Mask assembly and method for manufacturing display devices and electronic devices

Abstract

The present disclosure relates to a mask assembly and a method for manufacturing a display device and an electronic device. The mask assembly includes a mask sheet in which a plurality of deposition holes are defined, and a mask frame which supports the mask sheet, wherein each of the plurality of deposition holes includes a main hole, and a sub hole defined radially outward from the main hole.

Description

[0001] This application claims priority to and all benefits derived therefrom of Korean Patent Application No. 10-2025-0054801, filed on April 25, 2025, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The embodiments relate to mask assemblies, methods for manufacturing display devices, and methods for manufacturing electronic devices, and more specifically, to mask assemblies that can improve deposition quality, methods for manufacturing display devices, and methods for manufacturing electronic devices. Background Technology

[0003] In recent years, electronic devices have been widely used. Electronic devices are utilized in various forms (such as mobile electronic devices and fixed electronic devices), and these electronic devices include display devices that can provide users with visual information such as images or videos to support various functions.

[0004] Display devices visually display data and are formed by depositing various layers such as organic layers, inorganic layers, and metallic layers. Deposited materials can be deposited on a display substrate to form multiple layers of the display device. That is, the deposited material can be ejected from a deposition source and deposited on the display substrate through a mask assembly. Summary of the Invention

[0005] When forming multiple layers, it is desirable to prevent shading to improve deposition quality.

[0006] Examples may provide mask assemblies that can improve deposition quality, methods for manufacturing display devices, and methods for manufacturing electronic devices.

[0007] However, this is merely an exemplary embodiment, and the scope of this disclosure is not limited thereto.

[0008] Other features will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0009] In embodiments of this disclosure, a mask assembly includes: a mask sheet having a plurality of deposition holes defined therein; and a mask frame supporting the mask sheet, wherein each of the plurality of deposition holes includes a main hole and a secondary hole defined radially outward from the main hole.

[0010] In one embodiment, the secondary hole may be configured to surround the periphery of the main hole.

[0011] In one embodiment, the secondary holes may be provided as a plurality of secondary holes, and the plurality of secondary holes may be spaced apart along the periphery of the main hole.

[0012] In one embodiment, the main hole may have a polygonal shape, the number of the plurality of secondary holes may be provided to correspond to the number of edges of the polygon, and the plurality of secondary holes may be configured to face the edges of the polygon respectively.

[0013] In one embodiment, the main hole may have a circular shape, and the secondary hole may have a segmented annular shape.

[0014] In one embodiment, the secondary hole may be provided as a plurality of secondary holes, and the plurality of secondary holes may include a first secondary hole defined around the main hole and a second secondary hole defined outside the first secondary hole to surround the first secondary hole.

[0015] In one embodiment, the radial width of the main hole may be greater than the radial width of the secondary hole.

[0016] In one embodiment, the distance from the periphery of the main hole to the inner periphery of the secondary hole may be less than the radial width of the secondary hole.

[0017] In an embodiment of this disclosure, a method for manufacturing a display device includes: setting a display substrate and a deposition source facing each other; disposing a mask assembly between the display substrate and the deposition source; and depositing a deposition material from the deposition source through deposition holes in the mask assembly into a deposition region on the display substrate, wherein the deposition holes are configured to correspond to the deposition region and include a main hole and a secondary hole defined radially outward from the main hole, and in a plan view, the main hole and the secondary hole are disposed within the deposition region.

[0018] In one embodiment, the deposition region on the display substrate where the deposition material is deposited may include an emission layer for forming sub-pixels by depositing the deposition material in the deposition region.

[0019] In one embodiment, the emission layer of the sub-pixel can be formed by depositing the deposition material through the main aperture and the sub-aperture in the deposition region.

[0020] In one embodiment, the display substrate may include a pixel electrode disposed below the emitter layer of the sub-pixel, and the size of the main aperture may be the same as the size of the exposed portion of the pixel electrode.

[0021] In one embodiment, disposing the mask assembly between the display substrate and the deposition source may include setting the outer periphery of the sub-hole to overlap with the periphery of the deposition region.

[0022] In one embodiment, disposing the mask assembly between the display substrate and the deposition source may include setting the outer periphery of the sub-hole to be spaced inward from the periphery of the deposition region.

[0023] In one embodiment, the secondary hole may be configured to surround the periphery of the main hole.

[0024] In one embodiment, a plurality of secondary holes may be provided, and the plurality of secondary holes may be spaced apart along the periphery of the main hole.

[0025] In one embodiment, the main hole may have a polygonal shape, the number of the plurality of secondary holes may be provided to correspond to the number of edges of the polygon, and each of the plurality of secondary holes may be configured to face each of the edges of the polygon.

[0026] In one embodiment, the main hole may have a circular shape, and the secondary hole may have a segmented annular shape.

[0027] In one embodiment, the plurality of secondary holes may include a first secondary hole defined around the main hole and a second secondary hole defined outside the first secondary hole to surround the first secondary hole.

[0028] In an embodiment of this disclosure, a method for manufacturing an electronic device includes: setting a display substrate and a deposition source facing each other; disposing a mask assembly between the display substrate and the deposition source; and depositing a deposition material from the deposition source through deposition holes of the mask assembly in a deposition region on the display substrate, wherein the deposition holes are configured to correspond to the deposition region and include a main hole and a secondary hole defined radially outward from the main hole, and in a plan view, the main hole and the secondary hole are disposed in the deposition region.

[0029] Other features and advantages, different from those described above, will become apparent from the following detailed description, claims and drawings. Attached Figure Description

[0030] The above and other features and advantages of the exemplary embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 This is a block diagram of an embodiment of an electronic device;

[0032] Figures 2 to 4 This is a schematic diagram of an embodiment of an electronic device;

[0033] Figure 5 This is a schematic perspective view of an embodiment of the display device;

[0034] Figure 6 This is an equivalent circuit diagram of an embodiment including a pixel circuit in a display device;

[0035] Figure 7 This is a schematic cross-sectional view of an embodiment of the display device;

[0036] Figure 8 This is a cross-sectional view showing an embodiment of a manufacturing apparatus for a display device;

[0037] Figure 9 This is a schematic plan view of an embodiment of the mask assembly;

[0038] Figure 10 It is along Figure 9 A schematic cross-sectional view of an embodiment of the mask assembly intercepted by line X-X';

[0039] Figure 11 This is a schematic plan view of an embodiment of the sheet portion;

[0040] Figure 12 It is along Figure 11 A schematic cross-sectional view of an embodiment of the slice portion cut off by line XII-XII';

[0041] Figure 13 It is a schematic cross-sectional view of the sheet portion based on the comparative example; and

[0042] Figures 14 to 16 This is a schematic plan view of an embodiment of the sheet portion. Detailed Implementation

[0043] Now, reference will be made in detail to embodiments, exemplary embodiments of which are illustrated in the accompanying drawings, wherein similar reference numerals always refer to similar elements. In this regard, the illustrated embodiments may have different forms and should not be construed as limited to the description set forth herein. Accordingly, embodiments are described below only by reference to the drawn figures to explain the features of this description. As used herein, the term “and / or” includes any one and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0044] Various modifications can be applied to the illustrated embodiments, and specific embodiments will be illustrated in the accompanying drawings and described in the detailed description section. The effects and features of the illustrated embodiments, as well as the methods for achieving these effects and features, will become clearer with reference to the following detailed description using the accompanying drawings. However, the illustrated embodiments can be implemented in various forms and are not limited to the embodiments presented below.

