Intaglio printing plate and method for manufacturing the same

Abstract

Provided are a gravure printing plate achieving an improvement in durability and a manufacturing method thereof. A manufacturing method of a gravure printing plate for printing a paste used in an electronic component includes the steps of: preparing a base material having a cylindrical shape or a columnar shape, the base material having a printing pattern composed of a plurality of lands and a plurality of recesses divided by the plurality of lands provided on an outer peripheral surface; forming a plating layer on the outer peripheral surface of the base material so as to cover the plurality of recesses and the plurality of lands; grinding a surface layer portion of a portion of the plating layer covering the lands in a state where the plating layer is formed on the outer peripheral surface of the base material; and forming a carbon film on the plating layer in a state where the surface layer portion of the portion of the plating layer covering the lands is ground.

Description

Technical Field

[0001] This invention relates to gravure printing plates for printing pastes used in electronic components and methods for manufacturing the same. Background Technology

[0002] For example, Japanese Patent Application Publication No. 2012-66559 (Patent Document 1) discloses a generally cylindrical gravure printing plate with multiple recesses on its peripheral surface. This gravure printing plate is used in the manufacture of electronic components. For example, in the manufacture of multilayer ceramic capacitors, firstly, the gravure printing plate is immersed in a paste tank containing paste that serves as the internal electrode, thereby filling the recesses of the gravure printing plate with paste. Next, by sliding a squeegee against the outer peripheral surface of the gravure printing plate, the remaining portion of the paste filling the recesses is scraped off. Then, an appropriate amount of paste filling the recesses is transferred onto a green film.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-66559 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In the gravure printing plate described in Patent Document 1 above, there is a concern that the lifespan of the gravure printing plate may be reduced because the squeegee slides into contact with the outer peripheral surface of the gravure printing plate as described above, causing wear on the outer peripheral surface.

[0008] Therefore, the present invention was made to solve the above-mentioned problems, and its object is to provide a gravure printing plate with improved durability and a method for manufacturing the same.

[0009] Methods for solving problems

[0010] The gravure printing plate manufacturing method based on the present invention is a method for manufacturing a gravure printing plate for printing paste used in electronic components. The gravure printing plate manufacturing method based on the present invention includes the following steps: preparing a substrate having a cylindrical or cylindrical shape, and having a printing pattern formed on its outer peripheral surface by a plurality of ridges and a plurality of recesses divided by the ridges; forming a plating layer on the outer peripheral surface of the substrate to cover the plurality of recesses and the plurality of ridges; grinding the surface portion of the plating layer covering the ridges while the plating layer is formed on the outer peripheral surface of the substrate; and forming a carbon film on the plating layer while the surface portion of the plating layer covering the ridges is ground.

[0011] The gravure printing plate according to the present invention is a gravure printing plate for printing pastes used in electronic components. The gravure printing plate according to the present invention comprises a substrate, a plating layer, and a carbon film. The substrate has a cylindrical or cylindrical shape, and a printing pattern formed by a plurality of ridges and a plurality of recesses divided by the ridges is provided on its outer peripheral surface. The plating layer is provided on the outer peripheral surface of the substrate to cover the plurality of recesses and the plurality of ridges. The carbon film is provided on the plating layer. The outer peripheral surface of the substrate has a first surface, a second surface, and a third surface connecting the first surface and the second surface. The first surface constitutes the ridge. The second surface constitutes the bottom surface of the recess. The third surface constitutes the side surface of the recess. Viewed circumferentially from the substrate, on the surface of the plating layer on the carbon film side, the portion covering the second surface and the portion covering the third surface are curved and continuous. Viewed circumferentially from the substrate, on the surface of the carbon film opposite to the coating layer side, the portion of the coating layer covering the portion covering the second surface and the portion of the coating layer covering the portion covering the third surface are curvedly continuous. Viewed circumferentially from the substrate, on the surface of the coating layer on the carbon film side, the portion covering the first surface is formed by a flat surface. Viewed circumferentially from the substrate, on the surface of the carbon film opposite to the coating layer side, the portion of the coating layer covering the portion covering the first surface is formed by a flat surface.

[0012] In the gravure printing plate based on the present invention, the thickness of the plating layer covering the portion of the first side may be smaller than the thickness of the plating layer covering the portion of the third side.

