Rear case for display device having circuit component support structure

Abstract

A back case for a display device having a circuit component support structure is characterized by including a circuit board mounting portion on which a recessed portion in which a circuit board is to be fitted is formed, and the circuit board mounting portion is integrally formed with a plate material of a single material or a composite material of which the back case is formed in a molding process.

Description

Technical Field

[0001] This invention relates to a back cover for a display device having a circuit component support structure, specifically to a back cover that can stably support various circuit boards or electronic components by being disposed on the back of a display panel, and particularly to a back cover for a display device having a circuit component support structure that can be integrally formed using metal or composite materials. Background Technology

[0002] Electronic components such as circuit boards, power boards, or motherboards need to be stably fixed inside the display device, which is usually achieved using separate fixing components or chassis plates.

[0003] As described above, the fixing components or chassis plates that perform similar functions are usually made of metal and are fixed to the back cover of the display device or the chassis structure inside by means of screw fastening, riveting, or connector insertion.

[0004] Multiple fastening holes are formed on the upper side of the fixing component, and the circuit board (e.g., printed circuit board (PCB), power board, and motherboard) is directly fastened to the fixing component at the position corresponding to the fastening hole by means of screws, bolts, and clips, thereby being mechanically supported or fixed.

[0005] However, as described above, the mounting components need to be manufactured separately and attached to the back cover or internal structure, which increases the number of parts and complicates the assembly process, thus increasing manufacturing costs. In particular, when the mounting components and the back cover are made of different parts, it may become difficult to adjust the tolerances between the components, and there is also a possibility that the mounting components may wear or break due to repeated tightening. Furthermore, removing burrs generated during the tightening process and accurately aligning the screws also adds to the quality management burden.

[0006] In traditional techniques, a back cover made of aluminum composite material (ACM) or a single metal material (e.g., aluminum sheet and steel sheet) is typically used. Separate mounting components or chassis plates for mounting circuit boards are fabricated as individual parts and then attached to the back cover. As described above, this requires a fastening process between the back cover and the mounting components, as well as additional steps such as forming threaded holes for securing the circuit board and installing reinforcing ribs. Therefore, this leads to increased processing steps, increased mold count, decreased production performance, and higher unit prices.

[0007] Furthermore, while composite material back shell structures offer advantages such as lightweighting, thermal insulation, and rigidity, technologies that can integrate circuit board mounting are relatively rare. In particular, currently disclosed technologies that can integrally mount functions within structures made of metal and resin or fiber laminates are few and far between, and most current technologies still rely on individual components.

[0008] In view of this, there is an urgent need to develop a technology that can reduce the number of parts and processes by integrating circuit board mounting functions into the back cover itself, while also improving rigidity and assembly precision.

[0009] Therefore, the applicant has put forward this invention to solve the problems described above, and as a related prior art document, there is Korean Patent No. 10-2264479, "Method for Stamping Composite Materials". Summary of the Invention

[0010] The present invention aims to solve the problems described above, and its purpose is to provide a circuit board mounting part integrally formed on one side of the rear shell of a display device in a manner that can support the circuit board, and the corresponding rear shell is made of a sheet material of composite material or a single metal material, thereby ensuring rigidity and assembly precision while reducing the number of parts.

[0011] The present invention relates to a back cover for a display device having a circuit component support structure. The back cover may include a circuit board mounting portion having a recessed portion for mounting a circuit board. In the process of molding a sheet material of a single material or a composite material constituting the back cover, the circuit board mounting portion is integrally formed with the sheet material.

[0012] In addition, the recessed portion may include a plurality of mounting slots formed on one side of a single material plate or a composite material plate constituting the rear shell.

[0013] Furthermore, the plurality of mounting slots can be arranged spaced apart from each other in a manner corresponding to the outline shape of the circuit board.

[0014] In addition, the circuit board mounting portion may include protruding ribs that protrude from one side of a single material plate or a composite material plate constituting the rear housing, thereby dividing the plurality of mounting slots.

[0015] Furthermore, the sheet material of the single material can be made of metal or an alloy of two or more different metals.

