A protection circuit module and a battery assembly including the same

Abstract

Disclosed are a protection circuit module and a battery assembly including the same. The protection circuit module includes a protection circuit board extending in a first direction, and a flexible circuit board electrically connected to the protection circuit board, wherein the protection circuit board includes a first joint portion overlapping the flexible circuit board in a second direction perpendicular to the first direction, the first joint portion of the protection circuit board is coupled to the flexible circuit board, and a thickness of the first joint portion is less than a thickness of an area of the protection circuit board other than the first joint portion.

Description

Technical Field

[0001] This disclosure relates to a protection circuit module and a battery assembly including the protection circuit module. Background Technology

[0002] Unlike primary batteries, which are not designed for (re)charging, secondary (or rechargeable) batteries are designed to discharge and be recharged. Low-capacity secondary batteries are used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources to drive motors in hybrid and electric vehicles and to store electricity (e.g., household and / or utility-scale power storage). A secondary battery typically includes an electrode assembly containing positive and negative electrodes, a housing of the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] Secondary batteries can be equipped with a protection circuit module (PCM) to protect the battery from overcharging, over-discharging, or overcurrent. The protection circuit module can prevent the battery from catching fire or exploding by blocking current when the battery's internal temperature or voltage rises.

[0004] The information disclosed in this background section is intended to enhance the understanding of the background of this disclosure, and therefore may contain information that does not constitute related (or prior art). Summary of the Invention

[0005] An embodiment includes a protection circuit module comprising: a protection circuit board extending in a first direction; and a flexible circuit board electrically connected to the protection circuit board, wherein the protection circuit board includes a first binding portion overlapping the flexible circuit board in a second direction perpendicular to the first direction, the first binding portion of the protection circuit board being coupled to the flexible circuit board, and the thickness of the first binding portion being less than the thickness of the area of ​​the protection circuit board excluding the first binding portion.

[0006] The flexible circuit board may include a second connection portion that overlaps with the protective circuit board in a second direction perpendicular to the first direction.

[0007] The protective circuit board may include a first protective layer, a base layer and a second protective layer stacked in sequence, and at least a portion of the first protective layer is removed in the first connection portion.

[0008] Each of the first protective layer and the second protective layer may include a first insulating layer, a first copper layer, a second copper layer, and a second insulating layer.

[0009] The flexible circuit board may include a first flexible protective layer, a flexible base layer and a second flexible protective layer stacked in sequence, and in the second connection portion, at least a portion of the first flexible protective layer is removed.

[0010] The first flexible protective layer may include a covering film layer.

[0011] The first connection portion may be located at one end of the protective circuit board.

[0012] The second connection portion may be located at one end of the flexible circuit board.

[0013] The protection circuit module may further include insulating resin between the protection circuit board and the flexible circuit board.

[0014] The insulating resin may include: a first insulating portion between the protective circuit board and the flexible circuit board in the second direction; and a second insulating portion between the protective circuit board and the flexible circuit board in the first direction.

[0015] The flexible circuit board may further include at least one connecting member on the second connection portion, the flexible circuit board being electrically connected to the protection circuit board via the at least one connecting member.

[0016] The at least one connecting member can be connected to the portion of the flexible base layer located in the second connecting portion and the portion of the base layer of the protective circuit board located in the first connecting portion.

[0017] The base layer of the protective circuit board may include: a plurality of second copper layers, and an insulating layer between the plurality of second copper layers.

[0018] The flexible base layer may include: a plurality of first copper layers, and a flexible copper-clad laminate between the plurality of first copper layers.

[0019] The flexible circuit board may include at least one connecting member on the flexible base layer, the at least one connecting member being electrically connected to the flexible base layer and the base layer of the protective circuit board.

[0020] An embodiment includes a protection circuit module comprising: a protection circuit board extending in a first direction; a flexible circuit board overlapping the protection circuit board in a second direction perpendicular to the first direction; and a connecting member between the protection circuit board and the flexible circuit board, wherein the protection circuit board may include: a base layer; a first protective layer on a lower surface of the base layer, the first protective layer not overlapping the flexible circuit board in the second direction; and a second protective layer on an upper surface of the base layer, wherein the flexible circuit board may include: a flexible base layer; a first flexible protective layer on an upper surface of the flexible base layer, the first flexible protective layer not overlapping the protection circuit board in the second direction; and a second flexible protective layer on a lower surface of the flexible base layer, and wherein the connecting member electrically connects the lower surface of the base layer of the protection circuit board to the upper surface of the flexible base layer.

[0021] The lower surface of the protective circuit board may include a first stepped surface formed by the first protective layer, and the upper surface of the flexible circuit board includes a second stepped surface formed by the first flexible protective layer, the second stepped surface corresponding to the first stepped surface.

[0022] The protection circuit module may further include an insulating resin between the protection circuit board and the flexible circuit board, wherein the insulating resin may include: a first insulating portion between the base layer of the protection circuit board and the flexible base layer in the second direction; and a second insulating portion between the first protective layer and the flexible circuit board in the first direction.

[0023] An embodiment includes a battery assembly comprising: a battery cell including electrode terminals; and a protection circuit module electrically connected to the electrode terminals, wherein the protection circuit module may include: a protection circuit board electrically connected to the battery cell, the protection circuit board extending in a first direction; and a flexible circuit board electrically connected to the protection circuit board, wherein the protection circuit board includes a first connection portion overlapping the flexible circuit board in a second direction perpendicular to the first direction, the first connection portion of the protection circuit board being coupled to the flexible circuit board, and the thickness of the first connection portion being less than the thickness of the area of ​​the protection circuit board excluding the first connection portion.

[0024] The flexible circuit board may include a second connection portion that overlaps with the protective circuit board in a second direction perpendicular to the first direction. The second connection portion of the flexible circuit board is connected to the protective circuit board, and the thickness of the second connection portion is less than the thickness of the area of ​​the flexible circuit board other than the second connection portion.

