Heat dissipation structure, controller and vehicle

Abstract

The application relates to the technical field of vehicles and discloses a heat dissipation structure, a controller and a vehicle, wherein one side of a heat dissipation plate is provided with a heat dissipation fin, the heat dissipation fin is located in a liquid cooling chamber and is in contact with the heat dissipation plate. The heat generated by a heat generating component is transmitted to the heat dissipation fin and the cooling liquid in the liquid cooling chamber through the heat dissipation plate, and the flowing cooling liquid carries away the heat on the heat dissipation fin. The heat generating component is arranged on the side of the heat dissipation plate opposite to the heat dissipation fin, the heat dissipation plate is used for dissipating heat of the heat generating component, the heat generated by the heat generating component is quickly and timely transmitted to the cooling liquid in the liquid cooling chamber and the heat dissipation fin through the heat dissipation plate, the heat generating component is ensured to be in a relatively low temperature environment, the heat generating component is ensured to normally work, the service life of the heat generating component is prolonged, the service life of the controller is prolonged, the maintenance probability of the controller is reduced, and the user experience is improved.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and more particularly to a heat dissipation structure, a controller, and a vehicle. Background Technology

[0002] The controller is a crucial component of vehicle control. With the development of intelligent control and autonomous driving control, the computing power requirements for the controller are gradually increasing. Consequently, the heat generated during the operation of the controller is also increasing, placing higher demands on the controller's heat dissipation.

[0003] The current technology uses a water-cooled heat dissipation structure for controllers, but due to limitations in the molding process, the current water-cooled heat dissipation structure can no longer meet the heat dissipation requirements. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation structure, controller, and vehicle that can improve the heat dissipation capacity of the heat dissipation structure to meet the heat dissipation requirements of the controller.

[0005] To achieve this objective, in a first aspect, the heat dissipation structure provided by the present invention includes:

[0006] A liquid cooling plate and a heat dissipation plate are sealed together to form a liquid cooling chamber, which has a cooling inlet and a cooling outlet.

[0007] A heat sink is provided on one side of the heat sink, and the heat sink is located in the liquid cooling chamber and in contact with the heat sink.

[0008] As one feasible technical solution of the above-mentioned heat dissipation structure, an installation groove is provided on one side of the liquid cooling plate, and a liquid cooling groove is provided on the bottom wall of the installation groove. The heat dissipation plate is in contact with and sealed to the bottom wall of the installation groove, and the heat dissipation plate blocks the opening of the liquid cooling groove to form the liquid cooling chamber.

[0009] As one feasible technical solution for the above-mentioned heat dissipation structure, the liquid cooling chamber is provided with a partition, which divides the liquid cooling chamber into at least two sub-chambers. The at least two sub-chambers are connected end to end to form a serpentine channel. One end of the serpentine channel is connected to the cooling inlet, and the other end is connected to the cooling outlet.

[0010] As one feasible technical solution for the above-mentioned heat dissipation structure, the partition is integrally formed on the heat dissipation plate;

[0011] And / or, the partition is a copper structural component, or a series of aluminum structural components, or a 6063 aluminum alloy structural component;

[0012] And / or, each of the sub-cavities is provided with a heat sink, and the cooling inlet and the cooling outlet are both located at one end of the sub-cavity in communication with it.

[0013] As one feasible technical solution for the above-mentioned heat dissipation structure, at least one of the heat sink and the heat dissipation plate is a copper structural component, or an aluminum structural component, or a 6063 aluminum alloy structural component.

[0014] As one feasible technical solution for the above-mentioned heat dissipation structure, the heat sink includes at least two sheet-like structures, and the at least two sheet-like structures are arranged at intervals along the thickness direction of the sheet-like structures; the spacing between two adjacent sheet-like structures is 0.8mm to 1.5mm; and / or, the thickness of the sheet-like structures is 0.5mm to 2mm;

[0015] And / or, the heat sink is integrally formed on the heat sink plate.

