Optoelectronic device and method of assembling same, optical path system and method of calibrating same

Abstract

The photoelectric device comprises a fiber array and a photoelectric array chip, the fiber array comprises a first through-hole plate and a lens array, the first through-hole plate comprises a plurality of first through-holes, the lens array comprises a plurality of lens units, each lens unit comprises a lens, and each first through-hole is aligned with a first surface of each corresponding lens; the photoelectric array chip is connected to the fiber array and located above the lens array; the photoelectric array chip comprises a plurality of photoelectric detection units, each photoelectric detection unit forms a light transmission hole, and each light transmission hole is aligned with a second surface of each corresponding lens; each photoelectric detection unit comprises at least one first photoelectric detector, the first photoelectric detector detects a light spot corresponding to an optical path, converts an optical signal, and outputs an electrical signal. The photoelectric device determines the relative position of the light spot through the photoelectric array chip, effectively solving the real-time regulation and control problem of the relative position of the light spot and the fiber array in the optical path.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to an optoelectronic device and its installation method, as well as a corresponding optical switching system and its calibration method. Background Technology

[0002] Large data centers are the core infrastructure of the Artificial Intelligence (AI) era, relying on clusters of tens of thousands of Graphics Processing Units (GPUs) to support large-scale AI model training and real-time user demand response. The collaborative work of GPUs has enormous data communication requirements (hundreds of GB / s or even TB / s). Traditional optical-electrical-optical switching systems are not only inadequate in terms of communication speed, but their energy efficiency also struggles to meet the demands of the rapid development of AI. Therefore, communication between GPUs is gradually shifting towards all-optical circuit switches (OCS), which offer superior speed and power consumption.

[0003] An all-optical circuit switch (OCS) switching system includes input fiber optic arrays (FAUs), output fiber optic arrays, optical path deflection components, and auxiliary reflective units, among other optical components. A typical optical path diagram is shown below. Figure 1 As shown, the system includes a first fiber array A, a second fiber array B, and an optical path deflection component C. The first fiber array A, the second fiber array B, and the optical path deflection component C have the same number of units, and the units correspond one-to-one. The first fiber array is the input fiber array, and the second fiber array is the output fiber array; their roles can be interchanged. The light spot enters the optical system from the input fiber array, passes through the first fiber array A, and strikes the optical path deflection component C. After reflection by the optical path deflection component C, the light is output from the second fiber array B. Typically, the optical system may also include multiple optical path deflection components and reflection units. The optical fiber enters from the input fiber array, undergoes multiple reflections and deflections, and then exits from the output fiber array.

[0004] The calibration and stabilization of existing optical path systems rely on illuminating the optical path deflection components with another wavelength of light and using a camera to collect real-time monitoring information on the deflection of the reflective surface. However, using a dedicated camera to monitor the incident light significantly increases the complexity of the system, and the cost of the camera system and subsequent image processing hardware and software also increases substantially. Summary of the Invention

[0005] In view of the above problems, the purpose of the present invention is to provide an optoelectronic device, an assembly method, and an optical path system that integrates an optical fiber array and an optoelectronic array chip in the same optoelectronic device.

[0006] A photoelectric device, comprising:

[0007] The fiber array includes a first through-hole plate and a lens array. The first through-hole plate includes a plurality of first through-holes, and the lens array includes a plurality of lens units. Each lens unit includes a lens, and each first through-hole is aligned with the first surface of the corresponding lens.

[0008] Optoelectronic array chip;

[0009] The optoelectronic array chip includes several optoelectronic detection units, each of which forms a light-transmitting hole, and each light-transmitting hole is aligned with the second surface of the corresponding lens.

[0010] Each photoelectric detection unit includes at least one first photodetector, which detects the light spot corresponding to the optical path, converts the optical signal, and outputs an electrical signal.

[0011] Preferably, the lens array includes a second substrate located on a first through-hole plate, and lenses of a plurality of lens units are on the second substrate, transmitting light between the first through-hole plate, at least a portion of the second substrate, and the lenses.

[0012] Preferably, if the first photodetector detects that all or part of the light spot corresponding to the optical path is located at the edge of the lens, it is an offset light spot, and the electrical signal output by the first photodetector is a first electrical signal; if the first photodetector detects that the light spot corresponding to the optical path is located at the center of the lens, it is a normal light spot, and the electrical signal output by the first photodetector is a second electrical signal, and the first electrical signal is greater than the second electrical signal.

[0013] Preferably, the lens receives and focuses the light spot corresponding to the light path through the light-passing aperture.

[0014] Preferably, the opening size of the light-transmitting aperture is larger than the diameter of the light spot.

[0015] Preferably, the opening size of the light-transmitting hole satisfies: 0.2mm ≤ opening size of the light-transmitting hole ≤ 2mm.

[0016] Preferably, a gap is formed between each lens and the corresponding photoelectric detection unit to ensure that the lens is positioned within the gap.

[0017] Preferably, the photoelectric detection unit includes a first substrate, on which a light-transmitting hole is formed, and a plurality of first photodetectors are located on the substrate and surround the light-transmitting hole.

[0018] Preferably, the photoelectric detection unit includes a first substrate, on which a gap is formed, the gap size being larger than the height of the lens.

[0019] Preferably, the optoelectronic array chip is bonded to the fiber array via a bonding layer, and the optoelectronic array chip is located above the lens array; or the optoelectronic array chip is bonded to the fiber array via an adhesive layer, and the optoelectronic array chip is located above the lens array.

[0020] Preferably, the photoelectric array chip is connected to the fiber optic array via one or more combinations of locations other than corners, edges, or light-passing holes on the photoelectric array chip, with the photoelectric array chip positioned above the lens array.

[0021] Preferably, the electrical signal is provided to the control circuit, which converts the electrical signal into a drive control signal and provides it to the optical path deflection component, thereby adjusting the deflected light path and calibrating the offset light spot back to the range of the corresponding lens of the photoelectric device.

[0022] Preferably, the surface of the first photodetector includes a photosensitive layer, which detects the light spot corresponding to the optical path.

[0023] Preferably, the surface of the first photodetector includes a photosensitive layer, which is one of Si, SiGe, InP, and InGaAs.

[0024] Preferably, the electrodes of the first photodetector are led out to form photodetector unit electrodes, and the corresponding photodetector unit electrodes transmit the corresponding electrical signals.

