Freeze-adsorption clamp device for ingot processing, ingot processing system and ingot processing method thereof

Abstract

The application discloses a frozen adsorption clamp device for crystal ingot processing, a crystal ingot processing system and a crystal ingot processing method thereof, and the frozen adsorption clamp device comprises a base, the upper surface of the base is formed with a double helix flow channel; a bearing disc is arranged on the upper surface of the base; the double helix flow channel is used for passing antifreeze; the bearing disc is used for bearing a to-be-processed crystal ingot; the upper surface of the bearing disc is formed with a spider web groove, the spider web groove is configured to load pure water, and the pure water forms an ice layer under the action of the antifreeze to mechanically embed the to-be-processed crystal ingot. The application adopts the antifreeze as a circulating medium, even at an extremely low working temperature (below 0 DEG C), no icing blockage phenomenon occurs, and the continuity of transmission is ensured. The antifreeze and the pure water are used for adsorbing the to-be-processed crystal ingot and taking away the heat of the to-be-processed crystal ingot.

Description

Technical Field

[0001] This invention relates to the field of crystal ingot processing technology, and more particularly to a cryogenic adsorption fixture device, a crystal ingot processing system, and a crystal ingot processing method for crystal ingot processing. Background Technology

[0002] In the manufacturing process of silicon carbide ingots, flat grinding (double-end face grinding), spherical grinding (external cylindrical grinding), and laser lift-off are key processes. Due to the extremely high hardness (Mohs 9.2) and brittleness of silicon carbide, the workpiece fixing method during processing requires extremely high precision. Currently, the industry mainly uses the following four fixing technologies: 1. Mechanical combination clamps: using pressure plates or chucks for physical locking; 2. Adhesive bonding: using special wax or glue to bond the ingot to a metal tray; 3. Vacuum or magnetic chucks: using negative pressure or magnetic field adsorption; 4. Traditional cryogenic clamping: using low temperature to freeze the moisture on the contact surface for fixing.

[0003] In existing technologies, freezing trays mostly use a single medium circulation, and the internal flow channels are prone to freezing and blockage in a deep-cold environment, leading to equipment shutdown.

[0004] Therefore, existing technologies still need improvement and development. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a cryogenic adsorption fixture device, a crystal ingot processing system and a crystal ingot processing method for crystal ingot processing, in order to solve the problem that the crystal ingot freezing tray is prone to freezing and clogging in the prior art.

[0006] The technical solution adopted by this invention to solve the technical problem is as follows: A cryogenic adsorption fixture device for ingot processing, comprising: A base, wherein a double helical flow channel is formed on the upper surface of the base; A support plate is disposed on the upper surface of the base; The double helix flow channel is for the antifreeze to pass through; The support plate is used to support the crystal ingot to be processed; The upper surface of the carrier plate is formed with a spider web groove, which is configured to hold pure water. The pure water forms an ice layer under the action of the antifreeze to mechanically fit the crystal ingot to be processed.

[0007] The cryogenic adsorption fixture device for ingot processing, wherein the flatness of the upper surface of the support plate is less than or equal to 0.01 mm; the spider web groove includes: Concentric annular grooves and radial radial grooves; The radial radiating groove is connected to each concentric annular groove.

[0008] The cryogenic adsorption fixture device for ingot processing, wherein the base is provided with an inlet and an outlet; the double helical flow channel includes: Entering and exiting the spiral flow channel; The inlet interface, the inlet spiral flow channel, the outlet spiral flow channel, and the outlet interface are connected in sequence. The inlet spiral channel and the outlet spiral channel alternate spiraling.

[0009] The cryogenic adsorption fixture device for ingot processing, wherein the base comprises: The seat body, wherein the double helical flow channel is formed on the upper surface of the seat body; The connection between the inlet spiral channel and the outlet spiral channel is located at the center or edge of the seat.

[0010] The cryogenic adsorption fixture device for ingot processing, wherein when the connection between the inlet spiral flow channel and the outlet spiral flow channel is located at the edge of the base, the base further includes: A shaft portion is formed on the lower surface of the base body; A shaft inner sleeve is disposed on the shaft portion; A shaft sleeve is fitted over the inner shaft sleeve and is rotatably connected to the shaft portion. The inner sleeve of the shaft forms an inlet connecting channel and an outlet connecting channel; An inlet isolation cavity and an outlet isolation cavity are formed between the inner shaft sleeve and the outer shaft sleeve; The inlet is disposed on the outer sleeve of the shaft, and the inlet, the inlet isolation cavity, the inlet connecting channel and the inlet spiral channel are connected in sequence; The discharge port is disposed on the outer sleeve of the shaft, and the discharge port, the discharge isolation cavity, the discharge connecting channel and the discharge spiral channel are connected in sequence.