[0016] In addition, the composite material sheet may include: a first surface layer composed of a metal or an alloy of two or more metals that are different from each other; a plastic resin layer laminated to the first surface layer; and a second surface layer laminated to the resin layer composed of a metal or an alloy of two or more metals that are different from each other.

[0017] Furthermore, a fastening hole for mounting the circuit board into the mounting slot may be formed in the circuit board mounting portion. The fastening hole may be formed on one side of the plate that divides the plurality of mounting slots or on the protruding rib.

[0018] In addition, the fastening hole may have threads formed on its inner circumferential surface for screw fastening.

[0019] Furthermore, when the fastening hole is formed on the composite material sheet, the fastening hole can be formed in a manner that penetrates the first surface layer, the resin layer, and the second surface layer, and the thread can be formed on the second surface layer.

[0020] Furthermore, in the process of molding a sheet of a single material or a sheet of a composite material constituting the rear shell, the plurality of mounting grooves and the protruding ribs can be formed simultaneously by a single molding die.

[0021] Furthermore, the plurality of mounting slots can be configured symmetrically from left to right, with reference to the longitudinal centerline of the single-material plate or composite material plate constituting the rear shell.

[0022] In addition, the resin layer may be made of polypropylene (PP), polycarbonate (PC) or fiber-reinforced resin, and the first surface layer or the second surface layer may be made of iron plate (GI, SECC) or aluminum alloy.

[0023] According to the present invention, the back cover for a display device with a circuit component support structure does not require a separate fixing component or chassis plate for mounting the circuit board. Instead, the circuit board mounting part can be integrally formed directly in the molding process of the back cover, thereby achieving effects such as reducing the number of components, simplifying assembly, and reducing molding processes.

[0024] Furthermore, the back cover for a display device with a circuit component support structure according to the present invention can precisely form multiple mounting slots corresponding to the outer contour shape of the circuit board and protruding ribs dividing them on a molding die, thereby stably installing the circuit board without displacement or twisting, and can also greatly improve the assembly convenience and productivity of operators.

[0025] Furthermore, according to the present invention, the back cover for a display device having a circuit component support structure can form threads in the fastening holes that penetrate the first surface layer, resin layer and second surface layer of the plate made of composite material, thereby maintaining mechanical strength without wear even under repeated fastening, thus helping to ensure the vibration resistance and long-term durability of the substrate. Attached Figure Description

[0026] Figure 1 This is a rear perspective view of a display device rear housing having a circuit component support structure according to one embodiment of the present invention.

[0027] Figure 2 This is a rear view of a display device rear cover having a circuit component support structure according to one embodiment of the present invention.

[0028] Figure 3 This is a front view of the rear cover of a display device having a circuit component support structure according to one embodiment of the present invention.

[0029] Figure 4 It is against Figure 1 The diagram shows a three-dimensional representation of the cutting state based on the cutting line AA shown in the figure.

[0030] Figure 5 Yes Figure 4 The diagram shows a magnified cross-sectional view of region A in the figure.

[0031] [Symbol Explanation] 100: Back cover 110: First surface layer 120: Resin layer 130: Second surface layer 200: Circuit Board Mounting Section 210: Prominent Rib 211, 212, 213: Installation slots 220: Fastening hole Detailed Implementation

[0032] The advantages and features of the present invention, as well as the methods for achieving them, will become even clearer through the following detailed embodiments with reference to the accompanying drawings.

[0033] However, the present invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. The embodiments described below are only for the purpose of disclosing the present invention more completely and introducing the scope of the present invention more completely to those skilled in the art. The present invention should only be defined within the scope of the claims.

[0034] Next, please refer to Figures 1 to 5A rear casing for a display device having a circuit component support structure according to one embodiment of the present invention will be described. In order to prevent obscuring the essence of the invention during the description, specific descriptions of related known functions or configurations will be omitted.