[0025] Preferably, the electrodes of the photoelectric array chip are located on the surface of the photoelectric array chip.

[0026] Preferably, the light-transmitting hole is circular, elliptical, or polygonal.

[0027] Preferably, a pattern is also provided around the circumference or polygon of the light-transmitting hole.

[0028] Preferably, at least one first photodetector is located around the light-transmitting aperture.

[0029] Preferably, there are multiple first photodetectors, and the multiple first photodetectors surround the light-transmitting hole.

[0030] Preferably, the multiple first photodetectors are distributed on a continuous ring or on a discontinuous ring.

[0031] Preferably, multiple first photodetectors are distributed in a dot matrix on the ring.

[0032] Preferably, multiple first photodetectors are distributed on concentric rings or arcs of the same radius.

[0033] Preferably, multiple first photodetectors are distributed on concentric rings or arcs with different radii.

[0034] Preferably, the optoelectronic array chip and the fiber array are assembled on the same assembly structure, and the optical path originates from the outside of the optoelectronic device.

[0035] Preferably, several photoelectric detection unit electrodes are led out to form several photoelectric array chip electrodes.

[0036] Preferably, the optoelectronic device further includes an assembly housing, with the fiber array and optoelectronic array chips located inside the assembly housing, and several optoelectronic array chip electrodes connected to the pads of the assembly housing via bonding leads.

[0037] Preferably, when the optoelectronic device is used as a light input unit, the divergent light output from the optical fiber is transmitted to the lens array through the first through hole of the first through hole plate, and the lens array collimates the divergent light output from the external optical fiber into a parallel beam.

[0038] Preferably, when the optoelectronic device is used as a light output unit, the parallel light beam is transmitted to the optical fiber through the lens array and the first through hole of the first through-hole plate.

[0039] Preferably, each first through hole in the first through hole plate is formed by the passage of a first through hole square hole of a first size and a first through hole round hole of a second size, wherein the first size is larger than the second size; the first through hole square hole is the optical fiber insertion end, the first through hole round hole is connected to the second substrate, and the first through hole round hole is aligned with the first surface of the corresponding lens.

[0040] Preferably, each first through hole is aligned with the center of the first surface of each corresponding lens, and each light-transmitting hole is aligned with the center of the second surface of each corresponding lens.

[0041] Preferably, the first through-hole plate is a silicon through-hole plate.

[0042] Preferably, the second substrate is a light-transmitting silicon layer or a sapphire layer.

[0043] Preferably, the lens is a silicon lens or a germanium lens.

[0044] An optical path system includes a first optoelectronic device and a second optoelectronic device, wherein the first optoelectronic device and / or the second optoelectronic device are optoelectronic devices as claimed in any one of claims 1 to 26.

[0045] Preferably, the optical path system further includes a control circuit and an optical path deflection component. The second photoelectric device detects the light spot corresponding to the optical path and converts the light signal of the light spot corresponding to the optical path and outputs a second electrical signal. The control circuit generates a second driving control signal based on the second electrical signal output by the second photoelectric device. The second driving control signal is provided to the electrodes and drivers in the optical path deflection component, thereby adjusting the deflection angle of the corresponding reflective surface in the reflective unit of the optical path deflection component.

[0046] Preferably, the optical path system further includes a control circuit and an optical path deflection component. The first photoelectric device detects the light spot corresponding to the optical path and converts the light signal of the light spot corresponding to the optical path and outputs a first electrical signal. The control circuit generates a first driving control signal based on the first electrical signal output by the first photoelectric device. The first driving control signal is provided to the electrodes and driver in the optical path deflection component, thereby adjusting the deflection angle of the reflective surface corresponding to the reflective unit in the optical path deflection component.

[0047] Preferably, the reflection unit includes a MEMS micromirror array, and the deflection angle is determined by the two degrees of freedom deflection of the MEMS micromirror unit.

[0048] Preferably, the optical path system transmits the first optical path between the first optoelectronic device and the first optical path deflection component, and transmits the second optical path between the second optical path deflection component and the second optoelectronic device.

[0049] Preferably, the optoelectronic array chip and fiber array of the first optoelectronic device are assembled on the first assembly structure, and the optoelectronic array chip and fiber array of the second optoelectronic device are assembled on the second assembly structure, with the optical path originating from the outside of the first assembly structure or the outside of the second assembly structure.

[0050] Preferably, the first optical path and the second optical path are symmetrically distributed.

[0051] A calibration method for an optical path system.

[0052] The first optoelectronic device detects the light spot corresponding to the optical path, converts the optical signal of the light spot corresponding to the optical path, and outputs the first electrical signal;

[0053] The control circuit generates a first drive control signal based on the first electrical signal output by the first photoelectric device.

[0054] The first drive control signal is provided to the electrodes and driver of the optical path deflection component, thereby adjusting the deflection angle of the reflective surface of the reflective unit to ensure that the light spot is within the range of the corresponding lens of the second optoelectronic device.

[0055] and / or

[0056] The second photoelectric device detects the light spot corresponding to the optical path, converts the optical signal of the light spot corresponding to the optical path, and outputs a second electrical signal.

[0057] The control circuit generates a second drive control signal based on the second electrical signal output by the second photoelectric device.

[0058] The second drive control signal is provided to the electrodes and driver of the optical path deflection component, thereby adjusting the deflection angle of the reflective surface of the reflective unit to ensure that the light spot is within the range of the corresponding lens of the first optoelectronic device.

[0059] Preferably, the first optoelectronic device and the second optoelectronic device are optoelectronic devices as claimed in any one of claims 1 to 34.

[0060] A method for assembling a photoelectric device:

[0061] A fiber optic array is provided, which includes a first through-hole plate and a lens array. The first through-hole plate is connected to the lens array. The first through-hole plate includes a plurality of first through-holes. The lens array includes a plurality of lens units. Each lens unit includes a lens. Each first through-hole is aligned with the first surface of the corresponding lens.

[0062] Provide optoelectronic array chips;

[0063] The optoelectronic array chip includes several optoelectronic detection units, each of which forms a light-transmitting hole, and each light-transmitting hole is aligned with the second surface of the corresponding lens.

