Electronic system with peripheral connectors

Abstract

An electronic system (100) includes an electronic package (104) including an electronic package substrate (116) configured to couple to a host circuit board (106). The electronic package includes an integrated circuit (118) mounted on the electronic package substrate. The electronic package includes a socket connector (110) mounted to the electronic package substrate and electrically connected to the integrated circuit. The electronic system includes a perimeter connector (300) separate from the electronic package and configured to couple to the host circuit board. The perimeter connector is located proximate the socket connector outside a perimeter of the electronic package substrate. The electronic system includes a communication module (200) including a first connector interface and a second connector interface. The first connector interface is coupled to the socket connector. The second connector interface is coupled to the perimeter connector.

Description

Technical Field

[0001] The main topic of this article is electronic systems. Background Technology

[0002] Electronic systems are used for data communication. Some electronic systems include electronic packages mounted to a host circuit board for data communication. These electronic packages contain communication components, such as integrated circuits or computer processors. Data and power are typically transmitted to the communication components through the package substrate of the electronic package. To enhance data communication, some electronic systems incorporate a co-packaged receptacle connector, which enables a separable interface between the optical module or copper module and the electronic package, facilitating high-speed data communication over longer distances. The optical module and copper module are powered via the receptacle connector. However, this architecture requires space and contacts at the interface for power contacts and low-speed data communication, increasing the overall size of the receptacle connector and reducing the density of the package used for data communication.

[0003] There is still a need for an electronic system with an improved architectural layout to improve data communication and / or reduce the overall size and cost of electronic packages. Summary of the Invention

[0004] According to the present invention, an electronic system is provided, comprising an electronic package including an electronic package substrate configured for connection to a host circuit board. The electronic package includes an integrated circuit mounted to the electronic package substrate. The electronic package includes a receptacle connector mounted to the electronic package substrate and electrically connected to the integrated circuit. The electronic system includes a peripheral connector separate from the electronic package and configured for connection to a host circuit board. The peripheral connector is located near the receptacle connector on the periphery of the electronic package substrate. The electronic system includes a communication module including a first connector interface and a second connector interface. The first connector interface is connected to the receptacle connector. The second connector interface is connected to the peripheral connector.

[0005] According to another aspect of the invention, an electronic system is provided, comprising a host circuit board including a first mounting region and a second mounting region on its upper surface. The first mounting region and the second mounting region are separate and spaced apart from each other. The electronic system includes an electronic package coupled to the first mounting region of the host circuit board. The electronic package includes an electronic package substrate coupled to the host circuit board. The electronic package includes an integrated circuit mounted on top of the electronic package substrate. The electronic package includes a receptacle connector mounted on top of the electronic package substrate and electrically connected to the integrated circuit. The electronic system includes a peripheral connector separate from the electronic package and coupled to a second mounting region of the host circuit board. The peripheral connector is located near the receptacle connector on the periphery of the electronic package substrate. The electronic system includes a communication module including a first connector interface and a second connector interface. The first connector interface is coupled from above to the receptacle connector. The second connector interface is coupled from above to the peripheral connector. Attached Figure Description

[0006] Figure 1 An electronic system having a common packaging architecture communicatively connected to an electronic package is shown according to an exemplary embodiment.

[0007] Figure 2 This is a top view of a portion of an electronic system according to an exemplary embodiment.

[0008] Figure 3 This is a cross-sectional view of a portion of an electronic system according to an exemplary embodiment.

[0009] Figure 4 This is a top view of a portion of an electronic system according to an exemplary embodiment.

[0010] Figure 5 This is a cross-sectional view of a portion of an electronic system according to an exemplary embodiment.

[0011] Figure 6 This is a cross-sectional view of a portion of an electronic system according to an exemplary embodiment.

[0012] Figure 7 This is a perspective view of a communication module according to an exemplary embodiment.

[0013] Figure 8 This is a bottom view of a communication module according to an exemplary embodiment.

[0014] Figure 9 This is a perspective view of a communication module according to an exemplary embodiment.

[0015] Figure 10 This is a bottom view of a communication module according to an exemplary embodiment.

[0016] Figure 11 This is a top perspective view of a socket connector according to an exemplary embodiment.

[0017] Figure 12 This is a bottom perspective view of a socket connector according to an exemplary embodiment.

[0018] Figure 13 This is a top perspective view of the peripheral connector according to an exemplary embodiment.

[0019] Figure 14 This is a bottom perspective view of the peripheral connector according to an exemplary embodiment. Detailed Implementation

[0020] Figure 1 An electronic system 100 is illustrated having a common package architecture 102 communicatively coupled to an electronic package 104. The electronic system 100 includes a host circuit board 106. The electronic package 104 is coupled to the host circuit board 106. For example, the electronic package 104 may be directly mounted to the host circuit board 106. Alternatively, the electronic package 104 may be coupled to the host circuit board 106 via a receptacle connector (not shown). Data and / or power may be transferred between the host circuit board 106 and the electronic package 104. In an exemplary embodiment, the electronic system 100 includes a thermal component 108, such as a heat sink or cold plate, for dissipating heat from one or more components of the electronic system 100.

