Air guide device and board card heat dissipation structure

Abstract

The application discloses a wind guide device and a board card heat dissipation structure, and belongs to the technical field of heat dissipation devices. The wind guide device comprises a wind guide cover, a first air inlet channel is arranged on the lower layer of the front end of the wind guide cover, and a second air inlet channel is arranged on the upper layer of the front end of the wind guide cover; a first air outlet channel is arranged on the upper layer of the rear end of the wind guide cover, and a second air outlet channel is arranged on the lower layer of the rear end of the wind guide cover; the first air inlet channel is communicated with the first air outlet channel; the second air inlet channel is communicated with the second air outlet channel; when the wind guide device is installed on the board card, the inlet of the first air inlet channel is arranged towards the heat dissipation area, the outlet of the first air outlet channel is arranged towards the non-sensitive area, the inlet of the second air inlet channel is arranged towards the non-heat dissipation area, and the outlet of the second air outlet channel is arranged towards the heat-sensitive area. The two groups of independent air channels arranged in the upper and lower layers and communicated with each other can guide the hot air in the heat dissipation area to the non-sensitive area and guide the cold air at normal temperature to the heat-sensitive area, and the heat dissipation of the front end of the board card and the protection requirement of the heat-sensitive device at the rear end are considered.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation and airflow technology for circuit boards, and particularly to an airflow device and a heat dissipation structure for circuit boards. Background Technology

[0002] In existing circuit board cooling structures, the heat sink fins at the front end of the board and the heat-sensitive components (similar to optical modules) at the rear end are arranged side-by-side along the airflow direction, using a single airflow channel for overall ventilation and heat dissipation. When the board is operating, cool air from outside first flows through the front heat sink fins and absorbs heat to form hot air. This hot air then blows directly onto the heat-sensitive components at the rear along the single airflow channel, causing the heat-sensitive components to overheat. This design fails to simultaneously meet the heat dissipation requirements of the front-end cooling area and the low-temperature operating requirements of the rear heat-sensitive area, resulting in a serious thermal cascading interference problem. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the existing single-channel heat dissipation mode of the circuit board, which cannot take into account both the heat dissipation performance of the circuit board and the working stability of the thermal device, and to provide a wind guide device and circuit board heat dissipation structure.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: In a first aspect, embodiments of the present invention provide an air guiding device applied to a circuit board. The circuit board has a heat dissipation area at its front end and a heat-sensitive area arranged parallel to the heat dissipation area at its rear end. The air guiding device includes: an air guide shroud; a first air inlet channel is provided at the lower layer of the front end of the air guide shroud, and a second air inlet channel is provided at the upper layer of the front end of the air guide shroud; a first air outlet channel is provided at the upper layer of the rear end of the air guide shroud, and a second air outlet channel is provided at the lower layer of the rear end of the air guide shroud; the first air inlet channel is connected to the first air outlet channel; and the second air inlet channel is connected to the second air outlet channel. When the air guide device is installed on the board, the inlet of the first air inlet channel faces the heat dissipation area, the outlet of the first air outlet channel faces the non-sensitive area above the heat-sensitive area, the inlet of the second air inlet channel faces the non-heat dissipation area above the heat dissipation area, and the outlet of the second air outlet channel faces the heat-sensitive area.

[0005] Further, the air guide hood includes a hood body, a first isolation plate, a second isolation plate, and an intermediate isolation layer; the intermediate isolation layer is located inside the hood body and divides the space inside the hood body into an upper layer and a lower layer; the first isolation plate is disposed in the upper layer space and divides the upper layer space into a second air inlet channel at the front end and a first air outlet channel at the rear end; the second isolation plate is disposed in the lower layer space and divides the lower layer space into a first air inlet channel at the front end and a second air outlet channel at the rear end; the lower edge of the first isolation plate and the upper edge of the second isolation plate are both connected to the intermediate isolation layer, and the lower edge of the first isolation plate and the upper edge of the second isolation plate are connected to the intermediate isolation layer. The upper edge of the second isolation plate is projected onto the intermediate isolation layer in a cross pattern, so that the intermediate isolation layer forms a first docking area on the upper and lower sides respectively docking with the rear end of the first air inlet channel and the front end of the first air outlet channel, and forms a second docking area on the upper and lower sides respectively docking with the rear end of the second air inlet channel and the front end of the second air outlet channel; the first docking area is provided with a first guide port, which connects to the rear end of the first air inlet channel and the front end of the first air outlet channel; the second docking area is provided with a second guide port, which connects to the rear end of the second air inlet channel and the front end of the second air outlet channel.