[0016] Secondly, the controller provided by the present invention includes a circuit board and a heat dissipation structure as described in any of the above-described embodiments. A heat-generating component is mounted on the circuit board. The heat-generating component is located on the side of the heat sink opposite to the heat sink fin. The heat sink is used to dissipate heat from the heat-generating component.

[0017] As one feasible technical solution for the aforementioned controller, the heat-generating component is in contact with the heat sink surface;

[0018] And / or, the heat-generating component is fixed to the heat sink by thermally conductive adhesive;

[0019] And / or, the projection of the heat-generating component onto the plane of the heat sink is entirely within the area formed by the projection of the heat sink onto the plane of the heat sink.

[0020] As one feasible technical solution for the aforementioned controller, the controller further includes a backplate, which is connected to the liquid cooling plate to form a mounting cavity, and the circuit board is located within the mounting cavity.

[0021] Thirdly, the vehicle provided by the present invention includes the controller described in any of the above-described embodiments.

[0022] The present invention has at least the following beneficial effects:

[0023] The heat dissipation structure provided by this invention includes a liquid cooling plate and a heat dissipation plate, which are sealed together to form a liquid cooling chamber. The liquid cooling chamber has a cooling inlet and a cooling outlet. A heat dissipation fin is provided on one side of the heat dissipation plate, located inside the liquid cooling chamber and in contact with the heat dissipation plate. Coolant enters the liquid cooling chamber through the cooling inlet and flows out through the cooling outlet. The heat generated during the operation of the heat-generating component is transferred to the heat dissipation fin and the coolant in the liquid cooling chamber through the heat dissipation plate. As the coolant flows through the liquid cooling chamber, it carries away the heat from the heat dissipation fin, thereby cooling the heat-generating component.

[0024] The controller provided by this invention includes a circuit board and the aforementioned heat dissipation structure. The circuit board is equipped with a heat-generating component located on the side of the heat sink facing away from the heat sink. The heat sink dissipates heat from the heat-generating component, which facilitates the rapid and timely transfer of heat generated during the operation of the heat-generating component to the coolant in the liquid cooling chamber and the heat sink. This ensures that the heat-generating component is in a relatively low temperature environment, guaranteeing its normal operation and extending its service life. This, in turn, extends the service life of the controller, reduces the probability of controller maintenance, and improves the user experience.

[0025] The present invention provides a vehicle including the controller described above. By employing the controller, the vehicle reduces maintenance costs and improves user experience by extending the lifespan of the controller. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0027] Figure 1 A split view of the heat dissipation structure provided in an embodiment of the present invention from a first perspective;

[0028] Figure 2 This is a split view of the heat dissipation structure provided in the embodiment of the present invention from a second perspective.

[0029] In the picture:

[0030] 1. Liquid cooling plate; 11. Cooling outlet; 12. Liquid inlet pipe; 13. Liquid outlet pipe; 14. Mounting slot; 15. Liquid cooling tank; 16. Boss;

[0031] 21. Heat sink; 22. Heat fin; 23. Partition;

[0032] 3. Thermally conductive adhesive layer; 4. Heating element; 5. Circuit board; 6. Back plate; 61. Positioning protrusion. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0034] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0037] Embodiments of the present invention provide a heat dissipation structure, such as Figure 1 As shown, the heat dissipation structure includes a liquid cooling plate 1 and a heat dissipation plate 21. The liquid cooling plate 1 and the heat dissipation plate 21 are sealed together and enclosed to form a liquid cooling chamber. The liquid cooling chamber has a cooling inlet and a cooling outlet 11. A heat dissipation fin 22 is provided on one side of the heat dissipation plate 21. The heat dissipation fin 22 is located in the liquid cooling chamber and is in contact with the heat dissipation plate 21.

[0038] Coolant enters the liquid-cooled chamber through the cooling inlet and flows out through the cooling outlet 11. The heat generated during the operation of the heat-generating component 4 is transferred through the heat sink 21 to the heat sink 22 and the coolant within the liquid-cooled chamber. As the coolant flows through the liquid-cooled chamber, it carries away the heat from the heat sink 22, thus cooling the heat-generating component 4. For example, water is used as the coolant, which is low in cost.

