energy storage system

Abstract

The application discloses an energy storage system, relates to the technical field of energy storage systems, and aims to solve the problem that the cooling capacity of a liquid cooling subboard cannot be fully utilized, thereby causing poor heat dissipation effect of the liquid cooling subboard. The energy storage system comprises a box body, a liquid cooling plate, a power consumption device and a fan assembly arranged in the box body, and the box body has a first direction. The liquid cooling plate has a liquid cooling flow channel for liquid cooling fluid circulation and an air cooling flow channel for gas circulation. The power consumption device is arranged on one side of the liquid cooling plate in the first direction. The liquid cooling flow channel and the air cooling flow channel are arranged at intervals in the first direction, and the liquid cooling flow channel is closer to the power consumption device than the air cooling flow channel. The fan assembly is installed in the box body and is used for driving air in the box body to flow to the side of the liquid cooling plate provided with the power consumption device after heat exchange with the liquid cooling fluid. The application is used for improving the heat dissipation effect of the liquid cooling subboard.

Description

Technical Field

[0001] This application relates to the technical field of energy storage systems, specifically to an energy storage system. Background Technology

[0002] Currently, the power consumption of components installed inside energy storage system enclosures continues to rise, leading to a corresponding increase in power density within the enclosures. Many electronic components have specific temperature requirements during operation, making it crucial to reduce the ambient temperature inside the enclosures.

[0003] In existing technologies, high-power devices are typically cooled using liquid-cooled subplates. However, since the liquid-cooled subplate is installed at the bottom of the enclosure, only one side is usually effectively utilized, while the other side has a low utilization rate. This results in the cooling capacity not being fully utilized, leading to poor heat dissipation performance of the liquid-cooled subplate. Summary of the Invention

[0004] This application provides an energy storage system that can solve the problem that the cooling capacity of the liquid-cooled subplate cannot be fully utilized, resulting in poor heat dissipation performance of the liquid-cooled subplate.

[0005] To achieve the above objectives, the energy storage system provided in this application includes a housing, and a liquid cooling plate, power consumption devices and a fan assembly disposed within the housing, wherein the housing has a first orientation;

[0006] The liquid cooling plate has a liquid cooling channel for the flow of liquid cooling fluid and an air cooling channel for the flow of gas. The power consumption device is located on one side of the liquid cooling plate in the first direction. The liquid cooling channel and the air cooling channel are spaced apart in the first direction, and the liquid cooling channel is closer to the power consumption device than the air cooling channel.

[0007] The fan assembly is installed inside the enclosure and is used to drive the air inside the enclosure into the air-cooled flow channel to exchange heat with the liquid cooling fluid and then flow to the side of the liquid cooling plate where the power consumption device is located.

[0008] In some embodiments of this application, the liquid cooling plate includes a liquid cooling sub-plate and an air cooling sub-plate stacked along a first direction;

[0009] The power consumption device is located on the side of the liquid-cooled sub-board facing away from the air-cooled sub-board in the first direction. The liquid-cooled flow channel is located inside the liquid-cooled sub-board, and the air-cooled flow channel is located between the liquid-cooled sub-board and the air-cooled sub-board or inside the air-cooled sub-board.

[0010] The liquid cooling subplate is equipped with a conductive structure, through which the air cooling channel is connected to the side of the liquid cooling subplate opposite to the air cooling subplate.

[0011] In some embodiments of this application, the liquid cooling subplate is provided with at least N conductive structures, and the air cooling channels are at least N. The two ends of each air cooling channel are connected to the side of the liquid cooling subplate opposite to the air cooling subplate through the corresponding conductive structure; wherein, N≥2 and is a positive integer.

[0012] In some embodiments of this application, the airflow directions in two adjacent air-cooled channels are different.

[0013] In some embodiments of this application, each conductive structure includes a return air inlet and an air inlet. The return air inlets of two adjacent conductive structures are located on different sides of the liquid-cooled subplate and both penetrate the liquid-cooled subplate along the first direction.

[0014] In some embodiments of this application, the housing has a second direction and a third direction, and the first direction, the second direction, and the third direction intersect each other;

[0015] The return air inlet in a second-direction conductive structure and the air inlet in an adjacent conductive structure are located on the same side of the liquid-cooled subplate in the second direction. A blocking part is connected to the surface of the liquid-cooled subplate facing away from the air-cooled subplate. The blocking part is used to separate the return air inlet and the air inlet that are adjacent to each other in the third direction.

[0016] In some embodiments of this application, the housing has a second direction, which intersects with the first direction;

[0017] The conduction structure includes a return air inlet and an air inlet, which are respectively located at both ends of the liquid-cooled subplate in the second direction. One end of the air-cooled flow channel is connected to the return air inlet, and the other end is connected to the air inlet.

[0018] In some embodiments of this application, the housing has a third direction, and the first direction and the third direction intersect;

[0019] The ventilation structure includes a return air inlet and an air inlet, which are offset upwards from a third position.

[0020] In some embodiments of this application, where the air-cooling channel is located within the air-cooling subplate,

[0021] The conduction structure includes a return air inlet and an air inlet. A groove for forming an air-cooling channel is formed on the surface of the air-cooled subplate facing the liquid-cooled subplate. The groove opening faces the liquid-cooled subplate, and the orthographic projection of the return air inlet and the air inlet in the first direction is located inside the groove opening.