[0035] First, the present invention relates to a back cover for a display device having an integrally formed structure for mounting circuit boards such as motherboards, power boards, and printed circuit boards (PCBs). By eliminating the fixing components or chassis plates that are separately formed in conventional technologies, and directly forming the structure for mounting circuit boards in the back cover of the display device itself, the present invention achieves effects such as reducing the number of components, improving assembly efficiency, simplifying manufacturing processes, and ensuring product rigidity.

[0036] In particular, the present invention is characterized in that the plate constituting the rear shell can be a single material or a composite material, and a circuit board mounting part is integrally formed during the molding process of the plate, and is equipped with a plurality of grooves for mounting the circuit board.

[0037] Next, please refer to Figures 1 to 5 A detailed description will be given of a rear cover 100 for a display device having a circuit component support structure according to one embodiment of the present invention.

[0038] According to one embodiment of the present invention, the back cover 100 for a display device can be formed from a sheet material of a single material. In the case described above, the sheet material can be made of a metal such as iron or aluminum, or an alloy of two or more different metals.

[0039] The single-material sheet has structural rigidity, and in order to integrally form the circuit board mounting part 200 described later, it can be manufactured by forming processes such as stamping, in-mold forming, and hot pressing.

[0040] Furthermore, the back cover 100 for the display device according to one embodiment of the present invention may also be formed of a composite material sheet.

[0041] The composite material sheet is composed of a multi-layered structure that is stacked and bonded together, such as... Figure 2 , Figure 3 as well as Figure 5 As shown, a three-layer structure can be adopted, consisting of a first surface layer 110 made of metal or alloy, a resin layer 120 made of thermoplastic or fiber-reinforced composite resin, and a second surface layer 130 made of metal or alloy.

[0042] The first surface layer 110, the resin layer 120, and the second surface layer 130 can be sequentially stacked and bonded together. The first surface layer 110 and the second surface layer 120 can be made of iron sheet (GI, SECC) or aluminum alloy, while the resin layer 130 can be made of thermoplastic resins such as polypropylene (PP), polycarbonate (PC), and PA66, or a composite resin incorporating fibers. For reference, including fibers in the resin layer 120 can improve the mechanical strength and heat resistance of the resin layer, and also helps maintain a stable shape during molding.

[0043] As described above, this configuration appropriately distributes the material properties and functional roles of each layer, thereby simultaneously achieving multiple functions such as ensuring the rigidity of the entire board, improving thermal insulation performance, and reducing weight. In particular, the metal surface layer can provide overall structural support for the circuit board mounting section, while the resin layer provides molding flexibility and thermal insulation properties, thus achieving a lightweight structure.

[0044] The composite material sheet constructed as described above can integrate the individual layers through a hot-press bonding or molding process, and can also integrally form the circuit board mounting part 200, which will be described later, while forming the back shell 100.

[0045] For reference, the rear shell 100 made of a composite material sheet is illustrated in the accompanying drawings according to one embodiment of the present invention.

[0046] like Figures 1 to 5 As shown, the rear cover 100 according to one embodiment of the present invention includes: a circuit board mounting portion 200, which has a recessed portion for mounting a circuit board (not shown).

[0047] The circuit board mounting part 200 is a constituent element integrally formed with the plate body during the molding process of the back shell 100, which is made of a single material plate or a composite material plate.

[0048] According to one embodiment of the present invention, the circuit board mounting part 200 is an integrally formed component on one side of the rear housing 100, which can replace separate support components such as fixing parts or chassis plates that are separately equipped in the conventional technology.

[0049] In the circuit board mounting section 200, a recessed portion may be formed, including a plurality of mounting grooves 211, 212, 213 formed on one side of a single material plate or a composite material plate constituting the rear shell 100.

[0050] The mounting grooves 211, 212, and 213 are provided on one side of a single-material plate or a composite material plate constituting the rear shell 100, and can be integrally formed with the plate during the molding process.

[0051] like Figure 1 as well as Figure 2 As shown, the mounting grooves 211, 212, and 213 can be formed in the form of a groove with a certain depth on one side of the plate.

[0052] exist Figure 1 as well as Figure 2 In the first surface layer 110 of the composite material plate, three mounting grooves 211, 212, and 213 are formed in the form of grooves of a certain depth on one side.