[0045] In the following description, embodiments will be described in detail with reference to the accompanying drawings, in which the same or corresponding parts are indicated by the same reference numerals, and redundant descriptions are omitted.

[0046] In the following embodiments, it will be understood that although the terms “first,” “second,” etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another.

[0047] In the following embodiments, unless the context clearly indicates otherwise, singular expressions in the specification include plural expressions.

[0048] In the following embodiments, it will be further understood that the terms “comprising” and / or “having” as used herein specify the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0049] In the following embodiments, it will be understood that when a layer, area, or component is referred to as being "formed on" another layer, area, or component, it may be formed directly or indirectly on the other layer, area, or component. That is, for example, an intermediary layer, area, or component may exist.

[0050] In the following embodiments, when a layer, area, or component is connected to each other, these layers, areas, or components can be directly connected to each other, or another layer, another area, or another component can be disposed between these layers, areas, or components, and therefore these layers, areas, or components can be indirectly connected to each other. Additionally, when a layer, area, or component is electrically connected to each other, these layers, areas, or components can be directly electrically connected to each other, or another layer, another area, or another component can be disposed between these layers, areas, or components, and therefore these layers, areas, or components can be indirectly electrically connected to each other.

[0051] For ease of explanation, the dimensions of elements in the accompanying drawings may be exaggerated or reduced. For example, since the dimensions and thicknesses of the parts in the drawings are arbitrarily illustrated for ease of explanation, the following disclosure is not limited thereto.

[0052] In the following embodiments, expressions such as "A and / or B" may include A, B, or A and B. Furthermore, expressions such as "at least one of A and B" may include A, B, or A and B.

[0053] As used herein, when a wiring is referred to as “extending in a first or second direction”, it means that the wiring extends not only in a straight line shape in the first or second direction, but also in a zigzag shape or in a curved shape.

[0054] As used herein, "in a plan view" means the target portion viewed from above. Additionally, "in a cross-sectional view" means the target portion viewed vertically from the side. In the following embodiments, "overlapping" of the first and second components means that the first component is positioned above or below the second component.

[0055] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0056] When exemplary embodiments can be implemented differently, a particular process sequence can be performed differently from the described sequence. For example, two processes described sequentially can be performed substantially simultaneously, or they can be performed in the reverse order of the described sequence.

[0057] Figure 1 This is a block diagram of an embodiment of an electronic device.

[0058] refer to Figure 1 The electronic device 10 may include a display module 11, a processor 12, a memory 13, and a power module 14. In one embodiment, the display module 11 may be manufactured using a display device manufacturing apparatus 2 (see reference 14) described below. Figure 8 ) to manufacture.

[0059] Processor 12 may include at least one of a central processing unit (“CPU”), an application processor (“AP”), a graphics processing unit (“GPU”), a communication processor (“CP”), an image signal processor (“ISP”), and a controller. In one embodiment, processor 12 may be provided by being divided into two or more components from a functional or structural perspective. In one embodiment, for example, processor 12 may include a main processor in the form of a first driver chip containing a CPU, and an auxiliary processor in the form of a second driver chip containing a controller that receives video signals from the main processor and processes the video signals to match the interface specifications of display module 11.

[0060] The memory 13 may include at least one of non-volatile memory and volatile memory. Data information required for the operation of the processor 12 or the display module 11 may be stored in the memory 13. When the processor 12 executes an application stored in the memory 13, video data signals and / or input control signals are transmitted to the display module 11, and the display module 11 can process the provided signals to output video information through the display screen.

[0061] The power module 14 may include a power module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power module to generate the power required for the operation of the electronic device 10. The power conversion by the power conversion module may include, but is not limited to, direct current to direct current (“DC-DC”) conversion, alternating current to direct current (“AC-DC”) conversion, and direct current to alternating current (“DC-AC”) conversion.

[0062] The electronic device 10 may further include an input module 15, an output module (e.g., a non-image output module) 16 and / or a communication module 17.

[0063] Input module 15 can provide input information to processor 12 and / or display module 11. Input module 15 may include various sensor modules as well as physical buttons, keyboard, and microphone. In embodiments, sensor modules may include touch sensors, pressure sensors, distance sensors, position sensors, digitizers, motion recognition sensors, camera sensors, light receiving sensors, photoelectric conversion sensors, temperature sensors, and biosensors such as blood pressure sensors, blood glucose sensors, electrocardiogram sensors, and heart rate sensors.

[0064] The output module 16 can receive information other than images transmitted from the processor 12 and can provide that information to the user. In embodiments, the output module 16 may include a sound module, a tactile module, a light-emitting module, etc., and may include other functional modules inherent to the electronic device (e.g., a cooling module of a refrigerator).

[0065] The communication module 17 is responsible for transmitting and receiving information between the electronic device 10 and external devices, and may include a receiver and a transmitter. The communication module 17 may include modules such as mobile communication modules, Wi-Fi modules, and Bluetooth. ® Various wireless communication modules or various wired communication modules.

[0066] At least one of the components of the electronic device 10 described above may be included in the display device. Furthermore, some of the modules functionally included in a single module may be included in the display device, while other modules may be provided separately from the display device. In one embodiment, for example, the display device may include a display module 11, and the processor 12, memory 13, and power module 14 may be provided in the electronic device 10 as other devices rather than in the display device. In another embodiment, the power module 14 may be provided in the display device and may supply power to the processor 12 and memory 13 provided in the electronic device 10 rather than the display device, and this disclosure is not limited to the examples above.

[0067] Such a display device can be manufactured using the display device manufacturing apparatus described below in the embodiments.

[0068] Figures 2 to 4 This is a schematic diagram of an embodiment of an electronic device. Figures 2 to 4 Examples of various electronic devices used in the display devices described in the embodiments.

[0069] Figure 2 Examples of electronic devices include a smartphone 10_1a, a tablet PC 10_1b, a laptop computer 10_1c, a television (“TV”) 10_1d, and a desktop monitor 10_1e.

[0070] In addition to the display module 11, the smartphone 10_1a may also include an input module such as a touch sensor and a communication module. The smartphone 10_1a can process information received through the communication module or other input modules to display that information through the display module 11 of the display device.

[0071] Similar to the smartphone 10_1a, the tablet PC 10_1b, laptop computer 10_1c, TV 10_1d, and desktop monitor 10_1e also include a display module and an input module, and in some cases may further include a communication module.

[0072] Figure 3 This example illustrates the application of an electronic device including a display module in a wearable electronic device. The wearable electronic device could be smart glasses 10_2a, a head-mounted display 10_2b, a smartwatch 10_2c, etc.

[0073] The smart glasses 10_2a and the head-mounted display 10_2b may include a display module that emits a display image and a reflector that reflects the emitted display image to provide the display image to the user's eyes, and thus can provide the user with virtual reality or augmented reality images.

[0074] The smartwatch 10_2c includes a biosensor as an input device and can provide the user with biometric information identified by the biosensor through a display module.