[0006] Furthermore, the front side of the first isolation plate forms a first guide surface, which is inclined or arc-shaped.

[0007] Furthermore, the front side of the second isolation plate forms a second guide surface, which is inclined or arc-shaped. Furthermore, the intermediate isolation layer extends rearward with an isolation extension plate, which is located between the heat-sensitive and non-sensitive areas when the air guide device is installed on the board.

[0008] Furthermore, the isolation extension plate is connected to support plates on both sides in the width direction, and the support plates are arranged downwards.

[0009] Furthermore, the cover, the first isolation plate, the second isolation plate, and the intermediate isolation layer are integrally formed or separately connected.

[0010] Furthermore, the first docking area and / or the second docking area are fully hollowed out. Secondly, This invention also provides a board heat dissipation structure, including the air guide device and the board as described above. The air guide device is installed on the board. The front end of the board is provided with a heat dissipation area, and the rear end of the board is provided with a heat-sensitive area arranged parallel to the heat dissipation area. The inlet of the first air inlet channel faces the heat dissipation area, and the outlet of the first air outlet channel faces the non-sensitive area above the heat-sensitive area. The inlet of the second air inlet channel faces the non-heat dissipation area above the heat dissipation area, and the outlet of the second air outlet channel faces the heat-sensitive area.

[0011] Furthermore, the air guide device is detachably connected to the board.

[0012] The air guiding device and circuit board heat dissipation structure provided by this invention have the following advantages compared with the prior art: By setting two sets of independent air ducts that are cross-connected in upper and lower layers, the hot air for circuit board heat dissipation and the low-temperature cold air can be zoned and distributed. This invention can guide the hot air from the front heat dissipation area to the non-sensitive area for exhaust, while accurately delivering the room temperature cold air to the heat-sensitive area, completely avoiding hot air interference, taking into account both the heat dissipation requirements of the front end of the circuit board and the protection requirements of the heat-sensitive devices at the back end, and improving the overall reliability of the circuit board.

[0013] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the heat dissipation structure of the board provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the heat dissipation structure of the circuit board provided in an embodiment of the present invention. Figure 3 This is a first-view structural schematic diagram of the air guiding device provided in an embodiment of the present invention; Figure 4 This is a second-view structural schematic diagram of the air guiding device provided in an embodiment of the present invention; Figure 5 This is a third-view structural diagram of the air guiding device provided in an embodiment of the present invention; Figure 6 for Figure 5 Sectional view of AA; Figure 7 for Figure 5 A cross-sectional view of BB.

