Display panel and manufacturing method thereof

Abstract

The application discloses a display panel and a preparation method thereof. The display panel comprises a first electrode, a light emitting element, a second electrode and a metal connecting structure. The light emitting element comprises an upper surface and a lower surface, the first electrode and the upper surface of the light emitting element are at least partially electrically connected, the second electrode and the lower surface of the light emitting element are at least partially electrically connected, and the metal connecting structure is electrically connected with the first electrode. In this way, the first electrode and the upper surface of the light emitting element form an ohmic contact, the second electrode and the lower surface of the light emitting element form an ohmic contact, and the normal work of the display panel is realized through the first electrode and the second electrode. Moreover, the first electrode is electrically connected with the metal connecting structure, so that the first electrode is electrically connected with a metal contact of a driving substrate through the metal connecting structure in the subsequent process, the electrical connection mode of the first electrode and the metal contact is simple, and the electrical connection stability of the first electrode and the metal contact is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] MicroLED, or micro light-emitting diode, is an active-matrix display device with advantages such as high brightness, long lifespan, and fast response. It can achieve high-density pixel arrangement at the micrometer level, simultaneously meeting the demands for high brightness and high resolution displays. It has broad application prospects in fields such as micro-displays, micro-projectors, and augmented reality.

[0003] MicroLEDs consist of tiny pixel units. Each light-emitting element needs to establish an electrical connection with an N-electrode through a corresponding metal contact. The driving circuit provides an independent driving signal to each LED unit through the N-electrode, thereby achieving independent driving of each light-emitting element. However, the current connection method between the N-electrode and the metal contact has problems such as high process complexity, high manufacturing cost, and poor connection stability. Summary of the Invention

[0004] The present invention provides a display panel and a method for manufacturing the same, wherein a first electrode is electrically connected to a metal connection structure, which facilitates the subsequent electrical connection of the first electrode to the metal contacts of the driving substrate through the metal connection structure, ensuring a simple electrical connection method between the first electrode and the metal contacts and improving the electrical connection stability between the first electrode and the metal contacts.

[0005] In a first aspect, embodiments of the present invention provide a display panel, the display panel comprising:

[0006] A first electrode, a light-emitting element, and a second electrode, wherein the light-emitting element includes an upper surface and a lower surface, the first electrode and the upper surface of the light-emitting element are at least partially electrically connected, and the second electrode and the lower surface of the light-emitting element are at least partially electrically connected.

[0007] A metal connection structure is electrically connected to the first electrode.

[0008] Optionally, the display panel further includes a reflective structure, which includes a sidewall and a bottom wall. The light-emitting element is located in the space formed by the sidewall and the bottom wall of the reflective structure. The reflective structure is made of a conductive material, and the bottom wall of the reflective structure is a second electrode. The sidewall and the light-emitting element are electrically isolated.

[0009] Each of the reflective structures corresponds to a light-emitting element, and all adjacent reflective structures are electrically connected to form a common electrode.

[0010] Optionally, the display panel may further include an ohmic contact layer located between the lower surface of the light-emitting element and the bottom wall of the reflective structure to form an ohmic contact.

[0011] Optionally, the display panel further includes a first insulating structure, at least a portion of which is located between the sidewall and the light-emitting element to form electrical isolation between the sidewall and the light-emitting element, and another portion of the first insulating structure electrically isolates the reflective structure and the first electrode.

[0012] Optionally, the display panel further includes a first dielectric layer, a second dielectric layer, a driving substrate, and conductive connecting posts. The driving substrate is provided with metal contacts, and the conductive connecting posts are located between adjacent light-emitting elements and penetrate the first dielectric layer and the second dielectric layer. The two ends of the conductive connecting posts are electrically connected to a metal connection structure and a metal contact, respectively.

[0013] Optionally, the side of the first dielectric layer near the second dielectric layer and the side of the second dielectric layer near the first dielectric layer are both provided with interlocking concave and convex structures.

[0014] Optionally, the display panel further includes a second insulating structure located on the outer peripheral surface of the conductive connecting post for electrically isolating the outer peripheral surface of the conductive connecting post.

[0015] Optionally, the conductive connection post includes a first conductive connection post and a second conductive connection post that are electrically connected. The first conductive connection post is located in the first dielectric layer, and the end of the first conductive connection post facing away from the second dielectric layer is electrically connected to the metal connection structure.

[0016] The second conductive connection post is located in the second dielectric layer, and the end of the second conductive connection post facing away from the first dielectric layer is electrically connected to the metal contact, and the end of the second conductive connection post facing the first dielectric layer is electrically connected to the end of the first conductive connection post facing the second dielectric layer.

[0017] In the radial direction of the conductive connecting post, the width of the first conductive connecting post near the second dielectric layer is different from the width of the second conductive connecting post near the first dielectric layer.

[0018] Secondly, embodiments of the present invention also provide a method for manufacturing a display panel, the method comprising:

[0019] A light-emitting element is fabricated, the light-emitting element comprising an upper surface and a lower surface;

[0020] A first electrode and a second electrode are prepared, wherein the first electrode is at least partially electrically connected to the upper surface of the light-emitting element, and the second electrode is at least partially electrically connected to the lower surface of the light-emitting element;

[0021] A metal connection structure is prepared, wherein the metal connection structure is electrically connected to the first electrode.

[0022] Optionally, fabricating the light-emitting element and the second electrode includes:

[0023] A substrate is provided, and a material is deposited on one side of the substrate to form a full-layer ohmic contact layer and a light-emitting element layer. The full-layer ohmic contact layer and the light-emitting element layer are patterned to prepare a plurality of ohmic contact layers and a plurality of light-emitting elements.

[0024] An insulating layer is deposited on the side of the ohmic contact layer away from the substrate, and the insulating layer is patterned to expose the ohmic contact layer in order to form a first insulating structure on the light-emitting element;

[0025] A conductive material is deposited on the side of the ohmic contact layer away from the substrate to form a reflective structure, and the reflective structure is patterned to integrally form a sidewall and a bottom wall, wherein the bottom wall is a second electrode;

[0026] A first dielectric layer is formed on the reflective structure, and the first dielectric layer covers the reflective structure.

[0027] Optionally, fabricating the first electrode and the metal connection structure includes:

[0028] A driving substrate is provided, the driving substrate including metal contacts;

[0029] A second dielectric layer is prepared on one side of the driving substrate, the first dielectric layer and the second dielectric layer are fixed by welding, the substrate is removed, and a first electrode is prepared on the light-emitting element.

