Size-reducible and fully-inspected embedded material and method, embedded material, and planar capacitor material web
Patent Information
- Application Number
- CN202611158970.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-31
- Publication Date
- 2026-10-27
AI Technical Summary
然而，埋容材料在制造过程中易因介质层空泂、凹陷、杂质等不良导致微短路、电容值偏差大等问题
[0017]本发明的可尺寸缩减与全面检测的埋容材料在外围设置裁切区，并在裁切区中形成第一性能测试区，能够直接或间接表征保留区的多种性能，例如检测电容密度、介电损耗、剥离强度、尺寸、厚度等，不仅能全面评估电学性能、力学性能以及可靠性，还能实现多参数同步分析，检测效率高、精度高。
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Figure CN122983473A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of embedded capacitor technology, and particularly to an embedded capacitor material that can be shrunk in size and fully inspected, a method for manufacturing an embedded capacitor material that can be shrunk in size and fully inspected, and embedded capacitor material and planar capacitor material rolls. Background Technology
[0002] As electronic products become increasingly lightweight and highly integrated, embedded capacitor technology is widely used due to its space-saving and circuit-stabilizing advantages. However, during the manufacturing process, embedded capacitors are prone to problems such as micro-short circuits and large capacitance deviations due to defects in the dielectric layer, such as voids, depressions, and impurities.
[0003] Traditional testing methods have the following limitations: First, they rely on single performance tests, such as sampling tests for withstand voltage or capacitance density, which cannot comprehensively evaluate dielectric properties, mechanical properties, and reliability; second, they are inefficient and difficult to achieve simultaneous analysis of multiple parameters; third, they are indirect and prone to missing defects; and fourth, they cannot flexibly adjust the testing range according to customer needs. Summary of the Invention
[0004] In view of this, the present invention provides a shrinkable and fully testable embedded capacitor material that can directly or indirectly characterize various properties of the retention region, comprehensively evaluate dielectric properties, mechanical properties and reliability, and achieve simultaneous multi-parameter analysis.
[0005] A scalable and fully testable embedded capacitor material includes a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first and second conductive layers. The scalable and fully testable embedded capacitor material includes a reserved area and a cut area. The first conductive layer forms a first performance testing area in the cut area and a target effective area in the reserved area. The first performance testing area and the target effective area are separated. The first performance testing area is used for performance testing to indirectly characterize the performance of the reserved area.
[0006] Optionally, the second conductive layer is continuous in the retained area and the cut area; the dielectric layer is continuous in the retained area and the cut area.
[0007] Optionally, the first performance test area includes at least one first region, the first region having a plurality of first conductive parts arranged at intervals, each of the first conductive parts cooperating with the second conductive layer to directly detect at least one of the capacitance value, dielectric loss, thickness, and frequency characteristic curve, and indirectly characterize the uniformity and performance of the retention area.
[0008] Optionally, each of the first conductive portions has the same area, or at least two of the first conductive portions have different areas and / or shapes.
[0009] Optionally, the first region includes at least two rows or two columns of sub-regions, each row or column of the sub-regions is provided with a plurality of the first conductive parts, each of the first conductive parts in each row or column of the sub-regions has the same area, and the areas of the first conductive parts in different rows or different columns of the sub-regions are different.
[0010] Optionally, at least one of the first conductive portions in each row or column of the sub-region has a different area than the other first conductive portions, and the areas of the first conductive portions in different rows or columns of the sub-region are different.
[0011] Optionally, the first performance test area includes at least one second area, the second area having a plurality of second conductive parts arranged at intervals, the second conductive parts being used to directly detect peel strength and indirectly characterize the peel strength of the retained area.
[0012] Optionally, the first conductive layer forms a second performance test area in the cutting area, the second performance test area is provided with at least one third conductive part, the third conductive part is connected to the target effective area, and the third conductive part cooperates with the second conductive layer to detect the voltage withstand performance of the retained area.
[0013] Optionally, the cutting area is annular and is arranged circumferentially around the retention area.