[0011] The cryogenic adsorption fixture device for ingot processing, wherein the base further includes: The first sealed bearing enables a rotatable connection between the outer sleeve of the shaft and the shaft portion; The second sealed bearing enables a rotatable connection between the outer sleeve of the shaft and the shaft portion; The first sealing bearing seals the entry into the isolation cavity; The second sealing bearing seals the discharge isolation chamber.

[0012] A crystal ingot processing system, comprising: The cryogenic adsorption fixture device for ingot processing as described in any of the above; Antifreeze delivery device, providing antifreeze to the double spiral flow channel; A spraying device sprays the crystal ingots to be processed on the cryogenic adsorption fixture device used for crystal ingot processing. The processing device processes the crystal ingot to be processed; A non-contact thermometer is used to measure the temperature of the ingot to be processed; The freezing point of the antifreeze is lower than that of the spray liquid in the spraying device, and the freezing point of the spray liquid is lower than 0°C.

[0013] A method for processing an ingot using the ingot processing system described above, comprising the steps of: Pure water is sprayed onto the upper surface of the support plate, and the crystal ingot to be processed is placed on the upper surface of the support plate. Antifreeze is supplied to the double spiral channel through the antifreeze delivery device. The ingot to be processed is processed using a processing device; during the processing, a spray device is controlled to spray the ingot to be processed, and the temperature of the ingot to be processed is measured by a non-contact thermometer. The cooling power of the spray device and the antifreeze delivery device is adjusted based on the measured temperature; the processing device includes at least one of a flat grinding device, a grooving device, a rounding device, and a slicing device.

[0014] In the crystal ingot processing system described above, the temperature of the antifreeze is -5℃ to -30℃, and the temperature of the spray liquid in the spraying device is 1℃ to 4℃.

[0015] Beneficial effects: This application uses antifreeze as the circulating medium, which prevents freezing and blockage even at extremely low operating temperatures (below 0°C), ensuring continuous transmission. The antifreeze and pure water are used to absorb and remove heat from the ingots to be processed. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a cryogenic adsorption fixture device for ingot processing according to an embodiment of the present invention.

[0017] Figure 2 This is a partial cross-sectional view of a cryogenic adsorption fixture device for ingot processing according to an embodiment of the present invention.

[0018] Figure 3 This is a top view of the base in one embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of a cryogenic adsorption fixture device for ingot processing in another embodiment of the present invention.

[0020] Figure 5This is a partial cross-sectional view of a cryogenic adsorption fixture device for ingot processing in another embodiment of the present invention.

[0021] Figure 6 This is a top view of the base in another embodiment of the present invention.

[0022] Figure 7 This is a top view of the carrier disk in an embodiment of the present invention.

[0023] Figure 8 This is a functional principle block diagram of the ingot processing system in an embodiment of the present invention.

[0024] Explanation of reference numerals in the attached figures: 10. Base; 11. Double helical flow channel; 111. Inlet helical flow channel; 112. Outlet helical flow channel; 12. Inlet port; 13. Outlet port; 14. Seat body; 15. Shaft; 16. Inner shaft sleeve; 17. Outer shaft sleeve; 18. First sealed bearing; 19. Second sealed bearing; 20. Support plate; 21. Spider web groove; 211. Concentric annular groove; 212. Radial radial groove; 30. Antifreeze delivery device; 31. Antifreeze tank; 32. First circulation pump; 33. First refrigeration unit; 40. Spraying device; 41. Spraying liquid tank; 42. Second circulating pump; 43. Second refrigeration unit; 44. Nozzle; 50. Non-contact thermometer; 60. Control unit; 70. Crystal ingots to be processed. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0026] Please also refer to Figures 1-7 The present invention provides some embodiments of a cryogenic adsorption fixture device for ingot processing.

[0027] like Figure 1 and Figure 2 As shown, the cryogenic adsorption fixture device for ingot processing of the present invention includes: The base 10 has a double helical flow channel 11 formed on its upper surface; A support plate 20 is disposed on the upper surface of the base 10; The double helix channel 11 is for the passage of antifreeze; the support plate 20 is used to support the crystal ingot 70 to be processed; a spider web groove 21 is formed on the upper surface of the support plate 20, the spider web groove 21 is configured to hold pure water, and the pure water forms an ice layer under the action of the antifreeze to mechanically fit the crystal ingot 70 to be processed.