[0013] In the gravure printing plate based on the present invention, when viewed from the circumferential direction of the substrate, the portion covering the third side of the coating layer on the carbon film side can also be bent and continuous with the portion covering the first side.

[0014] In the gravure printing plate based on the present invention, the coating layer may be a Cr coating layer, and the carbon film may be a DLC film.

[0015] In the gravure printing plate based on the present invention, the thickness of the coating layer covering the portion of the third side can be 5 μm or more.

[0016] In the gravure printing plate based on the present invention, the portion covering the first surface on the carbon film side of the coating layer can also be a ground surface.

[0017] Invention Effects

[0018] According to the present invention, a gravure printing plate with improved durability and a method for manufacturing the same can be provided. Attached Figure Description

[0019] Figure 1 This is a schematic diagram showing a gravure printing apparatus equipped with the gravure printing plate according to the embodiment.

[0020] Figure 2 yes Figure 1 The image shown is a three-dimensional representation of the intaglio printing plate.

[0021] Figure 3 It is Figure 1 The image shown is a magnified schematic diagram of a portion of the printed pattern on the gravure printing plate.

[0022] Figure 4 It is along Figure 3 A schematic cross-sectional view of line IV-IV in the diagram.

[0023] Figure 5 This is a flowchart illustrating a method for manufacturing a gravure printing plate according to the embodiments.

[0024] Figure 6 It means Figure 5 A schematic cross-sectional view of the process.

[0025] Figure 7 It means Figure 5 A schematic cross-sectional view of the process.

[0026] Figure 8 It means Figure 5 A schematic cross-sectional view of the process.

[0027] Figure 9 It is a perspective view schematically showing the appearance of a laminated electronic component manufactured using the gravure printing plate involved in the embodiment.

[0028] Figure 10 It is along Figure 9 A schematic cross-sectional view of the XX line shown.

[0029] Figure 11 It is along Figure 9 A schematic cross-sectional view of the XI-XI line shown.

[0030] Figure 12 This is a flowchart illustrating a method for manufacturing a laminated electronic component using a gravure printing plate as described in the embodiment.

[0031] Explanation of reference numerals in the attached figures

[0032] 1 Gravure printing apparatus, 10 Gravure printing plate, 11 Substrate, 11a Outer peripheral surface, 12 Coating layer, 12a First coating layer surface, 12b Second coating layer surface, 12c Third coating layer surface, 13 Carbon film, 13a First carbon film surface, 13b Second carbon film surface, 13c Third carbon film surface, 20 Support roller, 30 Paste trough, 31 Conductive paste, 40 Squeegee, 50 Green sheet, 50a Dielectric sheet, 51 Electrode pattern, 100 Printed pattern, 101 Embankment, 102 Longitudinal embankment, 103 Transverse embankment, 105 Recess, 111 First surface, 112 Second surface, 113 Third surface, 1000 Multilayer ceramic capacitor, 1100 Body, 1110 First main surface, 1120 Second main surface, 1130 First side surface, 1140 Second side surface, 1150 First end face, 1160 Second end face, 1200 First external electrode, 1300 Second external electrode, 1400 Dielectric layer, 1500 Internal electrode layer, 1510 First internal electrode layer, 1520 Second internal electrode layer, C Inner layer, N Clamping part. Detailed Implementation

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the embodiments shown below, the same or common reference numerals in the drawings will not be repeated.

[0034] (Implementation Method)

[0035] <A. A general structure of gravure printing plates and gravure printing apparatus>

[0036] Figure 1 This is a schematic diagram showing a gravure printing apparatus equipped with the gravure printing plate according to the embodiment. Figure 2 yes Figure 1 The image shown is a three-dimensional representation of the intaglio printing plate. First, refer to... Figure 1 as well as Figure 2 The general structure of the gravure printing plate 10 and the gravure printing apparatus 1 equipped with the gravure printing plate 10 according to this embodiment will be described.

[0037] like Figure 1 as well as Figure 2 As shown, the gravure printing apparatus 1 includes a gravure printing plate 10, a support roller 20, a paste trough 30, and a scraper 40.

[0038] The gravure printing plate 10 has a cylindrical or cylindrical shape. The gravure printing plate 10 is configured to be able to... Figure 1 The arrow AR1 rotates in the direction of the center. Multiple printed patterns 100 are provided on the outer peripheral surface 11a of the substrate 11 of the gravure printing plate 10. Figure 2 Two of the multiple printed patterns 100 appear in the middle. The substrate 11 will be described in detail later.

