Conveying system

Abstract

The present invention provides a technology capable of inhibiting contamination of a substrate. The present invention provides a transfer system including a load port, a component storage, a first transfer unit, a second transfer unit disposed above or below the first transfer unit, and an atmospheric transfer module. The first transfer unit includes a first load lock module and a first vacuum transfer module. The second transfer unit includes a second load lock module and a second vacuum transfer module. The atmospheric transfer module is capable of transferring a substrate between a container placed on the load port and the first load lock module, and is capable of transferring a consumable component between the component storage and the second load lock module.

Description

Technical Field

[0001] The exemplary embodiments of the present invention relate to a conveying system. Background Technology

[0002] Patent documents 1 and 2 disclose techniques for replacing consumable components within processing modules used in the manufacture of semiconductor wafers.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-85072

[0006] Patent Document 2: Japanese Patent Application Publication No. 2018-10992 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] This invention provides a technique for suppressing substrate contamination.

[0009] Means for solving technical problems

[0010] In one exemplary embodiment of the invention, a delivery system is provided, comprising: a loading port; a component storage unit capable of storing consumable components used in at least one substrate processing module; a first delivery unit including at least one first loading locking module and a first vacuum delivery module, the first vacuum delivery module being capable of delivering a substrate between at least one substrate processing module and at least one first loading locking module; a second delivery unit disposed above or below the first delivery unit, the second delivery unit including at least one second loading locking module and a second vacuum delivery module, the second vacuum delivery module being capable of delivering consumable components between at least one substrate processing module and at least one second loading locking module; and an atmospheric delivery module capable of delivering a substrate between a container placed on the loading port and at least one first loading locking module, and capable of delivering consumable components between the component storage unit and at least one second loading locking module.

[0011] Invention Effects

[0012] According to an exemplary embodiment of the present invention, a technique capable of suppressing substrate contamination can be provided. Attached Figure Description

[0013] Figure 1 This is a diagram used to illustrate the structure of a substrate processing system (PS).

[0014] Figure 2This is a diagram used to illustrate the structure of a substrate processing system (PS).

[0015] Figure 3 This is a diagram used to illustrate the structure of a substrate processing system (PS).

[0016] Figure 4 This is a diagram used to illustrate a structural example of a plasma processing system.

[0017] Figure 5 This is a diagram used to illustrate a structural example of a capacitively coupled plasma processing device.

[0018] Figure 6 This is a diagram illustrating an example of the transport path for a substrate processing system (PS).

[0019] Figure 7 This is a diagram illustrating another example of the transport path for a substrate processing system (PS).

[0020] Figure 8 This is a diagram used to illustrate a variation of the PS substrate processing system.

[0021] Figure 9 This is a diagram used to illustrate a variation of the PS substrate processing system. Detailed Implementation

[0022] The various embodiments of the present invention will now be described in detail.

[0023] In one exemplary embodiment, a delivery system is provided, comprising: a loading port; a component storage unit capable of storing consumable components used in at least one substrate processing module; a first delivery unit including at least one first loading locking module and a first vacuum delivery module, the first vacuum delivery module being capable of delivering a substrate between at least one substrate processing module and at least one first loading locking module; a second delivery unit disposed above or below the first delivery unit, the second delivery unit including at least one second loading locking module and a second vacuum delivery module, the second vacuum delivery module being capable of delivering consumable components between at least one substrate processing module and at least one second loading locking module; and an atmospheric delivery module capable of delivering a substrate between a container placed on the loading port and at least one first loading locking module, and capable of delivering consumable components between the component storage unit and at least one second loading locking module.

[0024] In one exemplary embodiment, the second conveying unit is disposed below the first conveying unit.

[0025] In one exemplary embodiment, the atmospheric delivery module includes: a first opening connected to a first loading locking module via a gate valve; a second opening connected to a second loading locking module via a gate valve; a third opening connected to a loading port via a door valve; and a fourth opening disposed below the first, second, and third openings and connected to a component storage unit via a door valve.

[0026] In one exemplary embodiment, a delivery system is provided, comprising: a loading port; a component storage unit capable of storing consumable components used in at least one substrate processing module; a first delivery unit including at least one first loading locking module and a first vacuum delivery module, the first vacuum delivery module being capable of delivering a substrate between at least one substrate processing module and at least one first loading locking module; a second delivery unit disposed above or below the first delivery unit, the second delivery unit including at least one second loading locking module, a second vacuum delivery module, and a third vacuum delivery module, the second vacuum delivery module being capable of delivering consumable components from at least one second loading locking module to at least one substrate processing module, the third vacuum delivery module being disposed above or below the second vacuum delivery module and being capable of delivering consumable components from at least one substrate processing module to at least one second loading locking module; and an atmospheric delivery module capable of delivering a substrate between a container placed on the loading port and at least one first loading locking module, and capable of delivering consumable components between the component storage unit and at least one second loading locking module.

[0027] In one exemplary embodiment, the second conveying unit is disposed below the first conveying unit.

[0028] In one exemplary embodiment, the third vacuum delivery module is disposed below the second vacuum delivery module.

[0029] In one exemplary embodiment, the second vacuum delivery module includes: a first opening connected to a first loading locking module via a gate valve; a second opening connected to a second loading locking module via a gate valve; a third opening connected to a loading port via a door valve; and a fourth opening disposed below the first, second, and third openings and connected to a component storage unit via a door valve.

