An automated semiconductor high temperature diffusion furnace

Abstract

The application relates to the technical field of semiconductor wafer manufacturing, in particular to an automatic semiconductor high-temperature diffusion furnace, which comprises a furnace body, a gas-permeable skylight is arranged at the upper end of the furnace body, a reaction chamber is arranged in the inner cavity of the upper end of the furnace body, a rotary furnace cover is rotationally arranged on the outer wall of one end of the furnace body, a handle is fixedly connected to the outer wall of the rotary furnace cover, the inner cavity of the rotary furnace cover is communicated with the inner cavity of the reaction chamber, and a gas guide pipe is communicated with the inner cavity of the reaction chamber. The automatic semiconductor high-temperature diffusion furnace provided by the application realizes self-driven isolation dust removal, centrifugal separation of particles, passive rotation speed monitoring and automatic standby switching alarm of the furnace mouth gas through a pure mechanical flow guide and filter replacement mechanism, effectively solves the problem that a traditional scheme depends on external energy and electronic components and has poor reliability under high temperature, and improves the cleanliness and equipment service life in the wafer manufacturing process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer manufacturing technology, specifically to an automated high-temperature diffusion furnace for semiconductors. Background Technology

[0002] In semiconductor wafer manufacturing, high-temperature diffusion furnaces are core process equipment used to dope, oxidize, or anneal wafers under precisely controlled temperature and atmosphere. During the process, high-purity process gases are continuously introduced into the furnace to maintain reaction conditions and a slightly positive pressure environment, preventing external air and particulate contaminants from entering the furnace chamber. However, there is always a tiny gap at the sealing interface between the furnace door and the furnace tube port. Under the effects of thermal expansion and contraction and pressure fluctuations, the gas carrying doping byproducts may leak out disorderly from this gap, condensing upon contact with the sealing surface to form particle deposits. This not only contaminates the clean environment but also leads to the deterioration of the sealing surface and the shedding of particles into the furnace, seriously affecting wafer yield. To address this problem, some equipment introduces an external gas source at the furnace door to form a rotating gas curtain for isolation, but this wastes gas.

[0003] In the high-temperature and high-radiation furnace environment, electronic components have a high failure rate and short lifespan. More importantly, existing technologies lack a mechanical structure that integrates gas curtain formation, particle centrifugal separation, and alarm functions, making it difficult to achieve autonomous sensing of the furnace door status without the need for external energy and electrical control. Summary of the Invention

[0004] To address the above problems, the present invention provides an automated high-temperature semiconductor diffusion furnace.

[0005] This invention adopts the following technical solution: an automated high-temperature semiconductor diffusion furnace, comprising a furnace body, a ventilated skylight at the upper end of the furnace body, a reaction chamber within the upper cavity of the furnace body, a rotating furnace cover rotatably mounted on the outer wall of one end of the furnace body, a handle fixedly connected to the outer wall of the rotating furnace cover, the inner cavity of the rotating furnace cover communicating with the inner cavity of the reaction chamber, and a gas guide pipe communicating with the inner cavity of the reaction chamber, and further comprising: A flow guiding mechanism is provided to remove dust from the discharged gas. The flow guiding mechanism is located inside the rotary furnace cover and includes a turbofan. The system also includes a filter replacement mechanism that can automatically identify the turbine fan status and automatically filter large particles. The filter replacement mechanism is located inside the rotary furnace cover.

[0006] As a further description of the above technical solution: the flow guiding mechanism includes turbofan one and turbofan two. Turbofan one is rotatably disposed in the inner cavity of the rotary furnace cover. A magnetic suction ring is rotatably disposed on the outer wall of the rotary furnace cover. A connecting groove is opened in the inner cavity of the rotary furnace cover, and the connecting groove connects the cavities where turbofan one and turbofan two are located. A vent is opened on the magnetic suction ring, and the vent is connected to the cavity where turbofan two is located. An air jet is connected to the outer wall of the magnetic suction ring, and the air jet connects the vent to the outer side of the magnetic suction ring.

