An integrated circuit board cleaning and drying apparatus

Abstract

The application relates to an integrated circuit board cleaning and drying device in the field of circuit board cleaning, which comprises pipelines, the pipelines are concave-shaped track pipeline structures, the pipelines are provided with multiple pipelines, the multiple pipelines are equally spaced and parallelly distributed, the multiple pipelines are integrally divided into upper and lower two layers of symmetrical arrangement structures, and a cleaning operation cavity is formed in the gap region between the two layers of pipelines; a plurality of spray heads are arranged on the side of the upper and lower pipelines close to each other, and the plurality of spray heads are equally and uniformly distributed along the axial direction of the pipelines; the left and right ends of the pipelines are respectively fixedly connected with first and second connecting pipes; the bidirectional synchronous liquid supply structure at the two ends of the pipelines is adopted, the two-end independent adjusting valves and the pressure sensors are used for real-time closed-loop pressure regulation, the lowest point of the pipeline pressure is stably centered, the pressure, flow and atomization parameter differences of the spray heads of the whole pipeline are reduced, the problems of over-washing caused by high pressure at the near end and incomplete cleaning caused by low pressure at the far end under the long-pipeline spraying working condition are solved, and the cleaning uniformity and cleaning quality stability of the whole circuit board are improved.

Description

Technical Field

[0001] This invention relates to an integrated circuit board cleaning and drying apparatus in the field of circuit board cleaning. Background Technology

[0002] During the manufacturing process, dust, processing oil, residual additives, and oxide layer impurities easily adhere to the surface of integrated circuit boards. If these are not cleaned and removed, they will directly affect the stability of subsequent soldering, packaging, and power-on use of the circuit board, and may easily cause quality problems such as leakage, poor soldering, short circuits, and reduced service life. Therefore, integrated circuit boards must undergo strict acid pickling and drying processes before leaving the factory.

[0003] Most existing spray cleaning equipment adopts a single-end liquid supply spray structure. The pickling solution flows in from a single input end of the pipeline. Due to the combined effects of pipeline friction resistance, local resistance, and nozzle diversion loss, the pressure at the inlet end of the pipeline is high and the pressure at the far end is extremely low. This results in huge differences in nozzle flow rate, atomization degree, and rinsing force throughout the pipeline, leading to problems of over-cleaning at the near end and incomplete cleaning at the far end. The pressure difference defect is even more prominent under long pipeline spray conditions, resulting in poor cleaning uniformity on the circuit board surface and a large number of cleaning blind spots.

[0004] In view of the above-mentioned shortcomings, the present invention aims to create an integrated circuit board cleaning and drying device, which makes it more industrially valuable. Summary of the Invention

[0005] To address the aforementioned technical problems, the present invention aims to provide an integrated circuit board cleaning and drying device that solves the problem that existing spray cleaning equipment is mostly single-end liquid supply, which is affected by pipeline resistance and nozzle diversion loss, resulting in a large pressure difference between the inlet and outlet of the pipeline, inconsistent nozzle operating parameters, and this defect is particularly obvious under long pipeline conditions, causing poor uniformity of circuit board cleaning and the existence of cleaning blind spots.

[0006] The present invention provides an integrated circuit board cleaning and drying device, including a pipeline, wherein the pipeline has a U-shaped trajectory pipeline structure, and multiple pipelines are provided. The multiple pipelines are distributed in parallel at equal intervals, and the multiple pipelines are divided into an upper and lower symmetrical arrangement structure. The gap area between the two layers of pipelines forms a cleaning operation chamber. Multiple nozzles are provided on the side of the upper and lower pipelines that are close to each other, and the multiple nozzles are evenly distributed at equal distances along the axial direction of the pipeline; the left and right ends of the pipeline are respectively fixedly connected to a first pair of connecting pipes and a second pair of connecting pipes, and the outer end of the first pair of connecting pipes is connected to an external connecting pipe, which is connected to the external pickling solution supply assembly and the booster pump assembly respectively. The outer surface of the nozzle is provided with a through-type spray groove. The spray groove adopts a slender rectangular groove structure. The spray groove is arranged at an angle of 5° to 20° relative to the central axis of the pipeline. All spray grooves on the same pipeline have the same angle of inclination and are parallel to each other. A pressure-boosting baffle is fixedly installed at the midpoint of the internal axial direction of the pipeline. The pressure-boosting baffle adopts an inclined fixed installation structure, and the inclination angle of the pressure-boosting baffle is set to 10°~20°. The upper side of the pressure-boosting baffle and the upper inner wall of the pipeline form a second compression channel, and the lower side of the pressure-boosting baffle and the lower inner wall of the pipeline form a first compression channel. The cross-section of the first compression channel and the second compression channel are both set as right-angled trapezoidal groove structures, and both are gradually narrowing structures with one end larger and the other end smaller.