[0030] In one exemplary embodiment, the second loading locking module connected to the second vacuum delivery module is different from the second loading locking module connected to the third vacuum delivery module.

[0031] In one exemplary embodiment, a delivery system is provided, comprising: a loading port; a component storage unit capable of storing consumable components used in at least one substrate processing module; a first delivery unit including at least one first loading locking module and a first vacuum delivery module, the first vacuum delivery module being capable of delivering a substrate between at least one substrate processing module and at least one first loading locking module, and capable of delivering consumable components from at least one first loading locking module to at least one substrate processing module; a second delivery unit disposed above or below the first delivery unit, the second delivery unit including at least one second loading locking module and a second vacuum delivery module, the second vacuum delivery module being capable of delivering consumable components from at least one substrate processing module to at least one second loading locking module; and an atmospheric delivery module capable of delivering a substrate between a container placed on the loading port and at least one first loading locking module, and capable of delivering consumable components between the component storage unit and at least one second loading locking module.

[0032] In one exemplary embodiment, the second conveying unit is disposed below the first conveying unit.

[0033] In one exemplary embodiment, the atmospheric delivery module includes: a first opening connected to a first loading locking module via a gate valve; a second opening connected to a second loading locking module via a gate valve; a third opening connected to a loading port via a door valve; and a fourth opening disposed below the first, second, and third openings and connected to a component storage unit via a door valve.

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the same reference numerals are used to denote the same elements or identical elements in each drawing, and repeated descriptions are omitted. Unless otherwise specified, positional relationships such as up, down, left, and right are described based on the positional relationships shown in the drawings. The scale of the drawings does not represent an actual scale, and the actual scale is not limited to the scale shown.

[0035] <Example of a substrate processing system structure>

[0036] Figures 1 to 3 This is a diagram illustrating a structural example of a substrate processing system PS according to one embodiment. Figure 1 This is a diagram that roughly represents the longitudinal section of the substrate processing system PS. Figure 2 It is a general representation Figure 1 A diagram of section AA. Figure 3 It is a general representation Figure 1 A diagram of the BB section.

[0037] like Figures 1 to 3As shown, the substrate processing system PS includes: loading ports LP1 to LP5 (hereinafter collectively referred to as "loading ports LP"), atmospheric delivery module LM, aligner AN, parts stocker SR, first delivery unit TU1, second delivery unit TU2, and processing modules PM1 to PM6 (hereinafter collectively referred to as "processing modules PM"), etc.

[0038] The substrate processing system PS comprises two layers of transport units: a first transport unit TU1 and a second transport unit TU2. The first transport unit TU1 includes two first loading locking modules LL11 and LL12 (hereinafter collectively referred to as "first loading locking modules LL1") and a first vacuum transport module TM1. The second transport unit TU2 includes two second loading locking modules LL21 and LL22 (hereinafter collectively referred to as "second loading locking modules LL2") and a second vacuum transport module TM2. The second transport unit TU2 is positioned below the first transport unit TU1 (see reference). Figure 1 ).

[0039] The atmospheric delivery module LM is cuboid in shape and includes an FFU (Fan Filter Unit), which is an atmospheric delivery chamber maintained at atmospheric pressure. One of the two opposite sides of the atmospheric delivery module LM has a first opening and a second opening, which are connected to the first loading locking module LL1 and the second loading locking module LL2 via gate valves G11 and G12, respectively, which can be opened and closed.

[0040] The atmospheric transport module LM has a third opening on one of its two opposite sides, which is connected to loading ports LP1 to LP5 (hereinafter collectively referred to as "loading ports LP") via an openable and closable valve D1. A container C capable of holding multiple (e.g., 25) substrates can be placed at the loading port LP. Container C can be, for example, a FOUP (Front-Opening UnifiedPod). The substrates can be, for example, semiconductor substrates or sensor fixture substrates. Container C can be transported by a container transport mechanism such as an OHT (Overhead Hoist Transport) and placed on the loading port LP.

[0041] Each side of the atmospheric transport module LM has a fourth opening, which is connected to the component storage unit SR via an openable and closable gate valve D2. It can be as follows: Figure 1 As shown, the gate valve D2 (fourth opening) is located below the gate valve G11 (first opening), the gate valve G12 (second opening), and the gate valve D1 (third opening).

[0042] The component storage unit SR is capable of storing consumable parts used in the processing module PM. The component storage unit SR may include: a first area for holding new consumable parts (also referred to as "unused consumable parts" or "consumable parts before use"); a second area for holding used consumable parts (also referred to as "consumable parts after use"); and a partition wall for separating the first area from the second area. Consumable parts may be components that are replaceably installed within the processing module PM. Consumable parts may be components that are consumed by various processes performed within the processing module PM, such as plasma processing. Consumable parts may, for example, constitute the plasma processing apparatus 1 described later (see reference...). Figure 5 The components of the ring assembly 112 and the spray head 13.

[0043] An atmospheric transport robot (TR) capable of transporting objects is installed within the atmospheric transport module (LM). The objects to be transported can be substrates or consumable components. The atmospheric transport robot (TR) is configured to move along the long side of the atmospheric transport module (LM). Figures 1-3 The atmospheric transport robot TR moves in the x-direction and is configured to rotate, extend, and lift. It can transport objects based on motion instructions output by the control unit CU (described later). For example, the atmospheric transport robot TR can hold the object being transported using an end effector located at its front end and transport the object between the loading port LP, the first loading locking module LL1, the second loading locking module LL2, the aligner AN, and the component storage unit SR. Multiple atmospheric transport robots TR can be provided. Alternatively, the end effector may be referred to as a fork or pick.