[0064] Each photoelectric detection unit includes at least one first photoelectric detector, which detects the light spot corresponding to the optical path and converts the light signal of the light spot corresponding to the optical path into an electrical signal;

[0065] Preferably, the lens array includes a second substrate located on a first through-hole plate, and lenses of a plurality of lens units are on the second substrate, transmitting light between the first through-hole plate, at least a portion of the second substrate, and the lenses.

[0066] Preferably, the optoelectronic array chip is bonded to the optical fiber array via a bonding layer, and the optoelectronic array chip is located above the lens array; alternatively, the optoelectronic array chip is adhered to the optical fiber array via an adhesive layer, and the optoelectronic array chip is located above the lens array.

[0067] Preferably, the optoelectronic array chip is connected to the fiber optic array through one or more combinations of locations on the optoelectronic array chip other than its corners, edges, or light-transmitting holes, and the optoelectronic array chip is located above the lens array.

[0068] Preferably, the lens receives and focuses the light spot corresponding to the light path through the light-passing aperture.

[0069] Preferably, a gap is formed between the lens and the corresponding photoelectric detection unit to ensure that the lens is positioned within the gap.

[0070] Preferably, the photoelectric detection unit includes a first substrate, on which a light-transmitting hole is formed, and a plurality of first photodetectors are located on the substrate and surround the light-transmitting hole.

[0071] Preferably, the first substrate has a gap, the gap size of which is greater than the height of the lens.

[0072] Preferably, there are multiple first photodetectors, and the multiple first photodetectors surround the light-transmitting hole.

[0073] Preferably, several photoelectric detection unit electrodes are led out to form several photoelectric array chip electrodes.

[0074] Preferably, it further includes:

[0075] Provide a housing assembly;

[0076] The fiber optic array and optoelectronic array chips are located inside the assembly housing;

[0077] Several optoelectronic array chip electrodes are connected to the pads of the assembly shell via bonding leads.

[0078] Preferably, the fiber optic array and the optoelectronic array chip are assembled on the same assembly structure, and the optical path originates from outside the assembly structure.

[0079] Preferably, each first through hole is aligned with the center of the first surface of each corresponding lens, and each light-transmitting hole is aligned with the center of the second surface of each corresponding lens.

[0080] Preferably, the first through-hole plate is a silicon through-hole plate.

[0081] Preferably, the second substrate is a light-transmitting silicon layer or a sapphire layer.

[0082] Preferably, the lens is a silicon lens or a germanium lens.

[0083] The beneficial effects of the optoelectronic device and assembly method proposed in this invention are as follows:

[0084] The optoelectronic array chip is connected to the fiber optic array. The optoelectronic array chip is bonded to the fiber optic array via a bonding layer, or via an adhesive layer. The fiber optic array includes a first through-hole plate and a lens array. The first through-hole plate includes several first through-holes, and the lens array includes several lenses. The first through-hole plate is connected to the lens array. The optoelectronic array chip includes several photodetector units, forming several light-transmitting holes between them. Each light-transmitting hole corresponds one-to-one with each first through-hole and lens. The relative position of the light spot is determined by the optoelectronic array chip, effectively solving the problem of real-time control of the relative position of the light spot and the fiber optic array. This effectively realizes the transmission of light spot signals and electrical signals between the photodetector units in the optoelectronic array chip and the lenses in the fiber optic array, thereby optimizing alignment and collimation efficiency and reducing insertion loss. This optoelectronic device is simple in structure, easy to implement, and helps reduce size and cost, making it easy to use.

[0085] Furthermore, the optoelectronic device proposed in this invention includes an optical fiber array and an optoelectronic array chip. The optoelectronic array chip is connected to the optical fiber array and is located above the lens array of the optical fiber array. A first through-hole plate is connected to the lens array, and the first through-hole plate includes a plurality of first through-holes. The lens array includes a plurality of lens units, each lens unit including a lens, and each first through-hole is aligned with the first surface of the corresponding lens. The optoelectronic array chip includes a plurality of photodetector units, each photodetector unit forming a light-transmitting hole, and each light-transmitting hole is aligned with the second surface of the corresponding lens. This invention determines the relative position of the light spot through the optoelectronic array chip, effectively solving the problem of real-time control of the relative position of the light spot and the optical fiber array in the optical path. The optoelectronic device proposed in this invention has a simple structure, is easy to implement, and helps to reduce size and cost.

[0086] Furthermore, the photoelectric array chip electrodes of the photoelectric device proposed in this invention are respectively connected to the pads of the assembly shell through bonding wires, which effectively realizes the assembly of the photoelectric array chip and the fiber array.

[0087] Furthermore, the bonding / adhesive layer between the fiber optic array and the optoelectronic array chip can adopt different patterns, such as a ring near the periphery of the optoelectronic array chip, regions located at the four corners of the optoelectronic array chip, segmented regions near the periphery of the optoelectronic array chip, and adhesive regions inside the superimposed units at the four corners of the optoelectronic array chip. Through the connection of the bonding / adhesive layer, the first through-hole of the fiber optic array, the lens, and the light-passing hole correspond one-to-one, and the lens receives and focuses the light through the light-passing hole.

[0088] Furthermore, the light aperture can have different shapes, such as circular, elliptical, or polygonal. Patterns can also be placed around the circumference or polygonal shape of the light aperture.

[0089] Furthermore, each photoelectric detection unit includes at least one first photodetector. The first photodetector detects the corresponding light spot and converts it into an electrical signal, which is then fed back to the control circuit. The control circuit converts the electrical signal into a drive control signal and provides it to the optical path deflection component, thereby adjusting the deflection angle of the reflective surface of the optical path deflection component and calibrating the offset light spot back to the center range of the lens.

[0090] Furthermore, the optical path deflection component of the present invention receives the drive control signal of the control circuit through the corresponding electrode, and adjusts the deflection angle of the corresponding reflective surface according to the change of the drive control signal, thereby realizing that the reflective surface in the corresponding optical path deflection component can be precisely controlled by the control circuit.

[0091] The optoelectronic device of this invention highly integrates optical and electrical signals, making it convenient for users to use and operate. On the one hand, it greatly improves the integration level of the optoelectronic device, resulting in a compact structure and significantly saving the size of the device; on the other hand, it improves the light spot detection accuracy of the optoelectronic device.

[0092] Furthermore, the first photodetector can have different numbers and patterns.

