Power converter and light storage integrated machine

Abstract

The application provides a power converter and a light storage integrated machine, and relates to the technical field of energy storage equipment. The outer surface of the rear wall of the shell of the power converter is provided with a high-heat-dissipation tooth area and a low-heat-dissipation tooth area. The height of the heat-dissipation tooth of the high-heat-dissipation tooth area is greater than the height of the heat-dissipation tooth of the low-heat-dissipation tooth area along the arrangement direction of the circuit board and the rear wall of the shell, that is, the first direction. The height of the heat-dissipation tooth on the rear wall of the shell of the power converter is designed to be different, the heat dissipation area of the power converter in the high-heat-dissipation tooth area is increased, and the heat dissipation capacity and temperature uniformity of the power converter are improved. The low-heat-dissipation tooth area reduces the height of the heat-dissipation tooth, reduces the weight and cost of the heat-dissipation tooth of the power converter, and guarantees the heat dissipation performance of the corresponding area. Moreover, the height difference between the low-heat-dissipation tooth area and the high-heat-dissipation tooth area forms an air inlet space, the air flow can be increased, and the heat dissipation efficiency and heat dissipation performance of the power converter are further improved.

Description

Technical Field

[0001] This application relates to the field of energy storage equipment technology, and in particular to a power converter and a photovoltaic-energy storage integrated machine. Background Technology

[0002] An integrated energy storage unit is a highly integrated energy storage device that integrates core components such as battery pack, power conversion system (PCS), battery management system (BMS), energy management system (EMS), thermal management and fire protection system into a single device or cabinet to achieve the storage, conversion, intelligent scheduling and safe management of electrical energy.

[0003] In integrated energy storage systems, battery packs are typically stacked vertically, with the energy storage converter positioned above them. As the core power module of the integrated energy storage system, the energy storage converter performs bidirectional AC↔DC conversion, and the heat generated during its operation directly impacts the equipment's lifespan and safety. However, since battery packs generally rely on natural convection for cooling, the heat generated during operation is transferred to the energy storage converter above via conduction and convection, worsening the converter's cooling environment and becoming a bottleneck for the overall system's heat dissipation. Summary of the Invention

[0004] This application provides a power converter and an integrated photovoltaic energy storage unit to solve the problems of uneven heat dissipation and low heat dissipation efficiency of the power converter, thereby improving the heat dissipation uniformity and efficiency of the power converter.

[0005] On one hand, this application provides a power converter, including a housing, a circuit board inside the housing, power devices disposed on the circuit board, and the arrangement direction of the circuit board and the rear wall of the housing is a first direction; the circuit board includes a first circuit board, the side of the first circuit board on which the power devices are disposed faces the rear wall of the housing; the outer surface of the rear wall of the housing is provided with a high heat dissipation tooth area and a low heat dissipation tooth area, and along the first direction, the height of the heat dissipation teeth in the high heat dissipation tooth area is greater than the height of the heat dissipation teeth in the low heat dissipation tooth area.

[0006] The power converter provided in this embodiment has a circuit board disposed inside its housing, and power devices are disposed on the circuit board. Furthermore, the outer surface of the rear wall of the housing has a high-heat-dissipation fin area and a low-heat-dissipation fin area. Along the arrangement direction of the circuit board and the rear wall of the housing (a first direction), the height of the heat dissipation fins in the high-heat-dissipation fin area is greater than the height of the heat dissipation fins in the low-heat-dissipation fin area. By differentiating the height of the heat dissipation fins on the rear wall of the power converter housing, the heat dissipation area of ​​the power converter in the high-heat-dissipation fin area is increased, improving the heat dissipation capacity and temperature uniformity of the power converter. In the low-heat-dissipation fin area, the height of the heat dissipation fins is reduced, ensuring the heat dissipation performance of the corresponding area while reducing the weight and cost of the heat dissipation fins of the power converter. Moreover, the height difference between the low-heat-dissipation fin area and the high-heat-dissipation fin area creates an air intake space, which can increase airflow and further improve the heat dissipation efficiency and performance of the power converter.

[0007] In one possible implementation, the low heat dissipation tooth region includes a first low heat dissipation tooth region and a second low heat dissipation tooth region, the first low heat dissipation tooth region and the high heat dissipation tooth region are arranged alternately along a second direction; along a third direction, the second low heat dissipation tooth region is located below the first low heat dissipation tooth region and the high heat dissipation tooth region; wherein, both the second direction and the third direction are perpendicular to the first direction.

[0008] By arranging the first low-heat-dissipation denticle area and the high-heat-dissipation denticle area alternately along the second direction, multiple spaced air intake spaces can be formed in the upper part of the rear wall of the housing, increasing the airflow and air velocity in the upper part of the rear wall and improving the heat dissipation effect of the upper part of the rear wall. Furthermore, the overall distribution of heat dissipation denticles in the upper part of the rear wall is more balanced, resulting in a more balanced weight of the housing and higher reliability.

[0009] By setting a second low heat dissipation tooth area below the first low heat dissipation tooth area and the high heat dissipation tooth area along a third direction, an air intake space can be formed in the lower part of the rear wall of the housing, increasing the air flow of the high heat dissipation tooth area located above the second low heat dissipation tooth area, and also increasing the air flow entering the second low heat dissipation tooth area, thereby improving the overall heat dissipation efficiency and heat dissipation uniformity of the power converter.

[0010] In one possible implementation, power devices of different heights are disposed on the first circuit board along a first direction; the higher power devices face the high heat dissipation tooth area, and the lower power devices face the first low heat dissipation tooth area.

[0011] By aligning the high-heat-dissipation fin area with the taller power devices on the first circuit board, sufficient fin height can be ensured for the corresponding areas of the taller power devices, guaranteeing efficient heat dissipation for these devices. Conversely, by aligning the low-heat-dissipation fin area with the shorter power devices on the first circuit board, a recessed area is formed on the rear wall of the housing at the location of the shorter power devices. This recessed area provides additional space for the heat dissipation fins, achieving the height difference between the low-heat-dissipation fin area and the high-heat-dissipation fin area. Simultaneously, the recessed area does not impose excessive restrictions on the fin height of the low-heat-dissipation fin area, allowing it to still possess sufficient fin height to ensure efficient heat dissipation for the shorter power devices on the first circuit board.

[0012] In one possible implementation, the tooth height of the heat dissipation teeth in the first low heat dissipation tooth region is greater than or equal to the tooth height of the heat dissipation teeth in the high heat dissipation tooth region.

[0013] Thus, compared to the heat dissipation teeth in the high heat dissipation tooth area, the heat dissipation teeth in the first low heat dissipation tooth area have a comparable or larger heat dissipation area. The heat dissipation efficiency of the first low heat dissipation tooth area for power devices with lower height on the first circuit board is no less than that of the high heat dissipation tooth area for power devices with higher height on the first circuit board.

[0014] In one possible implementation, the outer surface of the rear wall of the housing also includes a blank area along a third direction, the blank area being located below the second low heat dissipation tooth area.

[0015] In this way, the blank area forms an air intake space between the second low heat dissipation tooth and the battery heat dissipation tooth of the battery pack below, which can increase the air intake volume at the bottom of the heat dissipation tooth on the rear wall and improve the heat dissipation efficiency and effect of the power converter. Furthermore, the gradual transition from the blank area, the second low heat dissipation tooth area, to the high heat dissipation tooth area above the second low heat dissipation tooth area can effectively improve the overall heat dissipation uniformity of the power converter.

[0016] In one possible implementation, the two sides of the second low heat dissipation tooth region in the second direction are the flow guiding region, which is the direction from the middle of the rear wall of the housing to the two sides of the housing in the second direction, and the distance between the heat dissipation teeth in the flow guiding region and the bottom end of the housing gradually increases.

[0017] In this way, the airflow guiding area is equivalent to forming a non-spinning area on the lower left and right sides of the rear wall, and this non-spinning area gradually expands towards the left and right sides of the main casing. This guides air to enter the airflow guiding area from both sides of the casing, thereby increasing the overall airflow on both sides of the heat dissipation fins on the rear wall of the casing, and further improving the heat dissipation efficiency of the power converter.

[0018] In one possible implementation, the two sides of the second low heat dissipation tooth region in the second direction are flow guiding regions. The bottom of the heat dissipation tooth in the flow guiding region has a bent section, which is inclined toward the side wall of the housing. Furthermore, in the second direction from the middle of the rear wall of the housing to the two sides of the housing, the inclination angle of the bent section of the heat dissipation tooth in the flow guiding region increases sequentially.

[0019] In this way, in the section where the bend is located, the width of the airflow channel formed by adjacent heat dissipation fins gradually increases in the direction pointing towards the bottom of the casing. This increases the airflow on both sides of the heat dissipation fins on the rear wall of the casing, improving the heat dissipation efficiency of the power converter.

[0020] In one possible implementation, in the second direction from the middle of the rear wall of the housing to both sides of the housing, the length of the bent section of the heat dissipation tooth located in the flow guide area decreases sequentially.

[0021] By shortening the length of the bends in each heat dissipation fin, the bottom of the bends can be prevented from extending beyond the rear wall of the casing, ensuring that the heat dissipation fins in the airflow guide area are fully connected to the rear wall of the casing. Furthermore, this helps to leave more finless areas at the bottom of the rear wall, further increasing the airflow at the bottom of the rear wall.

[0022] In one possible implementation, at least some of the heat dissipation teeth have a notch at the transition between the second low heat dissipation tooth region and the high heat dissipation tooth region.

[0023] In this way, the notch guides the airflow entering the high-heat-dissipation tooth area, causing the airflow to flow further towards the outer surface of the rear wall of the main shell. This increases the airflow rate into the high-heat-dissipation tooth area, improves the airflow uniformity in the high-heat-dissipation tooth area, and enhances the heat dissipation efficiency and uniformity of the high-heat-dissipation tooth area.

[0024] In one possible implementation, in the third direction, the heat dissipation teeth in the high heat dissipation tooth region and the heat dissipation teeth in the second low heat dissipation tooth region are integrally formed, and the heat dissipation teeth in the first low heat dissipation tooth region and the heat dissipation teeth in the second low heat dissipation tooth region are integrally formed.

[0025] In this way, the heat dissipation fins on the rear wall of the main shell extend longer in the third direction, which helps to increase the heat dissipation area of ​​the fins and improve their heat dissipation effect. Furthermore, it also enhances the structural strength and reliability of the main shell.

