Display module, preparation method thereof and display device

Abstract

The application provides a display module, a preparation method thereof and a display device. The display module comprises a display panel, a cover plate arranged on the light-emitting side of the display panel, and an ultra-clean film layer arranged on the backlight side of the display panel. The display panel comprises a display area, and the display area is provided with a through hole. The through hole penetrates the display panel along a direction perpendicular to the display panel to a surface of the cover plate close to the display panel. The ultra-clean film layer is formed with a avoiding area corresponding to the through hole. A hole film is arranged on the backlight side of the display panel corresponding to the position of the avoiding area. The orthographic projection of the hole film on the cover plate at least completely covers the orthographic projection of the through hole on the cover plate. The display module of the application arranges the hole film on the avoiding area of the ultra-clean film layer on the backlight side of the display panel, which is convenient to process, is conducive to improving the production and processing efficiency, reliably avoids the contamination of the hole area, does not affect the transmittance of the hole area, does not increase the frame size of the display module, and is conducive to improving the yield rate of the display module and the product competitiveness.

Description

Technical Field

[0001] This invention generally relates to the field of display technology, and more specifically to a display module, its manufacturing method, and a display device. Background Technology

[0002] As customer demand for OLED products increases, more and more aperture areas are required on OLED products. Since the aperture areas are usually not covered by the entire display module stack, there is a problem of dirt in the aperture areas, which affects the transmittance of the aperture areas and the yield of the display module. Summary of the Invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display module, its manufacturing method and display device, which, by opening holes in the entire stacked structure of the display panel and setting a perforated film in the avoidance area of ​​the ultra-clean film layer on the backlight side of the display panel, facilitates processing, improves production efficiency, reliably avoids dirt in the perforated area, does not affect the transmittance of the perforated area, and thus helps to improve the yield rate and product competitiveness of the display module.

[0004] In a first aspect, the present invention provides a display module, comprising:

[0005] The display panel has a cover plate on the light-emitting side and an ultra-clean film layer on the backlight side. The display panel includes a display area with a through hole that extends through the display panel in a direction perpendicular to the display panel to the surface of the cover plate near the display panel.

[0006] The ultra-clean thin film layer has a corresponding clearance zone for the through holes;

[0007] A perforated membrane is provided on the backlight side of the display panel at the position corresponding to the avoidance area, and the orthographic projection of the perforated membrane on the cover plate at least completely covers the orthographic projection of the through hole on the cover plate.

[0008] As an optional solution, in a direction parallel to the display panel, the edge of the ultra-clean film layer is recessed relative to the edge of the display panel to form a clearance zone. The perforated membrane is disposed in the same layer as the ultra-clean film layer and is located in the clearance zone, with the edge of the perforated membrane in contact with the edge of the ultra-clean film layer.

[0009] As an optional solution, the ultra-clean film layer forms a clearance area by penetrating the opening along the direction perpendicular to the display panel. The opening and the through hole of the ultra-clean film layer are connected. A release film is stacked on the side of the ultra-clean film layer away from the display panel, and the area on the release film corresponding to the clearance area is configured as a perforated film.

[0010] As an alternative, a partition structure is formed on the release film, which separates areas configured as porous membranes on the release film.

[0011] As an optional solution, the orthographic projection of the opening in the ultra-clean film layer onto the cover plate shall at least completely cover the orthographic projection of the through hole onto the cover plate.

[0012] As an optional solution, the distance between the edge of the opening and the edge of the through hole in the ultra-clean film layer is 0.1mm-0.5mm in the direction parallel to the display panel.

[0013] As an optional option, the thickness of the porous membrane is greater than or equal to 50 μm and less than or equal to 100 μm.

[0014] In a second aspect, the present invention provides a method for manufacturing a display module according to the first aspect, specifically comprising:

[0015] A display panel is provided, a cover plate is formed on the light-emitting side of the display panel, an ultra-clean film layer is formed on the backlight side of the display panel, the display panel includes a display area, the display area has a through hole, the through hole penetrates the display panel along a direction perpendicular to the display panel to the surface of the cover plate near the display panel;

[0016] An avoidance area is formed on the ultra-clean thin film layer to avoid the through hole. A perforated film is formed on the backlight side of the display panel at the position corresponding to the avoidance area. The orthographic projection of the perforated film on the cover plate at least completely covers the orthographic projection of the through hole on the cover plate.

