A server heat dissipation module

Abstract

A server heat dissipation module is used for dissipating heat of a server and allowing cooling liquid to pass through, the server has a plurality of heat sources, the server heat dissipation module comprises a plurality of main flow driving devices and a plurality of heat sinks, each main flow driving device is arranged and configured corresponding to each heat source along a flow direction, and each heat sink is stacked on each heat source. When each main flow driving device operates, each main flow driving device drives the cooling liquid to pass through each corresponding heat sink along the flow direction; thereby, the cooling liquid can be forced to pass through each heat sink to improve overall heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of server heat dissipation, and more particularly to a server heat dissipation module. Background Technology

[0002] With the rapid development of artificial intelligence (AI), the demand for servers has increased significantly, generating a large amount of heat during operation. Therefore, to maintain servers within a certain temperature range to ensure their performance and lifespan, most servers are equipped with heat sinks, which are then fully immersed in coolant to improve heat dissipation efficiency. However, because heat sinks have multiple fins, the coolant cannot flow naturally between the fins without external force, thus affecting the coolant's heat dissipation efficiency.

[0003] In view of this, the inventor has devoted himself to research and applied theoretical principles to address the shortcomings of the prior art, and has made every effort to solve the above-mentioned problems, which is the target of the inventor's improvement. Summary of the Invention

[0004] The main objective of this invention is to force coolant through each radiator to improve overall heat dissipation efficiency.

[0005] To achieve the above objectives, the present invention provides a server heat dissipation module for dissipating heat from at least one server and allowing a coolant to pass through. The server has multiple heat sources, and the server heat dissipation module includes multiple main flow driving devices and multiple heat sinks. Each main flow driving device is configured corresponding to each of the heat sources. Each main flow driving device and its corresponding heat source are arranged along the flow direction, and each heat sink is stacked on each of the heat sources. When each main flow driving device is in operation, each main flow driving device drives the coolant to pass through its corresponding heat sink along the flow direction.

[0006] In one embodiment of the present invention, each of the heat sources is arranged side by side parallel to the flow direction, and each of the main flow driving devices is arranged side by side.

[0007] In one embodiment of the present invention, each of the heat sources is arranged along the flow direction, and each of the main flow driving devices is arranged along the flow direction.

[0008] In one embodiment of the present invention, each main drive device is a fan or a pump.

[0009] In one embodiment of the present invention, each heat sink includes a base plate and a plurality of fins, wherein each fin in each heat sink is arranged parallel to each other on the base plate and parallel to the flow direction.

[0010] In one embodiment of the present invention, a plurality of thermal pads are further included, each thermal pad being stacked between each heat source and its corresponding heat sink.

[0011] In one embodiment of the present invention, a device for dissipating heat from multiple servers is provided, which also includes multiple auxiliary flow-driving devices and a flow-guiding module. The servers are arranged side by side in a container, and the auxiliary flow-driving devices are stacked on the heat sinks of the servers. The flow-guiding module includes a first housing, a second housing, and an infusion tube. The first housing covers the heat sources and corresponding heat sinks in one of the servers to form a first chamber, and the second housing covers the heat sources and corresponding heat sinks in another server to form a second chamber. The infusion tube passes through each server and connects the first chamber and the second chamber. The first housing has a first inlet and an outlet connecting to the first chamber, and the second housing has a second inlet connecting to the second chamber.

[0012] In one embodiment of the present invention, the position of the first liquid inlet is configured corresponding to the auxiliary flow driving device of the first housing, and the position of the second liquid inlet is configured corresponding to the auxiliary flow driving device of the second housing.

[0013] In one embodiment of the present invention, each drive device includes a fan or a pump.

[0014] In one embodiment of the present invention, each drive device includes a fan and a pump, and each pump is stacked between a corresponding heat sink and a corresponding fan.

[0015] In one embodiment of the present invention, each radiator includes a base plate and a plurality of fins. Each fin in each radiator is arranged parallel to each other on the base plate and parallel to the flow direction. A heat dissipation channel is formed between any two adjacent fins, and each heat dissipation channel is parallel to the infusion pipe.

[0016] In one embodiment of the present invention, the liquid outlet and the liquid delivery tube are located on opposite sides of the first housing.

[0017] The server heat dissipation module of the present invention is configured with each main flow drive device corresponding to each heat source, and each main flow drive device and the corresponding heat source are arranged along the flow direction, so that when each main flow drive device is running, each main flow drive device can drive the coolant to flow through each heat sink on the corresponding heat source along the flow direction. Therefore, the server heat dissipation module of the present invention can force the coolant to flow through each heat sink to improve heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 This is an exploded perspective view of the liquid cooling cabinet and various servers used in this invention.