[0007] As a further description of the above technical solution: the filter replacement mechanism includes a rotating shaft one and a rotating shaft two. The rotating shaft one is fixedly connected to the center of the turbofan one, and the rotating shaft two is fixedly connected to the center of the turbofan two. The rotating shaft two is horizontally inserted into the rotating furnace cover, and one end of the rotating shaft two near the rotating shaft one is rotatably disposed within the rotating shaft one. A sliding plate is movably disposed within the inner cavity of the rotating shaft two, and an insert rod is movably inserted within the rotating shaft two. A spring one is fixedly connected between the insert rod and the sliding plate. One end of the insert rod is fixedly connected to the rotating furnace cover. A bracket is horizontally inserted into the inner wall of the turbofan one, and a spring two is fixedly connected between the bracket and the rotating furnace cover. A placement cavity is provided inside the rotary furnace cover. A slip ring is movably installed in the placement cavity. The slip ring is fixedly connected to the insert bracket. A groove is opened in the inner wall of the slip ring. A slide bracket is inserted into the outer wall of the rotating shaft. A spring is fixedly connected between the slide bracket and the rotating shaft. One end of the slide bracket is movably inserted into the rotary furnace cover. A trigger rod is abutted against the rotating shaft. The trigger rod is horizontally slidable inside the rotary furnace cover. A connecting ring is fixedly connected to the magnetic suction ring. A bearing ring is fixedly connected to the connecting ring. The bearing ring is rotatably installed inside the rotary furnace cover. The lower end of the inner cavity of the rotary furnace cover is connected to the inner cavity of the bearing ring. A movable plug is inserted into the end of the rotary furnace cover near the bearing ring.

[0008] As a further description of the above technical solution: both the first turbofan and the second turbofan are magnetic, and the first turbofan is more magnetic than the second turbofan.

[0009] As a further description of the above technical solution: the upper outer walls of both turbofan one and turbofan two can generate an attractive force on the magnetic ring.

[0010] As a further description of the above technical solution: a non-Newtonian fluid is placed inside the placement cavity.

[0011] As a further description of the above technical solution: the slip ring and the insert are both horizontally inserted into the rotary furnace cover.

[0012] As a further description of the above technical solution: when the trigger rod is inserted into the connecting groove, the flow cross-section of the connecting groove first decreases and then increases.

[0013] This invention provides an automated high-temperature semiconductor diffusion furnace, which, compared with the prior art, has the following improvements and advantages: Firstly, it features self-driven air curtain isolation and dust removal. The gas flow drives the first and second turbofans to rotate, and the magnetic ring drives the jet nozzle to form a rotating air curtain. This achieves gas isolation at the furnace opening without the need for external energy, preventing external pollutants from entering. At the same time, centrifugal force is used to throw large particles in the gas into the carrying ring for centralized collection, effectively purifying leaked gas. Secondly, the mechanical automatic identification and switching alarm adopts a non-Newtonian fluid and carriage structure. When the speed of the first turbofan decreases due to long-term use, the carriage automatically pops out, triggering the second turbofan to take over. At the same time, the insertion rod drives the trigger rod to change the cross section of the connecting groove to generate a whistle. It can realize status identification, automatic replacement and sound alarm without electronic components, and is particularly suitable for furnace mouth environment with high temperature and strong radiation. Thirdly, the highly reliable integrated structure integrates gas curtain formation, particle separation, speed detection, backup switching and alarm functions into a purely mechanical structure, avoiding the risk of electronic component failure at high temperatures and significantly improving the stability and maintenance convenience of the diffusion furnace during long-term continuous operation. In summary, the automated high-temperature semiconductor diffusion furnace provided by this invention achieves self-driven isolation and dust removal of furnace gas, centrifugal separation of particles, passive speed monitoring, and automatic backup switching alarm through a purely mechanical flow guiding and filter replacement mechanism. This effectively solves the problems of traditional solutions relying on external energy and poor reliability of electronic components at high temperatures, thereby improving the cleanliness of the wafer manufacturing process and the lifespan of the equipment. Attached Figure Description

[0014] The present invention will be further explained below with reference to the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the structure of the rotating furnace lid provided in an embodiment of the present invention; Figure 3 This is a perspective sectional view of the rotating furnace lid provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the filter replacement mechanism provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of rotating shaft one and rotating shaft two provided in an embodiment of the present invention; Figure 6 for Figure 4 Enlarged view of point A in the middle; Figure 7 for Figure 4 Enlarged view of point B in the middle; Figure 8 for Figure 5 A magnified view of point C in the middle.