[0007] Furthermore, a conveyor line is provided inside the cleaning chamber for conveying PLC circuit boards.

[0008] Furthermore, the pickling solution supply assembly includes a pickling solution storage tank, a replenishment pipeline, a liquid level monitoring module, and a constant temperature control module. The liquid level monitoring module includes a liquid level gauge, which is installed inside the pickling solution storage tank. The constant temperature control module includes a temperature sensor and an electric heating plate, both of which are installed inside the pickling solution storage tank. The booster pump assembly includes a variable frequency booster pump and a pipeline flow regulating valve. The variable frequency booster pump is used to pump the pickling solution inside the pickling solution storage tank into the pipeline. The end output pipeline of the booster pump assembly is sealed and connected to the external connecting pipe and the second pair of connecting pipes. The connection ends of the external connecting pipe and the second pair of connecting pipes are independently equipped with pipeline flow regulating valves.

[0009] Furthermore, the tilt angle of the ejection groove is set to 15°.

[0010] Furthermore, the four edges of the pressure-boosting baffle are fixedly attached to the inner wall of the pipeline; the tilt angle of the pressure-boosting baffle is set to 15°. The small openings of the first compression channel and the second compression channel are arranged diagonally opposite each other.

[0011] Furthermore, the first pair of connecting pipes and the second pair of connecting pipes are each independently equipped with a filter assembly. The filter assembly includes a guide shell, which is a conical shell structure. The small end face of the guide shell is fixedly attached to the end face of the pipeline. Multiple through-holes are evenly opened on the end face of the pipeline. One end of the filter hole is connected to the internal cavity of the pipeline, and the other end is connected to the internal cavity of the conical guide shell. The outer ring sidewall of the guide shell and the inner sidewall of the second pair of connectors form an annular temporary collection cavity. The gap between the outer ring of the large end of the guide shell and the inner wall of the second pair of connectors forms an annular impurity inlet. The end of the second pair of connectors away from the pipeline is connected to a fixed circular pipe.

[0012] Furthermore, both the first and second connecting pipes are detachable cylindrical structures. The inner end of the connecting pipe is provided with an internal thread structure, and the outer ring of the end of the pipeline is provided with a matching external thread structure. The connecting pipe and the pipeline are disassembled and assembled by threaded engagement.

[0013] Furthermore, the first and second connecting pipes are connected to an external hot air supply system via a reversing valve.

[0014] Furthermore, both the first and second connecting pipes are independently equipped with adjustable pressure-stabilizing regulating valves, defined as regulating valve a and regulating valve b, respectively. Regulating valve a has a built-in matching pressure sensor a1, and regulating valve b has a built-in matching pressure sensor b1. The pressure sensors a1 and b1 are electrically connected to the built-in PLC control system of the device.

[0015] By means of the above-described solution, the present invention has at least the following advantages: This invention adopts a bidirectional synchronous liquid supply structure at both ends of the pipeline. Through independent regulating valves and pressure sensors at both ends, the pressure is adjusted in real time in a closed loop, so that the lowest pressure point of the pipeline is stably centered. This reduces the differences in pressure, flow rate and atomization parameters of the nozzles throughout the pipeline, and solves the problem of high pressure overwashing at the near end and incomplete cleaning at low pressure at the far end under the spraying conditions of long pipelines. This improves the uniformity of cleaning the entire circuit board and the stability of cleaning quality.

[0016] This invention features an inclined, staggered rectangular spray channel structure, which causes the fan-shaped spray surfaces of the nozzles to be distributed in an inclined, staggered, and parallel manner. This solves the problems of direct collision between adjacent liquid flows and energy loss in traditional vertical spray channels, ensuring the complete spray range of the pickling solution and sufficient rinsing force. At the same time, it forms a uniformly overlapping cleaning area, which can enhance the cleaning of circuit board corners, micro-holes, and gaps in fine lines, reduce cleaning blind spots, and improve the thoroughness of circuit board cleaning.

[0017] This invention features an inclined pressure-boosting baffle in the middle of the pipeline, which completely separates the bidirectional water inflow into two independent gradually narrowing channels. This avoids the problem of water flow at both ends colliding and depressurizing in the middle of the pipeline, and canceling out kinetic energy. It utilizes the principle of gradually narrowing fluid pressure boosting to adaptively compensate for the low-pressure area in the middle of the pipeline, achieving pressure balance of the nozzles throughout the pipeline without the need for additional pressure boosting equipment.