[0075] Figure 4 This example illustrates the application of electronic devices, including a display module, in a vehicle. In one embodiment, for example, electronic device 10_3 can be applied to the vehicle's instrument panel, center console, etc., or it can be applied to a central information display ("CID") located on the vehicle's instrument panel or an interior mirror display that replaces the side mirrors.

[0076] Although not illustrated, the electronic devices used in the display devices of the embodiments may include various household appliances that display information via the display module, such as refrigerators, washing machines, dryers, air conditioners, and robot vacuum cleaners, as well as devices primarily used for screen display, such as billboards, electronic signs, and game consoles. Furthermore, when the display module has the function of transmitting light, it can be applied to electronic devices such as smart windows or transparent display devices that simultaneously display a background and an image. The types of electronic devices according to this disclosure are not limited to the examples above, and the application of various other unillustrated electronic devices is also possible.

[0077] Figure 5 This is a schematic perspective view of an embodiment of the display device. In one embodiment, the display device 1 can be manufactured using a display device manufacturing apparatus 2, which will be described below.

[0078] refer to Figure 5 The display device 1 may include a display area DA for displaying an image and a peripheral area PA for not displaying an image. The display device 1 can provide an image via an array of multiple pixels PX arranged two-dimensionally on the xy-plane of the display area DA. Each pixel PX may include different sub-pixels. For example, each sub-pixel may emit a different color and may be one of a green sub-pixel, a red sub-pixel, and a blue sub-pixel.

[0079] In one embodiment, the plurality of sub-pixels includes a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. For ease of description, the following will describe the case where the first sub-pixel PX1 is a green sub-pixel, the second sub-pixel PX2 is a red sub-pixel, and the third sub-pixel PX3 is a blue sub-pixel.

[0080] The first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 are areas that can emit green light, red light, and blue light, respectively, and the display device 1 can use the light emitted from these sub-pixels to provide an image.

[0081] The peripheral area PA is the area that does not provide an image and may surround the entire display area DA. Drivers or main voltage lines for providing electrical signals or power to the pixel circuitry can be located in the peripheral area PA. The peripheral area PA may include pads that can be electrically connected as areas for electronic components or printed circuit boards.

[0082] like Figure 5As shown, the display area DA can have a polygonal shape such as a rectangle. In one embodiment, for example, the display area DA can have a quadrilateral shape, such as a rectangle whose horizontal length is greater than its vertical length, a quadrilateral shape, such as a rectangle whose horizontal length is less than its vertical length, or a square shape. In another embodiment, the display area DA can be a circle, an ellipse, or other polygons such as a triangle or a pentagon. Moreover, Figure 5 The display device 1 is exemplified as a flat panel display device, but the display device 1 can be implemented in various forms (such as flexible, foldable and rollable display devices).

[0083] Display device 1 can be used as a display screen for various products such as televisions, laptops, monitors, billboards, and Internet of Things (“IoT”) devices, as well as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, e-notebooks, e-books, portable multimedia players (“PMPs”), navigation systems, and ultra-mobile personal computers (“UMPCs”). Furthermore, display device 1 in the embodiments can be used in wearable devices such as smartwatches, watch phones, glasses displays, and head-mounted displays (“HMDs”). Moreover, display device 1 in the embodiments can be used as an instrument panel in a car, a CID (Center ID) mounted on the center console or dashboard of a car, an interior mirror display replacing the side mirrors of a car, and a display screen mounted on the back surface of the front seats for entertainment of passengers sitting in the rear seats.

[0084] Furthermore, although the display device 1 will be described below as including an organic light-emitting diode (“OLED”) as a display element, the display device 1 of this disclosure is not limited thereto. In one embodiment, the display device 1 may be a light-emitting display device including an inorganic light-emitting diode, i.e., an inorganic light-emitting display. In one embodiment, the display device 1 may be a quantum dot light-emitting display.

[0085] Figure 6 This is an equivalent circuit diagram of an embodiment including a pixel circuit in a display device. The pixel circuit PC can be electrically connected to a display element, and one display element can correspond to one pixel PX. In one embodiment, for example, the display element can be an organic light-emitting diode (OLED).

[0086] The pixel circuit PC may include a first transistor Td, a second transistor Ts, and a storage capacitor Cst. The second transistor Ts is a switching transistor connected to the scan line SL and the data line DL, which transmit scan signals Sn and data signals Dm (n and m are positive integers), respectively. It can be turned on by a switching signal input from the scan line SL to transmit the data signal Dm input from the data line DL to the first transistor Td. The storage capacitor Cst has one end electrically connected to the second transistor Ts and the opposite end electrically connected to the drive voltage line PL. It can store a voltage corresponding to the difference between the voltage received from the second transistor Ts and the drive power voltage ELVDD supplied to the drive voltage line PL.

[0087] The first transistor Td is a driving transistor connected to the driving voltage line PL and the storage capacitor Cst, and can control the magnitude of the driving current flowing from the driving voltage line PL to the organic light-emitting diode (OLED) in response to the voltage value stored in the storage capacitor Cst. The OLED can emit light with a predetermined brightness according to the driving current. The counter electrode 230 of the OLED (reference) Figure 7 It can receive electrode power voltage ELVSS.

[0088] Figure 6 An example pixel circuit PC includes two transistors and a storage capacitor, but this disclosure is not limited thereto. In one embodiment, for example, the number of transistors or the number of storage capacitors can be varied depending on the design of the pixel circuit PC.

[0089] Figure 7 This is a schematic cross-sectional view of an embodiment of the display device.

[0090] refer to Figure 7 The display device 1 may include a substrate 100, a pixel circuit layer 110 including a transistor TR, a via insulating layer 120 on the pixel circuit layer 110, a display element layer 140 disposed on the via insulating layer 120, and an encapsulation layer 300 on the display element layer 140.

[0091] Substrate 100 may have an upper surface extending in the x and y directions in a plan view. Substrate 100 may contain a semiconductor material, such as a group IV semiconductor, a group III-V compound semiconductor, or a group II-VI compound semiconductor. That is, substrate 100 may be a semiconductor substrate containing a semiconductor material. Specifically, substrate 100 may contain silicon (Si). That is, substrate 100 may include a silicon substrate (silicon semiconductor substrate). In one embodiment, for example, substrate 100 may be a silicon wafer. The silicon wafer may be a single-crystal silicon wafer, a polycrystalline silicon wafer, or an amorphous silicon wafer.

[0092] Therefore, an organic light-emitting diode display device that uses a semiconductor substrate as substrate 100 can also be called an OLED on silicon (“OLEDoS”). Since OLEDoS uses a semiconductor substrate as substrate 100, transistor manufacturing processes commonly used in the semiconductor technology field can be applied to the manufacturing process of the display device. Therefore, the formation of micro-pixels and the control of such pixels are possible, enabling OLEDoS to display ultra-high resolution images.

[0093] In some cases, the type of substrate 100 may not be limited to a semiconductor substrate. In one embodiment, for example, substrate 100 may comprise glass, metal, or polymer resin. Furthermore, substrate 100 may comprise polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. Of course, substrate 100 may have various modifications, such as having a multilayer structure comprising two layers each comprising such a polymer resin and an inorganic material (silicon oxide (SiO2) disposed between the two layers). x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y The barrier layer. In the following text, the case where the substrate 100 is a silicon substrate will be described in detail.