[0017] As an optional solution, a clearance area for the via is formed on the ultra-clean thin film layer, and a perforated film is formed on the backlight side of the display panel at the position corresponding to the clearance area, including:

[0018] In a direction parallel to the display panel, the edge of the ultra-clean film layer is recessed relative to the edge of the display panel to form a clearance zone;

[0019] A porous membrane is attached to the avoidance area. The porous membrane is set in the same layer as the ultra-clean film layer, and the edge of the porous membrane is in contact with the edge of the ultra-clean film layer.

[0020] Alternatively, an opening can be made in the ultra-clean film layer along a direction perpendicular to the display panel to form a clearance area, so that the opening and through hole of the ultra-clean film layer are connected.

[0021] A release film is formed on the side of the ultra-clean thin film layer away from the display panel, and the area on the release film corresponding to the avoidance area is configured as a perforated film.

[0022] Thirdly, the present invention provides a display device, characterized in that it includes the display module of the first aspect.

[0023] The display module of the present invention includes a cover plate on the light-emitting side of the display panel and an ultra-clean film layer on the backlight side of the display panel. The display panel includes a display area, through which through-holes are formed, penetrating the display panel along a direction perpendicular to the display panel to the surface of the cover plate near the display panel. The ultra-clean film layer forms a clearance area to avoid the through-holes. A perforated film is provided on the backlight side of the display panel corresponding to the clearance area, and the orthographic projection of the perforated film on the cover plate at least completely covers the orthographic projection of the through-holes on the cover plate. Thus, by forming a perforated area by integrally creating through-holes in the stacked structure of the display panel, and providing a perforated film in the clearance area of ​​the ultra-clean film layer on the backlight side of the display panel, the perforated film completely covers the through-holes. This reduces process requirements, facilitates processing, and avoids causing defects to the display module (e.g., but not limited to the perforated film inserting between display panel layers, causing display defects). This improves production efficiency while reliably avoiding contamination of the perforated area, thus not affecting the transmittance of the perforated area, further improving the yield rate and product competitiveness of the display module. Attached Figure Description

[0024] Other features, objectives, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0025] Figure 1 This is a schematic diagram of the structure of a display module in related technologies;

[0026] Figure 2 Photos of the dirty area around the hole;

[0027] Figure 3 A photograph showing white fog or white lines appearing in the hole area;

[0028] Figure 4 This is a schematic diagram of the artificially applied perforated membrane in a display module in related technologies;

[0029] Figure 5 This is a schematic diagram of the membrane-attached hole membrane on the equipment fixture of a display module in related technologies;

[0030] Figure 6 This is a schematic diagram of the rear structure of a display module according to an embodiment of this application;

[0031] Figure 7 for Figure 6 AA section diagram;

[0032] Figure 8 This is a schematic diagram of the rear structure of another display module according to an embodiment of this application;

[0033] Figure 9 for Figure 8 AA section diagram.

[0034] In the picture,

[0035] 1. Hole area;

[0036] 100. Display module;

[0037] 10. Display panel; 11. Through hole; 12. Perforated membrane;

[0038] 20. Cover plate, 30. Polarizing film, 40. Optical transparent adhesive, 50. Ultra-clean film layer, 51. Avoidance area, 52. Partition structure, 53. Release film. Detailed Implementation

[0039] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] Currently, medium and large-sized OLED display modules have a large number of aperture regions 1, and these aperture regions 1 are not covered by the display module stacking structure, such as... Figure 1 and 2 As shown, there is a problem of dirt in the aperture area, which to some extent affects the transmittance of the aperture area and the yield rate of the display module. In related technologies, thin film is attached to the corresponding position of the aperture area in the shipment of the display module to reduce the defect rate. However, the existing thin film attachment has the following problems: (1) When the corresponding aperture film is used with the CG (cover plate) unit, there is a phenomenon that the CG cannot be washed with water, which leads to the problem of water vapor white spots in the camera aperture at the corresponding position of the CG, affecting the optical characteristics of the aperture area, such as Figure 3 As shown; (2) The operator uses a fixture to attach the membrane at the corresponding position. To ensure mass production stability and avoid GDS or membrane peeling caused by operator operation, such as Figure 4 As shown, it is necessary to ensure that the distance from the edge of the perforated film to the edge of the display panel (PNL) is ≥0.8mm. This spacing will increase the bezel of the display module in the planar direction and affect the overall size of the device; (3) Automatic bonding is carried out using in-house equipment, such as Figure 5 As shown, the distance from the edge of the perforated film to the edge of the display panel must be ≥0.35mm to avoid GD at the corresponding position. This also increases the bezel of the display module in the planar direction to a certain extent, and also increases the in-factory bonding process, affecting production efficiency.

