Liquid removing device, air knife, air knife accessory, and liquid removing method

Abstract

The present application provides a technology capable of sufficiently suppressing electrification of an object from which gas is blown by a gas knife. An electrostatic elimination device (50) is provided with a conveyance device (1) that conveys an object (9) in a conveyance direction D and a gas knife (51) that blows gas toward the object (9). The gas knife (51) is provided with: a gas outlet (72) that ejects gas in a direction that is inclined toward an upstream side of the conveyance in a conveyance surface H through which the object (9) conveyed by the conveyance device (1) passes; a facing surface (70) that is disposed on a downstream side of the conveyance of the gas outlet (72) so as to form a gas flow formation space V with the conveyance surface H; and an ionizer (75) that supplies ions to the gas flow formation space V. The facing surface (70) is provided with: an upstream extending surface (701) that narrows an end portion on the upstream side of the conveyance in the gas flow formation space V and extends in a direction that approaches the conveyance surface H; and a downstream extending surface (702) that narrows an end portion on the downstream side of the conveyance in the gas flow formation space V and extends in a direction that approaches the conveyance surface H.

Description

Technical Field

[0001] This application relates to a liquid removal device, an air knife, accessories for the air knife, and a liquid removal method. Background Technology

[0002] In substrate processing apparatuses, there are devices that transport substrates and perform various processing on the transported substrates. In such substrate processing apparatuses, air knives are sometimes installed along the transport path of the substrate. The air knife blows gas, such as air, onto the transported substrate in a layered manner. This removes liquid adhering to the substrate. Specifically, for example, by blowing gas onto the upper surface of the substrate, a liquid film formed on that upper surface can be washed away, causing the liquid film to flow down from the edge of the substrate, thereby removing it from the substrate. As another example, by blowing gas onto the lower surface of the substrate, droplets adhering to that lower surface can be blown away, thereby removing them from the substrate.

[0003] When gas is blown from the air knife, the substrate may become charged. If the substrate becomes charged, various problems may occur, such as: airborne particles being adsorbed and adhering to the substrate; damage to the wiring pattern formed on the substrate due to current flowing through it; and discharge between the substrate and nearby components, which may lead to a decrease in yield.

[0004] Therefore, for example, an ionizer can be installed at a position downstream of the air knife during transport, supplying ions generated by the ionizer to the substrate from which gas is blown from the air knife (e.g., Patent Documents 1-4). According to this structure, the static electricity generated on the substrate due to the gas being blown from the air knife can be removed using the ions supplied from the ionizer.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2006-3036

[0008] Patent Document 2: International Publication No. 2003 / 050600

[0009] Patent Document 3: Japanese Utility Model Application Publication No. 5-85070

[0010] Patent Document 4: Japanese Utility Model Application Publication No. 5-73939

[0011] In recent years, with the development of miniaturization and high integration of wiring patterns formed on substrates, the impact of substrate electrification on wiring patterns has become increasingly significant, thus requiring technologies that can further suppress substrate electrification. Summary of the Invention

[0012] This application was made in view of the subject matter, and its purpose is to provide a technique that can sufficiently suppress the charging of an object from the gas blown from the air knife.

[0013] The first method is a liquid removal device, comprising a conveying device for conveying an object along a conveying direction and an air knife for blowing gas onto the object. The air knife comprises: a nozzle for ejecting the gas in a direction inclined upstream of the conveying surface as it approaches the surface through which the object being conveyed by the conveying device passes; an opposing surface, disposed downstream of the nozzle on the conveying surface, forming an airflow forming space between the nozzle and the conveying surface; and an ionizer for supplying ions to the airflow forming space. The opposing surface comprises: an upstream extending surface that extends towards the conveying surface in a manner that narrows the upstream end of the airflow forming space on the conveying surface; and a downstream extending surface that extends towards the conveying surface in a manner that narrows the downstream end of the airflow forming space on the conveying surface.

[0014] The second method, based on the liquid removal device involved in the first method, has an upstream protruding surface that slopes towards the upstream side of the transport surface as it approaches the transport surface.

[0015] The third method, based on the liquid removal device involved in the first or second method, has a downstream protruding surface that is inclined towards the downstream side of the transport surface as it approaches the transport surface.

[0016] The fourth method, based on the liquid removal device involved in any of the first to third methods, has a protruding surface that protrudes from the transport downstream side connected to the upstream protruding surface in a direction close to the transport surface.

[0017] The fifth method, based on the liquid removal device involved in any of the first to fourth methods, has the minimum separation distance between the upstream protruding surface and the transport surface being equal to the minimum separation distance between the downstream protruding surface and the transport surface.

[0018] The sixth method, based on the liquid removal device involved in any of the first to fifth methods, has the ionizer disposed on the downstream protruding surface.

[0019] The seventh method is an air knife that blows gas onto an object being transported along a transport direction. The air knife includes: a nozzle that sprays the gas in a direction that is inclined towards the upstream side of the transport surface as it approaches the surface through which the object being transported passes; an opposing surface that is configured on the downstream side of the nozzle to form an airflow forming space with the transport surface; and an ionizer that supplies ions to the airflow forming space. The opposing surface includes: an upstream extending surface that extends towards the transport surface in a manner that narrows the upstream end of the airflow forming space; and a downstream extending surface that extends towards the transport surface in a manner that narrows the downstream end of the airflow forming space.

[0020] The eighth embodiment is an air knife accessory, installed on an air knife body that blows gas ejected from a nozzle onto an object being transported along a transport direction. The air knife accessory includes: a downstream protruding surface, configured, in the installed state on the transport downstream side of the nozzle, to form an airflow forming space between itself and the transport surface through which the object being transported passes, such that the downstream end of the airflow forming space narrows and extends toward the transport surface; and an ionizer, in the installed state, supplying ions to the airflow forming space.

[0021] The ninth embodiment is a liquid removal device comprising a conveying device for conveying an object along a conveying direction and an air knife for blowing gas onto the object. The air knife comprises: a nozzle for ejecting the gas in a direction inclined towards the upstream side of the conveying process as it approaches the surface through which the object being conveyed by the conveying device passes; an opposing surface configured to form an airflow forming space between itself and the conveying surface on the downstream side of the nozzle; and an ionizer for supplying ions to the airflow forming space. When the gas is ejected from the nozzle, a vortex and an outgoing gas flow are formed. The vortex flows downstream of the conveying process on the side closer to the conveying surface and upstream of the conveying process on the side farther from the conveying surface in the airflow forming space. The outgoing gas flow is drawn out from the airflow forming space towards the upstream side of the conveying process.

[0022] The tenth method is a liquid removal method comprising: a transport step, in which an object is transported along a transport direction; an ejection step, in which gas is ejected from an ejection port of an air knife in a direction inclined towards the upstream side of the transport surface as it approaches the surface through which the object being transported is passed; and an ion supply step, in which ions are supplied to an airflow forming space disposed between an opposing surface of the air knife and the transport surface on the downstream side of the ejection port, wherein when the gas is ejected from the ejection port, a vortex and an outgoing gas flow are formed, the vortex in the airflow forming space flows towards the downstream side of the transport surface on the side close to the transport surface and flows towards the upstream side of the transport surface on the side away from the transport surface, and the outgoing gas flow is drawn out from the airflow forming space towards the upstream side of the transport.

[0023] In each of the first to eighth methods, an airflow forming space is provided between the opposing surface of the air knife and the transport surface, narrowing both ends of the transport direction. Therefore, when gas is ejected from the nozzle, a vortex is formed in the airflow forming space, thereby creating an exhaust gas flow drawn from the airflow forming space towards the upstream side of the transport. Ions supplied to the airflow forming space fill the airflow forming space by riding the vortex. Furthermore, a portion of the ions transported by the vortex are drawn from the airflow forming space towards the upstream side of the transport by the exhaust gas flow and transported to the upstream side of the nozzle. This effectively suppresses the possibility of the object becoming charged.

[0024] Furthermore, in the ninth and tenth embodiments, when gas is ejected from the nozzle, a vortex is formed in the airflow forming space, thereby creating an exhaust gas flow that is drawn from the airflow forming space to the upstream transport side. Ions supplied to the airflow forming space are filled by the vortex. Additionally, a portion of the ions transported by the vortex are drawn from the airflow forming space to the upstream transport side by the exhaust gas flow and transported to the upstream transport side of the nozzle. As a result, the possibility of the object becoming charged can be sufficiently suppressed. Attached Figure Description

[0025] Figure 1 This is a top view schematically showing the structure of the substrate processing system.

[0026] Figure 2 This is a side view schematically showing an example of the structure of a developing apparatus.

[0027] Figure 3 This is a perspective view of a substrate handling device.

[0028] Figure 4 This is a top view of the air knife installed in the transport path, viewed from the normal direction of the transport surface.

[0029] Figure 5This is a side sectional view of the air knife installed in the transport path, viewed from the direction orthogonal to the transport direction and along the transport surface.

[0030] Figure 6 This is a side view of the air knife taken along the length of the air knife installed in the transport path.

[0031] Figure 7 (a) and (b) are diagrams used to illustrate the flow of gas formed between the air knife and the substrate.

[0032] Figure 8 It is a diagram schematically illustrating the flow of ions.

[0033] Figure 9 This is a side sectional view of the air knife installed in the transport path, viewed from the direction orthogonal to the transport direction and along the transport surface.

[0034] Figure 10 This is a side view of the air knife taken along the length of the air knife installed in the transport path.

[0035] Figure 11 (a) and (b) are diagrams used to illustrate the flow of gas formed between the air knife and the substrate.

[0036] Figure 12 This is a diagram used to illustrate the accessories for air knives.

[0037] Figure 13 This is a side view of the air knife taken along the length of the air knife installed in the transport path.

[0038] Figure 14 This is a side view of the air knife taken along the length of the air knife installed in the transport path.

[0039] Figure 15 (a) to (c) are side views of the first, second, and third comparative air knives, respectively, taken along their respective length directions.

[0040] Figure 16 (a) and (b) are diagrams used to illustrate the flow of gas formed between the first comparative air knife and the substrate.

[0041] Figure 17 (a) and (b) are diagrams used to illustrate the flow of gas formed between the second comparative air knife and the substrate.

[0042] Figure 18 (a) and (b) are diagrams used to illustrate the flow of gas formed between the third comparative air knife and the substrate.

[0043] Explanation of reference numerals in the attached figures

[0044] 50, 50a liquid removal device

[0045] 1. Substrate handling device

[0046] 11-roller unit

[0047] 111 Roller

[0048] 112 rolls

[0049] 12 Drive Unit

[0050] 51, 51a, 51b, 51c, 51d air knife

[0051] 71 First matrix

[0052] 711i First side view

[0053] 711j Second side

[0054] 712 Front end

[0055] 712i First Front Face

[0056] 712j Second Front Face

[0057] 72 Spray nozzle

[0058] 73 flow path

[0059] 74 Second matrix

[0060] 741i First side view

[0061] 741j Second side

[0062] 742 Bottom

[0063] 7421 Storage Recess

[0064] 7422 Card Section

[0065] 75 Ionizer

[0066] 76. Protrusion

[0067] 761 Convex surface

[0068] 501 Air Knife Body

[0069] 502 air knife accessories

[0070] V, Va airflow formation space

[0071] 70, 70a facing surfaces

[0072] 701, 701a upstream protruding surface

[0073] 702, 702a Downstream extended surface Detailed Implementation

[0074] Hereinafter, embodiments will be described with reference to the accompanying drawings. Furthermore, the constituent elements described in this embodiment are merely examples and are not intended to limit the scope of this disclosure to these elements. Additionally, in the accompanying drawings, for ease of understanding, the dimensions or quantities of various parts are sometimes exaggerated or simplified as needed.

[0075] Expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along a direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.), unless otherwise specified, not only strictly indicate the positional relationship but also the state of relative displacement about angles or distances within tolerance or to achieve the same function. Similarly, expressions indicating equal states (e.g., "same," "equal," "homogeneous," etc.), unless otherwise specified, not only quantitatively and strictly indicate the state of equality but also indicate the state of having tolerances or differences in achieving the same level of function. Furthermore, expressions indicating shape (e.g., "circle," "quadrilateral," "cylindrical," etc.), unless otherwise specified, not only strictly indicate the shape geometrically but can also indicate the range of shapes that can achieve the same level of effect, such as having concavity or chamfers. Additionally, expressions such as "equipped with," "having," "possessing," "including," and "containing" are not exclusive expressions excluding the existence of other constituent elements. Furthermore, the expression "at least one of A, B, and C" includes "only A," "only B," "only C," "any two of A, B, and C," and "all of A, B, and C."