[0028] Specifically, a support plate 20 is placed on the base 10, and a crystal ingot 70 to be processed is placed on the support plate 20. The crystal ingot 70 can be a grown, unprocessed crystal ingot or a sliced ​​wafer awaiting further processing. A double-helix flow channel 11 is formed on the base 10. The antifreeze flows in different directions in adjacent helical channels of the double-helix flow channel 11, which helps to improve the temperature uniformity of the upper surface of the base 10 and achieves uniform heat exchange. A spider web groove 21 is formed on the upper surface of the support plate 20. The spider web groove 21 can be filled with pure water, which can be ultrapure water. The freezing point of the antifreeze is lower than that of pure water, which has a freezing point of 0°C. The temperature of the antifreeze is below 0°C, and the heat generated by the crystal ingot 70 during processing is absorbed by the ice layer and continues to be transferred to the antifreeze in the base 10. Under the action of antifreeze, the temperature of the pure water in the spider web tank 21 drops to 0℃ and undergoes a phase change to freeze. The ice layer not only provides a strong normal adsorption force to adsorb the ingot 70 to be processed, but also acts as an excellent heat conductor, rapidly transferring the heat of the ingot 70 to the antifreeze flowing inside the base 10, thus maintaining the ice layer in a frozen state and ensuring the adsorption of the ingot 70 (such as...). Figure 8 As shown, the dashed line with the arrow indicates non-contact cooling.

[0029] This application uses antifreeze as the circulating medium, which prevents freezing and blockage even at extremely low operating temperatures (below 0°C), ensuring continuous transmission. The antifreeze and pure water are used to absorb the heat from the ingot 70 to be processed and to remove the heat from the ingot 70.

[0030] The dimensions of the base 10 and the support plate 20 can be configured according to the size of the crystal ingot; for example, the diameters of the base 10 and the support plate 20 can range from 100mm to 500mm. The crystal ingot is typically machined into a circular shape, and the support plate 20 can also be a circular plate. Both the double-helix flow channel 11 and the spiderweb groove 21 are circular. This ensures that the antifreeze is evenly distributed within the base 10 with no dead angles, greatly eliminating local hot spots and ensuring a high degree of temperature uniformity on the support surface of the support plate 20. The depth of the double-helix flow channel 11 is greater than the depth of the spiderweb groove 21.

[0031] In a preferred embodiment of the present invention, the flatness of the upper surface of the bearing disk 20 is less than or equal to 0.01 mm.

[0032] Specifically, the upper surface of the support plate 20 is subjected to ultra-precision grinding, with a flatness controlled to ≤0.01mm, to ensure that the ice layer formed after pure water freezes is of uniform thickness, thereby ensuring the flatness of the crystal ingot after adsorption. The support plate 20 is provided with through holes evenly distributed around its circumference, and is connected to the base 10 with screws.

[0033] In a preferred implementation of this invention, such as Figure 7 As shown, the spider web groove 21 includes: Concentric annular groove 211 and radial radial groove 212; The radial radiating groove 212 is connected to each concentric annular groove 211.

[0034] Specifically, there are multiple concentric annular grooves 211, which are arranged concentrically. There are multiple radially radiating grooves 212, which are evenly distributed radially. The multiple concentric annular grooves and the multiple radially radiating grooves 212 form a spider web-like three-dimensional grid.

[0035] In a preferred implementation of this invention, such as Figure 1 and Figure 4 As shown, the base 10 is provided with an inlet port 12 and an outlet port 13; the double helix flow channel 11 includes: Entering the spiral flow channel 111 and exiting the spiral flow channel 112; The inlet port 12, the inlet spiral channel 111, the outlet spiral channel 112 and the outlet port 13 are connected in sequence; the inlet spiral channel 111 and the outlet spiral channel 112 spiral alternately.

[0036] Specifically, inlet 12 allows antifreeze to enter, and outlet 13 allows antifreeze to exit. Inlet 12 can be connected to the first circulation pump 32 of the antifreeze delivery device 30, and outlet 13 can be connected to the antifreeze tank 31 of the antifreeze delivery device 30. The first circulation pump 32 is connected to the antifreeze tank 31 and pumps the antifreeze in the antifreeze tank 31 from inlet 12 into the double helix flow channel 11. The antifreeze discharged from the double helix flow channel 11 flows back to the antifreeze tank 31 through outlet 13, thus forming a circulation loop. The antifreeze tank 31 is equipped with a first refrigeration unit 33, which controls the temperature of the antifreeze in the antifreeze tank 31.

[0037] The double helical flow channel 11 is divided into an inlet helical flow channel 111 and an outlet helical flow channel 112. The inlet port 12, the inlet helical flow channel 111, the outlet helical flow channel 112, and the outlet port 13 are connected in sequence. The antifreeze enters through the inlet port 12, passes through the inlet helical flow channel 111, then through the outlet helical flow channel 112, and finally exits through the outlet port 13. Both the inlet helical flow channel 111 and the outlet helical flow channel 112 are helical, and they are alternately distributed.