[0025] However, the aspects and features of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the detailed description below that other aspects and features not mentioned will be present. Attached Figure Description

[0026] The accompanying drawings illustrate embodiments of the present disclosure and, together with the detailed description thereof, further describe aspects and features of the disclosure. Therefore, this disclosure should not be construed as limited to the drawings.

[0027] Features will become apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0028] Figure 1 This is an exploded perspective view illustrating a battery assembly 100 according to an embodiment of the present disclosure;

[0029] Figure 2 This is a plan view illustrating a battery assembly 100 according to an embodiment of the present disclosure;

[0030] Figure 3 An example of a protection circuit module according to an embodiment of the present disclosure;

[0031] Figure 4 Examples illustrating the connection between a protective circuit board and a flexible circuit board according to embodiments of the present disclosure;

[0032] Figure 5 Examples illustrating the connection between a protective circuit board and a flexible circuit board according to embodiments of the present disclosure;

[0033] Figure 6 Examples illustrating a stacked structure constituting a protective circuit board according to embodiments of the present disclosure;

[0034] Figure 7 Examples of layers constituting a flexible circuit board according to embodiments of the present disclosure are shown;

[0035] Figure 8 Exemplary insulating resin and connecting members in an interconnection structure between a protective circuit board and a flexible circuit board according to embodiments of the present disclosure; and

[0036] Figure 9 An example illustrating the connection between a protective circuit board and a flexible circuit board according to an embodiment of the present disclosure. Detailed Implementation

[0037] Exemplary embodiments will now be described more fully below with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be comprehensive and complete, and will fully convey exemplary implementation methods to those skilled in the art.

[0038] In the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when a layer or element is referred to as "on" another layer or substrate, it may be directly on that other layer or substrate, or there may be intervening layers. Furthermore, it will be understood that when a layer is referred to as "below" another layer, it may be directly below, and there may be one or more intervening layers. Additionally, it will be understood that when a layer is referred to as "between two layers," it may be the only layer between those two layers, or there may be one or more intervening layers. Similar reference numerals always refer to similar elements.

[0039] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be construed as limited to their general or dictionary meaning, and should be interpreted as consistent with the technical ideas of the present disclosure, based on the principle that the inventor is capable of being his / her own lexicographer to appropriately define the concepts of the terms in order to best describe his / her invention. Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely some of the embodiments of the present disclosure and do not represent all the technical ideas, aspects, and features of the present disclosure. Accordingly, it should be understood that various equivalents and modifications that can replace or modify the embodiments described herein may exist at the time of filing this application.

[0040] Furthermore, it will be understood that the terms “comprising” and / or “including” as used in this specification specify the presence of the stated features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0041] Furthermore, in the figures, the dimensions of various components, layers, etc., may be exaggerated for clarity. The same reference numerals are used to label the same components.

[0042] Referring to two compared elements, features, etc., as “identical” can mean that they are “substantially identical.” Therefore, the phrase “substantially identical” can include cases where the deviation is considered low in the art (e.g., 5% or less). Additionally, when a parameter is said to be consistent in a given region, it can mean that it is consistent in terms of average value.

[0043] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Therefore, unless the context clearly indicates otherwise, the first element may be referred to as the second element.

[0044] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0045] Placing any element "above (or below)" or "on (or under)" another element can mean that the arbitrary element can be positioned to contact the upper (or lower) surface of the element, and that the other element can be positioned between the element and the arbitrary element positioned on (or under) the element.

[0046] Furthermore, it will be understood that when a component is referred to as “connected,” “linked,” or “attached” to another component, these components may be directly “connected,” “linked,” or “attached” to each other, or another component may be “intermediate” between these components. It will also be understood that when an element is referred to as “electrically connected” to another element, it may be directly connected to the other element, or an intermediary element may be present.

[0047] Throughout this specification, unless otherwise stated, when “A and / or B” is used, it means A, B, or A and B. That is, “and / or” includes any or all of the listed items. Unless otherwise stated, when “C~D” is used, it means C and below D.

[0048] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure.

[0049] Secondary batteries can be classified into can-type and bag-type based on the shape of their casing, and can-type batteries can be classified into prismatic and cylindrical types. When a secondary battery is can-type, the battery cell may include a can having a generally cuboid or cylindrical shape, and a lid assembly connected to the opening of the can to seal the can. The battery cell may include a battery casing, electrode assemblies housed within the battery casing, and electrolyte.

[0050] When the casing is can-shaped, the battery cells and the protection circuit module are electrically connected via conductors called leads or lead plates. For example, the lead plate can be attached to the battery cells simultaneously with the protection circuit module by methods such as soldering. In this disclosure, the configuration of the protection circuit module being connected to the battery cells as described above can be referred to as a battery assembly.

[0051] Additionally, the structure used to cover the space between the battery cell and the protection circuit module, as well as the surface of the protection circuit module, can be formed by molding with molding resin or by using a separate outer housing. The terminal block connection portion of the protection circuit module is connected to the lead plate to electrically connect to the battery cell, and the external connection terminals can be connected to external electronic devices to form an electrical path during charging and discharging.

[0052] The secondary battery formed as described above is called a battery cell, and the battery cell can be electrically connected to a protection circuit module to form a battery assembly. In this disclosure, the case of a pouch-type secondary battery cell is described as an example, but it can include secondary batteries of various shapes and structures such as prism, cylinder, and coin type.

[0053] Figure 1 This is an exploded perspective view illustrating a battery assembly 100 according to an embodiment of the present disclosure. Figure 2 This is a plan view illustrating a battery assembly 100 according to an embodiment of the present disclosure.

[0054] refer to Figure 1 The battery assembly 100 may include a battery cell 110, a protection circuit module 120 electrically connected to the battery cell 110, a fixing strap for fixing the protection circuit module 120 to the battery cell 110, and a covering strap 160 covering the surface of the battery cell 110.