[0022] In some embodiments of this application, the surfaces of the air-cooled subplate and the liquid-cooled subplate on opposite sides are in contact and thermally connected.

[0023] In some embodiments of this application, the air-cooled flow channel is located between the liquid-cooled subplate and the air-cooled subplate;

[0024] A side panel connects the liquid-cooled subplate and the air-cooled subplate. The liquid-cooled subplate, the air-cooled subplate, and the side panel together form an air-cooled cavity. The air-cooled flow channel is located inside the air-cooled cavity, or the air-cooled cavity is used to form the air-cooled flow channel.

[0025] In some embodiments of this application, the liquid cooling subplate is provided with at least N conductive structures, each conductive structure including a return air inlet and an air inlet, and the air-cooling cavity is provided with (N-1) baffles, which are used to divide the air-cooling cavity into N independent air-cooling channels. The return air inlet and air inlet in each conductive structure are connected to the corresponding air-cooling channel; wherein, N≥2 and is a positive integer.

[0026] In some embodiments of this application, the fan assembly includes a fan and a steering structure. The fan is mounted on the steering structure, which is located on the side surface of the liquid cooling subplate facing away from the air cooling subplate, and is used to adjust the airflow direction of the fan.

[0027] In some embodiments of this application, the conduction structure includes a return air inlet and an air inlet that extend along a first direction, with one end of the air-cooled flow channel connected to the return air inlet and the other end connected to the air inlet.

[0028] The steering structure has a manifold, as well as an inlet and an outlet that are both connected to the manifold. The inlet faces the liquid-cooled subplate and is connected to the air inlet. The inlet and outlet are located on adjacent sides of the steering structure. The fan is installed in the manifold and is located close to the outlet.

[0029] In some embodiments of this application, the housing is provided with a liquid inlet and a liquid outlet, one end of the liquid cooling channel is connected to the liquid inlet and the other end is connected to the liquid outlet;

[0030] Energy storage systems also include:

[0031] The cooling system is located outside the enclosure and connected in series between the inlet and outlet.

[0032] The above-mentioned technical solution of this application has at least the following beneficial effects:

[0033] In this technical solution, the liquid cooling channel and the air cooling channel are spaced apart, with the liquid cooling channel closer to the power consumption device. This allows heat to be quickly conducted from the power consumption device to the liquid cooling fluid in the liquid cooling channel. The liquid cooling fluid has a high specific heat capacity, enabling heat to be rapidly absorbed by the liquid cooling fluid in the liquid cooling channel after it is generated, achieving efficient heat transfer. Simultaneously, the fan assembly drives air into the air cooling channel to exchange heat with the liquid cooling fluid before flowing to the power consumption device side. This provides more contact and heat exchange opportunities between the liquid cooling fluid and the air, increasing the heat exchange area and thus improving the heat dissipation efficiency of the liquid cooling plate. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the energy storage system in an embodiment of this application;

[0036] Figure 2 This is a perspective view of the liquid-cooled subplate in the energy storage system in the embodiments of this application from one viewpoint;

[0037] Figure 3 This is a perspective view of the liquid-cooled subplate in the energy storage system in the embodiments of this application from another angle;

[0038] Figure 4 This is one of the exploded views of the liquid cooling plate in the energy storage system in the embodiments of this application;

[0039] Figure 5 This is a top view of the liquid cooling plate in the energy storage system in the embodiments of this application;

[0040] Figure 6 This is the second exploded view of the liquid cooling plate in the energy storage system in the embodiments of this application;

[0041] Figure 7 This is a perspective view of the steering structure in the energy storage system in the embodiments of this application from one viewpoint;

[0042] Figure 8 This is a perspective view of the steering structure in the energy storage system in the embodiments of this application from another angle;

[0043] Figure 9 This is a system block diagram of the energy storage system in the embodiments of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 1-Box;

[0046] 2-Liquid cooling plate; 2a-Liquid cooling channel; 21a-Inlet channel; 22a-Outlet channel; 23a-Branch channel; 2b-Air cooling channel; 21b-Sub-air duct; 21-Liquid cooling sub-plate; 211-Conduction structure; 2111-Return air inlet; 2111a-First return air inlet; 2111b-Second return air inlet; 2112-Air inlet; 2112a-First air inlet; 2112b-Second air inlet; 212-Blocking part; 22-Air cooling sub-plate; 23-Side panel; 231-Air cooling cavity; 232-Blocking component; 233-Baffle wall; 234-Heat dissipation structure; 24-Sealing plate; 241-Inlet port; 242-Outlet port; 25-Fin assembly;

[0047] 3-Power consumption devices;

[0048] 4-Fan assembly; 41-Fan; 42-Directional structure; 421-Bulk chamber; 422-Inlet; 423-Outlet;

[0049] Z - First direction; X - Second direction; Y - Third direction. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0052] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means N or more.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the connection within N components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0054] This application provides an energy storage system, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0055] Currently, the power consumption of components installed inside energy storage system enclosures continues to rise, leading to a corresponding increase in power density within the enclosures. Many electronic components have specific temperature requirements during operation, making it crucial to reduce the ambient temperature inside the enclosures.

