Mechanically coupling multiple leads to improve the robustness of a wire bond interconnect device to mechanical vibrations and shocks

Abstract

An electronic device module and a method of manufacture. A first wire bond is between a first conductive surface and a second conductive surface and proximate a second wire bond. The first wire bond has a first natural frequency. The first wire bond is mechanically coupled to the second wire bond via a coating to form a coated coupled wire bond. The coated coupled wire bond has a second natural frequency that is greater than the first natural frequency of the first wire bond.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of the earlier filing date of U.S. Provisional Application Serial No. 63 / 556,150, filed on February 21, 2024. Background Technology

[0003] In the resource recycling industry, drill strings are used to drill boreholes into formations. A drill string comprises a drill bit for drilling into the formation and an electronic system for controlling various aspects of the drilling operation. The electronic system consists of multiple electronic modules. Wire bonding interconnects are used in various applications within electronic packages, such as connecting a substrate or printed circuit board to pins for electrical connections with tool wiring and other electronic modules. Electronic packages using organic potting or molding are typically unstable in harsh environments, such as during drilling operations and / or at high temperatures (T>125°C). Shocks and vibrations caused by drilling can be transmitted along the drill string as the drill bit rotates to drill a borehole. Vibrations with frequencies above 1 kHz can be particularly detrimental to electronics. For example, vibrations with frequencies above 1 kHz can occur in the presence of high-frequency torsional oscillations (HFTO), metal-to-metal impacts, inadequate fixation, etc., thereby exciting resonant oscillations in the wire bonds. Due to the high quality factor of the intrinsic resonance of the wire bonds, the wire bonds may break or detach from their pins, rendering the electronic package inoperable. Therefore, a high-temperature stable electronic package is needed that can withstand the high-frequency vibrations caused during drilling by introducing a damping system to reduce the quality factor or by shifting the resonance to a frequency much higher than the typical excitation frequency caused by the aforementioned effects. Summary of the Invention

[0004] This document discloses a method for manufacturing an electronic device module. The method includes: bonding a first lead between a first conductive surface and a second conductive surface and close to a second lead, wherein the first lead has a first intrinsic frequency; and mechanically coupling the first lead to the second lead via a coating to form a coating-coupled lead, wherein the coating-coupled lead has a second intrinsic frequency greater than the first intrinsic frequency of the first lead.

[0005] This document also discloses an electronic device module for a downhole tool. The electronic device module includes: a first lead bonded between a first conductive surface and a second conductive surface, the first lead having a first intrinsic frequency; a second lead adjacent to the first lead; and a coating that mechanically couples the first lead to the second lead to form a coating-coupled lead, wherein the coating-coupled lead has a second intrinsic frequency greater than the first intrinsic frequency. Attached Figure Description

[0006] The following description should not be considered as limiting in any way. Referring to the accompanying drawings, the same element numbers are used:

[0007] Figure 1 A drill string is shown in an exemplary embodiment;

[0008] Figure 2 The electronic components module that can be used in a downhole device for a drill string is shown;

[0009] Figure 2A An internal cross-sectional view of the electronic device module is shown;

[0010] Figure 3 A side view showing the connection of the bonding wires is shown;

[0011] Figure 3A A top view of a single coated bonding wire is shown;

[0012] Figures 4A-4F A top view of the bonded wires in various coupling configurations for mechanically coupling the bonded wires to change the vibration frequency is shown;

[0013] Figures 5A-5C A top view is shown of two bonding wires coupled to each other in various coupling configurations;

[0014] Figures 6A-6C Front, side, and top views of the lead pairs coupled by the coating in the exemplary embodiment are shown respectively;

[0015] Figure 7 Two schematic diagrams illustrating the oscillation direction of a composite ribbon structure formed by bonding as shown in Figure 6 are shown.

[0016] Figures 8A-8C The front, side, and top views of the lead triplet coupled by the coating in the exemplary embodiment are shown respectively; and

[0017] Figures 9A-9C Front, side and top views of a cross-lead pair coupled by a coating in an exemplary embodiment are shown respectively. Detailed Implementation

[0018] Specific embodiments of one or more implementations of the devices and methods disclosed herein are presented by way of example rather than limitation, with reference to the accompanying drawings.