[0021] The common package architecture 102 includes a communication module 200 communicatively coupled to an electronic package 104. In an exemplary embodiment, the communication module 200 is coupled to the electronic package 104 at a detachable interface. For example, the communication module 200 may be coupled to a receptacle connector 110 of the electronic package 104. In various embodiments, the communication module 200 may be a common packaged copper connector (CPC) including a cable having copper signal conductors for transmitting signals. The CPC may include an active copper component. The CPC may include a passive copper component. In other various embodiments, the communication module 200 may be a common packaged optical connector (CPO) including an optical fiber cable having optical fibers for transmitting signals.

[0022] In an exemplary embodiment, the electronic system 100 includes a peripheral connector 300, separate from the electronic package 104, located outside the outer periphery of the electronic package 104. The peripheral connector 300 can be coupled to a host circuit board 106. For example, the peripheral connector 300 can be directly mounted to the host circuit board 106. Alternatively, the peripheral connector 300 can be coupled to the host circuit board 106 via a detachable interface, such as a receptacle connector, jack connector, plug connector, or other type of electrical connector. In an exemplary embodiment, the communication module 200 can be coupled to a corresponding peripheral connector 300. For example, the communication module 200 can be coupled to the peripheral connector 300 at a detachable interface. In an exemplary embodiment, the peripheral connector 300 can transmit data and / or power between the host circuit board 106 and the communication module 200. For example, low-speed data signals can be transmitted between the host circuit board 106 and the communication module 200 via the peripheral connector 300. High-speed data signals can be transmitted between the communication module 200 and the electronic package 104 via the receptacle connector 110 of the electronic package 104. In an exemplary embodiment, the communication module 200 is powered via a power interface through a peripheral connector 300. In this exemplary embodiment, all power is supplied to the communication module 200 via the peripheral connector 300, rather than via the electronic package 104. This allows the connection interface between the receptacle connector 110 of the electronic package 104 and the communication module 200 to be dedicated to high-speed data transmission, increasing high-speed data density and / or reducing the component size of the electronic package 104. In various embodiments, some low-speed signals may be transmitted via the receptacle connector 110. In various embodiments, some high-speed signals may be transmitted via the peripheral connector 300. As used herein, "high-speed" data communication is data communication measured in megabits per second (Mbps) or gigabits per second (Gbps), while "low-speed" data communication is data communication measured in kilobits per second (Kbps).

[0023] In various embodiments, the electronic package 104 is an integrated circuit assembly, such as an ASIC. However, the electronic package 104 can be another type of communication component, such as a processor, interposer assembly, socket assembly, host circuit board assembly, etc. In an exemplary embodiment, a plurality of communication modules 200 are coupled to the electronic package 104. For example, the communication modules 200 may be disposed on multiple sides of the electronic package 104, such as on all four sides of the electronic package 104. In alternative embodiments, other arrangements are possible.

[0024] In an exemplary embodiment, the thermal device 108 is used to dissipate heat from the electronic package 104, such as from a chip, processor, memory module, or other electrical components of the electronic package 104. The thermal device 108 can be used to dissipate heat from the communication module 200. The thermal device 108 can be used to press the communication module 200 against the receptacle connector 110 and / or peripheral connector 300 of the electronic package 104 to maintain an electrical connection between the communication module 200 and the receptacle connector 110 / peripheral connector 300. The thermal device 108 can be coupled to the host circuit board 106 or a reinforcement, such as a pad (not shown), beneath the host circuit board 106 to compress the thermal device 108. Optionally, features such as threaded post and / or threaded fasteners can be used to couple the thermal device 108 to the host circuit board 106 and / or the pad. Compression of the thermal device 108 is used for thermal bonding between the thermal device 108 and the communication module 200 and / or the chip. Mechanical and electrical connection between the compression-maintaining communication module 200 of the heating device 108 and the socket connector / peripheral connector 300.

[0025] In an exemplary embodiment, the bottom of the electronic package 104 is coupled to the host circuit board 106. In various embodiments, the electronic package 104 may be coupled to the host circuit board 106 at a lower mating interface (e.g., LGA interface, BGA interface, etc.). In an exemplary embodiment, the communication module 200 is coupled to the top of the electronic package 104 opposite the host circuit board 106, for example, to a receptacle connector 110 at the top of the electronic package 104. The cable 202 of the communication module 200 exits the electronic package 104 in a direction from the side of the electronic package 104. In the illustrated embodiment, the cable 202 extends generally horizontally, such as parallel to the host circuit board 106, thereby limiting the height of the electronic system 100. For example, the cable 202 remains below the thermal device 108. However, in alternative embodiments, the cable 202 may extend vertically through the thermal device 108, for example, perpendicular to the host circuit board 106. In such an embodiment, cable 202 extends through the heating device 108, allowing for closer spacing of other components on the host circuit board 106 of the adjacent electronic system 100.

[0026] Electronic system 100 allows for greater density and connectivity to electronic package 104 by providing a separate peripheral connector 300 located outside the package. For example, a subset of signals (e.g., lower-speed signals) and power can be routed through peripheral connector 300, allowing for fewer total connections or greater density of high-speed signals to be routed through receptacle connector 110 of electronic package 104. Performance and design efficiency are enhanced by providing a separate peripheral connector 300, independent of electronic package 104, to allow for a separate connection to communication module 200. In an exemplary embodiment, communication module 200 is coupled to electronic package 104 at multiple locations (e.g., at four sides of the chip) to increase the density of electronic system 100. In an exemplary embodiment, high-speed data signals are transmitted directly from electronic package 104 by communication module 200, rather than first routed through host board 106, and / or may be routed along a longer signal path via cable 202, rather than via traces on host board 106.

