Power electronic module with integrated heat sink

Abstract

A power electronic module (50) can be configured to control power in a plurality of phases. The power electronic module (50) can include a capacitor (52) having a housing (70) with a plurality of panels defining a box-shaped enclosure. The power electronic module (50) can include one or more heat sinks (68) disposed on an exterior of the housing (70), the one or more heat sinks (68) having a first planar surface disposed on one or more of the panels and a second planar surface opposite the first planar surface. The power electronic module (50) can include a plurality of power switch modules (54) electrically connected to the capacitor (52) and disposed on the second planar surface of the one or more heat sinks (68), the plurality of power switch modules (54) configured to control power flow in a respective phase of the plurality of phases.

Description

Technical Field

[0001] This disclosure generally relates to electrical systems, and for example to a power electronic module with an integrated heat sink. Background Technology

[0002] Power electronic modules are used in various machines and systems to provide control and / or conversion of electricity. For example, power electronic modules can be integrated into electrical systems used in electric vehicles, diesel-electric machines, battery-electric machines, or renewable energy systems, etc. Power electronic modules may include a combination of semiconductor devices and control circuitry to facilitate efficient conversion, regulation, and distribution of electricity. Furthermore, power electronic modules may include capacitors that act as energy storage devices and facilitate voltage regulation, filtering, and / or transient suppression to improve overall power quality. Without efficient thermal management, heat generated within the power electronic module (e.g., by the semiconductor devices) can damage sensitive semiconductor devices and associated control circuitry, and can also impair the capacitors by reducing their capacitance and / or power density. Therefore, the performance of a power electronic module can be compromised due to excessive heat.

[0003] U.S. Patent No. 10,932,396 ('396 patent) discloses a power module that may include a heat sink module for actively cooling capacitors and transistors of the power module. The power module may be a power module of a multiphase inverter module disposed within the drivetrain unit of an electric vehicle.

[0004] The power module of the '396 patent is not a multiphase power module. Instead, the '396 patent indicates that the power module can be coupled with two other power modules in a ternary configuration to form a three-phase inverter module. Therefore, the heat sink module of the '396 patent used in single-phase power modules is not suitable for multiphase power electronic modules. The spatial arrangement and thermal characteristics of the components in a multiphase power electronic module differ from those in a single-phase module. Therefore, multiphase power electronic modules, which distribute power among multiple individual phases, may exhibit some differences in power distribution, heat distribution, and heat dissipation compared to single-phase modules, differences that are not adequately addressed by the heat sink module of the '396 patent.

[0005] The power electronics module disclosed herein solves one or more of the problems set forth above and / or other problems in the art. Summary of the Invention

[0006] A power electronics module configured to control power in multiple phases may include a capacitor having a housing having multiple panels defining a box-shaped outer shell. The power electronics module may include one or more heat sinks disposed on the exterior of the housing, the heat sinks having a first planar surface disposed on one or more of the panels and a second planar surface opposite to the first planar surface. The power electronics module may include multiple power switching modules electrically connected to the capacitor and disposed on the second planar surface of the one or more heat sinks, the power switching modules being configured to control power flow in respective phases of the plurality of phases.

[0007] A power converter configured to control power in multiple phases may include a capacitor with a housing having multiple panels defining an outer shell. The power converter may include one or more heat sinks disposed on the exterior of the housing. The power converter may include multiple power switching modules electrically connected to the capacitor and disposed on respective planar surfaces of the one or more heat sinks, the power switching modules being configured to control power flow in respective phases of the multiple phases.

[0008] A machine may include: a power supply configured to output electrical power; and a power electronics module electrically coupled to the power supply and configured to control power in a plurality of phases. The power electronics module may include a capacitor having a housing having a plurality of panels defining an outer shell. The power electronics module may include one or more heat sinks disposed on the exterior of the housing. The power electronics module may include a plurality of power switch modules disposed on the one or more heat sinks and configured to control power flow in respective phases of the plurality of phases. The power electronics module may include a plurality of controllers configured to control respective power switch modules among the plurality of power switch modules. The power electronics module may include a plurality of busbars electrically connecting the respective power switch modules to the capacitor. Attached Figure Description

[0009] Figure 1 This is a perspective view of an exemplary machine.

[0010] Figure 2 This is a block diagram illustrating an exemplary power electronics module.

