Electronic component manufacturing apparatus and electronic component manufacturing method

Abstract

Provided is an electronic component manufacturing apparatus and an electronic component manufacturing method capable of appropriately preventing radiation from a radiation source from spreading to the outside. A ceramic green sheet manufacturing apparatus (1) includes: a thickness measuring device (4) having an irradiation head (19) of beta rays or X-rays and a measuring head (20) opposed to the irradiation head (19) so as to sandwich a ceramic green sheet (CG1) supported by a resin film (RF1) between the irradiation head (19), and measures the thickness of the ceramic green sheet (CG1); and a shielding wall (31) arranged to shield at least a portion of the periphery of the irradiation head (19) and attenuate radiation emitted from the irradiation head (19).

Description

Technical Field

[0001] The present invention relates to an electronic component manufacturing apparatus and a method for manufacturing electronic components, which have the function of measuring the thickness of ceramic green sheets disposed on a resin film. Background Technology

[0002] In the manufacture of multilayer ceramic electronic components such as multilayer ceramic capacitors, controlling the thickness of the ceramic green sheet is crucial. Typically, the ceramic green sheet is formed by coating a ceramic slurry onto a resin film at a given thickness. During the slurry coating process, the thickness of the coating film is measured while the amount of slurry applied is controlled and adjusted to achieve the desired thickness.

[0003] When measuring the thickness of ceramic green sheets, a common method is to use a non-contact thickness measuring device that does not damage the ceramic green sheet. For example, the multilayer thin film thickness measuring device described in Patent Document 1 includes a beta-ray thickness gauge. The beta-ray thickness gauge has a radiation source and a measuring unit facing each other, with the ceramic green sheet sandwiched in the thickness direction. In this case, the combined thickness of the ceramic green sheet and the resin film is measured as the film thickness value, and the thickness of the ceramic green sheet is obtained by subtracting the previously measured thickness of the resin film from this film thickness value.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 59-99339

[0007] However, in such non-contact thickness measuring devices, no appropriate technology has been proposed to prevent radiation from the radiation source from spreading to the outside. Summary of the Invention

[0008] The problem the invention aims to solve

[0009] The purpose of this invention is to provide an electronic component manufacturing apparatus and a method for manufacturing electronic components that can appropriately prevent radiation from a radiation source from extending to the outside.

[0010] Technical solutions for solving the problem

[0011] One aspect of the present invention relates to an electronic component manufacturing apparatus comprising:

[0012] A thickness measuring device includes a radiation source of beta rays or X-rays, and a measuring section positioned opposite the radiation source such that a ceramic green sheet supported by a resin film is clamped between the radiation source and the radiation source, for measuring the thickness of the ceramic green sheet; and

[0013] A protective barrier is configured to shield at least a portion of the area surrounding the radiation source, thereby attenuating the radiation emitted from the radiation source.

[0014] One aspect of this invention relates to an electronic component manufacturing method performed in an electronic component manufacturing apparatus.

[0015] The electronic component manufacturing apparatus includes:

[0016] A thickness measuring device comprises a radiation source of beta rays or X-rays, a measuring section positioned opposite the radiation source such that a ceramic green sheet supported by a resin film is clamped between the radiation source and the radiation source, and a moving mechanism for moving the radiation source in the width direction of the resin film and the ceramic green sheet, for measuring the thickness of the ceramic green sheet; and

[0017] A protective wall is disposed near the width-direction ends of the resin film and the ceramic green sheet to attenuate the radiation emitted from the radiation source.

[0018] The electronic component manufacturing method includes:

[0019] The process of measuring the thickness of the ceramic green sheet by means of the moving mechanism moving the radiation source and the measuring unit along the surface of the resin film and the ceramic green sheet; and

[0020] The process by which the moving mechanism moves the radiation source from outside the protective wall into the protective wall.

[0021] Invention Effects

[0022] According to the present invention, an electronic component manufacturing apparatus and a method for manufacturing electronic components can be provided that can appropriately prevent radiation from a radiation source from extending to the outside. Attached Figure Description

[0023] Figure 1 This is a schematic front view of the ceramic green sheet manufacturing apparatus according to the first embodiment of the present invention.

[0024] Figure 2 This is a schematic top view of a ceramic green sheet manufacturing apparatus.

[0025] Figure 3 This is a block diagram showing the control structure of a ceramic green sheet manufacturing apparatus.

[0026] Figure 4 It is a schematic 3D diagram of the protective wall.

[0027] Figure 5It is a cross-sectional view of the protective wall and a diagram schematically showing the actions of the operator in operating the measuring unit inside the protective wall.