[0027] Figure 2 This is a top view of a portion of an electronic system 100 according to an exemplary embodiment. The electronic package 104 includes an electronic package substrate 116 and communication elements, such as an integrated circuit 118 provided on the electronic package substrate 116. The integrated circuit 118 may be a chip, processor, memory module, or other component mounted on top of the electronic package 104. In the illustrated embodiment, the integrated circuit 118 is rectangular and generally centered on the electronic package substrate 116; however, in alternative embodiments, the integrated circuit 118 may have other shapes or locations.

[0028] The electronic package substrate 116 has conductors (e.g., traces, vias, pads, etc.) that provide electrical paths between the integrated circuit 118 and the receptacle connector 110, and between the integrated circuit 118 and the host circuit board 106. The electronic package substrate 116 may be a printed circuit board. The receptacle connector 110 is configured to connect to a corresponding conductor of the electronic package substrate 116, such as a conductor soldered or press-fitted to the electronic package substrate 116. The receptacle connector 110 may be electrically connected to the conductor using contacts, pins, solder balls, conductive elastic posts, or other intermediate conductive elements.

[0029] Figure 3 This is a cross-sectional view of a portion of an electronic system 100 according to an exemplary embodiment. Figure 3 The diagram shows a host circuit board 106, an electronic package 104 mounted to the host circuit board 106, a peripheral connector 300 mounted to the host circuit board 106, a communication module 200 connected to the electronic package 104 and the peripheral connector 300, and a thermal device 108 connected to the electronic package 104 and the communication module 200.

[0030] In an exemplary embodiment, the host circuit board 106 includes an upper surface 120 and a lower surface 122. An electronic package 104 is mounted to the upper surface 120. A peripheral connector 300 is mounted to the upper surface 120. Optionally, multiple peripheral connectors 300 may be provided, for example, at one or more sides of the electronic package 104 and / or around the periphery of the electronic package 104. The host circuit board 106 includes a host board conductor 124 at the upper surface 120. The host board conductor 124 may be a pad, solder ball, spring beam, or other type of electrical contact. The host board conductor 124 may include a signal conductor, power conductor, ground conductor, or other type of conductor. In an exemplary embodiment, the host circuit board 106 includes a first mounting region 126 and a second mounting region 128 separated from the first mounting region 126. The first mounting region 126 may be spaced apart from the second mounting region 128, for example, by a gap. The electronic package 104 is coupled to the first mounting region 126 and a corresponding host board conductor 124 at the first mounting region 126. The peripheral connector 300 is connected to the second mounting area 128 and the corresponding motherboard conductor 124 at the second mounting area 128.

[0031] In an exemplary embodiment, one or more reinforcing members 130 are disposed at the lower surface 122. The reinforcing member 130 may be a pad or other type of reinforcing member. In an exemplary embodiment, screws 132 or other types of fasteners are used to connect components to the host circuit board 106, for example, to the reinforcing member 130. For example, screws 132 connect a thermal device 108 to the host circuit board 106 to form a reliable thermal interface with the component(s) and to apply compressive force to the component(s). Screws 132 may be tightened to press the thermal device 108 against components of the electronic system 100, such as the electronic package 104 and / or the communication module 200. In alternative embodiments, compression may be applied by another compression element, rather than transmitted through the thermal device 108, such as a compression element directly connected to the peripheral connector 300 and / or the communication module 200.

[0032] In an exemplary embodiment, the electronic package substrate 116 includes an upper surface 140 and a lower surface 142. An integrated circuit 118 is mounted to the upper surface 140. The lower surface 142 is configured to be mounted to a host circuit board 106, for example, to an array of host board conductors 124, for electrical connection with the electronic package substrate 116. The electronic package substrate 116 includes a corresponding lower substrate conductor 144 on the lower surface 142, which abuts against the host board conductors 124. For example, the lower substrate conductor 144 may be a pad, solder ball, spring beam, or other type of electrical contact.

[0033] Integrated circuit 118 is disposed on upper surface 140. Integrated circuit 118 may be a chip or other type of integrated circuit. In various embodiments, integrated circuit 118 may be an ASIC. In an exemplary embodiment, electronic package substrate 116 includes upper substrate conductors 146 at upper surface 140. Upper substrate conductors 146 are electrical conductors, such as pads, vias, traces, or other circuit components of electronic package substrate 116. Upper substrate conductors 146 are electrically connected to integrated circuit 118, for example, using a ball grid array (BGA) with solder balls. In an exemplary embodiment, some upper substrate conductors 146 are electrically connected to corresponding lower substrate conductors 144 and thus electrically connected to host circuit board 106, while other upper substrate conductors 146 are electrically connected to corresponding receptacle connectors 110, for example, through circuit traces, vias, etc., of electronic package substrate 116.

[0034] In an exemplary embodiment, heat transfer device 148 is thermally coupled to heat transfer device 108 and integrated circuit 118 to transfer heat between integrated circuit 118 and heat transfer device 108. Heat transfer device 148 may be a metal block, such as a copper block. Heat transfer device 148 occupies the space between the upper surface of integrated circuit 118 and the bottom surface of heat transfer device 108. Heat transfer device 148 may be a spacer to accommodate the height difference between integrated circuit 118 and heat transfer device 108, for example, to accommodate communication module 200. Heat transfer device 108 may be pressed against heat transfer device 148, for example, by screws 132. Alternatively, heat transfer device 108 may be divided into multiple parts or elements to create different thermal paths for integrated circuit 118 and communication module 200.

