Liquid cooling heat dissipation module and electronic equipment

Abstract

Embodiments of the present application disclose a liquid cooling heat dissipation module and electronic equipment. The liquid cooling heat dissipation module comprises a shell, a first heat generating device and a liquid cooling heat dissipation component; the shell comprises an inner cavity for containing a first liquid cooling working medium, and the first heat generating device is immersed in the first liquid cooling working medium; the liquid cooling heat dissipation component comprises a first body part for absorbing heat and a second body part for releasing heat, the first body part and the second body part have a flow channel in communication, the flow channel is used for containing a second liquid cooling working medium, the first body part is located in the inner cavity of the shell, and the second body part is located outside the shell; the first body part is immersed in the first liquid cooling working medium, and a heat dissipation surface of the first heat generating device is in contact with a heat exchange interface of the first body part for heat exchange. In this way, based on immersion liquid cooling heat dissipation assisted by the liquid cooling heat dissipation component, heat in the cavity can be transmitted to the outside of the shell through the liquid cooling heat dissipation component, each device can work in a safe temperature range, and the performance of the device can be prevented from being affected by overheating.

Description

Technical Field

[0001] This application relates to the field of liquid cooling equipment technology, and in particular to a liquid cooling heat dissipation module and electronic equipment. Background Technology

[0002] With the increasing density, miniaturization, and modularization of heat-generating devices, heat dissipation has become an increasingly prominent issue. Traditional immersion liquid cooling technology immerses the heat-generating devices in a liquid coolant, exchanging the heat generated by the devices with the coolant. However, due to limitations in product miniaturization, the spacing between devices is small, resulting in low heat dissipation efficiency for high-loss-density heat-generating devices when using immersion liquid cooling technology. This applies to, but is not limited to, power transistors and chips. Therefore, traditional immersion liquid cooling methods cannot meet the heat dissipation requirements of high-loss-density heat-generating devices. Summary of the Invention

[0003] This application provides a liquid cooling heat dissipation module and electronic device, which meets the heat dissipation requirements of different heat-generating devices through optimized design of the liquid cooling heat dissipation architecture.

[0004] A first aspect of this application provides a liquid-cooled heat dissipation module, which includes a housing, a first heating element, and a liquid-cooled heat dissipation component. The housing includes an inner cavity for containing a first liquid cooling medium, and the first heating element is built into the inner cavity of the housing and immersed in the first liquid cooling medium. The liquid-cooled heat dissipation component includes a first body portion for absorbing heat and a second body portion for releasing heat. The first body portion and the second body portion have a communicating flow channel for containing a second liquid cooling medium. The first body portion is located in the inner cavity of the housing, and the second body portion is located outside the housing. At least a portion of the first body portion is immersed in the first liquid cooling medium, and the heat dissipation surface of the first heating element contacts the heat exchange interface of the first body portion for heat exchange.

[0005] This configuration, based on immersion liquid cooling supplemented by a liquid cooling component, allows heat to be transferred from the cavity to the outside of the housing, improving overall heat dissipation efficiency. On one hand, the heat generated by the first heating element can be exchanged through the heat dissipation surface to the first body of the liquid cooling component, i.e., to the liquid cooling component side. The heat is then carried away by the second liquid cooling medium within the component and transferred to the second body located outside the housing, effectively improving the heat dissipation efficiency of the first heating element and avoiding the adverse effects of overheating. On the other hand, some of the heat generated by the first heating element can also be exchanged to the first liquid cooling medium around its periphery. The first liquid cooling medium can then exchange the carried heat to both the housing side and the first body of the liquid cooling component. Thus, in addition to immersion liquid cooling, the first heating element can also be indirectly cooled by the liquid cooling component. Overall, the liquid cooling module provided in this application embodiment can effectively dissipate heat for the first heating element, preventing performance degradation, shortened lifespan, or damage due to overheating. This provides technical support for further reducing product size and increasing power density.

[0006] In practical applications, the liquid cooling module also includes a second heating element, which is immersed in the first liquid cooling medium. The power consumption of the first heating element is greater than that of the second heating element. Relatively speaking, for the first heating element with relatively high power consumption, effective heat dissipation can be achieved by immersion liquid cooling supplemented by a liquid cooling component. At the same time, the heat generated by the second heating element can be exchanged to the first liquid cooling medium, and then to the housing side and the first body of the liquid cooling component based on the heat generated by the first liquid cooling medium. It can also provide heat dissipation for the relatively low-power second heating element. The heat dissipation efficiency of different heating elements can be made closer, so that each heating element can operate within a safe temperature range, avoiding performance degradation, shortened lifespan, or damage due to overheating.

[0007] Based on the first aspect, this application also provides a first implementation of the first aspect: the liquid cooling heat dissipation module further includes a connecting layer, through which the first heating device contacts and exchanges heat with the first body portion. In this way, the connecting layer can fill the gap between the first heating device and the liquid cooling heat dissipation component, effectively reducing interface thermal resistance and improving heat conduction efficiency.

[0008] Based on the first embodiment of the first aspect, this application also provides a second embodiment of the first aspect: the connecting layer is formed by at least one of the following processes: solder welding; solder sintering; or electroplating. In practical applications, using solder and forming the connecting layer through welding or sintering processes can further improve the bonding reliability between the heat dissipation surface of the first heat-generating device and the heat exchange interface of the liquid-cooled heat dissipation component, while reasonably controlling the thermal resistance.

[0009] Other exemplary embodiments include the connection layer being formed using at least one of the following: thermal grease; thermal pad; thermal gel; graphene material; liquid metal.