[0030] The fabrication of conductive connecting pillars and metal connecting structures includes:

[0031] Vias are formed between different light-emitting elements, the vias penetrate the first dielectric layer and the second dielectric layer, and conductive material is filled in the vias to form the conductive connection pillars. A metal connection structure is formed on the conductive connection pillars, and the conductive connection pillars are electrically connected to the first electrode through the metal connection structure, and the metal contacts are electrically connected to the conductive connection pillars.

[0032] At the position corresponding to each light-emitting element, a lens structure is prepared on the light-emitting side of the light-emitting element.

[0033] Optionally, after forming vias between different light-emitting elements, the process further includes:

[0034] A second insulating structure is formed within the via, and the conductive connection post is formed on the second insulating structure. The second insulating structure is located on the outer peripheral surface of the conductive connection post to electrically isolate the outer peripheral surface of the conductive connection post.

[0035] Optionally, fabricating the first electrode includes:

[0036] A driving substrate is provided, a second dielectric layer is prepared on one side of the driving substrate, a concave-convex structure is provided between the first dielectric layer and the second dielectric layer, the first dielectric layer and the second dielectric layer are welded through the concave-convex structure, the substrate is removed, and a first electrode is prepared on the light-emitting element.

[0037] Optionally, the fabrication of the conductive connecting pillar includes:

[0038] The preparation of conductive connecting pillars includes:

[0039] A first via is formed in a first dielectric layer, the first via penetrating the first dielectric layer, and a first conductive connection post is formed by filling the first via with conductive material.

[0040] A driving substrate is provided, a second dielectric layer is formed on one side of the driving substrate, and a second via is formed in the second dielectric layer. The second via penetrates the second dielectric layer, and a conductive material is filled in the second via to form a second conductive connection post.

[0041] The first dielectric layer, the first conductive connecting post, the second dielectric layer, and the second conductive connecting post are bonded together to form an adhesive. In the radial direction of the conductive connecting post, the width of the first conductive connecting post near the second dielectric layer is different from the width of the second conductive connecting post near the first dielectric layer.

[0042] In summary, the display panel in this embodiment of the invention includes a first electrode, a light-emitting element, a second electrode, and a metal connection structure. The light-emitting element includes an upper surface and a lower surface. The first electrode is at least partially electrically connected to the upper surface of the light-emitting element, and the second electrode is at least partially electrically connected to the lower surface of the light-emitting element. The metal connection structure is electrically connected to the first electrode. Thus, the first electrode forms an ohmic contact with the upper surface of the light-emitting element, and the second electrode forms an ohmic contact with the lower surface of the light-emitting element, enabling the normal operation of the display panel through the first and second electrodes. Furthermore, the electrical connection between the first electrode and the metal connection structure facilitates subsequent electrical connection of the first electrode to the metal contacts of the driving substrate, ensuring a simple electrical connection method between the first electrode and the metal contacts and improving the stability of the electrical connection between the first electrode and the metal contacts. Attached Figure Description

[0043] Figure 1 This is a cross-sectional schematic diagram of a display panel provided in an embodiment of the present invention;

[0044] Figure 2 This is a top view of a display panel provided in an embodiment of the present invention;

[0045] Figure 3 This is a cross-sectional schematic diagram of another display panel provided in an embodiment of the present invention;

[0046] Figure 4 This is a cross-sectional schematic diagram of another display panel provided in an embodiment of the present invention;

[0047] Figure 5 This is a cross-sectional schematic diagram of another display panel provided in an embodiment of the present invention;

[0048] Figure 6 This is a schematic flowchart of a preparation method provided in an embodiment of the present invention;

[0049] Figure 7 This is a partial process flow diagram of a display panel provided in an embodiment of the present invention;

[0050] Figure 8 This is a partial process flow of another display panel provided in an embodiment of the present invention;

[0051] Figure 9 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention;

[0052] Figure 10 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention;

[0053] Figure 11 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be fully described below with reference to the accompanying drawings of the embodiments of this invention through specific implementation methods. Obviously, the described embodiments are only some, not all, embodiments of this invention. Various modifications and variations can be made to this invention without departing from the spirit or scope of this invention, which will be obvious to those skilled in the art. Therefore, this invention is intended to cover modifications and variations of this invention that fall within the scope of the corresponding claims (the claimed technical solutions) and their equivalents.

[0055] Furthermore, the terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "an," "one," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Terms such as "including" or "comprising" mean that the element or object preceding the word encompasses the element or object listed after the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly. In addition, descriptions of "same" or "equal" involved in the embodiments of this disclosure do not mean that two objects are completely equal in size or shape; they are allowed to be approximately the same or approximately equal within a certain error range. It should be noted that the implementation methods provided in the embodiments of this invention can be combined with each other without contradiction.

[0056] Figure 1 This is a cross-sectional schematic diagram of a display panel provided in an embodiment of the present invention. Figure 2 This is a top view structural diagram of a display panel provided in an embodiment of the present invention. See also... Figure 1 and Figure 2 The display panel includes a first electrode 10, a light-emitting element 20, and a second electrode 30. The light-emitting element 20 includes an upper surface and a lower surface. The first electrode 10 and the upper surface of the light-emitting element 20 are at least partially electrically connected, and the second electrode 30 and the lower surface of the light-emitting element 20 are at least partially electrically connected. The display panel also includes a metal connection structure 40, which is electrically connected to the first electrode 10.

[0057] Specifically, such as Figure 1 As shown, the light-emitting element 20 may include a single-layer light-emitting layer or multiple light-emitting layers, such as... Figure 1In the illustrated embodiment, the light-emitting element 20 includes three light-emitting layers stacked together to form a light-emitting mesa of the light-emitting element 20. The light-emitting mesa emits light to achieve light emission display by the light-emitting element 20. The first electrode 10 can be an N-electrode, with multiple first electrodes 10 independently arranged. Each first electrode 10 is at least partially electrically connected to the upper surface of the light-emitting element 20, thus forming an ohmic contact and ensuring low contact resistance. The second electrode 30 can be a P-electrode, and is at least partially electrically connected to the lower surface of the light-emitting element 20, forming an ohmic contact. Therefore, when a voltage is applied to the first electrode 10 and the second electrode 30, the light-emitting element 20 can be driven to emit light, ensuring normal operation of the light-emitting element 20.