[0035] A receptacle connector 110 is coupled to the upper surface 140 of an electronic package substrate 116. The receptacle connector 110 is electrically connected to an integrated circuit 118 via circuitry or conductors (e.g., upper substrate conductor 146) of the electronic package substrate 116. The circuitry may be arranged on one or more layers of the electronic package substrate 116. The receptacle connector 110 includes receptacle contacts 150 configured to be electrically connected to the upper substrate conductor 146 of the electronic package substrate 116 and configured to be electrically connected to corresponding communication module contacts 250 of the communication module 200. The receptacle contacts 150 may include a planar grid array (LGA) interface or a ball grid array (BGA) interface for connection to the electronic package substrate 116 at a separable or fixed / permanent interface. In an exemplary embodiment, the receptacle contacts 150 may include an LGA interface defining a separable mating interface for cooperating with the communication module 200.

[0036] A peripheral connector 300 is coupled to the upper surface 120 of the host circuit board 106. The peripheral connector 300 is configured for electrical connection to the communication module 200. The peripheral connector 300 includes an upper interface 302 and a lower interface 304. The upper interface 302 is configured for electrical connection to the communication module 200. In an exemplary embodiment, the upper interface 302 is a separable interface configured to detachably mate with the communication module 200. For example, the upper interface 302 may be a compression interface. The upper interface 302 may be an LGA interface. In an alternative embodiment, the upper interface 302 may be a fixed or permanent interface, such as a solder interface. The lower interface 304 is configured for electrical connection to the host circuit board 106. In an exemplary embodiment, the lower interface 304 is a fixed or permanent interface. For example, the lower interface 304 may be a BGA interface. The lower interface 304 may be soldered to the host circuit board 106. The peripheral connector 300 includes an upper portion 306 extending from the upper interface 302 and a lower portion 308 extending from the lower interface 304. The lower portion 308 is vertically aligned with the electronic package substrate 116. In various embodiments, the lower interface 304 at the bottom of the lower portion 308 is coplanar with the bottom of the electronic package substrate 116. However, in alternative embodiments, the lower interface 304 and the bottom of the electronic package substrate 116 may be at different levels or heights. In various embodiments, the upper portion 306 is vertically aligned with the receptacle connector 110. The mating interface of the peripheral connector 300 may be coplanar with the mating interface of the receptacle connector 110 for mating with the communication module 200. However, in alternative embodiments, the upper interface 302 and the mating interface of the receptacle connector 110 may be at different levels or heights.

[0037] Peripheral connector 300 includes peripheral connector contacts 350 configured to electrically connect at a lower interface 304 to a motherboard conductor 124 of a motherboard circuit board 106. Peripheral connector contacts 350 are configured to electrically connect at an upper interface 302 to corresponding communication module contacts 250 of a communication module 200. Peripheral connector contacts 350 may include pads, balls, spring beams, spring pins, or other types of contacts. Peripheral connector contacts 350 may form LGA, BGA, or other types of interfaces. In an exemplary embodiment, peripheral connector 300 is configured to float relative to electronic package 104 to align peripheral connector contacts 350 of peripheral connector 300 with mating with communication module 200, for example, during mating of communication module 200 with receptacle connector 110. Floating may occur in multiple directions (e.g., X and Y directions). In an exemplary embodiment, the peripheral connector 300 is configured to directly transmit a portion of the mating load of the communication module 200 to the host circuit board 106 during mating between the communication module 200 and the peripheral connector 300 and the receptacle connector 110. This reduces the mating force on the receptacle connector 110 and lowers the risk of damaging the receptacle connector 110.

[0038] Communication module 200 is used for data communication with integrated circuit 118 of electronic package 104. Communication module 200 includes a communication module housing 210 having a mating end 212 and a cable end 214. Communication module housing 210 extends between a front portion 216 and a rear portion 218. Communication module housing 210 includes a top 220 and a bottom 222. Cable 202 extends from cable end 214. Cable 202 may be a cable having copper signal conductors for transmitting signals or a fiber optic cable having optical fibers for transmitting signals. In the illustrated embodiment, cable end 214 is located at rear portion 218. Other locations are possible in alternative embodiments. In the illustrated embodiment, mating end 212 is located at bottom 222 for mating with receptacle connector 110 and peripheral connector 300. Other locations are possible in alternative embodiments. Communication module 200 may mate in a downward mating direction. In an exemplary embodiment, the mating interfaces of the socket connector 110 and the peripheral connector 300 are coplanar and are used to mate with the mating end 212 of the communication module 200.

[0039] Communication module 200 includes a communication component 230 held by a communication module housing 210. Communication component 230 is communicatively coupled to cable 202. Communication component 230 is communicatively coupled to communication module contact 250. Communication component 230 may include a printed circuit board or substrate supporting other electrical components. Communication component 230 may include optical components, such as an optical transceiver for converting between optical and electrical signals. Communication component 230 includes a first mating region 232 at a mating end 212 and a second mating region 234 at a mating end 212. The first mating region 232 and the second mating region 234 are separate and spaced apart from each other. For example, the first mating region 232 may be near the front portion 216, and the second mating region 234 may be near the rear portion 218. Communication component 230 includes a first communication module contact 252 at the first mating region 232 in a first array, the first communication module contact 252 being configured to mate with a receptacle connector 110. The communication component 230 includes a second communication module contact 254 in a second array at a second mating region 234, configured to mate with a peripheral connector 300 separate from the electronic package 104. In an exemplary embodiment, a first communication module contact 252 is configured to transmit high-speed data signals between the communication component 230 and the receptacle connector 110, and the second communication module contact 254 is configured to transmit power and / or low-speed signals between the communication component 230 and the peripheral connector 300.

