Flow uniformizing device and reaction furnace

Abstract

The application provides a flow uniformizing device and a reaction furnace, and relates to the field of semiconductor processing, and solves the technical problem of poor flow uniformizing effect of a traditional flow uniformizing plate. The flow uniformizing device comprises: a plurality of annular flow uniformizing members, the plurality of flow uniformizing members are nested in sequence, and are arranged in a furnace body, each flow uniformizing member is arranged around an axis of the furnace body, the innermost flow uniformizing member has a process space, the process space is configured to accommodate a product, the flow uniformizing member has a plurality of flow uniformizing holes, the furnace body has an air inlet, and process gas can enter the process space through the air inlet and the flow uniformizing holes of the plurality of flow uniformizing members in sequence to perform film plating on the product. By arranging the plurality of annular flow uniformizing members, the process gas entering from the air inlet can experience multiple flow uniformizing when moving along the radial direction of the furnace body, each flow uniformizing can adjust the distribution, flow rate or pressure of the process gas, the density, flow rate and pressure distribution of the process gas in the circumferential direction and the radial direction are more uniform, and the film plating quality is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, specifically to a flow equalization device and a reaction furnace. Background Technology

[0002] Chemical vapor deposition (CVD) is widely used in the semiconductor and photovoltaic industries to deposit functional thin films on product surfaces. For multi-plate, horizontal, or large-cavity CVD reactors, the stability and uniformity of the gas flow field within the reaction chamber directly determine the uniformity of the deposited film thickness and the consistency of the film properties.

[0003] In related technologies, to improve gas distribution within the furnace, a single-layer annular flow equalizer with multiple flow equalization holes is typically installed inside the furnace. However, this single-layer structure has significant limitations in practical applications. Specifically, due to the thickness of the single-layer flow equalizer, the process gas must pass through the plate in one go for forced throttling. Its narrow flow channel causes the process gas to abruptly drop from a high-pressure intake state at the outer ring to a low-pressure state in the central region within a very short path, creating a large radial pressure difference within the furnace and a significant velocity gradient in the radial direction, making it impossible to achieve uniform distribution of the process gas within the furnace. Furthermore, the single-layer flow equalizer cannot solve the local airflow turbulence caused by structural differences within the furnace (such as product placement and furnace wall heat radiation). Velocity and pressure distribution deviations typically exceed 10%, easily leading to problems such as uneven film thickness and significant edge effects. Therefore, relying solely on a single-layer annular flow equalizer for flow equalization results in high airflow resistance, low gas utilization, and insufficient flow equalization effect within the furnace, leading to significant waste of process gas and poor coating quality of the product. Summary of the Invention

[0004] To address the aforementioned technical problems, this application is proposed. Embodiments of this application provide a flow equalization device and a reaction furnace.

[0005] In a first aspect, one embodiment of this application provides a flow equalization device, which includes: multiple annular flow equalization elements, the multiple flow equalization elements being nested sequentially and disposed within a furnace body, each flow equalization element being arranged around the axis of the furnace body, the innermost flow equalization element having a process space configured to accommodate a product, the flow equalization element having multiple flow equalization holes, the furnace body having an air inlet, and process gas being able to sequentially enter the process space through the air inlet and the flow equalization holes of the multiple flow equalization elements to coat the product.

[0006] In some embodiments, for two adjacent flow equalizers, the diameter of the flow equalizer hole closer to the process space is smaller than the diameter of the flow equalizer hole farther from the process space; and / or, the multi-layer flow equalizer includes at least one set of flow equalizers, the at least one set of flow equalizers includes a plurality of sequentially adjacent flow equalizers, for any one set of flow equalizers in the at least one set of flow equalizers, the flow equalizer holes of each flow equalizer in the set of flow equalizers are respectively arranged in a one-to-one correspondence, the corresponding flow equalizer holes are arranged opposite each other in the radial direction of the furnace body, and the corresponding flow equalizer holes all extend in the radial direction of the furnace body; and / or, the multi-layer flow equalizer includes at least one set of flow equalizers, the at least one set of flow equalizers includes a plurality of sequentially adjacent flow equalizers, for any one set of flow equalizers in the at least one set of flow equalizers, the flow equalizer holes of each flow equalizer in the set of flow equalizers are respectively arranged in a one-to-one correspondence, the corresponding flow equalizer holes form a continuous channel.

[0007] In some embodiments, the flow equalization element adjacent to the furnace body is the outermost flow equalization element, the diameter of the flow equalization hole of the outermost flow equalization element is in the range of 2 mm to 5 mm, the diameter of the flow equalization hole of the innermost flow equalization element is in the range of 0.5 mm to 1 mm, and the diameter of the flow equalization hole of the flow equalization element located between the outermost and innermost layers is in the range of 1 mm to 2 mm.

[0008] In some embodiments, the aperture of the flow equalization holes of at least one flow equalization element gradually decreases in the radial direction of the furnace body from away from the process space to closer to the process space.

[0009] In some embodiments, the flow equalization device further includes: a plurality of guide vanes disposed between adjacent flow equalization elements, the guide vanes being configured to block or expose at least one flow equalization hole of at least one layer of adjacent flow equalization elements; a plurality of driving elements, the driving elements being disposed corresponding to at least one guide vane, the driving elements being configured to drive the corresponding at least one guide vane to rotate, so as to adjust the blocking area of ​​the flow equalization hole by the guide vane or to expose the flow equalization hole by the guide vane.

[0010] In some embodiments, a plurality of guide vanes are disposed between two adjacent layers of flow equalizers, the guide vanes being configured to block or expose at least one flow equalizer hole of the two adjacent layers of flow equalizers; and / or, the innermost flow equalizer has a plurality of guide grooves arranged sequentially along the extension direction of the furnace body axis on the side near the process space, the guide grooves being arranged around the process space, the guide grooves communicating with the flow equalizer holes, the guide grooves being configured to guide the process gas to flow radially towards the process space along the furnace body; and / or, a plurality of guide vanes are disposed on the side of the innermost flow equalizer away from the process space.

[0011] In some embodiments, the flow equalization device further includes: at least one flow velocity sensor disposed on the flow equalization element and configured to detect actual flow velocity data of the process gas; at least one pressure sensor disposed on the flow equalization element and configured to detect actual pressure data of the process gas; and a control component communicatively connected to at least one flow velocity sensor, at least one pressure sensor, and a plurality of driving elements, configured to receive actual flow velocity data detected by at least one flow velocity sensor and actual pressure data detected by at least one pressure sensor, generate at least one first control command based on the actual flow velocity data, actual pressure data, preset flow velocity data, and preset pressure data, and send the at least one first control command to the corresponding at least one driving element so that the corresponding at least one driving element drives the corresponding at least one guide vane to rotate.

[0012] Secondly, one embodiment of this application provides a reactor, including: a furnace body configured to contain a product; and a flow equalization device according to any of the first aspects described above, disposed within the furnace body and configured to equalize the process gas within the furnace body.

[0013] In some embodiments, the furnace body has a plurality of air inlets arranged circumferentially along the furnace body, the air inlets being configured to introduce process gas; and / or, the inner wall of the furnace body has a plurality of guide plates spaced apart circumferentially along the furnace body, the guide plates being parallel to the radial direction of the furnace body.

[0014] In some embodiments, the inner wall of the furnace body has a plurality of guide plates spaced apart circumferentially along the furnace body, the guide plates being parallel to the radial direction of the furnace body, and the extending direction of the guide plates intersecting the extending direction of the axis of the furnace body.

