 4 to 7 Redundant descriptions of parts that are the same or substantially the same.

[0104] Reference Figure 8 In a third direction (e.g., the Z-axis direction), the width w5 of the recess 814 may be equal to or substantially equal to the width w2 of the first circuit board 810. The width w5 of the recess 814 may refer to the length of the recess 814 in a third direction (e.g., the Z-axis direction).

[0105] like Figure 8 As shown, the connecting member 850 may have a width that decreases with increasing distance from the end 812. The width of the connecting member 850 can be modified in various ways depending on the designed bonding force of the first circuit board 810 and the second circuit board 840. According to an embodiment, the maximum width w6 of the connecting member 850 may be equal to or substantially equal to the width w5 of the recess 814. As another example, the maximum width w6 of the connecting member 850 may be less than the width w5 of the recess 814. However, this disclosure is not limited thereto, and the connecting member 850 may have a portion whose width increases or remains constant with increasing distance from the end 812.

[0106] Figure 9 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a third direction (e.g., the Z-axis direction) and a connecting member having a top portion higher than the top portion of the recessed portion. Figure 9 This can correspond to the view when observed in a third direction (e.g., the Z-axis direction) by Figure 8 A side view of the section obtained by cutting along the virtual centerline C. See below for reference. Figure 9 It is not necessary to repeat the reference above. Figures 4 to 8 Redundant descriptions of parts that are the same or substantially the same.

[0107] Reference Figure 9 At least a portion of the connecting member 950 can be inserted into the recess 814 of the first circuit board 810. The connecting member 950 can be on at least a portion of the recess 814 of the first circuit board 810 and on at least a portion of the second circuit board 840. The connecting member 950 can be on the entire recess 814 of the first circuit board 810 and on a portion of the second circuit board 840.

[0108] According to an embodiment, the recess 814 may be formed as an end 812 that penetrates the first circuit board 810 in a third direction (e.g., the Z-axis direction). The recess 814 may have a semi-circular shape in a plane defined by the X and Y axes.

[0109] According to an embodiment, the recess 814 may be formed at the center of the first circuit board 810 in a second direction (e.g., the Y-axis direction). However, the location of the recess 814 is not limited to this, and the recess 814 may be formed at various suitable locations at the end 812 of the first circuit board 810.

[0110] According to an embodiment, in the second direction (e.g., the Y-axis direction), the thickness t5 of the recess 814 can be less than or equal to 50% of the thickness t3 of the first circuit board 810. The thickness t3 of the first circuit board 810 can refer to the length of the first circuit board 810 in the second direction (e.g., the Y-axis direction). The thickness t5 of the recess 814 can refer to the length of the recess 814 in the second direction (e.g., the Y-axis direction).

[0111] According to an embodiment, in a first direction (e.g., the X-axis direction), the length d1 of the recess 814 may be less than or equal to 50% of the thickness t3 of the first circuit board 810. The length d1 of the recess 814 may be referred to as the depth of the recess 814 in the first direction (e.g., the X-axis direction).

[0112] According to an embodiment, the coupling member 950 may have a thickness that decreases with increasing distance from the end portion 812. The maximum thickness t4 of the coupling member 950 may be the same as or substantially the same as the thickness t3 of the first circuit board 810, or may be less than the thickness t3 of the first circuit board 810. The top end of the coupling member 950 may be higher than the top end of the recess 814. The top end of the coupling member 950 may be lower than the top end of the first circuit board 810 or at the same level as the top end of the first circuit board 810.

[0113] Figure 10This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a third direction (e.g., the Z-axis direction) and a connecting member having a top end portion corresponding to the top end portion of the recessed portion. Figure 10 This can correspond to the view when observed in a third direction (e.g., the Z-axis direction) by Figure 8 A side view of the section obtained by cutting along the virtual centerline C. See below for reference. Figure 10 It is not necessary to repeat the reference above. Figures 4 to 9 Redundant descriptions of parts that are the same or substantially the same.

[0114] like Figure 10 As shown, the connecting member 1050 may have a thickness that decreases from a maximum thickness t4 as the distance from the end 812 increases. The thickness of the connecting member 1050 can be modified in various ways depending on the designed bonding force of the first circuit board 810 and the second circuit board 840. According to an embodiment, the top end of the connecting member 1050 may be at the same or substantially the same level as the top end of the recess 814. The top end of the recess 814 may refer to the top end of the recess 814 in a second direction (e.g., the Y-axis direction).

[0115] Figure 11 This is a side view showing an example of a protection circuit module according to an embodiment of the present disclosure, the protection circuit module including a recessed portion penetrating an end in a third direction (e.g., the Z-axis direction) and a connecting member having a top end portion corresponding to the top end portion of the recessed portion. Figure 11 This can correspond to the view when observed in a third direction (e.g., the Z-axis direction) by Figure 8 A side view of the section obtained by cutting along the virtual centerline C. See below for reference. Figure 11 It is not necessary to repeat the reference above. Figures 4 to 10 Redundant descriptions of parts that are the same or substantially the same.