[0058] Furthermore, the display panel also includes a metal connection structure 40, which is a conductive structure used to realize the subsequent electrical connection between the first electrode 10 and the metal contacts in the driving substrate, thereby ensuring a simple electrical connection method between the first electrode 10 and the metal contacts. For example, in the embodiment shown in Figure 1, the display panel may further include a driving substrate 01 and conductive connection posts 50. The driving substrate 01 includes multiple metal contacts 100, which are used to provide electrical signals. The first electrode 10 is electrically connected to the conductive connection posts 50 through the metal connection structure 40, and the conductive connection posts 50 are electrically connected to the metal contacts 100. Thus, each metal contact 100 provides a driving signal to the corresponding electrically connected first electrode 10 through the metal connection structure 40, realizing independent driving of each light-emitting element 20. Moreover, the electrical connection between the first electrode 10 and the metal connection structure 40 simplifies the electrical connection method between the first electrode 10 and the metal contacts 100, improving the stability of the electrical connection between the first electrode 10 and the metal contacts 100.

[0059] It is understood that since the first electrode 10 is electrically connected to the conductive connecting post 50 through the metal connection structure 40, the first electrode 10 is arranged to overlap with the light-emitting element 20 at least partially in the thickness direction of the driving substrate 01, so as to ensure that the first electrode 10 and the light-emitting element 20 form an ohmic contact. Furthermore, the first electrode 10 and the metal connection structure 40 are staggered, so that the first electrode 10 is bridging with the conductive connecting post 50 through the metal connection structure 40.

[0060] In summary, the display panel includes a first electrode, a light-emitting element, a second electrode, and a metal connection structure. The light-emitting element includes an upper surface and a lower surface. The first electrode is at least partially electrically connected to the upper surface of the light-emitting element, and the second electrode is at least partially electrically connected to the lower surface of the light-emitting element. The metal connection structure is electrically connected to the first electrode. Thus, the first electrode forms an ohmic contact with the upper surface of the light-emitting element, and the second electrode forms an ohmic contact with the lower surface of the light-emitting element. The normal operation of the display panel is achieved through the first and second electrodes. Furthermore, the electrical connection between the first electrode and the metal connection structure facilitates subsequent electrical connection between the first electrode and the metal contacts of the driving substrate, ensuring a simple electrical connection method between the first electrode and the metal contacts and improving the stability of the electrical connection between the first electrode and the metal contacts.

[0061] Optional, see below Figure 1 Figure 2 The display panel also includes a reflective structure 60, which includes a sidewall 610 and a bottom wall 620. The light-emitting element 20 is located in the space formed by the sidewall 610 and the bottom wall 620 of the reflective structure 60. The reflective structure 60 is made of conductive material. The bottom wall 620 of the reflective structure 60 is a second electrode 30. The sidewall 610 and the light-emitting element 20 are electrically isolated. Each reflective structure 60 corresponds to one light-emitting element 20. All adjacent reflective structures 60 are electrically contacted to form a common electrode.

[0062] Specifically, this embodiment of the invention also includes a reflective structure 60, which includes a sidewall 610 and a bottom wall 620. The sidewall 610 and bottom wall 620 together form a reflective cup structure, and the light-emitting element 20 is disposed within the space formed by the sidewall 610 and bottom wall 620 of the reflective structure 60, that is, the light-emitting element 20 is disposed within the reflective cup structure and is enclosed by the reflective cup structure. In this way, light emitted from the side or other positions of the light-emitting element 20 will be reflected by the sidewall 610 and bottom wall 620 of the reflective structure 60, thereby ensuring that light emitted from other positions can be emitted from the upper surface of the light-emitting element 20, improving the light output and brightness of the light-emitting element 20.

[0063] Furthermore, in this embodiment of the invention, the sidewalls 610 and bottom wall 620 of the reflective structure 60 are fabricated simultaneously in a single process. For example, in a specific fabrication process, a substrate is first provided, and material is deposited on one side of the substrate to form a continuous light-emitting element layer. The continuous light-emitting element layer is then etched to form multiple light-emitting elements 20. Each light-emitting element 20 has a light-emitting mesa. During the subsequent fabrication of the reflective structure 60, the reflective structure 60 is deposited on the lower surface and side surface of the light-emitting mesa, integrally forming the sidewalls 610 and bottom wall 620. This allows the sidewalls 610 and bottom wall 620 of the reflective structure 60 to be fabricated simultaneously in a single process, improving the fabrication yield and reducing production costs. In addition, the reflective structure 60 is made of a conductive material, and the bottom wall 620 of the reflective structure 60 serves as the second electrode 30, electrically connected to the lower surface of the light-emitting element 20. The sidewall 610 is electrically isolated from the light-emitting element 20, thereby ensuring the normal light emission of the light-emitting element 20.

[0064] Furthermore, the reflective structure 60 is positioned corresponding to the light-emitting element 20, thereby ensuring that each light-emitting element 20 is located within the space formed by the sidewall 610 and bottom wall 620 of the corresponding reflective structure 60, thus improving the light output and brightness of each light-emitting element 20. In addition, the different reflective structures 60 are electrically connected to each other to form a common electrode, and the bottom wall 620 serves as the second electrode 30 electrically connected to the light-emitting element 20. In this way, the light extraction efficiency of the light-emitting element 20 can be further improved by setting up a common electrode.

[0065] Optional, see below Figure 1 The display panel also includes an ohmic contact layer 630, which is located between the lower surface of the light-emitting element 20 and the bottom wall 620 of the reflective structure 60 to form an ohmic contact. Specifically, the bottom wall 620 of the reflective structure 60 serves as the second electrode 30. The ohmic contact layer 630 is disposed between the second electrode 30 and the lower surface of the light-emitting element 20. The second electrode 30 forms an ohmic contact with the lower surface of the light-emitting element 20 through the ohmic contact layer 630, thereby reducing the contact resistance between the second electrode 30 and the light-emitting element 20 and improving the luminous efficiency of the light-emitting element 20.

[0066] Optional, see below Figure 1 The display panel also includes a first insulating structure 710, at least a portion of which is located between the sidewall 610 and the light-emitting element 20 to form electrical isolation between the sidewall 610 and the light-emitting element 20, and another portion of the first insulating structure 710 electrically isolates the reflective structure 60 and the first electrode 10.