[0019] refer to Figure 1An exemplary embodiment illustrates a drilling system 100 including a drill string 102. While a land-based drilling rig is shown, these concepts and methods are equally applicable to offshore drilling systems. The drill string 102 can be suspended from the drilling rig 104 and may include a connecting fitting 106 or coiled tubing for drilling a borehole 108 in a rock formation 110. The drill string 102 includes an inner bore to allow drilling fluid to flow from a surface location 105 to a drill bit 112 located at the bottom of the drill string 102 and back to the surface through the annulus between the borehole 108 wall and the drill string 102. The drill string 102 includes a bottom hole assembly (BHA) 114 above the drill bit 112. In one configuration, the BHA 104 includes the drill bit 112 and downhole tools. Downhole tools may be a sensor connector 116, a two-way telemetry device 118, a formation assessment (FE) device 120, a steering unit 122, and a rotary power unit, such as a drilling motor 124. Sensor connector 116 may include sensors for measuring near-bit orientation (e.g., BHA azimuth and dip, BHA coordinates, etc.) and sensors and tools for rotational orientation surveying. Drilling system 100 may also include information processing devices such as surface controller 126 and / or downhole controller 128. Communication between surface location 105 and BHA 114 may use uplinks and / or downlinks generated by mud-driven telemetry devices (such as mud pulse generators) and / or transmitted using hardwired (e.g., electrical conductors, optical fibers), acoustic signals, EM, or RF transmissions. One or more electronic modules 130 incorporated into BHA 114 or other components of drill string 102 may include components necessary for data storage and processing, communication, and / or control of BHA 114. These components may be housed in suitable compartments formed in or on drill string 102. Exemplary electronics in the electronic modules include printed circuit board assemblies (PCBAs) and multi-chip modules (MCMs).

[0020] Figure 2 An electronic module 200 is shown that can be used at the downhole device 106 of the drill string 100. The electronic module 200 includes a housing 202 and a pin portion 204 through which it can be connected to external devices. Figure 2AAn internal cross-sectional view 210 of the electronic device module 200 is shown. The housing 202 includes an electronic package 212 having a substrate 214 and a die 216 attached to the substrate 214. The die 216 may include a chip assembly or other electronic device. Bonding leads 218 form connections between the substrate 214 and the pins of the lead portion 204 of the housing 202. Bonding leads are typically made of gold, copper, silver, aluminum, or alloys such as aluminum alloys. Another bonding lead 220 connects the substrate 214 to the pins on the die 216. Although only one bonding lead 218 connecting the substrate 214 to the lead portion 204 of the housing 202 is shown, it should be understood that multiple bonding leads can be used to form multiple connections between the substrate 214 and the pins of the lead portion 204 of the housing 202. Additionally, multiple bonding leads 220 may be present connecting the substrate 214 to the die 216. Figure 2AThe electronic device module in the MCM can be a multi-chip module (MCM). The MCM uses a ceramic substrate to construct the circuit board and includes electronic components. These electronic components can be active or passive. In some embodiments, the electronic components can be constructed on or within the ceramic substrate. The electronic components are constructed from semiconductor materials (such as silicon and / or germanium) or alternative materials capable of withstanding temperatures up to 150°C to 175°C, 175°C to 200°C, 200°C to 225°C, 225°C to 250°C, or 250°C to 275°C. MCMs used in high-temperature applications can avoid the use of organic materials. Semiconductor components are typically not soldered to the metallization region of the ceramic substrate, but are interconnected via wire bonding or the use of adhesives. Semiconductor components can be wire-bonded to the substrate as so-called "bare dies." Wire bonding is a soldering technique that does not use flux materials. The coefficient of thermal expansion can be considered when selecting materials to construct the electronic components to be bonded to the ceramic substrate. The electronic components are attached to at least one side of the ceramic substrate. In an alternative embodiment, the electronic components are attached to both sides (front and back) of the ceramic substrate. The MCM is encapsulated in a housing to protect the substrate and the electronic components from environmental influences that could cause degradation of the materials used in the MCM (ambient gases, such as those originating from potting materials, solder, insulating materials, or organic materials used in polymer seals). In many applications, the MCM housing is hermetically sealed by using welding techniques to close the housing or by using metal seals. In downhole applications, the electronic board, including a circuit board, can be located within a cavity in a collar closed by a hatch or sleeve in a downhole tool. Alternatively, the circuit board can be located within a container inside the bore of a downhole tool (probe-based downhole tool) through which drilling fluid flows downhole. The electronic board (with or without a housing) can be securely attached to the inside of the downhole tool (collar, container in the bore (probe), megaframe) using fastening members, which can be screws, adhesives, or clamps. The fastener may include a biasing member, such as a spring or elastomeric material, which may be located somewhere within the cavity containing the electronic board or electronic housing. The biasing member compensates for vibrations and shocks generated during downhole operation of the downhole tool.