[0055] The battery cell 110 may include an electrode assembly and an outer bag material 111 covering the surface of the electrode assembly. The electrode assembly may include a positive electrode plate, a negative electrode plate, and a separator between the positive and negative electrode plates. Electrode tabs 112 may protrude from one side of the electrode assembly. For example, a positive electrode tab 112a connected to the positive electrode plate may protrude, and a negative electrode tab 112b connected to the negative electrode plate may protrude. The outer bag material 111 may wrap around the surface of the electrode assembly, exposing the electrode tabs 112 to the outside.

[0056] The protection circuit module 120 serves to prevent overcharging, over-discharging, and / or overcurrent of the battery cell 110. The protection circuit module 120 may include a protection circuit board 121, a flexible circuit board 125, and insulating resin. The insulating resin is located between the protection circuit board 121 and the flexible circuit board 125, which will be applied later. Figure 8 As described in the text.

[0057] Electronic components 122 used to monitor and protect the state of battery cell 110 can be mounted on protection circuit board 121. For example, electronic components 122 such as relays, capacitors and PTC (positive temperature coefficient) thermistors can be mounted on protection circuit board 121.

[0058] The protection circuit board 121 can be electrically connected to the battery cell 110. For example, the protection circuit board 121 can be electrically connected via electrode terminals to electrode tabs 112 protruding from one side of the battery cell 110. In this case, the electrode terminal connected to the positive electrode tab 112a can be used as a positive electrode terminal, and the electrode terminal connected to the negative electrode tab 112b can be used as a negative electrode terminal.

[0059] The flexible circuit board 125 can be connected to the protective circuit board 121. For example, the flexible circuit board 125 can be disposed on another surface of the protective circuit board 121, which is opposite to the surface of the protective circuit board 121 on which the electronic components 122 are mounted. The flexible circuit board 125 can be electrically connected to the protective circuit board 121 by methods such as soldering and other techniques.

[0060] In one embodiment, the flexible circuit board 125 may be a separable circuit board. For example, the flexible circuit board 125 may be manufactured separately from the protection circuit board 121, and then connected to the protection circuit board 121 during the assembly step of the protection circuit module 120. Accordingly, various designs of the protection circuit board 121 may be feasible. For example, by changing only the design of the flexible circuit board 125 according to the type of battery assembly 100 and connecting the flexible circuit board 125 to the protection circuit board 121, the protection circuit board 121 can be applied to various types of battery assemblies 100.

[0061] In one embodiment, the flexible circuit board 125 may correspond to an FPCB (flexible printed circuit board). In this case, the flexible circuit board 125 can be designed in various forms, allowing for a high degree of design freedom compared to a circuit board made of a rigid material.

[0062] The flexible circuit board 125 may include an extension. The extension may refer to a portion that protrudes from one end of the protective circuit board 121 along its length (e.g., the X-axis direction). A connector for connecting to an external device may be attached to one end of the extension.

[0063] The protection circuit module 120 connected to the battery cell 110 can be mounted on one side of the battery cell 110. A platform portion 113 can be mounted on one side of the outer material 111 of the bag (e.g., in the direction in which the electrode tabs 112 protrude), and the platform portion 113 can provide space for mounting the protection circuit module 120. For example, an insulating strip can be provided on the platform portion 113, and the protection circuit module 120 can be mounted on this insulating strip.

[0064] refer to Figure 1 and Figure 2The battery assembly 100 may include a battery cell 110 and a protection circuit module 120. The battery cell 110 may include a pouch material 111 covering the exterior of the battery cell 110. The pouch material 111 may include a platform portion 113 protruding in the direction in which the electrode terminals of the battery cell 110 protrude. The protection circuit module 120 may be mounted on the platform portion 113 of the pouch material 111.

[0065] The protection circuit module 120 may include a protection circuit board 121 and a flexible circuit board 125. The protection circuit board 121 and the flexible circuit board 125 may extend in a first direction (e.g., the X-axis direction). At least a portion of the protection circuit board 121 may overlap with the flexible circuit board 125 in a second direction perpendicular to the first direction (e.g., the Z-axis direction). For example, the protection circuit board 121 and the flexible circuit board 125 may be connected by soldering or brazing.

[0066] Figure 3 An example of a protection circuit module 300 according to an embodiment of the present disclosure is shown. Figure 3 The protection circuit module 300 in the middle is Figure 1 and Figure 2 Example of protection circuit module 120. For example, protection circuit module 300 can be used with [the circuit viewed in the Y-axis direction]. Figure 1 and Figure 2 The protection circuit module 120 shown corresponds to this.

[0067] The protection circuit module 300 may include a protection circuit board 310, a flexible circuit board 320, and a connector portion 330. Although the shape of the electronic components is shown on the protection circuit board 310, it can vary.

[0068] The protective circuit board 310 is electrically connected to the battery cell and can extend in a first direction (e.g., the X-axis direction). The protective circuit board 310 may include a first connecting portion 310a that overlaps with the flexible circuit board 320 in a second direction perpendicular to the first direction (e.g., the Z-axis direction). According to one embodiment, the first connecting portion 310a may be located at one end of the protective circuit board 310.

[0069] The flexible circuit board 320 includes a second connecting portion 320a that overlaps with the protective circuit board 310 in a second direction perpendicular to the first direction (e.g., the Z-axis direction). The second connecting portion 320a of the flexible circuit board 320 can be coupled to the protective circuit board 310. The second connecting portion 320a can be located at one end of the flexible circuit board 320. The flexible circuit board 320 can be electrically connected to the protective circuit board 310. The first connecting portion 310a of the protective circuit board 310 can be coupled to the flexible circuit board 320. For example, the first connecting portion 310a and the second connecting portion 320a can be coupled.