[0094] Pixel circuit layer 110 may be disposed on substrate 100. Pixel circuit layer 110 includes pixel circuits, that is, a plurality of pixel circuits respectively corresponding to each of the first to third sub-pixels PX1, PX2, and PX3, and each of the plurality of pixel circuits may include, as shown in the reference... Figure 6 The described transistor and / or storage capacitor. Pixel circuit layer 110 may include at least one transistor TR and at least one insulating layer.

[0095] Figure 7 An organic light-emitting diode (OLED) is shown as a display element disposed on a substrate 100. The OLED being electrically connected to the pixel circuit PC can be understood as follows: the pixel electrode 210 included in the OLED is electrically connected to the transistor TR included in the pixel circuit PC. For ease of illustration, Figure 7 For example, transistor TR is connected to each of the first to third organic light-emitting diodes OLED1, OLED2, and OLED3, and these transistors TR can be connected to the aforementioned first transistor Td (reference). Figure 6 )correspond.

[0096] A transistor TR may include a gate dielectric layer GO, a gate electrode GE, and an active region ACT. For example, a transistor TR may be a metal-oxide-semiconductor field-effect transistor (“MOSFET”), but is not limited thereto. In one embodiment, the individual transistor TRs may be separated from each other by element isolation regions disposed between these transistor TRs.

[0097] An active region ACT may be disposed within the substrate 100. The active region ACT may be formed as a part of the substrate 100. The active region ACT may be configured to extend within the substrate 100 in a first direction (e.g., the x-direction). A portion of the substrate 100 may be recessed, and the active region ACT may be disposed within the recessed portion of the substrate 100. The active region ACT may include a channel region C and drain regions D and source regions S respectively disposed on opposite sides of the channel region C. Each of the drain region D and source regions S may be a region on the substrate 100 containing a semiconductor material doped with impurities. The channel region C may overlap with the gate electrode GE.

[0098] The gate dielectric layer GO can be disposed between the gate electrode GE and the active region ACT. The gate dielectric layer GO can contain an inorganic insulating material, such as silicon oxide (SiO2) or silicon nitride (SiN). X ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO2).

[0099] The gate electrode GE can be disposed on the active region ACT. The gate electrode GE can be configured to extend in a direction (e.g., the y-direction) intersecting the active region ACT. The channel region C of the transistor TR can be formed in the active region ACT below the gate electrode GE. That is, the gate electrode GE can overlap with the channel region C of the transistor TR. The gate electrode GE can be disposed on the gate dielectric layer GO. The gate electrode GE can contain a conductive material. In one embodiment, for example, the gate electrode GE can contain metal nitrides such as titanium nitride (TiN), tantalum nitride (TaN), or tungsten nitride (WN), and / or metallic materials such as aluminum (Al), tungsten (W), copper (Cu), or molybdenum (Mo), or semiconductor materials such as doped polycrystalline silicon. The gate electrode GE can be formed as a multilayer or a single layer containing the above materials.

[0100] Interlayer insulating layer 111 can be disposed on substrate 100 and can cover transistor TR. Interlayer insulating layer 111 can contain at least one of oxide, nitride, and oxynitride. Interlayer insulating layer 111 can have a single-layer structure or a multilayer structure.

[0101] The drain electrode DE and the source electrode SE can be disposed on the interlayer insulating layer 111. The drain electrode DE and the source electrode SE can be connected to the drain region D and the source region S of the active region ACT, respectively, through contact holes provided in the interlayer insulating layer 111. The drain electrode DE and the source electrode SE can contain materials with good conductivity. The drain electrode DE and the source electrode SE can contain conductive materials including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and can be formed as a multilayer or a single layer containing the above materials.

[0102] A via insulating layer 120 may be disposed on the pixel circuit layer 110. The via insulating layer 120 may be an organic insulating layer covering the upper surface of the drain electrode DE and the upper surface of the source electrode SE, and having a generally flat upper surface, thereby acting as a planarization layer. For example, the via insulating layer 120 may contain organic materials such as acrylic acid, benzocyclobutene (“BCB”), or hexamethyldisiloxane (“HMDSO”). The via insulating layer 120 is illustrated as a single layer, but is not limited thereto, and may be formed as a multilayer.

[0103] The display element layer 140 can be disposed on the through-hole insulating layer 120. The display element layer 140 may include a first organic light-emitting diode OLED1, a second organic light-emitting diode OLED2, and a third organic light-emitting diode OLED3.

[0104] The first to third organic light-emitting diodes OLED1, OLED2, and OLED3 may include a stacked structure of pixel electrode 210, emission layer 220, and counter electrode 230. The first to third organic light-emitting diodes OLED1, OLED2, and OLED3 emit light, and the light-emitting regions may be defined as a first emission region to a third emission region EA1, EA2, and EA3, respectively.

[0105] Multiple pixel electrodes 210 may be disposed on the via insulating layer 120. The pixel electrodes 210 may be electrically connected to the transistor TR by providing contact holes in the via insulating layer 120. Each of the pixel electrodes 210 may include a light-transmitting conductive layer comprising or composed of a light-transmitting conductive oxide (such as ITO, In2O3, or IZO), and a reflective layer comprising or composed of a metal (such as Al or Ag). In one embodiment, for example, each of the pixel electrodes 210 may have a three-layer structure of ITO / Ag / ITO.

[0106] like Figure 7As shown, pixel electrode 210 may include a first pixel electrode 210a, a second pixel electrode 210b, and a third pixel electrode 210c. When viewed in a direction perpendicular to the substrate 100, the first pixel electrode to the third pixel electrode 210a, 210b, and 210c may be spaced apart from each other.

[0107] A pixel defining layer 130 may be disposed on the via insulating layer 120. The pixel defining layer 130 may define openings 130OP corresponding to the first to third sub-pixels PX1, PX2, and PX3, respectively. The openings 130OP of the pixel defining layer 130 may expose at least a portion (e.g., a central portion) of each of the pixel electrodes 210. In one embodiment, the first to third emission regions EA1, EA2, and EA3 may be defined as regions exposed through the openings 130OP of the pixel defining layer 130. The pixel defining layer 130 may comprise organic and / or inorganic insulating materials. For example, the pixel defining layer 130 may comprise organic materials such as polyimide or hexamethyldisiloxane (“HMDSO”).

[0108] Spacers (not shown) for preventing mask sagging may be further included on pixel defining layer 130. In one embodiment, the spacers may be integrally formed with pixel defining layer 130. In one embodiment, for example, the spacers and pixel defining layer 130 may be formed simultaneously in the same process using a halftone masking process.

[0109] An emission layer 220 may be disposed on the pixel electrode 210. The emission layer 220 may be disposed to cover the pixel electrode 210 exposed through the opening 130OP of the pixel defining layer 130. In one embodiment, the emission layer 220 may be integrally formed across a plurality of pixel electrodes 210.

[0110] The emitting layer 220 can emit light of a predetermined color. In one embodiment, for example, the emitting layer 220 can emit green, red, or blue light. In an alternative embodiment, the emitting layer 220 can emit white light.

