Display panel and display device

Abstract

The application discloses a display panel and a display device, and relates to the technical field of display, which comprises a display substrate and an encapsulation layer located on one side of the display substrate. The display substrate comprises a plurality of pixel opening areas and non-opening areas between the pixel opening areas. A first light shielding structure is arranged between a first inorganic layer and a second inorganic layer of the encapsulation layer, replacing an organic layer formed by an existing inkjet printing process, so as to thin the encapsulation layer, which is beneficial to panel thinning and narrow frame design. Meanwhile, the first light shielding structure is arranged in correspondence with the non-opening area, and the first light shielding structure has a first opening for exposing the pixel opening area, so as to ensure that light emitted by a light emitting element of the pixel opening area is emitted through the first opening. The first light shielding structure can shield external ambient light from irradiating a high reflectivity layer of the non-opening area, reduce the reflectivity to the environment, and the first light shielding structure is located in the encapsulation layer and is closer to the light emitting element, so that effective shielding can be realized under a smaller opening size, and the reflection reduction effect is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] In organic light-emitting diode (OLED) display panels, polarizers are typically used to reduce reflection of ambient light. However, polarizers have low transmittance, which affects light extraction efficiency. To address this, the industry has proposed CFOT (Color Filter On TFE) technology, which integrates color filters and a black matrix onto the thin-film encapsulation layer of the display panel to replace polarizers, thereby improving transmittance and reducing panel thickness. However, in existing CFOT display panels, the thin-film encapsulation layer is usually a stacked structure of "inorganic layer-organic layer-inorganic layer". The organic layer is often formed using inkjet printing (IJP). Due to the poor leveling problem of inkjet printing, the organic layer is relatively thick (usually several micrometers or more), and the edges of the organic layer are prone to forming slopes, which is not conducive to panel thinning and narrow bezel design. Furthermore, the problem of ambient light reflection in CFOT display panels has not been fundamentally improved.

[0003] Therefore, how to effectively reduce the reflectivity of the display panel to ambient light and improve the anti-reflection effect while thinning the encapsulation layer of the display panel is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a display panel and display device that, while thinning the encapsulation layer of the display panel, reduces the opening of the exposed high-reflectivity layer in the display panel, thereby reducing reflectivity and improving the anti-reflection effect.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] In a first aspect, this application provides a display panel, the display panel comprising:

[0007] The display substrate includes multiple pixel opening areas and non-opening areas located between adjacent pixel opening areas, and light-emitting elements are correspondingly disposed in the pixel opening areas.

[0008] The encapsulation layer located on one side of the display substrate includes a first inorganic layer, a second inorganic layer located on the side of the first inorganic layer facing away from the display substrate, and a first light-shielding structure located between the first inorganic layer and the second inorganic layer. The first light-shielding structure has a plurality of first openings. In a direction perpendicular to the plane of the display substrate, the first light-shielding structure at least partially overlaps with a non-opening area, and the first openings expose the pixel opening area.

[0009] Secondly, this application provides a display device that includes the aforementioned display panel.

[0010] Compared with existing technologies, the above technical solution has the following advantages:

[0011] The display panel provided in this application includes a display substrate and an encapsulation layer located on one side of the display substrate. The display substrate includes multiple pixel opening areas and non-opening areas located between adjacent pixel opening areas. By setting a first light-shielding structure between the first inorganic layer and the second inorganic layer of the encapsulation layer to replace the organic layer formed by the existing inkjet printing process, the thickness of the encapsulation layer in the display panel is reduced, which is beneficial for panel thinning and narrow bezel design. At the same time, the first light-shielding structure has multiple first openings, and in the direction perpendicular to the plane of the display substrate, the first light-shielding structure at least partially overlaps with the non-opening area. The first openings expose the pixel opening areas to ensure that the light emitted by the light-emitting elements in the pixel opening areas can pass through the first openings. Meanwhile, the first light-shielding structure can block external ambient light from shining on the high reflectivity layer of the non-opening area, reducing the reflectivity of the display panel to ambient light. Furthermore, the first light-shielding structure is located inside the encapsulation layer and is closer to the light-emitting elements in the pixel opening areas, so that the first light-shielding structure can effectively block the high reflectivity layer with a smaller opening size, further improving the anti-reflection effect. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a partial cross-sectional structural diagram of an existing CFOT display panel;

[0014] Figure 2 A partial cross-sectional structural diagram of a display panel provided in an embodiment of this application;

[0015] Figure 3 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0016] Figure 4 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0017] Figure 5 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0018] Figure 6A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0019] Figure 7 This is a schematic diagram showing how the transmittance of a GOC material changes with wavelength.

[0020] Figure 8 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0021] Figure 9 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0022] Figure 10 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0023] Figure 11 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0024] Figure 12 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0025] Figure 13 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0026] Figure 14 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0027] Figure 15 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0028] Figure 16 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0029] Figure 17 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0030] Figure 18 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0031] Figure 19 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0032] Figure 20 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0033] Figure 21A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0034] Figure 22 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0035] Figure 23 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0036] Figure 24 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0037] Figure 25 A partial cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0038] Figure 26 This is a partial top view of a display panel provided in an embodiment of the present application;

[0039] Figure 27 A partial top view of another display panel provided in an embodiment of this application;

[0040] Figure 28 A partial top view of another display panel provided in an embodiment of this application;

[0041] Figure 29 This is a top view of a display device provided in an embodiment of this application. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0043] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0044] Figure 1 A partial cross-sectional structural diagram of a conventional CFOT display panel is shown, as follows: Figure 1 As shown, in a conventional CFOT display panel, a planarization layer PLN, an anode layer RE, a pixel definition layer PDL, an emissive layer EL, an encapsulation layer TFE, a touch layer TPOT, a light-shielding material layer BMO, a color filter layer CF, a cover layer CFOC, and a cover plate 11 are sequentially disposed on the array substrate 10. As described in the background section, the CFOT display panel replaces the traditional polarizer with the touch layer TPOT, the light-shielding material layer BMO, and the color filter layer CF, thereby improving transmittance and reducing panel thickness. The touch layer TPOT may include alternately stacked touch metal layers TP and insulating layers (not shown in the figure). The light-shielding material layer BMO blocks the touch electrode TP1 in the touch metal layer TP above the touch layer TPOT. Figure 1 The diagram only shows the touch metal layer TP, which represents the touch layer TPOT (the insulating layer in the touch layer TPOT is not shown). This is mainly to show that the touch electrode TP1 in the touch metal layer TP is blocked by the light-shielding material layer BM0, and does not represent the actual position.

[0045] like Figure 1 As shown, in existing CFOT display panels, the encapsulation layer TFE includes a first inorganic layer CVD1, an organic layer LIJP, and a second inorganic layer CVD2. The organic layer LIJP is mostly formed by inkjet printing (IJP). Due to the poor leveling problem of inkjet printing, the thickness of the organic layer LIJP is relatively large (usually several micrometers or more), for example, at least 10 micrometers. Moreover, the edge of the organic layer LIJP is prone to forming a slope, which is not conducive to the thinning of the panel and the design of narrow bezels.

[0046] And, as Figure 1 As shown, in existing CFOT display panels, the light-shielding material layer BM0 is disposed above the touch layer TPOT, and the light-shielding material layer BM0 has multiple openings K10 to expose the pixel openings K11 in the pixel definition layer PDL (corresponding to the light-emitting element 20). However, due to the limitations of the thickness and morphology of the underlying organic layer LIJP, the size of the openings K10 of the light-shielding material layer BM0 is difficult to further reduce. As a result, the highly reflective layers such as the anode layer RE and the light-emitting layer EL exposed by the openings K10 of the light-shielding material layer BM0 will still reflect a lot of ambient light. That is, the problem of ambient light reflection in existing CFOT display panels has not been fundamentally improved.

[0047] Therefore, how to effectively reduce the reflectivity of the display panel to ambient light and improve the anti-reflection effect while thinning the encapsulation layer of the display panel is a technical problem that urgently needs to be solved by those skilled in the art.

[0048] In view of this, embodiments of this application provide a display panel, Figure 2 This illustration shows a partial cross-sectional structural diagram of a display panel according to an embodiment of this application, such as... Figure 2 As shown, the display panel includes a display substrate 100 and a TFE encapsulation layer located on one side of the display substrate 100.

[0049] The display substrate 100 includes a plurality of pixel opening regions 110 and non-opening regions 120 located between adjacent pixel opening regions 110. Each pixel opening region 110 is provided with a light-emitting element 20. The light-emitting element 20 may specifically include an anode RE1, a light-emitting layer EL1 and a cathode (not shown in the figure). The anode RE1 of the light-emitting element 20 is located in the anode layer RE, and the light-emitting layer EL1 of the light-emitting element 20 is located in the light-emitting layer EL.

[0050] Specifically, the display substrate 100 may include an array substrate 10 and a planarization layer PLN, an anode layer RE, and a pixel definition layer PDL sequentially disposed on one side of the array substrate 10; the array substrate 10 may include a substrate and a driving circuit layer (not shown in the figure) located on the substrate; the planarization layer PLN is used to cover the driving circuit layer and provide a flat surface for forming the light-emitting element 20; the anode layer RE includes the anode RE1 of the light-emitting element 20, and the anode layer RE is usually made of a metal material with high reflectivity (such as silver, aluminum or their alloys), which easily reflects ambient light; the pixel definition layer PDL has a plurality of pixel openings K11, the pixel openings K11 in the pixel definition layer PDL expose the anode RE1 of the light-emitting element 20 and define a pixel opening area 110, and the light-emitting layer EL1 of the light-emitting element 20 is at least partially located within the pixel openings K11 in the pixel definition layer PDL, and the area between adjacent pixel opening areas 110 in the display panel 100 is the non-opening area 120.

[0051] The encapsulation layer TFE is disposed on one side of the display substrate 100 to prevent water and oxygen from entering the light-emitting element 20. The encapsulation layer TFE includes a first inorganic layer CVD1, a second inorganic layer CVD2 located on the side of the first inorganic layer CVD1 facing away from the display substrate 100, and a first light-shielding structure 30 located between the first inorganic layer CVD1 and the second inorganic layer CVD2.

[0052] Specifically, both the first inorganic layer CVD1 and the second inorganic layer CVD2 can be transparent inorganic thin film encapsulation layers, which can be formed by chemical vapor deposition (CVD). Their materials can include, but are not limited to, silicon oxynitride, silicon nitride, or silicon oxide, and mainly serve to block water vapor.

[0053] In this embodiment, the first light-shielding structure 30 replaces the organic layer LIJP in the prior art and is disposed between the first inorganic layer CVD1 and the second inorganic layer CVD2. In other words, the organic layer LIJP located between the first inorganic layer CVD1 and the second inorganic layer CVD2 in the prior art is directly removed, and the first light-shielding structure 30 is disposed between the first inorganic layer CVD1 and the second inorganic layer CVD2. The thickness of the first light-shielding structure 30 can be much smaller than the thickness of the organic layer LIJP in the prior art, thereby significantly reducing the thickness of the encapsulation layer TFE in the display panel, which is beneficial for panel thinning and narrow bezel design. Furthermore, it eliminates the process steps for preparing the organic layer LIJP (i.e., IJP process) and its subsequent curing, pouring and other related processes, which can also simplify the process flow, reduce production costs, avoid the problems of edge slope and uneven thickness of the encapsulation layer TFE caused by the IJP process, and improve product yield.