[0042] Based on the above problems, in a first aspect, embodiments of this application provide a display module 100, which integrally opens a hole in the stacked structure on the display panel 10 to the surface of the cover plate 20 near the display panel 10, and correspondingly opens an avoidance area 51 in the ultra-clean film layer 50 on the backlight side of the display panel 10, and sets a perforated film 12 in the avoidance area 51, which helps to avoid dirt in the perforated area while ensuring the display effect of the display module and not affecting the frame of the display module.

[0043] Specifically, embodiments of this application provide a display module 100, such as... Figure 6-9 As shown, it includes:

[0044] Display panel 10, a cover plate 20 is provided on the light-emitting side of display panel 10, and an ultra-clean film layer 50 is provided on the backlight side of display panel 10. Display panel 10 includes a display area, and a through hole 11 is provided in the display area. The through hole 11 penetrates the display panel 10 along a direction perpendicular to the display panel 10 to the surface of the cover plate 20 near the display panel 10.

[0045] The ultra-clean thin film layer 50 has a clearance area 51 corresponding to the through hole 11;

[0046] A perforated membrane 12 is provided on the backlight side of the display panel 10 at the position corresponding to the avoidance area 51. The orthogonal projection of the perforated membrane 12 on the cover plate 20 at least completely covers the orthogonal projection of the through hole 11 on the cover plate 20.

[0047] It should be noted that the display panel 10 in the embodiments of this application can be a curved display panel 10, or it can be a flat display panel 10. A curved display panel 10 includes a flat center and curved edges; or a foldable display panel 10, where the two sides are flat and the center is folded. The display panel 10 includes a display area and a non-display area (peripheral area) located around the display area. The display area is used for display, and the non-display area includes bonding pad areas and areas for mounting other structures. The non-display area may include one bonding pad area. Alternatively, depending on actual process requirements, the non-display area may have two or more bonding pad areas.

[0048] It is understood that a cover plate 20 is provided on the light-emitting side of the display panel 10. The cover plate 20 is mainly used to protect the entire display module. The cover plate 20 is bonded to the light-emitting surface of the display panel 10 with optically transparent adhesive 40 (OCA). The orthographic projection of the cover plate 20 on the display panel 10 at least covers the display area of ​​the display panel 10. The cover plate 20 can be, but is not limited to, glass, transparent resin material, or PET, as long as it has good light transmittance to ensure reliable light emission. The embodiments of this application do not specifically limit this. Taking glass as an example, when applied to curved display products, at least one side of the cover plate 20 is bent, and the bonding of each layer of the display module is achieved through a 3D bonding process. In some embodiments, a polarizer 30 is also provided on the light-emitting side of the display panel 10. The polarizer 30 is located between the display panel 10 and the cover plate 20, and the polarizer 30 is bonded and fixed to the cover plate 20 with optically transparent adhesive. The polarizer 30 is mainly used to shield the ambient light irradiating into the display panel 10, thereby achieving an anti-reflection effect. Typically, the polarizer 30 may include a hard coating (HC), a TAC (triacetate cellulose), a polarizing layer (polyvinyl alcohol, PVA), a first photosensitive adhesive layer (Pressure Sensitive Adhesive, PSA), an ND film, and a second photosensitive adhesive layer (PSA) stacked sequentially. In actual use, the polarizer 30 also includes an upper protective film and a lower protective film. The upper protective film is disposed above the hard coating, and the lower protective film is disposed below the second photosensitive adhesive layer. When the polarizer 30 is installed on the cover plate 20, the lower protective film needs to be removed first, and then the second photosensitive adhesive layer is attached to the cover plate 20.

[0049] The backlight side of the display panel 10 is provided with a back film and an ultra-clean film layer 50 (SCF), which are stacked together along the direction away from the display panel 10. The back film can be a U-Film film, which is attached to the backlight side of the display panel 10 and mainly serves to protect and support the display panel 10. The back film may include a laminated acrylic film (Acryl film) and a polyethylene terephthalate film (PET film).