[0021] Figure 3 A side view of the bonding lead 218 for electrical connection is shown. The bonding lead 218 extends from point A at pin portion 204 to point B at electronic package 212. The bonding lead 206 forms an arc between points A and B. Point A is located at a height h above point B. The horizontal distance between points A and B is represented by x. The vertical height h of the bonding lead 218 is measured between point B and the top of the arc. w The length of the bonding wire 218 is determined by l wFor illustrative purposes, the height h is approximately 2.0 mm, the horizontal distance x is approximately 5.0 mm, and the vertical height h is... w Approximately 2.5mm, and the bonding wire length l w The length is approximately 6.0 mm. At connection point A or B, common wire bonding techniques (such as ball bonding, wedge bonding, or flexible bonding) are used to weld the bonding wire 218. At each connection point, the wire bond forms a heel 220. Simulations of the bonding wire show that it resonates at a frequency of approximately 2.7 kHz (resonant frequency or intrinsic frequency). The resonant frequency of the bonding wire is determined by the stiffness and length of the bonding wire 218. Excitation occurring at frequencies significantly lower or higher than this resonant frequency is extremely limited. The resonant frequency (~2.7 kHz) is within the frequency range of oscillations along the drill string 100, originating from the cutting process of the rock formation. The vibration can be lateral, axial, or torsional, such as high-frequency torsional oscillations (HFTO) typically above 50 Hz. However, because the vibrations in the drill string 100 occur at the intrinsic frequency and higher-order resonant frequencies, the bonding wire 218 is prone to breakage. In one embodiment, the resonant frequency of the bonding wire can be between 1 kHz and 3 kHz, between 2 kHz and 5 kHz, between 2 kHz and 10 kHz, or between 2 kHz and 20 kHz. The intrinsic frequency (resonant frequency) can be the fundamental intrinsic frequency (fundamental frequency).

[0022] A coating can be deposited on the bonding lead 218 to form a coating-lead composite, referred to herein as a coated bonding lead. Coated bonding leads exhibit different properties, particularly different intrinsic frequencies, different quality factors of the resonant intrinsic frequencies, and different mechanical properties (e.g., tensile strength and elastic modulus). The coating increases the stiffness of the bonding lead and correspondingly affects its resonant frequency. In various embodiments, coating 406 is made of parylene. Parylene has a density of about 1.1–1.8 g / cm³, a Young's modulus of about 2.6 to 3.0 gigapascals (GPa), and a Poisson's ratio of 0.35 to 0.4. The intrinsic frequency of the bonding lead varies with the thickness of the coating. For a single uncoated bonding lead (i.e., a bonding lead without a coating), the intrinsic frequency is about 2.8 kHz. For a coated bonding lead with coating 406 having a thickness of about 25 micrometers (μm), the intrinsic frequency is about 3.0 kHz. For a single coated bonding wire with a coating thickness of approximately 60 μm, the intrinsic frequency is approximately 4.0 kHz. In other embodiments, the coating may be made from a material selected from: poly(p-xylene) groups, polymers derived from polysiloxane groups, epoxy resins, etc. The coating may be applied to the bonding wire by vapor deposition or by spraying.

[0023] Figure 3AA top view 300 of a single bonding wire in a coating configuration is shown. The bonding wire 302 includes a first end 304 and a second end 306. The first end is connected to a first conductive surface (first contact pad 308), and the second end 306 is connected to a second conductive surface (second contact pad 310). A coating 305 coats the bonding wire 306 between the first end 304 and the second end 306. The coating 305 may coat the entire bonding wire 306 from the first end 304 to the second end 306, or it may coat only a portion of the bonding wire, such as 30%, 50%, or 80% of the length L of the bonding wire. In other embodiments (e.g., as...) Figures 4A-4F As shown in 5A-5C, a coating can be applied to two or more bonding wires. The entire coating of the bonding wire includes a heel 220, which stabilizes the area where the bonding wire is bonded to the connection point.