[0039] The diameter of the gravure printing plate 10 is set to, for example, 80 mm or more and 400 mm or less. The width dimension of the gravure printing plate 10 parallel to the axis is set to, for example, 150 mm or more and 300 mm or less.

[0040] The support roller 20 has a cylindrical or cylindrical shape. The support roller 20 is configured to be able to move along... Figure 1 Rotate in the direction of arrow AR2 (i.e., in the opposite direction to the rotation direction of the gravure printing plate 10).

[0041] The gravure printing plate 10 and the support roller 20 are arranged opposite each other to form a clamping portion N. The green sheet 50 passes through the clamping portion N so that a dielectric sheet 50a is clamped in the clamping portion N.

[0042] Conductive paste 31 is stored in paste trough 30. A portion of gravure printing plate 10 is immersed in conductive paste 31. When performing gravure printing using gravure printing plate 10, by rotating gravure printing plate 10, multiple recesses 105 (see below) are formed. Figure 3 ) is filled with conductive paste 31.

[0043] The squeegee 40 is positioned downstream of the paste trough 30 in the rotation direction of the gravure printing plate 10. The squeegee 40 slides against the gravure printing plate 10 with a given pressure. The squeegee 40 scrapes away any remaining portion of the conductive paste 31 adhering to the gravure printing plate 10.

[0044] In the gravure printing plate 10, which is maintained in a suitable amount of conductive paste 31 by the squeegee 40, the conductive paste 31 filling the plurality of recesses 105 and the conductive paste 31 adhering to the plurality of embankments 101 that divide the plurality of recesses 105 from each other are transferred to the green film 50 at the clamping part N. As a result, the electrode pattern 51 corresponding to the printed pattern 100 is printed on the green film 50.

[0045] <B. Detailed Structure of Gravure Printing Plates>

[0046] Figure 3 It is Figure 1 The image shown is a magnified schematic diagram of a portion of the printed pattern on the gravure printing plate. Figure 4 It is along Figure 3 A schematic cross-sectional view of line IV-IV in the diagram. More specifically, Figure 4 This is a cross-section near the central portion of the longitudinal section of the gravure printing plate in the circumferential direction, parallel to both the depth direction of the recess and the axial direction of the gravure printing plate. The longitudinal section and the recess will be discussed later. Next, refer to... Figure 3 as well as Figure 4 The detailed structure of the gravure printing plate 10 is explained. Additionally, in... Figure 3 In the image, the circumference of the intaglio printing plate 10 is indicated by the arrow CD.

[0047] like Figure 3 as well as Figure 4 As shown, the printed pattern 100 is composed of a plurality of ridges 101 and a plurality of recesses 105 divided by the plurality of ridges 101. The ridges 101 and the recesses 105 are disposed on the outer peripheral surface 11a of the substrate 11 of the gravure printing plate 10.

[0048] The plurality of dikes 101 are arranged, for example, in a grid pattern. The plurality of dikes 101 include longitudinal dikes 102 extending along the circumferential direction CD of the gravure printing plate 10 and transverse dikes 103 extending in a direction parallel to the axial direction of the gravure printing plate 10.

[0049] The plurality of recesses 105 are arranged in a matrix, for example, in a row direction parallel to the aforementioned axial direction and a column direction parallel to the circumferential direction CD. Alternatively, adjacent recesses 105 can be connected to each other by providing a notch in at least one of the longitudinal section 102 and the transverse section 103.

[0050] The printed pattern 100 has a generally rectangular shape. However, the shape of the printed pattern 100 is not particularly limited to a generally rectangular shape and can be appropriately changed according to the shape of the electrode pattern 51.

[0051] like Figure 4 As shown, the gravure printing plate 10 has a substrate 11, a plating layer 12 including a metal layer, and a carbon film 13.

[0052] As the substrate 11, a metal roller can be used, for example. The material of this metal roller can be a suitable metal such as stainless steel or copper. The metal roller can be cylindrical or cylindrical. In this embodiment, a copper-containing substrate 11 is used.

[0053] The outer peripheral surface 11a of the substrate 11 has a first surface 111, a second surface 112, and a third surface 113. The first surface 111, the second surface 112, and the third surface 113 are the surfaces of the outer peripheral surface 11a that constitute the portion of the printed pattern 100.

