Horizontal electroplating equipment compatible with single-sided and double-sided electroplating and heterojunction cell electroplating method

Abstract

The application belongs to the technical field of photovoltaic solar cell manufacturing and electroplating, and particularly relates to a horizontal electroplating equipment compatible with single and double-sided electroplating and a heterojunction cell electroplating control method. The first cathode assembly and the second cathode assembly in the horizontal electroplating equipment are in an asymmetric working state in an electrical connection state and / or a spatial arrangement position, so as to block the crosstalk path of the electroplating current between the first surface and the second surface of the cell piece. The asymmetry of the electrical connection state makes the two cathode assemblies time-sharing on and off through on-off control switches, so that single-sided time-sharing electroplating is realized without turning over. The asymmetry of the spatial arrangement position makes the orthographic projection not overlap by staggered arrangement of the upper and lower cathode rollers in the transmission direction, so that the staggered distance is used to increase the lateral resistance to suppress the crosstalk current, and independent double-sided simultaneous electroplating is realized. The application can realize independent and accurate control of the current of the N surface and the P surface of the heterojunction cell, is compatible with single and double-sided electroplating modes, does not need to turn over the cell piece, has low equipment modification cost, and has high production capacity.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic solar cell manufacturing and electroplating technology, specifically to a horizontal electroplating equipment compatible with single and double-sided electroplating and a method for controlling the electroplating of heterojunction cells. Background Technology

[0002] Heterojunction solar cells (HJTs) have become one of the mainstream technologies for high-efficiency photovoltaic cells due to their advantages such as high open-circuit voltage and low temperature coefficient. Copper electroplating technology, with its low cost and high conductivity, is widely considered an ideal solution for metallizing heterojunction cells. Horizontal electroplating equipment is commonly used in copper electroplating processes. One mainstream type of horizontal electroplating equipment is the "external conductive" type, whose structure is as follows: the cathode roller is positioned outside the electrolyte surface of the electroplating tank and does not contact the solution; the anode box is immersed in the solution; the solar cells are horizontally transported, with their edges contacting the cathode roller to form an electroplating circuit.

[0003] However, when performing simultaneous double-sided electroplating on heterojunction solar cells, an inherent challenge arises from the cell's electrical structure: the asymmetry in conductivity between the N-side and P-side. Specifically, the transparent conductive film on the N-side of a heterojunction solar cell forms an approximately ohmic contact or a low-resistance parallel path with the N-type crystalline silicon substrate, resulting in excellent overall conductivity. Conversely, the transparent conductive film on the P-side exhibits a reverse PN junction cutoff characteristic with the N-type substrate, leading to relatively poor conductivity, primarily relying on the lateral conductivity of the transparent conductive film layer itself. While solutions exist that incorporate insulating components in the fixture to prevent the N-side and P-side from sharing a common cathode, these primarily address the fixture structure and do not resolve the current crosstalk path issue formed between the upper and lower cathodes via the roller contact points during electroplating at the equipment level.

[0004] In traditional double-sided horizontal electroplating equipment, the upper and lower sets of cathodes form a complex circuit through the chemical solution, anode, cell edges, and their opposing contact points. Because the N-side has better conductivity, it diverts current that should flow through the P-side, leading to the following problems: First, current density is out of control. The current set on both sides is significantly different from the actual current flowing through each side, making precise process control impossible.

[0005] Second, the ITO reduction is uneven. In the pre-reduction step before electroplating, the N-side is over-reduced due to excessive current, which damages the interface between ITO and the amorphous silicon layer; the P-side is under-reduced due to insufficient current, resulting in poor adhesion and easy detachment of the subsequent copper plating.

[0006] Third, differences in coating quality. Inconsistencies in the morphology, height, and density of the copper grid lines on both sides affect the final performance and yield of the battery.