[0050] The super clean foam (SCF) layer 50 can be a composite film layer, typically employing a multi-layered structure. The super clean foam layer 50 may include a metal layer, which possesses heat dissipation and electrical conductivity properties. The metal layer is generally made of copper (Cu) or aluminum (Al). The super clean foam layer 50 may also include an adhesive layer and a functional layer located between the adhesive layer and the metal layer. The adhesive layer is used to bond the super clean foam layer 50 to the backlight side of the display panel 10. The adhesive layer can use embossing adhesive (EMBO) or other adhesive materials. EMBO helps reduce air bubbles generated during bonding with the display panel 10, thereby enhancing the connection strength between the display panel 10 and the super clean foam layer 50. In practical use, a protective film layer is provided on the adhesive layer of the ultra-clean film layer 50 on the side opposite to the metal layer to protect the ultra-clean film layer 50. When using the ultra-clean film layer 50, the protective film layer needs to be removed first. The functional layer has stress buffering properties, which can buffer the stress and impact applied to the display panel 10 from the outside. Specifically, the functional layer may include a foam layer, which is disposed on the side of the adhesive layer close to the metal layer. The material of the foam layer can be polyurethane (PU) or other materials. In some other embodiments, the functional layer may also include a support layer, which is disposed on the side of the foam layer close to the metal layer and plays a supporting and impact-resistant role. The support layer can be black to enhance the all-black effect of the product. The support layer can be black PI (Polyimide).

[0051] It is also understandable that the display area of ​​the display panel 10 has through holes 11, that is, through holes 11 are formed in the entire stacked structure of the display panel 10. The through holes 11 penetrate the display panel 10, the polarizer 30 and the optically transparent adhesive layer to the surface of the cover plate 20 near the display panel 10. This simplifies the hole area processing process and does not affect the setting of the cover plate 20, avoiding the problem of water vapor white spots appearing at the corresponding hole area positions on the cover plate 20. Among them, the ultra-clean film layer 50 has a relief area 51 corresponding to the through hole 11. The relief area 51 can be, but is not limited to, an opening on the ultra-clean film layer 50 or the ultra-clean film layer 50 being set inward relative to the display panel 10. The relief area 51 is used to avoid the through hole 11, which helps to avoid obstructing the camera component installed on the substrate and ensures that the camera component can be used normally.

[0052] It is also understandable that a perforated membrane 12 is provided at the position corresponding to the avoidance area 51 on the backlight side of the display panel 10. The orthographic projection of the perforated membrane 12 onto the cover plate 20 at least completely covers the orthographic projection of the through hole 11 onto the cover plate 20. This means that the perforated membrane 12 can cover only the through hole 11, or it can completely cover the entire avoidance area 51. This is beneficial for reliable protection of the hole area and prevents dirt from getting into it. Furthermore, since the perforated membrane 12 is located on the backlight side of the display panel 10, on the one hand, it helps to reliably prevent the perforated membrane 12 from colliding with or intersecting the structure on the light-emitting side of the display panel 10 during the application process, thus avoiding display defects in the display module and ensuring a good display effect. On the other hand, the perforated membrane 12 being located at the position corresponding to the avoidance area 51 does not affect the size of the display module in the direction parallel to the display panel 10, avoiding the need for a large bezel.

[0053] The display module of this application solves the problem of dirt in the hole area of ​​existing display modules, and the problem that the arrangement of the perforated film 12 affects the transmittance of the hole area and the yield of the display module. The embodiment of this application provides a cover plate 20 on the light-emitting side of the display panel 10, and an ultra-clean film layer 50 on the backlight side of the display panel 10. The display panel 10 includes a display area, and a through hole 11 is formed in the display area. The through hole 11 penetrates the display panel 10 along a direction perpendicular to the display panel 10 to the surface of the cover plate 20 near the display panel 10. The ultra-clean film layer 50 forms a avoidance area 51 to avoid the through hole 11. A perforated film 12 is provided on the backlight side of the display panel 10 at a position corresponding to the avoidance area 51. The orthographic projection of the perforated film 12 on the cover plate 20 at least completely covers the orthographic projection of the through hole 11 on the cover plate 20. Thus, by forming a hole area by opening through holes 11 throughout the stacked structure of the display panel 10, and setting a perforated film 12 in the avoidance area 51 of the ultra-clean film layer 50 on the backlight side of the display panel 10, the perforated film 12 completely covers the through holes 11. This method has low process requirements, is easy to process, and will not cause defects to the display module (e.g., but not limited to the perforated film 12 being inserted between the layers of the display panel 10, causing display defects). This method is beneficial to improving production efficiency while reliably avoiding dirt in the hole area, thereby not affecting the transmittance of the hole area, and further improving the yield rate and product competitiveness of the display module.

[0054] As a feasible approach, such as Figure 7 As shown, in the direction parallel to the display panel 10 ( Figure 7 In the X direction, the edge B2 of the ultra-clean film layer 50 is recessed relative to the edge B1 of the display panel 10 to form a clearance area 51. The perforated membrane 12 is disposed in the same layer as the ultra-clean film layer 50 and is located in the clearance area 51. The edge of the perforated membrane 12 is in contact with the edge B2 of the ultra-clean film layer 50.