[0070] According to one embodiment, the thickness of the first connecting portion 310a (e.g., in the Z-axis direction) can be less than the thickness of the area in the protective circuit board 310 excluding the first connecting portion 310a. The thickness of the second connecting portion 320a (e.g., in the Z-axis direction) can be less than the thickness of the area in the flexible circuit board 320 excluding the second connecting portion 320a. By reducing the thickness of the first connecting portion 310a and the second connecting portion 320a, the first connecting portion 310a and the second connecting portion 320a can be connected in a block form. As a result, the overall thickness of the protective circuit module 300 in which the protective circuit board 310 and the flexible circuit board 320 are connected can be reduced. This configuration can reduce the thickness of the battery assembly. For example, the fastening thickness between the protective circuit board 310 and the flexible circuit board 320 can be reduced.

[0071] Electronic components may be mounted on one surface of the protection circuit board 310. According to one embodiment, the electronic components may include protective integrated circuits (ICs), field-effect transistors (FETs), resistors, capacitors, thermistors, diodes, electrostatic discharge devices (e.g., transient voltage suppression (TVS) diodes), and voltage regulators or combinations thereof for detecting and blocking overvoltage, overcurrent, and overheating of individual battery cells. However, the electronic components may include various electronic components for detecting abnormal states of the battery or storing and / or processing state information. For example, the electronic components may include electrically erasable programmable read-only memory (EEPROM) or microcontroller units (MCUs) for storing and / or processing state information of individual battery cells. Predetermined spaces may be formed between electronic components, between electronic components and the protection circuit board 310, and above the electronic components. According to one embodiment, a filling resin may be applied to the predetermined space and cured to prevent external impact or moisture penetration and to improve the mechanical stability of the electronic components and the durability of the protection circuit module 300. For example, the filling resin may include epoxy resin, urethane resin, silicone resin, acrylic resin, or combinations thereof.

[0072] The terminal block connection portion 330 can be disposed on another surface of the protective circuit board 310, opposite to the surface of the protective circuit board 310 on which electronic components are mounted. The terminal block connection portion 330 connects to the electrode terminals of the battery cell and can be electrically connected to the electrode assembly connected to the electrode terminals. The terminal block connection portion 330 can be a conductor through which current for electrical connection can flow. For example, the terminal block connection portion 330 can be made of nickel. The connection between the terminal block connection portion 330 and the electrode terminals can be made by soldering, resistance welding, laser welding, or projection welding.

[0073] Figure 4 An example illustrating the connection between the protection circuit board 410 and the flexible circuit board 420 according to an embodiment of the present disclosure is shown. Reference Figure 4 , Figure 4 The protection circuit module 400 in the middle is Figure 1 and Figure 2 An example of the protection circuit module 120. The protection circuit module 400 may include a protection circuit board 410 and a flexible circuit board 420.

[0074] The protective circuit board 410 may include a first protective layer 412, a base layer 414, and a second protective layer 416 sequentially stacked in a second direction (e.g., the Z-axis direction). In one embodiment, the second protective layer 416 may be on the upper surface of the base layer 414. The first protective layer 412, the base layer 414, and the second protective layer 416 may each include at least one layer, and will be discussed later. Figure 6 Detailed description is provided.

[0075] The protective circuit board 410 may include a first connecting portion 410a as a region overlapping the flexible circuit board 420 in a second direction. The thickness of the first connecting portion 410a may be less than the thickness of the region in the protective circuit board 410 excluding the first connecting portion 410a. For example, in the first connecting portion 410a, at least a portion of the first protective layer 412 may be removed. According to one embodiment, in the first connecting portion 410a, the first protective layer 412 may be removed, and the first connecting portion 410a may include only the base layer 414 and the second protective layer 416. According to another embodiment, in the first connecting portion 410a, a portion of the first protective layer 412 may be removed, and the first connecting portion 410a may include the base layer 414, the second protective layer 416, and a portion of the first protective layer 412.

[0076] The flexible circuit board 420 may include a first flexible protective layer 422, a flexible base layer 424, and a second flexible protective layer 426 sequentially stacked in a direction opposite to the second direction. In one embodiment, the second flexible protective layer 426 may be on the lower surface of the flexible base layer 424. The first flexible protective layer 422, the flexible base layer 424, and the second flexible protective layer 426 may each include at least one layer, and will be discussed later. Figure 7 Detailed description is provided.

[0077] According to one embodiment, in the first connection portion 410a, the first protective layer 412 is removed, and the base layer 414 can be exposed to the outside. One surface of the exposed base layer 414 of the first connection portion 410a can face a corresponding surface of the first flexible protective layer 422 of the second connection portion 420a. One surface of the base layer 414 and one surface of the first flexible protective layer 422 can be electrically connected.

[0078] Figure 5 An example of the connection between the protection circuit board 510 and the flexible circuit board 520 according to an embodiment of the present disclosure is shown.

[0079] refer to Figure 5 , Figure 5 The protection circuit module 500 in the middle is Figure 1 and Figure 2 An example of the protection circuit module 120. The protection circuit module 500 may include a protection circuit board 510 and a flexible circuit board 520.

[0080] The protective circuit board 510 may include a first protective layer 512, a base layer 514, and a second protective layer 516 sequentially stacked in a second direction. The first protective layer 512, the base layer 514, and the second protective layer 516 may each include at least one layer, and will be described later... Figure 6 Detailed description is provided.

[0081] The protective circuit board 510 may include a first connecting portion 510a as a region overlapping with the flexible circuit board 520 in a second direction. The configuration of the first connecting portion 510a can be... Figure 4 The configuration described in the document corresponds to that described in the document, and redundant descriptions of the first connection portion 510a are omitted.

[0082] The flexible circuit board 520 may include a first flexible protective layer 522, a flexible base layer 524, and a second flexible protective layer 526 sequentially stacked in a direction opposite to the second direction. The first flexible protective layer 522, the flexible base layer 524, and the second flexible protective layer 526 may each include at least one layer, and will be discussed later. Figure 7 Detailed description is provided.

