An integrated dynamic thermal load and emulated fluid liquid cold plate test device

Abstract

The application provides a liquid cooling plate test device integrating dynamic heat load and simulation fluid, and the application is characterized in that a liquid cooling plate chip heat source simulation test fixture is arranged, the liquid cooling plate chip heat source simulation test fixture can simulate the heat generation working condition of a server chip, and then the complex power consumption curve of the server chip is reproduced, the technical defect that the traditional constant heat load test is disconnected with the actual working condition is overcome, the test data is closer to the real running scene, and the accuracy of the liquid cooling plate heat performance evaluation is effectively improved; while the simulation heat load is applied, the flow, pressure and temperature and other parameters are detected through the first detection part and the second detection part, then the heat performance test equipment and the flow resistance test can be synchronously performed, the causal relationship between the flow channel design defect and the heat performance can be intuitively revealed, and the optimization design of the liquid cooling plate is facilitated.

Description

Technical Field

[0001] This invention relates to the field of liquid-cooled plate testing technology, and more specifically, to a liquid-cooled plate testing device that integrates dynamic thermal load and simulated fluid. Background Technology

[0002] With the rapid development of artificial intelligence, big data, and cloud computing technologies, the computing power demand of data centers and high-performance computing servers is growing exponentially. As the core of computing power, chips such as GPUs and CPUs are experiencing a continuous increase in power consumption and thermal design power (TDP). Traditional air cooling methods are difficult to effectively control chip junction temperature due to the low specific heat capacity and low thermal conductivity of air, which can easily lead to thermal throttling and a decrease in computing power. Against this backdrop, liquid cooling technology has become an inevitable choice to solve the heat dissipation problem of high-power chips due to the much higher thermal conductivity and heat capacity of liquids than air. Among them, cold plate liquid cooling has become the mainstream heat dissipation solution for current AI data centers due to its relatively low retrofit cost and compatibility with existing data center infrastructure. As the core component in a liquid cooling system that comes into direct contact with the chip being cooled, the heat dissipation efficiency (thermal resistance) and fluid flowability (flow resistance) of the liquid cooling plate directly determine the performance baseline and reliability of the entire cooling system. Even minor design flaws or manufacturing deviations can lead to uneven heat dissipation, blockage of flow channels, leakage, or even system failure. Therefore, it is crucial to conduct rigorous and comprehensive performance testing on the liquid cooling plate.

[0003] However, traditional testing methods have the following obvious limitations: existing liquid cooling plate testing equipment mostly adopts constant heat load testing methods, which cannot simulate the dynamic power spectrum of server chips, resulting in a large deviation between test data and actual operating performance, making it difficult to accurately evaluate the heat dissipation capacity of liquid cooling plates under actual working conditions. Currently, thermal load testing and fluid simulation analysis are usually conducted independently. Thermal performance testing equipment and flow resistance testing equipment belong to different systems, lacking data linkage and mutual verification mechanisms. This makes it difficult to intuitively reveal the causal relationship between flow channel design defects and thermal performance, which is not conducive to the optimized design of liquid cooling plates.

[0004] Therefore, we have made improvements to this by proposing a liquid-cooled plate testing device that integrates dynamic thermal load and simulated fluid. Summary of the Invention

[0005] This invention provides a liquid-cooled plate testing device that integrates dynamic thermal load and simulated fluid, including a cabinet and a liquid-cooled plate dual-channel fluid testing pipeline assembly installed in the cabinet. The top of the cabinet is provided with a liquid-cooled plate chip heat source simulation test fixture, which is used to place the liquid-cooled plate to be tested and is also used to simulate the heat dissipation conditions of server chips. The liquid-cooled plate dual-channel fluid test pipeline assembly includes a water supply assembly and a water return assembly. The water supply assembly is used to connect to the water inlet of the liquid-cooled plate during testing to supply coolant to the liquid-cooled plate. The water return assembly is used to connect to the water outlet of the liquid-cooled plate during testing to discharge the liquid after heat exchange by the liquid-cooled plate. The water supply assembly is equipped with a first detection unit, and the return water assembly is equipped with a second detection unit. The first detection unit is used to detect the parameters of the cooling liquid before it enters the liquid cooling plate, and the second detection unit is used to detect the parameters of the cooling liquid after it flows out of the liquid cooling plate. It also includes a data processing module, which is electrically connected to the first detection unit, the second detection unit, and the liquid-cooled plate chip heat source simulation test fixture, and is used to calculate the thermal resistance and flow resistance of the liquid-cooled plate based on the detection data of the first detection unit and the second detection unit.