[0011] Figure 3 This is a perspective view of an exemplary power electronics module.

[0012] Figure 4 yes Figure 3 An exploded view of the power electronics module.

[0013] Figure 5 This is a perspective view of an exemplary power electronics module.

[0014] Figure 6 yes Figure 5 An exploded view of the power electronics module.

[0015] Figure 7 This is a perspective view of an exemplary heat sink. Detailed Implementation

[0016] This disclosure relates to a power electronic module suitable for any electrical machine or system. For example, the electrical machine or system may be an electric vehicle, a diesel-electric machine, a battery-electric machine, or a renewable energy system, etc.

[0017] Figure 1 This is a perspective view of an exemplary machine 10. Machine 10 can be a work machine. For example, machine 10 can perform earthmoving, excavation, or another operation associated with industries such as mining. As an example, such as Figure 1 As shown, machine 10 is a load-haul-dump (LHD) loader. However, machine 10 can be another type of machine, such as a compactor, paver, cold milling machine, grader, backhoe loader, wheel loader, harvester, excavator, automatic grader, skid steer loader, tractor, bulldozer, articulated underground truck, or off-highway truck, etc. Machine 10 can be a diesel-electric machine (e.g., it includes a diesel engine and an electrical system (such as a generator) to convert power from the engine into electricity for propulsion and / or operation of machine 10). Alternatively or concurrently, machine 10 can be a battery-electric machine (e.g., it uses electricity stored in one or more batteries for propulsion and / or operation of machine 10).

[0018] Machine 10 may include a frame 12 supported by a plurality of ground engagement members 14, which are shown as wheels. Alternatively or additionally, the ground engagement members 14 may include track assemblies, skids, etc. The ground engagement members 14 are used to propel machine 10 on a working surface.

[0019] Machine 10 includes a power source 16 configured to output electrical power, which can be used to power ground connection member 14. For example, power source 16 can provide power to an electric motor (not shown) of machine 10 and / or one or more machine accessories (e.g., a heating, ventilation, and air conditioning (HVAC) system). The electric motor can be a multiphase (e.g., three-phase) motor, such as an induction motor. Power source 16 may include an internal combustion engine (e.g., a diesel engine) and a generator coupled to the engine (e.g., in a diesel-electric machine configuration). Alternatively or additionally, power source 16 may include one or more batteries (e.g., in a battery-electric machine configuration). The machine includes a power electronics module 50 connected to power source 16. Power electronics module 50 is configured to provide control and / or conversion of electrical power in one or more electrical systems of machine 10. Power electronics module 50 can be a power converter. For example, power electronics module 50 can be configured as an AC inverter or a DC converter, etc.

[0020] Machine 10 may also include a device 20 mounted to frame 12, which can be used to manipulate and / or transport work materials at the work site. For example, device 20 may be mounted to frame 12 by a pair of lifting arms 22. Device 20 may include a bucket as shown in the figure. In some embodiments, power source 16 may (e.g., via the hydraulic system of machine 10) supply power to device 20.

[0021] As mentioned above, providing Figure 1 As an example. Other examples can be related to... Figure 1 The examples described are different.

[0022] Figure 2 This is a block diagram illustrating an example power electronics module 50. Power electronics module 50 is a multiphase (e.g., three-phase) power electronics module. That is, power electronics module 50 is configured to control power in multiple phases (e.g., multiple sinusoidal voltages or currents separated by an angle of 120 degrees). For example, power electronics module 50 can be configured to control the flow of power in a multiphase electrical system. For instance, power electronics module 50 can be configured to perform multiphase power conversion operations.

[0023] The power electronics module 50 includes a capacitor 52, multiple power switch modules 54, multiple controllers 56, multiple busbars 58, and / or a power supply module 60. The power module 50 may include additional circuitry components, electronics, sensors (e.g., current sensors), and / or electrical wiring to facilitate the operation of the power electronics module 50.

[0024] Capacitor 52 can be electrically connected to power supply 16 (directly or indirectly). Capacitor 52 can be configured to reduce ripple in the DC input and / or isolate the DC link from transients, etc. Capacitor 52 can be a high-temperature and / or high-density capacitor. In this example, capacitor 52 can be a polypropylene film capacitor. Capacitor 52 includes a set of terminals 62 that enable electrical connection of capacitor 52 to a circuit.