[0083] The flexible circuit board 520 includes a second connecting portion 520a as a region overlapping with the protective circuit board 510 in a second direction. The thickness of the second connecting portion 520a may be less than the thickness of the regions in the flexible circuit board 520 other than the second connecting portion 520a. For example, in the second connecting portion 520a, the first flexible protective layer 522 may be removed. According to one embodiment, in the second connecting portion 520a, the first flexible protective layer 522 may be removed, and the second connecting portion 520a may include only the flexible base layer 524 and the second flexible protective layer 526. According to another embodiment, in the second connecting portion 520a, a portion of the first flexible protective layer 522 may be removed. The second connecting portion 520a may include the flexible base layer 524, the second flexible protective layer 526, and a portion of the first flexible protective layer 522.

[0084] According to one embodiment, in the first connection portion 510a, the first protective layer 512 can be removed, thus exposing the base layer 514 to the outside, and in the second connection portion 520a, the first flexible protective layer 522 can be removed, thus exposing the flexible base layer 524 to the outside. One surface of the exposed base layer 514 can face a corresponding surface of the flexible base layer 524. One surface of the base layer 514 and one surface of the flexible base layer 524 can be electrically connected.

[0085] According to one embodiment, the first protective layer may be present only in a portion of the lower surface of the protective circuit board. According to another embodiment, the first protective layer may be present on the lower surface of the base layer, and the first protective layer may not overlap with the flexible circuit board in the second direction. For example, a first stepped surface 518 may be present on the lower surface of the protective circuit board due to the height difference between the area where the first protective layer is formed and the area where the first protective layer is not formed. In other words, the lower surface of the protective circuit board may include the first stepped surface 518 formed using the first protective layer. The first flexible protective layer may be present only in some areas of the upper surface of the flexible base layer of the flexible circuit board. According to one embodiment, the first flexible protective layer may be present on the upper surface of the flexible base layer, and the first flexible protective layer may not overlap with the protective circuit board in the second direction. For example, a second stepped surface 528 may be formed due to the height difference between the area where the first flexible protective layer is formed and the area where the first flexible protective layer is not formed. In other words, the upper surface of the flexible circuit board may include the second stepped surface 528 formed using the first flexible protective layer. The second stepped surface 528 may be arranged to correspond to the first stepped surface 518, through which the protective circuit board and the flexible circuit board are aligned along the second direction, thereby enhancing the structural connection stability between the two boards.

[0086] According to one embodiment, the connecting member 540 is located on the second connection portion 520a and can electrically connect the flexible circuit board 520 to the protective circuit board 510. For example, the connecting member 540 may be located between the second copper layer of the base layer 514 and the first copper layer of the flexible base layer 524. For example, the connecting member 540 can electrically connect the lower surface of the base layer 514 to the upper surface of the flexible base layer 524. For example, the connecting member 540 may be located on the upper surface of the copper layer included in the flexible base layer 524 of the flexible circuit board 520 and may be configured to overlap with the first connection portion 510a of the protective circuit board 510 along a second direction. For example, the first connection portion 510a is the area where the first protective layer 512 of the protective circuit board 510 is removed and may have a structure in which the second copper layer of the base layer 514 is exposed to the outside. Accordingly, the connecting member 540 is located between the copper layer of the flexible circuit board 520 and the copper layer of the protective circuit board 510 and may be formed as a conductive bonding structure that electrically connects the two conductive layers.

[0087] In one embodiment, the flexible circuit board 520 may include a connecting member 540, which may be pre-formed on the surface of the second connection portion 520a before the flexible circuit board 520 is coupled to the protective circuit board 510. For example, the connecting member 540 may be formed by applying solder paste to the copper layer of the flexible base layer 524, followed by a reflow method or thermoforming process after alignment and stacking with the protective circuit board 510. For example, the connecting member 540 is a conductive member formed in a localized area and may facilitate the formation of current paths, such as signal lines or power lines, between the protective circuit board 510 and the flexible circuit board 520. The connecting member 540 may be formed by soldering. More details will follow later. Figure 8 The connecting member 540 is described in the text.

[0088] Figure 6 Examples of stacked structures constituting a protection circuit board 600 according to embodiments of the present disclosure are shown.

[0089] Protection circuit board 600 is Figure 5 An example of a protective circuit board 510 is shown. The protective circuit board 600 may include a first protective layer 512, a base layer 514, and a second protective layer 516 sequentially stacked in a second direction. The first protective layer 512, the base layer 514, and the second protective layer 516 may each include at least one layer, and will be described below.

[0090] The first protective layer 512 may include a first insulating layer 610, a first copper layer 620, a second copper layer 630, and a second insulating layer 640. The first insulating layer 610, the first copper layer 620, the second copper layer 630, and the second insulating layer 640 may be stacked sequentially in a second direction. For example, the first insulating layer 610 may be located at the bottom of the first protective layer 512, and the second insulating layer 640 may be located at the top of the first protective layer 512. The first insulating layer 610 serves to distinguish the soldered area from the insulating area. The first copper layer 620 and the second copper layer 630 can be used as signal movement paths. The second insulating layer 640 serves to bond and insulate between the upper and lower layers.

[0091] The first copper layer 620 may be a copper plating layer formed on the surface by electroplating after circuit formation. According to one embodiment, the first copper layer 620 may be formed on the second copper layer 630 by electroplating for purposes such as improving conductivity, ensuring surface flatness, and improving solderability after circuit formation. The first copper layer 620 may be selectively formed in connection pad areas or wiring pattern areas as needed, and may serve as a surface conductor for electrical connection to external circuits. The first copper layer 620 may help improve interfacial adhesion characteristics with solder mask patterns or surface treatment layers in subsequent processes.

[0092] The second copper layer 630 may be a copper layer for circuit formation disposed adjacent to the insulating layer. In one embodiment, the second copper layer 630 is included in the first protective layer 512 of the protective circuit board 600 and may be a layer of copper material stacked for forming conductive circuit patterns. Wiring patterns may be formed on the second copper layer 630 by photolithography and chemical etching processes, and the second copper layer 630 may be used as internal signal lines or connection pads. The second copper layer 630 ensures adhesion stability at the interface with the upper and lower insulating layers and may help improve the electrical characteristics and mechanical durability of the entire circuit board.