[0054] Meanwhile, the first light-shielding structure 30 is provided with multiple first openings K1; in the direction perpendicular to the plane of the display substrate 100, the first light-shielding structure 30 and the non-opening area 120 at least partially overlap, that is, the first light-shielding structure 30 and the non-opening area 120 are correspondingly arranged, and the first openings K1 expose the pixel opening area 110; with this arrangement, on the one hand, the light emitted by the light-emitting element 20 of the pixel opening area 110 can pass through the first openings K1 of the first light-shielding structure 30 to achieve normal display; on the other hand, the first light-shielding structure 30 corresponding to the non-opening area 120 can block external incident light, preventing external incident light from shining on the lower anode layer RE, light-emitting layer EL and other high reflectivity layers, thereby reducing the reflectivity of the display panel to ambient light and improving the anti-reflection effect; and, by The first light-shielding structure 30 is disposed between the first inorganic layer CVD1 and the second inorganic layer CVD2. Compared with the light-shielding material layer BMO disposed above the touch layer TPOT in the prior art, the first light-shielding structure 30 is closer to the light-emitting element 20 of the pixel opening area 110. Therefore, the size of the first opening K1 in the first light-shielding structure 30 can be smaller than the size of the opening K10 in the light-shielding material layer BMO disposed above the touch layer TPOT. Thus, the first light-shielding structure 30 can effectively block the high reflectivity layers such as the anode layer RE and the light-emitting layer EL with a smaller opening size, reducing the area of ​​the high reflectivity layers such as the anode layer RE and the light-emitting layer EL exposed to the pixel opening area 110, which can further reduce the reflectivity of the display panel to ambient light, that is, further improve the anti-reflection effect.

[0055] Regarding the implementation of the first light-shielding structure 30, optionally, in some embodiments of this application, such as... Figure 2As shown, the first light-shielding structure 30 includes a light-shielding material, which can be an organic material with light-absorbing properties, such as black photoresist or black resin. That is, the first light-shielding structure 30 can be a light-shielding layer BM1. It can be understood that through photolithography, multiple first openings K1 can be formed in the light-shielding layer BM1 to form a first light-shielding structure 30 with multiple first openings K1.

[0056] Further optional, such as Figure 2 As shown, the encapsulation layer TFE of the display panel may also include a first adhesive layer OC1 located between the first inorganic layer CVD1 and the second inorganic layer CVD2, a first light-shielding structure 30 (light-shielding layer BM1) located on the side of the first adhesive layer OC1 away from the display substrate 100, and the first light-shielding structure 30 (light-shielding layer BM1) is at least partially embedded in the first adhesive layer OC1.

[0057] Specifically, a first adhesive layer OC1 can be coated onto the first inorganic CVD layer 1 first, and then the first adhesive layer OC1 can be partially cured or semi-cured. A light-shielding layer BM1 can then be formed on the first adhesive layer OC1. Through photolithography and imprinting processes, multiple first openings K1 can be formed in the light-shielding layer BM1, so that at least a portion of the light-shielding layer BM1 is embedded within the first adhesive layer OC1. Alternatively, a portion of the first adhesive layer OC1 can be coated onto the first inorganic CVD layer 1 first, and then a light-shielding layer BM1 with multiple first openings K1 can be formed. The remaining first adhesive layer OC1 can then be formed, so that at least a portion of the light-shielding layer BM1 is embedded within the first adhesive layer OC1.

[0058] It is understandable that the first adhesive layer OC1 is a transparent organic material layer, meaning that the thickness of the first adhesive layer OC1 is much smaller than the thickness of the organic layer LIJP in the prior art. Therefore, this setting can still significantly reduce the thickness of the encapsulation layer TFE in the display panel, which is beneficial for panel thinning and narrow bezel design. Furthermore, the first adhesive layer OC1 can play a planarization role, providing a flat surface for the patterning of the light-shielding layer BM1. On the other hand, it can also protect the first inorganic layer CVD1. For example, the thickness of the first adhesive layer OC1 is greater than 2μm, which avoids damage to the first inorganic layer CVD1 when forming multiple first openings K1 during the etching or cleaning process of the light-shielding layer BM1.

[0059] Another option, such as Figure 3 As shown, Figure 3 This illustration shows a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application, and... Figure 2 The display panel shown is different in that... Figure 3In the display panel shown, in addition to the first light-shielding structure 30 (light-shielding layer BM1), the second adhesive layer OC2 is also included between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE. The second adhesive layer OC2 covers the first light-shielding structure 30 (light-shielding layer BM1) and fills the first opening K1 in the first light-shielding structure 30 (light-shielding layer BM1).

[0060] Specifically, a light-shielding layer BM1 with multiple first openings K1 can be formed on the first inorganic layer CVD1. Then, a second adhesive layer OC2 is coated on the side of the light-shielding layer BM1 away from the display substrate 100. The second adhesive layer OC2 fills the first openings K1 of the light-shielding layer BM1 and covers the surface of the light-shielding layer BM1, thereby providing a flat surface for the deposition of the second inorganic layer CVD2.

[0061] It is understandable that the second adhesive layer OC2 is a transparent organic material layer, meaning that the thickness of the second adhesive layer OC2 is much smaller than the thickness of the organic layer LIJP in the prior art. Therefore, this design can still significantly reduce the thickness of the encapsulation layer TFE in the display panel, which is beneficial for panel thinning and narrow bezel design. Furthermore, the second adhesive layer OC2 can, on the one hand, play a planarization role, providing a flat surface for the deposition of the second inorganic layer CVD2, ensuring that the second inorganic layer CVD2 has good coverage and density. On the other hand, it can also play a buffering role, alleviating the impact between the first light-shielding structure 30 (light-shielding layer BM1) and... The stress between the second inorganic layers CVD2 improves the reliability of the encapsulation layer TFE. Furthermore, the second adhesive layer OC2 covers the first light-shielding structure 30 (light-shielding layer BM1), that is, the first light-shielding structure 30 (light-shielding layer BM1) is located on the side of the second adhesive layer OC2 closer to the display substrate 100. Therefore, the first light-shielding structure 30 (light-shielding layer BM1) is closer to the light-emitting element 20 of the pixel opening area 110. Thus, the first light-shielding structure 30 (light-shielding layer BM1) can effectively block high reflectivity layers such as the anode layer RE and the light-emitting layer EL with a smaller opening size, further improving the anti-reflection effect.

[0062] Further, another option, such as Figure 4 As shown, Figure 4 This illustration shows a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application, and... Figure 2 and Figure 3 The display panel shown is different in that... Figure 4In the display panel shown, in addition to the first light-shielding structure 30 (light-shielding layer BM1) between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, there are also a first adhesive layer OC1 and a second adhesive layer OC2. The first light-shielding structure 30 (light-shielding layer BM1) is located between the first adhesive layer OC1 and the second adhesive layer OC2. With this configuration, the total thickness of the first adhesive layer OC1, the first light-shielding structure 30 (light-shielding layer BM1), and the second adhesive layer OC2 between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE is still much smaller than the thickness of the organic layer LIJP in the prior art. This can still significantly reduce the thickness of the encapsulation layer TFE in the display panel, which is beneficial for panel thinning and narrow bezels. The frame design; furthermore, the first adhesive layer OC1 and the second adhesive layer OC2 provide planarization and buffer protection for the light-shielding layer BM1 from the top and bottom sides, respectively, further improving the structural stability and reliability of the encapsulation layer TFE. The first adhesive layer OC1 can also protect the first inorganic layer CVD1, avoiding damage to the first inorganic layer CVD1 when multiple first openings K1 are formed during the etching or cleaning process of the light-shielding layer BM1. The second adhesive layer OC2 can also provide a flat surface for the deposition of the second inorganic layer CVD2. The first light-shielding structure 30 (light-shielding layer BM1) can also effectively block high-reflectivity layers such as the anode layer RE and the light-emitting layer EL with a smaller opening size, further improving the anti-reflection effect.

[0063] Of course, another option is, such as Figure 5 As shown, Figure 5 A partial cross-sectional structural diagram of another display panel provided in this application embodiment is shown. It can be seen that a first light-shielding structure 30 (light-shielding layer BM1) can also be provided between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE. In this case, the thickness of the encapsulation layer TFE in the display panel can be further reduced, which is beneficial for panel thinning and narrow bezel design. However, in this case, the first inorganic layer CVD1 and the second inorganic layer CVD2 may be in direct contact over a large area. If both the first inorganic layer CVD1 and the second inorganic layer CVD2 are formed by chemical vapor deposition (CVD), there may be mechanical problems. Using atomic layer deposition (ALD) would improve this.

[0064] like Figures 2-5As shown, regardless of whether only a first light-shielding structure 30 (light-shielding layer BM1) is provided between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, or whether at least one of the first light-shielding structure 30 (light-shielding layer BM1) is provided between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE and the first adhesive layer OC1 and the second adhesive layer OC2 is superimposed, the display panel may also include a touch layer TPOT located on the side of the encapsulation layer TFE away from the display substrate 100, and the touch layer TPOT includes a plurality of touch electrodes TP1.

[0065] Optionally, the touch layer TPOT may include alternating layers of touch metal layers TP and insulating layers (not shown in the figure). The touch metal layers TP may include multiple touch electrodes TP1, which are used to implement touch detection functionality. It is understood that the material of the touch electrodes TP1 is typically a metal (e.g., molybdenum, aluminum, titanium, or their alloys), which has high reflectivity and easily reflects ambient light. Therefore, the touch electrodes TP1 need to be shielded on the side of the touch layer TPOT facing away from the display substrate 100 to avoid affecting the display effect.

[0066] like Figures 2-5 As shown, the display panel also includes a second light-shielding structure 40 located on the side of the touch layer TPOT facing away from the display substrate 100. The second light-shielding structure 40 may include a light-shielding material, such as black photoresist or black resin, which are organic materials with light-absorbing properties. That is, the second light-shielding structure 40 can be a light-shielding layer BM2. The second light-shielding structure 40 (light-shielding layer BM2) blocks the touch electrode TP1. In the direction perpendicular to the plane of the display substrate 100, the second light-shielding structure 40 and the touch electrode TP1 at least partially overlap, thereby preventing ambient light from being reflected by the touch electrode TP1. The second light-shielding structure 40 (light-shielding layer BM2) has multiple second openings K2. The second openings K2 expose the first openings K1 in the first light-shielding structure 30, thereby ensuring that the light emitted by the light-emitting element 20 in the pixel opening area 110 passes through the first opening K1 and the second openings K2 in sequence and then exits normally to achieve normal image display. Specifically, multiple second openings K2 can be formed in the light-shielding layer BM2 by photolithography.