[0038] In a preferred implementation of this invention, such as Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, the base 10 includes: The seat 14, wherein the double helical flow channel 11 is formed on the upper surface of the seat 14; The connection between the inlet spiral channel 111 and the outlet spiral channel 112 is located at the center or edge of the seat 14.

[0039] Specifically, the base 14 is connected to the support plate 20, and a double helical flow channel 11 is formed on the upper surface of the base 14. The inlet helical flow channel 111 and the outlet helical flow channel 112 are connected, and the connection point between the inlet helical flow channel 111 and the outlet helical flow channel 112 is located at the center or edge of the base 14. When the connection point between the inlet helical flow channel 111 and the outlet helical flow channel 112 is located at the center of the base 14, the inlet of the inlet helical flow channel 111 is located at the edge of the base 14, which facilitates the configuration of the inlet interface 12 on the base 14; the outlet of the outlet helical flow channel 112 is located at the edge of the base 14, which facilitates the configuration of the outlet interface 13 on the base 14. When the connection point between the inlet helical flow channel 111 and the outlet helical flow channel 112 is located at the center of the base 14, the base 14 is a fixed base, and an extension is formed at the bottom of the base 14. The extension can form a square plate, and mounting holes are provided at the four corners of the square plate. It is firmly fixed to the machine tool worktable by high-strength bolts. The base 10 not only provides rigid support, but also serves as the positioning reference for the entire fixture, ensuring stability during the machining process. The inlet port 12 and outlet port 13 are located on the side of the base 14, for seamless connection to external refrigeration pipes, which are connected to the antifreeze tank 31.

[0040] In a preferred implementation of this invention, such as Figures 5-6 As shown, when the connection between the inlet spiral channel 111 and the outlet spiral channel 112 is located at the edge of the base 14, the base 10 further includes: A shaft portion 15 is formed on the lower surface of the base body 14; A shaft inner sleeve 16 is disposed on the shaft portion 15; A shaft sleeve 17 is fitted over the inner shaft sleeve 16 and is rotatably connected to the shaft portion 15. The inner sleeve 16 forms an inlet connecting channel and an outlet connecting channel; an inlet isolation cavity and an outlet isolation cavity are formed between the inner sleeve 16 and the outer sleeve 17; the inlet interface 12 is disposed on the outer sleeve 17, and the inlet interface 12, the inlet isolation cavity, the inlet connecting channel and the inlet spiral channel 111 are sequentially connected; the outlet interface 13 is disposed on the outer sleeve 17, and the outlet interface 13, the outlet isolation cavity, the outlet connecting channel and the outlet spiral channel 112 are sequentially connected.

[0041] Specifically, when the connection between the inlet spiral flow channel 111 and the outlet spiral flow channel 112 is located at the edge of the seat 14, the inlet of the inlet spiral flow channel 111 and the outlet of the outlet spiral flow channel 112 are located at the center of the seat 14 and extend to the shaft portion 15. The inlet of the inlet spiral flow channel 111 connects to the inlet connecting flow channel, and the outlet of the outlet spiral flow channel 112 connects to the outlet connecting flow channel. The inner shaft sleeve 16 and the outer shaft sleeve 17 are tightly fitted together. Alternatively, a dynamic sealing structure, such as a sealed bearing, can be provided on the outer sleeve of the inner shaft sleeve 16 to separate the inlet isolation chamber and the outlet isolation chamber. The shaft portion 15, the seat 14, and the double spiral flow channel 11 are all coaxially arranged. The inlet isolation chamber is annular and surrounds the inner shaft sleeve 16; the outlet isolation chamber is annular and surrounds the inner shaft sleeve 16.

[0042] The outer sleeve 17 remains fixed, while the inner sleeve 16, shaft portion 15, base 14, bearing plate 20, and ingot 70 to be processed can rotate at high speed under the action of the drive mechanism. The shaft portion 15 is connected to the drive mechanism to realize the rotation of the shaft portion 15. The drive mechanism can be an external cylindrical grinding machine, which rigidly connects and precisely positions the shaft portion 15 to the rotary spindle or worktable of the external cylindrical grinding machine.

[0043] In a preferred implementation of this invention, such as Figure 5 As shown, the base 10 also includes: The first sealed bearing 18 enables the rotational connection between the outer sleeve 17 and the shaft portion 15; The second sealed bearing 19 enables the rotational connection between the outer sleeve 17 and the shaft portion 15; The first sealing bearing 18 seals the inlet isolation chamber; the second sealing bearing 19 seals the outlet isolation chamber.

