Flexible hole device for circuit board
Patent Information
- Application Number
- CN202611367286.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-09-04
- Publication Date
- 2026-10-23
AI Technical Summary
[0003]现有线路板开孔设备多采用刚性硬质钻头配合固定工作台的结构,相较于刚性线路板对边夹持的固定方式,柔性线路板基材多为聚酰亚胺(PI)等柔性材质,自身刚性较低,在开孔时难以适配传统的边缘对夹固定方式,在刚性钻头高速接触柔性线路板表面时,容易导致机械应力和热应力造成板材收缩变形和铜箔起翘的问题出现,此时的边缘对夹的方式难以对形变过程进行平衡,解决柔性线路板应力不平衡后的弯曲现象,此外,在钻孔过程中产生的树脂粉尘和铜屑容易残留在孔内,造成孔壁粗糙度超标,后续电镀工序出现镀铜不均、孔断等不良现象
1、该线路板柔性开孔装置,通过将齿架完全插入至驱动箱内腔,使得齿轮转动九十度,从而使得第一抚辊从上翘状态向柔性电路板方向翻转,此过程中,第一抚辊会在靠近柔性线路板中部的位置与其接触,并将线路板的一组对侧进行抚平,防止其存在弯曲现象,当第一抚辊逐渐靠近线路板边缘时,固夹件会随着安装架的翻转,逐渐与柔性线路板的边缘接触,直至对齐完成从上至下的边缘夹持,平衡线路板打孔时受到的应力。
Smart Images

Figure CN122970797A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board opening technology, specifically a flexible circuit board opening device. Background Technology
[0002] With the rapid development of electronic information technology, flexible circuit boards are widely used in smartphones, wearable devices, aerospace and other fields due to their advantages such as being thin, flexible, and having high wiring density. In the circuit board production process, hole drilling is one of the key processes, which directly affects the installation accuracy of subsequent components and the reliability of circuit connectivity.
[0003] Existing circuit board drilling equipment mostly uses a rigid hard drill bit with a fixed worktable. Compared with the rigid circuit board edge clamping method, flexible circuit boards are mostly made of flexible materials such as polyimide (PI), which have low rigidity. They are difficult to adapt to the traditional edge clamping method when drilling. When the rigid drill bit comes into contact with the surface of the flexible circuit board at high speed, mechanical stress and thermal stress can easily cause the board to shrink and deform and the copper foil to warp. At this time, the edge clamping method is difficult to balance the deformation process and solve the bending phenomenon caused by stress imbalance of the flexible circuit board. In addition, resin dust and copper shavings generated during the drilling process can easily remain in the hole, causing the hole wall roughness to exceed the standard, resulting in uneven copper plating and hole breakage in the subsequent electroplating process. Summary of the Invention
[0004] To address the shortcomings of existing technologies, this invention provides a flexible perforation device for circuit boards, which solves the problems mentioned in the background section.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a flexible perforation device for circuit boards, comprising a frame, a fixing frame, and a processing table, and further comprising a first smoothing component, which includes a drive module, a smoothing module, and an edge clamping module. The drive module includes a servo motor fixedly mounted on the frame, and a bidirectional lead screw fixedly mounted to the output shaft of the servo motor. Both sides of the outer surface of the bidirectional lead screw are helically connected with threaded sleeves. A drive box is fixedly mounted on the threaded sleeves. A gear is provided in the inner cavity of the drive box. A torsion spring column is provided in the middle of the gear, and the gear is rotatably connected to the drive box through the torsion spring column.
[0006] Preferably, the smoothing module includes a mounting bracket fixedly installed at both ends of the torsion spring column, a first guide column fixedly installed on the mounting bracket, a first return spring sleeved on the outer periphery of the first guide column, a drive frame movably installed on the outer surface of the first guide column, and a first smoothing roller fixedly installed on the inner side of the drive frame.
[0007] Preferably, the edge clamping module includes a clamping groove formed inside the first roller, a compression spring is fixedly connected to the clamping groove, and a clamping member is fixedly connected to the other end of the compression spring.
[0008] Preferably, it further includes a second smoothing component, which includes a gear frame meshing with a gear, and a fixed column fixedly installed inside the gear frame. A rotating sleeve is movably installed on the outer surface of the fixed column, and a first fixed plate is fixedly installed on the surface of the rotating sleeve. Second guide columns are fixedly installed on both sides of the surface of the first fixed plate. A second return spring is sleeved on the outer periphery of the second guide column. A positioning plate is movably installed on the outer surface of the second return spring. A second fixed plate is fixedly installed on the positioning plate, and a second smoothing roller is fixedly installed on the second fixed plate.