[0055] It is understandable that the edge B2 of the ultra-clean film layer 50 is recessed relative to the edge B1 of the display panel 10. This recess can be on one side, two sides, three sides, or four sides of the ultra-clean film layer 50, depending on the location and number of openings. As long as the edge of the ultra-clean film layer 50 closest to the through hole 11 is recessed, an avoidance area 51 is formed by this recess, so that the area on the display surface where the through hole 11 is opened protrudes relative to the ultra-clean film layer 50, reliably preventing the ultra-clean film layer 50 from blocking the hole area.

[0056] The edge B2 of the cleanroom film layer 50 is recessed to form a clearance area 51. The porous membrane 12 is set in the clearance area 51 and is set in the same layer as the cleanroom film layer 50. This helps to protect the porous area from dirt and also helps to reduce process requirements. During the attachment process of the porous membrane 12, the edge of the porous membrane 12 is inserted into the cleanroom film layer 50 without having a significant impact. The edge of the porous membrane 12 can be in close contact with the edge of the cleanroom film layer 50. Of course, the edge of the porous membrane 12 can also form a gap with the edge of the cleanroom film layer 50, as long as the porous membrane 12 completely covers the through hole 11.

[0057] This embodiment has low process requirements, can reliably protect the hole area, and can ensure the display efficiency of the display module and improve the yield of the display module.

[0058] As a feasible approach, such as Figure 8 and 9 As shown, the ultra-clean film layer 50 forms a clearance area 51 through the opening along the direction perpendicular to the display panel 10. The opening of the ultra-clean film layer 50 is connected to the through hole 11. A release film 53 is stacked on the side of the ultra-clean film layer 50 away from the display panel 10. The area on the release film 53 corresponding to the clearance area 51 is configured as a perforated film 12.

[0059] The ultra-clean film layer 50 forms a clearance area 51 through the opening, and the opening is connected to the through hole 11. The size of the opening of the ultra-clean film layer 50 in the direction parallel to the display panel 10 should be larger than the size of the through hole 11 in the direction parallel to the display panel 10. This helps to avoid obstructing the camera components set in the hole area. Since the ultra-clean film layer 50 has a release film 53, the area on the release film 53 corresponding to the clearance area 51 is directly configured as the hole film 12, without the need to attach an additional hole film 12, which simplifies the process and improves production efficiency.

[0060] It is understandable that, such as Figure 9 As shown, in the direction parallel to the display panel 10 ( Figure 9In the X direction), the edge B4 of the through hole 11 is recessed relative to the opening edge B3 of the ultra-clean film layer 50. The distance between the edge B4 of the through hole 11 and the opening edge B3 of the ultra-clean film layer 50 at various points can be equal or unequal, depending on the actual process.

[0061] In this embodiment, the porous membrane 12 and the ultra-clean film layer 50 are supplied as a single unit, which protects the porous area from dirt and eliminates the need for additional porous membrane 12, simplifying the process and improving production efficiency.

[0062] In a preferred embodiment, a partition structure 52 is formed on the release film 53, the partition structure 52 separating a region configured as a porous film 12 on the release film 53.

[0063] The partition structure 52 is mainly used to separate the area corresponding to the perforated membrane 12 and the area of ​​the ultra-clean film layer 50, so that after the ultra-clean film layer 50 is fixed to the backlight side of the display panel 10, the release film 53 of the ultra-clean film layer 50 can be removed for fixing the ultra-clean film layer 50 and other film layers. The partition structure 52 may be, but is not limited to, a dotted shear line or a straight shear line formed on the release film 53. Of course, in some other embodiments, the partition structure 52 may also be an indentation on the release film 53.

[0064] In this embodiment, the release film 53 is beneficial for separating the area of ​​the porous membrane 12, while not affecting the removal of the release film 53 of the ultra-clean film layer 50.

[0065] In some embodiments, the orthographic projection of the opening of the ultra-clean film layer 50 onto the cover plate 20 at least completely covers the orthographic projection of the through hole 11 onto the cover plate 20.

[0066] In this embodiment, the orthographic projection of the opening of the ultra-clean film layer 50 onto the cover plate 20 completely covers the orthographic projection of the through hole 11 onto the cover plate 20, which helps to prevent the ultra-clean film layer 50 from obscuring components such as cameras in the hole area.