[0044] Specifically, the upper half of the inner shaft sleeve 16, the upper half of the outer shaft sleeve 17, and the first sealed bearing 18 surround to form an inlet isolation chamber. The outer ring of the first sealed bearing 18 forms a primary barrier against the antifreeze entering the isolation chamber, and the seal of the first sealed bearing 18 forms a secondary barrier against the antifreeze entering the isolation chamber. The lower half of the inner shaft sleeve 16, the lower half of the outer shaft sleeve 17, and the second sealed bearing 19 surround to form a outlet isolation chamber. The outer ring of the second sealed bearing 19 forms a primary barrier against the antifreeze exiting the isolation chamber, and the seal of the second sealed bearing 19 forms a secondary barrier against the antifreeze exiting the isolation chamber. The first sealed bearing 18 and the second sealed bearing 19 can be high-precision angular contact ball bearings or cylindrical roller bearings. This sealed bearing can support the high-speed rotation of the circular bearing plate 20 and the ingot, while ensuring extremely high concentricity of the fluid rotary joint clearance to prevent refrigerant leakage.

[0045] Based on the cryogenic adsorption fixture device for ingot processing described in any of the above embodiments, the present invention also provides a preferred embodiment of an ingot processing system.

[0046] like Figure 8 As shown, the ingot processing system of this invention includes: The cryogenic adsorption fixture device for crystal ingot processing as described in any of the above embodiments; Antifreeze delivery device 30 provides antifreeze to the double helix flow channel 11; The spraying device 40 sprays the crystal ingot 70 to be processed on the cryogenic adsorption fixture device for crystal ingot processing. The processing device processes the ingot 70 to be processed; A non-contact thermometer 50 is used to measure the temperature of the ingot 70 to be processed; The freezing point of the antifreeze is lower than that of the spray liquid in the spraying device 40, and the freezing point of the spray liquid is lower than 0°C.

[0047] Specifically, the antifreeze delivery device 30 is used to deliver antifreeze to the cryogenic adsorption fixture device. The antifreeze delivery device 30 includes an antifreeze tank 31, a first circulation pump 32, and a first refrigeration unit 33. The first refrigeration unit 33 adjusts the temperature of the antifreeze in the antifreeze tank 31, and the first circulation pump 32 pumps the antifreeze from the antifreeze tank 31 into the cryogenic adsorption fixture device. The spraying device 40 is used to spray and cool the ingot 70 to be processed. The spraying device 40 includes a spray liquid tank 41, a second circulation pump 42, a second refrigeration unit 43, and nozzles 44. The second refrigeration unit 43 adjusts the temperature of the spray liquid in the spray liquid tank 41, and the second circulation pump 42 pumps the spray liquid into the nozzles 44 and sprays it onto the ingot 70 to be processed. The spray liquid can also be sprayed onto the processing device to cool it down. The processing apparatus is used to process the ingot 70 to be processed. The processing apparatus includes at least one of the following: a surface grinding apparatus, a grooving apparatus, a rounding apparatus, and a slicing apparatus. The surface grinding apparatus grinds and polishes the ingot 70 to be processed; the grooving apparatus grooves the ingot 70 to be processed; the rounding apparatus rounds the edges of the ingot 70 to be processed; and the slicing apparatus slices the ingot 70 to be processed. Slicing can be done by wire cutting or laser cutting, and the slicing apparatus includes wire cutting and laser slicing apparatuses. The non-contact temperature measuring instrument 50 can be a non-contact infrared temperature measuring instrument.

[0048] The ingot processing system forms a physically isolated two-stage dual-circulation loop, specifically a primary cold source loop, a secondary bonding layer cold source, and an external processing cooling loop. The primary cold source loop is an antifreeze loop. Antifreeze in the antifreeze tank 31 flows through the first circulation pump 32 to the double-helix flow channel 11 and then back to the antifreeze tank 31. Utilizing the extremely low freezing point of the antifreeze, ice blockage in the double-helix flow channel 11 is avoided, ensuring the continuity of the primary cold source transmission. The secondary bonding layer cold source is the ice layer in the spiderweb groove 21. Utilizing the property of pure water freezing at 0℃, an extremely thin and uniform ice layer is formed. This ice layer not only provides strong normal adsorption force but also acts as an excellent heat conductor, rapidly transferring heat from the ingot to the internally flowing antifreeze. The external processing cooling loop is a spray fluid loop. To address the large amount of heat generated during grinding and cutting, the system is equipped with an independent spray fluid circulation system. The spray liquid in the spray liquid tank 41, after reaching the ingot 70 to be processed via the second circulation pump 42, flows back into the spray liquid tank 41. It directly acts on the processing area via spraying, carrying away the frictional heat between the grinding wheel and the ingot surface. This achieves a balance between cooling the grinding wheel with spray liquid and preventing the ice layer from melting. The external spray liquid removes most of the heat without freezing, while the internal refrigerant counteracts conductive heat. Infrared feedback enables on-demand cooling, saving energy and preventing thermal cracking.