[0010] Based on the first embodiment of the first aspect, or the second embodiment of the first aspect, this application also provides a third embodiment of the first aspect: within the projection plane of the heat dissipation surface of the first heating device, the projection of the core of the first heating device is located within the projection of the connecting layer. Thus, along the heat dissipation path from the first heating device to the liquid-cooled heat dissipation component, the connecting layer can provide a heat exchange interface that meets the outer dimensions of the core, thereby constructing a heat dissipation path that effectively ensures heat exchange efficiency.

[0011] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, this application also provides a fourth implementation of the first aspect: the first heating device is configured as a plurality of devices, and the plurality of first heating devices are the same device or different devices.

[0012] For example, the first heat-generating device can be one or more of the following: a power transistor, a chip, a power module, or an electromagnetic component.

[0013] In practical applications, when multiple first heating devices are of different types, the heat dissipation surfaces of each first heating device can be flush or uneven, and the heat exchange interface on the liquid cooling heat dissipation component side can be adapted accordingly.

[0014] Based on the fourth implementation of the first aspect, this application also provides a fifth implementation of the first aspect: the liquid cooling heat dissipation module further includes a circuit board, with multiple first heat-generating devices respectively disposed on both sides of the circuit board, and at least two liquid cooling heat dissipation components; the at least two liquid cooling heat dissipation components are respectively located on both sides of the circuit board, and the liquid cooling heat dissipation components contact and exchange heat with the first heat-generating devices located on the same side of the circuit board. This configuration can fully utilize the surface area of ​​the circuit board to achieve a high-density device layout, and can obtain good heat dissipation effect based on the liquid cooling heat dissipation components, further reducing product size and increasing power density.

[0015] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, this application also provides a sixth embodiment of the first aspect: the liquid cooling heat dissipation component is a cold plate, and the liquid inlet and outlet of the cold plate are located in the second body part of the cold plate. In a specific implementation, the liquid inlet and outlet of the cold plate can be connected to the pipeline of an external cold source, respectively. Low-temperature coolant can be transported to the flow channel of the cold plate through the liquid inlet, and high-temperature coolant that has completed heat exchange is transported to the external cold source through the liquid outlet, thus forming a cooling water circulation.

[0016] For example, a pump can be used to drive the coolant to circulate. Specifically, the flow rate and velocity of the coolant can be adjusted and controlled according to the actual heat dissipation requirements, so that the heat inside the cavity can be quickly carried away by the flowing coolant.

[0017] Other examples include a cold plate that exchanges heat with multiple first heating elements, resulting in good overall integration.

[0018] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, this application also provides a seventh embodiment of the first aspect: the liquid cooling heat dissipation component is a heat pipe, the evaporation end of the heat pipe is located in the first body part, and the condensation end of the heat pipe is located in the second body part. With this configuration, based on the second liquid cooling working fluid disposed within the heat pipe channel, the second liquid cooling working fluid can achieve evaporation and condensation at a relatively low temperature. The heat generated by the operation of the first liquid cooling working fluid can be exchanged to the first body part (evaporation end) of the heat pipe. When the second liquid cooling working fluid in the heat pipe is heated to its boiling point, the gaseous working fluid can flow to the second body part (condensation end) side, where it condenses upon cooling to form a liquid working fluid. The liquid working fluid can flow back to the first body part, and the heat is quickly carried away through the heat pipe.

[0019] For example, the heat pipe can be configured as multiple heat pipes, each heat pipe can contact multiple first heating elements for heat exchange; and / or, for other examples, each first heating element contacts multiple heat pipes for heat exchange. Overall, the heat exchange characteristics of the heat pipes can be fully utilized to remove heat from the cavity and dissipate it to the outside of the housing.

[0020] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, or the fourth implementation of the first aspect, or the fifth implementation of the first aspect, this application also provides an eighth implementation of the first aspect: the liquid cooling heat dissipation component is a heat spreader, the evaporation part of the heat spreader is located in the first body part, and the condensation part of the heat spreader is located in the second body part.

[0021] For example, the heat spreader can be flat and can contact multiple first heating elements for heat exchange. In this way, the second liquid cooling medium can evaporate and condense at a lower temperature. The heat generated by the first liquid cooling medium can be exchanged to the first body section (evaporation section) of the heat spreader. When the second liquid cooling medium in the heat spreader reaches its boiling point, the gaseous medium can flow to the second body section (condensation section), where it condenses to form a liquid medium. The liquid medium can then flow back to the first body section, where the heat is quickly carried away by the heat spreader.

[0022] For example, the heat exchange plate can contact multiple first heating elements for heat exchange. Overall, the heat exchange characteristics of the heat exchange plate can be fully utilized to remove heat from the cavity and dissipate it to the outside of the housing.

[0023] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, or the eighth embodiment of the first aspect, this application also provides a ninth embodiment of the first aspect: a first heating device is disposed on a circuit board, the heat dissipation surface of the first heating device is parallel to the surface of the circuit board, and correspondingly, the heat exchange interface of the first body is parallel to the surface of the circuit board; or, the heat dissipation surface of the first heating device is perpendicular to the surface of the circuit board, and correspondingly, the heat exchange interface of the first body is perpendicular to the surface of the circuit board. This configuration can meet the heat dissipation needs of different circuit board component architectures and has good adaptability.