[0028] Figure 6 This is a schematic top view of a ceramic green sheet manufacturing apparatus showing the measuring section of the thickness measuring device in the first position.

[0029] Figure 7 This is a schematic top view of a ceramic green sheet manufacturing apparatus showing the measuring section of the thickness measuring device in the second position.

[0030] Figure 8 This is a schematic front view of the ceramic green sheet manufacturing apparatus according to the second embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures

[0032] 1: Ceramic green sheet manufacturing equipment (electronic component manufacturing equipment);

[0033] 2: Coating film forming apparatus;

[0034] 3: Coating film conveying device;

[0035] 4: Thickness measuring device;

[0036] 5: Unwinding device;

[0037] 6: Winding device;

[0038] 15: Measurement unit;

[0039] 16: Moving mechanism;

[0040] 17: Control Department;

[0041] 19: Irradiation head (radiation source);

[0042] 20: Measuring head (measuring section);

[0043] 21: End point in the first width direction;

[0044] 22: End in the second width direction;

[0045] 25: Position 1;

[0046] 26: Second position;

[0047] 31: Protective wall;

[0048] 32: Wall;

[0049] 33: An opening for receiving;

[0050] 34: Opening for operation;

[0051] 51: First protective wall;

[0052] 52: Second protective wall;

[0053] 53: Third protective wall;

[0054] 54: Fourth protective wall;

[0055] A1: The worker;

[0056] CG1: Ceramic green sheet (electronic component);

[0057] RF1: Resin film;

[0058] SP1: Space;

[0059] T1: Transport direction;

[0060] W1: Width direction. Detailed Implementation

[0061] The following describes embodiments of the electronic component manufacturing apparatus and method of the present invention, but the present invention is not limited thereto. Furthermore, the accompanying drawings are used to illustrate the invention, and sometimes the depiction is schematically simplified; sometimes the dimensions of the depicted components or the ratios between the dimensions of the components differ from those described in the specification. In addition, there are cases where components described in the specification are omitted in the drawings, or where the number of components is omitted.

[0062] (First Embodiment)

[0063] (Manufacturing equipment)

[0064] use Figure 1 as well as Figure 2 This will be used as an example of a ceramic green sheet manufacturing apparatus 1 as an electronic component manufacturing apparatus. Figure 1 This is a schematic front view of the ceramic green sheet manufacturing apparatus 1 according to the first embodiment of the present invention. Figure 2 This is a schematic top view of the ceramic green sheet manufacturing apparatus 1.

[0065] Ceramic green sheet manufacturing apparatus 1 (hereinafter referred to as "manufacturing apparatus 1") is an apparatus for manufacturing ceramic green sheets CG1 as a type of coated film in a continuous production process. Manufacturing apparatus 1 is an apparatus that coats a resin film RF1 with a ceramic slurry and winds up the ceramic green sheet CG1 formed by drying the coated ceramic slurry together with the resin film RF1.

[0066] The manufacturing apparatus 1 includes a coating film forming apparatus 2, a coating film conveying apparatus 3, and a thickness measuring apparatus 4.

[0067] Hereinafter, the direction in which the resin film RF1 is conveyed is defined as the conveying direction T1. As shown by arrow AR1, the resin film RF1 is conveyed from left to right in the conveying direction T1. Furthermore, the direction orthogonal to the conveying direction T1 and the width direction of the resin film RF1 is defined as the width direction W1.

[0068] The coating film forming apparatus 2 has a coating section equipped with coating devices such as a die coater, for coating the resin film RF1. Figure 1 The upper surface is coated with ceramic slurry to a given thickness.

[0069] The coating film forming apparatus 2 is positioned upstream of the thickness measuring apparatus 4 in the conveying direction T1 at the conveying position of the resin film RF1.

[0070] The coating film forming apparatus 2 includes a coating section (not shown) and a drying section (not shown). The coating section coats a ceramic slurry onto the resin film RF1. The method of coating the ceramic slurry, depending on the thickness of the formed ceramic green sheet, can employ on-roll coating machines, depressurized coating machines, off-roll coating machines, slot coating machines, curtain coating machines, lift coating machines, doctor blade coating machines, cast iron coating machines, reverse roller coating machines, scraper coating machines, screen printing, etc. The drying section dries the ceramic slurry coated on the surface of the resin film RF1. The heat source for drying in the drying section can be hot air, electric heating, microwaves, infrared rays, far-infrared rays, etc., used alone or in combination. The drying temperature is 30°C or higher and 100°C or lower.

