Anti-static floor based on composite conductive network and preparation process thereof

Abstract

The application discloses an anti-static floor based on a composite conductive network and a preparation process thereof, and relates to the floor processing field.The anti-static floor comprises, from top to bottom, a conductive wear-resistant surface layer, a gradient conductive transition layer, a three-dimensional conductive load-bearing core layer and a conductive cushion bottom layer, and further comprises an inter-floor interconnected conductive structure and a whole-house grounding conductive network.The whole-house grounding conductive network is in conductive communication with each floor, forming a double-layer composite conductive discharge system with three-dimensional conductive floor and whole-house grounding.The four-layer composite conductive structure is adopted to build a whole-area continuous conductive path in two-dimensional horizontal direction, gradient vertical direction and three-dimensional direction, which can quickly and smoothly discharge static electricity and prevent charge accumulation, and meanwhile, the wear resistance, load bearing, shock absorption and noise reduction performance of the floor are considered, so that the problems of easy failure of the traditional anti-static floor and existence of a conduction breakpoint are solved.

Description

Technical Field

[0001] This invention relates to the field of flooring processing, specifically to an antistatic flooring based on a composite conductive network and its manufacturing process. Background Technology

[0002] Antistatic flooring is widely used in special environments with high requirements for electrostatic protection, such as computer rooms, precision instrument workshops, communication base stations, and cleanrooms. It is primarily used to promptly discharge static electricity from the environment, eliminate charge accumulation, and prevent safety hazards such as equipment malfunctions, damage to precision components, and even fires caused by electrostatic discharge. It is a core supporting building material for special industrial buildings and intelligent computer rooms. With the rapid development of high-end manufacturing and big data computing centers, the industry has placed higher demands on the conductivity stability, overall conductivity, structural durability, and comprehensive mechanical properties of antistatic flooring.

[0003] Currently, most conventional antistatic flooring on the market uses a single-layer conductive coating, simple conductive filler doping, or a localized conductive structure design. The conductive network structure is simplistic and generally suffers from numerous technical defects. Traditional antistatic flooring fails to form a systematic three-dimensional conductive path, relying solely on the surface conductive medium for electrostatic conduction. This makes it impossible to construct a continuous conductive channel throughout the entire surface, easily leading to conductive breaks and localized conductive failures. Consequently, electrostatic discharge is slow, charges tend to accumulate locally on the floor, and the stability of electrostatic protection is poor.

[0004] In addition, the existing antistatic flooring panel splicing structure design has obvious shortcomings. There are generally insulation blind spots at the splicing points of the flooring, and the panels cannot achieve effective conductive interconnection. Individual floor panels are independently conductive, and the overall correlation is poor, making it difficult to achieve equipotential conductivity of the entire flooring in the whole house. Summary of the Invention

[0005] The purpose of this invention is to provide an antistatic floor based on a composite conductive network and its manufacturing process, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: An antistatic floor based on a composite conductive network includes a conductive wear-resistant surface layer, a gradient conductive transition layer, a three-dimensional conductive load-bearing core layer, and a conductive buffer bottom layer, which are sequentially composited from top to bottom. It also includes an inter-board interconnect conductive structure and a whole-house grounding conductive network. The conductive and wear-resistant surface layer contains a composite conductive filler of nano-carbon black and carbon nanotubes to form a transverse two-dimensional conductive network. The side of the floor has a tongue and groove structure and is conductively modified. The gradient conductive transition layer is doped with short-cut carbon fibers and conductive mica, and the filler density gradually increases from top to bottom to form a gradient ratio of vertical conductive channels. The three-dimensional conductive load-bearing core layer has a three-dimensional conductive path constructed inside. The conductive buffer bottom layer is fully covered and adhered to the bottom surface of the three-dimensional conductive load-bearing core layer; The inter-board conductive structure is located at the splicing position of the floor panels to achieve lateral conductivity between multiple floor panels. The whole-house grounding conductive network is connected to each floor, forming a dual-layer composite conductive discharge system of three-dimensional conductivity of the board and whole-house grounding.