[0054] The first surface 111 forms the embankment 101. The second surface 112 forms the bottom surface of the recess 105. The third surface 113 forms the side surface of the recess 105, connecting the first surface 111 and the second surface 112. In addition, the bottom surface of the recess 105 refers to the outer peripheral surface 11a of the portion located between adjacent embankments 101 that is the deepest part (i.e., the position furthest from the embankment 101 in the depth direction of the recess 105).

[0055] In this embodiment, the first surface 111 and the second surface 112 are flat surfaces, and the third surface 113 is a curved surface. More specifically, the third surface 113 is curved to form a bowl-shaped surface together with the second surface 112.

[0056] The depth h of the recess 105 (specifically, the distance from the outer surface of the carbon film 13 corresponding to the first surface 111 to the outer surface of the carbon film 13 corresponding to the second surface 112) is set to, for example, 5 μm or more and 40 μm or less. In this embodiment, the opening surface of the recess 105 has a rectangular shape when viewed from the normal direction. However, the shape of the opening surface when viewed from the normal direction is not particularly limited to a rectangular shape and can be appropriately varied. The recess 105 is formed, for example, by etching the outer peripheral surface 11a of the substrate 11.

[0057] A plating layer 12 is disposed on the outer peripheral surface 11a to cover the outer peripheral surface 11a of the substrate 11. Thus, the plating layer 12 covers a plurality of embankments 101 and a plurality of recesses 105. The plating layer 12 is made of a high-hardness material, such as Cr. This increases the hardness of the outer peripheral surface 11a. In this embodiment, a plating layer 12 containing Cr plating is used.

[0058] A carbon film 13 is disposed on the coating layer 12. More specifically, the carbon film 13 is disposed on the coating layer 12 covering the portion of the outer peripheral surface 11a of the substrate 11 that includes the first surface 111, the second surface 112, and the third surface 113.

[0059] The carbon coating 13 can be composed of a single layer or multiple layers. The carbon coating 13 is preferably composed of a DLC (Diamond-Like Carbon) film. In this embodiment, a carbon coating 13 comprising a DLC film is used.

[0060] Here, DLC film refers to a film made of a carbon-based material that combines the carbon-carbon bonds of both diamond and graphite. DLC films exhibit high hardness and low friction compared to ordinary materials. For example, compared to stainless steel and copper, which are listed as examples of materials constituting the substrate 11, DLC films have higher hardness and a lower coefficient of friction. DLC films are formed using various known methods such as vapor deposition.

[0061] By using a DLC film with a low coefficient of friction, the residual conductive paste 31 in the recess 105 after transfer is suppressed. Furthermore, by using a high-hardness DLC film, wear on the gravure printing plate 10 during sliding contact between the squeegee 40 and the gravure printing plate 10 is suppressed.

[0062] DLC films can also contain fluorine. As a result, due to the improved water resistance of DLC films, gravure printing plates 10 with excellent transfer properties can be made.

[0063] Silicon can also be incorporated into the interface portion of the DLC film. As a result, the hardness of the DLC film is further increased, thus suppressing the wear of the gravure printing plate 10.

[0064] In addition, the fluorine and silicon contained in the carbon coating 13 can be detected using energy dispersive X-ray spectroscopy (EDX).

[0065] like Figure 4 As shown, the coating layer 12 has a portion covering a first surface 111 of the outer peripheral surface 11a of the substrate 11, a portion covering a second surface 112 of the outer peripheral surface 11a of the substrate 11, and a portion covering a third surface 113 of the outer peripheral surface 11a of the substrate 11. Hereinafter, the surface of the coating layer 12 covering the first surface 111 on the carbon film 13 side will be referred to as the first coating layer surface 12a, the surface of the coating layer 12 covering the second surface 112 on the carbon film 13 side will be referred to as the second coating layer surface 12b, and the surface of the coating layer 12 covering the third surface 113 on the carbon film 13 side will be referred to as the third coating layer surface 12c.

[0066] like Figure 4 As shown, when viewed along the circumferential direction CD of the substrate 11, the surface 12a of the first plating layer is composed of a flat surface. As described later, the surface 12a of the first plating layer is composed of a ground surface. When observed as... Figure 4 In the case of the cross-section shown, as an example, the straightness of the straight portion of the first coating surface 12a can also be managed by the value of the straightness.