[0025] A power switching module 54 (which may also be referred to as a "power semiconductor module") may include one or more power switching devices 64 (which may also be referred to as "power semiconductor devices") and associated components in a package. The power switching device 64 is configured to control the flow of power (e.g., the flow of current) in the power electronic module 50. For example, the power switching device 64 may be configured to switch between an on or off state that allows power flow and an off or on state that prevents power flow. The power switching device 64 may include an insulated-gate bipolar transistor (IGBT), a thyristor, a power diode, or a metal-oxide-semiconductor field-effect transistor (MOSFET), etc. The power switching module 54 is electrically connected to a capacitor 52 (e.g., electrically connected to terminal 62 of the capacitor 52). For example, a busbar 58 (e.g., a DC busbar) electrically connects a corresponding power switching module 54 to the capacitor 52. The busbar 58 may include a laminated busbar and / or a monolithic busbar.

[0026] Each power switch module 54 is communicatively connected to and controlled by a corresponding controller 56 (e.g., which may be mounted on the power switch module 54). For example, one or more power switching devices 64 of the power switch module 54 are each communicatively connected to and controlled by the controller 56 for that power switch module 54. The controller 56 may be configured to generate a control signal applied to the gate terminal of the power switching device 64 for switching the power switching device 64 between an on state and an off state. Therefore, the controller 56 may be a gate drive controller, a gate drive board, etc. The controller 56 may include one or more integrated circuits and associated circuitry mounted on a circuit board (e.g., a printed circuit board). The power supply module 60 includes a plurality of power supply units 66. The power supply units 66 are electrically connected to and configured to power the corresponding controller 56.

[0027] The power electronics module 50 may include a corresponding set of components for each of a plurality of phases for power. For example, the power electronics module 50 may include a first set of power switch modules 54, a first set of controllers 56, and a first set of busbars 58 for a first phase (which may be represented as phase A); the power electronics module 50 may include a second set of power switch modules 54, a second set of controllers 56, and a second set of busbars 58 for a second phase (which may be represented as phase B); and the power electronics module 50 may include a third set of power switch modules 54, a third set of controllers 56, and a third set of busbars 58 for a third phase (which may be represented as phase C).

[0028] Therefore, the power switch module 54 is configured to control the flow of power in a corresponding phase of a plurality of phases of electrical power. For example, the power electronics module 50 may include one or more power switch modules 54 per phase (e.g., two or four power switch modules 54 per phase). For example, one or more first power switch modules 54 may control the flow of power in a first phase, one or more second power switch modules 54 may control the flow of power in a second phase, and one or more third power switch modules 54 may control the flow of power in a third phase.

[0029] As mentioned above, providing Figure 2 As an example. Other examples can be related to... Figure 2 The examples described are different.

[0030] Figure 3 This is a perspective view of an exemplary power electronics module 50, and Figure 4 yes Figure 3 An exploded view of the power electronics module 50 is shown. As illustrated, the power electronics module 50 includes a capacitor 52, a power switch module 54, a controller 56, a busbar 58, and / or a power supply module 60, as described herein. Additionally, the power electronics module 50 includes multiple heat sinks 68 (e.g., two, three, or four heat sinks 68). These components of the power electronics module 50 are assembled together in the illustrated configuration and may be contained within a housing (not shown). The power electronics module 50 may be arranged vertically, horizontally, or in another orientation within the housing (e.g., an enclosure), and interface connections (e.g., electrical connections, mechanical connections, and / or cooling connections) may be configured to accommodate the orientation of the power electronics module 50 (e.g., different configurations of interface connections may be used for different orientations). Figure 3-4 In the power electronics module configuration shown, busbar 58 may include laminated busbars.

[0031] The capacitor 52 may have a housing 70 surrounding its internal components. The housing 70 provides mechanical support and / or insulation for the capacitor 52. The housing 70 may be made of plastic, metal, and / or ceramic, etc. The housing 70 has multiple panels (e.g., substantially flat planar sections of the housing 70) that join along their edges to define an outer casing (e.g., a box-shaped casing). The panels may also be referred to as “walls,” “faces,” or “facets” of the housing 70. As shown, the terminals 62 of the capacitor 52 may be accessible at the end panels of the housing 70. In some embodiments, the power electronics module 50 may include an additional busbar 72 (e.g., mounted on the end panels) that electrically connects the terminals 62 to the busbar 58.