[0009] Preferably, a limiting component is fixedly installed on the outer mounting bracket, and a clearance groove is provided on the processing table.
[0010] Preferably, it also includes a negative pressure adsorption component, which includes an adsorption module and a lifting module. The adsorption module includes a negative pressure groove and adsorption micropores formed on the processing table. A piston is movably installed in the inner cavity of the negative pressure groove. A stopper rod is fixedly installed on the piston. A third fixing plate is fixedly installed at the lower end of the stopper rod. A third return spring is fixedly connected to the surface of the third fixing plate. The other end of the third return spring is fixedly connected to the bottom of the processing table.
[0011] Preferably, the lifting module includes a connecting frame fixedly installed at the bottom of the screw sleeve, and a driving component is fixedly installed at the other end of the connecting frame.
[0012] Preferably, a vacuum cleaner is fixedly mounted on the surface of the second fixing plate, and the exhaust port of the vacuum cleaner is tilted downward.
[0013] Preferably, the gear frame is provided with a positioning screw groove, the fixing post is provided with a cross screw groove, and a bolt is threaded onto the positioning screw groove.
[0014] In the above technical solution, the beneficial effects of the present invention are: 1. This flexible circuit board drilling device, by fully inserting the gear frame into the inner cavity of the drive box, causes the gear to rotate 90 degrees, thereby causing the first smoothing roller to flip from an upward state towards the flexible circuit board. During this process, the first smoothing roller will contact the flexible circuit board near the middle and smooth one pair of opposite sides of the circuit board to prevent bending. As the first smoothing roller gradually approaches the edge of the circuit board, the clamping member will gradually contact the edge of the flexible circuit board as the mounting frame flips, until alignment is completed and the edge clamping is completed from top to bottom, balancing the stress on the circuit board during drilling.
[0015] 2. In this flexible circuit board drilling device, when the edge of the flexible circuit board held by the second roller needs to be drilled, the screw sleeve needs to be activated again to move the second roller out of the edge of the flexible circuit board. At this time, the driving component will continue to follow, thereby releasing the lifting of the third fixing plate, causing the piston to move downward, thereby generating negative pressure to adsorb the flexible circuit board, so that it adheres more tightly to the processing table during the drilling process, preventing the flexible circuit board from shifting due to gaps between it and the processing table, which would affect the drilling effect.
[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure.
[0017] This application provides an overview of various implementations or examples of the technology described in this disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the clamping operation state of the flexible circuit board of the present invention; Figure 4 This is a schematic diagram showing the positional relationship between the first smoothing component and the second smoothing component of the present invention; Figure 5 This is a schematic diagram of the initial state structure of the first smoothing component of the present invention; Figure 6 This is a cross-sectional view of the negative pressure adsorption component of the present invention; Figure 7 This is a schematic diagram of the working state structure of the edge clamping module of the present invention; Figure 8 This is a schematic diagram showing the positional relationship between the cross-shaped screw groove and the positioning screw groove of the present invention; Figure 9 This is a schematic diagram of the clamping operation state of the rigid circuit board of the present invention.
[0019] In the diagram: 1. Frame; 11. Three-axis slide; 12. Drill bit; 13. Fixing frame; 14. Machining table; 2. Servo motor; 21. Two-way lead screw; 22. Screw sleeve; 23. Drive box; 24. Gear; 25. Torsion spring column; 26. Mounting bracket; 27. First guide column; 28. First return spring; 29. Drive frame; 210. First roller; 211. Compression spring; 212. Fixing component; 3. Gear frame; 31. Fixing column; 32. Rotating element 33. First fixing plate; 34. Second guide post; 35. Second return spring; 36. Positioning plate; 37. Second fixing plate; 38. Second roller; 4. Limiting component; 41. Displacement groove; 5. Negative pressure groove; 51. Adsorption micropore; 52. Piston; 53. Plug rod; 54. Third return spring; 55. Third fixing plate; 56. Connecting frame; 57. Driving component; 6. Vacuum cleaner; 7. Positioning screw groove; 71. Cross screw groove; 72. Bolt. Detailed Implementation
[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0021] Example 1: Please refer to Figures 1 to 5 ,and Figure 7 The present invention provides a technical solution: a flexible opening device for circuit boards, including a frame 1, a fixing frame 13 and a processing table 14, and a first smoothing component, which includes a drive module, a smoothing module and an edge clamping module. The drive module includes a servo motor 2 fixedly mounted on the frame 1, and a bidirectional lead screw 21 fixedly mounted to the output shaft of the servo motor 2. Both sides of the outer surface of the bidirectional lead screw 21 are helically connected to screw sleeves 22. A drive box 23 is fixedly mounted on the screw sleeves 22. A gear 24 is provided in the inner cavity of the drive box 23. A torsion spring column 25 is provided in the middle of the gear 24, and the gear 24 is rotatably connected to the drive box 23 through the torsion spring column 25.