[0040] In an exemplary embodiment, the power circuitry for supplying power to the communication module 200 is located within a peripheral connector 300, separate from and remote from the electronic package 104, and independent of the electronic package substrate 116 and the receptacle connector 110. Power for the communication module 200 is not transmitted through the interface between the receptacle connector 110 and the electronic package substrate 116, or through the interface between the host circuit board 106 and the electronic package substrate 116, but rather through the interface between the peripheral connector 300 and the communication module 200. The power interface is external to the package. For example, the power interface is outside the periphery of the electronic package 104 (not on it). Transmitting power through the peripheral connector 300 instead of the receptacle connector 110 reduces (may be zero) the number of circuits or paths dedicated to the power circuitry at the interface between the receptacle connector 110 and the electronic package substrate 116, and at the interface between the host circuit board 106 and the electronic package substrate 116. This arrangement allows more circuitry in the receptacle connector 110 to be used for high data signal paths or ground paths, enhancing data transmission between the receptacle connector 110 and the communication module 200 and / or reducing the footprint of the receptacle connector 110 by reducing the number of electrical paths between the receptacle connector 110 and the communication module 200, thereby reducing the footprint of the entire electronic package 104. For example, in various embodiments, all power requirements of the communication module 200 can be handled by the peripheral connector 300, resulting in zero-power circuitry between the receptacle connector 110 and the communication module 200.

[0041] Figure 4 This is a top view of a portion of an electronic system 100 according to an exemplary embodiment. Figure 4 One of the communication modules 200 is shown, connected to a corresponding receptacle connector 110 and a corresponding peripheral connector 300. A plurality of peripheral connectors 300 are shown as being located outside the periphery of the electronic package substrate 116. The peripheral connectors 300 may be located near, but spaced apart from, the corresponding receptacle connectors 110, such that both the peripheral connectors 300 and the corresponding receptacle connectors 110 can be connected to the same communication module 200.

[0042] Peripheral connectors 300 may be arranged along one or more sides 117 of the electronic package substrate 116. In the illustrated embodiment, the peripheral connector 300 is arranged along one of the sides 117, and the other sides 117 do not have peripheral connectors 300. However, in alternative embodiments, the peripheral connector 300 is arranged along two sides, three sides, or all four sides. The peripheral connector 300 is positioned beyond the edge at the side 117 and spaced apart from the edge at the side 117. In various embodiments, the peripheral connector 300 is arranged in a 1:1 ratio with the receptacle connector 110. However, in alternative embodiments, a single peripheral connector 300 may be provided associated with multiple receptacle connectors 110. For example, multiple communication modules 200 may mate with a single peripheral connector 300.

[0043] An integrated circuit 118 is disposed on an electronic package substrate 116, for example, generally centered on the electronic package substrate 116 between sides 117. A receptacle connector 110 is disposed on one or more sides 119 of the integrated circuit 118. The receptacle connector 110 is positioned between the side 119 of the integrated circuit 118 and the side 117 of the electronic package substrate 116. The receptacle connector 110 may be located at the side 117 of the electronic package substrate 116. The receptacle connector 110 may be located on one side, two sides, three sides, or all four sides of the electronic package substrate 116.

[0044] In an exemplary embodiment, the receptacle connector 110 transmits high-speed data signals between the communication module 200 and the electronic package substrate 116. In an exemplary embodiment, the peripheral connector 300 transmits low-speed data and power between the host circuit board 106 and the communication module 200. The communication module 200 is powered via a power interface through the peripheral connector 300. In an exemplary embodiment, all power is supplied to the communication module 200 through the peripheral connector 300 rather than through the electronic package assembly 104. This allows the connection interface between the receptacle connector 110 of the electronic package 104 and the communication module 200 to be dedicated to high-speed data transmission, increasing high-speed data density and / or reducing the size of the receptacle connector 110, thereby reducing the size of the electronic package substrate 116.

[0045] Figure 5 This is a cross-sectional view of a portion of an electronic system 100 according to an exemplary embodiment. Figure 5 The diagram shows a host circuit board 106, an electronic package 104 mounted to the host circuit board 106, a peripheral connector 300 mounted to the host circuit board 106, a communication module 200 connected to the electronic package 104 and the peripheral connector 300, and a thermal device 108 connected to the electronic package 104 and the communication module 200. Figure 5An alignment module 400 is shown for aligning the communication module 200 with the receptacle connector 110 and / or the peripheral connector 300.