[0007] As a further aspect of the present invention: the conductive and wear-resistant surface layer is made of an antistatic HPL high-voltage board, an antistatic ceramic glaze, or a homogeneous conductive PVC substrate, and the surface layer is doped with composite conductive fillers to form a stable conductive layer.

[0008] As a further embodiment of the present invention: the gradient conductive transition layer is made of conductive epoxy resin or conductive modified polyurethane substrate, and the upper and lower surfaces are respectively bonded to the conductive wear-resistant surface layer and the three-dimensional conductive load-bearing core layer.

[0009] As a further embodiment of the present invention: the three-dimensional conductive load-bearing core layer is selected from any one of the following: all-steel foamed cement core, calcium sulfate high-density core, or epoxy fiberglass integrated core. The all-steel foamed cement core forms a conductive network by spot welding upper and lower steel plates together with the internal conductive foamed cement; the calcium sulfate high-density core has a built-in conductive graphite skeleton and is pre-embedded with through-type conductive rubber columns in a uniform dot matrix; the epoxy fiberglass integrated core is integrally hot-pressed by impregnating fiberglass cloth with graphene conductive resin to form a three-dimensional conductive network throughout.

[0010] As a further embodiment of the present invention: the conductive buffer bottom layer is a composite conductive pad made of nitrile conductive rubber or aluminum foil doped with zinc oxide conductive powder and carbon fiber, which is fully covered and attached to the bottom surface of the three-dimensional conductive load-bearing core layer.

[0011] As a further embodiment of the present invention: the interconnecting conductive structure between boards includes conductive tenons and grooves and conductive adhesive strips, the surfaces of the male and female tenons of the floor are sprayed with conductive coatings, and conductive adhesive strips are pasted at the splicing gaps.

[0012] As a further embodiment of the present invention: the whole-house macro-grounding conductive network includes conductive brackets, conductive beams, equipotential copper foil grids and grounding copper cables. All conductive brackets are connected through conductive beams, and copper foil grids are pressed into the bottom of the brackets. The copper foil grids are grounded through grounding copper cables.

[0013] A manufacturing process for preparing the above-mentioned antistatic floor based on a composite conductive network includes the following steps: S1. Preparation of conductive masterbatch: Nano carbon black, carbon nanotubes, conductive mica and short carbon fibers are mixed with resin dispersant, and then fully mixed at high temperature of 180-220℃ for 30-45 minutes. After extrusion granulation, a composite conductive masterbatch with uniformly dispersed filler is prepared. S2. Substrate pretreatment: Depending on the core type, complete the following pretreatments: all-steel core stamping and spot welding, conductive cement filling and curing, or calcium sulfate core dot matrix opening and conductive rubber column pre-embedding, or epoxy fiberglass core layup pretreatment. S3. Gradient transition layer coating: A two-layer coating process is adopted, and conductive adhesive of different concentrations is coated on the upper surface of the core layer in sequence to form a gradient conductive structure with thinner upper layer and denser lower layer. It is then pre-cured at 60-80℃ for 15-25 minutes for later use. S4. Multi-layer integrated hot pressing: The functional layers are aligned and stacked, and a segmented temperature-controlled hot pressing process is adopted. Under a pressure of 3-5MPa, the multi-layer structure is integrated and formed by gradient temperature hot pressing for 20-30 minutes to ensure that each layer is tightly bonded. S5. Side conductive modification: After the molded sheet is cut and the tenon and groove are processed, conductive paste is sprayed on the side and tenon and groove, and cured at 100-120℃ for 10-15 minutes to form a uniform conductive layer. S6. Inspection and Warehousing: Inspect the electrical conductivity and structural performance of each floorboard individually, and put qualified finished floorboards into the warehouse.

[0014] As a further aspect of the present invention: in step S4, the segmented temperature-controlled hot pressing process sequentially goes through the stages of preheating at 120-140°C, high-temperature pressing at 160-180°C, and cooling and shaping at 50-70°C. The temperature control gradient is adapted to the material characteristics of each layer to ensure that each layer is tightly bonded, without delamination, and that the conductive path is continuous and uninterrupted.

[0015] As a further aspect of the present invention: in step S6, the qualified finished flooring products are put into storage after dust removal and protection.