[0024] Figure 4A A top view 400 of two bonded wires in a first connection configuration is shown, which improves the eigenfrequency of the resulting mechanically coupled bonded wire system. This contrasts with having only one bonded wire. Figure 4A The system includes a first bonding lead 403 (first bonding lead) and a second bonding lead 404 (second bonding lead), both of which are connected to a first conductive surface (first contact pad 401) and a second conductive surface (second contact pad 402). A coating 405 of sufficient thickness is deposited on both the first bonding lead 403 and the second bonding lead 404 along their entire length, thereby creating a mechanical connection or mechanical coupling between them. Individually, both the first bonding lead 403 and the second bonding lead 404 have a resonant eigenfrequency f. res (First eigenfrequency). After the bonding wires are coupled, the mechanical coupling system has an eigenfrequency (second eigenfrequency), which is higher than the first eigenfrequency f of a single bonding wire. resAnd it is located outside the vibration frequency range along the drill string 100. The second intrinsic frequency of the coupled bonding leads is also significantly higher than the intrinsic frequency of a single coated lead with the same coating thickness. Furthermore, the mechanical strength of the coupled bonding lead pair is greater than that of a single bonding lead in at least one direction and / or its elastic modulus is greater than that of a single bonding lead. The first intrinsic frequency may be a first fundamental intrinsic frequency, and the second intrinsic frequency may be a second fundamental intrinsic frequency. In one embodiment, the coating may be deposited only on a portion of the bonding leads, such as 30%, 50%, or 80% of the length of bonding leads 403 or 404. In another embodiment, the length of the first bonding lead 403 coated by the coating may be different from the length of the second bonding lead 404 coated by the coating. The first bonding lead 403 may have the same length as the second bonding lead 404, or it may have different lengths. The first bonding lead 403 has a first diameter, and the second bonding lead 404 has a second diameter. The first diameter can be the same as the second diameter, or the first diameter can be different from the second diameter. Typical bonding wire diameters range from 20 μm to 100 μm. Depending on the characteristics of the first and second bonding wires, their intrinsic frequencies may be the same or different. The identical characteristics of the first bonding wire 403 and the second bonding wire 404 result in the first and second bonding wires having the same intrinsic frequency.

[0025] It should be understood that the same concept can be applied to various interconnect configurations. Figure 4B In this configuration, a first bonding lead 403 is connected between a first single-lead contact pad 406 and a second contact pad 402, while a second bonding lead 404 is connected between a second single-lead contact pad 407 and the same second contact pad 402. Figure 4C In this configuration, the first bonding lead 403 is connected between the first single-lead contact pad 406 and the third single-lead contact pad 408, while the second bonding lead 404 is connected between the second single-lead contact pad 407 and the fourth single-lead contact pad 409. Although Figure 4A , Figure 4B and Figure 4C The diagram shows coupling between only two bonded wires; however, it should be understood that more than two bonded wires can be coupled together using the coating shown in the diagram. For example, in... Figure 4D , Figure 4E and Figure 4F The text shows the relationship with... Figure 4A , Figure 4B and Figure 4C The same coupling configuration is used, which has a first bonding lead, a second bonding lead, and a third bonding lead. Figure 4D In the middle, three bonding wires extend between two contact pads (the first contact pad and the second contact pad). Figure 4E In this configuration, each bonding lead is connected at one end to a separate single-lead contact pad, and all three bonding leads are connected at the other end to a second contact pad. Figure 4F In this configuration, each bonding wire is connected to a separate single-lead contact pad at one end and also to a separate single-lead contact pad at the other end.

[0026] To mechanically couple the bonding wires and increase the intrinsic frequency, it is not necessary to fully coat the bonding wires. Furthermore, partial mechanical coupling may be sufficient. Figure 5A A top view 500 shows two bonding leads in a first coupling configuration used to couple bonding leads to change the resonant frequency. The first bonding lead 502 is connected at one end to the substrate 212. Figure 2 The first bonding lead 502 is connected to pin A1 of the substrate 214 at one end, and to pin B1 of the pin portion 204 at the opposite end. The second bonding lead 504 is connected to pin A2 of the substrate 214 at one end, and to pin B2 of the pin portion 204 at the opposite end. Individually, both the first bonding lead 502 and the second bonding lead 504 have an intrinsic frequency f. res A coating 406 is deposited on both the first bonding lead 502 and the second bonding lead 504 along their entire length, or at least along 30%, 50%, or 80% of their length, thereby creating a mechanical connection or mechanical coupling between the first bonding lead 502 and the second bonding lead 504. Although the first and second bonding leads can be coated along their entire length, coupling can be formed only along a finite length interval between them. This length interval can be 11% to 50%, 11% to 80%, 11% to 95%, or 11% to 100% of the total length L of the bonding leads. Figure 5B A top view 510 of the bonding leads in a second coupling configuration is shown. In the second coupling configuration, a single coating point 506 is applied to bond the first bonding lead 502 to the second bonding lead 504 at a single local location or local point along the first bonding lead 502 and the second bonding lead 504. The local point may extend along approximately 0.5% to 10% of the length L of the bonding lead. Figure 5C A top view 512 of the bonding wires in a third coupling configuration is shown. In this third bonding configuration, a first bonding wire 502 is coupled to a second bonding wire 504 using multiple coating points 506. Each point is located at a single local point along the first bonding wire 502 and the second bonding wire 504. Although Figure 5A , Figure 5B and Figure 5CThe figure shows the coupling between only two bonded wires, but it should be understood that more than two bonded wires can be coupled together by the coating shown in the figure.