[0014] This application also relates to a method for manufacturing the above-mentioned scalable and fully inspectable embedded material, the method comprising: A sheet of embedded capacitor material is provided, the sheet of embedded capacitor material comprising a first conductive layer, a second conductive layer disposed opposite to each other, and a dielectric layer disposed between the first conductive layer and the second conductive layer; The first conductive layer is divided into a first performance test area and a target effective area that are spaced apart; The first conductive layer of the first performance test area is divided to form multiple conductive parts; The conductive part has at least one of the following functions: By using the conductive part in conjunction with the second conductive layer to detect at least one of the following: capacitance value, dielectric loss, thickness, frequency response curve, and withstand voltage performance, the uniformity and performance of the target effective area can be indirectly characterized. The peel strength is directly detected using the conductive part, which indirectly characterizes the peel strength of the target effective area.
[0015] This application also relates to a planar capacitor material roll, which includes the above-mentioned scalable and fully inspectable embedded capacitor material, wherein the planar capacitor material roll is cut to form the scalable and fully inspectable embedded capacitor material.
[0016] This application also relates to an embedded material obtained by cutting away the cut area from the above-described scalable and fully inspectable embedded material.
[0017] The scalable and fully testable embedded capacitor material of the present invention has a cutting area on the periphery, and a first performance test area is formed in the cutting area. It can directly or indirectly characterize a variety of properties of the retained area, such as capacitance density, dielectric loss, peel strength, size, thickness, etc. It can not only comprehensively evaluate electrical performance, mechanical performance and reliability, but also realize multi-parameter synchronous analysis, with high detection efficiency and high accuracy. Attached Figure Description
[0018] Figure 1 This is a top view schematic diagram of the embedded material that can be scalable and fully inspected according to the first embodiment of this application.
[0019] Figure 2 This is a bottom view of the embedded material with scalable and fully inspectable structure according to the first embodiment of this application.
[0020] Figure 3 This is a cross-sectional structural diagram of the embedded material that can be scalable and fully inspected according to the first embodiment of this application.
[0021] Figure 4 This is a top view of the embedded material with scalable and fully inspectable structure according to the second embodiment of this application.
[0022] Figure 5 This is a bottom view of the embedded material with scalable and fully inspectable structure according to the second embodiment of this application.
[0023] Figure 6 This is a top view of the embedded material with scalable and fully inspectable structure according to the third embodiment of this application.
[0024] Figure 7 This is a bottom view of the embedded material with scalable and fully inspectable structure according to the third embodiment of this application.
[0025] Figure 8 This is a schematic diagram of the planar capacitor material roll of this application.
[0026] Figure 9 This is a top view of the unfolded planar capacitor material roll after it has been cut.
[0027] Figure 10 This is a top view schematic diagram showing that the first conductive layer of the embedded capacitor material sheet is divided into a first performance test area and a target effective area. Detailed Implementation
[0028] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0029] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, electrical and operational aspects may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terminology used herein is for describing particular embodiments only and is not intended to limit the present application.
[0030] Although the terms first, second, etc., are used in some instances to describe various elements herein, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
[0031] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of a feature, step, operation, element, component, item, kind, and / or group, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition arise only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.
[0032] First Embodiment Figure 1 This is a top view schematic diagram of the scalable and fully inspectable embedded material according to the first embodiment of this application. Figure 2 This is a bottom view structural diagram of the embedded material with scalable and fully inspectable structure according to the first embodiment of this application. Figure 3 This is a cross-sectional structural schematic diagram of the scalable and fully inspectable embedded material according to the first embodiment of this application, as shown below. Figure 1 , Figure 2 and Figure 3As shown, the scalable and fully testable embedded capacitor material 10 includes a first conductive layer 11, a second conductive layer 12 disposed opposite to each other, and a dielectric layer 13 disposed between the first conductive layer 11 and the second conductive layer 12. The scalable and fully testable embedded capacitor material 10 includes a retention area 101 and a cutting area 102. The first conductive layer 11 forms a first performance test area 112 in the cutting area 102 and a target effective area 113 in the retention area 101. The first performance test area 112 and the target effective area 113 are spaced apart. The first performance test area 112 is used for performance testing to indirectly characterize the performance of the retention area 101.