[0007] Among known solutions, mechanical flipping single-sided plating equipment can avoid current crosstalk, but the equipment is complex, occupies a large area, and the flipping process easily leads to an increased breakage rate. Compensating for conductivity differences by adjusting the solution formulation or adding additives has limited effectiveness and increases cost and process complexity. Using electroplating fixtures to energize the two clamping points separately requires additional clamping steps, reducing production efficiency.

[0008] Therefore, there is an urgent need for a technical solution that can solve the above-mentioned current crosstalk problem at the equipment level and can flexibly accommodate the needs of single-sided and double-sided electroplating. Summary of the Invention

[0009] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and provide a horizontal electroplating equipment compatible with single and double-sided electroplating and a heterojunction cell electroplating control method. This effectively solves the current crosstalk problem caused by the difference in conductivity between the N-side and P-side of heterojunction cells, realizes independent and precise control of the current on both sides, is compatible with single and double-sided electroplating modes, does not require flipping the cell, has low equipment modification costs, and high production capacity.

[0010] To achieve the above objectives, the technical solution adopted by the present invention is as follows: This invention provides a horizontal electroplating apparatus compatible with both single and double-sided electroplating, comprising an electroplating tank, an anode assembly immersed in an electrolyte, and a first cathode assembly and a second cathode assembly respectively disposed on the upper and lower sides of a battery cell, wherein both the first cathode assembly and the second cathode assembly are located outside the electrolyte surface. The first cathode assembly and the second cathode assembly are in an asymmetrical operating state in terms of electrical connection and / or spatial arrangement to block crosstalk paths of the electroplating current between the first and second sides of the solar cell. By configuring the first cathode assembly and the second cathode assembly to be in an asymmetrical operating state in terms of electrical connection and / or spatial arrangement, the crosstalk path of the electroplating current between the first and second sides of the solar cell is blocked at the device level. This solves the current crosstalk problem caused by the difference in conductivity between the N-side and P-side of heterojunction solar cells, allowing the current on both sides to be controlled independently, while being compatible with both single-sided and double-sided electroplating operating modes.

[0011] In some embodiments, the asymmetrical operating state of the electrical connection is as follows: A switching control switch is connected in series between the first cathode assembly and the power supply, and between the second cathode assembly and the power supply, respectively. The switching control switch is used to independently control the connection or disconnection of each cathode assembly with the power supply, so that one of the first cathode assembly and the second cathode assembly is connected to the power supply while the other is disconnected. By achieving asymmetrical electrical connection, i.e., using switching control switches to independently control the connection or disconnection of each cathode assembly with the power supply, the current loop of the non-target surface can be completely cut off electrically, enabling single-sided time-sharing electroplating without flipping the solar cells, completely eliminating current crosstalk between the two surfaces, and with extremely low equipment modification costs, requiring only the addition of switching elements.

[0012] In some embodiments, the on / off control switch is a relay, contactor, or solid-state relay, and the control terminal of the on / off control switch is connected to a PLC controller. The use of a relay, contactor, or solid-state relay for the on / off control switch, controlled by a PLC controller, enables automated and precise control of the cathode assembly's on / off state, improving production efficiency and process consistency, and facilitating integration into existing production line control systems.

[0013] In some embodiments, the asymmetrical working state of the spatial arrangement is as follows: the first cathode assembly includes multiple first cathode rollers, and the second cathode assembly includes multiple second cathode rollers. The first cathode rollers and the second cathode rollers are staggered in the cell transport direction, and the orthographic projection of any first cathode roller in the direction perpendicular to the cell surface does not overlap with the orthographic projection of any second cathode roller. By achieving asymmetry in the spatial arrangement, that is, by staggering the upper and lower cathode rollers in the transport direction and ensuring that their orthographic projections do not overlap, direct physical pressure contact between the upper and lower cathodes is eliminated. The large lateral resistance formed by the staggered distance effectively suppresses crosstalk current, allowing both sides to be electroplated simultaneously and the current to be set independently, achieving precise process control while maintaining high production capacity.