[0067] When viewed along the circumferential direction CD of the substrate 11, the surface 12b of the second coating layer is composed of a flat surface. Alternatively, the surface 12b of the second coating layer does not necessarily have to be a flat surface; it may also be composed of a curved surface, or a combination of a flat surface and a curved surface.

[0068] When viewed along the circumferential direction CD of the substrate 11, the surface 12c of the third plating layer is bent and continuous with the surface 12a of the first plating layer. This is because, as described later, the surface portion of the plating layer 12 covering the first surface 111 is ground. When viewed along the circumferential direction CD of the substrate 11, the surface 12c of the third plating layer bends gently and is continuous with the surface 12b of the second plating layer.

[0069] When viewed along the circumferential direction CD of the substrate 11, the surface 12c of the third plating layer is curved such that the slope of its cross section (specifically, the slope relative to the surface 12a of the first plating layer, which is composed of flat surfaces) continuously exists with the portion that increases from the side of the first plating layer surface 12a toward the side of the second plating layer surface 12b, and the portion that decreases from the side of the first plating layer surface 12a toward the side of the second plating layer surface 12b (i.e., having an inflection point).

[0070] like Figure 4 As shown, the thickness t1 of the plating layer 12 covering the portion of the first surface 111 is smaller than the thickness t2 of the plating layer 12 covering the portion of the third surface 113. This is because, as described later, the surface portion of the plating layer 12 covering the portion of the first surface 111 is ground. Here, thickness t1 refers to the thickness of the portion covering the flat surface of the first surface 111 of the substrate 11, along the normal direction of that flat surface. Thickness t2 refers to the thickness of the portion of the plating layer 12 passing through by an imaginary line extending from the flat surface of the first surface 111 of the substrate 11 along the in-plane direction of that flat surface.

[0071] The thickness dimension t2 is preferably 1 μm or more and 12 μm or less. More preferably, the thickness dimension t2 is 3 μm or more, further preferably 5 μm or more, and even more preferably 8 μm or more. By setting the thickness dimension t2 to 3 μm or more, the width dimension (refer to...) of the first coating surface 12a formed by the flat surface can be... Figure 4 The dimension w can be made quite large, for example, it can be set to 5 μm or more. Furthermore, by setting the thickness dimension t2 to 5 μm or more, the dimension w can be made even larger, for example, it can be set to 7 μm or more. Moreover, by setting the thickness dimension t2 to 8 μm or more, the dimension w can be made even larger, for example, it can be set to 10 μm or more.

[0072] The thickness of the coating layer 12 can be confirmed by observing a cross-section near the central portion of the longitudinal embankment 102 on the circumferential CD of the gravure printing plate 10, which is parallel to both the depth direction of the recess 105 and the axial direction of the gravure printing plate 10, using a microscope such as a scanning electron microscope (SEM).

[0073] The carbon film 13 is formed with a substantially uniform thickness along the outer surface of the coating layer 12 constructed as described above. The carbon film 13 has a portion covering the first coating layer surface 12a, a portion covering the second coating layer surface 12b, and a portion covering the third coating layer surface 12c. Hereinafter, the surface of the carbon film 13 covering the portion of the first coating layer surface 12a that is opposite to the coating layer 12 side will be referred to as the first carbon film surface 13a, the surface of the carbon film 13 covering the portion of the second coating layer surface 12b that is opposite to the coating layer 12 side will be referred to as the second carbon film surface 13b, and the surface of the carbon film 13 covering the portion of the third coating layer surface 12c that is opposite to the coating layer 12 side will be referred to as the third carbon film surface 13c.

[0074] When viewed along the circumferential direction CD of the substrate 11, the surface 13a of the first carbon film is composed of a flat surface.

[0075] When viewed along the circumferential direction CD of the substrate 11, the surface 13b of the second carbon film is composed of a flat surface. Alternatively, the surface 13b of the second carbon film does not necessarily need to be flat; it can also be composed of a curved surface, or a combination of both flat and curved surfaces.

[0076] When viewed along the circumferential direction CD of the substrate 11, the third carbon film surface 13c is continuously curved with the first carbon film surface 13a and the second carbon film surface 13b.

[0077] When viewed along the circumferential direction CD of the substrate 11, the third carbon film surface 13c is curved such that the slope of its cross section (specifically, the slope relative to the first carbon film surface 13a, which is composed of flat surfaces) continuously exists with the portion that increases from the first carbon film surface 13a side toward the second carbon film surface 13b side, and the portion that decreases from the first carbon film surface 13a side toward the second carbon film surface 13b side (i.e., having an inflection point).