[0018] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show a certain embodiment of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the integrated circuit board cleaning and drying device of the present invention; Figure 2 This is a schematic diagram of the pipeline structure of the present invention; Figure 3 For the present invention Figure 1 Enlarged schematic diagram of the structure at point A in the middle; Figure 4 This is a cross-sectional view of the pipeline of the present invention; Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure at point B; Figure 6 This is a schematic diagram of the pressure booster baffle of the present invention from one perspective; Figure 7 This is a schematic diagram of the pressure booster baffle from another perspective of the present invention; Figure 8 This is a schematic diagram of the three-dimensional structure of the fan-shaped surface V formed by the spraying of pickling liquid by the nozzle of the present invention. Figure 9 This is a schematic diagram of the fan-shaped V-plane structure formed by the spraying of pickling liquid by the nozzle of the present invention; Figure 10 This is a schematic diagram of the structure of the regulating valve a, regulating valve b, pressure sensor a1, and pressure sensor b1 of the present invention. Figure 11 This is a block diagram of the pickling spray system and hot air drying system of the present invention.

[0021] In the diagram: 1. Pipeline; 2. First connecting pipe; 3. Second connecting pipe; 4. External connecting pipe; 5. Nozzle; 6. Conveyor line; 11. Pressure baffle; 31. Filter hole; 32. Temporary collection chamber; 33. Guide shell; 34. Impurity inlet; 35. Circular pipe; 51. Spray trough; 101. First compression channel; 102. Second compression channel. Detailed Implementation

[0022] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0023] Example 1

[0024] See Figures 1 to 9 A preferred embodiment of the present invention provides an integrated circuit board cleaning and drying device, comprising a pipeline 1, which has a concave trajectory distribution. Multiple pipelines 1 are provided, and the multiple pipelines 1 are distributed in parallel with equal spacing. All pipelines 1 are uniformly divided into upper and lower symmetrical arrangement structures. The gap area between the two layers of pipelines 1 forms a cleaning operation chamber. A conveyor line 6 is provided inside the cleaning operation chamber. The conveyor line 6 is a dedicated conveyor line for PLC circuit boards, used for continuously and uniformly conveying PLC circuit boards, realizing automated continuous feeding, cleaning and conveying operations of PLC circuit boards.

[0025] refer to Figure 1 and Figure 2 As shown, each pipe 1 is equipped with a nozzle 5 fixedly arranged on the inner wall near the conveyor line 6. There are multiple nozzles 5, and the multiple nozzles 5 are evenly distributed at equal distances along the axial direction of the pipe 1 to achieve full-area coverage spraying operation.

[0026] The left and right ends of the pipeline 1 are respectively fixedly connected to the first pair of connecting pipes 2 and the second pair of connecting pipes 3. The outer end of the first pair of connecting pipes 2 is connected to the outer connecting pipe 4. The outer connecting pipe 4 and the second pair of connecting pipes 3 are respectively connected to the external pickling liquid supply component and the booster pump component to form a complete liquid transportation circulation path.

[0027] When the external pump unit starts working, the prepared pickling solution can be steadily pumped into the pipeline 1. After the pickling solution fills the entire pipeline 1, it is evenly sprayed out through each nozzle 5. The high-pressure pickling solution is precisely sprayed onto the upper and lower surfaces of the PLC integrated circuit board that is being conveyed at a constant speed. The oxide layer, dust, oil stains and residual additives on the surface of the circuit board are washed away by high pressure, thereby realizing the automated continuous pickling and cleaning operation of the integrated circuit board.

[0028] This invention improves upon the traditional single-end liquid supply structure of cleaning pipelines by adopting a bidirectional synchronous liquid supply structure at both ends of the pipeline. Both the first pair of connecting pipes 2 and the second pair of connecting pipes 3 are independently equipped with adjustable pressure-stabilizing regulating valves, defined as regulating valve a and regulating valve b, respectively. Regulating valve a has a built-in pressure sensor a1, and regulating valve b has a built-in pressure sensor b1. The two sets of pressure sensors continuously collect water pressure data from both ends of the pipeline in real time and transmit the pressure data to the built-in PLC control system. The PLC control system dynamically adjusts the opening and closing degree of the two sets of regulating valves based on the real-time pressure difference, compensating for pipeline liquid supply pressure drift in real time, and maintaining a balanced state of water pressure at both ends. This ensures that the lowest pressure point in the pipeline is always stable at the exact center of the pipeline axis, adapting to pressure deviations caused by production line flow fluctuations, pipeline resistance changes, and nozzle wear, thereby improving pressure stability and spray consistency under long pipeline spraying conditions.