[0024] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, or the fourth implementation of the first aspect, or the fifth implementation of the first aspect, or the sixth implementation of the first aspect, or the seventh implementation of the first aspect, or the eighth implementation of the first aspect, or the ninth implementation of the first aspect, the embodiments of this application also provide a tenth implementation of the first aspect: the first liquid cooling medium is a single-phase liquid cooling medium or a two-phase liquid cooling medium. Based on the configuration of single-phase liquid cooling medium, the inner cavity of the shell can be fully filled to make full use of the available space inside the module and improve the heat exchange capacity of immersion liquid cooling. Based on the configuration of two-phase liquid cooling medium, a bottom liquid phase region and a top vapor phase region can be formed in the inner cavity of the shell. Correspondingly, the heat generated by the operation of the first heating device and the second heating device is exchanged to the first liquid cooling medium side. When the boiling point of the first liquid cooling medium is reached, the liquid working medium in the bottom liquid phase region vaporizes, and the vapor working medium rises to the top vapor phase region. It condenses at the top of the shell to form liquid working medium. The liquid working medium can fall back to the bottom liquid phase region, which can make full use of the latent heat of the two-phase liquid cooling medium to improve the heat exchange capacity of immersion liquid cooling.

[0025] A second aspect of this application provides an electronic device including the liquid-cooled heat dissipation module as described above. In practical applications, the first heat-generating device of the liquid-cooled heat dissipation module is a functional device of the electronic device, such as a power transistor or processor. Based on immersion liquid cooling supplemented by a liquid-cooled heat dissipation component, the heat generated by the first heat-generating device within the cavity can be transferred to the outside of the housing through the liquid-cooled heat dissipation component. Simultaneously, some of the heat generated by the first heat-generating device can be exchanged to a first liquid cooling medium on its periphery. The first liquid cooling medium can then exchange the carried heat to the housing side and the first body of the liquid-cooled heat dissipation component. Overall, this effectively improves the heat dissipation efficiency of the first heat-generating device and avoids the adverse effects that may result from excessively high temperatures in the first heat-generating device. Therefore, this provides technical support for further reducing product size and increasing power density.

[0026] For example, the electronic device may be an on-board charger (OBC), power distribution unit (PDU), motor control unit (MCU), or DC-to-DC converter (DCDC) and other vehicle-mounted devices.

[0027] Other examples include terminal electronic devices such as servers, laptops, tablets, or mobile phones.

[0028] A third aspect of this application provides an electronic device, which includes a heating element, a housing, a cold plate, and a pump. The housing includes an inner cavity for containing a first liquid coolant. The heating element is built into the inner cavity of the housing and is immersed in the first liquid coolant. The cold plate includes a first body portion for absorbing heat and a second body portion for releasing heat. The first body portion and the second body portion have communicating channels for containing the second liquid coolant. The first body portion is located in the inner cavity of the housing, and the second body portion is located outside the housing. The inlet and outlet of the cold plate are located in the second body portion of the cold plate. The inlet is connected to the outlet of the pump through a pipe, and the outlet is connected to the inlet of the pump through a pipe. At least a portion of the first body portion is immersed in the first liquid coolant, and the heat dissipation surface of the heating element contacts the heat exchange interface of the first body portion for heat exchange. By employing immersion liquid cooling supplemented by liquid cooling components, heat generated by the heating element inside the cavity can be transferred to the outside of the housing through the liquid cooling components. Simultaneously, some of the heat generated by the heating element can be exchanged to the first liquid cooling medium on its periphery. The first liquid cooling medium can then exchange the carried heat to the housing side and the first body of the liquid cooling components. Overall, this effectively improves the heat dissipation efficiency of the heating element and avoids the adverse effects that may result from excessively high heating element temperatures. Attached Figure Description

[0029] Figure 1 A schematic diagram of a liquid-cooled heat dissipation module provided in an embodiment of this application;

[0030] Figure 2 A schematic diagram of another liquid-cooled heat dissipation module provided in an embodiment of this application;

[0031] Figure 3 A schematic diagram of yet another liquid cooling heat dissipation module provided in an embodiment of this application;

[0032] Figure 4 A schematic diagram of another liquid-cooled heat dissipation module provided in an embodiment of this application;

[0033] Figure 5 A schematic diagram of yet another liquid cooling heat dissipation module provided in an embodiment of this application;

[0034] Figure 6 A schematic diagram of another liquid-cooled heat dissipation module provided in an embodiment of this application;

[0035] Figure 7 This is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. Detailed Implementation

[0036] This application provides a liquid cooling heat dissipation module implementation scheme that can effectively improve heat dissipation capacity to meet the performance requirements of different devices.

[0037] With the increasing density, miniaturization, and modularization of heat-generating devices, heat dissipation has become an increasingly prominent issue. For heat-generating devices that produce heat during operation, traditional immersion liquid cooling technology involves submerging the device in a liquid coolant. The heat generated by the device is exchanged with the coolant and dissipated through a closed cavity containing the coolant. However, due to limitations in product miniaturization, immersion liquid cooling solutions based on closed cavities cannot meet the heat dissipation requirements of high-loss-density heat-generating devices, such as, but not limited to, power transistors, chips, power modules, or electromagnetic components. If the heat generated during device operation is not dissipated in time, excessively high temperatures will lead to performance degradation or even damage to the device. Furthermore, high temperatures will accelerate device aging and reduce its lifespan.