[0093] The first insulating layer 610 and the second insulating layer 640 may each include a photosensitive insulating layer or an adhesive insulating layer. In one embodiment, the photosensitive insulating layer may comprise an insulating material with photosensitive properties. For example, a predetermined pattern can be formed on the photosensitive insulating layer by an exposure process and a development process, and wiring formation areas and non-contact areas on the photosensitive insulating layer can be selectively distinguished. In one embodiment, the adhesive insulating layer may be a structure in which a separate adhesive material is applied to the surface of the insulating layer. For example, the adhesive insulating layer may be formed in the form of an acrylic or epoxy adhesive applied to a polyimide (PI) or polyester (PET) type film. In other embodiments, the adhesive insulating layer may be composed of a thermosetting insulating material or a thermoplastic insulating material, wherein the insulating layer itself has adhesive properties. Depending on the required pattern forming accuracy, adhesive strength, insulation properties, etc., the insulating layer may comprise a single layer or a stacked structure consisting of at least one layer.

[0094] The second protective layer 516 may include a first insulating layer 610, a first copper layer 620, a second copper layer 630, and a second insulating layer 640. The first insulating layer 610, first copper layer 620, second copper layer 630, and second insulating layer 640 of the second protective layer 516 may be stacked sequentially in a direction opposite to the second direction. For example, the second insulating layer 640 may be disposed at the bottommost portion of the second protective layer 516, and the first insulating layer 610 may be disposed at the topmost portion of the second protective layer 516. The function of each layer may be the same as that of the first insulating layer 610, first copper layer 620, second copper layer 630, and second insulating layer 640 of the first protective layer 512 described above.

[0095] The base layer 514 may include a plurality of second copper layers 650 and an insulating layer 660 between the plurality of second copper layers 650. The plurality of second copper layers 650 and the insulating layer 660 between the plurality of second copper layers 650 may be stacked sequentially in a second direction. For example, the second copper layers 650 may be disposed at the bottommost and topmost portions of the base layer 514. The insulating layer 660 between the plurality of second copper layers 650 may serve as a signal transmission path.

[0096] The base layer 514 may be located between the second insulating layer 640 of the first protective layer 512 and the second insulating layer 640 of the second protective layer 516. For example, a plurality of second copper layers 650 of the base layer 514 may be located between the second insulating layer 640 of the first protective layer 512 and the second insulating layer 640 of the second protective layer 516.

[0097] The protective circuit board 600 may include a first connection portion 600a as a region overlapping with the flexible circuit board in a second direction. In the first connection portion 600a, at least a portion of the first protective layer 512 may be removed. For example, the first insulating layer 610, the first copper layer 620, the second copper layer 630, and the second insulating layer 640 of the first protective layer 512 may be removed. According to one embodiment, in the first connection portion 600a, the first protective layer 512 is removed, and the first connection portion 600a may include only the base layer 514 and the second protective layer 516. Therefore, in the first connection portion 600a, the second copper layer 650 of the base layer 514 may be exposed to the outside. The second copper layer 650 of the base layer 514 may be directly exposed to the outside and may be used as a conductive layer by soldering or similar processes.

[0098] Such as about Figure 4 As described, the flexible circuit board may include a first flexible protective layer, a flexible base layer, and a second flexible protective layer sequentially stacked in a direction opposite to the second direction. According to one embodiment, one surface of the exposed second copper layer 650 of the base layer 514 may face a corresponding surface of the first flexible protective layer. For example, one surface of the second copper layer 650 of the base layer 514 and one surface of the first flexible protective layer may be electrically connected.

[0099] Figure 7 Examples of layers constituting a flexible circuit board 700 according to embodiments of the present disclosure are shown.

[0100] refer to Figure 7 , Figure 7 The flexible circuit board 700 in the middle is Figure 5 An example of a flexible circuit board 520 is shown. The flexible circuit board 700 may include a first flexible protective layer 522, a flexible base layer 524, and a second flexible protective layer 526 sequentially stacked in a direction opposite to the second direction. The first flexible protective layer 522, the flexible base layer 524, and the second flexible protective layer 526 may each include at least one layer.

[0101] The first flexible protective layer 522 may include a coverlay layer 710. The coverlay layer 710 can block the first copper layer 720 from connecting to external components, thereby preventing current leakage and protecting the flexible circuit board 700 from external influences. The coverlay layer 710 may be stacked on the uppermost portion of the flexible circuit board 700 in the second direction.

[0102] The second flexible protective layer 526 may include a cover film layer 710, a bonding sheet layer 740, an epoxy layer 750, and a surface treatment layer 760. The cover film layer 710, bonding sheet layer 740, epoxy layer 750, and surface treatment layer 760 may be sequentially stacked in a direction opposite to the second direction. For example, the surface treatment layer 760 may be disposed at the lowermost portion of the second flexible protective layer 526, and the cover film layer 710 may be disposed at the uppermost portion of the second flexible protective layer 526. The cover film layer 710 may perform the same function as described above in the first flexible protective layer 522.

[0103] In one embodiment, the cover film 710, bonding sheet 740, epoxy layer 750, and surface treatment layer 760 can each be formed as a single layer, or as a stacked structure in which at least one layer is sequentially stacked. For example, each layer can be implemented as a stacked structure in which multiple layers with different physical properties are sequentially stacked to ensure mechanical rigidity, improve thermal reliability, or enhance electrical insulation properties. According to this configuration, the second flexible protective layer 526 can be designed into various stacking combinations according to the required operating environment or performance conditions, and can improve the physical durability and electrical stability of the flexible circuit board 700.

[0104] The flexible base layer 524 may include a plurality of first copper layers 720 and a flexible copper-clad laminate 730 between the plurality of first copper layers 720. For example, the first copper layers 720 may be disposed at the bottommost and topmost portions of the flexible base layer 524. The flexible copper-clad laminate 730 between the plurality of first copper layers 720 may serve as a signal transmission path. The flexible copper-clad laminate 730 may include sequentially stacked second copper layers and insulating layers.