[0067] In some embodiments, such as Figure 9 As shown, in the direction parallel to the display panel 10, the distance d between the opening edge B3 of the ultra-clean film layer 50 and the edge B4 of the through hole 11 is 0.1mm-0.5mm.

[0068] Specifically, the distance between the opening edge of the ultra-clean film layer 50 and the edge of the through hole 11 can be, but is not limited to, 0.1mm, 0.2mm, 0.3mm, 0.4mm, or 0.5mm. When the distance between the opening edge of the ultra-clean film layer 50 and the edge of the through hole 11 is less than 0.1mm, the processing precision requirement is high, and there may be a problem of obstructing the through hole 11. When the distance between the opening edge of the ultra-clean film layer 50 and the edge of the through hole 11 is greater than 0.5mm, the opening of the ultra-clean film layer 50 is too large, which affects the support, buffering, and heat dissipation functions of the display panel 10.

[0069] In some embodiments, the thickness of the porous membrane 12 is greater than or equal to 50 μm and less than or equal to 100 μm.

[0070] The thickness of the perforated membrane 12 refers to the thickness of the perforated membrane 12 in the direction perpendicular to the display panel (e.g., ...). Figure 7 or Figure 9 The dimension in the Y direction.

[0071] Specifically, the thickness of the porous membrane 12 can be, but is not limited to, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm. When the thickness of the porous membrane 12 is less than 50μm or greater than 100μm, the production and processing costs are high.

[0072] In summary, the display module of this application forms a hole area by integrally opening through holes 11 in the stacked structure of the display panel 10, and setting a perforated film 12 in the avoidance area 51 of the ultra-clean film layer 50 on the backlight side of the display panel 10. The perforated film 12 completely covers the through holes 11. The process requirements are low, the processing is convenient, and it will not cause adverse defects to the display module (e.g., but not limited to the perforated film 12 being inserted between the layers of the display panel 10, causing display defects). It is beneficial to improve the production and processing efficiency while reliably avoiding dirt in the hole area, thereby not affecting the transmittance of the hole area, and further improving the yield rate and product competitiveness of the display module.

[0073] Furthermore, by setting the ultra-clean film layer 50 to be recessed relative to the display panel 10 or by creating openings in the ultra-clean film layer 50, and configuring the release film 53 on the ultra-clean film as a perforated film 12, it is beneficial to protect the perforated area from dirt while not affecting the structure of the light-emitting side of the display panel 10. At the same time, it can also simplify the process and improve production efficiency.

[0074] In some embodiments, the display panel 10 includes a substrate, which may be, but is not limited to, a silicon substrate. The silicon substrate may include a silicon substrate and an ultra-clean thin film layer 50, a driving layer, a display layer, an encapsulation layer, a polarizer 30, a cover plate 20, etc., stacked on the silicon substrate in a direction away from the silicon substrate.

[0075] The driving layer may include multiple pixel driving circuits arranged in an array. Each pixel driving circuit may include multiple transistors and capacitors, among other electronic components. For example, each pixel driving circuit may include three transistors and one capacitor, forming a 3T1C (i.e., one driving transistor, two switching transistors, and one capacitor). It may also include more than three transistors and at least one capacitor, such as 4T1C (i.e., one driving transistor, three switching transistors, and one capacitor), 5T1C (i.e., one driving transistor, four switching transistors, and one capacitor), or 7T1C (i.e., one driving transistor, six switching transistors, and one capacitor), etc. The transistors may be thin-film transistors (TFTs).

[0076] It is understood that a thin-film transistor (TFT) may include a control electrode, a first electrode, and a second electrode. The control electrode is the gate of the TFT, the first electrode is one of the source and drain of the TFT, and the second electrode is the other of the source and drain of the TFT.

[0077] In some embodiments, the driving layer may include an active layer, a first gate metal layer (Gate1), a second gate metal layer (Gate2), a first metal trace layer (SD1), and a second metal trace layer (SD2). These layers are configured to form thin-film transistors, capacitors, and multiple signal lines for pixel driving in a pixel driving circuit. For example, the multiple signal lines may include power signal lines, data signal lines, reset signal lines, scan signal lines, enable signal lines, and initialization signal lines, etc. The driving layer may also include insulating layers that space these layers apart.