[0076] <1. First Implementation Method>

[0077] <1-1. Substrate Processing System>

[0078] Reference Figure 1 The substrate processing system 100 will be described. Figure 1 This is a top view schematically illustrating an example of the structure of the substrate processing system 100.

[0079] The substrate processing system 100 illustrated here is a system for coating and developing a substrate 9 with a resist (coating and developing system). The substrate 9, which is the object of processing in the substrate processing system 100, is, for example, a rectangular glass substrate used in a liquid crystal display device.

[0080] The substrate processing system 100 has a structure in which a plurality of substrate processing devices (cleaning device 101, dehydration and baking device 102, coating association device 103, pre-baking device 104, developing device 105, and post-baking device 106) are arranged between the indexer section ID and the interface section IF. In the forward path from the indexer section ID to the interface section IF, for example, the cleaning device 101, the dehydration and baking device 102, the coating association device 103, and the pre-baking device 104 are arranged sequentially. On the other hand, in the return path from the interface section IF to the indexer section ID, for example, the developing device 105 and the post-baking device 106 are arranged sequentially. Furthermore, the substrate processing system 100 is connected to the exposure device E via the interface section IF.

[0081] In the indexer section ID, the substrate handling robot (indexer robot) takes out the substrate 9 one by one from the storage container (box) that holds a plurality of substrates 9, and sends the taken-out substrates 9 to the cleaning device 101.

[0082] In the cleaning apparatus 101, for example, particles, organic contaminants, metallic contaminants, grease, or natural oxide film adhering to the surface of the substrate 9 are removed by supplying cleaning fluid to the substrate 9 (cleaning process). The substrate 9 that has undergone the cleaning process is sent to the dehydration and baking apparatus 102.

[0083] In the dehydration and baking apparatus 102, the substrate 9 is heated and dehydrated (dehydration and baking (drying) treatment). The substrate 9 that has undergone the dehydration and baking treatment is sent to the coating associated apparatus 103.

[0084] In the coating association apparatus 103, a resist is coated onto the substrate 9, and the coated resist is dried, for example, by depressurization drying, thereby forming a resist film on the surface of the substrate 9 (coating association process). The substrate 9 that has undergone the coating association process is sent to the pre-baking apparatus 104.

[0085] In the pre-baking apparatus 104, the resist film disposed on the substrate 9 is heated (pre-baking treatment) for purposes such as curing the resist film. The substrate 9 that has undergone the pre-baking treatment is sent to the interface section IF.

[0086] In the interface section IF, the substrate handling robot (interface robot) will transport the substrate 9 from the pre-baking device 104 to the exposure device E.

[0087] In the exposure apparatus E, light is irradiated onto the substrate 9 via a photomask, thereby transferring the pattern on the photomask onto the resist film provided on the substrate 9 (exposure process). The substrate 9, having undergone the exposure process, returns to the interface section IF.

[0088] In the interface section IF, the interface robot delivers the substrate 9 returned from the exposure device E to the developing device 105.

[0089] In the developing apparatus 105, firstly, a developing solution is supplied (coated) to the substrate 9. This develops the resist film, forming a pattern on the substrate 9 (development process). Then, the substrate 9 is washed with a rinsing solution (rinsing process). This stops the development process. Then, the rinsing solution adhering to the substrate 9 is removed (liquid removal process). The substrate 9, having undergone the liquid removal process, is sent to the post-baking apparatus 106.

[0090] In the post-baking apparatus 106, the substrate 9 is heated (post-baking treatment) for the purpose of improving the resist film quality after development. The substrate 9 that has undergone post-baking treatment is sent to the indexing unit ID.

[0091] In the indexer section ID, the indexer robot, for example, stores the substrate 9 delivered from the post-baking device 106 in a box.

[0092] The substrate processing system 100 includes a control unit 107 that controls the various components included in the system (cleaning device 101, dehydration and baking device 102, coating association device 103, pre-baking device 104, developing device 105, post-baking device 106, indexing unit ID, and interface unit IF). A series of operations performed in the substrate processing system 100 are carried out under the control of the control unit 107. The control unit 107 is, for example, a general computer with circuitry. As an example, the control unit 107 includes: a central processing unit (CPU) that performs data processing; ROM (Read-Only Memory) that stores basic programs; RAM (Random Access Memory) used as the operating area for the CPU to perform specified processing (data processing); storage devices (e.g., non-volatile storage devices such as flash memory or hard disk drives); and buses that connect them to each other. For example, a program specifying the processing to be executed by the control unit 107 is stored in the storage device. By executing the program through the CPU, the control unit 107 can perform the processing specified by the program. Of course, some or all of the processing executed by the control unit 107 can also be executed by dedicated hardware such as logic circuits.

[0093] <1-2. Advection Treatment Device>

[0094] The substrate processing system 100 includes a plurality of substrate processing apparatuses (cleaning apparatus 101, dehydration and baking apparatus 102, coating associated apparatus 103, pre-baking apparatus 104, developing apparatus 105, and post-baking apparatus 106), among which a processing apparatus (parallel flow processing apparatus) is included that sequentially transports substrates 9 in one direction and processes each substrate 9 individually. For example, the cleaning apparatus 101 and the developing apparatus 105 are parallel flow processing apparatuses. Hereinafter, refer to... Figure 2 , Figure 3 The structure of the advection treatment device will be explained using the developing device 105 as an example. Figure 2 This is a schematic diagram illustrating an example of the structure of the developing apparatus 105. Figure 3 This is a perspective view showing the general structure of the substrate handling device 1.

[0095] The developing apparatus 105 includes a substrate transport device 1, a substrate introduction unit 2, a developing processing unit 3, a rinsing processing unit 4, a liquid removal unit 5, and a substrate exit unit 6. The substrate transport device 1 is a transport device for transporting substrates 9. The substrate introduction unit 2, the developing processing unit 3, the rinsing processing unit 4, the liquid removal unit 5, and the substrate exit unit 6 are arranged in sequence from the upstream side of the transport direction D of substrate 9 along the transport path T formed by the substrate transport device 1. Each of these units 2, 3, 4, 5, and 6 is provided with a processing tank 2h, 3h, 4h, 5h, and 6h, respectively, and the interiors of adjacent processing tanks 2h, 3h, 4h, 5h, and 6h are connected by a transport inlet for the substrate 9 to pass through.

[0096] (Substrate handling device 1)

[0097] The substrate transport device 1 is, for example, a mechanism (roller transport mechanism) that transports the substrate 9 by means of rollers. The substrate transport device 1 includes a plurality of roller units 11 and a plurality of drive units 12.

[0098] Roller unit 11 includes a long, rod-shaped roller shaft 111 and rollers (transfer rollers) 112 supported by the roller shaft 111. Roller 112, for example, has a cylindrical circumferential surface and circular main surfaces at both ends in the width direction of the circumferential surface. As an example, the roller shaft 111 extends through the center of the main surface of roller 112 along the normal direction of the main surface, thereby supporting roller 112. Roller 112 is fixed in a manner that prevents it from rotating relative to roller shaft 111. Furthermore, a plurality of rollers 112 are arranged and supported at intervals (typically, at equal intervals) along the extending direction of roller shaft 111. As described above, substrate transport apparatus 1 includes a plurality of roller units 11. The plurality of roller units 11 are arranged in a row at intervals along a direction orthogonal to the extending direction of roller shaft 111, with roller shaft 111 extending parallel to each other. Specifically, for example, the roller shafts 111 of a plurality of roller units 11 are mounted between a pair of support plates 113 in an orientation that extends orthogonally to the extension direction of the support plates 113, and are arranged in a row at intervals along the extension direction of the pair of support plates 113, 113.

[0099] The drive unit 12 is configured to include, for example, an electric motor, to rotate the roller shaft 111 about its axis. The roller shaft 111 is coaxially arranged with the rotation axis Lc. By rotating the roller shaft 111 about its axis, each roller 112, which is fixed relative to the roller shaft 111 but cannot rotate, can rotate about the rotation axis Lc. By bringing the roller 112 into contact with the lower surface of the substrate 9 and rotating it about the rotation axis Lc, the substrate 9 is transported in the rotation direction of the roller 112. By rotating each roller shaft 111 of the plurality of roller units 11 arranged in a row about the rotation axis Lc in the same direction, the substrate 9 is transported along a path (transport path T) defined by the arrangement direction of the plurality of roller units 11, along a surface defined by the arrangement plane of the plurality of roller units 11, and in a direction (transport direction D) defined by the rotation direction of each roller unit 11. Hereinafter, the surface through which the substrate 9 transported by the substrate transport device 1 passes will be referred to as the "transport surface H". Specifically, the "surface through which the substrate 9 passes" is the surface through which the upper or lower surface of the substrate 9 passes. When the thickness of the substrate 9 is sufficiently small (thin), it can be considered that the surfaces through which the upper and lower surfaces of the substrate 9 pass are the same. Furthermore, the transport surface H is defined by the arrangement surface of the plurality of roller units 11. When the thickness of the substrate 9 is sufficiently small, it can be considered that the transport surface H is the same as the arrangement surface of the plurality of roller units 11 (specifically, the surface at the upper end of each roller 112 of each roller unit 11). As an example, a fixed number of adjacent roller units 11 are grouped to form a roller unit group 11g, and a drive unit 12 is provided for each roller unit group 11g. That is, each roller shaft 111 of a predetermined number of roller units 11 belonging to the same group is driven by the same drive unit 12. The drive unit 12 causes each roller shaft 111 of the predetermined number of roller units 11, which is the object of drive, to rotate (synchronously rotate) about the rotation axis Lc in the same direction and at the same rotational speed.

[0100] (Substrate introduction section 2)

[0101] The substrate introduction section 2 is a speed switching section that switches (changes) the transport speed of the substrate 9. For example, in order to increase throughput, the transport speed of the path section where the transported substrate 9 is not processed (simply transported) is sometimes higher than the transport speed of the path section where the transported substrate 9 is processed (e.g., the path section from the developing processing section 3 to the descaling section 5). In this case, a speed switching section provided between these two path sections switches the transport speed of the substrate 9. That is, the substrate introduction section 2 is provided upstream of the developing processing section 3 relative to the transport direction D, and, for example, the speed of the substrate 9 transported from the interface section IF at a relatively high speed is reduced. Specifically, for example, in the substrate introduction section 2, the rotation speed of the roller unit group 11g located downstream of the transport direction D is lower than the rotation speed of the roller unit group 11g located upstream of the transport direction D. As a result, the transport speed of the substrate 9 is switched from high speed to low speed, and the substrate 9 is sent out at a low speed.

[0102] (Developing Processing Section 3)

[0103] The developing unit 3 is a processing unit that supplies developing solution to the substrate 9. The developing unit 3 includes a developing nozzle 31 and an air knife 32.

[0104] A developing nozzle 31 is disposed in the transport path T and supplies developing solution to the upper surface of the transported substrate 9. The developing nozzle 31 is, for example, a nozzle with an elongated nozzle outlet (a slit nozzle). The developing nozzle 31 is disposed in a position where the extension direction of the nozzle outlet intersects (e.g., orthogonally) the transport direction D. In this state, the nozzle outlet extends along the entire width direction of the substrate 9 (the direction orthogonal to the transport direction D). Furthermore, the developing nozzle 31 is disposed, for example, in an inclined position where the ejection direction is tilted downwards towards the downstream side of the transport direction D. The developing nozzle 31 is connected to the developing solution storage unit 313, for example, via a supply pipe 312 into which an on / off valve 311 is inserted. When the on / off valve 311 is open, developing solution is supplied from the developing solution storage unit 313 to the developing nozzle 31 through the supply pipe 312, thereby ejecting the developing solution from the nozzle outlet. That is, the developing solution is ejected in a curtain-like manner along an ejection direction tilted downwards towards the downstream side of the transport direction D, covering the entire area of ​​the substrate 9 in the width direction. Therefore, a developer is supplied to the upper surface of the transported substrate 9, thereby forming a liquid layer of the developer on the upper surface. By forming the liquid layer of the developer, the resist film is developed, and a pattern is formed on the substrate 9.