[0032] The heat sink 68 may include any heat exchange component configured to dissipate heat in the power electronics module 50. The heat sink 68 may be a fluid-cooled (e.g., liquid-cooled) heat sink, such as... Figure 7 As further described below. For example, radiator 68 may be in a fluid cooling loop. In some embodiments, radiator 68 may be in a respective fluid cooling loop (e.g., radiator 68 is configured in parallel). Alternatively, radiator 68 may be in a single cooling loop (e.g., radiator 68 is configured in series).

[0033] The radiator 68 may have a generally flat planar shape. For example, the radiator 68 may include a plate having one or more internal fluid passages defined therein. In some examples, the radiator 68 may also include a set of internal fins positioned within (e.g., extending into) the fluid passages.

[0034] The heat sink 68 is disposed on the exterior of the housing 70 (e.g., on one or more panels in the panel) such that the heat sink 68 is in direct contact with the housing 70. For example, the heat sink 68 may be mounted to the exterior of the housing 70 by fasteners such as bolts. In this way, the heat sink 68 is configured to dissipate heat from the capacitor 52.

[0035] As shown, a heat sink 68 can be disposed on a corresponding panel of the housing 70 (e.g., a panel other than the end panel where terminal 62 is located), and a power switch module 54 can be disposed on the corresponding heat sink 68 (e.g., in a stacked configuration). One or more power switch modules 54 can be mounted to the heat sink 68 by fasteners (e.g., bolts) received in orifices (e.g., threaded orifices) in the heat sink 68. For example, a first planar surface of the heat sink 68 can be disposed on the corresponding panel (which also has a planar surface), and the power switch module 54 can be disposed on a second planar surface of the heat sink 68 (opposite to the first planar surface). The planar surfaces of the heat sink 68 provide a large thermal interface area between the heat sink 68 and the capacitor 52 and between the heat sink 68 and the power switch module 54.

[0036] In this manner, each heat sink 68 is configured to dissipate heat from the corresponding power switch modules 54 of a given phase of a plurality of phases of power. For example, as shown, the power electronics module 50 includes three heat sinks 68 (e.g., one for each of the three phases), wherein a first heat sink 68 is disposed on a first panel of the housing 70 and one or more first power switch modules 54 (for the first phase, phase A) are disposed on the first heat sink 68; a second heat sink 68 is disposed on a second panel of the housing 70 and one or more second power switch modules 54 (for the second phase, phase B) are disposed on the second heat sink 68; and a third heat sink 68 is disposed on a third panel of the housing 70 and one or more third power switch modules 54 (for the third phase, phase C) are disposed on the third heat sink 68. Alternatively, the power electronics module 50 may have a two-phase configuration or a four-phase configuration, wherein the two-phase configuration includes two heat sinks 68 and corresponding power switch modules 54 disposed on two panels of the housing 70, and the four-phase configuration includes four heat sinks 68 and corresponding power switch modules 54 disposed on four panels of the housing 70. The heat sink 68 can also dissipate heat from the controller 56 and / or busbar 58, which can conduct heat through the power switch module 54.

[0037] As mentioned above, providing Figure 3-4 As an example. Other examples can be related to... Figure 3-4 The examples described are different.

[0038] Figure 5 This is a perspective view of an exemplary power electronics module 50, and Figure 6 yes Figure 5 Exploded view of the power electronics module 50. Figure 5-6 The power electronics module 50 shown is Figure 3-4Alternatives to the power electronics module 50 shown herein. As shown, the power electronics module 50 includes the capacitor 52, power switch module 54, controller 56, busbar 58, and / or power supply module 60 described herein. Additionally, the power electronics module 50 includes a heat sink 68. The heat sink 68 may be a single heat sink 68, or a single heat sink 68 may be divided into multiple heat sinks 68 that are functionally similar to a single heat sink 68 (e.g., the heat sink 68 may include one or more heat sinks). These components of the power electronics module 50 are assembled together in the illustrated configuration and may be contained within a housing (not shown). The power electronics module 50 may be arranged vertically, horizontally, or in another orientation within the housing (e.g., an enclosure), and interface connections (e.g., electrical connections, mechanical connections, and / or cooling connections) may be configured to adapt to the orientation of the power electronics module 50 (e.g., different configurations of interface connections may be used for different orientations). Figure 5-6 In the configuration of the power electronics module shown, busbar 58 may include an integral busbar.