[0093] Furthermore, by employing the optoelectronic device proposed in this invention and adding a control circuit, real-time monitoring and control can be performed on the optical path system. The second optoelectronic device detects the light spot corresponding to the optical path, converts the light signal of the corresponding light spot, and outputs a second electrical signal. The control circuit generates a second drive control signal based on the second electrical signal output by the second optoelectronic device. This second drive control signal is provided to the electrodes and driver of the optical path deflection component, thereby adjusting the deflection angle of the corresponding reflective surface in the optical path deflection component; and / or the first optoelectronic device detects the light spot corresponding to the optical path, converts the light signal of the corresponding light spot, and outputs a first electrical signal. The control circuit generates a first drive control signal based on the first electrical signal output by the first optoelectronic device. This first drive control signal is provided to the electrodes and driver of the optical path deflection component, thereby adjusting the deflection angle of the corresponding reflective surface in the optical path deflection component.

[0094] Furthermore, this invention replaces the traditional fiber optic array with the optoelectronic device proposed in this invention, and proposes an optical path system based on the aforementioned optoelectronic device. By adding a control circuit, the optical path system can be monitored and controlled in real time. The light spot enters from the first optoelectronic device, passes through the optical path deflection component, and exits from the second optoelectronic device; this optical path is reversible, meaning it enters from the second optoelectronic device and exits from the first optoelectronic device.

[0095] Furthermore, the surface of the first photodetector of the present invention includes a photosensitive layer, which is one of Si, SiGe, InP, and InGaAs, and can be applied to different light wavelengths, thus having good versatility.

[0096] Furthermore, this patent proposes an assembly method for an optoelectronic device that can simultaneously fabricate fiber arrays and optoelectronic array chips in the same process, thereby improving assembly efficiency.

[0097] Furthermore, the optical path system proposed in this invention uses the optoelectronic device proposed in this application, eliminating the need for acquiring optical path deflection information via a camera as in the prior art. This significantly reduces system complexity and eliminates the high costs associated with camera systems and subsequent image processing hardware and software. Moreover, the optoelectronic device proposed in this invention boasts high integration, reducing reliance on external detection equipment for both the device itself and the optical path system employing it. This application significantly reduces complexity and cost, improves the accuracy of the optical path system in spot detection, and enhances calibration efficiency and feasibility. Attached Figure Description

[0098] The following description of embodiments of the present invention is with reference to the accompanying drawings:

[0099] Figure 1 A schematic diagram of a prior art optical path system is shown;

[0100] Figure 2 A cross-sectional schematic diagram of one unit in the optoelectronic device proposed in this invention is shown;

[0101] Figure 3 A schematic diagram of the optoelectronic device proposed in this invention is shown;

[0102] Figure 4 This diagram illustrates the principle of spot offset detection in the photoelectric device proposed in this invention.

[0103] Figure 5A , Figure 5B This diagram illustrates the structure of the first photodetector within the photoelectric array chip of the optoelectronic device proposed in this invention.

[0104] Figure 6A , Figure 6B , Figure 6C , Figure 6D This invention illustrates a schematic diagram of the connection scheme between the fiber optic array and the optoelectronic array chip in the optoelectronic device.

[0105] Figure 7 A top view of the fiber optic array portion of the optoelectronic device proposed in this invention;

[0106] Figure 8 A schematic diagram of the optical path system proposed in this invention is shown.

[0107] Explanation of reference numerals in the accompanying drawings of this invention:

[0108] 1-Fiber optic array;

[0109] 13-First through hole plate; 130-First through hole; 131-First through hole square hole; 132-First through hole round hole;

[0110] 23-Lens array; 231-Lens;

[0111] 24--Second basement

[0112] 5-Optoelectronic array chip;

[0113] 50 - Photodetector unit; 501 - First photodetector; 502 - Light-passing aperture; 503 - First photodetector electrode;

[0114] 504 - Electrode of the optoelectronic array chip; 505 - First substrate

[0115] 6- Bonding layer / adhesive layer;

[0116] 7-Control Circuit

[0117] 70-gap;

[0118] 10-Photoelectric device; 10-1-First photoelectric device; 10-2-Second photoelectric device;

[0119] 3-Optical path deflection component;

[0120] 4-Fiber optic cable; 4-1-First fiber optic cable; 4-2-Second fiber optic cable

[0121] 100 - Assembly housing; 101 - Solder pad; 200 - Bonding wire; Detailed Implementation

[0122] The invention will now be described in more detail with reference to the accompanying drawings. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, certain well-known parts may not be shown. Many specific details of the invention are described below, but as those skilled in the art will understand, the invention can be implemented without following these specific details.

[0123] This invention can be presented in various forms, some of which will be described below.

[0124] The photoelectric device 10 proposed in this invention, such as Figure 2 , Figure 3 As shown, it includes:

[0125] Fiber optic array 1 includes a first through-hole plate 13 and a lens array 23. The first through-hole plate 13 is connected to the lens array 23. The first through-hole plate 13 includes a plurality of first through-silicon vias (TSVs) 130. The lens array 23 includes a plurality of lens units. Each lens unit includes a lens 231. Each first through-hole 130 is aligned with the first surface of the corresponding lens 231. The lens can be a silicon lens or a germanium lens.

[0126] The optoelectronic array chip 5 is connected to the fiber array 1 and is located above the lens array 23.

[0127] The optoelectronic array chip 5 includes several optoelectronic detection units 50, each optoelectronic detection unit 50 forming a light-transmitting hole 502, and each light-transmitting hole 502 is aligned with the second surface of each corresponding lens 231;

[0128] Each photoelectric detection unit 50 includes at least one first photodetector 501, which detects the light spot corresponding to the optical path, converts the optical signal, and outputs an electrical signal.

[0129] The lens array 23 also includes a second substrate 24, which is located on the first through-hole plate 13. Lenses 231 of the plurality of lens units are located on the second substrate 24. Light is transmitted between the first through-hole plate, at least a portion of the second substrate, and the lenses. The second substrate is a silicon transparent layer or a sapphire layer.

[0130] Preferably, each first through hole is aligned with the center of the first surface of each corresponding lens, and each light-transmitting hole is aligned with the center of the second surface of each corresponding lens.

[0131] Preferably, the first through-hole plate is a silicon through-hole plate.