[0071] The ceramic slurry is obtained by preparing ceramic particles containing Ba, Ca, Ti, etc., a binder, an organic solvent, etc., and then wet-mixing them. The binder and solvent in the ceramic slurry can be well-known binders and solvents. The thickness of the applied ceramic slurry is 0.1 μm or more and 50 μm or less.

[0072] A resin film RF1 coated with ceramic slurry by the coating section of the coating film forming apparatus 2 is dried in the drying section of the coating film forming apparatus 2 to form a ceramic green sheet CG1.

[0073] The coating film conveying device 3 is a device for conveying the resin film RF1. The coating film conveying device 3 has an unwinding device 5 and a winding device 6. The unwinding device 5 has an unwinding roller 11. The winding device 6 has a winding roller 12. The resin film RF1 is conveyed from the unwinding roller 11 to the winding roller 12 and then wound up by the winding roller 12.

[0074] The rotational speeds of the unwinding roller 11 and the take-up roller 12 can be changed. If the rotational speeds of the unwinding roller 11 and the take-up roller 12 are changed, the conveying speed of the resin film RF1 will change.

[0075] In addition, the direction from the unwinding roller 11 to the winding roller 12 is parallel to the horizontal direction, and the resin film RF1 is conveyed parallel to the horizontal plane.

[0076] (Resin film)

[0077] The resin film RF1 is a sheet or film-like film used to coat ceramic slurry and support the ceramic green sheet CG1 formed by drying it.

[0078] The material of the resin film RF1 is not particularly limited, and resin sheets can be widely used. For example, the resin film RF1 can be selected from materials such as PP, PET, or PEN. Furthermore, the resin film RF1 preferably has light transmittance. Additionally, a laminated sheet formed by overlapping multiple sheets with different physical properties can also be used as the resin film RF1. Moreover, in order to efficiently peel the ceramic green sheet CG1 formed on the resin film RF1 from the resin film RF1, a sheet called a release layer can be provided on the surface of the resin film RF1 coated with ceramic slurry.

[0079] In addition, the width dimension of the resin film RF1 is, for example, 100 mm or more and 1000 mm or less, and the thickness dimension is 0.01 mm or more and 1.0 mm or less. The resin film is also sometimes referred to as a carrier film or carrier sheet.

[0080] like Figure 2 As shown, the resin film RF1 has a first width direction end 21 located on the lower side of the figure and a second width direction end 22 located on the upper side of the figure. The ceramic green sheet CG1 supported by the resin film RF1 also has a first width direction end and a second width direction end corresponding to the first width direction end 21 and the second width direction end 22 of the resin film RF1.

[0081] (Thickness measuring device)

[0082] The thickness measuring device 4 is an online film thickness gauge that measures the thickness of the ceramic green sheet CG1 placed on the conveyed resin film RF1.

[0083] The thickness measuring device 4 includes a measuring unit 15 and a moving mechanism 16. Furthermore, the moving mechanism 16... Figure 3 The diagram in the middle is a block diagram. Figure 1 as well as Figure 2 Not shown in the image.

[0084] (Measuring device)

[0085] The measuring unit 15 measures the film thickness value after combining the thickness of the ceramic green sheet CG1 (sheet thickness) and the thickness of the resin film RF1 (film thickness).

[0086] The measuring unit 15 has an irradiation head 19 as a radiation source and a measuring head 20 as a measuring section.

[0087] Irradiation head 19 is an X-ray generating device that irradiates radiation by causing electron beams emitted from the cathode to collide with the anode. The radiation is either X-rays or beta rays, depending on the material of the ceramic green sheet disposed on the resin film RF1. When using X-rays, the most suitable wavelength can be selected based on the properties of the material disposed on the resin film RF1. When using beta rays, the most suitable source can be used based on the properties of the material disposed on the resin film RF1, such as 85Kr, 147Pm, 204Ti, 90Sr, etc. Measurement head 20 measures the thickness of the resin film RF1 and the ceramic green sheet CG1 based on the transmittance of the radiation or the absorption coefficient of the irradiated object.

[0088] The irradiation head 19 and the measuring head 20 are positioned opposite each other, sandwiching the resin film RF1 and the ceramic green sheet CG1, for the purpose of measuring the amount of radiation transmitted. The irradiation head 19 and the measuring head 20 are moved as a unit by the moving mechanism 16.

[0089] (Mobile organization)

[0090] Mobile mechanism 16 ( Figure 3 ) such as Figure 2 As shown by the arrows AR2 extending on both sides of the width direction W1, the irradiation head 19 and the measuring head 20 move back and forth in the width direction W1 of the resin film RF1 and the ceramic green sheet CG1.