[0067] like Figures 2-5As shown, the display panel also includes a color resist layer 50 located on the side of the second light-shielding structure 40 (light-shielding layer BM2) facing away from the display substrate 100. The color resist layer 50 includes a plurality of color resist units 51. In the direction perpendicular to the plane of the display substrate 100, the color resist units 51 are correspondingly arranged with the light-emitting elements 20 in the pixel opening area 110. That is, in the direction perpendicular to the plane of the display substrate 100, each color resist unit 51 is correspondingly arranged with the second opening K2, the first opening K1, and the light-emitting elements 20 exposed by these two openings, so that the light emitted by the light-emitting element 20 passes through the first opening K1 and the second opening K2, and is filtered by the corresponding color resist unit 51 before being emitted. That is, the color resist unit 51 selectively transmits the light of the corresponding color emitted by the light-emitting element 20, while absorbing or filtering light of other wavelengths to improve the color purity of the emitted light and reduce the reflection of ambient light.

[0068] Understandably, the touch layer TPOT, the second light-shielding structure 40 (light-shielding layer BM2), and the color resist layer 50 (similar to a color filter layer) together replace the traditional polarizer. While reducing the reflectivity to ambient light, they also increase the transmittance of light of the corresponding color emitted by the light-emitting element 20, thereby improving the color purity of the emitted light.

[0069] It is also understandable that the second light-shielding structure 40 (light-shielding layer BM2) is located on the side of the color resist layer 50 closer to the display substrate 100. Therefore, the second light-shielding structure 40 (light-shielding layer BM2) is relatively closer to the light-emitting element 20 in the pixel opening region 110. This effectively shields the touch electrode TP1, thereby reducing the size of the second opening K2 in the second light-shielding structure 40 (light-shielding layer BM2). This further reduces the reflective area of ​​the high-reflectivity layers (such as the anode layer RE, the light-emitting layer EL, etc.) exposed to the pixel opening region 110, more effectively reducing the reflectivity of the display panel to ambient light and improving the anti-reflection effect. Simultaneously, the smaller size of the second opening K2 in the second light-shielding structure 40 (light-shielding layer BM2) also helps to improve the light purity emitted from the pixel opening region 110, reduce light crosstalk between adjacent pixels, and improve display quality.

[0070] Further optional, such as Figures 2-5 As shown, the plurality of pixel opening regions 110 include a first pixel opening region 111, a second pixel opening region 112 and a third pixel opening region 113. The first pixel opening region 111 is provided with a first color light-emitting element 21, the second pixel opening region 112 is provided with a second color light-emitting element 22, and the third pixel opening region 113 is provided with a third color light-emitting element 23.

[0071] Accordingly, one possible implementation of the color resist layer 50 is as follows: Figures 2-5As shown, the plurality of color resist units 51 include a first color resist unit 511, a second color resist unit 512, and a third color resist unit 513. In the direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 overlaps at least partially with the first color light-emitting element 21, the second color resist unit 512 overlaps at least partially with the second color light-emitting element 22, and the third color resist unit 513 overlaps at least partially with the third color light-emitting element 23. That is, for any color light-emitting element, a color resist unit is provided for filtering.

[0072] For example, the first color light-emitting element 21 can be a red light-emitting element for emitting red light; the second color light-emitting element 22 can be a blue light-emitting element for emitting blue light; and the third color light-emitting element 23 can be a green light-emitting element for emitting green light. Correspondingly, in the color resist layer 50, the first color resist unit 511 can be a red color resist unit, corresponding to the first color light-emitting element 21 (red light-emitting element); the second color resist unit 512 can be a blue color resist unit, corresponding to the second color light-emitting element 22 (blue light-emitting element); and the third color resist unit 513 can be a green color resist unit, corresponding to the third color light-emitting element 23 (green light-emitting element).

[0073] Correspondingly, another optional implementation of the color resist layer 50 is, as follows: Figure 6 As shown, Figure 6 This illustration shows a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application, and... Figures 2-5 The display panel shown is different in that... Figure 6In the display panel shown, the multiple color resist units 51 may include only the first color resist unit 511 and the second color resist unit 512, without including the third color resist unit; correspondingly, the encapsulation layer TFE also includes a third adhesive layer OC3 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The transmittance of the third adhesive layer OC3 for the third color light emitted by the third color light-emitting element 23 is greater than the transmittance for the first color light emitted by the first color light-emitting element 21, and greater than the transmittance for the second color light emitted by the second color light-emitting element 22. That is, by using the third adhesive layer OC3 to replace the third color resist unit, the third color light emitted by the third color light-emitting element 23 is transmitted with higher transmittance. The high transmittance achieves a filtering effect similar to that of the third color resist unit, thereby eliminating the need for the fabrication of the third color resist unit, reducing the number of photolithography steps, simplifying the process, and lowering production costs. At the same time, the first color light emitted by the first color light-emitting element 21 passes through the third adhesive layer OC3 with a relatively low transmittance and is selectively transmitted by the corresponding first color resist unit 511. The second color light emitted by the second color light-emitting element 22 passes through the third adhesive layer OC3 with a relatively low transmittance and is selectively transmitted by the corresponding second color resist unit 512. Thus, the color resist layer 50 includes only two color resist units, which can also reduce the overall thickness of the color resist layer 50, which is beneficial for the thinning of the display panel.

[0074] It is understood that the third adhesive layer OC3 can be similar to the first adhesive layer OC1, and is disposed on the side of the first light-shielding structure 30 (light-shielding layer BM1) close to the display substrate 100, or it can be similar to the second adhesive layer OC2, and is disposed on the side of the first light-shielding structure 30 (light-shielding layer BM1) away from the display substrate 100. This application does not limit this.

[0075] For example, the first color light-emitting element 21 can be a red light-emitting element for emitting red light; the second color light-emitting element 22 can be a blue light-emitting element for emitting blue light; and the third color light-emitting element 23 can be a green light-emitting element for emitting green light. Correspondingly, in the color resist layer 50, the first color resist unit 511 can be a red color resist unit, corresponding to the first color light-emitting element 21 (red light-emitting element); the second color resist unit 512 can be a blue color resist unit, corresponding to the second color light-emitting element 22 (blue light-emitting element); and the third adhesive layer OC3 can be a GOC (Green On Color filter) material. GOC material is an organic material formed by adding pigments or dyes to optical adhesive (OC) materials (such as acrylic or epoxy resin), which has selective absorption characteristics for light of a specific wavelength. Specifically, as... Figure 7 As shown, Figure 7A schematic diagram showing the transmittance of a GOC material as a function of wavelength is shown. It can be seen that the peak transmittance of the GOC material in the 550nm±50nm band (green light band) is higher than that in the 450nm±50nm band (blue light band) and the 650nm±50nm band (red light band). Therefore, the GOC material has higher transmittance in the green light band and relatively lower transmittance in the red and blue light bands, and can replace the green color resist unit.

[0076] Figure 8 This illustration shows a partial cross-sectional structural diagram of another display panel provided in this application embodiment. Taking the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE as an example, it includes a first light-shielding structure 30 (light-shielding layer BM1) and a second adhesive layer OC2. Figure 3 The same display panel shown also has a first light-shielding structure 30 (light-shielding layer BM1) and a second adhesive layer OC2 disposed between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE. Figure 8 In the display panel shown, the plurality of pixel opening areas 110 include a first pixel opening area 111, a second pixel opening area 112, and a third pixel opening area 113. The first pixel opening area 111 is correspondingly provided with a first color light-emitting element 21, the second pixel opening area 112 is correspondingly provided with a second color light-emitting element 22, and the third pixel opening area 113 is correspondingly provided with a third color light-emitting element 23. The display panel may also include a touch layer TPOT located on the side of the encapsulation layer TFE away from the display substrate 100, the touch layer TPOT including a plurality of touch electrodes TP1. Furthermore, the display panel also includes a second light-shielding structure 40 located on the side of the touch layer TPOT away from the display substrate 100. However, compared to… Figure 3 The display panel shown is different in that... Figure 8 In the display panel shown, the second light-shielding structure 40 is not composed of light-shielding material (i.e., light-shielding layer BM2), but is formed by stacking different colored color resist blocks in the color resist layer 50.

[0077] Specifically, such as Figure 8As shown, the display panel also includes a color resist layer 50 located on the side of the touch layer TPOT facing away from the display substrate 100. The color resist layer 50 includes a first color resist layer 501, a second color resist layer 502, and a third color resist layer 503. The first color resist layer 501 includes a first color resist unit 511 and a first block B1. In a direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21, used to filter the first color light emitted by the first color light-emitting element 21. The first block B1 at least partially overlaps with the non-opening area 120. The second color resist layer 502 includes a second color resist unit 512 and a second block B2. In a direction perpendicular to the plane of the display substrate 100, the second color resist unit 512 at least partially overlaps with the second color light-emitting element 22, used to filter the first color light emitted by the second color light-emitting element 22. The second color light is filtered, and the second block B2 overlaps at least partially with the non-opening area 120; the third color resist layer 503 includes a third color resist unit 513 and a third block B3. In the direction perpendicular to the plane of the display substrate 100, the third color resist unit 513 overlaps at least partially with the third color light-emitting element 23 to filter the third color light emitted by the third color light-emitting element 23, and the third block B3 overlaps at least partially with the non-opening area 120; that is, while forming the corresponding color resist unit, each color resist layer also retains a block (first block B1, second block B2 and third block B3) at the position corresponding to the non-opening area 120. The first block B1, the second block B2 and the third block B3 each overlap at least partially with the non-opening area 120. These blocks themselves are not used for filtering, but are used to form the second light-shielding structure 40.

[0078] like Figure 8 As shown, the second light-shielding structure 40 includes at least two of the first block B1, the second block B2, and the third block B3 in a stacked structure 41 along a direction perpendicular to the plane of the display substrate 100. That is, at least two of the first block B1, the second block B2, and the third block B3 are stacked together at the position corresponding to the non-opening area 120 to form the stacked structure 41. The stacked structure 41 serves as the second light-shielding structure 40 to block the touch electrode TP1. Furthermore, there is a second opening K2 between the different stacked structures 41. The second opening K2 exposes the first opening K1 in the first light-shielding structure 30, ensuring that the light emitted by the light-emitting element 20 in the pixel opening area 110 can pass through the first opening K1 and the second opening K2 in sequence and be emitted normally.

[0079] For example, the first color resist layer 501 can be a red color resist layer that selectively transmits red light, then the first color resist unit 511 is a red color resist unit, and the first block B1 is a red color resist block; the second color resist layer 502 can be a blue color resist layer that selectively transmits blue light, then the second color resist unit 512 is a blue color resist unit, and the second block B2 is a blue color resist block; the third color resist layer 503 can be a green color resist layer that selectively transmits green light, then the third color resist unit 513 is a green color resist unit, and the third block B3 is a green color resist block.