[0049] A non-contact thermometer 50 detects the temperature of the ingot 70 or the surface of the grinding wheel to be processed, and feeds the signal back to the PLC (Programmable Logic Controller) / industrial computer control unit to adjust the cooling output to maintain ice layer stability. The control unit 60 dynamically adjusts the power output of the refrigeration unit and the speed of the circulating pump based on the deviation between the real-time measured temperature and the set temperature using a PID (Proportional-Integral-Derivative) algorithm. During laser processing, the antifreeze delivery device 30 is activated, and the spray device 40 is deactivated to prevent the spray liquid from interfering with the optical path. During other processing stages, both the antifreeze delivery device 30 and the spray device 40 can be activated simultaneously.

[0050] This application has the following technical effects: 1. High clamping accuracy, no stress damage: By utilizing the high flatness of the support plate (≤0.01mm) and the uniform flow channel, the thickness of the ice layer at the interface is consistent and the adsorption force is uniform. Compared with traditional mechanical clamps, this flexible clamping avoids local stress concentration and effectively prevents microcracks or edge chipping of the ingot.

[0051] 2. Fast temperature control response to prevent thermal cracking: By using a non-contact temperature sensor for real-time feedback and a two-stage dual-loop temperature control system, the processing heat can be quickly dissipated, avoiding thermal stress caused by excessive temperature differences on the crystal ingot surface, thus eliminating the risk of crystal ingot cracking due to thermal shock.

[0052] 3. Pipelines do not freeze, and operation is stable: It adopts a dual-medium isolation design of "internal circulation antifreeze and external contact with pure water". The internal flow channel always uses a low freezing point medium, which fundamentally solves the problem of cooling pipes being prone to freezing and clogging in cryogenic environments, ensuring long-term continuous operation of the equipment.

[0053] 4. Cooling on demand, energy-efficient and highly effective: Closed-loop control based on temperature feedback enables "on-demand cooling." The system can automatically adjust the cooling power according to the heat load changes under different working conditions such as laser abrasion or grinding, avoiding ineffective energy consumption and significantly improving the energy efficiency ratio.

[0054] Based on the ingot processing system described in any of the above embodiments, the present invention also provides a preferred embodiment of the ingot processing method of the ingot processing system.

[0055] The ingot processing method of this invention includes the following steps: Step S100: Spray pure water onto the upper surface of the carrier plate, place the crystal ingot to be processed on the upper surface of the carrier plate, and supply antifreeze to the double spiral channel through the antifreeze delivery device. Step S200: The ingot to be processed is processed using a processing device; during the processing, the spray device is controlled to spray the ingot to be processed, and the temperature of the ingot to be processed is measured by a non-contact thermometer, and the cooling power of the spray device and the antifreeze delivery device is adjusted based on the measured temperature; the processing device includes at least one of a flat grinding device, a rounding device, and a grooving device.

[0056] Specifically, pure water is first sprayed onto the upper surface of the support plate; a small amount of pure water can be sprayed using a spraying device. Then, the ingot to be processed is placed on the support plate, and the antifreeze delivery device is controlled to deliver antifreeze into the double-helix flow channel, causing the pure water on the upper surface of the support plate to undergo a phase change, forming an ice layer that adsorbs the ingot. The ingot is then processed using a processing device. According to the ingot processing flow, the end faces of the ingot need to be flat-ground and the outer diameter of the ingot needs to be rounded. Afterward, the ingot is sliced ​​to obtain wafers, and the surface of the wafers is flat-ground. Flat-ground grinding and surface grinding require a flat-ground grinding device. Rounding grinding requires a rounding grinding device. Both the flat-ground grinding device and the rounding grinding device include grinding wheels. Diamond grinding wheels can be used.

[0057] The antifreeze includes an antifreeze agent and water. The antifreeze agent includes ethylene glycol, and the water can be deionized water. The spraying fluid includes cutting fluid or water, and also includes an organic antifreeze agent, which includes at least one of ethylene glycol, propylene glycol, and glycerol. The water can be deionized water. The freezing point of the antifreeze is below -30°C, and the freezing point of the spraying fluid is -5°C to -10°C. Since the antifreeze is at a temperature of -5°C to -30°C, it remains liquid and will not undergo a phase change to form a solid. The temperature of the spraying fluid in the spraying device is 1°C to 4°C, so even if the spraying fluid is sprayed onto the cryogenic adsorption fixture, it is unlikely to solidify and clog the edges of the ingot or the support plate. The spraying fluid can be sprayed onto the processing area to remove the frictional heat between the grinding wheel and the surface of the ingot. The volumetric flow rate of the spray is adjusted to 1.5 to 2.5 times that of conventional grinding (preferably above 20 L / min). By utilizing the dynamic shear force and high specific heat capacity of the high-flow-rate cutting fluid, the physical boundary layer of ice is forcibly destroyed. This causes the general cutting fluid to be discharged before it can freeze due to the high flow rate when it comes into contact with the disc at 1 to 4°C. This achieves the same technical effect of preventing the cutting fluid itself from freezing without damaging the interface ice layer.