[0091] Specifically, the moving mechanism 16 moves the irradiation head 19 and the measuring unit 15 along the surfaces of the resin film RF1 and the ceramic green sheet CG1 in the width direction W1. More specifically, the moving mechanism 16 is movable between a first position 25 and a second position 26, the first position 25 being near the first width direction end 21 of the resin film RF1 and the second position 26 being near the second width direction end 22 of the resin film RF1. The first position 25, being near the first width direction end 21 of the resin film RF1 and the ceramic green sheet CG1, is, for example, like... Figure 2 The position shown can also be a location away from the first width direction end 21 in the width direction W1. For example, the second position 26 near the second width direction end 22 of the resin film RF1 and the ceramic green sheet CG1 is like... Figure 2 The position shown can also be a location away from the second width direction end 22 in the width direction W1. In this embodiment, the first width direction end 21 side of the resin film RF1 is the area where the operator is permitted to access, and the second width direction end 22 side of the resin film RF1 is the area where the operator is not permitted to access.

[0092] The moving mechanism 16, for example, has various linear motion mechanisms that use motors, cylinders, linear motors, etc. as drive sources and utilize ball screws, racks and pinions, timing belts, guides, etc.

[0093] The measuring unit 15 moves back and forth along the width direction W1 of the resin film RF1 while performing measurements intermittently at given intervals. During measurement, the measuring unit 15 preferably moves back and forth within the range between the first width direction end 21 and the second width direction end 22 of the resin film RF1. Since the resin film RF1 moves in the transport direction T1, the measuring unit 15 performs measurements in a zigzag pattern on the resin film RF1. The thickness information measured by the measuring unit 15 is used by averaging data from multiple obliquely continuous measuring points. Typically, the number of averaged measuring points is 2 to 100, but it can be appropriately set according to the measurement conditions. In this way, it is preferable to perform measurements using multiple measuring points in one linear movement, but it is also possible to perform measurements using only one measuring point in one linear movement.

[0094] The type of radiation can be selected based on specific conditions such as the raw materials constituting the resin film RF1 and the ceramic green sheet CG1, and the thickness of the object being irradiated. Here, X-rays, which are electromagnetic waves with a wavelength of 1 pm or more and 10 nm or less, are preferably used as the radiation irradiated by the measuring unit 15.

[0095] (Control structure of the manufacturing equipment)

[0096] use Figure 3 The control structure of manufacturing apparatus 1 will be explained. Figure 3 This is a block diagram showing the control structure of manufacturing apparatus 1. Manufacturing apparatus 1 has a control unit 17.

[0097] The control unit 17 is a computer system having a processor (e.g., CPU), a storage device (e.g., ROM, RAM, HDD, SSD, etc.), and various interfaces (e.g., A / D converter, D / A converter, communication interface, etc.). The control unit 17 performs various control actions by executing programs stored in the storage unit (corresponding to a part or all of the storage area of ​​the storage device).

[0098] The control unit 17 can be composed of a single processor, or it can be composed of multiple processors that are independent for each control purpose.

[0099] Some or all of the functions of each element of the control unit 17 can be implemented as programs that can be executed by the computer system constituting the control unit. Alternatively, some of the functions of each element of the control unit 17 can also be implemented using a custom IC.

[0100] The control unit 17 can control the coating film forming apparatus 2, the unwinding device 5, the winding device 6, the moving mechanism 16, and the irradiation head 19. The control unit 17 can receive detection signals from the measuring head 20. Specifically, the control unit 17 controls the unwinding device 5 and the winding device 6 to transport the resin film RF1. The control unit 17 controls the moving mechanism 16 to move the irradiation head 19 back and forth in the width direction W1 of the resin film RF1. The control unit 17 also controls the ON / OFF state, intensity, and spacing of the radiation from the irradiation head 19.

[0101] The following describes the film thickness feedback control based on the control unit 17. The control unit 17 is capable of processing electrical signals that change according to the radiation detected by the measuring head 20. Specifically, the control unit 17 uses thickness information corresponding to the position information measured by the measuring unit 15 to calculate the thickness of the ceramic green sheet CG1 at a given position of the resin film RF1. The control unit 17 sends the calculated thickness data of the ceramic green sheet CG1 to the coating film forming apparatus 2. As a result, the coating film forming apparatus 2 controls the supply amount of ceramic slurry, thereby adjusting the amount of ceramic slurry coated onto the resin film RF1. As a result, ceramic green sheets CG1 with uniform thickness can be continuously and reliably manufactured. To achieve film thickness feedback control, the supply amount control unit can, for example, include a solenoid valve and a flow meter of electromagnetic or ultrasonic type in the coating film forming apparatus 2.