[0080] It is understandable that the red color-blocking block (such as the first block B1) allows long-wavelength (approximately 600nm-700nm) red light to pass through, while the blue color-blocking block (such as the second block B2) allows short-wavelength (approximately 400nm-500nm) blue light to pass through. However, when the red and blue color-blocking blocks overlap, the wavelengths they allow to pass through do not overlap. Therefore, neither red nor blue light can pass through the overlapping area of ​​the red and blue color-blocking blocks. In other words, this overlapping area has a good light-blocking effect on visible light and can replace light-blocking materials to achieve the light-blocking function. Similarly, overlapping of red color resist blocks (such as the first block B1) with green color resist blocks (such as the third block B3), overlapping of blue color resist blocks (such as the second block B2) with green color resist blocks (such as the third block B3), or overlapping of red color resist blocks (such as the first block B1), blue color resist blocks (such as the second block B2), and green color resist blocks (such as the third block B3) can all achieve a light-blocking effect. Therefore, by overlapping color resist blocks of different colors in the non-opening area 120, a layered structure 41 with light-blocking function can be formed as the second light-blocking structure 40, eliminating the need to prepare an additional light-blocking material layer (i.e., light-blocking layer BM2), thereby reducing process complexity, improving production efficiency, and reducing production costs.

[0081] It is also understood that the specific overlapping method of the stacked structure 41 (e.g., which color resist blocks overlap) can be selected according to actual process requirements. For example, the stacked structure 41 can be a stacked structure of red resist blocks (e.g., the first block B1) and blue resist blocks (e.g., the second block B2), a stacked structure of red resist blocks (e.g., the first block B1) and green resist blocks (e.g., the third block B3), a stacked structure of green resist blocks (e.g., the third block B3) and blue resist blocks (e.g., the second block B2), or a stacked structure of red resist blocks (e.g., the first block B1), blue resist blocks (e.g., the second block B2), and green resist blocks (e.g., the third block B3). This application does not limit this, as long as the stacked structure 41 can play a light-blocking role.

[0082] Figure 9 This illustration shows a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application, and... Figure 8 The difference in the display panels shown is that, Figure 9 In the display panel shown, the color resist layer 50 includes only a first color resist layer 501 and a second color resist layer 502. The first color resist layer 501 includes a first color resist unit 511 and a first block B1. In a direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21 to filter the first color light emitted by the first color light-emitting element 21. The first block B1 at least partially overlaps with the non-opening area 120. The second color resist layer 502 includes a second color resist unit 512 and a second block B2. In a direction perpendicular to the plane of the display substrate 100, the second color resist unit 512 at least partially overlaps with the second color light-emitting element 22 to filter the second color light emitted by the second color light-emitting element 22. The second block B2 at least partially overlaps with the non-opening area 120. The two blocks overlap at least partially, meaning that the first block B1 and the second block B2 each overlap at least partially with the non-opening area 120. The second light-shielding structure 40 located on the side of the touch layer TPOT away from the display substrate 100 includes a stacked structure 42 of the first block B1 and the second block B2 along a direction perpendicular to the plane of the display substrate 100. That is, the first block B1 and the second block B2 are stacked together at the corresponding positions in the non-opening area 120 to form a stacked structure 42. This stacked structure 42 serves as the second light-shielding structure 40 to block the touch electrode TP1. Furthermore, there is a second opening K2 between the different stacked structures 42. The second opening K2 exposes the first opening K1 in the first light-shielding structure 30, ensuring that the light emitted by the light-emitting element 20 in the pixel opening area 110 can pass through the first opening K1 and the second opening K2 in sequence and be emitted normally.

[0083] Meanwhile, the encapsulation layer TFE also includes a third adhesive layer OC3 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The transmittance of the third adhesive layer OC3 for the third color light emitted by the third color light-emitting element 23 is greater than that for the first color light emitted by the first color light-emitting element 21, and greater than that for the second color light emitted by the second color light-emitting element 22. That is, the third adhesive layer OC3 replaces the third color resist unit in the third color resist layer, so that the third color light emitted by the third color light-emitting element 23 passes through with a higher transmittance, achieving a filtering effect similar to that of the third color resist unit in the third color resist layer. The light-emitting effect can eliminate the need for the preparation of the third color resist layer, thereby reducing the number of photolithography steps, simplifying the process, and reducing production costs. At the same time, the first color light emitted by the first color light-emitting element 21 passes through the third adhesive layer OC3 with a relatively low transmittance and is selectively transmitted by the corresponding first color resist unit 511. The second color light emitted by the second color light-emitting element 22 passes through the third adhesive layer OC3 with a relatively low transmittance and is selectively transmitted by the corresponding second color resist unit 512. Thus, the color resist layer 50 only includes two colors, which can also reduce the overall thickness of the color resist layer 50, which is beneficial for the thinning of the display panel.

[0084] It is understood that the third adhesive layer OC3 can be similar to the first adhesive layer OC1, and is disposed on the side of the first light-shielding structure 30 (light-shielding layer BM1) close to the display substrate 100, or it can be similar to the second adhesive layer OC2, and is disposed on the side of the first light-shielding structure 30 (light-shielding layer BM1) away from the display substrate 100. This application does not limit this.

[0085] For example, the first color light-emitting element 21 can be a red light-emitting element for emitting red light; the second color light-emitting element 22 can be a blue light-emitting element for emitting blue light; and the third color light-emitting element 23 can be a green light-emitting element for emitting green light. Correspondingly, in the color resist layer 50, the first color resist unit 511 can be a red color resist unit, corresponding to the first color light-emitting element 21 (red light-emitting element); the second color resist unit 512 can be a blue color resist unit, corresponding to the second color light-emitting element 22 (blue light-emitting element); and the third adhesive layer OC3 can be a GOC material layer, which has high transmittance in the green light band and relatively low transmittance in the red and blue light bands, and can replace the green color resist unit.

[0086] The foregoing embodiments are mainly illustrated by taking the example of the color resist layer 50 being located on the side of the touch layer TPOT that is away from the display substrate 100. Figure 10 and Figure 11 This paper shows partial cross-sectional structural diagrams of two more display panels provided in embodiments of this application, which are similar to those described above. Figures 2-6 as well as Figures 8-9 The display panel shown is different in that... Figures 10-11 In the display panel shown, in addition to the light-shielding layer BM1 serving as the first light-shielding structure 30, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE also include a color resist layer 50. It is understood that the thickness of the color resist layer 50 is much smaller than the thickness of the organic layer LIJP in the prior art. Therefore, the total thickness of the first light-shielding structure 30 (light-shielding layer BM1) and the color resist layer 50 between the first inorganic layer CVD1 and the second inorganic layer CVD2 in the encapsulation layer TFE is still much smaller than the thickness of the organic layer LIJP in the prior art, and the thickness of the display panel can still be significantly reduced. The thickness of the encapsulation layer TFE is beneficial for panel thinning and narrow bezel design; and the color resist layer 50 covers the first light-shielding structure 30 (light-shielding layer BM1), that is, the first light-shielding structure 30 (light-shielding layer BM1) is located on the side of the color resist layer 50 closer to the display substrate 100. In this way, the first light-shielding structure 30 (light-shielding layer BM1) is relatively closer to the light-emitting element 20 of the pixel opening area 110, which is beneficial for achieving effective shielding of high reflectivity layers such as the anode layer RE and the light-emitting layer EL with a smaller first opening K1 size, thereby further reducing the reflectivity of the display panel to ambient light.

[0087] like Figure 10 and Figure 11 As shown, the color resist layer 50 includes multiple color resist units 51. The color resist units 51 fill the first opening K1 in the first light-shielding structure 30 (light-shielding layer BM1) and are correspondingly disposed with the light-emitting element 20. That is, in a direction perpendicular to the plane of the display substrate 100, each color resist unit 51 at least partially overlaps with a light-emitting element 20. The light emitted by the light-emitting element 20 is filtered by the corresponding color resist unit 51 before being emitted, thereby improving the color purity of the emitted light and simultaneously reducing reflection of ambient light. Simultaneously, the color resist layer 50 filling the first opening K1 and covering the first light-shielding structure 30 (light-shielding layer BM1) also serves a planarization function, providing a flat surface for the deposition of the second inorganic CVD2 layer, ensuring that the second inorganic CVD2 layer has good coverage and density.

[0088] Further optional, such as Figure 10 and Figure 11 As shown, in addition to the first light-shielding structure 30 (light-shielding layer BM1) and the color resist layer 50, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE may also include the first adhesive layer OC1 and / or the second adhesive layer OC2.

[0089] Among them, such as Figure 11As shown, when the encapsulation layer TFE also includes a first adhesive layer OC1 located between the first inorganic layer CVD1 and the second inorganic layer CVD2, the first adhesive layer OC1 is located on the side of the color resist layer 50 and the first light-shielding structure 30 (light-shielding layer BM1) close to the display substrate 100. The first adhesive layer OC1 can play a planarization role, providing a flat surface for the formation of the color resist layer 50 and the first light-shielding structure 30 (light-shielding layer BM1), and at the same time, it can also protect the first inorganic layer CVD1, avoiding damage to the first inorganic layer CVD1 in subsequent processes.

[0090] like Figure 10 and Figure 11 As shown, when the encapsulation layer TFE also includes a second adhesive layer OC2 located between the first inorganic layer CVD1 and the second inorganic layer CVD2, the second adhesive layer OC2 is located on the side of the color resist layer 50 and the first light-shielding structure 30 (light-shielding layer BM1) away from the display substrate 100. That is, the second adhesive layer OC2 covers the color resist layer 50, providing a flat surface for the deposition of the second inorganic layer CVD2, ensuring that the second inorganic layer CVD2 has good coverage and density, and at the same time can play a buffering role, relieving the stress between the underlying film layer and the second inorganic layer CVD2, and improving the reliability of the encapsulation layer TFE.

[0091] like Figure 11 As shown, the encapsulation layer TFE may also include a first adhesive layer OC1 and a second adhesive layer OC2. Specifically, the first adhesive layer OC1 is located on the side of the color resist layer 50 and the first light-shielding structure 30 (light-shielding layer BM1) closer to the display substrate 100, while the second adhesive layer OC2 is located on the side of the color resist layer 50 and the first light-shielding structure 30 (light-shielding layer BM1) away from the display substrate 100. The first light-shielding structure 30 (light-shielding layer BM1) and the color resist layer 50 are located between the first adhesive layer OC1 and the second adhesive layer OC2. With this configuration, the first adhesive layer OC1 and the second adhesive layer OC2 provide planarization and buffer protection for the color resist layer 50 and the first light-shielding structure 30 (light-shielding layer BM1) from the top and bottom, respectively, further improving the structural stability and reliability of the encapsulation layer TFE.

[0092] In addition, since the color resist layer 50 itself has good leveling properties, it can directly cover the first light-shielding structure 30 (light-shielding layer BM1) and fill the first opening K1, providing a flat surface for the deposition of the second inorganic layer CVD2. Therefore, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE can be provided only with the first light-shielding structure 30 (light-shielding layer BM1) and the color resist layer 50, without the first adhesive layer OC1 and / or the second adhesive layer OC2. In this way, the number of film layers between the first inorganic layer CVD1 and the second inorganic layer CVD2 in the encapsulation layer TFE is less, the total thickness is thinner, and it is more conducive to the thinning of the panel.