[0029] Specifically: the pickling solution supply component includes a pickling solution storage tank, a replenishment pipeline, a level monitoring module, and a constant temperature control module; the booster pump component includes a variable frequency booster pump and a pipeline flow regulating valve; the level monitoring module includes a level gauge, which is installed in the pickling solution storage tank and used to monitor the amount of pickling solution in the tank. When the level is insufficient, pickling solution is added to the tank through the replenishment pipeline; the constant temperature control module includes a temperature sensor, which is installed inside the pickling solution storage tank and used to monitor the temperature of the pickling solution; the pickling solution storage tank is also equipped with an electric heating plate to heat the pickling solution and maintain a constant temperature; and the variable frequency booster pump is used to pump the pickling solution from the tank to pipeline 1.

[0030] The end output pipeline of the booster pump assembly is sealed and connected to the external pipe 4 and the second pair of pipes 3. The flow regulating valves are independently installed at the connection ends of the external pipe 4 and the second pair of pipes 3. The two sets of flow regulating valves are respectively used in conjunction with the corresponding pressure sensors to achieve independent pressure regulation on both sides.

[0031] When the equipment is working, the pickling solution supply component completes the storage, temperature control and stable supply of the pickling solution, and the booster pump component performs pressure stabilization and boosting, real-time pressure monitoring and adaptive flow adjustment of the pickling solution, so that the pickling solution is smoothly input into the first pair of connecting pipes 2 and the second pair of connecting pipes 3 at constant pressure and constant flow, and finally evenly fills the entire pipeline 1 and is sprayed out by each nozzle 5 under high pressure, ensuring that the spray pressure, spray flow and atomization state of all nozzles in the entire pipeline are highly consistent.

[0032] To further highlight the advantages of the bidirectional liquid supply structure of this invention, we first analyze the inherent technical defects of the traditional single-end water inlet structure: Traditional integrated circuit board cleaning equipment uses a single-end water inlet and single-end pressure stabilization method for liquid supply. The pickling solution flows in from a single input end of the pipeline and flows unidirectionally along the pipeline axis. Due to the combined effects of pipeline friction resistance, local resistance, and nozzle diversion losses, a pressure gradient attenuation problem inevitably occurs, specifically manifested as high pressure at the inlet end and low pressure at the far end of the pipeline. This results in significant differences in the working conditions of the corresponding nozzles. The nozzles at the inlet end have sufficient water pressure, large flow rate, fine atomization, long spray range, and strong rinsing force; while the nozzles at the far end of the pipeline suffer from severe pressure loss, insufficient flow rate, coarse atomized particles, short spray range, and weak rinsing force. The poor consistency in spray flow rate, atomization effect, and rinsing force of all nozzles throughout the pipeline directly leads to uneven cleaning of the circuit board surface, over-cleaning at the near end and incomplete cleaning at the far end, resulting in localized residual impurities and uneven corrosion. Moreover, the longer the pipeline, the more obvious the pressure deviation defect of the single-end liquid supply becomes, making it unsuitable for long-distance, large-area full-area circuit board cleaning operations.

[0033] This invention, by adopting a two-end bidirectional synchronous water and liquid supply structure, solves the problem of traditional unidirectional pressure attenuation distribution, thus optimizing the internal pressure distribution of the pipeline: the pressure values ​​at the two inlet ports on the left and right sides of the pipeline are the highest, and the pressure gradually and evenly decreases from both ends to the middle along the pipeline axis. The lowest pressure point is precisely located at the midpoint of the pipeline axis, forming a stable pressure distribution pattern of high pressure at both ends and slightly low pressure in the middle. The nozzles at both ends of the pipeline have sufficient pressure, stable flow, fine droplets, qualified spray range, and strong flushing force. The nozzles in the middle of the pipeline have relatively the lowest pressure, moderate flow, uniform atomization, and a moderately shortened spray distance, but there will be no problem of sudden pressure drop or spray failure in some areas.

[0034] In summary, compared to the problem of "extremely high pressure at one end and extremely low pressure at the other end" in traditional single-end water inlet structures, the bidirectional liquid supply structure of this invention compresses the pressure and flow differences of the entire pipeline to a controllable range, significantly reduces the differences in operating parameters between each nozzle, and qualitatively improves the uniformity and consistency of spraying. Especially for large-scale spraying conditions with long pipelines and multiple nozzles, the optimization and improvement effect is obvious, solving the problems of uneven spraying, local cleaning blind spots, and unstable cleaning quality in long-distance circuit board cleaning.