[0056] In existing technologies, high-power devices are typically cooled using liquid-cooled subplates. However, since the liquid-cooled subplate is installed at the bottom of the enclosure, only one side is usually effectively utilized, while the other side has a low utilization rate. This results in the cooling capacity not being fully utilized, leading to poor heat dissipation performance of the liquid-cooled subplate.

[0057] Therefore, this application provides a novel energy storage system. The energy storage system includes a housing and a liquid-cooled plate, a power-consuming device, and a fan assembly disposed within the housing. The housing has a first orientation. The liquid-cooled plate has a liquid-cooled channel for the flow of liquid cooling fluid and an air-cooled channel for the flow of gas. The power-consuming device is disposed on one side of the liquid-cooled plate in the first orientation. The liquid-cooled channel and the air-cooled channel are spaced apart in the first orientation, with the liquid-cooled channel closer to the power-consuming device than the air-cooled channel. The fan assembly is installed within the housing and drives air from within the housing into the air-cooled channel to exchange heat with the liquid cooling fluid before flowing to the side of the liquid-cooled plate where the power-consuming device is located.

[0058] In this technical solution, the liquid cooling channel and the air cooling channel are spaced apart, with the liquid cooling channel closer to the power consumption device. This allows heat to be quickly conducted from the power consumption device to the liquid cooling fluid in the liquid cooling channel. The liquid cooling fluid has a high specific heat capacity, enabling heat to be rapidly absorbed by the liquid cooling fluid in the liquid cooling channel after it is generated, achieving efficient heat transfer. Simultaneously, the fan assembly drives air into the air cooling channel to exchange heat with the liquid cooling fluid before flowing to the power consumption device side. This provides more contact and heat exchange opportunities between the liquid cooling fluid and the air, increasing the heat exchange area and thus improving the heat dissipation efficiency of the liquid cooling plate.

[0059] Please refer to Figures 1-3 The energy storage system provided in this application includes a housing 1, and a liquid-cooled plate 2, a power-consuming device 3, and a fan assembly 4 disposed within the housing 1. The housing 1 has intersecting first directions Z, second directions X, and third directions Y. The liquid-cooled plate 2 has a liquid-cooled flow channel 2a for the flow of liquid cooling fluid and an air-cooled flow channel 2b for the flow of gas. The power-consuming device 3 is disposed on one side of the liquid-cooled plate 2 in the first direction Z. The liquid-cooled flow channel 2a and the air-cooled flow channel 2b are spaced apart in the first direction Z, and the liquid-cooled flow channel 2a is closer to the power-consuming device 3 than the air-cooled flow channel 2b. The fan assembly 4 is installed inside the housing 1 and is used to drive the air inside the housing 1 into the air-cooled flow channel 2b to exchange heat with the liquid cooling fluid and then flow to the side of the liquid-cooled plate 2 where the power-consuming device 3 is disposed.

[0060] In this technical solution, the liquid cooling channel 2a and the air cooling channel 2b are spaced apart, with the liquid cooling channel 2a closer to the power consumption device 3. This allows heat to be quickly transferred from the power consumption device 3 to the liquid cooling fluid in the liquid cooling channel 2a. The liquid cooling fluid has a high specific heat capacity, enabling heat to be rapidly absorbed by the liquid cooling fluid in the liquid cooling channel 2a after it is generated, achieving efficient heat transfer. Simultaneously, the fan assembly 4 drives air into the air cooling channel 2b to exchange heat with the liquid cooling fluid before flowing to the side of the power consumption device 3. This provides more contact and heat exchange opportunities between the liquid cooling fluid and the air, increasing the heat exchange area and thus improving the heat dissipation efficiency of the liquid cooling plate 2.

[0061] In other words, the upper surface of the liquid cooling plate 2 can directly absorb the heat from the power-consuming device 3, allowing this heat to be directly conducted to the liquid cooling fluid in the liquid cooling channel 2a. The fan assembly 4 can drive air into the air-cooled channel 2b to exchange heat with the side of the liquid cooling channel 2a opposite to the upper surface, ensuring sufficient heat exchange between the hot air and the side of the liquid cooling channel 2a opposite to the upper surface, thereby fully utilizing the heat exchange capacity of the liquid cooling channel 2a. The liquid cooling plate 2 of this application, through the synergistic effect of liquid cooling and air cooling, fully utilizes the high-efficiency heat dissipation capacity of liquid cooling and the wide contact of air cooling, significantly improving heat dissipation efficiency and effectively solving the heat dissipation problem of high-power devices 3 in the energy storage system.

[0062] Combination Figures 1-4The liquid-cooled plate 2 includes a liquid-cooled sub-plate 21 and an air-cooled sub-plate 22 stacked along the first direction Z. A power-consuming device 3 is located on the side of the liquid-cooled sub-plate 21 facing away from the air-cooled sub-plate 22 along the first direction Z. A liquid-cooling channel 2a is located within the liquid-cooled sub-plate 21, and an air-cooling channel 2b is located between the liquid-cooled sub-plate 21 and the air-cooled sub-plate 22, or within the air-cooled sub-plate 22. A conductive structure 211 is provided on the liquid-cooled sub-plate 21, through which the air-cooling channel 2b connects to the side of the liquid-cooled sub-plate 21 facing away from the air-cooled sub-plate 22. The stacked arrangement of the liquid-cooled sub-plate 21 and the air-cooled sub-plate 22 along the first direction Z integrates both liquid-cooling and air-cooling heat dissipation methods within a limited space, eliminating the need for separate liquid-cooling and air-cooling systems and improving the space utilization within the enclosure 1. This tightly stacked structure reduces thermal resistance during heat transfer, allowing heat to be conducted more quickly from the power-consuming device 3 to the liquid-cooled subplate 21 via the conductive structure 211 to the air-cooled channel 2b, thus improving heat transfer efficiency. Furthermore, the liquid-cooled subplate 21 and the air-cooled subplate 22 can be designed, manufactured, and tested as independent modules. During production, this modular design improves efficiency and reduces costs. Simultaneously, during equipment maintenance and replacement, individual modules can be operated more conveniently without disassembling and replacing the entire liquid-cooled plate 2.