[0044] The aligner AN can adjust the position of the transported object. The aligner AN can be, for example... Figure 3 As shown, it is connected to one side of the atmospheric transport module LM along the short side direction (y direction). The aligner AN can also be connected to the side of the atmospheric transport module LM along the long side direction (x direction), or it can be disposed inside the atmospheric transport module LM. The aligner AN may include: a rotatable support platform for mounting the transported object; and an optical sensor. The aligner AN can, for example, use the optical sensor to detect the position of the transported object (e.g., its outer perimeter) and output it to the control unit CU described later. The control unit CU can control the position of the end effector of the atmospheric transport robot TR or the position of the transported object on the support platform when receiving the transported object from the aligner AN, based on the input position of the transported object.

[0045] The first loading and locking module LL1 (LL11, LL12) is disposed between the atmospheric delivery module LM and the first vacuum delivery module TM1. The first loading and locking module LL1 has openings on two opposite sides. One opening is connected to the atmospheric delivery module LM via the aforementioned openable and closable gate valve G11. The other opening is connected to the first vacuum delivery module TM1 via the openable and closable gate valve G12.

[0046] The first loading and locking module LL1 has an internal pressure variable chamber capable of switching its internal pressure to vacuum or atmospheric pressure. The first loading and locking module LL1 also has a stage configured inside. The first loading and locking module LL1 can maintain its internal pressure at atmospheric pressure to receive the transport object from the atmospheric transport module LM, and depressurize its internal pressure to deliver the transport object into the first vacuum transport module TM1. Furthermore, the first loading and locking module LL1 can maintain its internal pressure at vacuum to receive the transport object from the first vacuum transport module TM1, and pressurize its internal pressure to atmospheric pressure to deliver the transport object into the atmospheric transport module LM.

[0047] The second loading and locking module LL2 (LL21, LL22) is disposed between the atmospheric delivery module LM and the second vacuum delivery module TM2. The second loading and locking module LL2 has openings on two opposite sides. One opening is connected to the atmospheric delivery module LM via the aforementioned openable and closable gate valve G21. The other opening is connected to the second vacuum delivery module TM2 via the openable and closable gate valve G22.

[0048] The second loading and locking module LL2 has an internal pressure variable chamber capable of switching its internal pressure to vacuum or atmospheric pressure. The second loading and locking module LL2 also has a worktable configured inside. The second loading and locking module LL2 can maintain its internal pressure at atmospheric pressure to receive the transported object from the atmospheric transport module LM, and depressurize its internal pressure to deliver the transported object into the second vacuum transport module TM2. Furthermore, the second loading and locking module LL2 can maintain its internal pressure at vacuum to receive the transported object from the second vacuum transport module TM2, and pressurize its internal pressure to atmospheric pressure to deliver the transported object into the atmospheric transport module LM.

[0049] like Figure 2As shown, the first vacuum transport module TM1 has a roughly quadrilateral shape when viewed from above. The first vacuum transport module TM1 is connected to the first loading and locking modules LL11 and LL12 via the aforementioned openable and closable gate valve G12. Furthermore, the first vacuum transport module TM1 has openings on two opposite sides, which are connected to processing modules PM1 to PM6 via openable and closable gate valves G13. The first vacuum transport module TM1 has a vacuum chamber with a vacuum atmosphere. A first vacuum transport robot VR1 is disposed inside the first vacuum transport module TM1. Multiple first vacuum transport robots VR1 can be provided.

[0050] The first vacuum transport robot VR1 is configured to rotate, extend, and lift. The first vacuum transport robot VR1 can transport objects based on motion instructions output by the control unit CU (described later). For example, the first vacuum transport robot VR1 can hold the object to be transported using an end effector located at its front end and transport the object between the first loading and locking module LL1 and the processing module PM.

[0051] like Figure 3 As shown, the second vacuum transport module TM2 has a roughly quadrilateral shape when viewed from above. The second vacuum transport module TM2 is connected to the second loading and locking modules LL21 and LL22 via the aforementioned openable and closable gate valve G22. Furthermore, the second vacuum transport module TM2 has openings on two opposite sides, which are connected to processing modules PM1 to PM6 via openable and closable gate valves G23. The second vacuum transport module TM2 has a vacuum chamber with a vacuum atmosphere. The second vacuum transport robot VR2 is disposed inside the second vacuum transport module TM2.

[0052] The second vacuum transport robot VR2 is configured to rotate, extend, and lift. The second vacuum transport robot VR2 can transport objects based on motion instructions output by the control unit CU (described later). For example, the second vacuum transport robot VR2 can hold the object to be transported using an end effector located at its front end and transport the object between the second loading and locking module LL2 and the processing module PM.

[0053] Processing modules PM1 through PM6 each have a processing chamber and an internal worktable (stage). At least one of processing modules PM1 through PM6 can be a plasma processing system described later (see reference). Figure 4 , Figure 5 For example, at least one of the processing modules PM1 to PM6 can depressurize the internal pressure and introduce processing gas after the substrate is placed on the worktable, apply RF electrical power to generate plasma, and use the plasma to perform plasma processing on the substrate.