[0035] Meanwhile, considering that during the operation of the bidirectional liquid supply structure, the two streams of water inside the pipeline flow from both ends to the middle, forming a weak water flow counter-flow effect and local turbulence effect at the midpoint of the pipeline, it can disturb the static liquid inside the pipeline, avoid problems such as impurity deposition, liquid stratification and slow flow rate on the inner wall of the pipeline, maintain the continuous flow and renewal of the liquid inside the pipeline, and further improve the stability of the spray.

[0036] During equipment operation, if there is a slight fluctuation in the water supply pressure at both ends, the system can capture the differential pressure signal in real time through the pressure sensor, dynamically adjust the opening and closing of the regulating valve, correct the low-pressure zone offset problem, ensure that the low-pressure zone in the middle of the pipeline is always centered and stable, reduce the problem of spray failure of the middle nozzle and fluctuation in cleaning quality caused by pressure drift, and adapt to complex working conditions such as production line start-up and shutdown, flow switching and nozzle wear.

[0037] Example 2

[0038] refer to Figures 3 to 4 As shown in the figure, this embodiment improves the nozzle 5 based on embodiment 1, further enhancing the integrity of circuit board cleaning coverage and the high-pressure rinsing force, and eliminating cleaning blind spots.

[0039] In this invention, the outer surface of the nozzle 5 is provided with a through-type spray groove 51. The spray groove 51 adopts a slender rectangular groove structure, which is different from the point spray mode of the traditional circular nozzle. The rectangular groove structure allows the pickling liquid to be sprayed out evenly in a fan-shaped planar spray state, forming a surface spray coverage effect. It can completely cover the entire width range of the PLC integrated circuit board at one time. Combined with the operation mode of the conveyor line 6 conveying the circuit board at a constant speed, it can perform continuous spray cleaning of the entire surface of the circuit board without dead angles and with full coverage, improving the cleaning efficiency and coverage integrity.

[0040] refer to Figures 8 to 9 As shown, in actual industrial production conditions, there are traditional parallel-arranged spray channels. Compared with parallel rectangular spray channels, the fan-shaped diffusion surface formed by the spray from a single spray channel is a regular vertical surface V, and all fan-shaped surfaces V are arranged parallel to each other. Although this structure can ensure basic coverage, high-speed liquid flow will collide and cancel each other out at the edge areas of two adjacent fan-shaped surfaces V, resulting in liquid kinetic energy loss, directly shortening the spray path of the pickling solution, reducing the rinsing force of the liquid flow impacting the circuit board surface, and insufficient cleaning impact force in the edge areas. Long-term use can easily lead to impurities remaining at the edges and corners of the circuit board, resulting in insufficient cleaning. To solve this problem, the present invention improves the arrangement angle of the spray channels 51, arranging all spray channels 51 at an angle of 5° to 20° relative to the central axis of the pipeline 1, and all spray channels 51 on the same pipeline 1 have the same angle of inclination and are parallel to each other, ensuring that the spray pattern is regular and controllable.

[0041] In this embodiment, the optimal tilt angle of the spray trough 51 is set to 15°. This angle can balance the spray coverage, the spray impact force and the overlapping cleaning area, and solve the problem of liquid flow collision loss.

[0042] After angle optimization, the fan-shaped surfaces V formed by the spraying of each spraying groove 51 are arranged in an inclined, staggered and parallel state. The edge liquid flow of adjacent fan-shaped surfaces V no longer collides and impacts each other, solving the problem of mutual cancellation and kinetic energy loss of adjacent liquid flow. The pickling liquid at the edge of the fan-shaped surface V can maintain complete spraying kinetic energy and be sprayed directly onto the surface of the PLC circuit board without resistance or loss. The pickling liquid spraying path is complete and the high-pressure rinsing force is sufficient throughout the process.

[0043] Meanwhile, the inclined and staggered fan-shaped spray surfaces can form a uniform overlapping cleaning area. Compared with the traditional offset loss mode of the parallel spray structure, this structure increases the repeated cleaning coverage area of ​​the PLC circuit board surface, strengthens the cleaning of the PLC circuit board corners, fine line gaps and micro-holes, improves the overall cleaning effect and cleaning uniformity, and solves the problems of weak spray force, incomplete edge cleaning and cleaning blind spots of traditional nozzles.