[0033] When testing at least one of the capacitance value, dielectric loss, thickness, and frequency characteristic curve of the scalable and fully testable embedded capacitor material 10, a testing device is used to connect the first performance test area 112 and the second conductive layer 12. For example, the positive electrode of the testing device is connected to the first performance test area 112 and the negative electrode is connected to the second conductive layer 12, and the corresponding data is collected. The collected data can indirectly characterize the performance of the retention area 101. When performing a peel strength test on the scalable and fully testable embedded material 10, the testing equipment is connected to the first performance test area 112. By pulling the first conductive layer 11 of the first performance test area 112, the first conductive layer 11 is gradually separated from the dielectric layer 13, and corresponding data is collected. The collected data can indirectly characterize the performance of the retention area 101.
[0034] The scalable and fully testable embedded capacitor material 10 of this application has a cutting area 102 on the periphery, and a first performance test area 112 is formed in the cutting area 102. It can directly or indirectly characterize various properties of the test retention area 101, such as capacitance density, dielectric loss, peel strength, size, thickness, etc. It can not only comprehensively evaluate dielectric properties, mechanical properties and reliability, but also realize multi-parameter synchronous analysis, with high testing efficiency and high accuracy.
[0035] It is worth mentioning that the size-reducible and fully inspectable embedded material 10 of this application can also be called a shrinkable embedded material. The subject line “size-reducible and fully inspectable embedded material” in the entire text can be replaced with the subject line “shrinkable embedded material”.
[0036] Optionally, such as Figure 2 and Figure 3As shown, the second conductive layer 12 is continuous and uninterrupted in the retention area 101 and the cutting area 102; the dielectric layer 13 is also continuous and uninterrupted in the retention area 101 and the cutting area 102. In this application, only the first conductive layer 11 is chemically etched or physically cut to form the first performance test area 112 and the target effective area 113. The first performance test area 112 is chemically etched or physically cut to form multiple conductive parts, each of which is used for performance testing of the retention area 101.
[0037] Optionally, the capacitance density of the scalable and fully inspectable embedded capacitor material 10 is 0.1 to 9.3 nF / cm², for example, 0.2 nF / cm², 0.3 nF / cm², 0.5 nF / cm², 0.8 nF / cm², 0.9 nF / cm², 1.0 nF / cm², 1.2 nF / cm², 1.5 nF / cm², 1.6 nF / cm², 2.0 nF / cm², 3.0 nF / cm², 4.0 nF / cm², 5.0 nF / cm², 6.0 nF / cm², 7.0 nF / cm², 8.0 nF / cm², and 9.0 nF / cm².
[0038] Optionally, the dimensionally reducible and fully inspectable embedded material 10 has a peel strength ≥0.5 N / mm.
[0039] Optionally, the scalable and fully testable embedded capacitor material 10 has a withstand voltage ≥1V / 60s.
[0040] Optionally, the length of the retention area 101 of the scalable and fully inspectable embedded material 10 is 10mm to 1200mm, for example, 15mm, 20mm, 25mm, 30mm, 50mm, 60mm, 80mm, 100mm, 120mm, 150mm, 200mm, 250mm, 300mm, 400mm, 500mm, 600mm, 700mm, 800mm, 900mm, 1 000mm; The width of the retention area 101 of the embedded material 10, which can be shrunk in size and fully inspected, is 10mm to 1000mm, for example, 15mm, 20mm, 25mm, 30mm, 50mm, 60mm, 80mm, 100mm, 120mm, 150mm, 200mm, 250mm, 300mm, 400mm, 500mm, 600mm, 700mm, 800mm, 900mm.