[0105] An air knife 32 is disposed in the transport path T and ejects gas (here, for example, air) onto the transported substrate 9. The air knife 32 is disposed downstream of the developing nozzle 31 in the transport direction D. The air knife 32 is, for example, a nozzle with an elongated ejection outlet. The air knife 32 is disposed in a position where the extension direction of the ejection outlet intersects the transport direction D. In this state, the ejection outlet extends over the entire width of the substrate 9. In addition, the air knife 32 is disposed in a vertical position with the ejection direction vertically downward. The air knife 32 is connected to a compressed air supply source M, for example, via a supply pipe 322 into which an on / off valve 321 is inserted. When the on / off valve 321 is open, compressed air (compressed gas) is supplied from the compressed air supply source M to the air knife 32 through the supply pipe 322, so that the air is ejected from the ejection outlet at high pressure. That is, air is ejected at high pressure in a curtain shape covering the entire width direction of the substrate 9 along the vertically downward ejection direction. Because the air blown vertically downwards towards the substrate 9 being transported forms a barrier, it prevents the developer present on the upper surface of the substrate 9 from moving downstream along the transport direction D with the substrate 9. The developer that cannot move with the substrate 9 is flushed upstream of the transport direction D or in a direction intersecting the transport direction D and flows down from the substrate 9, thus being removed from the substrate 9. In this way, the air knife 32 may not completely remove the developer from the substrate 9, leaving a trace amount of developer on the substrate 9 that does not cause the substrate 9 to dry completely.

[0106] (Rinsing and processing section 4)

[0107] The rinsing processing unit 4 is a processing unit that supplies rinsing liquid to the substrate 9. The rinsing processing unit 4 is equipped with two types of rinsing nozzles (a first rinsing nozzle 41a and a second rinsing nozzle 41b).

[0108] A first rinsing nozzle 41a is disposed on the transport path T and supplies rinsing fluid to the upper surface of the transported substrate 9. The first rinsing nozzle 41a is, for example, a nozzle with an elongated nozzle outlet. The first rinsing nozzle 41a is disposed such that the extension direction of the nozzle outlet intersects the transport direction D. In this state, the nozzle outlet extends over the entire width of the substrate 9. In addition, the first rinsing nozzle 41a is disposed such as an inclined position where the ejection direction is tilted from vertically downward toward the downstream side of the transport direction D. The first rinsing nozzle 41a is connected to the rinsing fluid storage unit 413, for example, via a supply pipe 412 into which an on / off valve 411 is inserted. When the on / off valve 411 is open, rinsing fluid (e.g., pure water as rinsing fluid) is supplied from the rinsing fluid storage unit 413 to the first rinsing nozzle 41a through the supply pipe 412, thereby ejecting the rinsing fluid from the nozzle outlet of the first rinsing nozzle 41a. That is, the rinsing fluid is ejected in a curtain-like manner over the entire width of the substrate 9 along an ejection direction that is tilted from vertically downward toward the downstream side of the transport direction D. Therefore, rinsing liquid is supplied to the upper surface of the transported substrate 9 to replace the developer remaining on the upper surface. That is, the substrate 9 is washed with rinsing liquid.

[0109] The second rinsing nozzle 41b, like the first rinsing nozzle 41a, is disposed in the transport path T and supplies rinsing fluid to the upper surface of the transported substrate 9. The second rinsing nozzle 41b is disposed downstream of the first rinsing nozzle 41a in the transport direction D. A plurality of second rinsing nozzles 41b may be provided along the transport direction D. The second rinsing nozzle 41b is, for example, a nozzle with a plurality of nozzles provided along the extension direction of an elongated cylindrical body, arranged in a manner where the extension direction of the cylindrical body intersects the transport direction D. Like the first rinsing nozzle 41a, the second rinsing nozzle 41b is connected to the rinsing fluid storage section 413 via, for example, a supply pipe 412 through which an on / off valve 411 is inserted. When the on / off valve 411 is open, rinsing fluid (e.g., pure water as rinsing fluid) is supplied to the second rinsing nozzle 41b from the rinsing fluid storage section 413 through the supply pipe 412, thereby spraying the rinsing fluid from each nozzle of the second rinsing nozzle 41b in a spray pattern. Therefore, rinsing liquid is further supplied to the upper surface of the transported substrate 9 to replace the developer remaining on the upper surface. That is, the substrate 9 is washed with rinsing liquid.

[0110] (Liquid removal section 5)

[0111] The liquid removal section 5 is a processing section for removing liquid adhering to the substrate 9. The liquid removal section 5 includes an air knife 51. In the liquid removal section 5, a liquid removal device 50 is formed, which includes a substrate transport device 1 and an air knife 51.

[0112] An air knife 51 is disposed on the transport path T to blow gas (e.g., air) onto the transported substrate 9. Air knives 51 are disposed on both the upper and lower sides of the transport surface H. Each air knife 51 is, for example, a nozzle with an elongated nozzle outlet. Each air knife 51 is disposed such that the extension direction of its nozzle intersects the transport direction D. In this state, the nozzle extends along the entire width of the substrate 9. Furthermore, the air knife 51 disposed on the upper side of the transport surface H is disposed in an inclined position, with its ejection direction tilted from vertically downwards towards the upstream side of the transport direction D (tilting towards the upstream side of the transport direction D as it approaches the transport surface H). The air knife 51 disposed on the lower side of the transport surface H is disposed in an inclined position, with its ejection direction tilted from vertically upwards towards the upstream side of the transport direction D (tilting towards the upstream side of the transport direction D as it approaches the transport surface H). Each air knife 51 is connected to a compressed air supply source M, for example, via a supply pipe 512 into which an on / off valve 511 is inserted. When the on / off valve 511 is open, compressed air is supplied from the compressed air supply source M to each air knife 51 through the supply pipe 512, thereby ejecting air at high pressure from the nozzle. That is, air is ejected at high pressure in a curtain-like (layer-like) manner from the nozzle of the air knife 51 disposed on the upper side of the transport surface H, along a spray direction inclined from vertically downward to the upstream side of the transport direction D, covering the entire area in the width direction of the substrate 9. As a result, liquid adhering to the upper surface of the transported substrate 9 (e.g., a liquid film formed on the upper surface) is flushed upstream in the transport direction D, flows down from the edge of the substrate 9, and is thus removed from the upper surface (liquid removal). On the other hand, air is ejected at high pressure in a curtain-like manner from the nozzle of the air knife 51 disposed on the lower side of the transport surface H, along a spray direction inclined from vertically upward to the upstream side of the transport direction D, covering the entire area in the width direction of the substrate 9. As a result, liquid (e.g., droplets) adhering to the lower surface of the substrate 9 being transported is blown away upstream in the transport direction D, thereby being removed from the lower surface.

[0113] (Substrate Outlet Section 6)

[0114] The substrate exit section 6, like the substrate inlet section 2, is a speed switching section that switches the transport speed of the substrate 9. The substrate exit section 6 is located downstream of the liquid removal section 5 in the transport direction D, and, for example, accelerates the speed of the substrate 9, which is transported from the liquid removal section 5 at a relatively low speed. Specifically, for example, in the substrate exit section 6, the rotational speed of the roller unit group 11g located downstream of the transport direction D is greater than the rotational speed of the roller unit group 11g located upstream of the transport direction D. As a result, the transport speed of the substrate 9 switches from low speed to high speed, and the substrate 9 is delivered at high speed.

[0115] <1-3. Air Knife>

[0116] Below, refer to Figure 4 , Figure 5 , Figure 6The air knife 51 of the liquid removal unit 5 will be described in detail. Figure 4 This is a diagram of the air knife 51 installed on the transport path T, viewed from the normal direction of the transport surface H. Figure 5 This is a cross-sectional view of the air knife 51 installed on the transport path T, viewed from a direction parallel to the transport surface H and orthogonal to the transport direction D. Figure 6 This is a side view of the air knife 51 installed in the transport path T, viewed along the length of the air knife.

[0117] (a) Structure

[0118] The air knife 51 is disposed as described above in the transport path T formed by the substrate transport device 1, and blows gas (e.g., air) onto the object (substrate 9) being transported along the transport direction D. The liquid removal device 50 is thus formed by including the substrate transport device 1 and the air knife 51.

[0119] The air knife 51 includes a first substrate 71, an outlet 72, a flow path 73, a second substrate 74, and an ionizer 75.

[0120] The first base 71 is a long strip-shaped component, having a pair of parallel side surfaces (first side surface 711i and second side surface 711j) extending along the length direction, a front end surface 712 connected to one end of the pair of side surfaces 711i and 711j in the width direction, a base end surface 713 connected to the other end of the pair of side surfaces 711i and 711j in the width direction, and an end surface 714 connected to each end of the pair of side surfaces 711i and 711j in the length direction.

[0121] The nozzle 72 is a slit-shaped opening disposed on the first base 71. Specifically, the nozzle 72 extends along the entire length of the front end face 712. A portion of the nozzle 72 on one side (first front end face) 712i and a portion on the other side (second front end face) 712j of the front end face 712 form a predetermined angle of less than 180 degrees (preferably less than 90 degrees). That is, the front end face 712 has a mountain-shaped profile that tapers towards the nozzle 72.

[0122] The flow path 73 is disposed inside the first substrate 71 and communicates with the nozzle 72 at one end. Specifically, for example, a pair of inner wall surfaces (a first inner wall surface 731i and a second inner wall surface 731j) are disposed inside the first substrate 71, and the flow path 73 is formed by the gap between the pair of inner wall surfaces 731i and 731j. The pair of inner wall surfaces 731i and 731j extend parallel to each other. In addition, the pair of inner wall surfaces 731i and 731j extend parallel to a pair of side surfaces 711i and 711j, for example. The extension direction of the pair of inner wall surfaces 731i and 731j defines the extension direction of the flow path 73, and thus defines the ejection direction Q of the gas from the nozzle 72. The ejection direction Q defines the positional relationship between the inner wall surfaces 731i and 731j and the second front end surface 712j by forming a predetermined angle (first angle) θ1 with the second front end surface 712j.

[0123] The second base 74 is an elongated component, with a length in the longitudinal direction approximately the same as that of the first base 71. The second base 74 has a pair of parallel side surfaces (first side surface 741i and second side surface 741j) extending in the longitudinal direction, a bottom surface 742 connected to one end of the pair of side surfaces 741i and 741j in the width direction, a cover surface 743 connected to the other end of the pair of side surfaces 741i and 741j in the width direction, and an end surface 744 connected to each end of the pair of side surfaces 741i and 741j in the longitudinal direction.

[0124] The second base 74 is mounted on the first base 71. Specifically, the second base 74 is mounted on the first base 71 with its first side surface 741i in surface contact with the second side surface 711j of the first base 71. The method of mounting the second base 74 on the first base 71 is arbitrary. For example, the second base 74 can be mounted on the first base 71 by bonding the first side surface 741i to the second side surface 711j with adhesive, double-sided tape, etc. Alternatively, the second base 74 can be mounted on the first base 71 using mounting clamps (e.g., connecting plates and bolts). Alternatively, the second base 74 can be mounted on the first base 71 using a snap-fit ​​mechanism provided between it and the first base 71. With the second base 74 mounted on the first base 71, the second front end surface 712j and the bottom surface 742 are connected at a predetermined angle (second angle) θ2, forming a curved surface (facing surface) 70.

[0125] The ionizer 75 generates ions by ionizing the surrounding air to remove static electricity (neutralize it). This device is also called an electrostatic eliminator, static electricity remover, etc. Specifically, the ionizer 75 has, for example, a discharge plate 751. The discharge plate 751 has, for example, a strip-shaped, thin plate-like substrate and electrodes disposed on the substrate. When power (e.g., high-frequency power) is supplied to the electrodes, a discharge is generated from the electrodes, and ions are generated in a planar manner from approximately the entirety of one main surface (ion generating surface) of the discharge plate 751. Commercially available examples of such ionizers 75 include, for example, the F2 series of ion blades (registered trademark) from FISA Corporation (catalog URL: https: / / www.fisa.co.jp / product / dynac / ionblade_F2.html). Alternatively, the ionizer 75 can be pre-unitized with a second substrate 74. Commercially available products that are modular ionizers 75 include, for example, the B1 series of ion blades (registered trademark) from FISA Corporation (catalog URL: https: / / www.fisa.co.jp / product / dynac / ionblade_B1.html).