[0044] Example 3

[0045] refer to Figure 4 , Figure 6 and Figure 7 As shown in the figure, this embodiment, based on Embodiments 1 and 2, optimizes the structure to address the problems of low pressure and insufficient flushing force in the middle of the bidirectional liquid supply pipeline by adding a pressure-boosting compensation structure in the middle of the pipeline: a pressure-boosting baffle 11, which solves the inherent defects of pressure relief due to the opposing flow of bidirectional water. As can be seen from Embodiment 1, in the bidirectional liquid supply mode of the present invention, the water inlet pressure at both ends of pipeline 1 is the highest, and the pressure is the lowest point at the axial midpoint. The main reason for this is that the pickling liquid flowing in opposite directions at both ends of pipeline 1 converges and opposes each other in the middle of the pipeline, and the water flow impact forces cancel each other out, resulting in kinetic energy loss. This directly leads to insufficient spray pressure, poor atomization effect, and weak flushing force of the middle nozzle. This phenomenon is particularly prominent in long pipeline conditions, which can easily cause incomplete cleaning of the middle area of ​​the circuit board and affect the overall cleaning consistency.

[0046] To solve this problem, the present invention has a pressure boosting baffle 11 fixedly installed at the midpoint of the axial direction inside the pipeline 1. The pressure boosting baffle 11 adopts an inclined fixed installation structure. The inclination angle of the pressure boosting baffle 11 is set to 10°~20°, which can be adapted and adjusted according to the pipe diameter and flow parameters of the pipeline 1. In this embodiment, a 15° inclination angle is preferred, which has a better pressure boosting effect and will not cause blockage of the pipeline 1 or flow attenuation.

[0047] The pressure baffle 11 is completely fixed to the inner wall of the pipeline 1, thereby completely separating the internal space of the pipeline 1. The pressure baffle 11 divides the internal cavity of the pipeline 1 into two independent sets of gradual flow channels.

[0048] Specifically: the upper side of the pressure baffle 11 and the upper inner wall of the pipeline 1 form a second compression channel 102, and the lower side of the pressure baffle 11 and the lower inner wall of the pipeline 1 form a first compression channel 101. The cross-sections of the first compression channel 101 and the second compression channel 102 are both set as right-angled trapezoidal groove structures, forming a gradually narrowing fluid channel structure with a large opening at one end and a small opening at the other end, and pressure compensation is achieved by utilizing the principle of fluid gradually narrowing and pressurizing.

[0049] Meanwhile, the small openings of the first compression channel 101 and the second compression channel 102 are arranged diagonally opposite each other, ensuring that the liquids flowing in from both ends can enter the two sets of compression channels independently, and the flow is split without interference. The pickling liquids entering from the left and right ends of the pipeline 1 are completely separated by the pressure baffles 11 and flow into the first compression channel 101 and the second compression channel 102 independently, solving the problem of the opposing water flows at both ends directly converging and offsetting each other and the kinetic energy canceling out in the middle of the pipeline 1. During the flow of the pickling liquid inside the gradually narrowing channel, as the flow cross section gradually decreases, the liquid velocity continues to increase and the pressure gradually rises, forming a significant fluid pressurization effect.

[0050] When high-pressure liquid is ejected from nozzle 5 in the middle of pipeline 1, the liquid pressure in the middle area, which originally had the lowest pressure, is compensated and the jetting power is increased, which offsets the pressure loss caused by the bidirectional water flow and makes the jetting pressure, flow rate and atomization effect of all nozzles in pipeline 1 tend to be consistent.

[0051] This embodiment utilizes a mechanical diversion and pressurization structure, eliminating the need for additional booster pumps or modifications to the liquid supply system. It can autonomously achieve adaptive pressure compensation in the middle of pipeline 1, resulting in a simple structure, stable operation, and no additional energy consumption. This solves the problems of low pressure and weak cleaning in the middle of bidirectional liquid supply structures, further improving the uniformity of spraying in pipeline 1, ensuring consistent cleaning intensity across the entire surface of the integrated circuit board, eliminating weak cleaning areas, and improving product cleaning yield.

[0052] Example 4

[0053] refer to Figure 4 and Figure 5 As shown in the figure, this embodiment adds a self-cleaning filter anti-clogging structure at the end of the pipeline based on the above embodiment, which solves the problems of easy clogging of nozzles and pipelines in existing cleaning equipment, frequent shutdowns for cleaning, high maintenance costs and poor production continuity; the present invention has independently assembled filter components inside the first pair of connecting pipes 2 and the second pair of connecting pipes 3. The two sets of filter components have the same structure and are symmetrically arranged to achieve synchronous filtration of water entering from both ends and intercept liquid impurities in all directions.

[0054] The filter assembly includes a guide shell 33, which adopts a conical shell structure design. The small end face of the guide shell 33 is fixedly attached to the end face of the pipeline 1. Multiple through-holes 31 are evenly opened on the end face of the pipeline 1. One end of the filter hole 31 is connected to the internal cavity of the pipeline 1, and the other end is connected to the internal cavity of the conical guide shell 33 to form a filter flow channel.