[0006] As a preferred technical solution of this application, the bottom of the cabinet is provided with a water collection tank corresponding to the position of the liquid cooling plate dual-channel fluid test pipeline assembly, and a drain connector is provided at the lowest point of the water collection tank for connecting the drain pipe.

[0007] As a preferred technical solution of this application, the liquid-cooled plate chip heat source simulation test fixture includes a support base that is bolted to the top of the cabinet. A support member is provided on the top of the support base, and a positioning member is provided on the top of the support member. The positioning member is used for positioning the liquid-cooled plate after it is placed. Several heating modules are provided between the support base and the support member. The several heating modules heat the corresponding areas of the CPU and GPU of the liquid-cooled plate respectively to simulate the heat dissipation conditions of the CPU and GPU during use.

[0008] As a preferred technical solution of this application, the support member includes a plurality of support plates that are bolted to the top of the support base, and a top plate is bolted between the tops of the plurality of support plates; The positioning component includes several positioning seats that are bolted to the top of the top plate. The positioning seats are provided with positioning grooves. The several positioning seats cooperate with the positioning grooves to form a positioning area, which is used for positioning after the liquid cooling plate is placed.

[0009] As a preferred technical solution of this application, the heating module includes a heating block that is bolted to the top of the support base. The heating block is provided with a plurality of grooves, and heating rods are installed in the grooves. The top of the top plate is provided with a clearance opening corresponding to the top of the heating block. A thermally conductive phase change plate is provided on the top of the heating block.

[0010] As a preferred technical solution of this application, the water supply assembly includes a first connecting pipe located inside the cabinet, one end of the first connecting pipe extending to the outside of the cabinet and connected to a water supply pipe via a quick-connect fitting, the water supply pipe being used to connect to the cold water output end of the heat exchange equipment, a plurality of second connecting pipes being connected to the first connecting pipe via quick-connect fittings, the second connecting pipes being connected to a fifth connecting pipe via quick-connect fittings, and the water supply assembly also includes a first Parker hose communicating with the fifth connecting pipe, the first Parker hose being connected to a first connector.

[0011] As a preferred technical solution of this application, the first detection unit includes a first temperature sensor and a second control valve disposed on the second connecting pipe. The end of the second control valve away from the second connecting pipe is connected to a first pressure sensor, and an ultrasonic flow meter is also disposed on the second connecting pipe. The second connecting pipe is also equipped with a first control valve, which is used to control the flow of water between the second connecting pipe and the fifth connecting pipe.

[0012] As a preferred technical solution of this application, the first detection unit further includes a visual flow meter, which is connected between the first Parker hose and the fifth connecting pipe and is installed on the top of the cabinet.

[0013] As a preferred technical solution of this application, the return water assembly includes a fourth connecting pipe located inside the cabinet. One end of the fourth connecting pipe extends to the outside of the cabinet and is connected to a return water pipe via a quick-connect fitting. The return water pipe is used to connect to the water inlet of the heat exchange equipment. The fourth connecting pipe is provided with a third connecting pipe in the same number as the second connecting pipe. The third connecting pipe is connected to a second Parker hose via a quick-connect fitting. The second Parker hose is connected to a second connector.