[0026] In one possible implementation, in the third direction, the projections of the heat dissipation teeth in the high heat dissipation tooth region and the heat dissipation teeth in the second low heat dissipation tooth region coincide, and the projections of the heat dissipation teeth in the first low heat dissipation tooth region and the heat dissipation teeth in the second low heat dissipation tooth region coincide.

[0027] In this way, from a third-party perspective, the main heat dissipation teeth in the high-heat dissipation tooth area and the main heat dissipation teeth in the second low-heat dissipation tooth area are positioned correspondingly but separated from each other, creating an air intake space between them, which increases the air intake volume in both areas. Similarly, the main heat dissipation teeth in the first low-heat dissipation tooth area and the second low-heat dissipation tooth area are positioned correspondingly but separated from each other, creating an air intake space between them, which also increases the air intake volume in both areas. This improves the heat dissipation efficiency and effect of the main casing.

[0028] In one possible implementation, the spacing of the heat dissipation denticles on the outer surface of the rear wall of the housing is the same along the second direction.

[0029] In this way, the heat dissipation fins are evenly distributed on the rear wall of the main shell, resulting in a more uniform heat dissipation effect on the entire rear wall. Furthermore, the air pressure on the rear wall of the main shell is also evenly distributed, leading to better stress resistance and higher reliability, which helps extend the service life of the main shell.

[0030] In one possible implementation, the top wall of the housing is provided with heat dissipation fins.

[0031] In this way, the top heat dissipation fins on the outer surface of the top wall of the casing can increase the heat dissipation area and convection effect of the top wall of the casing, allowing the heat accumulated on the top of the casing to be dissipated to the outside more quickly and thoroughly. This further improves the overall heat dissipation efficiency and heat dissipation uniformity of the power converter.

[0032] In one possible implementation, a heat-conducting plate is further provided inside the housing. The heat-conducting plate is disposed along a first direction on the side of the first circuit board facing away from the rear wall of the housing, and a heat-conducting layer is disposed between the heat-conducting plate and the first circuit board.

[0033] In this way, the first circuit board can transfer heat to the rear wall of the casing on one side, where the heat is quickly dissipated through the heat dissipation vents on the outer wall of the casing. The first circuit board can also transfer heat to a heat-conducting plate on the other side via a heat-conducting layer, where the heat-conducting plate can also conduct heat from the first circuit board to the casing and dissipate it to the outside. Therefore, the first circuit board has two heat conduction paths, which significantly improves its heat dissipation efficiency, resulting in better heat dissipation, more stable operation, and higher reliability.

[0034] In one possible implementation, the circuit board further includes a second circuit board disposed on the side of the heat-conducting plate facing away from the first circuit board, and a heat-conducting layer is also disposed between the heat-conducting plate and the second circuit board.

[0035] In this way, the second circuit board can transfer heat to the heat-conducting plate through the heat-conducting layer, and the heat-conducting plate can also conduct heat from the second circuit board to the housing and dissipate it to the outside. This improves the heat dissipation performance of the second circuit board and ensures its stability and reliability during operation. Furthermore, the heat-conducting plate can also serve as a mounting base for the second circuit board, securing it within the housing. Simultaneously, the heat-conducting plate can separate the first and second circuit boards, ensuring they do not interfere with each other.

[0036] In one possible implementation, bosses are provided on both sides of the heat-conducting plate, and a heat-conducting layer is disposed between the bosses and the circuit board.

[0037] In this way, the protrusions on the surface of the heat-conducting plate can reduce the gap between the heat-conducting plate and the circuit board, providing suitable filling space for the heat-conducting layer. This ensures a stable and reliable fit between the heat-conducting plate and the circuit board through the heat-conducting layer. At the same time, it prevents the heat-conducting layer from becoming too thick due to an excessive gap between the heat-conducting plate and the circuit board, thus avoiding the thickness of the heat-conducting layer affecting its own heat transfer performance, and ensuring that the heat-conducting layer can quickly and effectively transfer the heat from the circuit board to the heat-conducting plate.

[0038] In one possible implementation, the power converter further includes a decorative cover, which is disposed on both sides of the housing along a second direction, and at least one side of the decorative cover is provided with an air inlet, which is disposed corresponding to the low heat dissipation tooth area.

[0039] In this way, the air inlet avoids the heat dissipation fins in the low-heat-dissipation fin area, preventing air from entering the area containing the heat dissipation fins on the rear wall of the casing from the side. This allows more air to enter the air intake space created by reducing the height of the heat dissipation fins in the low-heat-dissipation fin area, ensuring sufficient airflow into the casing. Furthermore, the air inlet also avoids some electronic components located on the left and / or right walls of the casing, enabling electrical connections between these electronic components and external devices.

[0040] On the other hand, embodiments of this application provide an integrated photovoltaic and energy storage system, including multiple battery packs and the aforementioned power converter, with the power converter stacked on the multiple battery packs.

[0041] The integrated photovoltaic and energy storage unit provided in this application includes the aforementioned power converter, and therefore possesses all the technical effects of a power converter, which will not be repeated here.

[0042] In one possible implementation, the outer wall of each battery pack is provided with heat dissipation teeth, and the heat dissipation teeth in the high heat dissipation tooth area of ​​the power converter are flush with the heat dissipation teeth of the battery pack.

[0043] This ensures that the heat dissipation fins in the high-heat-dissipation fin area of ​​the power converter have sufficient height, effectively increasing the heat dissipation area and improving the heat dissipation efficiency in this area. At the same time, it avoids the heat dissipation fins in the high-heat-dissipation fin area occupying additional thickness space, which is beneficial for the overall thinning of the photovoltaic-storage integrated unit.

[0044] In one possible implementation, the top of the uppermost battery pack among the multiple battery packs is provided with a first connection terminal, and the bottom of the power converter is provided with a second connection terminal, and the first connection terminal and the second connection terminal are plugged into each other.

[0045] In this way, the battery pack and power converter are electrically connected by plugging in the first and second connection terminals. This connection method is simpler, more efficient, and facilitates the removal and replacement of the power converter or battery pack. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the structural framework of an integrated energy storage device in related technologies.

[0047] Figure 2 This is a schematic diagram of the structure of the integrated photovoltaic and energy storage unit provided in the embodiments of this application;

[0048] Figure 3A An exploded structural diagram of the integrated optical storage machine provided in an embodiment of this application;

[0049] Figure 3B An exploded structural diagram from another perspective of the integrated photovoltaic and energy storage system provided in the embodiments of this application;

[0050] Figure 4 This is a schematic diagram of the power converter provided in the embodiments of this application;

[0051] Figure 5 for Figure 4 Exploded view of the power converter in the diagram;

[0052] Figure 6 An exploded view of the internal structure of the power converter provided in the embodiments of this application;

[0053] Figure 7 A layout structure diagram of a power converter provided in an embodiment of this application;

[0054] Figure 8 This is a schematic diagram of the main housing of a power converter provided in an embodiment of this application;

[0055] Figure 9 for Figure 8 A top view of the main housing of the power converter in the diagram;

[0056] Figure 10This is a schematic diagram of the architecture of a power converter provided in an embodiment of this application;

[0057] Figure 11 A front view of the main housing of another power converter provided in an embodiment of this application;

[0058] Figure 12 A front view of the main housing of another power converter provided in an embodiment of this application;

[0059] Figure 13 This is a schematic diagram of the structural frame of the integrated photovoltaic and energy storage system provided in the embodiments of this application;

[0060] Figure 14 This is a side view of the integrated optical storage unit provided in an embodiment of this application.

[0061] Explanation of reference numerals in the attached figures:

[0062] 10-Integrated photovoltaic and energy storage system;

[0063] 100 - Power converter; 101 - Second connection terminal;

[0064] 110 - Shell; 111 - Main shell; 1111 - Rear wall; 1112 - Top wall; 1113 - Bottom wall; 1114 - Left wall; 1115 - Right wall; 112 - Front cover;

[0065] 113 - High heat dissipation tooth area; 114 - Low heat dissipation tooth area; 1141 - First low heat dissipation tooth area; 1142 - Second low heat dissipation tooth area; 115 - Blank area; 116 - Guided flow area;

[0066] 120 - Decorative cover; 121 - Air inlet;

[0067] 130 - Circuit board; 131 - First circuit board; 132 - Second circuit board; 1301 - Power device;

[0068] 140 - Heat-conducting plate; 141 - Boss;

[0069] 150 - Thermally conductive layer; 151 - First thermally conductive layer; 152 - Second thermally conductive layer; 153 - Third thermally conductive layer;

[0070] 200 - Battery pack; 201 - First connection terminal; 210 - Battery;

[0071] 300 - Heat dissipation tooth; 310 - Battery heat dissipation tooth; 320 - Converter heat dissipation tooth; 321 - Main heat dissipation tooth; 3211 - Bent section; 3212 - Notch; 322 - Top heat dissipation tooth. Detailed Implementation

[0072] In the embodiments of this application, terms such as "first" and "second" are used to distinguish identical or similar items with essentially the same function and purpose. For example, "first chip" and "second chip" are used only to distinguish different chips and do not limit their order of execution. Those skilled in the art will understand that terms such as "first" and "second" do not limit the quantity or execution order, and that "first" and "second" do not necessarily imply that they are different.

[0073] It should be noted that, in the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0074] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0075] Figure 1 This is a schematic diagram of the structural framework of an integrated energy storage device in related technologies. (Refer to...) Figure 1 As shown, in the integrated energy storage unit 1, the battery packs 11 are typically stacked vertically, and the energy storage inverter 12 is positioned on top of the battery packs. It should be noted that... Figure 1 To simplify the structure of the integrated energy storage unit 1, only one battery pack 11 is shown in the diagram. In reality, the battery pack 11 may include multiple packs stacked sequentially. The heat dissipation design of the integrated energy storage unit 1 generally adopts natural heat dissipation. The heat generated by the battery pack 11 during operation is transferred to the energy storage inverter 12 above through conduction and convection, which deteriorates the heat dissipation environment of the energy storage inverter 12.

[0076] like Figure 1As shown, in related technologies, the outer casing of the energy storage converter 12 is usually provided with heat dissipation teeth 13 of uniform height. The height of the heat dissipation teeth 13 of the energy storage converter 12 is approximately the same as that of the heat dissipation teeth 13 of the battery pack 11, or the height of the heat dissipation teeth 13 of the energy storage converter 12 is slightly greater than that of the heat dissipation teeth 13 of the battery pack 11.