[0022] The smoothing module includes mounting brackets 26 fixedly installed at both ends of the torsion spring column 25. A first guide post 27 is fixedly installed on the mounting bracket 26. A first return spring 28 is sleeved on the outer periphery of the first guide post 27. A drive frame 29 is movably installed on the outer surface of the first guide post 27. A first smoothing roller 210 is fixedly installed on the inner drive frame 29. The mounting bracket 26 has a movable groove that matches the drive frame 29, which facilitates its telescopic movement.
[0023] The edge clamping module includes a clamping groove inside the first roller 210. A compression spring 211 is fixedly connected to the clamping groove. A clamping member 212 is fixedly connected to the other end of the compression spring 211. The clamping member 212 is arc-shaped and both it and the second roller 38 are made of rubber to avoid damage to the flexible circuit board during clamping and smoothing.
[0024] Specifically, the present invention also includes a three-axis slide 11, a drill bit 12, and a fixing frame 13. The three-axis slide 11 is mounted on the frame 1 and is used to drive the drill bit 12. The processing table 14 is fixed to the frame 1 via the fixing frame 13. Both sides of the processing table 14 are provided with drive boxes 23. One side is connected to a bidirectional lead screw 21 via a screw sleeve 22 and can be driven by the bidirectional lead screw 21. The drive box 23 on the other side can be installed by a guide rod and a slider. The drive boxes 23 on both sides are connected by a gear frame 3 and a fixing column 31. During the movement of the screw sleeve 22, all drive boxes 23 will move. At the same time, the presence of the guide rod can limit the screw sleeve 22 and prevent it from rotating when driven. In use, the servo motor 2 is first started to drive the bidirectional lead screw 21 to rotate, causing the screw sleeve 22 to move the drive box 23. The drive boxes 23 on both sides move towards the center of the processing table 14. Next, the flexible circuit board is placed flat on the surface of the processing table 14. Then, the gear frame 3 is inserted into the inner cavity of the drive box 23. During insertion, the toothed grooves on the gear frame 3 mesh with the gear 24, thereby driving the gear 24. The length of the toothed groove is equal to one-quarter of the circumference of the gear 24. That is, when the gear frame 3 is fully inserted to the bottom of the drive box 23, the gear 24 rotates ninety degrees, causing the first roller 210 to flip from its upward position towards the flexible circuit board, as shown in the attached instruction manual. Figure 5 Included with instruction manual Figure 4 As shown, during the flipping process of the first smoothing roller 210, it will contact the flexible circuit board near the center. As the gear 24 continues to rotate, the first return spring 28 will undergo compression deformation, and the drive frame 29 will drive the first smoothing roller 210 to retract, allowing the first smoothing roller 210 to continue moving on the surface of the flexible circuit board, thereby smoothing one pair of opposite sides of the circuit board and preventing bending. As the first smoothing roller 210 gradually approaches the edge of the circuit board, the clamping member 212 will gradually contact the edge of the flexible circuit board as the mounting frame 26 flips, until alignment is completed and the edge clamping from top to bottom is achieved, as shown in the attached instruction manual. Figure 7 As shown.
[0025] Example 2: Please refer to Figure 3 , Figure 4 and Figure 6It also includes a second smoothing component, which includes a gear frame 3 that meshes with the gear 24, and a fixed post 31 fixedly installed inside the gear frame 3. A rotating sleeve 32 is movably installed on the outer surface of the fixed post 31. A first fixed plate 33 is fixedly installed on the surface of the rotating sleeve 32. A second guide post 34 is fixedly installed on both sides of the surface of the first fixed plate 33. A second return spring 35 is sleeved on the outer periphery of the second guide post 34. A positioning plate 36 is movably installed on the outer surface of the second return spring 35. A second fixed plate 37 is fixedly installed on the positioning plate 36. A second smoothing roller 38 is fixedly installed on the second fixed plate 37.
[0026] A limiting component 4 is fixedly installed on the outer mounting bracket 26, and a clearance groove 41 is provided on the processing table 14.
[0027] It also includes a negative pressure adsorption component, which includes an adsorption module and a lifting module. The adsorption module includes a negative pressure groove 5 and adsorption micropores 51 opened on the processing table 14. A piston 52 is movably installed in the inner cavity of the negative pressure groove 5. A stopper rod 53 is fixedly installed on the piston 52. A third fixing plate 55 is fixedly installed at the lower end of the stopper rod 53. A third return spring 54 is fixedly connected to the surface of the third fixing plate 55. The other end of the third return spring 54 is fixedly connected to the bottom of the processing table 14.