[0016] Figure Labels 1. Air guide shroud; 1a. First air inlet channel; 1b. Second air inlet channel; 1c. First air outlet channel; 1d. Second air outlet channel; 1e. First guide port; 1f. Second guide port; 11. Cover body; 12. First isolation plate; 121. First guide surface; 13. Second isolation plate; 131. Second guide surface; 14. Intermediate isolation layer; 141. Isolation extension plate; 142. Support plate; 2. Board; 21. Heat dissipation area; 22. Heat-sensitive area; 23. Non-sensitive area; 24. Non-heat dissipation area. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0021] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0024] See Figures 1 to 7 As shown, this embodiment of the invention provides an air guiding device applied to a circuit board 2. The front end of the circuit board 2 is provided with a heat dissipation area 21, and the rear end of the circuit board 2 is provided with a heat-sensitive area 22 arranged parallel to the heat dissipation area 21. The air guiding device includes: an air guide shroud 1, the lower layer of the front end of the air guide shroud 1 is provided with a first air inlet channel 1a, and the upper layer of the front end of the air guide shroud 1 is provided with a second air inlet channel 1b; the upper layer of the rear end of the air guide shroud 1 is provided with a first air outlet channel 1c, and the lower layer of the rear end of the air guide shroud 1 is provided with a second air outlet channel 1d; the first air inlet channel 1a is connected to the first air outlet channel 1c; and the second air inlet channel 1b is connected to the second air outlet channel 1d. When the air guide device is installed on the board 2, the inlet of the first air inlet channel 1a is set towards the heat dissipation area 21, the outlet of the first air outlet channel 1c is set towards the non-sensitive area 23 above the heat-sensitive area 22, the inlet of the second air inlet channel 1b is set towards the non-heat dissipation area 24 above the heat dissipation area 21, and the outlet of the second air outlet channel 1d is set towards the heat-sensitive area 22.

[0025] Specifically, when the air guide device is installed on the surface of the board 2, the inlet of the first air inlet channel 1a faces the heat dissipation area 21 of the board 2, and can receive the hot air after heat exchange in the heat dissipation area 21. The hot air is then transported through the first air outlet channel 1c to the non-sensitive area 23 above the heat-sensitive area 22 for discharge. The inlet of the second air inlet channel 1b faces the non-heat dissipation area 24 above the heat dissipation area 21, and can receive room temperature or low temperature cold air. The cold air is then directly transported to the heat-sensitive area 22 through the second air outlet channel 1d, realizing the directional diversion and transportation of hot and cold air.

[0026] This embodiment achieves complete separation of the hot air from the heat dissipation area and the cold air from the cooling area by using two sets of independent cross-flow structures, preventing the hot air from blowing directly onto the heat-sensitive area 22. This structure does not require any changes to the original structural layout of the board 2 and can simultaneously meet the high-efficiency heat dissipation requirements of the front-end heat dissipation area 21 and the low-temperature operation requirements of the rear-end heat-sensitive area 22, completely eliminating the thermal cascading interference problem of the board 2's heat dissipation.

[0027] In one embodiment, the air guide shroud 1 includes a shroud body 11, a first isolation plate 12, a second isolation plate 13, and an intermediate isolation layer 14; the intermediate isolation layer 14 is located inside the shroud body 11 and divides the space inside the shroud body 11 into an upper layer and a lower layer; the first isolation plate 12 is disposed in the upper layer space and divides the upper layer space into a second air inlet channel 1b at the front end and a first air outlet channel 1c at the rear end; the second isolation plate 13 is disposed in the lower layer space and divides the lower layer space into a first air inlet channel 1a at the front end and a second air outlet channel 1d at the rear end; the lower edge of the first isolation plate 12 and the upper edge of the second isolation plate 13 are both connected to the intermediate isolation layer 14, and the lower edge of the first isolation plate 12... The upper edge of the second isolation plate 13 is intersected with the projection of the second isolation plate 13 onto the intermediate isolation layer 14, so that the intermediate isolation layer 14 forms a first docking area with the rear end of the first air inlet channel 1a and the front end of the first air outlet channel 1c respectively on its upper and lower sides, and forms a second docking area with the rear end of the second air inlet channel 1b and the front end of the second air outlet channel 1d respectively on its upper and lower sides; the first docking area is provided with a first guide port 1e, which connects to the rear end of the first air inlet channel 1a and the front end of the first air outlet channel 1c; the second docking area is provided with a second guide port 1f, which connects to the rear end of the second air inlet channel 1b and the front end of the second air outlet channel 1d.