[0063] The liquid-cooled subplate 21 has at least N conductive structures 211, and the air-cooled channels 2b have at least N. The two ends of each air-cooled channel 2b are connected to the side of the liquid-cooled subplate 21 facing away from the air-cooled subplate 22 via the corresponding conductive structure 211. Here, N ≥ 2 and is a positive integer. When the fan assembly 4 drives airflow, the multiple air-cooled channels 2b can guide the air to be distributed more evenly and contact the liquid-cooled subplate 21, enhancing the convective heat transfer effect between the air and the liquid-cooled subplate 21, helping to increase the heat transfer rate, and further improving the heat dissipation efficiency of the liquid-cooled subplate 21. In other words, multiple air-cooled channels 2b mean a larger surface area for heat exchange between the liquid cooling fluid and the air. During heat transfer, a larger heat exchange area allows for more thorough heat exchange, enabling the liquid cooling fluid to carry away more heat, thereby improving the overall heat dissipation efficiency of the cooling system and more effectively reducing the operating temperature of the power-consuming device 3.

[0064] In this design, the airflow directions within adjacent air-cooling channels 2b differ, causing the airflow on the side of the liquid-cooled subplate 21 opposite to the air-cooled subplate 22 to no longer be a linear flow in a single direction, but rather a complex flow pattern involving multiple directions. For example, the air in one air-cooling channel 2b may flow horizontally to the left, while the air in an adjacent air-cooling channel 2b may flow horizontally to the right. At the edges or corners of the liquid-cooled subplate 21, a single-direction airflow may not be sufficient to cover the area, while airflows in different directions can enter these areas from other angles, thereby achieving more comprehensive coverage of the entire surface of the liquid-cooled subplate 21, increasing the coverage area of ​​the flow field, and improving the heat dissipation efficiency of the liquid-cooled subplate 21. For instance, having opposite airflow directions within adjacent air-cooling channels 2b reduces the design complexity of the air-cooling channels 2b.

[0065] In this embodiment, each conductive structure 211 includes a return air inlet 2111 and an air inlet 2112. The return air inlets 2111 of two adjacent conductive structures 211 are located on different sides of the liquid-cooled subplate 21, and both penetrate the liquid-cooled subplate 21 along the first direction Z. In specific applications, the return air inlet 2111 is used to guide the airflow in the area above the liquid-cooled subplate 21 to the corresponding air-cooling channel 2b. After heat exchange in the air-cooling channel 2b, the air is retransmitted to the area above the liquid-cooled subplate 21 via the air inlet 2112. In this way, the high-temperature airflow in the area above the liquid-cooled subplate 21 can enter the corresponding air-cooling channel 2b from different directions, thereby enabling more uniform heat exchange with various parts of the liquid-cooled subplate 21 and improving the heat dissipation efficiency of the liquid-cooled subplate 21. For example, the return air inlets 2111 of two adjacent conductive structures 211 are located on opposite sides of the liquid-cooled subplate 21 in the second direction X. Alternatively, the return air vents 2111 in two adjacent conductive structures 211 are located on adjacent sides of the liquid-cooled subplate 21.

[0066] Alternatively, the air inlets 2112 in two adjacent conductive structures 211 are located on different sides of the liquid-cooled subplate 21. This avoids localized air stagnation in the area above the liquid-cooled subplate 21 that may be caused by unidirectional airflow, enhances the air turbulence effect, and allows air that might otherwise be stagnant in certain areas to be drawn into the entire airflow circulation, thus avoiding the problem of localized air stagnation. As a result, the air above the liquid-cooled subplate 21 can flow continuously and evenly, and the heat of the power consumption device 3 can be carried away by the airflow in a timely manner, protecting the normal operation of the power consumption device 3.

[0067] Please refer to Figure 4 and Figure 5The return air inlet 2111 in a conductive structure 211 and the air inlet 2112 in an adjacent conductive structure 211 are located on the same side of the liquid-cooled subplate 21 in the second direction X. A blocking part 212 is connected to the surface of the liquid-cooled subplate 21 facing away from the air-cooled subplate 22. The blocking part 212 is used to separate the return air inlet 2111 and the air inlet 2112 that are adjacent in the third direction Y. Without the blocking part 212, the air flowing out of the air inlet 2112 may be directly sucked back into the return air inlet 2111 without sufficient heat exchange, forming a short-circuit loop. This would result in the air not effectively exchanging heat with the liquid-cooled subplate 21, reducing the heat dissipation efficiency of the liquid-cooled subplate 21. The presence of the blocking part 212 avoids this situation, ensuring that the air can be fully heat-exchanged in the air-cooled flow channel 2b before returning to the appropriate area above the liquid-cooled subplate 21 through the air inlet 2112, thereby improving the effectiveness of heat dissipation.