[0014] In some embodiments, the misalignment distance between the first cathode roller and the second cathode roller in the transmission direction is 10mm to 100mm. Setting the misalignment distance to 10mm to 100mm allows for the selection of an appropriate misalignment amount based on the cell size and conductive layer characteristics, ensuring that the lateral resistance is sufficiently large to effectively suppress crosstalk current, while not affecting the smooth transmission of the cell.

[0015] In some embodiments, the misalignment distance is 30mm to 50mm; the diameters of the first cathode roller and the second cathode roller are 20mm to 60mm. The misalignment distance is preferably 30mm to 50mm, and the cathode roller diameter is 20mm to 60mm. Within this parameter range, optimal crosstalk suppression and equipment compactness can be achieved, while ensuring good contact between the roller and the edge of the solar cell, balancing electroplating uniformity and equipment operational stability.

[0016] In some embodiments, the first cathode assembly is divided into multiple independent electroplating zones, and the second cathode assembly is correspondingly divided into multiple independent electroplating zones, each equipped with an independent rectified power supply. Dividing the first and second cathode assemblies into multiple independent electroplating zones, each equipped with an independent rectified power supply, allows for segmented gradient current control along the cell's travel direction, in addition to independent control of the current on both sides. This optimizes the uniformity of the plating at both ends and improves the overall electroplating quality of the cell.

[0017] This invention also provides a method for controlling the electroplating of heterojunction batteries, using a horizontal electroplating device compatible with single and double-sided electroplating as described in any one of claims 1 to 7, characterized by comprising the following steps: Configure the first cathode assembly and the second cathode assembly such that they are in the asymmetrical operating state in terms of electrical connection and / or spatial arrangement. The solar cells are horizontally conveyed through the electroplating area; Electroplating is performed on the solar cells under the asymmetric operating state. This heterojunction solar cell electroplating control method, by configuring the cathode assembly to operate in an asymmetric state and performing electroplating under this state, can flexibly select single-sided or double-sided electroplating modes, and achieve independent and precise control of the current, voltage, and electroplating time for each side, avoiding problems such as uneven ITO reduction and coating quality differences caused by the difference in conductivity between the N-side and P-side.

[0018] In some embodiments, the asymmetric operating state is configured as an asymmetric electrical connection state, specifically including: Select the surface to be plated according to the process requirements, disconnect the cathode components of the non-target surfaces from the power supply, and connect only the cathode components of the target surfaces to the power supply to perform single-sided electroplating on the target surfaces. After electroplating one side is completed, the on / off control switch is switched to disconnect the cathode assembly on the plated side from the power supply and connect the cathode assembly on the other side to the power supply for single-sided electroplating. In the asymmetrical mode of electrical connection, the on / off states of the cathode assemblies on both sides are switched in a time-sharing manner, so that one side is electroplated first and then the other side is electroplated. The cell posture remains unchanged throughout the process and there is no need to flip it, avoiding the risk of breakage and alignment accuracy problems caused by flipping. At the same time, the electroplating parameters of the two sides can be optimized and set independently.

[0019] In some embodiments, the asymmetric operating state is configured as an asymmetric spatial arrangement, specifically including: The first cathode roller and the second cathode roller are arranged in a staggered manner so that the orthographic projections do not overlap; Then, the first cathode assembly and the second cathode assembly are simultaneously energized to electroplate both sides of the battery cell at the same time, and the current on both sides is controlled independently. The first and second cathode components are each divided into multiple independent electroplating zones, each equipped with an independent rectified power supply for segmented current control along the cell's travel direction. In an asymmetrical spatial arrangement, the staggered arrangement of the upper and lower cathode rollers enables simultaneous and independent electroplating of both sides, maintaining a production capacity comparable to existing bifacial equipment while achieving independent and precise current control on both sides. Furthermore, by equipping each zone with an independent rectified power supply, segmented current control along the cell's travel direction can be achieved, further improving coating uniformity.