[0055] The outer ring sidewall of the guide shell 33 and the inner sidewall of the second pair of connectors 3 form an annular temporary collection cavity 32. The gap between the outer ring of the large end of the guide shell 33 and the inner wall of the second pair of connectors 3 forms an annular impurity inlet 34. The end of the second pair of connectors 3 away from the pipeline 1 is connected to a fixed circular pipe 35 for connecting to an external pickling solution supply pipeline.

[0056] During equipment operation, pickling solution carrying impurities enters the second pair of pipes 3 through the circular pipe 35. The liquid flow first impacts and adheres to the inner wall of the conical surface of the guide shell 33. Under the guidance of the conical surface, it spreads and flows evenly. Solid particles and waste residue impurities in the liquid are precisely intercepted inside the guide shell 33. Clean pickling solution can smoothly enter the pipeline 1 through the filter hole 31 to complete the impurity filtration and purification operation. The particulate impurities accumulated on the inner wall of the guide shell 33 will automatically detach from the port of the filter hole 31 under the combined action of continuous liquid flow impact and liquid backflow reaction force, and flow along the conical surface. They will automatically flow into the temporary collection chamber 32 for centralized storage through the impurity inlet 34.

[0057] This structure ensures that there is no accumulation of impurities or blockage on the end face of the filter hole 31, maintaining smooth flow through the filter hole at all times. At the same time, both the first connecting pipe 2 and the second connecting pipe 3 in this invention adopt a detachable cylindrical structure design. The inner end of the connecting pipe is provided with an internal thread structure, and the outer ring of the end of the pipe 1 is provided with a matching external thread structure. The two can be detached and assembled by screwing them together. The staff can periodically unscrew and disassemble the connecting pipe to centrally clean the impurities accumulated inside the temporary collection chamber 32. The maintenance operation is simple and efficient, and it is suitable for long-term continuous industrial production conditions.

[0058] Example 5

[0059] refer to Figure 1 , Figure 2 and Figure 11 As shown in the figure, this embodiment adds an integrated spray drying structure on the basis of all the above embodiments, integrating the pickling spray system and the hot air drying system into the same set of pipeline equipment, solving the problem of large equipment footprint caused by the separation of cleaning and drying processes in traditional equipment.

[0060] In this invention, the first pair of connecting pipes 2 and the second pair of connecting pipes 3 at both ends of the pipeline 1 are not only connected to the pickling solution supply component, but also connected to the external hot air supply system through an independent reversing valve, so that the pickling spray operation and the hot air drying operation can be completed respectively, realizing the integrated operation of cleaning and drying.

[0061] Specifically, the hot air system includes a hot air generator, a constant temperature and pressure regulating valve, a reversing valve, and a hot air delivery pipeline. The hot air generator produces constant temperature and dry hot air. The temperature and speed of the hot air are precisely controlled by the pressure regulating valve. The reversing valve switches between the pickling solution path and the hot air path. The two media enter the pipeline 1 at different times, without cross-flow or interference. After the equipment completes the pickling spraying process of the circuit board, the control system automatically switches the reversing valve, closes the pickling solution supply path and opens the hot air supply path. The constant temperature and high pressure hot air enters the pipeline 1 bidirectionally through the first pair of connecting pipes 2 and the second pair of connecting pipes 3, fills the entire pipeline cavity, and is evenly sprayed out through multiple sets of nozzles 5 to form a full-area hot air coverage drying area.

[0062] With the cyclic conveying function of conveyor line 6, the integrated circuit boards that have completed pickling can re-enter the cleaning chamber with the rotating conveyor line to receive full-area hot air jet drying treatment. The hot air can quickly remove residual cleaning liquid and fine water stains from the surface of the circuit board, while deeply drying the gaps and micropores of the circuit board lines, avoiding water stains and oxidation and moisture problems, and improving the cleaning and drying quality of the circuit board.

[0063] In summary, this invention achieves two-stage cycle operation with a single set of equipment. The first stage involves acid pickling and spray cleaning, while the second stage involves hot air constant temperature drying. This eliminates the need for additional independent drying equipment and manual transfer of materials, thereby increasing equipment integration, reducing floor space, and making the process simpler and more efficient.

[0064] In actual use, a quick-drain component is added at the reversing valve position. After the pickling process is completed and before the hot air process is started, the residual pickling liquid inside the pipeline can be quickly drained to prevent the residual liquid from being carried out by the hot air and forming water mist, thus preventing secondary corrosion and secondary pollution of the circuit board.