[0068] In some embodiments of this application, each conductive structure 211 includes a return air inlet 2111 and an air inlet 2112. The return air inlet 2111 and the air inlet 2112 are respectively located at both ends of the liquid-cooled subplate 21 in the second direction X. One end of the air-cooled flow channel 2b is connected to the return air inlet 2111, and the other end is connected to the air inlet 2112. This makes the airflow path below the liquid-cooled subplate 21 more defined and directional. After being drawn in from the return air inlet 2111, the air flows along the air-cooled flow channel 2b, passes through the heat exchange area, and then enters the area above the liquid-cooled subplate 21 from the air inlet 2112, forming an orderly circulating airflow. Furthermore, the return air inlet 2111 and the air inlet 2112 located at both ends of the liquid-cooled subplate 21 create a large temperature difference area on the liquid-cooled subplate 21, thereby enhancing the convective heat transfer effect between the air and the liquid-cooled subplate 21. Hot air enters the air-cooled flow channel 2b from the return air inlet 2111 at one end and exchanges heat with the liquid-cooled fluid to become cold air. The cold air enters the area above the liquid-cooled subplate 21 from the air inlet 2112 at the other end, forming a significant temperature gradient. This promotes faster and more complete heat transfer between the air and the liquid-cooled subplate 21. This enhanced convective heat transfer capability can effectively improve heat dissipation efficiency.

[0069] For example, such as Figures 2-4As shown, there are two air-cooled airflow channels 2b. Correspondingly, there are also two conduction structures 211, each including a return air inlet 2111 and an air inlet 2112. For example, the two return air inlets 2111 of the two conduction structures 211 are the first return air inlet 2111a and the second return air inlet 2111b, respectively, and the two air inlets 2112 of the two conduction structures 211 are the first air inlet 2112a and the second air inlet 2112b, respectively. The first return air inlet 2111a and the first air inlet 2112a are used to form one conduction structure 211, and the second return air inlet 2111b and the second air inlet 2112b are used to form the other conduction structure 211.

[0070] In this embodiment, each conductive structure 211 includes a return air inlet 2111 and an air inlet 2112. The return air inlet 2111 and the air inlet 2112 in the same conductive structure 211 are staggered in the third direction Y, so that the airflow paths of the return air inlet 2111 and the air inlet 2112 in the same conductive structure 211 are no longer symmetrical and directly opposite. When air is transferred from the air inlet 2112 to the area above the liquid-cooled subplate 21, and then flows to the return air inlet 2111, due to the staggered arrangement of the two in the third direction Y, the airflow is no longer a simple straight path, but will generate more bends and turns. This irregular path increases the degree of air turbulence, which helps to improve the heat exchange efficiency between the air and the power consumption devices 3 in the area above the liquid-cooled subplate 21, and improves the heat dissipation effect.

[0071] In some embodiments of this application, when the air-cooled flow channel 2b is located within the air-cooled sub-plate 22, the guiding structure 211 includes a return air inlet 2111 and an air inlet 2112. A groove (not shown in the figure) for forming the air-cooled flow channel 2b is formed on the surface of the air-cooled sub-plate 22 facing the liquid-cooled sub-plate 21. The opening of the groove faces the liquid-cooled sub-plate 21, and the orthogonal projections of the return air inlet 2111 and the air inlet 2112 in the first direction Z are located within the opening of the groove. The groove on the air-cooled sub-plate 22 cooperates with the return air inlet 2111 and the air inlet 2112 of the guiding structure 211, effectively guiding the airflow. After entering from the return air inlet 2111, the air flows along the shape of the groove and is then transported to the top of the liquid-cooled sub-plate 21 via the air inlet 2112, forming an orderly airflow path. This clear airflow guidance helps reduce airflow turbulence and eddy current generation, improving airflow stability. Meanwhile, the air-cooled flow channel 2b is set inside the air-cooled subplate 22, utilizing the internal space of the air-cooled subplate 22, without needing to occupy additional external space to construct the complex air-cooled flow channel 2b. In this embodiment, the lower surface of the liquid-cooled subplate 21 is a flat surface and covers the side surface of the groove opening of the air-cooled subplate 22 to seal the groove opening, and to allow the return air port 2111 and the air inlet 2112 to communicate with the corresponding groove through the groove opening.

[0072] The surfaces of the air-cooled subplate 22 and the liquid-cooled subplate 21 on their opposing sides are in contact and thermally connected. In this design, because the air-cooled subplate 22 and the liquid-cooled subplate 21 are in direct contact and thermally connected, the shortest heat transfer path is provided for heat to flow from the liquid-cooled subplate 21 to the air-cooled subplate 22, resulting in faster heat transfer and achieving efficient heat exchange between the liquid-cooled subplate 21 and the air-cooled subplate 22, thus preventing the temperature of the air-cooled subplate 22 from becoming too high. In some embodiments, the air-cooled subplate 22 can also be used to form the bottom plate of the housing 1. In this embodiment, a protective structural component can be added to the bottom side of the bottom plate to ensure its structural strength.