[0027] exist Figure 5A , Figure 5B and Figure 5C In this process, when bonding wires are coupled to form a coupled bonded wire pair including a first bonded wire 502 and a second bonded wire 504, the intrinsic frequency of the coupled bonded wire pair is higher than the intrinsic frequencies of the first bonded wire 502 (i.e., as an uncoated bonded wire) and the second bonded wire 504 (i.e., as an uncoated bonded wire), thereby making the intrinsic frequency of the coupled bonded wire pair outside the range of vibration frequencies that typically occur along the drill string 100. In various embodiments, the coating 506 is made of parylene coating, but it may also be made of, for example, silicone or epoxy resin adhesive. The coating is made of a non-conductive material.

[0028] Figure 6A This is a front view 600 showing a cross-section of a bonding wire pair coupled by a coating in an exemplary embodiment. The coating ensures electrical isolation between the bonding wires. The bonding wire pair includes a first bonding wire 502 and a second bonding wire 504. In various non-limiting embodiments, each bonding wire has a diameter of 50 μm and a center-to-center distance (cc) of 125 μm. The thickness t of the (parylene) coating 506 is 60 μm. In one embodiment, each bonding wire has a diameter of 50 μm, a center-to-center distance of 100 μm, and a coating thickness t of 50 μm. In another embodiment, each bonding wire has a diameter of 50 μm, a center-to-center distance of 60 μm, and a coating thickness t of 15 μm. In yet another embodiment, each bonding wire has a diameter of 50 μm, a center-to-center distance of 250 μm, and a coating thickness t of 110 μm. The function of coating 506 is to increase the intrinsic frequency of each bonding lead to approximately 10 kHz. Although in Figure 6A Two bonding wires are shown, but in alternative embodiments, any number of bonding wires can be coupled to each other. Figure 6B A side view 610 of the bonding wire pair is shown. Figure 6C A top view 612 of a bonding wire pair is shown. The bonding wires are coupled together in a coating-coupled parallel bonding wire configuration, or form a coating-coupled parallel wire pair.

[0029] Figure 7Two schematic diagrams are shown illustrating the oscillation direction of a parallel bonded wire configuration formed by the coupling shown in illustrative Figure 6. The first oscillation schematic 700 shows an out-of-plane oscillation 702 with an intrinsic frequency of 9.9 kHz. The second schematic 704 shows an in-plane oscillation 706 with an intrinsic frequency of 10 kHz.

[0030] Figure 8A This is a front view 800 showing a cross-section of a bonding wire triplet coupled by a coating in an exemplary embodiment. The bonding wire triplet includes a first bonding wire 502, a second bonding wire 504, and a third bonding wire 802. Each bonding wire has a diameter of 50 μm and a center-to-center distance (cc) of 125 μm. The (parylene) coating 506 has a thickness t of 60 μm. At this thickness, the coating 506 raises the eigenfrequency of the out-of-plane oscillation mode of the bonding wire triplet to approximately 13.2 kHz (out-of-plane resonance). The eigenfrequency is now at 10.1 kHz (in-plane oscillation) because this particular coupling does not affect the in-plane oscillation mode (in-plane resonant frequency). Figure 8B A side view 810 of a bonding wire triplet is shown. Figure 8C A top view 812 of a bonding wire triplet is shown.

[0031] Figure 9A This is a front view 900 of a cross-section of a coating-coupled cross-bonded lead pair. An uncoated first bond lead and an uncoated second bond lead cross (cross leads). In an exemplary embodiment, the cross leads are coupled by a coating. A first bond lead 502 connects from pin A1 to pin B2, and a second bond lead 504 connects from pin A2 to pin B1. Pins B2 and B1, and pins A1 and A2, can be at different or the same potential, or can carry different or the same electrical signals. Once the coating is applied, the bond leads are rotated (and crossed) relative to each other (approximately 15 degrees) to further suppress out-of-plane oscillations. For a coating 506 with a thickness of 60 μm, the intrinsic frequency of the coating-coupled cross-bonded lead configuration is approximately 10.1 kHz (out-of-plane oscillation). The next oscillation mode (intrinsic frequency) exists at approximately 10.3 kHz (in-plane oscillation). Figure 9B A side view 910 of a cross-bonded lead pair is shown. Figure 9C A top view 912 of the cross-bonded lead pair is shown.