[0039] For example, the heat sink 22 includes at least two sheet-like structures, which are spaced apart along the thickness direction of the sheet-like structures. The sheet-like structures are not only easy to manufacture, but also allow for smaller spacing between adjacent sheet-like structures, facilitating the arrangement of more sheet-like structures and increasing the total area of ​​the heat sink 22 that can contact the coolant. This allows the coolant flowing within the liquid cooling chamber to quickly remove heat from the heat sink 22, thereby achieving efficient heat dissipation. Using the heat sink 21 to dissipate heat from the heat-generating component 4 facilitates the rapid and timely transfer of heat generated by the heat-generating component 4 to the coolant within the liquid cooling chamber and to the heat sink 22.

[0040] In some embodiments, the spacing between two adjacent sheet-like structures is 0.8 mm to 1.5 mm. For ease of description, the spacing between two adjacent sheet-like structures is denoted as d. When d is greater than 1.5 mm, the spacing between two adjacent sheet-like structures is too large, resulting in unsatisfactory heat dissipation; when d is less than 0.8 mm, the spacing between two adjacent sheet-like structures is too small, increasing processing difficulty and cost. By limiting the spacing to 0.8 mm ≤ d ≤ 1.5 mm, processing difficulty and cost can be reduced while ensuring heat dissipation. For example, d = 1 mm.

[0041] In some embodiments, the present invention also provides a controller, which includes the heat dissipation structure described above. The controller further includes a circuit board 5 and a heat-generating component 4 disposed on the circuit board 5. Exemplarily, the heat-generating component 4 is a computing chip in the controller. To improve the heat dissipation effect on the heat-generating component 4, the heat-generating component 4 is disposed on the side of the heat sink 21 opposite to the heat sink 22. The heat sink 21 dissipates heat from the heat-generating component 4, which facilitates the rapid and timely transfer of heat generated during operation to the coolant in the liquid-cooled chamber and the heat sink 22, ensuring that the heat-generating component 4 is in a relatively low temperature environment, guaranteeing its normal operation, extending its service life, and thus extending the service life of the controller, reducing the probability of controller maintenance, and improving user experience. The circuit board 5 also generates heat during operation. This heat is transferred to the coolant in the liquid-cooled chamber through the heat sink 21, ensuring that the circuit board 5 is in a relatively low temperature environment, guaranteeing its normal operation.

[0042] In some embodiments, the projection of the heat-generating component onto the plane of the heat sink 21 lies entirely within the area formed by the projection of the heat sink 22 onto the plane of the heat sink 21. This arrangement helps ensure that the plane of the heat-generating component 4 facing the heat sink 21 can dissipate heat through the heat sink 21, allowing the heat generated by the heat-generating component 4 to be quickly and timely transferred to the heat sink 22 and the coolant in the liquid cooling chamber, thus improving the heat dissipation effect on the heat-generating component 4. It should be noted that, taking at least two sheet-like structures distributed along the first direction as an example, for ease of description, the sheet-like structures at both ends of the first direction are referred to as edge sheet-like structures. The projection of the surface of each edge sheet-like structure facing away from the other edge sheet-like structure onto the plane of the heat sink 21 is called the first projection. The first projection is a line segment. The rectangular area formed by connecting the endpoints of the two first projections at the same end in the second direction is called the area formed by the projections of all the sheet-like structures onto the plane of the heat sink 21.

[0043] In some embodiments, the heating element 4 is attached to the heat sink 21 using thermally conductive adhesive. The thermally conductive adhesive is the thermally conductive silicone, also known as thermally conductive gel. This not only simplifies the installation of the heating element 4 and improves the connection efficiency between the heating element 4 and the heat sink 21, but also allows the heat generated by the heating element 4 to be transferred to the heat sink 21 through the thermally conductive adhesive while it is being fixed to the heat sink 21, and then transferred from the heat sink 21 to the heat sink 22 and the coolant in the liquid cooling chamber. It should be noted that after the heating element 4 is attached to the heat sink 21 using thermally conductive adhesive, a thermally conductive adhesive layer 3 is formed between the heating element 4 and the heat sink 21.