[0073] Please refer to Figure 6 In the case where the air-cooled flow channel 2b is located between the liquid-cooled sub-plate 21 and the air-cooled sub-plate 22, a side panel 23 connects the liquid-cooled sub-plate 21 and the air-cooled sub-plate 22. The liquid-cooled sub-plate 21, the air-cooled sub-plate 22, and the side panel 23 together enclose an air-cooled cavity 231. The air-cooled flow channel 2b is located within the air-cooled cavity 231, or the air-cooled cavity 231 is used to constitute the air-cooled flow channel 2b. That is to say, when there is only one air-cooled flow channel 2b, the aforementioned air-cooled cavity 231 can directly constitute the air-cooled flow channel 2b. When there are two or more air-cooled flow channels 2b, the aforementioned air-cooled cavity 231 can be understood as a accommodating space containing or providing multiple air-cooled flow channels 2b. Among them, the side panel 23, together with the liquid-cooled sub-plate 21 and the air-cooled sub-plate 22, encloses the relatively closed air-cooled cavity 231, which can effectively prevent air leakage and ensure the normal operation of the air-cooling system.

[0074] The liquid-cooled subplate 21 is provided with at least N conductive structures 211, each including a return air inlet 2111 and an air inlet 2112. The air-cooled cavity 231 is provided with N-1 baffles 232, which divide the air-cooled cavity 231 into N independent air-cooled channels 2b. The return air inlet 2111 and air inlet 2112 in each conductive structure 211 are connected to the corresponding air-cooled channel 2b; where N ≥ 2 and is a positive integer. Compared to a single air-cooled channel 2b, multiple independent air-cooled channels 2b can increase the airflow path and velocity, thereby enhancing the air convection heat transfer effect and enabling more effective heat exchange between the air and the lower surface of the liquid-cooled subplate 21. Each air-cooled channel 2b can independently dissipate heat to its corresponding area, avoiding the situation of excessive or insufficient local heat dissipation that may occur due to a single air-cooled channel 2b. Multiple independent air-cooled channels 2b help improve the temperature distribution uniformity of the air-cooled subplate 22 and the liquid-cooled subplate 21.

[0075] The main function of the baffle 232 is to divide the air-cooled cavity 231 into N independent air-cooled channels 2b, allowing each air-cooled channel 2b to independently flow air and exchange heat, thus avoiding mutual interference between different channels. In conjunction with the return air inlet 2111 and the air inlet 2112 in the conduction structure 211, the baffle 232 can precisely guide the airflow direction within the air-cooled cavity 231, ensuring that the air in each air-cooled channel 2b can effectively exchange heat with the liquid-cooled subplate 21.

[0076] In practical use, due to the presence of N independent air-cooling channels 2b, targeted heat dissipation design can be implemented based on the heat distribution in different areas of the liquid-cooled subplate 21 and the air-cooled subplate 22. For example, for areas with concentrated heat, more air-cooling channels 2b can be allocated, or the size, shape, and airflow of the air-cooling channels 2b can be adjusted to achieve precise heat dissipation control and improve the efficiency of the entire heat dissipation system.

[0077] Please continue to refer to Figure 3 Each air-cooled channel 2b is also provided with M baffles 233 that have the same extension trajectory as the baffle 232, so as to divide one air-cooled channel 2b into (M+1) sub-channels 21b. Each sub-channel 21b is provided with heat dissipation structures 234 arranged at intervals along its extension direction. Each heat dissipation structure 234 includes multiple heat dissipation fins arranged at intervals. The multiple heat dissipation fins are arranged at intervals in a direction that is approximately perpendicular to the extension direction of the sub-channel 21b in which they are located.

[0078] In this embodiment, the side panel 23 is directly formed on the periphery of the liquid-cooled sub-plate 21 and forms an integral structure with it. The side panel 23 and the liquid-cooled sub-plate 21 enclose an air-cooled cavity 231. The air-cooled sub-plate 22 is disposed opposite to the liquid-cooled sub-plate 21 and is sealed to the end of the side panel 23 away from the liquid-cooled sub-plate 21 to seal the air-cooled cavity 231. The partition 232, the baffle 233, and the heat dissipation structure 234 are all disposed on the side surface of the liquid-cooled sub-plate 21 facing the air-cooled sub-plate 22.

[0079] In some embodiments of this application, the liquid cooling plate 2 further includes a sealing plate 24. The sealing plate 24 and the air-cooled sub-plate 22 are respectively disposed on opposite sides of the liquid cooling sub-plate 21, and a liquid cooling channel 2a is formed between the sealing plate 24 and the liquid cooling sub-plate 21, while an air cooling channel 2b is formed between the liquid cooling sub-plate 21 and the air cooling sub-plate 22, thereby ensuring that the liquid cooling channel 2a and the air cooling channel 2b are easy to implement. The sealing plate 24 and the air cooling sub-plate 22 are respectively located on opposite sides of the liquid cooling sub-plate 21, and this layout makes the structure of the liquid cooling plate 2 more compact. Compared with other complex structural designs, unnecessary space occupation is reduced. That is, a liquid cooling channel 2a is formed on one side surface of the liquid cooling sub-plate 21, and an air cooling channel 2b is formed on the other side surface. The sealing plate 24 is used to seal the liquid cooling channel 2a, and the air cooling sub-plate 22 is used to seal the air cooling channel 2b. Both the sealing plate 24 and the air cooling sub-plate 22 have a flat plate structure.