[0116] Reference Figure 11 The recess 814 may be formed from the upper middle portion of the first circuit board 810 to the bottom of the first circuit board 810 in a second direction (e.g., the Y-axis direction). Therefore, the recess 814 may have a shape that covers at least a portion of the bonding member 1150.

[0117] like Figure 11As shown, the connecting member 1150 may have a thickness that decreases from a maximum thickness t4 as the distance from the end 812 increases. The thickness of the connecting member 1150 may be modified in various ways depending on the designed bonding force of the first circuit board 810 and the second circuit board 840. According to an embodiment, the top end of the connecting member 1150 may be at the same or substantially the same level as the top end of the recess 814. The top end of the recess 814 may refer to the top end of the recess 814 in a second direction (e.g., the Y-axis direction).

[0118] Although the present disclosure has been described above with respect to embodiments thereof, the present disclosure is not limited thereto. Various modifications and variations may be made by those skilled in the art within the spirit of the present disclosure and the equivalents of the appended claims.

Claims

1. A protection circuit module, comprising: A first circuit board is electrically connected to a battery cell and extends in a first direction; The second circuit board is electrically connected to the first circuit board; as well as The first circuit board and the second circuit board are joined together using a connecting component. Wherein, the first circuit board includes a recess at the end that overlaps with the second circuit board along a second direction intersecting the first direction, and at least a portion of the connecting member is inserted into the recess.

2. The protection circuit module according to claim 1, wherein, The recessed portion has a shape that is recessed into the interior of the first circuit board on the surface of the end facing the first direction.

3. The protection circuit module according to claim 1, wherein, The recessed portion penetrates the end of the first circuit board in the second direction.

4. The protection circuit module according to claim 3, wherein, The recessed portion is located at the center of the first circuit board on a third direction intersecting the first and second directions.

5. The protection circuit module according to claim 3, wherein, In a third direction intersecting the first and second directions, the width of the recess is less than or equal to 50% of the width of the first circuit board.

6. The protection circuit module according to claim 3, wherein, In the first direction, the length of the recess is less than or equal to 50% of the width of the first circuit board.

7. The protection circuit module according to claim 3, wherein, The connecting member has a width that decreases as the distance from the end increases, and the maximum width of the connecting member is greater than or equal to the width of the recess.

8. The protection circuit module according to claim 1, wherein, The recessed portion penetrates the end of the first circuit board upwards at a third direction intersecting the first and second directions.

9. The protection circuit module according to claim 8, wherein, The recessed portion is located at the center of the first circuit board in the second direction.

10. The protection circuit module according to claim 8, wherein, In the second direction, the thickness of the recess is less than or equal to 50% of the thickness of the first circuit board.

11. The protection circuit module according to claim 8, wherein, In the first direction, the length of the recess is less than or equal to 50% of the thickness of the first circuit board.

12. The protection circuit module according to claim 8, wherein, The connecting member has a thickness that decreases with increasing distance from the end, and the top end of the connecting member is higher than or at the same level as the top end of the recess.

13. The protection circuit module according to claim 1, wherein, The bonding component includes at least one of epoxy resin, silicone resin, polyurethane, polyimide, UV-curable resin and acrylic resin.

14. The protection circuit module according to claim 1, wherein, The width of the second circuit board corresponds to the width of the first circuit board.

15. The protection circuit module according to claim 14, wherein, In a third direction intersecting the first and second directions, the center of the second circuit board corresponds to the center of the first circuit board.

16. A battery assembly, comprising: Battery cell, including electrode terminals; as well as The protection circuit module is electrically connected to the electrode terminals. The protection circuit module includes: A first circuit board is electrically connected to the battery cell and extends in a first direction; A second circuit board, electrically connected to the first circuit board; and The first circuit board and the second circuit board are joined together using a connecting component. Wherein, the first circuit board includes a recess at the end that overlaps with the second circuit board along a second direction intersecting the first direction, and at least a portion of the connecting member is inserted into the recess.

17. The battery assembly of claim 16, wherein, The recessed portion has a shape that is recessed into the interior of the first circuit board on the surface of the end facing the first direction.

18. The battery assembly of claim 16, wherein, The recessed portion penetrates the end of the first circuit board in the second direction.

19. The battery assembly of claim 16, wherein, The recessed portion penetrates the end of the first circuit board upwards at a third direction intersecting the first and second directions.

20. The battery assembly of claim 16, wherein, The bonding component includes at least one of epoxy resin, silicone resin, polyurethane, polyimide, UV-curable resin and acrylic resin.

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