[0020] The beneficial effects of this invention are: First, the problem of current crosstalk is completely solved. By making the first and second cathode components operate asymmetrically in terms of electrical connection and / or spatial arrangement, the crosstalk path of the electroplating current between the first and second surfaces of the solar cell is blocked at the equipment level. Specifically, the asymmetry in electrical connection completely cuts off the current loop to the non-target surface, and the asymmetry in spatial arrangement utilizes the large lateral resistance created by the staggered distance to reduce crosstalk current by more than 90%.

[0021] Secondly, it enables precise process control. The current, voltage, and plating time for each side can be set independently and precisely, no longer affected by differences in conductivity on the other side. Process parameters can be optimized separately for the N-side and P-side to obtain the best ITO interface quality and copper adhesion, avoiding over- or under-reduction of ITO caused by current crosstalk.

[0022] Third, it is compatible with both single-sided and double-sided electroplating modes. The asymmetry of the electrical connection state enables single-sided time-sharing electroplating without flipping the battery cells, while the asymmetry of the spatial arrangement enables simultaneous and independent double-sided electroplating on both sides. The production mode is flexible and can adapt to the needs of different products and processes.

[0023] Fourth, no cell flipping is required, maintaining high production capacity. Compared to mechanically flipped single-sided plating equipment, this invention eliminates the need to flip the cells throughout the entire process, avoiding increased breakage rates and alignment accuracy issues caused by flipping. The asymmetric electrical connection scheme can maintain a high production line cycle time through dual-tank series connection or single-tank time-sharing; the asymmetric spatial arrangement scheme allows for simultaneous electroplating on both sides, achieving the same production capacity as existing double-sided equipment.

[0024] Fifth, the equipment modification cost is extremely low. The asymmetrical solution in terms of electrical connection only requires the addition of on / off control switches and PLC control logic, with minimal modification costs; the asymmetrical solution in terms of spatial layout only requires adjustment of the installation position of the cathode rollers, without adding any electrical components. Both solutions can be made with minimal modifications to existing double-sided horizontal electroplating equipment without increasing the equipment length.

[0025] Sixth, it can be used in conjunction with gradient current control methods. By dividing the cathode assembly into multiple independent plating zones and equipping them with independent rectified power supplies, linear or stepped current ramping can be performed according to the cell entry area during single-sided or independent double-sided plating, further improving the uniformity of the plating at both ends. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, obtaining other drawings based on these drawings without creative effort still falls within the scope of the present invention.

[0027] Figure 1 This is a side view of a device in an embodiment of the present invention where the cathode roller on one side is replaced with a non-conductive roller in an asymmetric electrical connection scheme. Figure 2 This is a side view of a device with staggered upper and lower cathodes in an embodiment of the present invention using an asymmetrical spatial arrangement. Figure 3 This is a side view of the equipment layout for continuous electroplating in dual-tank series in an embodiment of the present invention using an asymmetric electrical connection scheme. Figure 4 This is a top view of the cathode assembly with independent power supply in a spatially asymmetrical arrangement scheme according to an embodiment of the present invention. Figure 5 This is a control flowchart of an asymmetric electrical connection scheme in the electroplating control method of this invention. Figure 6 This is a control flowchart for an asymmetric spatial arrangement scheme in the electroplating control method of this invention.

[0028] The meanings of the markings in the diagram are as follows: 1—Battery cell; 2—Cathode conductive roller; 3—Anode box; 4—Water blocking roller; 5—Upper cathode assembly; 6—Lower cathode assembly; 7—First electroplating tank; 8—Second electroplating tank; 9—First zone rectifier power supply; 10—Second zone rectifier power supply; 11—Third zone rectifier power supply. Detailed Implementation

[0029] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings, are intended to cover non-exclusive inclusion.

[0031] The directional and positional terms used in this invention, such as up, down, front, back, left, right, inside, outside, top, bottom, side, etc., are merely for reference to the accompanying drawings. Therefore, the directional and positional terms used are for illustrating and understanding this invention, and not for limiting the scope of protection of this invention.