[0126] An ionizer 75 is disposed on a second substrate 74. Specifically, for example, the ionizer 75 has its discharge plate 751 disposed on a bottom surface 742, and at least a portion of various components (power supply circuit, control circuit, wiring cables, etc.) used to supply power to the discharge plate 751 are housed inside the second substrate 74. The discharge plate 751 extends, for example, along the entire length of the bottom surface 742. Therefore, with the second substrate 74 mounted on the first substrate 71, the discharge plate 751 is parallel to the nozzle 72 and extends along the entire length of the nozzle 72. The manner in which the discharge plate 751 is disposed on the bottom surface 742 can be arbitrary. As an example, a long, narrow recess (receiving recess) 7421 extending along the entire length of the bottom surface 742 is provided. The discharge plate 751 is housed within the receiving recess 7421 along its extending direction, with the ion-generating surface facing the opening of the receiving recess 7421 (i.e., with the ion-generating surface exposed). Furthermore, an insulating member 7422 extending inwards from the opening of the receiving recess 7421 is provided, either wholly or partially, on the periphery of the opening. The insulating member 7422 is formed of an insulator (an insulating material, such as an insulating resin). With the discharge plate 751 housed in the receiving recess 7421, the insulating member 7422 wholly or partially surrounds the ion-generating surface, thereby preventing the adsorption of ions generated by the ion-generating surface by nearby conductive components.

[0127] (b) Configuration

[0128] As described above, the air knife 51 is disposed on the transport path T. The air knife 51 is disposed above or below the transport surface H at a height (hereinafter referred to as "approach height") where the nozzle 72 approaches the transport surface H without contact. Furthermore, the air knife 51 is disposed with the discharge plate 751 positioned downstream of the transport direction D (hereinafter referred to as "downstream transport side") relative to the nozzle 72, and the extending directions of the nozzle 72 and the discharge plate 751 intersect (e.g., non-orthogonal intersection) the transport direction D. Moreover, the air knife 51 is disposed in an orientation (hereinafter referred to as "tilted orientation") such that the ejection direction Q of the gas ejected from the nozzle 72 is tilted towards the upstream side of the transport direction D (hereinafter referred to as "upstream transport side") as it approaches the transport surface H.

[0129] When the air knife 51 is arranged at an inclined position at a height close to the ground, the opposing surface 70 formed by the connection of the second front end surface 712j and the bottom surface 742 is provided with a space (hereinafter referred to as "airflow forming space") V between the downstream side of the nozzle 72 and the transport surface H (i.e., the substrate 9 transported by the substrate transport device 1), and is arranged facing the transport surface H.

[0130] The opposing surface 70 has an upstream extension surface 701 that extends towards the transport surface H in a manner that narrows the upstream end (hereinafter referred to as the "first end") of the airflow forming space V. The upstream extension surface 701 is formed in the surface region of the opposing surface 70 on the upstream side of the transport surface, namely the second front end surface 712j. Specifically, when the air knife 51 is arranged in an inclined position, a first angle θ1 is defined such that the second front end surface 712j becomes an inclined surface that tilts towards the upstream side of the transport surface as it approaches the transport surface H. By extending the second front end surface 712j towards the transport surface H, the first end of the airflow forming space V is narrowed.

[0131] Furthermore, the opposing surface 70 has a downstream extension surface 702 that extends towards the transport surface H in a manner that narrows the downstream end (hereinafter referred to as the "second end") of the airflow forming space V. The downstream extension surface 702 is formed in the bottom surface 742 of the opposing surface 70, which is the surface region on the downstream side of the transport. Specifically, when the air knife 51 is arranged in an inclined position, a second angle θ2 is defined such that the bottom surface 742 is an inclined surface that slopes towards the downstream side of the transport as it approaches the transport surface H. By extending the bottom surface 742 towards the transport surface H, the second end of the airflow forming space V is narrowed.

[0132] Furthermore, a discharge plate 751 of an ionizer 75 is provided in the opposing surface 70 (of which the downstream protruding surface 702, i.e., the bottom surface 742). That is, the discharge plate 751 is positioned facing the airflow forming space V. Therefore, ions generated in the ionizer 75 are supplied to the airflow forming space V.

[0133] (c) Action

[0134] As described above, the air knife 51 is connected to the compressed air supply source M, for example, via a supply pipe 512 into which an on / off valve 511 is inserted (see reference). Figure 2 When the on / off valve 511 is open, gas (e.g., compressed air) is supplied to the air knife 51 from the compressed air supply source M via the supply piping 512. The gas supplied to the air knife 51 flows through the flow path 73 and is ejected from the nozzle 72 in the ejection direction Q (ejection process). Additionally, a wiring (not shown) for supplying power to the ionizer 75 is connected to the air knife 51. When power is supplied to the ionizer 75 via this wiring, ions are generated in a planar manner from the ion generation surface, thereby supplying ions to the airflow forming space V (ion supply process). In the air knife 51, when gas is ejected from the nozzle 72, ions are supplied to the airflow forming space V in parallel. That is, the ejection process and the ion supply process are performed in parallel.

[0135] On the other hand, the substrate transport apparatus 1 transports the substrate 9 along the transport direction D (transport process). Currently, any position within the main surface of the transported substrate 9 is of interest. When the position of interest approaches the air knife 51, gas ejected from the nozzle 72 along the ejection direction Q is blown toward the position of interest. As described above, the ejection direction Q is a direction that slopes upstream of the transport surface H as it approaches. By blowing gas in this direction, liquid adhering to the position of interest is either flushed toward the upstream of the transport or blown away, thereby being peeled off (removed) from the position of interest. Specifically, for example, by blowing gas toward the upper surface of the substrate 9, liquid (e.g., liquid film) adhering to the position of interest within the upper surface is flushed from the position of interest toward the upstream of the transport, thereby being peeled off from the position of interest. After being further flushed toward the upstream of the transport, the liquid peeled off from the position of interest flows down from the edge of the substrate 9, thereby being discharged from the substrate 9. When the air knife 51 is arranged in a position where the extension direction of the nozzle 72 does not orthogonally intersect the transport direction D, the liquid peeled off from the location of interest flows to one side of the substrate 9 in the width direction. For example, it flows down from the corner of the end edge on that side and the end edge on the upstream side of transport, and is thus discharged from the substrate 9. Alternatively, for example, by blowing gas toward the lower surface of the substrate 9, the liquid (e.g., droplets) adhering to the location of interest on the lower surface is blown away from the location of interest toward the upstream side of transport, thereby peeling it off from the location of interest. In this way, the liquid adhering to the substrate 9 can be removed when the substrate 9 passes the location where the air knife 51 is arranged.

[0136] When the substrate 9 passes the placement position of the air knife 51, the substrate 9 may become charged. There are two reasons for considering the substrate 9 becoming charged. First, when the gas blown from the air knife 51 flows along the substrate 9, friction between the gas and the substrate 9 may cause it to become charged (frictional charging). Second, when liquid is peeled off the substrate 9 by the blown gas, the substrate 9 may become charged (peeling charging). However, as described above, in the air knife 51, when gas is ejected from the nozzle 72, ions are supplied to the gas flow forming space V in parallel. By supplying ions to the gas flow forming space V, the possibility of the substrate 9 becoming charged can be sufficiently suppressed. The reasons are explained below.

[0137] <1-4. Flow of Gases and Ions>

[0138] (a) Gas flow

[0139] First, refer to Figure 7 (a) and (b) illustrate the flow of gas formed between the air knife 51 and the substrate 9. Figure 7 (a) is a diagram showing the simulation results of the gas flow formed around the air knife 51 when gas is ejected from the nozzle 72. Figure 7 (b) is a schematic diagram showing the gas flow as determined by simulation results.

[0140] The gas ejected from the nozzle 72 flows in an ejection direction Q that is inclined towards the upstream side of the transport surface as it approaches the transport surface H (ejected gas flow K1). The ejected gas flow K1 collides with the substrate 9 at a position (first collision position) P1 that is closer to the upstream side of the transport surface than directly below (or directly above) the nozzle 72. Most of the gas that collides with the substrate 9 flows from the first collision position P1 along the substrate 9 towards the upstream side of the transport surface (first gas flow K2), and the remaining part flows from the first collision position P1 along the substrate 9 towards the downstream side of the transport surface (second gas flow K3). The first gas flow K2 collides with the liquid L attached to the substrate 9 at the first collision position P1 or at a position (second collision position P2) that is closer to the upstream side of the transport surface than that position (second collision position P2). As a result, near the second collision position P2, the liquid L is peeled off from the substrate 9.

[0141] When gas is ejected from nozzle 72, a vortex K4 is formed in the airflow forming space V located on the downstream side of the transport surface at nozzle 72. The reason for the formation of vortex K4 can be considered as follows: When gas is ejected from nozzle 72, a second gas flow K3 flows into the airflow forming space V and flows downstream of the transport surface there. Near its second end, it collides with a gas flow (opposing flow) J1 flowing upstream of the transport surface. After colliding with the opposing flow J1, the second gas flow K3 rolls away from the transport surface H and reverses its flow direction towards the upstream side of the transport surface. As a result, a vortex K4 is formed in the airflow forming space V (i.e., a vortex K4 flowing downstream of the transport surface near the transport surface H and flowing upstream of the transport surface away from the transport surface H). In particular, here, since the downstream protruding surface 702 has an inclined surface (bottom surface 742) that slopes towards the downstream side of the transport surface H as it approaches the transport surface H, the gas flow that rolls away from the transport surface H flows along the bottom surface 742, thereby being able to smoothly reverse towards the upstream side of the transport.

[0142] When a vortex K4 is formed in the airflow forming space V, an exhaust gas flow K5 is formed, which is drawn from the airflow forming space V towards the upstream side of the transport. The reason for the formation of the exhaust gas flow K5 can be considered as follows: The vortex K4 formed in the airflow forming space V flows towards the downstream side of the transport on the side near the transport surface H, reverses direction while flowing away from the transport surface H near the second end, flows towards the upstream side of the transport on the side away from the transport surface H, and flows towards the transport surface H near the first end. That is, when the vortex K4 is formed in the airflow forming space V, a gas flow that is not opposite to the direction Q is formed near the nozzle 72. Since the first end is narrowed by the upstream extension surface 701, a portion of this gas flow is guided (carried) towards the exhaust gas flow K1 through the Venturi effect, thereby being drawn from the airflow forming space V towards the upstream side of the transport, forming the exhaust gas flow K5 flowing towards the upstream side of the transport. In particular, here, since the upstream protruding surface 701 has an inclined surface (second front end surface 712j) that slopes towards the upstream side of the transport surface H, a gas flow with sufficient velocity is formed near the nozzle 72 by causing the vortex K4 to flow along the second front end surface 712j. As a result, gas is easily drawn out from the airflow forming space V towards the upstream side of the transport. That is, the outgoing gas flow K5 is easily formed.

[0143] (b) Ion flow

[0144] Below, refer to Figure 8 The flow of ions generated in ionizer 75 is explained. Figure 8 It is a diagram schematically illustrating the flow of ions.

[0145] Ions generated in ionizer 75 are supplied to the gas flow forming space V. As described above, when gas is ejected from nozzle 72, a vortex K4 is formed in the gas flow forming space V, and an exhaust gas flow K5 is formed that draws out of the gas flow forming space V towards the upstream transport side. Therefore, the ions supplied to the gas flow forming space V are filled with the gas flow forming space V (injected gas flow forming space V) by riding on the vortex K4. In addition, a portion of the ions carried by the vortex K4 are carried in the exhaust gas flow K5 and drawn out of the gas flow forming space V towards the upstream transport side, and transported to the upstream transport side of nozzle 72.