[0019] Figure 2 This is a schematic diagram of the system in which the present invention is applied;

[0020] Figure 3 This is a cross-sectional view of the server used in this invention.

[0021] Figure 4 A cross-sectional view of another embodiment of the server to which this invention is applied;

[0022] Figure 5 This is a cross-sectional side view of the present invention and each server;

[0023] In the attached figures, the following labels are used:

[0024] 10: Liquid cooler;

[0025] 11: Container;

[0026] 12: Liquid inlet port;

[0027] 13: Liquid outlet port;

[0028] 20: Server;

[0029] 21: Chassis;

[0030] 22: Heat source;

[0031] 30: Main drive unit;

[0032] 31: Radiator;

[0033] 311: Base plate;

[0034] 312: Fins;

[0035] 313: Heat dissipation channel;

[0036] 32: Secondary flow drive device;

[0037] 321: Fan;

[0038] 322: Pump;

[0039] 33: Thermal pad;

[0040] 40: Traffic diversion module;

[0041] 41: First shell;

[0042] 411: First chamber;

[0043] 412: First liquid inlet;

[0044] 413: liquid outlet;

[0045] 42: Second shell;

[0046] 421: Second chamber;

[0047] 422: Second liquid inlet;

[0048] 43: Infusion tubing;

[0049] 50: Main pump;

[0050] 60: Heat sink;

[0051] 70: Circulation piping;

[0052] D: Flow direction. Detailed Implementation

[0053] In the description of this invention, it should be understood that the terms "front side," "rear side," "left side," "right side," "front end," "rear end," "end," "longitudinal," "lateral," "vertical," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting conditions of this invention.

[0054] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" describe various elements, components, regions, hierarchies, and / or parts, which should not be limited by these terms. These terms are used only to distinguish one element, component, region, hierarchy, or part from another. Unless the context clearly indicates otherwise, the use of terms such as "first," "second," "third," "fourth," and "fifth" herein does not imply order or sequence.

[0055] Unless otherwise defined, the terms "substantially" and "approximately" are used to describe and narrate small changes. When combined with an event or situation, the term may include the exact moment the event or situation occurred, or an approximate point in time. For example, when combined with a numerical value, the term may include a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0056] The detailed description and technical content of the present invention will be explained below in conjunction with the accompanying drawings. However, the drawings are for illustrative purposes only and are not intended to limit the scope of the invention.

[0057] This invention provides a server heat dissipation module for cooling at least one server 20 and allowing a coolant (not shown) to pass through. Specifically, this invention immerses at least one server 20 in a coolant and uses the server heat dissipation module to cool the server 20. In this embodiment, the number of servers 20 is multiple; for ease of explanation, only a single server 20 will be described below, but this is not intended to limit the invention. Please refer to [reference needed]. Figures 1 to 3 As shown, the server heat dissipation module of the present invention mainly includes multiple main drive devices 30 and multiple heat sinks 31.

[0058] Server 20 and server cooling module are housed within a liquid cooling cabinet 10. In this embodiment, the liquid cooling cabinet 10 is a hollow rectangular body, but the invention is not limited thereto. The liquid cooling cabinet 10 has a container 11, a liquid inlet 12, and a liquid outlet 13. The container 11 is located inside the liquid cooling cabinet 10, making the liquid cooling cabinet 10 a hollow structure, and the container 11 is filled with coolant. In this embodiment, the liquid inlet 12 and the liquid outlet 13 are respectively located on opposite sides of the liquid cooling cabinet 10, with the liquid inlet 12 located near the bottom of the liquid cooling cabinet 10 and the liquid outlet 13 located near the top of the liquid cooling cabinet 10, but the invention is not limited thereto. The container 11 connects the liquid inlet 12 and the liquid outlet 13, allowing low-temperature coolant to enter the container 11 through the liquid inlet 12 for heat exchange, and the heated coolant flows along a flow direction D and exits the liquid cooling cabinet 10 through the liquid outlet 13.

[0059] Each server 20 includes a housing 21, and each server 20 has multiple heat sources 22 disposed within the housing 21. It should be noted that the housing 21 is used to protect the internal heat sources 22 and other components; therefore, the housing 21 is not completely sealed, allowing coolant to flow into the housing 21 along the flow direction D to cool the heat sources 22. See also... Figure 3 As shown, in this embodiment, the heat sources 22 are arranged side by side, substantially parallel to the flow direction D. However, the present invention is not limited thereto; for example, in... Figure 4 In another embodiment shown, each heat source 22 may be arranged along the flow direction D, but in other embodiments, each heat source 22 may be arranged in a matrix.