[0028] Specifically, this embodiment uses the cooperative structure of the cover 11, the first isolation plate 12, the second isolation plate 13, and the intermediate isolation layer 14 to precisely form two sets of independent cross-flow ducts that do not interfere with each other. The duct separation and sealing performance is excellent, which can effectively prevent the mixing of hot and cold air. The cross-projection plate layout structure is compact and can be adapted to the small installation space of the board 2, ensuring the stability and accuracy of cross-flow splitting.

[0029] In one embodiment, the front side of the first isolation plate 12 forms a first guide surface 121, which is inclined or arc-shaped.

[0030] Specifically, after the cold air enters from the inlet of the second air inlet channel 1b, it flows smoothly along the first guide surface 121 with an inclined or arc-shaped structure. The first guide surface 121 can change the trajectory of the straight flow of the cold air, guide the cold air to be smoothly delivered to the second guide port 1f, adapt to the overall cross air duct layout, and ensure that the cold air delivery path is regular.

[0031] In this embodiment, the first guide surface 121 with an inclined or arc-shaped structure can weaken the turbulence and flow phenomena generated when cold air enters the air duct, reduce the wind resistance generated by the airflow hitting the first isolation plate 12, reduce airflow loss, improve the stability of low-temperature cold air delivery, and continuously ensure a stable supply of cooling airflow to the heat-sensitive area 22.

[0032] Understandably, the tilt angle or curvature of the first guide surface 121 can be adjusted according to the wind speed and cold air flow requirements of the duct design, so as to maximize the optimization of the cold air guiding effect without changing the overall shape of the air guide cover 1.

[0033] In one embodiment, the front side of the second isolation plate 13 forms a second guide surface 131, which is inclined or arc-shaped.

[0034] Specifically, the design principle of the second guide surface 131 is basically the same as that of the first guide surface 121. The second guide surface 131 can be symmetrically or asymmetrically matched with the first guide surface 121. Differentiated airflow design can be carried out according to the difference in flow rate of hot and cold air to achieve balanced and stable operation of airflow in the dual air ducts.

[0035] In one embodiment, the intermediate isolation layer 14 extends rearward with an isolation extension plate 141. When the air guide device is installed on the board 2, the isolation extension plate 141 is located between the heat-sensitive area 22 and the non-sensitive area 23.

[0036] Specifically, the isolation extension plate 141 is fixedly positioned by relying on the intermediate isolation layer 14, and can form a stable physical separation structure at the rear end of the board 2, completely separating the non-sensitive area 23 that discharges hot air from the heat-sensitive area 22 that receives cold air, blocking the edge gaps of the hot and cold air flow, and avoiding cross-interference of airflow.

[0037] This embodiment effectively eliminates the problem of hot air backflow and cold air leakage at the rear of the board 2 by setting the isolation extension plate 141, further enhances the isolation effect of hot and cold air zones, continuously ensures the low-temperature working environment of the heat-sensitive area 22, and completely avoids the continuous thermal interference of hot air on the heat-sensitive device.

[0038] Understandably, the extension length and coverage width of the isolation extension board 141 can be adapted and adjusted according to the size and specifications of the rear area of ​​different boards 2 to ensure complete coverage of the boundary between the heat-sensitive area 22 and the non-sensitive area 23, and to adapt to the installation and use of multiple types of boards 2.

[0039] In one embodiment, the isolation extension plate 141 is connected to support plates 142 on both sides in the width direction, and the support plates 142 are arranged downward.

[0040] Specifically, the support plate 142 is integrated with the side walls on both sides of the cover 11. The support plate 142 is vertically arranged between the isolation extension plate 141 and the surface of the plate 2, which can provide all-round vertical support and positioning for the suspended isolation extension plate 141, effectively limiting the deformation and displacement of the isolation extension plate 141. At the same time, it can be closely attached to the surface of the plate 2, reducing the installation gap between the air guide device and the plate 2.

[0041] In this embodiment, the support plate 142 connects the side wall of the cover 11 and the isolation extension plate 141 to form a closed-loop overall support structure, which greatly improves the structural stability and installation firmness of the isolation extension plate 141, effectively avoids plate shaking and deformation under long-term air guiding conditions, ensures the separation accuracy of the rear end area of ​​the board 2, and can also help limit the overall installation position of the air guiding device, improve the installation fit between the air guiding device and the board 2 and the overall structural reliability.