[0105] The flexible base layer 524 may be located between the cover film layer 710 of the first flexible protective layer 522 and the cover film layer 710 of the second flexible protective layer 526. For example, a plurality of first copper layers 720 of the flexible base layer 524 may be located between the cover film layer 710 of the first flexible protective layer 522 and the cover film layer 710 of the second flexible protective layer 526.

[0106] The flexible circuit board 700 includes a second connection portion 700a as a region overlapping with a protective circuit board in a second direction. In the second connection portion 700a, at least a portion of the first flexible protective layer 522 can be removed. For example, the cover film layer 710 can be removed. According to one embodiment, in the second connection portion 700a, the first flexible protective layer 522 is removed, and the second connection portion 700a may include only the flexible base layer 524 and the second flexible protective layer 526. Therefore, in the second connection portion 700a, the first copper layer 720 of the flexible base layer 524 can be exposed to the outside. The first copper layer 720 of the flexible base layer 524 can be directly exposed to the outside and can be used as a conductive layer by soldering or similar processes.

[0107] Such as about Figure 5 The described protective circuit board may include a first protective layer, a base layer, and a second protective layer sequentially stacked in a second direction. According to one embodiment, one surface of the exposed first copper layer 720 of the flexible base layer 524 may face a corresponding surface of the second copper layer of the base layer of the protective circuit board. The surface of the second copper layer of the base layer of the protective circuit board may be electrically connected to the surface of the first copper layer 720 of the flexible base layer 524.

[0108] The flexible circuit board 700 may include at least one connecting member 770 on the flexible base layer 524. The connecting member 770 can electrically connect the flexible base layer 524 to the base layer of the protective circuit board. For example, multiple connecting members 770 may be on the first copper layer 720 of the flexible base layer 524. The first copper layer 720 of the flexible base layer 524 and the second copper layer of the base layer of the protective circuit board may be electrically connected by the connecting member 770.

[0109] Figure 8 An exemplary insulating resin 830 and connecting member 840 in a connection structure between a protective circuit board 510 and a flexible circuit board 520 according to an embodiment of the present disclosure are illustrated.

[0110] refer to Figure 8 , Figure 8 The protection circuit module 800 in the middle is Figure 1 and Figure 2 An example of the protection circuit module 120. The protection circuit module 800 may include a protection circuit board 810, a flexible circuit board 820, an insulating resin 830 between the protection circuit board 810 and the flexible circuit board 820, and a connecting member 840.

[0111] The insulating resin 830 may include a first insulating portion 832 between the protective circuit board 810 and the flexible circuit board 820 in a second direction, and a second insulating portion 834 between the protective circuit board 810 and the flexible circuit board 820 in the first direction. For example, the first insulating portion 832 may be between the second copper layer of the base layer and the first copper layer of the flexible base layer. The second insulating portion 834 may be connected to the first insulating portion 832 in a vertical direction.

[0112] A connecting member 840 is located on the second connection portion of the flexible circuit board 820 and can electrically connect the flexible circuit board 820 to the protective circuit board 810. According to one embodiment, the flexible circuit board 820 may include at least one connecting member 840 on the second connection portion, and at least one connecting member 840 may be connected to a portion of the flexible base layer located in the second connection portion and a portion of the base layer of the protective circuit board located in the first connection portion. For example, the connecting member 840 may be located between the protective circuit board 810 and the flexible circuit board 820. For example, the connecting member 840 may be located between the second copper layer of the base layer and the first copper layer of the flexible base layer. The connecting member 840 may be formed by soldering. The stress generated due to the current in the base layer can be adjusted by adjusting the number of connecting members 840.

[0113] For example, the first insulating portion 832 can fill the space between the first connecting portion and the second connecting portion, excluding the area where the connecting member 840 is formed. With this configuration, the protective circuit board 810 and the flexible circuit board 820 can be insulated from each other, preventing the inflow of foreign objects and short circuits, and increasing the bonding strength between the protective circuit board 810 and the flexible circuit board 820.

[0114] Figure 9 An example illustrating the connection between the protection circuit board 910 and the flexible circuit board 920 according to an embodiment of the present disclosure is shown. Reference Figure 9 , Figure 9 The protection circuit module 900 in the middle is Figure 1 and Figure 2 An example of the protection circuit module 120. The protection circuit module 900 may include a protection circuit board 910 and a flexible circuit board 920.

[0115] The protective circuit board 910 includes a first protective layer 912, a base layer 914, and a second protective layer 916 sequentially stacked in a second direction, and the flexible circuit board 920 may include a first flexible protective layer 922, a flexible base layer 924, and a second flexible protective layer 926 sequentially stacked in a direction opposite to the second direction. The detailed configuration of each layer is as follows... Figure 6 and Figure 7 The detailed configuration is the same as in [the other context].

[0116] In the first connection portion 910a, a portion of the first protective layer 912 can be removed. For example, the first insulating layer of the first protective layer 912 can be removed, and the first copper layer of the first protective layer 912 can be exposed. The first copper layer can be directly exposed to the outside and used as a conductive layer by soldering. In the second connection portion 920a, the first flexible protective layer 922 can be removed. For example, the cover film layer of the second connection portion 920a can be removed.

[0117] According to one embodiment, the first copper layer of the first protective layer 912 and the first copper layer of the flexible base layer 924 may face each other. A connecting member is provided between the first copper layers of the first protective layer 912 and the first copper layer of the flexible base layer 924, and this connecting member can electrically connect the first copper layers to each other. Insulating resin may be used to fill the empty space between the protective circuit board 910 and the flexible circuit board 920.

[0118] According to some embodiments of this disclosure, the protection circuit board and the flexible circuit board are connected in a modular manner, and the overall thickness of the protection circuit module can be reduced.