[0032] By rotating the bonded leads, the overall stiffness of the coated-coupled cross-bonded leads is increased. Higher stiffness results in higher intrinsic frequencies. In an illustrative example, for a standard configuration of parallel coated bonded leads (coated-coupled parallel bonded leads), such as... Figure 6A , Figure 6B , Figure 6CAs shown, the intrinsic frequency is approximately 9.9 kHz (for out-of-plane oscillations). By rotating the bonding wires relative to each other and crossing them (coating-coupled cross-bonded wires), the intrinsic frequency is approximately 10.1 kHz (for out-of-plane oscillations). In an alternative embodiment, multiple bonding wires may cross each other to further increase the stiffness of the overall structure of the coating-coupled cross-bonded wires, thereby further increasing the intrinsic frequency associated with the overall structure. The angle α between bonding wires 502 and 504 at the crossover point 902 may be between 1 degree and 90 degrees. In an alternative embodiment, this angle may be between 5 degrees and 80 degrees. In another embodiment, this angle may be between 10 degrees and 70 degrees. In yet another embodiment, this angle may be between 10 degrees and 50 degrees.

[0033] To achieve a thicker coating, thus facilitating bonding in either a coating-coupled parallel bonded lead configuration or a coating-coupled cross-bonded lead configuration, the coating can be applied in two layers. The first layer can be formed from a low-quality coating that includes voids (a void-rich layer). A thin second layer is applied over the first layer. The second layer is a high-quality coating made of the same material, which is void-free or substantially void-free. The density of the second coating is higher than that of the first layer. Due to the lower quality requirements, the first layer may require less time to form than the second layer. The first layer couples the bonding leads, while the second layer protects the bonding leads from chemical interactions with the environment that could lead to harmful chemical processes that could damage or destroy the bonding leads.

[0034] The following are some of the aforementioned publicly disclosed implementation schemes:

[0035] Implementation Scheme 1. A method for manufacturing an electronic device module, the method comprising: bonding a first lead between a first conductive surface and a second conductive surface and close to a second lead, wherein the first lead has a first intrinsic frequency; and mechanically coupling the first lead to the second lead via a coating to form a coating-coupled lead, wherein the coating-coupled lead has a second intrinsic frequency greater than the first intrinsic frequency of the first lead.

[0036] Implementation Scheme 2. The method according to any of the foregoing implementation schemes, wherein one of the following conditions exists: (i) the second wire is bonded between the first conductive surface and the second conductive surface; (ii) the second wire is bonded between the first conductive surface and a third conductive surface other than the second conductive surface; (iv) the second wire is bonded between the third surface and the fourth surface.

[0037] Implementation Scheme 3. The method according to any of the foregoing embodiments, the method further comprising coupling a third lead to the first lead and the second lead via the coating.

[0038] Implementation Scheme 4. The method according to any of the foregoing embodiments, the method further comprising coupling the first lead to the second lead, wherein the center-to-center distance between the first lead and the second lead is in the range of about 25 micrometers to 250 micrometers.

[0039] Implementation Scheme 5. The method according to any of the foregoing embodiments, the method further comprising coupling the first lead to the second lead at one of the following locations: (i) a single local point along the first lead and the second lead; (ii) a plurality of local points along the first lead and the second lead; and (iii) at least 11% of the entire length of the first lead and the second lead.

[0040] Implementation Scheme 6. The method according to any of the foregoing embodiments, wherein the thickness of the coating is in the range of one of the following values: (i) about 5 micrometers to 15 micrometers; (ii) about 16 micrometers to 30 micrometers; (iii) about 31 micrometers to 50 micrometers; and (iv) about 51 micrometers to 300 micrometers.

[0041] Implementation Scheme 7. The method according to any of the foregoing embodiments, wherein the material of the coating is selected from at least one of the following: (i) a poly(p-xylene) group; (ii) a polymer derived from a polysiloxane group; (iii) an epoxy resin; and (iv) a combination of epoxy resin and silicone resin.