[0015] The flow equalization device and reactor proposed in this application, by setting up multi-layer annular flow equalization components, allow the process gas entering from the inlet to undergo multiple flow equalizations as it moves radially along the furnace body. Each flow equalization can adjust the distribution, velocity, or pressure of the process gas, making the density, velocity, and pressure distribution of the process gas more uniform in both the circumferential and radial directions, thereby improving the coating quality. Furthermore, by adjusting the process gas through multiple flow equalizations, compared to rectifying the process gas only once using a single-layer flow equalization plate, the process gas can be gradually rectified, progressively adjusting its velocity and distribution, reducing the pressure difference within the furnace body and the radial velocity gradient of the process gas, thereby reducing airflow resistance, improving gas utilization, and lowering process costs. Attached Figure Description

[0016] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a schematic diagram of the structure of a reactor provided in an exemplary embodiment of this application.

[0018] Figure 2 The diagram shown is a structural schematic of a furnace body provided in an exemplary embodiment of this application.

[0019] Figure 3 The diagram shown is a schematic representation of the flow equalization element, flow guide vane, and drive element provided in an exemplary embodiment of this application.

[0020] Figure 4 The image shown is a top view of a reactor provided in an exemplary embodiment of this application.

[0021] Figure 5 The diagram shown is a structural schematic of the main body and the guide plate provided in an exemplary embodiment of this application.

[0022] Figure 6 The diagram shown is a schematic representation of the deflector posture provided in an exemplary embodiment of this application.

[0023] Figure label: 100. Flow equalization device; 110. Furnace body; 111. Baffle plate; 112. Air inlet; 113. Main body; 114. Air inlet pipe; 120. Flow equalization component; 120a. First flow equalization component; 120b. Second flow equalization component; 120c. Third flow equalization component; 121. Flow guide groove; 122. Flow equalization hole; 123. Channel; 130. Process space; 131. Edge area; 132. Flow guide channel; 140. Flow guide blade; 150. Drive component; 160. Flow velocity sensor; 170. Pressure sensor; 180. Control component; 190. Temperature sensor; 200. Reactor; 300. Product; L. Axis. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Figure 1 The diagram shown is a schematic representation of the structure of a reactor provided in an exemplary embodiment of this application. Figure 2 The diagram shown is a schematic representation of the furnace body provided in an exemplary embodiment of this application. To clearly illustrate the internal structure of the flow equalization device 100, the top of the furnace body 110 is hidden in the accompanying drawings provided in this embodiment.

[0026] like Figure 1 As shown in the figure, this application embodiment provides a flow equalization device 100, which includes: multiple annular flow equalization elements 120. The multiple flow equalization elements 120 are nested sequentially and disposed within a furnace body 110. Each layer of flow equalization elements 120 is arranged around the axis L of the furnace body 110. The innermost flow equalization element 120 has a process space 130, which is configured to accommodate a product 300. The flow equalization element 120 has multiple flow equalization holes 122, and the furnace body 110 has an air inlet 112. Process gas can sequentially enter the process space 130 through the air inlet 112 and the flow equalization holes 122 of the multiple flow equalization elements 120 to coat the product 300.

[0027] Specifically, the furnace body 110 can be a cylindrical or near-cylindrical structure, and the central area of ​​the furnace body 110 is the process space 130, which is used to accommodate multiple products 300 to be coated. The bottom of the furnace body 110 has an exhaust port, which can be pumped to a vacuum state inside the furnace body 110 by a pump unit.

[0028] Specifically, the multi-layer flow equalizers 120 are all annular in structure and are coaxially arranged along the axis L of the furnace body 110. For example, the multi-layer flow equalizers 120 include an outermost first flow equalizer 120a, a middle second flow equalizer 120b, and an innermost third flow equalizer 120c. The third flow equalizer 120c has a process space 130. The second flow equalizer 120b is fitted outside the third flow equalizer 120c, and the first flow equalizer 120a is fitted outside the second flow equalizer 120b.

[0029] Specifically, each layer of flow equalization component 120 is provided with multiple flow equalization holes 122. The multiple flow equalization holes 122 are evenly arranged in M ​​columns and N rows along the circumference and axial direction of the flow equalization component 120. This is used to disperse the process gas passing through the multiple flow equalization holes 122 into multiple relatively uniform small streams of gas flow, thereby achieving the functions of flow equalization, regulating gas pressure and process gas flow rate. Moreover, this regular arrangement method is relatively convenient to process. M and N are both positive integers.

[0030] Specifically, the furnace body 110 is provided with at least one air inlet 112, preferably multiple air inlets 112 distributed circumferentially. For example, the furnace body 110 includes a main body 113 and at least one air inlet pipe 114. The main body 113 has at least one mounting port, and the air inlet pipe 114 passes through the mounting port. The opening of the air inlet pipe 114 for introducing process gas is the air inlet 112.

[0031] For example, the distance between adjacent flow equalizers 120 ranges from 8 mm to 25 mm. The actual spacing can be adjusted according to the size of the furnace body 110 and process requirements to ensure gradient flow equalization effect.

[0032] Traditional flow equalization devices are mostly rigid structures, operating under high temperature and vacuum conditions (such as the 800℃~1200℃ high temperature required for CVD processes). Pa~ Under vacuum conditions (Pa), it is prone to thermal expansion and deformation, and cannot adaptively compensate for the flow uniformity deviation caused by the deformation, thus affecting the flow uniformity stability. Therefore, the flow uniform component 120 can be made of high-temperature resistant ceramic materials, such as silicon carbide (chemical formula SiC) and alumina (chemical formula... Made of materials such as [material name], it possesses characteristics such as high temperature resistance, vacuum resistance, non-volatile properties, and resistance to deformation. It can adaptively compensate for deviations caused by high temperature thermal expansion, adapt to the high temperature vacuum process environment of CVD, and ensure that the device can maintain a stable flow uniformity effect under extreme operating conditions, thereby reducing the failure rate.

[0033] When the gas source supplies process gas to the flow equalization device 100, the process gas first reaches the edge region 131 inside the furnace body 110 through the gas inlet 112, and then passes through the flow equalization holes 122 of the multi-layer flow equalization element 120 from the outside to the inside and enters the process space 130.

[0034] In the above embodiments, by setting up multi-layer annular flow equalizers 120, the process gas entering from the inlet 112 can undergo multiple flow equalizations as it moves radially along the furnace body 110. Each flow equalization can adjust the distribution, velocity, or pressure of the process gas, making the density, velocity, and pressure distribution of the process gas more uniform in the circumferential and radial directions, thereby improving the coating quality. Furthermore, by adjusting the process gas through multiple flow equalizations, compared to rectifying the process gas only once using a single-layer flow equalizer, the process gas can be gradually rectified, gradually adjusting its velocity and distribution, reducing the pressure difference within the furnace body 110 and the radial velocity gradient of the process gas, thereby reducing airflow resistance, improving gas utilization, and reducing process costs.

[0035] In some embodiments, for two adjacent flow equalizers 120, the aperture of the flow equalizer hole 122 of the flow equalizer 120 closer to the process space 130 is smaller than the aperture of the flow equalizer hole 122 of the flow equalizer 120 farther from the process space 130.