[0078] The display layer may include a light-emitting device layer and an encapsulation layer. The light-emitting device layer is stacked on the side of the driving layer away from the substrate. The light-emitting device layer may include a pixel definition layer and multiple light-emitting devices. The pixel definition layer has multiple pixel openings, and each pixel opening defines the position of a light-emitting device to form a sub-pixel. For example, the light-emitting device may be an OLED light-emitting device or a QLED light-emitting device. Taking an OLED light-emitting device as an example, along the direction away from the substrate, the light-emitting device may include a first electrode, a light-emitting layer, and a second electrode stacked sequentially. Of course, the light-emitting device may also include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the first electrode and the light-emitting layer, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the second electrode and the light-emitting layer; in some embodiments, the first electrode may be an anode layer, and the second electrode may be a cathode layer. The anode layer may be a composite structure composed of a transparent conductive oxide film / metal film / transparent conductive oxide film stacked sequentially. The transparent conductive oxide film is made of materials such as ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide), and the metal film is made of materials such as gold (Au), silver (Ag), nickel (Ni), and platinum (Pt). For example, the anode layer can also be a single-layer structure, and the material of the single-layer structure can be any of ITO, IZO, Au, Ag, Ni, and Pt. Each pixel opening exposes a portion of the anode layer of the corresponding light-emitting device, and at least a portion of the light-emitting layer is located within the corresponding pixel opening, forming an electrical connection with the corresponding anode layer. For example, the cathode layers of each light-emitting device can be electrically connected to each other, forming a single structure. For example, the cathode layer material can be any of aluminum (Al), silver (Ag), and magnesium (Mg), or any of magnesium-silver alloys and aluminum-lithium alloys.

[0079] An encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate to protect the light-emitting device. The encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. For example, the first and second inorganic encapsulation layers may be made of inorganic materials such as nitrides, oxides, oxynitrides, nitrates, carbides, or any combination thereof, and the fabrication process may employ chemical vapor deposition (CVD), such as plasma-enhanced chemical vapor deposition (PECVD). For example, the organic insulating layer may be made of materials such as acrylic fiber, hexamethyldisiloxane, polyacrylates, polycarbonate, or polystyrene, and the fabrication process may employ inkjet printing (IJP).

[0080] Secondly, embodiments of this application provide a method for manufacturing a display module according to the first aspect, specifically including:

[0081] Step S10: Provide a display panel 10. A cover plate 20 is formed on the light-emitting side of the display panel 10, and an ultra-clean film layer 50 is formed on the backlight side of the display panel 10. The display panel 10 includes a display area. A through hole 11 is provided in the display area. The through hole 11 penetrates the display panel 10 along a direction perpendicular to the display panel 10 to the surface of the cover plate 20 near the surface of the display panel 10.

[0082] Step S20: A clearance area 51 for avoiding the through hole 11 is formed on the ultra-clean thin film layer 50. A perforated film 12 is formed on the backlight side of the display panel 10 at a position corresponding to the clearance area 51. The orthogonal projection of the perforated film 12 on the cover plate 20 at least completely covers the orthogonal projection of the through hole 11 on the cover plate 20.

[0083] The method for preparing the display module according to the embodiments of this application is simple and easy to implement. It can reliably protect the hole area from dirt and does not affect the display effect of the display panel 10, which is beneficial to improving the yield of the display panel 10.

[0084] In some embodiments, step S20, forming a clearance area 51 for the clearance via 11 on the ultra-clean thin film layer 50, and forming a perforated film 12 on the backlight side of the display panel 10 corresponding to the clearance area 51, includes:

[0085] In a direction parallel to the display panel 10, the edge of the ultra-clean film layer 50 is recessed relative to the edge of the display panel 10 to form a clearance area 51;

[0086] A porous membrane 12 is attached to the avoidance area 51. The porous membrane 12 is disposed in the same layer as the ultra-clean film layer 50, and the edge of the porous membrane 12 is in contact with the edge of the ultra-clean film layer 50.

[0087] Alternatively, an avoidance area 51 can be formed by a through-hole in the ultra-clean film layer 50 along a direction perpendicular to the display panel 10, so that the through-hole in the ultra-clean film layer 50 is connected to the through-hole 11.

[0088] A release film 53 is formed on the side of the ultra-clean thin film layer 50 away from the display panel 10, and the area on the release film 53 corresponding to the avoidance area 51 is configured as a perforated film 12.

[0089] In summary, the manufacturing method of the display module according to the embodiments of this application has low process requirements, is easy to process, and will not cause adverse defects to the display module (e.g., but not limited to the insertion of the perforated film 12 between the layers of the display panel 10, causing display defects). Furthermore, it will not increase the bezel of the display module, and there is no need to set functional wiring at the opening of the display panel 10, nor is it necessary to consider the module loss caused by rework. This is beneficial to improving production and processing efficiency while reliably avoiding dirt in the hole area, thereby not affecting the transmittance of the hole area, and further beneficial to improving the yield rate and product competitiveness of the display module.