[0053] The mounting slots 211, 212, and 213 may have a groove shape corresponding to the outer contour of the circuit board, so that the circuit board can be accurately and stably fixed to one side of the first surface layer 110.

[0054] As described above, the mounting slots 211, 212, and 213 not only provide space to support the circuit board, but also serve as guides to prevent the circuit board from falling out of position or twisting.

[0055] In addition, multiple mounting slots 211, 212, and 213 are arranged at intervals from each other, and the spacing between each mounting slot 211, 212, and 213 is designed according to the shape of the circuit board to be installed and the fixing point.

[0056] As described above, the arrangement of the mounting grooves 211, 212, and 213, which are spaced apart, can support the circuit board at various positions by multiple grooves that are not a single large groove. This helps to uniformly maintain the overall plateau and fixing force of the circuit board and can also effectively disperse the board shaking caused by impact or vibration.

[0057] Furthermore, the mounting slots 211, 212, and 213 can be configured symmetrically with reference to the longitudinal centerline of the single-material plate or composite material plate constituting the rear housing 100. The configuration of the mounting slots 211, 212, and 213 as described above, symmetrically with reference to the longitudinal centerline, facilitates precise configuration while ensuring the circuit board is stably aligned with the rear housing 100.

[0058] Furthermore, the symmetrical arrangement of mounting slots 211, 212, and 213 allows for intuitive identification of the circuit board's installation position, thereby improving assembly convenience for operators. In terms of mold design, the use of a symmetrical mold structure helps ensure the precision of mold manufacturing and maintain structural balance. Moreover, the symmetrical structure of mounting slots 211, 212, and 213 also contributes to preventing the circuit board from shaking or twisting and improving its durability against external forces.

[0059] In addition, the installation slots 211, 212, and 213, as well as... Figure 1 , Figure 2 as well as Figure 5 As shown, the surface can be divided by protruding ribs 210 formed on one side of the first surface layer 110.

[0060] The protruding rib 210 can be achieved by a structure that protrudes from one side of a single material plate or a composite material plate constituting the rear shell 100.

[0061] The mounting grooves 211, 212, and 213 are recessed in the shape of grooves, while the protruding ribs 210 protrude outward from the surface of the plate, thereby forming a partition that divides the three mounting grooves 211, 212, and 213.

[0062] The protruding rib 210 can physically define the configuration boundary of the circuit board, and at the same time, it can assist in guiding the alignment of the circuit board within the mounting slots 211, 212, and 213 when the circuit board is installed into the mounting slots 211, 212, and 213.

[0063] In addition, the protruding rib 210 not only divides the mounting slots 211, 212, and 213 for the user, but also serves as a mechanical resistance element to prevent horizontal movement or displacement due to vibration that may occur when the circuit board is installed into the mounting slots 211, 212, and 213.

[0064] The protruding ribs 210 described above are the same as the mounting grooves 211, 212, and 213, and can be integrally formed with the sheet metal during the process of forming the rear shell 100.

[0065] Furthermore, the mounting grooves 211, 212, 213 and the protruding ribs 210 of the circuit board mounting section 200 can be formed simultaneously by a single molding die during the molding process of a single material plate or a composite material plate constituting the rear shell 100.

[0066] As described above, by integrally forming the mounting grooves 211, 212, 213 and the protruding ribs 210 in the same molding process using a single molding die, the circuit board mounting structure can be integrated while the back cover 100 is being molded, thereby providing a structural foundation that can precisely support the circuit board without the need for separate component assembly or insertion processes.

[0067] Furthermore, by simultaneously forming mounting grooves 211, 212, and 213 and protruding ribs 210, positional alignment errors between the two components can be prevented, and the mounting precision of the circuit board can be improved. The configuration described above can also simultaneously provide process benefits such as reducing the number of molds, simplifying manufacturing processes, shortening assembly time, and improving overall productivity.

[0068] Furthermore, according to one embodiment of the present invention, the circuit board mounting portion 200 is as follows: Figures 1 to 3 As shown, a plurality of fastening holes 220 may be formed for fixing the circuit board to the mounting slots 211, 212, 213.