[0036] For example, the diameter of the flow equalization hole 122 of the third flow equalization member 120c is larger than the diameter of the flow equalization hole 122 of the second flow equalization member 120b, and the diameter of the flow equalization hole 122 of the second flow equalization member 120b is larger than the diameter of the flow equalization hole 122 of the first flow equalization member 120a.

[0037] In the above embodiments, by making the aperture of the flow equalization holes 122 of the multi-layer flow equalization member 120 decrease sequentially from the outside to the inside, the following advantages are achieved.

[0038] First, taking a flow equalization device 120 with three or more layers as an example, the outer layer with a large aperture 120 initially disperses the large stream of process gas entering through the inlet 112, eliminating macroscopic airflow non-uniformity; the middle layer with a medium aperture 120 further homogenizes the gas with a medium aperture, reducing the velocity gradient; the inner layer with a small aperture 120 finally performs fine rectification of the airflow, eliminating microscopic velocity fluctuations and local turbulence, so that the airflow entering the process space 130 has both high uniformity and high stability. This progressive layering results in higher flow equalization accuracy.

[0039] Second, if a single-layer flow equalizer with a small orifice is used directly, the total airflow resistance is too high, making it difficult to distribute the process gas evenly and resulting in severe pressure loss. In the above embodiment, a gradient design with large orifices in front and small orifices behind is used to gradually release the flow resistance radially, resulting in a more stable airflow and a more reasonable pressure loss distribution.

[0040] Third, as the process gas flows from the inner edge region 131 of the furnace body 110 to the process space 130, the pressure gradually decreases. The outer high-pressure zone uses a large aperture to ensure sufficient flow capacity, while the inner low-pressure zone uses a small aperture for fine control. This makes the gas load of each flow equalizer 120 more matched with the gas pressure in its area, avoiding local overload or underload problems.

[0041] Fourth, the combined use of the multi-layer flow equalizer 120 results in a significantly better overall flow equalization effect than a single-layer flow equalizer, and it also exhibits stronger resistance to intake fluctuations and better process robustness.

[0042] In some embodiments, the flow equalization element 120 adjacent to the furnace body 110 is the outermost flow equalization element 120. The diameter of the flow equalization hole 122 of the outermost flow equalization element 120 is in the range of 2 mm to 5 mm. The diameter of the flow equalization hole 122 of the innermost flow equalization element 120 is in the range of 0.5 mm to 1 mm. The diameter of the flow equalization hole 122 of the flow equalization element 120 located between the outermost and innermost layers (i.e., the flow equalization element 120 of the middle layer) is in the range of 1 mm to 2 mm.

[0043] For example, the diameter of the flow equalization holes 122 of the outermost flow equalization element 120 is 2 mm, 3 mm, 4 mm, or 5 mm. The diameter of the flow equalization holes 122 of the innermost flow equalization element 120 is 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm. The diameter of the flow equalization holes 122 of the intermediate flow equalization element 120 is 1 mm, 1.3 mm, 1.5 mm, 1.7 mm, or 1.9 mm.

[0044] For example, the diameter of the flow equalization hole 122 of the first flow equalization member 120a is in the range of 2 mm to 5 mm, the diameter of the flow equalization hole 122 of the second flow equalization member 120b is in the range of 1 mm to 2 mm, and the diameter of the flow equalization hole 122 of the third flow equalization member 120c is in the range of 0.5 mm to 1 mm.

[0045] In the above embodiments, by limiting the aperture range of the flow equalization holes 122 of the outermost, middle, and innermost flow equalization components 120 to 2 mm~5 mm, 1 mm~2 mm, and 0.5 mm~1 mm respectively, a progressive graded flow equalization system is constructed. This system can gradually equalize the process gas, significantly reduce the velocity distribution deviation and pressure distribution deviation without significantly increasing the overall flow resistance, and reduce the local turbulence problems caused by high-speed jets and structural obstructions. This improves the stability and uniformity of the airflow in the process space 130, improves the coating quality, and takes into account the gas utilization rate and process window stability under high-temperature vacuum conditions.

[0046] In some embodiments, the multilayer flow equalizer 120 includes at least one set of flow equalizers 120, and the at least one set of flow equalizers 120 includes a plurality of sequentially adjacent flow equalizers 120. For any set of flow equalizers 120 in the at least one set of flow equalizers 120, the flow equalizer holes 122 of each flow equalizer 120 in the set of flow equalizers 120 are respectively provided in a one-to-one correspondence. The corresponding flow equalizer holes 122 are arranged opposite to each other in the radial direction of the furnace body 110, and the corresponding flow equalizer holes 122 all extend in the radial direction of the furnace body 110.

[0047] Specifically, in a set of flow equalizers 120, the flow equalizer holes 122 corresponding to each layer of flow equalizers 120 are directly opposite each other in the radial direction of the furnace body 110, forming a row of holes aligned radially. The extension direction of each flow equalizer hole 122 is along the radial direction of the furnace body 110, so that the process gas can pass through the corresponding flow equalizer holes 122 of each layer of flow equalizers 120 in the radial direction in sequence.

[0048] For example, the first flow equalizer 120a, the second flow equalizer 120b, and the third flow equalizer 120c form a group of flow equalizers 120, and the flow equalizer holes 122 of each of the first flow equalizer 120a, the second flow equalizer 120b, and the third flow equalizer 120c are all correspondingly provided. For example, if the flow equalizer holes 1 of the first flow equalizer 120a, the flow equalizer holes 2 of the second flow equalizer 120b, and the flow equalizer holes 3 of the third flow equalizer 120c are all correspondingly provided, then the flow equalizer holes 1, 2, and 3 are arranged sequentially along a radial direction and all extend along that radial direction.

[0049] In the above embodiments, by aligning the flow equalization holes 122 on the multilayer flow equalization member 120 radially and extending them radially, the following advantages are achieved.

[0050] First, a complete coaxial gradient airflow channel was constructed. The process gas flows in a straight radial direction from the edge region 131 to the process space 130, with no bends or lateral diffusion in the airflow path, and the pressure decreases uniformly in the radial direction, thus ensuring that the basic conditions for gas intake are completely consistent throughout the circumference of the furnace body 110.

[0051] Second, the zonal adjustment logic of the guide vane 140 is matched (details of the guide vane 140 are provided in the embodiments below). The rotation of the guide vane 140 only affects the flow area of ​​the corresponding channel, and the airflow in each region in the circumferential direction does not interfere with each other, thus achieving independent and precise compensation for each zone. If the flow equalization hole 122 is misaligned in the circumferential direction, the airflow will mix across channels in the gap between the two flow equalization elements 120, and the adjacent regions will generate coupling interference when the guide vane 140 adjusts the airflow, which cannot meet the control requirements of high-precision zonal uniformity.

[0052] Third, the variable-diameter flow equalization orifice 120 is adapted (details of the variable-diameter flow equalization orifice 120 are provided in the embodiments below). For two adjacent flow equalization elements 120, when the columnar airflow output from the flow equalization orifice 120 of the outer flow equalization element 120 is relatively stable and precisely aligned with the inlet of the variable-diameter flow equalization orifice 120 of the inner flow equalization element 120, the variable-diameter flow equalization orifice 120 can effectively gather and buffer the incoming flow, further smoothing the velocity distribution and achieving fine rectification. If the orifice is misaligned, the high-speed columnar airflow will directly impact the sidewall of the variable-diameter flow equalization orifice 120, inducing local turbulence and thus disrupting the flow equalization effect.