[0093] It should be noted that this application does not limit the order of film formation of different color resist layers, and the film formation method of each color resist layer may be based on the material characteristics of the resist layer, including but not limited to photolithography or inkjet printing.

[0094] Regarding the specific arrangement of the color resist layer 50 between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, it is optional, such as... Figure 10 and Figure 11 As shown, the plurality of pixel opening regions 110 include a first pixel opening region 111, a second pixel opening region 112, and a third pixel opening region 113. The first pixel opening region 111 is correspondingly provided with a first color light-emitting element 21, the second pixel opening region 112 is correspondingly provided with a second color light-emitting element 22, and the third pixel opening region 113 is correspondingly provided with a third color light-emitting element 23. The plurality of color resist units 51 include a first color resist unit 511, a second color resist unit 512, and a third color resist unit 513. In the direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21, the second color resist unit 512 at least partially overlaps with the second color light-emitting element 22, and the third color resist unit 513 at least partially overlaps with the third color light-emitting element 23. That is to say, the color resist layer 50 includes color resist units of three colors, which are respectively provided in correspondence with the three color light-emitting elements 20.

[0095] Another option, such as Figure 12 As shown, Figure 12 This illustration shows a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application, and... Figure 10 and Figure 11 The display panel shown is different in that... Figure 12In the display panel shown, the multiple color resist units 51 may include only the first color resist unit 511 and the second color resist unit 512, excluding the third color resist unit. Correspondingly, the encapsulation layer TFE also includes a third adhesive layer OC3 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The transmittance of the third adhesive layer OC3 for the third color light emitted by the third color light-emitting element 23 is greater than its transmittance for the first color light emitted by the first color light-emitting element 21, and greater than its transmittance for the second color light emitted by the second color light-emitting element 22. That is, by using the third adhesive layer OC3 to replace the third color resist unit, the third color light emitted by the third color light-emitting element 23 can pass through with higher transmittance, achieving a similar filtering effect to the third color resist unit, thus eliminating the need for a third color resist unit. The fabrication of the third color resist unit reduces the number of photolithography steps, simplifies the process, and lowers production costs. At the same time, the first color light emitted by the first color light-emitting element 21 is selectively transmitted by the corresponding first color resist unit 511 and passes through the third adhesive layer OC3 with a relatively low transmittance. The second color light emitted by the second color light-emitting element 22 is selectively transmitted by the corresponding second color resist unit 512 and passes through the third adhesive layer OC3 with a relatively low transmittance. Thus, the color resist layer 50 includes only two color resist units, which can also reduce the overall thickness of the color resist layer 50 and is beneficial for the thinning of the display panel.

[0096] It is understood that the third adhesive layer OC3 can be disposed on the side of the first light-shielding structure 30 (light-shielding layer BM1) and the color resist layer 50 close to the display substrate 100 (i.e., between the color resist layer 50 and the first inorganic layer CVD1), or it can be disposed on the side of the first light-shielding structure 30 (light-shielding layer BM1) and the color resist layer 50 away from the display substrate 100 (i.e., between the color resist layer 50 and the second inorganic layer CVD2). This application does not limit this.

[0097] For example, the first color light-emitting element 21 can be a red light-emitting element for emitting red light; the second color light-emitting element 22 can be a blue light-emitting element for emitting blue light; and the third color light-emitting element 23 can be a green light-emitting element for emitting green light. Correspondingly, in the color resist layer 50, the first color resist unit 511 can be a red color resist unit, corresponding to the first color light-emitting element 21 (red light-emitting element); the second color resist unit 512 can be a blue color resist unit, corresponding to the second color light-emitting element 22 (blue light-emitting element); and the third adhesive layer OC3 can be a GOC material layer, which has high transmittance in the green light band and relatively low transmittance in the red and blue light bands, and can replace the green color resist unit.

[0098] The foregoing embodiments are mainly illustrated by setting a light-shielding layer BM1 between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE as the first light-shielding structure 30. Figures 13-16This illustration shows partial cross-sectional structural diagrams of four different display panels provided in embodiments of this application. The difference from the aforementioned embodiments is that... Figures 13-16 In the display panel shown, the first light-shielding structure 30 is not composed of light-shielding material (i.e., light-shielding layer BM1), but is formed by stacking different colored color resist blocks in the color resist layer 50 within the encapsulation layer TFE.

[0099] like Figures 13-16 As shown, the encapsulation layer TFE includes a color resist layer 50 located between the first inorganic layer CVD1 and the second inorganic layer CVD2; considering that in the display panel, multiple pixel opening areas 110 include a first pixel opening area 111, a second pixel opening area 112, and a third pixel opening area 113, the first pixel opening area 111 is correspondingly provided with a first color light-emitting element 21, the second pixel opening area 112 is correspondingly provided with a second color light-emitting element 22, and the third pixel opening area 113 is correspondingly provided with a third color light-emitting element 23, accordingly, The color resist layer 50 includes a first color resist layer 501, a second color resist layer 502, and a third color resist layer 503; wherein, the first color resist layer 501 includes a first color resist unit 511 and a first block B1, wherein, in a direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21 for filtering the first color light emitted by the first color light-emitting element 21, and the first block B1 at least partially overlaps with the non-opening area 120; the second color resist layer 502 includes a second color resist unit 512. In the second block B2, in a direction perpendicular to the plane of the display substrate 100, the second color resist unit 512 at least partially overlaps with the second color light-emitting element 22, for filtering the second color light emitted by the second color light-emitting element 22, and the second block B2 at least partially overlaps with the non-opening area 120; the third color resist layer 503 includes a third color resist unit 513 and a third block B3, in a direction perpendicular to the plane of the display substrate 100, the third color resist unit 513 at least partially overlaps with the third color light-emitting element 23, for filtering the second color light emitted by the second color light-emitting element 22, and the second block B2 at least partially overlaps with the non-opening area 120; The third color light emitted by the third color light-emitting element 23 is filtered, and the third block B3 overlaps at least partially with the non-opening area 120. That is, while forming the corresponding color resist unit, each color resist layer also retains a block (first block B1, second block B2 and third block B3) at the position corresponding to the non-opening area 120. The first block B1, the second block B2 and the third block B3 each overlap at least partially with the non-opening area 120. These blocks themselves are not used for filtering, but are used to form the first light-shielding structure 30.

[0100] like Figures 13-16As shown, the first light-shielding structure 30 includes at least two of the first block B1, the second block B2, and the third block B3 in a stacked structure 31 along a direction perpendicular to the plane of the display substrate 100. That is, at least two of the first block B1, the second block B2, and the third block B3 are stacked together at the position corresponding to the non-opening area 120 to form the stacked structure 31. This stacked structure 31 serves as the first light-shielding structure 30 corresponding to the non-opening area 120, used to block external incident light and prevent external incident light from irradiating the lower anode layer RE, light-emitting layer EL, and other high reflectivity layers. Furthermore, there is a first opening K1 between the different stacked structures 31. The first opening K1 exposes the pixel opening area 110, ensuring that the light emitted by the light-emitting element 20 in the pixel opening area 110 can pass through the first opening K1 and be emitted normally.

[0101] For example, the first color resist layer 501 can be a red color resist layer that selectively transmits red light, then the first color resist unit 511 is a red color resist unit, and the first block B1 is a red color resist block; the second color resist layer 502 can be a blue color resist layer that selectively transmits blue light, then the second color resist unit 512 is a blue color resist unit, and the second block B2 is a blue color resist block; the third color resist layer 503 can be a green color resist layer that selectively transmits green light, then the third color resist unit 513 is a green color resist unit, and the third block B3 is a green color resist block.

[0102] It is understandable that the red color-blocking block (such as the first block B1) allows long-wavelength (approximately 600nm-700nm) red light to pass through, while the blue color-blocking block (such as the second block B2) allows short-wavelength (approximately 400nm-500nm) blue light to pass through. However, when the red and blue color-blocking blocks overlap, the wavelengths they allow to pass through do not overlap. Therefore, neither red nor blue light can pass through the overlapping area of ​​the red and blue color-blocking blocks. In other words, this overlapping area has a good light-blocking effect on visible light and can replace light-blocking materials to achieve the light-blocking function. Similarly, overlapping of red color resist blocks (such as the first block B1) with green color resist blocks (such as the third block B3), overlapping of blue color resist blocks (such as the second block B2) with green color resist blocks (such as the third block B3), or overlapping of red color resist blocks (such as the first block B1), blue color resist blocks (such as the second block B2), and green color resist blocks (such as the third block B3) can all achieve a light-shielding effect. Therefore, by overlapping color resist blocks of different colors in the non-opening area 120 within the encapsulation layer TFE, a layered structure 31 with light-shielding function can be formed as the first light-shielding structure 30, eliminating the need to prepare an additional light-shielding material layer (i.e., light-shielding layer BM1), thereby reducing process complexity, improving production efficiency, and reducing production costs.

[0103] It is also understandable that the specific overlapping method of the stacked structure 31 (e.g., which color resist blocks overlap) can be selected according to actual process requirements. For example, the stacked structure 31 can be a stacked structure of red color resist blocks (e.g., the first block B1) and blue color resist blocks (e.g., the second block B2). Figure 15 and Figure 16 As shown), a stacked structure of red color resist blocks (such as the first block B1) and green color resist blocks (such as the third block B3), a stacked structure of green color resist blocks (such as the third block B3) and blue color resist blocks (such as the second block B2), or a stacked structure of red color resist blocks (such as the first block B1), blue color resist blocks (such as the second block B2), and green color resist blocks (such as the third block B3) (as shown). Figure 13 and Figure 14 (As shown). This application does not impose any limitations on this, as long as the layered structure 31 can serve a light-blocking function.

[0104] Further optional, such as Figure 13 and Figure 15 As shown, in addition to the color resist layer 50, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE may also include a first adhesive layer OC1. The first adhesive layer OC1 is located on the side of the color resist layer 50 that is close to the display substrate 100. The first adhesive layer OC1 can play a planarization role, providing a flat surface for the formation of the color resist layer 50. At the same time, it can also protect the first inorganic layer CVD1, avoiding damage to the first inorganic layer CVD1 in subsequent processes.

[0105] Another option, such as Figure 13 and Figure 14 As shown, in addition to the color resist layer 50, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE may also include a second adhesive layer OC2. The second adhesive layer OC2 is located on the side of the color resist layer 50 away from the display substrate 100. The stacked structure 31 (i.e. the first light-shielding structure 30) formed by stacking different color blocks in the color resist layer 50 protrudes towards the second adhesive layer OC2. That is, the second adhesive layer OC2 covers the color resist layer 50, providing a flat surface for the deposition of the second inorganic layer CVD2, ensuring that the second inorganic layer CVD2 has good coverage and density, and at the same time can play a buffering role, relieving the stress between the underlying film layer and the second inorganic layer CVD2, and improving the reliability of the encapsulation layer TFE.