[0146] In the region A1 near the second collision position P2 where the first gas flow K2 collides with the liquid L (the peeling region), the substrate 9 may become charged when the liquid L is peeled off from the substrate 9. However, a portion of the ions supplied to the gas flow forming space V are drawn out from the gas flow forming space V by the outgoing gas flow K5 to the upstream transport side and transported to the upstream transport side of the nozzle 72. Therefore, ions are present around the peeling region A1. Thus, it is possible to sufficiently avoid the substrate 9 becoming charged in the peeling region A1.

[0147] Furthermore, in the region A2 where the eddy current K4 contacts the substrate 9 (friction region), the substrate 9 may become charged due to friction with the gas. However, ions supplied to the gas flow forming space V are carried by the eddy current K4 and fill the gas flow forming space V, thus ions are present around the friction region A2. Therefore, it is possible to sufficiently avoid the substrate 9 becoming charged in the friction region A2.

[0148] <1-5. Comparative Examples>

[0149] (a) Gas flow

[0150] The vortex K4 formed in the air knife 51 and the effluent gas flow K5 will be described in detail based on a comparison with the air knives involved in the comparative examples (first comparative air knife 51s, second comparative air knife 51t, and third comparative air knife 51u). Furthermore, in the following description, the same reference numerals are used for elements identical to those described in the air knife 51, and their descriptions are omitted.

[0151] (First comparative example)

[0152] like Figure 15As shown in (a), the first comparative air knife 51s differs from the air knife 51 in the shape of the second substrate 74s. Specifically, the second substrate 74s of the first comparative air knife 51s, when mounted on the first substrate 71, is connected to the downstream side of the nozzle 72 and has a bottom surface 742s at a predetermined angle (third angle) θ3 with respect to the ejection direction Q. When the first comparative air knife 51s is arranged at an inclined position close to its height, the third angle θ3 is defined such that the bottom surface 742s extends parallel to the transport surface H. Therefore, when the first comparative air knife 51s is arranged at an inclined position close to its height, the space (first comparative space) Vs between the transport surface H and the bottom surface 742s is a space whose thickness does not change (neither narrowing nor widening) throughout the entire transport direction D, and its thickness is a smaller dimension relative to the separation distance between the nozzle 72 and the transport surface H.

[0153] Reference Figure 16 (a) and (b) illustrate the flow of gas formed between the first comparative air knife 51s and the substrate 9. Figure 16 (a) is a graph showing the simulation results of the gas flow formed around the first comparative air knife 51s when gas is ejected from the nozzle 72. Figure 16 (b) is a schematic diagram showing the gas flow as determined by simulation results.

[0154] In the first comparative air knife 51s, the gas ejected from the nozzle 72 forms an ejected gas flow K1 that flows in an ejection direction Q that is inclined towards the upstream side of the transport surface H, and collides with the substrate 9 at the first collision position P1. Most of the gas that collides with the substrate 9 forms a first gas flow K2 that flows upstream of the transport surface along the substrate 9, and the remaining part forms a second gas flow K3 that flows downstream of the transport surface along the substrate 9. The first gas flow K2 collides with the liquid L attached to the substrate 9 at the second collision position P2. As a result, near the second collision position P2, the liquid L is peeled off from the substrate 9.

[0155] When gas is ejected from the nozzle 72, a vortex K40 is formed near the upstream end (first end) of the first comparison space Vs. The reason for the formation of the vortex K40 can be considered as follows: The second gas flow K3 flowing into the first comparison space Vs collides with the gas flow (opposite flow) J1 flowing upstream of the transport side near the first end, thus reversing its flow direction towards the upstream of the transport side. As a result, a vortex K40 is formed near the first end (i.e., a vortex K40 flowing downstream of the transport side near the transport surface H and flowing upstream of the transport side away from the transport surface H). The thickness of the first comparison space Vs along the entire transport direction D is a smaller dimension than the separation distance between the nozzle 72 and the transport surface H; therefore, the diameter of the vortex K40 formed near the first end is equal to the separation distance between the nozzle 72 and the transport surface H (hereinafter referred to as "smaller vortex K40"). If a small vortex K40 is formed near the first end, a flow of exhaust gas K5 drawn from the first comparison space Vs to the upstream side of the transport will not be formed.

[0156] On the other hand, in the air knife 51, the airflow forming space V located between the transport surface H and the opposing surface 70 is, as described above, a space that narrows at both ends (the first end and the second end) of the transport direction D, that is, a space that relatively widens at the center of the transport direction D. The vortex K4 formed in the airflow forming space V is a vortex with a diameter (hereinafter referred to as "larger vortex K4") that is larger in the thickness direction of the central part of the airflow forming space V (that is, larger than the separation distance between the nozzle 72 and the transport surface H). As described above, if a larger vortex K4 is formed in the airflow forming space V, an exhaust gas flow K5 will be formed that is drawn from the airflow forming space V to the upstream side of the transport.

[0157] (Second comparative example)

[0158] like Figure 15 As shown in (b), the second comparative air knife 51t differs from the air knife 51 in that it lacks the second substrate 74 and the ionizer 75. That is, the second comparative air knife 51t has a first substrate 71, an outlet 72, and a flow path 73, but lacks the second substrate 74 and the ionizer 75. When the second comparative air knife 51t is arranged in an inclined position at near its height, a space (second comparison space) Vt is provided between the second front end face 712j (i.e., the second front end face 712j at a first angle θ1 to the ejection direction Q) that is inclined towards the upstream side of the transport surface H and the transport surface H, and is arranged facing the transport surface H. Therefore, the second comparison space Vt forms a space that narrows as it moves towards the upstream side of the transport surface (i.e., a space that widens as it moves towards the downstream side of the transport surface).

[0159] Reference Figure 17(a) and (b) illustrate the flow of gas formed between the second comparative air knife 51t and the substrate 9. Figure 17 (a) is a graph showing the simulation results of the gas flow formed around the second comparative air knife 51t when gas is ejected from the nozzle 72. Figure 17 (b) is a schematic diagram showing the gas flow as determined by simulation results.

[0160] In the second comparative air knife 51t, the gas ejected from the nozzle 72 forms an ejected gas flow K1 that flows in an ejection direction Q inclined towards the upstream side of the transport as it approaches the transport surface H, and collides with the substrate 9 at the first collision position P1. Most of the gas that collides with the substrate 9 forms a first gas flow K2 that flows upstream of the transport along the substrate 9, and the remaining portion forms a second gas flow K3 that flows downstream of the transport along the substrate 9. The first gas flow K2 collides with the liquid L attached to the substrate 9 at the second collision position P2. As a result, near the second collision position P2, the liquid L is peeled off from the substrate 9.

[0161] When gas is ejected from the nozzle 72, a small vortex K40 is formed near the upstream end (first end) of the second comparison space Vt. That is, even in the second comparison space Vt, similar to the first comparison space Vs, only a small vortex K40 is formed near the first end, and no large vortex K40 is formed. The reason for this is as follows: The second comparison space Vt is a space that widens towards the downstream side of the transport (the downstream end (second end) widens), therefore, the opposing flow J1 flowing towards the upstream side of the transport is not obstructed and flows into the second comparison space Vt, reaching the second front end face 712j and being guided away from the transport surface H. That is, the opposing flow J1 is formed throughout the entire thickness direction of the second comparison space Vt. The second gas flow K3 flowing into the second comparison space Vt is pushed into the vicinity of the first end by this opposing flow J1 and collides with it, reversing its flow direction towards the upstream side of the transport, thus forming a small vortex K40 near the first end. As described above, when a small vortex K40 is formed near the first end, the exhaust gas flow K5 drawn from the second comparison space Vt to the upstream side of the transport will not be formed.

[0162] On the other hand, in the air knife 51, the airflow forming space V formed between the transport surface H and the opposing surface 70 is a space that narrows not only at the first end but also at the second end. Therefore, the opposing flow J1, which flows upstream of the transport surface and attempts to enter the airflow forming space V, is mostly blocked and cannot enter the airflow forming space V. That is, although a small amount of opposing flow J1 enters the airflow forming space V through the gap between the downstream end of the downstream protruding surface 702 and the transport surface H, its amount is very small compared to the opposing flow J1 entering the second comparison space Vt. This small amount of opposing flow J1 entering the airflow forming space V collides with the second gas flow K3 and reverses towards the downstream side of the transport surface, forming a reverse vortex J10 opposite to the vortex K4. However, since the amount of opposing flow J1 entering the airflow forming space V is small, it can be considered that the reverse vortex J10 will be pushed into the vicinity of the second end by the vortex K4. As a result, a large vortex K4 is formed in the airflow forming space V. As described above, when a large vortex K4 is formed in the airflow forming space V, an exhaust gas flow K5 is formed that is drawn out from the airflow forming space V towards the upstream side of the transport.

[0163] (Third comparative example)

[0164] like Figure 15 As shown in (c), the third comparative air knife 51u differs from the air knife 51 in the shape of the second base 74u. Specifically, the second base 74u of the third comparative air knife 51u, when mounted on the first base 71, has a bottom surface 742u connected to the downstream side of the second front end face 712j. However, the angle (fourth angle) θ4 between them differs from the second angle θ2 (in the air knife 51, the second front end face 712j and the bottom surface 742 form a second angle θ2). Specifically, when the third comparative air knife 51u is mounted at an inclined position close to its height, the bottom surface 742u extends parallel to the transport surface H, defining the fourth angle θ4. Therefore, when the third comparison air knife 51u is installed at an inclined position at a height close to the height, the space (third comparison space) Vu between the curved surface formed by the connection of the second front end surface 712j and the bottom surface 742u and the transport surface H is a space in which the thickness of the upstream end (first end) of the transport becomes narrower and the thickness of the downstream end (second end) of the transport remains unchanged.

[0165] Reference Figure 18 (a) and (b) illustrate the flow of gas formed between the third comparative air knife 51u and the substrate 9. Figure 18 (a) is a graph showing the simulation results of the gas flow formed around the third comparative air knife 51u when gas is ejected from the nozzle 72. Figure 18 (b) is a schematic diagram showing the gas flow as determined by simulation results.

[0166] In the third comparative air knife 51u, the gas ejected from the nozzle 72 forms an ejected gas flow K1 that flows in an ejection direction Q inclined towards the upstream side of the transport as it approaches the transport surface H, and collides with the substrate 9 at the first collision position P1. Most of the gas that collides with the substrate 9 forms a first gas flow K2 that flows upstream of the transport along the substrate 9, and the remaining portion forms a second gas flow K3 that flows downstream of the transport along the substrate 9. The first gas flow K2 collides with the liquid L attached to the substrate 9 at the second collision position P2. As a result, near the second collision position P2, the liquid L is peeled off from the substrate 9.

[0167] When gas is ejected from nozzle 72, in the third comparison space Vu, the second gas flow K3 flowing downstream of the transport interacts with the gas flow flowing upstream of the transport, thereby forming a plurality of vortices K40, J10, and J20. Specifically, the second gas flow K3 flowing into the third comparison space Vu collides with the gas flow (first opposing flow) J1 flowing upstream of the transport, reversing its direction towards the upstream of the transport to form vortex K40. Furthermore, a portion of vortex K40 is guided downstream of the transport surface H along the second front end face 712j, and midway along the bottom surface 742u, collides with the gas flow (second opposing flow) J2 flowing upstream of the transport, reversing its direction away from the bottom surface 742u and towards the upstream of the transport to form a reversing vortex J10. Moreover, the second opposing flow J2, colliding with the reversing vortex J10, reverses its direction away from the bottom surface 742u and towards the downstream of the transport to form a secondary vortex J20. Even in the third comparison space Vu, similar to the first comparison space Vs and the second comparison space Vt, a smaller vortex K40 is formed near the first end, and a larger vortex K4 is not formed. The reason for this is as follows: the third comparison space Vu is a space where the first end narrows while the thickness of the second end remains constant. Therefore, a considerable amount of gas flowing upstream of the transport flow will flow into the third comparison space Vu, resulting in a larger reverse vortex J10 and secondary vortex J20 formed relatively downstream of the transport flow than the vortex K40 formed relatively upstream of the transport flow. As a result, the vortex K40 can be considered to be pushed into the vicinity of the first end due to the reverse vortex J10. As described above, with a smaller vortex K40 forming near the first end, the exhaust gas flow K5 drawn from the third comparison space Vu towards the upstream of the transport flow will not be formed.