[0053] Fourth, it simplifies the intelligent control algorithm. The coaxial corresponding channel structure can establish a standardized circumferential-radial standardized airflow model. The control component 180 (such as a programmable logic controller (PLC) – details of the control component 180 are provided in the embodiments below) only needs to calculate the flow velocity or pressure deviation based on single-channel parameters. There is no need to compensate for the coupling error introduced by cross-channel flow, which significantly reduces the computational load of the control module and improves the response speed and reliability of adaptive adjustment.

[0054] In some embodiments, the multilayer flow equalizer 120 includes at least one set of flow equalizers 120, and the at least one set of flow equalizers 120 includes a plurality of sequentially adjacent flow equalizers 120. For any set of flow equalizers 120 in the at least one set of flow equalizers 120, the flow equalizer holes 122 of each flow equalizer 120 in the set of flow equalizers 120 are respectively provided in a one-to-one correspondence, and the corresponding flow equalizer holes 122 form a continuous channel 123.

[0055] Specifically, for any set of flow equalizers 120, adjacent flow equalizers 120 can be tightly attached together so that there is no gap between the corresponding flow equalizer holes 122 (or the gap is so small as to be negligible), thereby forming a continuous channel 123; or, a first sealing member can be provided between adjacent flow equalizers 120, the first sealing member having at least one connecting hole, and the flow equalizer holes 122 of adjacent flow equalizers 120 are respectively connected to the two ends of the connecting hole without gap (or the gap is so small as to be negligible), thereby forming a continuous channel 123.

[0056] Here, the first seal and the second seal (described later) can both be high-temperature metal seals. By setting multiple seals as described above, it is possible to adapt to... Pa~ The vacuum environment of Pa ensures reliable sealing performance, preventing process gas leakage and the entry of external impurities, thus ensuring the smooth progress of the CVD process.

[0057] For example, in a group of flow equalizers 120, the corresponding flow equalizer holes 122 in each layer of flow equalizers 120 are radially aligned, extend radially, and can form a continuous through channel 123.

[0058] For two adjacent flow equalizers 120, if a gap is reserved between them, the process gas will experience lateral flow and mixing between the adjacent flow equalizers 120 after passing through the equalization holes 122 of the outer flow equalizer 120. Although this method can achieve a certain flow equalization effect, it has two drawbacks: first, the gas is prone to forming local eddies between adjacent flow equalizers 120, resulting in increased pressure loss; second, the flow direction becomes turbulent after the gas diffuses laterally, which greatly increases the pressure and velocity deviations that the subsequent inner flow equalizer 120 needs to compensate for, resulting in a larger adjustment range of the guide vane 140, making it difficult to guarantee control accuracy and easily exceeding the set deviation threshold.

[0059] In the above embodiments, by forming continuous channels 123 in the corresponding flow equalization holes 122 on the multilayer flow equalization member 120, the following advantages are achieved.

[0060] First, it blocks the lateral flow of process gas between layers. For two adjacent flow equalizers 120, after the process gas passes through the flow equalizer hole 122 of the outer flow equalizer 120, it can only enter the flow equalizer hole 122 of the inner flow equalizer 120 aligned with it radially. There is no lateral diffusion path for the process gas between the two flow equalizers 120, thereby eliminating the eddies between adjacent flow equalizers 120 and significantly reducing the pressure loss of the airflow.

[0061] Secondly, it achieves precise pressure regulation and flow rate adjustment in stages. For two adjacent flow equalization elements 120, the outer flow equalization element 120 (such as the first flow equalization element 120a) is responsible for primary pressure reduction, providing coarse adjustment in the high flow rate range; the middle flow equalization element 120 (such as the second flow equalization element 120b) undertakes secondary pressure stabilization, further refining the flow rate range. After the two-stage flow equalization holes 122 form continuous coaxial channels 123, each flow equalization element 120 only undertakes the task of pressure attenuation in a fixed range, making the pressure and flow rate of the process gas controllable in stages and achieving higher flow equalization accuracy.

[0062] Third, it reduces the burden on the back-end adaptive adjustment. For the multi-layer flow equalizer 120, at least one outer flow equalizer 120 (such as the first flow equalizer 120a) and at least one intermediate flow equalizer 120 (such as the second flow equalizer 120b) have pre-completed a stable gradient pressure distribution. Only the innermost flow equalizer 120 (such as the third flow equalizer 120c) needs to work with the fine-tuning mechanism such as the guide vane 140 to make small compensations to meet the final flow equalization requirements. This narrows the rotation angle range of the guide vane 140, reduces the response frequency of the drive component 150, and makes it easier to stably control the overall airflow distribution deviation within the preset range (e.g., ≤5%), thereby improving the system's adjustment efficiency and reliability.

[0063] Fourth, the structure is compact and suitable for high-temperature vacuum environments. The design of continuous channels 123 eliminates the cavity between two adjacent flow equalizers 120, reducing the space for process gas to stagnate under high-temperature conditions and lowering the risk of high-temperature impurity deposition. At the same time, this structure shortens the overall radial dimension of multiple flow equalizers 120, making it suitable for narrow-cavity horizontal CVD reactors, reducing the volume of the vacuum chamber, and improving vacuum pumping efficiency.

[0064] In some embodiments, the aperture of the flow equalization holes 122 of at least one flow equalization element 120 gradually decreases along the radial direction of the furnace body 110 from away from the process space 130 to close to the process space 130.

[0065] Specifically, the diameter of the flow equalization holes 122 of at least one layer of flow equalization element 120 gradually decreases along the radial direction of the furnace body 110 from away from the process space 130 to closer to the process space 130, that is, the flow equalization holes 122 are variable diameter flow equalization holes 122 with gradually decreasing diameter. Preferably, the diameter of the flow equalization holes 122 of the innermost flow equalization element 120 (such as the third flow equalization element 120c) gradually decreases along the radial direction of the furnace body 110 from away from the process space 130 to closer to the process space 130; except for the innermost flow equalization element 120, the diameter of the flow equalization holes 122 of other flow equalization elements 120 can be constant.

[0066] For example, in a certain layer of flow equalization device 120, the opening diameter of the flow equalization hole 122 of the flow equalization device 120 away from the process space 130 is 0.8 mm, and the opening diameter of the hole closer to the process space 130 is 0.5 mm.

[0067] In related technologies, the flow equalization holes on the flow equalization plate are typically right-angled openings with a constant diameter. When process gas enters the opening, boundary separation occurs, forming a vortex region and continuously increasing flow resistance. In the above embodiment, by adopting a flow equalization hole 122 structure with a radially decreasing diameter and a smoothly transitioning inclined surface on the hole wall, the flow cross-sectional area gradually decreases after the gas enters the channel, and the flow velocity increase process is continuous and gentle. This reduces the vortices generated when the process gas passes through the flow equalization hole 120, improves airflow stability, and reduces airflow resistance.

[0068] Figure 3 The diagram shown is a schematic representation of the flow equalization element, flow guide vane, and drive element provided in an exemplary embodiment of this application.

[0069] In some embodiments, such as Figure 3 As shown, the flow equalization device 100 further includes a plurality of guide vanes 140 and a plurality of driving members 150. The plurality of guide vanes 140 are disposed between adjacent flow equalization members 120, and the guide vanes 140 are configured to either block or expose at least one flow equalization hole 122 of at least one layer of adjacent flow equalization members 120. The driving member 150 is correspondingly disposed to at least one guide vane 140, and the driving member 150 is configured to drive the corresponding at least one guide vane 140 to rotate, thereby adjusting the blocking area of ​​the guide vane 140 on the flow equalization hole 122 or exposing the flow equalization hole 122 by the guide vane 140.