[0044] In some embodiments, a mounting groove 14 is provided on one side of the liquid cooling plate 1, and a liquid cooling groove 15 is provided on the bottom wall of the mounting groove 14. The heat dissipation plate 21 is sealed to the bottom wall of the mounting groove 14, and the heat dissipation plate 21 seals the opening of the liquid cooling groove 15 to form a liquid cooling chamber. The heat dissipation plate 21 is adhered and fixed to the bottom wall of the mounting groove 14. The installation method of the heat dissipation plate 21 is simple, convenient and quick, and the contact between the heat dissipation plate 21 and the bottom wall of the mounting groove 14 helps to improve the sealing effect of the liquid cooling chamber and prevent leakage.

[0045] Specifically, a boss 16 is provided on the side of the liquid cooling plate 1 facing away from the heat sink 21, and the aforementioned liquid cooling groove 15 is formed on the side of the boss 16 facing the heat sink 21. For example, the boss 16 is integrally formed into the liquid cooling plate 1.

[0046] As an alternative, an annular protrusion can be provided on the heat sink 21, with the inner cavity of the annular protrusion forming a cooling groove. The mounting groove 14 is placed on the liquid cooling plate 1, and the annular protrusion is inserted into the cooling groove and abuts against the bottom wall of the cooling groove, so that the bottom wall of the mounting groove 14 seals the opening of the cooling groove to form a liquid cooling chamber. The heat sink 22 is placed between the bottom wall of the mounting groove 14 and the bottom wall of the cooling groove.

[0047] As an alternative, the heat sink 21 can be welded and fixed to the bottom wall of the mounting groove 14. By forming an annular weld around the mounting groove 14, the heat sink 21 can block the opening of the liquid cooling groove 15 to form a liquid cooling chamber.

[0048] As an alternative, the heat sink 21 can be welded and fixed to the bottom wall of the mounting groove 14, and a sealing element can be sandwiched between the heat sink 21 and the bottom wall of the mounting groove 14. The sealing element is located outside the mounting groove 14 and within the area enclosed by the weld, so as to use the heat sink 21 to block the opening of the liquid cooling groove 15 to form a liquid cooling chamber.

[0049] In some embodiments, a partition 23 is provided in the liquid cooling chamber, which divides the liquid cooling chamber into at least two sub-chambers; the at least two sub-chambers are connected in sequence to form a serpentine channel, one end of the serpentine channel is connected to the cooling inlet, and the other end of the serpentine channel is connected to the cooling outlet 11.

[0050] For example, a partition 23 is provided, which divides the liquid cooling chamber into two sub-chambers. This arrangement helps to extend the flow path of the coolant within the liquid cooling chamber, allowing the coolant to fully absorb the heat from the surface of the heat sink 21 and the heat sink 22, thereby improving the cooling effect of the heat dissipation structure on the heat-generating component 4.

[0051] It should be noted that the number of sub-chambers can be set according to actual needs. The number of sub-chambers is not limited to two; it can also be three, four, or more, thus forming a serpentine passage.

[0052] Both the cooling inlet and cooling outlet 11 are located on the bottom wall of the liquid cooling tank 15. Each sub-chamber has at least two plate-like structures distributed along the first direction, with the cooling inlet and cooling outlet 11 located at one end of the sub-chamber they communicate with. Taking two sub-chambers as an example, the cooling inlet is connected to one end of the sub-chamber in the second direction, and the cooling outlet is connected to one end of the other sub-chamber in the second direction. The second direction, the first direction, and the thickness direction of the heat sink 21 are perpendicular to each other. The cooling inlet is connected to a liquid inlet pipe 12, and the cooling outlet 11 is connected to a liquid outlet pipe 13. It should be noted that the thickness direction of the heat sink 21 is... Figure 1 and Figure 2 The third party shown. It should be noted that, Figure 1 and Figure 2 The first and second directions can be interchanged; in other words, the first and second directions can be interchanged. Figure 1 and Figure 2 The first direction shown is taken as the second direction. Figure 1 and Figure 2 The second direction shown is taken as the first direction.