[0054] The substrate processing system (PS) can be connected to the control unit (CU) via a communication interface. In one embodiment, the control unit (CU) may be part or all of the control unit (CU) included in the substrate processing system (PS). The control unit (CU) may be, for example, a computer. The control unit (CU) includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), auxiliary storage devices, etc. The CPU can operate based on programs stored in the ROM or auxiliary storage devices to control various parts of the substrate processing system (PS).

[0055] <Structural Example of a Plasma Processing System>

[0056] Reference Figure 4 An example of a plasma processing system that can be used as a processing module (PM) will be described. Figure 4 This is a diagram used to illustrate an example of the structure of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing device 1 and a control unit 2.

[0057] In one embodiment, the plasma processing apparatus 1 includes a plasma processing chamber 10, a substrate support 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. Furthermore, the plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space; and at least one gas outlet for discharging gas from the plasma processing space. The gas supply port is connected to the gas supply unit 20 (described later), and the gas outlet is connected to the exhaust system 40 (described later). The substrate support 11 is disposed within the plasma processing space and has a substrate support surface for supporting a substrate.

[0058] The plasma generation unit 12 is capable of generating plasma from at least one processing gas supplied to the plasma processing space. The plasma formed within the plasma processing space can be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), electron-cyclotron-resonance plasma (ECR), helicon wave plasma (HWP), or surface wave plasma (SWP), etc. Furthermore, various types of plasma generation units, including AC (Alternating Current) plasma generation units and DC (Direct Current) plasma generation units, can also be used. In one embodiment, the AC signal (AC power) used in the AC plasma generation unit has a frequency in the range of 100 kHz to 10 GHz. Therefore, the AC signal includes RF (Radio Frequency) signals and microwave signals. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0059] The control unit 2 is capable of processing computer-executable commands for causing the plasma processing apparatus 1 to perform the various processes described herein. The control unit 2 may be configured to control various elements of the plasma processing apparatus 1 to perform the various processes described herein. In one embodiment, the control unit 2 may be part or entirely included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is implemented, for example, by a computer 2a. The processing unit 2a1 may be configured to read a program from the storage unit 2a2 and perform various control actions by executing the read program. The program may be pre-stored in the storage unit 2a2 or retrieved via a medium when needed. The retrieved program is stored in the storage unit 2a2 and read and executed by the processing unit 2a1. The medium may be various storage media readable by the computer 2a or a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). Storage unit 2a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. Communication interface 2a3 can communicate with plasma processing device 1 via a communication line such as LAN (Local Area Network). Furthermore, the control unit CU of substrate processing system PS may also perform some or all of the functions of control unit 2. Additionally, control unit 2 may also perform some of the functions of control unit CU of substrate processing system PS.

[0060] Reference Figure 5 Here, a structural example of a capacitively coupled plasma processing device, which is an example of plasma processing device 1, will be described. Figure 5 This is a diagram used to illustrate a structural example of a capacitively coupled plasma processing device.

[0061] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. Furthermore, the plasma processing apparatus 1 includes a substrate support 11 and a gas inlet. The gas inlet is capable of introducing at least one processing gas into the plasma processing chamber 10. The gas inlet includes a spray head 13. The substrate support 11 is disposed within the plasma processing chamber 10. The spray head 13 is disposed above the substrate support 11. In one embodiment, the spray head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the spray head 13, the sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 is grounded. The spray head 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0062] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region 111a for supporting a substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 when viewed from above. The substrate W is disposed on the central region 111a of the main body portion 111, and the ring assembly 112 is disposed on the annular region 111b of the main body portion 111 in such a way that it surrounds the substrate W on the central region 111a of the main body portion 111. Therefore, the central region 111a is also referred to as a substrate support surface for supporting the substrate W, and the annular region 111b is also referred to as an annular support surface for supporting the ring assembly 112.

[0063] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive component. The conductive component of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic component 1111a and an electrostatic electrode 1111b disposed within the ceramic component 1111a. The ceramic component 1111a has a central region 111a. In one embodiment, the ceramic component 1111a also has an annular region 111b. Alternatively, other components surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating component, may have an annular region 111b. In this case, the ring assembly 112 may be disposed on the annular electrostatic chuck or the annular insulating component, or it may be disposed on both the electrostatic chuck 1111 and the annular insulating component. Furthermore, at least one RF / DC electrode coupled to the RF power supply 31 and / or DC power supply 32 (described later) can be disposed within the ceramic component 1111a. In this case, the at least one RF / DC electrode can function as a lower electrode. The RF / DC electrode is also referred to as a bias electrode when the bias RF signal and / or DC signal (described later) are supplied to the at least one RF / DC electrode. Alternatively, the conductive component of the base 1110 and the at least one RF / DC electrode can function as multiple lower electrodes. Furthermore, the electrostatic electrode 1111b can also function as a lower electrode. Therefore, the substrate support portion 11 includes at least one lower electrode.

[0064] The ring assembly 112 includes one or more annular components. In one embodiment, the one or more annular components include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0065] Furthermore, the substrate support 11 may include a temperature control module capable of adjusting at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas may flow in the flow path 1110a. In one embodiment, the flow path 1110a is formed within the base 1110, and one or more heaters are disposed within the ceramic component 1111a of the electrostatic chuck 1111. Additionally, the substrate support 11 may include a heat transfer gas supply section capable of supplying heat transfer gas to the gap between the back surface of the substrate W and the central region 111a.