[0038] Based on this, embodiments of this application provide a liquid-cooled heat dissipation module, including a housing, a first heating device, and a liquid-cooled heat dissipation component. The housing includes an inner cavity for containing a first liquid cooling medium, and the first heating device is built into the inner cavity of the housing and immersed in the first liquid cooling medium. The liquid-cooled heat dissipation component includes a first body portion for absorbing heat and a second body portion for releasing heat. The first body portion and the second body portion have a connected flow channel for containing a second liquid cooling medium. The first body portion is located in the inner cavity of the housing, and the second body portion is located outside the housing. At least a portion of the first body portion is immersed in the first liquid cooling medium, and the heat dissipation surface of the first heating device contacts the surface of the first body portion for heat exchange. Here, the "heat dissipation surface" of the first heating device refers to the device surface with the lowest thermal resistance in the heat dissipation path of the first heating device. In other words, the heat dissipation path that can be constructed through the heat dissipation surface has high heat dissipation efficiency. The "heat exchange interface" of a liquid cooling heat dissipation component refers to the surface of its first body that is used to exchange heat with the first heat-generating device. It should be understood that the "heat exchange interface" can be a part of the surface of the first body, and the other part of the first body that is immersed can exchange heat with the first liquid working fluid.

[0039] This configuration, based on immersion liquid cooling supplemented by a liquid cooling component, allows heat to be transferred from the cavity to the outside of the housing, improving overall heat dissipation efficiency. For the first heating element, on one hand, the heat generated during its operation is exchanged through the heat dissipation surface to the first body of the liquid cooling component, i.e., to the liquid cooling component side. The heat is then carried away by the second liquid cooling medium within the component and transferred to the second body located outside the housing, effectively improving the heat dissipation efficiency of the first heating element and avoiding the adverse effects of overheating. On the other hand, some of the heat generated by the first heating element can also be exchanged to the first liquid cooling medium around its periphery. The first liquid cooling medium can then exchange the carried heat to both the housing side and the first body of the liquid cooling component. Thus, in addition to immersion liquid cooling, the second heating element can also be indirectly cooled by the liquid cooling component.

[0040] Overall, the liquid cooling module provided in this application embodiment can effectively dissipate heat for the first heat-generating device, preventing performance degradation, shortened lifespan, or damage due to overheating. This provides a technical guarantee for further reducing product size and increasing power density.

[0041] To better understand the technical solution and effects of this application, specific embodiments will be described in detail below with reference to the accompanying drawings. Please refer to... Figure 1 The figure is a schematic diagram of a liquid cooling heat dissipation module provided in an embodiment of this application.

[0042] In this embodiment, the liquid cooling heat dissipation module 100 includes a housing 10, a circuit board assembly 20, and a liquid cooling heat dissipation component 30.

[0043] The housing 10 includes an inner cavity for accommodating the first liquid cooling medium 101. The circuit board assembly 20 and part of the liquid cooling heat dissipation components 30 are built into the inner cavity of the housing 10 and are immersed in the first liquid cooling medium 101.

[0044] In specific implementations, the housing 10 can be an integral structure as shown in the figure, or it can be a separately processed structure (not shown in the figure), which is then fixed and sealed to form the housing 10. It is understood that the structural form of the housing 10 can meet the functional requirements of assembling the circuit board assembly 20 and the liquid cooling heat dissipation component 30, as well as forming a sealed inner cavity to accommodate the first liquid cooling working fluid 101. The embodiments of this application are not limited to this.

[0045] like Figure 1As shown, the circuit board assembly 20 includes a first heating element 201, a second heating element 202, and a circuit board 203. The first heating element 201 and the second heating element 202 are disposed on the circuit board 203. For example, the first heating element 201 is illustrated as a high-power transistor, and the second heating element 202 is illustrated as a low-power capacitor or resistor, illustrating the compatible assembly relationship between the first heating element 201 and the second heating element 202. In other possible implementations, the first heating element 201 and the second heating element 202 can be disposed on the circuit board, or they can be independently disposed according to the configuration needs of different scenarios; in other words, each heating element can be independently disposed within the housing 10, rather than being limited to forming a circuit board assembly.

[0046] In this design, the pin 2011 of the power transistor (first heating element 201) is soldered to the circuit board 203, achieving an electrical connection between the power transistor and the circuit board 203. A capacitor or resistor (second heating element 202) can be surface-mounted on the circuit board 203, achieving an electrical connection between the capacitor / resistor and the circuit board 203. In specific implementations, the assembly and connection methods between each heating element and the circuit board 203 can be determined according to the overall module design requirements and can be implemented using existing technologies, such as, but not limited to, connections via blade sockets or via pin headers and connectors. Further details are omitted here.

[0047] Here, there can be one or more first heating devices 201. Multiple first heating devices 201 can be of the same type, such as, but not limited to, multiple power transistors or multiple chips. Multiple first heating devices 201 can also be of different types, such as, but not limited to, some first heating devices 201 being power transistors and others being chips (not shown in the figure). In the case where multiple first heating devices 201 are of different types, the heat dissipation surfaces of each first heating device 201 can be flush or uneven. Correspondingly, the heat exchange interface on the liquid cooling component 30 side can be adaptively configured. This provides good adaptability.

[0048] Similarly, there may be one or more second heating devices 202. Multiple second heating devices 202 may be devices of the same type, such as, but not limited to, multiple resistors or multiple capacitors. Multiple second heating devices 202 may also be devices of different types, such as, but not limited to, some second heating devices 202 being resistors and others being capacitors.