[0053] For ease of description, the sub-chamber directly connected to the cooling inlet is referred to as the upstream sub-chamber, and the sub-chamber directly connected to the cooling outlet is referred to as the downstream sub-chamber. A flow gap is formed between two adjacent sheet-like structures.

[0054] The coolant entering the upstream sub-chamber through the inlet pipe 12 and cooling inlet enters the flow gap in the upstream sub-chamber. The coolant flows in the second direction to the other end of the upstream sub-chamber and then enters the second sub-chamber. The coolant entering the second sub-chamber enters the flow gap, flows in the second direction to the cooling outlet 11, and flows out through the outlet pipe 13.

[0055] For example, the inlet pipe 12 and the outlet pipe 13 are integrally formed on the liquid cooling plate 1, which simplifies the processing of the inlet pipe 12 and the outlet pipe 13, reduces processing costs, and improves processing efficiency. As an alternative, the inlet pipe 12 and the outlet pipe 13 can also be welded and fixed to the liquid cooling plate 1; or the inlet pipe 12 and the outlet pipe 13 can be threaded to the liquid cooling plate 1.

[0056] In some embodiments, the partition 23 is integrally formed on the heat sink 21, and the heat sink 22 is integrally formed on the heat sink 21. In other words, the partition 23, the heat sink 22, and the heat sink 21 are integrally formed into a single structure. This configuration simplifies the processing of the partition 23, the heat sink 22, and the heat sink 21, and reduces processing costs. Exemplarily, at least two of the above-mentioned sheet-like structures spaced apart along a first direction are formed using a tooth-forming process. Specifically, the side of the partition 23 away from the heat sink 21 abuts against the bottom wall of the liquid cooling tank 15 to facilitate the division of the liquid cooling chamber using the partition 23. The end of the partition 23 near the cooling inlet abuts against the inner wall of the liquid cooling tank 15 on one side of the second direction. The end of the partition 23 away from the cooling inlet and the inner wall of the liquid cooling tank 15 on the other side of the second direction are spaced apart to facilitate the connection of two adjacent sub-chambers to form a U-shaped chamber.

[0057] As an alternative, the heat sink 22 can be processed independently of the heat sink 21, and the processed heat sink 22 can be glued and fixed to the heat sink 21 with thermally conductive adhesive, or the heat sink 22 can be welded and fixed to the heat sink 21.

[0058] In some embodiments, at least one of the partition 23, heat sink 22, and heat dissipation plate 21 is a copper structural component, or a series of aluminum structural components, or a 6063 aluminum alloy structural component. Exemplarily, the partition 23, heat sink 22, and heat dissipation plate 21 are all made of copper structural components. Copper structural components have high heat transfer efficiency and are easy to form for the heat sink 22, reducing processing difficulty.

[0059] In some embodiments, the controller further includes a back plate 6, which is connected to the liquid cooling plate 1 to form a mounting cavity. The circuit board 5 is located in the mounting cavity, which not only facilitates the timely transfer of heat generated by the circuit board 5 and the heat-generating component 4 to the heat sink 22 and the coolant in the liquid cooling cavity through the heat sink 21, but also protects the circuit board 5 by keeping it in the mounting cavity and extending its service life.

[0060] Specifically, the back plate 6 has a positioning protrusion 61 extending circumferentially and forming an annular shape on the side facing the liquid cooling plate 1. The positioning protrusion 61 is inserted into the mounting groove 14 and the back plate 6, circuit board 5 and liquid cooling plate 1 are connected by fasteners. The circuit board 5 is located in the space enclosed by the positioning protrusion 61, and the circuit board 5 is clamped between the heating component 4 and the back plate 6, which serves to fix the circuit board 5.