[0042] Understandably, the height of the support plate 142 can be adjusted to match the flatness of the board 2 surface, which can achieve precise horizontal positioning of the isolation extension plate 141 and ensure the stability of the hot and cold air separation effect.

[0043] In one embodiment, the cover 11, the first isolation plate 12, the second isolation plate 13 and the intermediate isolation layer 14 are integrally formed or separately connected.

[0044] Specifically, the one-piece molded structure involves casting and injection molding of all components as a whole, without any seams; the split-connection structure involves fixing individual components into a whole through snap-fit, adhesive, or bolt connections. The one-piece molded structure ensures the airtightness and integrity of the connections between components, preventing air leakage and cross-contamination in the duct; the split-connection structure allows for individual processing, disassembly, and replacement of each component, adapting to different production, processing, and maintenance scenarios. Both structural forms can meet the core usage requirements of cross-ventilation.

[0045] This embodiment offers two structural options to adapt to different production and usage scenarios. The one-piece molded structure boasts high strength and excellent sealing, while the split-connection structure offers flexible processing and convenient maintenance, significantly improving the production adaptability and practicality of the air guide device.

[0046] In one embodiment, the first docking area and / or the second docking area are fully hollowed out.

[0047] Specifically, when the first docking area and / or the second docking area are completely hollowed out, the airflow of the corresponding air duct can pass through the intermediate isolation layer 14 without obstruction or resistance, realizing the complete connection between the air inlet channel and the air outlet channel, maximizing the release of the effective ventilation cross-sectional area of ​​the air duct, ensuring the smoothness of airflow, improving the delivery flow and uniformity of hot and cold air, avoiding problems such as poor heat dissipation and insufficient cooling caused by poor local ventilation, and effectively improving the overall air guiding and heat dissipation performance of the air guiding device.

[0048] Secondly, this embodiment of the invention also provides a board heat dissipation structure, including the air guide device and the board 2 as described above. The air guide device is installed on the board 2. The front end of the board 2 is provided with a heat dissipation area 21, and the rear end of the board 2 is provided with a heat-sensitive area 22 arranged parallel to the heat dissipation area 21. The inlet of the first air inlet channel 1a is arranged towards the heat dissipation area 21, the outlet of the first air outlet channel 1c is arranged towards the non-sensitive area 23 above the heat-sensitive area 22, the inlet of the second air inlet channel 1b is arranged towards the non-heat dissipation area 24 above the heat dissipation area 21, and the outlet of the second air outlet channel 1d is arranged towards the heat-sensitive area 22.

[0049] Specifically, this board's heat dissipation structure utilizes the cross-flow characteristics of the air guide device to achieve layered and distributed delivery of hot and cold air to the board 2. Structurally, it completely resolves the contradiction between front-end heat dissipation and rear-end thermal device protection, improving the heat dissipation stability and long-term operational reliability of the high-power board 2. Furthermore, this heat dissipation structure requires no modification to the original circuitry and layout of the board 2, making it compatible with the heat dissipation modifications and mass production assembly of existing mainstream high-power communication and computing boards 2, thus having a wide range of applicability.

[0050] In one embodiment, the air guide device is detachably connected to the board 2.

[0051] Specifically, the detachable connection method can adopt conventional assembly structures such as snap-fit ​​connection, bolt fastening connection, and magnetic connection, which can realize the quick disassembly, assembly, individual replacement and cleaning maintenance of the air guide device. When the air guide device has problems such as dust accumulation or deformation, it can be disassembled and repaired separately without disassembling the entire board 2 structure, and the integrity of the main structure of board 2 is not affected.

[0052] The above embodiments are preferred implementations of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious substitutions without departing from the concept of the present technical solution are within the protection scope of the present invention.