[0077] However, due to the uniform height of the heat dissipation fins 13 of the energy storage converter 12, the heat dissipation capacity of high-heat areas (such as areas where high-power inductors, transistors, diodes, and other devices are located) is insufficient, easily leading to localized overheating of the energy storage converter 12. Furthermore, the air intake space of the heat dissipation fins 13 of the energy storage converter 12 is limited by the obstruction of the heat dissipation fins 13 of the battery pack 11 below, resulting in low heat dissipation efficiency of the energy storage converter 12. In addition, the overall weight of the heat dissipation fins 13 of the energy storage converter 12 is large, leading to high heat dissipation costs.

[0078] In view of this, this application provides a power converter and an integrated photovoltaic storage unit. The power converter has a circuit board disposed within its housing, and power devices are mounted on the circuit board. Furthermore, the outer surface of the rear wall of the housing has a high-heat-dissipation tooth area and a low-heat-dissipation tooth area. Along the arrangement direction of the circuit board and the rear wall of the housing (a first direction), the height of the heat dissipation teeth in the high-heat-dissipation tooth area is greater than the height of the heat dissipation teeth in the low-heat-dissipation tooth area. By differentiating the height of the heat dissipation teeth on the rear wall of the power converter housing, the heat dissipation area of ​​the power converter in the high-heat-dissipation tooth area is increased, improving the heat dissipation capacity and temperature uniformity of the power converter. In the low-heat-dissipation tooth area, the height of the heat dissipation teeth is reduced, ensuring the heat dissipation performance of the corresponding area while reducing the weight and cost of the heat dissipation teeth. Moreover, the height difference between the low-heat-dissipation tooth area and the high-heat-dissipation tooth area creates an air intake space, which increases airflow and further improves the heat dissipation efficiency and performance of the power converter.

[0079] The integrated photovoltaic storage machine and its power converter provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0080] For ease of description below, this application establishes an XYZ coordinate system to illustrate the relative positions of the components in the integrated photovoltaic and energy storage unit. Specifically, the extension direction of one side of the integrated photovoltaic and energy storage unit in the planar direction (which can be considered as the thickness direction of the integrated photovoltaic and energy storage unit) is defined as the X direction, the extension direction of the other side of the integrated photovoltaic and energy storage unit in the planar direction (which can be considered as the width direction of the integrated photovoltaic and energy storage unit) is defined as the Y direction, and the height direction of the integrated photovoltaic and energy storage unit is defined as the Z direction.

[0081] Figure 2 This is a schematic diagram of the integrated photovoltaic and energy storage system provided in an embodiment of this application. (Refer to...) Figure 2As shown in the illustration, this application provides a photovoltaic-storage integrated unit 10, including a power converter 100 and multiple battery packs 200. The battery packs 200 are used to store electrical energy (e.g., surplus energy generated by photovoltaic power generation, off-peak electricity from the grid) and to discharge it when needed (e.g., during periods of insufficient sunlight, power outages, or peak electricity consumption). The power converter 100 is used to achieve bidirectional inversion of direct current (DC) and alternating current (AC), converting AC to DC during charging and storing it in the battery packs 200, and converting DC to AC during discharging to supply power to the load.

[0082] The multiple battery packs 200 can be positioned along the height direction of the integrated photovoltaic and energy storage unit 10. Figure 2 The batteries are stacked sequentially in the Z direction shown, and each battery pack 200 can contain multiple batteries 210 (see [reference]). Figure 13 (As shown). The power converter 100 is stacked on top of the plurality of battery packs 200, with the power converter 100 stacked on the topmost battery pack 200.

[0083] Understandably, as an example, Figure 2 The diagram illustrates that the integrated photovoltaic and energy storage unit 10 includes four battery packs 200, which are stacked sequentially along the Z-direction. In other examples, the integrated photovoltaic and energy storage unit 10 may also include three battery packs 200, five battery packs 200, or even more battery packs 200; this embodiment does not impose any limitations on this.

[0084] Each battery pack 200 has heat dissipation fins 300 on its outer wall, allowing for natural convection cooling. For ease of description, the heat dissipation fins 300 on the outer wall of the battery pack 200 are referred to as battery heat dissipation fins 310. For example, the portion of the battery pack 200 housing with the battery heat dissipation fins 310 can be integrally formed using a die-casting process, allowing the battery heat dissipation fins 310 to be integrally formed onto the housing of the battery pack 200.

[0085] The battery heat dissipation fins 310 on the battery pack 200 are connected to the outer wall of the battery pack 200, and the heat dissipation fins 310 extend away from the outer wall of the battery pack 200. The heat dissipation fins 310 can conduct heat generated by the battery pack 200, increasing the heat dissipation area of ​​the battery pack 200. At the same time, a flow channel is formed between adjacent heat dissipation fins 310, which can increase the flow rate and velocity of air flowing over the surface of the heat dissipation fins 310. Thus, the heat dissipation efficiency and heat dissipation effect of the battery pack 200 are ensured, allowing the battery pack 200 to operate at a suitable temperature.

[0086] Similarly, heat dissipation fins 300 can also be provided on the outer wall of the housing 110 of the power converter 100, and the power converter 100 relies on these heat dissipation fins 300 for natural convection heat dissipation. For ease of description, the heat dissipation fins 300 on the outer wall of the power converter 100 will be defined as converter heat dissipation fins 320 below.

[0087] The power converter 100 has heat dissipation fins 320 connected to the outer wall of the housing 110, and the heat dissipation fins 320 extend away from the housing 110. The heat dissipation fins 320 can conduct heat generated by the power converter 100, increasing the heat dissipation area of ​​the power converter 100. Simultaneously, airflow channels are formed between adjacent heat dissipation fins 320, increasing the airflow rate and velocity across the surface of the heat dissipation fins 320. This ensures the heat dissipation efficiency and effect of the power converter 100, allowing it to operate at a suitable temperature.

[0088] Figure 3A This is an exploded structural diagram of the integrated photovoltaic and energy storage system provided in an embodiment of this application. Figure 3B This is an exploded structural diagram from another perspective of the integrated photovoltaic and energy storage system provided in the embodiments of this application. The diagram is shown to clearly illustrate the connection structure between the power converter 100 and the battery pack 200. Figure 3A and Figure 3B The image only shows one of the multiple battery packs 200 of the integrated photovoltaic and energy storage unit 10, which is the battery pack 200 located at the top and stacked with the power converter 100.

[0089] Combination Figure 3A and Figure 3B As shown, the top of the uppermost battery pack 200 is provided with a first connection terminal 201, and the bottom of the power converter 100 is provided with a second connection terminal 101. The first connection terminal 201 and the second connection terminal 101 are plugged into each other. In this way, the battery pack 200 and the power converter 100 can be electrically connected to achieve power transmission or signal interaction between the battery pack 200 and the power converter 100. Furthermore, the plug-in method for electrical connection between the power converter and the battery pack 200 is simpler, more efficient, and facilitates the disassembly and replacement of the power converter 100 or the battery pack 200.

[0090] Figure 4 This is a schematic diagram of the power converter provided in an embodiment of this application. Figure 5 for Figure 4 The exploded structure diagram of the power converter in the diagram. Combined with... Figure 4 and Figure 5As shown, the housing 110 of the power converter 100 may include a main housing 111 and a front cover 112. The main housing 111 and the front cover 112 together form a receiving cavity, which is used to receive the components of the power converter 100.

[0091] The main shell 111 may include a rear wall 1111 and side walls surrounding the rear wall 1111. The main shell 111 as a whole may be a frame with one open side. The side walls of the main shell 111 may be located in the height direction of the shell 110 ( Figure 4 and Figure 5 The top wall 1112 and bottom wall 1113 on the upper and lower sides of the rear wall 1111 (shown in the Z direction) and the width / length direction of the housing 110 (shown in the Z direction) Figure 4 and Figure 5 (As shown in the Y direction) connects the left wall 1114 and right wall 1115 on the left and right sides of the rear wall 1111. The front cover 112 can be disposed opposite to the rear wall 1111 of the main shell 111, and the front cover 112 covers the opening of the main shell 111.

[0092] The main housing 111 of the power converter 100 may also be equipped with electronic components such as terminals, sensors, and connectors (not shown in the figure). These electronic components may be located on the left wall 1114 and / or right wall 1115 of the main housing 111. Some of these electronic components can be used to establish electrical connections between components within the housing 110 and external devices. The power converter 100 may also include a decorative cover 120, which can be installed on the left wall 1114 and right wall 1115 of the main housing 111. The decorative cover 120 can conceal the electronic components located on the left wall 1114 and / or right wall 1115 of the main housing 111, making the appearance of the power converter 100 more concise and aesthetically pleasing, and also protecting these electronic components.

[0093] It should be noted that, in order to more clearly demonstrate the structure of the main housing 111 of the power converter 100, and also to facilitate understanding of the position and function of the decorative cover 120, Figure 4 and Figure 5 Only the decorative cover 120 located on one side of the main shell 111 is shown in the diagram.

[0094] like Figure 5As shown, a circuit board 130 is disposed within the housing 110 of the power converter 100, and power devices 1301 are disposed on the circuit board 130. It should be noted that the term "power device 1301" here should be interpreted broadly. Power devices 1301 may include active power devices such as transistors (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs)), diodes, etc., and may also include passive power devices such as inductors, capacitors, and resistors. For example, when the circuit board 130 is used in the power converter 100, all components on the circuit board 130 can be considered as power devices 1301.

[0095] The circuit board 130 extends approximately along the height of the housing 110, and is arranged side-by-side with the rear wall 1111 of the main housing 111 and the front cover 112. For ease of explanation, in this embodiment, the arrangement direction of the circuit board 130 and the rear wall 1111 of the main housing 111 is defined as a first direction, which can be the thickness direction of the power converter 100. Figure 4 or Figure 5 (The X direction is shown in the diagram).

[0096] During operation of the power converter 100, the circuit board 130 generates a large amount of heat, which is transferred and dissipated onto the housing 110. The aforementioned converter heat dissipation fins 320 can be arranged on the outer wall of the main housing 111 to dissipate the heat generated by the power converter 100 more quickly and efficiently. For example, the main housing 111 of the power converter 100 can be integrally die-cast, and the converter heat dissipation fins 320 can be integrally formed on the main housing 111.

[0097] Since the surface of the circuit board 130 faces the rear wall 1111 of the main housing 111, more of the heat generated by the circuit board 130 will be transferred to the rear wall 1111 of the main housing 111. Therefore, the main housing 111 can have at least some converter heat dissipation fins 320 distributed on the outer surface of the rear wall 1111 to ensure that the converter heat dissipation fins 320 can effectively improve the heat dissipation performance of the power converter 100.