[0168] On the other hand, as described above, in the air knife 51, the airflow forming space V located between the transport surface H and the opposing surface 70 is a space that narrows not only at the first end but also at the second end. A large portion of the opposing flow J1, which flows upstream of the transport surface and attempts to enter the airflow forming space V, is blocked and cannot flow into the airflow forming space V. Therefore, it is assumed that the secondary vortex J20 will not form, while the reverse vortex J10 is pushed into the vicinity of the second end due to the vortex K4. As a result, a large vortex K4 is formed in the airflow forming space V. As described above, when a large vortex K4 is formed in the airflow forming space V, an exhaust gas flow K5 is formed that is drawn from the airflow forming space V towards the upstream of the transport surface.

[0169] (b) Ion flow

[0170] As described above, in the first comparative air knife 51s, the second comparative air knife 51t, or the third comparative air knife 51u, even if gas is ejected from the nozzle 72, a large eddy current K4 will not be formed in the comparative spaces Vs, Vt, and Vu, and therefore no outgoing gas flow K5 will be formed from the comparative spaces Vs, Vt, and Vu to the upstream side of the transport. If the outgoing gas flow K5 is not formed, even if ions are supplied to the comparative spaces Vs, Vt, and Vu, the ions will not be transported to the upstream side of the transport of the nozzle 72. Therefore, ions cannot exist around the stripping region A1, and thus it is impossible to avoid the situation where the substrate 9 becomes charged in the stripping region A1. The static electricity generated on the substrate 9 in the stripping region A1 will only be de-charged after a certain period of time (i.e., when the substrate 9 is transported downstream to the region where ions exist). However, in this case, since it takes some time from the generation of static electricity to its de-charge, particles in the air may be adsorbed and attached to the charged substrate 9 before de-charge. In addition, when the substrate 9 is charged, even for a short time, there may be a momentary increase in potential, which may cause various defects (for example, the wiring pattern may be damaged due to current flowing through it, or a discharge may occur between the substrate 9 and the components located nearby).

[0171] In response, in the air knife 51, when gas is ejected from the nozzle 72, a large vortex K4 is formed in the airflow forming space V, thereby forming an exhaust gas flow K5 that is drawn from the airflow forming space V towards the upstream transport side. Therefore, as described above, ions supplied to the airflow forming space V are carried by the vortex K4 and fill the airflow forming space V. A portion of the ions carried by the vortex K4 are drawn from the airflow forming space V towards the upstream transport side by the exhaust gas flow K5 and transported to the upstream transport side of the nozzle 72. Thus, ions are present around the peeling region A1 and the friction region A2, thereby effectively preventing the substrate 9 from becoming charged in the peeling region A1 and the friction region A2. As long as sufficient ions are present around the peeling region A1 and the friction region A2, the substrate 9 will not become charged at all, and there is no need for de-charging. Therefore, particles in the air will not be adsorbed and adhere to the substrate 9, and no potential increase will occur on the substrate 9.

[0172] The amount of ions present around the peeling region A1 and the friction region A2 can be considered to increase with the amount of ions carried by the eddy current K4. To carry more ions in the eddy current K4, it is effective, for example, to place an ionizer 75 (specifically, a discharge plate 751) facing the eddy current K4. In many cases, due to design or specification limitations, the discharge plate 751 must be positioned at a certain distance from the nozzle 72. When a large eddy current K4 is formed in the airflow forming space V, the area through which the eddy current K4 circulates (and even the area facing the eddy current K4) becomes very large. Therefore, it is easy to position the discharge plate 751 at a certain distance from the nozzle 72 and facing the eddy current K4. By positioning the discharge plate 751 facing the eddy current K4, a sufficient amount of ions can be carried by the eddy current K4, thus ensuring a sufficient amount of ions around the peeling region A1 and the friction region A2. This effectively prevents the substrate 9 from becoming charged in the peeling region A1 and the friction region A2.

[0173] <1-6. Effects>

[0174] The liquid removal apparatus 50 according to the above embodiment includes a transport device (substrate transport device) 1 for transporting an object (such as a substrate 9) in a transport direction D and an air knife 51 for blowing gas onto the substrate 9. The air knife 51 includes: a nozzle 72 for ejecting gas in a direction (ejection direction) Q that is inclined towards the upstream side of the transport as it approaches the transport surface H (i.e., the surface through which the substrate 9 transported by the substrate transport device 1 passes); an opposing surface 70, which is arranged downstream of the nozzle 72 to form an airflow forming space V with the transport surface H; and an ionizer 75 for supplying ions to the airflow forming space V. The opposing surface 70 includes: an upstream extension surface 701 that extends towards the transport surface H in a manner that narrows the upstream end (first end) of the airflow forming space V; and a downstream extension surface 702 that narrows the downstream end (second end) of the airflow forming space V in a manner that narrows towards the transport surface H. With this structure, an airflow forming space V, narrowing at both ends (the first end and the second end) of the transport direction D, is provided between the opposing surface 70 of the air knife 51 and the transport surface H (i.e., between the opposing surface 70 and the transported substrate 9). Therefore, when gas is ejected from the nozzle 72, a vortex K4 is formed in the airflow forming space V, and an exhaust gas flow K5 is formed that is drawn from the airflow forming space V to the transport upstream side. Ions supplied to the airflow forming space V fill the airflow forming space V by riding on the vortex K4. In addition, a portion of the ions transported by riding on the vortex K4 are drawn from the airflow forming space V to the transport upstream side by riding on the exhaust gas flow K5, and thus transported to the transport upstream side of the nozzle 72. As a result, the situation where the substrate 9 becomes charged can be sufficiently suppressed.

[0175] Furthermore, in the above embodiment, the upstream protruding surface 701 has an inclined surface (second front end surface 712j) that slopes towards the upstream side of the transport surface H as it approaches. With this structure, by causing the vortex K4 to flow along the second front end surface 712j, a gas flow with sufficient velocity can be formed near the nozzle 72, making it easy to form the exhaust gas flow K5.

[0176] Furthermore, in the above embodiment, the downstream protruding surface 702 has an inclined surface (bottom surface 742) that slopes towards the downstream side of the transport surface H as it approaches the transport surface H. With this structure, the gas flow that rolls away from the transport surface H can flow along the bottom surface 742 and thus smoothly reverse towards the upstream side of the transport surface.

[0177] Furthermore, in the above embodiment, the ionizer 75 generates ions in a planar manner. Therefore, it is unnecessary to send the generated ions out through a transport gas flow, or in other words, the gas flow can be suppressed to a lesser extent. Consequently, the vortex K4 formed in the airflow forming space V is less likely to be disturbed. Additionally, compared to ionizers that generate ions from needle-shaped electrodes, the electrode potential of the planar ionizer 75 is less likely to rise. If the electrode potential is less likely to rise, the risk of airborne particles being adsorbed and attached to the electrode can be reduced. Furthermore, the risk of particles attached to the electrode being attached to the substrate 9 can be reduced.

[0178] <2. Second Implementation Method>

[0179] <2-1. Air Knife>

[0180] Reference Figure 9 , Figure 10 The air knife 51a according to the second embodiment will be described. Figure 9 This is a cross-sectional view of the air knife 51a installed on the transport path T, viewed from a direction parallel to the transport surface H and orthogonal to the transport direction D. Figure 10 A side view of the air knife 51a arranged in the transport path T, viewed along its length. Furthermore, in the following description, the same reference numerals are used for elements identical to those described in the above embodiments, and their descriptions are omitted.

[0181] (a) Structure

[0182] The air knife 51a, like the air knife 51 in the first embodiment, is disposed in the transport path T formed by the substrate transport apparatus 1, and blows gas (e.g., air) onto the object (substrate 9) being transported along the transport direction D. The substrate transport apparatus 1 and the air knife 51a are included to form a liquid removal apparatus 50a.

[0183] The air knife 51a differs from the air knife 51 according to the first embodiment in that it has a protrusion 76. That is, the air knife 51a has a first base 71, a nozzle 72, a flow path 73, a second base 74, an ionizer 75, and a protrusion 76. The structures of the first base 71, nozzle 72, flow path 73, second base 74, and ionizer 75 were described in the first embodiment.

[0184] A protrusion 76 is provided in the second base 74. Specifically, the protrusion 76 extends across the entire end edge of the bottom surface 742 of the second base 74, connecting to the second side surface 741j, and protrudes from the bottom surface 742. The protrusion 76 can be formed in any manner. For example, it can be formed by mounting a rod-shaped member with a rectangular cross-section along the end edge of the bottom surface 742 connecting to the second side surface 741j. Alternatively, it can be formed by mounting a plate-shaped member with a rectangular main surface to the second side surface 741j with one end edge protruding. Hereinafter, the surface of the protrusion 76 that connects to the bottom surface 742 will be referred to as the "protruding surface 761". The bottom surface 742 and the protruding surface 761 are connected at a predetermined angle (fifth angle) θ5, forming a curved surface. For example, the protrusion 76 can protrude along the normal direction of the bottom surface 742, in which case the fifth angle θ5 is 90 degrees.

[0185] As described above, the second base 74 is mounted on the first base 71. With the second base 74, which has a protrusion 76, mounted on the first base 71, the second front end face 712j is connected to the bottom face 742 at a second angle θ2, and the bottom face 742 is connected to the protruding face 761 at a fifth angle θ5, thereby forming a two-section bent surface (facing surface) 70a.

[0186] (b) Configuration

[0187] As described above, the air knife 51a is disposed on the transport path T. The air knife 51a is positioned above or below the transport surface H, with the nozzle 72 disposed at a height close to the transport surface H (closeness height). Furthermore, the air knife 51a is disposed with the discharge plate 751 downstream of the nozzle 72, and the extension directions of both the nozzle 72 and the discharge plate 751 intersect the transport direction D. Additionally, the air knife 51a is disposed with the gas ejected from the nozzle 72 in an upward-sloping direction (tilting position) as it approaches the transport surface H, with the ejection direction Q of the gas from the nozzle 72 tilting towards the upstream side of the transport path.

[0188] When the air knife 51a is installed at an inclined position at a height close to the ground, the opposing surface 70a formed by the second front end surface 712j, the bottom surface 742 and the protruding surface 761 is provided with a space (airflow forming space) Va between the downstream side of the nozzle 72 and the transport surface H, and is arranged facing the transport surface H.

[0189] The opposing surface 70a has an upstream extension surface 701a that extends towards the transport surface H in a manner that narrows the upstream end (first end) of the airflow forming space Va. The upstream extension surface 701a is formed in the surface region of the upstream side of the opposing surface 70a, i.e., the second front end surface 712j. Specifically, when the air knife 51a is arranged in an inclined position, the second front end surface 712j is defined at a first angle θ1 such that it forms an inclined surface that tilts towards the upstream side of the transport surface H. By extending the second front end surface 712j towards the transport surface H, the first end of the airflow forming space Va is narrowed.

[0190] Furthermore, the opposing surface 70a has a downstream extension surface 702a that extends towards the transport surface H in a manner that narrows the end (second end) of the downstream side of the airflow forming space Va. The downstream extension surface 702a is formed by two surface regions on the downstream side of the opposing surface 70a (i.e., the first surface region, the bottom surface 742, and the second surface region connected to the downstream side, the protruding surface 761). Specifically, when the air knife 51a is arranged in an inclined position, the bottom surface 742 is defined at a second angle θ2 such that it forms an inclined surface that slopes towards the downstream side of the transport surface H. In this state, the protruding surface 761 is defined at a fifth angle θ5 such that it protrudes from the bottom surface 742 towards the transport surface H. Therefore, the protruding surface 761 protrudes further towards the transport surface H from the end edge of the bottom surface 742 closest to the transport surface H (i.e., the end edge located closest to the downstream side of the transport surface). By extending the bottom surface 742a and the protruding surface 761 toward the direction of the transport surface H, the second end of the airflow forming space Va is narrowed.