[0132] Preferably, the second substrate is a light-transmitting silicon layer or a sapphire layer.

[0133] For ease of description, this application's Figure 2 It is a unit of the optoelectronic device, including a portion of the first through-hole plate 13, a first through-hole 130 (first through-hole square hole 131 and first through-hole round hole 132), a portion of the second substrate 24, a lens 231 and a photoelectric detection unit 50 to form the optoelectronic device 10.

[0134] Lens 231 receives and focuses the light spot corresponding to the light path through light-passing aperture 502.

[0135] The opening size of the light-transmitting aperture 502 is larger than the diameter of the light spot, and the opening size of the light-transmitting aperture 502 satisfies the following condition: 0.2mm ≤ opening size of the light-transmitting aperture ≤ 2mm.

[0136] The optoelectronic array chip 5 is connected to the fiber array 1 by bonding or adhesive layer 6, and the optoelectronic array chip 5 is located above the lens array 23.

[0137] A gap 70 is formed between the lens 231 and the corresponding photoelectric detection unit 30 to meet the requirements of the curved surface shape of the lens.

[0138] The photoelectric detection unit includes a first substrate 505, on which a light-transmitting hole 502 is formed. A plurality of first photodetectors 501 are located on the substrate and surround the light-transmitting hole 502. The first substrate 505 has a gap 70, the size of which is greater than the height of the lens 231.

[0139] The optoelectronic array chip 5 and the fiber array 1 are assembled on the same assembly structure, and the optical path originates from the outside of the assembly structure.

[0140] like Figure 2 , Figure 3 The optical fiber array 1 of the optoelectronic device 10 of this application is composed of a first through-hole plate 13 and a lens array 23 columns connected together. Each first through-hole plate 13 contains hundreds of first through holes 130, and each lens array 23 contains hundreds of lenses 231, wherein each first through hole 130 corresponds one-to-one with each lens 231.

[0141] When the optoelectronic device 10 is used as a light input unit, the divergent light output from the external optical fiber 4 is transmitted to the lens array 23 through the first through holes 131 and 132 of the first through hole plate 13. The lens array 23 collimates the divergent light output from the external optical fiber 4 into a parallel beam.

[0142] When the optoelectronic device 10 is used as a light output unit, the parallel light beam is transmitted to the external optical fiber 4 through the lens array 23 and the first through holes 131 and 132 of the first through hole plate 13.

[0143] like Figure 2 , Figure 3 As shown, each first through hole 130 of the first through hole plate 13 is formed by a larger first through hole square hole 131 and a smaller first through hole round hole 132 passing through it; wherein the larger first through hole square hole 131 is the external optical fiber insertion end, the smaller first through hole round hole 132 is connected to the second substrate, and the first through hole round hole 132 is aligned with the first surface of the corresponding lens 231. The specific assembly method is as follows: the external optical fiber 4 is inserted from the larger square hole 131 of the first through hole plate 13 into the smaller round hole 132 of the first through hole. After being fixed with UV glue, the end face of the optical fiber is ground and polished in an integrated manner. Then it is aligned with the lens array 23 and bonded or glued to the second substrate 24. The optical fiber array 1 and the photoelectric array chip 5 are then connected together and assembled into the metal shell, that is, the assembly shell 100. Each photoelectric detection unit electrode 503 is led out to form a number of photoelectric array chip electrodes 504. The number of photoelectric array chip electrodes 504 are electrically connected to the pads 101 of the assembly shell 100 through bonding leads 200. There are multiple pads 101. Due to the cross-sectional view, the number of photoelectric array chip electrodes 504 shown in Figure 5 overlaps, but in fact, the number of photoelectric array chip electrodes 504 are independent.

[0144] A top view of the optoelectronic array chip 5 is shown below. Figure 7 As shown. A first photodetector 501 is located around a light-transmitting aperture 502, and a first photodetector electrode 503 is connected to a first photoarray chip electrode 504 via leads. Preferably, the surface of the first photodetector 501 includes a photosensitive layer, which detects the corresponding light spot. Preferably, the photosensitive layer on the surface of the first photodetector 501 is one of Si, SiGe, InP, or InGaAs to meet the application requirements of different light wavelengths. The photoarray chip electrode 504, formed by the lead-out of the first photodetector electrode, is located on the front side of the photoarray chip 5.

[0145] The connection scheme between the lens array 23 of the fiber optic array 1 and the optoelectronic array chip 5 is as follows: Figure 8 As shown, the optoelectronic array chip 5 is bonded to the fiber array 1 via a bonding layer 6, and the optoelectronic array chip 5 is positioned above the lens array 23. Alternatively, the optoelectronic array chip 5 can be adhered to the fiber array 1 via an adhesive layer, and the optoelectronic array chip 5 is positioned above the lens array 23. The bonding layer / adhesive layer 6 can employ different patterns. Figure 6A The bonding / adhesive layer 6 is a ring shape near the outer edge of the chip. Figure 6B The bonding / adhesive layer 6 is located in the four corners of the chip. Figure 6C The bonding / adhesive layer 6 is a segmented area near the periphery of the chip. Figure 6D The bonding / adhesive layer 6 is the bonding area located inside the regional stacking unit at the four corners of the chip. Through the connection of the bonding / adhesive layer 6, the lens corresponds one-to-one with the light-transmitting hole 502, and the lens receives and focuses light through the light-transmitting hole 502.

[0146] The light-transmitting aperture 502 can have different shapes. Preferably, the light-transmitting aperture 502 is circular, elliptical, or polygonal. Preferably, the circumference of the light-transmitting aperture 502 is also patterned. Preferably, the polygonal shape of the light-transmitting aperture 502 is also patterned.

[0147] Each photoelectric detection unit 50 includes at least one first photodetector 501. The first photodetector 501 detects the corresponding light spot and converts it into an electrical signal, which is then fed back to the control circuit. Figure 8 As shown, the control circuit converts the electrical signal into a drive control signal and provides it to the optical path deflection component 3 of the corresponding optical path of the optical path system, thereby adjusting the outgoing light path of the corresponding optical path.