[0032] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments: This invention provides a horizontal electroplating apparatus compatible with both single and double-sided electroplating, including an electroplating tank 100, an anode assembly (anode box 3) immersed in an electrolyte, and a first cathode assembly 5 and a second cathode assembly 6 respectively disposed on the upper and lower sides of a battery cell 1. Both the first cathode assembly 5 and the second cathode assembly 6 are located outside the electrolyte surface. The first cathode assembly 5 and the second cathode assembly 6 are in an asymmetrical working state in terms of electrical connection and / or spatial arrangement to block crosstalk paths of the electroplating current between the first and second sides of the battery cell 1. Example 1 This invention provides a horizontal electroplating device for single-tank time-sharing electroplating where the first and second cathode components operate in an asymmetrical electrical connection state. Relays, serving as on / off control switches, are connected in series between the first and second cathode components and the power supply, respectively. The control terminals of these relays are connected to a PLC controller to independently control the connection or disconnection of each cathode component with the power supply.

[0033] like Figure 1 As shown, the horizontal electroplating equipment includes an electroplating tank 100, an anode box 3 immersed in an electrolyte, an upper cathode assembly 5, and a lower cathode assembly 6 located above the electrolyte surface. Each cathode assembly includes multiple rows of cathode conductive rollers 2 and wires connected to the power supply; all cathode conductive rollers 2 are located outside the electrolyte surface. In an alternative embodiment, the cathode conductive rollers on the non-target surface can be replaced with water-blocking rollers 4 that only serve a conveying function.

[0034] The specific electroplating control method is as follows: First, determine the surface to be plated based on process requirements. If the lower surface of the battery cell needs to be electroplated, the PLC outputs a switch signal to control the relay connected in series between the lower cathode assembly 6 and the power supply to close, thus connecting the power supply; simultaneously, it controls the relay connected in series between the upper cathode assembly 5 and the power supply to open, completely isolating it from the power supply. The conveyor mechanism is started, and the battery cell 1 enters the electroplating area horizontally. The lower cathode roller contacts the edge of the lower surface of the battery cell, and the lower anode is energized, forming a complete circuit for single-sided electroplating of the lower surface. At this time, although the upper surface of the battery cell is immersed in the chemical solution, because its cathode is disconnected, there is no current circuit, and no electrochemical reaction occurs. After the lower surface electroplating is completed, the PLC switches the switch state, connecting the upper cathode assembly 5 and disconnecting the lower cathode assembly 6 to perform single-sided electroplating of the upper surface. Throughout the entire process, the battery cell's posture remains unchanged and does not need to be flipped.

[0035] Example 2 A dual-tank series continuous electroplating system with asymmetrical electrical connections is another implementation of this asymmetrical electrical connection. The equipment consists of a first electroplating tank 7 and a second electroplating tank 8 arranged sequentially along the transport direction, as shown in the diagram. Figure 3 As shown. In the first electroplating tank 7, only the upper cathode assembly 5 is connected and the lower cathode assembly 6 is disconnected, dedicated to electroplating the upper surface of the battery cell 1; in the second electroplating tank 8, only the lower cathode assembly 6 is connected and the upper cathode assembly 5 is disconnected, dedicated to electroplating the lower surface of the battery cell 1. The battery cell 1 is conveyed horizontally through the two tanks in a straight line by a conveyor mechanism, completing double-sided electroplating sequentially, realizing continuous production without any intermediate flipping operations.

[0036] Example 3 This embodiment provides a horizontal electroplating device in which the first and second cathode components are arranged asymmetrically in a spatially staggered configuration. The structure is as follows: Figure 2 As shown. The device includes a horizontal conveying mechanism, an upper cathode assembly 5, and a lower cathode assembly 6. The upper cathode assembly 5 includes multiple upper cathode rollers, and the lower cathode assembly 6 includes multiple lower cathode rollers. In the conveying direction of the solar cell 1, the upper and lower cathode rollers are staggered, with a stagger distance D of 40 mm, and the diameter of the cathode rollers is 30 mm. This arrangement satisfies the condition that the orthographic projection of any upper cathode roller in the direction perpendicular to the surface of the solar cell does not overlap with the orthographic projection of any lower cathode roller. The upper and lower anode boxes 3 correspond to their respective cathodes and are immersed in the chemical solution.