[0016] Compared with the prior art, the beneficial effects of the present invention are: ① It adopts a four-layer composite conductive structure to construct a two-dimensional horizontal, gradient vertical, and three-dimensional continuous conductive path throughout the entire area, which can quickly and smoothly discharge static electricity and prevent charge accumulation. At the same time, it takes into account the wear resistance, load-bearing capacity, shock absorption and noise reduction performance of the floor, and solves the problems of easy failure of conductivity and the existence of conduction breakpoints in traditional antistatic flooring.

[0017] ② The conductive interconnection structure between boards eliminates the insulation blind spots at the splicing points, achieving equipotential conduction of the entire board. Combined with the whole-house grounding network, it forms a double-layer composite electrostatic discharge system with stable grounding, strong fault tolerance, effectively avoiding the risk of electrostatic sparking, and meeting the requirements of high-level anti-static applications.

[0018] ③ The integrated and exclusive preparation process effectively improves the dispersion of conductive fillers, precisely shapes gradient conductive and three-dimensional conductive structures, and ensures that the multilayer board is tightly composited and the conductive path is continuous and stable.

[0019] ④ Overcoming the drawbacks of traditional single-layer conductive flooring that is prone to failure, it adopts an embedded full-area conductive structure, which greatly improves the reliability and service life of anti-static properties. Moreover, the molding process is simple and the finished product quality is stable, making it suitable for various large-scale high-precision anti-static engineering scenarios. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of an antistatic floor based on a composite conductive network.

[0021] In the diagram: 1. Conductive and wear-resistant surface layer; 2. Gradient conductive transition layer; 3. Three-dimensional conductive load-bearing core layer; 4. Conductive buffer bottom layer. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] Please refer to the attached diagram. An antistatic floor based on a composite conductive network comprises, from top to bottom, a conductive and wear-resistant surface layer 1, a gradient conductive transition layer 2, a three-dimensional conductive load-bearing core layer 3, and a conductive buffer bottom layer 4. It is also equipped with an inter-panel interconnecting conductive structure and a whole-room grounding conductive network. Through the combination of multi-layered structure, inter-panel interconnection, and whole-room grounding, a stable and floor-mountable antistatic discharge system is constructed to meet the antistatic requirements of industrial and computer room applications.

[0027] The conductive and wear-resistant surface layer 1 is the outermost functional structure of the flooring, primarily responsible for wear resistance and surface static electricity conduction. This layer contains uniformly dispersed nano-carbon black and carbon nanotube composite conductive fillers, forming a transverse two-dimensional conductive network that can quickly conduct static electricity generated on the flooring surface. To achieve conductive continuity between multiple floorboards, the sides of the floorboards utilize a tongue-and-groove splicing structure, and the sides and tongue-and-groove positions undergo specific conductive modification treatment to structurally ensure conductive continuity between the boards.

[0028] A gradient conductive transition layer 2 is bonded beneath the conductive wear-resistant surface layer 1, serving to connect the surface layer and the core layer and stabilize the conductive pathway. This layer's substrate is doped with two conductive fillers: chopped carbon fiber and conductive mica. During production, the filler doping ratio is controlled to ensure a gradually increasing filler density distribution from top to bottom, precisely forming a gradient-ratio vertical conductive channel. This allows surface static electricity to be smoothly conducted downwards layer by layer, preventing static buildup. This layer uses conductive epoxy resin or conductive modified polyurethane as its base material, and its upper and lower surfaces are tightly bonded to the conductive wear-resistant surface layer 1 and the three-dimensional conductive load-bearing core layer 3, respectively, ensuring no gaps between layers and uninterrupted conductivity.

[0029] The three-dimensional conductive load-bearing core layer 3 is the core load-bearing and three-dimensional conductive body of the floor. It is located below the gradient conductive transition layer 2 and mainly bears equipment loads and ground pressure. At the same time, it constructs the core three-dimensional conductive path of the whole house and is the key structure for vertical electrostatic conduction. This core layer can be made of any one of three materials, namely, all-steel foamed cement core, calcium sulfate high-density core, or epoxy fiberglass integrated core, depending on actual production needs and usage scenarios. All three materials can achieve stable three-dimensional conductivity and are suitable for different load-bearing scenarios.