[0058] The surface grinding process is as follows: Preparation and clamping: Place the silicon carbide ingot to be processed in the center of the circular support plate of the cryogenic fixture. Turn on the internal circulation pump to introduce antifreeze at -15°C; at the same time, spray a small amount of ultrapure water onto the surface of the support plate.

[0059] Ice adsorption: Based on the high flatness of the bearing plate (≤0.01mm) and the uniform heat exchange of the double spiral flow channel, the ultrapure water on the contact surface forms a uniformly thick micro ice layer within 30 seconds, which firmly adsorbs the crystal ingot without mechanical stress concentration.

[0060] Surface grinding: Start the surface grinder and use the diamond grinding wheel to grind the upper surface of the ingot.

[0061] Thermal feedback control: A large amount of grinding heat is generated during the grinding process, and an infrared thermometer monitors the surface temperature of the ingot in real time. When a local temperature rise is detected, the control system automatically increases the flow rate of the antifreeze spray or decreases the temperature, maintaining a stable ice layer thickness through "on-demand cooling" to prevent the ingot from cracking or flying out due to thermal stress.

[0062] Material preparation: After processing, turn off the internal cooling and turn on the micro heating function of the support plate (or let it warm up naturally). Once the ice layer melts, remove the crystal ingot and flip it over. Repeat the above steps to process the other end face.

[0063] The rounding process is as follows: Vertical clamping: The crystal ingot is vertically mounted on the cryogenic fixture through the end face (the fixture is placed horizontally on the spindle of the rotary grinding machine).

[0064] Strong Adsorption: Due to the large radial cutting force during the rounding process, the system sets the antifreeze temperature to -20℃ and utilizes the deep ice crystal anchoring effect to provide extremely high normal adsorption force and tangential shear resistance.

[0065] Rolling grinding: The grinding wheel feeds along the outer periphery of the ingot.

[0066] Dynamic temperature control: The rounding process is under continuous high heat load. When the infrared sensor detects the overall temperature rise of the ingot, the closed-loop control system instructs the refrigeration unit to operate at full power to ensure a constant surface temperature of the fixture, preventing the ingot from slipping due to local melting of ice, and ensuring cylindricity accuracy.

[0067] Positioning edge machining: After the outer circle of the ingot is ground, the spindle indexing stops, the grinding wheel cuts into the positioning edge, and the material is unloaded after completion.

[0068] The ingot processing method also includes the following steps: Step S300: Modify the ingot to be processed using a laser slicing processing device, and peel off the ingot to obtain a wafer using an ultrasonic peeling device.

[0069] Specifically, when using a laser slicing device for slicing, the laser forms a modified layer on the end face of the ingot to be processed. Then, an ultrasonic peeling device can be used to peel it off to obtain a wafer.

[0070] In the laser lift-off process without spraying liquid, a shallow grid of ice on the disk surface is used as a high-specific-heat-capacity heat sink to directly absorb the instantaneous thermal stress generated by the laser. The fixture materials are transformed into functional materials, effectively preventing wafer breakage during laser lift-off and broadening the process window for laser processing.

[0071] The laser slicing and retrieval process is as follows: Precision adsorption: The rounded crystal ingot is adsorbed onto the surface of the fixture, and the adsorption temperature is set to -10℃ (light freezing mode) to ensure that the adsorption is flat and does not damage the crystal lattice.

[0072] Laser processing: The laser head is focused on the interior or surface of the crystal ingot to perform scanning modification.

[0073] Low-energy operation: Laser processing generates less and more concentrated heat. The infrared temperature measurement system detects a low heat load and automatically reduces the cooling power, precisely cooling only the area around the laser's point of action to remove excess heat.

[0074] Separation: After processing, the separated wafers are removed by ultrasonic peeling.

[0075] The preferred embodiment uses the processing of hard, brittle, non-magnetic silicon carbide (SiC) ingots as an example for detailed explanation. However, the three-dimensional mechanical anchoring structure and dual-loop closed-loop temperature control architecture of this device have universal physical adsorption and heat dissipation enhancement characteristics, and its application scope is not limited to silicon carbide crystal processing. The materials of the ingots to be processed include, but are not limited to, flat grinding, rounding, slicing, or laser ablation of crystals such as gallium nitride (GaN), diamond, sapphire (Al2O3), gallium oxide (Ga2O3), silicon (Si) ingots, gallium arsenide (GaAs), and indium phosphide (InP). The processing method of this application can also be applied to the precision clamping and heat exchange processing of rough or porous non-magnetic materials such as porous ceramic matrix composites (CMC) and carbon fiber composites. The processing method of this application can also be applied to quartz glass, optical lenses, piezoelectric ceramic sheets, etc. By utilizing the flexible stress-free cryogenic clamping of this invention, stress fracture and surface contamination of such ultra-thin materials during processing can be completely avoided.