[0098] Figure 6 This is an exploded structural diagram of the internal structure of the power converter provided in an embodiment of this application. (Combined with...) Figure 5 and Figure 6As shown, the circuit board 130 disposed within the housing 110 of the power converter 100 may include a first circuit board 131. The first circuit board 131 is disposed near the rear wall 1111 of the main housing 111, and for example, the first circuit board 131 is directly fixed to the rear wall 1111 of the main housing 111. The heat generated by the first circuit board 131 is mainly transferred to the main housing 111, and the converter heat dissipation teeth 320 arranged on the outer wall of the main housing 111 can more quickly and thoroughly dissipate the heat of the first circuit board 131.

[0099] In some embodiments, the power devices 1301 of the first circuit board 131 can be fully integrated on one side of the first circuit board 131. In this way, the power devices 1301 only occupy one side of the space of the first circuit board 131, and the overall space occupied by the first circuit board 131 is small. This facilitates the internal space structure layout of the power converter 100 and also helps to reduce the size of the power converter 100.

[0100] In other embodiments, the power devices 1301 of the first circuit board 131 may also be distributed on both sides of the first circuit board 131. This reduces the density of power devices 1301 on a single side of the first circuit board 131, facilitating the layout design of the first circuit board 131. It also helps to reduce the area of ​​the first circuit board 131 and lower its cost. This application does not impose specific limitations in this regard.

[0101] When all the power devices 1301 on the first circuit board 131 are integrated on one side of the first circuit board 131, as an example, the side of the first circuit board 131 with the power devices 1301 can face the rear wall 1111 of the main housing 111, and all the power devices 1301 on the first circuit board 131 are located on the side of the first circuit board 131 facing the rear wall 1111 of the main housing 111. As another example, the side of the first circuit board 131 with the power devices 1301 can also face away from the rear wall 1111 of the main housing 111, and all the power devices 1301 on the first circuit board 131 are located on the side of the first circuit board 131 facing away from the rear wall 1111 of the main housing 111.

[0102] The first circuit board 131 can be directly attached to the rear wall 1111 of the main housing 111 via the thermally conductive layer 150. The heat generated by the first circuit board 131 can be directly transferred to the rear wall 1111 of the housing 110 via the thermally conductive layer 150. This improves the heat transfer efficiency of the first circuit board 131, thereby improving the heat dissipation efficiency and effect of the power converter 100. For ease of explanation, in this embodiment, the thermally conductive layer 150 disposed between the first circuit board 131 and the rear wall 1111 of the main housing 111 is defined as the first thermally conductive layer 151.

[0103] Wherein, when the power device 1301 on the first circuit board 131 faces the rear wall 1111 of the main housing 111, the first heat-conducting layer 151 can be disposed between the power device 1301 and the rear wall 1111 of the main housing 111 (see Figure 7 or Figure 10 (As shown). For example, a first thermally conductive layer 151 can be provided between some high-power, high-heat-generating power devices 1301 (such as transistors, diodes, high-power inductors, etc.) and the rear wall 1111 of the main casing 111. The heat generated by these power devices 1301 is quickly transferred to the main casing 111 through the first thermally conductive layer 151, and the heat is quickly dissipated through natural convection. This improves the heat dissipation efficiency of these power devices 1301 and ensures the operational reliability and service life of these power devices 1301.

[0104] For example, the first thermally conductive layer 151 may be a thermally conductive adhesive disposed between the first circuit board 131 and the rear wall 1111 of the main housing 111, or the first thermally conductive layer 151 may be a thermally conductive pad disposed between the first circuit board 131 and the rear wall 1111 of the main housing 111. The thermally conductive pad may include an elastic matrix (e.g., silicone matrix, acrylic matrix, polyurethane matrix, etc.) and a thermally conductive filler (e.g., alumina, zinc oxide, aluminum nitride, boron nitride, etc.) filled in the elastic matrix. When the first thermally conductive layer 151 is disposed between the power device 1301 on the first circuit board 131 and the rear wall 1111 of the main housing 111, the first thermally conductive layer 151 may also be a potting compound encapsulating the power device 1301.

[0105] Continue to refer to Figure 6 As shown, a heat-conducting plate 140 can also be provided inside the housing 110 of the power converter 100. The heat-conducting plate 140 can be disposed along a first direction on the side of the first circuit board 131 facing away from the rear wall 1111 of the main housing 111. The heat-conducting plate 140 can be made of a metal material with good thermal conductivity, such as aluminum or copper. The heat-conducting plate 140 can be attached to the side of the first circuit board 131 facing away from the rear wall 1111 of the main housing 111, and the heat-conducting plate 140 is connected to the housing 110, for example, the heat-conducting plate 140 is connected to the left wall 1114 and the right wall 1115 of the main housing 111. The heat generated by the first circuit board 131 can be conducted to the heat-conducting plate 140, and then transferred to the housing 110, such as the main housing 111, through the heat-conducting plate 140, and finally dissipated to the outside through natural convection. In this way, the heat dissipation efficiency of the first circuit board 131 can be improved, ensuring the working performance of the first circuit board 131.

[0106] A thermally conductive layer 150 may be disposed between the heat-conducting plate 140 and the first circuit board 131. For ease of explanation, in this embodiment, the thermally conductive layer 150 between the heat-conducting plate 140 and the first circuit board 131 is defined as a second thermally conductive layer 152. The second thermally conductive layer 152 can fill the gap between the heat-conducting plate 140 and the first circuit board 131, compensate for structural defects such as flatness, protrusions, and pits in the heat-conducting plate 140 and the first circuit board 131, and transfer the heat generated by the first circuit board 131 to the heat-conducting plate 140. The second thermally conductive layer 152 may be, for example, thermally conductive adhesive, thermally conductive pad, or potting compound, etc., which will not be described in detail here.

[0107] With this configuration, one side of the first circuit board 131 can be attached to the rear wall 1111 of the main housing 111, and the heat transferred from the first circuit board 131 can be quickly dissipated through the heat dissipation fins 320 on the outer wall of the main housing 111. Simultaneously, the other side of the first circuit board 131 can be attached to the heat-conducting plate 140, which can also conduct heat from the first circuit board 131 to the housing 110 and dissipate it to the outside. Therefore, the first circuit board 131 has two heat conduction paths, which can significantly improve the heat dissipation efficiency of the first circuit board 131, resulting in better heat dissipation, more stable operation, and higher reliability.

[0108] Combination Figure 5 and Figure 6 As shown, in some embodiments, the circuit board 130 disposed within the housing 110 of the power converter 100 may further include a second circuit board 132, which is disposed near the front cover 112 of the housing 110. The second circuit board 132 may be disposed in a first direction on the side of the heat-conducting plate 140 facing away from the first circuit board 131, with the heat-conducting plate 140 located between the first circuit board 131 and the second circuit board 132.

[0109] Similar to the first circuit board 131, the power devices 1301 of the second circuit board 132 can be all integrated on one side of the second circuit board 132, or the power devices 1301 of the second circuit board 132 can be distributed on both sides of the second circuit board 132. When all the power devices 1301 of the first circuit board 131 are integrated on one side of the first circuit board 131, and all the power devices 1301 of the second circuit board 132 are integrated on one side of the second circuit board 132, the space occupied by the first circuit board 131, the second circuit board 132, and the heat-conducting plate 140 in the first direction can be minimized.

[0110] At this time, for the second circuit board 132 located on the rear wall 1111 of the main shell 111, which is far from the housing 110, and near the front shell of the housing 110, the heat-conducting plate 140 can serve as the mounting base for the second circuit board 132. The second circuit board 132 can be fixedly connected to the heat-conducting plate 140 to secure it within the housing 110. Simultaneously, the heat-conducting plate 140, as a partition structure between the first circuit board 131 and the second circuit board 132, also serves to isolate the first circuit board 131 and the second circuit board 132, preventing them from scratching or colliding due to vibration. In some cases, it can also act as a shield, ensuring the operational reliability of the first circuit board 131 and the second circuit board 132.

[0111] Figure 7 This is a layout diagram of a power converter provided in an embodiment of this application. Figure 7 This diagram is mainly used to illustrate the component layout structure inside the housing 110 of the power converter 100. Therefore, the converter heat dissipation teeth 320 provided on the outer wall of the housing 110 are omitted and should not be interpreted as limiting the actual structure of the power converter 100.

[0112] Reference Figure 7 As shown, when a second circuit board 132 is also disposed within the housing 110 of the power converter 100, in some embodiments, the surface of the heat-conducting plate 140 facing the second circuit board 132 can be attached to the second circuit board 132. Furthermore, the heat generated by the second circuit board 132 can be conducted to the heat-conducting plate 140, which then transfers the heat to the housing 110, and finally dissipates the heat to the outside through the housing 110. This improves the heat dissipation performance of the second circuit board 132, ensuring the stability and reliability of the second circuit board 132 during operation.

[0113] A thermally conductive layer 150 may also be provided between the heat-conducting plate 140 and the second circuit board 132. For ease of explanation, this embodiment defines the thermally conductive layer 150 between the heat-conducting plate 140 and the second circuit board 132 as a third thermally conductive layer 153. The third thermally conductive layer 153 can fill the gap between the heat-conducting plate 140 and the second circuit board 132, transferring the heat generated by the second circuit board 132 to the heat-conducting plate 140. The third thermally conductive layer 153 may be, for example, thermally conductive adhesive, thermally conductive pad, or potting compound, etc., which will not be described in detail here.

[0114] In other embodiments, the heat-conducting plate 140 may also be attached to only one of the first circuit board 131 and the second circuit board 132.

[0115] Based on this, the side of the second circuit board 132 opposite to the heat-conducting plate 140 can be attached to the housing 110 of the power converter 100, for example, the second circuit board 132 can be attached to the front cover 112 of the housing 110. A heat-conducting layer 150 can also be provided between the contact surfaces of the second circuit board 132 and the housing 110 to transfer the heat generated by the second circuit board 132 to the housing 110. When one side of the second circuit board 132 is attached to the heat-conducting plate 140 and the other side of the second circuit board 132 is attached to the housing 110, the second circuit board 132 has two heat conduction paths, which can significantly improve the heat dissipation efficiency of the second circuit board 132.