[0030] Different conductive molding processes are adopted for different types of three-dimensional conductive load-bearing core layers 3: the all-steel foamed cement core is fixed by spot welding of upper and lower steel plates, and is formed with conductive foamed cement filling inside to form a complete internal conductive network; the calcium sulfate high-density core has a pre-built conductive graphite skeleton, and at the same time, through-through conductive rubber columns are pre-embedded according to a uniform dot matrix layout to ensure uniform vertical conductivity; the epoxy fiberglass integrated core uses graphene conductive resin impregnated fiberglass cloth and is formed by integrated hot pressing process, which can form a three-dimensional conductive network that is fully connected and has better conductivity stability.

[0031] The conductive buffer bottom layer 4 is fully covered and adhered to the bottom surface of the three-dimensional conductive load-bearing core layer 3, serving the functions of cushioning and shock absorption, bottom conductivity, and sealing protection. This layer uses nitrile conductive rubber doped with zinc oxide conductive powder and carbon fiber, or aluminum foil composite conductive pad material, which can both bear the static electricity conducted by the core layer and quickly conduct the static electricity into the grounding system, and also buffer ground vibration, protect the core layer structure, and improve the overall service life of the floor.

[0032] The interconnecting conductive structure is located at the joints of each floorboard, primarily used to achieve lateral electrical conductivity between multiple floorboards, solving the problem of limited conductivity in a single floorboard. This structure consists of conductive tongue and groove joints and conductive adhesive strips. During manufacturing, a conductive coating is evenly sprayed onto the surfaces of the tongue and groove joints. During on-site installation, conductive adhesive strips are applied to the joints, completely eliminating conductive blind spots and achieving full lateral conductivity throughout the entire flooring system.

[0033] The whole-house grounding conductive network serves as the terminal discharge structure of the entire anti-static system. It can interconnect with the conductive structures of all floors, ultimately constructing a two-layer composite conductive discharge system of three-dimensional conductivity of the boards and whole-house grounding, completely and safely discharging static electricity to the ground. This network mainly consists of conductive supports, conductive beams, equipotential copper foil grids, and grounding copper cables. During installation, all conductive supports are connected as a whole through the conductive beams. The bottom of the supports is tightly pressed against the equipotential copper foil grid, and then the copper foil grid is led out and grounded through the grounding copper cable, forming a complete, groundable static discharge circuit.

[0034] In addition, each functional layer uses a suitable special substrate to ensure that the structural performance and conductivity are compatible: the conductive and wear-resistant surface layer 1 can be made of antistatic HPL high voltage board, antistatic ceramic glaze or homogeneous conductive PVC substrate, and a stable and durable conductive layer is formed by doping with composite conductive fillers, taking into account the use requirements of wear resistance, antistatic and easy cleaning.

[0035] To adapt to industrial mass production and ensure uniform conductivity and firm bonding of each floorboard, this antistatic floor is equipped with a proprietary manufacturing process. The overall process is simple and the parameters are controllable, specifically including the following six steps: S1. Preparation of conductive masterbatch: Conductive raw materials such as nano carbon black, carbon nanotubes, conductive mica, and short-cut carbon fibers are mixed in advance and combined with a special resin dispersant. The mixture is placed in a mixing equipment and mixed at a high temperature of 180-220℃ for 30-45 minutes to ensure that the various conductive fillers are fully dispersed and mixed evenly without agglomeration. After mixing, the mixture is extruded and granulated to obtain a stable composite conductive masterbatch, which provides the core raw material for the subsequent preparation of each layer of conductive substrate.

[0036] S2. Substrate Pretreatment: Based on the selected material of the three-dimensional conductive load-bearing core layer 3, targeted pretreatment operations are carried out to adapt to the production process of different core layers: If it is an all-steel foamed cement core, the steel plate is first stamped and spot-welded to shape, and then conductive cement is filled and allowed to cure statically; if it is a calcium sulfate high-density core, holes are pre-drilled according to the dot matrix layout, and conductive rubber columns are pre-embedded and fixed; if it is an epoxy fiberglass integrated core, fiberglass cloth laying and resin impregnation pretreatment are completed to ensure that the core layer basic structure and conductive components are pre-embedded in place to avoid rework in subsequent processes.