[0014] As a preferred technical solution of this application, the second detection unit includes a second temperature sensor and a fourth control valve disposed on the third connecting pipe, wherein a second pressure sensor is connected to the end of the fourth control valve away from the third connecting pipe. The third connecting pipe is also equipped with a third control valve, which is used to control the flow of water between the second Parker hose and the third connecting pipe.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention utilizes a liquid-cooled plate chip heat source simulation test fixture. This fixture can simulate the heating conditions of server chips, thereby replicating the complex power consumption curves of server chips. This overcomes the technical shortcomings of traditional constant heat load testing, which is disconnected from actual operating conditions. The resulting test data is closer to real-world operating scenarios, effectively improving the accuracy of liquid-cooled plate thermal performance evaluation. While applying simulated heat load, this invention simultaneously detects parameters such as flow rate, pressure, and temperature through a first and second detection unit. This allows for simultaneous thermal performance testing and flow resistance testing, directly revealing the causal relationship between flow channel design defects and thermal performance, facilitating optimized liquid-cooled plate design. Furthermore, this invention employs a dual-channel design, enabling the testing of two liquid-cooled plates. During the testing of one plate, operators can install the other plate or disassemble the tested plate, improving testing efficiency. Attached Figure Description

[0016] Figure 1 A schematic diagram of the liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid provided in this application; Figure 2 Another structural schematic diagram of the liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid provided in this application; Figure 3 This is a schematic diagram of the internal structure of the cabinet provided in this application; Figure 4 A schematic diagram of the liquid-cooled plate chip heat source simulation test fixture provided in this application; Figure 5 An exploded view of the liquid-cooled plate chip heat source simulation test fixture provided in this application; Figure 6 This is a schematic diagram of the heating module provided in this application; Figure 7 A schematic diagram of the structure of the heating rod provided in this application; Figure 8 A schematic diagram of the structure of the liquid cooling plate provided in this application when placed on the liquid cooling plate chip heat source simulation test fixture; Figure 9 A schematic diagram of the structure of the liquid-cooled plate dual-channel fluid testing pipeline assembly provided in this application; Figure 10 A schematic diagram of the water supply component provided in this application; Figure 11 A partial structural schematic diagram of the water supply component provided in this application; Figure 12 This is a schematic diagram of the structure of the water return assembly provided in this application; Figure 13 A partial structural schematic diagram of the water return assembly provided in this application; Figure 14 This is a schematic diagram of the liquid cooling plate structure; Figure 15 This is a schematic diagram of the bottom structure of the liquid cooling plate; Figure 16 A schematic diagram of the structure of the liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid provided in this application during use.

[0017] The image shows: 1. Cabinet; 101. Cable tray cover; 102. Control box; 103. Touch screen; 104. Electrical control box; 105. Water collection tank; 106. Drain connector; 2. Liquid-cooled plate dual-channel fluid testing pipeline assembly; 201. Water supply pipe; 202. Water return pipe; 203. Visual flow meter; 204. First Parker hose; 205. First connector; 206. First connecting pipe; 207. Second connecting pipe; 208. First control valve; 209. First temperature sensor; 210. Second control valve; 211. First pressure sensor; 212. Ultrasonic flow meter; 213. Second connector; 214. 215. Second Parker hose; 216. Third control valve; 217. Third connecting pipe; 218. Fourth connecting pipe; 219. Second temperature sensor; 220. Second pressure sensor; 221. Fourth control valve; 222. Fifth connecting pipe; 3. Liquid-cooled plate chip heat source simulation test fixture; 301. Support base; 302. Support plate; 303. Top plate; 304. Positioning base; 305. Positioning groove; 306. Sensor; 307. Heating module; 3071. Heating block; 3072. Groove; 3073. Heating rod; 3074. Thermocouple; 3075. Thermally conductive phase change sheet; 308. Support column. Detailed Implementation