[0102] (Protective wall)

[0103] Manufacturing apparatus 1 includes a protective wall 31. Use Figures 4-7 To explain the protective wall 31. Figure 4 This is a schematic three-dimensional view of the protective wall 31. Figure 5 It is a cross-sectional view of the protective wall 31, and a diagram schematically showing the operation of the measuring unit 15 inside the protective wall 31 by the operator A1. Figure 6 This is a schematic top view of the manufacturing apparatus 1 showing the measuring unit 15 of the thickness measuring device 4 in the first position 25. Figure 7 This is a schematic top view of the manufacturing apparatus 1 showing the measuring unit 15 of the thickness measuring device 4 in the second position 26.

[0104] The protective wall 31 is a structure configured to shield at least a portion of the area surrounding the irradiation head 19 and to attenuate the radiation R1 emitted from the irradiation head 19. The protective wall 31 comprises commonly used shielding materials such as lead, concrete, iron, or tungsten.

[0105] like Figure 2 , Figure 6 as well as Figure 7As shown, the protective wall 31 is located at the first position 25, which is near the first width direction end 21 of the resin film RF1 and the ceramic green sheet CG1.

[0106] The protective wall 31 has a wall portion 32 that defines a space SP1 for accommodating the irradiation head 19. The protective wall 31 is provided with a accommodating opening 33, which allows the irradiation head 19 to move in the width direction W1 and thus enter and exit the space SP1. The accommodating opening 33 opens toward the resin film RF1 and the ceramic green sheet CG1. In other words, the accommodating opening 33 of the protective wall 31 opens toward the second width direction end 22 of the resin film RF1.

[0107] The protective wall 31 extends relatively long in the vertical direction and has an upper part and a lower part as needed. More specifically, the wall portion 32 of the protective wall 31 has a main wall portion 32A and an opening wall portion 32B extending from the main wall portion 32A and forming an accommodating opening 33. The opening wall portion 32B is narrower in the conveying direction T1 than the main wall portion 32A. Therefore, as... Figure 6 As shown, when the irradiation head 19 is housed within the protective wall 31, the amount of radiation emitted from the irradiation head 19 through the receiving opening 33 decreases.

[0108] use Figure 4 as well as Figure 5The cross-sectional structure of the main body wall portion 32A of the protective wall 31 will be described in detail below. The main body wall portion 32A is generally rectangular and has wall portions that are bent at multiple right angles. Specifically, the main body wall portion 32A has a back wall portion 32A1, a pair of side walls 32A2, and a pair of front wall portions 32A3. The back wall portion 32A1 extends in a straight line along the conveying direction T1 when viewed from above. The pair of side walls 32A2 extend in a straight line from both ends of the back wall portion 32A1 toward the resin film RF1 side in the width direction W1. The pair of front wall portions 32A3 extend in a straight line from the ends of the pair of side walls 32A2 toward each other in the conveying direction T1. The connection between the front wall portions 32A3 and the side walls 32A2 is a first bend 38A. In the first bend 38A, the angle between the front wall portions 32A3 and the side walls 32A2 is a right angle. Furthermore, the aforementioned opening wall portion 32B is a pair of walls, each extending from the end of a pair of front wall portions 32A3 toward the resin film RF1 side in the width direction W1. The width direction W1 length of the opening wall portion 32B is shorter than the width direction W1 length of the side wall 32A2. The connection between the opening wall portion 32B and the front wall portion 32A3 is a second bend portion 38B. In the second bend portion 38B, the angle between the opening wall portion 32B and the front wall portion 32A3 is a right angle. According to the above structure, a space SP1 and a receiving opening 33 narrower in width than the transport direction T1 are formed. In addition, the angles of the first bend portion 38A and the second bend portion 38B may not be right angles. According to this structure, the working space during the cleaning of the irradiation head 19 (described later) can be ensured, and the angle of the radiation emitted from the protective wall 31 can be limited.

[0109] In this manner, the protective wall 31 is positioned near the first width-direction end 21 of the resin film RF1 and the ceramic green sheet CG1. The moving mechanism 16 moves the irradiation head 19 and the measuring head 20 along the surface of the resin film RF1 and the ceramic green sheet CG1 toward a first position 25 near the protective wall 31. When the measuring unit 15 is in the first position 25, as... Figure 5 as well as Figure 6 As shown, the irradiation head 19 is stored within the protective wall 31. In other words, the protective wall 31 is configured to surround the irradiation head 19. In this case, the protective wall 31 only needs to surround the perimeter of the irradiation head 19, thus reducing the grounding area of ​​the protective wall 31.