[0090] Thirdly, the present invention provides a display device including the display module of the first aspect. It is understood that this display device possesses all the features and advantages of the aforementioned display module, which will not be repeated here. In summary, this display device has high quality and yield, and excellent display effect.

[0091] A display device is a product with image display capabilities. For example, a display device can be any of the following: monitor, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large-area wall, home appliance, information query equipment (such as business query equipment for e-government, banks, hospitals, power companies, etc.), monitor, etc. A display device can also be a microdisplay or a product containing a microdisplay. Products containing microdisplays can be any of the following: smartwatch, smart bracelet, helmet display, stereoscopic display, and AR devices (such as AR glasses), VR devices (such as VR glasses), etc. For example, a microdisplay can be a display with a display size ranging from approximately 0.2 inches to approximately 2.5 inches, but is not limited to this. Understandably, a microdisplay can also be a display with a smaller display size, such as a display size less than or equal to 0.2 inches.

[0092] It should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., used above to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the panel or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise stated, "a plurality of" means two or more.

[0093] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display module, characterized in that, include: The display panel has a cover plate on its light-emitting side and an ultra-clean film layer on its backlight side. The display panel includes a display area with a through hole that extends through the display panel in a direction perpendicular to the display panel to the surface of the cover plate near the display panel. The ultra-clean film layer has a clearance area corresponding to the through hole; A perforated membrane is provided on the backlight side of the display panel corresponding to the position of the avoidance area, and the orthographic projection of the perforated membrane on the cover plate at least completely covers the orthographic projection of the through hole on the cover plate.

2. The display module according to claim 1, characterized in that, In a direction parallel to the display panel, the edge of the ultra-clean film layer is recessed relative to the edge of the display panel to form the clearance area. The porous membrane is disposed in the same layer as the ultra-clean film layer and is located in the clearance area. The edge of the porous membrane is in contact with the edge of the ultra-clean film layer.

3. The display module according to claim 1, characterized in that, The ultra-clean film layer forms the avoidance area by through-holes along a direction perpendicular to the display panel. The openings of the ultra-clean film layer are connected to the through holes. A release film is stacked on the side of the ultra-clean film layer away from the display panel. The area on the release film corresponding to the avoidance area is configured as the perforated film.

4. The display module according to claim 3, characterized in that, A partition structure is formed on the release film, the partition structure dividing the release film into regions configured as the porous membrane.

5. The display module according to claim 3, characterized in that, The orthographic projection of the opening in the ultra-clean film layer onto the cover plate at least completely covers the orthographic projection of the through hole onto the cover plate.

6. The display module according to claim 5, characterized in that, In a direction parallel to the display panel, the distance between the edge of the opening in the ultra-clean film layer and the edge of the through hole is 0.1mm-0.5mm.

7. The display module according to any one of claims 1-6, characterized in that, The thickness of the porous membrane is greater than or equal to 50 μm and less than or equal to 100 μm.

8. A method for manufacturing a display module according to any one of claims 1-7, characterized in that, Specifically, it includes: The display panel is provided, wherein a cover plate is formed on the light-emitting side of the display panel, and an ultra-clean film layer is formed on the backlight side of the display panel. The display panel includes a display area, and a through hole is formed in the display area. The through hole penetrates the display panel along a direction perpendicular to the display panel to the surface of the cover plate near the display panel. An avoidance area is formed on the ultra-clean film layer to avoid the through hole, and a perforated film is formed on the backlight side of the display panel at a position corresponding to the avoidance area. The orthographic projection of the perforated film on the cover plate at least completely covers the orthographic projection of the through hole on the cover plate.

9. The method for preparing a display module according to claim 8, characterized in that, A clearance area is formed on the ultra-clean thin film layer to avoid the through-hole, and the perforated film is formed on the backlight side of the display panel at a position corresponding to the clearance area, including: In a direction parallel to the display panel, the edge of the ultra-clean film layer is recessed relative to the edge of the display panel to form the clearance area; The porous membrane is attached to the avoidance area, the porous membrane is disposed in the same layer as the ultra-clean film layer, and the edge of the porous membrane is in contact with the edge of the ultra-clean film layer; Alternatively, the clearance area can be formed by a through-hole in the ultra-clean film layer along a direction perpendicular to the display panel, so that the through-hole in the ultra-clean film layer is connected to the through-hole; A release film is formed on the side of the ultra-clean thin film layer away from the display panel, and the area on the release film corresponding to the avoidance area is configured as the perforated film.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-7.

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