[0046] Alignment module 400 includes an upper alignment element 402 and a lower alignment element 404. The upper alignment element 402 is coupled to communication module 200. The lower alignment element 404 is coupled to host circuit board 106 and / or peripheral connector 300. The lower alignment element 404 may additionally or alternatively be coupled to electronic package 104, such as to electronic package substrate 116 and / or receptacle connector 110. The upper alignment element 402 and lower alignment element 404 cooperate to align communication module 200 with receptacle connector 110 and peripheral connector 300. The upper alignment element 402 may include posts, pins, receptacles, openings, or other types of alignment elements. The lower alignment element 404 may include receptacles, openings, posts, pins, or other types of alignment elements. Alignment elements 402 and 404 may allow communication module 200 to be aligned laterally and / or longitudinally (e.g., X / Y alignment) during mating (e.g., in the Z direction). The communication module 200 can be configured to float relative to the receptacle connector 110 and / or the peripheral connector 300 during mating. The receptacle connector 110 and / or the peripheral connector 300 can allow predetermined mating tolerances relative to each other to accommodate mating with the communication module 200. In an exemplary embodiment, the peripheral connector 300 can have a larger mating tolerance than the receptacle connector 110. For example, the receptacle connector 110 can be designed with a tighter mating tolerance, while the peripheral connector 300 can be designed with a looser mating tolerance, allowing the peripheral connector 300 to connect to the communication module 200 based on alignment between the communication module 200 and the receptacle connector 110.

[0047] Figure 6 This is a cross-sectional view of a portion of an electronic system 100 according to an exemplary embodiment. Figure 6 The diagram shows a host circuit board 106, an electronic package 104 mounted to the host circuit board 106, a peripheral connector 300, a communication module 200 connected to the electronic package 104 and the peripheral connector 300, and a thermal device 108 connected to the electronic package 104 and the communication module 200.

[0048] In the illustrated embodiment, the electronic system 100 includes a board connector 500 coupled to a host circuit board 106, having a separable mating interface for mates with a peripheral connector 300. The peripheral connector 300 can be coupled to the communication module 200 at a permanent or fixed interface. For example, the peripheral connector 300 can be soldered to the communication module 200 and extend from the bottom of the communication module 200. The board connector 500 is separate from the electronic package 104 and located outside the periphery of the electronic package substrate 116. The peripheral connector 300 can be mated to the board connector 500. The board connector 500 can be a plug connector or a receptacle connector. The board connector 500 can be a receptacle connector. The board connector 500 is configured to transmit low-speed data signals and / or power between the host circuit board 106 and the peripheral connector 300. This low-speed data signal and / or power is transmitted to the communication module 200 via the peripheral connector 300.

[0049] Figure 7 This is a perspective view of the communication module 200 according to an exemplary embodiment. Figure 8 This is a bottom view of a communication module 200 according to an exemplary embodiment. In the illustrated embodiment, the communication module 200 is a co-packaged optical module (CPO). The cable 202 extending from the communication module 200 is an optical fiber cable, such as a dual-fiber cable, a quad-fiber cable, a ribbon cable, etc. In the exemplary embodiment, the communication module 200 is an optical module configured to convert between electrical signals and optical signals.

[0050] The communication module 200 includes a communication module housing 210 that holds the communication component 230. The communication module housing 210 extends between a mating end 212 at a bottom 222 and a cable end 214 at a rear 218. A cable 202 extends from the cable end 214.

[0051] In an exemplary embodiment, the communication component 230 includes a first communication module board 242 at a first mating region 232 and a second communication module board 244 at a second mating region 234. The first communication module board 242 holds a corresponding first communication module contact 252, and the second communication module board 244 holds a corresponding second communication module contact 254. The contact spacing of the communication module contacts 252 may be the same as or different from the contact spacing of the communication module contacts 254. The first communication module board 242 is configured to mate with a receptacle connector 110. The second communication module board 244 is configured to mate with a peripheral connector 300. The communication module boards 242 and 244 may be separate boards or part of a common board.

[0052] In an exemplary embodiment, communication component 230 includes an optical transceiver 236 configured to convert between electrical and optical signals. Optical transceiver 236 may include an optical transmitting device and / or an optical receiving device. Optical transceiver 236 may be connected to a first communication module board 242 and a second communication module board 244. Optical transceiver 236 may receive power from peripheral connector 300 via second communication module contact 254 and second communication module board 244. Optical transceiver 236 is configured to transmit and / or receive high-speed data signals with receptacle connector 110 via first communication module contact 252 and first communication module board 242. In an alternative embodiment, communication component 230 may include a single communication module board instead of separate first and second communication module boards 242.

[0053] Figure 9 This is a perspective view of the communication module 200 according to an exemplary embodiment. Figure 10 This is a bottom view of a communication module 200 according to an exemplary embodiment. In the illustrated embodiment, the communication module 200 is a common-package copper connector (CPC). The cable 202 extending from the communication module 200 is a copper conductor cable.

[0054] The communication module 200 includes a communication module housing 210 that holds the communication component 230. The communication module housing 210 extends between a mating end 212 at a bottom 222 and a cable end 214 at a rear 218. A cable 202 extends from the cable end 214.

[0055] In an exemplary embodiment, the communication component 230 includes a first communication module board 242 at a first mating region 232 and a second communication module board 244 at a second mating region 234. The first communication module board 242 holds a corresponding first communication module contact 252, and the second communication module board 244 holds a corresponding second communication module contact 254. The first communication module board 242 is configured to mate with a receptacle connector 110. The second communication module board 244 is configured to mate with a peripheral connector 300. In an exemplary embodiment, the communication component 230 includes an active copper component 238, such as a transceiver, gearbox chip, or other active component, configured to amplify or extend data signals along data lines and / or amplify or regenerate signals along data lines. The active copper component 238 can be connected to the first communication module board 242 and the second communication module board 244. The active copper component 238 can receive power from the peripheral connector 300 through the second communication module contact 254 and the second communication module board 244. The active copper component 238 is configured to transmit and / or receive high-speed data signals with the receptacle connector 110 via the first communication module contact 252 and the first communication module board 242. In other embodiments, the communication component 230 may be a passive copper component. In an alternative embodiment, the communication component 230 may include a single communication module board instead of separate first and second communication module boards 242 and 244.