[0111] In one embodiment, the emitter layer 220 may comprise a relatively high molecular weight or a relatively low molecular weight organic material. The emitter layer 220 may comprise an organic emitter layer. In one embodiment, for example, the emitter layer 220 may comprise a polymeric material, such as poly(p-phenyleneacetylene) (“PPV”) or polyfluorene. The emitter layer 220 may be formed by screen printing, inkjet printing, laser-induced thermal imaging (“LITI”), etc. However, this disclosure is not limited thereto, and the emitter layer 220 may comprise an inorganic emitter material or quantum dots.

[0112] In one embodiment, a functional layer (not illustrated) may be disposed below and above the emitter layer 220. The functional layer may include a hole injection layer (“HIL”), a hole transport layer (“HTL”), an electron transport layer (“ETL”), and / or an electron injection layer (“EIL”). Such a functional layer may be integrally formed across multiple pixel electrodes 210, or may be patterned to correspond to each of the multiple pixel electrodes 210.

[0113] Counter electrode 230 may be disposed on pixel electrode 210 and may overlap pixel electrode 210. Counter electrode 230 may be disposed on emitter layer 220. Counter electrode 230 may comprise or be composed of a conductive material having a relatively low work function. In one embodiment, for example, counter electrode 230 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. In an alternative embodiment, counter electrode 230 may further comprise a layer such as ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the above-described materials. Counter electrode 230 may be integrally formed to cover the entire substrate 100.

[0114] The encapsulation layer 300 may be disposed on the counter electrode 230. The encapsulation layer 300 may be disposed to cover a plurality of organic light-emitting diodes, namely, first to third organic light-emitting diodes OLED1, OLED2, and OLED3. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320 on the first inorganic encapsulation layer 310, and a second inorganic encapsulation layer 330.

[0115] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise one or more inorganic materials selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may comprise a polymeric material. Polymeric materials may include acrylic resins, epoxy resins, polyimides, and polyethylene. In one embodiment, the organic encapsulation layer 320 may comprise an acrylate. The organic encapsulation layer 320 may be formed by curing monomers or coating polymers. The organic encapsulation layer 320 may be transparent.

[0116] Although not illustrated, a touch sensor layer may be disposed on the encapsulation layer 300, and an optical functional layer may be disposed on the touch sensor layer. The touch sensor layer can acquire coordinate information based on external input (e.g., a touch event). The optical functional layer can reduce the reflectivity of light incident from the outside toward the display device (external light), and / or can improve the color purity of light emitted from the display device. In one embodiment, the optical functional layer may include a retarder and / or a polarizer. The retarder may be of film type or liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be of film type or liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined configuration. The retarder and polarizer may further include a protective film.

[0117] The adhesive component can be disposed between the touch sensor layer and the optical functional layer. The adhesive component can be any common component known in the art without limitation. In one embodiment, the adhesive component can be a pressure-sensitive adhesive (“PSA”).

[0118] Figure 8 This is a cross-sectional view illustrating an embodiment of a manufacturing apparatus for a display device. In one embodiment, the display device manufacturing apparatus 2 can be used to manufacture the aforementioned display device.

[0119] The manufacturing apparatus 2 for the display device may include a chamber 90, a first support portion 20, a second support portion 30, a mask assembly MA, a deposition source 50, a magnetic portion 60, a visual portion 70, and a pressure control portion 80.

[0120] The chamber 90 may have a space formed therein, and the display substrate DS and mask assembly MA may be accommodated therein. In this case, a portion of the chamber 90 may be opened, and a gate valve 91 may be installed in the open portion of the chamber 90. In this case, the open portion of the chamber 90 may be opened or closed according to the operation of the gate valve 91.

[0121] The display substrate DS can refer to the display substrate DS during the manufacture of the display device, wherein at least one of an organic layer, an inorganic layer, and a metal layer is deposited on the substrate 100. In an alternative embodiment, the display substrate DS can be a substrate 100 on which no organic layer, inorganic layer, or metal layer has yet been deposited.

[0122] The first support portion 20 can support the display substrate DS. In this case, the first support portion 20 can be in the form of a plate fixed inside the cavity 90. In another embodiment, the first support portion 20 can be in the form of a shuttle on which the display substrate DS is placed and can perform linear movement within the cavity 90. In another embodiment, the first support portion 20 can include an electrostatic chuck or adhesive chuck fixed to or disposed in the cavity 90 so as to be movable within the cavity 90.

[0123] The second support portion 30 can support the mask assembly MA. The second support portion 30 can be disposed inside the chamber 90. The second support portion 30 can perform fine adjustment of the position of the mask assembly MA. The second support portion 30 may include a separate drive unit or alignment unit so that the mask assembly MA can move in different directions from each other.

[0124] In one embodiment, the second support portion 30 may be in the form of a shuttle. In this case, the second support portion 30 may house and transport the mask assembly MA. In one embodiment, for example, the second support portion 30 may be moved outside the chamber 90 and, after the mask assembly MA is placed, may be accessed from outside the chamber 90 into the chamber 90.

[0125] In these cases, the first support portion 20 and the second support portion 30 can also be integrally formed. In this case, the first support portion 20 and the second support portion 30 may include a movable shuttle. The first support portion 20 and the second support portion 30 include a structure that fixes the mask assembly MA and the display substrate DS when the display substrate DS is placed on the mask assembly MA, and can also linearly move the display substrate DS and the mask assembly MA simultaneously.

[0126] However, for the sake of convenience, the detailed description below will focus on the form in which the first support portion 20 and the second support portion 30 are separated from each other and are disposed at different positions, and the first support portion 20 and the second support portion 30 are disposed inside the chamber 90.

[0127] The deposition source 50 can be positioned to face the mask assembly MA. The deposition material can be contained within the deposition source 50 and can be evaporated or sublimated by applying heat to the deposition material. The deposition source 50 can be fixed inside the chamber 90 or positioned inside the chamber 90 to allow linear movement in one direction.

[0128] A mask assembly MA can be disposed inside the chamber 90. The mask assembly MA may include a mask frame MF and a mask sheet MS. This will be described in detail below. Deposition material can pass through the mask assembly MA and be deposited on the display substrate DS.

[0129] The magnetic portion 60 can be disposed inside the cavity 90 to face the display substrate DS and / or the mask assembly MA. The magnetic portion 60 can apply a magnetic force to the mask assembly MA to force the mask assembly MA toward the display substrate DS. In particular, the magnetic portion 60 can not only prevent the mask sheet MS from sagging, but also bring the mask sheet MS close to the display substrate DS. Moreover, the magnetic portion 60 can uniformly maintain the gap between the mask sheet MS and the display substrate DS.

[0130] A vision section 70 is disposed in the cavity 90 and can capture images of the position of the display substrate DS and the mask assembly MA. In this case, the vision section 70 may include a camera configured to capture images of the display substrate DS and the mask assembly MA. Based on the images captured by the vision section 70, the position of the display substrate DS and the position of the mask assembly MA can be determined, and any deformation of the mask assembly MA can be confirmed. Moreover, based on these images, the position of the display substrate DS can be finely adjusted at the first support section 20, or the position of the mask assembly MA can be finely adjusted at the second support section 30. However, the detailed description below will focus on the case where the position of the display substrate DS and the position of the mask assembly MA are aligned by finely adjusting the position of the mask assembly MA at the second support section 30.