[0191] In this configuration, with the air knife 51a positioned at an inclined angle and close to its height, the minimum separation distance between the upstream protruding surface 701a and the transport surface H is referred to as the "first separation distance G1," and the minimum separation distance between the downstream protruding surface 702a and the transport surface H is referred to as the "second separation distance G2." Preferably, the second separation distance G2 is greater than or equal to the first separation distance G1, and more preferably equal to it. That is, the second separation distance G2 is preferably as small as possible within the range of the first separation distance G1. The first separation distance G1 is the separation distance between the upstream edge of the second front end face 712j and the transport surface H, and the second separation distance G2 is the separation distance between the protruding edge of the protruding surface 761 and the transport surface H. In this case, for example, it is preferable to define the dimensions of the protruding part 76 in the protruding direction such that the second separation distance G2 is greater than or equal to the first separation distance G1 (especially preferably equal to the first separation distance G1). The term "equal" here refers not only to the case where the first separation distance G1 and the second separation distance G2 are the same, but also to the case where the difference between the first separation distance G1 and the second separation distance G2 is sufficiently small.

[0192] Furthermore, a discharge plate 751 for an ionizer 75 is provided on the opposing surface 70a (of which the downstream extending surface 702a, i.e., the bottom surface 742). That is, the discharge plate 751 is positioned facing the airflow forming space Va. Therefore, the ions generated in the ionizer 75 are supplied to the airflow forming space Va.

[0193] <2-2. Flow of Gases and Ions>

[0194] (a) Gas flow

[0195] Reference Figure 11 (a) and (b) illustrate the flow of gas formed between the air knife 51a and the substrate 9. Figure 11 (a) is a diagram showing the simulation results of the gas flow formed around the air knife 51a when gas is ejected from the nozzle 72. Figure 11 (b) is a schematic diagram showing the gas flow as determined by simulation results.

[0196] In the air knife 51a, similar to the air knife 51 of the first embodiment, the gas ejected from the nozzle 72 flows in an ejection direction Q that is inclined towards the upstream side of the transport as it approaches the transport surface H (ejected gas flow K1). The ejected gas flow K1 collides with the substrate 9 at the first collision position P1. Most of the gas that collides with the substrate 9 flows from the first collision position P1 along the substrate 9 towards the upstream side of the transport (first gas flow K2), and the remaining part flows from the first collision position P1 along the substrate 9 towards the downstream side of the transport (second gas flow K3). The first gas flow K2 collides with a substance (e.g., liquid) L attached to the substrate 9 at the second collision position P2. As a result, near the second collision position P2, the liquid L is peeled off from the substrate 9.

[0197] When gas is ejected from the nozzle 72, a vortex K4a is formed in the airflow forming space Va located on the downstream side of the transport surface at the nozzle 72. The reason for forming the vortex K4a can be considered as follows: When gas is ejected from the nozzle 72, a second gas flow K3 flows into the airflow forming space Va and flows downstream, colliding with the protruding surface 761 at its second end. The second gas flow K3, colliding with the protruding surface 761, rolls away from the transport surface H, thus reversing its flow direction towards the upstream side of the transport surface. As a result, a vortex K4a is formed in the airflow forming space Va (i.e., a vortex K4a flowing downstream on the side near the transport surface H and flowing upstream on the side away from the transport surface H). In particular, the downstream protruding surface 702a has a protruding surface 761 that protrudes from the bottom surface 742 towards the transport surface H, thus sufficiently narrowing the second end. Therefore, it can block the opposing flow J1 flowing upstream and attempting to flow into the airflow forming space Va. Therefore, in the airflow forming space Va, almost no opposing flow J1 will form from the gap between the downstream end of the transport surface 702a and the transport surface H into the airflow forming space Va. Figure 7 ), thus preventing the formation of reverse vortex J10 ( Figure 7 As a result, a large vortex K4a is formed, which is essentially formed by the entire airflow through the space Va.

[0198] When a vortex K4a is formed in the airflow forming space Va, an exhaust gas flow K5 is formed that is drawn out from the airflow forming space Va towards the upstream side of the transport. The reason for forming the exhaust gas flow K5 is as explained in the first embodiment.

[0199] (b) Ion flow

[0200] In the air knife 51a, similar to the air knife 51 according to the first embodiment, ions generated in the ionizer 75 are supplied to the airflow forming space Va. As described above, when gas is ejected from the nozzle 72, a vortex K4a is formed in the airflow forming space Va, thereby forming an exhaust gas flow K5 that is drawn from the airflow forming space Va to the upstream transport side. Therefore, the ions supplied to the airflow forming space Va fill the airflow forming space Va by riding on the vortex K4a. In addition, a portion of the ions transported by riding on the vortex K4a are drawn from the airflow forming space Va to the upstream transport side by riding on the exhaust gas flow K5 and transported to the upstream transport side of the nozzle 72. As a result, it is possible to sufficiently avoid the substrate 9 becoming charged in the peeling region A1 and the friction region A2.

[0201] <3. Third Implementation Method>

[0202] <3-1. Air Knife>

[0203] Reference Figure 12 The air knife 51b according to the third embodiment will be described. Figure 12 This is a side view of the air knife 51b viewed along its length. Furthermore, in the following descriptions, elements identical to those described in the above embodiments will be labeled with the same reference numerals, and their descriptions will be omitted.

[0204] (a) Structure

[0205] The air knife 51b, like the air knife 51 in the first embodiment, is disposed in the transport path T formed by the substrate transport apparatus 1, and blows gas (e.g., air) onto the object (substrate 9) being transported along the transport direction D. The substrate transport apparatus 1 and the air knife 51b are included to form a liquid removal device.

[0206] The air knife 51b includes an air knife body 501 and an air knife accessory 502 mounted on the air knife body 501. That is, the air knife 51b is formed by mounting the air knife accessory 502 on the air knife body 501.

[0207] The air knife body 501 blows air onto the substrate 9 being transported along the transport direction D. The air knife body 501 can be, for example, a conventional air knife. As an example, the air knife body 501 includes a first base 71, an outlet 72, and a flow path 73. The structures of the first base 71, the outlet 72, and the flow path 73 are as described in the first embodiment.

[0208] The air knife accessory 502 is mounted on the air knife body 501 as described above. Specifically, the air knife accessory 502 includes, for example, a second base 74 and an ionizer 75. The structures of the second base 74 and the ionizer 75 are as described in the first embodiment.

[0209] The air knife accessory 502 is mounted to the air knife body 501 with its first side surface 741i of the second base 74 in surface contact with the second side surface 711j of the first base 71. The method of mounting the air knife accessory 502 to the air knife body 501 is arbitrary. For example, the air knife accessory 502 can be mounted to the air knife body 501 using a mounting clamp 77 (e.g., a connecting plate 771 and bolts 772). Alternatively, the air knife accessory 502 can also be mounted to the air knife body 501 using a snap-fit ​​mechanism. Furthermore, the first side surface 741i can be bonded to the second side surface 711j using adhesive, double-sided tape, or the like to mount the air knife accessory 502 to the air knife body 501. When the air knife accessory 502 is installed on the air knife body 501 (installation state), the second front end face 712j of the air knife body 501 and the bottom face 742 of the air knife accessory 502 are connected at a specified second angle θ2 to form a curved surface (facing surface) 70.

[0210] (b) Configuration

[0211] The air knife body 501 can be, for example, an existing air knife disposed on the transport path T. Specifically, the air knife body 501 has, for example, an outlet 72 positioned at a height close to the transport surface H in a non-contact state (closeness height) on either the upper or lower side of the transport surface H. Furthermore, the air knife body 501 is disposed such that the extending direction of the outlet 72 intersects the transport direction D. Also, the air knife body 501 is disposed such that the gas ejected from the outlet 72 is inclined towards the upstream side of the transport surface as it approaches the transport surface H (inclined posture). An air knife accessory 502 is installed on the downstream side of the air knife body 501 during transport. That is, the air knife accessory 502 is installed on the air knife body 501 such that its first side surface 741i makes surface contact with the second side surface 711j disposed on the downstream side of the transport surface.

[0212] When the air knife 51b, formed by installing the air knife accessory 502 on the air knife body 501, is installed at an inclined position at a height close to the height, the second front end face 712j of the air knife body 501 and the bottom face 742 of the air knife accessory 502 in the installed state form an opposing face 70. On the downstream side of the nozzle 72, a space (airflow forming space) V is provided between the air knife 51b and the transport surface H, and the air knife 51b is positioned opposite to the transport surface H.

[0213] The opposing surface 70 has an upstream extending surface 701 that narrows the upstream end (first end) of the airflow forming space V and extends towards the transport surface H, and a downstream extending surface 702 that narrows the downstream end (second end) of the airflow forming space V and extends towards the transport surface H. The upstream extending surface 701 is formed on the second front end surface 712j of the air knife body 501. Specifically, when the air knife body 501 is arranged in an inclined position, the second front end surface 712j is defined at a first angle θ1 such that it forms an inclined surface that slopes towards the upstream side of the transport surface H. The downstream extending surface 702 is formed on the bottom surface 742 of the air knife accessory 502 in the installed state. Specifically, when the air knife accessory 502 is installed on the air knife body 501 arranged in an inclined position, the bottom surface 742 is defined at a second angle θ2 such that it forms an inclined surface that slopes towards the downstream side of the transport surface H. Furthermore, a discharge plate 751 for the ionizer 75 is provided on the opposing surface 70 (where the downstream protruding surface 702 is the bottom surface 742 of the air knife accessory 502). That is, the discharge plate 751 is positioned facing the airflow forming space V. Therefore, ions generated in the ionizer 75 are supplied to the airflow forming space V.

[0214] <3-2. Flow of Gases and Ions>

[0215] The gas flow between the air knife 51b and the substrate 9 is the same as that of the gas flow between the air knife 51 and the substrate 9 in the first embodiment. That is, in the air knife 51b, when gas is ejected from the nozzle 72, a vortex K4 is formed in the airflow forming space V, thereby forming an outgoing gas flow K5 drawn from the airflow forming space V to the upstream side of the transport (see reference). Figure 7 Therefore, the ions supplied to the airflow forming space V are filled by the vortex K4. Additionally, a portion of the ions transported by the vortex K4 are drawn out from the airflow forming space V towards the upstream transport side by the outgoing gas flow K5 and transported to the upstream transport side of the nozzle 72. This effectively suppresses the possibility of the substrate 9 becoming charged in the peeling region A1 and the friction region A2.

[0216] <4. Variations>

[0217] The structures involved in the above embodiments can be modified appropriately. In the following description, the same reference numerals are used for elements that are the same as those described in the above embodiments, and their descriptions are omitted.

[0218] In the air knife 51 according to the first embodiment, the shape, size, angle, etc. of each part can be appropriately changed. For example, in the air knife 51, the minimum separation distance (first separation distance) G1 between the upstream protruding surface 701 and the transport surface H is the separation distance between the upstream edge of the second front end surface 712j and the transport surface H, and the minimum separation distance (second separation distance) G2 between the downstream protruding surface 702 and the transport surface H is the separation distance between the downstream edge of the bottom surface 742 and the transport surface H. In this case, it is preferable that the second separation distance G2 is greater than or equal to the first separation distance G1, and it is particularly preferable that it is equal to the first separation distance G1. For example, the size of the second base 74, etc., can be specified in such a way that the second separation distance G2 is larger than the first separation distance G1. Figure 6 Additionally, for example, such as Figure 13 The air knife 51c shown can have its dimensions, etc., specified by making the second separation distance G2 equal to the first separation distance G1.

[0219] In the air knife 51a according to the second embodiment, the shape, size, angle, etc. of each part can be appropriately changed. For example, Figure 14 The air knife 51d shown, when positioned at an angle close to its height, can have its bottom surface 742d arranged in a plane parallel to the transport surface H. Alternatively, the bottom surface 742d can be tilted downstream of the transport surface H. In these cases, the protruding surface 761 forms a downstream extending surface 702a.

[0220] In the air knife 51b according to the third embodiment, the shape, size, angle, etc. of each part can be appropriately changed. For example, the air knife accessory 502 may have a protrusion 76.