[0106] Further, another option, such as Figure 13As shown, in addition to the color resist layer 50, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE may also include a first adhesive layer OC1 and a second adhesive layer OC2. The first adhesive layer OC1 is located on the side of the color resist layer 50 close to the display substrate 100, and the second adhesive layer OC2 is located on the side of the color resist layer 50 away from the display substrate 100. The stacked structure 31 (i.e. the first light-shielding structure 30) formed by stacking different color blocks in the color resist layer 50 protrudes towards the second adhesive layer OC2. The first adhesive layer OC1 and the second adhesive layer OC2 provide planarization and buffer protection for the color resist layer 50 from the top and bottom sides, respectively, further improving the structural stability and reliability of the encapsulation layer TFE.

[0107] In addition, since the color resist layer 50 itself has good leveling properties, another option, such as Figure 16 As shown, the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE can also be provided with only a color resist layer 50, and different color blocks in the color resist layer 50 are stacked to form a stacked structure 31 as the first light-shielding structure 30. In this way, the number of film layers between the first inorganic layer CVD1 and the second inorganic layer CVD2 in the encapsulation layer TFE is less, the total thickness is thinner, and it is more conducive to the thinning of the panel.

[0108] It should be noted that this application does not limit the order of film formation of different color resist layers, and the film formation method of each color resist layer may be based on the material characteristics of the resist layer, including but not limited to photolithography or inkjet printing.

[0109] Figure 17 and Figure 18 This illustration shows partial cross-sectional structural diagrams of two other display panels provided in embodiments of this application, and... Figures 13-16 Compared to the display panel shown, Figure 17 and Figure 18 The display panel shown also has a color resist layer 50 placed between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, and a stacked structure is formed by stacking different color resist blocks in the color resist layer 50 of the encapsulation layer TFE as the first light-shielding structure 30. Figure 17 and Figure 18The difference in the display panel shown is that the color resist layer 50 only includes a first color resist layer 501 and a second color resist layer 502; wherein, the first color resist layer 501 includes a first color resist unit 511 and a first block B1, and in the direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21 for filtering the first color light emitted by the first color light-emitting element 21, while the first block B1 at least partially overlaps with the non-opening area 120; the second color resist layer 502 includes a second color resist unit 512 and a second block B2, and in the direction perpendicular to the plane of the display substrate 100, the second color resist unit 512 at least partially overlaps with the second color light-emitting element 22 for filtering the second color light emitted by the second color light-emitting element 22, while the second block B2 at least partially overlaps with the non-opening area 120. The first light-shielding structure 30 includes a stacked structure 32 of the first block B1 and the second block B2 along a direction perpendicular to the plane of the display substrate 100. That is, the first block B1 and the second block B2 are stacked together at the positions corresponding to the non-opening area 120 to form a stacked structure 32. This stacked structure 32 serves as the first light-shielding structure 30 corresponding to the non-opening area 120, used to block external incident light and prevent external incident light from irradiating the lower anode layer RE, light-emitting layer EL and other high reflectivity layers. Furthermore, there is a first opening K1 between different stacked structures 32. The first opening K1 exposes the pixel opening area 110, ensuring that the light emitted by the light-emitting element 20 in the pixel opening area 110 can pass through the first opening K1 and be emitted normally.

[0110] Meanwhile, the encapsulation layer TFE also includes a third adhesive layer OC3 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The third adhesive layer OC3 has a higher transmittance for the third color light emitted by the third color light-emitting element 23 than for the first color light emitted by the first color light-emitting element 21, and also higher than for the second color light emitted by the second color light-emitting element 22. In other words, by using the third adhesive layer OC3 to replace the third color resist unit, the third color light emitted by the third color light-emitting element 23 can pass through with higher transmittance, achieving a filtering effect similar to that of the third color resist unit, thereby enabling… By eliminating the need for the preparation of the third color resist layer, the number of photolithography steps is reduced, the process flow is simplified, and production costs are lowered. At the same time, the first color light emitted by the first color light-emitting element 21 is selectively transmitted by the corresponding first color resist unit 511 and passes through the third adhesive layer OC3 with a relatively low transmittance. The second color light emitted by the second color light-emitting element 22 is selectively transmitted by the corresponding second color resist unit 512 and passes through the third adhesive layer OC3 with a relatively low transmittance. Thus, the color resist layer 50 only includes two colors, which can also reduce the overall thickness of the color resist layer 50, which is beneficial for the thinning of the display panel.

[0111] It is understandable that the third adhesive layer OC3 can be similar to the first adhesive layer OC1, and is disposed on the side of the color resist layer 50 near the display substrate 100, such as... Figure 18 As shown; the third adhesive layer OC3 can also be similar to the second adhesive layer OC2, and is disposed on the side of the color resist layer 50 facing away from the display substrate 100, such as... Figure 17 As shown, this application does not impose any limitations on this.

[0112] For example, the first color light-emitting element 21 can be a red light-emitting element for emitting red light; the second color light-emitting element 22 can be a blue light-emitting element for emitting blue light; and the third color light-emitting element 23 can be a green light-emitting element for emitting green light. Correspondingly, in the color resist layer 50, the first color resist unit 511 can be a red color resist unit, corresponding to the first color light-emitting element 21 (red light-emitting element); the second color resist unit 512 can be a blue color resist unit, corresponding to the second color light-emitting element 22 (blue light-emitting element); and the third adhesive layer OC3 can be a GOC material layer, which has high transmittance in the green light band and relatively low transmittance in the red and blue light bands, and can replace the green color resist unit.

[0113] It is understandable that, between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, in addition to the color resist layer 50 and the third adhesive layer OC3, and the stacked structure 32 formed by the first block B1 and the second block B2 in the color resist layer 50 serving as the first light-shielding structure 30, the first adhesive layer OC1 and / or the second adhesive layer OC2 can also be provided. The first adhesive layer OC1 can be located on the side of the color resist layer 50 closer to the display substrate 100, and the second adhesive layer OC2 can be located on the side of the color resist layer 50 away from the display substrate 100, depending on the specific circumstances.

[0114] Based on the first light-shielding structure 30, which is formed by stacking different color blocks (whether two or three colors) in the color resist layer 50 of the encapsulation layer TFE, when the encapsulation layer TFE also includes a first adhesive layer OC1 located between the first inorganic layer CVD1 and the second inorganic layer CVD2, and the first adhesive layer OC1 is located on the side of the color resist layer 50 closer to the display substrate 100, such as Figure 15 , Figure 18 (The third adhesive layer OC3 can be considered as the first adhesive layer OC1) and Figure 19 and Figure 20 As shown, Figures 19-20This illustration shows partial cross-sectional structural diagrams of two more display panels provided in embodiments of this application. The first adhesive layer OC1 can be configured with a groove T1, which accommodates at least a portion of the stacked structures 31 / 32 (i.e., the first light-shielding structure 30). In other words, the first adhesive layer OC1 is not a completely flat film layer, but rather has a groove T1 located at a position corresponding to the non-opening area 120. At least a portion of the stacked structures 31 / 32 formed by stacking different color blocks in the color resist layer 50 is located within the groove T1.

[0115] It is understandable that by providing a groove T1 in the first adhesive layer OC1, the stacked structures 31 / 32, which serve as the first light-shielding structure 30, are at least partially embedded within the first adhesive layer OC1. In other words, the stacked structures 31 / 32 extend into the first adhesive layer OC1, allowing them to get closer to the underlying first inorganic layer CVD1, and further closer to the light-emitting element 20 in the pixel opening region 110. Thus, the stacked structures 31 / 32 (i.e., the first light-shielding structure 30) achieve shielding of the non-opening region 120 at a position closer to the high-reflectivity layers (anode layer RE, light-emitting layer EL, etc.). This enables effective shielding of the high-reflectivity layer with a smaller first opening K1 size, further reducing the area of ​​the high-reflectivity layer exposed in the pixel opening region 110, more effectively reducing the reflectivity of the display panel to ambient light, and further improving the anti-reflection effect.

[0116] Meanwhile, the first adhesive layer OC1 can still serve a planarization function, providing a smooth surface base for the formation of the color resist layer 50, and can also protect the first inorganic layer CVD1, preventing damage to the first inorganic layer CVD1 in subsequent processes. The formation of the groove T1 can be achieved through processes such as photolithography, imprinting, or etching, and the specific choice can be made according to actual process requirements; this application does not impose any limitations on this.

[0117] Further optional, such as Figure 20 As shown, the stacked structure 31 / 32 can penetrate the first adhesive layer OC1, meaning that the stacked structure 31 / 32 directly contacts the first inorganic layer CVD1 through the first adhesive layer OC1. Thus, the stacked structure 31 / 32 (i.e., the first light-shielding structure 30) is closer to the light-emitting element 20 of the pixel opening region 110, achieving shielding of the non-opening region 120 almost immediately adjacent to the light-emitting element 20. This allows for effective shielding of high-reflectivity layers such as the anode layer RE and the light-emitting layer EL within a smaller first opening K1 size, minimizing the area of ​​high-reflectivity layers exposed in the pixel opening region 110, effectively reducing the reflectivity of the display panel to ambient light, and further improving the anti-reflection effect.

[0118] It is understandable that when the stacked structure 31 / 32 penetrates the first adhesive layer OC1, the first adhesive layer OC1 is divided into multiple separate parts by the stacked structure 31 / 32. However, the first adhesive layer OC1 can still protect the first inorganic layer CVD1 below its area. Furthermore, the process of the groove T1 penetrating the first adhesive layer OC1 can be achieved by photolithography or etching, which is easy to implement.

[0119] Based on the first light-shielding structure 30, which is formed by stacking different color blocks (whether two or three colors) in the color resist layer 50 of the encapsulation layer TFE, when the encapsulation layer TFE also includes a second adhesive layer OC2 located between the first inorganic layer CVD1 and the second inorganic layer CVD2, and the second adhesive layer OC2 is located on the side of the color resist layer 50 away from the display substrate 100, such as Figures 13-14 , Figure 17 (The third adhesive layer OC3 can be regarded as the second adhesive layer OC2) Figures 19-20 As shown, a stacked structure 31 / 32 (i.e., the first light-shielding structure 30) formed by stacking different color blocks in the color resist layer 50 can be configured to protrude towards the second adhesive layer OC2. In this way, the second adhesive layer OC2 covers the color resist layer 50 and the stacked structure 31 / 32, which can provide a flat surface for the deposition of the second inorganic CVD2, ensuring that the second inorganic CVD2 has good coverage and density. At the same time, the second adhesive layer OC2 can play a buffering role, relieving the stress between the underlying film layer and the second inorganic CVD2, and improving the reliability of the encapsulation layer TFE. The stacked structure 31 / 32 protrudes towards the second adhesive layer OC2 as the first light-shielding structure 30, so that the first light-shielding structure 30 can achieve the light-shielding function without affecting the planarization effect of the second adhesive layer OC2, thus ensuring the structural reliability of the encapsulation layer TFE and achieving effective light shielding of the non-opening area 120.