[0037] The specific electroplating control method is as follows: the upper cathode assembly 5 and the lower cathode assembly 6 are connected to their respective independent rectified power supplies, and electroplating is performed on the upper and lower surfaces of the solar cell 1 simultaneously. Since the upper and lower cathode rollers are spatially offset, there is no direct physical pressure contact. For current to crosstalk from the upper surface to the lower surface, it must traverse the entire offset distance D along the conductive layer of the solar cell itself. This lateral path has extremely high resistance, effectively suppressing crosstalk current, allowing the currents on both sides to be set and controlled independently without interference. For example, setting the current on the N side to 1.0A and the current on the P side to 1.0A, the measured current on the N side is 1.02A and the current on the P side is 0.98A, with the crosstalk current less than 0.05A, achieving precise independent control.

[0038] Example 4 Combining the asymmetric electroplating of the spatial arrangement of the partitions, as an optimized implementation method of the asymmetric spatial arrangement, the upper cathode assembly 5 and the lower cathode assembly 6 are each divided into multiple independent electroplating zones along the transmission direction, with each zone consisting of 3 rollers. Each zone is equipped with an independent rectifier power supply, while ensuring that the upper and lower cathodes within each zone still meet the staggered arrangement requirements. Figure 4 The partitioned configuration is shown from a top-down view. The upper cathode assembly 5 is divided into three zones along the transmission direction: a first zone, a second zone, and a third zone, each independently powered by a rectifier power supply 9 for the first zone, a rectifier power supply 10 for the second zone, and a rectifier power supply 11 for the third zone. The lower cathode assembly 6 is correspondingly divided into three zones, each also powered by an independent rectifier power supply. During electroplating, not only are the currents on the upper and lower surfaces independent, but segmented gradient current control can also be implemented along the traveling direction of the solar cell 1, further optimizing the uniformity of the plating at both ends.

[0039] In asymmetrical spatial arrangement schemes, the misalignment distance D can be selected within the range of 10mm to 100mm, with 30mm to 50mm being preferred. The diameter of the cathode roller ranges from 20mm to 60mm.

[0040] Example 5 like Figure 5 The control flow of an asymmetric electrical connection scheme is shown. The method includes: S1, selecting the current surface to be plated according to process requirements; S2, determining whether the current surface to be plated is the first surface. If yes, disconnecting the second cathode assembly from the power supply and connecting the first cathode assembly from the power supply to perform single-sided electroplating on the first surface; if no, disconnecting the first cathode assembly from the power supply and connecting the second cathode assembly from the power supply to perform single-sided electroplating on the second surface; S3, after completing the electroplating of the current surface, switching the on / off state of each cathode assembly from the power supply to perform single-sided electroplating on the other surface; S4, determining whether both surfaces have been plated. If yes, ending the process; if no, returning to continue executing the corresponding steps.

[0041] Example 6 like Figure 6 The control flow of an asymmetric spatial arrangement scheme is shown. The method includes: S1, staggering the first cathode roller and the second cathode roller in the transmission direction so that their orthographic projections do not overlap; S2, simultaneously connecting the first cathode assembly and the second cathode assembly to their respective independent power supplies; S3, independently setting the electroplating current for the first and second surfaces; S4, equipping each cathode assembly with an independent rectifier power supply according to its zone, and setting segmented current parameters along the direction of cell travel; S5, starting the conveyor mechanism, allowing the cell to enter the electroplating zone horizontally, electroplating both surfaces simultaneously, and each zone outputting current according to preset parameters.

[0042] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this invention; the scope of protection of this invention is defined by the claims in the claims, and all equivalent changes and modifications made in accordance with this invention are within the scope of protection of this patent.