[0148] Spot position detection and calibration scheme, such as Figure 4 As shown. If the light spot is located within the center area of ​​lens 231, it is a normal light spot (e.g. Figure 4 The blue indicator light spot is shown); if the light spot is entirely or partially located at the edge of lens 231, it is an offset light spot (e.g., Figure 4(The red indicator light spot is shown). The electrical signal output by the first photodetector 501 from the offset light spot is the first electrical signal, and the electrical signal output by the first photodetector 501 from the normal light spot is the second electrical signal. The first electrical signal is greater than the second electrical signal. The control circuit adjusts the path of the light output by the optical path deflection component 3 according to the above principle, thereby calibrating the offset light spot back to the center range of the lens.

[0149] The number and pattern design of the first photodetector 501 within the photodetector unit are different. At least one first photodetector 501 is located around the light-transmitting aperture 502. Figure 7 The diagram shows multiple first photodetectors 501, which surround the light-transmitting aperture 502. Preferably, the multiple first photodetectors 501 are distributed on a continuous ring (e.g., Figure 5A , Figure 5B As shown) or on an intermittent ring. Preferably, multiple first photodetectors 501 are distributed on a dotted ring (as shown). Figure 5A (As shown). Preferably, the first photodetector 501 is annular around the light-transmitting aperture 502 (e.g., Figure 5B (As shown). Preferably, the plurality of first photodetectors 501 are distributed on concentric rings or concentric arcs with different radii.

[0150] Using the optoelectronic device proposed in this patent, the optical path system can be monitored and controlled in real time, such as... Figure 8 The diagram illustrates an optical path system with a first photoelectric device 10-1 and a second photoelectric device 10-2. The first photoelectric device 10-1 employs the photoelectric device proposed in this application. The second photoelectric device 10-2 can employ the photoelectric device proposed in this application or other photoelectric devices. For convenience, this embodiment uses both the first photoelectric device 10-1 and the second photoelectric device 10-2 as an example. A light spot enters from the first photoelectric device 10-1, passes through the optical path deflection component 3, and exits from the second photoelectric device 10-2. This optical path is reversible, meaning it enters from the second photoelectric device 10-2 and exits from the first photoelectric device 10-1.

[0151] The second photoelectric device 10-2 detects the light spot corresponding to the incident light and outputs a second electrical signal after converting the light signal. The control circuit generates a second drive control signal based on the second electrical signal to adjust the deflection angle of the reflective surface corresponding to the optical path deflection component 3, so as to ensure that the light spot is within the center range of the corresponding lens of the first photoelectric device 10-2; and / or the first photoelectric device 10-1 detects the light spot corresponding to the incident light and outputs a first electrical signal after converting the light signal. The control circuit generates a first drive control signal based on the first electrical signal to adjust the deflection angle of the reflective surface corresponding to the reflective unit of the optical path deflection component 3, so as to ensure that the light spot is within the center range of the corresponding lens of the first photoelectric device 10-2. The optical path system transmits the first optical path between the first photoelectric device and the first optical path deflection component, and transmits the second optical path between the second optical path deflection component and the second photoelectric device. The first and second optical paths are symmetrically distributed.

[0152] The reflecting unit can be a MEMS micromirror array. The deflection angle is determined by the two degrees of freedom of the MEMS micromirror unit to ensure that each output light beam enters the center of the output fiber perpendicularly, thereby minimizing optical loss. The reflecting unit can also be other types of reflectors.

[0153] A method for assembling a photoelectric device, comprising:

[0154] Provide a housing 100;

[0155] A fiber optic array 1 is provided. The fiber optic array 1 includes a first through-hole plate 13 and a lens array 23. The first through-hole plate 13 is connected to the lens array 23. The first through-hole plate 13 includes a plurality of first through-holes 130. The lens array 23 includes a plurality of lens units. Each lens unit includes a lens 231. Each first through-hole 130 is aligned with the first surface of the corresponding lens 231.

[0156] The first through-hole plate 13 includes a plurality of first through holes 130, the first through hole square hole 131 and the first through hole round hole 132 are connected to form a first through hole, the lens array 23 includes a plurality of lenses 231, and the first through-hole plate 13 is connected to the second substrate 24.

[0157] A photoelectric array chip 5 is provided, which covers the lens array 23 of the fiber optic array 1.

[0158] The photoelectric array chip 5 includes several photoelectric detection units 50, each photoelectric detection unit 50 forming a light-transmitting hole 502, and each light-transmitting hole 502 is aligned with the second surface of each corresponding lens 231.

[0159] Each photoelectric detection unit 50 includes at least one first photodetector 501, which detects the light spot corresponding to the optical path, converts the optical signal, and outputs an electrical signal.

[0160] The optoelectronic array chip 5 and the fiber array 1 are assembled in the same assembly structure, and the incident light comes from the outside of the assembly structure.

[0161] The optoelectronic array chip 5 and the fiber array 1 are assembled in the assembly shell 100. Several optoelectronic detection unit electrodes 503 are led out to form several optoelectronic array chip electrodes 504. Several optoelectronic array chip electrodes 504 are electrically connected to the pads 101 of the assembly shell 100 through bonding leads 300.

[0162] The optoelectronic device, optical path system, and calibration method proposed in this invention solve the problem of real-time control of the relative position of the light spot and the fiber array in the optical path system. Compared with the traditional monitoring light plus camera solution, it significantly reduces system complexity and helps to reduce size and cost.

[0163] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0164] As described above, these embodiments of the present invention do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to effectively utilize the invention and its modifications. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A photoelectric device, characterized in that, include: An optical fiber array, comprising a first through-hole plate and a lens array, wherein the first through-hole plate comprises a plurality of first through-holes, and the lens array comprises a plurality of lens units, each lens unit comprising a lens, and each first through-hole is aligned with the first surface of the corresponding lens; Optoelectronic array chip; The optoelectronic array chip includes a plurality of optoelectronic detection units, each optoelectronic detection unit forming a light-transmitting hole, and each light-transmitting hole being aligned with the second surface of each corresponding lens. Each photoelectric detection unit includes at least one first photoelectric detector, which detects the light spot corresponding to the optical path, converts the optical signal, and outputs an electrical signal.

2. The photoelectric device according to claim 1, characterized in that, The lens array includes a second substrate located on the first through-hole plate, and the lenses of the plurality of lens units are on the second substrate, transmitting light between the first through-hole plate, at least a portion of the second substrate, and the lenses.