[0078] <C. Method for manufacturing gravure printing plates>

[0079] Figure 5 This is a flowchart illustrating a method for manufacturing a gravure printing plate according to the embodiments. Figures 6-8 They represent Figure 5 Schematic sectional views of each process in the process. Next, refer to Figures 5-8 An example of a method for manufacturing the gravure printing plate 10 according to this embodiment will be described. Furthermore, Figures 6-8 The cross-section shown is the same as the one described above. Figure 4 The cross-section of the corresponding position of the gravure printing plate 10.

[0080] like Figure 5As shown, firstly, in process S1, a substrate is prepared. Specifically, a substrate 11 is prepared having a cylindrical or cylindrical shape, and having a printed pattern 100 formed by a plurality of embankments 101 and a plurality of recesses 105 divided by the plurality of embankments 101 on its outer peripheral surface 11a.

[0081] Next, as Figure 5 as well as Figure 6 As shown, in step S2, a plating layer 12 is formed on the outer peripheral surface 11a of the substrate 11 to cover the plurality of recesses 105 and the plurality of embankments 101. In this embodiment, the plating layer 12 is formed with a uniform thickness.

[0082] Next, as Figure 5 as well as Figure 7 As shown, in step S3, the surface portion of the coating layer 12 that covers the embankment 101 is ground. For example, cylindrical grinding can be used as a grinding method.

[0083] Through this grinding, as described above, the thickness t1 of the plating layer 12 covering the portion of the first surface 111 is configured to be smaller than the thickness t2 of the plating layer 12 covering the portion of the third surface 113 (refer to...). Figure 4 Furthermore, through this grinding, the outer surface of the plating layer 12 covering the portion of the first surface 111, namely the first plating layer surface 12a, becomes a planarized grinding surface.

[0084] Next, as Figure 5 as well as Figure 8 As shown, in step S4, a carbon film 13 is formed on the coating layer 12. In this embodiment, a carbon film 13 containing a DLC film is formed on the coating layer 12 by vapor deposition.

[0085] Gravure printing plate 10 is manufactured through the processes S1 to S4 described above.

[0086] <D. Summary>

[0087] The gravure printing plate 10 of this embodiment, as described above, has a first coated layer surface 12a that is flat when viewed along the circumferential direction CD of the substrate 11. Furthermore, the first carbon film surface 13a is also flat when viewed along the circumferential direction CD of the substrate 11.

[0088] This configuration reduces the sliding contact resistance when the squeegee 40 slides into contact with the gravure printing plate 10. As a result, the gravure printing plate 10 can be made with significantly reduced wear during sliding contact with the squeegee 40, thus improving its durability.

[0089] Furthermore, with this configuration, when the conductive paste 31 attached to the embankment 101 (more specifically, to the carbon film 13 covering the embankment 101) is transferred to the green film 50, uneven thickness of the conductive paste 31 transferred to the green film 50 can be significantly suppressed. Therefore, the transferability of the gravure printing plate 10 can also be improved.

[0090] Furthermore, in the gravure printing plate 10 according to this embodiment, as described above, when viewed along the circumferential direction CD of the substrate 11, the second plating layer surface 12b and the third plating layer surface 12c are curvedly continuous. Additionally, when viewed along the circumferential direction CD of the substrate 11, the second carbon film surface 13b and the third carbon film surface 13c are curvedly continuous.

[0091] With this configuration, compared to the case where the second coating layer surface 12b and the third coating layer surface 12c are bent and continuous, and the second carbon film surface 13b and the third carbon film surface 13c are bent and continuous, the transferability can be improved. This is because, when there are bent portions on the surface, after transfer at the clamping portion N, paste is more likely to remain in that portion.

[0092] <E. Stacked electronic components and their manufacturing methods>

[0093] Figure 9 It is a perspective view schematically showing the appearance of a laminated electronic component manufactured using the gravure printing plate involved in the embodiment. Figure 10 It is along Figure 9 A schematic cross-sectional view of the XX line shown. Figure 11 It is along Figure 9 A schematic cross-sectional view of the XI-XI line shown. Figure 12 This is a flowchart illustrating a method for manufacturing laminated electronic components using the gravure printing plate described in the embodiment. Next, refer to... Figures 9-12 The structure and manufacturing method of a multilayer ceramic capacitor 1000, which is an example of a multilayer electronic component manufactured using the gravure printing plate 10 according to this embodiment, will be described. In the figures, the length direction of the body portion is represented by L, the width direction by W, and the stacking direction by T.