[0041] Optionally, the width of the cut area 102 of the shrinkable and fully inspectable embedded material 10 is 10mm to 200mm, for example, 15mm, 20mm, 25mm, 30mm, 50mm, 60mm, 80mm, 90mm, 100mm, 120mm, 150mm, or 180mm.
[0042] Optionally, the first conductive layer 11 and the second conductive layer 12 are, for example, copper foil.
[0043] Optionally, such as Figure 1 As shown, the first performance testing area 112 includes at least one first region 112a. The first region 112a has multiple first conductive portions 1121 arranged at intervals. Each first conductive portion 1121 cooperates with the second conductive layer 12 to detect at least one of the following: capacitance value, dielectric loss, thickness, and frequency response curve. This indirectly characterizes the uniformity and performance of the retention area 101. That is, by connecting the first conductive portion 1121 and the second conductive layer 12 with a testing device, the corresponding parameters can be collected. In this embodiment, each first conductive portion 1121 is formed by chemical etching or physical cutting of the first conductive layer 11 of the first region 112a.
[0044] Optionally, such as Figure 1 As shown, the first performance test area 112 includes at least two first regions 112a, which are located on opposite sides of the target effective area 113. The length direction of the target effective area 113 is defined as the first direction X, and the width direction is defined as the second direction Y, with the first direction X and the second direction Y being perpendicular. Multiple first conductive portions 1121 of each first region 112a are arranged sequentially at intervals along the first direction X or the second direction Y. In this embodiment, parameters of the first regions 112a on the left and right sides of the target effective area 113 are obtained, and the data deviation between the two sides is calculated. The uniformity of the detection results is judged by comparing the deviation value with a preset threshold; for example, a deviation value less than or equal to the preset threshold indicates good uniformity.
[0045] Optionally, the first performance test area 112 includes four first regions 112a, which are located around the target effective area 113, that is, each side of the target effective area 113 is adjacent to a first region 112a.
[0046] Optionally, the shape of each first conductive part 1121 is, for example, rectangular, square, circular, etc., and its area is 1 cm². 2 1mm 2 2mm 2 1 inch 2 However, this is not the limit.
[0047] Optionally, the number of first conductive parts 1121 in each first region 112a can be freely designed according to actual needs. For example, each first region 112a includes 30 first conductive parts 1121. When detecting at least one of capacitance value, dielectric loss, thickness, and frequency characteristic curve, multiple first conductive parts 1121 can be connected sequentially using a detection device to obtain multiple sets of data.
[0048] Optionally, such as Figure 1 As shown, the areas of each first conductive part 1121 are the same, or at least two first conductive parts 1121 have different areas and / or shapes.
[0049] Optionally, the cutting area 102 is annular and is arranged around the circumference of the retention area 101. That is, the cutting area 102 is located in the edge area of the embedded material 10 that can be sized down and fully inspected, and the retention area 101 is located in the central area of the embedded material 10 that can be sized down and fully inspected. Performance testing is performed in the edge area of the embedded material 10 that can be sized down and fully inspected to avoid damaging the retention area 101.
[0050] Optionally, such as Figure 1 As shown, the first performance test area 112 includes at least one second region 112b. The second region 112b is provided with a plurality of second conductive portions 1122 arranged at intervals. The second conductive portions 1122 are used to directly detect the glass strength, thereby indirectly characterizing the peel strength of the retention area 101. In this embodiment, each second conductive portion 1122 is formed by chemical etching or physical cutting of the first conductive layer 11 of the second region 112b.
[0051] Optionally, such as Figure 1 As shown, the first performance test area 112 includes four second areas 112b, two of which are located on the left and right sides of the reserved area 101 respectively, and the two second areas 112b are adjacent to the two first areas 112a. The other two second areas 112b are located on the upper and lower sides of the reserved area 101 respectively.
[0052] Optionally, the second conductive portion 1122 is in the form of a long strip matrix, and the length direction of the second conductive portion 1122 is parallel to the first direction X or the second direction Y; the length of the second conductive portion 1122 is 120mm and the width is 3.2mm, but it is not limited thereto.