[0049] In this embodiment, the first liquid coolant 101 is a single-phase liquid coolant. The heat generated during operation while immersed in the first liquid coolant 101 can be exchanged to the first liquid coolant 101 side. Based on the first liquid coolant 101, the carried heat can be transferred to the housing 10 and dissipated to the external environment; simultaneously, the carried heat can also be transferred to the liquid cooling heat dissipation component 30, where the heat is carried away. In specific implementations, the first liquid coolant 101 can be selected as a liquid coolant with good insulation and compatibility, such as, but not limited to, fluorinated liquids, synthetic oils, mineral oils, lubricating oils, synthetic greases, or silicone oils.

[0050] The power consumption of the first heating device 201 is greater than that of the second heating device 202. The heat dissipation surface 2012 of the first heating device 201 contacts the heat exchange interface 304 of the liquid cooling heat dissipation component 30 for heat exchange, so as to improve the heat dissipation efficiency of the first heating device 201 and meet the heat dissipation requirements of high power consumption devices.

[0051] In this embodiment, the liquid cooling heat dissipation component 30 is Figure 1 The cold plate shown is a first body portion 301 for absorbing heat and a second body portion 302 for releasing heat. The first body portion 301 and the second body portion 302 have communicating flow channels 303, with an inlet 303a and an outlet 303b located in the second body portion 302. It should be understood that... Figure 1 From this perspective, the inlet 303a and outlet 303b are at the same height. Of course, in other possible implementations, the inlet 303a and outlet 303b can also be staggered in the height direction, instead of being limited to the height position being the same as shown in the figure.

[0052] The first body portion 301 is located inside the cavity of the housing 10 and is immersed in the first liquid cooling medium 101. The heat dissipation surface of the first heating device 201 contacts the surface of the first body portion 301 for heat exchange. The second body portion 302 is located outside the housing 10. The second liquid cooling medium in the flow channel 303 is a coolant, so that the heat inside the cavity can be carried away by the flow of the coolant.

[0053] In a specific implementation, the inlet 303a and outlet 303b of the flow channel 303 can be connected to the pipelines (outlet pipe and return pipe) of an external cold source (not shown in the figure), respectively. The low-temperature coolant can be transported to the flow channel 303 of the cold plate (30) through the inlet 303a, and the high-temperature coolant that has completed heat exchange can be transported to the external cold source through the outlet 303b, thus forming a cooling water circulation. For example, but not limited to, a pump can be used to drive the coolant circulation. Specifically, the flow rate and velocity of the coolant can be adjusted and controlled according to the actual heat dissipation requirements, so that the heat in the cavity can be quickly carried away by the flowing coolant.

[0054] It should be noted that, Figure 1 The first body portion 301 shown is completely submerged in the first liquid cooling medium 101. In other possible implementations, the first body portion 301 may also be partially submerged in the first liquid cooling medium 101 (not shown in the figure), which can also achieve the above-mentioned heat exchange effect.

[0055] In one implementation, the second body portion 302 of the cold plate can be integrally formed with the first body portion 301 to form a flow channel 303 for realizing the flow of coolant. For example... Figure 1 As shown, the second body portion 302 is located outside the housing 10. An inlet 303a and an outlet 303b are formed on the second body portion 302, and it can be connected to the piping of an external cold source via a detachable connector or by welding. In another implementation, the second body portion 302 and the first body portion 301 of the cold plate can be separate structures. For example, but not limited to, the second body portion 302 can be a connector (not shown in the figure) that is sealed to the first body portion 301. After the connector is assembled with the first body portion 301, a flow channel 303 for realizing the flow of coolant is formed, and then connected to the piping of an external cold source via the connector. The specific details can be determined according to the overall product design requirements and assembly process conditions; this application embodiment does not limit this.

[0056] To further improve the heat exchange efficiency between the first heating element 201 and the cold plate, for example... Figure 1 As shown, the first heating element 201 and the cold plate can exchange heat through the connection layer 40.

[0057] The connecting layer 40 is located between the heat dissipation surface 2012 of the first heating device 201 and the heat exchange interface 304 of the liquid cooling component 30, and is used to improve the heat exchange efficiency between the first heating device 201 and the liquid cooling component 30. In specific implementations, the connecting layer 40 can be implemented using different structures, materials and / or processes to fill the gap between the first heating device 201 and the liquid cooling component 30, thereby reducing interface thermal resistance and improving heat conduction efficiency. For example, the connecting layer 40 can be formed using solder and through welding or sintering processes to achieve reliable bonding between the heat dissipation surface 2012 of the first heating device 201 and the heat exchange interface 304 of the liquid cooling component 30, and reasonably control the thermal resistance; at the same time, by reducing the interface thermal resistance, the risk of delamination of the connecting layer can be effectively reduced. As another example, the connecting layer 40 can be a thermally conductive material such as thermal grease, thermal pad, thermal gel, graphene material or liquid metal (e.g., but not limited to indium or gallium). For example, the heat dissipation surface 2012 of the first heat-generating device 201 and the liquid cooling heat dissipation component 30 can also be connected by an electroplating process to form a connecting layer 40. The specific details can be determined according to the overall product design requirements and assembly process conditions, and are not limited in the embodiments of this application.

[0058] For example Figure 1 As shown, the heat dissipation surface 2012 of the first heat-generating device 201 is parallel to the surface of the circuit board 30, and the first body portion 301 of the liquid cooling heat dissipation component 30 is approximately parallel to the circuit board 203. Of course, for a non-flat liquid cooling heat dissipation component 30, at least the heat exchange interface of its first body portion 301 is approximately parallel to the circuit board 203 to ensure reliable contact between it and the heat dissipation surface 2012 of the first heat-generating device 201. Accordingly, the first heat-generating devices 201 are stacked between the first body portion 301 and the circuit board 203.