[0116] Among them, such as Figure 7 As shown, a boss 141 can be provided on the surface of the heat-conducting plate 140, and a heat-conducting layer 150 can be disposed between the boss 141 and the corresponding circuit board 130. There is usually a certain gap between the heat-conducting plate 140 and the circuit board 130, especially when there is no power device 1301 on the side of the circuit board 130 facing the heat-conducting plate 140, the gap between them is relatively large. By providing a boss 141 protruding towards the circuit board 130 on the surface of the heat-conducting plate 140, the gap between the heat-conducting plate 140 and the circuit board 130 can be reduced, providing suitable filling space for the heat-conducting layer 150. In this way, a stable and reliable fit can be achieved between the heat-conducting plate 140 and the circuit board 130 through the heat-conducting layer 150. At the same time, it can also prevent the heat-conducting layer 150 from being too thick due to the excessive gap between the heat-conducting plate 140 and the circuit board 130, thus avoiding the thickness of the heat-conducting layer 150 from affecting its own heat transfer performance, and ensuring that the heat-conducting layer 150 can quickly and effectively transfer the heat of the circuit board 130 to the heat-conducting plate 140.

[0117] Furthermore, the boss 141 alters the shape, thickness, and other characteristics of a local area of ​​the heat-conducting plate 140, which helps to improve the structural strength and reliability of the heat-conducting plate 140. When the second circuit board 132 is connected to the heat-conducting plate 140, the stability and reliability of the second circuit board 132 can also be improved.

[0118] Furthermore, the position of the boss 141 on the heat-conducting plate 140 is not specifically limited in this embodiment. For example, the boss 141 can be correspondingly positioned with high-power, high-heat-generating power devices 1301 (such as the aforementioned transistors, diodes, high-power inductors, etc.) on the circuit board 130, and the heat-conducting layer 150 can be disposed between these power devices 1301 and the boss 141. This allows the heat from these power devices 1301 to be quickly dissipated through the heat-conducting plate 140, ensuring the operating performance of these power devices 1301. Alternatively, the boss 141 can also be correspondingly positioned with local high-power circuit areas (such as drive circuits, rectifier circuits, etc.) on the circuit board 130, and the heat-conducting layer 150 can be disposed between the local high-power circuit areas and the boss 141.

[0119] When the two side surfaces of the heat-conducting plate 140 are respectively attached to the first circuit board 131 and the second circuit board 132, protrusions 141 can be provided on both side surfaces of the heat-conducting plate 140. The heat-conducting plate 140 as a whole can be suspended between the first circuit board 131 and the second circuit board 132. There are gaps between the heat-conducting plate 140 and the first circuit board 131, and between the heat-conducting plate 140 and the second circuit board 132, and the protrusions 141 provided on both side surfaces of the heat-conducting plate 140 are attached to the first circuit board 131 and the second circuit board 132 respectively.

[0120] In some examples, when the power device 1301 is disposed on the surface of the heat-conducting plate 140 facing the circuit board 130, there is a large gap between the circuit board 130 and the heat-conducting plate 140. In this case, the surface of the heat-conducting plate 140 facing the circuit board 130 may not have a boss 141, and the surface of the heat-conducting plate 140 may maintain a planar structure. The heat-conducting layer 150 may be disposed between the planar surface of the heat-conducting plate 140 and the power device 1301 of the circuit board 130.

[0121] Figure 8 This is a schematic diagram of the main housing of a power converter provided in an embodiment of this application. (Refer to...) Figure 8 As shown, for ease of description, in this embodiment of the application, the heat dissipation teeth 300 located on the outer surface of the rear wall 1111 in the main housing 111 of the power converter 100 are defined as main heat dissipation teeth 321. Furthermore, one end of the main heat dissipation tooth 321 connected to the outer surface of the rear wall 1111 of the main housing 111 is defined as the connecting end of the main heat dissipation tooth 321, and the end of the main heat dissipation tooth 321 away from the rear wall 1111 of the main housing 111 is defined as the free end of the main heat dissipation tooth 321.

[0122] The main heat dissipation fins 321 can extend between the top and bottom ends of the rear wall 1111 of the main housing 111, and the extension direction of the main heat dissipation fins 321 can be inclined to the width direction of the integrated optical storage unit 10. Figure 8 (as shown in the Y direction) so that air can flow more smoothly between the bottom and top of the main heat dissipation tooth 321.

[0123] For example, the main heat dissipation fins 321 can be along the height direction of the integrated photovoltaic and energy storage unit 10 ( Figure 8 As shown in the Z direction, the airflow channel formed by adjacent main heat dissipation teeth 321 also extends along the Z direction. This allows air to flow more smoothly within the airflow channel formed by the main heat dissipation teeth 321. The airflow velocity on the surface of the main heat dissipation teeth 321 is faster, resulting in higher heat dissipation efficiency and better heat dissipation of the power converter 100. Furthermore, it reduces the impact of air on the main heat dissipation teeth 321, which helps improve the reliability of the main heat dissipation teeth 321 and extends the overall service life of the main housing 111.

[0124] like Figure 8 As shown in the embodiment of this application, the outer surface of the rear wall 1111 of the main shell 111 is provided with a high heat dissipation tooth area 113 and a low heat dissipation tooth area 114. Along the first direction ( Figure 8 (As shown in the X direction), the height of the main heat dissipation teeth 321 in the high heat dissipation tooth area 113 is greater than the height of the main heat dissipation teeth 321 in the low heat dissipation tooth area 114. In this way, the main heat dissipation teeth 321 on the outer surface of the rear wall 1111 of the main shell 111 are staggered in height, and the ends of the main heat dissipation teeth 321 away from the rear wall 1111 of the main shell 111 are not located in the same vertical plane.

[0125] It should be noted that the height of the main heat dissipation tooth 321 mentioned here refers to the degree of extension of the main heat dissipation tooth 321, which can be considered as the extension height of the main heat dissipation tooth 321 relative to a certain reference vertical plane (such as the central vertical plane of the front cover 112 in the first direction). The comparison is the distance between the vertical plane where the free end of the main heat dissipation tooth 321 is located and the reference vertical plane, and does not limit the tooth height of the main heat dissipation tooth 321 itself (the distance from the connecting end of the main heat dissipation tooth 321 to the free end of the main heat dissipation tooth 321).

[0126] Furthermore, the so-called main heat dissipation teeth 321 in the high heat dissipation tooth region 113 and the main heat dissipation teeth 321 in the low heat dissipation tooth region 114 are defined according to the degree of extension of the main heat dissipation teeth 321 in different regions, and are not mechanically understood to mean that the main heat dissipation teeth 321 in the high heat dissipation tooth region 113 and the main heat dissipation teeth 321 in the low heat dissipation tooth region 114 are necessarily different. When the main heat dissipation teeth 321 extend continuously between the top and bottom ends of the rear wall 1111 of the main shell 111, a part of the same main heat dissipation teeth 321 may be located in the high heat dissipation tooth region 113 and another part may be located in the low heat dissipation tooth region 114.

[0127] By providing a high-heat-dissipation tooth area 113 and a low-heat-dissipation tooth area 114 on the outer surface of the rear wall 1111 of the main housing 111, the main heat dissipation teeth 321 on the outer surface of the rear wall 1111 form a staggered structure. The heat dissipation teeth 300 in the high-heat-dissipation tooth area 113 have a larger overall surface area, increasing the heat dissipation area of ​​the power converter 100 in the high-heat-dissipation tooth area 113, thus enhancing the heat dissipation capacity of the power converter 100 in the high-heat-dissipation tooth area 113. The high-heat-dissipation tooth area 113 can be correspondingly arranged with high-power, high-heat-generating power devices 1301 arranged on the first circuit board 131 inside the housing 110. By increasing the heat dissipation area of ​​the high-heat-dissipation tooth area 113, the heat dissipation efficiency of the power devices 1301 arranged in the corresponding area is enhanced. Thus, the overall temperature uniformity of the power converter 100 is enhanced, ensuring the working performance of the high-power, high-heat-generating power devices 1301, and improving the stability and reliability of the power converter 100 during operation.

[0128] At least a portion of the low-heat-dissipation serrations 114 are provided on the outer surface of the rear wall 1111 of the main housing 111, which can correspond to the low-power, low-heat-generating power devices 1301 provided on the first circuit board 131 inside the housing 110. In this way, the low-heat-dissipation serrations 114, by reducing the height of the main heat dissipation serrations 321, can meet the heat dissipation requirements of the corresponding area on the first circuit board 131, ensuring the operating performance of the power devices 1301 in the corresponding area. Simultaneously, it can reduce the overall weight and cost of the heat dissipation serrations 300 of the power converter 100, which is beneficial for the lightweight design of the power converter 100 and also reduces the production cost of the power converter 100.

[0129] Furthermore, the main heat dissipation fins 321 create a height difference between the low heat dissipation fin area 114 and the high heat dissipation fin area 113. The reduced space of the main heat dissipation fins 321 in the low heat dissipation fin area 114 compared to the main heat dissipation fin area 113 forms an air intake space. This air intake space increases airflow, allowing more air to enter the high heat dissipation fin area 113. This further enhances the heat dissipation efficiency of the high heat dissipation fin area 113, further improving the heat dissipation capacity of the power converter 100. This results in more balanced heat dissipation and better temperature uniformity in the power converter 100, and also increases the operational reliability of the first circuit board 131.

[0130] Continue to refer to Figure 8 In some embodiments, the low heat dissipation tooth region 114 provided on the outer surface of the rear wall 1111 of the main housing 111 may include a first low heat dissipation tooth region 1141 and a second low heat dissipation tooth region 1142. The first low heat dissipation tooth region 1141 and the high heat dissipation tooth region 113 may be along the second direction (the width direction of the integrated optical storage unit 10). Figure 8 The first low-heat-dissipation tooth region 1141 and the second low-heat-dissipation tooth region 1142 can be arranged along a third direction (the height direction of the integrated photovoltaic storage unit 10). Figure 8 The first low heat dissipation tooth region 1141 is arranged in the Z direction. Furthermore, the second low heat dissipation tooth region 1142 is located below the first low heat dissipation tooth region 1141 in the third direction.

[0131] The main heat dissipation teeth 321 of the high heat dissipation tooth region 113 can extend from the upper end of the rear wall 1111 of the main housing 111 to the lower end of the rear wall 1111. The high heat dissipation tooth region 113 occupies at least the upper space of the rear wall 1111 in the third direction. For example, high-power, high-heat-generating power devices 1301 on the first circuit board 131 inside the housing 110 can be concentrated and arranged, and at least a portion of the area on the rear wall 1111 of the main housing 111 corresponding to these power devices 1301 can be set as the high heat dissipation tooth region 113.