[0131] The pressure control unit 80 can be connected to the chamber 90 to control the pressure inside the chamber 90. In one embodiment, for example, the pressure control unit 80 can control the pressure inside the chamber 90 to be the same as or close to atmospheric pressure. Furthermore, the pressure control unit 80 can control the pressure inside the chamber 90 to be the same as or close to vacuum pressure.

[0132] The pressure control unit 80 may include a connecting pipe 81 connected to the chamber 90 and a pump 82 installed in the connecting pipe 81. Depending on the operation of the pump 82, external air may be introduced through the connecting pipe 81, or gas inside the chamber 90 may be guided to the outside through the connecting pipe 81.

[0133] Regarding the method of manufacturing a display device using the manufacturing apparatus 2 described above, firstly, a display substrate DS can be prepared.

[0134] The pressure control unit 80 can maintain the interior of the chamber 90 at a pressure that is the same as or close to atmospheric pressure, and the gate valve 91 can be operated to open the opening portion of the chamber 90.

[0135] Subsequently, the display substrate DS can be loaded from outside the cavity 90 into the cavity. The display substrate DS can be loaded into the cavity 90 in various ways. In one embodiment, for example, the display substrate DS can be loaded from outside the cavity 90 into the cavity 90 by a robotic arm or the like located outside the cavity 90. In one embodiment, when the first support portion 20 is formed in the form of a shuttle, the first support portion 20 can also be removed from inside the cavity 90 to outside the cavity 90, and then the display substrate DS can be placed on the first support portion 20 by a separate robotic arm or the like located outside the cavity 90, and the first support portion 20 can also be loaded from outside the cavity 90 into the cavity 90. In one embodiment, the display substrate DS and the deposition source 50 can be positioned facing each other.

[0136] The mask assembly MA can be positioned inside the cavity 90 as described above. In one embodiment, similar to or analogous to the display substrate DS, the mask assembly MA can also be loaded from outside the cavity 90 into the cavity 90. In one embodiment, the mask assembly MA can be positioned between the display substrate DS and the deposition source 50.

[0137] When the display substrate DS is loaded into the chamber 90, the display substrate DS can be placed on the first support portion 20. The vision portion 70 can capture images of the position of the display substrate DS and the position of the mask assembly MA. The position of the display substrate DS and the position of the mask assembly MA can be determined based on the images captured by the vision portion 70. The manufacturing apparatus 2 for the display device may be equipped with a separate control unit (not shown) to determine the position of the display substrate DS and the position of the mask assembly MA.

[0138] Once the positions of the display substrate DS and the mask assembly MA are determined, the second support portion 30 can finely adjust the position of the mask assembly MA.

[0139] Subsequently, deposition source 50 operates to supply deposition material toward mask assembly MA, and the deposition material passing through multiple deposition holes in mask sheet MS can be deposited on display substrate DS. Deposition source 50 can move parallel to display substrate DS and mask assembly MA, or display substrate DS and mask assembly MA can move parallel to deposition source 50. That is, deposition source 50 can move relative to display substrate DS and mask assembly MA. Pump 82 can evacuate gas inside chamber 90 and discharge it to the outside, thereby maintaining the pressure inside chamber 90 at a pressure equal to or close to a vacuum.

[0140] As described above, deposition material supplied from deposition source 50 passes through mask assembly MA and is deposited on display substrate DS, thereby forming at least one of multiple layers (e.g., organic layers, inorganic layers, and metal layers) stacked in the display device. Furthermore, the method for manufacturing electronic device 10 can be similar to the method for manufacturing display device described above. In one embodiment, the method for manufacturing electronic device 10 may include: positioning display substrate DS and deposition source 50 facing each other; disposing mask assembly MA between display substrate DS and deposition source 50; and depositing deposition material from deposition source 50 through deposition apertures in mask assembly MA onto display substrate DS.

[0141] Figure 9 This is a schematic plan view of an embodiment of the mask assembly. Figure 10 It is along Figure 9 A schematic cross-sectional view of an embodiment of a mask assembly taken by line X-X'.

[0142] refer to Figure 9 and Figure 10 The mask assembly MA may include a mask frame MF and a mask sheet MS.

[0143] The mask frame MF is a frame that supports the mask sheet MS, and may be a frame that defines an opening region OA at its center. In one embodiment, the mask frame MF may be a circular frame, and the opening region OA may also be defined as circular. However, the shape of the mask frame MF is not limited to this, and may be various polygonal shapes. In the following description, for convenience, the case where the mask frame MF is a circular frame will be mainly described.

[0144] A mask sheet MS can be mounted on a mask frame MF. The opening area (also referred to as the central opening area) OA of the mask frame MF can be covered by the mask sheet MS. In one embodiment, the mask sheet MS can be fixed to the mask frame MF by welding. Moreover, in one embodiment, the mask sheet MS can have a circular shape corresponding to the shape of the opening area OA of the mask frame MF.

[0145] The mask sheet MS may include a main body portion 410 and a sheet portion 420.

[0146] The body portion 410 may comprise a silicon material. In one embodiment, for example, the body portion 410 may comprise silicon oxide (SiO2). x Silicon nitride (SiN) x ) and silicon oxynitride (SiO) x N y At least one of the following materials.

[0147] The main body portion 410 may cover the opening region OA of the mask frame MF. The main body portion 410 may correspond to the shape of the mask frame MF. In one embodiment, for example, when the mask frame MF has a circular frame, the main body portion 410 may have a circular shape. However, this disclosure is not limited thereto, and the main body portion 410 may have various polygonal shapes. In the following description, for ease of description, the case where the main body portion 410 has a circular shape will be mainly described.

[0148] In one embodiment, a body opening 410OP may be defined in the body portion 410. For example, a plurality of body openings 410OP may be provided and may be spaced apart in a first direction (x-direction) and a second direction (y-direction). In other words, the body portion 410 may include lattice-shaped ribs to define a plurality of body openings 410OP.

[0149] In one embodiment, each of the plurality of body openings 410OP can be defined as having a quadrilateral shape (e.g., a rectangular shape). Each of such a plurality of body openings 410OP can correspond to the shape of the display panel. That is, each of the plurality of body openings 410OP can correspond to the shape of a single display panel unit.

[0150] The sheet portion 420 can be disposed on the main body portion 410. The sheet portion 420 can be disposed on the main body portion 410 to cover the main body opening 410OP.

[0151] In one embodiment, the sheet portion 420 may comprise a metallic material. In one embodiment, for example, the sheet portion 420 may comprise at least one of aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo). In another embodiment, the sheet portion 420 may comprise an inorganic material. In one embodiment, for example, the sheet portion 420 may comprise silicon oxide (SiO₂). x Silicon nitride (SiN) x ) and silicon oxynitride (SiO) x N y At least one of the following materials.