[0059] To maximize the heat exchange efficiency of the first heating element 201, the projection of the die 2013 of the first heating element 201 is located within the projection of the connecting layer 40, within the projection plane of the heat dissipation surface of the first heating element 201. Thus, along the heat dissipation path from the first heating element 201 to the cold plate side, the connecting layer 40 provides a heat exchange interface that meets the dimensional requirements of the die 2013, forming a heat dissipation path that effectively ensures heat exchange efficiency.

[0060] In the foregoing embodiment, the first liquid cooling medium 101 used for immersion liquid cooling in the inner cavity of the housing 10 is a single-phase liquid cooling medium. In other specific implementations, a two-phase liquid cooling medium can also be used to achieve immersion liquid cooling. Please refer to [link to relevant documentation]. Figure 2 This figure is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. It is intended to clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0061] and Figure 1 Compared to the described implementation scheme, the difference in this implementation scheme is that the first liquid cooling medium 101a is a two-phase liquid cooling medium, and a bottom liquid phase region and a top vapor phase region are formed in the inner cavity of the shell 10. The first heating element 201 and the second heating element 202 are immersed in the first liquid cooling medium 101a. The heat generated during operation is exchanged to the first liquid cooling medium 101a side. When the boiling point of the first liquid cooling medium 101a is reached, the liquid working medium in the bottom liquid phase region vaporizes, and the vapor working medium rises to the top vapor phase region. It condenses upon cooling at the top of the shell 10 to form a liquid working medium, which can then fall back to the bottom liquid phase region.

[0062] In a specific implementation, the first body portion 301 of the liquid cooling heat dissipation component 30 may be partially or completely immersed in the first liquid cooling medium 101a. The specific immersion can be determined according to the overall product design requirements, and this application embodiment does not impose any limitations.

[0063] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0064] The foregoing Figure 1 and Figure 2 In the described embodiment, the first heating element 201 is located above the circuit board 203, and the first body portion 301 of the liquid cooling heat dissipation component 30 is located above the first heating element 201. In other specific implementations, the first heating element 201 and the liquid cooling heat dissipation component 30 may also be located below the circuit board 203. Please refer to [link to relevant documentation]. Figure 3 This figure is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0065] and Figure 1 Compared to the described implementation scheme, the difference in this embodiment is that the first heating device 201 is located below the circuit board 203, and correspondingly, the first body portion 301 of the liquid cooling heat dissipation component 30 is located below the first heating device 201. Similarly, the heat dissipation surface 2012 of the first heating device 201 contacts and exchanges heat with the heat dissipation interface 304 of the first body portion 301 through the connecting layer 40.

[0066] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0067] In the foregoing embodiments, the first body portion 301 of the liquid cooling heat dissipation component 30 is generally parallel to the circuit board 203. In other specific implementations, the first body portion 301 of the liquid cooling heat dissipation component 30 may also be vertically arranged relative to the circuit board 203. Please refer to... Figure 4 This figure is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. It is intended to clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0068] and Figure 1 Compared to the described implementation scheme, the difference in this embodiment is that the heat dissipation surface 2012 of the first heat-generating device 201 is perpendicular to the circuit board 203, and correspondingly, the first body portion 301 of the liquid-cooled heat dissipation component 30 is perpendicular to the circuit board 203. Similarly, the heat dissipation surface 2012 of the first heat-generating device 201 contacts and exchanges heat with the heat dissipation interface 304 of the first body portion 301 through the connecting layer 40. For the non-flat liquid-cooled heat dissipation component 30, at least the heat exchange interface of its first body portion 301 is perpendicular to the circuit board 203 to ensure reliable contact between it and the heat dissipation surface 2012 of the first heat-generating device 201.

[0069] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0070] In the foregoing embodiments, the liquid-cooled heat dissipation component 30 is a pump-driven cold plate, which removes heat from the cavity through the flow characteristics of the second liquid cooling medium within the flow channel. In other specific implementations, the liquid-cooled heat dissipation component 30 may also be a non-pump-driven heat dissipation component. Please refer to... Figure 5 This figure is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. The figure is taken from a perspective perpendicular to the circuit board 203. This is to clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0071] and Figure 1 Compared to the described implementation, the difference in this embodiment is that the liquid cooling heat dissipation component 30a is a heat pipe. This heat pipe (30a) includes a first body portion 301a for absorbing heat and a second body portion 302a for releasing heat, with interconnected flow channels (not shown in the figure) within the first body portion 301a and the second body portion 302a. Here, the evaporation end of the heat pipe is located in the first body portion 301a, and the condensation end of the heat pipe is located in the second body portion 302a.

[0072] The first body part 301a is located in the inner cavity of the housing 10 and is immersed in the first liquid cooling medium 101. The heat dissipation surface of the first heating device 201 contacts the surface of the first body part 301a for heat exchange. The second body part 302a is located outside the housing 10. The second liquid cooling medium disposed in the flow channel is a phase change liquid cooling medium, which transfers heat through the flow of the medium during the phase change process.

[0073] In practice, a negative pressure vacuum can be maintained in the flow channel of the heat pipe (30a). This allows the second liquid coolant to evaporate and condense at a lower temperature. The heat generated by the first liquid coolant 101 can be exchanged to the first body section 301a of the heat pipe (30a). When the second liquid coolant inside the heat pipe reaches its boiling point, the vaporized coolant can flow to the second body section 302a, where it condenses upon cooling to form a liquid coolant. The liquid coolant can then flow back to the first body section 301a, carrying away heat through the heat pipe.