[0119] According to some embodiments of this disclosure, the clamping thickness between the protective circuit board and the flexible circuit board can be reduced.

[0120] According to some embodiments of this disclosure, the stress generated by the current in the base layer can be adjusted by changing the number of connecting members between the protective circuit board and the flexible circuit board.

[0121] According to some embodiments of this disclosure, the insulating resin between the protective circuit board and the flexible circuit board can insulate the protective circuit board and the flexible circuit board from each other, thereby preventing the inflow of foreign matter and short circuits, and can increase the bonding force between the protective circuit board and the flexible circuit board.

[0122] Example embodiments have been disclosed herein, and although specific terminology has been used, they are used and interpreted in a general and descriptive sense only and are not intended to be limiting. In some instances, as will be apparent to those skilled in the art at the time of filing this application, unless specifically instructed otherwise, features, characteristics, and / or elements described in connection with particular embodiments may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Accordingly, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. A protection circuit module, comprising: Protect the circuit board, extending in the first direction; as well as A flexible circuit board is electrically connected to the protective circuit board, wherein: The protective circuit board includes a first connection portion that overlaps with the flexible circuit board in a second direction perpendicular to the first direction. The first connection portion of the protective circuit board is connected to the flexible circuit board, and The thickness of the first connecting portion is less than the thickness of the area in the protective circuit board excluding the first connecting portion.

2. The protection circuit module according to claim 1, wherein the flexible circuit board includes a second connection portion that overlaps with the protection circuit board in a second direction perpendicular to the first direction.

3. The protection circuit module according to claim 2, wherein: The protective circuit board includes a first protective layer, a base layer, and a second protective layer stacked sequentially, and In the first connection portion, at least a portion of the first protective layer is removed.

4. The protection circuit module according to claim 3, wherein each of the first protection layer and the second protection layer comprises a first insulating layer, a first copper layer, a second copper layer, and a second insulating layer.

5. The protection circuit module according to claim 3, wherein: The flexible circuit board includes a first flexible protective layer, a flexible base layer, and a second flexible protective layer stacked sequentially. In the second connection portion, at least a portion of the first flexible protective layer is removed.

6. The protection circuit module according to claim 5, wherein the first flexible protective layer includes a cover film layer.

7. The protection circuit module according to claim 1, wherein the first connection portion is located at one end of the protection circuit board.

8. The protection circuit module according to claim 2, wherein the second connection portion is located at one end of the flexible circuit board.

9. The protection circuit module according to claim 2, further comprising an insulating resin between the protection circuit board and the flexible circuit board.

10. The protection circuit module according to claim 9, wherein the insulating resin comprises: The first insulating portion between the protective circuit board and the flexible circuit board in the second direction; as well as The second insulating portion between the protective circuit board and the flexible circuit board in the first direction.

11. The protection circuit module according to claim 5 or 6, wherein the flexible circuit board further includes at least one connecting member on the second connection portion, the flexible circuit board being electrically connected to the protection circuit board via the at least one connecting member.

12. The protection circuit module of claim 11, wherein the at least one connecting member is connected to the portion of the flexible base layer located in the second connection portion and the portion of the base layer of the protection circuit board located in the first connection portion.

13. The protection circuit module according to claim 5 or 6, wherein the base layer of the protection circuit board comprises: Multiple second copper layers, and An insulating layer is located between the plurality of second copper layers.

14. The protection circuit module according to claim 13, wherein the flexible base layer comprises: Multiple first copper layers, and A flexible copper-clad laminate is disposed between the plurality of first copper layers.

15. The protection circuit module of claim 14, wherein the flexible circuit board includes at least one connecting member on the flexible base layer, the at least one connecting member being electrically connected to the flexible base layer and the base layer of the protection circuit board.

16. A protection circuit module, comprising: Protect the circuit board, extending in the first direction; A flexible circuit board overlaps the protective circuit board in a second direction perpendicular to the first direction; as well as A connecting member is located between the protective circuit board and the flexible circuit board. The protection circuit board includes: base layer; A first protective layer, on the lower surface of the base layer, which does not overlap with the flexible circuit board in the second direction; and A second protective layer is provided on the upper surface of the base layer; The flexible circuit board includes: Flexible base layer; A first flexible protective layer, on the upper surface of the flexible base layer, does not overlap with the protective circuit board in the second direction; and A second flexible protective layer is located on the lower surface of the flexible base layer, and The connecting member electrically connects the lower surface of the base layer of the protective circuit board to the upper surface of the flexible base layer.

17. The protection circuit module according to claim 16, wherein: The lower surface of the protective circuit board includes a first stepped surface formed using the first protective layer; and The upper surface of the flexible circuit board includes a second stepped surface formed by the first flexible protective layer, and the second stepped surface corresponds to the first stepped surface.

18. The protection circuit module of claim 16, further comprising an insulating resin between the protection circuit board and the flexible circuit board, wherein the insulating resin comprises: The first insulating portion between the base layer and the flexible base layer of the protective circuit board in the second direction; as well as The second insulating portion between the first protective layer and the flexible circuit board in the first direction.

19. A battery assembly, comprising: Battery cell, including electrode terminals; as well as The protection circuit module is electrically connected to the electrode terminals. The protection circuit module includes: A protection circuit board, electrically connected to the battery cell, extends in a first direction; and A flexible circuit board is electrically connected to the protective circuit board, wherein: The protective circuit board includes a first connection portion that overlaps with the flexible circuit board in a second direction perpendicular to the first direction. The first connection portion of the protective circuit board is connected to the flexible circuit board, and The thickness of the first connecting portion is less than the thickness of the area in the protective circuit board excluding the first connecting portion.

20. The battery assembly of claim 19, wherein: The flexible circuit board includes a second connection portion that overlaps with the protective circuit board in a second direction perpendicular to the first direction. The second connection portion of the flexible circuit board is connected to the protective circuit board, and The thickness of the second connection portion is less than the thickness of the area in the flexible circuit board excluding the second connection portion.

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