[0094] like Figures 9-11 As shown, the multilayer ceramic capacitor 1000 includes a body portion 1100, a first external electrode 1200, and a second external electrode 1300. The body portion 1100 includes a plurality of dielectric layers 1400 and a plurality of internal electrode layers 1500 that are alternately stacked along the stacking direction T.

[0095] The body portion 1100 includes a first main surface 1110 and a second main surface 1120 facing each other in the stacking direction T, a first side surface 1130 and a second side surface 1140 facing each other in the width direction W orthogonal to the stacking direction T, and a first end surface 1150 and a second end surface 1160 facing each other in the length direction L orthogonal to both the stacking direction T and the width direction W. A first external electrode 1200 is disposed on the first end surface 1150. A second external electrode 1300 is disposed on the second end surface 1160.

[0096] The plurality of internal electrode layers 1500 includes a plurality of first internal electrode layers 1510 connected to the first external electrode 1200 and a plurality of second internal electrode layers 1520 connected to the second external electrode 1300. Additionally, in Figure 10 as well as Figure 11 The example shown is an example where five pieces are provided for each of the first internal electrode layer 1510 and the second internal electrode layer 1520, but the number of pieces of the first internal electrode layer 1510 and the second internal electrode layer 1520 is not limited to five pieces.

[0097] The inner layer C has electrostatic capacitance by being stacked in the stacking direction T through the opposing portions of the first inner electrode layer 1510 and the opposing portions of the second inner electrode layer 1520.

[0098] The first external electrode 1200 is formed on the entire first end face 1150 of the body portion 1100, and is formed to extend from the first end face 1150 to the first main face 1110, the second main face 1120, the first side face 1130, and the second side face 1140. The first external electrode 1200 is electrically connected to the first internal electrode layer 1510.

[0099] The second external electrode 1300 is formed on the entire second end face 1160 of the body portion 1100, and is formed to extend from the second end face 1160 to the first main face 1110, the second main face 1120, the first side face 1130, and the second side face 1140. The second external electrode 1300 is electrically connected to the second internal electrode layer 1520.

[0100] The first external electrode 1200 and the second external electrode 1300, for example, have a base electrode layer and a plating layer disposed on the base electrode layer. The base electrode layer, for example, includes a sintered electrode layer.

[0101] The sintered electrode layer is a layer containing glass and metal, which can be a single layer or multiple layers.

[0102] The electrode layer is formed by applying a conductive paste containing glass and metal to the body portion 1100 and then firing it. The firing can be performed simultaneously with the firing of the body portion 1100 or after the firing of the body portion 1100.

[0103] The plating layer disposed on the substrate electrode layer can be a single layer or multiple layers.

[0104] like Figure 12 As shown, when manufacturing a multilayer ceramic capacitor 1000 using a gravure printing plate 10, firstly, in process T1, a green sheet 50 and a conductive paste 31 for the internal electrodes are prepared. The green sheet 50 is formed from a dielectric paste made by mixing ceramic powder, such as barium titanate, a binder, a dispersant, and a plasticizer. The conductive paste 31 is made by mixing conductive powder, a solvent, a binder, and ceramic powder. Known green sheets and conductive pastes can be used as the green sheet 50 and the conductive paste 31.

[0105] Next, in process T2, a gravure printing plate 10 is used to transfer a conductive paste 31 for the internal electrodes onto the raw sheet 50 in a given pattern. This forms a dielectric sheet 50a with the electrode pattern 51. Alternatively, the gravure printing plate 10 can also be used when transferring the dielectric paste.

[0106] Next, in process T3, a laminated sheet is fabricated by stacking multiple dielectric sheets. Specifically, first, a given number of outer layer dielectric sheets without printed electrode patterns are stacked. Next, dielectric sheets 50a with printed electrode patterns 51 are sequentially stacked on top of them. Next, a given number of the aforementioned outer layer dielectric sheets are stacked on top of them.

[0107] Next, in process T4, the laminated blocks are manufactured. Specifically, the laminated sheets are pressed in the lamination direction using a pressing device such as isostatic pressing.