[0070] Specifically, the guide vanes 140 are preferably positioned between the intermediate flow equalizer 120 and the innermost flow equalizer 120, and are evenly spaced along the circumference of the furnace body 110. The guide vanes 140 can be made of high-temperature alloy sheets with a thickness ranging from 0.1 mm to 0.3 mm. They are lightweight, have a fast response time, and are coated with a high-temperature resistant boron nitride coating to prevent oxidation and deformation at high temperatures, thus extending their service life. The size and position of the guide vanes 140 should be compatible with the distribution of the corresponding flow equalizer holes 122, ensuring that each guide vane 140 can precisely adjust the airflow through its corresponding area, achieving localized fine-tuning and ensuring uniform airflow throughout the entire furnace body 110.

[0071] Specifically, the guide vane 140 can contact the flow equalizer 120, or have a small gap with it. When rotated to a set first angle range, the guide vane 140 can block one or more flow equalizer holes 122. By rotating the guide vane 140, the area of ​​the flow equalizer hole 122 blocked by the guide vane 140 can also be adjusted, thereby finely adjusting the process gas flow rate. The guide vane 140 can be used to block the inlet side or outlet side of the flow equalizer hole 122.

[0072] Specifically, the drive unit 150 may include a stepper motor. The drive unit of the stepper motor is located below the bottom of the furnace body 110, and the drive shaft of the stepper motor passes through a mounting hole at the bottom of the furnace body 110 and is connected to one or more guide vanes 140, thereby driving one or more guide vanes 140 to rotate. The response time of the stepper motor is ≤0.5 s, and the rotation accuracy is ±0.5°. The driving process involves no mechanical friction and no dust generation, avoiding contamination of the furnace body 110.

[0073] For example, the guide vane 140 can be used to block or expose the flow equalization hole 122 of the third flow equalizer 120c and / or the flow equalization hole 122 of the second flow equalizer 120b.

[0074] For example, the guide vane 140 can be used to shield or expose a row of flow equalization holes 120 arranged sequentially along the axial direction of the flow equalization element 120.

[0075] For example, the axis of the guide vane 140 is parallel to the axis of the furnace body 110, and the drive member 150 can drive the guide vane 140 to rotate around the axis.

[0076] For example, the rotation angle range of the guide vane 140 is 0° to 45°.

[0077] For example, the flow equalization device 100 further includes a guide rail. The guide rail is disposed at the edge of the flow equalization member 120 and arranged in a ring shape to assist the guide vane 140 in rotating stably, avoid airflow impact causing the guide vane 140 to deviate, and improve adjustment stability.

[0078] For example, a second seal may also be provided between the drive shaft and the bottom of the furnace body 110 to prevent the gap between the inner wall of the mounting hole and the drive shaft from affecting the sealing performance of the furnace body 110.

[0079] In related technologies, the single-layer flow uniform plate structure is fixed and cannot be adapted to the requirements of different CVD processes (such as different types of process gases, flow rates, and pressures). When the process parameters are adjusted, it is impossible to achieve uniform distribution of process gases, resulting in poor versatility.

[0080] In the above embodiments, by setting guide vanes 140 and driving them to rotate via a drive unit 150, the shielding area of ​​the guide vanes 140 on the uniform flow holes 122 is adjusted, enabling the uniform flow device 100 to dynamically fine-tune the local airflow in different regions. When the flow velocity or pressure in a certain region is too high, the gas flow rate through that region can be reduced by increasing the shielding area of ​​the guide vanes 140 on the uniform flow holes 122. When the flow velocity or pressure in a certain region is too low, the shielding area of ​​the guide vanes 140 on the uniform flow holes 122 can be reduced, or even the corresponding uniform flow holes 122 can be completely exposed to increase the gas throughput. This allows for fine-tuning of local flow velocity and pressure, compensating for local airflow turbulence in the furnace body 110, enhancing adaptability to different process parameters and product 300 loading states, and improving the uniformity of chemical vapor deposition coating.

[0081] In some embodiments, such as Figure 1 and Figure 3 As shown, a plurality of guide vanes 140 are disposed between two adjacent layers of flow equalizers 120, and the guide vanes 140 are configured to block or expose at least one flow equalizer hole 122 of the two adjacent layers of flow equalizers 120.

[0082] Specifically, when the guide vane 140 rotates to a preset second angle range, it can simultaneously block part of the flow equalization holes 122 of each of the two adjacent flow equalization components 120; or, when the guide vane 140 rotates to a preset third angle range, it can block part of the flow equalization holes 122 of one of the two adjacent flow equalization components 120, and when the guide vane 140 rotates to a preset fourth angle range, it can block part of the flow equalization holes 122 of the other of the two adjacent flow equalization components 120. The third angle range and the fourth angle range may overlap or not overlap.

[0083] In the above embodiments, the guide vane 140 can block or expose the flow equalization holes 122 of the two flow equalization elements 120, and adjust the blocking area of ​​the flow equalization holes 122 of the two flow equalization elements 120. Therefore, the guide vane 140 can more accurately and flexibly adjust the airflow passage area of ​​the corresponding area, realize more precise fine-tuning of local flow velocity and pressure, thereby compensating for local airflow turbulence in the furnace body 110 and improving the uniformity of the chemical vapor deposition process.

[0084] In some embodiments, a plurality of guide vanes 140 are disposed on the side of the innermost flow equalizer 120 away from the process space 130.

[0085] Specifically, multiple guide vanes 140 are disposed between the innermost flow equalizer 120 and the adjacent intermediate flow equalizer 120. For example, multiple guide vanes 140 are disposed between the second flow equalizer 120b and the third flow equalizer 120c. The multiple guide vanes 140 can be used to block or expose some of the flow equalizer holes 122 of the innermost flow equalizer 120; or, the multiple guide vanes 140 can be used to block or expose some of the flow equalizer holes 122 of the innermost flow equalizer 120, as well as some of the flow equalizer holes 122 of the intermediate flow equalizer 120 adjacent to the innermost flow equalizer 120.

[0086] In the above embodiment, since the innermost flow equalizer 120 is used to regulate the process gas about to enter the process space 130, by setting multiple guide vanes 140 on the side of the innermost flow equalizer 120 away from the process space 130, the flow rate and pressure of the airflow about to enter the process space 130 can be finely adjusted, so that the regulated process gas directly enters the process space 130 with a uniform flow rate and pressure. This can significantly improve the airflow uniformity in the process space 130, thereby significantly improving the coating uniformity of the product.

[0087] In some embodiments, such as Figure 3 As shown, the innermost flow equalizer 120 has a plurality of flow guide grooves 121 arranged sequentially along the extension direction of the axis L of the furnace body 110 on the side near the process space 130. The flow guide grooves 121 are arranged around the process space 130 and are connected to the flow equalizer holes 122. The flow guide grooves 121 are configured to guide the process gas to flow radially from the furnace body 110 to the process space 130.

[0088] Specifically, the guide channel 121 can be in the form of a ring structure, and multiple guide channels 121 can be arranged sequentially along the extension direction of the axis L of the furnace body 110. Alternatively, multiple guide channels 121 can be arranged in A rows and B columns along the extension direction of the axis L of the furnace body 110 and the circumference of the furnace body 110, with B guide channels in each row surrounding the process space 130. A and B are both positive integers.