[0074] To effectively control the flow of the working fluid within the heat pipe, the inner wall of the flow channel of the heat pipe (30a) can be constructed using sintered metal powder, grooves, or wire mesh, etc., to transport the condensed liquid working fluid from the second body section 302a side back to the first body section 301a via capillary force. This can be achieved using existing technologies, which will not be elaborated upon here.

[0075] In this embodiment, the surface of the first body portion 301a can contact and exchange heat with a portion of the heat dissipation surface of the first heating device 201. To improve the heat exchange capacity, in a specific implementation, multiple heat pipes (30a) can be configured. For example, each heat pipe can sequentially contact and exchange heat with multiple first heating devices 201; or, for another example, each heat pipe can also contact and exchange heat with a portion of the multiple first heating devices 201 (not shown in the figure). The specific configuration can be selected according to the overall product design requirements, and this application embodiment does not limit the choice.

[0076] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0077] Please see Figure 6 This figure is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. The figure is taken from a perspective perpendicular to the circuit board 203. This is to clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0078] and Figure 1 Compared to the described implementation, the difference in this embodiment is that the liquid cooling heat dissipation component 30b is a vapor chamber (VC). This vapor chamber (30b) includes a first body portion 301b for absorbing heat and a second body portion 302b for releasing heat. The first body portion 301b and the second body portion 302b have interconnected flow channels (not shown in the figure). Here, the evaporation section of the VC is located in the first body portion 301b, and the condensation section of the VC is located in the second body portion 302b.

[0079] The first body portion 301b is located inside the cavity of the housing 10 and is immersed in the first liquid cooling medium 101. The heat dissipation surface of the first heating device 201 contacts the surface of the first body portion 301b for heat exchange. The second body portion 302b is located outside the housing 10, and the second liquid cooling medium disposed in the flow channel is a phase change liquid cooling medium, which transfers heat through the flow of the medium during the phase change process.

[0080] In a practical implementation, the VC can be flat and can exchange heat with multiple first heating elements 201. The internal flow channels of VC30b can maintain a negative pressure vacuum state. In this way, the second liquid cooling medium can achieve evaporation and condensation at a relatively low temperature. The heat generated by the first liquid cooling medium 101 immersed in the VC can be exchanged to the first body part 301b of the VC (30b). When the second liquid cooling medium in the VC is heated to its boiling point, the gaseous medium can flow to the second body part 302 side, where it condenses upon cooling to form a liquid medium. The liquid medium can flow back to the first body part 301b, carrying away the heat through the VC.

[0081] To effectively control the flow of the working fluid within the heat pipe, the inner wall of the flow channel of VC(30b) can be constructed using sintered metal powder, grooves, or wire mesh, etc., to transport the condensed liquid working fluid from the second body section 302b back to the first body section 301b via capillary force. This can be achieved using existing technologies, which will not be elaborated upon here.

[0082] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0083] In the foregoing embodiments, the circuit board 203 is a single-sided board. In other specific implementations, the circuit board 203 can also be a double-sided board, meaning that heat-generating devices are disposed on both sides of the board. Please refer to [link to relevant documentation]. Figure 7 This figure is a schematic diagram of another liquid cooling heat dissipation module provided in an embodiment of this application. It is intended to clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0084] and Figure 1 Compared to the described implementation scheme, the difference in this implementation scheme is that: both sides of the circuit board 203 are provided with first heating devices 201, and correspondingly, two liquid cooling heat dissipation components (cold plates) 30 are provided. The two liquid cooling heat dissipation components 30 are respectively provided corresponding to the first heating devices 201 on both sides of the circuit board 203; that is, the heat dissipation surface of the first heating device 201 located below the circuit board 203 contacts the heat exchange interface of one cold plate (30) for heat exchange, and the heat dissipation surface of the first heating device 201 located above the circuit board 203 contacts the heat exchange interface of the other cold plate (30) for heat exchange. Overall, the heat inside the cavity can be removed through the corresponding cold plates.

[0085] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0086] The liquid cooling heat dissipation modules described in the foregoing embodiments can be widely used in various application scenarios. In addition to the aforementioned liquid cooling heat dissipation modules, this application also provides an electronic device that includes the liquid cooling heat dissipation modules described in the foregoing embodiments for heat dissipation. In a specific implementation, the first heat-generating device of the liquid cooling heat dissipation module can be a high-loss-density heat-generating device of the electronic device, such as, but not limited to, the power transistor of an OBC, or a functional device such as a processor in a laptop computer.

[0087] For example, the electronic device can be an in-vehicle device such as an OBC, PDU, MCU, or DC-DC converter; other examples include servers, laptops, tablets, or mobile phones. Based on immersion liquid cooling supplemented by a liquid cooling component, the heat generated by the first heating element inside the cavity can be transferred to the outside of the housing through the liquid cooling component. Simultaneously, some of the heat generated by the first heating element can be exchanged to the first liquid cooling medium around its periphery. Based on the first liquid cooling medium, the carried heat can be exchanged to the housing side and the first body of the liquid cooling component. Overall, this effectively improves the heat dissipation efficiency of the first heating element and avoids the adverse effects of excessively high temperatures in the first heating element. Therefore, it provides technical support for further reducing product size and increasing power density.

[0088] It should be understood that the other main functional components of the aforementioned vehicle-mounted equipment and terminal electronic equipment can be implemented using existing technologies, so they will not be elaborated upon here.