[0066] The spray head 13 is capable of introducing at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The spray head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas inlets 13c. The process gas supplied to the gas supply port 13a can be introduced into the plasma processing space 10s through the gas diffusion chamber 13b and the plurality of gas inlets 13c. In addition, the spray head 13 includes at least one upper electrode. Furthermore, the gas inlet unit may include, in addition to the spray head 13, one or more side gas injectors (SGIs) installed in one or more openings formed on the sidewall 10a.

[0067] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is capable of supplying at least one type of process gas from its respective gas source 21 to the spray head 13 via its respective flow controller 22. Each flow controller 22 may, for example, include a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may include at least one flow modulation device for modulating or pulsed the flow rate of the at least one type of process gas.

[0068] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is capable of supplying at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This allows plasma to be formed from at least one processing gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least a part of the plasma generation unit 12. Furthermore, by supplying a bias RF signal to at least one lower electrode, a bias potential can be generated on the substrate W, attracting the ionic components of the formed plasma to the substrate W.

[0069] In one embodiment, the RF power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit, and is capable of generating a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10MHz to 150MHz. In one embodiment, the first RF generation unit 31a may be capable of generating multiple source RF signals with different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0070] The second RF generation unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit and is capable of generating a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 31b may be capable of generating multiple bias RF signals with different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. Furthermore, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0071] Furthermore, the power supply 30 may include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generating unit 32a and a second DC generating unit 32b. In one embodiment, the first DC generating unit 32a is connected to at least one lower electrode and is capable of generating a first DC signal. The generated first DC signal is applied to at least one lower electrode. In one embodiment, the second DC generating unit 32b is connected to at least one upper electrode and is capable of generating a second DC signal. The generated second DC signal is applied to at least one upper electrode.

[0072] In various embodiments, the first DC signal and the second DC signal can be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses can have a pulse waveform with a rectangular, trapezoidal, triangular, or combination thereof shape. In one embodiment, a waveform generation unit for generating a sequence of voltage pulses from the DC signal is connected between the first DC generation unit 32a and at least one lower electrode. Therefore, the first DC generation unit 32a and the waveform generation unit constitute a voltage pulse generation unit. When the second DC generation unit 32b and the waveform generation unit constitute a voltage pulse generation unit, the voltage pulse generation unit is connected to at least one upper electrode. The voltage pulses can have positive or negative polarity. Furthermore, the sequence of voltage pulses can include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. Additionally, the first generation unit 32a and the second DC generation unit 32b can be provided in addition to the RF power supply 31, or the first DC generation unit 32a can be provided instead of the second RF generation unit 31b.

[0073] The exhaust system 40 can be connected, for example, to a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure within the plasma processing space 10s can be regulated using the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0074] <An example of the transport path for substrate and consumable components>

[0075] Figure 6 This diagram illustrates an example of the transport path for the substrate and consumable components in a substrate processing system (PS). In this example, the substrate is transported via a first transport unit (TU1). Furthermore, the consumable components are transported via a second transport unit (TU2). An example of substrate input before processing, substrate output after processing, consumable component input before use, and consumable component output after use will be described below. The transport of the substrate and consumable components can be performed by controlling each part of the substrate processing system (PS) via a control unit (CU).

[0076] (Input of the substrate before processing)

[0077] like Figure 6 As shown, the substrate before processing is fed from the loading port LP into the processing module PM via the atmospheric transport module LM, the first loading locking module LL1, and the first vacuum transport module TM1.

[0078] For example, firstly, a container C, such as a FOUP, containing multiple substrates W, is transported by a conveying mechanism such as an OHT and placed at any loading port LP. Next, the gate valve D1 of the loading port LP is opened, and an atmospheric transport robot TR delivers the substrates W from container C into an atmospheric transport module LM. The position of the substrates W on the end effector of the atmospheric transport robot TR can be corrected using an alignment device AN. Next, the gate valve G11 of any first loading locking module LL1 is opened, and the atmospheric transport robot TR delivers the substrates W into that first loading locking module LL1. Next, the gate valve G11 is closed, switching the pressure within the first loading locking module LL1 from atmospheric pressure to a predetermined vacuum level. Next, the gate valve G12 is opened, and a first vacuum transport robot VR1 delivers the substrates W into a first vacuum transport module TM1. Next, the gate valve G13 of any processing module PM is opened, and the first vacuum transport robot VR1 delivers the substrates W into that processing module PM. Then, the processing module PM performs the processing on the substrate W.

[0079] (Sending out the processed substrate)

[0080] like Figure 6As shown, the substrate processed in the processing module PM is sent from the processing module PM to the loading port LP via the first vacuum transport module TM1, the first loading locking module LL1, and the atmospheric transport module LM.

[0081] For example, first, the gate valve G13 of the processing module PM, which has processed the substrate W, is opened. Next, the first vacuum transport robot VR1 delivers the substrate W into the first vacuum transport module TM1. Then, the gate valve G12 is opened, and the first vacuum transport robot VR1 delivers the substrate W into any of the first loading locking modules LL1. Next, the gate valve G12 is closed, switching the pressure in the first loading locking module LL1 from a predetermined vacuum level to atmospheric pressure. Next, the gate valve G11 is opened, and the atmospheric transport robot TR delivers the substrate W into the atmospheric transport module LM. Finally, the gate valve D1 of any loading port LP is opened, and the atmospheric transport robot TR delivers the substrate W into the container C on that loading port LP.