[0056] Figure 11 This is a top perspective view of the socket connector 110 according to an exemplary embodiment. Figure 12 This is a bottom perspective view of a receptacle connector 110 according to an exemplary embodiment. The receptacle connector 110 includes a receptacle connector housing 160 and a receptacle substrate 170 that retains receptacle contacts 150. The top of the receptacle connector 110 is configured to connect with a communication module 200 (such as...). Figure 1 (As shown) mating. The bottom of the socket connector 110 is configured to mount to the electronic package substrate 116 (as shown). Figure 1 (As shown).

[0057] The receptacle connector housing 160 includes walls 162 forming a cavity or receptacle 164 configured to receive part of a communication module 200. For example, the receptacle 164 may receive a first communication module board 242 of the communication module 200. In the illustrated embodiment, the receptacle connector housing 160 is generally rectangular and has walls 162 on the four sides of the receptacle 164. In alternative embodiments, other shapes are possible. The walls 162 are used for alignment or positioning of the first communication module board 242 within the receptacle 164 to align the first communication module contact 252 with the receptacle contact 150. The receptacle connector housing 160 may hold a receptacle substrate 170. For example, the walls 162 may be coupled to the receptacle substrate 170, or the receptacle substrate 170 may be coupled to the walls 162. The walls 162 may be molded around a portion of the receptacle substrate 170. In various other embodiments, the receptacle substrate 170 may be integrally formed with the walls 162. For example, the receptacle substrate 170 may be the base of the receptacle connector housing 160.

[0058] The receptacle substrate 170 holds the receptacle contacts 150 in an array. For example, the receptacle contacts 150 may be held in columns and rows. The receptacle contacts 150 may have uniform spacing in the columns and / or rows. In alternative embodiments, the receptacle contacts 150 may be arranged in other patterns. The receptacle contacts 150 may extend through openings or channels in the receptacle substrate 170, located between the top and bottom of the receptacle substrate 170, to mate with the communication module 200 and the electronic package substrate 116. The receptacle contacts 150 may form an LGA or other type of separable interface at the upper mating interface. For example, the receptacle contacts 150 may include a spring beam at the upper mating interface. The receptacle contacts 150 may form an LGA or BGA or other type of interface at the lower mating interface. For example, the receptacle contacts 150 may include pads, solder balls, spring beams, or other types of contacts at the lower mating interface.

[0059] In an exemplary embodiment, the receptacle contact 150 may include pairs of signal contacts arranged such that each pair is configured to transmit differential high-speed data signals. The signal contact pairs of the receptacle contact 150 may be surrounded by ground contacts to provide shielding around the signal contact pairs. In alternative embodiments, other arrangements are possible. In various embodiments, the receptacle contact 150 includes only high-speed data signal contacts and ground contacts, and does not include any low-speed data signal contacts or power contacts. Instead, low-speed data signals and power are transmitted to the communication module 200 via a peripheral connector 300 located away from the receptacle connector 110. In other various embodiments, some of the receptacle contacts 150 may be used for low-speed data signaling and / or power transmission; however, a subset of the signaling and / or power may be transmitted to the communication module 200 via a peripheral connector 300 located away from the receptacle connector 110.

[0060] Figure 13 This is a top perspective view of the peripheral connector 300 according to an exemplary embodiment. Figure 14 This is a bottom perspective view of a peripheral connector 300 according to an exemplary embodiment. The peripheral connector 300 includes a peripheral connector housing 360 that holds peripheral contacts 350. The top of the peripheral connector 300 is configured to connect with a communication module 200 (such as...). Figure 1 (As shown) mating. The bottom of the peripheral connector 300 is configured to mount to the host circuit board 106 (as shown). Figure 1 (As shown).

[0061] The peripheral connector housing 360 includes walls 362 forming a receptacle 364 configured to receive part of the communication module 200. For example, the receptacle 364 may receive a second communication module board 244 of the communication module 200. In the illustrated embodiment, the peripheral connector housing 360 is generally rectangular and has walls 362 on the four sides of the receptacle 364. In alternative embodiments, other shapes are possible. The walls 362 are used for alignment or positioning of the second communication module board 244 within the receptacle 364 to align the second communication module contacts 254 with the peripheral contacts 350. In various other embodiments, the peripheral connector housing 360 may be provided without the receptacle 364, instead having a flat top.

[0062] The peripheral connector housing 360 holds peripheral contacts 350 in an array. For example, peripheral contacts 350 may be held in columns and rows. Peripheral contacts 350 may have uniform spacing in columns and / or rows. In alternative embodiments, peripheral contacts 350 may be arranged in other patterns. Peripheral contacts 350 may extend through openings or channels in the peripheral connector housing 360, located between the top and bottom of the peripheral connector housing 360, to mate with the communication module 200 and the host circuit board 106. Peripheral contacts 350 may form an LGA or other type of separable interface at the upper mating interface. For example, peripheral contacts 350 may include a spring beam at the upper mating interface. Peripheral contacts 350 may form an LGA or BGA or other type of interface at the lower mating interface. For example, peripheral contacts 350 may include pads, solder balls, spring beams, or other types of contacts at the lower mating interface. In an exemplary embodiment, peripheral contacts 350 may include low-speed signal contacts, ground contacts, power contacts, or other types of contacts.