[0018] For an example, please refer to... Figures 1-16 A liquid-cooled plate testing device integrating dynamic heat load and simulated fluid includes a cabinet 1 and a liquid-cooled plate dual-channel fluid test pipeline assembly 2 installed in the cabinet 1. A liquid-cooled plate chip heat source simulation test fixture 3 is installed on the top of the cabinet 1. The liquid-cooled plate chip heat source simulation test fixture 3 is used to place the liquid-cooled plate to be tested, and the liquid-cooled plate chip heat source simulation test fixture 3 is also used to simulate the heat dissipation conditions of server chips. The liquid-cooled plate dual-channel fluid test pipeline assembly 2 includes a water supply assembly and a water return assembly. The water supply assembly is used to connect to the water inlet end of the liquid-cooled plate during testing to supply coolant to the liquid-cooled plate. The water return assembly is used to connect to the water outlet end of the liquid-cooled plate during testing to discharge the liquid after heat exchange by the liquid-cooled plate. The water supply assembly is equipped with a first detection unit, and the return water assembly is equipped with a second detection unit. The first detection unit is used to detect the parameters of the cooling liquid before it enters the liquid cooling plate, and the second detection unit is used to detect the parameters of the cooling liquid after it flows out of the liquid cooling plate. It also includes a data processing module, which is electrically connected to the first detection unit, the second detection unit, and the liquid-cooled plate chip heat source simulation test fixture 3, and is used to calculate the thermal resistance and flow resistance of the liquid-cooled plate based on the detection data of the first detection unit and the second detection unit.

[0019] Furthermore, the cabinet 1 is equipped with an electrical control box 104. The data processing module includes a PLC controller installed in the electrical control box 104. The electrical control box 104 is also equipped with electronic components such as power switches, circuit breakers, and relays required for the operation of the PLC controller. It should be noted that the PLC controller is an existing component, and the electronic components and circuit connections required for its operation are all existing technologies, which will not be described in detail in this application. The electrical control box 104 centrally houses the PLC controller and various supporting electronic components, realizing the integrated and enclosed installation of electrical components. A control box 102 is also installed on the top of the cabinet 1. The control box 102 is equipped with a touch screen 103 that is connected to the PLC controller. The touch screen 103 is also equipped with multiple control switches and an emergency stop switch.

[0020] Several cable routing cover 101 are provided on the top of the cabinet 1 and on the electrical control box 104. The cable routing cover 101 is used for cable routing, and the cable routing cover 101 on the top of the cabinet 1 is also used for the extension of the liquid cooling plate pipes into the cabinet 1. It should be noted that the cable routing cover 101 and the cable routing cover 101 of the liquid cooling plate pipes are different cable routing cover 101.

[0021] The bottom of the cabinet 1 is provided with a water collection tank 105 corresponding to the position of the liquid cooling plate dual-channel fluid test pipeline assembly 2. The lowest point of the water collection tank 105 is provided with a drain connector 106, which is used to connect to the drain pipe to drain the water in the water collection tank 105.

[0022] Furthermore, there are two liquid-cooled plate chip heat source simulation test fixtures 3, which are used to provide limit for the two liquid-cooled plates, support synchronous alignment test of the two liquid-cooled plates, and improve test efficiency.

[0023] Furthermore, the liquid-cooled plate chip heat source simulation test fixture 3 includes a support base 301 that is bolted to the top of the cabinet 1. The top of the support base 301 is provided with a support component, and the top of the support component is provided with a positioning component. The positioning component is used for positioning the liquid-cooled plate after it is placed. Several heating modules 307 are provided between the support base 301 and the support component. The heating modules 307 heat the corresponding areas of the CPU and GPU of the liquid-cooled plate respectively to simulate the heat dissipation conditions when the CPU and GPU are in use, restore the real use scenario of the liquid-cooled plate, and improve the accuracy of the local heat dissipation performance test of the liquid-cooled plate.

[0024] The support includes several support plates 302 that are bolted to the top of the support base 301. A top plate 303 is bolted between the tops of the support plates 302. The top plate 303 and the support plates 302 cooperate with each other to support the positioning component.

[0025] The positioning components include several positioning seats 304 bolted to the top of the top plate 303. The positioning seats 304 have positioning grooves 305. The positioning seats 304 and the positioning grooves 305 cooperate to form a positioning area. The positioning area is used for positioning after the liquid cooling plate is placed, ensuring that the heat exchange area at the bottom of the liquid cooling plate is in close contact with the heating module 307, reducing uneven heat exchange and test data distortion caused by placement misalignment. The bolted positioning seats 304 can be finely adjusted according to different specifications of liquid cooling plates, adapting to the testing needs of multiple models of liquid cooling plates, making the equipment more versatile.