[0042] Implementation Scheme 8. The method according to any of the foregoing embodiments, the method further comprising causing the first lead to cross over the second lead to form a cross lead, and coupling the first lead of the cross lead to the second lead via the coating to form a coating-coupled cross lead.

[0043] Implementation Scheme 9. The method according to any of the foregoing embodiments, wherein the first intrinsic frequency is within the vibration frequency range of the downhole tool, and the second intrinsic frequency is outside the vibration frequency range of the downhole tool.

[0044] Implementation Scheme 10. The method according to any of the foregoing embodiments, wherein the coating is applied by vapor deposition.

[0045] Implementation Scheme 11. The method according to any of the foregoing embodiments, wherein the coating comprises a first layer and a second layer, wherein the density of the first layer is lower than the density of the second layer.

[0046] Implementation Scheme 12. An electronic device module for a downhole tool. The electronic device module includes: a first lead bonded between a first conductive surface and a second conductive surface, the first lead having a first intrinsic frequency; a second lead adjacent to the first lead; and a coating that mechanically couples the first lead to the second lead to form a coating-coupled lead, wherein the coating-coupled lead has a second intrinsic frequency greater than the first intrinsic frequency.

[0047] Implementation Scheme 13. The electronic device module according to any of the foregoing embodiments, wherein the center-to-center distance between the first lead and the second lead is in the range of about 25 micrometers to 250 micrometers.

[0048] Implementation Scheme 14. An electronic device module according to any of the foregoing embodiments, wherein the coating couples the first lead to the second lead at one of the following locations: (i) a single local point along the first lead and the second lead; (ii) a plurality of local points along the first lead and the second lead; and (iii) at least 11% of the entire length of the first lead and the second lead.

[0049] Implementation Scheme 15. An electronic device module according to any of the foregoing embodiments, wherein the thickness of the coating is in the range of one of the following values: (i) between 5 micrometers and 15 micrometers; (ii) between about 16 micrometers and 30 micrometers; (iii) between about 31 micrometers and 50 micrometers; and (iv) between about 51 micrometers and 300 micrometers.

[0050] Implementation Scheme 16. An electronic device module according to any of the foregoing embodiments, wherein the material of the coating is selected from at least one of the following: i) a poly(p-xylene) group material; (ii) a polymer derived from a polysiloxane group; (iii) an epoxy resin; and (iv) a combination of epoxy resin and silicone resin.

[0051] Implementation Scheme 17. An electronic device module according to any of the foregoing embodiments, wherein the first lead crosses above the second lead to form a coating-coupled cross lead, and the coating at least partially covers the coating-coupled cross lead.

[0052] Implementation Scheme 18. An electronic device module according to any of the foregoing embodiments, wherein the first intrinsic frequency is within the vibration frequency range of the downhole tool, and the second intrinsic frequency is outside the vibration frequency range of the downhole tool.

[0053] Implementation Scheme 19. An electronic device module according to any of the foregoing embodiments, wherein the coating comprises a first layer and a second layer, wherein the density of the first layer is lower than the density of the second layer.

[0054] Implementation Scheme 20. An electronic device module according to any of the foregoing embodiments, wherein the first lead is positioned parallel to the second lead to form a coating-coupled parallel lead, and the coating at least partially covers the coating-coupled parallel lead.

[0055] In the context of describing the invention (particularly in the context of the appended claims), the terms “an” and “the”, and similar designations, should be interpreted to cover both singular and plural forms, unless otherwise specified herein or clearly contradicted by the context. Furthermore, it should be noted that the terms “first,” “second,” etc., used herein do not indicate any order, quantity, or importance, but are used to distinguish one element from another. The terms “about,” “substantially,” and “generally” are intended to include a degree of error associated with a specific number of measurements based on the equipment available at the time of filing. For example, “about” and / or “substantially” and / or “generally” can include a range of ±8% for a given value.

[0056] Although the invention has been described with reference to one or more exemplary embodiments, those skilled in the art will understand that various changes can be made and equivalents can be substituted for elements therein without departing from the scope of the invention. Furthermore, many modifications can be made to adapt particular situations or materials to the teachings of the invention without departing from the basic scope of the invention. Therefore, it is contemplated that the invention is not limited to the specific embodiments disclosed as the best mode contemplated for carrying out the invention, but rather that the invention will encompass all embodiments falling within the scope of the claims. Additionally, exemplary embodiments of the invention have been disclosed in the drawings and detailed descriptions, and although specific terminology has been used, it is used in a general and descriptive sense only, and not for limiting purposes, unless otherwise specified; therefore, the scope of the invention is not limited thereto.