[0089] Specifically, the opening of the guide channel 121 faces the process space 130, and the bottom of the channel is radially opposite to the opening. The flow equalization hole 122 can be set at the bottom of the guide channel 121. Each guide channel 121 is connected to at least one flow equalization hole 122, so that the process gas ejected from the flow equalization hole 122 first enters the interior of the guide channel 121. The wall of the guide channel 121 is parallel to the radial direction of the furnace body 110, and the process gas can flow smoothly radially to the process space 130 under the guidance of the wall of the guide channel 121.

[0090] In the above embodiment, a guide groove 121 communicating with the flow equalization hole 122 is provided on the side of the innermost flow equalization component 120 near the process space 130. This can achieve circumferential pressure equalization and radial rectification, effectively solving the problems of local high-speed jets and uneven flow field generated after the airflow is ejected from the flow equalization hole 122. Specifically, it has the following advantages.

[0091] First, after the process gas flows out from the flow equalization hole 122 of the innermost flow equalization component 120, it enters the interior of the flow guide groove 121. The gas flows circumferentially in the groove and is fully mixed, so that the circumferential pressure is uniform, realizing the stabilization and equalization of the airflow, and providing uniform initial pressure conditions for the subsequent radial diffusion of the airflow.

[0092] Second, when the gas, after being uniformly pressurized in the circumference, overflows from the guide groove 121, the inner wall of the guide groove 121 is a smooth transition surface, which can effectively guide the airflow and guide the process gas to flow smoothly radially towards the process space 130 in the center of the furnace body 110 in the direction defined by the groove wall, thereby reducing airflow turbulence and deflection.

[0093] Third, the gas released from the uniform flow orifice 122 is in jet form. The process gas in jet form directly rushes into the process space 130, which will form a local high-speed zone. The guide groove 121 can first collect and buffer the multiple scattered streams, and then release them smoothly, so that the process gas diffuses radially at a more uniform speed.

[0094] Figure 4 The image shown is a top view of a reactor provided in an exemplary embodiment of this application.

[0095] In some embodiments, such as Figure 4 As shown, the flow equalization device 100 further includes at least one flow velocity sensor 160, at least one pressure sensor 170, and a control component 180. The flow velocity sensor 160 is disposed on the flow equalization element 120 and configured to detect the actual flow velocity data of the process gas. The pressure sensor 170 is disposed on the flow equalization element 120 and configured to detect the actual pressure data of the process gas. The control component 180 is communicatively connected to at least one flow velocity sensor 160, at least one pressure sensor 170, and multiple drive elements 150, and is configured to receive the actual flow velocity data detected by at least one flow velocity sensor 160 and the actual pressure data detected by at least one pressure sensor 170, generate at least one first control command based on the actual flow velocity data, the actual pressure data, preset flow velocity data, and preset pressure data, and send the at least one first control command to the corresponding at least one drive element 150, so that the corresponding at least one drive element 150 drives the corresponding at least one guide vane 140 to rotate.

[0096] Specifically, since the product 300 undergoes CVD processing within the process space 300, preferably, the flow rate sensor 160 can be positioned on the innermost flow equalizer 120 near the process space 130 to accurately detect the actual flow rate data of the process space 130. Similarly, the pressure sensor 170 can be positioned on the innermost flow equalizer 120 near the process space 130 to accurately detect the actual pressure data of the process space 130. The number and arrangement of the flow rate sensor 160 and pressure sensor 170 can be single-point or multi-point to fully monitor the flow rate and pressure of the process gas. The flow rate sensor 160 and pressure sensor 170 can also be positioned between two adjacent flow equalizers 120.

[0097] Specifically, the control component 180 is communicatively connected to the flow velocity sensor 160, pressure sensor 170, and drive unit 150 via wired or wireless means. The control component 180 may include a programmable logic controller (PLC), a data processing module, and a touch-screen control panel. The data processing module receives actual flow velocity data collected by the flow velocity sensor 160 and actual pressure data collected by the pressure sensor 170. The data processing module can calculate the distribution deviation of gas flow velocity and pressure using algorithms, actual flow velocity data, and actual pressure data, and outputs a corresponding second control command based on the calculated deviation. Based on the second control command, the PLC outputs a first control command to control the drive unit 150 at the corresponding position, causing the guide vane 140 to rotate. By adjusting the flow equalization parameters and using the flow equalization component 120 and the guide plate 111 (described later), the flow velocity and pressure distribution deviation of the process gas can be ≤5%, achieving high-precision adaptive flow equalization and field uniformity. The touch control panel is used to manually set flow equalization parameters (such as preset flow rate data, preset pressure data (such as pressure threshold), view the operating status (such as gas flow rate distribution, 140° rotation angle of the guide vanes), and preset flow equalization modes corresponding to different processes (such as different gas types, different deposition thicknesses, and different product quantities). It supports one-click switching and is easy to operate.

[0098] For example, the accuracy of the actual flow velocity data collected by the flow velocity sensor 160 is ±0.1 m / s, and the accuracy of the actual pressure data collected by the pressure sensor 170 is ±0.1 kPa.

[0099] Exemplarily, the flow equalization device 100 further includes at least one temperature sensor 190. The at least one temperature sensor 190 is disposed on the flow equalization element 120. The temperature sensor 190 is capable of detecting actual temperature data and sending the actual temperature data to a control component 180 communicatively connected to the temperature sensor 190. The control component 180 can generate at least one third control command based on the actual temperature data and preset temperature data, and send the at least one third control command to the heating component, so that the heating component heats the furnace body 110 according to the third control command, thereby achieving automatic adjustment of the process temperature of the furnace body 110.

[0100] For example, the temperature sensor 190 should be compatible with CVD process temperatures of 800 ℃ to 1200 ℃. The temperature sensor 190 is preferably located on the innermost flow equalizer 120 near the process space 130, but it can also be located between two adjacent flow equalizers 120. Furthermore, the actual temperature data sent by the temperature sensor 190 to the control component 180 can provide temperature compensation for the adjustment logic of the control component 180. That is, the first control command needs to be generated based on the actual temperature data to avoid changes in airflow characteristics caused by temperature variations affecting the flow equalization effect.

[0101] For example, at least one flow rate sensor 160, at least one pressure sensor 170 and at least one temperature sensor 190 may be arranged around the process space 300.

[0102] In related technologies, adjustable flow equalization devices are mostly manually adjustable, which has low adjustment accuracy and slow response speed. They cannot adapt to the dynamic changes of process parameters in real time, and the adjustment process requires shutdown operation (such as manually measuring the product film thickness after shutdown to determine whether the gas flow is uniform, manually adjusting valves, etc.), which cannot adapt to the dynamic changes of process parameters in real time and affects production efficiency.

[0103] In the above embodiment, by arranging a flow rate sensor 160 and a pressure sensor 170 around the flow equalizer 120, and by having the control component 180 compare the actual flow rate data and actual pressure data with preset flow rate data and preset pressure data respectively to generate a first control command, which drives the corresponding drive component 150 to adjust the rotation angle of the guide vane 140, real-time adaptive adjustment of the process gas flow rate and pressure is achieved, reducing manual intervention and downtime adjustments, and improving production efficiency and coating quality stability. The structure in this embodiment, used in conjunction with the flow equalizer 120 and the guide vane 111, can achieve high-precision uniformity across the entire furnace body 110, meeting the needs of high-precision, multi-workpiece CVD deposition in fields such as semiconductors and aerospace.