[0132] The first low-heat dissipation tooth region 1141 is located on the upper part of the rear wall 1111 of the main shell 111. A height difference is formed between the first low-heat dissipation tooth region 1141 and the high-heat dissipation tooth region 113, which are adjacent to each other along the second direction. The reduced space between the main heat dissipation teeth 321 of the first low-heat dissipation tooth region 1141 and the main heat dissipation teeth 321 of the high-heat dissipation tooth region 113 forms an air intake space. This allows more air to enter the air intake space between the first low-heat dissipation tooth region 1141 and the high-heat dissipation tooth region 113, thereby improving the heat dissipation efficiency of the first low-heat dissipation tooth region 1141. Furthermore, the air entering the air intake space between the first low-heat dissipation tooth region 1141 and the high-heat dissipation tooth region 113 can contact the surface of the heat dissipation fins of the high-heat dissipation tooth region 113, also improving the heat dissipation efficiency of the high-heat dissipation tooth region 113.

[0133] The second low-heat dissipation tooth region 1142 is located at the lower part of the rear wall 1111 of the main casing 111. A height difference is formed between the second low-heat dissipation tooth region 1142 and the high-heat dissipation tooth region 113. The space reduced by the main heat dissipation tooth 321 of the second low-heat dissipation tooth region 1142 compared to the main heat dissipation tooth 321 of the high-heat dissipation tooth region 113 forms an air intake space. In this way, more air will enter the air intake space formed between the second low-heat dissipation tooth region 1142 and the high-heat dissipation tooth region 113.

[0134] When the second low-heat-dissipation tooth region 1142 is adjacent to the high-heat-dissipation tooth region 113 in the second direction, more air can enter the second low-heat-dissipation tooth region 1142. Simultaneously, the airflow over the surface of the main heat-dissipation tooth 321 of the adjacent high-heat-dissipation tooth region 113 can be increased, thereby improving the heat dissipation efficiency of both the second low-heat-dissipation tooth region 1142 and the adjacent high-heat-dissipation tooth region 113. When the high-heat-dissipation tooth region 113 is located above the second low-heat-dissipation tooth region 1142 in the third direction, more air can enter the high-heat-dissipation tooth region 113 from the air intake space, thereby improving the heat dissipation efficiency of the high-heat-dissipation tooth region 113. Thus, the overall heat dissipation efficiency and heat dissipation uniformity of the power converter 100 can be improved.

[0135] For example, such as Figure 8 As shown, the first low-heat-dissipation tooth region 1141 and the high-heat-dissipation tooth region 113 can be arranged alternately along the second direction. This creates multiple spaced air intake spaces on the upper part of the rear wall 1111 of the main casing 111, increasing the airflow and improving the heat dissipation effect. Furthermore, the width of each air intake space on the upper part of the rear wall 1111 is relatively small, resulting in a higher airflow velocity, which significantly contributes to the improved heat dissipation efficiency of the upper part of the rear wall 1111. Additionally, the overall distribution of the main heat dissipation teeth 321 on the upper part of the rear wall 1111 is more balanced, leading to a more balanced weight distribution and higher reliability of the main casing 111.

[0136] The second low heat dissipation tooth area 1142 can occupy at least the lower part of the rear wall 1111 on both sides in the second direction, so as to increase the airflow from the left and right sides of the main shell 111 and improve the overall heat dissipation capacity of the main shell 111.

[0137] Among them, such as Figure 8 As shown, the second low-heat dissipation tooth region 1142 can occupy the entire lower space of the rear wall 1111 of the main housing 111 in the second direction, while the high-heat dissipation tooth region 113 only occupies the upper space of the rear wall 1111 in the third direction. Thus, the second low-heat dissipation tooth region 1142 forms an air intake space in the entire lower space of the rear wall 1111 of the main housing 111, significantly increasing the airflow to the high-heat dissipation tooth region 113 located in the upper space of the rear wall 1111, and significantly improving the heat dissipation efficiency of the high-heat dissipation tooth region 113. At this time, the high-power, high-heat-generating power devices 1301 on the first circuit board 131 inside the housing 110 can all be concentrated in the upper space of the housing 110.

[0138] In other examples, the second low-heat-dissipation tooth region 1142 may occupy only a portion of the lower space of the rear wall 1111 in the second direction, and at least a portion of the high-heat-dissipation tooth region 113 may extend into the lower space of the rear wall 1111. This increases the space occupied by the high-heat-dissipation tooth region 113 on the rear wall 1111, increasing the overall heat dissipation area of ​​the rear wall 1111 and effectively improving the heat dissipation efficiency of the main casing 111. In this case, the high-power, high-heat-generating power device 1301 on the first circuit board 131 inside the casing 110 may be partially located in the upper space of the casing 110 and partially located in the lower space of the casing 110.

[0139] Furthermore, the second low-heat-generating tooth region 1142 can be configured to correspond to the low-power, low-heat-generating power device 1301 on the first circuit board 131 within the housing 110. Not only is the height (extension height) of the main heat-generating tooth 321 in the second low-heat-generating tooth region 1142 lower than the height of the main heat-generating tooth 321 in the high-heat-generating tooth region 113, but the tooth height (distance between the connecting end and the free end of the main heat-generating tooth 321) of the main heat-generating tooth 321 in the second low-heat-generating tooth region 1142 is also lower than the tooth height of the main heat-generating tooth 321 in the high-heat-generating tooth region 113. Thus, the second low-heat-generating tooth region 1142 can meet the heat dissipation requirements of the low-power, low-heat-generating power device 1301. Simultaneously, the second low-heat-generating tooth region 1142 can reduce the overall weight and cost of the main heat-generating tooth 321 on the main housing 111.

[0140] Continue to refer to Figure 8 For the main heat dissipation teeth 321 disposed on the outer surface of the rear wall 1111 of the main housing 111 as a whole, along the second direction ( Figure 8(As shown in the Y direction), the spacing of the main heat dissipation fins can be the same. In this way, the main heat dissipation fins 321 are evenly distributed on the rear wall 1111 of the main shell 111, resulting in a more uniform heat dissipation effect on the entire rear wall 1111, allowing heat to be quickly and effectively dissipated to the outside. Furthermore, the air pressure on the rear wall 1111 of the main shell 111 is also evenly distributed, resulting in good stress resistance and high reliability of the main shell 111, which helps extend the service life of the main shell 111.

[0141] like Figure 8 As shown, in some implementations, for the direction along a third party ( Figure 8 The high heat dissipation tooth region 113 and the second low heat dissipation tooth region 1142 (shown in the Z direction) are arranged vertically. The main heat dissipation teeth in the high heat dissipation tooth region 113 and the corresponding main heat dissipation teeth in the second low heat dissipation tooth region 1142 can be integrally formed. That is, the main heat dissipation teeth in the high heat dissipation tooth region 113 and the corresponding main heat dissipation teeth in the second low heat dissipation tooth region 1142 can be a continuous extending piece of the same main heat dissipation tooth, with the lower part of the main heat dissipation tooth located in the second low heat dissipation tooth region 1142 and the upper part of the main heat dissipation tooth located in the high heat dissipation tooth region 113. In this way, the extension length of the main heat dissipation tooth in the third direction is longer, which is beneficial to increasing the heat dissipation area of ​​the main heat dissipation tooth and improving the heat dissipation effect of the main heat dissipation tooth. Furthermore, it can also enhance the structural strength and reliability of the main shell 111.

[0142] Similarly, for the first low-heat dissipation tooth region 1141 and the second low-heat dissipation tooth region 1142 arranged vertically along a third direction, the main heat dissipation teeth in the first low-heat dissipation tooth region 1141 and the corresponding main heat dissipation teeth in the second low-heat dissipation tooth region 1142 can be integrally formed. The main heat dissipation teeth in the first low-heat dissipation tooth region 1141 and the corresponding main heat dissipation teeth in the second low-heat dissipation tooth region 1142 can be the same continuous main heat dissipation tooth, with the lower part of the main heat dissipation tooth located within the second low-heat dissipation tooth region 1142 and the upper part of the main heat dissipation tooth located within the first low-heat dissipation tooth region 1141. Further details are omitted here.

[0143] In other embodiments, for the high heat dissipation tooth region 113 and the second low heat dissipation tooth region 1142 arranged vertically along a third direction, the main heat dissipation teeth of the high heat dissipation tooth region 113 and the main heat dissipation teeth of the second low heat dissipation tooth region 1142 can be correspondingly arranged in the third direction. The projections of the main heat dissipation teeth of the high heat dissipation tooth region 113 and the main heat dissipation teeth of the second low heat dissipation tooth region 1142 in the third direction coincide, but the main heat dissipation teeth of the high heat dissipation tooth region 113 and the main heat dissipation teeth of the second low heat dissipation tooth region 1142 are separated from each other, and there can be a gap between the main heat dissipation teeth of the high heat dissipation tooth region 113 and the main heat dissipation teeth of the second low heat dissipation tooth region 1142. In this way, an air intake space is formed between the high heat dissipation tooth region 113 and the second low heat dissipation tooth region 1142 in the third direction, which can increase the air intake volume of the high heat dissipation tooth region 113 and the second low heat dissipation tooth region 1142, and improve the heat dissipation efficiency and heat dissipation effect of the main casing 111.

[0144] Similarly, for the first low-heat-dissipation tooth region 1141 and the second low-heat-dissipation tooth region 1142 arranged vertically along a third direction, the main heat-dissipation teeth of the first low-heat-dissipation tooth region 1141 and the main heat-dissipation teeth of the second low-heat-dissipation tooth region 1142 can be correspondingly arranged in the third direction. The projections of the main heat-dissipation teeth of the first low-heat-dissipation tooth region 1141 and the main heat-dissipation teeth of the second low-heat-dissipation tooth region 1142 in the third direction coincide, but the main heat-dissipation teeth of the first low-heat-dissipation tooth region 1141 and the main heat-dissipation teeth of the second low-heat-dissipation tooth region 1142 are separated from each other, and there can be a gap between the main heat-dissipation teeth of the first low-heat-dissipation tooth region 1141 and the main heat-dissipation teeth of the second low-heat-dissipation tooth region 1142. Further details are omitted here.

[0145] Continue to refer to Figure 8 In some embodiments, the outer surface of the rear wall 1111 of the main housing 111 may also include a blank area 115. The blank area 115 refers to the area on the outer surface of the rear wall 1111 where the main heat dissipation teeth 321 are not arranged; the blank area 115 can be considered as a region without heat dissipation teeth. Specifically, the blank area 115 may be arranged below the second low heat dissipation tooth region 1142 along a third direction.