[0067] Specifically, such as Figure 1As shown, the display panel also includes a first insulating structure 710. The first insulating structure 710 may include a portion located within the reflective structure 60, i.e., disposed on the side wall 610 and between the side wall 610 and the light-emitting element 20, thereby isolating the side wall 610 and the side surface of the light-emitting element 20 from each other and preventing interference with the normal operation of the light-emitting element 20. Furthermore, the first insulating structure 710 also includes a portion located outside the reflective structure 60, i.e., between the reflective structure 60 and the first electrode 10. Since the bottom wall 620 of the reflective structure 60 serves as the second electrode 30, by disposing the first insulating structure 710 between the reflective structure 60 and the first electrode 10, short circuits between the first electrode 10 and the second electrode 30 are prevented, thereby ensuring the normal operation of the display panel.

[0068] Optional, see below Figure 1 The display panel also includes a first dielectric layer 810, a second dielectric layer 820, a driving substrate 01, and a conductive connecting post 50. The driving substrate 01 is provided with a metal contact 100. The conductive connecting post 50 is located between adjacent light-emitting elements 20 and passes through the first dielectric layer 810 and the second dielectric layer 820. The two ends of the conductive connecting post 50 are electrically connected to the metal connecting structure 40 and the metal contact 100, respectively.

[0069] Specifically, the display panel also includes a driving substrate 01. A first dielectric layer 810 and a second dielectric layer 820 are both disposed on one side of the driving substrate 01, thereby providing support for the first dielectric layer 810 and the second dielectric layer 820 through the driving substrate 01. The first dielectric layer 810 is located on the side of the second dielectric layer 820 away from the driving substrate 01, and the conductive connection post 50 penetrates through the first dielectric layer 810 and the second dielectric layer 820, at least partially overlapping with the metal contact 100 in the driving substrate 01, thereby ensuring that the conductive connection post 50 and the metal contact 100 are electrically connected. The conductive connection post 50 is also electrically connected to the first electrode 10 through a metal connection structure 40. Furthermore, the first electrode 10 is electrically connected to the metal contact 100 through the metal connection structure 40 and the conductive connection post 50, thereby providing a driving signal to the corresponding electrically connected first electrode 10 through each metal contact 100, realizing independent driving of each light-emitting element 20.

[0070] It should be noted that the materials of the first dielectric layer 810 and the second dielectric layer 820 can be the same or different, and the present invention does not impose any restrictions on this. When the materials of the first dielectric layer 810 and the second dielectric layer 820 are the same, the first dielectric layer 810 and the second dielectric layer 820 are integral dielectric layers.

[0071] Optional, see below Figure 1The first dielectric layer 810 and the second dielectric layer 820 are fixed together by welding, which simplifies the bonding method of the first dielectric layer 810 and the second dielectric layer 820 and ensures the alignment and electrical connection between the conductive connecting post 50 and the metal contact 100.

[0072] Optionally, in yet another embodiment, Figure 3 This is a cross-sectional schematic diagram of another display panel provided in an embodiment of the present invention. See also... Figure 3 The first dielectric layer 810 and the second dielectric layer 820 are both provided with interlocking concave and convex structures on the side of the second dielectric layer 820 and the side of the second dielectric layer 820 that is close to the first dielectric layer 810.

[0073] For example, such as Figure 3 In the illustrated embodiment, the first dielectric layer 810 is located on the side of the second dielectric layer 820 facing away from the driving substrate 01. Multiple first protrusion structures and multiple first recessed structures can be provided on the side of the first dielectric layer 810 facing the second dielectric layer 820, with the first protrusion structures and first recessed structures spaced apart. Multiple second protrusion structures and multiple second recessed structures can be provided on the side of the second dielectric layer 820 facing the first dielectric layer 810, with the second protrusion structures and second recessed structures spaced apart. The first protrusion structures and second recessed structures are correspondingly arranged, and the first recessed structures and second protrusion structures are correspondingly arranged. During corresponding soldering, the first protrusion structures and second recessed structures interlock, and the second protrusion structures and first recessed structures interlock, thereby soldering the first dielectric layer 810 and the second dielectric layer 820 together. Thus, by using the interlocking protrusion and concave structures, the alignment difficulty of the first dielectric layer 810 and the second dielectric layer 820 can be reduced.

[0074] It is understandable that when the materials of the first dielectric layer 810 and the second dielectric layer 820 are exactly the same, and the concave and convex structures are perfectly matched and fitted, the fitting marks of the first dielectric layer 810 and the second dielectric layer 820 are not visible.

[0075] Optional, Figure 4 This is a cross-sectional schematic diagram of another display panel provided in an embodiment of the present invention. See also Figure 4 The display panel also includes a second insulating structure 720, which is located on the outer peripheral surface of the conductive connecting post 50 for electrically isolating the outer peripheral surface of the conductive connecting post 50.

[0076] Specifically, such as Figure 4As shown, in one embodiment, vias are provided between the first dielectric layer 810 and the second dielectric layer 820 between different light-emitting elements 20. The vias penetrate the first dielectric layer 810 and the second dielectric layer 820, and conductive material is filled into the vias to form conductive connection pillars 50. Before forming the conductive connection pillars 50, to avoid electrical connection between the conductive connection pillars 50 and the reflective structure 60, a second insulating structure 720 is first formed on the side peripheral surface of the via. Then, the conductive connection pillars 50 are formed on the second insulating structure 720, thereby forming the second insulating structure 720 on the outer peripheral surface of the conductive connection pillars 50. The second insulating structure 720 electrically isolates the conductive connection pillars 50 from the reflective structure 60, thereby preventing short circuit between the first electrode 10 and the second electrode 30 and ensuring the normal operation of the display panel. In addition, the second insulating structure 720 is also used to electrically isolate the metal connection structure 40 from the reflective structure 60, thereby further preventing short circuit between the first electrode 10 and the second electrode 30.