[0069] The fastening holes 220 can be formed on one side of the plate that divides the plurality of mounting slots 211, 212, 213 or on the protruding ribs 210, for stably fixing the circuit board by fastening components such as screws.

[0070] The fastening hole 220 has a structure in which threads are formed on its inner circumferential surface for screw fastening. When formed on a composite material sheet, it is formed in a manner that penetrates the first surface layer 110, the resin layer 120, and the second surface layer 130, and the threads can be formed on the second surface layer 130. As described above, by forming threads on the second surface layer 130 of the metal material that defines the fastening hole 220, a strong fastening force can be maintained even when the threads are repeatedly tightened.

[0071] Therefore, the circuit boards installed in the mounting slots 211, 212, and 213 can be firmly fixed in the mounting slots 211, 212, and 213 through the fastening holes 220, so that they will not shake or fall off due to vibration or external force.

[0072] The specific embodiments of the present invention have been described above. Various modifications can be made without departing from the scope of the present invention.

[0073] Therefore, the scope of the present invention is not limited to the illustrated embodiments, but should be defined within the scope of the appended claims and the scope of the claims themselves.

Claims

1. A rear housing for a display device with a circuit component support structure, characterized in that, The rear housing includes a circuit board mounting portion, which has a recessed portion for mounting a circuit board. In the process of molding a sheet of a single material or a composite material constituting the rear shell, the circuit board mounting portion is integrally formed with the sheet material.

2. The rear housing for a display device with a circuit component support structure according to claim 1, characterized in that, The recess includes a plurality of mounting slots formed on one side of a single-material plate or a composite material plate constituting the rear shell.

3. The rear housing for a display device with a circuit component support structure according to claim 2, characterized in that, The plurality of mounting slots are arranged spaced apart from each other in a manner corresponding to the outline shape of the circuit board.

4. The rear housing for a display device with a circuit component support structure according to claim 3, characterized in that, The circuit board mounting portion includes protruding ribs that protrude from one side of a single-material or composite material sheet constituting the rear housing, thereby dividing the plurality of mounting slots.

5. The rear housing for a display device with a circuit component support structure according to claim 4, characterized in that, The single-material plate is made of metal or an alloy of two or more different metals.

6. The rear housing for a display device with a circuit component support structure according to claim 4, characterized in that, The composite material sheet includes: The first surface layer is composed of a metal or an alloy of two or more metals that are different from each other; A plastic resin layer is laminated onto the first surface layer; and The second surface layer, laminated onto the resin layer, is composed of a metal or an alloy of two or more different metals.

7. The rear housing for a display device having a circuit component support structure according to claim 5 or 6, characterized in that, The circuit board mounting portion has fastening holes for mounting the circuit board into the mounting groove. The fastening holes are formed on one side of the plate or on the protruding rib that divides the plurality of mounting slots.

8. The rear housing for a display device with a circuit component support structure according to claim 7, characterized in that, The fastening hole has threads formed on its inner circumferential surface for screw fastening.

9. The rear housing for a display device with a circuit component support structure according to claim 8, characterized in that, When the fastening hole is formed on the composite material sheet, the fastening hole is formed in a manner that penetrates the first surface layer, the resin layer, and the second surface layer. The thread is formed on the second surface layer.

10. The rear housing for a display device with a circuit component support structure according to claim 4, characterized in that, In the process of molding a sheet of a single material or a composite material constituting the rear shell, the plurality of mounting grooves and the protruding ribs are formed simultaneously by a molding die.

11. The rear housing for a display device with a circuit component support structure according to claim 2, characterized in that, The plurality of mounting slots are arranged symmetrically from left to right, with reference to the longitudinal centerline of the single material plate or composite material plate constituting the rear shell.

12. The rear housing for a display device with a circuit component support structure according to claim 6, characterized in that, The resin layer is composed of polypropylene (PP), polycarbonate (PC), or fiber-reinforced resin. The first surface layer or the second surface layer is made of iron plate (GI, SECC) or aluminum alloy.

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