[0037] S3. Gradient Transition Layer Coating: Utilizing an industry-standard two-layer coating process, conductive adhesives of different concentrations are applied twice to the pre-treated three-dimensional conductive load-bearing core layer 3, precisely creating a gradient conductive structure with a thinner top and denser bottom to match the conductivity requirements of the gradient conductive transition layer 2. After coating, the layer is placed in a constant temperature device and pre-cured at 60–80°C for 15–25 minutes to allow the adhesive layer to initially set and prevent dripping, ready for use.

[0038] S4. Multi-layer integrated hot pressing: The pre-treated conductive and wear-resistant surface layer 1, gradient conductive transition layer 2, three-dimensional conductive load-bearing core layer 3, and conductive buffer bottom layer 4 are precisely aligned and stacked, and integrated composite is achieved using a segmented temperature-controlled hot pressing process. A constant pressure of 3–5 MPa is maintained throughout the process, and the hot pressing time is controlled within 20–30 minutes. Through gradient temperature control, each substrate layer is fully bonded and cured to form the final shape.

[0039] The segmented temperature-controlled hot pressing process consists of three core stages, perfectly adapted to the heat resistance and curing characteristics of each layer of material: the first stage is preheating at 120-140℃ to soften each layer of substrate and expel interlayer air; the second stage is high-temperature pressure holding at 160-180℃ to achieve tight bonding between layers; and the third stage is cooling and shaping at 50-70℃ to quickly fix the overall structure, effectively preventing delamination and hollowing problems, and ensuring continuous and uninterrupted conductive paths in each layer.

[0040] S5. Side Conductive Modification: After hot pressing, the integral board is cut to standard dimensions and the tenon and groove are precision machined. After the structural shaping is completed, a special conductive paste is sprayed on the side of the board and the tenon and groove. Then it is sent into the curing equipment and cured at 100-120℃ for 10-15 minutes to form a uniform and wear-resistant conductive layer on the side, ensuring the conductive stability after the boards are spliced.

[0041] S6. Inspection and Warehousing: After the finished boards are processed, each board undergoes comprehensive testing for conductivity, structural strength, and bonding accuracy, and unqualified products are rejected. Qualified finished products undergo thorough dust removal and protective packaging before being classified and stored in the warehouse to prevent dust adhesion and structural damage during transportation and storage, ensuring that the quality of products leaving the factory meets standards.

[0042] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0043] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An antistatic floor based on a composite conductive network, characterized in that, It includes a conductive and wear-resistant surface layer (1), a gradient conductive transition layer (2), a three-dimensional conductive load-bearing core layer (3), and a conductive buffer bottom layer (4) formed sequentially from top to bottom, as well as an inter-board interconnect conductive structure and a whole-house grounding conductive network. The conductive and wear-resistant surface layer (1) contains a composite conductive filler of nano-carbon black and carbon nanotubes to form a transverse two-dimensional conductive network. The side of the floor has a tongue and groove structure and the side of the floor is modified to be conductive. The gradient conductive transition layer (2) is doped with short-cut carbon fibers and conductive mica, and the filler density gradually increases from top to bottom to form a gradient ratio of vertical conductive channels. The three-dimensional conductive load-bearing core layer (3) has a three-dimensional conductive path inside. The conductive buffer bottom layer (4) is fully covered and adhered to the bottom surface of the three-dimensional conductive load-bearing core layer (3); The inter-board conductive structure is located at the splicing position of the floor panels to achieve lateral conductivity between multiple floor panels. The whole-house grounding conductive network is connected to each floor, forming a dual-layer composite conductive discharge system of three-dimensional conductivity of the board and whole-house grounding.

2. The antistatic floor based on a composite conductive network according to claim 1, characterized in that, The conductive and wear-resistant surface layer (1) is made of antistatic HPL high-voltage board, antistatic ceramic glaze or homogeneous conductive PVC substrate, and the surface layer is doped with composite conductive filler to form a stable conductive layer.