[0077] Optional, Figure 5 This is a cross-sectional schematic diagram of another display panel provided in an embodiment of the present invention. See also Figure 5 The conductive connection post 50 includes a first conductive connection post 510 and a second conductive connection post 520 that are electrically connected. The first conductive connection post 510 is located in the first dielectric layer 810, and the end of the first conductive connection post 510 facing away from the second dielectric layer 820 is electrically connected to the metal connection structure 40. The second conductive connection post 520 is located in the second dielectric layer 820, and the end of the second conductive connection post 520 facing away from the first dielectric layer 810 is electrically connected to the metal contact 100. The end of the second conductive connection post 520 facing the first dielectric layer 810 is electrically connected to the end of the first conductive connection post 510 facing the second dielectric layer 820. In the radial direction of the conductive connection post 50, the width of the end of the first conductive connection post 510 near the second dielectric layer 820 is different from the width of the end of the second conductive connection post 520 near the first dielectric layer 810.

[0078] For example, such as Figure 5In the illustrated embodiment, the first conductive connecting post 510 is disposed within and penetrates the first dielectric layer 810. The second conductive connecting post 520 is disposed within and penetrates the second dielectric layer 820. The first conductive connecting post 510 and the second conductive connecting post 520 at least partially overlap, ensuring that the end of the second conductive connecting post 520 facing the first dielectric layer 810 is electrically connected to the end of the first conductive connecting post 510 facing the second dielectric layer 820, i.e., the first conductive connecting post 510 and the second conductive connecting post 520 are electrically connected. Furthermore, the end of the first conductive connecting post 510 facing away from the second dielectric layer 820 is electrically connected to the metal connection structure 40, thereby achieving an electrical connection between the first conductive connecting post 510 and the metal connection structure 40. The end of the second conductive connecting post 520 facing away from the first dielectric layer 810 is electrically connected to the metal contact 100, thereby realizing the electrical connection between the second conductive connecting post 520 and the metal contact 100. The first electrode 10 is electrically connected to the metal contact 100 through the metal connection structure 40, the first conductive connecting post 510, and the second conductive connecting post 520, thereby providing a driving signal to the corresponding electrically connected first electrode 10 through each metal contact 100, realizing the independent driving of each light-emitting element 20. In addition, in the radial direction of the conductive connecting post 50, the width of the end of the first conductive connecting post 510 near the second dielectric layer 820 is different from the width of the end of the second conductive connecting post 520 near the first dielectric layer 810. The size of the first conductive connecting post 510 can be larger than that of the second conductive connecting post 520, and the cross-sections of both the first conductive connecting post 510 and the second conductive connecting post 520 can be trapezoidal. When the first conductive connecting post 510 and the second conductive connecting post 520 are aligned, the wider end of the first conductive connecting post 510 can be electrically connected to the wider end of the second conductive connecting post 520, which can reduce the alignment accuracy and improve the alignment yield.

[0079] Optionally, multiple lens structures are also provided on the light-emitting side of the display panel, with each lens structure corresponding to one light-emitting element 20. This ensures that the light emitted by each light-emitting element 20 is collimated through the lens structures, improving the light emission effect of the light-emitting element 20. It is understandable that... Figure 1 The example described uses a hemispherical lens as an example, but this is not a limitation. In other embodiments, the lens structure also includes a Fresnel lens. The edge of the Fresnel lens includes multiple protruding structures, and the central region is a semi-elliptical structure. The multiple protruding structures are arranged around the semi-elliptical structure, so that the thickness of the lens structure can be reduced without weakening the light-gathering effect of the lens structure.

[0080] Based on the same inventive concept, embodiments of the present invention also provide a method for manufacturing a display panel. Figure 6 This is a schematic flowchart of a preparation method provided in an embodiment of the present invention. Figure 6As shown, the preparation method includes:

[0081] S110, Prepare the light-emitting element.

[0082] The light-emitting element may include a single-layer light-emitting layer or multiple light-emitting layers. In one embodiment, the light-emitting element may include three light-emitting layers, which are stacked to form a light-emitting platform of the light-emitting element. The light-emitting platform is used to emit light to achieve the light emission display of the light-emitting element. The light-emitting element also includes an upper surface and a lower surface, wherein the upper surface of the light-emitting element can be the surface of the light-emitting platform away from the reflective structure, and the lower surface can be the surface of the light-emitting platform closer to the reflective structure.

[0083] S120, Prepare the first electrode and the second electrode.

[0084] The first electrode can be an N-type electrode, with multiple first electrodes independently arranged. Each first electrode is at least partially electrically connected to the upper surface of the light-emitting element, forming an ohmic contact and ensuring low contact resistance. The second electrode can be a P-type electrode, also electrically connected to the lower surface of the light-emitting element, forming an ohmic contact. Thus, when a voltage is applied to both the first and second electrodes, the light-emitting element can be driven to emit light, ensuring its normal operation.

[0085] S130, Prepare the metal connection structure.

[0086] Specifically, the metal connection structure is a conductive structure used to achieve electrical connection between the first electrode and the metal contacts in the driving substrate, thereby ensuring a simple electrical connection method between the first electrode and the metal contacts. For example, the display panel may further include a driving substrate and conductive connecting pillars. The driving substrate includes multiple metal contacts used to provide electrical signals. The first electrode is electrically connected to the conductive connecting pillars through the metal connection structure, and the conductive connecting pillars are electrically connected to the metal contacts. Thus, each metal contact provides a driving signal to the corresponding electrically connected first electrode through the metal connection structure, realizing independent driving of each light-emitting element. Furthermore, the way the first electrode is electrically connected to the metal connection structure simplifies the electrical connection method between the first electrode and the metal contacts, improving the stability of the electrical connection between the first electrode and the metal contacts.

[0087] It is understandable that, since the first electrode is electrically connected to the conductive connecting post through the metal connection structure, the first electrode is arranged to overlap with the light-emitting element at least partially in the thickness direction of the driving substrate, so as to ensure that the first electrode and the light-emitting element form an ohmic contact. Furthermore, the first electrode and the metal connection structure are staggered, so that the first electrode is bridging with the conductive connecting post through the metal connection structure.

[0088] In summary, the display panel includes a first electrode, a light-emitting element, a second electrode, and a metal connection structure. The light-emitting element includes an upper surface and a lower surface. The first electrode is at least partially electrically connected to the upper surface of the light-emitting element, and the second electrode is at least partially electrically connected to the lower surface of the light-emitting element. The metal connection structure is electrically connected to the first electrode. Thus, the first electrode forms an ohmic contact with the upper surface of the light-emitting element, and the second electrode forms an ohmic contact with the lower surface of the light-emitting element. The normal operation of the display panel is achieved through the first and second electrodes. Furthermore, the electrical connection between the first electrode and the metal connection structure facilitates subsequent electrical connection between the first electrode and the metal contacts of the driving substrate, ensuring a simple electrical connection method between the first electrode and the metal contacts and improving the stability of the electrical connection between the first electrode and the metal contacts.