[0104] Based on the same concept, such as Figure 1 and Figure 4As shown in the illustration, this application also provides a reactor 200, which includes a furnace body 110 and a flow equalization device 100 as described in the above embodiments. The furnace body 110 is configured to contain product 300. The flow equalization device 100 is disposed within the furnace body 110 and configured to equalize the process gas within the furnace body 110.

[0105] Specifically, the reactor 200 is used for chemical vapor deposition processes. The central area within the reactor 200 constitutes the process space 130, which is used to stack or place multiple products 300 to be coated. The furnace body 110 can be used with pump sets, heating components, and gas sources to establish a high-temperature, low-pressure process environment filled with a specific atmosphere within the process space 130.

[0106] Since the reactor 200 includes a flow equalization device 100, all the technical features and effects of the flow equalization device 100 in the reactor 200 will not be described in detail here.

[0107] In some embodiments, the furnace body 110 has a plurality of air inlets 112 arranged circumferentially along the furnace body 110, and the air inlets 112 are configured to introduce process gases.

[0108] Specifically, the furnace body 110 includes a main body 113 and multiple air inlet pipes 114. The main body 113 has multiple mounting ports arranged circumferentially along the main body 113. The air inlet pipes 114 pass through the mounting ports, and the opening of the air inlet pipes 114 for introducing process gas is the air inlet 112.

[0109] For example, multiple air inlets 112 are evenly arranged along the circumference of the furnace body 110.

[0110] For example, the angle between the perpendicular lines of adjacent air inlets and the axis of the furnace body 110 is ≥90°, such as... Figure 4 As shown, the angle between the perpendicular lines of adjacent air inlets and the axis of furnace body 110 is 90°.

[0111] In the above embodiments, by providing multiple air inlets 112 along the circumference of the furnace body 110, the pressure unevenness caused by a single air inlet can be avoided, and the process gas can be more evenly introduced into the furnace body 110 from all sides, thereby improving the uniformity of the process gas distribution in the furnace body 110.

[0112] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the inner wall of the furnace body 110 has a plurality of guide plates 111 arranged at intervals along the circumference of the furnace body 110, and the guide plates 111 are parallel to the radial direction of the furnace body 110.

[0113] Specifically, each air inlet 112 is located between adjacent guide vanes 111. A flow channel 132 can be formed between adjacent guide vanes 111 to divide and guide the process gas.

[0114] For example, the spacing between adjacent guide vanes 111 is equal.

[0115] In related technologies, process gas enters the furnace body 110 directly from the inlet 112 without a flow guide structure. The process gas is prone to impacting the flow equalizer 120, and local airflow collisions and swirling occur, resulting in a large number of eddies and turbulence, which increases flow resistance and causes flow loss during the inlet stage.

[0116] In the above embodiments, by setting multiple guide vanes 111, the following advantages are achieved.

[0117] First, it serves to divert and guide the flow. The guide plates 111 are evenly distributed radially, dividing the annular space (i.e., the edge region 131) between the inner wall of the furnace body 110 and the outermost flow equalizer 120 into multiple independent flow channels 132. After the process gas enters from the inlet 112, it is guided by each guide plate 111 to diffuse evenly in the circumferential direction, avoiding the formation of a local high-pressure zone due to the concentration of process gas near the inlet 112, and ensuring that the process gas is evenly distributed to each flow channel 132 in the circumferential direction.

[0118] Secondly, it plays a role in uniformly distributing pressure. The cross-sectional dimensions of each flow channel 132 are basically the same, and the resistance encountered by the gas when flowing in each channel is the same, thereby ensuring that the pressure distribution along the circumference at the inner outlet of the annular space is uniform, providing consistent circumferential air intake conditions for the downstream multi-layer flow equalizer 120.

[0119] Third, it suppresses eddies. The surface of the guide plate 111 is parallel to the radial direction of the furnace body 110. Under the guidance of the guide plate 111, the gas flows steadily radially within the channel, preventing swirling or eddies caused by excessive flow space. At the same time, the guide plate 111 blocks the circumferential collision of process gases, reducing turbulence and energy loss.

[0120] Fourth, it plays a role in stabilizing and buffering pressure. The parallel structure of multiple flow channels 132 is equivalent to dividing a single large chamber into multiple parallel small pressure-stabilizing chambers. The overall pressure stabilization effect is better than that of a single chamber, which can effectively reduce the impact of intake pressure fluctuations on the airflow inside the furnace body 110.

[0121] In summary, the guide plate 111 completes the initial diversion, pressure equalization and guidance of the airflow before the process gas enters the multi-layer flow equalizer 120, thus suppressing the generation of eddies.

[0122] Figure 5 The diagram shown is a structural schematic of the main body and the guide plate provided in an exemplary embodiment of this application. Figure 6The diagram shown is a schematic diagram of the orientation of the guide plate provided in an exemplary embodiment of this application, wherein Z represents the axial direction of the furnace body (i.e., the extension direction of the axis L of the furnace body 110), and Y represents the radial direction of the furnace body.

[0123] In some embodiments, such as Figure 5 and Figure 6 As shown, the inner wall of the furnace body 110 has a plurality of guide plates 111 spaced apart along the circumference of the furnace body 110. The guide plates 111 are parallel to the radial direction of the furnace body 110, and the extension direction of the guide plates 111 intersects the extension direction of the axis L of the furnace body 110.

[0124] Specifically, when the process gas is injected into the furnace body 110 through the inlet 112 and encounters the guide plate 111, it will be guided to slide along the inclined direction of the guide plate 111, thereby forming a composite flow with both circumferential and axial components. This is beneficial for improving the circumferential and axial velocity and pressure distribution in the longer and wider furnace body 110, so that the process gas has been initially homogenized in the circumferential and axial directions before reaching the flow equalization device 100.

[0125] Specifically, the guide vanes 111 can be spaced apart circumferentially along the furnace body 110, and the distance between adjacent guide vanes 111 can be the same. However, the extending direction of the guide vanes 111 has a certain angle with the axis L of the furnace body 110, that is, the guide vanes 111 can be arranged at an angle relative to the axis L of the furnace body 110. The angle between the extending directions of multiple guide vanes 111 and the extending direction of the axis L of the furnace body 110 can be the same.

[0126] For example, the angle between the extension direction of the baffle 111 and the extension direction of the axis L of the furnace body 110 is 20°, 30° or 40°.

[0127] In the above embodiments, by making the guide plate 111 parallel to the radial direction of the furnace body 110, and its extending direction intersecting the extending direction of the axis L of the furnace body 110, the guide plate 111 is arranged in an inclined manner, which achieves the following technical effects: First, although the extension direction of the guide plate 111 is deflected relative to the axis of the furnace body 110, the guide plate 111 is still parallel to the radial direction of the furnace body 110. The airflow is constrained by the guide plate 111 and is still transported radially towards the central area of ​​the furnace body 110. It will not deflect excessively to the circumference and can still reliably achieve the basic function of air intake from all sides and uniform diffusion towards the center, thus meeting the gas supply requirements of the CVD cavity.