[0089] Furthermore, the ordinal numbers "first" and "second," etc., used herein are only for describing the composition or structure of the same function in the technical solution. It is understood that the use of the aforementioned ordinal numbers does not constitute a limitation on the understanding of the technical solution for which protection is sought in this application.

[0090] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A liquid-cooled heat dissipation module, characterized in that, The liquid cooling heat dissipation module includes a housing, a first heat-generating device, and liquid cooling heat dissipation components; The housing includes an inner cavity for containing a first liquid cooling medium, and the first heating device is built into the inner cavity of the housing and is immersed in the first liquid cooling medium. The liquid cooling heat dissipation component includes a first body part for absorbing heat and a second body part for releasing heat. The first body part and the second body part have interconnected flow channels for containing a second liquid cooling medium. The first body part is located in the inner cavity of the housing, and the second body part is located outside the housing. At least a portion of the first body part is immersed in the first liquid cooling medium, and the heat dissipation surface of the first heating device contacts the heat exchange interface of the first body part for heat exchange.

2. The liquid-cooled heat dissipation module according to claim 1, characterized in that, The liquid cooling heat dissipation module also includes a second heating device, which is immersed in the first liquid cooling medium, and the power consumption of the first heating device is greater than that of the second heating device.

3. The liquid-cooled heat dissipation module according to claim 1 or 2, characterized in that, The liquid cooling heat dissipation module also includes a connecting layer, through which the first heat-generating device contacts and exchanges heat with the first body part.

4. The liquid-cooled heat dissipation module according to claim 3, characterized in that, The connecting layer is formed by at least one of the following processes: solder welding, solder sintering, and electroplating.

5. The liquid-cooled heat dissipation module according to claim 3, characterized in that, The connecting layer is formed using at least one of the following: thermal grease, thermal pad, thermal gel, graphene material, and liquid metal.

6. The liquid-cooled heat dissipation module according to any one of claims 3 to 5, characterized in that, Within the projection plane of the heat dissipation surface of the first heating device, the projection of the core of the first heating device is located within the projection of the connecting layer.

7. The liquid-cooled heat dissipation module according to any one of claims 1 to 6, characterized in that, The first heating device is configured as multiple devices, which may be the same device or different devices.

8. The liquid-cooled heat dissipation module according to claim 7, characterized in that, The liquid cooling heat dissipation module also includes a circuit board, and a plurality of the first heat-generating devices are respectively disposed on both sides of the circuit board. The liquid cooling heat dissipation components are configured to be at least two; the at least two liquid cooling heat dissipation components are respectively located on both sides of the circuit board, and the liquid cooling heat dissipation components contact and exchange heat with the first heat-generating devices located on the same side of the circuit board relative to the circuit board.

9. The liquid-cooled heat dissipation module according to any one of claims 1 to 8, characterized in that, The liquid cooling heat dissipation component is a cold plate, and the liquid inlet and outlet of the cold plate are located in the second body part of the cold plate.

10. The liquid-cooled heat dissipation module according to claim 9, characterized in that, The cold plate exchanges heat with multiple of the first heating elements.

11. The liquid-cooled heat dissipation module according to any one of claims 1 to 8, characterized in that, The liquid cooling heat dissipation component is a heat pipe, with the evaporation end of the heat pipe located in the first body part and the condensation end of the heat pipe located in the second body part.

12. The liquid-cooled heat dissipation module according to claim 11, characterized in that, The heat pipes are configured as a plurality of heat pipes, each heat pipe contacting and exchanging heat with a plurality of the first heating devices, and / or each first heating device contacting and exchanging heat with a plurality of the heat pipes.

13. The liquid-cooled heat dissipation module according to any one of claims 1 to 8, characterized in that, The liquid cooling heat dissipation component is a heat spreader plate, with the evaporation part of the heat spreader plate located in the first body part and the condensation part of the heat spreader plate located in the second body part.

14. The liquid-cooled heat dissipation module according to claim 13, characterized in that, The heat exchange plate exchanges heat with multiple of the first heating elements.

15. The liquid-cooled heat dissipation module according to any one of claims 1 to 14, characterized in that, The first heating element is disposed on the circuit board, and the heat dissipation surface of the first heating element is parallel to the surface of the circuit board. Correspondingly, the heat exchange interface of the first body is parallel to the surface of the circuit board; or, the heat dissipation surface of the first heating element is perpendicular to the surface of the circuit board, and correspondingly, the heat exchange interface of the first body is perpendicular to the surface of the circuit board.

16. The liquid-cooled heat dissipation module according to any one of claims 1 to 15, characterized in that, The first liquid cooling medium is either a single-phase liquid cooling medium or a two-phase liquid cooling medium.

17. An electronic device, characterized in that, The electronic device includes the liquid cooling heat dissipation module according to any one of claims 1 to 16.

18. An electronic device, characterized in that, The electronic device includes a heating element, a housing, a cold plate, and a pump. The housing includes an inner cavity for containing a first liquid coolant. The heating element is built into the inner cavity of the housing and is immersed in the first liquid coolant. The cold plate includes a first body portion for absorbing heat and a second body portion for releasing heat. The first body portion and the second body portion have communicating channels for containing a second liquid coolant. The first body portion is located in the inner cavity of the housing, and the second body portion is located outside the housing. The inlet and outlet of the cold plate are located in the second body portion of the cold plate. The inlet is connected to the outlet of the pump through a pipe, and the outlet is connected to the inlet of the pump through a pipe. At least a portion of the first body portion is immersed in the first liquid coolant, and the heat dissipation surface of the heating element contacts the heat exchange interface of the first body portion for heat exchange.

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