[0120] In the foregoing embodiments, regardless of whether the first light-shielding structure 30 includes a light-shielding material, i.e., a light-shielding layer BM1, or whether the first light-shielding structure 30 is a stacked structure of different color resist blocks in the color resist layer 50, such as Figures 2-6 as well as Figures 10-20As shown, a touch layer TPOT can be provided on the side of the encapsulation layer TFE away from the display substrate 100. The touch layer TPOT includes multiple touch electrodes TP1. At the same time, the display panel also includes a second light-shielding structure 40 located on the side of the touch layer TPOT away from the display substrate 100. The second light-shielding structure 40 includes a light-shielding material, that is, the second light-shielding structure 40 can be a light-shielding layer BM2. The second light-shielding structure 40 (light-shielding layer BM2) blocks the touch electrodes TP1. That is, in the direction perpendicular to the plane of the display substrate 100, the second light-shielding structure 40 and the touch electrodes TP1 overlap at least partially, thereby preventing ambient light from being reflected by the touch electrodes TP1. Furthermore, the second light-shielding structure 40 (light-shielding layer BM2) has multiple second openings K2. The second openings K2 expose the first openings K1 in the first light-shielding structure 30, thereby ensuring that the light emitted by the light-emitting element 20 in the pixel opening area 110 passes through the first opening K1 and the second opening K2 in sequence and is emitted normally.

[0121] Figure 21 and Figure 22 This application provides two more partial cross-sectional structural schematic diagrams of display panels, as shown in the embodiments. Figure 21 and Figure 22 As shown, unlike the aforementioned embodiments, Figure 21 In the display panel shown, the touch layer TPOT is not disposed on the side of the encapsulation layer TFE away from the display substrate 100, but is disposed inside the encapsulation layer TFE, that is, between the first inorganic layer CVD1 and the second inorganic layer CVD2. At this time, since the touch layer TPOT is located inside the encapsulation layer TFE, the multiple touch electrodes TP1 in the touch layer TPOT are also located between the first inorganic layer CVD1 and the second inorganic layer CVD2. Therefore, the touch electrodes TP1 can be blocked by the first light-shielding structure 30 inside the encapsulation layer TFE.

[0122] Specifically, such as Figure 21 and Figure 22 As shown, the encapsulation layer TFE includes a first inorganic layer CVD1, a second inorganic layer CVD2, a touch layer TPOT located between the first inorganic layer CVD1 and the second inorganic layer CVD2, and a first light-shielding structure 30. The touch layer TPOT includes multiple touch electrodes TP1. The first light-shielding structure 30 blocks the touch electrodes TP1 to prevent ambient light from being reflected by the touch electrodes TP1. At the same time, the first light-shielding structure 30 is also used to block the anode layer RE, the light-emitting layer EL, and other high-reflectivity layers corresponding to the non-opening area 120. Therefore, there is no need to set a second light-shielding structure 40 separately for the touch electrodes TP1, which further simplifies the film structure and process flow, and is conducive to further thinning of the display panel and simplification of the process.

[0123] It is understandable that the specific implementation of the first light-shielding structure 30 may include a light-shielding material, namely the light-shielding layer BM1, or a stacked structure formed by stacking different colored color resist blocks in the color resist layer 50 (such as...). Figure 21 and Figure 22 (As shown), the specifics depend on the situation. Figure 21 and Figure 22 In the process, the encapsulation layer TFE includes a color resist layer 50 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The color resist layer 50 includes only a first color resist layer 501 and a second color resist layer 502. The first color resist layer 501 includes a first color resist unit 511 and a first block B1. In a direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21 to filter the first color light emitted by the first color light-emitting element 21. The first block B1 at least partially overlaps with the non-opening region 120. The second color resist layer 502 includes a second color resist unit 512 and a second block B2. In a direction perpendicular to the plane of the display substrate 100, the first color resist unit 511 at least partially overlaps with the first color light-emitting element 21 to filter the first color light emitted by the first color light-emitting element 21. In the direction of the plane where 0 is located, the second color resist unit 512 overlaps at least partially with the second color light-emitting element 22 to filter the second color light emitted by the second color light-emitting element 22, and the second block B2 overlaps at least partially with the non-opening area 120; the first light-shielding structure 30 includes a stacked structure 32 of the first block B1 and the second block B2 along the direction perpendicular to the plane where the display substrate 100 is located, the stacked structure 32 shields the touch electrode TP1; and there is a first opening K1 between the different stacked structures 32, the first opening K1 exposes the pixel opening area 110, and ensures that the light emitted by the light-emitting element 20 in the pixel opening area 110 can pass through the first opening K1 normally.

[0124] Meanwhile, the encapsulation layer TFE also includes a third adhesive layer OC3 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The transmittance of the third adhesive layer OC3 for the third color light emitted by the third color light-emitting element 23 is greater than its transmittance for the first color light emitted by the first color light-emitting element 21, and greater than its transmittance for the second color light emitted by the second color light-emitting element 22. That is, by using the third adhesive layer OC3 to replace the third color resist unit, the third color light emitted by the third color light-emitting element 23 can pass through with a higher transmittance, achieving a light filtering effect similar to that of the third color resist unit. The preparation of the third color resist layer can be omitted, thereby reducing the number of photolithography steps, simplifying the process, and reducing production costs. The first color light emitted by the first color light-emitting element 21 is selectively transmitted by the corresponding first color resist unit 511 and passes through the third adhesive layer OC3 with a relatively low transmittance. The second color light emitted by the second color light-emitting element 22 is selectively transmitted by the corresponding second color resist unit 512 and passes through the third adhesive layer OC3 with a relatively low transmittance. Thus, the color resist layer 50 only includes two colors, which can also reduce the overall thickness of the color resist layer 50 and is beneficial for the thinning of the display panel.

[0125] Figure 23 This illustration shows a partial cross-sectional structural diagram of another display panel provided in an embodiment of this application, as shown below. Figure 23 As shown, based on any of the above embodiments, the encapsulation layer TFE may further include a first via V1 located between the first inorganic layer CVD1 and the second inorganic layer CVD2, the first via V1 connecting the first inorganic layer CVD1 and the second inorganic layer CVD2. That is, the first via V1 is formed in the film layer (e.g., the first light-shielding structure 30, the color resist layer 50, the adhesive layer, etc.) located between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE through photolithography or etching processes, allowing the first inorganic layer CVD1 and the second inorganic layer CVD2 to directly contact each other through the first via V1. It is understood that the setting of the first via V1 allows the first inorganic layer CVD1 and the second inorganic layer CVD2 to directly overlap at this location, enhancing the bonding force between the first inorganic layer CVD1 and the second inorganic layer CVD2, reducing the risk of peeling between the film layers of the encapsulation layer TFE due to stress mismatch, and improving the structural stability and reliability of the encapsulation layer TFE.

[0126] Further optional, such as Figure 23 As shown, the first via V1 can penetrate the first light-shielding structure 30. Since the first light-shielding structure 30 is correspondingly set to the non-opening area 120 in the direction perpendicular to the plane of the display substrate 100, and the first via V1 penetrates the first light-shielding structure 30, the first via V1 is also correspondingly set to the non-opening area 120 to avoid affecting the normal light output of the pixel opening area 110.

[0127] Figure 24 and Figure 25 This paper illustrates partial cross-sectional structural diagrams of two display panels provided in embodiments of this application, and... Figure 23 The same display panel shown is in Figure 24 and Figure 25 In the display panel shown, multiple pixel aperture areas 110 include a first pixel aperture area 111, a second pixel aperture area 112, and a third pixel aperture area 113. The first pixel aperture area 111 is correspondingly provided with a first color light-emitting element 21, the second pixel aperture area 112 is correspondingly provided with a second color light-emitting element 22, and the third pixel aperture area 113 is correspondingly provided with a third color light-emitting element 23. The encapsulation layer TFE also includes a third adhesive layer OC3 located between the first inorganic layer CVD1 and the second inorganic layer CVD2. The transmittance of the third adhesive layer OC3 for the third color light emitted by the third color light-emitting element 23 is greater than the transmittance for the first color light emitted by the first color light-emitting element 21, and greater than the transmittance for the second color light emitted by the second color light-emitting element 22. That is, the third adhesive layer OC3 can replace the third color resist unit, so that the third color light emitted by the third color light-emitting element 23 passes through with a higher transmittance, achieving a filtering effect similar to that of the third color resist unit, thereby eliminating the need for the fabrication of the third color resist unit. Therefore, even if a color resist layer 50 is provided between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, the third color resist unit corresponding to the third pixel opening area 113 can be omitted, so that the position between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE corresponding to the third pixel opening area 113 is filled by the third adhesive layer OC3.

[0128] Therefore, with Figure 23 The display panel shown is different in that... Figure 24 and Figure 25 In the display panel shown, in a direction perpendicular to the plane of the display substrate 100, the first via V1 overlaps with the third pixel opening area 113. Specifically, the first via V1 is positioned between the first inorganic layer CVD1 and the second inorganic layer CVD2 of the encapsulation layer TFE, corresponding to the third pixel opening area 113, and penetrates the area of ​​the third adhesive layer OC3 corresponding to the third pixel opening 113. Thus, the first via V1 is not affected by the pattern of the third color resist unit corresponding to the third pixel opening area 113, making the layout of the first via V1 more flexible. Simultaneously, the opening area of ​​the first via V1 can be relatively large, increasing the contact area between the first inorganic layer CVD1 and the second inorganic layer CVD2 through the first via V1, further enhancing the interlayer bonding force of the encapsulation layer TFE, reducing the risk of peeling, and improving the structural stability and reliability of the encapsulation layer TFE.

[0129] It is understandable that, in the direction perpendicular to the plane of the display substrate 100, the first via V1 overlaps with the third pixel opening area 113. Specifically, in the direction perpendicular to the plane of the display substrate 100, the first via V1 is located within the area of ​​the third pixel opening area 113, or the first via V1 partially overlaps with the third pixel opening area 113, or the first via V1 completely overlaps with the third pixel opening area 113, depending on the specific situation.

[0130] Regarding the shape of the first via V1, as follows: Figures 26-28 As shown, Figures 26-28 The diagram shows a partial top view of three display panels provided in embodiments of this application. It can be seen that a first via V1 can be correspondingly disposed in the middle region of the first pixel opening region 111, the second pixel opening region 112, and the third pixel opening region 113, so that the first inorganic layer CVD1 and the second inorganic layer CVD2 are in contact. The first via V1 can be circular, such as... Figure 26 As shown; it can also be a ring or semi-ring surrounding one of the first pixel opening area 111, the second pixel opening area 112, and the third pixel opening area 113, such as Figure 27 As shown; it can also be other shapes such as rhombus or square, such as Figure 28 As shown. This application does not limit the shape of the first via V1.

[0131] Accordingly, embodiments of this application also provide a display device. Figure 29 The diagram shows a top view of a display device according to an embodiment of this application. Figure 29 As shown, the display device 300 includes the display panel 200 provided in any of the above embodiments. Since the display panel 200 has been described in detail in the foregoing embodiments, it will not be described again here.

[0132] The display device 300 can be any electronic device with display capabilities, such as a touch screen, mobile phone, tablet computer, laptop computer, e-reader, or television.