[0076] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A cryogenic adsorption fixture device for ingot processing, characterized in that, include: A base, wherein a double helical flow channel is formed on the upper surface of the base; A support plate is disposed on the upper surface of the base; The double helix flow channel is for the antifreeze to pass through; The support plate is used to support the crystal ingot to be processed; The upper surface of the carrier plate is formed with a spider web groove, which is configured to hold pure water. The pure water forms an ice layer under the action of the antifreeze to mechanically fit the crystal ingot to be processed.

2. The cryogenic adsorption fixture device for ingot processing according to claim 1, characterized in that, The flatness of the upper surface of the bearing plate is less than or equal to 0.01 mm; the spider web groove includes: Concentric annular grooves and radial radial grooves; The radial radiating groove is connected to each concentric annular groove.

3. The cryogenic adsorption fixture device for ingot processing according to any one of claims 1 to 2, characterized in that, The base is provided with an inlet and an outlet; the double helix flow channel includes: Entering and exiting the spiral flow channel; The inlet interface, the inlet spiral flow channel, the outlet spiral flow channel, and the outlet interface are connected in sequence. The inlet spiral channel and the outlet spiral channel alternate spiraling.

4. The cryogenic adsorption fixture device for ingot processing according to claim 3, characterized in that, The base includes: The seat body, wherein the double helical flow channel is formed on the upper surface of the seat body; The connection between the inlet spiral channel and the outlet spiral channel is located at the center or edge of the seat.

5. The cryogenic adsorption fixture device for ingot processing according to claim 4, characterized in that, When the connection between the inlet spiral channel and the outlet spiral channel is located at the edge of the base, the base further includes: A shaft portion is formed on the lower surface of the base body; A shaft inner sleeve is disposed on the shaft portion; A shaft sleeve is fitted over the inner shaft sleeve and is rotatably connected to the shaft portion. The inner sleeve of the shaft forms an inlet connecting channel and an outlet connecting channel; An inlet isolation cavity and an outlet isolation cavity are formed between the inner shaft sleeve and the outer shaft sleeve; The inlet is disposed on the outer sleeve of the shaft, and the inlet, the inlet isolation cavity, the inlet connecting channel and the inlet spiral channel are connected in sequence; The discharge port is disposed on the outer sleeve of the shaft, and the discharge port, the discharge isolation cavity, the discharge connecting channel and the discharge spiral channel are connected in sequence.

6. The cryogenic adsorption fixture device for ingot processing according to claim 5, characterized in that, The base also includes: The first sealed bearing enables a rotatable connection between the outer sleeve of the shaft and the shaft portion; The second sealed bearing enables a rotatable connection between the outer sleeve of the shaft and the shaft portion; The first sealing bearing seals the entry into the isolation cavity; The second sealing bearing seals the discharge isolation chamber.

7. A crystal ingot processing system, characterized in that, include: The cryogenic adsorption fixture device for ingot processing as described in any one of claims 1 to 6; Antifreeze delivery device, providing antifreeze to the double spiral flow channel; A spraying device sprays the crystal ingots to be processed on the cryogenic adsorption fixture device used for crystal ingot processing. The processing device processes the crystal ingot to be processed; A non-contact thermometer is used to measure the temperature of the ingot to be processed; The freezing point of the antifreeze is lower than that of the spray liquid in the spraying device, and the freezing point of the spray liquid is lower than 0°C.

8. A method for processing an ingot using the ingot processing system as described in claim 7, characterized in that, Including the following steps: Pure water is sprayed onto the upper surface of the support plate, and the crystal ingot to be processed is placed on the upper surface of the support plate. Antifreeze is supplied to the double spiral channel through the antifreeze delivery device. The ingot to be processed is processed using a processing device; during the processing, a spray device is controlled to spray the ingot to be processed, and the temperature of the ingot to be processed is measured by a non-contact thermometer. The cooling power of the spray device and the antifreeze delivery device is adjusted based on the measured temperature; the processing device includes at least one of a flat grinding device, a grooving device, a rounding device, and a slicing device.

9. The ingot processing method of the ingot processing system according to claim 8, characterized in that, The temperature of the antifreeze is -5℃ to -30℃, and the temperature of the spray liquid in the spraying device is 1℃ to 4℃.

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