[0152] In one embodiment, a plurality of deposition holes 420H overlapping with a body opening 410OP may be defined in the wafer portion 420. In one embodiment, for example, one body opening 410OP may overlap with a plurality of deposition holes 420H. The shapes of the plurality of deposition holes 420H may correspond to the shape of a deposition pattern to be deposited on the display substrate DS. In one embodiment, for example, the plurality of deposition holes 420H may have a shape corresponding to an emission layer pattern of pixels to be deposited on the display substrate DS. Accordingly, deposition material may pass through the plurality of deposition holes 420H to form an emission layer (e.g., ...) on the display substrate DS. Figure 7(Emission layer 220 shown in the figure).

[0153] Figure 11 This is a schematic plan view of an embodiment of the sheet portion. Figure 11 Example Figure 9 Enlarged views of some deposition pores are shown in the image. Figure 12 It is along Figure 11 A schematic cross-sectional view of an embodiment of the slice portion cut by line XII–XII'. Figure 12 Example Figure 10 Enlarged views of some deposition pores are shown in the image. Figure 13 It is a schematic cross-sectional view of the sheet portion based on the comparative example.

[0154] refer to Figure 11 and Figure 12 Each of the plurality of deposition holes 420H can be a hole for depositing a deposition region AA on the display substrate DS. In one embodiment, the deposition region AA can be the aforementioned emitter layer 220 (see Figure 7 The area where the deposition takes place. In other words, the deposition hole 420H can be a hole used to deposit the emission layer 220. Figure 11 and Figure 12 Examples of OLEDs used for the first to third organic light-emitting diodes OLED1, OLED2 and OLED3 (see Figure 7 The deposition region AA of any one of the emission layers 220. In one embodiment, for example... Figure 11 and Figure 12 The deposition region AA illustrated herein may refer to the region where the emission layer 220 of the first organic light-emitting diode OLED1 (e.g., the emission layer 220 emitting green light) is deposited. In one embodiment, it will be understood that the emission layer 220 of the second organic light-emitting diode OLED2 (e.g., the emission layer 220 emitting red light) may be disposed between these deposition regions AA.

[0155] In one embodiment, each of the plurality of deposition wells 420H may include a main well 420MH and a secondary well 420SH.

[0156] In one embodiment, the main aperture 420MH can be connected to the pixel defining layer 130 (see...). Figure 7 The shape of the exposed pixel electrode 210 is provided to correspond to its shape. In one embodiment, for example, as... Figure 12 As shown, the pixel electrode 210 exposed through the pixel defining layer 130 can be provided in a hexagonal shape, and the main aperture 420MH can also be provided in a hexagonal shape. However, this disclosure is not limited thereto, and it will be understood that the main aperture 420MH can be provided in other polygonal or circular shapes to cover the exposed pixel electrode 210.

[0157] Furthermore, in one embodiment, the size of the main aperture 420MH can be the same as the size of the pixel electrode 210 exposed through the pixel defining layer 130 (or the size of the exposed portion of the pixel electrode 210). In other words, the width D1 of the main aperture 420MH can be the same as the width of the pixel electrode 210 exposed through the pixel defining layer 130. Accordingly, the main aperture 420MH can allow deposition material to pass through to cover the exposed pixel electrode 210 in the display substrate DS, thereby depositing the emitter layer 220.

[0158] The secondary aperture 420SH can be radially outward from the primary aperture 420MH (or defined by it). In one embodiment, the secondary aperture 420SH can be positioned around the periphery of the primary aperture 420MH. In this case, the secondary aperture 420SH can be spaced apart from the periphery of the primary aperture 420MH by a predetermined distance.

[0159] The secondary hole 420SH can have a smaller size than the main hole 420MH. In one embodiment, for example, the radial width D1 of the main hole 420MH can be greater than the radial width D2 of the secondary hole 420SH.

[0160] In one embodiment, a plurality of secondary holes 420SH may be provided. In one embodiment, the plurality of secondary holes 420SH may be spaced apart along the periphery of the main hole 420MH. In one embodiment, for example, when the main hole 420MH is provided as a polygon, the secondary holes 420SH may be provided in a number corresponding to the number of edges of the polygon, and the plurality of secondary holes 420SH may be defined to face the edges of their respective polygons. In one embodiment, for example, each of the plurality of secondary holes 420SH may be provided in the form of a quadrilateral (e.g., a rectangle) parallel to the edges of the polygon. Figure 11 Example: A main hole 420MH with a hexagonal shape and six secondary holes 420SH.

[0161] Furthermore, in one embodiment, the distance S between the main hole 420MH and the secondary hole 420SH can be less than the radial width D2 of the secondary hole 420SH. Specifically, the distance S from the periphery of the main hole 420MH to the inner periphery of the secondary hole 420SH can be less than the radial width D2 of the secondary hole 420SH.

[0162] In one embodiment, deposition material can pass through the main aperture 420MH and the secondary aperture 420SH to be deposited in the deposition region AA on the display substrate DS. The deposition material passing through the main aperture 420MH can cover the exposed pixel electrode 210, and the deposition material passing through the secondary aperture 420SH allows deposition material to be deposited around the exposed pixel electrode 210. Accordingly, an emitter layer 220 for a sub-pixel can be formed. In this case, in one embodiment, in a plan view, the main aperture 420MH and the secondary aperture 420SH can be defined (or disposed) within the deposition region AA. In one embodiment, for example, the sheet portion 420 can be configured such that the outer periphery of the secondary aperture 420SH is configured to overlap with the periphery of the deposition region AA, and deposition can then be performed.

[0163] The cross-sections of the defining main hole 420MH and secondary hole 420SH in the sheet portion 420 can be tapered. In one embodiment, for example, as... Figure 12 As shown, the cross-section of the sheet portion 420 can be tapered, such that the width of the main hole 420MH and the width of the secondary hole 420SH decrease in the direction toward the display substrate DS.

[0164] Through the embodiments of this disclosure, deposition quality can be improved compared to the case where the deposition hole 420H is provided as a single opening. Figure 13 This example illustrates the case where deposition well 420H is provided as a single opening. (Reference) Figure 13 Depositional material ejected from the sedimentary source at a relatively small incident angle may be deposited beyond the depositional area AA, causing a shadowing phenomenon. (Reference) Figure 12 In embodiments of this disclosure, deposited material sprayed at a relatively small incident angle may not be able to pass through the main aperture 420MH and the secondary aperture 420SH. That is, deposited material with a relatively large incident angle (e.g., sprayed more directly) can pass through the main aperture 420MH and the secondary aperture 420SH to be deposited on the display substrate DS. Accordingly, as Figure 12 As shown, most of the deposited material can be deposited within the deposition area AA, and shading can be prevented.

[0165] Figures 14 to 16 This is a schematic plan view of an embodiment of the sheet portion. The sheet portion in the illustrated embodiment is similar to the sheet portion described above; therefore, for ease of description, only the differences will be described below.

[0166] refer to Figure 14 The deposition well 420H may include a main well 420MH and a secondary well 420SH. The secondary well 420SH may be defined around the periphery of the main well 420MH. Moreover, the secondary well 420SH may be spaced apart from the periphery of the main well 420MH by a predetermined distance.