[0028] The lifting module includes a connecting frame 56 fixedly installed at the bottom of the screw sleeve 22, and a driving component 57 fixedly installed at the other end of the connecting frame 56. The driving component 57 is wedge-shaped and is used to drive the third fixed plate 55.
[0029] Based on Embodiment 1, after the gear frame 3 is inserted into the inner cavity of the drive box 23, the positioning plate 36 is interfered with by the limiting member 4, thereby placing the second smoothing roller 38 above the flexible circuit board and preventing it from affecting the smoothing operation of the first smoothing component. When the clamping member 212 completes the edge clamping from top to bottom through the flipping operation, the limiting member 4 will also flip and move to the side and lower side of the processing table 14 through the relief groove 41, thereby releasing the limiting of the second smoothing roller 38 and allowing it to contact the flexible circuit board. Then, the servo motor 2 is started to drive the bidirectional lead screw 21 to rotate and drive the screw sleeve 22, causing the drive box 23 to move the gear frame 3, thereby moving the second smoothing roller 38 on the surface of the flexible circuit board until it reaches the edge of the flexible circuit board, thereby performing a smoothing operation on the other side of the other set of opposite sides, thus ensuring the flatness of the flexible circuit board, and stopping at the edge of the flexible circuit board to complete the positioning of the flexible circuit board. During this process, the clamping member 212 will move to the diagonal of the flexible circuit board. In this way, during the subsequent drilling process, the first and second smoothing components can ensure the flatness of the flexible circuit board surface before drilling. At the same time, by clamping the flexible circuit board from above, the stress contraction caused by drilling can be balanced, improving the drilling effect. It should be noted that the elastic force of the first return spring 28 that provides elasticity to the limiting member 4 can be set to be greater than the elastic force of the second return spring 35 and the elastic force of the first return spring 28 that provides elasticity to the first smoothing roller 210. In this way, the limiting member 4 can smoothly limit the positioning plate 36. At the same time, the light elasticity of the positioning plate 36 prevents damage to the flexible circuit board during the smoothing operation. On the other hand, when the gear 3 is inserted into the inner cavity of the drive box 23, screw positioning can be used to prevent the reset effect of the torsion spring column 25 from causing the gear 3 to become unstable.
[0030] Example 3: Please refer to Figure 4 , Figure 8 and Figure 9 A vacuum cleaner 6 is fixedly installed on the surface of the second fixing plate 37, and the exhaust port of the vacuum cleaner 6 is tilted downward.
[0031] The gear frame 3 has a positioning screw groove 7, the fixing column 31 has a cross screw groove 71, and the positioning screw groove 7 is threaded with a bolt 72.
[0032] Specifically, when the second roller 38 moves toward the center of the flexible circuit board, the screw sleeve 22 will drive the drive component 57 to move accordingly. The wedge-shaped drive component 57 will drive the third fixed plate 55, thereby causing the stopper rod 53 to drive the piston 52 to move upward to the top of the inner cavity of the negative pressure groove 5. When the second roller 38 performs a smoothing operation, the drive component 57 will return to its original position with the screw sleeve 22. At this time, the drive component 57 still lifts the third fixed plate 55, but is located at the edge of the third fixed plate 55. When the edge of the flexible circuit board held by the second roller 38 needs to be punched, the screw sleeve 22 needs to be activated again, so that the second roller 38 moves out of the edge of the flexible circuit board. At this time, the drive component 57 will continue to follow, thereby releasing the lifting of the third fixed plate 55, causing the piston 52 to move downward, thereby generating negative pressure to adsorb the flexible circuit board, so that it adheres more tightly to the processing table 14 during the punching process, preventing the flexible circuit board from shifting due to gaps between it and the processing table 14, which would affect the punching effect. Furthermore, resin dust and copper shavings generated during drilling are easily left inside the hole, causing excessive roughness of the hole wall. This leads to uneven copper plating and hole breakage in subsequent electroplating processes. In this invention, after the drilling operation is completed, the servo motor 2 can be started to drive the screw sleeve 22 to move the vacuum cleaner 6 toward the center of the flexible circuit board. At the same time, the drive component 57 will continue to lift the third fixed plate 55, causing the piston 52 to move upward in the inner cavity of the negative pressure groove 5. This allows the airflow to be ejected from the adsorption micro-hole 51. When the adsorption micro-hole 51 is connected to the through hole of the circuit board, the airflow will carry out the powder in the through hole. When the adsorption micro-hole 51 is not connected to the through hole, it will lift a part of the flexible circuit board, allowing the vacuum cleaner 6 to come into contact with it, improving the dust collection effect of the vacuum cleaner 6 and ensuring that the powder in the through hole can be sucked out cleanly. Furthermore, when it is necessary to drill holes in the rigid circuit board, the rotating sleeve 32 can be rotated to make the positioning plate 36 vertical. Then, the bolt 72 is screwed into the cross screw groove 71 to position the positioning plate 36. At this time, the second smoothing component can be removed, and the servo motor 2 can be started to directly make the screw sleeve 22 drive the positioning plate 36 to clamp the rigid circuit board, so as to achieve the purpose of flexible use of rigid and flexible circuit boards.