[0015] In the diagram: 1. Furnace body; 2. Rotating furnace cover; 3. Handle; 4. Ventilation skylight; 5. Reaction chamber; 6. Flow guiding mechanism; 61. Turbine fan one; 62. Turbine fan two; 63. Magnetic suction ring; 64. Jet nozzle; 65. Connecting groove; 66. Vent; 7. Filter replacement mechanism; 71. Rotating shaft one; 72. Rotating shaft two; 73. Insert rod; 74. Spring one; 75. Sliding plate; 76. Insert bracket; 77. Spring two; 78. Placement cavity; 79. Slip ring; 710. Slide frame; 711. Spring three; 712. Connecting ring; 713. Bearing ring; 714. Trigger rod; 715. Movable plug. Detailed Implementation

[0016] To make the technical means, creative features, objectives, and effects of this invention readily understandable, the invention is further described below with reference to specific illustrations. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0017] Please see Figure 1 - Figure 8 This invention provides a technical solution: an automated high-temperature semiconductor diffusion furnace, comprising a furnace body 1, a ventilated skylight 4 at the upper end of the furnace body 1, a reaction chamber 5 within the upper cavity of the furnace body 1, a rotating furnace cover 2 rotatably mounted on the outer wall of one end of the furnace body 1, a handle 3 fixedly connected to the outer wall of the rotating furnace cover 2, the inner cavity of the rotating furnace cover 2 communicating with the inner cavity of the reaction chamber 5, and a gas guide pipe communicating with the inner cavity of the reaction chamber 5, and further comprising: The flow guiding mechanism 6 is capable of removing dust from the discharged gas. The flow guiding mechanism 6 is installed inside the rotary furnace cover 2 and includes a turbo fan 61. And the filter replacement mechanism 7, which can automatically identify the status of the turbofan-61 and automatically filter large particles, is located inside the rotary furnace cover 2.

[0018] Specifically, the self-driven air curtain isolation and dust removal system uses gas flow to drive the first turbofan 61 and the second turbofan 62 to rotate, and uses the magnetic ring 63 to drive the jet nozzle 64 to form a rotating air curtain. This system can achieve gas isolation at the furnace opening without external energy, preventing external pollutants from entering. At the same time, centrifugal force is used to throw large particles in the gas into the bearing ring 713 for centralized collection, effectively purifying leaked gas.

[0019] The mechanical automatic identification and switching alarm adopts a non-Newtonian fluid and carriage 710 structure. When the speed of the turbofan 1 61 decreases due to long-term use, the carriage 710 automatically pops out, triggering the turbofan 2 62 to take over the work. At the same time, the insertion rod 73 drives the trigger rod 714 to change the cross section of the connecting groove 65 to generate a whistle. It can realize status identification, automatic replacement and sound alarm without electronic components, and is particularly suitable for furnace mouth environment with high temperature and strong radiation.

[0020] The highly reliable integrated structure integrates gas curtain formation, particle separation, speed detection, backup switching, and alarm functions into a purely mechanical structure, avoiding the risk of electronic component failure at high temperatures and significantly improving the stability and maintenance convenience of the diffusion furnace during long-term continuous operation.

[0021] In another embodiment of the present invention, the flow guiding mechanism 6 includes a first turbofan 61 and a second turbofan 62. The first turbofan 61 is rotatably disposed in the inner cavity of the rotary furnace cover 2. A magnetic ring 63 is rotatably disposed on the outer wall of the rotary furnace cover 2. A connecting groove 65 is provided in the inner cavity of the rotary furnace cover 2, which connects the cavities where the first turbofan 61 and the second turbofan 62 are located. A vent 66 is provided on the magnetic ring 63, which is connected to the cavity where the second turbofan 62 is located. An air jet 64 is connected to the outer wall of the magnetic ring 63, which connects the vent 66 to the outer side of the magnetic ring 63.