[0167] In one embodiment, deposition material can pass through the main aperture 420MH and the secondary aperture 420SH to be deposited in the deposition region AA on the display substrate DS. The deposition material passing through the main aperture 420MH can cover the exposed pixel electrode 210 (see...). Figure 7 Furthermore, the deposited material passing through the secondary aperture 420SH allows the deposited material to be deposited around the exposed pixel electrode 210. Accordingly, an emitter layer 220 for a sub-pixel can be formed (see...). Figure 7 In this case, in one embodiment, in a plan view, the main aperture 420MH and the secondary aperture 420SH can be defined (or configured) within the deposition region AA. In one embodiment, the sheet portion 420 can be configured such that the secondary aperture 420SH is defined inwardly spaced from the periphery of the deposition region AA, and deposition can then be performed. In other words, the secondary aperture 420SH can be defined between the periphery of the deposition region AA and the periphery of the main aperture 420MH. Accordingly, deposition material exceeding the deposition region AA can be further prevented.

[0168] refer to Figure 15 In one embodiment, the main aperture 420MH may be provided in a circular shape. Secondary apertures 420SH may be defined along the periphery of the main aperture 420MH. In one embodiment, a plurality of secondary apertures 420SH may be provided, and each of the plurality of secondary apertures 420SH may be provided in a segmented annular shape. In one embodiment, for example, as... Figure 15 As shown, two secondary holes 420SH can be provided, and each of the secondary holes 420SH can have a semi-annular shape. However, this disclosure is not limited to this, and it will be understood that two or more secondary holes 420SH can be provided. In one embodiment, for example, four secondary holes 420SH can be provided, and each of the secondary holes 420SH can be provided in a quarter-annular shape.

[0169] refer to Figure 16 In one embodiment, the secondary aperture 420SH may include a first secondary aperture 420SH1 and a second secondary aperture 420SH2. The first secondary aperture 420SH1 may be defined to surround the main aperture 420MH. Moreover, a plurality of first secondary apertures 420SH1 may be provided, and the plurality of first secondary apertures 420SH1 may be spaced apart from each other along the periphery of the main aperture 420MH. That is, a first row of apertures consisting of a plurality of first secondary apertures 420SH1 may be defined to surround the main aperture 420MH.

[0170] The second auxiliary hole 420SH2 can be disposed (or defined) outside the first auxiliary hole 420SH1 to surround the first auxiliary hole 420SH1. Multiple second auxiliary holes 420SH2 can be provided, and the multiple second auxiliary holes 420SH2 can be spaced apart from each other along the outer periphery of the multiple first auxiliary holes 420SH1. That is, a second row of holes consisting of multiple second auxiliary holes 420SH2 can be disposed to surround the first row of holes.

[0171] In this configuration, in one embodiment, each of the second secondary apertures 420SH2 can be defined to face each of the first secondary apertures 420SH1. Since the secondary apertures 420SH include the first secondary apertures 420SH1 and the second secondary apertures 420SH2, it further prevents deposited material sprayed at a relatively small incident angle from passing through the sheet portion 420, and allows deposited material with a relatively large incident angle (e.g., sprayed more directly) to pass through the sheet portion 420 more easily.

[0172] Through these examples, when depositing deposition materials on a display substrate, shading can be prevented and deposition quality can be improved.

[0173] The effects of this disclosure are not limited to those mentioned above, and those skilled in the art will clearly understand from the description of the claims that other effects not mentioned are possible.

[0174] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and are not intended to be limiting. The description of features or advantages within each embodiment should generally be considered applicable to other similar features or advantages in other embodiments. Although embodiments have been described with reference to the drawn figures, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the appended claims.

Claims

1. A mask assembly, comprising: A mask sheet, in which multiple deposition holes are defined; as well as Mask frame, supporting the mask sheet, Each of the plurality of deposition pores includes: main hole; as well as The secondary hole is defined radially outward from the main hole.

2. The mask assembly according to claim 1, The secondary hole surrounds the periphery of the main hole.

3. The mask assembly according to claim 1, The secondary holes are provided as a plurality of secondary holes, and the plurality of secondary holes are spaced apart along the periphery of the main hole.

4. The mask assembly according to claim 3, The main hole has a polygonal shape. The number of the plurality of secondary holes corresponds to the number of edges of the polygon, and the plurality of secondary holes respectively face the edges of the polygon.

5. The mask assembly according to claim 3, The main hole has a circular shape, and The secondary hole has a segmented annular shape.

6. The mask assembly according to claim 2, The secondary hole is provided as a plurality of secondary holes, and the plurality of secondary holes includes a first secondary hole surrounding the main hole and a second secondary hole defined outside the first secondary hole and surrounding the first secondary hole.

7. The mask assembly according to any one of claims 1 to 6, The radial width of the main hole is greater than the radial width of the secondary hole.

8. The mask assembly according to any one of claims 1 to 4, The distance from the periphery of the main hole to the inner periphery of the secondary hole is less than the radial width of the secondary hole.

9. A method for manufacturing a display device, the method comprising: The display substrate and the deposition source are positioned so that they face each other. A mask assembly is disposed between the display substrate and the deposition source; as well as The deposition material is deposited from the deposition source through the deposition holes of the mask assembly into the deposition area on the display substrate. The deposition wells are configured to correspond to the deposition regions and include: A main hole and a secondary hole defined radially outward from the main hole, and In the plan view, the main hole and the secondary hole are located within the deposition area.

10. The method according to claim 9, The deposition region on the display substrate where the deposition material is deposited includes forming an emission layer for a sub-pixel by depositing the deposition material in the deposition region.

11. The method according to claim 10, The emission layer of the sub-pixel is formed by depositing the deposition material through the main aperture and the sub-aperture in the deposition region.

12. The method according to claim 11, The display substrate includes a pixel electrode disposed below the emission layer of the sub-pixel, and the size of the main aperture is the same as the size of the exposed portion of the pixel electrode.

13. The method according to any one of claims 9 to 12, The placement of the mask assembly between the display substrate and the deposition source includes setting the outer periphery of the sub-hole to overlap with the periphery of the deposition region.

14. The method according to any one of claims 9 to 12, The placement of the mask assembly between the display substrate and the deposition source includes setting the outer periphery of the sub-hole to be spaced inward from the periphery of the deposition region.

15. The method according to any one of claims 9 to 12, The secondary hole surrounds the periphery of the main hole.

16. The method according to any one of claims 9 to 12, The secondary holes are provided as a plurality of secondary holes, and the plurality of secondary holes are spaced apart along the periphery of the main hole.

17. The method according to claim 16, The main hole has a polygonal shape. The number of the plurality of secondary holes corresponds to the number of edges of the polygon, and each of the plurality of secondary holes faces each of the edges of the polygon.

18. The method according to claim 16, The main hole has a circular shape, and The secondary hole has a segmented annular shape.

19. The method according to claim 16, The plurality of secondary holes includes a first secondary hole surrounding the main hole and a second secondary hole defined outside the first secondary hole and surrounding the first secondary hole.

20. A method for manufacturing an electronic device, the method comprising: The display substrate and the deposition source are positioned so that they face each other. A mask assembly is disposed between the display substrate and the deposition source; as well as The deposition material is deposited from the deposition source through the deposition holes of the mask assembly into the deposition area on the display substrate. The deposition wells are configured to correspond to the deposition regions and include: A main hole and a secondary hole defined radially outward from the main hole, and In the plan view, the main hole and the secondary hole are located within the deposition area.

Images