[0033] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A flexible perforation device for circuit boards, comprising a frame (1), a fixing frame (13), and a processing table (14), characterized in that: It also includes a first smoothing component, which includes a drive module, a smoothing module and an edge clamping module. The drive module includes a servo motor (2) fixedly mounted on the frame (1) and a bidirectional lead screw (21) fixedly mounted to the output shaft of the servo motor (2). Both sides of the outer surface of the bidirectional lead screw (21) are spirally connected to the screw sleeves (22). A drive box (23) is fixedly mounted on the screw sleeves (22). A gear (24) is provided in the inner cavity of the drive box (23). A torsion spring column (25) is provided in the middle of the gear (24), and the gear (24) is rotatably connected to the drive box (23) through the torsion spring column (25).
2. The flexible perforation device for circuit boards according to claim 1, characterized in that: The smoothing module includes a mounting bracket (26) fixedly installed at both ends of a torsion spring column (25). A first guide column (27) is fixedly installed on the mounting bracket (26). A first reset spring (28) is sleeved on the outer periphery of the first guide column (27). A drive frame (29) is movably installed on the outer surface of the first guide column (27). A first smoothing roller (210) is fixedly installed on the inner side of the drive frame (29).
3. The flexible perforation device for circuit boards according to claim 2, characterized in that: The edge clamping module includes a clamping groove formed inside the first roller (210), a compression spring (211) is fixedly connected to the clamping groove, and a clamping member (212) is fixedly connected to the other end of the compression spring (211).
4. The flexible perforation device for circuit boards according to claim 1, characterized in that: It also includes a second smoothing component, which includes a gear frame (3) meshing with a gear (24) and a fixed column (31) fixedly installed inside the gear frame (3). A rotating sleeve (32) is movably installed on the outer surface of the fixed column (31). A first fixed plate (33) is fixedly installed on the surface of the rotating sleeve (32). A second guide column (34) is fixedly installed on both sides of the surface of the first fixed plate (33). A second return spring (35) is sleeved on the outer periphery of the second guide column (34). A positioning plate (36) is movably installed on the outer surface of the second return spring (35). A second fixed plate (37) is fixedly installed on the positioning plate (36). A second smoothing roller (38) is fixedly installed on the second fixed plate (37).
5. The flexible perforation device for circuit boards according to claim 2, characterized in that: A limiting component (4) is fixedly installed on the outer mounting bracket (26), and a clearance groove (41) is provided on the processing table (14).
6. The flexible perforation device for circuit boards according to claim 1, characterized in that: It also includes a negative pressure adsorption component, which includes an adsorption module and a lifting module. The adsorption module includes a negative pressure groove (5) and adsorption micropores (51) opened on the processing table (14). A piston (52) is movably installed in the inner cavity of the negative pressure groove (5). A stopper rod (53) is fixedly installed on the piston (52). A third fixing plate (55) is fixedly installed at the lower end of the stopper rod (53). A third reset spring (54) is fixedly connected to the surface of the third fixing plate (55). The other end of the third reset spring (54) is fixedly connected to the bottom of the processing table (14).
7. The flexible perforation device for circuit boards according to claim 6, characterized in that: The lifting module includes a connecting frame (56) fixedly installed at the bottom of the screw sleeve (22), and a driving component (57) is fixedly installed at the other end of the connecting frame (56).
8. The flexible perforation device for circuit boards according to claim 4, characterized in that: A vacuum cleaner (6) is fixedly mounted on the surface of the second fixing plate (37), and the exhaust port of the vacuum cleaner (6) is tilted downward.
9. The flexible perforation device for circuit boards according to claim 4, characterized in that: The gear frame (3) is provided with a positioning screw groove (7), the fixing column (31) is provided with a cross screw groove (71), and the positioning screw groove (7) is threaded with a bolt (72).