[0080] When it is necessary to replace the coolant or check for leaks in the liquid-cooled flow channel 2a, or to clean the air-cooled flow channel 2b or maintain the fan 41, these operations can be performed conveniently and independently without interference, thus improving the convenience of maintenance. In this embodiment, the sealing plate 24 is provided with an inlet port 241 corresponding to the return air port 2111 on the liquid-cooled sub-plate 21, and an outlet port 242 corresponding to the air inlet 2112 on the liquid-cooled sub-plate 21.

[0081] Please continue to refer to Figure 2 The liquid cooling channel 2a includes an inlet channel 21a and an outlet channel 22a, as well as branch channels 23a connected in parallel between the inlet channel 21a and the outlet channel 22a. Each branch channel 23a has at least two fin groups 25 arranged at intervals along its extension direction, and each fin group 25 includes multiple spaced heat dissipation fins. The parallel branch channels 23a allow the coolant to flow through multiple paths simultaneously, avoiding the temperature gradient problem that may occur with a single channel and ensuring the uniformity of the cooling effect. The fin groups 25 significantly improve the heat exchange efficiency of the liquid cooling channel 2a by increasing the heat dissipation area. When the liquid flows through the channel, heat is transferred to the liquid through the fins, and the presence of the fins greatly increases the heat transfer area per unit volume.

[0082] Please combine Figure 1 and Figure 7The fan assembly 4 includes a fan 41 and a deflector structure 42. The fan 41 is mounted on the deflector structure 42, which is located on the side of the liquid cooling subplate 21 facing away from the air cooling subplate 22. The deflector structure 42 is used to adjust the airflow direction of the fan 41, ensuring that the airflow directly hits the power consumption device 3. This application, through precise airflow direction control, can maximize the removal of heat from the power consumption device 3, improving heat dissipation efficiency, ensuring the normal operation of the power consumption device 3, and extending its service life. Therefore, regardless of the location of the power consumption device 3, the airflow can be directed accurately towards it, ensuring that the focus of heat dissipation is on the power consumption device 3. When the airflow direction of the fan 41 is accurately directed towards the power consumption device 3, the fan 41 does not need to operate at excessively high speeds to ensure heat dissipation; the fan speed can be reduced as much as possible while meeting heat dissipation requirements, thereby reducing the energy consumption of the fan 41.

[0083] Optionally, the guiding structure 211 includes a return air inlet 2111 and an air inlet 2112 extending along the first direction Z. One end of the air-cooled flow channel 2b is connected to the return air inlet 2111, and the other end is connected to the air inlet 2112. Figure 8 As shown, the steering structure 42 has a manifold 421, and an inlet 422 and an outlet 423, both connected to the manifold 421. The inlet 422 faces the liquid-cooled subplate 21 and is connected to the air inlet 2112. The inlet 422 and the outlet 423 are located on adjacent sides of the steering structure 42. The fan 41 is installed in the manifold 421 and positioned close to the outlet 423. The connection between the inlet 422 and the air inlet 2112 allows air to continuously enter the manifold 421 from the air-cooled flow channel 2b, ensuring a continuous air supply. The design of the manifold 421, inlet 422, and outlet 423 in the steering structure 42, combined with the position of the fan 41, can efficiently guide airflow. The fan 41 is positioned close to the outlet 423, so when the fan 41 rotates, it can quickly blow air from the manifold 421 through the outlet 423, which helps to improve the efficiency of the entire air circulation.

[0084] Please refer to Figure 1 and Figure 9 The housing 1 is equipped with a liquid inlet and a liquid outlet, and the liquid cooling channel 2a (see label) Figure 2One end of the device is connected to the inlet, and the other end is connected to the outlet. The energy storage system also includes a cooling system, which is located outside the housing 1 and connected in series between the inlet and outlet. The cooling system is independent of the housing 1 and does not require space inside the housing 1, allowing for the installation of larger capacity or more functional energy storage devices within a limited space. The external location of the cooling system makes maintenance, repair, or component replacement more convenient. It eliminates the need to open the housing 1, reducing the impact of maintenance operations on the normal operation of the energy storage system and lowering the difficulty and risk of maintenance. Furthermore, the external location of the cooling system reduces the risk of direct damage to internal components of the energy storage system from coolant leaks. If a leak occurs, the leaked coolant primarily affects the external environment of the housing 1 and will not directly contact critical components such as batteries and circuits inside the energy storage system, thus reducing the possibility of short circuits, corrosion, and other safety accidents caused by coolant leaks.

[0085] For example, the cooling system includes a water tank and a cooling device connected in series between the inlet and outlet, and a circulating water pump that drives the liquid cooling fluid to circulate between the inlet and outlet. When the operating state of the circulating water pump changes (such as flow fluctuations), the water tank can store or release a certain amount of water, thereby stabilizing the flow rate of the entire water circulation system. This helps to reduce the adverse effects of flow fluctuations on the cooling device and energy storage system, improving system stability.

[0086] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0087] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. An energy storage system, characterized in that, It includes a housing, and a liquid cooling plate, power consumption devices and a fan assembly disposed within the housing, the housing having a first orientation; The liquid cooling plate has a liquid cooling channel for the flow of liquid cooling fluid and an air cooling channel for the flow of gas. The power consumption device is disposed on one side of the liquid cooling plate in the first direction. The liquid cooling channel and the air cooling channel are spaced apart in the first direction, and the liquid cooling channel is closer to the power consumption device than the air cooling channel. The fan assembly is installed inside the housing and is used to drive the air inside the housing into the air-cooled flow channel to exchange heat with the liquid cooling fluid and then flow to the side of the liquid cooling plate where the power consumption device is located.