[0039] The capacitor 52 may have a housing 70 defined by a plurality of panels, and the terminals 62 of the capacitor 52 may be accessible at the end panels of the housing 70, as described herein. In some embodiments, the power electronics module 50 may include an additional busbar 74 (e.g., a laminated busbar) that electrically connects the terminals 62 to the busbar 58.

[0040] As described herein, heat sink 68 is disposed on the exterior of housing 70. As shown, heat sink 68 may be disposed on a single panel of housing 70 (e.g., a panel other than the end panel where terminal 62 is located), and power switch module 54 may be disposed on a single heat sink 68 (e.g., in a stacked configuration). For example, a first planar surface of heat sink 68 may be disposed on a single panel (which also has a planar surface), and power switch module 54 may be disposed on a second planar surface of heat sink 68 (opposite to the first planar surface).

[0041] In this manner, the heat sink 68 is configured to dissipate heat from the power switching modules 54 used for multiple phases of power. For example, as shown, the power electronics module 50 includes a single heat sink 68 (e.g., covering three phases) disposed on a panel of the housing 70, wherein one or more first power switching modules 54 (for the first phase, phase A) are disposed on the single heat sink 68, one or more second power switching modules 54 (for the second phase, phase B) are disposed on the single heat sink 68, and one or more third power switching modules 54 (for the third phase, phase C) are disposed on the single heat sink 68. Alternatively, the power electronics module 50 may have a two-phase configuration or a four-phase configuration, wherein the two-phase configuration includes power switching modules 54 for two phases disposed on the heat sink 68, and the four-phase configuration includes power switching modules 54 for four phases disposed on the heat sink 68.

[0042] As shown, the power electronics module 50 can be mounted in the frame 76. The frame can define one or more module accommodating portions 78. For example, the power electronics module 50 can be mounted in a first module accommodating portion 78a of the frame 76. In some embodiments, an additional power electronics module 50 (not shown) can be mounted in a second module accommodating portion 78b of the frame 76. The additional power electronics module 50 can be electrically connected to the power electronics module 50 to increase power.

[0043] As mentioned above, providing Figure 5-6 As an example. Other examples can be related to... Figure 5-6 The examples described are different.

[0044] Figure 7 This is a perspective view of an exemplary heat sink 68. As described herein, a power switch module 54 may be disposed on the heat sink 68. As shown, the heat sink 68 has a fluid inlet 80, a fluid outlet 82, and a fluid passage 84 between the fluid inlet 80 and the fluid outlet 82. The fluid passage 84 may be configured in a path passing through each of the power switch modules 54. For example, the path may be connected in parallel (as shown) or in series (e.g., a serpentine path) through the power switch modules 54. The fluid inlet 80, the fluid outlet 82, and the fluid passage 84 may be part of a fluid cooling circuit. For example, a cooling fluid (e.g., water or liquid coolant) may be supplied at the fluid inlet 80, may circulate through the fluid passage 84 (where the fluid absorbs heat), and may exit through the fluid outlet 82. The fluid cooling circuit may include a cooling fluid supply (e.g., a fluid pump) for supplying cooling fluid (e.g., fresh cooling fluid or cooled, previously heated fluid) to the heat sink 68.

[0045] As mentioned above, providing Figure 7 As an example. Other examples can be related to... Figure 7The examples described are different.

[0046] Industrial applicability

[0047] The power electronics module 50 described herein can be used with any machine or system to provide control and / or conversion of electricity. For example, the power electronics module 50 can be used in diesel-electric machines, battery-electric machines, or renewable energy systems, etc. Without efficient thermal management, the heat generated in the power electronics module 50 may damage the capacitor 52, the power switching module 54, and / or the controller 56. For example, excessive heat can reduce the capacitance and / or power density of the capacitor 52. Therefore, the performance of the power electronics module 50 may be impaired due to excessive heat.