[0060] Each main flow drive device 30 is respectively provided corresponding to each heat source 22. Specifically, each main flow drive device 30 and its corresponding heat source 22 are arranged along the flow direction D. In this embodiment, each main flow drive device 30 is a fan, but the invention is not limited thereto; for example, each main flow drive device 30 can also be a pump. Please refer to [link to relevant documentation]. Figure 3 As shown, the main drive devices 30 in this embodiment are arranged side by side, but the present invention is not limited thereto; for example, in... Figure 4In another embodiment shown, the main flow-driving devices 30 are arranged along the flow direction D.

[0061] Each heat sink 31 is stacked on its corresponding heat source 22 to absorb the heat generated by the heat source 22. Specifically, each heat sink 31 includes a base plate 311 and a plurality of fins 312. The fins 312 in each heat sink 31 are substantially parallel to each other on the base plate 311, thereby forming a heat dissipation channel 313 between any two adjacent fins 312, and each fin 312 is substantially parallel to the flow direction D so that the coolant can pass through the heat dissipation channel 313 between the fins 312 along the flow direction D. In other words, the fins 312 in each heat sink 31 are disposed on the side of the heat sink 31 away from the corresponding heat source 22. In this embodiment, the server heat dissipation module of the present invention also includes a plurality of thermal pads 33, but the present invention is not limited thereto, and those skilled in the art should be able to choose whether to use thermal pads 33 according to their needs. Each thermal pad 33 is stacked between each heat source 22 and its corresponding heat sink 31, thereby quickly conducting the heat generated by each heat source 22 to the heat sink 31. The thermal pad 33 can be paraffin wax, silicone resin, or an alloy of iron, tin, silver, copper, indium, tin, bismuth, or tungsten; the present invention does not impose any restrictions on these materials.

[0062] Therefore, when each main flow drive device 30 is in operation, each main flow drive device 30 can drive the coolant along the flow direction D through the corresponding radiator 31, thereby improving the overall liquid cooling efficiency.

[0063] For further explanation, please refer to [link / reference]. Figure 1 , Figure 2 and Figure 5 As shown, the server heat dissipation module of the present invention also includes multiple auxiliary airflow driving devices 32 and an airflow guiding module 40. The following is a more detailed description, using multiple servers 20 as examples.

[0064] Each server 20 is arranged in pairs side-by-side within the reservoir 11, thus being completely immersed in the coolant. In this embodiment, the servers 20 are spaced apart for easy placement and retrieval, but in other embodiments, the servers 20 may be arranged adjacent to each other. In the accompanying drawings of this embodiment, the number of servers 20 is ten pairs, arranged sequentially in pairs, but the present invention is not limited to this. The number and arrangement of servers 20 can be adjusted according to different needs, as long as the number of servers 20 is more than one pair. For ease of explanation, the following description uses only one pair of servers 20, but this is not intended to limit the number of servers 20 in the present invention to only one pair, as stated above.

[0065] Each secondary power drive device 32 is stacked on the heat sinks 31 of each server 20. Each secondary power drive device 32 can be a fan 321, a pump 322, or both a fan 321 and a pump 322. In this embodiment, each secondary power drive device 32 includes a stacked fan 321 and a pump 322, that is, each pump 322 is stacked between the corresponding heat sink 31 and the corresponding fan 321. However, in other embodiments, each fan 321 may also be stacked between the corresponding heat sink 31 and the corresponding pump 322, or the secondary power drive device 32 may only include a fan 321 or a pump 322.

[0066] The flow guiding module 40 includes a first housing 41, a second housing 42, and an infusion tube 43. Both the first housing 41 and the second housing 42 are hollow covers. The first housing 41 covers the heat sources 22 and corresponding heat sinks 31 in one of the servers 20, forming a first chamber 411. The second housing 42 covers the heat sources 22 and corresponding heat sinks 31 in another server 20, forming a second chamber 421. Specifically, the first housing 41 covers and abuts against the corresponding auxiliary flow guiding device 32 so that the corresponding heat sink 31 can be tightly attached to the corresponding heat source 22, and both the corresponding heat sink 31 and the corresponding heat source 22 are located within the first chamber 411. The second housing 42 covers and abuts against the corresponding auxiliary flow guiding device 32 so that the corresponding heat sink 31 can be tightly attached to the corresponding heat source 22, and both the corresponding heat sink 31 and the corresponding heat source 22 are located within the second chamber 421. An infusion tube 43 passes through each server 20, and its two ends are connected to the first chamber 411 and the second chamber 421 respectively, thus achieving a series connection. The first housing 41 has a first inlet 412 and an outlet 413 connecting the first chamber 411. The second housing 42 has a second inlet 422 connecting the second chamber 421. In other words, besides being connected to the second chamber 421 via the infusion tube 43, the first chamber 411 can only be connected to the outside of the first housing 41 through the first inlet 412 and the outlet 413, while the second chamber 421 can only be connected to the outside of the second housing 42 through the second inlet 422.