[0026] A sensor 306 is also bolted to the top of the top plate 303. The sensor 306 is used to connect to the PLC controller to detect whether the positioning area is placed in the liquid cooling plate.

[0027] The top of the support base 301 is also provided with auxiliary components, which include several support columns 308 that are bolted to the top of the support base 301. The top of the support column 308 passes through the top plate 303, and the top of the support column 308 is used to provide auxiliary support for the liquid cooling plate.

[0028] The heating module 307 includes a heating block 3071 bolted to the top of the support base 301. The heating block 3071 has several grooves 3072, and heating rods 3073 are installed within the grooves 3072. The top plate 303 has a clearance opening corresponding to the top of the heating block 3071. The heating rods 3073 are connected to a temperature controller, which is connected to a PLC controller. The temperature controller controls the heating of the heating rods 3073. The heating block 3071 is made of oxygen-free copper. The grooves 3072 in the heating block 3071 are used to embed and install the heating rods 3073, thus fixing their position. The temperature controller and PLC controller are linked, allowing for precise control of the heating of the heating rods 3073, enabling dynamic thermal load simulation. This simulates the temperature changes of the chip under different loads, adapting to different testing requirements.

[0029] A thermally conductive phase change plate 3075 is provided on the top of the heating block 3071. The thermally conductive phase change plate 3075 has high thermal conductivity and uniform temperature characteristics. It can fill the tiny gap between the heating block 3071 and the bottom of the liquid cooling plate, eliminate contact thermal resistance, and allow the heat generated by the heating block 3071 to be uniformly and quickly conducted to the corresponding areas of the CPU and GPU of the liquid cooling plate. This restores the true heating and uniform temperature state of the chip and improves the accuracy of thermal resistance test data.

[0030] The bottom of the heating block 3071 is connected to a thermocouple 3074 by bolts. The thermocouple 3074 is used to connect to the PLC controller. The thermocouple 3074 collects the real-time temperature data of the heating block 3071 and transmits it to the PLC controller, forming a closed-loop control of temperature acquisition, feedback and regulation. It can calibrate the heating temperature of the heating rod 3073 in real time, ensure that the temperature under simulated heating conditions is accurate and controllable, reduce the distortion of the liquid cooling plate heat dissipation performance test results caused by temperature deviation, and ensure the stability and accuracy of the test conditions.

[0031] The support base 301 has a wiring port for wiring the sensor 306, heating rod 3073 and thermocouple 3074.

[0032] Furthermore, the water supply assembly includes a first connecting pipe 206 located inside the cabinet 1. One end of the first connecting pipe 206 extends to the outside of the cabinet 1 and is connected to a water supply pipe 201 via a quick-connect fitting. The water supply pipe 201 is used to connect to the cold water output end of the heat exchange equipment. The first connecting pipe 206 is provided with two water supply sections, and a first detection section is provided on the water supply section. The water supply section includes a second connecting pipe 207 connected to the first connecting pipe 206 via a quick-connect fitting. The second connecting pipe 207 is connected to a fifth connecting pipe 221 via a quick-connect fitting. The water supply section also includes a first Parker hose 204 communicating with the fifth connecting pipe 221. The first Parker hose 204 is connected to a first connector 205. The first Parker hose 204 has flexible adaptability and, when used with the first connector 205, can be adapted to the liquid cooling plate water inlet interface, making disassembly and assembly convenient.

[0033] The first detection unit includes a first temperature sensor 209 and a second control valve 210 installed on the second connecting pipe 207. The end of the second control valve 210 away from the second connecting pipe 207 is connected to a first pressure sensor 211. An ultrasonic flow meter 212 is also installed on the second connecting pipe 207. The first temperature sensor 209 can collect the temperature of the coolant before water enters the liquid cooling plate in real time, providing reference data at the water inlet for calculating the heat exchange temperature difference of the liquid cooling plate. The first pressure sensor 211 can collect the pressure of the coolant before water enters the liquid cooling plate in real time. The second connecting pipe 207 is also equipped with a first control valve 208, which is used to control the flow of water between the second connecting pipe 207 and the fifth connecting pipe 221.