[0082] (Installation of consumable parts before use)

[0083] like Figure 6 As shown, consumable components before use are sent from the component storage SR to the processing module PM via the atmospheric transport module LM, the second loading locking module LL2, and the second vacuum transport module TM2.

[0084] For example, firstly, the consumable component P, before use, is transported from its storage location (first area) in the component storage unit SR to before the gate valve D2. Next, gate valve D2 is opened, and the atmospheric transport robot TR delivers the consumable component P into the atmospheric transport module LM. The position of the consumable component P on the end effector of the atmospheric transport robot TR can be corrected using the alignment device AN. Next, the gate valve G21 of any second loading and locking module LL2 is opened, and the atmospheric transport robot TR delivers the consumable component P into that second loading and locking module LL2. Next, gate valve G21 is closed, switching the pressure within the second loading and locking module LL2 from atmospheric pressure to a specified vacuum pressure. Next, gate valve G22 is opened, and the second vacuum transport robot VR2 delivers the consumable component P into the second vacuum transport module TM2. Next, the gate valve G23 of any processing module PM is opened, and the second vacuum transport robot VR2 delivers the consumable component P into that processing module PM. Finally, the consumable component P is installed in the specified position within the processing module PM.

[0085] (Return of consumable parts after use)

[0086] like Figure 6As shown, the consumable parts used in the processing module PM are sent from the processing module PM to the part storage unit SR via the second vacuum delivery module TM2, the second loading locking module LL2, and the atmospheric delivery module LM.

[0087] For example, first, the gate valve G23 of the processing module PM containing the consumable component P to be sent out is opened. Next, the second vacuum transport robot VR2 sends the consumable component P into the second vacuum transport module TM2. Then, the gate valve G22 is opened, and the second vacuum transport robot VR2 sends the consumable component P into any of the second loading and locking modules LL2. Next, the gate valve G22 is closed, switching the pressure in the second loading and locking module LL2 from a predetermined vacuum level to atmospheric pressure. Next, the gate valve G21 is opened, and the atmospheric transport robot TR sends the consumable component P into the atmospheric transport module LM. Next, the gate valve D2 of the component storage unit SR is opened, and the atmospheric transport robot TR sends the used consumable component P to the component storage unit SR. The used consumable component P is then transported to its storage location (second area) within the component storage unit SR.

[0088] exist Figure 6 In the example shown, the substrate is transported via the first transport unit TU1, and the consumable parts are transported via the second transport unit TU2. That is, the coexistence of the substrate and the used consumable parts in the vacuum atmosphere of the first transport unit TU1 and the second transport unit TU2 can be avoided. This suppresses the adhesion of particles or the like, scattered from the used consumable parts, to the first transport unit TU1 or the substrate. Furthermore, the transport of the substrate via the first transport unit TU1 and the transport of the consumable parts via the second transport unit TU2 can be performed simultaneously. For example, the substrate can be transported between one processing module PM, while the consumable parts are transported between another processing module PM. This suppresses the decrease in substrate processing productivity during consumable part replacements, etc.

[0089] In addition, Figure 6 In the substrate processing system PS shown, the path for delivering used consumable parts is configured to be as low as possible below the substrate transport path. Specifically, the second transport unit TU2, which delivers used consumable parts, is positioned below the first transport unit TU1, which transports the substrate. Furthermore, the gate valve D2, which communicates with the component storage unit SR within the atmospheric transport module LM, is positioned below the gate valves G11, G12, and gate valve D1. This prevents contamination of the first transport unit TU1 or the substrate from particles or other debris falling from the used consumable parts.

[0090] Figure 7 This is another example diagram illustrating the transport path of the substrate and consumable components in a plasma processing system (PS). Figure 7 In the example shown, the substrate is transported and the consumable parts are fed in before use via the first transport unit TU1, while the consumable parts are fed out after use via the second transport unit TU2. That is, compared with... Figure 6 The difference in the example shown is that the consumable component before use is fed into the processing module PM via the first conveying unit TU1. The feeding of the consumable component before use will be explained below. Regarding the feeding and unloading of the substrate and the unloading of the consumable component after use, the process is similar to... Figure 6 The examples shown are the same, so the explanation is omitted.

[0091] (Installation of consumable parts before use)

[0092] like Figure 7 As shown, consumable components before use are sent from the component storage SR to the processing module PM via the atmospheric transport module LM, the first loading locking module LL1, and the first vacuum transport module TM1.

[0093] For example, firstly, the consumable component P, before use, is transported from its storage location (first area) in the component storage unit SR to before the gate valve D2. Next, gate valve D2 is opened, and the atmospheric transport robot TR delivers the consumable component P into the atmospheric transport module LM. The position of the consumable component P on the end effector of the atmospheric transport robot TR can be corrected using the alignment device AN. Next, the gate valve G11 of any first loading locking module LL1 is opened, and the atmospheric transport robot TR delivers the consumable component P into that first loading locking module LL1. Next, gate valve G11 is closed, switching the pressure within the first loading locking module LL1 from atmospheric pressure to a specified vacuum pressure. Next, gate valve G12 is opened, and the first vacuum transport robot VR1 delivers the consumable component P into the first vacuum transport module TM1. Next, the gate valve G13 of any processing module PM is opened, and the first vacuum transport robot VR1 delivers the consumable component P into that processing module PM. Finally, the consumable component P is installed in the specified position within the processing module PM.