[0089] Optionally, in yet another embodiment, Figure 7 This is a partial process flow diagram of a display panel provided in an embodiment of the present invention. Figure 8 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention.

[0090] See Figure 7 The fabrication of the light-emitting element 20 and the second electrode 30 includes:

[0091] S210, Provide a substrate 02, and deposit material on one side of the substrate 02 to form a full-layer ohmic contact layer 630 and a light-emitting element layer 03.

[0092] S220: Pattern the entire ohmic contact layer 630 and the light-emitting element layer 03 to prepare multiple ohmic contact layers 630 and multiple light-emitting elements 20.

[0093] Specifically, as shown in steps S210 and S220, when fabricating the light-emitting element 20, the film layer on the upper surface of the light-emitting element 20 is fabricated first, and the film layer on the lower surface of the light-emitting element 20 is fabricated last. That is, the fabrication order of the light-emitting layers in the light-emitting element 20 is the reverse of the actual arrangement order. After all the light-emitting layers of the light-emitting element 20 are fabricated, a full-layer ohmic contact layer 630 is fabricated on the top layer. The full-layer ohmic contact layer 630 and the light-emitting element layer 03 are patterned and etched to form multiple ohmic contact layers 630 and multiple light-emitting elements 20.

[0094] S230, deposit an insulating layer on the side of the ohmic contact layer 630 away from the substrate 02, and pattern the insulating layer to expose the ohmic contact layer 630, so as to form a first insulating structure 710 on the light-emitting element 20.

[0095] Specifically, as shown in step S230, the first insulating structure 710 is at least partially disposed on the side surface of the light-emitting element 20, thereby facilitating the subsequent isolation of the reflective structure and the side surface of the light-emitting element 20 from each other and avoiding interference with the normal operation of the light-emitting element 20. In addition, the first insulating structure 710 also exposes at least a portion of the ohmic contact layer 630, thereby facilitating the subsequent contact and electrical connection between the reflective structure and the ohmic contact layer 630.

[0096] S240. A conductive material is deposited on the side of the ohmic contact layer 630 away from the substrate to form a reflective structure 60. The reflective structure 60 is then patterned to integrally form a sidewall 610 and a bottom wall 620, wherein the bottom wall 620 is the second electrode 30.

[0097] Specifically, as shown in step S240, in this embodiment of the invention, the sidewalls 610 and bottom wall 620 of the reflective structure 60 are fabricated simultaneously in a single process. For example, a conductive material is deposited on the side of the ohmic contact layer 630 away from the substrate to form the reflective structure 60. The reflective structure 60 is deposited on the lower surface and side surface of the light-emitting mesa, integrally forming the sidewalls 610 and bottom wall 620. This allows the sidewalls 610 and bottom wall 620 of the reflective structure 60 to be fabricated simultaneously in a single process, improving the fabrication yield and reducing production costs. Furthermore, the reflective structure 60 is made of a conductive material, and the bottom wall 620 of the reflective structure 60 serves as the second electrode 30, electrically connected to the lower surface of the light-emitting element 20, while the sidewall 610 is electrically isolated from the light-emitting element 20, thereby ensuring the normal light emission of the light-emitting element 20.

[0098] Furthermore, the reflective structure 60 is positioned corresponding to the light-emitting element 20, thereby ensuring that each light-emitting element 20 is located within the space formed by the sidewall 610 and bottom wall 620 of the corresponding reflective structure 60, thus improving the light output and brightness of each light-emitting element 20. In addition, the different reflective structures 60 are electrically connected to each other to form a common electrode, and the bottom wall 620 serves as the second electrode 30 electrically connected to the light-emitting element 20. In this way, the light extraction efficiency of the light-emitting element 20 can be further improved by setting up a common electrode.

[0099] S250. A first dielectric layer 810 is formed on the reflective structure 60, and the first dielectric layer 810 covers the reflective structure 60.

[0100] See also Figure 8 The fabrication of the first electrode 10 and the metal connection structure 40 includes:

[0101] S260. A drive substrate 01 is provided, which includes metal contacts 100 for providing various drive signals.

[0102] S270. A second dielectric layer 820 is prepared on one side of the driving substrate 01.

[0103] Specifically, as shown in step S270, a second dielectric layer 820 is prepared on one side of the driving substrate 01. The second dielectric layer 820 can be a bonding layer, which facilitates subsequent bonding between the second dielectric layer 820 and the first dielectric layer 810.

[0104] S280, the first dielectric layer 810 and the second dielectric layer 820 are fixed by welding, the substrate 02 is removed, and the first electrode 10 is prepared on the light-emitting element 20.

[0105] Specifically, as shown in step S280, the substrate 02 and the driving substrate 01 are arranged opposite to each other so that the first dielectric layer 810 and the second dielectric layer 820 are in contact with each other. Then, the first dielectric layer 810 and the second dielectric layer 820 are fixed by welding. The substrate 02 is removed to expose the light-emitting element 20, and a first electrode 10 is prepared on the upper surface of the light-emitting element 20 so that the first electrode 10 and the light-emitting element 20 form an ohmic contact.

[0106] S290. A via is formed between different light-emitting elements 20. The via penetrates the first dielectric layer 810 and the second dielectric layer 820. A conductive material is filled in the via to form a conductive connection post 50. A metal connection structure 40 is formed on the conductive connection post 50. The conductive connection post 50 is electrically connected to the first electrode 10 through the metal connection structure 40, and the metal contact 100 is electrically connected to the conductive connection post 50.

[0107] Specifically, as shown in step S290, in this embodiment of the invention, the via penetrates the first dielectric layer 810 and the second dielectric layer 820, and the via at least partially overlaps with the metal contact 100. Then, conductive material is filled into the via to form a conductive connection post 50, ensuring that the conductive connection post 50 is electrically connected to the corresponding metal contact 100. Furthermore, a metal connection structure 40 is formed on the side of the conductive connection post 50 facing away from the metal contact 100, so that the conductive connection post 50 is electrically connected to the first electrode 10 through the metal connection structure 40. This allows each metal contact 100 to provide a driving signal to the corresponding electrically connected first electrode 10, thereby achieving independent driving of each light-emitting element 20.