[0110] The protective wall 31 has a pair of working openings 32 for the irradiation head 19 disposed in the space SP1, enabling operator-based operation. More specifically, the pair of working openings 34 are formed on a pair of side walls 32A2. Furthermore, the wall 32 may have, for example, a working window 35 containing leaded glass. More specifically, the working window 35 is provided on the rear wall 32A1. In this case, lead gloves 36 are connected to the working openings 34, such as... Figure 5 The operator A1 shown is able to clean the irradiation head 19. In this case, the operator A1 is less likely to be irradiated by the radiation R1 naturally radiated from the irradiation head 19. Furthermore, with the irradiation head 19 housed within the protective wall 31, maintenance of equipment such as the unwinding device 5 and the winding device 6 becomes easier.

[0111] After stopping the radiation from the irradiation head 19, the control unit 17 moves the measuring unit 15 to the first position 25. Figure 6 The irradiation head 19 is moved, that is, housed within the protective wall 31. This allows, for example, an operator to clean or maintain the unwinding roller 11 and the take-up roller 12. Furthermore, the operator can clean the irradiation head 19 within the protective wall 31.

[0112] Manufacturing apparatus 1 includes a reference sample 37. The reference sample 37 is located at a second position 26, which is near the second width-direction end 22 of the resin film RF1. When performing a reference value correction operation for the maintenance of a film thickness gauge, such as... Figure 7 As shown, the measuring unit 15 is moved to a second position 26 opposite to the reference sample 37. Furthermore, the so-called reference value correction operation involves, for example, measuring the reference sample and confirming whether there is any deviation from the reference value. In this case, the position of the reference sample 37 is not on the first width direction end 21 side where the operator is located, thus ensuring high operator safety. Alternatively, the reference sample 37 may also be surrounded by the same protective wall as the protective wall 31 disposed on the first width direction end 21 side.

[0113] (Uses of ceramic raw shavings)

[0114] Ceramic green sheet CG1 is used in the manufacture of multilayer ceramic capacitors. For example, conductive paste for internal electrodes is printed on the ceramic green sheet in a given pattern, such as by screen printing, gravure printing, etc., thereby forming an internal electrode pattern.

[0115] Next, a given number of outer ceramic green sheets without internal electrode patterns are stacked, followed by a given number of outer ceramic green sheets with internal electrodes formed on top of these, and then a given number of outer ceramic green sheets are stacked on top of these to create a laminated capacitor. The ceramic green sheets form the dielectric layer constituting the laminated ceramic capacitor.

[0116] A laminated block is fabricated by pressing the laminated sheets in the lamination direction using methods such as isostatic pressing. Next, the laminated block is cut to a given size to produce laminated chips.

[0117] Next, the stacked small pieces are fired to create a laminate. A conductive paste for external electrodes is applied to both ends of the resulting laminate and then fired to form external electrodes. This process is used to manufacture a multilayer ceramic capacitor.

[0118] (Second Implementation)

[0119] The structure, location, and number of protective walls are not limited to the first embodiment. As a variation of the protective wall, [the following is an example]... Figure 8 The second implementation method will be described below. Figure 8 This is a schematic front view of the ceramic green sheet manufacturing apparatus 1A according to the second embodiment of the present invention. Furthermore, the basic structure and operation of the manufacturing apparatus 1A are the same as those of the manufacturing apparatus 1 of the first embodiment; therefore, the following description focuses on the differences.

[0120] The coating film conveying device 3A is a device for conveying the resin film RF1. The coating film conveying device 3A has an unwinding device 5 and a winding device 6. The unwinding device 5 has an unwinding roller 11. The winding device 6 has a winding roller 12. The resin film RF1 is conveyed from the unwinding roller 11 to the winding roller 12 and then wound up by the winding roller 12.

[0121] The coating film conveying device 3A has multiple rollers (41 to 44). The multiple rollers (41 to 44) are roller 1 41, roller 2 42, roller 3 43, and roller 44.

[0122] Rollers 41 and 42 are positioned on the unwinding device 5 side to change the conveying orientation of the resin film RF1. Specifically, roller 41 is positioned above roller 42, causing the conveying orientation to change at a right angle so that the resin film RF1 exiting the unwinding device 5 moves downward. Roller 42 causes the conveying orientation to change at a right angle so that the resin film RF1 exiting the first roller 41 moves in the lateral (horizontal) direction.