[0034] The first detection unit also includes a visual flow meter 203, which is connected between the first Parker hose 204 and the fifth connecting pipe 221. The visual flow meter 203 is installed on the top of the cabinet 1, which allows for direct and real-time observation of the inlet fluid flow status, enabling manual real-time monitoring of the fluid operation status and timely detection of problems such as abnormal pipeline flow, blockage, and leakage.

[0035] Furthermore, the return water assembly includes a fourth connecting pipe 217 located inside the cabinet 1. The fourth connecting pipe 217 is provided with two return water sections, and a second detection section is provided on the return water section. One end of the fourth connecting pipe 217 extends to the outside of the cabinet 1 and is connected to a return water pipe 202 via a quick-connect coupling. The return water pipe 202 is used to connect to the water inlet of the heat exchange equipment. The return water section includes a third connecting pipe 216 connected to the fourth connecting pipe 217 via a quick-connect coupling. The third connecting pipe 216 is connected to a second Parker hose 214 via a quick-connect coupling. The second Parker hose 214 is connected to a second connector 213. The second Parker hose 214 is flexibly adaptable, and the second connector 213 is connected to the water outlet of the liquid cooling plate, making disassembly and assembly convenient. The fluid after heat exchange flows back to the heat exchange equipment through the fourth connecting pipe 217 and the return water pipe 202, forming a closed-loop circulation system to realize the recycling of cold liquid.

[0036] The second detection unit includes a second temperature sensor 218 and a fourth control valve 220 installed on the third connecting pipe 216. The end of the fourth control valve 220 away from the third connecting pipe 216 is connected to a second pressure sensor 219. The second temperature sensor 218 collects the outlet water temperature of the liquid cooling plate and forms a temperature difference data with the inlet water temperature, which provides the core basis for calculating the heat exchange efficiency and thermal resistance of the liquid cooling plate. The second pressure sensor 219 collects the fluid pressure at the outlet water end and forms a pressure difference data with the inlet water pressure, which can be used to measure the fluid flow resistance inside the liquid cooling plate, i.e., the flow resistance.

[0037] A third control valve 215 is also provided on the third connecting pipe 216. The third control valve 215 is used to control the flow of water between the second Parker hose 214 and the third connecting pipe 216.

[0038] The second connector 213 and the first connector 205 are connectors that are compatible with the connectors on the liquid cooling plate pipeline, such as UQD quick-connect connectors. UQD quick-connect connectors can be adapted to the mainstream specifications of liquid cooling plate pipeline interfaces on the market, and the equipment has strong versatility. The quick-connect structure can quickly complete the pipeline connection and disconnection without auxiliary tools, improving the efficiency of sample assembly and disassembly, while the interface sealing performance is excellent.