3. The photoelectric device according to claim 1, characterized in that, If the first photodetector detects that all or part of the light spot corresponding to the optical path is located at the edge of the lens, it is an offset light spot, and the electrical signal output by the first photodetector is a first electrical signal. If the first photodetector detects that the light spot corresponding to the optical path is located at the center of the lens, it is a normal light spot, and the electrical signal output by the first photodetector is a second electrical signal. The first electrical signal is greater than the second electrical signal.

4. The photoelectric device according to claim 1, characterized in that, The lens receives and focuses the light spot corresponding to the optical path through the light-passing hole.

5. The photoelectric device according to claim 1, characterized in that, The opening size of the light-transmitting aperture is larger than the diameter of the light spot.

6. The photoelectric device according to claim 5, characterized in that, The opening size of the light-transmitting hole satisfies the following condition: 0.2mm ≤ opening size of the light-transmitting hole ≤ 2mm.

7. The photoelectric device according to claim 1, characterized in that, A gap is formed between each lens and its corresponding photoelectric detection unit to allow the lens to be positioned within the gap.

8. The photoelectric device according to claim 1, characterized in that, The photoelectric detection unit includes a first substrate, on which the light-transmitting hole is formed, and the plurality of first photodetectors are located on the substrate and surround the light-transmitting hole.

9. The photoelectric device according to claim 7, characterized in that, The photoelectric detection unit includes a first substrate, on which the gap is formed, and the size of the gap is greater than the height of the lens.

10. The photoelectric device according to claim 1, characterized in that, The photoelectric array chip is bonded to the optical fiber array via a bonding layer, and the photoelectric array chip is located above the lens array; or the photoelectric array chip is adhered to the optical fiber array via an adhesive layer, and the photoelectric array chip is located above the lens array.

11. The photoelectric device according to claim 1, characterized in that, The photoelectric array chip is connected to the optical fiber array via one or more combinations of locations on the photoelectric array chip other than the corner, edge, or light-transmitting hole, with the photoelectric array chip located above the lens array.

12. The photoelectric device according to claim 1, characterized in that, The electrical signal is provided to the control circuit, which converts the electrical signal into a drive control signal and provides it to the optical path deflection component, thereby adjusting the deflected light path and calibrating the offset light spot back to the range of the corresponding lens of the photoelectric device.

13. The photoelectric device according to claim 1, characterized in that, The surface of the first photodetector includes a photosensitive layer, which detects the light spot corresponding to the optical path.

14. The photoelectric device according to claim 13, characterized in that, The surface of the first photodetector includes a photosensitive layer, which is one of Si, SiGe, InP, and InGaAs.

15. The photoelectric device according to claim 1, characterized in that, The electrodes of the first photodetector are led out to form photodetector unit electrodes, and the corresponding photodetector unit electrodes transmit the corresponding electrical signals.

16. The photoelectric device according to claim 15, characterized in that, The electrodes of the photoelectric array chip are located on the surface of the photoelectric array chip.

17. The photoelectric device according to claim 1, characterized in that, The light-transmitting hole can be circular, elliptical, or polygonal.

18. The photoelectric device according to claim 17, characterized in that, A pattern is also provided around the circumference or polygon of the light-transmitting hole.

19. The photoelectric device according to claim 1, characterized in that, The at least one first photodetector is located around the light-transmitting aperture.

20. The photoelectric device according to claim 19, characterized in that, There are multiple first photodetectors, and the multiple first photodetectors surround the light-transmitting aperture.

21. The photoelectric device according to claim 20, characterized in that, The plurality of first photodetectors are distributed on a continuous ring or on an intermittent ring.

22. The photoelectric device according to claim 20, characterized in that, The plurality of first photodetectors are distributed in a dot matrix on the ring.

23. The photoelectric device according to claim 20, characterized in that, The plurality of first photodetectors are distributed on concentric rings or concentric arcs of the same radius.

24. The photoelectric device according to claim 20, characterized in that, The plurality of first photodetectors are distributed on concentric rings or concentric arcs with different radii.

25. The photoelectric device according to claim 1, characterized in that, The optoelectronic array chip and the fiber array are assembled on the same assembly structure, and the optical path originates from the outside of the optoelectronic device.

26. The photoelectric device according to any one of claims 1 to 25, characterized in that, Several photoelectric detection unit electrodes are led out to form several photoelectric array chip electrodes.

27. The photoelectric device according to claim 26, characterized in that, The optoelectronic device further includes an assembly housing, in which the fiber array and the optoelectronic array chip are located, and the electrodes of the plurality of optoelectronic array chips are respectively connected to the pads of the assembly housing via bonding leads.

28. The photoelectric device according to claim 1, characterized in that, When the optoelectronic device is used as a light input unit, the divergent light output from the optical fiber is transmitted to the lens array through the first through hole of the first through-hole plate, and the lens array collimates the divergent light output from the external optical fiber into a parallel beam.

29. The photoelectric device according to claim 1, characterized in that, When the optoelectronic device is used as a light output unit, the parallel light beam is transmitted to the optical fiber through the lens array and the first through hole of the first through-hole plate.

30. The photoelectric device according to claim 2, characterized in that, Each first through hole in the first through-hole plate is formed by the passage of a first through-hole square hole of a first size and a first through-hole round hole of a second size, wherein the first size is larger than the second size; the first through-hole square hole is the optical fiber insertion end, the first through-hole round hole is connected to the second substrate, and the first through-hole round hole is aligned with the first surface of the corresponding lens.

31. The photoelectric device according to claim 1, characterized in that, Each first through hole is aligned with the center of the first surface of each corresponding lens, and each light-transmitting hole is aligned with the center of the second surface of each corresponding lens.

32. The photoelectric device according to claim 1, characterized in that, The first through-hole plate is a silicon through-hole plate.

33. The photoelectric device according to claim 2, characterized in that, The second substrate is a transparent silicon layer or a sapphire layer.

34. The photoelectric device according to claim 1, characterized in that, The lens is a silicon lens or a germanium lens.

35. An optical path system, characterized in that, It includes a first optoelectronic device and a second optoelectronic device, wherein the first optoelectronic device and / or the second optoelectronic device employs the optoelectronic device as described in any one of claims 1 to 26.