[0053] Optionally, the methods for dividing the first conductive part 1121, the second conductive part 1122, and the target effective area 113 include, but are not limited to, laser etching, chemical etching, and manual scribing.
[0054] Optionally, such as Figure 1As shown, a second performance test area 114 is formed in the cutting area 102 of the first conductive layer 11. The second performance test area 114 is provided with at least one third conductive part 1141. The third conductive part 1141 is connected to the target effective area 113. The third conductive part 1141 cooperates with the second conductive layer 12 to test the voltage withstand performance of the retained area 101. In this embodiment, the third conductive part 1141 and the first conductive layer 11 of the target effective area 113 are not cut apart. The third conductive part 1141 is only used for performance testing and will be removed together with the cutting area 102 after the test is completed.
[0055] When performing a voltage withstand test on the scalable and fully testable embedded capacitor material 10, a testing device is used to connect the third conductive part 1141 and the second conductive layer 12. For example, the positive electrode of the testing device is connected to the third conductive part 1141 and the negative electrode is connected to the second conductive layer 12, and corresponding data is collected. The collected data can represent the performance of the reserved area 101.
[0056] Optionally, the third conductive portion 1141 is in the form of a long strip matrix, and the length direction of the third conductive portion 1141 is parallel to the first direction X. The third conductive portion 1141 is disposed adjacent to the target effective area 113, and the length of the third conductive portion 1141 is less than or equal to the length of the target effective area 113. For example, the length of the third conductive portion 1141 is 500mm and the width is 20mm, but it is not limited to this.
[0057] Optionally, such as Figure 1 As shown, the upper and lower sides of the target effective area 113 are connected to the third conductive part 1141. After the performance of the third conductive part 1141 is tested, it can be removed together with the cutting area 102 by chemical etching or physical cutting.
[0058] Second Embodiment Figure 4 This is a top view schematic diagram of the scalable and fully inspectable embedded material according to the second embodiment of this application. Figure 5 This is a bottom view schematic diagram of the scalable and fully inspectable embedded material according to the second embodiment of this application, as shown. Figure 4 and Figure 5 As shown, the scalable and fully testable embedded material 10 of this embodiment has a structure and function that are roughly the same as the scalable and fully testable embedded material 10 of the first embodiment, the difference being that the local structure of the first performance test area 112 is different.
[0059] Optionally, such as Figure 4 and Figure 5As shown, the first region 112a includes at least two rows or two columns of sub-regions. Each row or column of sub-regions is provided with multiple first conductive parts 1121. The area of each first conductive part 1121 in each row or column of sub-regions is the same, while the area of the first conductive parts 1121 in different rows or columns of sub-regions is different. In this embodiment, using a smaller area of first conductive parts 1121 can more precisely characterize the capacitance distribution of the target effective region 113, and the distribution pattern of the test data on both sides can highly represent the overall electrical performance of the target effective region 113.
[0060] Optionally, at least one first conductive portion 1121 in each row or column of sub-region has a different area than other first conductive portions 1121, and the areas of the first conductive portions 1121 in different rows or columns of sub-region are different.
[0061] Optionally, the first region 112a includes three rows of sub-regions, each row of sub-regions being arranged sequentially at intervals along a first direction X, and multiple first conductive portions 1121 of each sub-region being arranged sequentially at intervals along a second direction Y. In this embodiment, the sub-region near the target effective region 113 is provided with 11 0.01cm... 2 The first conductive part 1121 has seven 0.04cm sub-regions in its middle. 2 The first conductive part 1121 has three 0.25cm sub-regions on its outermost side. 2 The first conductive part 1121.
[0062] Optionally, the first performance test area 112 includes two first regions 112a and two third regions 112b. The two first regions 112a are located on the left and right sides of the target effective area 113 along the first direction X, respectively. The second performance test area 114 is located on the left side of the target effective area 113 and between the first regions 112a and the target effective area 113. The two second regions 112b are located on the upper and lower sides of the target effective area 113 along the second direction Y, respectively.