[0133] The various parts of this manual are described in a combination of parallel and progressive methods. Each part focuses on the differences between the other parts, and the same or similar parts can be referred to each other.

[0134] The features described above regarding the disclosed embodiments can be substituted or combined with each other to enable those skilled in the art to implement or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that, include: The display substrate includes a plurality of pixel opening areas and non-opening areas located between adjacent pixel opening areas, and light-emitting elements are correspondingly disposed in the pixel opening areas. An encapsulation layer located on one side of the display substrate includes a first inorganic layer, a second inorganic layer located on the side of the first inorganic layer facing away from the display substrate, and a first light-shielding structure located between the first inorganic layer and the second inorganic layer. The first light-shielding structure has a plurality of first openings. In a direction perpendicular to the plane of the display substrate, the first light-shielding structure at least partially overlaps with the non-opening area, and the first openings expose the pixel opening area.

2. The display panel according to claim 1, characterized in that, The first light-shielding structure includes a light-shielding material.

3. The display panel according to claim 2, characterized in that, The encapsulation layer further includes a first adhesive layer located between the first inorganic layer and the second inorganic layer, wherein the first light-shielding structure is located on the side of the first adhesive layer away from the display substrate and is at least partially embedded in the first adhesive layer.

4. The display panel according to claim 2, characterized in that, The encapsulation layer further includes a second adhesive layer located between the first inorganic layer and the second inorganic layer, the second adhesive layer covering the first light-shielding structure and filling the first opening.

5. The display panel according to any one of claims 2-4, characterized in that, The display panel also includes a touch layer located on the side of the encapsulation layer opposite to the display substrate, and the touch layer includes a plurality of touch electrodes; The display panel further includes a second light-shielding structure located on the side of the touch layer opposite to the display substrate. The second light-shielding structure includes a light-shielding material and blocks the touch electrodes. The second light-shielding structure has a plurality of second openings, and the second openings expose the first opening. The display panel further includes a color resist layer located on the side of the second light-shielding structure away from the display substrate. The color resist layer includes a plurality of color resist units, and the color resist units are disposed corresponding to the light-emitting elements in a direction perpendicular to the plane of the display substrate.

6. The display panel according to claim 5, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The plurality of color resist units include a first color resist unit and a second color resist unit. In a direction perpendicular to the plane of the display substrate, the first color resist unit overlaps at least partially with the first color light-emitting element, and the second color resist unit overlaps at least partially with the second color light-emitting element. The plurality of color resist units also include a third color resist unit, which at least partially overlaps with the third color light-emitting element in a direction perpendicular to the plane of the display substrate. Alternatively, the encapsulation layer may further include a third adhesive layer located between the first inorganic layer and the second inorganic layer, wherein the third adhesive layer has a transmittance of the third color light emitted by the third color light-emitting element greater than its transmittance of the first color light emitted by the first color light-emitting element, and greater than its transmittance of the second color light emitted by the second color light-emitting element.

7. The display panel according to any one of claims 2-4, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The display panel also includes a touch layer located on the side of the encapsulation layer opposite to the display substrate, and the touch layer includes a plurality of touch electrodes; The display panel further includes a color resist layer located on the side of the touch layer opposite to the display substrate. The color resist layer includes a first color resist layer, a second color resist layer, and a third color resist layer. The first color resist layer includes a first color resist unit and a first block. The second color resist layer includes a second color resist unit and a second block. The third color resist layer includes a third color resist unit and a third block. In a direction perpendicular to the plane of the display substrate, the first color resist unit at least partially overlaps with the first color light-emitting element, the second color resist unit at least partially overlaps with the second color light-emitting element, and the third color resist unit at least partially overlaps with the third color light-emitting element. The first block, the second block, and the third block each at least partially overlap with the non-opening area. The display panel further includes a second light-shielding structure located on the side of the touch layer opposite to the display substrate. The second light-shielding structure includes at least two of the first block, the second block, and the third block stacked in a direction perpendicular to the plane of the display substrate. The stacked structure shields the touch electrode. There is a second opening between different stacked structures, and the second opening exposes the first opening.

8. The display panel according to any one of claims 2-4, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The display panel also includes a touch layer located on the side of the encapsulation layer opposite to the display substrate, and the touch layer includes a plurality of touch electrodes; The display panel further includes a color resist layer located on the side of the touch layer opposite to the display substrate. The color resist layer includes a first color resist layer and a second color resist layer. The first color resist layer includes a first color resist unit and a first block, and the second color resist layer includes a second color resist unit and a second block. In a direction perpendicular to the plane of the display substrate, the first color resist unit at least partially overlaps with the first color light-emitting element, the second color resist unit at least partially overlaps with the second color light-emitting element, and the first block and the second block each at least partially overlap with the non-opening area. The display panel further includes a second light-shielding structure located on the side of the touch layer away from the display substrate. The second light-shielding structure includes a stacked structure of the first block and the second block along a direction perpendicular to the plane of the display substrate. The stacked structure blocks the touch electrode. There is a second opening between different stacked structures. The second opening exposes the first opening. The encapsulation layer further includes a third adhesive layer located between the first inorganic layer and the second inorganic layer; the transmittance of the third adhesive layer to the third color light emitted by the third color light-emitting element is greater than the transmittance to the first color light emitted by the first color light-emitting element, and greater than the transmittance to the second color light emitted by the second color light-emitting element.

9. The display panel according to claim 2, characterized in that, The encapsulation layer further includes a color resist layer located between the first inorganic layer and the second inorganic layer. The color resist layer covers the first light-shielding structure and includes a plurality of color resist units. The color resist units fill the first opening and are correspondingly disposed with the light-emitting element.

10. The display panel according to claim 5, characterized in that, The encapsulation layer further includes a first adhesive layer and / or a second adhesive layer located between the first inorganic layer and the second inorganic layer. The first adhesive layer is located on the side of the color resist layer and the first light-shielding structure close to the display substrate, and the second adhesive layer is located on the side of the color resist layer and the first light-shielding structure away from the display substrate.

11. The display panel according to claim 5, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The plurality of color resist units include a first color resist unit and a second color resist unit. In a direction perpendicular to the plane of the display substrate, the first color resist unit overlaps at least partially with the first color light-emitting element, and the second color resist unit overlaps at least partially with the second color light-emitting element. The plurality of color resist units also include a third color resist unit, which at least partially overlaps with the third color light-emitting element in a direction perpendicular to the plane of the display substrate. Alternatively, the encapsulation layer may further include a third adhesive layer located between the first inorganic layer and the second inorganic layer, wherein the third adhesive layer has a transmittance of the third color light emitted by the third color light-emitting element greater than its transmittance of the first color light emitted by the first color light-emitting element, and greater than its transmittance of the second color light emitted by the second color light-emitting element.

12. The display panel according to claim 1, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The encapsulation layer includes a color resist layer located between the first inorganic layer and the second inorganic layer. The color resist layer includes a first color resist layer, a second color resist layer, and a third color resist layer. The first color resist layer includes a first color resist unit and a first block. The second color resist layer includes a second color resist unit and a second block. The third color resist layer includes a third color resist unit and a third block. In a direction perpendicular to the plane of the display substrate, the first color resist unit at least partially overlaps with the first color light-emitting element, the second color resist unit at least partially overlaps with the second color light-emitting element, and the third color resist unit at least partially overlaps with the third color light-emitting element. The first block, the second block, and the third block each at least partially overlap with the non-opening area. The first light-shielding structure includes at least two of the first block, the second block, and the third block in a stacked structure along a direction perpendicular to the plane of the display substrate, and the first opening is present between different stacked structures.

13. The display panel according to claim 1, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The encapsulation layer includes a color resist layer located between the first inorganic layer and the second inorganic layer. The color resist layer includes a first color resist layer and a second color resist layer. The first color resist layer includes a first color resist unit and a first block. The second color resist layer includes a second color resist unit and a second block. In a direction perpendicular to the plane of the display substrate, the first color resist unit at least partially overlaps with the first color light-emitting element, the second color resist unit at least partially overlaps with the second color light-emitting element, and the first block and the second block each at least partially overlap with the non-opening area. The first light-shielding structure includes a stacked structure of the first block and the second block along a direction perpendicular to the plane of the display substrate, and the first opening is provided between different stacked structures; The encapsulation layer further includes a third adhesive layer located between the first inorganic layer and the second inorganic layer. The third adhesive layer has a transmittance of the third color light emitted by the third color light-emitting element greater than its transmittance of the first color light emitted by the first color light-emitting element, and a transmittance of the second color light emitted by the second color light-emitting element.

14. The display panel according to claim 12 or 13, characterized in that, The encapsulation layer further includes a first adhesive layer located between the first inorganic layer and the second inorganic layer. The first adhesive layer is located on the side of the color resist layer near the display substrate. The first adhesive layer has a groove that accommodates at least a portion of the stacked structure.

15. The display panel according to claim 14, characterized in that, The laminated structure extends through the first adhesive layer.

16. The display panel according to claim 12 or 13, characterized in that, The encapsulation layer further includes a second adhesive layer located between the first inorganic layer and the second inorganic layer. The second adhesive layer is located on the side of the color resist layer away from the display substrate, and the stacked structure protrudes toward the second adhesive layer.

17. The display panel according to any one of claims 2-4 and 9-13, characterized in that, The display panel also includes a touch layer located on the side of the encapsulation layer opposite to the display substrate, and the touch layer includes a plurality of touch electrodes; The display panel further includes a second light-shielding structure located on the side of the touch layer opposite to the display substrate. The second light-shielding structure includes a light-shielding material and blocks the touch electrodes. The second light-shielding structure has a plurality of second openings, and the second openings expose the first opening.

18. The display panel according to any one of claims 2-4 and 9-13, characterized in that, The display panel further includes a touch layer located between the first inorganic layer and the second inorganic layer, the touch layer including a plurality of touch electrodes, and the first light-shielding structure shielding the touch electrodes.

19. The display panel according to claim 1, characterized in that, The encapsulation layer further includes a first via located between the first inorganic layer and the second inorganic layer, the first via connecting the first inorganic layer and the second inorganic layer.

20. The display panel according to claim 19, characterized in that, The first via penetrates the first light-shielding structure.

21. The display panel according to claim 19, characterized in that, The plurality of pixel opening regions include a first pixel opening region, a second pixel opening region, and a third pixel opening region. The first pixel opening region is correspondingly provided with a first color light-emitting element, the second pixel opening region is correspondingly provided with a second color light-emitting element, and the third pixel opening region is correspondingly provided with a third color light-emitting element. The encapsulation layer further includes a third adhesive layer located between the first inorganic layer and the second inorganic layer. The third adhesive layer has a transmittance of the third color light emitted by the third color light-emitting element greater than its transmittance of the first color light emitted by the first color light-emitting element, and greater than its transmittance of the second color light emitted by the second color light-emitting element. In a direction perpendicular to the plane of the display substrate, the first via overlaps with the third pixel opening area.

22. A display device, characterized in that, Includes the display panel as described in any one of claims 1-21.

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