[0128] Second, compared to the structure where the extension direction of the guide plate 111 is parallel to the axis L, after the guide plate 111 is deflected, the guide channel 132 becomes an oblique flow-dividing channel. After the gas enters the furnace body 110 from the air inlet 112, the oblique channel can more effectively guide the airflow to diffuse circumferentially, weaken the local high-pressure zone generated by the impact of high-speed airflow at the air inlet 112, further balance the circumferential air pressure of the entire annular space (i.e., the edge region 131), and reduce the circumferential pressure difference.

[0129] Third, the inclined baffle 111 can effectively buffer the impact of the intake airflow, avoid the direct reflection of airflow that may be caused by the straight plate structure parallel to the axis, significantly reduce the turbulence inside the baffle channel 132, and make the pressure stabilization effect better than that of the baffle 111 parallel to the axis.

[0130] Fourth, the inclined guide plate 111 has a higher tolerance for circumferential machining dimension deviation of the annular diversion groove, and when assembling the furnace body 110, there is no need to strictly align the axial reference, which reduces the machining and assembly cost of the high-temperature vacuum cavity.

[0131] Fifth, the inclined guide plate 111 can better adapt to high-flow-rate gas intake conditions. Under the high-flow-rate process conditions of high-capacity, multi-blade CVD furnaces, its pressure stabilization and flow equalization effect is particularly significant, which broadens the window for the reactor 200 to be applicable to different process parameters and enhances the equipment's versatility and process compatibility.

[0132] In summary, in practical applications, process gas is introduced into the edge region 131 within the furnace body 110 through the inlet 112. After initial diversion and pressure stabilization by the guide plate 111, it sequentially passes through multiple layers of flow equalization components 120 to achieve gradient flow equalization, gradually eliminating airflow turbulence and velocity gradients, and ensuring initial uniform distribution of the gas radially and circumferentially. The velocity sensor 160, pressure sensor 170, and temperature sensor 190 collect real-time data on actual velocity, pressure, and temperature, and transmit this data to the control component 180. The control component 180 analyzes the collected data and calculates the distribution deviations of velocity and pressure. When the distribution deviation exceeds 5%, the control component 180 generates a first control command based on the direction and magnitude of the deviation, controlling the corresponding drive component 150 to rotate the guide vanes 140, adjusting the airflow area until the velocity and pressure distribution deviations converge to within 5%. Throughout the deposition process, the above-mentioned closed-loop process of "collection-analysis-adjustment-recollection" is continuously repeated to achieve adaptive flow and field uniformity, adapt to the dynamic changes of process parameters in real time, and ensure the coating uniformity of products 300 at all positions within the process space 130.

[0133] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0134] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0135] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0136] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0137] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A flow equalization device, characterized in that, include: A multi-layered annular flow equalizer is nested within a furnace body. Each layer of the flow equalizer is arranged around the axis of the furnace body. The innermost flow equalizer has a process space configured to accommodate the product. The flow equalizer has multiple flow equalization holes. The furnace body has an air inlet. Process gas can enter the process space through the air inlet and the flow equalization holes of the multiple flow equalizers in sequence to coat the product.

2. The flow equalization device according to claim 1, characterized in that, For two adjacent flow equalization components, the diameter of the flow equalization hole of the flow equalization component closer to the process space is smaller than the diameter of the flow equalization hole of the flow equalization component farther from the process space. And / or, the multi-layer flow equalizer includes at least one set of flow equalizers, and the at least one set of flow equalizers includes a plurality of sequentially adjacent flow equalizers. For any set of flow equalizers in the at least one set of flow equalizers, the flow equalizer holes of each flow equalizer in the set of flow equalizers are arranged in a one-to-one correspondence. The corresponding flow equalizer holes are arranged opposite to each other in the radial direction of the furnace body, and the corresponding flow equalizer holes all extend in the radial direction of the furnace body. And / or, the multi-layered flow equalizer includes at least one group of flow equalizers, and the at least one group of flow equalizers includes a plurality of sequentially adjacent flow equalizers. For any group of flow equalizers in the at least one group of flow equalizers, the flow equalizing holes of each flow equalizer in the group of flow equalizers are provided in a one-to-one correspondence, and the corresponding flow equalizing holes form a continuous channel.

3. The flow equalization device according to claim 1, characterized in that, The flow equalization element adjacent to the furnace body is the outermost flow equalization element. The diameter of the flow equalization holes in the outermost flow equalization element ranges from 2 mm to 5 mm. The diameter of the flow equalization holes in the innermost flow equalization element ranges from 0.5 mm to 1 mm. The diameter of the flow equalization holes in the flow equalization element located between the outermost and innermost layers ranges from 1 mm to 2 mm.

4. The flow equalization device according to claim 1, characterized in that, The diameter of the flow equalization holes in at least one layer of the flow equalization element gradually decreases in the radial direction of the furnace body from away from the process space to closer to the process space.

5. The flow equalization device according to any one of claims 1 to 4, characterized in that, Also includes: Multiple guide vanes are disposed between adjacent flow equalizers, the guide vanes being configured to either block or expose at least one flow equalizer hole in at least one layer of adjacent flow equalizers; Multiple driving members are provided, each driving member being corresponding to at least one of the flow guide vanes. The driving members are configured to drive the corresponding at least one of the flow guide vanes to rotate, thereby adjusting the area of ​​the flow guide vanes blocking the flow equalization orifice or exposing the flow equalization orifice by the flow guide vanes.

6. The flow equalization device according to claim 5, characterized in that, A plurality of the flow guide vanes are disposed between two adjacent layers of the flow equalizer, and the flow guide vanes are configured to either block or expose at least one of the flow equalizer holes in the two adjacent layers of the flow equalizer; And / or, The innermost flow equalizer has a plurality of flow guide grooves arranged sequentially along the extension direction of the furnace body on the side near the process space. The flow guide grooves surround the process space and are connected to the flow equalizer holes. The flow guide grooves are configured to guide the process gas to flow radially from the furnace body to the process space. And / or, a plurality of the flow guide vanes are disposed on the side of the innermost flow equalizer away from the process space.

7. The flow equalization device according to claim 5, characterized in that, Also includes: At least one flow rate sensor is disposed on the flow equalizer and configured to detect the actual flow rate data of the process gas; At least one pressure sensor is disposed on the flow equalizer and configured to detect the actual pressure data of the process gas; A control component, communicatively connected to at least one flow velocity sensor, at least one pressure sensor, and a plurality of drive components, is configured to receive actual flow velocity data detected by at least one flow velocity sensor and actual pressure data detected by at least one pressure sensor, generate at least one first control command based on the actual flow velocity data, the actual pressure data, preset flow velocity data, and preset pressure data, and send the at least one first control command to the corresponding at least one drive component to cause the corresponding at least one drive component to drive the corresponding at least one guide vane to rotate.

8. A reactor, characterized in that, include: A furnace body configured to contain products; The flow equalization device according to any one of claims 1 to 7 is disposed in the furnace body and configured to equalize the process gas in the furnace body.

9. The reactor according to claim 8, characterized in that, The furnace body has a plurality of air inlets arranged circumferentially along the furnace body, and the air inlets are configured to introduce process gas. And / or, The inner wall of the furnace body has a plurality of guide plates spaced apart along the circumference of the furnace body, and the guide plates are parallel to the radial direction of the furnace body.

10. The reactor according to claim 8, characterized in that, The inner wall of the furnace body has multiple [features] along the furnace body. The furnace body has circumferentially spaced guide plates, which are parallel to the radial direction of the furnace body and whose extension direction intersects the extension direction of the axis of the furnace body.

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