[0048] The power electronics module 50 described herein has improved thermal management capabilities. Specifically, the arrangement of multiple heat sinks 68 between the housing 70 of the capacitor 52 and the power switch module 54 provides heat dissipation for both the capacitor 52 and the power switch module 54, while also efficiently minimizing heat transfer from the power switch module 54 to the capacitor 52. Therefore, the multiple heat sinks 68 prevent damage to the capacitor 52 and the power switch module 54, and improve the capacitance and / or power density of the capacitor 52. Furthermore, the planar surfaces of the multiple heat sinks 68 provide a large thermal interface area between the multiple heat sinks 68, the capacitor 52, and the power switch module 54, promoting efficient heat dissipation from the power electronics module 50. Moreover, the stacked configuration of the multiple heat sinks 68 with multiple electrically associated components provides balanced and efficient heat dissipation for the multiphase power electronics module 50. In this way, the power electronics module 50 has improved performance, thereby improving the performance of the machine or system including the power electronics module 50.

Claims

1. A power electronics module (50) configured to control the power in multiple phases, comprising: A capacitor (52) having a housing (70) having a plurality of panels defining a box-shaped outer shell; One or more radiators (68) are disposed on the outside of the housing (70). The one or more heat sinks (68) have a first planar surface disposed on one or more panels in the panel and a second planar surface opposite to the first planar surface; as well as Multiple power switch modules (54) are electrically connected to the capacitor (52) and disposed on the second planar surface of the one or more heat sinks (68). The plurality of power switch modules (54) are configured to control the power flow in the respective phases of the plurality of phases.

2. The power electronics module (50) according to claim 1, wherein the one or more heat sinks (68) comprise a plurality of heat sinks (68) disposed on respective panels of the plurality of panels, and The plurality of power switch modules (54) are disposed on the respective heat sinks (68) of the plurality of heat sinks (68).

3. The power electronic module (50) according to claim 2, wherein the first heat sink (68) of the plurality of heat sinks (68) is disposed on the first panel of the plurality of panels, and the first power switch module (54) of the plurality of power switch modules (54) is disposed on the first heat sink (68). The second heat sink (68) of the plurality of heat sinks (68) is disposed on the second panel of the plurality of panels, and the second power switch module (54) of the plurality of power switch modules (54) is disposed on the second heat sink (68). The third heat sink (68) of the plurality of heat sinks (68) is disposed on the third panel of the plurality of panels, and the third power switch module (54) of the plurality of power switch modules (54) is disposed on the third heat sink (68).

4. The power electronics module (50) according to claim 1, wherein the one or more heat sinks (68) are disposed on a single panel of the plurality of panels. The one or more heat sinks (68) mentioned above include a single heat sink (68), and The first power switch module (54), the second power switch module (54) and the third power switch module (54) of the plurality of power switch modules (54) are disposed on the single heat sink (68).

5. The power electronic module (50) according to any one of claims 1-4, further comprising: Multiple controllers (56) are configured to control a corresponding power switch module (54) among the multiple power switch modules (54). The plurality of controllers (56) are disposed on the respective power switch modules (54).

6. The power electronic module (50) according to any one of claims 1-5, wherein the power electronic module (50) is configured as an AC inverter or a DC converter.

7. A machine (10), comprising: Power supply (16), which is configured to output power; as well as A power electronics module (50), electrically coupled to the power source (16) and configured to control power in a plurality of phases, including: A capacitor (52) having a housing (70) having a plurality of panels defining an outer shell; One or more radiators (68) are disposed on the outside of the housing (70); Multiple power switch modules (54) are disposed on one or more heat sinks (68) and configured to control the power flow in a corresponding phase of the multiple phases; Multiple controllers (56), the multiple controllers being configured to control respective power switch modules (54) among the multiple power switch modules (54); and Multiple busbars (58) electrically connect the respective power switch modules (54) to the capacitors (52).

8. The machine (10) according to claim 7, wherein the plurality of phases comprises three phases.

9. The machine (10) according to any one of claims 7-8, wherein the one or more radiators (68) comprise a plurality of radiators (68) disposed on respective panels of the plurality of panels. The plurality of power switch modules (54) are disposed on the respective heat sinks (68) of the plurality of heat sinks (68), and The plurality of radiators (68) are located in corresponding fluid cooling circuits.

10. The machine (10) according to any one of claims 7-9, wherein one or more of the radiators (68) has a fluid inlet (80), a fluid outlet (82) and a fluid passage (84) between the fluid inlet (80) and the fluid outlet (82).

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