[0146] By creating a blank area 115 at the bottom of the outer surface of the rear wall 1111 of the main housing 111, an air intake space is formed between the second low heat dissipation tooth 300 and the battery heat dissipation tooth 310 of the battery pack 200 below. This further increases the bottom airflow of the main heat dissipation tooth 321 on the rear wall 1111, further improving the heat dissipation efficiency and effect of the power converter 100. Furthermore, the blank area 115 increases the airflow to the second low heat dissipation tooth area 1142, improving its heat dissipation efficiency. The reduced space of the main heat dissipation tooth 321 in the second low heat dissipation tooth area 1142 also increases the airflow to the high heat dissipation tooth area 113 above it, improving its heat dissipation efficiency. This transitional design effectively improves the overall heat dissipation uniformity of the power converter 100.

[0147] Continue to refer to Figure 8 In some embodiments, heat dissipation teeth 300 may also be distributed on the outer surface of the top wall 1112 of the main shell 111. For ease of description, the heat dissipation teeth 300 located on the outer surface of the top wall 1112 of the main shell 111 are defined as top heat dissipation teeth 322 in this embodiment.

[0148] Hot air rises and accumulates at the top of the housing 110. By providing top heat dissipation fins 322 on the outer surface of the top wall 1112 of the main housing 111, the heat dissipation area and convection effect of the top wall 1112 of the main housing 111 can be increased, thereby dissipating the heat accumulated at the top of the housing 110 to the outside more quickly and thoroughly. This further improves the overall heat dissipation efficiency and uniformity of the power converter 100.

[0149] For example, the top heat dissipation denticles 322 provided on the top wall 1112 of the main shell 111 can be connected to the top ends of at least some of the main heat dissipation denticles 321 provided on the rear wall 1111 of the main shell 111. In this way, the heat dissipation area of ​​at least some of the main heat dissipation denticles 321 is increased, and the length of the flow channel formed between adjacent main heat dissipation denticles 321 is also increased, which can further improve the heat dissipation efficiency of the main heat dissipation denticles 321.

[0150] Figure 9 for Figure 8 The top view of the main casing of the power converter in the diagram. Figure 10 This is a schematic diagram of the architecture of a power converter provided in an embodiment of this application. Figure 10 It is mainly used to illustrate the spatial architecture of the power converter 100 in the upper part of the third direction, to show the matching design of the main heat dissipation tooth 321 and the first circuit board 131 in the housing 110, and should not be construed as limiting the actual structure of the power converter 100.

[0151] Combination Figure 9 and Figure 10 As shown, along the first direction ( Figure 9 and Figure 10 As shown in the X direction, power devices 1301 of different heights are disposed on the first circuit board 131 inside the housing 110, and different regions of the rear wall 1111 of the main housing 111 therefore have different shapes. Specifically, in the regions corresponding to the power devices 1301 with higher heights along the first direction on the first circuit board 131 (e.g., inductors, capacitors, etc.), the thickness of the main housing 111 along the first direction is also greater, and the rear wall 1111 of the main housing 111 is further away from the front cover 112 in these regions. In the regions corresponding to the power devices 1301 with lower heights along the first direction on the first circuit board 131 (e.g., transistors, diodes, etc.), the thickness of the main housing 111 along the first direction is also smaller, and the rear wall 1111 of the main housing 111 is closer to the front cover 112 in these regions. In other words, the rear wall 1111 of the main housing 111 has recessed regions, which correspond to the lower-height power devices 1301 on the first circuit board 131.

[0152] In response, the rear wall 1111 of the main shell 111 along the second direction ( Figure 9 and Figure 10 The high heat dissipation tooth region 113 and the first low heat dissipation tooth region 1141 (shown in the Y direction) are arranged to be adapted to the shape and structure of the rear wall 1111 of the main shell 111.

[0153] Specifically, the taller power devices 1301 on the first circuit board 131 can face the high heat dissipation tooth area 113, or in other words, the high heat dissipation tooth area 113 is correspondingly arranged with the taller power devices 1301 on the first circuit board 131. This ensures that the main heat dissipation teeth 321 in the area corresponding to the taller power devices 1301 on the first circuit board 131 have sufficient tooth height, so that the rear wall 1111 of the main housing 111 has a large heat dissipation area in the area where these power devices 1301 are located, guaranteeing the heat dissipation efficiency and effect for these power devices 1301.

[0154] The lower-height power device 1301 on the first circuit board 131 can face the first low heat dissipation tooth area 1141, or in other words, the first low heat dissipation tooth area 1141 is correspondingly arranged with the lower-height power device 1301 on the first circuit board 131. The recessed area on the rear wall 1111 of the main housing 111 provides additional space for the main heat dissipation tooth 321, so that the height of the main heat dissipation tooth 321 in the first low heat dissipation tooth area 1141 is lower than the height of the main heat dissipation tooth 321 in the high heat dissipation tooth area 113, thus forming an air intake space between the first low heat dissipation tooth area 1141 and the high heat dissipation tooth area 113.

[0155] Furthermore, since the first low-heat-dissipation tooth region 1141 is located in the recessed area on the rear wall 1111 of the main housing 111, the additional space provided by the recessed area allows for less restriction on the tooth height of the main heat-dissipation tooth 321 of the first low-heat-dissipation tooth region 1141. The main heat-dissipation tooth 321 of the first low-heat-dissipation tooth region 1141 can still have sufficient tooth height, ensuring that the main heat-dissipation tooth 321 of the first low-heat-dissipation tooth region 1141 has a large heat dissipation area, and also has a good heat dissipation effect on the power device 1301 with a relatively low height on the first circuit board 131.

[0156] For example, the tooth height of the main heat dissipation tooth 321 in the first low heat dissipation tooth region 1141 can be greater than or equal to the tooth height of the main heat dissipation tooth 321 in the high heat dissipation tooth region 113. Thus, compared to the main heat dissipation tooth 321 in the high heat dissipation tooth region 113, the main heat dissipation tooth 321 in the first low heat dissipation tooth region 1141 has a comparable or larger heat dissipation area. The heat dissipation efficiency of the first low heat dissipation tooth region 1141 for the lower-height power devices 1301 on the first circuit board 131 is no less than the heat dissipation efficiency of the high heat dissipation tooth region 113 for the higher-height power devices 1301 on the first circuit board 131. Especially when the lower-height power devices 1301 on the first circuit board 131 are high-power devices 1301 such as transistors and diodes, the heat dissipation effect and reliability of these power devices 1301 can be guaranteed.

[0157] Figure 11 A front view of the main housing of another power converter provided in an embodiment of this application. Figure 12 A front view of the main housing of another power converter provided in an embodiment of this application. (Refer to...) Figure 11 and Figure 12 As shown, in this embodiment of the application, the rear wall 1111 of the main shell 111 can also be modified in the second direction ( Figure 11 and Figure 12 The structure of the main heat dissipation teeth 321 in the two sides of the Y direction shown in the figure is improved, and the airflow guide area 116 is formed in the lower part of the rear wall 1111 of the main shell 111 in the two sides of the second direction. This is to further increase the air intake on the left and right sides of the rear wall 1111 of the main shell 111 and improve the heat dissipation efficiency of the rear wall 1111 of the main shell 111.

[0158] As previously mentioned, the lower part of the rear wall 1111 of the main housing 111 can be occupied by the second low heat dissipation tooth region 1142 on both sides in the second direction. Therefore, the following description will take the example of the flow guiding region 116 being located in the second low heat dissipation tooth region 1142. The flow guiding region 116 may include a portion of the main heat dissipation tooth 321 in the second low heat dissipation tooth region 1142.

[0159] like Figure 11As shown, as an example, in the second direction from the middle of the rear wall 1111 of the main housing 111 to both sides of the rear wall 1111, the distance between the main heat dissipation fins 321 in the guide zone 116 and the bottom end of the main housing 111 gradually increases. Thus, the guide zone 116 effectively forms a toothless area on the lower left and right sides of the rear wall 1111, and this toothless area gradually expands towards the left and right sides of the main housing 111. This allows air to be guided from both sides of the housing 110 into the guide zone 116, thereby increasing the airflow on both sides of the main heat dissipation fins 321 on the rear wall 1111 of the main housing 111, further improving the heat dissipation efficiency of the power converter 100.

[0160] When the rear wall 1111 of the main shell 111 has a blank area 115 at the bottom in the third direction, the non-heat dissipation tooth area formed by the flow guide area 116 can be considered as an expansion of the blank area 115, so that the size of the blank area 115 on the left and right sides in the second direction gradually increases.

[0161] like Figure 12 As shown, as another example, the bottom of the heat dissipation fins 300 located in the airflow guiding area 116 may have a bent section 3211, which is inclined towards the sidewall of the corresponding side of the main housing 111. Furthermore, in the second direction from the middle of the rear wall 1111 of the main housing 111 to both sides of the rear wall 1111, the inclination angle of the bent sections 3211 of each main heat dissipation fin 321 in the airflow guiding area 116 increases sequentially. The bent sections 3211 make the airflow channel formed by adjacent main heat dissipation fins 321 in the airflow guiding area 116 "flared". That is, in the section where the bent sections 3211 are located, the width of the airflow channel gradually increases along the direction pointing towards the bottom of the main housing 111. This increases the airflow volume on both sides of the main heat dissipation fins 321 on the rear wall 1111 of the main housing 111, improving the heat dissipation efficiency of the power converter 100.

[0162] Based on this, in the second direction from the middle of the rear wall 1111 of the main housing 111 to both sides of the rear wall 1111, the length of the bent section 3211 of the main heat dissipation tooth 321 in the airflow guiding area 116 is successively shortened. On the one hand, since the bent section 3211 of the main heat dissipation tooth 321 is inclined towards the side wall of the main housing 111, by successively shortening the length of the bent section 3211 of each main heat dissipation tooth 321, the bottom end of the bent section 3211 of the main heat dissipation tooth 321 can be prevented from extending beyond the rear wall 1111 of the main housing 111, so that the main heat dissipation tooth 321 of the airflow guiding area 116 is completely connected to the rear wall 1111 of the main housing 111. This ensures the connection reliability of the main heat dissipation tooth 321 and also prevents the main heat dissipation tooth 321 from interfering with the peripheral space of the integrated photovoltaic storage unit 10. On the other hand, it also helps to leave more areas without heat dissipation teeth at the bottom of the rear wall 1111 of the main housing 111, further increasing the air intake at the bottom of the rear wall 1111.