[0022] Both the WS-161 and WS-262 are magnetic, but the magnetic properties of the WS-161 are stronger than those of the WS-262.

[0023] Both the upper outer walls of the WS-1 61 and WS-2 62 can generate an attractive force on the magnetic ring 63.

[0024] Specifically, the self-driven air curtain isolation and dust removal system uses gas flow to drive the first turbofan 61 and the second turbofan 62 to rotate, and uses the magnetic ring 63 to drive the jet nozzle 64 to form a rotating air curtain. This system can achieve gas isolation at the furnace opening without external energy, preventing external pollutants from entering. At the same time, centrifugal force is used to throw large particles in the gas into the bearing ring 713 for centralized collection, effectively purifying leaked gas.

[0025] In another embodiment of the present invention, the filter replacement mechanism 7 includes a first rotating shaft 71 and a second rotating shaft 72. The first rotating shaft 71 is fixedly connected to the center of the first turbofan 61, and the second rotating shaft 72 is fixedly connected to the center of the second turbofan 62. The second rotating shaft 72 is horizontally inserted into the rotary furnace cover 2, and one end of the second rotating shaft 72 near the first rotating shaft 71 is rotatably disposed within the first rotating shaft 71. A sliding plate 75 is movably disposed within the inner cavity of the second rotating shaft 72, and an insert rod 73 is movably inserted into the second rotating shaft 72. A spring 74 is fixedly connected between the insert rod 73 and the sliding plate 75. One end of the insert rod 73 is fixedly connected into the rotary furnace cover 2. A bracket 76 is horizontally inserted into the inner wall of the first turbofan 61, and a spring 77 is fixedly connected between the bracket 76 and the rotary furnace cover 2. The first rotating shaft 71 and the second rotating shaft 72 are located within the rotary furnace. The cover 2 has a placement cavity 78, and a sliding ring 79 is movably installed in the placement cavity 78. The sliding ring 79 is fixedly connected to the insert 76. The inner wall of the sliding ring 79 has a groove. A slide 710 is inserted into the outer wall of the rotating shaft 1 71. A spring 3 711 is fixedly connected between the slide 710 and the rotating shaft 1 71. One end of the slide 710 is movably inserted into the rotary furnace cover 2. The rotating shaft 2 72 abuts against a trigger rod 714. The trigger rod 714 is horizontally slidably installed in the rotary furnace cover 2. A magnetic ring 63 is fixedly connected to a connecting ring 712. A bearing ring 713 is fixedly connected to the connecting ring 712. The bearing ring 713 is rotatably installed in the rotary furnace cover 2. The lower end of the inner cavity of the rotary furnace cover 2 is connected to the inner cavity of the bearing ring 713. A movable plug 715 is inserted into the end of the rotary furnace cover 2 near the bearing ring 713.

[0026] A non-Newtonian fluid is placed inside the placement cavity 78.

[0027] Both the slip ring 79 and the insert bracket 76 are horizontally inserted into the rotary furnace cover 2.

[0028] When the trigger rod 714 is inserted into the connecting groove 65, the flow cross-section of the connecting groove 65 first decreases and then increases.

[0029] Specifically, the mechanical automatic identification and switching alarm adopts a non-Newtonian fluid and slide 710 structure. When the speed of turbofan 1 61 decreases due to long-term use, slide 710 automatically pops out, triggering turbofan 2 62 to take over the work. At the same time, the insertion rod 73 drives the trigger rod 714 to change the cross section of the connecting groove 65 to generate a whistle. It can realize status identification, automatic replacement and sound alarm without electronic components, and is particularly suitable for furnace mouth environment with high temperature and strong radiation.

[0030] The highly reliable integrated structure integrates gas curtain formation, particle separation, speed detection, backup switching, and alarm functions into a purely mechanical structure, avoiding the risk of electronic component failure at high temperatures and significantly improving the stability and maintenance convenience of the diffusion furnace during long-term continuous operation.