2. The energy storage system according to claim 1, characterized in that, The liquid cooling plate includes a liquid cooling sub-plate and an air cooling sub-plate stacked along the first direction; The power consumption device is disposed on the side of the liquid-cooled sub-plate facing away from the air-cooled sub-plate in the first direction. The liquid-cooled flow channel is disposed inside the liquid-cooled sub-plate. The air-cooled flow channel is disposed between the liquid-cooled sub-plate and the air-cooled sub-plate or inside the air-cooled sub-plate. The liquid cooling subplate is provided with a conductive structure, and the air-cooling channel is connected to the side of the liquid cooling subplate opposite to the air-cooling subplate through the conductive structure.

3. The energy storage system according to claim 2, characterized in that, The liquid cooling subplate is provided with at least N of the aforementioned conductive structures, and the air cooling channels are provided with at least N. The two ends of each air cooling channel are connected to the side of the liquid cooling subplate opposite to the air cooling subplate through the corresponding conductive structure; wherein, N≥2 and is a positive integer.

4. The energy storage system according to claim 3, characterized in that, The airflow directions in the two adjacent air-cooled channels are different.

5. The energy storage system according to claim 3, characterized in that, Each of the aforementioned conductive structures includes a return air inlet and an air inlet. The return air inlets of two adjacent conductive structures are located on different sides of the liquid-cooled subplate, and both penetrate the liquid-cooled subplate along the first direction.

6. The energy storage system according to claim 5, characterized in that, The housing has a second direction and a third direction, and the first direction, the second direction and the third direction intersect each other; The return air inlet in one of the conductive structures and the air inlet in the adjacent conductive structure are located on the same side of the liquid-cooled subplate in the second direction. A blocking part is connected to the surface of the liquid-cooled subplate facing away from the air-cooled subplate. The blocking part is used to separate the return air inlet and the air inlet that are arranged adjacent to each other in the third direction.

7. The energy storage system according to claim 2, characterized in that, The housing has a second direction, which intersects with the first direction; The conductive structure includes a return air inlet and an air inlet, which are respectively located at both ends of the liquid-cooled subplate in the second direction. One end of the air-cooled flow channel is connected to the return air inlet, and the other end is connected to the air inlet.

8. The energy storage system according to any one of claims 2 to 7, characterized in that, The enclosure has a third direction, and the first direction and the third direction intersect. The conductive structure includes a return air inlet and an air inlet, which are offset upwards from the third side.

9. The energy storage system according to claim 2, characterized in that, When the air-cooling channel is located within the air-cooling subplate... The conductive structure includes a return air inlet and an air inlet. The surface of the air-cooled subplate facing the liquid-cooled subplate is provided with a groove for forming the air-cooled flow channel. The groove opening faces the liquid-cooled subplate, and the orthographic projection of the return air inlet and the air inlet in the first direction is located within the groove opening.

10. The energy storage system according to claim 9, characterized in that, The surfaces of the air-cooled subplate and the liquid-cooled subplate on opposite sides are in contact and thermally connected.

11. The energy storage system according to claim 2, characterized in that, In the case where the air-cooled flow channel is located between the liquid-cooled subplate and the air-cooled subplate; A side panel is connected between the liquid-cooled subplate and the air-cooled subplate. The liquid-cooled subplate, the air-cooled subplate, and the side panel together enclose an air-cooled cavity. The air-cooled flow channel is located inside the air-cooled cavity, or the air-cooled cavity is used to form the air-cooled flow channel.

12. The energy storage system according to claim 11, characterized in that, The liquid cooling subplate is provided with at least N conductive structures, each of which includes a return air inlet and an air inlet. The air-cooling cavity is provided with (N-1) baffles, which are used to divide the air-cooling cavity into N independent air-cooling channels. The return air inlet and the air inlet in each conductive structure are connected to the corresponding air-cooling channel. Wherein, N≥2 and is a positive integer.

13. The energy storage system according to claim 2, characterized in that, The fan assembly includes a fan and a steering structure. The fan is mounted on the steering structure, which is located on the side surface of the liquid-cooled subplate facing away from the air-cooled subplate, and is used to adjust the airflow direction of the fan.

14. The energy storage system according to claim 13, characterized in that, The conductive structure includes a return air inlet and an air inlet that extend along the first direction. One end of the air-cooled flow channel is connected to the return air inlet, and the other end is connected to the air inlet. The steering structure has a manifold cavity, and an inlet and an outlet that are both connected to the manifold cavity. The inlet is positioned facing the liquid-cooled subplate and is connected to the air inlet. The inlet and the outlet are located on adjacent sides of the steering structure. The fan is installed in the manifold cavity and positioned close to the outlet.

15. The energy storage system according to claim 1, characterized in that, The housing is provided with a liquid inlet and a liquid outlet. One end of the liquid cooling channel is connected to the liquid inlet, and the other end is connected to the liquid outlet. The energy storage system also includes: A cooling system is located outside the housing and connected in series between the liquid inlet and the liquid outlet.

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