Claims

1. A horizontal electroplating apparatus compatible with single and double-sided electroplating, comprising an electroplating tank, an anode assembly immersed in an electrolyte, and a first cathode assembly and a second cathode assembly respectively disposed on the upper and lower sides of a battery cell, wherein the first cathode assembly and the second cathode assembly are both located outside the electrolyte surface, characterized in that: The first cathode assembly and the second cathode assembly are in an asymmetrical working state in terms of electrical connection and / or spatial arrangement, so as to block the crosstalk path of the electroplating current between the first and second surfaces of the battery cell.

2. The horizontal electroplating equipment compatible with single and double-sided electroplating according to claim 1, characterized in that: The asymmetrical operating state of the electrical connection is as follows: an on / off control switch is connected in series between the first cathode component and the power supply, and between the second cathode component and the power supply. The on / off control switch is used to independently control the connection or disconnection of each cathode component with the power supply, so that one of the first cathode component and the second cathode component is connected to the power supply while the other is disconnected from the power supply.

3. The horizontal electroplating equipment compatible with single and double-sided electroplating according to claim 2, characterized in that: The on / off control switch is a relay, contactor, or solid-state relay, and the control terminal of the on / off control switch is connected to the PLC controller.

4. The horizontal electroplating equipment compatible with single and double-sided electroplating according to claim 1, characterized in that: The asymmetric working state of the spatial arrangement is as follows: the first cathode assembly includes multiple first cathode rollers, the second cathode assembly includes multiple second cathode rollers, the first cathode rollers and the second cathode rollers are staggered in the cell transport direction, and the orthographic projection of any first cathode roller in the direction perpendicular to the cell surface does not overlap with the orthographic projection of any second cathode roller.

5. The horizontal electroplating equipment compatible with single and double-sided electroplating according to claim 4, characterized in that: The misalignment distance between the first cathode roller and the second cathode roller in the transmission direction is 10mm to 100mm.

6. The horizontal electroplating equipment compatible with single and double-sided electroplating according to claim 5, characterized in that: The misalignment distance is 30mm to 50mm; the diameters of the first cathode roller and the second cathode roller are 20mm to 60mm.

7. The horizontal electroplating equipment compatible with single and double-sided electroplating according to claim 4 or 5, characterized in that: The first cathode assembly is divided into multiple independent electroplating zones, and the second cathode assembly is correspondingly divided into multiple independent electroplating zones, each equipped with an independent rectifier power supply.

8. A method for controlling electroplating of heterojunction batteries, employing a horizontal electroplating equipment compatible with single and double-sided electroplating as described in any one of claims 1 to 7, characterized in that: Includes the following steps: Configure the first cathode assembly and the second cathode assembly such that they are in the asymmetrical operating state in terms of electrical connection and / or spatial arrangement. The solar cells are horizontally conveyed through the electroplating area; Electroplating is performed on the battery cells under the asymmetric operating state.

9. The method for controlling the electroplating of heterojunction batteries according to claim 8, characterized in that: The asymmetric operating state is configured as an asymmetric electrical connection state, specifically including: Select the surface to be plated according to the process requirements, disconnect the cathode components of the non-target surfaces from the power supply, and connect only the cathode components of the target surfaces to the power supply to perform single-sided electroplating on the target surfaces. After one side of the electroplating is completed, switch the on / off control switch to disconnect the cathode assembly of the plated side from the power supply, and connect the cathode assembly of the other side to the power supply to perform single-sided electroplating on the other side.

10. The method for controlling the electroplating of heterojunction batteries according to claim 8, characterized in that: The asymmetric operating state is configured as an asymmetric spatial arrangement, specifically including: The first cathode roller and the second cathode roller are arranged in a staggered manner so that the orthographic projections do not overlap; Then, the first cathode assembly and the second cathode assembly are simultaneously energized to electroplate both sides of the battery cell at the same time, and the current on both sides is controlled independently. The first cathode assembly and the second cathode assembly are each divided into multiple independent electroplating zones, each zone is equipped with an independent rectifier power supply, and segmented current control is performed along the direction of cell travel.

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