[0163] Figure 13 This is a schematic diagram of the structural framework of the integrated photovoltaic and energy storage system provided in the embodiments of this application. Specifically, to clearly illustrate the architecture of the power converter 100, Figure 13 The diagram only shows one battery pack 200 located below the power converter 100. In practical applications, the integrated photovoltaic and energy storage unit 10 may include multiple battery packs 200 stacked sequentially. Additionally, Figure 13 The diagram mainly illustrates the overall framework structure of the integrated photovoltaic and energy storage unit 10, and should not be interpreted as limiting the actual structure of the integrated photovoltaic and energy storage unit 10.

[0164] Reference Figure 13 As shown in the figure, the main heat dissipation teeth 321 disposed on the rear wall 1111 of the housing 110 of the power converter 100, for the main heat dissipation teeth 321 whose lower part is located in the second low heat dissipation tooth region 1142 and whose upper part is located in the high heat dissipation tooth region 113, at least a portion of these main heat dissipation teeth 321 may be provided with a notch 3212. The notch 3212 may be located at the transition between the second low heat dissipation tooth region 1142 and the high heat dissipation tooth region 113.

[0165] Air flows upward along the main heat dissipation teeth 321 of the second low heat dissipation tooth region 1142. The notch 3212 located between the second low heat dissipation tooth region 1142 and the high heat dissipation tooth region 113 can guide the airflow, causing it to flow further towards the outer surface of the rear wall 1111 of the main housing 111. Thus, the airflow rate entering the guide channel between adjacent main heat dissipation teeth 321 in the high heat dissipation tooth region 113 is greater, further enhancing the heat dissipation efficiency of the high heat dissipation tooth region 113. Furthermore, the airflow can flow more evenly across the various regions of the main heat dissipation teeth 321 in the high heat dissipation tooth region 113, improving the heat dissipation uniformity of the high heat dissipation tooth region 113. Consequently, the heat dissipation efficiency and heat dissipation uniformity of the power converter 100 are improved.

[0166] Figure 14 This is a side view of the integrated optical storage unit provided in an embodiment of this application. Figure 14 The diagram only shows the power converter 100 and a battery pack 200 located below the power converter 100. In practical applications, the integrated photovoltaic and energy storage unit 10 may include multiple battery packs 200 stacked sequentially.

[0167] Reference Figure 14 As shown, in the power converter 100, for the width direction of the integrated photovoltaic storage unit 10 (the aforementioned second direction), Figure 14 The decorative covers 120 (shown in the Y direction) are provided on the left and right sides of the housing 110. At least one of the decorative covers 120 may be provided with an air inlet 121, which may correspond to the low heat dissipation tooth area 114 on the outer surface of the rear wall 1111 of the main housing 111.

[0168] The air inlet 121 avoids obstructing the main heat dissipation fins 321 of the low heat dissipation fin area 114, preventing air from entering the space where the main heat dissipation fins 321 are located on the rear wall 1111 from the side of the housing 110. This allows more air to enter the air intake space formed by reducing the height of the main heat dissipation fins 321 in the low heat dissipation fin area 114, ensuring the air intake volume of the main housing 111. For example, the air inlet 121 can be located at the lower part of the decorative cover 120, and the air inlet 121 can be correspondingly arranged with the second low heat dissipation fin area 1142 on the rear wall 1111 of the main housing 111.

[0169] Meanwhile, the air inlet 121 can also avoid some electronic components that need to be electrically connected to the outside world, which are installed on the left wall 1114 and / or right wall 1115 of the housing 110. Cables, wires, etc. can be used to pass through the air inlet 121 to realize the electrical connection between these electronic components and external devices.

[0170] When only one side wall of the housing 110 requires electronic components to be electrically connected to external devices, an air inlet 121 can be provided on the decorative cover 120 on one side of the housing 110. This air inlet 121 can both allow the electronic components to exit and allow air to enter the main heat dissipation fins 321 from the side of the housing 110. Alternatively, air inlets 121 can be provided on both sides of the decorative cover 120 of the housing 110, which can meet the requirement of exiting the wiring on both sides of the housing 110 and increase the air intake of the main heat dissipation fins 321.

[0171] Continue to refer to Figure 14 In some embodiments, the height of the main heat dissipation tooth 321 of the high heat dissipation tooth region 113 of the power converter 100 can be flush with the height of the battery heat dissipation tooth 310 of the battery pack 200. This ensures that the main heat dissipation tooth 321 of the high heat dissipation tooth region 113 has sufficient height, effectively increasing the heat dissipation area of ​​the high heat dissipation tooth region 113 and ensuring its heat dissipation efficiency. Simultaneously, it avoids the main heat dissipation tooth 321 of the high heat dissipation tooth region 113 being obstructed in the thickness direction (first direction) of the photovoltaic-storage integrated machine 10. Figure 14 The additional space occupied in the X direction (as shown in the figure) is beneficial to the overall thinness of the integrated optical and energy storage unit 10 and reduces the space occupied by the integrated optical and energy storage unit 10.

[0172] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A power converter, characterized in that, The device includes a housing, a circuit board is provided inside the housing, a power device is disposed on the circuit board, and the arrangement direction of the circuit board and the rear wall of the housing is a first direction; the circuit board includes a first circuit board, and the side of the first circuit board on which the power device is disposed faces the rear wall of the housing; The outer surface of the rear wall of the housing is provided with a high heat dissipation tooth area and a low heat dissipation tooth area. Along the first direction, the height of the heat dissipation teeth in the high heat dissipation tooth area is greater than the height of the heat dissipation teeth in the low heat dissipation tooth area.

2. The power converter according to claim 1, characterized in that, The low heat dissipation tooth region includes a first low heat dissipation tooth region and a second low heat dissipation tooth region, the first low heat dissipation tooth region and the high heat dissipation tooth region are arranged alternately along a second direction; along a third direction, the second low heat dissipation tooth region is located below the first low heat dissipation tooth region and the high heat dissipation tooth region; wherein, the second direction and the third direction are both perpendicular to the first direction.

3. The power converter according to claim 2, characterized in that, Along the first direction, power devices of different heights are disposed on the first circuit board; the higher power devices face the high heat dissipation tooth area, and the lower power devices face the first low heat dissipation tooth area.

4. The power converter according to claim 3, characterized in that, The tooth height of the heat dissipation teeth in the first low heat dissipation tooth region is greater than or equal to the tooth height of the heat dissipation teeth in the high heat dissipation tooth region.

5. The power converter according to claim 3, characterized in that, The outer surface of the rear wall of the housing also includes a blank area, which is located below the second low heat dissipation tooth area along the third direction.

6. The power converter according to any one of claims 2-5, characterized in that, The second low heat dissipation tooth area is a flow guiding area on both sides in the second direction. In the second direction, it extends from the middle of the rear wall of the housing to both sides of the housing. The distance between the heat dissipation teeth in the flow guiding area and the bottom end of the housing gradually increases.

7. The power converter according to any one of claims 2-5, characterized in that, The second low heat dissipation tooth area has two sides in the second direction as a flow guiding area. The bottom of the heat dissipation tooth in the flow guiding area has a bent section, which is inclined toward the side wall of the housing. Furthermore, in the second direction from the middle of the rear wall of the housing to both sides of the housing, the inclination angle of the bent section of the heat dissipation tooth in the flow guide area increases sequentially.

8. The power converter according to claim 7, characterized in that, In the first direction, from the middle of the rear wall of the housing to both sides of the housing, the length of the bent section of the heat dissipation tooth in the flow guide area decreases sequentially.

9. The power converter according to any one of claims 2-7, characterized in that, At least a portion of the heat dissipation teeth have a notch at the transition between the second low heat dissipation tooth region and the high heat dissipation tooth region.

10. The power converter according to any one of claims 2-9, characterized in that, In the third direction, the heat dissipation teeth of the high heat dissipation tooth region and the heat dissipation teeth of the second low heat dissipation tooth region are integrally formed, and the heat dissipation teeth of the first low heat dissipation tooth region and the heat dissipation teeth of the second low heat dissipation tooth region are integrally formed.

11. The power converter according to any one of claims 2-9, characterized in that, In the third direction, the projections of the heat dissipation teeth in the high heat dissipation tooth region and the heat dissipation teeth in the second low heat dissipation tooth region coincide, and the projections of the heat dissipation teeth in the first low heat dissipation tooth region and the heat dissipation teeth in the second low heat dissipation tooth region also coincide.

12. The power converter according to any one of claims 2-11, characterized in that, Along the second direction, the spacing of the heat dissipation teeth on the outer surface of the rear wall of the housing is the same.

13. The power converter according to any one of claims 1-12, characterized in that, The top wall of the casing has heat dissipation denticles.

14. The power converter according to any one of claims 1-13, characterized in that, A heat-conducting plate is also provided inside the housing. The heat-conducting plate is disposed along the first direction on the side of the first circuit board facing away from the rear wall of the housing. A heat-conducting layer is provided between the heat-conducting plate and the first circuit board.

15. The power converter according to claim 14, characterized in that, The circuit board also includes a second circuit board, which is disposed on the side of the heat-conducting plate opposite to the first circuit board, and a heat-conducting layer is also disposed between the heat-conducting plate and the second circuit board.

16. The power converter according to claim 15, characterized in that, Both sides of the heat-conducting plate are provided with bosses, and the heat-conducting layer is disposed between the bosses and the circuit board.

17. The power converter according to any one of claims 1-16, characterized in that, It also includes a decorative cover, which is disposed on both sides of the housing along the second direction, and at least one side of the decorative cover is provided with an air inlet, which is disposed corresponding to the low heat dissipation tooth area.

18. A photovoltaic-storage integrated machine, characterized in that, It includes multiple battery packs and a power converter as described in any one of claims 1-17, wherein the power converter is stacked on the multiple battery packs.

19. The integrated photovoltaic and energy storage system according to claim 18, characterized in that, Each of the battery packs has heat dissipation teeth on its outer wall, and the heat dissipation teeth in the high heat dissipation tooth area of ​​the power converter are at the same height as the heat dissipation teeth of the battery pack.

20. The integrated photovoltaic and energy storage system according to claim 18, characterized in that, The top of the uppermost battery pack among the plurality of battery packs is provided with a first connection terminal, and the bottom of the power converter is provided with a second connection terminal. The first connection terminal and the second connection terminal are plugged into each other.

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