[0108] Next, in process T5, chip stacks are produced. Specifically, chip stacks are cut out by using a cutting tool to cut the stacked blocks to a given size. At this time, the corners and edges of the chip stacks can also be rounded by methods such as tumbling.

[0109] Next, in process T6, the stacked sheets are fired. The firing temperature also depends on the dielectric and the material of the electrode pattern, but is, for example, set to above 900°C and below 1300°C.

[0110] Next, in process T7, external electrodes are formed. For example, conductive paste for external electrodes is applied to both ends of the laminated wafer and then sintered to form sintered electrode layers on these ends. At this time, the sintering temperature is set, for example, to 700°C or higher and 900°C or lower.

[0111] Next, a plating layer is applied to the surface of the sintered electrode layer as needed. Through the processes T1 to T7 described above, a multilayer ceramic capacitor 1000 is manufactured.

[0112] Furthermore, when the laminated electronic component manufactured using the gravure printing plate 10 is a piezoelectric component, the dielectric can be made of piezoelectric ceramic. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) based ceramics. When the laminated electronic component is a thermistor, the dielectric can be made of semiconductor ceramic. Examples of semiconductor ceramics include spinel based ceramics. When the laminated electronic component is an inductor, the dielectric can be made of magnetic ceramic. In this case, the internal electrode becomes a coil-shaped conductor. Examples of magnetic ceramics include ferrite.

[0113] (Other methods, etc.)

[0114] The characteristic structures shown in the above embodiments of the present invention can, of course, be combined with each other without departing from the spirit of the invention.

[0115] The embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the invention is defined by the claims, and also includes all modifications within the scope and equivalent meanings of the claims.

Claims

1. A method for manufacturing a gravure printing plate, said gravure printing plate being used for printing pastes for use in electronic components. The method for manufacturing the gravure printing plate includes the following steps: Prepare a substrate, which has a cylindrical or cylindrical shape and has a printed pattern on its outer circumferential surface consisting of multiple embankments and multiple recesses divided by the multiple embankments. A plating layer is formed on the outer peripheral surface of the substrate to cover the plurality of recesses and the plurality of embankments; With the coating layer formed on the outer peripheral surface of the substrate, the surface portion of the coating layer covering the embankment is ground. as well as With the surface portion of the coating layer covering the embankment being ground, a carbon film is formed on the coating layer.

2. A gravure printing plate for printing pastes used in electronic components. The intaglio printing plate has the following features: The substrate has a cylindrical or cylindrical shape and a printed pattern formed by multiple embankments and multiple recesses divided by the multiple embankments is provided on its outer peripheral surface. A plating layer is disposed on the outer peripheral surface of the substrate to cover the plurality of recesses and the plurality of embankments; as well as A carbon film is disposed on the coating layer. The outer peripheral surface of the substrate has a first surface forming the embankment, a second surface forming the bottom surface of the recess, and a third surface forming the side surface of the recess and connecting the first surface and the second surface. Viewed circumferentially from the substrate, on the surface of the coating layer on the carbon film side, the portion covering the second side and the portion covering the third side are curved and continuous. Viewed circumferentially from the substrate, on the surface of the carbon film opposite to the coating layer side, the portion of the coating layer covering the portion covering the second surface and the portion of the coating layer covering the portion covering the third surface are curvedly continuous. Viewed circumferentially from the substrate, on the surface of the coating layer on the side of the carbon film, the portion covering the first surface is composed of a flat surface. Viewed circumferentially from the substrate, on the surface of the carbon film opposite to the coating layer side, the portion of the coating layer covering the portion covering the first surface is composed of a flat surface.

3. The gravure printing plate according to claim 2, wherein, The thickness of the plating layer covering the portion of the first surface is less than the thickness of the plating layer covering the portion of the third surface.

4. The gravure printing plate according to claim 2 or 3, wherein, Viewed circumferentially from the substrate, on the surface of the coating layer on the carbon film side, the portion covering the third side is bent and continuous with the portion covering the first side.

5. The gravure printing plate according to any one of claims 2 to 4, wherein, The coating layer is a Cr coating layer, and the carbon film is a DLC film.

6. The gravure printing plate according to any one of claims 2 to 5, wherein, The thickness of the coating layer covering the portion of the third surface is 5 μm or more.

7. The gravure printing plate according to any one of claims 2 to 6, wherein, On the surface of the carbon film side of the coating layer, the portion covering the first surface is a ground surface.

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