[0094] exist Figure 7In the example shown, the substrate and the consumable parts before use are transported via the first transport unit TU1, and the consumable parts after use are transported via the second transport unit TU2. That is, the coexistence of the substrate and the consumable parts after use in the vacuum atmosphere of the first transport unit TU1 and the second transport unit TU2 can be avoided. This suppresses the adhesion of particles or the like, scattered from the consumable parts after use, to the first transport unit TU1 or the substrate. Furthermore, the transport of the substrate via the first transport unit TU1 and the delivery of the consumable parts via the second transport unit TU2 can be performed simultaneously. For example, the substrate can be transported between one processing module PM, while the consumable parts after use are delivered between another processing module PM. This suppresses the decrease in substrate processing productivity during consumable part replacements, etc.

[0095] In addition, Figure 7 In the substrate processing system PS shown, the path for delivering used consumable parts is configured to be as low as possible below the substrate transport path. Specifically, the second transport unit TU2, which delivers used consumable parts, is positioned below the first transport unit TU1, which transports the substrate. Furthermore, the gate valve D2, which communicates with the component storage unit SR within the atmospheric transport module LM, is positioned below the gate valves G11, G12, and gate valve D1. This prevents contamination of the first transport unit TU1 or the substrate from particles or other debris falling from the used consumable parts.

[0096] <Variation Example>

[0097] Figure 8 This diagram is used to illustrate a variation of the PS (Photo Processing System). For example... Figure 8 As shown, the second vacuum transport module TM2 can consist of two layers. The upper second vacuum transport module TM2A (second vacuum transport module) and the lower second vacuum transport module TM2B (third vacuum transport module) can be connected to the reference... Figures 1-3 The second vacuum delivery module TM2 described herein is similarly constructed.

[0098] For example, the upper second vacuum transport module TM2A is connected to the second loading and locking modules LL21 and LL22 via an openable and closable gate valve G22A. Furthermore, the upper second vacuum transport module TM2A has openings on two opposite sides, which are connected to processing modules PM1 to PM6 via openable and closable gate valves G23A. The upper second vacuum transport module TM2A internally houses the second vacuum transport robot VR2A.

[0099] For example, the lower second vacuum transport module TM2B is connected to the second loading and locking modules LL21 and LL22 via an openable and closable gate valve G22B. Furthermore, the lower second vacuum transport module TM2B has openings on two opposite sides, which are connected to processing modules PM1 to PM6 via openable and closable gate valves G23B. The lower second vacuum transport module TM2B internally houses the second vacuum transport robot VR2B.

[0100] exist Figure 8 In the example shown, with Figure 6 Similarly, in the example shown, the substrate is transported via the first transport unit TU1, and the consumable components are transported via the second transport unit TU2. Thus, it is possible to compare with the reference... Figure 6 Similarly, it suppresses particles and the like from consumable parts after use from adhering to the first conveying unit TU1 or the substrate. Furthermore, it can suppress the decrease in substrate processing productivity during consumable part replacements, etc.

[0101] exist Figure 8 In the example shown, the consumable parts before use are fed in via the second vacuum conveying module TM2A on the upper side of the second conveying unit TU2. Furthermore, the consumable parts after use are discharged via the second vacuum conveying module TM2B on the lower side of the second conveying unit TU2. This prevents particles or the like from flying off the used consumable parts from adhering to the upper second vacuum conveying module TM2A or the used consumable parts. Moreover, the feeding of consumable parts via the upper second vacuum conveying module TM2A and the discharge of consumable parts via the lower second vacuum conveying module TM2B can be performed simultaneously. For example, a replacement consumable part can be fed into a processing module PM while a used consumable part is being discharged from the same processing module PM. This shortens the time required for replacing consumable parts.

[0102] Figure 9 This is a diagram used to illustrate a variation of the PS substrate processing system. Figure 9 The example shown is in Figure 8 In the example shown, the second loading locking modules LL2 (LL21 and LL22) are further configured as a two-layer structure. The upper second loading locking module LL2A and the lower second loading locking module LL2B can be connected to the reference... Figures 1-3 The second loading locking module LL2 described herein is similarly configured.

[0103] For example, the upper second loading locking module LL2A is configured between the atmospheric delivery module LM and the upper second vacuum delivery module TM2A. The upper second loading locking module LL2A has openings on two opposite sides. One opening is connected to the atmospheric delivery module LM via an openable and closable gate valve G21A. The other opening is connected to the upper second vacuum delivery module TM2A via an openable and closable gate valve G22A.

[0104] For example, the lower second loading locking module LL2B is configured between the atmospheric delivery module LM and the lower second vacuum delivery module TM2B. The lower second loading locking module LL2B has openings on two opposite sides. One opening is connected to the atmospheric delivery module LM via an openable and closable gate valve G21B. The other opening is connected to the lower second vacuum delivery module TM2B via an openable and closable gate valve G22B.

[0105] exist Figure 9 In the example shown, with Figure 6 Similarly, in the example shown, the substrate is transported via the first transport unit TU1, and the consumable components are transported via the second transport unit TU2. Thus, it is possible to compare with the reference... Figure 6 Similarly, it suppresses particles and the like from consumable parts after use from adhering to the first conveying unit TU1 or the substrate. Furthermore, it can suppress the decrease in substrate processing productivity during consumable part replacements, etc.