[0067] Therefore, when each of the auxiliary flow-driving devices 32 of the present invention is in operation, the coolant can be forced through the first inlet 412 and the second inlet 422 to the corresponding heat dissipation channels 313 for heat exchange, thereby further enhancing the cooling effect of each radiator 31 on each heat source 22. The heated coolant can also enter the first chamber 411 and the second chamber 421 through the corresponding heat dissipation channels 313 respectively. The coolant in the second chamber 421 can enter the first chamber 411 through the liquid delivery pipe 43, and the coolant in the first chamber 411 can leave to the outside of the first housing 41 through the liquid outlet 413 to form a flow circulation. In addition, since each auxiliary flow-driving device 32 in this embodiment consists of a stacked fan 321 and a pump 322, even if the fan 321 or pump 322 of one of the auxiliary flow-driving devices 32 fails and cannot operate, the undisturbed fan 321 or pump 322 in that auxiliary flow-driving device 32 can still force the coolant to flow. Furthermore, even if the auxiliary flow-driving device 32 in one of the servers 20 completely fails and cannot operate, since the infusion pipe 43 connects the first chamber 411 and the second chamber 421, the auxiliary flow-driving device 32 in the other server 20 can still push or draw the coolant in the second chamber 421 into the first chamber 411, and finally exit to the outside of the first housing 41 through the outlet 413. This not only further forces the coolant through each radiator 31 to improve heat dissipation efficiency, but also ensures the heat dissipation efficiency of the entire server heat dissipation module by forcing the coolant to flow through the secondary drive device 32 in the other server 20 connected in series when the secondary drive device 32 in one of the servers 20 fails to operate.

[0068] To further explain, the first liquid inlet 412 is positioned corresponding to the auxiliary flow drive device 32 of the first housing 41, and the second liquid inlet 422 is positioned corresponding to the auxiliary flow drive device 32 of the second housing 42. This allows the coolant to directly pass through the auxiliary flow drive devices 32 via the first liquid inlet 412 and the second liquid inlet 422 when each auxiliary flow drive device 32 is operating. In other words, in this embodiment, each fan 321 is located below the first liquid inlet 412 and the second liquid inlet 422, respectively, while each pump 322 is located below each fan 321 and above each fin 312 of each radiator 31. This allows the coolant to directly pass through the first liquid inlet 412 and the second liquid inlet 422 through each auxiliary flow drive device 32 to the corresponding heat dissipation channels 313 for heat exchange.

[0069] In this embodiment, each heat dissipation channel 313 is substantially parallel to the liquid inlet pipe 43, so that when the coolant flows out from the heat dissipation channel 313 corresponding to the first housing 41, it can directly enter the liquid inlet pipe 43 and into the first chamber 411. However, the present invention is not limited thereto, and in other embodiments, each heat dissipation channel 313 may also be arranged to cross the liquid inlet pipe 43. Furthermore, in this embodiment, the outlet 413 and the liquid inlet pipe 43 are located on opposite sides of the first housing 41, thereby preventing the coolant flowing out from the liquid inlet pipe 43 from directly affecting the coolant passing through the outlet 413. However, the present invention is not limited thereto.

[0070] To further explain, the liquid cooler 10 of the server cooling module can also be connected to a main pump 50, a heat sink 60, and a circulation pipe 70. The circulation pipe 70 connects the main pump 50, the liquid cooler 10, and the heat sink 60 in series to form a circulation loop (not labeled in the figure), allowing the coolant to circulate within it. Specifically, the circulation pipe 70 is connected to the liquid inlet 12 and the liquid outlet 13 of the liquid cooler 10. Therefore, the main pump 50 can push the coolant along the circulation pipe 70 from the liquid inlet 12 of the liquid cooler 10 to the bottom of the tank 11 of the liquid cooler 10, and into the casing 21 of each server 20. Then, driven by the main drive device 30 and the auxiliary drive device 32 of each server 20, the coolant passes through the heat dissipation channels 313 of each heat sink 31 to dissipate heat and cool the heat sources 22 attached to each heat sink 31, and then flows into the first chamber 411 and the second chamber 421. The coolant is affected by the auxiliary flow drive devices 32 and enters the first chamber 411 through the liquid delivery pipe 43. It then flows together with the coolant in the first chamber 411 through the liquid outlet 413 to the outside of the first housing 41. At this time, the coolant heats up due to heat absorption and leaves the liquid cooler 10 through the liquid outlet 13 at the top of the tank 11 along the flow direction D and re-enters the circulation pipe 70. Then, the heated coolant enters the heat dissipation 60 for heat dissipation and cooling to a low temperature. Finally, it returns to the main pump 50 through the circulation pipe 70 to complete the circulation.