[0123] The third roller 43 and the fourth roller 44 are positioned on the side of the winding device 6 to change the conveying orientation of the resin film RF1. Specifically, the third roller 43 is positioned below the fourth roller 44, causing the conveying direction to change at a right angle so that the resin film RF1 moves upward. The fourth roller 44 causes the conveying orientation to change at a right angle so that the resin film RF1 exiting the third roller 43 moves in the lateral direction (horizontal direction).

[0124] In addition, the direction from the second roller 42 to the third roller 43 is parallel to the horizontal direction, and the resin film RF1 is conveyed parallel to the horizontal plane.

[0125] Manufacturing apparatus 1A has protective walls (51-54). The protective walls are structures configured to shield at least a portion of the area surrounding the irradiation head 19 and to attenuate the radiation R1 emitted from the irradiation head 19. The protective walls (51-54) contain commonly used shielding materials such as lead, concrete, iron, or tungsten.

[0126] Specifically, protective walls (51-52) are disposed between the irradiation head 19 and the unwinding device 5. Protective walls (53-54) are disposed between the irradiation head 19 and the winding device 6. As a result, the radiation R1 directed towards the unwinding device 5 and the winding device 6 is attenuated, thereby improving the safety of operators working on the unwinding device 5 and the winding device 6. Only one of the protective walls (51-52) or the protective walls (53-54) may be provided, but both are preferred.

[0127] More specifically, the protective wall (51-54) is set in the conveying direction after the resin film RF1 and the ceramic green sheet CG1 have been changed in direction by multiple rollers (41-44).

[0128] The protective walls (51-54) have a first protective wall 51, a second protective wall 52, a third protective wall 53, and a fourth protective wall 54. The protective walls (51-54) extend along the orthogonal direction of the paper surface, i.e., the width direction W1, and have a given width. Preferably, the width dimension of the protective walls (51-54) is larger than the width dimension of the unwinding device 5 and the winding device 6.

[0129] The first protective wall 51 and the second protective wall 52 are disposed between the irradiation head 19 and the unwinding device 5. The first protective wall 51 and the second protective wall 52 are disposed along the resin film RF1.

[0130] More specifically, the first protective wall 51 is disposed on the unwinding device 5 side of the resin film RF1, extending between the first roller 41 and the second roller 42. The first protective wall 51 is disposed close to the resin film RF1. The second protective wall 52 has a first portion 52A extending between the first roller 41 and the second roller 42. The first portion 52A is disposed on the side of the resin film RF1 opposite to the unwinding device 5. The first portion 52A is disposed close to the resin film RF1. Furthermore, the second protective wall 52 has a second portion 52B extending from one end of the first portion 52A. The second portion 52B is disposed above the first roller 41 and above the resin film RF1 extending from the unwinding device 5. The second portion 52B is disposed close to the resin film RF1. The first portions 52A of the first protective wall 51 and the second protective wall 52 overlap when viewed in the transport direction T1. At least a portion of the first protective wall 51 and at least a portion of the second protective wall 52 extend in a direction intersecting the horizontal direction, specifically in the vertical direction. At least a portion of the first protective wall 51 and at least a portion of the second protective wall 52 are configured to sandwich the resin film RF1. That is, at the aforementioned overlapping position, the radiation R1 from the irradiation head 19 is blocked by the double walls, making it less likely to reach the unwinding device 5. In summary, the radiation R1 can be attenuated according to the construction and arrangement of the first protective wall 51 and the second protective wall 52, thus reducing the amount reaching the unwinding device 5.

[0131] The third protective wall 53 and the fourth protective wall 54 are disposed between the irradiation head 19 and the winding device 6. The third protective wall 53 and the fourth protective wall 54 are disposed along the resin film RF1.

[0132] More specifically, the third protective wall 53 is disposed on the winding device 6 side of the resin film RF1, extending between the third roller 43 and the fourth roller 44. The third protective wall 53 is disposed close to the resin film RF1. The fourth protective wall 54 has a first portion 54A extending between the third roller 43 and the fourth roller 44. The first portion 54A is disposed on the side of the resin film RF1 opposite to the winding device 6. The first portion 54A is disposed close to the resin film RF1. The fourth protective wall 54 has a second portion 54B extending from one end of the first portion 54A. The second portion 54B is disposed above the fourth roller 44. The fourth protective wall 54 has a third portion 54C extending from one end of the second portion 54B. The third portion 54C is disposed on the side of the winding device 6. The third portion 54C is close to the upper side of the winding device 6. The first portions 54A of the third protective wall 53 and the fourth protective wall 54 overlap when viewed in the transport direction T1. At least a portion of the third protective wall 53 and at least a portion of the fourth protective wall 54 extend in a direction intersecting the horizontal direction, specifically in the vertical direction. At least a portion of the third protective wall 53 and at least a portion of the fourth protective wall 54 are configured to sandwich the resin film RF1. That is, at the aforementioned overlapping position, the radiation R1 from the irradiation head 19 is blocked by the double walls, thus making it difficult for it to reach the winding device 6. In summary, the construction and arrangement of the third protective wall 53 and the fourth protective wall 54 attenuate the radiation R1, thereby reducing the amount reaching the winding device 6.