[0031] Working principle: When using this device, the wafer is first placed in the reaction chamber 5 for processing, and then the rotary furnace cover 2 is closed. Since the diffusion process relies on the decomposition of the gaseous dopant source at high temperature, the dopant atoms need to be continuously transported to the wafer surface, so that the gaseous material is continuously transported to the inner cavity of the reaction chamber 5. After the gaseous material participates in the processing, it slowly enters the inner cavity of the rotary furnace cover 2. Then the gas will flow through the inner cavity of the first turbo fan 61, the connecting groove 65, the inner cavity of the second turbo fan 62, the vent 66, and the jet nozzle 64. Finally, the gas is ejected outward from the jet nozzle 64. When the gas flows into the inner cavity of the rotary furnace cover 2, the rotating shaft 71 is pushed by the airflow and rotates. When the rotating shaft 71 rotates, it can drive the magnetic ring 63 to rotate together through the suction force, so that the gas ejected from the jet nozzle 64 can be ejected and rotated at the same time, forming a ring of gas curtain, which can relieve pressure and isolate external impurities of the processed gas. When the gas drives the turbofan 61 to rotate, the turbofan 61 will drive the magnetic ring 63, the connecting ring 712 and the bearing ring 713 to rotate together. Due to the eddy current, the gas will pass through the connecting groove 65 and rotate. The particles in the gas will fall into the bearing ring 713 due to centrifugal force and gravity. At the same time, when the bearing ring 713 rotates, it will use centrifugal force to fling the particles that have fallen into the bearing ring 713 toward the side away from the connecting groove 65, so that the large particles filtered out are more concentrated, which is convenient for subsequent collection and processing. After prolonged use, the turbofan engine 61 may experience excessively slow rotation speed. When gas is introduced into the rotary furnace cover 2, the insert 76 and slip ring 79 slide towards the inside of the rotary furnace cover 2. The slide 710 is located in the groove of the slip ring 79. The slide 710 rotates rapidly with the rotating shaft 71. Because the placement cavity 78 contains a non-Newtonian fluid, the rapidly rotating slide 710 cannot eject outward from the rotating shaft 71. This is because when the rapidly rotating slide 710 extends into the non-Newtonian fluid, it makes the non-Newtonian fluid viscous, preventing the slide 710 from... When the rotation speed of the first rotating shaft 71 is too slow, the slide 710 can pop out of the first rotating shaft 71, so that the other side of the slide 710 is separated from the rotating furnace cover 2. Under the action of the first spring 74, the second rotating shaft 72 moves toward the first rotating shaft 71. Then the second rotating shaft 72 is separated from the rotating furnace cover 2. At this time, the second rotating shaft 72 can rotate, so that the gas drives the second turbofan 62 to rotate. When the second turbofan 62 rotates, it can attract the magnetic ring 63, so that the magnetic ring 63 rotates accordingly. The turbofan 61 can be replaced in time according to the rotation speed of the gas drive. During the replacement process, the trigger rod 714 will be inserted into the connecting groove 65. The cross-sectional area of ​​the gas flow in the connecting groove 65 will first decrease and then increase, and the gas flow velocity will increase instantaneously, causing the gas movement to generate a whistle. This can promptly remind the staff of the status of the turbofan 1 61 and turbofan 2 62 through the gas, facilitating timely maintenance.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automated high-temperature semiconductor diffusion furnace, comprising a furnace body (1), wherein a ventilated skylight (4) is provided at the upper end of the furnace body (1), a reaction chamber (5) is provided in the inner cavity at the upper end of the furnace body (1), a rotating furnace cover (2) is rotatably provided on the outer wall of one end of the furnace body (1), a handle (3) is fixedly connected to the outer wall of the rotating furnace cover (2), the inner cavity of the rotating furnace cover (2) is connected to the inner cavity of the reaction chamber (5), and a gas guide pipe is connected to the inner cavity of the reaction chamber (5), characterized in that, further include: The flow guiding mechanism (6) is capable of removing dust from the discharged gas. The flow guiding mechanism (6) is located inside the rotary furnace cover (2). The flow guiding mechanism (6) includes a turbo fan (61). The filter replacement mechanism (7) is capable of automatically identifying the state of the turbine fan (61) and automatically filtering large particles. The filter replacement mechanism (7) is located inside the rotary furnace cover (2).