[0071] The server heat dissipation module of the present invention is configured with each main flow drive device 30 corresponding to each heat source 22, and each main flow drive device 30 and the corresponding heat source 22 are arranged along the flow direction D, so that when each main flow drive device 30 is running, each main flow drive device 30 can drive the coolant along the flow direction D through each heat sink 31 on the corresponding heat source 22. Therefore, the server heat dissipation module of the present invention can force the coolant to flow through each heat sink 31 to improve heat dissipation efficiency.

[0072] In summary, the foregoing disclosure of this invention is intended to enable those skilled in the art to clearly understand the technical content of this invention and implement it accordingly, and is not intended to limit the scope of patent protection of this invention. In addition, this invention may have other embodiments not listed. Without departing from the spirit and essence of this invention, those skilled in the art should be able to devise various corresponding changes and modifications based on this invention, but all such changes and modifications should fall within the scope of protection of the patents claimed in this invention.

Claims

1. A server heat dissipation module for dissipating heat from at least one server and allowing a coolant to pass through, characterized in that, The server has multiple heat sources, and the server heat dissipation module includes: Multiple main flow driving devices are configured to correspond to each of the aforementioned heat sources, and each main flow driving device and its corresponding heat source are arranged along a flow direction; and Multiple heat sinks are stacked on each of the heat sources; When each of the main flow-driving devices is in operation, each of the main flow-driving devices drives the coolant to flow through the corresponding radiator along the flow direction.

2. The server heat dissipation module as described in claim 1, characterized in that, Each of the heat sources is arranged in parallel to the flow direction, and each of the main flow-driving devices is arranged in parallel.

3. The server heat dissipation module as described in claim 1, characterized in that, Each of the heat sources is arranged along the flow direction, and each of the main flow-driving devices is arranged along the flow direction.

4. The server heat dissipation module as described in claim 1, characterized in that, Each of the main drive devices is a fan or a pump.

5. The server heat dissipation module as described in claim 1, characterized in that, Each of the heat sinks includes a base plate and a plurality of fins, wherein each of the fins in each heat sink is arranged parallel to each other on the base plate and parallel to the flow direction.

6. The server heat dissipation module as described in claim 1, characterized in that, It also includes multiple thermal pads, each of which is stacked between each heat source and its corresponding heat sink.

7. The server heat dissipation module as described in claim 1, characterized in that, The server heat dissipation module is used to dissipate heat from multiple servers and also includes multiple auxiliary flow-driving devices and a flow-guiding module. The servers are arranged side by side, and the auxiliary flow-driving devices are stacked on the multiple heat sinks of each server. The flow-guiding module includes a first housing, a second housing, and an infusion tube. The first housing covers the heat source and the corresponding multiple heat sinks in one of the servers to form a first chamber. The second housing covers the heat source and the corresponding multiple heat sinks in another server to form a second chamber. The infusion tube passes through each server and connects the first chamber and the second chamber. The first housing has a first inlet and an outlet connecting to the first chamber, and the second housing has a second inlet connecting to the second chamber.

8. The server heat dissipation module as described in claim 7, characterized in that, The position of the first liquid inlet corresponds to the auxiliary flow driving device of the first housing, and the position of the second liquid inlet corresponds to the auxiliary flow driving device of the second housing.

9. The server heat dissipation module as described in claim 7, characterized in that, Each of the aforementioned auxiliary drive devices includes a fan or a pump.

10. The server heat dissipation module as described in claim 7, characterized in that, Each of the secondary drive devices includes a fan and a pump, and each pump is stacked between the corresponding heat sink and the corresponding fan.

11. The server heat dissipation module as described in claim 10, characterized in that, Each of the radiators includes a base plate and a plurality of fins. Each of the fins in each radiator is arranged parallel to each other on the base plate and parallel to the flow direction. A heat dissipation channel is formed between any two adjacent fins, and each heat dissipation channel is parallel to the infusion pipe.

12. The server heat dissipation module as described in claim 7, characterized in that, The liquid outlet and the infusion tube are located on opposite sides of the first housing.

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