Claims

1. A method for manufacturing an electronic device module, the method comprising: A first lead is bonded between a first conductive surface and a second conductive surface and is close to the second lead, wherein the first lead has a first intrinsic frequency; as well as The first lead is mechanically coupled to the second lead via a coating to form a coated lead, wherein the coated lead has a second intrinsic frequency greater than the first intrinsic frequency of the first lead.

2. The method according to claim 1, wherein, One of the following situations exists: (i) the second wire is bonded between the first conductive surface and the second conductive surface; (ii) the second wire is bonded between the first conductive surface and a third conductive surface other than the second conductive surface; (iv) the second wire is bonded between the third surface and the fourth surface.

3. The method of claim 1, further comprising coupling a third lead to the first lead and the second lead via the coating.

4. The method of claim 1, further comprising coupling the first lead to the second lead, wherein the center-to-center distance between the first lead and the second lead is in the range of about 25 micrometers to 250 micrometers.

5. The method of claim 1, further comprising coupling the first lead to the second lead at one of the following locations: (i) a single local point along the first lead and the second lead; (ii) a plurality of local points along the first lead and the second lead; and (iii) at least 11% of the entire length of the first lead and the second lead.

6. The method according to claim 1, wherein, The thickness of the coating is in the range of one of the following values: (i) about 5 micrometers to 15 micrometers; (ii) about 16 micrometers to 30 micrometers; (iii) about 31 micrometers to 50 micrometers; and (iv) about 51 micrometers to 300 micrometers.

7. The method according to claim 1, wherein, The material of the coating is selected from at least one of the following: (i) poly(p-xylene) groups; (ii) polymers derived from polysiloxane groups; (iii) epoxy resins; and (iv) combinations of epoxy resins and silicone resins.

8. The method of claim 1, further comprising causing the first lead to cross over the second lead to form a cross lead, and coupling the first lead of the cross lead to the second lead via the coating to form a coating-coupled cross lead.

9. The method according to claim 1, wherein, The first intrinsic frequency is within the vibration frequency range of the downhole tool, and the second intrinsic frequency is outside the vibration frequency range of the downhole tool.

10. The method according to claim 1, wherein, The coating is applied by vapor deposition.

11. The method according to claim 1, wherein, The coating comprises a first layer and a second layer, wherein the density of the first layer is lower than the density of the second layer.

12. An electronic device module for downhole tools, the electronic device module comprising: A first lead is bonded between a first conductive surface and a second conductive surface, and the first lead has a first intrinsic frequency. The second lead is close to the first lead; and A coating that mechanically couples the first lead to the second lead to form a coating-coupled lead, wherein the coating-coupled lead has a second intrinsic frequency greater than the first intrinsic frequency.

13. The electronic device module according to claim 12, wherein, The center-to-center distance between the first lead and the second lead is in the range of approximately 25 micrometers to 250 micrometers.

14. The electronic device module according to claim 12, wherein, The coating couples the first lead to the second lead at one of the following locations: (i) a single local point along the first lead and the second lead; (ii) multiple local points along the first lead and the second lead; and (iii) at least 11% of the entire length of the first lead and the second lead.

15. The electronic device module according to claim 12, wherein, The thickness of the coating is within one of the following ranges: (i) 5 micrometers to 15 micrometers; (ii) about 16 micrometers to 30 micrometers; (iii) about 31 micrometers to 50 micrometers; and (iv) about 51 micrometers to 300 micrometers.

16. The electronic device module according to claim 12, wherein, The material of the coating is selected from at least one of the following: (i) poly(p-xylene) group materials; (ii) polymers derived from polysiloxane groups; (iii) epoxy resins; and (iv) combinations of epoxy resins and silicone resins.

17. The electronic device module according to claim 12, wherein, The first lead crosses above the second lead to form a coating-coupled cross lead, and the coating at least partially covers the coating-coupled cross lead.

18. The electronic device module according to claim 12, wherein, The first intrinsic frequency is within the vibration frequency range of the downhole tool, and the second intrinsic frequency is outside the vibration frequency range of the downhole tool.

19. The electronic device module according to claim 12, wherein, The coating comprises a first layer and a second layer, wherein the density of the first layer is lower than the density of the second layer.

20. The electronic device module according to claim 12, wherein, The first lead is positioned parallel to the second lead to form a coating-coupled parallel lead, and the coating at least partially covers the coating-coupled parallel lead.

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