[0106] In addition, Figure 9 In the example shown, within the second conveying unit TU2, the feeding path of the consumable parts before use and the output path of the consumable parts after use are completely separated. This further suppresses contamination of the consumable parts before use by the used consumable parts and further reduces the time required for replacing the consumable parts.

[0107] According to one embodiment, a technique is provided that can suppress substrate contamination.

[0108] The embodiments described above are for illustrative purposes only and are not intended to limit the scope of the invention. Various modifications can be made to the embodiments described above without departing from the scope and spirit of the invention. For example, some of the constituent elements of one embodiment can be added to another embodiment. Additionally, some of the constituent elements of one embodiment can be replaced with corresponding constituent elements in another embodiment.

[0109] Explanation of reference numerals in the attached figures

[0110] AN……Aligner, CU……Control Unit, D1, D2……Gate Valves, G11, G12, G13, G21, G22, G23……Gate Valves, LL11, LL12……First Loading Locking Module, LL21, LL22……Second Loading Locking Module, LP1~LP5……Loading Port, LM……Atmospheric Transport Module, PS……Substrate Processing System, SR……Component Storage, TM1……First Vacuum Transport Module, TM2……Second Vacuum Transport Module, TU1……First Transport Unit, TU2……Second Transport Unit, TR……Atmospheric Transport Robot, VR1……First Vacuum Transport Robot, VR2……Second Vacuum Transport Robot.

Claims

1. A conveying system, characterized in that, include: Load port; A component storage device capable of storing consumable components used in at least one substrate processing module; A first conveying unit, the first conveying unit includes at least one first loading and locking module and a first vacuum conveying module, the first vacuum conveying module being able to convey a substrate between the at least one substrate processing module and the at least one first loading and locking module; A second conveying unit configured above or below the first conveying unit, the second conveying unit including at least one second loading locking module and a second vacuum conveying module, the second vacuum conveying module being capable of conveying consumable components between the at least one substrate processing module and the at least one second loading locking module; and An atmospheric delivery module is capable of delivering substrates between a container placed on the loading port and the at least one first loading locking module, and of delivering consumable components between the component storage and the at least one second loading locking module.

2. The conveying system according to claim 1, characterized in that: The second conveying unit is positioned below the first conveying unit.

3. The conveying system according to claim 2, characterized in that: The atmospheric transport module includes: The first opening is connected to the first loading and locking module via a gate valve; The second opening is connected to the second loading locking module via a gate valve; The third opening is connected to the loading port via a valve; and A fourth opening, located below the first, second, and third openings, is connected to the component storage unit via a valve.

4. A conveying system, characterized in that, include: Load port; A component storage device capable of storing consumable components used in at least one substrate processing module; A first conveying unit, the first conveying unit includes at least one first loading and locking module and a first vacuum conveying module, the first vacuum conveying module being able to convey a substrate between the at least one substrate processing module and the at least one first loading and locking module; A second conveying unit is configured above or below the first conveying unit. The second conveying unit includes at least one second loading locking module, a second vacuum conveying module, and a third vacuum conveying module. The second vacuum conveying module is capable of conveying consumable components from the at least one second loading locking module to the at least one substrate processing module. The third vacuum conveying module is configured above or below the second vacuum conveying module and is capable of conveying consumable components from the at least one substrate processing module to the at least one second loading locking module. and An atmospheric delivery module is capable of delivering substrates between a container placed on the loading port and the at least one first loading locking module, and of delivering consumable components between the component storage and the at least one second loading locking module.

5. The conveying system according to claim 4, characterized in that: The second conveying unit is positioned below the first conveying unit.

6. The conveying system according to claim 5, characterized in that: The third vacuum delivery module is positioned below the second vacuum delivery module.

7. The conveying system according to any one of claims 4 to 6, characterized in that: The second vacuum delivery module includes: The first opening is connected to the first loading and locking module via a gate valve; The second opening is connected to the second loading locking module via a gate valve; The third opening is connected to the loading port via a valve; and A fourth opening, located below the first, second, and third openings, is connected to the component storage unit via a valve.

8. The conveying system according to any one of claims 4 to 6, characterized in that: The second loading locking module connected to the second vacuum delivery module is different from the second loading locking module connected to the third vacuum delivery module.

9. A conveying system, characterized in that, include: Load port; A component storage device capable of storing consumable components used in at least one substrate processing module; A first conveying unit, comprising at least one first loading and locking module and a first vacuum conveying module, wherein the first vacuum conveying module is capable of conveying a substrate between the at least one substrate processing module and the at least one first loading and locking module, and is capable of conveying consumable components from the at least one first loading and locking module to the at least one substrate processing module; A second conveying unit is configured above or below the first conveying unit. The second conveying unit includes at least one second loading locking module and a second vacuum conveying module. The second vacuum conveying module is capable of conveying consumable components from the at least one substrate processing module to the at least one second loading locking module. and An atmospheric delivery module is capable of delivering substrates between a container placed on the loading port and the at least one first loading locking module, and of delivering consumable components between the component storage and the at least one second loading locking module.

10. The conveying system according to claim 9, characterized in that: The second conveying unit is positioned below the first conveying unit.

11. The conveying system according to claim 10, characterized in that: The atmospheric transport module includes: The first opening is connected to the first loading and locking module via a gate valve; The second opening is connected to the second loading locking module via a gate valve; The third opening is connected to the loading port via a valve; and A fourth opening, located below the first, second, and third openings, is connected to the component storage unit via a valve.

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