[0108] It should be noted that after the metal connection structure 40 is fabricated, a lens structure can be fabricated on the light-emitting side of the light-emitting element 20 at the position corresponding to each light-emitting element 20, so as to improve the light-emitting effect of the light-emitting element 20 through the lens structure.

[0109] In yet another embodiment, Figure 9 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention. See also Figure 9 After forming vias between different light-emitting elements 20, the process also includes:

[0110] S310, A second insulating structure 720 is formed within the via.

[0111] Specifically, as shown in step S310, in this embodiment of the invention, after fabricating the entire reflective structure 60, the reflective structure 60 may not be patterned, i.e., the entire structure is retained. Then, when preparing vias in the first dielectric layer 810 and the second dielectric layer 820, the vias simultaneously penetrate the corresponding regions of the reflective structure 60. And before fabricating the conductive connecting post 50, a second insulating structure 720 is formed within the via.

[0112] S320, and a conductive connecting post 50 is formed on the second insulating structure 720.

[0113] Specifically, as shown in step S320, a second insulating structure 720 is first prepared on the side peripheral surface of the via, and then a conductive connecting post 50 is prepared on the second insulating structure 720, thereby forming the second insulating structure 720 on the outer peripheral surface of the conductive connecting post 50. The second insulating structure 720 electrically isolates the conductive connecting post 50 from the reflective structure 60, thereby preventing a short circuit between the first electrode 10 and the second electrode 30 and ensuring the normal operation of the display panel. In addition, the second insulating structure 720 is also used to electrically isolate the metal connecting structure from the reflective structure 60, further preventing a short circuit between the first electrode 10 and the second electrode 30.

[0114] Optionally, in yet another embodiment, Figure 10 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention. See also Figure 10 The preparation of the first electrode 10 includes:

[0115] S410, A first dielectric layer 810 is formed on the reflective structure 60, and a concave-convex structure that cooperates with each other is formed on the first dielectric layer 810.

[0116] Specifically, as shown in step S410, a concave-convex structure is prepared on the side of the first dielectric layer 810 away from the substrate 02. The concave-convex structure includes a plurality of first protrusion structures and a plurality of first recess structures, with the first protrusion structures and the first recess structures spaced apart.

[0117] S420. A driving substrate 01 is provided, a second dielectric layer 820 is prepared on one side of the driving substrate 01, and a concave-convex structure that cooperates with each other is formed on the second dielectric layer 820.

[0118] Specifically, as shown in step S420, a concave-convex structure is prepared on the side of the second dielectric layer 820 away from the driving substrate 01. The concave-convex structure includes a plurality of second protrusion structures and a plurality of second recess structures, with the second protrusion structures and the second recess structures spaced apart.

[0119] S430, the first dielectric layer 810 and the second dielectric layer 820 are welded together using a concave-convex structure, the substrate 02 is removed, and the first electrode 10 is fabricated on the light-emitting element 20.

[0120] Specifically, as shown in step S430, the first protruding structure and the second recessed structure are correspondingly arranged, and the first recessed structure and the second protruding structure are correspondingly arranged. During welding, the first protruding structure and the second recessed structure interlock, and the second protruding structure interlocks with the first recessed structure, thereby welding the first dielectric layer 810 and the second dielectric layer 820 together. Thus, by using the interlocking protruding and recessed structures, the alignment difficulty of the first dielectric layer 810 and the second dielectric layer 820 can be reduced.

[0121] Optionally, in yet another embodiment, Figure 11 This is a partial process flow diagram of another display panel provided in an embodiment of the present invention. See also Figure 11 The preparation of conductive connecting post 50 includes:

[0122] S510, a first via is formed in the first dielectric layer 810, the first via penetrates the first dielectric layer 810, and a conductive material is filled in the first via to form a first conductive connection post 510.

[0123] Specifically, as shown in step S510, the first conductive connection post 510 is disposed within the first dielectric layer 810 and penetrates the first dielectric layer 810.

[0124] S520. A driving substrate 01 is provided, a second dielectric layer 820 is prepared on one side of the driving substrate 01, and a second via is formed in the second dielectric layer 820. The second via penetrates the second dielectric layer 820, and a conductive material is filled in the second via to form a second conductive connection post 520.

[0125] Specifically, as shown in step S520, the second conductive connecting post 520 is disposed within the second dielectric layer 820 and penetrates the second dielectric layer 820. The size of the first conductive connecting post 510 can be larger than the size of the second conductive connecting post 520, and both the cross-sections of the first conductive connecting post 510 and the second conductive connecting post 520 can be trapezoidal.

[0126] S530, the first dielectric layer 810, the first conductive connecting post 510, the second dielectric layer 820, and the second conductive connecting post 520 are bonded together to form an adhesive.

[0127] Specifically, as shown in step S530, when aligning the first conductive connecting post 510 and the second conductive connecting post 520, the wider end of the first conductive connecting post 510 can be electrically connected to the wider end of the second conductive connecting post 520. This reduces the alignment accuracy and improves the alignment yield. The first conductive connecting post 510 and the second conductive connecting post 520 at least partially overlap, ensuring that the end of the second conductive connecting post 520 facing the first dielectric layer 810 is electrically connected to the end of the first conductive connecting post 510 facing the second dielectric layer 820, i.e., the first conductive connecting post 510 and the second conductive connecting post 520 are electrically connected. Furthermore, the end of the first conductive connecting post 510 facing away from the second dielectric layer 820 is electrically connected to the metal connection structure, thereby achieving electrical connection between the first conductive connecting post 510 and the metal connection structure. The end of the second conductive connection post 520 facing away from the first dielectric layer 810 is electrically connected to the metal contact 100, thereby realizing the electrical connection between the second conductive connection post 520 and the metal contact 100. The first electrode is electrically connected to the metal contact 100 through the metal connection structure, the first conductive connection post 510 and the second conductive connection post 520, thereby providing a driving signal to the corresponding electrically connected first electrode through each metal contact 100, realizing the independent driving of each light-emitting element 20.

[0128] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include; A first electrode, a light-emitting element, and a second electrode, wherein the light-emitting element includes an upper surface and a lower surface, the first electrode and the upper surface of the light-emitting element are at least partially electrically connected, and the second electrode and the lower surface of the light-emitting element are at least partially electrically connected. A metal connection structure, wherein the metal connection structure is electrically connected to the first electrode; The driving substrate and conductive connecting post are provided. The driving substrate is provided with metal contacts. The two ends of the conductive connecting post are electrically connected to the metal connection structure and the metal contacts, respectively.