Claims

1. An electronic system (100), comprising: An electronic package (104) includes an electronic package substrate (116) configured to be coupled to a host circuit board (106), the electronic package including an integrated circuit (118) mounted to the electronic package substrate, and the electronic package including a socket connector (110) mounted to the electronic package substrate and electrically connected to the integrated circuit. A peripheral connector (300) is separate from the electronic package and configured to be coupled to the host circuit board, the peripheral connector being positioned near the receptacle connector on the periphery of the electronic package substrate; and The communication module (200) includes a first connector interface and a second connector interface, the first connector interface being connected to the socket connector and the second connector interface being connected to the peripheral connector.

2. The electronic system (100) according to claim 1, wherein, The electronic package substrate (116) includes a first side edge defining a portion of the periphery of the electronic package substrate, the socket connector (110) is mounted to the electronic package substrate between the first side edge and the integrated circuit (118), and the peripheral connector (300) is positioned beyond and spaced apart from the first side edge.

3. The electronic system (100) according to claim 1, wherein, The peripheral connector (300) includes an upper portion (306) and a lower portion (308), the lower portion being vertically aligned with the electronic package substrate (116) and the upper portion being vertically aligned with the socket connector (110).

4. The electronic system (100) according to claim 1, wherein, The peripheral connector (300) includes a lower interface (304) configured to be connected to the host circuit board (106) and an upper interface (302) configured to be connected to a second connector interface of the communication module (200). The lower interface is coplanar with the bottom (222) of the electronic package substrate (116) and the upper interface is coplanar with the top (220) of the socket connector (110).

5. The electronic system (100) according to claim 1, wherein, The socket connector (110) includes a high-speed data contact for transmitting high-speed data signals between the electronic package substrate (116) and the communication module (200), and the peripheral connector (300) includes a power contact configured to transmit power between the host circuit board (106) and the communication module.

6. The electronic system (100) according to claim 5, wherein, The peripheral connector (300) includes a low-speed data contact for transmitting low-speed data signals between the host circuit board (106) and the communication module (200).

7. The electronic system (100) according to claim 1, wherein, Power transmission to the communication module (200) mainly flows through the peripheral connector (300).

8. The electronic system (100) according to claim 1, wherein, The peripheral connector (300) is configured to float relative to the electronic package (104) to align the peripheral connector with the communication module (200) during mating with the receptacle connector (110).

9. The electronic system (100) of claim 1 further includes an alignment module configured to align the communication module (200) with at least one of the socket connector (110) and the peripheral connector (300).

10. The electronic system (100) according to claim 1, wherein, The socket connector (110) includes a compressible interface (302) at the top (220) of the socket connector for mating with the first connector interface, and the peripheral connector (300) includes a compressible interface at the top of the peripheral connector for mating with the second connector interface.

11. The electronic system (100) according to claim 1, wherein, The peripheral connector (300) is configured to directly transmit a portion of the mating load of the communication module (200) to the host circuit board (106) during the mating of the communication module with the peripheral connector and the socket connector (110).

12. The electronic system (100) according to claim 1, wherein, The communication module (200) includes: A communication module housing having a mating end (212) and a cable end (214), the communication module housing extending between a front portion and a rear portion (218); Cable (202), the cable extending from the end of the cable; A communication component (230) held by the communication module housing (210) is communicatively connected to the cable. The communication component includes a first mating region (232) defining a first mating interface and a second mating region (234) defining a second mating interface. The first mating region and the second mating region are separate and spaced apart from each other, wherein the first mating region is closer to the front and the second mating region is closer to the rear. The communication component includes a first contact in a first array at the first mating region, the first array being configured to mate with a socket connector (110) of the electronic package (104). The communication component includes a second contact in a second array at the second mating region, the second array being configured to mate with the peripheral connector (300). The first contact is configured to transmit high-speed data signals between the communication component and the socket connector, and the second contact is configured to transmit power between the communication component and the peripheral connector.

13. The electronic system (100) according to claim 1, wherein, The communication module (200) is an optical module configured to convert between electrical signals and optical signals, and the optical module includes an optical transmitting device in an optical receiving device.

14. An electronic system (100), comprising: A host circuit board (106) includes a first mounting area and a second mounting area on the surface of the host circuit board, the first mounting area and the second mounting area being separate and spaced apart from each other. An electronic package (104) is coupled to the first mounting area of ​​the host circuit board, the electronic package includes an electronic package substrate (116) coupled to the host circuit board, the electronic package includes an integrated circuit (118) mounted to the electronic package substrate, and the electronic package includes a socket connector (110) mounted to the electronic package substrate and electrically connected to the integrated circuit. A peripheral connector (300) is separate from the electronic package and connected to a second mounting area of ​​the host circuit board, the peripheral connector being located near the socket connector on the periphery of the electronic package substrate; and A communication module (200) includes a first connector interface and a second connector interface, wherein the first connector interface is connected to the socket connector in a mating direction, and the second connector interface is connected to the peripheral connector in the mating direction.

15. The electronic system (100) according to claim 14 further includes a thermal device (108) thermally connected to the integrated circuit (118) and the communication module (200).

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