[0063] Third Embodiment Figure 6 This is a top view schematic diagram of the scalable and fully inspectable embedded material according to the third embodiment of this application. Figure 7 This is a bottom view structural diagram of the scalable and fully inspectable embedded material according to the third embodiment of this application. The scalable and fully inspectable embedded material 10 of this embodiment has a structure and function that are roughly the same as the scalable and fully inspectable embedded material 10 of the first embodiment. The difference lies in the arrangement of the first region 112a, the second region 112b and the second performance test area 114.
[0064] Optionally, such as Figure 6As shown, the first performance test area 112 includes four first areas 112a and two third areas 112c. The four first areas 112a are arranged around the target effective area 113 in the circumferential direction. The second performance test area 114 and the target effective area 113 are surrounded by the four first areas 112a. The two second areas 112b are located on the upper and lower sides of the target effective area 113 along the second direction Y.
[0065] Fourth embodiment This application also relates to a method for manufacturing the above-mentioned scalable and fully inspectable embedded material, the method comprising: A buried capacitor material sheet is provided, which includes a first conductive layer 11, a second conductive layer 12 disposed opposite to each other, and a dielectric layer 13 disposed between the first conductive layer 11 and the second conductive layer 12. The first conductive layer 11 is divided to form a spaced first performance test area 112 and a target effective area 113; The first conductive layer 11 of the first performance test area 112 is divided to form multiple conductive parts; The conductive part has at least one of the following functions: By utilizing the interaction between the conductive portion and the second conductive layer 12 to detect at least one of the following parameters—capacitance, dielectric loss, thickness, and frequency response curve—the uniformity and performance of the target effective region 113 can be indirectly characterized. The conductive portion is either the first conductive portion 1121 or the second conductive portion 1122 described in the above embodiment. The peel strength of the target effective region 113 is indirectly characterized by directly detecting the peel strength using a conductive part, which is the second conductive part 1122 in the above embodiment. In this embodiment, the conductive part forming region used to detect the capacitance value, dielectric loss, thickness, and frequency characteristic curve is divided into a first region 112a; the conductive part forming region used to detect the peel strength is divided into a second region 112b. For example, the first conductive layer 11 can be divided into the target effective region 113 and the first performance test region 112, and the first performance test region 112 can be divided into at least one first region 112a and at least one second region 112b. The arrangement of each region is as described in the above embodiment and will not be repeated here.
[0066] Optionally, the first conductive layer is divided to form a second performance test area 114 connected to the target effective area 113; the third conductive part 1141 of the second performance test area 114 is used in conjunction with the second conductive layer 12 to test the voltage withstand performance of the reserved area 101.
[0067] Fifth Embodiment Optionally, Figure 8 This is a schematic diagram of the planar capacitor material roll of this application. Figure 9This is a top view of the unfolded planar capacitor material roll after it has been cut. Figure 10 This is a top view schematic diagram of the first conductive layer of the embedded capacitor material sheet divided into a first performance test area and a target effective area, as shown in this application. Figure 8 , Figure 9 and Figure 10 As shown, this application also relates to a planar capacitor material roll, including the above-mentioned scalable and fully inspectable embedded capacitor material; the planar capacitor material roll is cut to form the scalable and fully inspectable embedded capacitor material.
[0068] Optionally, the length of the planar capacitor material roll is 1m to 1000m. The planar capacitor material roll is a material with continuous characteristics in the time-space preparation process. After the planar capacitor material roll is unrolled, it is divided into multiple segments of the above-mentioned scalable and fully inspectable embedded capacitor material 10. Then, the first conductive layer 11 of the scalable and fully inspectable embedded capacitor material 10 is divided, for example by laser etching, chemical etching, manual scribing, etc., to form a first performance test area 112, a second performance test area 114, and a target effective area 113 on the dielectric layer 13. Subsequently, the first performance test area 112 is divided to form at least one first region 112a and at least one second region 112b. In the first region 112a, the first conductive layer 11 is divided into multiple first conductive parts 1121, and in the second region 112b, the first conductive layer 11 is divided into at least one second conductive part 1122.