2. The display panel according to claim 1, characterized in that, It also includes a reflective structure, which includes a sidewall and a bottom wall. The light-emitting element is located in the space formed by the sidewall and the bottom wall of the reflective structure. The reflective structure is made of a conductive material. The bottom wall of the reflective structure is a second electrode. The sidewall and the light-emitting element are electrically isolated. Each of the reflective structures corresponds to a light-emitting element, and all adjacent reflective structures are electrically connected to form a common electrode.

3. The display panel according to claim 2, characterized in that, It also includes an ohmic contact layer, which is located between the lower surface of the light-emitting element and the bottom wall of the reflective structure to form an ohmic contact.

4. The display panel according to claim 3, characterized in that, It also includes a first insulating structure, at least a portion of which is located between the sidewall and the light-emitting element to form electrical isolation between the sidewall and the light-emitting element, and another portion of the first insulating structure electrically isolates the reflective structure and the first electrode.

5. The display panel according to claim 1, characterized in that, It also includes a first dielectric layer and a second dielectric layer, wherein the conductive connection post is located between adjacent light-emitting elements and penetrates the first dielectric layer and the second dielectric layer.

6. The display panel according to claim 5, characterized in that, Both the side of the first dielectric layer near the second dielectric layer and the side of the second dielectric layer near the first dielectric layer are provided with interlocking concave and convex structures.

7. The display panel according to claim 5, characterized in that, It also includes a second insulating structure located on the outer peripheral surface of the conductive connecting post for electrically isolating the outer peripheral surface of the conductive connecting post.

8. The display panel according to claim 5, characterized in that, The conductive connection post includes a first conductive connection post and a second conductive connection post that are electrically connected. The first conductive connection post is located in the first dielectric layer, and the end of the first conductive connection post facing away from the second dielectric layer is electrically connected to the metal connection structure. The second conductive connection post is located in the second dielectric layer, and the end of the second conductive connection post facing away from the first dielectric layer is electrically connected to the metal contact, and the end of the second conductive connection post facing the first dielectric layer is electrically connected to the end of the first conductive connection post facing the second dielectric layer. In the radial direction of the conductive connecting post, the width of the end of the first conductive connecting post near the second dielectric layer is different from the width of the end of the second conductive connecting post near the first dielectric layer.

9. A method for manufacturing a display panel, characterized in that, include: A light-emitting element is fabricated, the light-emitting element comprising an upper surface and a lower surface; A first electrode and a second electrode are prepared, wherein the first electrode is at least partially electrically connected to the upper surface of the light-emitting element, and the second electrode is at least partially electrically connected to the lower surface of the light-emitting element; A metal connection structure is prepared, wherein the metal connection structure is electrically connected to the first electrode; A driving substrate is provided, the driving substrate including metal contacts; A conductive connecting post and a metal connecting structure are prepared. The conductive connecting post is prepared and a metal connecting structure is prepared on the conductive connecting post. The conductive connecting post is electrically connected to the first electrode through the metal connecting structure, and the metal contact is electrically connected to the conductive connecting post.

10. The preparation method according to claim 9, characterized in that, Fabrication of the light-emitting element and the second electrode includes: A substrate is provided, and a material is deposited on one side of the substrate to form a full-layer ohmic contact layer and a light-emitting element layer. The full-layer ohmic contact layer and the light-emitting element layer are patterned to prepare a plurality of ohmic contact layers and a plurality of light-emitting elements. An insulating layer is deposited on the side of the ohmic contact layer away from the substrate, and the insulating layer is patterned to expose the ohmic contact layer in order to form a first insulating structure on the light-emitting element; A conductive material is deposited on the side of the ohmic contact layer away from the substrate to form a reflective structure, and the reflective structure is patterned to integrally form a sidewall and a bottom wall, wherein the bottom wall is a second electrode; A first dielectric layer is formed on the reflective structure, and the first dielectric layer covers the reflective structure.

11. The preparation method according to claim 10, characterized in that, The fabrication of the first electrode and the metal connection structure includes: A second dielectric layer is prepared on one side of the driving substrate, the first dielectric layer and the second dielectric layer are fixed by welding, the substrate is removed, and a first electrode is prepared on the light-emitting element. The fabrication of conductive connecting pillars and metal connecting structures includes: forming vias between different light-emitting elements, the vias penetrating a first dielectric layer and a second dielectric layer, filling the vias with conductive material to form the conductive connecting pillars, forming metal connecting structures on the conductive connecting pillars, the conductive connecting pillars being electrically connected to the first electrode through the metal connecting structures, and the metal contacts being electrically connected to the conductive connecting pillars; At the position corresponding to each light-emitting element, a lens structure is prepared on the light-emitting side of the light-emitting element.

12. The preparation method according to claim 11, characterized in that, After forming vias between different light-emitting elements, the process also includes: A second insulating structure is formed within the via, and the conductive connection post is formed on the second insulating structure. The second insulating structure is located on the outer peripheral surface of the conductive connection post to electrically isolate the outer peripheral surface of the conductive connection post.

13. The preparation method according to claim 10, characterized in that, The fabrication of the first electrode includes: A driving substrate is provided, a second dielectric layer is prepared on one side of the driving substrate, a concave-convex structure is provided between the first dielectric layer and the second dielectric layer, the first dielectric layer and the second dielectric layer are welded through the concave-convex structure, the substrate is removed, and a first electrode is prepared on the light-emitting element.

14. The preparation method according to claim 10, characterized in that, The fabrication of conductive connecting pillars includes: A first via is formed in a first dielectric layer, the first via penetrating the first dielectric layer, and a first conductive connection post is formed by filling the first via with conductive material. A driving substrate is provided, a second dielectric layer is formed on one side of the driving substrate, and a second via is formed in the second dielectric layer. The second via penetrates the second dielectric layer, and a conductive material is filled in the second via to form a second conductive connection post. The first dielectric layer, the first conductive connecting post, the second dielectric layer, and the second conductive connecting post are bonded together to form an adhesive. In the radial direction of the conductive connecting post, the width of the first conductive connecting post near the second dielectric layer is different from the width of the second conductive connecting post near the first dielectric layer.

Images