36. The optical path system according to claim 35, characterized in that, The optical path system also includes a control circuit and an optical path deflection component. The second photoelectric device detects the light spot corresponding to the optical path and converts the light signal of the light spot corresponding to the optical path and outputs a second electrical signal. The control circuit generates a second driving control signal based on the second electrical signal output by the second photoelectric device. The second driving control signal is provided to the electrodes and driver in the optical path deflection component, thereby adjusting the deflection angle of the corresponding reflective surface in the reflective unit of the optical path deflection component.

37. The optical path system according to claim 35, characterized in that, The optical path system further includes a control circuit and an optical path deflection component. The first photoelectric device detects the light spot corresponding to the optical path and converts the light signal of the light spot corresponding to the optical path and outputs a first electrical signal. The control circuit generates a first driving control signal based on the first electrical signal output by the first photoelectric device. The first driving control signal is provided to the electrodes and driver in the optical path deflection component, thereby adjusting the deflection angle of the reflective surface corresponding to the reflective unit in the optical path deflection component.

38. The optical path system according to claim 36 or 37, characterized in that, The reflection unit includes a MEMS micromirror array, and the deflection angle is determined by the two-degree-of-freedom deflection of the MEMS micromirror unit.

39. The optical path system according to claim 35, characterized in that, The optical path system transmits a first optical path between the first optoelectronic device and the first optical path deflection component, and transmits a second optical path between the second optical path deflection component and the second optoelectronic device.

40. The optical path system according to claim 35, characterized in that, The optoelectronic array chip of the first optoelectronic device and the optical fiber array are assembled on the first assembly structure, and the optoelectronic array chip of the second optoelectronic device and the optical fiber array are assembled on the second assembly structure. The optical path originates from the outside of the first assembly structure or the outside of the second assembly structure.

41. The optical path system according to claim 39, characterized in that, The first optical path and the second optical path are symmetrically distributed.

42. A calibration method for an optical path system, characterized in that, The first optoelectronic device detects the light spot corresponding to the optical path, converts the optical signal of the light spot corresponding to the optical path, and outputs the first electrical signal; The control circuit generates a first drive control signal based on the first electrical signal output by the first photoelectric device. The first drive control signal is provided to the electrodes and driver of the optical path deflection component, thereby adjusting the deflection angle of the reflective surface of the reflective unit to ensure that the light spot is within the range of the corresponding lens of the second optoelectronic device. and / or The second photoelectric device detects the light spot corresponding to the optical path, converts the optical signal of the light spot corresponding to the optical path, and outputs a second electrical signal. The control circuit generates a second drive control signal based on the second electrical signal output by the second photoelectric device. The second drive control signal is provided to the electrodes and driver of the optical path deflection component, thereby adjusting the deflection angle of the reflective surface of the reflective unit to ensure that the light spot is within the range of the corresponding lens of the first optoelectronic device.

43. The calibration method for an optical path system according to claim 42, characterized in that, The first optoelectronic device and the second optoelectronic device are optoelectronic devices as described in any one of claims 1 to 34.

44. A method for assembling a photoelectric device, characterized in that, A fiber optic array is provided, the fiber optic array including a first through-hole plate and a lens array, the first through-hole plate being connected to the lens array, the first through-hole plate including a plurality of first through-holes, the lens array including a plurality of lens units, each lens unit including a lens, and each first through-hole being aligned with the first surface of the corresponding lens; Provide optoelectronic array chips; The optoelectronic array chip includes a plurality of optoelectronic detection units, each optoelectronic detection unit forming a light-transmitting hole, and each light-transmitting hole being aligned with the second surface of each corresponding lens. Each photoelectric detection unit includes at least one first photoelectric detector, which detects the light spot corresponding to the optical path, converts the light signal of the light spot corresponding to the optical path, and outputs an electrical signal.

45. The assembly method according to claim 44, characterized in that, The lens array includes a second substrate located on the first through-hole plate, and the lenses of the plurality of lens units are on the second substrate, transmitting light between the first through-hole plate, at least a portion of the second substrate, and the lenses.

46. ​​The assembly method according to claim 44, characterized in that, The optoelectronic array chip is bonded to the optical fiber array via a bonding layer, and the optoelectronic array chip is located above the lens array; alternatively, the optoelectronic array chip is adhered to the optical fiber array via an adhesive layer, and the optoelectronic array chip is located above the lens array.

47. The assembly method according to claim 44, characterized in that, The photoelectric array chip is connected to the fiber optic array through one or more combinations of its corners, edges, or locations other than the light-passing holes, and the photoelectric array chip is located above the lens array.

48. The assembly method according to claim 44, characterized in that, The lens receives and focuses the light spot corresponding to the optical path through the light-passing hole.

49. The assembly method according to claim 44, characterized in that, A gap is formed between the lens and the corresponding photoelectric detection unit so that the lens is positioned within the gap.

50. The assembly method according to claim 44, characterized in that, The photoelectric detection unit includes a first substrate, on which the light-transmitting hole is formed, and the plurality of first photodetectors are located on the substrate and surround the light-transmitting hole.

51. The assembly method according to claim 50, characterized in that, The first substrate has the gap, the gap being larger than the height of the lens.

52. The assembly method according to claim 44, characterized in that, There are multiple first photodetectors, and the multiple first photodetectors surround the light-transmitting aperture.

53. The assembly method according to any one of claims 44 to 52, characterized in that, The electrodes of the several photoelectric detection units are respectively led out to form several photoelectric array chip electrodes.

54. The assembly method according to claim 53, characterized in that, Also includes: Provide a housing assembly; The fiber optic array and the optoelectronic array chip are located inside the assembly housing; The electrodes of the several optoelectronic array chips are respectively connected to the pads of the assembly shell via bonding leads.

55. The assembly method according to claim 44, characterized in that, The fiber optic array and the optoelectronic array chip are assembled on the same assembly structure, and the optical path originates from outside the assembly structure.

56. The assembly method according to claim 44, characterized in that, Each first through hole is aligned with the center of the first surface of each corresponding lens, and each light-transmitting hole is aligned with the center of the second surface of each corresponding lens.

57. The assembly method according to claim 45, characterized in that, The first through-hole plate is a silicon through-hole plate.

58. The assembly method according to claim 44, characterized in that, The second substrate is a transparent silicon layer or a sapphire layer.

59. The assembly method according to claim 44, characterized in that... The lens is a silicon lens or a germanium lens.

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