[0069] Sixth Embodiment This application also relates to an embedded material obtained by cutting away the cut area 102 from the above-described scalable and fully inspectable embedded material 10.
[0070] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Furthermore, the structures or structural features involved can be arbitrarily combined and superimposed. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. A shrinkable and fully inspectable embedded material, characterized in that, The embedded capacitor material includes a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first conductive layer and the second conductive layer, which are disposed opposite to each other. The scalable and fully testable embedded capacitor material includes a reserved area and a cut area. The first conductive layer forms a first performance test area in the cut area and a target effective area in the reserved area. The first performance test area is separated from the target effective area. The first performance test area is used for performance testing to indirectly characterize the performance of the reserved area.
2. The resizable and fully inspectable embedded material as described in claim 1, characterized in that, The second conductive layer is continuous in the retained area and the cut area; the dielectric layer is continuous in the retained area and the cut area.
3. The resilient and fully inspectable embedded material as described in claim 1, characterized in that, The first performance test area includes at least one first region, which is provided with a plurality of first conductive parts arranged at intervals. Each first conductive part cooperates with the second conductive layer to detect at least one of the capacitance value, dielectric loss, thickness, and frequency characteristic curve, thereby indirectly characterizing the uniformity and performance of the retention area.
4. The resizable and fully inspectable embedded material as described in claim 3, characterized in that, The areas of each of the first conductive parts are the same, or at least two of the first conductive parts have different areas and / or shapes.
5. The resizable and fully inspectable embedded material as described in claim 3, characterized in that, The first region includes at least two rows or two columns of sub-regions, and each row or column of the sub-regions is provided with a plurality of the first conductive parts; The area of each first conductive part in each row or column of the sub-region is the same, while the area of the first conductive part in different rows or columns of the sub-region is different. or, At least one of the first conductive portions in each row or column of the sub-regions has an area different from the other first conductive portions, and the areas of the first conductive portions in different rows or columns of the sub-regions are different.
6. The resizable and fully inspectable embedded material as described in claim 3, characterized in that, The first performance test area includes at least one second region, the second region having a plurality of second conductive parts arranged at intervals between each other, the second conductive parts being used to directly detect glass strength and indirectly characterize the peel strength of the retained area.
7. The resizable and fully inspectable embedded material as described in any one of claims 1 to 6, characterized in that, The first conductive layer forms a second performance test area in the cutting area. The second performance test area has at least one third conductive portion, which is connected to the target effective area. The third conductive portion cooperates with the second conductive layer to test the voltage withstand performance of the retained area; and / or... The cutting area is ring-shaped and is arranged around the circumference of the retention area.
8. A method for manufacturing the scalable and fully inspectable embedded material according to any one of claims 1 to 7, characterized in that, The method includes: A sheet of embedded capacitor material is provided, the sheet of embedded capacitor material comprising a first conductive layer, a second conductive layer disposed opposite to each other, and a dielectric layer disposed between the first conductive layer and the second conductive layer; The first conductive layer is divided into a first performance test area and a target effective area that are spaced apart; The first conductive layer of the first performance test area is divided to form multiple conductive parts; The conductive part has at least one of the following functions: By using the conductive part in conjunction with the second conductive layer to detect at least one of the capacitance value, dielectric loss, thickness, and frequency characteristic curve, the uniformity and performance of the target effective area can be indirectly characterized. The peel strength is directly detected using the conductive part, which indirectly characterizes the peel strength of the target effective area.
9. A planar capacitor material roll, characterized in that, The planar capacitor material roll includes the scalable and fully inspectable embedded capacitor material as described in any one of claims 1 to 7; the planar capacitor material roll is cut to form the scalable and fully inspectable embedded capacitor material.
10. A type of embedded material, characterized in that, The embedded material is obtained by cutting away the cut area from the sizing-reducible and fully inspectable embedded material as described in any one of claims 1 to 7.