[0061] In some embodiments, at least two fasteners are provided, and the at least two fasteners are arranged at intervals along the circumference of the back plate 6. The heat sink 21 is located within the area enclosed by the at least two fasteners, so that the fasteners do not pass through the heat sink 21, eliminating the need to open holes for fasteners on the heat-generating component 4, thus ensuring that the heat-generating component 4 can work normally. It should be noted that the holes for fasteners on the circuit board 5 are arranged in the non-circuitous portion of the circumferential edge of the back plate 6, avoiding the need for opening holes in the circuitry portion of the circuit board 5, which would affect the normal operation of the circuit board 5.

[0062] In some embodiments, the present invention also provides a vehicle including the controller described above. By employing the controller, the vehicle reduces maintenance costs and improves user experience by extending the controller's lifespan.

[0063] This controller can be applied to products such as servers, inverters, and on-board chargers in vehicles, which will not be listed here.

[0064] Furthermore, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A heat dissipation structure, characterized in that, It includes a liquid cooling plate (1) and a heat dissipation plate (21), the liquid cooling plate (1) and the heat dissipation plate (21) are sealed together and enclosed to form a liquid cooling chamber, the liquid cooling chamber having a cooling inlet and a cooling outlet (11); The heat sink (21) has a heat sink (22) on one side, and the heat sink (22) is located in the liquid cooling chamber and is in contact with the heat sink (21).

2. The heat dissipation structure according to claim 1, characterized in that, The liquid cooling plate (1) has an installation groove (14) on one side, and a liquid cooling groove (15) is provided on the bottom wall of the installation groove (14). The heat dissipation plate (21) is in contact with the bottom wall of the installation groove (14) and is sealed. The heat dissipation plate (21) blocks the opening of the liquid cooling groove (15) to form the liquid cooling chamber.

3. The heat dissipation structure according to claim 1 or 2, characterized in that, The liquid cooling chamber is provided with a partition (23), which divides the liquid cooling chamber into at least two sub-chambers. The at least two sub-chambers are connected in sequence to form a serpentine channel. One end of the serpentine channel is connected to the cooling inlet, and the other end is connected to the cooling outlet (11).

4. The heat dissipation structure according to claim 3, characterized in that, The partition (23) is integrally formed on the heat sink (21); And / or, the partition (23) is a copper structural component, or a series of aluminum structural components, or a 6063 aluminum alloy structural component; And / or, each of the sub-cavities is provided with a heat sink (22), and the cooling inlet and the cooling outlet (11) are both located at one end of the sub-cavity in communication with it.

5. The heat dissipation structure according to any one of claims 1 to 4, characterized in that, At least one of the heat sink (22) and the heat sink plate (21) is made of copper, or is made of aluminum, or is made of 6063 aluminum alloy.

6. The heat dissipation structure according to any one of claims 1 to 4, characterized in that, The heat sink (22) includes at least two sheet-like structures, which are arranged at intervals along the thickness direction of the sheet-like structures; the spacing between two adjacent sheet-like structures is 0.8 mm to 1.5 mm; and / or the thickness of the sheet-like structures is 0.5 mm to 2 mm. And / or, the heat sink (22) is integrally formed on the heat sink plate (21).

7. A controller, including a circuit board (5) and a heat dissipation structure as described in any one of claims 1 to 6, wherein a heat-generating component (4) is mounted on the circuit board (5), the heat-generating component (4) is located on the side of the heat sink (21) facing away from the heat sink (22), and the heat sink (21) is used to dissipate heat from the heat-generating component (4).

8. The controller according to claim 7, characterized in that, The heat sink (21) is in contact with the surface of the heat-generating component (4); And / or, the heating element (4) is fixed to the heat sink (21) by means of thermally conductive adhesive; And / or, the projection of the heat-generating component (4) onto the plane of the heat sink (21) is completely located within the area formed by the projection of the heat sink (22) onto the plane of the heat sink (21).

9. The controller according to claim 7 or 8, characterized in that, The controller also includes a back plate (6), which is connected to the liquid cooling plate (1) and forms an installation cavity, and the circuit board (5) is located in the installation cavity.

10. A vehicle, characterized in that, Includes the controller as described in any one of claims 7 to 9.

Images