3. The antistatic floor based on a composite conductive network according to claim 1, characterized in that, The gradient conductive transition layer (2) is made of conductive epoxy resin or conductive modified polyurethane substrate, and its upper and lower surfaces are respectively bonded to the conductive wear-resistant surface layer (1) and the three-dimensional conductive load-bearing core layer (3).

4. The antistatic floor based on a composite conductive network according to claim 1, characterized in that, The three-dimensional conductive load-bearing core layer (3) is selected from any one of the following: all-steel foamed cement core, calcium sulfate high-density core, or epoxy fiberglass integrated core. The all-steel foamed cement core forms a conductive network by spot welding upper and lower steel plates together with the internal conductive foamed cement; the calcium sulfate high-density core has a built-in conductive graphite skeleton and is pre-embedded with through-type conductive rubber columns in a uniform dot matrix; the epoxy fiberglass integrated core is integrally hot-pressed by impregnating fiberglass cloth with graphene conductive resin to form a three-dimensional conductive network throughout.

5. The antistatic floor based on a composite conductive network according to claim 1, characterized in that, The conductive buffer bottom layer (4) is a composite conductive pad made of nitrile conductive rubber or aluminum foil doped with zinc oxide conductive powder and carbon fiber, which is fully covered and attached to the bottom surface of the three-dimensional conductive load-bearing core layer (3).

6. The antistatic floor based on a composite conductive network according to claim 1, characterized in that, The interconnecting conductive structure between boards includes conductive tenons and grooves and conductive adhesive strips. The surfaces of the male and female tenons of the floorboards are sprayed with a conductive coating, and conductive adhesive strips are pasted at the joints.

7. The antistatic floor based on a composite conductive network according to claim 1, characterized in that, The whole-house macro-grounding conductive network includes conductive brackets, conductive beams, equipotential copper foil grids, and grounding copper cables. All conductive brackets are connected through conductive beams, and copper foil grids are pressed into the bottom of the brackets. The copper foil grids are grounded through grounding copper cables.

8. A manufacturing process for preparing the antistatic flooring based on a composite conductive network as described in any one of claims 1-7, characterized in that, Includes the following steps: S1. Preparation of conductive masterbatch: Nano carbon black, carbon nanotubes, conductive mica and short carbon fibers are mixed with resin dispersant, and then fully mixed at high temperature of 180-220℃ for 30-45 minutes. After extrusion granulation, a composite conductive masterbatch with uniformly dispersed filler is prepared. S2. Substrate pretreatment: Depending on the core type, complete the following pretreatments: all-steel core stamping and spot welding, conductive cement filling and curing, or calcium sulfate core dot matrix opening and conductive rubber column pre-embedding, or epoxy fiberglass core layup pretreatment. S3. Gradient transition layer coating: A two-layer coating process is adopted, and conductive adhesive of different concentrations is coated on the upper surface of the core layer in sequence to form a gradient conductive structure with thinner upper layer and denser lower layer. It is then pre-cured at 60-80℃ for 15-25 minutes for later use. S4. Multi-layer integrated hot pressing: The functional layers are aligned and stacked, and a segmented temperature-controlled hot pressing process is adopted. Under a pressure of 3-5MPa, the multi-layer structure is integrated and formed by gradient temperature hot pressing for 20-30 minutes to ensure that each layer is tightly bonded. S5. Side conductive modification: After the molded sheet is cut and the tenon and groove are processed, conductive paste is sprayed on the side and tenon and groove, and cured at 100-120℃ for 10-15 minutes to form a uniform conductive layer. S6. Inspection and Warehousing: Inspect the electrical conductivity and structural performance of each floorboard individually, and put qualified finished floorboards into the warehouse.

9. The antistatic flooring based on a composite conductive network and its manufacturing process according to claim 8, characterized in that, In step S4, the segmented temperature-controlled hot pressing process sequentially goes through the stages of preheating at 120-140℃, high-temperature pressing at 160-180℃, and cooling and shaping at 50-70℃. The temperature control gradient is adapted to the characteristics of each layer of material to ensure that each layer is tightly bonded, without delamination, and that the conductive path is continuous and uninterrupted.

10. The antistatic floor based on a composite conductive network and its preparation process according to claim 9, characterized in that, In step S6, qualified finished flooring products are put into storage after dust removal and protection.

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