[0221] In the air knives 51, 51a, and 51b described in each embodiment, the first substrate 71 may be formed entirely or partially of metal (e.g., stainless steel, aluminum, etc.). An outlet 72 and a flow path 73 are provided in the first substrate 71, in which high-pressure gas (e.g., compressed air) flows. For example, if at least the portion of the first substrate 71 including the outlet 72 and the flow path 73 is formed of metal, the outlet 72 and the flow path 73 are less prone to deformation even under gas pressure.

[0222] In the air knives 51, 51a, and 51b of each embodiment, the second substrate 74 may be formed entirely or partially of an insulator (insulating material) (e.g., an insulating resin). For example, if the portion of the second substrate 74 in which at least the discharge plate 751 is provided is formed of an insulator, it is possible to suppress the occurrence of ions generated in the ion-generating surface being adsorbed by nearby conductive components (e.g., the first substrate 71 formed of metal).

[0223] In the air knives 51, 51a, and 51b according to each embodiment, the first substrate 71 and the second substrate 74 can be formed from different materials. For example, the forming material of the first substrate 71 can be a material with higher rigidity than the forming material of the second substrate 74. In addition, for example, the forming material of the second substrate 74 can be a material with higher insulation than the forming material of the first substrate 71.

[0224] In the air knives 51, 51a, and 51b described in each embodiment, the first substrate 71 and the second substrate 74 can be integrally formed. For example, during the component manufacturing stage, the first substrate 71 and the second substrate 74 can be formed as a single component through integral molding or the like.

[0225] In the air knives 51, 51a, and 51b described in each embodiment, the method of setting the discharge plate 751 on the bottom surface 742 can be arbitrary. For example, the discharge plate 751 can be fixed to the bottom surface 742 by adhesive, double-sided tape, bolts, or a snap-fit ​​structure (if a receiving recess 7421 is provided on the bottom surface 742, it is fixed to the receiving recess 7421). Specifically, for example, a snap-fit ​​member extending inward to the inside of the opening can be provided on the periphery of the opening of the receiving recess 7421, either wholly or partially. With the snap-fit ​​member elastically deformed and retracted to the outside of the opening of the receiving recess 7421, the discharge plate 751 is pushed into the receiving recess 7421 from the opening. Then, by elastically resetting the snap-fit ​​member, it returns to the state of extending inward to the inside of the opening, thereby snapping the discharge plate 751 into the receiving recess 7421. In this case, the snap-fit ​​member can be formed of an insulator (an insulating material, such as an insulating resin). That is, the engaging component can function as the insulating component 7422 involved in the above-described embodiments.

[0226] In the air knives 51, 51a, and 51b described in each embodiment, a gap (e.g., a gap surrounding the ion-generating surface) can be provided around the discharge plate 751. Specifically, for example, the receiving recess 7421 can be formed to be a larger size than the discharge plate 751 when viewed from above, thereby providing a gap between the receiving recess 7421 and the discharge plate 751 housed therein. When a gap is provided around the discharge plate 751, since an insulator, i.e., air, is present around the discharge plate 751, the occurrence of ions generated in the ion-generating surface being adsorbed by nearby conductive components can be effectively suppressed.

[0227] In the air knives 51, 51a, and 51b described in each embodiment, the location of the discharge plate 751 is not limited to the bottom surface 742. For example, the discharge plate 751 may also be provided on the second front end surface 712j, the protruding surface 761, etc.

[0228] In the air knife 51, 51a, and 51b of each embodiment, when the discharge plate 751 is provided throughout the substantially entire extension direction of the nozzle 72, a single discharge plate 751 with the same dimension in the extension direction as the nozzle 72 can be provided, or a plurality of discharge plates 751 with a dimension in the extension direction shorter than the nozzle 72 can be arranged.

[0229] In the air knives 51, 51a, and 51b described in each embodiment, the ionizer 75 generates ions in a planar shape, but the structure of the ionizer 75 is not limited to this. For example, the ionizer 75 may also generate ions in a conical shape from the tip of a needle-shaped electrode. In this case, the needle-shaped electrode may be provided, for example, on the bottom surface 742, the second front end surface 712j, the protruding surface 761, etc.

[0230] In the air knives 51, 51a, and 51b described in each embodiment, the gas supplied to the flow path 73 can be dry air, fresh air, or the like. Of course, the gas supplied to the flow path 73 is not limited to air; for example, it can also be an inactive gas (e.g., nitrogen). Furthermore, a pump or similar device for pressurizing the gas flowing therein can be inserted into the supply piping 512 connected to the flow path 73.

[0231] In the liquid removal devices 50 and 50a according to various embodiments, air knives 51, 51a, and 51b can be disposed above or below the transport surface H. A pair of air knives 51, 51a, and 51b can be arranged facing each other at the same position in the transport direction D, clamping the transport surface H. Figure 2 Alternatively, air knives 51, 51a, and 51b can be installed on the upper and lower sides of the transport surface H at different positions in the transport direction D.

[0232] The substrate transport apparatus 1 according to each embodiment can transport the substrate 9 in an inclined posture (a posture in which the main surface is inclined in the width direction). That is, the air knife 51 can be provided on the transport path T on which the substrate 9 is transported in an inclined posture. Of course, in this case, the air knife 51 is also preferably provided in an inclined posture (a posture in which it is inclined in the length direction). In addition, when the substrate 9 is transported in an inclined posture, for example, a mechanism for lifting and lowering one of the pair of support plates 113, 113 on which the roller 111 is mounted can be provided. In this structure, when the lifting mechanism lifts and lowers one of the support plates 113, the pair of support plates 113, 113 are arranged at different heights, and each roller unit 11 mounted between the pair of support plates 113, 113 forms an inclined posture. Thus, the substrate 9 is transported in an inclined posture.

[0233] The liquid removal devices 50 and 50a according to each embodiment can be provided in various substrate processing apparatuses other than the developing apparatus 105. For example, the liquid removal devices 50 and 50a can be provided in the cleaning apparatus 101. As an example, when the cleaning apparatus 101 includes a substrate transport device 1 that transports a substrate 9 in a roller manner, a processing section group (e.g., a cleaning processing section that supplies cleaning liquid to the substrate 9 to clean the substrate 9 and a liquid removal section that removes cleaning liquid adhering to the substrate 9) provided along the transport path T formed by the substrate transport device 1, a speed switching section (substrate introduction section) provided on the upstream side of the transport direction D of the processing section group, and a speed switching section (substrate exit section) provided on the downstream side of the transport direction D of the processing section group, air knives 51, 51a, and 51b can be provided in the liquid removal section. That is, liquid removal devices 50 and 50a, which include the substrate transport device 1 and air knives 51, 51a, and 51b, can be formed in the liquid removal section of the cleaning apparatus 101.

[0234] The substrate 9 that is the object of processing in the substrate processing system 100 equipped with the liquid removal devices 50 and 50a according to each embodiment (that is, the substrate 9 that is the object of processing in the liquid removal devices 50 and 50a, the substrate 9 that is the object of the gas blown by the air knives 51, 51a and 51b) can be various glass substrates (e.g., glass substrates for liquid crystal displays (LCDs), glass substrates for plasma displays (PDPs), glass substrates for organic light-emitting diodes (OLEDs), glass substrates for field emission displays (FEDs), glass substrates for solar panels, glass substrates for optical discs, glass substrates for magnetic disks, glass substrates for photomasks, etc.), various ceramic substrates (e.g., ceramic substrates for magnetic / optical discs), semiconductor substrates (semiconductor wafers), electronic device substrates, printing plates, etc.

[0235] The liquid removal devices 50 and 50a described in each embodiment can be mounted on various devices other than the substrate processing device. In addition, the object to which the gas is blown by the air knives 51, 51a, and 51b provided by the liquid removal devices 50 and 50a is not necessarily the substrate 9.

[0236] As described above, the liquid removal device, air knife, air knife accessories, and liquid removal method have been described in detail. However, the above description is illustrative in all respects, and the liquid removal device, air knife, air knife accessories, and liquid removal method are not limited thereto. It should be understood that many variations not shown can be contemplated without departing from the scope of this disclosure. The structures described in the above embodiments and variations can be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A liquid removal device, wherein, The liquid removal device includes a conveying device for conveying the object along the conveying direction and an air knife for blowing gas onto the object. The air knife has the following features: The nozzle ejects the gas in a direction that tilts towards the upstream side of the transport surface as it approaches the transport surface, the transport surface being the surface through which the object being transported by the transport device passes; The opposing surfaces, downstream of the conveying surface at the nozzle, are configured to form an airflow forming space with the conveying surface; and An ionizer supplies ions into the space formed by the gas flow. The opposing surfaces have: An upstream extending surface extends towards the transport surface in a manner that narrows the upstream end of the transport airflow forming space; and The downstream protruding surface extends towards the transport surface in a manner that narrows the downstream end of the transport space of the airflow forming space.

2. The liquid removal device according to claim 1, wherein, The upstream protruding surface has an inclined surface that slopes towards the upstream side of the transport surface as it approaches the transport surface.

3. The liquid removal device according to claim 1 or 2, wherein, The downstream protruding surface has an inclined surface that slopes towards the downstream side of the transport surface as it approaches the transport surface.

4. The liquid removal device according to claim 1 or 2, wherein, The downstream protruding surface has a protruding surface that protrudes from the downstream side of the transport surface connected to the upstream protruding surface in a direction close to the transport surface.

5. The liquid removal device according to claim 1 or 2, wherein, The minimum separation distance between the upstream protruding surface and the transport surface is equal to the minimum separation distance between the downstream protruding surface and the transport surface.

6. The liquid removal device according to claim 1 or 2, wherein, The ionizer is disposed on the downstream protruding surface.

7. An air knife that blows gas onto an object being transported along a transport direction, wherein, The air knife has the following features: The nozzle ejects the gas in a direction that tilts towards the upstream side of the transport surface as it approaches the transport surface, the transport surface being the surface through which the object being transported passes; The opposing surfaces, downstream of the conveying surface at the nozzle, are configured to form an airflow forming space with the conveying surface; and An ionizer supplies ions into the space formed by the gas flow. The opposing surfaces have: The upstream extending surface extends towards the transport surface in a manner that narrows the upstream end of the transport airflow forming space. The downstream protruding surface extends towards the transport surface in a manner that narrows the downstream end of the transport space of the airflow forming space.

8. An accessory for an air knife, mounted on the body of an air knife that blows gas ejected from a nozzle onto an object being transported along a transport direction, wherein, The air knife accessory includes: The downstream protruding surface, in its installed state on the air knife body, is configured to form an airflow forming space between itself and the transport surface on the downstream side of the nozzle, and extends towards the transport surface in a manner that narrows the end of the downstream side of the airflow forming space, the transport surface being the surface through which the transported object passes; and An ionizer, in the aforementioned installation state, supplies ions to the gas flow forming space.

9. A liquid removal device, wherein, The liquid removal device includes a conveying device for conveying the object along the conveying direction and an air knife for blowing gas onto the object. The air knife has the following features: The nozzle ejects the gas in a direction that tilts towards the upstream side of the transport surface as it approaches the transport surface, the transport surface being the surface through which the object being transported by the transport device passes; The opposing surfaces, on the downstream side of the conveying surface at the nozzle, are configured to form an airflow forming space with the conveying surface; as well as An ionizer supplies ions into the space formed by the gas flow. When the gas is ejected from the nozzle, a vortex is formed and an exhaust gas flow is generated. The vortex in the airflow forming space flows downstream of the transport surface on the side closer to the transport surface and upstream of the transport surface on the side farther from the transport surface. The outgoing gas stream is drawn out from the airflow forming space towards the upstream side of the transport.

10. A method for removing liquid, wherein, It includes the following processes: The material handling process involves moving objects along the transport direction. In the ejection process, gas is ejected from the nozzle of the air knife in a direction that tilts towards the upstream side of the transport surface as it approaches the transport surface; the transport surface is the surface through which the object being transported passes; and In the ion supply process, ions are supplied to the airflow forming space located between the opposing surface of the air knife and the transport surface on the downstream side of the nozzle. When the gas is ejected from the nozzle, a vortex is formed and an exhaust gas flow is generated. The vortex in the airflow forming space flows downstream of the transport surface on the side closer to the transport surface and upstream of the transport surface on the side farther from the transport surface. The exhaust gas stream is drawn out from the airflow forming space towards the upstream side of the transport.

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