[0133] In this case, when the irradiation head 19 is, for example, in position 25, such as Figure 8 As shown, the protective walls (51-54) are configured to block the radially extending radiation lines R1. Furthermore, by making the conveying direction T1 of the ceramic green sheet CG1 and the direction of the radiation lines R1 at an angle, and by making the protective walls (51-54) along the conveying direction T1 of the ceramic green sheet CG1, both the conveying of the ceramic green sheet CG1 and the blocking of the radiation lines R1 are taken into account.

[0134] There are no particular restrictions on the shape, location, or number of protective walls. Protective walls can be flat or curved.

[0135] (Other implementation methods)

[0136] The present invention has been described above with respect to various embodiments, but the present invention is not limited to the above embodiments and various modifications can be made without departing from the spirit of the invention. In particular, the various embodiments and variations described in this specification can be arbitrarily combined as needed.

[0137] The ceramic sheet used for thickness measurement can also be a coating film applied to the ceramic slurry before drying.

[0138] Ceramic green sheets can also be deposited on a resin film by means of bonding, vapor deposition, or spraying.

[0139] Radiation sources can also combine X-rays and beta rays and use the difference in their absorption coefficients to determine film thickness.

[0140] The coating film forming device can also be located on the upstream side of the unwinding device 5.

Claims

1. An electronic component manufacturing apparatus, comprising: A thickness measuring device includes a radiation source of beta rays or X-rays, and a measuring section positioned opposite the radiation source such that a ceramic green sheet supported by a resin film is clamped between the radiation source and the radiation source, for measuring the thickness of the ceramic green sheet; and A protective barrier is configured to shield at least a portion of the area surrounding the radiation source, thereby attenuating the radiation emitted from the radiation source.

2. The electronic component manufacturing apparatus according to claim 1, wherein, The thickness measuring device further includes a moving mechanism that moves the radiation source along the width direction of the resin film and the ceramic green sheet. The protective wall is disposed near the width-direction ends of the resin film and the ceramic green sheet.

3. The electronic component manufacturing apparatus according to claim 2, wherein, The resin film and the ceramic green sheet have a first width direction end and a second width direction end. The protective wall is disposed near the first width direction end of the resin film and the ceramic green sheet. The moving mechanism moves the radiation source and the measuring unit along the surface of the resin film and the ceramic sheet to a first position near the protective wall.

4. The electronic component manufacturing apparatus according to claim 2 or 3, wherein, The protective wall has: a wall portion that defines a space capable of accommodating the radiation source; and an opening portion that is open toward the resin film and the ceramic sheet side.

5. The electronic component manufacturing apparatus according to claim 4, wherein, The protective wall has a working opening that enables operator-based operations to be performed on the radiation source disposed in the space.

6. The electronic component manufacturing apparatus according to claim 1, wherein, The electronic component manufacturing apparatus further includes an unwinding device and a winding device for conveying the resin film and the ceramic green sheet. The protective wall is disposed between the radiation source and the unwinding device or between the radiation source and the winding device.

7. The electronic component manufacturing apparatus according to claim 6, wherein, The electronic component manufacturing apparatus also includes multiple rollers for conveying the resin film and the ceramic green sheet while changing their orientation. The protective wall is arranged along the conveying direction of the resin film and the ceramic green sheet after their orientation has been changed by the plurality of rollers.

8. A method for manufacturing an electronic component, performed in an electronic component manufacturing apparatus. The electronic component manufacturing apparatus includes: A thickness measuring device comprises a radiation source of beta rays or X-rays, a measuring section positioned opposite the radiation source such that a ceramic green sheet supported by a resin film is clamped between the radiation source and the radiation source, and a moving mechanism for moving the radiation source in the width direction of the resin film and the ceramic green sheet, for measuring the thickness of the ceramic green sheet; and A protective wall is disposed near the width-direction ends of the resin film and the ceramic green sheet to attenuate the radiation emitted from the radiation source. The electronic component manufacturing method includes: The process of measuring the thickness of the ceramic green sheet by means of the moving mechanism moving the radiation source and the measuring unit along the surface of the resin film and the ceramic green sheet; and The process by which the moving mechanism moves the radiation source from outside the protective wall into the protective wall.

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