[0039] The usage process is as follows: For ease of understanding, this application uses C to represent the liquid cooling plate, A to represent the part of the liquid cooling plate that is attached to the GPU, and B to represent the part of the liquid cooling plate that is attached to the CPU. These are marked in the figure. The liquid cooling plate is placed in the positioning groove 305. The positioning seat 304 and the positioning groove 305 cooperate with each other to support and position the liquid cooling plate. At this time, the parts of the liquid cooling plate that are attached to the GPU and the parts that are attached to the CPU are attached to the corresponding heating module 307. Specifically, they are attached to the thermally conductive phase change sheet 3075 in the heating module 307. The heating module 307 generates heat to simulate the heating condition. Insert the two pipes of the liquid cooling plate into the cabinet 1 through the corresponding wiring hole cover 101. Then connect the connectors on the two pipes of the liquid cooling plate to the first connector 205 and the second connector 213 respectively. Connect the water supply pipe 201 and the return water pipe 202 to the existing heat exchange equipment. Open the third control valve 215 and the first connector 205. Cold water is input through the water supply pipe 201, and enters the liquid cooling plate through the first connecting pipe 206, the second connecting pipe 207, the first control valve 208, the fifth connecting pipe 221 and the first Parker hose 204. During the process, the parameters are detected by the first temperature sensor 209, the first pressure sensor 211, the ultrasonic flow meter 212 and the visual flow meter 203. The data detected by the first temperature sensor 209, the first pressure sensor 211 and the ultrasonic flow meter 212 are transmitted to the PLC controller, while the data detected by the visual flow meter 203 is observed and used manually. After the coolant enters the liquid cooling plate for heat exchange, it is output to the second Parker hose 214, and then transported back to the heat exchange equipment through the third control valve 215, the third connecting pipe 216, the fourth connecting pipe 217 and the return water pipe 202. During the process, the parameters are detected by the second temperature sensor 218 and the second pressure sensor 219, and the detected data is transmitted to the PLC controller. By comparing the water pressure parameters before and after, the pressure difference can be determined, and by comparing the water temperature changes before and after, the temperature difference can be calculated. After use, close the first control valve 208 and the third control valve 215, and separate the connector of the liquid cooling plate pipe from the second connector 213 and the first connector 205. The liquid dripping during disassembly and assembly will be collected in the water collection tank 105 and discharged through the drain connector 106.

[0040] Thermal resistance detection principle: The heating module 307 simulates the dynamic heat load of the server CPU and GPU. The thermocouple 3074 collects the heat reference temperature in real time. The first temperature sensor 209 and the second temperature sensor 218 collect the inlet temperature of the coolant and the outlet temperature after heat exchange, respectively. The heat exchange temperature difference of the fluid is calculated. Combined with the heating power and fluid flow data, the heat dissipation thermal resistance of the CPU and GPU partitions of the liquid cooling plate is obtained through the thermal resistance calculation formula, which reflects the heat exchange and heat dissipation capacity of the liquid cooling plate. Flow resistance detection principle: The first pressure sensor and the second pressure sensor 219 are used to collect the fluid pressure at the inlet and outlet of the liquid cooling plate, respectively. The pressure difference of the fluid flowing through the internal flow channel of the liquid cooling plate is calculated. Combined with the real-time flow data collected by the ultrasonic flow meter 212 and the visual flow meter 203, the fluid velocity and flow channel structure parameters are matched to calculate the fluid flow resistance of the liquid cooling plate, which reflects the unobstructed flow of the internal flow channel of the liquid cooling plate and the fluid compatibility.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] Obviously, the embodiments described above are merely some embodiments of the present invention, not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms; rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this invention.

Claims

1. A liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid, characterized in that, Includes a cabinet (1) and a liquid-cooled plate dual-channel fluid test pipeline assembly (2) installed in the cabinet (1). The top of the cabinet (1) is provided with a liquid-cooled plate chip heat source simulation test fixture (3). The liquid-cooled plate chip heat source simulation test fixture (3) is used to place the liquid-cooled plate to be tested, and the liquid-cooled plate chip heat source simulation test fixture (3) is also used to simulate the heat dissipation conditions of the server chip. The liquid-cooled plate dual-channel fluid test pipeline assembly (2) includes a water supply assembly and a water return assembly. The water supply assembly is used to connect to the water inlet end of the liquid-cooled plate during testing to supply coolant to the liquid-cooled plate. The water return assembly is used to connect to the water outlet end of the liquid-cooled plate during testing to discharge the liquid after heat exchange by the liquid-cooled plate. The water supply assembly is equipped with a first detection unit, and the return water assembly is equipped with a second detection unit. The first detection unit is used to detect the parameters of the cooling liquid before it enters the liquid cooling plate, and the second detection unit is used to detect the parameters of the cooling liquid after it flows out of the liquid cooling plate. It also includes a data processing module, which is electrically connected to the first detection unit, the second detection unit and the liquid-cooled plate chip heat source simulation test fixture (3), and is used to calculate the thermal resistance and flow resistance of the liquid-cooled plate based on the detection data of the first detection unit and the second detection unit.

2. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 1, characterized in that, The bottom of the cabinet (1) is provided with a water collection tank (105) corresponding to the position of the liquid-cooled plate dual-channel fluid test pipeline assembly (2). The lowest point of the water collection tank (105) is provided with a drain connector (106), which is used to connect the drain pipe.

3. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 1, characterized in that, The liquid-cooled plate chip heat source simulation test fixture (3) includes a support base (301) installed on the top of the cabinet (1). The support base (301) is provided with a support member on the top and a positioning member on the top of the support member. The positioning member is used for positioning the liquid-cooled plate after it is placed. Several heating modules (307) are provided between the support base (301) and the support member. The several heating modules (307) heat the corresponding areas of the CPU and GPU of the liquid-cooled plate respectively to simulate the heat dissipation conditions of the CPU and GPU during use.

4. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 3, characterized in that, The support includes a plurality of support plates (302) mounted on the top of the support base (301), and a top plate (303) is installed between the tops of the plurality of support plates (302). The positioning component includes several positioning seats (304) installed on the top of the top plate (303). The positioning seats (304) are provided with positioning grooves (305). The several positioning seats (304) and the positioning grooves (305) cooperate to form a positioning area, which is used for positioning after the liquid cooling plate is placed.

5. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 4, characterized in that, The heating module (307) includes a heating block (3071) installed on the top of the support base (301). The heating block (3071) is provided with a plurality of grooves (3072). A heating rod (3073) is installed in the groove (3072). The top plate (303) has a clearance opening corresponding to the top of the heating block (3071). A thermally conductive phase change plate (3075) is provided on the top of the heating block (3071).

6. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 1, characterized in that, The water supply assembly includes a first connecting pipe (206) located inside the cabinet (1), one end of the first connecting pipe (206) extends to the outside of the cabinet (1) and is connected to a water supply pipe (201), the water supply pipe (201) is used to connect to the cold water output end of the heat exchange equipment, a plurality of second connecting pipes (207) are connected to the first connecting pipe (206), the second connecting pipes (207) are connected to a fifth connecting pipe (221), the water supply assembly also includes a first Parker hose (204) communicating with the fifth connecting pipe (221), the first Parker hose (204) is connected to a first connector (205).

7. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 6, characterized in that, The first detection unit includes a first temperature sensor (209) and a second control valve (210) disposed on the second connecting pipe (207). The second control valve (210) is connected to a first pressure sensor (211) at one end away from the second connecting pipe (207), and an ultrasonic flow meter (212) is also disposed on the second connecting pipe (207). The second connecting pipe (207) is also provided with a first control valve (208), which is used to control the opening and closing of the water passage between the second connecting pipe (207) and the fifth connecting pipe (221).

8. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 7, characterized in that, The first detection unit also includes a visual flow meter (203), which is connected between the first Parker hose (204) and the fifth connecting pipe (221) and is installed on the top of the cabinet (1).

9. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 8, characterized in that, The return water assembly includes a fourth connecting pipe (217) located inside the cabinet (1). One end of the fourth connecting pipe (217) extends to the outside of the cabinet (1) and is connected to a return water pipe (202). The return water pipe (202) is used to connect to the water inlet of the heat exchange equipment. The fourth connecting pipe (217) is provided with a third connecting pipe (216) in the same number as the second connecting pipe (207). The third connecting pipe (216) is connected to a second Parker hose (214). The second Parker hose (214) is connected to a second connector (213).

10. The liquid-cooled plate testing device integrating dynamic thermal load and simulated fluid as described in claim 9, characterized in that, The second detection unit includes a second temperature sensor (218) disposed on the third connecting pipe (216) and a fourth control valve (220), wherein a second pressure sensor (219) is connected to one end of the fourth control valve (220) away from the third connecting pipe (216). The third connecting pipe (216) is also equipped with a third control valve (215), which is used to control the opening and closing of the water passage between the second Parker hose (214) and the third connecting pipe (216).

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