2. The automated high-temperature semiconductor diffusion furnace according to claim 1, characterized in that: The flow guiding mechanism (6) includes a turbo fan one (61) and a turbo fan two (62). The turbo fan one (61) is rotatably disposed in the inner cavity of the rotary furnace cover (2). A magnetic ring (63) is rotatably disposed on the outer wall of the rotary furnace cover (2). A connecting groove (65) is provided in the inner cavity of the rotary furnace cover (2). The connecting groove (65) connects the cavities where the turbo fan one (61) and the turbo fan two (62) are located. A vent (66) is provided on the magnetic ring (63). The vent (66) is connected to the cavity where the turbo fan two (62) is located. An air jet (64) is connected to the outer wall of the magnetic ring (63). The air jet (64) connects the vent (66) to the outer side of the magnetic ring (63).

3. The automated high-temperature semiconductor diffusion furnace according to claim 2, characterized in that: The filter replacement mechanism (7) includes a first rotating shaft (71) and a second rotating shaft (72). The first rotating shaft (71) is fixed to the center of the first turbofan (61), and the second rotating shaft (72) is fixed to the center of the second turbofan (62). The second rotating shaft (72) is horizontally inserted into the rotary furnace cover (2), and one end of the second rotating shaft (72) near the first rotating shaft (71) is rotatably disposed within the first rotating shaft (71). A sliding plate (75) is movably disposed within the inner cavity of the second rotating shaft (72). A rod (73) is movably inserted into the second rotating shaft (72). A spring (74) is fixed between the rod (73) and the slide plate (75). One end of the rod (73) is fixed inside the rotary furnace cover (2). A bracket (76) is horizontally inserted into the inner wall of the turbine fan (61). A spring (77) is fixed between the bracket (76) and the rotary furnace cover (2). A space for placing the rotating shaft (71) and the second rotating shaft (72) is opened inside the rotary furnace cover (2). The cavity (78) contains a sliding ring (79) that is fixedly connected to the insert (76). The inner wall of the sliding ring (79) has a slot. A slide (710) is inserted into the outer wall of the first rotating shaft (71). A spring (711) is fixedly connected between the slide (710) and the first rotating shaft (71). One end of the slide (710) is movably inserted into the rotary furnace cover (2). The second rotating shaft (72) abuts against a trigger rod (714). The trigger rod (714) is horizontally slidably disposed inside the rotating furnace cover (2). The magnetic suction ring (63) is fixedly connected to the connecting ring (712). The connecting ring (712) is fixedly connected to the bearing ring (713). The bearing ring (713) is rotatably disposed inside the rotating furnace cover (2). The lower end of the inner cavity of the rotating furnace cover (2) is connected to the inner cavity of the bearing ring (713). A movable plug (715) is inserted into one end of the rotating furnace cover (2) near the bearing ring (713).

4. The automated high-temperature semiconductor diffusion furnace according to claim 2, characterized in that: Both the first turbofan (61) and the second turbofan (62) are magnetic, and the first turbofan (61) is more magnetic than the second turbofan (62).

5. An automated high-temperature semiconductor diffusion furnace according to claim 2, characterized in that: The upper outer walls of both turbofan one (61) and turbofan two (62) can generate attraction force on the magnetic ring (63).

6. The automated high-temperature semiconductor diffusion furnace according to claim 3, characterized in that: The placement cavity (78) contains a non-Newtonian fluid.

7. The automated high-temperature semiconductor diffusion furnace according to claim 3, characterized in that: The slip ring (79) and the insert (76) are both horizontally inserted into the rotary furnace cover (2).

8. An automated high-temperature semiconductor diffusion furnace according to claim 3, characterized in that: When the trigger rod (714) is inserted into the connecting groove (65), the flow cross-section of the connecting groove (65) first decreases and then increases.

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