Claims

1. A ventilation device applied to a circuit board, wherein the front end of the circuit board has a heat dissipation area, and the rear end of the circuit board has a heat-sensitive area arranged parallel to the heat dissipation area, characterized in that, The air guiding device includes: an air guide hood, wherein the lower layer of the front end of the air guide hood is provided with a first air inlet channel, and the upper layer of the front end of the air guide hood is provided with a second air inlet channel; the upper layer of the rear end of the air guide hood is provided with a first air outlet channel, and the lower layer of the rear end of the air guide hood is provided with a second air outlet channel; the first air inlet channel is connected to the first air outlet channel; and the second air inlet channel is connected to the second air outlet channel. When the air guide device is installed on the board, the inlet of the first air inlet channel faces the heat dissipation area, the outlet of the first air outlet channel faces the non-sensitive area above the heat-sensitive area, the inlet of the second air inlet channel faces the non-heat dissipation area above the heat dissipation area, and the outlet of the second air outlet channel faces the heat-sensitive area.

2. The air guiding device according to claim 1, characterized in that, The air guide hood includes a hood body, a first isolation plate, a second isolation plate, and an intermediate isolation layer. The intermediate isolation layer is located inside the hood body and divides the space inside the hood body into an upper layer and a lower layer. The first isolation plate is disposed in the upper layer space and divides the upper layer space into a second air inlet channel at the front end and a first air outlet channel at the rear end. The second isolation plate is disposed in the lower layer space and divides the lower layer space into a first air inlet channel at the front end and a second air outlet channel at the rear end. The lower edge of the first isolation plate and the upper edge of the second isolation plate are both connected to the intermediate isolation layer, and the projections of the lower edge of the first isolation plate and the upper edge of the second isolation plate on the intermediate isolation layer are intersecting, so that the intermediate isolation layer forms a first docking area with the rear end of the first air inlet channel and the front end of the first air outlet channel on its upper and lower sides respectively, and forms a second docking area with the rear end of the second air inlet channel and the front end of the second air outlet channel on its upper and lower sides respectively. The first docking area is provided with a first guide port, which connects to the rear end of the first air inlet channel and the front end of the first air outlet channel. The second docking area is provided with a second guide port, which connects to the rear end of the second air inlet channel and the front end of the second air outlet channel.

3. The air guiding device according to claim 2, characterized in that, The front side of the first isolation plate forms a first guide surface, which is inclined or arc-shaped.

4. The air guiding device according to claim 2, characterized in that, The front side of the second isolation plate forms a second guide surface, which is inclined or arc-shaped.

5. The air guiding device according to claim 2, characterized in that, The intermediate isolation layer extends to the rear end with an isolation extension plate. When the air guide device is installed on the board, the isolation extension plate is located between the heat-sensitive area and the non-sensitive area.

6. The air guiding device according to claim 5, characterized in that, The isolation extension plate is connected to support plates on both sides in the width direction, and the support plates are set downward.

7. The air guiding device according to claim 2, characterized in that, The cover, the first isolation plate, the second isolation plate, and the intermediate isolation layer are either integrally formed or separately connected.

8. The air guiding device according to claim 2, characterized in that, The first docking area and / or the second docking area are fully hollowed out.

9. A heat dissipation structure for a circuit board, characterized in that, The device includes the air guide device and the board according to any one of claims 1 to 8. The air guide device is installed on the board. The front end of the board is provided with a heat dissipation area, and the rear end of the board is provided with a heat-sensitive area arranged parallel to the heat dissipation area. The inlet of the first air inlet channel is arranged facing the heat dissipation area, and the outlet of the first air outlet channel is arranged facing the non-sensitive area above the heat-sensitive area. The inlet of the second air inlet channel is arranged facing the non-heat dissipation area above the heat dissipation area, and the outlet of the second air outlet channel is arranged facing the heat-sensitive area.

10. A heat dissipation structure for a circuit board according to claim 9, characterized in that, The air guide device is detachably connected to the board.

Images