[0065] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An integrated circuit board cleaning and drying device, comprising a pipeline (1), characterized in that: The pipeline (1) is a concave trajectory pipeline structure. There are multiple pipelines (1), which are distributed in parallel at equal intervals. The pipelines (1) are divided into two symmetrical layouts, and the gap between the two pipelines (1) forms a cleaning operation chamber. Multiple nozzles (5) are provided on the side of the upper and lower pipelines (1) that are close to each other. The multiple nozzles (5) are evenly distributed at equal distances along the axial direction of the pipeline (1). The left and right ends of the pipeline (1) are respectively fixedly connected to a first pair of connecting pipes (2) and a second pair of connecting pipes (3). The outer end of the first pair of connecting pipes (2) is connected to an outer connecting pipe (4). The outer connecting pipe (4) and the second pair of connecting pipes (3) are respectively connected to the external pickling liquid supply assembly and the booster pump assembly. The outer surface of the nozzle (5) is provided with a through-type spray groove (51). The spray groove (51) adopts a slender rectangular groove structure. The spray groove (51) is arranged at an angle of 5° to 20° relative to the central axis of the pipeline (1). All spray grooves (51) on the same pipeline (1) have the same angle of inclination and are parallel to each other. A pressure-boosting baffle (11) is fixedly installed at the midpoint of the internal axial direction of the pipeline (1). The pressure-boosting baffle (11) adopts an inclined fixed installation structure, and the inclination angle of the pressure-boosting baffle (11) is set to 10°~20°. The upper side of the pressure-boosting baffle (11) and the upper inner wall of the pipeline (1) form a second compression channel (102), and the lower side of the pressure-boosting baffle (11) and the lower inner wall of the pipeline (1) form a first compression channel (101). The cross-sections of the first compression channel (101) and the second compression channel (102) are both set as right-angled trapezoidal groove structures and are both gradually narrowing structures with one end larger and the other end smaller.

2. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The cleaning operation chamber is equipped with a conveyor line (6), which is used to transport PLC circuit boards.

3. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The pickling solution supply assembly includes a pickling solution storage tank, a replenishment pipeline, a liquid level monitoring module, and a constant temperature control module. The liquid level monitoring module includes a liquid level gauge, which is installed inside the pickling solution storage tank. The constant temperature control module includes a temperature sensor and an electric heating plate, both of which are installed inside the pickling solution storage tank. The booster pump assembly includes a variable frequency booster pump and a pipeline flow regulating valve. The variable frequency booster pump is used to pump the pickling solution inside the pickling solution storage tank into the pipeline (1). The end output pipeline of the booster pump assembly is sealed and connected to the external pipe (4) and the second pair of pipes (3). The access ends of the external pipe (4) and the second pair of pipes (3) are respectively equipped with pipeline flow regulating valves.

4. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The tilt angle of the ejection groove (51) is set to 15°.

5. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The four edges of the pressure boosting baffle (11) are fixedly attached to the inner wall of the pipeline (1); the inclination angle of the pressure boosting baffle (11) is set to 15°. The small opening of the first compression channel (101) and the small opening of the second compression channel (102) are arranged diagonally opposite each other.

6. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The first pair of connecting pipes (2) and the second pair of connecting pipes (3) are each independently equipped with a filter assembly. The filter assembly includes a guide shell (33), which is a conical shell structure. The small end face of the guide shell (33) is fixedly attached to the end face of the pipeline (1). Multiple through-holes (31) are evenly opened on the end face of the pipeline (1). One end of the filter hole (31) is connected to the internal cavity of the pipeline (1), and the other end is connected to the internal cavity of the conical guide shell (33). The outer ring sidewall of the guide shell (33) and the inner sidewall of the second pair of pipes (3) form an annular temporary collection cavity (32). The gap between the outer ring of the large end of the guide shell (33) and the inner wall of the second pair of pipes (3) forms an annular impurity inlet (34). The end of the second pair of pipes (3) away from the pipeline (1) is connected to a fixed circular pipe (35).

7. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The first pair of connectors (2) and the second pair of connectors (3) are both detachable cylindrical structures. The inner end of the connector is provided with an internal thread structure, and the outer ring of the end of the pipeline (1) is provided with a matching external thread structure. The connector and the pipeline (1) are disassembled and assembled by thread engagement.

8. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The first pair of pipes (2) and the second pair of pipes (3) are connected to an external hot air supply system through a reversing valve.

9. The integrated circuit board cleaning and drying apparatus according to claim 1, characterized in that: The first pair of pipes (2) and the second pair of pipes (3) are each independently equipped with an adjustable pressure regulating valve, which is defined as regulating valve a and regulating valve b respectively. The regulating valve a has a built-in matching pressure sensor a1, and the regulating valve b has a built-in matching pressure sensor b1. The pressure sensor a1 and the pressure sensor b1 are electrically connected to the built-in PLC control system of the equipment.

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